Image sensor driving module, optical assembly, camera module, and electronic device

Abstract

This application discloses an image sensor driving module, an optical assembly, a camera module, and an electronic device. The image sensor driving module includes a driving unit, a fixed base, and a movable base. A part of the structure of the support part and a part of the structure of the fixed base form a holding structure. The fixed base supports a fixed member of the driving unit. The movable base includes a support part, a fixed part, and a connection part. The support part is configured to support the image sensor and the movable member of the driving unit. The holding structure is configured to provide a holding force to the support part so that contact between the support part and the fixed base is maintained. This application can ensure the movement stability of the image sensor and avoid axial vibration or tilt generated by the image sensor during the movement process.

Description

[Technical field]

[0001] This application claims priority to Chinese Patent Application No. 202210129798.4, entitled “Image Sensor Driving Module, Optical Assembly, Camera Module, and Electronic Device,” filed with the State Intellectual Property Office of the People's Republic of China on February 11, 2022, which is incorporated herein by reference in its entirety. This application claims priority to Chinese Patent Application No. 202310142208.6, entitled “Image Sensor Driving Module, Optical Assembly, Camera Module, and Electronic Device,” filed with the State Intellectual Property Office of the People's Republic of China on February 7, 2023, which is incorporated herein by reference in its entirety.

[0002] Possible implementations of this application relate to the field of photography, in particular to image sensor driving modules, optical assemblies, camera modules, and electronic devices. [Background technology]

[0003] When an electronic device with a photographing function (e.g., a mobile phone or a tablet computer) performs photographing, the photographed picture may be blurred, ghosted, or unclear due to slight shaking. For example, a human body holding an object will physiologically shake to a certain extent. A human body is often in a state of motion during image capture, and these irregular and non-autonomous shaking or motion vibrations may cause the captured image to be blurred, resulting in a poor user experience. Therefore, an electronic device with a photographing function needs to have an automatic focus (AF) function and an optical image stabilization (OIS) function.

[0004] When designing the camera module, a driving structure is taken into consideration to drive the image sensor to move, and the driving structure drives the image sensor to move so as to adjust the specific position and attitude of the image sensor to realize the image stabilization function of the camera module.

[0005] As electronic devices develop toward lighter weight, thinner size, and more functionality, when designing a camera module, how to design the driving structure of the image sensor to satisfy the movement stability of the image sensor and ensure image quality has become an ongoing research topic in the industry. Summary of the Invention

[0006] This application provides an image sensor driving module, an optical assembly, a camera module, and an electronic device to ensure the moving stability and image quality of the image sensor.

[0007] According to a first aspect, an embodiment of the present application provides an image sensor driving module including a driving unit, a fixed base, and a movable base. The driving unit includes a fixed member and a movable member that can move relative to each other. The fixed base is configured to carry the fixed member. The movable base includes a carrying part, a fixed part, and a connecting part. The connecting part is configured to realize a mechanical and electrical connection between the carrying part and the fixed part, the carrying part is configured to carry the image sensor and the movable member, and the fixed part is connected to the fixed base. The carrying part forms a holding structure with the fixed base and the contact, a part of the carrying part and a part of the fixed base, the holding structure is configured to provide a holding force to the carrying part, and the driving unit is configured to drive the carrying part to move relative to the fixed base. The moving direction can be a direction perpendicular to the optical axis of the camera module, in other words, a direction of a plane on which the photosensitive surface of the image sensor is located, or a direction of a plane parallel to the photosensitive surface. The holding force of the holding structure maintains contact between the carrying part and the fixed base.

[0008] In the conventional camera module, the moving station of the image sensor is made to float with respect to the bottom plate of the module. The space between the moving station and the bottom plate not only increases the size of the camera module in the direction of the optical axis, but also easily causes the tilt of the moving station and the vibration in the direction of the optical axis, resulting in the deterioration of the imaging quality. In addition, the air thermal resistance is high, and the heat of the image sensor and the driving circuit is difficult to dissipate, so that the junction temperature of the image sensor becomes excessively high (for example, about 70 degrees, even reaching 90 degrees), resulting in excessive imaging noise of the image sensor and affecting the imaging quality. In this application, the holding structure is arranged to ensure the contact between the carrier and the fixed platform. This can ensure that there is no displacement in the direction of the optical axis in the moving process of the image sensor, and improve the stability of the image sensor in the moving process. The moving route of the image sensor can be limited to a stable plane. This can avoid the axial vibration or tilt generated by the image sensor in the moving process (specifically, reduce the crosstalk of the displacement in the optical axis direction of the image sensor and the rotation direction of the image sensor), and ensure the quality and stability of the image data obtained by the image sensor. In the design solution in which the moving station of the image sensor is made floating with respect to the bottom plate of the module, it is necessary to arrange a sensor for detecting the position in the optical axis direction on the moving station. In this application, since the image sensor does not have a displacement in the optical axis direction, it is not necessary to configure a sensor for detecting the position in the optical axis direction in this application. This can help reduce the cost of the image sensor driving module, simplify the structure of the components arranged on the movable base, and realize the small size of the movable base.

[0009] In this application, by using the contact between the carrier and the fixed base, the thermal resistance between the carrier and the fixed base can be further reduced, and by using the contact relationship between the carrier and the fixed part, the heat of the carrier can be better conducted to one side of the outer surface of the fixed base, thereby improving the thermal conduction ability of the image sensor driving module. The heat dissipation efficiency of the image sensor and the driving unit can be optimized, and the deterioration of the imaging quality caused by the excessively high temperature of the camera module in the video shooting process or long-term shooting process is avoided.

[0010] In one possible implementation, the connection part forms at least a part of the holding structure, the connection part is an elastic structure, and the elastic force of the connection part acts on the carrying part to form a holding force. In this implementation, the elastic force of the connection part is used as a holding force to ensure contact between the carrying part and the fixed base, and another holding structure other than the fixed base and the movable base is added if necessary. The connection part can not only ensure that the carrying part moves under the driving force of the driving unit, but also provide a holding force. The dual-function design of the connection part facilitates miniaturization of the size of the image sensor driving module.

[0011] In one possible implementation, the connection point between the connection part and the fixed part is at a first position, and the connection point between the connection part and the support part is at a second position, and an elastic potential energy exists between the first position and the second position, and the elastic potential energy forms a holding force. This solution provides an embodiment of how to form the elastic force of the connection part. Forming the elastic potential energy between the first position and the second position uses the assembly position of the connection part. This helps to ensure the miniaturization of the size of the image sensor driving module.

[0012] In one possible implementation, the fixed base includes a fixed platform, the carrier contacts the inner surface of the fixed platform, and the carrier is configured to carry the image sensor to move on the inner surface of the fixed platform, the image sensor is located on the light output side of the lens assembly of the camera module, the inner surface of the fixed platform is perpendicular to the optical axis of the camera module, the distance between the first position in the direction of the optical axis and the inner surface of the fixed platform is smaller than the distance between the second position in the direction of the optical axis and the inner surface of the fixed platform, and the elastic tension of the connection acts on the second position to form a holding force toward the fixed platform. In this solution, the distance relationship between the first position and the second position and the fixed platform is determined in the process of assembling the movable base. This can provide a force that pulls the second position toward the fixed platform, in other words, can form a holding force. In this solution, forming the holding force is performed in the assembly process. For the connection of the movable base, the structure of the connection does not need to be specially designed in the manufacturing process of the connection to consider forming the holding force. This can reduce the manufacturing cost.

[0013] In another implementation, the connection part forms at least a part of the holding structure, and the fixed part and the carrying part can be designed not to be on the same plane in the manufacturing process of the movable base. Before assembly, there is a height difference between the first position and the second position in the optical axis direction. In the assembly process, the first position and the second position can be assembled to be in the same plane state. Alternatively, in the assembly process, the specific physical position of the first position or the second position can be adjusted to store energy, specifically to store elastic potential energy in the connection part. And the force of the elastic potential energy acting on the carrying part is a holding force toward the fixed platform. This solution helps to realize a miniaturized size of the assembled image sensor driving module.

[0014] In one possible implementation, a magnetic member is disposed on the carrier, and the magnetic member and a part of the fixed base configured to contact the carrier form at least a part of the holding structure, and the part of the fixed base configured to contact the carrier has a magnetic conductive material, and a magnetic attraction force between the magnetic member and the fixed base forms at least a part of the holding force. In this solution, the magnetic member is disposed on the carrier, and the fixed platform is designed to cooperate with the magnetic member to form the magnetic attraction force. By using the magnetic attraction force as the holding force, the life and stability of the holding force can be ensured.

[0015] In one possible implementation, the magnetic member includes at least two magnets, which are arranged in a dot-like distribution on the carrier and adjacent to the outer edge of the carrier, the outer edge of the carrier being the edge position of the carrier facing the fixed part. Specifically, the number of magnets may be three or four. If there are three magnets, the three magnets may form a plane. This can ensure the surface contact of the contact surface between the carrier and the fixed base. If there are four magnets, the magnets may be symmetrically distributed at the four outer corner positions of the image sensor. This helps to ensure the movement stability of the image sensor. In this solution, the magnets are arranged at the outer edge of the carrier so that the magnets are as far away from the image sensor as possible, and the influence of the magnetic field generated by the magnets on the image sensor is reduced.

[0016] In one possible implementation, the magnetic member includes at least two magnetic stripes, all of which are long stripes, and the at least two magnetic stripes are symmetrically distributed on the carrier and adjacent to the outer edge of the carrier, which is the edge of the carrier facing the fixed part. Arranging the magnetic stripes in a long stripe shape not only provides a large magnetic attraction force, but also facilitates assembly and installation. In this embodiment of the application, the magnetic attraction force between the magnetic member arranged on the carrier and the fixed base needs to ensure that the carrier can maintain contact with the fixed base during the moving process, and the magnetic attraction force needs to be controlled within a preset range, in other words, the magnetic attraction force cannot be excessively large. If the magnetic attraction force is excessively large, the driving unit may not be able to drive the carrier to move, or the efficiency of moving the carrier may be affected.

[0017] In one possible implementation, the movable member is a magnetic driving member, the fixed member is a coil driving member, the magnetic member includes the magnetic driving member, and the magnetic attraction force between the magnetic driving member and the fixed base forms at least a part of the holding force. In this solution, the magnetic driving member is used to form the holding structure, which facilitates the design of a miniaturized size of the image sensor driving module.

[0018] In one possible implementation, the magnetic member is disposed on the fixed base, a part of the carrier has a magnetic conductive material, and the part of the carrier having the magnetic conductive material is a magnetic attracting member, the magnetic member and the magnetic attracting member form at least a part of the holding structure, the magnetic member is placed at the position of the contact surface between the fixed base and the carrier, and the magnetic attraction force between the magnetic member and the magnetic attracting member forms the holding force. In this solution, the magnetic member is disposed on the fixed platform, and the magnetic attracting member, for example a steel plate, is disposed on the carrier accordingly. This design can reduce the influence of the magnetic member on the driving unit and the image sensor, and ensure the moving stability of the image sensor and the quality of the generated image signal.

[0019] In one possible implementation, the magnetic member is located on a surface of the fixed base remote from the carrier, or the magnetic member is embedded inside the fixed base. The magnetic attraction member is located on a surface of the carrier facing the fixed base, and the magnetic attraction member contacts the fixed base to form a friction interface, and the magnetic attraction member is further configured to carry the image sensor. The carrier includes a circuit board and the above-mentioned magnetic attraction member, and the magnetic attraction member is attached to the bottom surface of the circuit board to reinforce the strength of the circuit board. In this solution, the magnetic member is located on the surface of the fixed base remote from the carrier, so that the distance between the magnetic member and the image sensor and the driving unit can be maximized. This can reduce the influence of the magnetic member on the driving unit and the image sensor, and ensure the movement stability of the image sensor and the quality of the generated image signal. The magnetic member is embedded inside the fixed platform so that the magnetic member and the fixed platform are integrated. This does not affect the overall structure of the image sensor driving module, and facilitates assembly and positioning between the image sensor driving module and another structure of the electronic device.

[0020] In one possible implementation, the image sensor driving module includes an elastic member, one end of the elastic member is located on the carrier, and the other end of the elastic member is located on the fixed base, the elastic member forms at least a part of the holding structure, and the elastic force applied by the elastic member to the carrier constitutes at least a part of the holding force, and the direction of the elastic force is toward the contact surface between the carrier and the fixed base. This solution provides a specific solution of the holding structure, and by disposing the elastic member, the stability of the holding force of the holding structure can be improved, and the elastic member and the connecting part can jointly form the holding structure. In other words, by utilizing the holding force provided by the connecting part and the holding force of the elastic member, the contact between the carrier and the fixed platform can be made more stable.

[0021] In one possible implementation, a friction interface is formed on the contact surface between the support and the fixed base, and the friction interface has a friction coefficient of less than 0.3. In this application, the friction coefficient of the sliding friction between the support and the fixed base is limited, and therefore the smooth movement of the image sensor can be ensured based on limiting the plane on which the image sensor moves. This reduces the friction resistance in the movement process of the image sensor and improves the efficiency of driving and moving the image sensor.

[0022] In one possible implementation, at the position of the friction interface, the support and / or the fixed base comprises a super slip material layer, which is of solid structure, and the friction coefficient of the friction interface is realized by using the super slip material layer. The combination of the solid structure super slip material layer with the support and the fixed platform is easier to implement, for example, it can be directly connected and attached by using an adhesive layer, and has the advantage of a simple and easy assembly process.

[0023] In one possible implementation, a lubricating layer is disposed between the carrier and the fixed base at the position of the friction interface, the lubricating layer being of an oil-like, grease-like or paste-like structure, and the friction coefficient of the friction interface being less than 0.3 is realized by using the lubricating layer. In this solution, a lubricating layer of an oil-like, grease-like or paste-like structure is disposed between the carrier and the fixed base to realize a friction interface with a low friction coefficient. Since the shape of the lubricating layer is not constant, the lubricating layer is applied to the contact surface between the carrier and the fixed base, and the lubricating layer can have a small size. This facilitates the miniaturization of the camera module in the optical axis direction of the camera module. The design of the lubricating layer further helps ensure the flatness of the contact surface, and it can be understood that the flatness can be compensated by using the lubricating layer to avoid vibration or tilt in the optical axis direction during the movement process of the image sensor.

