Wiring board and head mount display

Abstract

To provide a wiring board and a head mount display that achieves both visibility (transparency) and performance for film antennas mountable in the transparent area of smart glasses.SOLUTION: In a wiring board, a mesh wiring layer 20 formed on a substrate 11 corresponding to an antenna has a plurality of openings 23 formed by being surrounded by mutually adjacent first direction wiring 21 and mutually adjacent second direction wiring 22. The transparent substrate 11 is exposed from each opening 23. This enhances the overall transparency of the wiring board.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] An embodiment of the present disclosure relates to a wiring board and a head-mounted display. [Background technology]

[0002] Currently, mobile devices such as smartphones, tablets, and smart glasses (AR, MR, etc.) These mobile terminal devices are becoming more sophisticated, smaller, thinner and lighter. Since the communication band is used, multiple antennas are required according to the communication band. The terminal equipment includes a telephone antenna, a WiFi (Wireless Fidelity) antenna, a 3G (Gen 4G (Generation) antenna, 5G (Generation) antenna , LTE (Long Term Evolution) antenna, Bluetooth (registered trademark) antenna, NF It is equipped with multiple antennas, including an antenna for C (Near Field Communication). However, as mobile terminal devices become smaller, the space available for mounting antennas is limited. The degree of freedom in antenna design is limited. Therefore, the radio wave sensitivity is not necessarily satisfactory.

[0003] Therefore, a filter that can be mounted on the display area of ​​a mobile terminal device or the transparent area of ​​smart glasses is This film antenna has an antenna pattern on a transparent substrate. In the transparent antenna having the opaque conductive layer formed thereon, the antenna pattern is A mesh-like conductive mesh layer consisting of a conductive portion as a conductive layer and a number of openings as non-conductive portions. It is formed by [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-66610 Summary of the Invention [Problem to be solved by the invention]

[0005] For example, in a conventional film antenna, one or more A mesh wiring layer is mounted. Such a mesh wiring layer is used for wireless communication or eye tracking. Therefore, there is a need to improve the performance of such functions. It is being considered.

[0006] The present embodiment is directed to a wiring board and a head-mounted display that can improve performance. Provide play. [Means for solving the problem]

[0007] The embodiments of the present disclosure relate to the following [1] to [9].

[0008] [1] A wiring board, a transparent substrate; a mesh wiring layer disposed on the substrate; a plurality of electronic components electrically connected to the mesh wiring layer; The mesh wiring layer includes: a first dark layer disposed on the substrate; a metal layer disposed on the first dark layer; a second dark layer covering the first dark layer and the metal layer; A plurality of terminal portions are formed on the mesh wiring layer, The electronic components are arranged at intervals from one another and have different front faces. A wiring board mounted on the terminal section.

[0009] [2] The wiring according to [1], wherein the glass transition temperature of the substrate is 150°C or higher and 400°C or lower. substrate.

[0010] [3] The wiring board according to [1] or [2], wherein the electronic component includes a light-emitting element.

[0011] [4] The wiring board according to [3], wherein the light emitting element emits light having an infrared wavelength.

[0012] [5] The mesh wiring layer is configured as an antenna, and the electronic component is an antenna driver. The wiring board according to [1] or [2], which includes a semiconductor element for operation.

[0013] [6] The mesh wiring layer is configured as an antenna, and the electronic component is a light emitting element. and a semiconductor element for driving the antenna, substrate.

[0014] [7] A dummy wiring layer electrically independent from the mesh wiring layer is provided around the mesh wiring layer. The wiring board according to any one of [1] to [6], wherein

[0015] [8] A plurality of the dummy wiring layers are provided, and openings in the mesh wiring layer and the dummy wiring layer are formed. The ratio gradually increases from the mesh wiring layer to the dummy wiring layer far from the mesh wiring layer. The wiring board according to [7], wherein the wiring board is gradually increased in size.

[0016] [9] The frame and a transparent display attached to the frame; an imaging unit attached to the frame, The display device includes: [1] to [8], and a wiring board according to any one of [1] to [8]. a display unit laminated on the wiring board.

[0017]

[10] The wiring board has a peripheral portion attached to the frame and a portion surrounded by the peripheral portion. a central portion; The head mounted display according to [9], wherein the electronic component is arranged in the central portion. stomach. [Effects of the Invention]

[0018] According to the embodiment of the present disclosure, the performance of the wiring board and the head mounted display is improved. can. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a perspective view showing a head-mounted display according to an embodiment. [Figure 2] FIG. 2 is a front view (view taken along line II in FIG. 1) showing the head mounted display according to the embodiment. [Figure 3] FIG. 3 is a cross-sectional view (cross-sectional view taken along line III-III in FIG. 2) showing the display device of the head-mounted display according to the embodiment. [Figure 4] FIG. 4 is a cross-sectional view (cross-sectional view taken along line IV-IV in FIG. 2) showing the display device of the head-mounted display according to the embodiment. [Figure 5] FIG. 5 is an enlarged plan view showing the wiring board according to the embodiment. [Figure 6] FIG. 6 is a cross-sectional view (a cross-sectional view taken along line VI-VI in FIG. 5) showing the wiring board according to the embodiment. [Figure 7]FIG. 7 is a cross-sectional view (cross-sectional view taken along line VII-VII in FIG. 5) showing the wiring board according to the embodiment. [Figure 8A] FIG. 8A is a cross-sectional view showing a method for manufacturing a wiring board according to one embodiment. [Figure 8B] FIG. 8B is a cross-sectional view showing the method for manufacturing the wiring board according to the embodiment. [Figure 8C] FIG. 8C is a cross-sectional view showing the method for manufacturing the wiring board according to the embodiment. [Figure 8D] FIG. 8D is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. [Figure 8E] FIG. 8E is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. [Figure 8F] FIG. 8F is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. [Figure 8G] FIG. 8G is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. [Figure 8H] FIG. 8H is a cross-sectional view showing the method for manufacturing the wiring board according to the embodiment. [Figure 8I] FIG. 8I is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. [Figure 8J] FIG. 8J is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. [Figure 9] FIG. 9 is a plan view showing a wiring board according to a first modified example. [Figure 10] FIG. 10 is an enlarged plan view showing a wiring board according to a first modified example. [Figure 11] FIG. 11 is a plan view showing a wiring board according to a second modified example. [Figure 12] FIG. 12 is an enlarged plan view showing a wiring board according to a second modified example. [Figure 13] FIG. 13 is a plan view showing a wiring board according to a third modified example. DETAILED DESCRIPTION OF THE INVENTION

[0020] First, one embodiment will be described with reference to Fig. 1 to Fig. 8J. FIG.

[0021] The following figures are schematic diagrams, so please understand the size and shape of each part. In order to simplify the description, the illustrations have been exaggerated as appropriate. In the following drawings, the same parts are denoted by the same reference numerals. In addition, the dimensions of each member described in this specification may be omitted. The numerical values ​​and material names are examples of the embodiment, and are not limited to these. In this specification, terms that specify shapes or geometric conditions, such as parallel and orthogonal, The terms "vertical" and "vertical" are interpreted not only to mean the strict meaning but also to mean the substantially same state. We will explain this.

[0022] In the following embodiments, the "X direction" refers to a direction parallel to one side of the wiring board. The "Y direction" is a direction perpendicular to the X direction and parallel to the other side of the wiring board. The "Z direction" is the direction perpendicular to both the X and Y directions and parallel to the thickness direction of the wiring board. The "surface" refers to the surface on the positive side in the Z direction, where the head-mounted display is attached. The "back side" refers to the surface on the negative Z-direction facing the head-mounted display. This refers to the side opposite the side worn by the player.

[0023] 1 to 7, a head-mounted display (hereinafter simply referred to as a head-mounted display) according to the present embodiment will be described. The configuration of the HMD according to this embodiment is a see-through type (seen In this specification, "HMD" refers to a device that is worn on the wearer's head. This HMD also includes smart glasses (AR, MR, etc.). Included.

