Locking frame holder and workpiece loader for wet chemical semiconductor processing

Abstract

To provide a workpiece holder and a device for loading workpieces onto the holder for use in wet chemical semiconductor processing. [Solution] The workpiece holder includes two perimeter seal plates, an electrical contact insert, and a locking plate. When the locking plate is in the locked position, the perimeter seal plates provide force for both fluid sealing and electrical contact. The locking plate also functions as an electrical bus, supplying current to the electrical contact insert. The workpiece loader includes a stage for inserting or removing a workpiece from the workpiece holder. The loader also includes a vacuum chuck that positions the perimeter seal plates before loading and compresses the perimeter seal plates during locking and unlocking.

Description

Technical Field

[0001] The present invention relates to methods and systems for wet chemical semiconductor processing such as cleaning, etching, and electroplating of semiconductor substrates for advanced packaging or high-density interconnect applications. More specifically, the present invention relates to systems and methods for transporting and protecting workpieces, such as rectangular substrates, for use in wet chemical processes including electrochemical deposition.

Background Art

[0002] Electrochemical deposition is used as a manufacturing technique for applying thin films to semiconductor substrates including semiconductor wafers and rectangular panels. The film can include copper, tin, nickel, cobalt iron, indium, and other metals. During electrochemical deposition, an electric current flows from an anode through a plating bath to a cathode. When the substrate is used as the cathode, a metal can be deposited thereon.

[0003] Advanced packaging involves interconnecting components before applying conventional integrated circuit packaging processes. Advanced packaging enables multiple devices to be combined and packaged as a single electronic device. Rectangular substrate panels are a type of advanced packaging substrate, which provides manufacturing and cost advantages and enables large and complex systems to be built on the panel substrate. Rectangular substrate panels are typically manufactured as organic laminates consisting of an epoxy composite matrix, i.e., a glass fiber reinforcement of the same composition as a printed circuit board.

[0004] High-purity glass can also be used as the base material for rectangular panel substrates, which offers significant advantages over organic laminates. These advantages include dimensional stability and a similar thermal expansion coefficient to silicon, both of which are important for heterogeneous integration applications. Direct bonding of the die to the glass improves thermal performance compared to organic laminates. Using pure glass as the panel substrate also allows for the use of electroplating to fill through-glass vias.

[0005] Workpiece holders are used to transport substrates through wet processing tools. When used with electroplating tools, workpiece holders also provide electrical contact during electroplating. Electrical contact with the workpiece or substrate typically occurs on the edge region where the metal contacts of the holder are in physical contact with the metal seed layer on the workpiece surface. To make contact with the seed layer, the contacts may need to align with openings in the patterned photoresist.

[0006] This contact area needs to be kept dry to avoid metal buildup on the contacts and deplating of the seed due to the formation of localized galvanic cells. Therefore, a key function of the holder is to seal the contact area and prevent the electroplating solution from wetting the electrical contacts and seed layer.

[0007] Workpiece holders for wet processing steps, such as chemical etching, photoresist stripping, and cleaning, must provide secure support for the substrate, typically in a vertical orientation in wet chemical process modules, with minimal physical contact to the workpiece, so that the chemical deposition or removal process is not obstructed by the workpiece holder surface that holds the substrate in place.

[0008] Holders for wet semiconductor processing of rectangular workpieces can contact and / or restrain two, three, or four edges of the workpiece, and in vertical processing, contact is typically on both the front and back surfaces of the workpiece. In some applications, a complete perimeter seal is advantageous because it prevents the plating bath from coming into contact with the edges of the workpiece, which could lead to undesirable areas of plating.

[0009] Figure 1 schematically shows a known electroplating tool 50 that can utilize the frame holder and loader / unloader apparatus of the present invention. The electroplating tool 50 is described in Patent Document 1, which is incorporated herein by reference. The electroplating tool 50 includes an input / output module 51, a loader / unloader module 52, a workpiece holder storage module 53, process modules 54-58, a proximity patterning shield storage module 59, a transporter support area 65, a maintenance support area 66, an electrical and chemical systems area 67, and a workpiece holder cleaning module 68. The tool 50 is a single-ended tool, in which unprocessed workpieces are introduced into the tool and processed workpieces are removed from the tool at the same input / output front-end module 51. The input / output front-end module 51 includes one or more front-opening unified pods (FOUPs) and an equipment front-end module (EFEM) robot for transporting workpieces between the input / output module 51 and the loader / unloader module 52.

