Disk drive

Abstract

To provide a disk drive capable of suppressing contamination. [Solution] A disk device according to one embodiment comprises a magnetic disk, a magnetic head, a flexible printed circuit board, electronic components, and a wall. The flexible printed circuit board is electrically connected to the magnetic head. The electronic components are mounted on the flexible printed circuit board. The wall has higher rigidity than the flexible printed circuit board and is attached to the flexible printed circuit board. The flexible printed circuit board has a first surface facing the electronic components through a gap, and a second surface located on the opposite side of the first surface and facing the wall, and is provided with a first through-hole that opens to the first surface and the second surface and communicates with the gap. The wall is provided with a second through-hole that penetrates the wall and communicates with the first through-hole.

Description

Technical Field

[0001] Embodiments of the present invention relate to a disk device.

Background Art

[0002] A disk device such as a hard disk drive reads and writes information to and from a magnetic disk by a magnetic head. The disk device has, for example, a flexible printed circuit board that electrically connects between a controller and the magnetic head. Various electronic components are mounted on the flexible printed circuit board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Substances that can contaminate the disk device, such as flux, are removed by cleaning the disk device. However, if there is a gap between the flexible printed circuit board and the electronic components, there is a risk that substances that can contaminate the disk device will remain in the gap.

[0005] An example of the problem to be solved by the present invention is to provide a disk device capable of suppressing contamination.

Means for Solving the Problems

[0006] A disk device according to one embodiment comprises a magnetic disk, a magnetic head, a flexible printed circuit board, an electronic component, and a wall. The magnetic head is configured to read and write information to the magnetic disk. The flexible printed circuit board is electrically connected to the magnetic head. The electronic component is mounted on the flexible printed circuit board. The wall is more rigid than the flexible printed circuit board and is attached to the flexible printed circuit board. The flexible printed circuit board has a first surface facing the electronic component through a gap, and a second surface located opposite the first surface and facing the wall, and is provided with a first through-hole that opens to the first surface and the second surface and communicates with the gap. The wall is provided with a second through-hole that penetrates the wall and communicates with the first through-hole. The flexible printed circuit board has a first layer including the first surface, a second layer covering the first surface, and pads provided on the first surface. The electronic component comprises a case and a metal member provided on the case. The second layer has a fifth through-hole that penetrates the second layer and exposes the first surface and the pad, and has a third surface through which the fifth through-hole opens, and an inner surface of the fifth through-hole that extends between the first surface and the third surface. The metal member has a joint that is joined to the pad by solder, and a separated portion provided between the joint and the case, which is spaced apart from the joint in a first direction along the first surface in a direction along the first surface, and is spaced apart from the first surface in a direction perpendicular to the first surface than the joint. The inner surface is spaced apart from the edge of the pad in the first direction. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is an illustrative perspective view showing a disassembled HDD according to the first embodiment. [Figure 2] Figure 2 is an illustrative plan view showing a schematic FPC of the first embodiment. [Figure 3]Figure 3 is an exemplary plan view showing a portion of the second connection point near the sensor of the first embodiment. [Figure 4] Figure 4 is an exemplary cross-sectional view showing a portion of the second connection of the first embodiment along the line F4-F4 in Figure 3. [Figure 5] Figure 5 is an illustrative plan view showing a portion of the second connection area near the relay connector of the first embodiment. [Figure 6] Figure 6 is an exemplary cross-sectional view showing a portion of the second connection of the first embodiment along the line F6-F6 in Figure 5. [Figure 7] Figure 7 is an exemplary cross-sectional view showing a portion of the second connection point near the sensor according to the second embodiment. [Figure 8] Figure 8 is an exemplary plan view showing a portion of the second connection area near the relay connector according to the third embodiment. [Figure 9] Figure 9 is an exemplary cross-sectional view showing a portion of the second connection in the third embodiment along the line F9-F9 in Figure 8. [Figure 10] Figure 10 is an exemplary bottom view showing a relay connector of a third embodiment. [Modes for carrying out the invention]

[0008] (First embodiment) The first embodiment will be described below with reference to Figures 1 to 6. Note that in this specification, the components of the embodiment and their descriptions may be described using multiple expressions. The components and their descriptions are examples and are not limited by the expressions used herein. Components may also be identified by names different from those used herein. Furthermore, components may also be described using expressions different from those used herein.

[0009] Figure 1 is an exemplary perspective view showing a disassembled hard disk drive (HDD) 10 according to the first embodiment. The HDD 10 is an example of a disk device and may also be referred to as an electronic device, storage device, external storage device, or magnetic disk device. Note that the disk device is not limited to the HDD 10.

[0010] The HDD 10 comprises a housing 11, a plurality of magnetic disks 12, a spindle motor 13, a plurality of magnetic heads 14, an actuator assembly 15, a voice coil motor (VCM) 16, a ramp load mechanism 17, a flexible printed circuit board (FPC) 18, and a printed circuit board (PCB) 19.

[0011] The housing 11 comprises a base 21, an inner cover 22, and an outer cover 23. The base 21 is a bottomed container made of a metal material such as aluminum alloy, and has a bottom wall 25 and side walls 26. The bottom wall 25 is formed in the shape of a roughly rectangular (square) plate. The side walls 26 protrude from the edge of the bottom wall 25. The bottom wall 25 and the side walls 26 are formed integrally.

[0012] The inner cover 22 and the outer cover 23 are made of a metal material such as an aluminum alloy. The inner cover 22 is attached to the end of the side wall 26 by screws, for example. The outer cover 23 covers the inner cover 22 and is airtightly fixed to the end of the side wall 26 by welding, for example.

[0013] The inside of the housing 11 is sealed. Inside the housing 11 are the magnetic disk 12, spindle motor 13, magnetic head 14, actuator assembly 15, VCM 16, ramp load mechanism 17, and FPC 18.

[0014] The inner cover 22 is provided with a vent hole 22a. Further, the outer cover 23 is provided with a vent hole 23a. Components are attached inside the base 21. After the inner cover 22 and the outer cover 23 are attached to the base 21, the air inside the housing 11 is exhausted from the vent holes 22a and 23a. Further, a gas different from air is filled inside the housing 11.

[0015] The gas filled inside the housing 11 is, for example, a low-density gas having a lower density than air, an inert gas with low reactivity, or the like. For example, helium is filled inside the housing 11. Note that other fluids may be filled inside the housing 11. Also, the inside of the housing 11 may be maintained at a vacuum, a low pressure close to a vacuum, or a negative pressure lower than atmospheric pressure.

[0016] The vent hole 23a of the outer cover 23 is blocked by a seal 28. The seal 28 hermetically seals the vent hole 23a and suppresses the leakage of the fluid filled inside the housing 11 from the vent hole 23a. Note that the inside and the outside of the housing 11 may be in communication.

[0017] The magnetic disk 12 is, for example, a disk having magnetic recording layers provided on the upper and lower surfaces. The diameter of the magnetic disk 12 is, for example, 3.5 inches, but is not limited to this example. A plurality of magnetic disks 12 are stacked with an interval therebetween.

[0018] The spindle motor 13 supports and rotates a plurality of stacked magnetic disks 12. The plurality of magnetic disks 12 are held, for example, by a clamp spring on the hub of the spindle motor 13.

[0019] The magnetic head 14 records and reproduces information with respect to the recording layer of the magnetic disk 12. In other words, the magnetic head 14 reads and writes information to and from the magnetic disk 12. The magnetic head 14 is mounted on an actuator assembly 15.

[0020] The actuator assembly 15 is rotatably supported on a support shaft 31 positioned away from the magnetic disk 12. The VCM 16 rotates the actuator assembly 15 to the desired position. When the magnetic head 14 moves to the outermost edge of the magnetic disk 12, the ramp load mechanism 17 holds the magnetic head 14 in the unloaded position away from the magnetic disk 12.

[0021] The actuator assembly 15 includes an actuator block 35, a plurality of arms 36, and a plurality of head suspension assemblies 37. The head suspension assembly 37 will be referred to as the suspension 37 below. The suspension 37 may also be referred to as a head gimbal assembly (HGA).

[0022] The actuator block 35 is rotatably supported on the support shaft 31, for example, via bearings. Multiple arms 36 protrude from the actuator block 35 in a direction substantially perpendicular to the support shaft 31. Alternatively, the actuator assembly 15 may be divided, with arms 36 protruding from each of the multiple actuator blocks 35.

[0023] Multiple arms 36 are arranged with intervals between them in the direction in which the support shaft 31 extends. Each arm 36 is formed in a plate shape that can enter between adjacent magnetic disks 12. Multiple arms 36 extend substantially parallel to each other.