[0024] In one possible implementation, the lubricating layer may include a rolling structure.

[0025] In one possible implementation, the friction coefficient of the friction interface is less than 0.3 by carrying out a surface treatment manufacturing process on the contact surface between the support and the fixed base. The surface treatment method can be a surface modification technique such as polishing, a surface alloying technique such as carburizing and nitriding, a surface conversion film (additive material and base material chemically react to form a conversion film by using a chemical method), and the like. The surface treatment method can form the friction interface X without adding a super slip material layer or a lubricating layer, and obtain a small size in the optical axis direction.

[0026] In one possible implementation, the friction interface includes a material with thermal conductivity. In this application, the thermal resistance at the location of the friction interface can be reduced, and by using the contact relationship between the support part and the fixed part, the heat of the support part can be better conducted to one side of the outer surface of the fixed base, thereby improving the thermal conduction ability of the image sensor driving module. The heat dissipation efficiency of the image sensor and the driving unit can be optimized, and the deterioration of the imaging quality caused by the excessively high temperature of the camera module in the video shooting process or long-term shooting process is avoided.

[0027] In one possible implementation, the thermal conductivity of the friction interface is greater than 0.5 W / m K. In this solution, limiting the thermal conductivity of the friction interface helps ensure the performance of the image sensor and improve the quality of the image signal.

[0028] In one possible implementation, the contact manner between the carrier and the fixed base is a planar contact, the planar surface on the carrier used to contact the fixed base is a first planar surface, the planar surface on the fixed base used to contact the carrier is a second planar surface, and both the first planar surface and the second planar surface are continuous complete planar structures. This solution facilitates heat transfer. The large contact area between the carrier and the fixed base exhibits high heat transfer efficiency. This solution can improve the heat dissipation capability through complete planar contact.

[0029] In one possible implementation, the contact manner between the carrier and the fixed base is the contact between a flat surface and an array of bumps, and at the position where the carrier contacts the fixed base, one of the structures of the carrier and the fixed base is a completely flat surface structure, and the other structure of the carrier and the fixed base is an array of bump structures, and the array of bump structures is arranged corresponding to the entire area of ​​the completely flat surface structure. In this solution, the problem of misalignment in the optical axis direction caused by the flatness of the contact between the flat surfaces can be solved by the contact of the array of bump structures with the flat surface. The arrangement of the array of bump structures makes it easy to control the flatness of the flat surface, including the position where the bumps contact the flat surface. In the process of relative movement, it can be more stable and the friction coefficient can be stable.

[0030] In one possible implementation, the contact manner between the carrier and the fixed base is the contact between a plane and a plurality of array-like bumps, and at the position where the carrier contacts the fixed base, one of the structures of the carrier and the fixed base is a completely plane structure, and the other structure of the carrier and the fixed base is a multi-bump structure, and the multi-bump structure is arranged corresponding to a partial area of ​​the completely plane structure. In this solution, the cooperation of the bump structure distributed at a local position and the plane helps to adjust the flatness of the position of the friction interface. The position of the contact surface between the fixed platform and the carrier does not require high manufacturing precision of flatness to meet the moving stability of the image sensor.

[0031] In one possible implementation, the contact manner between the carrier and the fixed base is the contact between a plane and a protruding rod structure, and at the position where the carrier contacts the fixed base, one of the structures of the carrier and the fixed base is a completely plane structure, and the other of the structures of the carrier and the fixed base is a protruding rod structure. Compared with the bump structure, this solution can increase the contact area by arranging the rod structure, which helps to reduce the pressure and avoids the friction damage of the contact surface in the process of relative movement affecting the positioning accuracy in the optical axis direction. Compared with the full-surface contact structure, the rod structure can eliminate the problem of movement in the optical axis direction caused by flatness.

[0032] In one possible implementation, the movable base is an integrated circuit board structure, the support part includes a first area configured to support the movable member and another electronic component, and the size of the movable base in the direction of the optical axis of the image sensor is the thickness of the movable base, and the thickness of the first area, the thickness of the connection part, and the thickness of the fixed part are equal. The movable base including the integrated circuit structure can save the space of the image sensor driving module in the thickness direction. This facilitates the design of the miniaturization of the size of the image sensor driving module in the direction of the optical axis of the image sensor. In this implementation, the circuit board is formed by using an integral molding process. The manufacturing process is simple, the assembly is convenient, and the structure stability is good. The trace layer of the movable base is routed only within the same circuit board. This can ensure the stability of signal transmission and reduce signal loss.

[0033] In one possible implementation, the carrier comprises a second region configured to mount the image sensor, the first region is connected between the second region and the connection portion, the thickness of the second region is smaller than the thickness of the first region, the first region is arranged around an edge of the second region to surround the accommodation space together with the second region and to accommodate the image sensor with the accommodation space, and the contact surface between the first region and the fixed base is flush with the contact surface between the second region and the fixed base. In this solution, the carrier comprises a groove, which is configured to accommodate the image sensor, so that the space in the optical axis direction is saved and a design with a small size in the optical axis direction is easily realized.

[0034] In one possible implementation, the fixed base includes a fixed platform and a fixed frame, and a holding force is used to maintain the contact between the carrier and the fixed platform, and the fixed frame is fixedly connected to an edge of the fixed platform, and the fixed frame and the fixed platform enclose an enclosed space in which the driving unit, the connection part, and a part of the carrier are located, and the driving unit is located on the side of the carrier that is far from the fixed platform. This solution limits the specific position layout of the driving unit, which facilitates the design of a small size of the image sensor driving module.

[0035] In one possible implementation, the fixed base includes a fixed platform, and a holding force is used to maintain contact between the carrier and the fixed platform, the driving unit is located between the carrier and the fixed platform, and the fixed member is attached to the fixed platform. This solution limits the specific position layout of the driving unit and the fixed member is attached by using the fixed platform, which facilitates the design of a small size of the image sensor driving module.

[0036] In one possible implementation, the fixed base includes a fixed frame, the fixed frame is fixedly connected to the edge of the fixed platform, the fixed part is connected to the fixed frame, and the fixed part is separated from the fixed platform by at least a part of the fixed frame. This solution provides a specific structure in which the fixed base is connected to the fixed part of the movable base, which facilitates the rational configuration of the structural layout of the image sensor driving module, and achieves the advantages of compactness and small size of the whole structure.

[0037] In one possible implementation, the support portion includes a first support platform and a second support platform, the first support platform is configured to support the image sensor, the first support platform contacts the fixed base to form a contact surface, a direction perpendicular to the contact surface is a direction of an optical axis, the second support platform and the connection portion are stacked in the direction of the optical axis, and the movable member of the drive unit is attached to the second support platform.

[0038] In one possible implementation, the first carrying platform and the connecting part are connected together to form an integral structure, and the connecting part is located between the second carrying platform and the contact surface in the direction of the optical axis. In this implementation, the carrying part is designed as a structure of two plates (specifically the first carrying platform and the second carrying platform), and by using an architecture in which the second carrying platform and the connecting part are stacked, a small-sized design of the movable base in the direction perpendicular to the optical axis can be realized. When this solution is applied to electronic equipment, the board occupation area of ​​the circuit board on which the camera module is located can be reduced.

[0039] In one possible implementation, the first carrying platform and the connecting part are respectively connected to the top surface and the bottom surface of the second carrying platform, and the second carrying platform is located between the connecting part and the contact surface in the direction of the optical axis. In this implementation, the carrying part is designed as a structure of two plates (specifically, the first carrying platform and the second carrying platform), and by using an architecture in which the second carrying platform and the connecting part are stacked, a small-sized design of the movable base in the direction perpendicular to the optical axis can be realized. When this solution is applied to electronic equipment, the board occupation area of ​​the circuit board on which the camera module is located can be reduced.

[0040] In one possible implementation, the carrier includes a first plate and a second plate, the outer edge of the first plate and the connecting portion are connected together to form an integral structure, and the accommodation space is formed by surrounding the inner edge of the first plate, the first plate is configured to carry the movable member, and the second plate includes a first part and a second part, the first part and the first plate are stacked, the second part is located at the bottom of the accommodation space, the second part is configured to carry the image sensor so as to allow the image sensor to be accommodated in the accommodation space, and the second plate contacts the fixed base. In this solution, the second plate is connected to the image sensor, the first plate supports the movable member, and the image sensor is accommodated in the accommodation space. This helps to realize a size in the optical axis direction so that a compact architecture in the optical axis direction can be easily realized for the image sensor driving module.

[0041] According to a second aspect, an embodiment of the present application provides an optical assembly including an axial motion drive module and an image sensor drive module according to any possible implementation of the first aspect, wherein the axial motion drive module is fixedly connected to the image sensor drive module, the image sensor drive module configured to drive the image sensor to move in a plane perpendicular to the optical axis, and the axial motion drive module configured to drive the lens assembly to move and tilt axially.

[0042] According to a third aspect, an embodiment of the present application provides a camera module including an image sensor, a lens assembly, and an optical assembly according to the second aspect, wherein the lens assembly is mounted on the axial motion drive module, the image sensor is mounted on the image sensor drive module, and the lens assembly is located on a light input side of the image sensor.

[0043] According to a fourth aspect, an embodiment of the present application provides a camera module including an image sensor, a lens assembly, and an image sensor drive module according to any possible implementation of the first aspect, wherein the image sensor is attached to the image sensor drive module, and the lens assembly is located on a light input side of the image sensor.

[0044] According to a fifth aspect, an embodiment of the present application provides an electronic device including a processor and a camera module according to the third or fourth aspect, the processor being electrically connected to the camera module, the processor being configured to process an image signal output by the image sensor. [Brief description of the drawings]

[0045] [Figure 1] FIG. 1 is a three-dimensional view of an electronic device according to one possible implementation of the present application. [Diagram 2] 2 is a three-dimensional view of the electronic device shown in FIG. 1 in another direction. [Figure 3A]FIG. 2 is a three-dimensional view of a camera module according to one possible implementation of the present application. [Figure 3B] FIG. 2 is a three-dimensional cross-sectional view of a camera module according to one implementation of the present application. [Figure 4] FIG. 2 is a three-dimensional exploded view of a camera module according to one possible implementation of the present application. [Diagram 5] FIG. 2 is a three-dimensional exploded view of a camera module according to one possible implementation of the present application. [Figure 6] FIG. 2 is a three-dimensional view of an image sensor driving module according to one possible implementation of the present application. [Figure 7] FIG. 2 is a three-dimensional exploded view of an image sensor driving module according to one possible implementation of the present application. [Figure 8] FIG. 2 is a three-dimensional exploded view of an image sensor driving module according to one possible implementation of the present application. [Figure 9] 1 is a cross-sectional view of an image sensor driving module according to one possible implementation of the present application. [Figure 10A] 10 is a partially enlarged view of the cross-sectional view of the image sensor driving module shown in FIG. 9. [Figure 10B] FIG. 2 is a partially enlarged cross-sectional view of an image sensor driving module according to one possible implementation of the present application. [Figure 11A] 1 is a schematic diagram of a friction interface between a support part of an image sensor driving module and a fixed platform according to one possible implementation of this application. [Figure 11B] 1 is a schematic diagram of a friction interface between a support part of an image sensor driving module and a fixed platform according to one possible implementation of this application. [Figure 11C] 1 is a schematic diagram of a friction interface between a support part of an image sensor driving module and a fixed platform according to one possible implementation of this application. [Figure 12] 1 is a schematic diagram of a friction interface between a support part of an image sensor driving module and a fixed platform according to one possible implementation of this application. [Figure 13]1 is a schematic diagram of a friction interface between a support part of an image sensor driving module and a fixed platform according to one possible implementation of this application. [Figure 14] 1 is a schematic diagram of a specific form of contact surface between a carrier of an image sensor driving module and a fixed platform according to one possible implementation of this application; [Figure 15] 1 is a schematic diagram of a specific form of contact surface between a carrier of an image sensor driving module and a fixed platform according to one possible implementation of this application; [Figure 16] 1 is a schematic diagram of a specific form of contact surface between a carrier of an image sensor driving module and a fixed platform according to one possible implementation of this application; [Figure 17] 1 is a schematic diagram of a specific form of contact surface between a carrier of an image sensor driving module and a fixed platform according to one possible implementation of this application; [Figure 18] 1 is a schematic diagram of a specific form of contact surface between a carrier of an image sensor driving module and a fixed platform according to one possible implementation of this application; [Figure 19] 1 is a schematic diagram of a specific form of contact surface between a carrier of an image sensor driving module and a fixed platform according to one possible implementation of this application; [Figure 20] 1 is a schematic diagram of a specific architecture of a holding structure of an image sensor driving module according to one possible implementation of this application; [Figure 21] 1 is a schematic diagram of a specific architecture of a holding structure of an image sensor driving module according to one possible implementation of this application; [Figure 22] 1 is a schematic diagram of a specific architecture of a holding structure of an image sensor driving module according to one possible implementation of this application; [Figure 23A] 1 is a schematic diagram of a specific architecture of a holding structure of an image sensor driving module according to one possible implementation of this application; [Figure 23B]1 is a schematic diagram of a specific architecture of a holding structure of an image sensor driving module according to one possible implementation of this application; [Figure 24] 1 is a schematic diagram of a specific architecture of a holding structure of an image sensor driving module according to one possible implementation of this application; [Figure 25A] 1 is a cross-sectional view of an image sensor driving module according to one possible implementation of the present application. [Figure 25B] Similar to the implementation shown in FIG. 25A, a detailed structure of the first bearing region is shown in FIG. 25B. [Figure 26] 1 is a cross-sectional view of an image sensor driving module according to one possible implementation of the present application. [Figure 27] 1 is a cross-sectional view of an image sensor driving module according to one possible implementation of the present application. [Figure 28] 1 is a cross-sectional view of an image sensor driving module according to one possible implementation of the present application. [Figure 29] 1 is a cross-sectional view of an image sensor driving module according to one possible implementation of the present application. [Diagram 30] 1 is a cross-sectional view of an image sensor driving module according to one possible implementation of the present application. [Diagram 31] 1 is a cross-sectional view of an image sensor driving module according to one possible implementation of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0046] Possible implementations of this application will now be described with reference to the accompanying drawings in which:

[0047] 1 is a schematic diagram of the structure of an electronic device 1000 in some possible implementations according to one possible implementation of this application. The electronic device may be an electronic product such as a mobile phone, a tablet computer, a laptop computer, a television, an in-vehicle device, a wearable device, or a video surveillance device. The wearable device may be a smart band, a smart watch, a wireless headset, an augmented reality (AR) glass, an augmented reality technology helmet, a virtual reality (VR) technology glass, a virtual reality technology helmet, or the like. One possible implementation of this application is described using an example in which the electronic device is a mobile phone.