[0010] Figure 1 shows five process modules 54-58, but the tool 50 can have any number of process modules, such as the number of different metals to be electroplated, the number of pre- and post-plating processes, and the number of duplicate modules used in parallel to increase tool throughput, depending on the exact process to be performed.

[0011] The workpiece holder storage module 53 is used to store workpiece holders when they are not in use. A local transporter (not shown) transports the workpiece holders from the storage area 53 to the loader / unloader 52 to initiate these operations. The transporter support area 65 provides mechanical, electrical, and fluid support to two or more transporters extending into the loader / unloader 52, process modules 54-58, and the CPS storage area 59. The electrical and chemical systems area 67 houses the power distribution and fluid handling systems for all other modules. The maintenance support area 66 allows support personnel access to the equipment in the electrical and chemical systems area 67 and to all electrical and fluid connections within process modules 54-58. The workpiece holder cleaning module 68 includes equipment for cleaning workpiece holders when they are not in use to process workpieces.

[0012] The processing flow for an unprocessed workpiece in tool 50 begins with a front-end loading robot (not shown) transporting it from the input / output module 51 to the loader / unloader module 52, where the workpiece 60 (not shown) is loaded into the workpiece holder. The loaded workpiece holder is then transported using a transport mechanism to a series of pre-processing modules 54-55 for wet processing steps such as pre-cleaning, pre-rinsing, and chemical activation. The loaded workpiece holder is then transported to either process module 56 or 57 for electroplating. After electroplating, the loaded workpiece holder 100 is transported to process module 58 for further processing steps such as final rinsing and drying. Following the final rinsing and drying, the loaded workpiece holder is transported to the loader / unloader module 52, where the workpiece is unloaded from the workpiece holder. The processed workpieces are then transferred to the input / output module 51 and stored in a FOUP (not shown) until all workpieces in the current batch have been processed.

[0013] Known workpiece holders with perimeter sealing have various limitations that are addressed by the present invention. The front frame of such known four-sided frame holders may be too thick, making it impossible to position either an electric field homogeneity shield or a fluid stirring plate close enough to the workpiece. Proximity-placed shields, including a pattern of apertures corresponding to target positions on the workpiece, as described in Patent Document 2, are used in electroplating to improve the homogeneity of plated features on the workpiece. Stirring plates are used to increase the plating, stripping, or etching rate by uniformly increasing the transport of processing chemical components to the workpiece surface. Both proximity-placed shields and stirring plates need to be placed within a few millimeters of the workpiece, which has not been possible using known four-sided frame holders. [Prior art documents] [Patent Documents]

[0014] [Patent Document 1] U.S. Patent No. 11,887,874 [Patent Document 2] U.S. Patent No. 11,608,563 [Patent Document 3] U.S. Patent No. 11,942,341 [Overview of the project] [Problems that the invention aims to solve]

[0015] There is a need for a compact workpiece holder that allows processing of both sides of a workpiece while enabling the placement of shields or stirring plates near both sides of the workpiece. There is a need for such a workpiece holder having a reliable internal locking mechanism without relying on external equipment such as vacuum clamping, and for such a holder that independently sets the sealing and electrical contact forces between the holder and the workpiece. [Means for solving the problem]

[0016] According to a first aspect of the present invention, a workpiece holder is provided for holding a substantially flat, quadrilateral workpiece in a processing chamber of a wet semiconductor processing system, the workpiece holder is adapted to be inserted into and removed from the processing chamber while holding the workpiece, The workpiece holder is Support frame and A first and second periphery sealing plate attached to a support frame, wherein each of the first and second periphery sealing plates is provided with individual interlocking features attached to each, A locking plate is movable relative to a support frame between a locked configuration in which the locking plate engages with interlocking features of both first and second perimeter sealing plates, and an open configuration in which the locking is disengaged, wherein in the open configuration, the first and second perimeter sealing plates can be sufficiently separated to allow a workpiece to be inserted between them, and in the locked configuration, the workpiece is clamped to the support frame, Includes, Each of the first and second periphery sealing plates includes a deflection that is biased to provide a sealing force to the workpiece when the locking plate is in a locked configuration.