[0024] The actuator block 35 and the multiple arms 36 are integrally formed from, for example, aluminum. However, the materials for the actuator block 35 and arms 36 are not limited to this example.

[0025] The voice coil of the VCM16 is mounted on a projection that protrudes from the actuator block 35 to the opposite side of the arm 36. The VCM16 has a pair of yokes, a voice coil positioned between the yokes, and a magnet provided on the yoke.

[0026] As described above, the VCM16 rotates the actuator assembly 15. In other words, the VCM16 rotates (moves) the actuator block 35, arm 36, and suspension 37 as a single unit.

[0027] The suspension 37 is attached to the tip of the corresponding arm 36 and protrudes from the arm 36. As a result, the multiple suspensions 37 are arranged at intervals in the direction in which the support shaft 31 extends.

[0028] Each of the multiple suspensions 37 has a base plate 41, a road beam 42, and a flexure 43. Furthermore, a magnetic head 14 is mounted at the tip of the suspension 37.

[0029] The base plate 41 and the load beam 42 are made of, for example, stainless steel. However, the materials of the base plate 41 and the load beam 42 are not limited to this example. The base plate 41 is formed in a plate shape and is attached to the tip of the arm 36. The load beam 42 is formed in a plate shape that is thinner than the base plate 41. The load beam 42 is attached to the tip of the base plate 41 and protrudes from the base plate 41.

[0030] The flexiser 43 is formed in a long, narrow strip shape. However, the shape of the flexiser 43 is not limited to this example. The flexiser 43 is a laminate having a metal plate such as stainless steel (backing layer), an insulating layer formed on the metal plate, a conductive layer formed on the insulating layer and constituting multiple wirings (wiring patterns), and a protective layer (insulating layer) covering the conductive layer.

[0031] A gimbal section (elastic support section) is provided at one end of the flexure 43, which is positioned on the load beam 42 and is displaceable. The gimbal section is located at the tip of the suspension 37 and is equipped with a magnetic head 14. The other end of the flexure 43 is connected to the FPC 18. As a result, the FPC 18 is electrically connected to the magnetic head 14 via the wiring of the flexure 43.

[0032] PCB19 is a rigid substrate, such as a glass epoxy substrate, and can be a multilayer substrate or a build-up substrate. PCB19 is placed outside the housing 11 and attached to the bottom wall 25 of the base 21. PCB19 is attached to the bottom wall 25 by, for example, multiple screws.

[0033] PCB19 may include, for example, an interface (I / F) connector 51, a controller 52, and a relay connector 53. Other components may also be mounted on PCB19.

[0034] The I / F connector 51 is a connector compliant with an interface standard such as Serial ATA (SATA) and is connected to the I / F connector of the host computer. The HDD 10 receives power from the host computer and sends and receives various data to and from the host computer through the I / F connector 51.

[0035] The controller 52 is, for example, a system-on-a-chip (SoC) and includes a read / write channel (RWC), a hard disk controller (HDC), and a processor. The RWC, HDC, and processor may be separate components.

[0036] The processor of controller 52 is, for example, a CPU (Central Processing Unit). The processor performs overall control of the HDD 10 according to firmware pre-stored in ROM. For example, the processor loads the firmware from ROM into RAM and performs control of the magnetic head 14, RWC, HDC, and other parts according to the loaded firmware.

[0037] The relay connector 53 is electrically connected to various components located inside the housing 11, for example, through a connector provided on the bottom wall 25. As a result, the PCB 19 is electrically connected to the spindle motor 13, magnetic head 14, actuator assembly 15, VCM 16, and FPC 18 located inside the housing 11.

[0038] Figure 2 is a schematic example plan view showing the FPC 18 of the first embodiment. As shown in Figure 2, the FPC 18 is formed in a roughly L-shaped strip when removed from other parts and in a natural state where no external forces are acting on it. Note that the shape of the FPC 18 is not limited to this example. The FPC 18 has a first connecting portion 61, a second connecting portion 62, and an intermediate portion 63.

[0039] The first connector 61 is provided, for example, at one end of the FPC 18 in the direction in which the FPC 18 extends. The first connector 61 is attached to the actuator block 35, for example, by screws. The first connector 61 is electrically connected to the VCM 16 and the flexure 43.

[0040] The second connector 62 is provided, for example, at the other end of the FPC 18 in the direction in which the FPC 18 extends. The second connector 62 is attached to the bottom wall 25, for example, by screws. The second connector 62 is electrically connected to the PCB 19, for example, through a connector provided on the bottom wall 25.

[0041] The intermediate section 63 is provided between the first connecting section 61 and the second connecting section 62. The intermediate section 63 extends in a strip shape and flexes between the first connecting section 61 and the second connecting section 62 in accordance with the rotation of the actuator block 35.

[0042] As shown in each drawing, the X, Y, and Z axes are defined herein for convenience. The X, Y, and Z axes are orthogonal to each other. The X axis is provided along the width of the natural intermediate section 63. The Y axis is provided along the length of the natural intermediate section 63. The Z axis is provided along the thickness of the natural FPC 18.

[0043] Furthermore, the X, Y, and Z directions are defined herein. The X direction is a direction along the X axis and includes the +X direction indicated by the X-axis arrow and the -X direction which is the opposite direction of the X-axis arrow. The Y direction is a direction along the Y axis and includes the +Y direction indicated by the Y-axis arrow and the -Y direction which is the opposite direction of the Y-axis arrow. The Z direction is a direction along the Z axis and includes the +Z direction indicated by the Z-axis arrow and the -Z direction which is the opposite direction of the Z-axis arrow.

[0044] The first connecting portion 61 is connected to the end of the intermediate portion 63 in the +Y direction and extends from that end in the +Y direction. The second connecting portion 62 is connected to the end of the intermediate portion 63 in the -Y direction and extends from that end in the +X direction. Note that the first connecting portion 61 and the second connecting portion 62 are not limited to this example.

[0045] The HDD10 further comprises a plurality of preamplifiers 65, a relay connector 66, a sensor 67, and a plurality of reinforcing plates 68. The relay connector 66 and the sensor 67 are examples of electronic components. The reinforcing plates 68 are examples of walls.

[0046] The preamplifier 65 is mounted on the first connection section 61. The preamplifier 65 is electrically connected to the flexi 43, for example, via the wiring and pads of the FPC 18. The preamplifier 65 is also electrically connected to the magnetic head 14 via the flexi 43. The preamplifier 65 amplifies the write signal and transmits it to the magnetic head 14, and also amplifies the read signal received from the magnetic head 14.

[0047] The relay connector 66 and the sensor 67 are mounted on the second connection section 62. The relay connector 66 is electrically connected to the relay connector 53 of the PCB 19, for example, through a connector provided on the bottom wall 25. This connects the second connection section 62 to the PCB 19. The relay connector 66 may also be directly connected to the relay connector 53 of the PCB 19. The sensor 67 detects, for example, the humidity or atmospheric pressure inside the housing 11. The sensor 67 is not limited to this example.

[0048] The reinforcing plate 68 is made of a metal such as aluminum or a synthetic resin, and is formed in the shape of a plate. However, the reinforcing plate 68 is not limited to this example. Multiple reinforcing plates 68 are attached to the first connection part 61 and the second connection part 62.

[0049] The reinforcing plate 68 has higher rigidity than the FPC 18. Therefore, the reinforcing plate 68 improves the rigidity of the first connection part 61 and the second connection part 62. The intermediate part 63 is not attached to the reinforcing plate 68 and can bend.

[0050] Figure 3 is an exemplary plan view showing a portion of the second connection portion 62 near the sensor 67 of the first embodiment. Figure 4 is an exemplary cross-sectional view showing a portion of the second connection portion 62 of the first embodiment along the line F4-F4 in Figure 3.

[0051] As shown in Figure 4, the FPC 18 has a mounting surface 71 and a back surface 72. The back surface 72 is an example of a second surface. The mounting surface 71 is one surface of the FPC 18. The preamplifier 65, the relay connector 66, and the sensor 67 are mounted on the mounting surface 71. Therefore, the mounting surface 71 faces the preamplifier 65, the relay connector 66, and the sensor 67. The back surface 72 is located on the opposite side of the mounting surface 71. The back surface 72 faces the reinforcing plate 68.

[0052] The FPC18 has a base layer 75, a conductive layer 76, and a cover layer 77. The base layer 75 is an example of a first layer. The conductive layer 76 is an example of a third layer. The cover layer 77 is an example of a second layer.

