Light emitting device, image forming apparatus, display, photoelectric conversion device, electronic apparatus, illumination device, movable body, and wearable device

Abstract

To provide a technique advantageous for reducing the difference in characteristics between areas of a pixel array unit.SOLUTION: A light emitting device has a pixel array unit including a plurality of pixels arranged to form a plurality of rows and a plurality of columns, and a plurality of signal lines extending in a column direction. Each of the plurality of signal lines is divided into a plurality of sub-signal lines, and signals generated by using output signals from the same reference voltage generation circuit are supplied to the pixels on the same column through corresponding sub-signal lines.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light-emitting device, an image forming device, a display device, a photoelectric conversion device, an electronic device, a lighting device, a mobile object, and a wearable device. [Background technology]

[0002] Light-emitting devices or display devices using light-emitting elements such as organic light-emitting diodes (OLEDs) are known. Patent Document 1 discloses a configuration that shortens the writing time by supplying video signals to the upper and lower halves of a pixel array section via different data lines. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-077567 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the configuration described in Patent Document 1, signals are supplied from different drive circuits to the signal lines of the upper and lower halves of the pixels in the same column, which results in differences in characteristics between the upper and lower halves of the pixel array.

[0005] The present invention provides an advantageous technique for reducing the difference in characteristics between regions of a pixel array section. [Means for solving the problem]

[0006] According to one aspect of the present invention, there is provided a light emitting device having a pixel array section including a plurality of pixels arranged to form a plurality of rows and a plurality of columns, and a plurality of signal lines extending in the column direction, each of the plurality of signal lines being divided into a plurality of sub-signal lines, and configured such that pixels in the same column are supplied with signals generated using output signals from the same reference voltage generation circuit via the corresponding sub-signal lines. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide an advantageous technique for reducing the difference in characteristics between regions of a pixel array section. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a diagram showing a configuration of a pixel substrate of a light-emitting device. [Figure 2] FIG. 2 is a diagram showing the configuration of a circuit board of the light emitting device. [Figure 3] 4 is a timing chart showing an example of the operation of the light emitting device. [Figure 4] FIG. 2 is a diagram showing a configuration of a pixel substrate of a light-emitting device. [Figure 5] FIG. 2 is a diagram showing the configuration of a circuit board of the light emitting device. [Figure 6] 4 is a timing chart showing an example of the operation of the light emitting device. [Figure 7] FIG. 1 illustrates a structure of a light-emitting device. [Figure 8] 4 is a timing chart showing an example of the operation of the light emitting device. [Figure 9] FIG. 2 is a diagram showing a configuration of a pixel substrate of a light-emitting device. [Figure 10] FIG. 1 is a cross-sectional view showing a configuration example of a pixel of a light-emitting device. [Figure 11] FIG. 1 is a diagram showing an example of the configuration of an image forming apparatus. [Figure 12] FIG. 1 illustrates an example of the configuration of a display device. [Figure 13] FIG. 1 illustrates an example of a photoelectric conversion device. [Figure 14] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 15]FIG. 1 illustrates an example of a display device. [Figure 16] FIG. 1 is a diagram showing a configuration example of a lighting device. [Figure 17] FIG. 1 is a diagram showing an example of a moving object. [Figure 18] FIG. 1 is a diagram showing an example of a wearable device. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] First Embodiment A light emitting device according to the first embodiment will be described with reference to Figures 1 to 3. Note that the following embodiments are merely examples of the present invention, and the present invention is not limited to the numerical values, shapes, materials, components, arrangement and connection of the components, etc.

[0011] 1 and 2 are schematic diagrams showing a light emitting device 10 according to this embodiment. The light emitting device 10 has a pixel substrate 100 (first substrate) and a circuit substrate 200 (second substrate) stacked on top of each other. FIG. 1 shows the configuration of the pixel substrate 100, and FIG. 2 shows the configuration of the circuit substrate 200. A pixel array section 101 is formed on the pixel substrate 100. The pixel array section 101 includes a plurality of pixels 102 arranged to form a plurality of rows and a plurality of columns. Each of the plurality of pixels 102 includes a light emitting diode (light emitting element) and emits light with an amount of light corresponding to an input luminance signal voltage. A luminance signal voltage Vsig, which is an image signal, is input to each of the plurality of pixels 102 from a signal output circuit via a signal line.

[0012] The pixel array section 101 includes a plurality of signal lines extending in the column direction. In this embodiment, as shown in FIG. 1, each of the plurality of signal lines is divided into a plurality of sub-signal lines. Consider two regions obtained by dividing a region including a plurality of pixels 102 into two by a line parallel to the row direction. One of the two regions is referred to as region A (first region), and the other is referred to as region B (second region). Region A includes a first plurality of sub-signal lines 103, and region B includes a second plurality of sub-signal lines 104. While a single signal line extending in the column direction was conventionally provided for each column of pixels in the pixel array section, the term "sub-signal line" refers to a signal line divided into regions. An image signal is input to each pixel in region A via the sub-signal line 103, and an image signal is input to each pixel in region B via the sub-signal line 104. Hereinafter, the "sub-signal line" will be simply referred to as the "signal line." The signal line 103 (first sub-signal line) is connected to the circuit of the circuit board 200 via the first connection portion 105, and the signal line 104 (second sub-signal line) is connected to the circuit of the circuit board 200 via the second connection portion .

[0013] A control signal 108 is input to each pixel from a vertical scanning circuit 107 via a scanning line. When the control signal 108 is LOW, it becomes active, and the potential of the signal line 103 is written to the pixel 102. When the control signal 108 is HIGH, it becomes inactive, and the pixel 102 and the signal line 103 are disconnected. Here, as in the example shown in FIG. 1 , the vertical scanning circuit 107 is formed on the pixel substrate 100, but it may also be formed on the circuit substrate 200.

[0014] Each of the pixels 102 may have multiple sub-pixels arranged for each color. In this case, signal lines are arranged for each column based on each sub-pixel. For example, if one pixel includes three sub-pixels, three signal lines may be arranged for one pixel column.

[0015] A signal output circuit 201 is formed on the circuit board 200. The signal output circuit 201 may include a horizontal scanning circuit 202, column DAC circuits 203 arranged across multiple columns, and column driver circuits 204 arranged across multiple columns. The vertical scanning circuit 107 and the signal output circuit 201 are controlled by a control circuit 205.

[0016] The circuit board 200 further includes a signal line switching circuit 207. The signal line switching circuit 207 switches the connection destination of the output of the signal output circuit 201 between multiple sub-signal lines. Specifically, the signal line switching circuit 207 switches whether the signal output from the column driver circuit 204 is output to the signal line 103 of region A via the first connection unit 105 or to the signal line 104 of region B via the second connection unit 106. The signal line switching circuit 207 is controlled by a switching control signal 208. For example, when the switching control signal 208 is LOW, the signal line switching circuit 207 connects to the signal line 103 of region A, and when the switching control signal 208 is HIGH, the signal line switching circuit 207 connects to the signal line 104 of region B. In one example, the signal line switching circuit 207 may include multiple selectors 2071 that select the signal line 103 of region A or the signal line 104 of region B as the connection destination of the output of the signal output circuit 201 for each pixel column.