[0048] Please refer to Figures 1 and 2. Figure 2 is a schematic diagram of the structure of the electronic device 1000 shown in Figure 1 from another angle. The electronic device 1000 includes a housing 100, a display 200, a front camera assembly 300, a rear camera assembly 400, a main board 500, a processor 600, a memory 700, and a battery 800. The display 200 is configured to display an image, and the display 200 may further be integrated with a touch function. The display 200 is attached to the housing 100. The housing 100 may include a bezel 1001 and a rear cover 1002. The display 200 and the rear cover 1002 are respectively attached to two opposite sides of the bezel 1001. In this possible implementation, in the external space of the electronic device 1000, a space facing the display 200 is configured as the front of the electronic device 1000, and a space facing the rear cover 1002 is configured as the rear of the electronic device 1000.

[0049] In some possible implementations, the front camera assembly 300 is disposed within the housing 100 and disposed below the display 200. The display 200 includes a front camera hole 2001 through which the front camera assembly 300 collects light from the front of the electronic device 1000 to capture an image. The front camera assembly 300 may include a camera module described in the following possible implementations, or may include a camera module of another structure.

[0050] In some possible implementations, at least one rear camera hole 1003 is disposed in the rear cover 1002. The rear camera assembly 400 is disposed in the housing 100. The rear camera assembly 400 collects light from the rear of the electronic device 1000 through the at least one rear camera hole 1003 to capture images. In possible implementations of this application, "at least one" includes two cases, "one" and "multiple", where "multiple" means more than two, and "two or more" includes two. The rear camera assembly 400 includes at least one camera module 4001, and may include one or more of a standard camera module, a long focus camera module, a wide-angle camera module, an ultra-long focus camera module, or an ultra-wide-angle camera module. For example, the rear camera assembly 400 includes a standard camera, a wide-angle camera, and a periscope long focus camera. The camera module 4001 of the rear camera assembly 400 may include a camera module described in the possible implementations below, or may include a camera module of other configurations.

[0051] In some possible implementations, the rear camera assembly 400 may further include a flash module 4002. The rear cover 1002 includes a flash hole 1004. The flash module 4002 is located within the housing 100 and emits light through the flash hole 1004.

[0052] In some possible implementations, the main board 500 is located in the housing 100, and the processor 600 and the memory 700 are attached to the main board 500. The display 200, the front camera assembly 300, and the back camera assembly 400 are coupled to the processor 600. The memory 700 is configured to store computer program code. The computer program code includes computer instructions. The processor 600 is configured to call the computer instructions to enable the electronic device 1000 to perform corresponding operations, such as enabling the display 200 to display a target image or enabling the front camera assembly 300 or the back camera assembly 400 to collect a target image. The battery 800 is electrically connected to the main board 500 and configured to supply power to the electronic device 1000. In some possible implementations, the electronic device 1000 may further include one or more of functional modules, such as an antenna module, a mobile communication module, a sensor module, a motor, a microphone module, and a speaker module. These functional modules may be electrically connected to the processor 600 to transmit signals.

[0053] One possible implementation of this application provides a camera module, which may be the front camera assembly 300 or the back camera assembly 400 in the implementations shown in Figures 1 and 2. The camera module is electrically connected to a processor 600 of an electronic device. Specifically, the processor 600 is electrically connected to an image sensor of the camera module, and may drive the image sensor and process an image signal output from the image sensor.

[0054] FIG. 3A is a three-dimensional assembly view of the camera module 10 according to an implementation of this application. FIG. 3B is a three-dimensional cross-sectional view of the camera module 10 according to an implementation of this application. FIG. 4 and FIG. 5 are three-dimensional exploded views in two directions of the camera module 10 provided in FIG. 3A. Please refer to FIG. 3A, FIG. 3B, FIG. 4, and FIG. 5. In one implementation, the camera module 10 includes an image sensor driving module 2, a lens driving module 3, an image sensor 4, and a lens assembly 5. The lens driving module 3 and the image sensor driving module 2 form an optical assembly 80, and the image sensor driving module 2 is configured to drive and move the image sensor 4. The lens driving module 3 is configured to perform optical focusing, optical image stabilization, aberration adjustment, etc. of the camera module 10.

[0055] In one implementation, the image sensor 4 moves on a reference plane. The reference plane can be coplanar or parallel to the light-sensitive surface of the image sensor 4, and the reference plane can be a plane perpendicular to the extension direction of the optical axis P. The optical axis P may be understood as the optical axis of the image sensor 4, the optical axis of the lens assembly 5, or the optical axis of the camera module 10. In the camera module, theoretically, the optical axis of the lens assembly 5 and the optical axis of the image sensor 4 can overlap. In the case of an assembly error or design tolerance, the optical axis of the lens assembly 5 and the optical axis of the image sensor 4 may be offset or tilted with respect to each other. However, regardless of the overlap, offset, or tilt, the optical axis of the lens assembly 5 and the optical axis of the image sensor 4 extend in the same direction (the coincident extension direction can be understood as substantially the same direction, and a relative tilt within a small range is allowed), and both of them can be considered as the optical axis of the camera module 10.

[0056] In one implementation, the lens driving module 3 includes a housing 31 and a driving component 32. The housing 31 is closed to form an accommodation space, and the housing 31 is configured to be fixedly connected to other functional modules (e.g., the image sensor driving module 2). The driving component 32 is accommodated in the accommodation space of the housing 31, and the driving component 32 is configured to drive and move the lens assembly 5 of the camera module 10. Specifically, the driving component 32 of the driving module 3 is configured to drive and move or tilt the lens assembly 5 in an axial direction (specifically, in the extension direction of the optical axis P) to perform optical image stabilization, optical focusing, aberration adjustment, and the like. Specifically, the lens driving module 3 can drive and move the lens assembly 5 in an axial direction to perform optical focusing of the camera module 10. The lens driving module 3 can also be configured to compensate for other optical parameters of the camera module 10, such as aberration, and the aberration can be compensated for by the lens driving module 3 driving and moving at least a part of the lens of the lens assembly 5. 3B, in one implementation, the driving component 32 includes a magnetic driving member 321 and a coil driving member 322. The coil driving member 322 is connected to the lens assembly 5, and the magnetic driving member 321 is connected to the housing 31. When the coil driving member 322 is powered on, the coil driving member 322 and the magnetic driving member 321 are coupled to generate an electromagnetic driving force for driving and moving the lens assembly 5. In a specific implementation of this application, the driving component 32 of the lens driving module 3 is shielded by the housing 31, and the driving component 32 of the lens driving module 3 does not participate in driving the image sensor driving module 2.

[0057] In this solution, the lens driving module 3 and the image sensor driving module 2 of the optical assembly 80 are two independent modular structures, and the image sensor driving module 2 can be adapted to different types of lens driving modules 3 to form different driving solutions. The image sensor driving module 2 provided in this application can form multiple different optical image stabilization solutions and has wide adaptability. In an assembly process of one implementation, the image sensor 4 can be attached to the image sensor driving module 2 first, and then the lens driving module 3 is attached to the top surface of the image sensor driving module 2. Specifically, the lens driving module 3 and the image sensor driving module 2 can be fixedly connected by using an adhesive (adhesive layer 801). In an assembly process of another implementation, the lens driving module 3 and the image sensor driving module 2 are fixedly connected as a whole to form the optical assembly 80, and then the image sensor 4 is attached to the optical assembly 80. In other words, the optical assembly 80 may be of a modular structure independent of the image sensor 4 and the lens assembly 5, and the assembly precision of the modular structure is easily controlled and the manufacturing cost is low. In the process of assembling the optical assembly 80 with the image sensor 4 and the lens assembly 5, the assembly process can be simplified, and the positioning precision of the assembled optical components is high, which helps ensure the optical stability of the camera module.

[0058] The camera module 10 includes a circuit board 9 configured to electrically connect to a processor of a main board of an electronic device. The circuit board 9 can be a flexible circuit board. The circuit board 9 can be a part of the image sensor driving module 2. The circuit board 9 is configured to transmit a signal collected by the image sensor 4 to the processor. A driving circuit can further be disposed on the circuit board 9, and the driving circuit is configured to drive the image sensor driving module 2 to move the image sensor 4.

[0059] Please refer to FIG. 4 and FIG. 5. In a specific implementation, the image sensor driving module 2 includes a first top surface S1 and a first bottom surface S2 arranged on opposite sides. The first bottom surface S2 is flat and configured to connect to a main board or a mid-frame support of an electronic device. The first top surface S1 is of a frame-like architecture. The image sensor driving module 2 includes a first carrying area R1, which is located inside an opening S11 formed by the first top surface S1 surrounding, and the image sensor 4 is mounted on the first carrying area R1 from the opening S11. An optical component 6, such as an IR filter, may further be mounted on the first carrying area R1. The lens driving module 3 is of a frame-like architecture as a whole. The area surrounded by the lens driving module 3 is located on the light incident side of the first carrying area R1 of the image sensor driving module 2, in other words, directly opposite the first carrying area R1 in the optical axis direction. The opening S11 is connected to the first carrying area R1 and the area surrounded by the lens driving module 3, and the area surrounded by the lens driving module 3 is configured to mount the lens assembly 5. In one implementation, a part of the lens assembly 5 may be located inside the opening S11. In one implementation, a part of the lens assembly 5 may be placed in the first carrying area R1 instead. The lens driving module 3 includes a second bottom surface S3 and a second top surface S4 arranged on opposite sides. The second bottom surface S3 is the outer surface of the bottom plate of the housing 31, and the second top surface S4 is the outer surface of the top plate of the housing 31. The second bottom surface S3 may be attached by gluing to the first top surface S1 using an adhesive layer 801, or the second bottom surface S3 may instead be attached to the first top surface S1 by another connection manner, such as screwing or welding.

[0060] In another implementation provided in this application, the lens driving module may not be disposed in the camera module 10. The image sensor driving module 2 is used only to adjust the position of the image sensor 4 to implement functions such as image stabilization or aberration compensation of the camera module 10. A miniaturized camera module 10 with a simple structure is provided and used in a specific electronic device. This helps to save space in the electronic device and reduce the board area occupied by the electronic device.

[0061] As shown in FIG. 3B, the image sensor driving module 2 provided in one implementation of this application includes a fixed base 21, a driving unit 22, and a movable base 23. The driving unit 22 includes a fixed member 221 and a movable member 222 that can move relative to each other. For example, the fixed member 221 is a magnet, and the movable member 222 is a coil. When the movable member 222 is powered on, the movable member 222 interacts with the fixed member 221 to generate a driving force. The fixed base 21 is configured to carry the fixed member 221, and the movable base 23 is configured to carry the movable member 222 and the image sensor 4. The fixed base 21 includes a fixed platform 211 and a fixed frame 212. The fixed platform 211 includes an inner surface S0 and a first bottom surface S2 that are opposite to each other, and the fixed frame 212 is connected to the fixed platform 211 and protrudes from the inner surface S0, the fixed member 221 is attached to the fixed base 21, and an opening S11 is formed on the side of the fixed frame 212 that is far from the inner surface. The movable base 23 and the inner surface S0 of the fixed platform 211 may be in contact with each other. The movable base 23 includes a carrying portion 231, a fixed portion 232, and a connecting portion 233. The connecting portion 233 is configured to realize a mechanical and electrical connection between the carrying portion 231 and the fixed portion 232, and the fixed portion 232 is connected to the fixed base 21, and the fixed portion 232 is connected to the fixed base 21 in a relatively fixed manner. The carrying portion 231 includes a second carrying region R2 and a first carrying region R1. The second carrying region R2 is located around the first carrying region R1, the second carrying region R2 is configured to carry the movable member 222, the first carrying region R1 is configured to carry the image sensor 4, and the opening S11 is configured to mount the image sensor 4 on the first carrying region R1.

[0062] In this application, the image sensor driving module 2 is designed as a module architecture independent of the image sensor 4. After the image sensor driving module 2 is assembled as a whole, the image sensor 4 is assembled to the image sensor driving module 2 through the opening S11 of the image sensor driving module 2. In this application, the image sensor driving module 2 is decoupled from the image sensor 4. This helps to control the manufacturing accuracy of the image sensor driving module 2. Since the image sensor 4 is not assembled to the image sensor driving module 2 in the manufacturing and assembly process of the image sensor driving module 2, the manufacturing process of the image sensor driving module 2 has no effect on the performance of the image sensor 4, and the testing process of the image sensor driving module 2 can instead use a separate image sensor dedicated to testing. When the image sensor driving module 2 is used in a camera module, the high-quality performance of the image sensor 4 of the camera module can be ensured, the manufacturing yield of the camera module can be improved, and the cost can be reduced.

[0063] The detailed structure of the specific image sensor driving module provided in this application is described as follows. FIG. 6 is a three-dimensional assembly view of the image sensor driving module 2 according to one implementation of this application. FIG. 7 and FIG. 8 are three-dimensional exploded views in two directions of the image sensor driving module 2 according to FIG. 6. FIG. 9 is a cross-sectional view of the image sensor driving module 2 according to FIG. 6. As shown in FIG. 9, in this implementation, the fixed base 21 corresponds to the housing of the image sensor driving module 2. The fixed frame 212 of the fixed base 21 includes a side frame 2122 and a top plate 2121, and the top plate 2121 and the inner surface S0 of the fixed platform 211 are arranged opposite to each other. The side frame 2122 is connected between the top plate 2121 and the fixed platform 211, and forms an enclosed space 2120 together with the top plate 2121 and the fixed platform 211. The driving unit 22, the connection part 233, and the second carrying area R2 are located in the enclosed space 2120. The opening S11 is formed by the surrounding top plate 2121.

