Epoxy resin composition, epoxy resin cured product, prepreg, fiber-reinforced composite material, repair method of epoxy resin cured product, repair method of fiber-reinforced composite material, re-molding method of epoxy resin cured product, re-molding method of fiber-reinforced composite material, decomposition method of epoxy resin cured product, and reinforcement fiber recovery method of fiber-reinforced composite material

The epoxy resin composition with dynamic covalent bonding moieties and controlled active hydrogen ratio addresses the inefficiencies of existing compositions by enabling remoldability and self-repairability while maintaining mechanical and thermal properties, facilitating the reuse of cured products.

JP2025154240APending Publication Date: 2025-10-10TEIJIN LTD
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Patent Information

Application Number
JP2024057131
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-29
Publication Date
2025-10-10

AI Technical Summary

Technical Problem

Existing epoxy resin compositions require excessive amounts of expensive compounds with dynamic covalent bonding sites to achieve sufficient fluidity, which impair the heat resistance and mechanical properties of the cured product, and methods to reuse cured products are inefficient.

Method used

An epoxy resin composition using a curing agent with dynamic covalent bonding moieties in an amount equal to or less than the theoretical equivalent, combined with a specific ratio of active hydrogen, allowing for excellent remoldability and self-repairability in the cured product.

Benefits of technology

The composition achieves remoldability and self-repairability in the cured product, maintaining high mechanical properties and heat resistance, and enables methods for repairing, remolding, decomposing, and recovering reinforcing fibers from fiber-reinforced composite materials.

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Abstract

To provide an epoxy resin composition which is excellent in re-moldability and self-repair property in a cured product, in use of a compound containing a dynamic covalent bond equal to or less than a theoretical equivalent to an epoxy resin, an epoxy resin cured product obtained by curing the epoxy resin composition, a prepreg, a fiber-reinforced composite material, a repair method, a re-molding method and a decomposition method of an epoxy resin cured product, and a repair method, a re-molding method and a reinforcement fiber recovery method of a fiber-reinforced composite material.SOLUTION: An epoxy resin composition contains at least an epoxy resin [A] and a curing agent [B], wherein an average epoxy equivalent of the epoxy resin [A] is within a range of 320 g / eq or more and 5,000 g / eq or less, the curing agent [B] contains at least a curing agent [B1] containing a dynamic covalent bond Y, the curing agent [B1] contains active hydrogen, and a ratio (b1) / (a) of a molar quantity (b1) of the active hydrogen to a molar quantity (a) of an epoxy group in the epoxy resin [A] is within a range of 0.25 or more and 2.0 or less.SELECTED DRAWING: None
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