[0017] In this embodiment, one column DAC circuit 203 corresponds to one column driver circuit 204. The column DAC circuit 203 converts image data scanned by the horizontal scanning circuit 202 and input to each pixel column into an analog signal and supplies the analog signal to the column driver circuit 204. The column driver circuit 204 outputs a luminance signal (luminance signal voltage Vsig) corresponding to the output signal from the column DAC circuit 203.

[0018] The circuit board 200 is further formed with a reference voltage generation circuit 206. The reference voltage generation circuit 206 generates analog voltages Vref (for example, 256 analog voltages when the image data is 8 bits) in number corresponding to the image data, and supplies the analog voltages Vref to the column DAC circuit 203. The reference voltage generation circuit 206 may also generate a reference voltage Vcal used to correct variations in the signal output circuit 201 and the pixels 102. In this case, the reference voltage Vcal may be supplied to the pixels 102 via the column driver circuit 204 and signal lines 103 and 104.

[0019] 3 is a timing chart showing an example of the operation of the light emitting device 10 according to this embodiment. In FIG. 3, the horizontal synchronization signal indicates the horizontal scanning period of the nth row, which includes a reset period and a signal writing period. During the period from time t201 to time t206, pixels in region A connected to signal line 103 are scanned, and during the period after time t206, pixels in region B connected to signal line 104 are scanned.

[0020] At time t201, a horizontal synchronization signal starts scanning of the pixels in region A of the pixel array unit 101. At this time, the switching control signal 208 is LOW, and the signal line switching circuit 207 connects the output of the column driver circuit 204 to the signal line 103 of region A.

[0021] At time t202, the column driver circuit 204 outputs a reset potential. This starts writing the reset voltage to the pixel 102. A waiting time is required until the signal line 103 reaches the reset potential, and the settling time at this time is expressed as τ=CR, where C is the capacitance of the signal line and R is the resistance of the signal line. Furthermore, the control signal 108 becomes LOW, and the reset potential of the signal line 103 is written to the pixel 102.

[0022] At time t203, the control signal 108 becomes HIGH, completing the writing of the reset voltage to the pixel 102. The reset period is from time t202 to time t203.

[0023] At time t204, the column driver circuit 204 outputs a luminance signal potential. At this time, the switching control signal 208 is LOW, and the signal line switching circuit 207 connects the output of the column driver circuit 204 to the signal line 103 of region A. This starts writing the luminance signal voltage to the pixel 102. As with the reset potential, a settling time is required before the luminance signal potential is reached. Then, the control signal 108 goes LOW, and the luminance signal potential of the signal line 103 is written to the pixel 102. The light-emitting element provided in the pixel 102 emits light with an amount of light corresponding to the input luminance signal voltage.

[0024] At time t205, the control signal 108 goes HIGH, completing the writing of the luminance signal voltage to the pixel 102. The period from time t204 to time t205 is the signal writing period.

[0025] At time t206, a horizontal synchronization signal starts scanning of the pixels in region B of the pixel array unit 101. At this time, the switch control signal 208 becomes HIGH, and the output of the column driver circuit 204 is connected to the signal line 104 in region B.

[0026] The period from time t207 to time t208 is a reset period, similar to the period from time t202 to time t203, during which the reset potential of the signal line 104 is written to the pixels in region B.

[0027] The period from time t209 to time t210 is a signal writing period, similar to the period from time t204 to time t205, during which the luminance signal potential of the signal line 104 is written to the pixels in region B.

[0028] Here, each of the column DAC circuits 203 and the column driver circuits 204 may correspond to one sub-pixel column or to a plurality of sub-pixel columns.

[0029] As described above, according to this embodiment, each of the multiple signal lines extending in the column direction is divided into multiple sub-signal lines. Then, signals generated using output signals from the same reference voltage generation circuit are supplied to pixels in the same column via the corresponding sub-signal lines. The "signal generated using output signals from the same reference voltage generation circuit" may be, for example, an output signal from the column DAC circuit 203 generated based on the output from the reference voltage generation circuit 206. Alternatively, the "signal generated using output signals from the same reference voltage generation circuit" may be a luminance signal output from the column driver circuit 204 in accordance with the output signal from the column DAC circuit 203.

[0030] According to this embodiment, signals generated using output signals from the same reference voltage generation circuit are supplied to pixels in the same column via corresponding sub-signal lines, thereby reducing the difference in characteristics between pixels in region A and region B.

[0031] 1, the first connection portion 105 and the second connection portion 106 are provided at ends of the signal line 103 (first sub-signal line) and the signal line 104 (second sub-signal line) that are closer to each other. However, the positions of the first connection portion 105 and the second connection portion 106 are not limited to this. For example, as shown in FIG. 9, the first connection portion 105 and the second connection portion 106 may be provided at ends of the signal line 103 and the signal line 104 that are farther from each other.

[0032] Second Embodiment A light emitting device according to a second embodiment will be described with reference to Figures 4 to 6. Matters not mentioned in this second embodiment may follow those of the first embodiment as long as they are not contradictory.

[0033] Similar to the first embodiment, the light emitting device 10 has a pixel substrate 100 (first substrate) and a circuit substrate 200 (second substrate) stacked on top of each other. Figure 4 shows the configuration of the pixel substrate 100, and Figure 5 shows the configuration of the circuit substrate 200.

[0034] In the second embodiment, as shown in FIG. 4 , the pixel array unit 101 has four regions obtained by dividing an area including a plurality of pixels 102 into four by lines parallel to the row direction. Here, the four regions are region C (first region), region D (second region), region E (third region), and region F (fourth region). Region C includes a first plurality of sub-signal lines 301, region D includes a second plurality of sub-signal lines 302, region E includes a third plurality of sub-signal lines 303, and region F includes a fourth plurality of sub-signal lines 304. An image signal is input to each pixel in region C via the sub-signal line 301, and an image signal is input to each pixel in region D via the sub-signal line 302. Furthermore, an image signal is input to each pixel in region E via the sub-signal line 303, and an image signal is input to each pixel in region F via the sub-signal line 304. Hereinafter, as in the first embodiment, the "sub-signal lines" will be simply referred to as "signal lines." Signal line 301 (first sub-signal line) is connected to the circuit of circuit board 200 via first connection portion 305, and signal line 302 (second sub-signal line) is connected to the circuit of circuit board 200 via second connection portion 306. Furthermore, signal line 303 (third sub-signal line) is connected to the circuit of circuit board 200 via third connection portion 307, and signal line 304 (fourth sub-signal line) is connected to the circuit of circuit board 200 via fourth connection portion 308.

[0035] Unlike the first embodiment, the signal output circuit of the circuit board 200 has two column driver circuits 401 and 402 and two signal line switching circuits 403 and 404. The signal line switching circuit 403 switches between outputting the signal output from the column driver circuit 401 to the signal line 301 via the first connection unit 305 and outputting the signal to the signal line 302 via the second connection unit 306. The signal line switching circuit 403 is controlled by a switching control signal 405. The signal line switching circuit 404 switches between outputting the signal output from the column driver circuit 402 to the signal line 303 via the third connection unit 307 and outputting the signal to the signal line 304 via the fourth connection unit 308. The signal line switching circuit 404 is controlled by a switching control signal 406.