[0064] The drive unit in FIG. 6 is inside the fixed base 21 and cannot be seen because the drive unit is blocked by the fixed base 21. The fixed base 21 can be used as a carrier for mounting and can also protect the drive unit 22 and the movable base 23. The fixed base 21 can also be used as a structure for connecting the image sensor drive module 2 to another device. For example, the image sensor drive module 2 can be mounted on a circuit board of an electronic device by fixedly connecting the fixed base 21 to the circuit board.

[0065] Please refer to Figures 7, 8 and 9. In one implementation, the fixed platform 211 has a flat structure, and the fixed platform 211 is configured to contact a part of the movable base 23. The inner surface of the fixed platform 211 can have a flat structure, the inner surface of the fixed platform 211 can be perpendicular to the direction of the optical axis of the image sensor 4, the inner surface of the fixed platform 211 can be parallel to the photosensitive surface of the image sensor 4, and the outer surface of the fixed platform 211 is the first bottom surface S2 (shown in Figure 5) of the image sensor driving module 2. In one implementation, the fixed platform 211 is made of a metal material, or the fixed platform 211 has a magnetic conductive material. The fixed platform 211 can be attracted by the magnetic attraction force of the magnetic component. The fixed platform 211 is configured to contact a part of the movable base 23 that drives and moves the image sensor 4, and the movable base 23 drives and moves the image sensor 4 on the fixed platform 211. During the moving process, the contact surfaces between the fixed platform 211 and the movable base 23 maintain contact. The fixed platform 211 has a thermally conductive material and can be used as a heat dissipation structure to dissipate heat generated by the image sensor and other electronic components of the movable base 23.

[0066] Specifically, the fixed platform 211 includes a central region 2111, a connection region 2112, and an edge region 2113. The central region 2111, the connection region 2112, and the edge region 2113 are on the same plane. The connection region 2112 is disposed around the central region 2111, and is connected between the edge region 2113 and the central region 2111. As shown in FIG. 7, the fixed platform 211 can be of a one-piece flat plate structure. The dotted box represents the distinction between the central region 2111, the connection region 2112, and the edge region 2113 in a schematic manner. Specifically, the distinction between these three parts should be defined based on the functions of these three parts. A detailed description is as follows. The central region 2111 is configured to contact a part of the movable base 23. In one implementation, a portion of the structure of the movable base 23 that supports the image sensor 4 is frame-shaped (or ring-shaped), a portion of the central region 2111 is in contact with the movable base 23, a portion of the central region 2111 and the image sensor 4 are disposed facing each other, and a gap exists between the central region 2111 and the image sensor 4. The edge region 2113 is configured to connect to the fixed frame 212.

[0067] In one implementation, the fixed frame 212 includes a top plate 2121 and a side frame 2122. The top plate 2121 is a rectangular frame structure, and an opening S11 formed by the surrounding of the top plate 2121 is configured to mount or accommodate an optical component (e.g., an optical lens) or is used as a light transmission hole. The outer shape of the opening S11 formed by the surrounding of the top plate 2121 is larger in size than the outer shape of the image sensor. This helps to mount the image sensor to the movable base 23 through the position of the opening S11.

[0068] The side frame 2122 is connected to the outer edge of the top plate 2121, and the side frame 2122 and the top plate 2121 together surround and form an enclosed space 2120. In this implementation, the fixed member 221 of the driving unit 22 is attached to the inner side of the top plate 2121 and located within the enclosed space 2120. In this implementation, the fixed member 221 is a magnetic driving member, and the fixed member 221 includes four stripe-shaped magnets, which are arranged on opposite sides in pairs. The top plate 2121 includes four frames, and one stripe-shaped magnet is mounted on each frame.

[0069] In one implementation, the magnetic conductive structure 2123 is disposed in the fixed frame 212. In the implementation shown in FIG. 7, the magnetic conductive structure 2123 is disposed on the inner surface of the top plate 2121. In another implementation, the magnetic conductive structure 2123 may be disposed on the outer surface of the top plate 2121 instead, or may be embedded in the middle layer of the top plate 2121 instead. The fixed member 221 is mounted on the inner side of the magnetic conductive structure 2123, and the magnetic conductive structure 2123 is configured to implement magnetic shielding of the image sensor driving module 2. The magnetic conductive structure 2123 is made of a material with magnetic shielding performance. The shape of the magnetic conductive structure 2123 may be the same as that of the top plate 2121. The magnetic conductive structure 2123 may be disposed on both the top plate 2121 and the side frame 2122 instead. In other words, the magnetic conductive structure 2123 forms the architecture of the enclosed space 2120 and shields the magnetic environment in the image sensor driving module 2 in all directions. In one implementation, the magnetic conductive structure 2123 can be a plate-like structure, such as a metal plate, which can be attached to the inner surface of the top plate 2121. In another implementation, the magnetic conductive structure 2123 can instead be a layer structure coated on the surface of the top plate, such as a coating with magnetic conductive function formed on the surface of the top plate 2121 by spray coating or electroplating, etc. The magnetic conductive structure 2123 can instead be a mesh structure, with electromagnetic shielding function, or with grounding function. In this application, the magnetic conductive structure 2123 is disposed in the fixed frame 212, thereby realizing the magnetic shielding of the image sensor driving module 2. When the driving unit 22 of the image sensor driving module 2 is magnetically driven, the magnetic conductive structure 2123 can ensure the stability of the driving signal of the driving unit 22, thereby improving the movement stability of the image sensor 4. In addition, the magnetic conductive structure 2123 is grounded to protect the electronic components of the image sensor driving module 2, for example to prevent static electricity from damaging the electronic components.

[0070] In one implementation, the fixed frame 212 may be of a monolithic structure. By using a two-material injection molding process, the top plate 2121, the side frame 2122, and the magnetic conductive structure 2123 are made of a monolithic structure.

[0071] As shown in Fig. 8, a positioning structure 2125 is disposed protruding from the inner surface of the top plate 2121 of the fixed frame 212. The positioning structure 2125 protrudes from the inner surface of the top plate 2121 into the enclosed space 2120. The positioning structure 2125 is cylindrical, and the top plate 2121 is rectangular in structure. The positioning structures 2125 are four in number and distributed at the four corners of the top plate 2121. The positioning structures 2125 are configured to cooperate with the corresponding hole structures of the movable base 23 to realize the assembly and positioning between the fixed base 21 and the movable base 23. Through the cooperation between the positioning structure 2125 and the hole structures of the movable base 23, precise alignment between the movable member 222 and the fixed member 221 of the drive unit 22 can be realized in the assembly process.

[0072] As a power source of the image sensor driving module, the driving unit 22 is configured to generate a driving force, which can drive the movable base 23 to move relative to the fixed base 21. In one implementation, the driving unit 22 is a motor of a magnetic structure, for example a VCM (voice coil motor), and the fixed member 221 and the movable member 222 are a magnetic driving member and a coil driving member, respectively. In the implementation shown in FIG. 7, the fixed member 221 is a magnetic driving member, and the movable member 222 is a coil driving member. In another specific solution, the fixed member 221 is a coil driving member, and the movable member 222 is a magnetic driving member. In another implementation, the driving unit 22 may instead be other types of drivers, for example an SMA (shape memory alloy) motor or a PIEZO (piezoelectric motor) motor. In this embodiment of the application, the movable member 222 and the fixed member 221 of the driving unit 22 may be two components (for example, a coil and a magnet of a motor of a magnetic structure) that are independent of each other. In a power-on state, a driving force is generated to drive and move the image sensor. The movable member 222 and the fixed member 221 of the drive unit 22 in this embodiment of the application may alternatively be of integral structure, such as a shape memory alloy motor, and may be driven by changing the size of the material through electrical heating.

[0073] In one implementation, no electrical connections or electronic components are disposed on the fixed base 21, and all circuit routing, electronic components, and components that need to be powered in the camera module 10 are disposed on the movable base 23. The movable base 23 corresponds to the main board (or circuit board structure) of the camera module 10, and is configured to carry all components that need to be powered or transmit signals. This solution facilitates the design of a compact camera module 10, optimizes the signal transmission path, and improves signal stability. In particular, when the movable base 23 is an integrated circuit board structure, the routing for transmitting signals or currents only needs to be disposed in the integrated circuit board, and there is no need to transmit signals or currents between different circuit boards or FPCs. This signal and current transmission process can ensure signal stability and reduce signal loss. In addition, it is easy to isolate signals to prevent mutual interference of signals from affecting the quality of the image signal.

[0074] Please refer to FIG. 7, FIG. 8, and FIG. 9. In one implementation, the movable base 23 includes a carrying part 231, a fixed part 232, and a connecting part 233. The connecting part 233 is configured to realize mechanical and electrical connection between the carrying part 231 and the fixed part 232. The mechanical connection is a connection relationship in a structural form, and may include a direct connection or an indirect connection. The direct connection may also be of an integrated architecture. For example, two parts of an integrated circuit board structure may be understood as a direct connection. The indirect connection is to make a connection by using another connecting structure, for example, to connect two plate structures by using solder balls. The electrical connection is a connection of signal routing. By using the electrical connection relationship, image signals, electrical signals, or other signals may be transmitted. For example, the electrical connection is made by using the routing of a circuit board, or the electrical connection is made by using an FPC. The fixed part 232 is connected to the fixed base 21. Specifically, the fixed part 232 may be connected between the fixed platform 211 and the fixed frame 212. In another implementation, the fixed portion 232 may instead be connected to the fixed frame 212 , with the fixed portion 232 and the fixed platform 211 separated by at least a portion of the fixed frame 212 .

[0075] The movable base 23 includes a hole structure 235. The hole structure 235 is distributed at the corners of the movable base 23, and is configured to cooperate with the positioning structure 2125 of the fixed base 21 to realize the positioning of the assembly process between the movable base 23 and the fixed base 21, thereby ensuring the positioning accuracy between the fixed member 221 and the movable member 222 of the driving unit 22. The hole structure 235 is distributed between the support part 231 and the connecting part 233, and is located outside the four corners of the support part 231.

[0076] The movable member 222 of the driving unit 22 is disposed on the carrier 231. The carrier 231 is further configured to assemble the image sensor 4. Specifically, after the image sensor driving module 2 is assembled, the image sensor 4 is disposed on the carrier 231 through the opening S11 by using an assembly device such as a surface mount machine. In the assembly process, the image sensor 4 is attached to the carrier 231 and electrically connected. The image sensor 4 can be attached to the carrier 231 by using an adhesive, and then the traces of the image sensor 4 and the traces of the carrier 231 are electrically connected using gold wires. In another implementation, the image sensor 4 may instead be directly connected to the solder pads of the carrier 231 using solder balls, and the image sensor 4 and the traces of the carrier 231 are implemented using the solder balls and the solder pads.

[0077] Specifically, please refer to FIG. 7, FIG. 8, FIG. 9, and FIG. 10A. The fixed part 232 of the movable base 23 is assembled between the edge region 2113 of the fixed platform 211 and the side frame 2122 of the fixed frame 212. The outer edge of the fixed part 232 is connected to the circuit board 9, and the circuit board 9 and the fixed part 232 may be an integral structure, or the circuit board 9 may be connected to the fixed part 232 through a plug-in instead. Specifically, a male connector may be disposed on the fixed part 232, and a female connector may be disposed on the circuit board 9. Electrical signal transmission is performed through cooperation between the male connector and the female connector. The circuit board 9 is configured to electrically connect to the processor of the electronic device and transmit the signal of the image sensor 4 to the processor. The support part 231 and the fixed platform 211 are stacked, and the central region of the support part 231 surrounds the receiving space 2310, and the receiving space 2310 is used to receive the image sensor 4. In another implementation, the accommodating space 2310 may be used to accommodate other optical components 6 (e.g., optical filters or lenses) instead, or may be used as a passage for light to pass through (this means that no optical components are arranged, and the accommodating space 2310 is located on the light incident side of the image sensor 4). As shown in FIG. 7, the electronic device 7 is arranged on the surface of the support 231 far from the fixed platform 211, and the electronic device 7 is distributed on the opposite side of the accommodating space 2310 on the support 231. To ensure the structural symmetry of the movable base 23, the electronic device 7 may be distributed symmetrically on both sides of the accommodating space 2310. This helps to ensure a stable movement process of the movable base 23. In one implementation, the electronic device 7 and the movable member 222 of the driving unit 22 are mounted on the same surface of the support 231, specifically, on the surface of the support 231 facing the top plate 2121 of the fixed frame 212. Thus, the electronic device 7 on the carrier 231 and the movable member 222 are all accommodated in the enclosed space 2120 of the fixed frame 212 (as shown in Figures 8 and 10A).

[0078] As shown in FIG. 9, the movable member 222 is mounted on the second bearing area R2 of the carrier 231 on the side not facing the fixed platform 211, and the movable member 222 faces the top plate 2121. Specifically, in this implementation, the movable member 222 of the driving unit 22 is a coil driving member. The movable member 222 includes four coils arranged in pairs on opposite sides, all of the coils are arranged in one-to-one correspondence with the four magnets attached to the top plate 2121, and these coils are arranged on the carrier 231. Circuit routing is arranged in the carrier 231 so that the power traces of the coils are easily routed. In one implementation, see FIG. 7, FIG. 8, FIG. 9, and FIG. 10A. The support structure 8 is arranged on the carrier 231, and the movable member 222 surrounds the support structure 8. Specifically, a support structure 8 is arranged for each coil, and the support structure 8 is arranged as a rigid structure protruding from the surface of the carrier 231. It can be appreciated that the coil is disposed around a support structure 8 which can protect the coil from being scratched by other structures.