[0024] As shown in FIGS. 1 and 2, the HMD 90 according to this embodiment includes a frame 91 and a frame A transparent display device 95 attached to the frame 91 and an imaging unit attached to the frame 91 99 (see FIG. 2). In this embodiment, the HMD 90 is a display device for the right eye. 95 for the right eye and a display device 95 for the left eye, making it a so-called eyeglass-type HMD. The display device 95 for the left eye and the display device 95 for the right eye have substantially the same structure. In addition, the display devices 95 are synchronized with each other, and display the same image on the left and right or corresponding images on the left and right. Furthermore, the two display devices 95 are configured to be individually controllable. The two display devices 95 may be the same, and may display different images from each other. The D90 may be a so-called goggle-type HMD equipped with a single display device 95.

[0025] The frame 91 of the HMD 90 includes a rim 92 and a pair of temples 93 connected to the rim 92. Each display device 95 is fitted into the rim 92. In this embodiment, the rim 92 is provided with a wireless communication circuit 94a for the HMD 90.

[0026] In addition, a control unit 94b for controlling each display device 95 is provided on the pair of temples 93. The control unit 94b includes an image display unit (not shown) that generates image light. In this embodiment, one control unit 94b is disposed on each temple 93. A control unit 94b disposed on the right temple 93 controls the display device for the right eye. A control unit 94b arranged on the left temple 93 controls the display device 95 for the left eye. 5.

[0027] Next, the display device 95 will be described. As shown in FIGS. 2 and 3, the display device 95 includes: a substrate 96, a wiring board 10 provided on the substrate 96, and a substrate 10 laminated on the wiring board 10. 96 and a display unit 97 provided between the wiring board 10. The wiring board 10 covers the entire area of ​​the base material 96. Although not shown, the wiring board 10 , it may cover only a portion of the substrate 96 .

[0028] The material of the substrate 96 may be any material that is transparent in the visible light range. For example, a glass substrate can be used as the substrate 6. In this embodiment, the HMD 90 When worn by a wearer, the base material 96 is disposed on the side farther from the wearer, and the wiring board 10 is disposed on the side farther from the wearer. In other words, the HMD90 is placed on the side closest to the wearer. When the wiring board 10 is worn, the wiring board 10 is arranged between the base material 96 and the wearer. For example, when a wearer wears the HMD90, the HMD90 may be detected by surrounding structures or other people. Even if contact occurs, the wiring board 10 can be prevented from contacting surrounding structures, etc. Therefore, the first direction wiring 21 and the second direction wiring 22 of the mesh wiring layer 20 of the wiring board 10 are and the second direction wiring 22 are prevented from being disconnected due to contact with surrounding structures, etc. When the HMD 90 is worn by a wearer, the base material 96 is disposed on the side closer to the wearer. The wiring board 10 may be placed on the side farther from the wearer.

[0029] In this specification, "having transparency" means that the transmittance of visible light is 85% or more. Visible light refers to light with a wavelength between 400 nm and 700 nm. In addition, the visible light transmittance of 85% or more means that the material to be measured (for example, the substrate 96 When measuring the absorbance of ), the absorbance was measured in the entire wavelength range from 400 nm to 700 nm. The absorbance is measured using a spectrophotometer (Japan Spectroscopic Corporation). This is performed using a spectrometer (V-670 manufactured by the company).

[0030] The display unit 97 includes a half mirror. A unit that superimposes the external light of the image display unit (not shown) and the image light from the image display unit (not shown) that generates the image light. In addition, the display unit 97 is configured so that the image display area becomes transparent when the image is not displayed. The light passing through the display unit 97 allows the wearer to see the outside world. The wearer can then view the outside world while viewing the image formed by the light. In the illustrated example, the display unit 97 is configured to display a virtual image. It is provided at a position overlapping with the approximate center of the base material 96 in plan view (see FIG. 2). However, the present invention is not limited to this, and the display unit 97 may be positioned so as to overlap any region of the base material 96 when viewed from the front. It may also be provided in a position.

[0031] The display device 95 may be a display device that projects an image using a prism or a hologram. Alternatively, it may be a display device using a transmissive liquid crystal display or the like. stomach.

[0032] Next, the imaging unit 99 will be described. The imaging unit 99 generates an image by capturing an image of a subject, for example. In this embodiment, the imaging unit 99 may be a camera such as a digital camera. However, the imaging unit 99 is not limited to this and may be an infrared camera that can capture images of external light. As shown in FIG. 4, the image capturing unit 99 captures the image of the wearer. That is, an electronic component (light-emitting element) 17 (to be described later) irradiates the wearer's eye with light. The reflected infrared light is reflected by the wearer's eyes, and the reflected light is incident on the image capturing unit 99. 99 is configured to capture an image obtained by infrared light reflected by the wearer's eye, is also good.

[0033] The control unit 94b acquires information on the position of the wearer's eyes and the wearer's visual field from the image captured by the imaging unit 99. The control unit 94b detects the position of the wearer's eyes using a known line-of-sight detection technique. For example, the control unit 94b may detect the infrared light reflected by the cornea of ​​the wearer. The position of the wearer's eye is calculated based on the positional relationship between the base point obtained by shooting and the wearer's pupil. The control unit 94b may detect the position of the iris or pupil. Based on the position of the camera, the position information of the wearer's eyes and the direction of the wearer's line of sight may be detected. The imaging unit 99 may have a function to detect the position information of the wearer's eyes and the direction of the wearer's line of sight. stomach.

[0034] The detected eye position information and gaze direction of the wearer are used for the calibration of the HMD90. The calibration of the HMD90 is applicable to the application and the wearer's eye tracking function. When the HMD 90 or an application is started, the image on the display unit 97 This calibration involves adjusting the display position of the detected device. By using the position information of the wearer's eyes, the display position of the image on the display unit 97 can be adjusted. The gaze tracking function of the HMD90 uses, for example, the detected gaze direction of the wearer. This allows for eye tracking.

[0035] The image captured by the imaging unit 99 may be transmitted to an external information processing device. In this case, the external information processing device uses the received image to obtain the position information of the wearer's eyes and the wearer's visual field. The line direction may also be detected.

[0036] Next, the configuration of the wiring board will be described with reference to Figures 5 to 7. 1 is a diagram showing a wiring board according to an embodiment of the present invention;

[0037] The wiring board 10 shown in FIGS. 5 to 7 is used in the display device 95 (see FIGS. 1 and 2). The wiring board 10 is a substrate that can be used for wiring. The wiring board 10 is made up of a transparent substrate 11 and a transparent substrate 12 disposed on the substrate 11. a mesh wiring layer 20 formed thereon, and a plurality of electronic components 1 electrically connected to the mesh wiring layer 20; Specifically, the wiring board 10 includes a primer layer 7 disposed on a substrate 11. The mesh wiring layer 20 is disposed on the primer layer 15. A power supply section 40 is electrically connected to the bush wiring layer 20 .

[0038] The shape of the substrate 11 may be substantially rectangular in plan view. Both are substantially flat and have a substantially uniform thickness. (See FIG. 6) may be, for example, 2 μm or more, or 10 μm or more, By making the thickness T1 of the substrate 11 2 μm or more, the wiring substrate 10, and the first direction wiring 21 and the second direction wiring 22 of the mesh wiring layer 20 are The thickness T1 of the substrate 11 is, for example, 200 μm or less. It may be 50 μm or less, or 25 μm or less. The planar shape of the plate 11 may be a rectangle with rounded corners.

[0039] The material of the substrate 11 may be any material as long as it has transparency in the visible light range and electrical insulation properties. The substrate 11 may be made of, for example, polyester resin, acrylic resin, or polycarbonate. acrylate resin, polyimide resin, polyolefin resin, cellulose resin, polyarylate resin Organic insulating materials such as polyester resins or fluororesin materials may also be used. The resin may be polyethylene terephthalate or the like. The acrylic resin may be polymethyl The polyolefin resin may be a cycloolefin polymer or the like. The cellulose-based resin may be triacetyl cellulose or the like. The base resin material may be PTFE, PFA, etc. For example, the material of the substrate 11 is , cycloolefin polymer, or polynorbornene polymer (manufactured by Sumitomo Bakelite Co., Ltd.) The material of the substrate 11 may be selected depending on the application. Glass, ceramics, or the like may be appropriately selected. The substrate 11 is made of a single layer. However, the present invention is not limited to this, and may be applied to a structure in which a plurality of substrates or layers are laminated. The substrate 11 may be a film-like member or a plate-like member. That's fine.