[0017] According to a second aspect of the present invention, a semiconductor processing system is provided for processing a substantially flat, quadrilateral workpiece while it is loaded into the workpiece holder of the first aspect, the system is A processing chamber for wet chemical etching, cleaning or electrodeposition, A workpiece loader for loading workpieces into the workpiece holder during the loading operation, Includes.

[0018] Other specific aspects and features of the present invention are defined in the appended claims.

[0019] Next, the present invention will be described with reference to the accompanying drawings (not to scale).

Brief Description of the Drawings

[0020] [Figure 1] Schematically shows a known electrochemical deposition tool. [Figure 2] Schematically shows the workpiece holder and the workpiece from the front. [Figure 3] Schematically shows the details of the workpiece holder from the front. [Figure 4] Schematically shows the details of the workpiece holder from the front. [Figure 5] Schematically shows the details of the workpiece holder locking assembly from the front. [Figure 6A] Schematically shows the details of the workpiece holder locking plate from the front. [Figure 6B] Schematically shows the details of the workpiece holder locking plate from the front. [Figure 7A] Schematically shows a cross-section of the workpiece holder in the clamping position from the side. [Figure 7B] Schematically shows the workpiece holder in the clamping position in an isometric view. [Figure 8] Schematically shows a part of the workpiece holder and the flexible peripheral sealing plate in an isometric view. [Figure 9A] Schematically shows a part of the workpiece holder locking plate and the locking assembly in an unlocked configuration from the front. [Figure 9B] Schematically shows a part of the workpiece holder locking plate and the locking assembly in a locked configuration from the front. [Figure 10A] Schematically shows a part of the workpiece holder locking plate and the locking assembly in an unlocked configuration from the front. [Figure 10B]The front view schematically shows a portion of the workpiece holder locking plate and the locking assembly in their locked configuration. [Figure 11] The loading system for the workpiece holder is schematically shown in an isometric view. [Figure 12] The cross-section of the loading system is schematically shown in an isometric view. [Figure 13] An isometric view schematically shows a part of the loading system. [Figure 14] An isometric view schematically shows a part of the loading system. [Modes for carrying out the invention]

[0021] For consistency and clarity, similar reference figures are retained for similar parts throughout the following description. Figures 2–4 are shown with a nominal Cartesian axis Z fixed to the workpiece and indicating the vertical direction. In the following description, the term “workpiece” refers to any item suitable for wet chemical semiconductor processing, including semiconductor wafers, substrates, and panels, as is commonly known in the art.

[0022] Figure 2 shows a workpiece holder 100, which can be used with an electrochemical deposition tool such as the one shown in Figure 1. The workpiece holder 100 includes a central support frame 110 with an extension 111, first and second periphery sealing plates 150, 150' (only the foremost sealing plate 150 is visible in Figure 2, which will hereafter be referred to as the “front periphery sealing plate” or “front PSP”), and a transport handle 170 attached to the extension 111. The workpiece 60 is shown in the tightened position after being loaded into the workpiece holder 100 by the loader / unloader module 52. The transport handle 170 is adapted to be used to pick up the workpiece holder 100 from the loader / unloader module 52 by an overhead transporter and transport it to pre-processing modules 54 and 55, and subsequently to at least one process module 56-58, and then return it to the loader / unloader module 52 for unloading. Each periphery sealing plate 150 is substantially rectangular and covers the outer periphery of the workpiece 60, while having a window formed in its central region to allow chemical access to the workpiece 60 in use.

[0023] The perimeter seal plates 150, 150' and the central support frame 110, extension 111, and transport handle 170 can be manufactured from stainless steel overmolded and / or coated with, for example, FKM material, a fluorinated polymer such as Viton (RTM), polytetrafluoroethylene, or ethylene chlorotrifluoroethylene. Alternatively, these components can be manufactured from a polymer such as polyetheretherketone. The perimeter seal plates 150, 150' are each manufactured as deflections of a shape, dimensions, and material selected to provide a known force when constrained in a closed, clamped position.