[0079] In this application, the driving unit 22 drives the support 231 to move, and the position of the fixed part 232 remains unchanged. Thus, in the process of moving the support 231, the connection part 233 is elastically deformed, and the connection part 233 is connected between the fixed part 232 and the support 231. In terms of mechanical connection, the connection part 233 corresponds to a spring or spring plate structure, and a circuit board routing for transmitting signals and currents is also disposed on the connection part 233. The electrical connection between the support 231 and the fixed part 232 is implemented through the circuit board routing. In other words, the signal of the image sensor 4 can be transmitted to the outside of the image sensor driving module 2. The connection part 233 is a thin stripe-shaped spring arm structure connected between the fixed part 232 and the support 231. Specifically, a plurality of stripe-shaped spring arms, in other words, the connection part 233, is formed by removing material from the movable base 23. The connecting portion 233 is elastically deformable due to the form of the material. The connecting portion 233 can be elastically deformed when the supporting portion 231 is driven to move relative to the fixed portion 232 by the driving force of the driving unit 22, and the mechanical and electrical connection between the fixed portion 232 and the supporting portion 231 is maintained. In one implementation of this application, the driving unit 22 can drive the image sensor 4 to move in the X-axis direction and the Y-axis direction. Both the X-axis direction and the Y-axis direction are perpendicular to the direction of the optical axis of the image sensor 4, and the optical axis direction is regarded as the Z-axis. The X-axis direction, the Y-axis direction, and the optical axis direction can form a three-axis Cartesian coordinate system. Specifically, the driving unit 22 drives the image sensor 4 to move in the X-axis direction and the Y-axis direction perpendicular to each other on a plane perpendicular to the optical axis. In the process of moving the supporting portion 231, the connecting portion 233 is elastically deformed to ensure that the supporting portion 231 can move relative to the fixed portion 232.

[0080] In one implementation, the movable base 23 may have an elastic circuit board structure, in which the carrying part 231 and the fixed part 232 are not elastic, and the connecting part 233 is elastic. FIG. 10A is a partial enlarged schematic view of FIG. 9. The connecting part 233 includes a conductor layer 2333 and a metal layer 2334. The conductor layer 2333 is configured to set the circuit board routing and implement the electrical connection between the carrying part 231 and the fixed part 232. The metal layer 2334 may have a metal bending structure. The metal layer 2334 is configured to provide elastic deformation of the connecting part 233. The presence of the metal layer 2334 ensures the flexibility and strength of the connecting part 233, thereby improving the elastic deformation ability of the connecting part 233. The conductor layer 2333 and the metal layer 2334 may be insulated by using an insulating layer (the insulating layer is omitted in FIG. 10A), and the insulating layer may specifically be a polyamide insulating material.

[0081] Please refer to Figures 7, 8, 9, and 10A. The movable base 23 includes an integrated circuit substrate structure 23A and a reinforcing plate structure 23B. The integrated circuit substrate structure 23A includes a fixing portion 232, a connecting portion 233, and a part of a support portion (referred to as a first plate 231A). The integrated circuit substrate structure 23A is a structure integrally formed using a circuit board manufacturing process, and a conductor layer 2333 and a metal layer 2334 are disposed within the structure. The metal layer 2334 is configured to ensure the strength and elastic deformation ability of the connecting portion 233. The reinforcing plate structure 23B is a part of the support portion (referred to as a second plate), and the reinforcing plate structure 23B is connected to the bottom surface of the part of the support portion (referred to as a first plate 231A) of the integrated circuit substrate structure 23A.

[0082] The stiffening plate structure 23B is configured to contact the fixed platform 211 and form a frictional interface X to conduct and dissipate heat. Generally, in this implementation, the support portion 231 includes a first plate 231A and a second plate (reinforcement plate structure 23B), and the outer edge of the first plate 231A and the connecting portion 233 are connected together to form an integral structure, and an accommodating space 2310 is formed by surrounding the inner edge of the first plate 231A, the first plate 231A is configured to support the movable member 222, the second plate (reinforcement plate structure 23B) includes a first portion 23B1 and a second portion 23B2, the first portion 23B1 and the first plate 231A are stacked, the second portion 23B2 is located at the bottom of the accommodating space 2310, the second portion 23B2 is configured to support the image sensor 4, allowing the image sensor 4 to be accommodated in the accommodating space 2310, and the second plate (reinforcement plate structure 23B) contacts the fixed platform 211 of the fixed base 21. The first portion 23B1 of the second plate (reinforcement plate structure 23B) is connected to the first plate 231A using an adhesive layer, the first portion 23B1 and the first plate 231A are stacked, the second portion 23B2 is located in the receiving space, and the second portion 23B2 is connected to the image sensor 4 using an adhesive layer. As shown in FIG. 9, the image sensor 4 is electrically connected to the first plate 231A through a signal wire 41 (e.g., a gold wire). An adhesive structure 61 is disposed at the position of the signal wire 41, and the adhesive structure 61 is configured to attach an optical component 6, such as an IR optical filter. On the one hand, the adhesive structure 61 can be fixedly connected to the optical component 6, and on the other hand, the adhesive structure 61 can also attach the signal wire 41 to ensure a stable and reliable electrical connection between the image sensor 4 and the conductor layer 2333 of the carrier 231. In this solution, the signal of the image sensor is transmitted by using the first plate, the connection part, and the fixing part.

[0083] In the optical axis direction, the part of the second plate (reinforcement plate structure 23B) directly facing the opening S11 and the part of the first plate 231A directly facing the opening S11 together form a first carrying area R1 of the carrier 231 (the part marked R1 between the two dashed lines in FIG. 9 represents the first carrying area R1 of the carrier 231). The part of the first plate 231A directly facing the top plate 2121 is the second carrying area R2 of the carrier 231 (the part marked R2 between the two dashed lines in FIG. 9 represents the second carrying area R2 of the carrier 231). The opening S11 of the image sensor driving module 2 provided in this solution directly faces the first carrying area R1. In the process of assembling the image sensor 4, the image sensor 4 is directly attached using the suction force of the suction cup, and the suction cup is moved in the optical axis direction. The image sensor 4 is disposed in the first carrying area R1, and the image sensor 4 is fixedly connected to the carrying part 231. In another implementation, the opening S11 and the first carrying area R1 may be disposed offset instead. It may be understood that some areas of the first carrying area R1 directly face the opening S11, and some areas of the first carrying area R1 do not directly face the opening S11. In this implementation, in the process of assembling the image sensor, the image sensor may be attached by using a suction cup, in which the image sensor is disposed in an area corresponding to the opening S11 in the optical axis direction, and the suction cup is moved in a direction perpendicular to the optical axis direction to transport the image sensor to the first carrying area.

[0084] Fig. 10B is a partially enlarged cross-sectional view of an image sensor driving module according to one possible implementation of this application. Please refer to Fig. 10B. There is a gap G between the movable base 23 and the inner surface S0 of the fixed platform 211. It can be understood that the movable base 23 and the inner surface S0 of the fixed platform 211 are separated in a floating manner.

[0085] Please refer to FIG. 9 and FIG. 10A. The support 231 contacts with the fixed platform 211 of the fixed base 21, and a friction interface X is formed at the contact position between the support 231 and the fixed platform 211 of the fixed base 21. The friction coefficient of the friction interface X is less than 0.3. The friction interface X can be the contact surface between the support 231 and the fixed base 21 (in other words, the friction interface is in the form of one surface). The friction interface X can alternatively be a medium, such as a lubricant, between the support 231 and the fixed base 21 (i.e., the friction interface is in the form of grease or paste). The friction interface X can alternatively be a layer structure between the support 231 and the fixed base 21. For example, a super slip material layer is disposed between the support 231 and the fixed base 21 to form the friction interface X (in other words, the friction interface is formed by a three-dimensional layer structure). Generally, the support 231 and the fixed platform 211 are in a sliding friction relationship, and a low friction coefficient can be obtained at the friction interface X through surface treatment or by disposing a solid structure layer or a grease-like or paste-like lubricating layer. In one possible implementation, the lubricating layer may include a rolling structure. In this application, the friction coefficient of the sliding friction between the support 231 and the fixed platform 211 is limited, and therefore, the smooth movement of the image sensor 4 can be ensured based on limiting the plane on which the image sensor 4 moves. This reduces the friction resistance in the movement process of the image sensor 4 and improves the efficiency of driving and moving the image sensor.

[0086] In one implementation, at the position of the friction interface X, the support 231 and / or the fixed platform 211 of the fixed base 21 includes a super slip material layer, the super slip material layer is a solid structure, and the friction coefficient of the friction interface X is realized by using the super slip material layer. In the first case, see FIG. 11A. The super slip material layer M1 is disposed only on the surface of the support 231, and the super slip material layer M1 on the surface of the support 231 contacts the surface of the fixed platform 211 of the fixed base 21. The friction interface X is formed, and the friction coefficient of the friction interface X is less than 0.3. In this solution, there is no need to dispose the super slip material layer on the fixed base 21. This helps to save the super slip material and reduce the cost. In the second case, see FIG. 11B. The super slip material layer M2 is disposed only on the surface of the fixed platform 211 of the fixed base 21. The area of ​​the super slip material layer M2 disposed on the fixed platform 211 of the fixed base 21 needs to be larger than the area of ​​the part of the support 231 that contacts the fixed platform 211. Because the support 231 needs to slide on the super slip material layer M2, the area covered by the moving process of the support needs to be considered for the super slip material layer M2 disposed in this solution. The fixed platform 211 of the fixed base 21 is a simple flat plate structure, and no circuit architecture is disposed on the fixed platform 211 of the fixed base 21, so disposing the super slip material layer M2 on the fixed platform 211 has the advantage of easy manufacturing. In the third case, see FIG. 11C. The super slip material layer is disposed on the surface of the support 231 and the fixed platform 211 of the fixed base 21. Specifically, the super slip material layer M1 is disposed on the surface of the support 231, and the super slip material layer M2 is disposed on the surface of the fixed platform 211. The superslip material layer M1 is in contact with the superslip material layer M2, and the area of ​​the superslip material layer M2 is greater than the area of ​​the superslip material layer M1.This solution combines the first case with the second case. A friction interface X is formed between the super slip material layer M1 and the super slip material layer M2, and the friction coefficient of the friction interface X provided by this solution can be smaller. The combination of the solid structure super slip material layer with the support 231 and the fixed platform 211 is easier to implement, for example, can be directly connected and attached by using an adhesive layer, and has the advantage of a simple and easy assembly process.

[0087] In the implementations shown in Figures 11A, 11B and 11C, the superslip material layer M1 and the superslip material layer M2 can be coatings or coating structures disposed on the surfaces of the support 231 and the fixed platform 211, specifically formed by using a physical spray coating or electroplating process. The superslip material layer M1 and the superslip material layer M2 can alternatively be separate sheet-like structures. For example, the superslip material layer M1 and the superslip material layer M2 are micro-nanostructures (nanomaterials) and are connected to the surfaces of the support 231 and the fixed platform 211 by using manufacturing processes such as adhesion and physical pressing.

[0088] In one implementation, see FIG. 12. At the position of the friction interface X, a lubricating layer M3 is disposed between the support 231 and the fixed platform 211 of the fixed base 21, the lubricating layer M3 being of oil-like, grease-like or paste-like structure, and the friction coefficient of the friction interface X being less than 0.3 is realized by using the lubricating layer M3. In this solution, the lubricating layer M3 of oil-like, grease-like or paste-like structure is disposed between the support 231 and the fixed platform 211 of the fixed base 21 to implement the friction interface X with a low friction coefficient. Since the shape of the lubricating layer M3 is not constant, the lubricating layer M3 is applied to the contact surface between the support 231 and the fixed platform 211 of the fixed base 21, and the lubricating layer M3 can have a small size. This facilitates the miniaturization of the camera module in the optical axis direction. The design of the lubricating layer M3 further helps ensure the flatness of the contact surface, and it can be understood that the use of the lubricating layer M3 can compensate for the flatness problem to avoid vibration or tilt in the optical axis direction during the movement process of the image sensor 4.

[0089] In one implementation, see FIG. 13. There is no super slip material layer or lubricant between the support 231 and the fixed platform 211 of the fixed base 21. In this implementation, the friction coefficient of the friction interface X is less than 0.3 by carrying out a surface treatment manufacturing process on the surface that contacts the support 231 and the fixed platform 211 of the fixed base 21. The surface treatment method can be a surface modification technique such as polishing, a surface alloying technique such as carburizing and nitriding, a surface conversion film (additive material and base material chemically react to form a conversion film by using a chemical method), and the like. The surface treatment method can form the friction interface X without adding a super slip material layer or a lubricant layer, and obtain a small size in the optical axis direction.

[0090] In another implementation, a solid super slip material layer and a grease-like or pasty lubricant can be used in combination in the same implementation. Alternatively, a solid super slip material layer and a surface obtained by using a surface treatment manufacturing process are used in the same implementation. Alternatively, a grease-like or pasty lubricant and a surface obtained by using a surface treatment manufacturing process are used in the same implementation.

[0091] In this application, the friction coefficient of the friction interface X of the contact surface between the support 231 and the fixed base 21 is set to implement a sliding connection with a low friction coefficient between the support 231 and the fixed base 21. In the process of driving and moving the support 231 of the movable base 23, the image sensor 4 can be flexibly driven through the friction interface X with a low friction coefficient, such as a super-slip material or a lubricating layer, and the stability of the axial position of the image sensor 4 in the moving process is ensured, and no axial displacement, vibration, tilt, or similar phenomena occur. The contact between the support 231 and the fixed base 21 further facilitates heat conduction. The circuit, coil driving member, and image sensor of the support 231 all generate heat in the operation process. In this implementation of this application, heat conduction can be performed through the contact between the support 231 and the fixed base 21. The friction interface X includes a material with heat conductive properties. The support 231 can be a heat conductive material, and the fixed platform 211 of the fixed base 21 can also be a heat conductive material. The thermal conductivity of the friction interface X is higher than 0.5 W / m K. In this solution, limiting the thermal conductivity of the friction interface helps ensure the performance of the image sensor and improve the quality of the image signal.