[0040] In this embodiment, the substrate 11 is transparent. The substrate 11 has a transmittance of visible light. The visible light of the substrate 11 may be 85% or more, or may be 90% or more. There is no particular upper limit to the transmittance, but it may be, for example, 100% or less. By setting the transmittance within the above range, the transparency of the wiring board 10 is increased, and the display device 95 can be easily viewed. It's easy to do.

[0041] The glass transition temperature of the substrate 11 may be 150° C. or higher and 400° C. or lower. In the embodiment, as will be described later, the electronic component 17 is connected to the board via a flexible printed circuit board or the like. The wiring is directly mounted on the terminal portion 18 formed on the mesh wiring layer 20 without any wiring. Therefore, since the glass transition temperature of the substrate 11 is 150° C. or higher, the electronic component 17 can be attached to the terminal portion. When directly mounting the substrate 11 on the substrate 18, damage to the substrate 11 due to heat can be suppressed. The glass transition temperature of the plate 11 is 400°C or less, so that the manufacturing process or the use environment of the finished product can be easily performed. Therefore, the yellowness of the substrate 11 can be kept low. This allows the transparency of the substrate 11 to be ensured.

[0042] Next, the primer layer 15 will be described. The primer layer 15 is formed on the mesh wiring layer 20. In this embodiment, the primer layer 1 The primer layer 15 is provided on the first surface 11a of the substrate 11. This eliminates the need for patterning in step 5, thereby reducing the number of process steps. The liner layer 15 is formed on the first surface 11a of the substrate 11 in the area where the mesh wiring layer 20 is provided. It may be provided only in the

[0043] The primer layer 15 contains a polymer material. In this case, the material of the primer layer 15 is For this purpose, a colorless and transparent polymer material can be used.

[0044] The primer layer 15 may contain an acrylic resin or a polyester resin. This makes it possible to more effectively improve the adhesion between the mesh wiring layer 20 and the substrate 11. When the acrylic resin is contained in the immer layer 15, the acrylic resin may be acrylic acid. Polymers containing acrylic acid, methacrylic acid, and derivatives thereof as monomer components are also included. Examples of the vinyl resin include acrylic acid, methyl acrylate, ethyl acrylate, and acrylic acid. Propyl acrylate, butyl acrylate, methacrylic acid, ethyl methacrylate, propyl methacrylate propyl, butyl methacrylate, 2-ethylhexyl acrylate, acrylamide, acrylic Monomers that are copolymerizable with acrylate, hydroxyl acrylate, etc. as the main components copolymerized with styrene, divinylbenzene, acrylonitrile, etc. In addition to the above monomers, a monomer having an acrylic group or a methacrylic group may be used. The resin that is the main component is a dimer having two units per molecule or a multifunctional urethane acrylate. It may be added to oils and has an organic molecule with two or more epoxy groups per molecule as its main component. This may be added to the resin containing the acrylic resin, which crosslinks the resin. The primer layer 15 is cured to form a primer layer 15. The cured primer layer has excellent adhesion. In addition, it has excellent water resistance, acid resistance, alkali resistance, solvent resistance, or a combination thereof. Therefore, the adhesion between the mesh wiring layer 20 and the substrate 11 is This can prevent deterioration during wiring formation or over time.

[0045] The polymer material of the primer layer 15 is resistant to visible light, ultraviolet light, X-rays, electron beams, α rays, β rays, and the like. Even if the polymer material is hardened by crosslinking it through irradiation with γ-rays or γ-rays, This improves the scratch resistance and heat resistance of the primer layer 15.

[0046] The primer layer 15 is resistant to visible light (light having a wavelength of 400 nm or more and 700 nm or less). The transmittance may be 85% or more, or may be 90% or more. There is no particular upper limit to the visible light transmittance of the film 5, but it may be, for example, 100% or less. By setting the visible light transmittance of the polymer layer 15 within the above range, the transparency of the wiring board 10 can be improved. Therefore, the display device 95 can be easily viewed.

[0047] The thickness T2 of the primer layer 15 (length in the Z direction, see FIG. 5) is 0.05 μm or more and 0.5 The thickness T2 of the primer layer 15 is 0.05 μm or more. This effectively improves the adhesion between the mesh wiring layer 20 and the substrate 11. The thickness T2 of the liner layer 15 is 0.5 μm or less, so that the transparency of the wiring board 10 is ensured. can.

[0048] In this embodiment, the mesh wiring layer 20 functions as a transmitter / receiver (antenna) of electromagnetic waves. In this case, the mesh wiring layer 20 is configured as an array antenna. In this way, when the mesh wiring layer 20 is configured as an array antenna, In this case, the performance of the millimeter wave antenna for transmitting and receiving millimeter waves with high directivity can be improved. An array antenna is an antenna in which multiple antenna elements (radiating elements) are arranged in a regular pattern. An antenna in which the amplitude and phase of the excitation of the elements can be controlled independently.

[0049] As shown in FIGS. 5 to 7, the mesh wiring layer 20 is formed on the substrate 11. In the example shown, the mesh wiring layer 20 is present on the entire surface of the substrate 11. However, However, the present invention is not limited to this, and the mesh wiring layer 20 may be present only in a partial area on the substrate 11. is also good.

[0050] The mesh wiring layer 20 is used for a millimeter wave antenna, a telephone antenna, a WiFi antenna, etc. , 3G antenna, 4G antenna, 5G antenna, LTE antenna, Bluetooth ( The antenna may be compatible with either a QR code (registered trademark) antenna or an NFC antenna. When the wiring board 10 does not have a radio wave transmitting / receiving function, each mesh wiring layer 20 is It may have functions such as a ring function, fingerprint authentication, heater, noise cut (shield), etc. The hovering function allows the user to operate the display without touching it directly. This refers to function.

[0051] As shown in FIG. 5, the mesh wiring layer 20 has metal wires arranged in a lattice or mesh pattern. This pattern shape is repeatedly arranged in the X and Y directions. That is, the mesh wiring layer 20 has a portion extending in a first direction (for example, the Y direction). a portion extending in a second direction (for example, the X direction) (a first-direction wiring 21 described later) and a portion extending in a second direction (for example, the X direction) (a The pattern shape is made up of second directional wiring 22).

[0052] As shown in Fig. 5, the mesh wiring layer 20 has a plurality of wires. The flash wiring layer 20 includes a plurality of first direction wirings 21 and a plurality of wirings connecting the first direction wirings 21. The first direction wirings 21 and the second direction wirings 22 are connected to each other. 2 are integrally formed as a whole to form a lattice or mesh shape. The wiring 21 extends linearly in one direction (Y direction). The first direction wiring 21 and the second direction wiring 22 extend linearly in another direction (X direction) that is perpendicular to the first direction wiring 21. The directional wiring 22 may extend in a direction that is not parallel to either the X direction or the Y direction. stomach.

[0053] In the mesh wiring layer 20, adjacent first direction wirings 21 and adjacent A plurality of openings 23 are formed by being surrounded by the second direction wiring 22. The transparent substrate 11 is exposed from the opening 23. This can increase transparency overall.

[0054] The planar shape of each opening 23 is approximately square in plan view. The wirings 21 and the second direction wirings 22 are arranged at equal intervals. 1 are arranged at equal intervals from each other, and the pitch P1 is, for example, 0.01 mm or more and 1 mm or less. The second direction wirings 22 are arranged at equal intervals. The pitch P2 can be set in the range of 0.01 mm to 1 mm, for example. As shown in the figure, a plurality of first directional wirings 21 and a plurality of second directional wirings 22 are arranged at equal intervals. As a result, there is no variation in the size of the openings 23 within the mesh wiring layer 20. This makes it difficult to see the mesh wiring layer 20 with the naked eye. P1 is equal to the pitch P2 of the second direction wirings 22. Therefore, each opening 23 is The openings 23 are substantially square in plan view, and the transparent primer layer 15 and the substrate 11 are exposed. Therefore, by increasing the area of ​​each opening 23, The transparency of the entire wire substrate 10 can be improved. L3 can be set in the range of, for example, 0.01 mm or more and 1 mm or less. The first direction wiring 21 and the second direction wiring 22 are perpendicular to each other, but are not limited to this. The openings 23 may intersect at an angle or an obtuse angle. It is also acceptable to use a uniform size, and it does not have to be uniform across the entire surface and can be changed depending on the location.