[0053] The base layer 75 is made of an insulating material such as polyimide and has insulating properties. If the FPC 18 is a multilayer FPC, the base layer 75 may have multiple insulating layers and multiple conductive layers.

[0054] The base layer 75 has an upper surface 75a and a lower surface 75b. In this specification, "upper" and "lower" are convenient terms based on the vertical direction in Figure 4 and do not limit the direction, position, or other conditions. The upper surface 75a is an example of a first surface. The lower surface 75b is an example of a second surface.

[0055] The upper surface 75a is the surface of the base layer 75 oriented in the +Z direction. The lower surface 75b is located on the opposite side of the upper surface 75a and is the surface of the base layer 75 oriented in the -Z direction. The back surface 72 of the FPC 18 includes the lower surface 75b.

[0056] The conductive layer 76 is made of a conductor such as copper and has electrical conductivity. The conductive layer 76 is provided on the upper surface 75a of the base layer 75. An adhesive layer may be provided between the conductive layer 76 and the upper surface 75a.

[0057] As shown in Figure 3, the conductive layer 76 has a plurality of pads 81 and a plurality of wirings 82. A pad 81 is an example of a first terminal and may also be called a land or electrode. The pads 81 and wirings 82 are provided on the upper surface 75a of the base layer 75.

[0058] Sensor 67 is electrically connected to pad 81. Wiring 82 extends from pad 81 and electrically connects, for example, pad 81 to relay connector 66. Wiring 82 may also be connected to other wiring, via holes, ground, or other conductors.

[0059] The cover layer 77 covers at least a portion of the upper surface 75a of the base layer 75 and at least a portion of the conductive layer 76. Therefore, the conductive layer 76 is located between the base layer 75 and the cover layer 77. For example, the cover layer 77 covers a portion of the pad 81 and the wiring 82. As shown in Figure 4, the cover layer 77 has a lower surface 77a and an upper surface 77b. The upper surface 77b is an example of a third surface.

[0060] The lower surface 77a is the surface of the cover layer 77 facing the -Z direction. The lower surface 77a faces the upper surface 75a of the base layer 75. The upper surface 77b is located on the opposite side of the lower surface 77a and is the surface of the cover layer 77 facing the +Z direction. The upper surface 77b forms the surface of the FPC 18. Therefore, the mounting surface 71 of the FPC 18 includes the upper surface 77b of the cover layer 77.

[0061] The cover layer 77 comprises a cover film 85 and an adhesive 86. The cover film 85 is made of an insulating material such as polyimide. The adhesive 86 is made of an insulating adhesive, for example. Therefore, the cover layer 77 is insulating. In other words, the electrical resistance of the base layer 75 and the cover layer 77 is higher than the electrical resistance of the conductive layer 76.

[0062] The adhesive 86 is interposed between the cover film 85 and the upper surface 75a of the base layer 75 and the conductive layer 76. The adhesive 86 adheres the cover film 85 to the upper surface 75a of the base layer 75 and the conductive layer 76.

[0063] An exposed hole 87 is provided in the cover layer 77. The exposed hole 87 is an example of a third through hole and exposed hole. The exposed hole 87 penetrates the cover layer 77 in approximately the Z direction and opens to the lower surface 77a and the upper surface 77b. As shown in Figure 3, the exposed hole 87 has an exposed portion 87a and a plurality of extended portions 87b.

[0064] The exposed portion 87a has a shape corresponding to the shape of the sensor 67. In this embodiment, the exposed portion 87a is a substantially rectangular hole. The exposed portion 87a exposes a part of the upper surface 75a of the base layer 75 and a part of the multiple pads 81. As a result, the exposed upper surface 75a forms the surface of the FPC 18 and is included in the mounting surface 71 of the FPC 18.

[0065] Multiple extensions 87b extend, for example, radially from the exposed portion 87a. The extensions 87b expose a portion of the upper surface 75a of the base layer 75. On the other hand, the extensions 87b are spaced apart from the conductive layer 76. That is, the conductive layer 76 is not exposed by the extensions 87b.

[0066] As shown in Figure 4, the cover layer 77 further has an inner surface 77c which is the inner surface of the exposed hole 87. The inner surface 77c extends between the lower surface 77a and the upper surface 77b of the cover layer 77. Since the lower surface 77a is bonded to the upper surface 75a of the base layer 75, the inner surface 77c extends between the upper surface 75a of the base layer 75 and the upper surface 77b of the cover layer 77.

[0067] The inner surface 77c has a first edge 77d and a second edge 77e. The first edge 77d is the edge of the inner surface 77c connected to the lower surface 77a. The first edge 77d is also the edge of the lower surface 77a connected to the inner surface 77c. Since the lower surface 77a is bonded to the upper surface 75a of the base layer 75, the first edge 77d is connected to the upper surface 75a of the base layer 75. The second edge 77e is the edge of the inner surface 77c connected to the upper surface 77b. The second edge 77e is also the edge of the upper surface 77b connected to the inner surface 77c.

[0068] At least a portion of the exposed hole 87 tapers toward the upper surface 75a of the base layer 75. Therefore, the second edge 77e is larger than the first edge 77d. At least a portion of the inner surface 77c extends diagonally between the first edge 77d and the second edge 77e, for example, toward the upper surface 75a of the base layer 75. A portion of the inner surface 77c may also extend substantially perpendicular to the upper surface 75a.

[0069] The aforementioned exposed holes 87 are formed, for example, by punching the cover film 85. The shape of the inner surface 77c can be easily controlled by punching. Therefore, exposed holes 87 that extend diagonally with respect to the upper surface 75a can be easily formed.

[0070] In the FPC18 described above, the mounting surface 71 has a surface area 91 and a recessed area 92. The surface area 91 is an example of a first area. The recessed area 92 is an example of a second area. In the examples in Figures 3 and 4, the surface area 91 has the upper surface 77b of the cover layer 77. Therefore, the exposed hole 87 opens into the surface area 91.

[0071] The recessed region 92 is recessed from the surface region 91. In the examples in Figures 3 and 4, the recessed region 92 has the upper surface 75a of the base layer 75 exposed by the exposed hole 87 and the inner surface 77c of the cover layer 77. For this reason, the pad 81 is provided in the recessed region 92. Also, the second edge 77e of the inner surface 77c is the edge of the surface region 91 that is connected to the inner surface 77c of the recessed region 92.

[0072] A through-hole 95 is provided in the FPC 18. The through-hole 95 is an example of a first through-hole. The through-hole 95 penetrates the base layer 75 in approximately the Z direction and opens to the upper surface 75a and the lower surface 75b. In the example in Figure 3, the through-hole 95 has a circular cross-section. However, the shape of the cross-section of the through-hole 95 is not limited to this example and may be rectangular or other shapes.

[0073] As shown in Figure 4, the through-hole 95 is provided in the portion of the upper surface 75a that is exposed by the exposed hole 87. Therefore, the through-hole 95 is exposed by the exposed hole 87 and is provided in the recessed region 92. In other words, the through-hole 95 communicates with the exposed hole 87.

[0074] The reinforcing plate 68 is attached to the FPC 18 so as to cover the lower surface 75b of the base layer 75. Therefore, the base layer 75 is located between the cover layer 77 and the reinforcing plate 68. A through hole 101 is provided in the reinforcing plate 68. The through hole 101 is an example of a second through hole.

[0075] The through-hole 101 penetrates the reinforcing plate 68 in approximately the Z direction. The through-hole 101 has approximately the same shape as the through-hole 95 of the FPC 18. The through-hole 101 overlaps with the through-hole 95 in the Z direction and communicates with the through-hole 95. However, the shape of the through-hole 101 may differ from the shape of the through-hole 95.

[0076] An adhesive layer 110 is provided between the FPC 18 and the reinforcing plate 68. The adhesive layer 110 adheres the FPC 18 and the reinforcing plate 68 to each other. Through holes 111 are provided in the adhesive layer 110. The through holes 111 have substantially the same shape as the through holes 95 and 101, and connect the through holes 95 and 101 to each other.

[0077] The sensor 67 is, for example, a land grid array (LGA). However, the sensor 67 is not limited to this example. The sensor 67 has a package 121 and a plurality of lands 122. The package 121 is an example of a case. The lands 122 are an example of a second terminal.

[0078] Package 121 includes, for example, a circuit board on which multiple elements are mounted, and a molded resin covering the circuit board and elements. The case is a component that forms the outer surface of the electronic component and may also serve as a component on which an electrical circuit, such as a circuit board, is provided.