[0024] Figure 3 shows the workpiece holder 100, including internal details of the front perimeter sealing plate (PSP) 150. As shown, the front PSP 150 is detachably connected on each lateral side to an internal contact plate (ICP) 156, as well as top and bottom ICPs 156', an inner seal 152, and an outer seal 154, all of which are also detachably connected to the rear PSP 150', positioned between the front and rear PSPs 150, 150'. This configuration allows for four-sided electrical contact with the workpiece 60 via the ICPs 156, 156'. In an alternative embodiment (not shown) utilizing only two-sided electrical contact, the PSP 150 would include only the side ICPs 156, omitting the top and bottom ICPs 156'. In a preferred embodiment, the inner seal 152 and outer seal 154 are incorporated into the PSP 150 during polymer overmolding. In an alternative embodiment, the seals 152 and 154 may include removable and / or replaceable polymer O-rings.

[0025] Figure 4 shows the workpiece holder 100 with the foremost PSP 150 removed to reveal its internal features. These include a front locking assembly 120 and a locking plate 130. The locking plate 130 can slide vertically against the central support frame 110 in the direction indicated by the z-axis. A portion 130' of the locking plate 130 passes through the extension 111 and extends beyond the transport handle 170. The locking plate 130 can be manufactured from, for example, stainless steel or a conductor of another metal. When the workpiece holder 100 is inserted into the ECD process modules 56, 57, the contacts (not shown) are activated. When an external power supply (also not shown) is electrically connected to a portion 130' of the locking plate, the locking plate 130 can be used as an electrical bus.

[0026] Figure 5 shows a more detailed view of the locking assembly, which includes a front locking assembly 120 and a rear locking assembly 120'. In Figure 5, these are shown superimposed. The front and rear locking assemblies 120 and 120' are crenellated so that when the front PCP 150 and rear PCP 150' are in their clamping positions, they each include interlocking features including alternating side interlock features 121 and 121' and top and bottom interlock features 122 and 122' in the form of extensions / crenations that can slide across each other in a direction perpendicular to the vertical z-axis and perpendicular to the page plane. The width of the interlock extensions 121 and 121' is shown as "W" in Figure 5, and the gap between adjacent interlock extensions can be 2W, where W can range, for example, from 5 to 25 mm.

[0027] Figures 6A and 6B show details of the locking plate 130 at its top and bottom left corners, respectively. The locking plate 130 includes a main support 133 with a gapped side having lateral extension fingers / crenations 131, and top and bottom extensions 132. The lateral extension fingers 131 are repeating projections of sufficient width to allow sliding in a direction perpendicular to the page plane between the corresponding projections in the interlock extensions 121 and 121'. The top and bottom extensions 132 are formed as plates and have sufficient thickness to allow insertion between the top and bottom interlock extensions 122 and 122'. The width of each lateral extension finger 131 and the gap between adjacent lateral extension fingers 131 are indicated as 2W, and are sized to interlock together with the interlock extensions 121 and 121' shown in Figure 5.

[0028] Although the interlocking extensions 121, 121', 122, 122', and the projections of the locking plate extension fingers 131 are shown as being rectangular, the present invention is not limited in this way, and various shapes, such as triangular forms / projections, may be used, merely as examples.

[0029] Figures 7A and 7B show cross-sectional and isometric views of the workpiece holder 100, where its two perimeter sealing plates 150 ("front PSP") and 150' ("rear PSP") hold the workpiece 60 in a clamped position. In these figures, it can be seen that each of the front and rear PCPs 150 and 150' functions effectively as a leaf spring, with its inner edge, where the inner seal 152 is formed, biased toward the central surface of the workpiece holder 100 (i.e., the surface co-plane with the workpiece 60), but able to bend away from this surface. Each of the front PCP 150 and rear PCP 150' applies a clamping force to the workpiece holder 100 at its respective inner seal 152. Each of the front PCP 150 and rear PCP 150' also applies a sealing force to the central support frame 110 at its respective outer seal 154. The front and rear PCPs 150 and 150' compress ICP 156 to make electrical contact with the workpiece 60 at ICP contacts 158. The ICP 156 and ICP contacts 158 can be manufactured as an assembly welded to the PCPs 150 and 150'. Alternatively, they can be bolted to the PCPs 150 and 150', thereby making them removable. The locking plate 130 can make electrical contact with the ICP 156 and ICP contacts 158 using flexible straps (not shown). Locking plate extension fingers 131 extending from the locking plate 130 toward the center of the workpiece holder 100 are inserted into the locking assembly 120, and the locking plate 130 is positioned to secure the rear PCP 150' to the front PCP 150 in a locked, clamped position.