[0055] As shown in FIG. 6, each of the first direction wirings 21 has a cross section perpendicular to its longitudinal direction (X-direction cross section). In this case, the cross-sectional shape of the first direction wiring 21 is approximately rectangular or approximately square. The shape is substantially uniform along the longitudinal direction (Y direction) of the first directional wiring 21. In this way, each second direction wiring 22 has a cross section perpendicular to its longitudinal direction (i.e., a Y-direction cross section) The cross-sectional shape (X-direction cross-section) of the first directional wiring 21 is substantially rectangular or square. In this case, the cross-sectional shape of the second directional wiring 22 is the same as that of the second directional wiring 22. The cross-sectional shape of the first directional wiring 21 and the second directional wiring 22 are substantially uniform along the longitudinal direction (X direction). The cross-sectional shape of the directional wiring 22 does not necessarily have to be approximately rectangular or approximately square. For example, The cross-sectional shape of the first directional wiring 21 and the cross-sectional shape of the second directional wiring 22 are different from each other on the front side (Z direction plus The negative Z-side is narrower than the negative Z-side, or the negative Z-side is located on both sides of the width. The side surface may be curved.

[0056] In this embodiment, the line width W1 of the first direction wiring 21 (see FIG. 6) and the line width W2 of the second direction wiring 2 The line width W2 (see FIG. 7) of 2 is not particularly limited and can be appropriately selected depending on the application. The line width W1 of the first direction wiring 21 is the width in a cross section perpendicular to the longitudinal direction (length in the X direction) The line width W2 of the second direction wiring 22 is the width in a cross section perpendicular to the longitudinal direction (Y direction For example, the line width W1 of the first direction wiring 21 is 0.1 μm or more and 5.0 μm or less. The thickness can be selected within the range of 0.2 μm to 2.0 μm. The line width W2 of 22 can be selected in the range of 0.1 μm or more and 5.0 μm or less, and 0.2 μm or more and 2 It may be 0.0 μm or less.

[0057] The height H1 of the first directional wiring 21 (see FIG. 6) and the height H2 of the second directional wiring 22 (see FIG. 7) ) is not particularly limited and can be appropriately selected depending on the application. The height H2 of the first and second directional wirings 21 is the length in the Z direction. The height H1 of the second directional wiring 21 and the height H2 of the second directional wiring 22 are, for example, 60 nm or more and 5.0 μm or less. You can choose from the following ranges:

[0058] As shown in FIGS. 6 and 7, the mesh wiring layer 20 includes first dark layers 21c and 22c. c, metal layers 21m and 22m, and second dark layers 21d and 22d. The metal layers 21m and 22m are formed by connecting the first metal layers 21a and 22a and the second metal layers 21b and 22b. The first metal layers 21a and 22a and the second metal layers 21b and 22b are mutually In this case, the first metal layers 21a and 22a and the second metal layer The first metal layers 21a and 22a and the second metal layers 21b and 22b do not need to be distinguishable from each other. The second metal layers 21b and 22b may be distinguishable from each other.

[0059] The above-mentioned first dark layers 21c and 22c are disposed on the substrate 11. Specifically, The first dark color layers 21c and 22c are disposed on the primer layer 15. The first metal layer 21a, The second metal layers 21b and 22b are disposed on the first dark layers 21c and 22c. The second dark layers 21d and 22d are disposed on the first metal layers 21a and 22a. The color layers 21c and 22c cover the first metal layers 21a and 22a and the second metal layers 21b and 22b. That is, the first directional wiring 21 is formed by the first dark color layer 21 disposed on the primer layer 15. c, a first metal layer 21a disposed on the first dark color layer 21c, and a second metal layer 21b disposed on the first metal layer 21a. The second metal layer 21b is formed by the first dark color layer 21c, the first metal layer 21a, and the second metal layer 21b. The second directional wiring 22 has a second dark color layer 21d covering the primer layer 15. a first dark layer 22c disposed on the first metal layer 22a; and a second metal layer 22b disposed on the first metal layer 22a; a first dark layer 22c; The second metal layer 22b has a second dark layer 22d covering the second metal layer 22a.

[0060] Among these, the first dark color layers 21c and 22c are arranged from the substrate 11 side with respect to the mesh wiring layer 20. By suppressing the reflection of incident visible light, the mesh wiring layer 20 is made difficult to see with the naked eye. This is the layer for

[0061] The first dark color layers 21c and 22c may be layers of a dark color such as black. 1c, 22c are metal layers formed by sputtering or vapor deposition, etc., and then darkened. In this case, the first dark color layers 21c and 22 may be formed by blackening. The first dark layer c may be formed as a layer made of a metal oxide or a metal sulfide. The layers 21c and 22c may be formed as layers containing palladium or tellurium. The dark layers 21c and 22c are dark metal layers formed by sputtering or vapor deposition. , may be formed on the surface of the primer layer 15. In this case, the first dark color layers 21c, 22c The layer may be made of copper, nickel or chromium (hereinafter also referred to as copper, etc.). The dark layers 21c and 22c are made of an alloy of copper or the like, a nitride or oxide of a single metal such as copper, or Alternatively, it may be a layer made of a nitride or oxide of an alloy such as copper.

[0062] The surface roughness Sa (arithmetic mean height of the surface) of the first dark layers 21c and 22c is 5 nm or more and 200 nm or less. The surface roughness Sa of the first dark color layers 21c and 22c may be 5 nm or less. This makes it possible to suppress reflection of visible light in the first dark color layers 21c and 22c. Therefore, the mesh wiring layer 20 can be made difficult to see with the naked eye of an observer. The surface roughness Sa of the first dark color layers 21c and 22c is 200 nm or less. This prevents the haze value from becoming too high. Therefore, the mesh wiring layer 20 can be easily seen by the naked eye of the observer. When measuring the surface roughness Sa of the first dark color layers 21c and 22c, Using a microscope (Keyence Corporation, VK-X1000), Based on this, the surface roughness Sa of the rear surface of the first dark color layers 21c and 22c is measured. When measuring the surface roughness Sa of the layers 21c and 22c, first, a laser beam is applied to the wiring board 10. The wiring board 10 was placed under a laser microscope so that the light was irradiated from the second surface 11b of the board 11. The magnification of the objective lens is set to 50 times. In this case, the measurement area is about 270 μm. Next, the wiring board 10 is subjected to laser irradiation from the second surface 11b side of the substrate 11. In this way, the surface roughness Sa of the first dark color layers 21c and 22c is measured. According to this measurement method, the first metal layers 21a and 22a are formed on the first dark color layers 21c and 22c. Even after laminating the first dark color layers 21c and 22c on the first metal layers 21b and 22b, Roughness Sa can be measured.

[0063] Thickness d of the first dark layers 21c and 22c 1c , d 2c is between 0.1 μm and 5.0 μm It may be 0.2 μm or more and 4.5 μm or less, and may be 0.3 μm or more and 4.0 μm or less. The thickness d of the first dark color layers 21c and 22c may be less than 1 / 2 m. 1c , d 2c is less than 0.1 μm By virtue of this, adhesion between the primer layer 15 and the first dark color layers 21c and 22c is improved, and The adhesion between the first dark color layers 21c, 22c and the first metal layers 21a, 22a can be improved. 1. Thickness d of dark layers 21c and 22c 1c , d 2c The first The haze value of the dark color layers 21c and 22c can be prevented from becoming too high. Therefore, the mesh wiring layer 20 can be made difficult to recognize by the observer. The thickness d of the first dark color layers 21c and 22c can be made difficult to see with the naked eye. 1c , d 2c 5 By making the thickness 0.0 μm or less, the time required to form the mesh wiring layer 20 can be reduced.