[0079] Package 121 has a bottom surface 121a. The bottom surface 121a faces the top surface 75a of the base layer 75, which is exposed to the exposed hole 87, through space S1. In other words, the top surface 75a of the base layer 75 faces the package 121 of the sensor 67 through space S1. Space S1 is an example of a gap.

[0080] Land 122 is provided on the lower surface 121a of package 121. Land 122 is electrically connected to pad 81 of FPC 18 via solder 125. As a result, sensor 67 is mounted in a recessed area 92 of the mounting surface 71 of FPC 18.

[0081] The through-hole 95 of the FPC 18 communicates with the space S1 provided between the upper surface 75a of the base layer 75 and the package 121. In the direction along the upper surface 75a (XY plane), the through-hole 95 communicates with space S1 at approximately its center. Note that the position of the through-hole 95 is not limited to this example. Space S1 communicates with the outside of the FPC 18 through the through-holes 95, 101, and 111.

[0082] In the direction along the top surface 75a, each of the through holes 95, 101, and 111 is smaller than the exposed hole 87. Also, in the direction along the top surface 75a, each of the through holes 95, 101, and 111 is smaller than the package 121.

[0083] In the direction along the top surface 75a, the edge of the top surface 77b connected to the inner surface 77c (the second edge 77e) is larger than the package 121 of the sensor 67. In the direction along the top surface 75a, the package 121 is located inside the second edge 77e.

[0084] In the direction along the upper surface 75a, the second edge 77e is spaced apart from the package 121. In other words, in the direction along the surface region 91, the edge of the surface region 91 connected to the inner surface 77c of the recessed region 92 (the second edge 77e) is spaced apart from the package 121. Also, in the direction along the upper surface 75a, the first edge 77d is spaced apart from the package 121.

[0085] A gap G1 is provided between the package 121 and the second edge 77e. The gap G1 communicates with space S1 and the outside of the FPC 18. In other words, space S1 communicates with the outside of the FPC 18 through the gap G1.

[0086] In the direction along the upper surface 75a, at least a portion of the extension 87b of the exposed hole 87 is spaced apart from the package 121. Therefore, the extension 87b communicates with space S1 and the outside of the FPC 18. In other words, space S1 communicates with the outside of the FPC 18 through the extension 87b.

[0087] Figure 5 is an exemplary plan view showing a portion of the second connection portion 62 near the relay connector 66 of the first embodiment. Figure 6 is an exemplary cross-sectional view showing a portion of the second connection portion 62 of the first embodiment along the line F6-F6 in Figure 5.

[0088] As shown in Figure 5, the conductive layer 76 has a plurality of pads 131 and a plurality of wirings 132. The pads 131 are an example of a first terminal and may also be called lands or electrodes. The pads 131 and wirings 132 are provided on the upper surface 75a of the base layer 75.

[0089] The relay connector 66 is electrically connected to the pad 131. The wiring 132 extends from the pad 131 and electrically connects, for example, the pad 131 to the preamplifier 65 or the sensor 67. The wiring 132 may also be connected to other wiring, via holes, ground, or other conductors.

[0090] The cover layer 77 covers a portion of the pad 131 and the wiring 132. The cover layer 77 is provided with a plurality of exposure holes 135. As shown in Figure 6, the exposure holes 135 penetrate the cover layer 77 in approximately the Z direction and open to the lower surface 77a and the upper surface 77b. The exposure holes 135 expose a portion of the upper surface 75a of the base layer 75 and a portion of the plurality of pads 131.

[0091] Multiple through-holes 141 are provided in the FPC 18. The through-holes 141 are an example of a first through-hole. Each of the multiple through-holes 141 penetrates the base layer 75 and the cover layer 77 in approximately the Z direction and opens to the upper surface 77b of the mounting surface 71 and the lower surface 75b of the rear surface 72.

[0092] In the example shown in Figure 5, the through-hole 141 has a circular cross-section. However, the shape of the cross-section of the through-hole 141 is not limited to this example; it may be square or have other shapes. Furthermore, the shapes of multiple through-holes 141 may differ from each other.

[0093] As shown in Figure 6, the reinforcing plate 68 is provided with a plurality of through holes 142. The through holes 142 are an example of a second through hole. The through holes 142 penetrate the reinforcing plate 68 in approximately the Z direction. The through holes 142 have approximately the same shape as the through holes 141 of the FPC 18. The through holes 142 overlap with the through holes 141 in the Z direction and communicate with the through holes 141. Note that the shape of the through holes 142 may differ from the shape of the through holes 141.

[0094] Multiple through holes 143 are provided in the adhesive layer 110. The through holes 143 have substantially the same shape as the through holes 141 and 142, and connect the through holes 141 and 142 to each other. However, the shape of the through holes 143 may differ from the shape of the through holes 141 and 142.

[0095] The relay connector 66 has a case 151 and a plurality of lead wires 152. The lead wires 152 are an example of a second terminal. The case 151 is, for example, the part of the relay connector 66 that is formed of an insulator such as synthetic resin. A conductor including the lead wires 152 is attached to the case 151.

[0096] Case 151 has a bottom surface 151a and a side surface 151b. The bottom surface 151a faces the top surface 77b of the cover layer 77 through space S2. In other words, the top surface 77b of the cover layer 77 faces the case 151 of the relay connector 66 through space S2. Space S2 is an example of a gap. The side surface 151b faces in a direction intersecting the direction in which the bottom surface 151a faces.

[0097] The lead wire 152 is provided on the side 151b of the case 151. The lead wire 152 is electrically connected to the pad 131 of the FPC 18 via solder 155. This allows the relay connector 66 to be mounted on the FPC 18.

[0098] The through-holes 141 of the FPC 18 communicate with the space S2 provided between the upper surface 77b of the cover layer 77 and the case 151. In the direction along the upper surface 77b (XY plane), one of the through-holes 141 communicates with space S2 at approximately the center of space S2. Note that the position of the through-holes 141 is not limited to this example. Space S2 communicates with the outside of the FPC 18 through the through-holes 141, 142, and 143.

[0099] The following describes some examples of how to mount the relay connector 66 and sensor 67 to the FPC 18. Note that the method of mounting the relay connector 66 and sensor 67 to the FPC 18 is not limited to the method described below, and other methods may be used. First, solder paste (solder 125, 155) is supplied to the pads 81, 131, for example, by printing or coating.

[0100] Next, the sensor 67 is mounted on the pad 81. Furthermore, the relay connector 66 is mounted on the pad 131. The FPC 18 is positioned between the sensor 67 and the reinforcing plate 68, and also between the relay connector 66 and the reinforcing plate 68. Therefore, the reinforcing plate 68 can suppress deformation of the FPC 18 during mounting.

[0101] Next, the FPC 18 is heated in a reflow oven, and the solder paste melts. As a result, the land 122 of the sensor 67 is joined to the pad 81, and the lead wire 152 of the relay connector 66 is joined to the pad 131. At this time, flux that has been mixed with or separately supplied to the solder 125 and 155 may leak out from the solder 125 and 155.

[0102] Next, the FPC18 is cleaned, for example, by ultrasonic cleaning. For example, the FPC18 is placed in a tank filled with cleaning solution C. As shown by the arrows in Figure 4, the cleaning solution C flows into space S1 through the through holes 95, 101, and 111. The cleaning solution C can also be discharged from space S1 to the outside of the FPC18 through the through holes 95, 101, and 111.

[0103] The cleaning fluid C flows into space S1 through gap G1. The cleaning fluid C also flows into space S1 through extension 87b of exposed hole 87. The cleaning fluid C can be discharged from space S1 to the outside of FPC18 through gap G1 and extension 87b.

[0104] The cleaning solution C flows into space S1 and is discharged from space S1. In other words, the cleaning solution C flows through space S1. This allows the cleaning solution C to remove substances that could contaminate the HDD 10, such as flux, from space S1.

[0105] As shown in Figure 6, the cleaning fluid C flows into space S2 through through holes 141, 142, and 143. The cleaning fluid C can also be discharged from space S2 to the outside of FPC 18 through through holes 141, 142, and 143. Furthermore, the cleaning fluid C can pass through the gap G2 between case 151 and FPC 18.

[0106] The cleaning solution C flows into space S2 and is discharged from space S2. In other words, the cleaning solution C flows through space S2. This allows the cleaning solution C to remove any substances present in space S2 that could contaminate the HDD 10.