[0092] In the camera module, when the moving station of the image sensor is made to float with respect to the bottom plate of the module, the space between the moving station and the bottom plate not only increases the size of the camera module in the direction of the optical axis, but also easily causes the tilt of the moving station and vibration in the optical axis direction, resulting in a deterioration of the imaging quality. In addition, the air thermal resistance is high, and the heat of the image sensor and the driving circuit is difficult to dissipate, so that the junction temperature of the image sensor becomes excessively high (e.g., about 70 degrees, even reaching 90 degrees), resulting in excessive imaging noise of the image sensor and affecting the imaging quality. In one implementation of this application, the moving stability of the image sensor 4 can be ensured through the contact between the support 231 and the fixed platform 211. The moving route of the image sensor 4 is limited to a fixed (stable) plane (e.g., a plane perpendicular to the optical axis). This avoids the axial vibration or tilt generated by the image sensor 4 during the moving process, and ensures the quality and stability of the image data acquired by the image sensor 4. In addition, the thermal resistance can be further reduced in this application, and by using the contact relationship between the support and the fixed part, the heat of the support can be better conducted to one side of the outer surface of the fixed base 21, thereby improving the thermal conduction ability of the image sensor driving module 2. The heat dissipation efficiency of the image sensor 4 and the driving unit 22 can be optimized, and the deterioration of the imaging quality caused by the excessively high temperature of the camera module 10 in the video shooting process or long-term shooting process is avoided. In a specific implementation provided in this application, the operating junction temperature of the image sensor 4 can be controlled to be lower than 70 degrees. For example, the operating junction temperature of the image sensor can be lower than 50 degrees.

[0093] FIG. 14 shows a specific structure of the contact surface between the support 231 and the fixed platform 211. In this implementation, the contact manner between the support 231 and the fixed platform 211 of the fixed base 21 is a planar contact. This solution facilitates heat transfer. The large contact area between the support 231 and the fixed base 21 exhibits high heat transfer efficiency. This solution can improve the heat dissipation ability through complete planar contact. The plane on the support 231 used to contact the fixed base 21 is a first plane S5, and the plane on the fixed platform 211 of the fixed base 21 used to contact the support 231 is a second plane S6, and both the first plane S5 and the second plane S6 are continuous complete planar structures.

[0094] FIG. 15 shows a specific structure of the contact surface between the support 231 and the fixed platform 211. The contact manner between the support 231 and the fixed platform 211 of the fixed base 21 is the contact between a plane and an array of bumps, and at the position where the support 231 contacts the fixed platform 211, one of the structures of the support 231 and the fixed platform 211 is a completely plane structure, and the other structure of the support 231 and the fixed platform 211 is an array of bump structures. As shown in FIG. 15, the support 231 includes an array of bump structures S51, and the structure where the fixed platform 211 contacts the support 231 is the second plane S6, and the array of bump structures S51 are arranged corresponding to the entire area of ​​the second plane S6. In this solution, the problem of misalignment in the optical axis direction caused by the flatness of the contact between the planes can be solved by the contact between the array of bump structures S51 and the second plane S6. Arranging the bump structure S51 in an array is easy to control the flatness of the plane, including the position where the bumps contact. In the process of relative movement, it can be more stable and the friction coefficient can be stable. In the implementation shown in FIG. 15, the bump structure S51 in an array may be arranged on the fixed platform 211 instead. Correspondingly, the second plane S6 is arranged on the support 231.

[0095] FIG. 16 shows a specific structure of the contact surface between the support 231 and the fixed platform 211. The contact manner between the support 231 and the fixed platform 211 of the fixed base 21 is contact between a plane and a plurality of array-shaped bumps, and at the position where the support 231 contacts the fixed platform 211, one of the structures of the support 231 and the fixed platform 211 is a completely plane structure, and the other structure of the support 231 and the fixed platform 211 is a multi-bump structure. As shown in FIG. 16, a multi-bump structure S52 is disposed on the support 231, and the structure where the fixed platform 211 contacts the support 231 is the second plane S6, and the multi-bump structure S52 is disposed corresponding to a partial area of ​​the second plane S6. In this implementation, the second plane S6 has a rectangular shape, and the multi-bump structure S52 is disposed at positions corresponding to the four corners of the second plane S6. In another implementation, the multi-bump structure S52 may be instead disposed at another position corresponding to the second plane S6, for example, at the midpoint position of the side corresponding to the second plane S6. Alternatively, the multi-bump structure S52 is distributed corresponding to each side. In the implementation shown in FIG. 16, the multi-bump structure S52 may instead be disposed on the fixed platform 211. Correspondingly, the second plane S6 is disposed on the support part 231. In this solution, the bump structure S52 distributed at a local position cooperates with the plane to help adjust the flatness of the position of the friction interface. The position of the contact surface between the fixed platform 211 and the support part 231 does not require high manufacturing accuracy of flatness to meet the moving stability of the image sensor 4.

[0096] Please refer to Figures 17, 18 and 19. These three figures show three specific different structural forms of the contact surface between the support 231 and the fixed platform 211. In one implementation, the contact manner between the support 231 and the fixed platform 211 of the fixed base 21 is contact between a flat surface and a protruding rod structure, or contact between protruding rod structures. By arranging the rod structure, the contact area can be increased compared with the bump structure. This helps to reduce the pressure and avoids the friction damage of the contact surface in the process of relative movement from affecting the positioning accuracy in the optical axis direction. Compared with the full-surface contact structure, the rod structure can eliminate the problem of movement in the optical axis direction caused by flatness.

[0097] As shown in Fig. 17, at the contact position between the support 231 and the fixed platform 211 of the fixed base 21, the structure of the support 231 is a protruding rod structure S53, and the structure of the fixed platform 211 is a complete planar structure S6. The protruding rod structure S53 slides on the planar structure S6 to realize a friction interface. In this implementation, the protruding rod structures S53 are distributed in a ring shape. As shown in Fig. 18, the structure of the support 231 is also a protruding rod structure S53. The difference from the implementation shown in Fig. 17 is that the protruding rod structures S53 in the implementation shown in Fig. 18 are distributed in a mesh shape.

[0098] 19, at the contact position between the support 231 and the fixed platform 211 of the fixed base 21, the structure of the fixed platform 211 is a protruding rod structure S54. In this solution, the structure of the support 231 may be a planar structure S7. The structure of the support 231 may alternatively be a rod-like structure. In another implementation, a protruding rod structure may alternatively be arranged on the support 231, and the fixed platform 211 may be arranged as a planar structure.

[0099] 14-19 are schematic illustrations of several different configurations of friction interfaces, and are not intended to limit the configurations of friction interfaces in this application, in which different configurations of friction interfaces may be designed based on specific design requirements.

[0100] Please refer to FIG. 10A. In this application, the support 231 is in sliding contact with the fixed platform 211 which provides a moving platform for the support 231, and the support 231 does not separate from the fixed platform 211 during the moving process. Therefore, the support 231 needs to have a holding force to maintain the contact between the support 231 and the fixed platform 211. Specifically, a holding structure is disposed in the image sensor driving module 2. A part of the holding structure is located in the support 231 (this can be understood as the part of the holding structure being a part of the support), and a part of the holding structure is located in the fixed base 21 (this can be understood as the part of the holding structure being a part of the fixed base). The holding structure provides a holding force for the support 231 to maintain the contact between the support 231 and the fixed platform 211 of the fixed base 21. The arrangement of the holding structure can be implemented in a number of different implementations. Details are as follows.

[0101] In one implementation, as shown in FIG. 10A, the holding structure 26 includes a connecting part 233 and a fixed part 232. The connecting part 233 is connected to the carrying part 231, and the fixed part 232 is located on the fixed base 21, in other words, the fixed part 232 is fixedly connected to the fixed base 21. A part of the structure of the fixed base 21 to which the fixed part 232 is fixedly connected can be used as a part of the holding structure. In this solution, the connecting part 233 of the movable base 23 is used as a part of the holding structure, and the connecting part 233 is an elastic structure, and the elastic force of the connecting part 233 acts on the carrying part 231 to form a holding force. In this implementation, the elastic force of the connecting part 233 is used as a holding force to ensure the contact between the carrying part 231 and the fixed base 21, and another holding structure other than the fixed base and the movable base is added if it may be required. The connecting part 233 can not only ensure that the carrying part 231 moves under the driving force of the driving unit 22, but also provide a holding force. The dual function design of the connection part 233 facilitates miniaturization of the size of the image sensor driving module 2 .

[0102] Please refer to FIG. 10A. The connection point between the connection part 233 and the fixing part 232 is a first position 2331, and the connection point between the connection part 233 and the support part 231 is a second position 2332, and there is an elastic potential energy between the first position 2331 and the second position 2332, which forms a holding force. This solution provides an embodiment of how to form the elastic force of the connection part 233. Forming the elastic potential energy between the first position 2331 and the second position 2332 uses the assembly position of the connection part 233. This helps to ensure the miniaturization of the size of the image sensor driving module 2.

[0103] Specifically, in a direction perpendicular to the fixed platform 211, i.e., in the direction of the optical axis, the distance D1 between the first position 2331 in the optical axis direction and the fixed platform 211 is smaller than the distance D2 between the second position 2332 in the optical axis direction and the fixed platform 211. It can be understood that the first position 2331 and the second position 2332 form a stepped architecture in the assembly process, and the assembled connection part 233 has a force pulling the support part 231 in a direction toward the fixed platform 211. In other words, the elastic tension of the connection part 233 acts on the second position 2332 to form a holding force toward the fixed platform 211. In this solution, the distance relationship between the first position 2331 and the second position 2332 and the fixed platform 211 is determined in the process of assembling the movable base 23. If it is guaranteed that D1 is smaller than D2, this means that it can provide a force pulling the second position 2332 toward the fixed platform 211, which forms a holding force. In this solution, forming the holding force is implemented in the assembly process. For the connection part 233 of the movable base 23, the structure of the connection part 233 does not need to be specially designed in the manufacturing process of the connection part 233 to take into account forming the holding force. This can reduce the manufacturing cost.

[0104] In another implementation, the connection portion 233 is used as a retaining structure, and the fixed portion 232 and the support portion 231 can be designed not to be on the same plane in the manufacturing process of the movable base 23. Specifically, when the connection portion 233 is in a free state (without any restricting force), the first position 2331 at the connection point between the connection portion 233 and the fixed portion 232 and the second position 2332 at the connection point between the connection portion 233 and the support portion 231 correspond to different positions of the optical axis. Before assembly, there is a height difference between the first position 2331 and the second position 2332 in the optical axis direction. In the assembly process, the first position 2331 and the second position 2332 can be assembled to be on the same plane. Alternatively, in the assembly process, the specific physical position of the first position 2331 or the second position 2332 may be adjusted to store energy, specifically, to store elastic potential energy in the connection portion 233. And the force of the elastic potential energy acting on the support 231 is a holding force towards the fixed platform 211. This solution helps to realize a miniaturized size of the assembled image sensor driving module.

[0105] In one implementation, see FIG. 20 and FIG. 21. The holding structure 26 includes a magnetic member 24 and a fixed platform 211. The magnetic member 24 is attached to the support 231, and the magnetic attraction between the magnetic member 24 and the fixed platform 211 forms at least a part of the holding force. In this solution, the magnetic member is placed on the support 231, and the fixed platform 211 is designed to cooperate with the magnetic member to form the magnetic attraction. By using the magnetic attraction as the holding force, the life and stability of the holding force can be ensured. If the elastic force of the connection part 233 is used as the holding force, the elastic coefficient of the elastic force may change during long-term use, and the elastic performance of the connection part 233 may be deteriorated. In this case, the holding force between the support 231 and the fixed platform 211 may be affected. If the holding force is insufficient to support the support 231 to contact the fixed platform 211 through the friction interface, the movement stability of the image sensor 4 will be affected, and the thermal conductivity of the image sensor driving module 2 will also be affected. In this solution, a magnetic member 24 is arranged and the magnetic attraction force is used as the holding force, thus ensuring the continuous stability of the holding force and extending the service life of the image sensor driving module 2.

[0106] In one implementation, the holding force includes a resilient force provided by the connection portion 233 and may further include a magnetic force provided by the magnetic member 24 .

[0107] In a specific implementation, as shown in FIG. 20, the magnetic member 24 includes four magnets 241, 242, 243, and 244. The four magnets 241, 242, 243, and 244 are arranged on the support 231 in a dot-like distribution state and are adjacent to the outer edge of the support 231. The outer edge of the support 231 is the edge position of the support 231 on the fixed part 232 side. In this implementation, the four magnets 241, 242, 243, and 244 are distributed at the four corners of the support 231. In another implementation, the magnetic member 24 may include two or three magnets, or the number of magnets may be five or more, and the multiple magnets are distributed at the edge positions of the support 231 at equal intervals. Specifically, when there are three magnets, the three magnets may form a plane. This can ensure the surface contact of the contact surface between the support and the fixed base. When there are four magnets, they may be symmetrically distributed at the four outer corner positions of the image sensor, which helps ensure the movement stability of the image sensor.

[0108] In a specific implementation, as shown in FIG. 21, the magnetic member 24 includes four magnetic stripes 245, 246, 247, and 248. The four magnetic stripes 245, 246, 247, and 248 are all in the shape of a long stripe, symmetrically distributed on the support 231 in pairs, and adjacent to the outer edge of the support 231. The outer edge of the support 231 is the edge position of the support 231 on the fixed part 232 side. In this implementation, the magnetic stripes 245, 246, 247, and 248 are located inside the coil, which is the movable member 222 of the driving unit. In another implementation, the magnetic stripes 245, 246, 247, and 248 may be arranged around the movable member 222 instead. In another implementation, the number of magnetic stripes may be two, three, or more. Arranging the magnetic stripes in a long stripe shape not only provides a large magnetic attraction force, but also facilitates assembly and installation.