[0064] The first metal layers 21a and 22a improve the adhesion between the substrate 11 and the mesh wiring layer 20. The first metal layers 21a and 22a are formed by electrolytically depositing the second metal layers 21b and 22b. The first metal layers 21a and 22a serve as a seed layer when the first metal layers 21a and 22a are formed by plating. Alternatively, the first metal layer 21 may be formed by a sputtering method, a vapor deposition method, or the like. The first dark color layers 21a and 22a may be formed by the same method as the first dark color layers 21c and 22c.

[0065] Thickness d of the first metal layers 21a and 22a 1a , d 2a is between 10nm and 1000nm It may be 30 nm or more and 500 nm or less, or 50 nm or more and 300 nm or less. The thickness d of the first metal layers 21a and 22a may be 1a , d 2a is 10nm or more By doing so, when the second metal layers 21b and 22b are formed on the first metal layers 21a and 22a, Therefore, the second metal layers 21b and 22b can be effectively supported. Thickness d 1a , d 2a When the thickness of the mesh wiring layer 20 is 1000 nm or less, This can shorten the time.

[0066] The second metal layers 21b and 22b are formed to have a height H1 of the first directional wiring 21 and a height H2 of the second directional wiring 22. This serves to increase the height H2 of the first directional wiring 21 and the second directional wiring 22. The resistance value can be reduced. The second metal layers 21b and 22b are formed by plating or the like. Alternatively, the electrode may be formed by electrolytic plating.

[0067] Thickness d of second metal layers 21b and 22b 1b , d 2b is between 50nm and 4990nm It may be 100 nm or more and 2000 nm or less, and it may be 200 nm or more and 180 The thickness d of the second metal layers 21b and 22b may be 0 nm or less. 1b , d 2b is 50nm As a result, the height H1 of the first directional wiring 21 and the height H2 of the second directional wiring 22 are The second metal layer 2 can be made higher, and the resistance values ​​of the first directional wiring 21 and the second directional wiring 22 can be reduced. Thickness d of 1b and 22b 1b , d 2b is 4990nm or less, mesh wiring The time required to form the layer 20 can be reduced.

[0068] The first dark layers 21c and 22c and the first metal layers 21a and 22a have the same crystal properties. On the other hand, the first metal layers 21a and 22a and the second metal layers 21b and 22b may be mutually The first metal layers 21a and 22a and the second metal layer 21 may have different crystal properties. b, 22b are at least one of the crystal fraction, crystal structure, crystallite size, and crystal plane spacing. For example, the first metal layers 21a and 22a may be irradiated with CuKα radiation. The diffraction angle 2θ of the (111) plane measured using the second metal layer 21b, 22 For example, the diffraction angle 2θ of the (111) plane of the first metal layers 21a and 22b may be larger than the diffraction angle 2θ of the (111) plane of the first metal layers 21a and 22b. a is the diffraction angle 2θ of the (111) plane measured using CuKα radiation as the X-ray source, which is 43. The first dark color layers 21c and 22 may have a crystallinity of 430° or less. In this case, the adhesion between the first metal layers 21a and 22a and the diffraction angle 2 θ may be 43.420° or less, or 43.410° or less. The lower limit of the diffraction angle 2θ is not particularly limited, but may be 43.250° or more. The diffraction angle may be 3,300° or more, or 43,350° or more. The measurements were performed using an X-ray diffraction device (Rigaku Corporation, Smart Lab, 9kW type). The diffraction angle 2θ of the (111) plane of the first metal layers 21a and 22a and the diffraction angle 2θ of the (111) plane of the second metal layer 21 are determined. The diffraction angles 2θ of the (111) planes of 22b and 22b are measured at the power supply part 40. As will be described later, the power supply section 40 is formed by a part of the second metal film 51 constituting the first metal layers 21a and 22a. and a part of the third metal film 52 constituting the second metal layers 21b and 22b. The layers 21a and 22a and the second metal layers 21b and 22b are formed at the same time. 40, the diffraction angle 2θ of the (111) plane of the first metal layers 21a and 22a and the diffraction angle 2θ of the (111) plane of the second metal layers 21a and 22a are The diffraction angle 2θ of the (111) plane of the layers 21b and 22b can be measured. In this case, the line widths W1 and W2 In the mesh wiring layer 20 having a relatively narrow area, the (111) surfaces of the first metal layers 21a and 22a Compared with measuring the diffraction angle 2θ, the diffraction angle of the (111) plane of the first metal layers 21a and 22a is This allows us to accurately measure angles such as 2θ. The measurement conditions are as follows: Measurement mode: 2θ / θ measurement (Out-Plane) X-ray source: Cu-Kα 45kV-50mA Optical system: Concentration method Incident optical system 1: Soller slit 5deg Incident optical system 2: Variable slit (IS) 1 deg Length limit slit: 10 mm Receiving optical system 1: Variable slit (RS1) 1 deg, (RS2) 0.3 mm Receiving optical system 2: PSA OPEN / solar slit 5deg Detector: Scintillation counter Measurement range: 35-80deg Step: 0.02deg Measurement time: 2.0 deg / min

[0069] The second metal layers 21b and 22b are measured using CuKα radiation as an X-ray source (111). The crystal may have a crystal characteristic such that the diffraction angle 2θ of the first plane is less than 43.4°. When the second metal layers 21b and 22b are formed by etching, The diffraction angle 2θ of the (111) plane of the second metal layers 21b and 22b is 43 It may be 43.390° or less, 43.380° or less, or 43.370° or less. It could be below.

[0070] Next, the second dark color layers 21d and 22d will be described. By suppressing the reflection of visible light by the mesh wiring layer 20, the mesh wiring layer 20 can be seen with the naked eye. The second dark color layers 21d and 22d are layers for making the mesh wiring layer 20 less visible. The second dark layers 21d and 22d cover the entire area of ​​the power supply section 40. is also good.

[0071] The second dark color layers 21d and 22d may be layers of a dark color such as black. The color layers 21d and 22d may be layers whose surfaces are roughened.

[0072] The surface roughness Sa of the second dark color layers 21d and 22d may be 5 nm or more and 100 nm or less. The surface roughness Sa of the second dark color layers 21d and 22d is 5 nm or more, Therefore, the reflection of visible light on the surfaces of the layers 21d and 22d can be suppressed. The mesh wiring layer 20 covered with the color layers 21d and 22d can be made difficult to see with the naked eye of an observer. The surface roughness Sa of the second dark color layers 21d and 22d is 100 nm or less, This prevents the haze values ​​of the color layers 21d and 22d from becoming too high. This makes it difficult for the viewer to recognize the presence of the color layers 21d and 22d. , 22d, the mesh wiring layer 20 covered with the insulating layer 22d can be made difficult to see with the naked eye of an observer. The surface roughness Sa was measured using a laser microscope (Keyence Corporation, VK-X1000). and is calculated based on ISO 25178.

[0073] The second dark layers 21d and 22d constitute, for example, the mesh wiring layer 20 or the power supply section 40. By subjecting a part of the metal material to a darkening treatment (blackening treatment), the mesh wiring layer 20 or It may be formed from a part of the power supply part 40. In this case, the second dark color layer 21d, The second dark color layer 22d may be formed as a layer made of metal oxide or metal sulfide. The layers 21d and 22d are formed as coatings of dark colored materials or plating layers of nickel, chromium, or the like. The second dark color may be formed on the surface of the mesh wiring layer 20 or the power supply portion 40. The layers 21d and 22d are formed by roughening the surface of the mesh wiring layer 20 or the power supply portion 40. It may be formed.

[0074] The material of the first directional wiring 21 and the second directional wiring 22 may be any metal material having electrical conductivity. That is, the first dark color layers 21c and 22c, the first metal layers 21a and 22a, and the second metal layer 21 The material of the second dark layers 21b, 22b and 22d may be any metal material having electrical conductivity. In this embodiment, the material of the first directional wiring 21 and the second directional wiring 22 is copper. The first directional wiring 21 and the second directional wiring 22 may be made of, for example, gold or silver. , copper, platinum, tin, aluminum, iron, nickel, or other metal materials, or these metals In addition, the material of the first metal layers 21a and 22a and the material of the second metal layer 22b can be used. The layers 21b and 22b may be made of the same material. This can improve the adhesion between the layers 21a and 22a and the second metal layers 21b and 22b.

