Printed circuit board
The integration of a glass layer with a via structure in a substrate cavity addresses the challenge of high-speed data transmission and optical waveguide formation in conventional organic packages, ensuring transparency and improved signal transmission.
JP2025137380APending Publication Date: 2025-09-19SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information
- Application Number
- JP2024211526
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-06
- Filing Date
- 2024-12-04
- Publication Date
- 2025-09-19
AI Technical Summary
Technical Problem
Conventional organic packages face challenges in achieving sufficient transmission speeds and transparency, limiting the formation of optical waveguides due to increased chip speeds.
Method used
Incorporating a glass layer with a via structure containing an optical waveguide pattern into a substrate cavity to enable optical signal transmission between layers.
Benefits of technology
Ensures transparency and facilitates easy formation of optical waveguides, enhancing data transmission speed and quality.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide a printed circuit board which can secure a sufficient transmittance and can easily form an optical waveguide for transmitting a light signal.SOLUTION: The present invention relates to a printed circuit board 100A including: a substrate 110 having a cavity H; and a via structure 150 at least partially disposed in the cavity H, the via structure 150 including: a glass layer 151; a first optical waveguide pattern 152 on the glass layer 151; and a dielectric layer 153 disposed on the glass layer 151 and covering at least a part of the first optical waveguide pattern 152.SELECTED DRAWING: Figure 3
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