[0036] In this embodiment, one column DAC circuit 203 corresponds to two column driver circuits 401 and 402 .

[0037] FIG. 6 is a timing chart showing an example of the operation of the light emitting device 10 in this embodiment. In the period from time t301 to time t302, region C of the pixel array unit 101 connected to the signal line 301 is scanned. At time t301, scanning of region C of the pixel array unit 101 is started by a horizontal synchronization signal. At this time, the switching control signal 405 is LOW, and the signal line switching circuit 403 connects the output of the column driver circuit 401 to the signal line 301 of region C. As a result, the reset period and signal writing period of the pixels in each row of region C are scanned sequentially.

[0038] In the period from time t302 to time t303, region D of the pixel array unit 101 connected to the signal line 302 is scanned. At time t302, scanning of region D of the pixel array unit 101 is started by a horizontal synchronization signal. At this time, the switching control signal 405 is HIGH, and the signal line switching circuit 403 connects the output of the column driver circuit 401 to the signal line 302 of region D. As a result, the reset period and signal writing period of the pixels in each row of region D are scanned sequentially.

[0039] During the period from time t303 to time t304, region E of the pixel array unit 101 connected to the signal line 303 is scanned. At time t303, scanning of region E of the pixel array unit 101 is started by a horizontal synchronization signal. At this time, the switching control signal 406 is LOW, and the signal line switching circuit 404 connects the output of the column driver circuit 402 to the signal line 303 of region E. As a result, the reset period and signal writing period of the pixels in each row of region E are sequentially scanned.

[0040] In the period after time t304, region F of the pixel array unit 101 connected to the signal line 304 is scanned. At time t304, scanning of region F of the pixel array unit 101 is started by the horizontal synchronization signal. At this time, the switching control signal 406 is HIGH, and the signal line switching circuit 404 connects the output of the column driver circuit 402 to the signal line 304 of region F. As a result, the reset period and signal writing period of the pixels in each row of region F are scanned sequentially.

[0041] In the above example, it has been described that areas C, D, E, and F are scanned sequentially, but it is also possible to scan areas C and E in parallel, and then scan areas D and F in parallel.

[0042] As described above, by increasing the number of divisions of the signal line compared to the first embodiment, the time constant of the signal line is shortened, and therefore the reset period and signal write time can be shortened.

[0043] Furthermore, in this embodiment, signals are supplied to the pixels in areas C, D, E, and F by switching the connections between the outputs of column driver circuits 401 and 402 and four divided signal lines 301, 302, 303, and 304 using signal line switching circuits 403 and 404. At this time, a configuration is adopted in which signals can be supplied to areas C, D, E, and F from the column driver circuit 204 and the reference voltage generation circuit 206, thereby reducing differences in pixel characteristics. Because areas C and D and areas E and F use different column DAC circuits, differences in characteristics may occur between areas D and E due to differences in the column DAC circuits, but this has the advantage of shortening the signal writing period described above.

[0044] Third Embodiment A light emitting device according to the third embodiment will be described with reference to Figures 7 and 8. Matters not mentioned in this third embodiment may follow those of the first and second embodiments as long as they are not inconsistent.

[0045] FIG. 7 is a diagram illustrating a configuration of a light-emitting device 10 according to a third embodiment. In the first and second embodiments described above, the light-emitting device 10 has been described as having a pixel substrate 100 (first substrate) and a circuit substrate 200 (second substrate) stacked on top of each other. However, the present invention is not limited to a configuration in which multiple substrates are stacked. In the third embodiment, unlike the first embodiment, the pixel array section 101 and the signal output circuit 501 are formed on the same substrate 500. Each of the multiple signal lines extending in the column direction is divided into a first plurality of sub-signal lines 103 and a second plurality of sub-signal lines 104. Here, two regions are considered, obtained by dividing a region including multiple pixels 102 into two by a line parallel to the row direction. One of the two regions is referred to as region G (first region), and the other is referred to as region H (second region). Region G includes the first plurality of sub-signal lines 103, and region H includes the second plurality of sub-signal lines 104. An image signal is input to each pixel in region G via a sub-signal line 103, and an image signal is input to each pixel in region H via a sub-signal line 104. Hereinafter, the "sub-signal line" will be simply referred to as the "signal line."

[0046] The signal line 103 is connected to a signal output circuit 501, and the signal line 104 is connected to a signal output circuit 502. Each of the signal output circuits 501 and 502 may include a horizontal scanning circuit, a column DAC circuit, and a column driver circuit 204. The output of the reference voltage generation circuit 206 is input to the column DAC circuits of the signal output circuits 501 and 502 via a signal line switching circuit 503. The signal line switching circuit 503 is controlled by a switching control signal 504. For example, when the switching control signal 504 is LOW, the signal line switching circuit 503 connects to the signal output circuit 501 for region G, and when the switching control signal 504 is HIGH, the signal line switching circuit 503 connects to the signal output circuit 502 for region H.

[0047] 8 is a timing chart showing an example of the operation of the light emitting device 10 in this embodiment. The difference is that the switching control signal 208 is used as the switching control signal in the first embodiment, whereas the switching control signal 504 is used in this embodiment. However, when comparing FIG. 8 with FIG. 3, the timing relationships in the timing charts are the same.

[0048] As described above, in this embodiment, when signals are supplied to pixels in region G, the output of the reference voltage generation circuit 206 is input to the signal output circuit 501 via the signal line switching circuit 503. When signals are supplied to pixels in region H, the output of the reference voltage generation circuit 206 is input to the signal output circuit 502 via the signal line switching circuit 503. In this case, when scanning the pixels in region G and the pixels in region H, signals are supplied from the same reference voltage generation circuit 206.

[0049] As described above, this embodiment can reduce differences in pixel characteristics. Because the configuration of this embodiment uses different column DAC circuits and column driver circuits for the pixels in region G and the pixels in region H, the effect of suppressing differences in characteristics may be weaker than in the first and second embodiments. However, even without a stacked structure, which is generally considered to have a cost disadvantage, it is possible to apply a configuration in which, as described above, signals generated using output signals from the same reference voltage generation circuit are supplied to pixels in the same column via corresponding sub-signal lines. Therefore, this configuration can also reduce differences in pixel characteristics between regions.

[0050] <Application example> Hereinafter, application examples of the light emitting device 10 according to the above-described embodiment, such as an image forming device, a display device, a photoelectric conversion device, an electronic device, a lighting device, a mobile object, and a wearable device, will be described. As described above, the light emitting device 10 will be described assuming that organic light emitting elements such as organic EL elements are arranged in the plurality of pixels 102 arranged in the pixel array section 101. First, details of the components arranged in the pixel array section 101 of the light emitting device 10 will be shown, and then application examples will be described.

[0051] Structure of organic light-emitting element The organic light-emitting element is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the cathode. When a color filter is provided, a planarizing layer may be provided between the protective layer and the color filter. The planarizing layer may be made of an acrylic resin, etc. The same applies when a planarizing layer is provided between the color filter and the microlens.