[0075] The overall aperture ratio At of the mesh wiring layer 20 is, for example, in the range of 87% or more and less than 100%. By setting the overall aperture ratio At of the mesh wiring layer 20 in this range, the wiring The conductivity and transparency of the substrate 10 can be ensured. The overall aperture ratio At of the mesh wiring layer 20 is 9 It may be 5% or more and less than 100%. This can increase the transparency of the wiring board 10. The aperture ratio is the ratio of the aperture area to the area of ​​a predetermined region (for example, a mesh The percentage (%) of the area of ​​the opening region in the unit area of ​​the entire wiring layer 20. This means that there are no metal parts such as the first directional wiring 21 and the second directional wiring 22, and the substrate 11 is exposed. This refers to the area where

[0076] A plurality of terminal portions 18 are formed on the mesh wiring layer 20. are formed on the first directional wiring 21 and the second directional wiring 22. 8 may be made of the same material as the first directional wiring 21 and the second directional wiring 22. The terminal portion 18 has a width W1 larger than the line width W1 of the first directional wiring 21 and a width W2 of the second directional wiring 22. It may have large dimensions.

[0077] Next, the electronic component 17 will be described. In this embodiment, the electronic component 17 is, for example, an L In this case, the light emitting element emits light containing infrared wavelengths. In this case, the light emitting element (LED chip) has a luminance peak at a dominant wavelength of 840 nm. The light emitting element may have a wavelength of 780 nm or may have almost no emission intensity below 780 nm. Light in the visible light range may also be irradiated.

[0078] The electronic components 17 are arranged at intervals from one another and have different ends. In this embodiment, the electronic component 17 is mounted on a flexible printed circuit board. The electronic components 17 are directly mounted on the terminals 18 without using a substrate or the like. is connected to two terminals 18 so that the equivalent circuit has two poles. The component 17 has a terminal portion 18 formed on the first directional wiring 21 and a terminal portion 18 formed on the second directional wiring 22. The terminal portion 18 is connected to the power supply 11 .

[0079] Such a wiring board 10 has a peripheral edge 10a (shaded area in FIG. 2) attached to a frame 91. The peripheral portion 10a includes a central portion 10b surrounded by a peripheral portion 10a. It may be an area where the distance from the frame 91 is 100 mm or less. The electronic components 17 are arranged in the central portion 10b. The energy required to irradiate light from item 17 (light-emitting element) can be reduced.

[0080] Although not shown, a metal layer is formed on the primer layer 15 so as to cover the mesh wiring layer 20. A protective layer may be formed. The protective layer protects the mesh wiring layer 20. The protective layer is formed so as to cover at least the mesh wiring layer 20 of the substrate 11. Examples of suitable acrylates include polymethyl (meth)acrylate and polyethyl (meth)acrylate. Polyvinyl resins and their modified resins and copolymers, polyesters, polyvinyl alcohol, polyacetic acid Polyvinyl resins such as vinyl, polyvinyl acetal, polyvinyl butyral, and their copolymers Colorless and transparent materials such as polymers, polyurethanes, epoxy resins, polyamides, and chlorinated polyolefins The insulating resin may be any of the following.

[0081] Referring again to FIG. 2, the mesh wiring layer 20 is electrically connected to the power supply unit 40. The power supply section 40 is made of a substantially rectangular conductive thin plate member. The longitudinal direction of the power supply section 40 is The power supply part 40 is made of a material that is parallel to the X direction and the short side of the power supply part 40 is parallel to the Y direction. , for example, metal materials such as gold, silver, copper, platinum, tin, aluminum, iron or nickel; Alternatively, an alloy containing these metals can be used. When the device is incorporated into the HMD 90, the wireless communication circuit 9 is provided on the frame 91 of the HMD 90. 4a (see FIG. 2). In this case, it is preferable that the mounting bracket 91 is provided at a position overlapping the rim 92 of the frame 91. This makes it easier to connect the mesh wiring layer 20 and the wireless communication circuit 94a. , it is possible to suppress obstruction of visibility of the outside world.

[0082] Next, referring to FIGS. 8A to 8J, a method for manufacturing the wiring board 10 according to this embodiment will be described. and explain.

[0083] First, as shown in FIG. 8A, the first surface 11a and the second surface 11b located on the opposite side of the first surface 11a are A substrate 11 including the film 1b is prepared. The substrate 11 is transparent.

[0084] Next, as shown in FIG. 8B, a primer layer 15 is formed on the substrate 11. The primer layer 15 may be formed on substantially the entire first surface 11a of the substrate 11. Methods for forming 15 include roll coating, gravure coating, and gravure reverse coating. , microgravure coating, slot die coating, die coating, knife coating, inkjet Wet coat, dispenser coat, kiss coat, spray coat, screen printing, Offset printing and flexographic printing may also be used.

[0085] Next, a plurality of first directional wirings 21 and a plurality of first directional wirings 21 are formed on the primer layer 15. A mesh wiring layer 20 including a plurality of second direction wires 22 connected to each other is formed.

[0086] At this time, first, as shown in FIG. 8C, the first metal film 5 is formed on the substantially entire surface of the primer layer 15. This first metal film 55 is a film for forming the first dark layers 21c and 22c. The first metal film 55 is made of, for example, copper or the like, an alloy of copper or the like, a nitride of a single metal such as copper, or the like. The oxide, or nitride or oxide of an alloy such as copper, is used by sputtering or evaporation. The thickness of the first metal film 55 is 10 nm to 1000 nm. In the present embodiment, the first metal film 55 may contain copper.

[0087] As shown in FIG. 8D, the second metal film 51 is laminated on almost the entire surface of the first metal film 55. The second metal film 51 is a film for forming the first metal layers 21a and 22a. The second metal film 51 may be formed by, for example, a sputtering method. In this embodiment, the second metal film 51 may have a thickness of 10 nm or more and 1000 nm or less. may contain copper.

[0088] Next, as shown in FIG. 8E, a third metal film 52 is laminated on the second metal film 51. The third metal film 52 is a film for forming the second metal layers 21b and 22b. The third metal film 51 may be formed by electrolytic plating using the second metal film 51 as a seed layer. The thickness of the metal film 52 may be 50 nm or more and 4990 nm or less. Therefore, the third metal film 52 may contain copper. The step (FIG. 8C) of laminating the second metal film 51 and the step (FIG. 8D) of laminating the second metal film 52 are performed in a vacuum chamber (not shown). On the other hand, the step of laminating the third metal film 52 (FIG. 8E) may be performed in a vacuum chamber (not shown). It may be performed outside the vacuum chamber.

[0089] Next, as shown in FIG. 8F, a photo-curable insulating resist is applied to almost the entire surface of the third metal film 52. As the photo-curable insulating resist 53, for example, acrylic resin, epoxy resin, etc. Examples of the organic resin include organic resins such as silicon-based resins.

[0090] Subsequently, as shown in FIG. 8G, an insulating layer 54 is formed by photolithography. In this case, a photo-curable insulating resist 53 is patterned by photolithography, and an insulating At this time, the first directional wiring 21 and the second directional wiring 2 The insulating layer 54 is formed so that the third metal film 52 corresponding to 2 is exposed.

[0091] Next, as shown in FIG. 8H, the portion of the first surface 11a of the substrate 11 that is not covered with the insulating layer 54 is The third metal film 52, the second metal film 51 and the first metal film 55 located in the lower portion are removed. In this case, ferric chloride, cupric chloride, strong acids such as sulfuric acid and hydrochloric acid, persulfates, hydrogen peroxide or By performing a wet treatment using these aqueous solutions or a combination thereof, the substrate 11 The third metal film 52, the second metal film 51 and the first metal film 55 are formed so that the first surface 11a is exposed. In this wet etching process, the third metal film 52 and the second metal film 51 are etched. The liquid for the first metal film 55 may be different from the liquid for the second metal film 56.