[0109] In this embodiment of the application, the magnetic attraction force between the magnetic member 24 arranged on the carrier 231 and the fixed base 21 needs to ensure that the carrier 231 can maintain contact with the fixed base 21 during the moving process, and the magnetic attraction force needs to be controlled within a preset range, in other words, the magnetic attraction force cannot be excessively large. If the magnetic attraction force is excessively large, the driving unit 22 may not be able to drive the carrier 231 to move, or the efficiency of moving the carrier 231 may be affected.

[0110] In a specific implementation, please refer to FIG. 22. The holding structure 26 includes a moving member 222 and a fixed platform 211. Specifically, the moving member 222 is a magnetic driving member, and the fixed member 221 is a coil driving member. In this implementation, the fixed member 221 is attached to the fixed base 21, and a circuit board routing needs to be arranged on the fixed base 21 to supply power to the coil driving member. Generally, in this solution, the magnetic driving member 222 is used as a magnetic member (similar to the magnet and magnetic stripe architecture described above), and the magnetic attraction between the magnetic driving member 222 and the fixed platform 211 forms at least a part of the holding force. In this solution, the magnetic driving member (movable member 222) is used to form the holding structure. This facilitates the design of the image sensor driving module 2 to be miniaturized in size.

[0111] Please refer to Figures 23A and 23B. In one implementation, the magnetic member is disposed on the fixed platform 211 of the fixed base 21, and the magnetically attractive member, for example a steel plate, is disposed on the support part 231 of the movable base 23. The magnetic attraction between the magnetic member and the magnetically attractive member forms the holding force. Specifically, in this implementation, the holding structure 26 includes the magnetic member 24 and the magnetically attractive member 238. The magnetically attractive member 238 has a magnetic conductive material and is a part of the support part 231. The magnetic member 24 is attached to the fixed base 21 and is disposed at the position of the contact surface between the fixed base 21 and the support part 231. The magnetic attraction between the magnetic member 24 and the magnetically attractive member 238 forms the holding force. In the implementation shown in Figure 23A, the magnetic member 24 is disposed on the surface of the fixed platform 211 of the fixed base 21 that is farther from the support part 231. In the implementation shown in Figure 23B, the magnetic member 24 is embedded inside the fixed platform 211 of the fixed base 21. The support part 231 includes a circuit board structure and a magnetic attraction member 238, and the magnetic attraction member is attached to the bottom surface of the circuit board structure to reinforce the strength of the circuit board. The magnetic attraction member 238 is located on the surface of the support part 231 facing the fixed platform 211. The magnetic attraction member 238 contacts the fixed platform 211 to form a friction interface X. The magnetic attraction member 238 is further configured to carry the image sensor 4. In this implementation, the magnetic attraction member 238 may have the same structure as the reinforcing plate structure 23B in the implementation shown in FIG. 7. However, in this implementation, the magnetic attraction member 238 can not only provide the structural reinforcement function of the support part 231, but also can carry the image sensor 4. In addition, the magnetic attraction member 238 needs to have a magnetic conductive material. The magnetic attraction member 238 needs to cooperate with the magnetic member 24 to generate a magnetic attraction force. However, in the implementation shown in FIG. 7, the reinforcing plate structure 23B does not need to create a magnetic attraction force, but only needs to provide a reinforcing force to the circuit board structure 23A and carry the image sensor 4.

[0112] In the implementation shown in FIG. 23A and FIG. 23B, the magnetic member 24 and the magnetically attractive member 238 form a part of the holding structure 26, and the other part of the holding structure 26 includes the connecting part 233 and the fixed part 232. Specifically, in this implementation, the holding structure 26 ensures the contact reliability between the holding part 231 and the fixed platform 211 by the magnetic force and the elastic force acting together between the holding part 231 and the fixed platform 211. In this solution, the magnetic member 24 is disposed on the fixed platform 211, and the magnetically attractive member, for example a steel plate, is disposed on the holding part 231 correspondingly. This design can reduce the influence of the magnetic member on the driving unit 22 and the image sensor 4, and ensure the moving stability of the image sensor 4 and the quality of the generated image signal. In this solution, the magnetic member 24 is disposed on the surface of the fixed base 21 farther from the holding part 231, so that the distance between the magnetic member 24 and the image sensor 4 and the driving unit 22 can be maximized. This can reduce the influence of the magnetic member 24 on the driving unit 22 and the image sensor 4, and ensure the movement stability of the image sensor 4 and the quality of the generated image signal. The magnetic member 24 is embedded inside the fixed platform 211 so that the magnetic member 24 and the fixed platform 211 are integrated together. This does not affect the overall structure of the image sensor driving module 2, and facilitates assembly and positioning between the image sensor driving module 2 and another structure of the electronic device.

[0113] In a specific implementation, please refer to FIG. 24. The image sensor driving module includes an elastic member 25. One end of the elastic member 25 is connected to the top plate 2121 of the fixed frame 212 of the fixed base 21, and the other end is connected to the support part 231. It can be understood that one end of the elastic member is located in the support part, specifically, one end of the elastic member is a part of the structure of the support part, and the other end of the elastic member is located in the fixed base, specifically, the other end of the elastic member is a part of the structure of the fixed base. In the assembled state, the elastic member 25 is in an elastically compressed state, and the elastic member 25 applies an elastic force to the support part 231. The elastic force is toward the contact surface between the support part 231 and the fixed base 21, and the elastic force is a holding force to ensure that the support part 231 contacts the fixed platform 211. The elastic member 25 can maintain a contact state at the friction interface X. 23A and 23B, the elastic member 25, the connecting portion 233, and the fixing portion 232 together form the holding structure 26. In other words, the holding force provided by the connecting portion 233 and the holding force of the elastic member 25 are utilized, so that the contact between the support portion 231 and the fixing platform 211 can be more stable.

[0114] In this application, the support 231 contacts the fixed platform 211 of the fixed base 21, and the support 231 further has a holding force for maintaining a contact state between the support 231 and the fixed base 21. The direction of the holding force is toward the contact surface between the support 231 and the fixed base 21, so that the holding force can abut the support 231 against the fixed base 21 regardless of the position or environment of the image sensor driving module 2. Regardless of how the camera module 10 is placed, the holding force needs to be greater than the sum of the gravity of the support 231 and all the structures supported on the support 231 so that the support 231 can move on a fixed plane during the movement process of the image sensor 4. The movement stability of the image sensor 4 can be realized, and the image sensor 4 can be prevented from tilting or generating axial movement. The axial movement is in the direction of the optical axis. It can be understood that the plane on which the contact surface between the support 231 and the fixed base 21 is located is a plane perpendicular to the optical axis. The image sensor driving module 2 provided in this application can drive the image sensor 4 to move on a plane perpendicular to the optical axis.

[0115] Please refer to FIG. 25A. In one implementation, the movable base 23 has an integrated circuit board structure. Specifically, the carrying portion 231, the connecting portion 233, and the fixing portion 232 are integrally formed, and the periphery of the fixing portion 232 is configured to connect a circuit board (e.g., FPC) 9. The circuit board 9 is configured to electrically connect the image sensor 4 to a processor of an electronic device. In this implementation, the circuit board 9 and the fixing portion 232 have an integrated circuit board structure. The circuit board is formed by using an integral molding process. The manufacturing process is simple, the assembly is convenient, and the structural stability is good. The trace layer of the movable base 23 is routed only within the same circuit board. This can ensure the stability of signal transmission and reduce signal loss. The carrying portion 231 includes a first region 231C configured to carry the movable member 222 and other electronic devices, and a second region 231D configured to carry the image sensor 4. The size of the movable base 23 in the direction of the optical axis P of the image sensor 4 is the thickness of the movable base 23, and the thickness T1 of the first region 231C, the thickness T2 of the connecting portion 233, and the thickness T3 of the fixed portion 232 are equal. The movable base including the integrated circuit structure can save the space of the image sensor driving module in the thickness direction. This facilitates the design of a miniaturized size of the image sensor driving module in the optical axis direction of the image sensor.

[0116] The first region 231C is connected between the second region 231D and the connecting portion 233, and the thickness T4 of the second region 231D is smaller than the thickness T1 of the first region 231C. The first region 231C is disposed around the edge of the second region 231D and surrounded together with the second region 231D to form an accommodation space (the accommodation space in FIG. 25A is occupied by the image sensor 4, so the accommodation space is not marked). The accommodation space is used to accommodate the image sensor 4, and the image sensor 4 can be connected to the bottom surface and the second region 231D by using an adhesive layer. A gap can be provided between the side of the image sensor 4 and the inner wall of the accommodation space. This helps to mount the image sensor. In this solution, the support 231 is provided with a groove, and the groove is configured to accommodate the image sensor, so that the space in the optical axis direction is saved and a design with a small size in the optical axis direction is easily realized. The contact surface between the first region 231C and the fixed platform 211 of the fixed base 21 is flush with the contact surface between the second region 231D and the fixed platform 211. In this implementation, the second region 231D of the support 231 can be a completely flat plate structure, in other words, the second region 231D does not have any through-hole or window structure. In another implementation, the second region 231D can be a frame-like structure instead. Specifically, the second region 231D supports only an edge portion of the image sensor 4, and a portion of the image sensor 4 is separated from the fixed platform 211 via a gap. The gap may be air or may be filled with a heat-conducting medium.

[0117] FIG. 25B is the same as the implementation shown in FIG. 25A, and the detailed structure of the first carrying region R1 is shown in FIG. 25B. The first carrying region R1 includes a first central region R11 and a second central region R12, which are directly opposite the opening S11 in the extending direction of the optical axis. The second central region R12 is located around the first central region R11 and is connected between the first central region R11 and the second carrying region R2. The first central region R11 is configured to mount the image sensor 4, and the second central region R12 is configured to mount the optical component 6. In this implementation, the movable base 23 is an integrated circuit board structure. The size of the movable base 23 in the optical axis direction of the image sensor 4 is the thickness of the movable base, and the thickness T1 of the second carrying region R2, the thickness T2 of the connection part 233, and the thickness T3 of the fixed part 232 are equal.

[0118] At least a part of the first carrying region R1 has a concave structure, and the thickness of the at least a part of the first carrying region R1 is smaller than the thickness of the second carrying region R2, so as to form a receiving space used to receive the image sensor 4. In the implementation shown in FIG. 25A and FIG. 25B, the thickness of the first central region R11 of the first carrying region R1 is smaller than the thickness of the second central region R12, and the thickness of the second central region R12 is equal to the thickness of the second carrying region R2. The second central region R12 and the first central region R11 are surrounded together to form a receiving space used to receive the image sensor 4. In another implementation, the thickness of the first central region R11 may be equal to the thickness of the second central region R12, in other words, the first carrying region R1 has a structure of uniform thickness. The thickness of the first carrying region R1 is smaller than the thickness of the second carrying region R2. Thus, an accommodation space used to accommodate the image sensor is formed between the second carrying area R2 and the first carrying area R1.

[0119] Please refer to FIG. 26. In the implementation shown in FIG. 26, the friction interface X between the support 231 and the fixed platform 211 is a three-dimensional layer structure. For a specific design of the friction interface X, please refer to the implementations shown in FIG. 11A, FIG. 11B, and FIG. 11C. In the extension direction of the optical axis P of the image sensor 4, a height difference is formed between the fixed part 232 and the support 231. Specifically, the vertical distance H1 between the fixed platform 211 and the surface of the fixed part 232 on the side farther from the fixed platform 211 is smaller than the vertical distance H2 between the fixed platform 211 and the surface of the support 231 on the side farther from the fixed platform 211. In this implementation, the fixed part 232 and the fixed platform 211 are connected by using an adhesive layer.

[0120] In the implementation shown in Figures 25A and 26, the drive unit 22 is located on the side of the support 231 away from the fixed platform 211, in other words, the drive unit 22 is located between the top plate 2121 of the fixed frame 212 and the support 231.

[0121] Please refer to Fig. 27. In one implementation, the fixed platform 211 of the fixed base 21 is flat, and the fixed frame 212 is connected to an edge region of the fixed platform 211, and the fixed frame 212 is configured to connect to the fixed part 232 of the movable base 23. Specifically, the fixed frame 212 includes a first part 212A and a second part 212B. The first part 212A is located between the fixed part 232 and the fixed platform 211, and supports the fixed part 232 above the fixed platform 211. The second part 212B is located on the side of the fixed part 232 farther from the first part 212A, in other words, the fixed part 232 is sandwiched between the first part 212A and the second part 212B. The driving unit 22 is located between the carrier 231 and the fixed platform 211, the fixed member 221 of the driving unit 22 is attached to the fixed platform 211, and the movable member 222 is attached to the surface of the carrier 231 facing the fixed platform 211. Specifically, the movable member 222 is attached to the side of the second carrying area R2 of the carrier 231 that is far from the top plate 2121 (in other words, the surface of the second carrying area R2 facing the fixed platform 211). In this solution, the position of the fixed member 221 on the fixed platform 211 is around the friction interface X between the carrier 231 and the fixed platform 211. The movement range of the carrier 231 on the fixed platform 211 is within the range limited by the fixed member 221 on the fixed platform 211. The carrier 231 includes three parts: a first section A1, a second section A2, and a third section A3. The second section A2 is connected between the first section A1 and the third section A3. The first section A1 is connected to the connection portion 233 and is configured to place the movable member 222 and other electronic devices. The third section A3 is configured to support the image sensor 4. The first section A1 may be parallel to the third section A3.

[0122] 27, the fixed frame 212 of the fixed base 21 includes a top plate 2121. The top plate 2121 is configured to block the connection portion 233, and the top plate 2121 is configured to protect the connection portion 233.

[0123] In another implementation, as shown in Fig. 28, no top plate may be placed on the fixed base 21, and the fixed part 232 of the movable base 23 overlaps the top surface 212C of the fixed frame 212. This implementation realizes a miniaturization of the image sensor driving module and helps to save space in the electronic device. In the implementation shown in Fig. 28, the area surrounded by the end of the fixed frame 212 farther from the fixed platform 211 is the opening S11. In the process of assembling the image sensor 4, the image sensor 4 is assembled to the first supporting area R1 of the supporting part 231 through the opening S11.