[0052] substrate Examples of the substrate include quartz, glass, silicon wafer, resin, and metal. Furthermore, the substrate may be provided with a switching element such as a transistor, a wiring pattern, and the like, and an insulating layer thereon. The insulating layer may be made of any material as long as it allows contact holes to be formed so that a wiring pattern can be formed between the first electrode and the substrate, and insulation from unconnected wiring patterns is ensured. For example, the insulating layer may be made of a resin such as polyimide, silicon oxide, silicon nitride, or the like.

[0053] electrode A pair of electrodes can be used as the electrodes. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode, and the other is the cathode. It can also be said that the electrode that supplies holes to the light-emitting layer is the anode, and the electrode that supplies electrons is the cathode.

[0054] A material with a high work function may be selected as the anode material. For example, a metal such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, or tungsten, a mixture containing these metals, or an alloy combining these metals may be used as the anode material. Alternatively, a metal oxide such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), or zinc indium oxide may be used as the anode material. Alternatively, a conductive polymer such as polyaniline, polypyrrole, or polythiophene may be used as the anode material.

[0055] These electrode materials may be used alone or in combination of two or more. The anode may be composed of one layer or multiple layers.

[0056] When the electrode is used as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys thereof, or laminates thereof can be used. The above materials can also function as a reflective film without functioning as an electrode. Furthermore, when a transparent electrode is used as the electrode, a transparent conductive oxide layer such as indium tin oxide (ITO) or indium zinc oxide can be used, but is not limited to these. Photolithography technology can be used to form the electrode.

[0057] On the other hand, a material with a low work function may be selected as the cathode material. Examples include simple metals such as alkali metals (e.g., lithium), alkaline earth metals (e.g., calcium), aluminum, titanium, manganese, silver, lead, and chromium, as well as mixtures containing these metals. Alternatively, alloys combining these simple metals may be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, and zinc-silver may be used. Metal oxides such as indium tin oxide (ITO) may also be used. These electrode materials may be used alone or in combination. The cathode may have a single-layer or multi-layer structure. Silver may be used as the cathode, and a silver alloy may be used to reduce silver aggregation. The alloy ratio is not important as long as silver aggregation is reduced. For example, the silver:other metal ratio may be 1:1 or 3:1.

[0058] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but using a DC or AC sputtering method, for example, can provide good coverage of the formed film and reduce the resistance of the cathode.

[0059] Pixel isolation layer The pixel separation layer may be formed of silicon oxides such as silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO) formed using a chemical vapor deposition (CVD) method. To increase the in-plane resistance of the organic compound layer, the thickness of the organic compound layer, particularly the hole transport layer, may be thinned on the sidewalls of the pixel separation layer. Specifically, the thickness of the organic compound layer on the sidewalls can be thinned by increasing the taper angle of the sidewalls of the pixel separation layer or the thickness of the pixel separation layer, thereby increasing vignetting during deposition.

[0060] On the other hand, the sidewall taper angle and film thickness of the pixel separation layer can be adjusted to the extent that voids are not formed in the protective layer formed thereon. By preventing voids from being formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, deterioration of reliability such as the occurrence of dark spots and poor conduction of the second electrode can be reduced.

[0061] According to this embodiment, charge leakage to adjacent pixels can be effectively suppressed even if the taper angle of the sidewall of the pixel separation layer is not steep. As a result of this study, it was found that charge leakage can be sufficiently reduced if the taper angle is between 60 degrees and 90 degrees. The thickness of the pixel separation layer may be between 10 nm and 150 nm. Similar effects can also be achieved even if the pixel separation layer is composed only of pixel electrodes without a pixel separation layer. However, in this case, short circuits in organic light-emitting elements can be reduced by making the thickness of the pixel electrode less than half that of the organic layer or by making the edge of the pixel electrode forward tapered at less than 60 degrees.

[0062] Furthermore, even when the first electrode is a cathode and the second electrode is an anode, a wide color gamut and low-voltage operation are possible by forming an electron transport material and a charge transport layer, and an emitting layer on the charge transport layer.

[0063] organic compound layer The organic compound layer may be formed as a single layer or as multiple layers. When multiple layers are present, they may be called hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc., depending on their functions. The organic compound layer is mainly composed of organic compounds but may also contain inorganic atoms or inorganic compounds. The organic compound layer may contain, for example, copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0064] protective layer A protective layer may be provided on the cathode. For example, by adhering glass with a moisture absorbent on the cathode, the penetration of moisture and other contaminants into the organic compound layer can be reduced, thereby reducing the occurrence of display defects. In another embodiment, a passivation layer such as silicon nitride may be provided on the cathode to reduce the penetration of moisture and other contaminants into the organic compound layer. For example, after forming the cathode, the cathode may be transferred to another chamber without breaking the vacuum, and a 2 μm-thick silicon nitride may be formed by CVD to serve as a protective layer. After forming the protective layer by CVD, a protective layer may be formed by atomic layer deposition (ALD). The material of the protective layer formed by ALD is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed by CVD on the protective layer formed by ALD. The protective layer formed by ALD may have a thickness smaller than that of the protective layer formed by CVD. Specifically, the thickness of the protective layer formed by ALD may be 50% or less, or even 10% or less, of the protective layer formed by CVD.

[0065] Color filters A color filter may be provided on the protective layer. For example, a color filter taking into consideration the size of the organic light-emitting element may be provided on another substrate, and the substrate on which the color filter is formed may be bonded to the substrate on which the organic light-emitting element is provided. Alternatively, for example, a color filter may be patterned on the above-mentioned protective layer using photolithography technology. The color filter may be made of a polymer.

[0066] planarization layer A planarization layer may be disposed between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the layers below the planarization layer. It may also be called a material resin layer without limiting the purpose. The planarization layer may be composed of an organic compound, and may be a low molecular weight or a high molecular weight. In consideration of reducing the unevenness, a high molecular weight organic compound may be used for the planarization layer.

[0067] The planarization layers may be provided above and below the color filter. In this case, the constituent materials of the planarization layers may be the same or different. Specific examples of the material for the planarization layer include polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0068] Microlenses The organic light-emitting device may have an optical component such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be intended to increase the amount of light extracted from the organic light-emitting device or to control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be determined in the same way in any cross-sectional view. In other words, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the semicircle is the vertex of the microlens.

[0069] It is also possible to define the midpoint of a microlens. In the cross section of the microlens, a line segment is imagined from the point where an arc shape ends to the point where another arc shape ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0070] The microlens has a first surface having a convex portion and a second surface opposite the first surface. The second surface can be disposed closer to the functional layer (light-emitting layer) than the first surface. To achieve this configuration, it is necessary to form the microlens on the light-emitting device. If the functional layer is an organic layer, high-temperature processes can be avoided in the microlens manufacturing process. Furthermore, if the second surface is disposed closer to the functional layer than the first surface, the glass transition temperatures of the organic compounds constituting the organic layer may all be 100°C or higher, and are preferably, for example, 130°C or higher.