[0107] Once ultrasonic cleaning is complete, the FPC18 is removed from the cleaning solution C. At this time, the cleaning solution C in space S1 is discharged through at least one of the through holes 95, 101, 111, gap G1, and extension 87b. The cleaning solution C in space S2 is discharged through at least one of the through holes 141, 142, 143, and gap G2.

[0108] For example, the cleaning fluid C that flows into spaces S1 and S2 transmits ultrasonic waves. These ultrasonic waves lift the flux present in spaces S1 and S2 away from the FPC18. Subsequently, the cleaning fluid C, along with the flux, is discharged from spaces S1 and S2 as described above. With this, the mounting of components onto the FPC18 is completed.

[0109] In the HDD 10 according to the first embodiment described above, the FPC 18 has an upper surface 75a facing the sensor 67 through space S1, and a lower surface 75b located on the opposite side of the upper surface 75a and facing the reinforcing plate 68. The FPC 18 is provided with through holes 95 that open to the upper surface 75a and the lower surface 75b and communicate with space S1. The reinforcing plate 68 is provided with through holes 101 that penetrate the reinforcing plate 68 and communicate with the through holes 95. That is, the space S1 between the sensor 67 and the upper surface 75a communicates with the outside through the through holes 95 and 101. As a result, the through holes 95 and 101 can allow cleaning fluid C to flow through to clean space S1, and it is possible to suppress the remaining of substances that can contaminate the HDD 10, such as flux, in space S1. Therefore, the HDD 10 of this embodiment can suppress contamination of the HDD 10, and consequently, it can suppress substances that can contaminate the HDD 10 from causing malfunctions such as head crashes.

[0110] The FPC18 has a pad 81. The sensor 67 has a package 121 and a land 122 provided on the package 121 and electrically connected to the pad 81 via solder 125. The space S1 is provided between the top surface 75a and the package 121. That is, the through holes 95,101 can introduce cleaning fluid C into the large space S1 between the package 121 and the top surface 75a. Therefore, the HDD 10 of this embodiment can be easily cleaned by cleaning fluid C in the large space S1 between the package 121 and the top surface 75a, where substances that may contaminate the HDD 10 tend to remain.

[0111] The FPC 18 has a base layer 75 including an upper surface 75a, and a cover layer 77 covering the upper surface 75a. The cover layer 77 is provided with an exposure hole 87 that penetrates the cover layer 77 and exposes the upper surface 75a, the through hole 95, and the pad 81. The cover layer 77 has an upper surface 77b through which the exposure hole 87 opens, and an inner surface 77c of the exposure hole 87 that extends between the upper surface 75a and the upper surface 77b. In the direction along the upper surface 75a, the edge of the upper surface 77b connected to the inner surface 77c (second edge 77e) is spaced apart from the package 121. Therefore, a gap G1 communicating with space S1 is provided between the second edge 77e and the package 121. The gap G1 allows a cleaning liquid C to flow through to clean space S1, and prevents substances that could contaminate the HDD 10, such as flux, from remaining in space S1. Furthermore, since space S1 is connected to the outside through two or more pathways, it is possible to suppress the stagnation of the cleaning solution C in space S1.

[0112] The inner surface 77c has a first edge 77d connected to the upper surface 75a and a second edge 77e connected to the upper surface 77b and larger than the first edge 77d. At least a portion of the inner surface 77c extends diagonally with respect to the upper surface 75a between the first edge 77d and the second edge 77e. As a result, the cover layer 77 can widen the gap G1 and cover a wider area of ​​the upper surface 75a compared to the case where the inner surface 77c extends perpendicularly with respect to the upper surface 75a. Therefore, the HDD 10 of this embodiment can suppress the exposure of the conductive layer 76 provided on the upper surface 75a, and consequently suppress corrosion of the conductive layer 76.

[0113] The FPC18 has a base layer 75, a cover layer 77, and a conductive layer 76. The conductive layer 76 is located between the base layer 75 and the cover layer 77 and includes a pad 81. The cover layer 77 is provided with an exposed hole 87 that penetrates the cover layer 77. The exposed hole 87 has an exposed portion 87a that exposes the upper surface 75a, the through hole 95, and the pad 81, and an extended portion 87b that extends from the exposed portion 87a, exposing the upper surface 75a and spaced apart from the conductive layer 76. In the direction along the upper surface 75a, at least a part of the extended portion 87b is spaced apart from the package 121. Therefore, the extended portion 87b connects the space S1 to the outside. The extended portion 87b allows a cleaning liquid C to flow through the space S1, and can suppress the remaining of substances that can contaminate the HDD 10, such as flux, in the space S1. Furthermore, since space S1 communicates with the outside through two or more paths, the stagnation of the cleaning fluid C in space S1 can be suppressed. In addition, since the extension portion 87b is spaced apart from the conductive layer 76, the conductive layer 76 is not exposed. As a result, the HDD 10 of this embodiment can suppress corrosion of the conductive layer 76.

[0114] The sensor 67 is LGA. As a result, the space S1 is small, making it difficult to circulate the cleaning fluid C. However, in this embodiment, the HDD 10 has the space S1 connected to the outside through through holes 95 and 101. This allows the cleaning fluid C to clean the space S1, and prevents substances that could contaminate the HDD 10, such as flux, from remaining in the space S1.

[0115] The FPC 18 has a mounting surface 71 and pads 81 provided on the mounting surface 71. The sensor 67 has a package 121 and lands 122 provided on the package 121 and electrically connected to the pads 81 via solder 125. The mounting surface 71 has a surface area 91 and a recessed area 92 that is recessed from the surface area 91 and on which the pads 81 are provided. In the direction along the surface area 91, the edge of the surface area 91 that connects to the recessed area 92 (the second edge 77e) is spaced apart from the package 121. Therefore, a gap G1 is provided between the second edge 77e and the package 121 that communicates with the space S1 between the mounting surface 71 and the package 121. The gap G1 allows a cleaning liquid C to flow through to clean the space S1, and prevents substances that could contaminate the HDD 10, such as flux, from remaining in the space S1. Therefore, the HDD 10 of this embodiment can suppress contamination of the HDD 10, and consequently, it can suppress substances that can contaminate the HDD 10 from causing malfunctions such as head crashes.

[0116] The FPC 18 has a base layer 75 on which a pad 81 is provided, and a cover layer 77 that covers the base layer 75. The cover layer 77 has a surface area 91. The cover layer 77 is provided with an exposure hole 87 that penetrates the cover layer 77 and opens to the surface area 91, exposing the base layer 75 and the pad 81. The recessed area 92 has the inner surface 77c of the exposure hole 87. In the direction along the surface area 91, the edge of the surface area 91 (second edge 77e) connected to the inner surface 77c is spaced apart from the package 121. That is, the gap G1 between the second edge 77e and the package 121 is formed by forming the exposure hole 87 in the cover layer 77. Therefore, the HDD 10 of this embodiment can easily form a gap G1 through which cleaning fluid C can flow.

[0117] (Second embodiment) A second embodiment will be described below with reference to Figure 7. In the following description of the embodiments, components having the same function as those already described will be denoted by the same reference numerals as those previously described, and their description may be omitted. Furthermore, multiple components denoted by the same reference numerals do not necessarily share all functions and properties, and may have different functions and properties depending on the embodiment.

[0118] Figure 7 is an exemplary cross-sectional view showing a portion of the second connection portion 62 near the sensor 67 according to the second embodiment. As shown in Figure 7, the HDD 10 of the second embodiment has an adhesive layer 200 instead of the adhesive layer 110. The adhesive layer 200 is the same as the adhesive layer 110 of the first embodiment, except as described below.

[0119] The adhesive layer 200 is provided with a through hole 201 instead of the through hole 111. The through hole 201 is a fourth through hole and an example of a through hole. The through hole 201 penetrates the adhesive layer 200 in approximately the Z direction.

[0120] In the direction along the upper surface 75a (XY plane), the through hole 201 is larger than the package 121 and larger than the exposed portion 87a of the exposed hole 87. In the direction along the upper surface 75a, the package 121 and the exposed portion 87a of the exposed hole 87 are located inside the edge 201a of the through hole 201.

[0121] In the direction along the upper surface 75a, the edge 201a of the through hole 201 is spaced apart from the package 121 and also spaced apart from the exposed portion 87a of the exposed hole 87. Note that the size of the through hole 201 is not limited to this example.

[0122] The HDD10 of the second embodiment has an FPC218 instead of an FPC18. The FPC218 is the same as the FPC18 of the first embodiment, except as described below. The FPC218 has a first portion 218a and a second portion 218b.