[0124] See Fig. 29. In one implementation, the support part 231 includes a first support platform 231E and a second support platform 231F, the first support platform 231E is configured to support the image sensor 4, and the first support platform 231E has a receiving slot E1. The image sensor 4 is attached to the receiving slot E1 of the first support platform 231E by using an adhesive layer, and the first support platform 231E contacts the fixed platform 211 of the fixed base 21 to form a contact surface, and the direction perpendicular to the contact surface is the direction of the optical axis P. The second support platform 231F and the connecting part 233 are stacked in the direction of the optical axis P, and the movable member 222 of the drive unit 22 is attached to the second support platform 231F, and the fixed member 221 is attached to the top plate 2121 of the fixed frame 212 of the fixed base 21. The driving unit 22 is located on the side of the second carrying platform 231F remote from the connecting portion 233. The first carrying platform 231E and the connecting portion 233 are connected together to form an integral structure, and the connecting portion 233 is located between the second carrying platform 231F and the contact surface (i.e., the friction interface X) in the direction of the optical axis P. The first carrying platform 231E and the second carrying platform 231F are connected by using solder balls, in other words, mechanical connection can also be implemented. In this implementation, the carrying portion 231 is designed as a structure of two plates (specifically, the first carrying platform 231E and the second carrying platform 231F), and by using an architecture in which the second carrying platform 231F and the connecting portion 233 are stacked, a small-sized design of the movable base 23 in the direction perpendicular to the optical axis P can be realized. When this solution is applied to electronic devices, the board occupation area of ​​the circuit board on which the camera module is located can be reduced. In the implementation shown in FIG. 29, the part of the second supporting platform 231F directly facing the top plate 2121 is the second supporting area R2, and the second supporting area R2 and the connection portion 233 are stacked.In the direction of the optical axis P, the connection part 233 is located between the second carrying area R2 and the fixed platform 211, and the first carrying area R1 includes a first assembly area R13 and a second assembly area R14, and the first assembly area R13 is configured to carry the image sensor 4. The connection part 233 surrounds the first assembly area R13 and is connected to the edge of the first assembly area R13, and the second assembly area R14 and the second carrying area R2 are connected together. The second assembly area R14 and a part of the first assembly area R13 overlap to form an overlap area R111, and the positions of the mechanical connection and the electrical connection between the first assembly area R13 and the second assembly area R14 are all within the overlap area R111. The part within the rectangular frame indicated by the dashed line in FIG. 29 represents the overlap area R111.

[0125] See Figures 30 and 31. In this implementation, the first carrying platform 231E and the connection part 233 are respectively connected to the top and bottom surfaces of the second carrying platform 231F, and the second carrying platform 231F is located between the connection part 233 and the fixed platform 211 in the direction of the optical axis P. It can also be understood that the second carrying platform 231F is located between the connection part and the friction interface in the direction of the optical axis P. In this implementation, the first carrying platform 231E and the second carrying platform are directly connected to form a Z-shaped architecture, and the connection part 233 is located on the side of the second carrying platform 231F away from the fixed platform 211, and the connection part 233 is connected to the top surface of the second carrying platform 231F by using an adaptation plate 233A. The adaptive plate 233A and the second supporting platform 231F are connected by using solder balls, in other words, a mechanical connection or an electrical connection can be realized. The drive unit 22 is located between the second supporting platform 231F and the fixed platform 211, and the movable member 222 is attached to the second supporting platform 231F, and the fixed member 221 is attached to the fixed platform 211.

[0126] 30, the portion of the second carrying platform 231F facing the top plate 2121 is the second carrying region R2, and the movable member 222 is attached to the surface of the second carrying region R2 facing the fixed platform 211. In the optical axis direction, the connection portion 233 is located between the top plate 2121 and the second carrying region R2. The first carrying platform 231E is the first carrying region R1.

[0127] 30 , the fixed frame 212 includes a top plate 2121. The top plate 2121 is located above the connection portion 233 and may protect the connection portion 233. The fixed portion 232 and the fixed platform 211 are spaced apart by a portion of the fixed frame 212; in other words, the fixed portion 232 is attached to the fixed frame 212.

[0128] In the implementation shown in Figure 31, the top plate 2121 is not placed on the fixed frame 212, and the fixed portion 232 is attached to the top surface of the fixed frame 212, in other words, the fixed portion 232 is attached to the surface of the fixed frame 212 away from the fixed platform 211.

[0129] The terms "first," "second," "third," "fourth," and various numerals in this specification are used merely for distinction purposes for ease of explanation and are not to be construed as limitations on the scope of this application.

[0130] It should be understood that the sequence numbers of the above processes do not mean the execution sequence in various embodiments of this application. The execution sequence of the processes should be determined based on the functions and internal logic of the processes, and should not be construed as a limitation on the implementation process of the embodiments of this application.

[0131] The above description is merely a specific implementation of this application, and is not intended to limit the scope of protection of this application. Any variations or replacements that can be easily thought of by those skilled in the art within the technical scope disclosed in this application shall fall within the scope of protection of this application. If no contradiction occurs, the possible implementations of this application and the features in the possible implementations may be combined with each other. Therefore, the scope of protection of this application shall be subject to the scope of protection of the claims.

Claims

1. An image sensor driving module, the image sensor driving module being used in a camera module, a drive unit having a fixed member and a movable member that are movable relative to each other; a stationary base configured to carry the stationary member; a movable base having a carrying part, a fixed part, and a connecting part, the connecting part being configured to realize a mechanical and electrical connection between the carrying part and the fixed part, the carrying part being configured to carry an image sensor and the movable member, and the fixed part being connected to the fixed base; having a holding structure is formed by a partial structure of the support part and a partial structure of the fixed base, the holding structure is configured to provide a holding force to the support part, the drive unit is configured to drive the support part to move relative to the fixed base, and contact between the support part and the fixed base is maintained by the holding force of the holding structure; Image sensor driving module.

2. The image sensor driving module of claim 1 , wherein the driving unit is configured to drive the carrier to move relative to the fixed base in a plane perpendicular to an optical axis of a lens assembly of the camera module.

3. 3. The image sensor driving module of claim 1, wherein the connection portion of the support portion forms at least a part of the holding structure, the connection portion having an elastic structure, and the elastic force of the connection portion acts on the support portion to form the holding force.

4. 4. The image sensor driving module of claim 3, wherein a connection point between the connection portion and the fixed portion is at a first position, a connection point between the connection portion and the support portion is at a second position, and elastic potential energy exists between the first position and the second position, and the elastic potential energy forms the holding force.

5. 5. The image sensor driving module of claim 4, wherein the fixed base has a fixed platform, the support portion is in contact with an inner surface of the fixed platform, the support portion is configured to support the image sensor to move on the inner surface of the fixed platform, the image sensor is located on the light output side of the lens assembly of the camera module, the inner surface of the fixed platform is perpendicular to the optical axis of the lens assembly, a distance between the first position in the direction of the optical axis of the lens assembly and the inner surface of the fixed platform is smaller than a distance between the second position in the direction of the optical axis of the lens assembly and the inner surface of the fixed platform, and an elastic tension of the connection portion acts on the second position to form the holding force toward the fixed platform.

6. 6. An image sensor driving module as described in any one of claims 1 to 5, wherein a magnetic member is arranged on the support portion, and the magnetic member and a portion of the fixed base configured to contact the support portion form at least a part of the holding structure, the portion of the fixed base configured to contact the support portion having a magnetic conductive material, and a magnetic attraction force between the magnetic member and the fixed base forms at least a part of the holding force.

7. 7. The image sensor driving module of claim 6, wherein the magnetic member has at least two magnets arranged in a dot-like distribution on the support portion and adjacent to an outer edge of the support portion, the outer edge of the support portion being an edge position of the support portion facing the fixed portion.

8. 7. The image sensor driving module of claim 6, wherein the magnetic member has at least two magnetic stripes, all of which are long stripes, the at least two magnetic stripes are symmetrically distributed on the support portion and adjacent to the outer edge of the support portion, the outer edge of the support portion being the edge position of the support portion facing the fixed portion.

9. 6. An image sensor driving module as described in any one of claims 1 to 5, wherein a magnetic member is arranged on the fixed base, a portion of the supporting portion has a magnetic conductive material, the portion of the supporting portion having the magnetic conductive material is a magnetic attractive member, the magnetic member and the magnetic attractive member form at least a portion of the holding structure, the magnetic member is placed at a position of a contact surface between the fixed base and the supporting portion, and a magnetic attractive force between the magnetic member and the magnetic attractive member forms the holding force.

10. The image sensor driving module described in any one of claims 1 to 9, wherein the image sensor driving module has an elastic member, one end of the elastic member is located on the support portion and the other end of the elastic member is located on the fixed base, the elastic member forms at least a part of the holding structure, the elastic force applied to the support portion by the elastic member constitutes at least a part of the holding force, and the direction of the elastic force is toward the contact surface between the support portion and the fixed base.

11. The image sensor driving module according to claim 1 , wherein a friction interface is formed on the contact surface between the support part and the fixed base, and the friction interface has a friction coefficient of less than 0.

3.

12. The image sensor driving module of claim 11, wherein at the position of the friction interface, the support and / or the fixed base have a super-slip material layer, the super-slip material layer having a solid structure, and the friction coefficient of the friction interface being less than 0.3 is achieved by using the super-slip material layer.

13. The image sensor driving module of claim 11, wherein a lubricating layer is disposed between the support and the fixed base at the position of the friction interface, the lubricating layer having an oil-like, grease-like or paste-like structure, and the friction coefficient of the friction interface being less than 0.3 is achieved by using the lubricating layer.

14. The image sensor driving module according to claim 11 , wherein the friction coefficient of the friction interface being less than 0.3 is achieved by performing a surface treatment manufacturing process on the contact surface between the support part and the fixed base.

15. The image sensor driving module according to claim 11 , wherein the friction interface comprises a material having thermal conductive properties.

16. The image sensor driving module according to claim 15 , wherein the thermal conductivity of the friction interface is greater than 0.5 W / m·K.

17. 17. The image sensor driving module of claim 1, wherein the contact manner between the support and the fixed base is contact between planes, a plane on the support used to contact the fixed base is a first plane, a plane on the fixed base used to contact the support is a second plane, and both the first plane and the second plane are continuous, completely planar structures.

18. 17. The image sensor driving module of claim 1, wherein the contact mode between the support and the fixed base is contact between a plane and an array of bumps, and at the position where the support contacts the fixed base, one of the structures of the support and the fixed base is a completely planar structure, and the other of the structure of the support and the fixed base is an array of bump structures, and the array of bump structures are arranged to correspond to all areas of the completely planar structure.

19. 17. The image sensor driving module of claim 1, wherein the contact manner between the support and the fixed base is between a plane and a plurality of array-shaped bumps, and at the position where the support contacts the fixed base, one of the structures of the support and the fixed base is a completely planar structure, and the other of the structure of the support and the fixed base is a multi-bump structure, and the multi-bump structure is arranged corresponding to a partial region of the completely planar structure.

20. 17. The image sensor driving module of claim 1, wherein the contact manner between the support and the fixed base is between a plane and a protruding rod structure, and at the position where the support contacts the fixed base, one of the structures of the support and the fixed base is a completely planar structure, and the other of the support and the fixed base is the protruding rod structure.

21. 21. The image sensor driving module of claim 1, wherein the fixed base has the fixed platform and a fixed frame, the retaining force is used to maintain contact between the support portion and the fixed platform, the fixed frame is fixedly connected to an edge of the fixed platform, the fixed frame and the fixed platform enclose an enclosed space within which the driving unit, the connection portion and part of the support portion are located, and the driving unit is located on the side of the support portion away from the fixed platform.

22. 21. The image sensor driving module of claim 1, wherein the fixed base has the fixed platform, the holding force is used to maintain contact between the support and the fixed platform, the driving unit is located between the support and the fixed platform, and the fixed member is attached to the fixed platform.

23. 21. The image sensor driving module of claim 1, wherein the support portion has a first support platform and a second support platform, the first support platform is configured to support the image sensor, the first support platform contacts the fixed base to form a contact surface, a direction perpendicular to the contact surface is a direction of an optical axis, the second support platform and the connection portion are stacked in the direction of the optical axis, and the movable member of the drive unit is attached to the second support platform.

24. 24. The image sensor driving module of claim 23, wherein the first support platform and the connecting portion are connected together to form an integral structure, and the connecting portion is located between the second support platform and the contact surface in the direction of the optical axis.

25. 24. The image sensor driving module of claim 23, wherein the first support platform and the connection portion are connected to the top surface of the second support platform and the bottom surface of the second support platform, respectively, and the second support platform is located between the connection portion and the contact surface in the direction of the optical axis.

26. 21. The image sensor driving module of claim 1, wherein the support portion has a first plate and a second plate, an outer edge of the first plate is connected to the connection portion, and an accommodating space is formed by surrounding an inner edge of the first plate, the movable member is arranged on the first plate, the second plate has a first part and a second part, the first part and the first plate are stacked, the second part is located at the bottom of the accommodating space, the second part is configured to support the image sensor to enable the image sensor to be accommodated in the accommodating space, and the second plate is in contact with the fixed base.

27. 27. An optical assembly comprising an axial motion drive module and an image sensor drive module according to any one of claims 1 to 26, wherein the axial motion drive module is fixedly connected to the image sensor drive module, the image sensor drive module is configured to drive an image sensor to move in a plane perpendicular to an optical axis, and the axial motion drive module is configured to drive a lens assembly to move and tilt it axially.

28. 28. A camera module having an image sensor, a lens assembly, and the optical assembly of claim 27, wherein the lens assembly is mounted on an axial motion drive module, the image sensor is mounted on an image sensor drive module, and the lens assembly is located on a light incident side of the image sensor.

29. A camera module having an image sensor, a lens assembly, and an image sensor driving module described in any one of claims 1 to 26, wherein the image sensor is attached to the image sensor driving module and the lens assembly is located on the light incident side of the image sensor.

30. 30. An electronic device comprising a processor and a camera module according to claim 28 or 29, the processor being electrically connected to the camera module, the processor being configured to process image signals output by an image sensor.

Images