[0071] Counter substrate An opposing substrate may be disposed on the planarization layer. The opposing substrate is called an opposing substrate because it is provided at a position corresponding to the aforementioned substrate. The opposing substrate may be made of the same material as the aforementioned substrate. When the aforementioned substrate is defined as a first substrate, the opposing substrate may be a second substrate.

[0072] organic layer The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light-emitting element according to an embodiment of the present disclosure may be formed by the following method.

[0073] The organic compound layer constituting the organic light-emitting device according to the embodiment of the present disclosure can be formed by dry processes such as vacuum deposition, ionization deposition, sputtering, plasma, etc. Alternatively to the dry process, a wet process can be used in which the compound is dissolved in an appropriate solvent and a layer is formed by a known coating method (e.g., spin coating, dipping, casting, LB method, inkjet method, etc.).

[0074] Here, when a layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur and the layer has excellent stability over time. When a film is formed by a coating method, the film can be formed by combining it with an appropriate binder resin.

[0075] Examples of the binder resin include polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, urea resin, etc. However, the binder resin is not limited to these.

[0076] These binder resins may be used singly or in combination as homopolymers or copolymers, and may further contain known additives such as plasticizers, antioxidants, and ultraviolet absorbers, as needed.

[0077] Pixel circuit The light-emitting device may have a pixel circuit connected to the light-emitting element. The pixel circuit may be an active matrix type that controls the emission of the first light-emitting element and the second light-emitting element independently. The active matrix type circuit may be voltage-programmed or current-programmed. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the emission brightness of the light-emitting element, a transistor that controls the emission timing, a capacitor that holds the gate voltage of the transistor that controls the emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0078] The light-emitting device has a display region and a peripheral region arranged around the display region. The display region has pixel circuits, and the peripheral region has a display control circuit. The mobility of a transistor constituting the pixel circuit may be lower than the mobility of a transistor constituting the display control circuit.

[0079] The slope of the current-voltage characteristics of the transistors that make up the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistors that make up the display control circuit. The slope of the current-voltage characteristics can be measured using the so-called Vg-Ig characteristics.

[0080] The transistors that make up the pixel circuit are transistors connected to the light-emitting elements, such as the first light-emitting element.

[0081] pixel An organic light emitting device includes a plurality of pixels, each of which includes sub-pixels that emit different colors, for example, RGB colors.

[0082] A pixel has an area called a pixel aperture that emits light. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0083] The spacing between the subpixels may be 10 μm or less, and specifically may be 8 μm, 7.4 μm, or 6.4 μm.

[0084] The pixels may be arranged in a known manner in a plan view. For example, they may be in a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the subpixels in a plan view may be any known shape. For example, they may be rectangular, quadrilaterals such as diamonds, or hexagons. Of course, a shape that is close to a rectangle, rather than an exact shape, is included in the rectangle. The shape of the subpixels and the pixel arrangement may be used in combination.

[0085] Uses of the organic light-emitting device according to embodiments of the present disclosure The organic light-emitting device according to the embodiment of the present disclosure can be used as a component of a display device or a lighting device, and can also be used as an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, or a light-emitting device having a white light source and a color filter.

[0086] The display device may be an image information processing device that has an image input unit that inputs image information from an area CCD, linear CCD, memory card, etc., has an information processing unit that processes the input information, and displays the input image on the display unit.

[0087] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. The display device may also be used in the display unit of a multifunction printer.

[0088] Next, further explanation will be given with reference to the drawings. FIG. 10(a) shows an example of a pixel, which is a component of the pixel array unit 101 described above. The pixel has sub-pixels 810. The sub-pixels are divided into 810R, 810G, and 810B based on their light emission. The emitted colors may be distinguished by the wavelength of light emitted from the light-emitting layer, or the light emitted from the sub-pixels may be selectively transmitted or color-converted using a color filter or the like. Each sub-pixel has a reflective electrode 802 as a first electrode on an interlayer insulating layer 801, an insulating layer 803 covering the edge of the reflective electrode 802, an organic compound layer 804 covering the first electrode and the insulating layer, a transparent electrode 805 as a second electrode, a protective layer 806, and a color filter 807.

[0089] A transistor and a capacitor may be disposed below or inside the interlayer insulating layer 801. The transistor and the first electrode may be electrically connected via a contact hole (not shown) or the like.

[0090] The insulating layer 803 may also be called a bank or a pixel separation film. The insulating layer 803 covers the edges of the first electrodes and is disposed to surround the first electrodes. The portions of the first electrodes not covered by the insulating layer 803 come into contact with the organic compound layer 804 and become light-emitting regions.

[0091] The organic compound layer 804 includes a hole injection layer 841 , a hole transport layer 842 , a first light-emitting layer 843 , a second light-emitting layer 844 , and an electron transport layer 845 .

[0092] The second electrode may be a transparent electrode, a reflective electrode, or a semi-transparent electrode.

[0093] The protective layer 806 reduces the penetration of moisture into the organic compound layer. Although the protective layer is illustrated as a single layer, it may be a multi-layer structure. Each layer may be an inorganic compound layer and an organic compound layer.

[0094] The color filters 807 are divided into 807R, 807G, and 807B depending on their colors. The color filters may be formed on a planarization film (not shown). A resin protective layer (not shown) may be disposed on the color filters. The color filters may be formed on a protective layer 806. The color filters may be provided on an opposing substrate such as a glass substrate and then bonded thereto.

[0095] A display device 800 in FIG. 10(b) (corresponding to the light-emitting device 10 described above) may have an organic light-emitting element 826 and a TFT 818, which is an example of a transistor. An insulating layer 812 is provided on a substrate 811 made of glass, silicon, or the like. An active element such as the TFT 818 is disposed on the insulating layer 812, and a gate electrode 813, a gate insulating film 814, and a semiconductor layer 815 of the active element are disposed on the insulating layer 812. The TFT 818 may also include the semiconductor layer 815, a drain electrode 816, and a source electrode 817. An insulating film 819 is provided on the TFT 818. An anode 821 and a source electrode 817 constituting the organic light-emitting element 826 are connected via a contact hole 820 provided in the insulating film 819.

[0096] The electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 826 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the embodiment shown in Figure 10(b). In other words, it is sufficient that either the anode or the cathode is electrically connected to either the TFT source electrode or the drain electrode. TFT stands for thin film transistor.

[0097] In the display device 800 of FIG. 10(b), the organic compound layer is illustrated as if it were a single layer, but the organic compound layer 822 may be a plurality of layers. On the cathode 823, a first protective layer 824 and a second protective layer 825 for reducing the deterioration of the organic light-emitting element are provided.

[0098] In the display device 800 of FIG. 10(b), a transistor is used as the switching element, but another switching element may be used instead.

[0099] Further, the transistor used in the display device 800 of FIG. 10(b) is not limited to a transistor using a single crystal silicon wafer, and may also be a thin film transistor having an active layer on an insulating surface of a substrate. Examples of the active layer include non-single crystal silicon such as single crystal silicon, amorphous silicon, and microcrystalline silicon, and non-single crystal oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Note that the thin film transistor is also called a TFT element.