[0092] Subsequently, the insulating layer 54 is removed, as shown in FIG. 8I. In this case, a permanganate solution Wet treatment using N-methyl-2-pyrrolidone, acid or alkaline solution, etc., or oxygen protease The insulating layer 54 on the third metal film 52 is removed by performing a dry treatment using plasma. do.

[0093] Next, as shown in FIG. 8J, second dark layers 21d and 22d are formed. The color layers 21d and 22d are formed on a part of the first metal film 55, the second metal film 51, and the third metal film 52. The second dark layer 21d may be formed by performing a darkening treatment (blackening treatment). , 22d are a coating of a dark color material or a plating layer of nickel or chromium, etc. It may be formed on the surfaces of the metal film 55, the second metal film 51, and the third metal film 52. The second dark layers 21d and 22d are formed on the surfaces of the first metal film 55, the second metal film 51, and the third metal film 52. It may also be formed by roughening the surface.

[0094] In this way, the substrate 11 and the primer layer 11 provided on the first surface 11a of the substrate 11 are The wiring substrate 10 having the mesh wiring layer 20 disposed on the primer layer 15 is obtained. In this case, the mesh wiring layer 20 includes first directional wiring 21 and second directional wiring 22. At this time, the first metal film 55, the second metal film 51, and a part of the third metal film 52 are supplied with An electrical section 40 may be formed.

[0095] Thereafter, the wiring board 10 is attached to the base material 96 fitted into the rim 92 of the frame 91. 1 is obtained. 2, the wiring board 10 may be attached to the base material 96.

[0096] Next, the operation of this embodiment having the above-described configuration will be described.

[0097] As shown in FIGS. 1 and 2, the wiring board 10 is connected to the HMD 9 as a component of the display device 95. The control unit 94b of the HMD 90 determines the wearer's The position information of the wearer's eyes and the direction of the wearer's gaze are detected. The wearer's gaze direction can be applied to, for example, a gaze tracking function of the wearer.

[0098] According to this embodiment, the wiring board 10 includes a transparent substrate 11 and a a mesh wiring layer 20 and a plurality of electronic components electrically connected to the mesh wiring layer 20; 17. The mesh wiring layer 20 is a first dark layer disposed on the substrate 11. 21c, 22c, and first metal layers 21a, 22a disposed on the first dark layers 21c, 22c. and second metal layers 21b and 22b disposed on the first metal layers 21a and 22a, and a first dark layer 21c, 22c, a second dark layer covering the first metal layers 21a, 22a and the second metal layers 21b, 22b. The mesh wiring layer 20 has a plurality of terminal portions 18 formed thereon. The electronic components 17 are arranged at intervals from one another and are different from one another. The electronic component 17 is mounted on a terminal portion 18. This allows the light emitted from the electronic component 17 to be visually recognized. It can be difficult.

[0099] Here, infrared wavelength light is usually not visible to the wearer's eyes. When light is emitted, the retina detects the light, which may cause the wearer to perceive it as bright. And, if the wearer feels the brightness, there is a risk that the light source will enter the wearer's field of vision. In this way, when a light source enters the field of view of the wearer, the visibility of the HMD 90 decreases. In particular, when used in a dark place or at night, the visibility of the HMD 90 decreases. When the optic nerve of the retina, which can detect photons, receives many photons at the same time, the optic nerve It is possible that the human eye perceives light with higher energy than infrared wavelengths. When light is irradiated from a single point toward the eye, the density of the light as a luminous flux increases, and the effective For example, when two photons strike the cones of the retina, In this case, the infrared wavelength of 900 nm is There is a possibility that the light will be perceived as green light with a half wavelength of 450 nm.

[0100] In contrast to this, in this embodiment, a plurality of electronic components 17 are arranged at intervals from each other, The two are mounted on different terminal sections 18. This allows for a low-illuminance light source. Therefore, it is possible to maintain a predetermined illuminance even when the wearer is wearing a In addition, it is possible to use a low-intensity light source to create diffused light, It is presumed that this makes the light source less visible.

[0101] In this embodiment, the electronic component 17 is mounted via a flexible printed circuit board or the like. In this case, the electronic components are mounted directly on the terminal portion 18 without being attached to the opaque frame 91 or the like. 17, the electronic components 17 can be mounted at a higher density and the degree of freedom in placement is In addition to the structural efficiency, it is also possible to improve the efficiency of wireless communication or This can contribute to improved performance in features such as eye tracking.

[0102] Furthermore, according to this embodiment, in the HMD 90, the wiring substrate 10 has transparency. The wiring board 10 includes the substrate 11 and the mesh wiring layer 20 disposed on the substrate 11. This ensures the transparency of the wiring board 10 when it is incorporated into the HMD 90. Since the outside world can be seen through the openings 23 of the mesh wiring layer 20, the visibility of the outside world is not obstructed. There is no such thing.

[0103] In the above-described embodiment, the electronic component 17 is a light-emitting element. For example, the electronic component 17 may be a semiconductor element for driving an antenna. In this case, the wiring board 10 may include a plurality of types of electronic components 17. For example, the electronic component 17 may include a light emitting element and a semiconductor element for driving an antenna. .

[0104] Next, modified examples of the wiring board will be described.

[0105] 9 and 10 show a first modified example of the wiring board. 1 differs from the first embodiment in that a dummy wiring layer 30 is provided around the mesh wiring layer 20. 9 and 10, the other configurations are substantially the same as those shown in FIGS. 1 to 8J are denoted by the same reference numerals, and detailed description thereof will be omitted. do.

[0106] In the wiring board 10 shown in FIG. 9, the dummy wiring layer 3 is formed along the periphery of the mesh wiring layer 20. Unlike the mesh wiring layer 20, the dummy wiring layer 30 is substantially It does not function as an antenna.

[0107] As shown in FIG. 10, the dummy wiring layer 30 is made up of dummy wirings each having a predetermined unit pattern shape. That is, the dummy wiring layer 30 is made up of a plurality of identically shaped wiring layers 30a. Each dummy wiring 30a is connected to the mesh wiring layer 20. (first directional wiring 21 and second directional wiring 22). The dummy wirings 30a are regularly arranged throughout the entire area of ​​the dummy wiring layer 30. The dummy wirings 30a are spaced apart from each other in the planar direction and are arranged to protrude above the substrate 11. That is, each dummy wiring 30a is connected to the mesh wiring layer 20, the power supply section 40, and other wiring layers. The dummy wirings 30a are electrically independent of each other. It is roughly L-shaped when viewed from the front.

[0108] In this case, the dummy wiring 30a has the unit pattern shape of the mesh wiring layer 20 described above (see FIG. 5) has a shape in which a part of the mesh wiring layer 20 and the dummy wiring layer 21 are missing. 30, the mesh wiring layer 20 disposed on the substrate 11 can be made difficult to visually recognize. It can be made less visible.

[0109] As shown in FIG. 10, the dummy wiring 30a is connected to the first directional wiring 21 or the second directional wiring 22. Specifically, the dummy wirings 30a extend parallel to the first direction wirings 21. The wiring 22 includes a first portion 31a and a second portion 32a extending parallel to the second directional wiring 22. The first portion 31a has a shape in which a part of the first directional wiring 21 is missing. The first portion 31a and the second portion 31b have a shape in which a part of the second direction wiring 22 is missing. The other configurations of the wiring 32a are the same as those of the first directional wiring 21 and the second directional wiring 22. Therefore, detailed description will be omitted here. The wiring 22 extends parallel to the first or second direction wiring 22, so that the mesh disposed on the substrate 11 The dummy wiring layer 30 has an aperture ratio that is larger than that of the mesh wiring layer 20. The aperture ratio of the dummy wiring layer 30 may be the same as or different from that of the dummy wiring layer 20. When the aperture ratio of the dummy wiring layer 30 is different from that of the mesh wiring layer 20, the aperture ratio of the dummy wiring layer 30 is different from that of the mesh wiring layer 20. The aperture ratio may be close to that of the wiring layer 20.

