Semiconductor device with elasticity
The stretchable semiconductor device addresses peeling and connection issues by using a combination of stretchable and non-stretchable substrates with adjusted wiring layers and through electrodes, stabilizing semiconductor element operation.
JP2025153008APending Publication Date: 2025-10-10NIPPON HOSO KYOKAI
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Patent Information
- Application Number
- JP2024055257
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-10-10
AI Technical Summary
Technical Problem
Conventional stretchable semiconductor devices experience peeling between substrates and semiconductor elements, instability in electrical connections, and increased wiring resistance due to varying lengths of wiring, leading to signal delays and operational instability.
Method used
A stretchable semiconductor device with a stretchable resin substrate and non-stretchable resin substrates, featuring wiring layers with varying cross-sectional areas and thicknesses to minimize wiring resistance differences, and using fluid metal materials and through electrodes for stable connections.
Benefits of technology
The device stabilizes semiconductor element operation by reducing the impact of stretching and signal delays, ensuring consistent performance.
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Abstract
To provide a semiconductor device with elasticity, in which, by reducing a difference in wiring resistances caused by the different lengths of stretchable wiring layers, the effects of expansion and contraction on a semiconductor element are reduced and the operation of the semiconductor element can be stabilized.SOLUTION: A semiconductor device with elasticity includes: a plurality of wiring layers 9a, 9b, 10a, 10b which are provided in a stretchable manner between adjacent ones of a plurality of non-stretchable resin substrates 3 on a side of a surface, of a stretchable resin substrate 2, facing the non-stretchable resin substrates 3; and non-stretchable wiring boards 11, 12 electrically connected to ends of the wiring layers 9a, 10b, among the plurality of wiring layers 9a, 9b, 10a, 10b, which are arranged in a peripheral area E surrounding the periphery of the plurality of non-stretchable resin substrates 3 and are extended to the peripheral area E. In the wiring layers 9a, 10b extended to the peripheral area E, cross sectional areas of the wiring layers 9a, 10b are different from each other depending on the lengths of the respective wiring layers 9a, 10b so as to reduce a difference in the wiring resistances thereof.SELECTED DRAWING: Figure 1
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