[0100] The transistor included in the display device 800 of FIG. 10(b) may be formed in a substrate such as a silicon substrate. Here, forming in the substrate means manufacturing a transistor by processing the substrate itself such as a silicon substrate. That is, having a transistor in the substrate can also be regarded as the substrate and the transistor being integrally formed.

[0101] The organic light-emitting element according to the present embodiment has its emission luminance controlled by a TFT which is an example of a switching element, and an image can be displayed by the emission luminance of each organic light-emitting element provided in a plurality of planes. Here, the switching element according to the present embodiment is not limited to a TFT, and may be a transistor formed of low-temperature polysilicon or an active matrix driver formed on a substrate such as a silicon substrate. "On the substrate" can also mean "in the substrate". Whether to provide a transistor in the substrate or use a TFT is selected according to the size of the display portion. For example, if the size is about 0.5 inches, an organic light-emitting element may be provided on a silicon substrate.

[0102] 11(a) to 11(c) are schematic diagrams showing an example of an image forming apparatus using the above-described light emitting device 10. The image forming apparatus 926 shown in Fig. 11(a) includes a photosensitive member 927, an exposure light source 928, a developing unit 931, a charging unit 930, a transfer unit 932, a transport unit 933 (the transport roller in the configuration of Fig. 11(a)), and a fixing unit 935.

[0103] Light 929 is emitted from an exposure light source 928, and an electrostatic latent image is formed on the surface of the photoconductor 927. The light emitting device 10 can be applied to this exposure light source 928. The developing unit 931 contains toner or the like as a developer and can function as a developing device that applies the developer to the exposed photoconductor 927. The charging unit 930 charges the photoconductor 927. The transfer unit 932 transfers the developed image to a recording medium 934. The transport unit 933 transports the recording medium 934. The recording medium 934 can be, for example, paper or film. The fixing unit 935 fixes the image formed on the recording medium.

[0104] 11(b) and 11(c) are schematic diagrams showing an exposure light source 928 in which a plurality of light-emitting sections 936 are arranged along the longitudinal direction of a long substrate. The light-emitting device 10 can be applied to this light-emitting section 936. That is, a plurality of pixels 150 arranged in the pixel array 110 are arranged along the longitudinal direction of the substrate. A direction 937 is parallel to the axis of the photoconductor 927. This column direction is the same as the axial direction of the photoconductor 927 when it rotates. This direction 937 can also be called the long axis direction of the photoconductor 927.

[0105] FIG. 11(b) shows a configuration in which the light-emitting units 936 are arranged along the longitudinal axis direction of the photosensitive element 927. FIG. 11(c) shows a modified configuration of the arrangement of the light-emitting units 936 shown in FIG. 11(b). FIG. 11(c) shows a configuration in which the light-emitting units 936 are arranged alternately in the column direction in each of the first and second columns. The light-emitting units 936 are arranged at different positions in the row direction in the first and second columns. In the first column, multiple light-emitting units 936 are arranged at intervals, and in the second column, light-emitting units 936 are arranged at positions corresponding to the gaps between the light-emitting units 936 in the first column. Multiple light-emitting units 936 are also arranged at intervals in the row direction. The arrangement of the light-emitting units 936 shown in FIG. 11(c) can be described as, for example, a grid-like arrangement, a houndstooth arrangement, or a checkerboard pattern.

[0106] FIG. 12 is a schematic diagram illustrating an example of a display device using the light-emitting device 10 described above. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected to flexible printed circuits FPCs 1002 and 1004. Active elements such as transistors are disposed on the circuit board 1007. The battery 1008 may not be disposed if the display device 1000 is not a portable device, and even if it is a portable device, it does not need to be disposed in this position. The light-emitting device 10 can be applied to the display panel 1005. The pixels 150 disposed in the pixel array section 101 of the light-emitting device 10 functioning as the display panel 1005 are connected to active elements such as transistors disposed on the circuit board 1007 and operate.

[0107] The display device 1000 shown in FIG. 12 may be used as a display unit of a photoelectric conversion device (which may also be called an imaging device) that has an optical unit with multiple lenses and an imaging element that receives light that has passed through the optical unit and photoelectrically converts it into an electrical signal. The photoelectric conversion device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the photoelectric conversion device or a display unit located within a viewfinder. The photoelectric conversion device may be a digital camera or a digital video camera.

[0108] FIG. 13 is a schematic diagram illustrating an example of a photoelectric conversion device 1100 using the light-emitting device 10 described above. The photoelectric conversion device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The photoelectric conversion device 1100 may also be referred to as an imaging device. The light-emitting device 10 of this embodiment may be applied to the viewfinder 1101 or the rear display 1102, which are display units. In this case, the pixel array unit 101 of the light-emitting device 10 may display not only an image to be captured, but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the moving speed of a subject, the possibility that the subject will be blocked by an obstruction, and the like.

[0109] Since the timing suitable for capturing an image is often very short, it is better to display information as soon as possible. Therefore, a light emitting device 10 in which pixels 150 including light emitting elements using an organic light emitting material such as an organic EL element are arranged in a pixel array section 101 may be used in a viewfinder 1101 or a rear display 1102. This is because organic light emitting materials have a fast response speed. A light emitting device 10 using an organic light emitting material is more suitable than a liquid crystal display device for these devices, which require a high display speed.

[0110] The photoelectric conversion device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on a photoelectric conversion element (not shown) housed in a housing 1104 that receives light that has passed through the optical section. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically.

[0111] The light emitting device 10 may be applied to a display unit of an electronic device. In this case, the light emitting device 10 may have both a display function and an operation function. Examples of the portable terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0112] FIG. 14 is a schematic diagram showing an example of an electronic device 1200 using the light-emitting device 10 described above. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit 1202 may be a biometric recognition unit that recognizes a fingerprint to perform unlocking or the like. A portable device having a communication unit can also be called a communication device. The light-emitting device 10 can be applied to the display unit 1201.

[0113] 15(a) and 15(b) are schematic diagrams illustrating an example of a display device 1300 using the light-emitting device 10 described above. FIG. 15(a) illustrates a display device such as a television monitor or a PC monitor. The display device 1300 includes a frame 1301 and a display unit 1302. The light-emitting device 10 can be applied to the display unit 1302. The display device 1300 may include a base 1303 that supports the frame 1301 and the display unit 1302. The base 1303 is not limited to the form illustrated in FIG. 15(a). For example, the bottom edge of the frame 1301 may also serve as the base 1303. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0114] FIG. 15(b) is a schematic diagram illustrating another example of a display device using the light-emitting device 10 described above. The display device 1310 shown in FIG. 15(b) is configured to be bendable and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The light-emitting device 10 can be applied to the first display unit 1311 and the second display unit 1312. The first display unit 1311 and the second display unit 1312 may be a single display unit without any joints. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or the first display unit and the second display unit may display a single image.