[0110] In this way, the mesh wiring layer 20 is surrounded by a wiring layer 21 that is electrically independent from the mesh wiring layer 20. By providing the dummy wiring layer 30, the outer edge of the mesh wiring layer 20 can be obscured. This makes it possible to make the mesh wiring layer 20 less visible on the surface of the image display device 60. This makes it difficult for a user of the HMD 90 to recognize the mesh wiring layer 20 with the naked eye.

[0111] 11 and 12 show a second modified example of the wiring board. In this embodiment, two or more dummy wiring layers 30 having different aperture ratios are arranged around the mesh wiring layer 20. The difference is that the other configurations are the same as those shown in FIGS. 1 to 10. 11 and 12, the same configuration as that shown in FIGS. Some parts are given the same reference numerals and detailed explanations are omitted.

[0112] In the wiring substrate 10 shown in FIG. 11, the mesh wiring layer 20 has a periphery with a different aperture ratio. A plurality of (two in this case) dummy wiring layers 30A, 30B (first dummy wiring layer 30) having different wiring patterns are Specifically, the mesh wiring layer 20 has a first dummy wiring layer 30A and a second dummy wiring layer 30B. A first dummy wiring layer 30A is arranged along the periphery, and a first dummy wiring layer 30B is arranged along the periphery of the first dummy wiring layer 30A. The second dummy wiring layer 30B is disposed between the first and second dummy wiring layers 30A and 30B. Unlike the wiring layer 20, it does not actually function as an antenna.

[0113] As shown in FIG. 12, the first dummy wiring layer 30A is a dummy wiring having a predetermined unit pattern shape. The second dummy wiring layer 30B is made up of a repetition of the first wiring 30a1. The dummy wiring 30a2 is configured by repeating the unit pattern shape of the dummy wiring 30a2. The dummy wiring layers 30A and 30B are each formed of a plurality of dummy wirings 30a1 and 30a2 of the same shape. a2, and each of the dummy wirings 30a1 and 30a2 is connected to the mesh wiring layer 20. The dummy wirings 30a1 and 30a2 are electrically independent from each other. The dummy wirings 30a1, 30b are regularly arranged throughout the layers 30A, 30B. 30a2 are spaced apart from each other in the planar direction and are arranged to protrude above the substrate 11. The dummy wirings 30a1 and 30a2 are connected to the mesh wiring layer 20 and the power supply portion 4, respectively. 0 and other dummy wirings 30a1, 30a2. The shapes of a1 and 30a2 are each approximately L-shaped in plan view.

[0114] In this case, the dummy wirings 30a1 and 30a2 are the unit patterns of the mesh wiring layer 20 described above. 5. This allows the mesh wiring layer 20 and Differences from the first dummy wiring layer 30A and the first dummy wiring layer 30A and the second dummy wiring layer 3 0B, the mesh wiring layer 20 disposed on the substrate 11 is difficult to visually recognize. As shown in FIG. 12, the dummy wirings 30a1 and 30a2 are arranged in the first direction. The dummy wiring 30a1 extends parallel to the line 21 or the second direction wiring 22. Specifically, the dummy wiring 30a1 is The first portion 31a1 extends parallel to the first directional wiring 21, and the second portion 31a2 extends parallel to the second directional wiring 22. The dummy wiring 30a2 extends parallel to the first direction wiring 21. and a second portion 32a2 extending parallel to the second directional wiring 22. There are.

[0115] The area of ​​each dummy wiring 30a1 in the first dummy wiring layer 30A is In this case, the area of ​​each dummy wiring 30a1 is larger than that of each dummy wiring 30a2 in the first embodiment. The width is the same as the line width of each dummy wiring 30a2, but is not limited to this. The line width of each of the dummy wirings 30a1, 30a2 may be larger than the line width of each of the dummy wirings 30a1, 30a2. The other configurations of the dummy wiring 30a2 are the same as those of the dummy wiring 30a in the first modification. Therefore, detailed explanation will be omitted here.

[0116] In this modification, the mesh wiring layer 20 and the openings of the two or more dummy wiring layers 30A and 30B The ratio is calculated by dividing the mesh wiring layer 20 by the dummy wiring layers 30A and 30B that are far from the mesh wiring layer 20. In other words, the aperture ratio of each dummy wiring layer may be increased in stages. The size may be gradually increased from the one closest to the mesh wiring layer 20 to the one farther away. In this case, the aperture ratio of the first dummy wiring layer 30A is larger than the aperture ratio of the mesh wiring layer 20. The aperture ratio of the second dummy wiring layer 30B may be set to be smaller than the aperture ratio of the first dummy wiring layer 30A. As a result, the mesh wiring layer 20 and the dummy wiring layers 30A and 30B Therefore, the mesh wiring layer 2 on the surface of the image display device 60 can be made even more unclear. This makes the 0 even less visible.

[0117] In this way, the dummy wiring layers 30A and 30B electrically independent from the mesh wiring layer 20 are By disposing the wiring layer 20 in this manner, the outer edge of the mesh wiring layer 20 can be made less clear. This makes it possible to make the mesh wiring layer 20 less visible on the surface of the image display device 60. The mesh wiring layer 20 can be made difficult to be recognized by the naked eye of a user. Three or more dummy wiring layers with different aperture ratios may be provided around 0.

[0118] 13 shows a third modified example of the wiring board. The modified example shown in FIG. 13 has mesh wiring. The plane shape of the layer 20 is different, and the other configurations are the same as those shown in FIGS. 1 to 12. In Fig. 13, the same parts as those shown in Figs. 1 to 12 are denoted by the same reference numerals. Detailed explanations will be omitted.

[0119] FIG. 13 is an enlarged plan view showing the mesh wiring layer 20 according to the third modified example. The first direction wiring 21 and the second direction wiring 22 intersect at an angle (not at a right angle), and each opening The shape of the opening 23 is a rhombus in a plan view. Although they are not parallel to either the X direction or the Y direction, the first direction wiring 21 and the second direction wiring Either one of the two may be parallel to the X direction or the Y direction.

[0120] A plurality of components disclosed in the above-described embodiments and modifications may be appropriately combined as needed. Alternatively, it is possible to use all the components shown in the above embodiment and each modification. Some components may be removed from the

Claims

1. A wiring board, a transparent substrate; a mesh wiring layer disposed on the substrate; a plurality of electronic components electrically connected to the mesh wiring layer; The mesh wiring layer includes: a first dark layer disposed on the substrate; a metal layer disposed on the first dark layer; a second dark layer covering the first dark layer and the metal layer; A plurality of terminal portions are formed on the mesh wiring layer, The electronic components are arranged at intervals from one another and have different front faces. A wiring board mounted on the terminal section.

2. 2. The substrate according to claim 1, wherein the glass transition temperature of the substrate is 150° C. or more and 400° C. or less. Wire board.

3. The wiring board according to claim 1 , wherein the electronic component includes a light-emitting element.

4. The wiring board according to claim 3 , wherein the light emitting element emits light having an infrared wavelength.

5. The mesh wiring layer is configured as an antenna, and the electronic component is an antenna driver.

10. The wiring board according to claim 1, comprising a semiconductor element for operation.

6. The mesh wiring layer is configured as an antenna, and the electronic component is a light emitting element.

2. The wiring board according to claim 1, further comprising: a semiconductor element for driving the antenna.

7. A dummy wiring layer electrically independent from the mesh wiring layer is provided around the mesh wiring layer. The wiring board according to claim 1 , further comprising:

8. A plurality of the dummy wiring layers are provided, and openings in the mesh wiring layer and the dummy wiring layer are formed. The ratio gradually increases from the mesh wiring layer to the dummy wiring layer far from the mesh wiring layer.

8. The wiring board according to claim 7, wherein the wiring board is gradually enlarged.

9. The frame and a transparent display attached to the frame; an imaging unit attached to the frame, The display device includes: The wiring substrate according to any one of claims 1 to 8, a display unit laminated on the wiring board.

10. The wiring board has a peripheral portion attached to the frame and a portion surrounded by the peripheral portion. a central portion; The head mounted display according to claim 9, wherein the electronic components are arranged in a central portion. Ray.

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