[0123] The first portion 218a is a part of the FPC 218 bonded to the reinforcing plate 68 by the adhesive layer 200. The second portion 218b is a part of the FPC 218 that overlaps the through hole 201 in the Z direction. Each of the first portion 218a and the second portion 218b has a base layer 75, a conductive layer 76, and a cover layer 77.

[0124] The first portion 218a extends substantially flat along the reinforcing plate 68. The first portion 218a has a surface area 91 of the mounting surface 71. The surface area 91 has the upper surface 77b of the cover layer 77. The first portion 218a may have irregularities or be bent.

[0125] The second portion 218b is bent so as to contact the reinforcing plate 68 through the through hole 201. As a result, the lower surface 75b of the base layer 75 of the second portion 218b contacts the reinforcing plate 68. The second portion 218b is recessed from the upper surface 77b of the cover layer 77 of the first portion 218a. As a result, the second portion 218b has a recessed area 92 on the mounting surface 71.

[0126] In the second portion 218b, an exposed hole 87 is provided in the cover layer 77. The recessed region 92 of the second portion 218b has the upper surface 75a of the base layer 75 facing the package 121, and a pad 131 is provided on the upper surface 75a. In addition, a through hole 95 opening to the upper surface 75a is provided in the second portion 218b.

[0127] The through-hole 95 communicates directly with the through-hole 101 of the reinforcing plate 68. Therefore, the space S3 provided between the upper surface 75a and the package 121 in the second embodiment communicates with the outside of the FPC 218 through the through-holes 95 and 101. The through-hole 95 may also communicate with the through-hole 101 via other holes or spaces.

[0128] In the second portion 218b, the base layer 75, the conductive layer 76, and the cover layer 77 are all bent in a recessed manner from the first portion 218a. Therefore, the recessed region 92 in the second embodiment includes not only the upper surface 75a of the base layer 75 and the inner surface 77c of the cover layer 77, but also the upper surface 77b of the cover layer 77.

[0129] In the second embodiment, the edge 91a of the surface region 91 connected to the recessed region 92 is provided on the upper surface 77b of the cover layer 77. In the direction along the surface region 91 (XY plane), the edge 91a of the surface region 91 connected to the recessed region 92 is spaced apart from the package 121.

[0130] In the second embodiment, the land 122 is electrically connected to the pad 81 of the FPC 218 via solder 225 instead of solder 125. In the Z direction, the length (height) of solder 225 in the second embodiment is longer than the length (height) of solder 125 in the first embodiment.

[0131] Solder 225 is supplied to the pad 81, for example, by printing using a metal mask. The metal mask is generally formed to be substantially flat. Therefore, when the metal mask is placed on the first portion 218a of the FPC 218, it is spaced apart from the recessed second portion 218b. As a result, the holes in the metal mask are extended substantially in proportion to the depth to which the second portion 218b is recessed.

[0132] The amount of solder 225 supplied to the holes in the metal mask increases in proportion to the depth to which the second portion 218b is recessed. Therefore, the height of the solder 225 exceeds the height of the solder 125 in the first embodiment. Note that the solder 225 is not limited to this example.

[0133] Because the height of the solder 225 is extended, the distance between the upper surface 75a of the base layer 75 and the package 121 in the second embodiment is longer than the distance in the first embodiment. Therefore, the space S3 provided between the upper surface 75a and the package 121 is larger than the space S1 in the first embodiment.

[0134] When the FPC218 of the second embodiment is cleaned, the cleaning fluid C flows into the space S3 through the through holes 95 and 101. The cleaning fluid C can also be discharged from the space S3 to the outside of the FPC218 through the through holes 95 and 101.

[0135] The cleaning fluid C flows into space S3 through the gap G3 between the edge 91a of the surface region 91 connected to the recessed region 92 and the package 121. The cleaning fluid C can also be discharged from space S3 to the outside of the FPC 218 through the gap G3.

[0136] In the HDD 10 of the second embodiment described above, the adhesive layer 200 adheres the FPC 218 and the reinforcing plate 68 to each other. The adhesive layer 200 is provided with through holes 201 that penetrate through the adhesive layer 200. The FPC 218 has a first portion 218a that is adhered to the reinforcing plate 68 by the adhesive layer 200, and a second portion 218b that is bent to contact the reinforcing plate 68 through the through holes 201. That is, the second portion 218b is bent so as to be recessed from the first portion 218a. The second portion 218b has an upper surface 75a and is provided with through holes 95 and a pad 81. Solder 225 connecting the pad 81 and the land 122 is formed, for example, by printing using a metal mask. The metal mask is placed on the first portion 218a of the FPC 218 that is not recessed. Therefore, compared to the case where the second portion 218b is not recessed, the amount of solder 225 printed on the pad 81 of the recessed second portion 218b is greater. Because a large amount of solder 225 is provided between the pad 81 and the land 122, the space S3 between the top surface 75a and the package 121 becomes larger (higher). Accordingly, the HDD 10 of this embodiment makes it easier for the cleaning fluid C to flow into the space S3 between the top surface 75a and the package 121 from the side, and it is possible to suppress the retention of substances that can contaminate the HDD 10, such as flux, in the space S3. In addition, since the space S3 communicates with the outside through two or more paths, it is possible to suppress the stagnation of the cleaning fluid C in the space S3.

[0137] The reinforcing plate 68 has higher rigidity than the FPC 218 and is attached to the FPC 218. The adhesive layer 200 adheres the FPC 218 and the reinforcing plate 68 to each other. The adhesive layer 200 is provided with through holes 201 that penetrate through the adhesive layer 200. The FPC 218 has a first portion 218a that is bonded to the reinforcing plate 68 by the adhesive layer 200, and a second portion 218b that is bent to contact the reinforcing plate 68 through the through holes 201. The first portion 218a has a surface area 91. The second portion 218b has a recessed area 92. That is, the gap G3 between the edge 91a of the surface area 91 connected to the recessed area 92 and the package 121 is formed by providing through holes 201 in the adhesive layer 200 and forming the bent second portion 218b in the FPC 218. Therefore, the HDD 10 of this embodiment can easily form a gap G3 between the edge 91a of the surface region 91 connected to the recessed region 92 and the package 121.

[0138] (Third embodiment) A third embodiment will be described below with reference to Figures 8 to 10. Figure 8 is an exemplary plan view showing a portion of the second connection portion 301 near the relay connector 302 according to the third embodiment. Figure 9 is an exemplary cross-sectional view showing a portion of the second connection portion 301 of the third embodiment along the line F9-F9 in Figure 8.

[0139] As shown in Figure 8, the HDD 10 of the third embodiment has a second connection part 301 instead of a second connection part 62, and a relay connector 302 instead of a relay connector 66. Except as described below, the second connection part 301 is the same as the second connection part 62, and the relay connector 302 is the same as the relay connector 66.

[0140] In the second connection section 301, the FPC 18 further has a plurality of pads 311. The plurality of pads 311 are arranged in two rows in the X direction together with the plurality of pads 131. The pads 311 are located at both ends of the row containing the plurality of pads 131, 311. Note that the pads 311 are not limited to this example.

[0141] The pads 311 are contained within the conductive layer 76. Therefore, multiple pads 311 are provided on the upper surface 75a of the base layer 75. The upper surface 75a is an example of the surface of the first layer. The pads 311 may or may not be electrically connected to other pads, electronic components, or ground via wiring.

[0142] Each of the multiple pads 131, 311 is formed in a roughly rectangular shape extending in the Y direction. Therefore, the length of pad 311 in the Y direction is longer than the length of pad 311 in the X direction. Note that the shape of pads 131, 311 is not limited to this example.

[0143] Each of the multiple pads 311 has four edges 311a, 311b, 311c, and 311d. Edge 311a is an example of the edge of the pad in a first direction. Edge 311b is an example of the edge of the pad in a second direction.

[0144] The edge 311a is the edge of the pad 311 in the direction toward the center of the relay connector 302 in the Y direction (hereinafter referred to as the inward direction). The inward direction is the direction along the upper surface 75a and is an example of the first direction. For the pad 311 shown in Figure 9, the +Y direction is the inward direction.

[0145] Edge 311b is the edge of the pad 311 in the opposite direction to the inward direction (hereinafter referred to as the outward direction). The outward direction is the direction along the upper surface 75a and is an example of a second direction. For the pad 311 shown in Figure 9, the -Y direction is the outward direction. As shown in Figure 8, edges 311a and 311b extend approximately in the X direction.

[0146] Edge 311c is the edge of pad 311 in the +X direction. Edge 311d is the edge of pad 311 in the -X direction. Edges 311c and 311d extend approximately in the Y direction between edge 311a and edge 311b.