[0115] FIG. 16 is a schematic diagram illustrating an example of a lighting device 1400 using the light-emitting device 10 described above. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusion unit 1405. The light-emitting device 10 may be applied to the light source 1402. The optical film 1404 may be a filter that improves the color rendering of the light source. The light diffusion unit 1405 can effectively diffuse light from the light source, such as for lighting, and deliver the light over a wide area. If necessary, a cover may be provided on the outermost part. The lighting device 1400 may include both the optical film 1404 and the light diffusion unit 1405, or only one of them.

[0116] The lighting device 1400 is, for example, a device that illuminates a room. The lighting device 1400 may emit white, daylight white, or any other color from blue to red. It may have a dimming circuit that adjusts the light intensity. The lighting device 1400 may have a power supply circuit connected to the light emitting device 10 that functions as the light source 1402. The power supply circuit is a circuit that converts AC voltage into DC voltage. White has a color temperature of 4200K, and daylight white has a color temperature of 5000K. The lighting device 1400 may also have a color filter. The lighting device 1400 may also have a heat sink. The heat sink dissipates heat from within the device to the outside, and examples of the heat sink include metal with a high specific heat, liquid silicon, etc.

[0117] FIG. 17 is a schematic diagram of an automobile 1500 having a tail lamp, which is an example of a vehicle lamp using the above-described light-emitting device 10. The automobile 1500 may have a tail lamp 1501 that is turned on when the brakes are applied, for example. The above-described light-emitting device 10 may be used as a headlamp as a vehicle lamp. An automobile is an example of a mobile body, and the mobile body may be a ship, a drone, an aircraft, a railroad vehicle, an industrial robot, or the like. The mobile body may have a body and a lamp provided thereon. The lamp may indicate the current location of the body.

[0118] The light emitting device 10 can be applied to a tail lamp 1501. The tail lamp 1501 may have a protective member that protects the light emitting device 10 functioning as the tail lamp 1501. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but may be made of polycarbonate or the like. The protective member may also be made by mixing a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like with polycarbonate.

[0119] The automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window may be a window for checking the front and rear of the automobile, or may be a transparent display such as a head-up display. The light-emitting device 10 may be used in the transparent display. In this case, the constituent materials of the electrodes and the like of the light-emitting device 10 are made of transparent materials.

[0120] 18(a) and 18(b), a further application example of the light emitting device 10 will be described. The light emitting device 10 can be applied to systems that can be worn as a wearable device, such as smart glasses, a head-mounted display (HMD), or smart contacts. An image capturing and displaying device used in such an application example has an image capturing device capable of photoelectrically converting visible light and a light emitting device capable of emitting visible light.

[0121] 18(a) is a diagram showing glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or SPAD is provided on the front side of a lens 1601 of the glasses 1600. In addition, a light emitting device 10 is provided on the back side of the lens 1601.

[0122] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power supply unit that supplies power to the image capture device 1602 and the light emitting device 10. The control device 1603 also controls the operations of the image capture device 1602 and the light emitting device 10. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0123] FIG. 18(b) is a diagram showing glasses 1610 (smart glasses) according to one application example. The glasses 1610 include a control device 1612, which is equipped with an imaging device corresponding to the imaging device 1602 and a light-emitting device 10. A lens 1611 includes an optical system for projecting light emitted from the imaging device in the control device 1612 and the light-emitting device 10, and an image is projected onto the lens 1611. The control device 1612 functions as a power supply unit that supplies power to the imaging device and the light-emitting device 10 and controls the operation of the imaging device and the light-emitting device 10. The control device 1612 may also include a gaze detection unit that detects the gaze of the wearer. Infrared light may be used for gaze detection. The infrared light-emitting unit emits infrared light toward the eyeball of a user gazing at a displayed image. An imaging unit having a light-receiving element detects the emitted infrared light reflected from the eyeball, thereby obtaining an image of the eyeball. By providing a reduction means for reducing the amount of light from the infrared light emitting section to the display section in a plan view, degradation of image quality is reduced.

[0124] The gaze of the user relative to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be used for gaze detection using the image of the eyeball. As an example, a gaze detection method based on the Purkinje image formed by reflection of irradiated light on the cornea can be used.

[0125] More specifically, gaze detection processing is performed based on the pupil-corneal reflex method, which calculates a gaze vector representing the direction (rotation angle) of the eyeball based on the pupil image and Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0126] The light emitting device 10 according to the embodiment of the present disclosure may have an imaging device having a light receiving element, and may control the display image based on information on the user's line of sight from the imaging device.

[0127] Specifically, the light emitting device 10 determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the light emitting device 10, or may be determined by an external control device and received. In the display area of ​​the light emitting device 10, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0128] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first display area and the second display area may be determined by a control device of the light-emitting device 10, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0129] Note that AI may be used to determine the first field of view area and areas with high priority. The AI ​​may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from the image of the eyeball, using as training data an image of the eyeball and the actual direction in which the eyeball in the image was looking. The AI ​​program may be included in the light-emitting device 10, the imaging device, or an external device. If included in an external device, it is transmitted to the light-emitting device 10 via communication.

[0130] When display control is performed based on visual recognition detection, the smart glasses can be applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured outside information in real time.