[0030] Figure 8 shows an isometric view of the side of the workpiece holder 100, where the rear PCP 150' is shown in an untightened, open configuration, while the front PCP 150 is omitted for clarity. The central support frame 110, the locking plate 130, and the locking plate extension fingers 131 are all visible. The inner seal 152, the outer seal 154, the locking assembly 120' and locking extension 121' of the rear PCP 150' are also shown. As pressure is applied to the PCP 150', as will be described in more detail below, the locking plate extension fingers 131 slide vertically between the corresponding interlock extensions 121' before tightening.

[0031] Figures 9A and 9B show the relative orientation of the left corner of the top of the locking plate 130, the front locking assembly 120, and the rear locking assembly 120' before and after locking, respectively. As shown in Figure 9A, before locking, the top extension 132 is oriented above the top interlock extensions 122 and 122' of the locking assembly, and the side interlock extensions 121 and 121' are oriented to slide beyond the side extension fingers 131. During locking, the locking plate 130 slides vertically downward, inserting the top extension 132 between the top extensions 122 and 122' and the side extension fingers 131 between the side interlock extensions 121' and 121.

[0032] Figures 10A and 10B show the relative orientation of the left corner of the bottom of the locking plate 130, the front locking assembly 120, and the rear locking assembly 120' before and after locking, respectively. As shown in Figure 10A, before locking, the bottom extension 132 is oriented so that it can slide above the bottom interlock extensions 122 and 122' of the locking assembly, and the side interlock extensions 121 and 121' can slide beyond the side extension fingers 131. During locking, the locking plate 130 slides vertically downward, inserting the bottom extension 132 between the bottom extensions 122 and 122' and the side extension fingers 131 between the side interlock extensions 121' and 121.

[0033] Figure 11 shows an isometric view of a workpiece loader 200 for use with a workpiece holder 100, including an upper frame 210, a lower frame 220, and a loader support frame 230. The workpiece loader 200 is shown in a first, horizontal configuration into which the workpiece holder 100 can be inserted. A quadrilateral and substantially flat workpiece 60 and an end effector 190 in position before the workpiece 60 is inserted into the workpiece holder 100 are also shown. At the start of the loading operation, the workpiece 60 can be aligned on the end effector 190 before insertion, and the features of the workpiece 60 are aligned with the workpiece holder 100 by an alignment system (not shown), particularly with respect to the features on the proximity patterning shield (not shown) when the workpiece holder 100 is inserted into the ECD process module 56, as described in Patent Document 3.

[0034] Figure 12 shows an isometric view of a workpiece loader 200 for use with a workpiece holder 100, with callout areas 201 and 202. Callout area 201 extends from a portion of the top of the workpiece holder 100. Callout area 202 extends from a portion of the bottom of the workpiece holder 100.

[0035] Figure 13 shows details of the callout region 201 from Figure 12. The upper frame 210 includes an upper vacuum chuck 211, shown gripping the rear PCP 150'. The lower frame 220 includes a lower vacuum chuck 221, shown gripping the front PCP 150. A loader support frame 230 can provide rigid support to the lower frame 220. Alternatively, the loader support frame 230 may include an actuated lift assembly (not shown) for vertically translating the lower frame 220.

[0036] Figure 14 provides details of the callout area 202 from Figure 12 to aid in the subsequent discussion of the loading operation. Before or during the loading operation, the upper frame 210 is raised upward by a mechanical or pneumatic assembly (not shown) so that the gap between the rear PCP 150' and the central support frame 110 is sufficient to allow the workpiece 60 and end effector 190 to pass through. During loading, the end effector 190 lowers, placing the workpiece 60 onto a vertical stage 222 supported on the lower frame 230. The end effector 190 then retracts. The stage 222 is then lowered by a mechanical or pneumatic assembly (not shown), thereby placing the workpiece 60 onto the rear PCP 150'. The upper support frame 210 is then lowered, compressing both the rear PCP 150' and the front PCP 150. The upper and lower vacuum chucks 211, 221 are configured to provide sufficient force to the front and rear PSPs 150, 150' so that the locking plate 130 can be inserted between the interlocking shapes 121, 121', 122, 122' of the PSPs 150, 150'. An actuation system including an actuator (not shown) then slides the locking plate 130 between the locking assemblies 120 and 120', thereby locking the workpiece holder 100 in this compressed state. The workpiece loader 200 can now be rotated by a rotary actuator (not shown) from this first substantially horizontal orientation to a second, substantially vertical orientation, allowing the overhead transporter to pick up the workpiece holder 100 and transport it to the preceding process module 54 and subsequent process modules. [Explanation of symbols]