[0147] In the second connection portion 301, a plurality of exposed holes 320 are provided in the cover layer 77. The exposed holes 320 are examples of exposed holes and fifth through holes. As shown in Figure 9, the exposed holes 320 penetrate the cover layer 77 in approximately the Z direction and open to the lower surface 77a and the upper surface 77b.

[0148] The number of multiple exposure holes 320 is equal to the number of multiple pads 311. Each of the multiple exposure holes 320 partially exposes the upper surface 75a of the base layer 75 and one of the multiple pads 311. Note that the number of exposure holes 320 is not limited to this example.

[0149] The cover layer 77 further has an inner surface 321 which is the inner surface of the exposed hole 320. The inner surface 321 extends between the lower surface 77a and the upper surface 77b of the cover layer 77. Since the lower surface 77a is bonded to the upper surface 75a of the base layer 75, the inner surface 321 extends between the upper surface 75a of the base layer 75 and the upper surface 77b of the cover layer 77.

[0150] The exposed hole 320 does not cover, but exposes, the edge 311a, a portion of the edge 311c, and a portion of the edge 311d of the pad 311. In other words, the inner surface 321 of the exposed hole 320 is spaced apart from the edge 311a.

[0151] The cover layer 77 covers the edge 311b of the pad 311, the rest of the edge 311c, and the rest of the edge 311d. The edges 311b, 311c, and 311d may be exposed, for example, by an exposure hole 320.

[0152] As shown in Figure 8, the side 151b of case 151 includes two side 331 and two side 332. The two side 331 are located at both ends of case 151 in the Y direction. The lead wires 152 are located on side 331. The two side 332 are located at both ends of case 151 in the X direction.

[0153] Figure 10 is an exemplary bottom view showing a relay connector 302 of a third embodiment. As shown in Figure 10, the case 151 is provided with a plurality of notches 335. Each of the plurality of notches 335 opens to one of two corresponding sides 332, one of two corresponding sides 331, and the bottom surface 151a.

[0154] Case 151 further has a bottom surface 335a and an inner surface 335b of the notch 335. The bottom surface 335a is oriented approximately in the -Z direction. The inner surface 335b is oriented in a direction intersecting the direction of the bottom surface 335a.

[0155] Case 151 further has a plurality of retaining protrusions 336, 337. Retaining protrusions 336 protrude from the bottom surface 335a in approximately the -Z direction at a position spaced apart from the inner surface 335b. Retaining protrusions 337 protrude from the inner surface 335b at a position spaced apart from the bottom surface 335a in the -Z direction.

[0156] As shown in Figure 8, the intermediate connector 302 further has a plurality of lead wires 340. The lead wires 340 are an example of metal materials. The lead wires 152 and 340 of the intermediate connector 302 are made of metal.

[0157] Lead wire 152 electrically connects pad 131 to a connector provided on the bottom wall 25 or to a relay connector 53 on PCB 19. Lead wire 340 may electrically connect pad 311 to other components. Alternatively, lead wire 340 may be a reinforcing pin that is not electrically connected to the component to which relay connector 302 is connected.

[0158] As shown in Figure 10, the multiple lead wires 340 are fitted into the notches 335 of the case 151 and attached to the case 151. Note that a portion of the lead wires 340 may be embedded in the case 151. A portion of the multiple lead wires 340 protrudes from the side surface 331 of the case 151. In other words, the multiple lead wires 340 are provided on the side surface 331. Each of the multiple lead wires 340 has a joint portion 341, a separated portion 342, and an intermediate portion 343. The joint portion 341, the separated portion 342, and the intermediate portion 343 are formed integrally.

[0159] As shown in Figure 9, the joint 341 extends approximately in the Y direction. At least a portion of the joint 341 is located outside the notch 335. The joint 341 is joined to the pad 311 of the FPC 18 via solder 345.

[0160] The separated portion 342 is housed in the notch 335 and attached to the case 151. Therefore, the separated portion 342 is provided between the joint portion 341 and the case 151. The separated portion 342 may also be located outside the notch 335.

[0161] The separated portion 342 is spaced inward from the joint portion 341 in the direction along the upper surface 75a. Furthermore, the separated portion 342 is spaced further from the upper surface 75a than the joint portion 341 in the Z direction. The Z direction is perpendicular to the upper surface 75a.

[0162] The intermediate portion 343 is provided between the joint portion 341 and the separation portion 342. The intermediate portion 343 extends diagonally with respect to the upper surface 75a between the end of the joint portion 341 in the inward direction and the end of the separation portion 342 in the outward direction. The intermediate portion 343 extends away from the upper surface 75a as it approaches the separation portion 342 from the joint portion 341.

[0163] The inner surface 321 of the exposed hole 320 is spaced apart from the end of the intermediate portion 343 in the inward direction. For example, the inner surface 321 has an edge 321a. The edge 321a is provided, for example, at the end of the inner surface 321 in the inward direction and extends substantially in the X direction. The edge 321a of the inner surface 321 and the edge 311a of the pad 311 face each other.

[0164] The edge 321a of the inner surface 321 is spaced inward from the edge 311a of the pad 311. Furthermore, in the Y direction, the edge 321a is spaced inward from the intermediate portion 343. The spaced portion 342 covers at least a portion of the edge 321a. In other words, in the Y direction, the edge 321a is located between the two ends of the spaced portion 342 in the Y direction. The intermediate portion 343 may also cover a portion of the edge 321a. At least a portion of the edge 321a of the inner surface 321 is covered by the case 151. In other words, at least a portion of the edge 321a is located between the top surface 75a and the case 151.

[0165] As shown in Figure 10, a portion of the joint 341, a portion of the separated portion 342, and the intermediate portion 343 are located between the inner surface 335b of the notch 335 and the retaining projection 336. Furthermore, the separated portion 342 is located between the bottom surface 335a of the notch 335 and the retaining projection 337. As a result, the retaining projections 336 and 337 hold the lead wire 340.

[0166] As shown in Figure 9, a space S4 is provided between the separated portion 342 and the upper surface 77b of the cover layer 77. Space S4 is part of the notch 335 and opens to the side surface 332 of the case 151. Furthermore, a space S5 is provided between the separated portion 342 and the intermediate portion 343 and the upper surface 75a of the base layer 75 exposed to the exposed hole 320.

[0167] Space S4 communicates with spaces S2 and S5. Therefore, space S5 communicates with space S2 and through holes 141, 142, and 143 via space S4. Furthermore, space S5 communicates with the side surface 332 of case 151 via space S4.

[0168] The following is an example of a method for mounting the relay connector 302 to the FPC 18. Note that the method for mounting the relay connector 302 to the FPC 18 is not limited to the method described below, and other methods may be used. First, solder paste (solder 155, 345) is supplied to the pads 131, 311, for example, by printing or coating.

[0169] Next, the intermediate connector 302 is mounted on pads 131 and 311. Then, the FPC 18 is heated in a reflow oven and the solder paste melts. This connects the lead wires 152 and 340 of the intermediate connector 302 to pads 131 and 311. At this time, flux mixed with or separately supplied to the solder 155 and 345 may leak out from the solder 155 and 345.

[0170] Next, the FPC18 is cleaned, for example, by ultrasonic cleaning. For example, the FPC18 is placed in a tank filled with cleaning solution C. The cleaning solution C flows into space S5 through through holes 141, 142, 143, space S2, and space S4. Alternatively, the cleaning solution C may flow into space S5 through space S4 which opens on the side surface 332. The cleaning solution C can be discharged from space S5 to the outside of the FPC18 through space S4.

[0171] The cleaning solution C flows into spaces S4 and S5 and is discharged from spaces S4 and S5. In other words, the cleaning solution C flows through spaces S4 and S5. As a result, the cleaning solution C can remove any substances present in spaces S4 and S5 that could contaminate the HDD 10.

[0172] As shown in Figure 10, a dead end DE is provided between the FPC 18 and the relay connector 302. The dead end DE includes a part of space S4 and space S5. The dead end DE is surrounded by the FPC 18, the inner surface 335b of the notch 335, the retaining projection 336, the retaining projection 337, the joint 341, the separated portion 342, and the intermediate portion 343, and is open only in a substantially inward direction. For this reason, the cleaning fluid C may have difficulty flowing into the dead end DE and may have difficulty flowing out of the dead end DE.

[0173] In this embodiment, the inner surface 321 of the exposed hole 320 is spaced apart from the edge 311a of the pad 311. As a result, the exposed hole 320 is set to be large at the dead end DE, and consequently, a large area of ​​the upper surface 75a of the base layer 75 is exposed by the exposed hole 320.