[0131] The disclosure of the present specification includes at least the following configurations. (Item 1) a pixel array section including a plurality of pixels arranged to form a plurality of rows and a plurality of columns, and a plurality of signal lines extending in the column direction; Each of the plurality of signal lines is divided into a plurality of sub-signal lines, A signal generated using an output signal from the same reference voltage generating circuit is supplied to pixels in the same column via a corresponding sub-signal line. A light-emitting device characterized by: (Item 2) the light emitting device has a first substrate and a second substrate stacked on top of each other; the pixel array section is formed on the first substrate, A signal output circuit that outputs the signal is formed on the second substrate. 2. The light emitting device according to item 1. (Item 3) 3. The light emitting device according to item 2, wherein the second substrate further includes a signal line switching circuit that switches the connection destination of the output of the signal output circuit between the plurality of sub-signal lines. (Item 4) 4. The light emitting device according to item 3, wherein the reference voltage generating circuit is further formed on the second substrate. (Item 5) 5. The light-emitting device according to item 3 or 4, characterized in that the signal line switching circuit includes a plurality of selectors that select, for each pixel column, one of the plurality of sub-signal lines as a connection destination for the output of the signal output circuit. (Item 6) the signal output circuit further includes a column DAC circuit that converts data for each pixel column into an analog signal; 6. The light emitting device according to any one of items 2 to 5, wherein the plurality of sub-signal lines are supplied with signals based on output signals from the column DAC circuit. (Item 7) the signal output circuit further includes a column driver circuit that outputs a luminance signal according to the output signal from the column DAC circuit; 7. The light emitting device according to item 6, wherein the plurality of sub-signal lines are supplied with signals based on output signals from the column driver circuit. (Item 8) a first sub-signal line connected to the second substrate via a first connection portion provided on the first substrate; a second sub-signal line is connected to the second substrate via a second connection portion provided on the first substrate; the first connection portion and the second connection portion are provided at ends of the first sub-signal line and the second sub-signal line that are closer to each other; 8. The light emitting device according to any one of items 2 to 7, (Item 9) a first sub-signal line connected to the second substrate via a first connection portion provided on the first substrate; a second sub-signal line is connected to the second substrate via a second connection portion provided on the first substrate; the first connection portion and the second connection portion are provided at ends of the first sub-signal line and the second sub-signal line that are farther from each other; 8. The light emitting device according to any one of items 2 to 7, (Item 10) The plurality of signal lines are a first region being one of two regions obtained by dividing the region including the plurality of pixels into two by a line parallel to the row direction, a first plurality of sub-signal lines provided for each pixel column; a second plurality of sub-signal lines provided for each pixel column in a second region that is the other of the two regions; 10. The light emitting device according to any one of items 1 to 9, comprising: (Item 11) The plurality of signal lines are a first region among four regions obtained by dividing the region including the plurality of pixels into four regions along lines parallel to the row direction, wherein a first plurality of sub-signal lines are provided for each pixel column in a first region; a second plurality of sub-signal lines provided for each pixel column in a second region of the four regions; a third plurality of sub-signal lines provided for each pixel column in a third region of the four regions; a fourth plurality of sub-signal lines provided for each pixel column in a fourth region of the four regions; 10. The light emitting device according to any one of items 1 to 9, comprising: (Item 12) a photosensitive member, an exposure light source for exposing the photosensitive member, a developing device for applying a developer to the exposed photosensitive member, and a transfer device for transferring an image developed by the developing device onto a recording medium, 12. An image forming apparatus, characterized in that the exposure light source comprises the light emitting device according to any one of items 1 to 11. (Item 13) 12. A display device comprising: the light-emitting device according to any one of items 1 to 11; and an active element connected to the light-emitting device. (Item 14) an optical unit having a plurality of lenses, an image pickup element that receives light that has passed through the optical unit, and a display unit that displays an image picked up by the image pickup element; 12. A photoelectric conversion device, wherein the display unit comprises the light-emitting device according to any one of items 1 to 11. (Item 15) 12. An electronic device comprising: a display unit having the light-emitting device according to any one of items 1 to 11; a housing in which the display unit is provided; and a communication unit provided in the housing for communicating with the outside. (Item 16) 12. A lighting device comprising: a light source having the light-emitting device according to any one of items 1 to 11; and a light diffusion section or optical film that transmits light emitted by the light source. (Item 17) 12. A moving body comprising: a lighting fixture having the light-emitting device according to any one of items 1 to 11; and a vehicle on which the lighting fixture is mounted. (Item 18) 1. A wearable device having a display device for displaying an image, A wearable device characterized in that the display device has the light-emitting device described in any one of items 1 to 11.

[0132] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0133] 10: Light emitting device, 100: Pixel substrate, 101: Pixel array section, 102: Pixel, 103: Signal line, 104: Signal line, 200: Circuit substrate, 201: Signal output circuit, 202: Horizontal scanning circuit, 203: Column DAC circuit, 204: Column driver circuit, 205: Control circuit, 206: Reference voltage generation circuit, 207: Signal line switching circuit

Claims

1. a pixel array section including a plurality of pixels arranged to form a plurality of rows and a plurality of columns, and a plurality of signal lines extending in the column direction; Each of the plurality of signal lines is divided into a plurality of sub-signal lines, A signal generated using an output signal from the same reference voltage generating circuit is supplied to pixels in the same column via a corresponding sub-signal line. A light-emitting device characterized by:

2. The light emitting device includes a first substrate and a second substrate stacked on top of each other, the pixel array unit is formed on the first substrate, A signal output circuit that outputs the signal is formed on the second substrate.

2. The light emitting device according to claim 1.

3. 3. The light emitting device according to claim 2, further comprising a signal line switching circuit formed on the second substrate, the signal line switching circuit switching a destination of an output of the signal output circuit between the plurality of sub-signal lines.

4. 4. The light emitting device according to claim 3, wherein the reference voltage generating circuit is further formed on the second substrate.

5. 4. The light emitting device according to claim 3, wherein the signal line switching circuit includes a plurality of selectors that select one of the plurality of sub-signal lines for each pixel column as a connection destination for the output of the signal output circuit.

6. the signal output circuit further includes a column DAC circuit that converts data for each pixel column into an analog signal; 3. The light emitting device according to claim 2, wherein the plurality of sub-signal lines are supplied with signals based on output signals from the column DAC circuit.

7. the signal output circuit further includes a column driver circuit that outputs a luminance signal according to the output signal from the column DAC circuit; 7. The light emitting device according to claim 6, wherein the plurality of sub-signal lines are supplied with signals based on output signals from the column driver circuit.

8. a first sub-signal line connected to the second substrate via a first connection portion provided on the first substrate; a second sub-signal line connected to the second substrate via a second connection portion provided on the first substrate; the first connection portion and the second connection portion are provided at ends of the first sub-signal line and the second sub-signal line that are closer to each other; 3. The light emitting device according to claim 2.

9. a first sub-signal line connected to the second substrate via a first connection portion provided on the first substrate; a second sub-signal line is connected to the second substrate via a second connection portion provided on the first substrate; the first connection portion and the second connection portion are provided at ends of the first sub-signal line and the second sub-signal line that are farther from each other; 3. The light emitting device according to claim 2.

10. The plurality of signal lines are a first region being one of two regions obtained by dividing the region including the plurality of pixels into two by a line parallel to the row direction, a first plurality of sub-signal lines provided for each pixel column; a second plurality of sub-signal lines provided for each pixel column in a second region that is the other of the two regions; 2. The light emitting device according to claim 1, comprising:

11. The plurality of signal lines are a first region among four regions obtained by dividing the region including the plurality of pixels into four regions along lines parallel to the row direction, wherein a first plurality of sub-signal lines are provided for each pixel column in a first region; a second plurality of sub-signal lines provided for each pixel column in a second region of the four regions; a third plurality of sub-signal lines provided for each pixel column in a third region of the four regions; a fourth plurality of sub-signal lines provided for each pixel column in a fourth region of the four regions; 2. The light emitting device according to claim 1, comprising:

12. a photosensitive member, an exposure light source for exposing the photosensitive member, a developing device for applying a developer to the exposed photosensitive member, and a transfer device for transferring an image developed by the developing device onto a recording medium, An image forming apparatus, comprising the light emitting device according to claim 1 as the exposure light source.

13. A display device comprising: the light-emitting device according to claim 1; and an active element connected to the light-emitting device.

14. an optical unit having a plurality of lenses, an image pickup element that receives light that has passed through the optical unit, and a display unit that displays an image picked up by the image pickup element; 12. A photoelectric conversion device, wherein the display section comprises the light-emitting device according to claim 1.

15. 12. An electronic device comprising: a display unit having the light-emitting device according to claim 1; a housing in which the display unit is provided; and a communication unit provided in the housing for communicating with an external device.

16. 12. An illumination device comprising: a light source having the light-emitting device according to claim 1; and a light diffusion portion or an optical film that transmits light emitted by the light source.

17. A moving body comprising: a lighting fixture having the light-emitting device according to any one of claims 1 to 11; and a body on which the lighting fixture is provided.

18. 1. A wearable device having a display device for displaying an image, A wearable device, wherein the display device comprises the light-emitting device according to claim 1 .

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