[0037] 50 Electroplating Tools 51 Input / Output Modules 52 Loader / Unloader Modules 53 Workpiece holder storage module 54-58 Process Modules 59 Proximity Patterning Shield Storage Module 60 workpieces 65 Transporter support area 66 Maintenance support area 67 Electrical and Chemical Systems Area 68 Workpiece holder cleaning module 100 Workpiece Holders 110 Central support frame 111 Extension 120 Front Locking Assembly 120' Rear Locking Assembly 121, 121' Side interlock feature 122, 122' Top and bottom extensions / crelation 130 Locking Plates 130' Part of the locking plate 131 Side extension fingers 132 Top and bottom extensions 133 Primary supports 150 Front perimeter sealing plate 150' Rear Surround Sealing Plate 152 Inner seal 154 Outer seal 156 Side internal contact plate (ICP) 156' Top and bottom ICP 158 ICP contacts 170 Transport handle 190 End Effector 200 Workpiece Loader 210 Upper frame 211 Upper Vacuum Chuck 220 Lower frame 221 Lower vacuum chuck 222 stages 230 Loader Support Frame

Claims

1. A workpiece holder for holding a substantially flat, quadrilateral workpiece in a processing chamber of a wet or semiconductor processing system, wherein the workpiece holder is adapted to be inserted into and removed from the processing chamber while holding the workpiece. The aforementioned workpiece holder is Support frame and First and second perimeter sealing plates attached to the support frame, wherein each of the first and second perimeter sealing plates is provided with individual interlocking features attached to each, A locking plate, wherein the locking plate is movable relative to the support frame between a locked configuration in which the locking plate engages with the interlocking features of both the first and second periphery sealing plates, and an open configuration in which the locking is disengaged, wherein in the open configuration the first and second periphery sealing plates can be sufficiently separated to allow the workpiece to be inserted between them, and in the locked configuration the workpiece is fastened to the support frame by the locking plate, Includes, A workpiece holder in which each of the first and second periphery sealing plates includes a deflection that is biased to provide a sealing force to the workpiece when the locking plate is in the locked configuration.

2. It includes a plurality of internal contact plates positioned between the first and second peripheral sealing plates, The workpiece holder according to claim 1, wherein when the locking plate is in the locked configuration, the internal contact plate provides electrical contact to the workpiece.

3. The workpiece holder according to claim 2, wherein the locking plate is in electrical contact with the internal contact plate.

4. The workpiece holder according to claim 1, wherein the first and second periphery sealing plates are made of stainless steel coated with a fluorinated polymer selected from the group including FKM material, Viton (RTM), polytetrafluoroethylene, and ethylenechlorotrifluoroethylene.

5. The workpiece holder according to claim 1, wherein the first and second periphery sealing plates are manufactured from a polymer, the polymer optionally comprising polyetheretherketone.

6. The workpiece holder according to claim 2, wherein the internal contact plate is separable from the first and second periphery sealing plates.

7. A semiconductor processing system for processing a substantially flat, quadrilateral workpiece while it is loaded into a workpiece holder according to claim 1, wherein the system is A processing chamber for wet chemical etching, cleaning, or electrodeposition, A workpiece loader for loading the workpiece into the workpiece holder during the loading operation, A semiconductor processing system, including a semiconductor processing system.

8. The aforementioned workpiece loader is First and second zippers, End effectors and, An actuation system for sliding the locking plate between the locked and unlocked configurations, Includes, The first and second chucks are configured to grip the first and second peripheral sealing plates and to sufficiently separate the first and second peripheral sealing plates so that the end effector and the workpiece can be inserted into the workpiece holder. The first and second chucks are configured to provide sufficient force to the first and second peripheral sealing plates so that the locking plate can be inserted between the interlocking features. The semiconductor processing system according to claim 7.

9. The semiconductor processing system according to claim 9, wherein the workpiece loader includes an alignment system for aligning the workpiece with respect to the workpiece holder before inserting the workpiece into the workpiece holder.

10. The semiconductor processing system according to claim 9, wherein the workpiece loader includes a rotary actuator for rotating the workpiece holder between a substantially horizontal configuration and a substantially vertical configuration.

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