[0174] By setting the exposed hole 320 to be large at the dead end DE, for example, the dimensions of the dead end DE in the Z direction become larger. Specifically, the distance between the separated portion 342 and the intermediate portion 343 and the FPC 18 becomes longer. As a result, the cleaning fluid C can easily flow into the dead end DE and easily flow out of the dead end DE.

[0175] Once ultrasonic cleaning is complete, the FPC18 is removed from the cleaning solution C. At this time, the cleaning solution C in space S5, along with the flux, is discharged through space S4. With this, the mounting of the relay connector 302 to the FPC18 is completed.

[0176] In the HDD 10 of the third embodiment described above, the FPC 18 has a base layer 75 including an upper surface 75a, a cover layer 77 covering the upper surface 75a, and a pad 311 provided on the upper surface 75a. The relay connector 302 has a case 151 and lead wires 340 provided on the case 151. The cover layer 77 is provided with an exposure hole 320 that penetrates the cover layer 77 and exposes the upper surface 75a and the pad 311. The cover layer 77 has an upper surface 77b through which the exposure hole 320 opens, and an inner surface 321 of the exposure hole 320 that extends between the upper surface 75a and the upper surface 77b. The lead wires 340 have a joint portion 341 and a separated portion 342. The joint portion 341 is joined to the pad 311 via solder 345. The separated portion 342 is provided between the joint portion 341 and the case 151, and in the direction along the upper surface 75a, it is separated from the joint portion 341 in the inward direction along the upper surface 75a, and in the Z direction perpendicular to the upper surface 75a, it is separated from the upper surface 75a more than the joint portion 341. The inner surface 321 is separated from the edge 311a of the pad 311 in the inward direction. That is, the upper surface 75a is exposed between the edge 311a of the pad 311 in the inward direction and the inner surface 321 without being covered by the cover layer 77. Therefore, a space S5 through which the cleaning liquid C can flow can be formed between the edge 311a of the pad 311 in the inward direction and the inner surface 321, and between the separated portion 342 and the upper surface 75a. In other words, the spaces S4, S5 between the separated portion 342 and the FPC 18 are set to be large, and the cleaning liquid C can easily flow through these spaces S4, S5. Therefore, the HDD 10 of this embodiment can suppress the retention of substances that can contaminate the HDD 10, such as flux, in the spaces S4 and S5 between the separated portion 342 and the FPC 18, and consequently, it can suppress the occurrence of such contaminating substances causing malfunctions such as head crashes.

[0177] The lead wire 340 is provided between the joint portion 341 and the separated portion 342 and has an intermediate portion 343 that extends diagonally with respect to the upper surface 75a. The inner surface 321 is spaced apart from the end of the intermediate portion 343 in the inward direction. As a result, the spaces S4 and S5 between the intermediate portion 343 and the FPC 18 are made large, and the cleaning fluid C can easily flow through these spaces S4 and S5. Therefore, the HDD 10 of this embodiment can suppress the remaining of substances that can contaminate the HDD 10 in the spaces S4 and S5 between the intermediate portion 343 and the FPC 18, and consequently, it can suppress the occurrence of such contaminating substances causing malfunctions such as head crashes.

[0178] At least a portion of the edge 321a of the inner surface 321 in the inward direction is located between the upper surface 75a and the case 151. In other words, at least a portion of the edge 321a of the exposed hole 320 in the inward direction is covered by the case 151. That is, the inward direction is the direction along the upper surface 75a, from the joint 341 toward the inside of the relay connector 302. The spaces S4 and S5 between the separated portion 342 and the FPC 18 are provided between the case 151 and the FPC 18. In this embodiment, the HDD 10 can have a large space S4 and S5 between the case 151 and the FPC 18, which can suppress the retention of substances that could contaminate the HDD 10 in the spaces S4 and S5 between the separated portion 342 and the FPC 18.

[0179] The edge 311b of the pad 311 in the outward direction, opposite to the inward direction, is covered by the cover layer 77. This prevents solder from adhering to the wiring, for example, if the edge 311b of the pad 311 in the outward direction is connected to the wiring.

[0180] In the above description, suppression is defined, for example, as preventing the occurrence of an event, action, or effect, or reducing the degree of an event, action, or effect. Also in the above description, restriction is defined, for example, as preventing movement or rotation, or allowing movement or rotation within a predetermined range while preventing movement or rotation beyond that predetermined range.

[0181] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0182] 10...Hard disk drive (HDD), 12...Magnetic disk, 14...Magnetic head, 18...Flexible printed circuit board (FPC), 66...Intermediate connector, 67...Sensor, 68...Reinforcement plate, 71...Mounting surface, 72...Back, 75...Base layer, 75a...Top surface, 76...Conductive layer, 77...Cover layer, 77b...Top surface, 77c...Inner surface, 77d...First edge, 77e...Second edge, 81...Pad, 87...Exposed hole, 87a...Exposed part, 87b...Extended part, 91...Surface area, 91a...Edge, 92...Recessed area, 95,101...Through hole, 121... Package, 122...land, 125...solder, 131...pad, 141,142...through hole, 151...case, 152...lead wire, 155...solder, 200...adhesive layer, 201...through hole, 218...flexible printed circuit board (FPC), 218a...first part, 218b...second part, 225...solder, 302...intermediate connector, 311...pad, 311a...edge, 320...exposed hole, 321...inner surface, 340...lead wire, 341...joint, 342...separated part, 343...intermediate part, 345...solder, S1,S2,S3...space.

Claims

1. Magnetic disks and A magnetic head configured to read and write information to the magnetic disk, A flexible printed circuit board electrically connected to the magnetic head, The electronic components mounted on the aforementioned flexible printed circuit board, It has higher rigidity than the aforementioned flexible printed circuit board, and the wall attached to the flexible printed circuit board, It is equipped with, The flexible printed circuit board has a first surface facing the electronic components through a gap, and a second surface located on the opposite side of the first surface and facing the wall, and is provided with a first through-hole that opens to the first surface and the second surface and communicates with the gap. The wall is provided with a second through-hole that penetrates the wall and communicates with the first through-hole. The flexible printed circuit board has a first layer including the first surface, a second layer covering the first surface, and a pad provided on the first surface. The aforementioned electronic component comprises a case and a metal member provided in the case. The second layer is provided with a fifth through-hole that penetrates the second layer and exposes the first surface and the pad, and has a third surface through which the fifth through-hole opens, and an inner surface of the fifth through-hole that extends between the first surface and the third surface. The metal member has a joint portion joined to the pad via solder, and a separated portion provided between the joint portion and the case, which is spaced apart from the joint portion in a first direction along the first surface, and spaced further apart from the first surface than the joint portion in a direction perpendicular to the first surface. The inner surface is spaced apart from the edge of the pad in the first direction. Disk drive.

2. The metal member is provided between the joint and the separation portion and has an intermediate portion that extends diagonally with respect to the first surface, The inner surface is spaced apart from the end of the intermediate portion in the first direction. The disk device according to claim 1.

3. The disk device according to claim 1 or 2, wherein at least a portion of the edge of the inner surface in the first direction is located between the first surface and the case.

4. The disk device according to claim 1, wherein the edge of the pad in a second direction opposite to the first direction is covered by the second layer.

5. Magnetic disks and A magnetic head configured to read and write information to the magnetic disk, A flexible printed circuit board having a first layer, a pad provided on the surface of the first layer, and a second layer covering the surface, with an exposure hole provided that penetrates the second layer to expose the surface and the pad, and electrically connected to the magnetic head, The flexible printed circuit board has an electronic component and a case, a metal member provided in the case, and the flexible printed circuit board is mounted on the electronic component. It is equipped with, The metal member has a joint portion joined to the pad via solder, and a separated portion provided between the joint portion and the case, which is spaced apart from the joint portion in a first direction along the surface and spaced apart from the surface in a direction perpendicular to the surface than the joint portion. The inner surface of the exposed hole is spaced apart from the edge of the pad in the first direction. Disk drive.

6. The metal member is provided between the joint and the separated portion and has an intermediate portion that extends diagonally with respect to the surface, The inner surface is spaced apart from the end of the intermediate portion in the first direction. The disk device according to claim 5.

7. The disk device according to claim 5 or 6, wherein at least a portion of the edge of the inner surface in the first direction is located between the surface and the case.

8. The disk device of claim 5, wherein the edge of the pad in a second direction opposite to the first direction is covered by the second layer.

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