Horizontal plating production line

Abstract

We provide a horizontal plating production line. [Solution] The system includes a horizontal plating apparatus 100 and a circuit board supply apparatus 200. The horizontal plating apparatus includes a first machine frame 110, a plating cylinder 120 and a horizontal plating transport apparatus 130 provided on the first machine frame, the plating cylinder extends along a first direction, the horizontal plating transport apparatus is used to plate circuit boards by moving them within the plating cylinder, and the circuit board supply apparatus includes a second machine frame and a supply transport mechanism provided on the second machine frame, the supply transport mechanism being a transport line of a certain length, and is used to place circuit boards horizontally and transport them horizontally to the horizontal plating transport apparatus of the plating apparatus. In the entire transport process, robot operation is not required to maintain the circuit boards horizontally, the space occupied by the apparatus is smaller than that of conventional plating apparatuses, manufacturing costs are lower, and the system meets the demand for high-precision plating.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board plating, and particularly to a horizontal plating production line.

Background Art

[0002] Conventional plating of wiring boards, whether it is an auto line or a VCP, adopts the vertical plating method. In the plating process, the wiring board is vertically clamped by a jig and immersed in the chemical solution, and the wiring board is swung using a mechanism with a swinging function to flow the chemical solution into the interconnecting holes of the wiring board, and plating is formed under the conductive action of the chemical solution. Such a horizontal plating device with such a structure has a large occupied space, requires a robot to supply and discharge materials, has a high manufacturing cost, and moreover, the accuracy of the substrate is low and it cannot meet the demand for high-precision plating.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The main object of the present invention is to propose a horizontal plating production line in order to solve the problems of high manufacturing cost and poor plating accuracy of conventional plating devices.

Means for Solving the Problems

[0004] In order to achieve the above object, a horizontal plating production line according to the present invention includes a horizontal plating device including a first body frame, a plating cylinder provided on the first body frame, and a horizontal plating transfer device, wherein an inlet and an outlet are respectively provided at both ends of the plating cylinder, and the horizontal plating transfer device is used to move the circuit board entering the plating cylinder from the inlet to the outlet, and a horizontal plating device The circuit board supply device is provided at the end of the plating cylinder near the inlet and includes a second machine frame and a supply and transport mechanism provided on the second machine frame for horizontally placing a circuit board and transporting the circuit board along a first direction, maintaining the circuit board in the plating cylinder horizontally and moving it to the horizontal plating transport device.

[0005] In one embodiment, the circuit board supply device further includes a first positioning mechanism for positioning a circuit board in the supply and transport mechanism to a preset position, and a first push mechanism for moving the circuit board in the supply and transport mechanism along the first direction to adjust the pitch between two adjacent circuit boards positioned by the first positioning mechanism and arranged along the first direction.

[0006] In one embodiment, the first push mechanism is used to push a circuit board positioned by the first positioning mechanism so that it moves along the first direction, thereby the pitch between the pushed circuit board and the previous circuit board positioned by the first positioning mechanism is a preset value L, the actual pitch value between the two circuit boards is D, and L and D satisfy the condition L-1.5mm ≤ D ≤ L+1.5mm.

[0007] In one embodiment, the horizontal plating production line includes a reversing device and two horizontal plating devices, the reversing device being located between the two horizontal plating devices and used to reverse a circuit board plated by one of the horizontal plating devices and to transport it to the other horizontal plating device, such that the horizontal plating transport devices of the two horizontal plating devices each sandwich the circuit board on opposite sides.

[0008] In one embodiment, the inversion device includes a third machine frame and a feeding mechanism and an inversion mechanism provided on the third machine frame, wherein the feeding mechanism is used to horizontally place a circuit board, and the inversion mechanism is used to flip the circuit board over in the feeding mechanism.

[0009] In one embodiment, the reversing mechanism includes a drive assembly, a rotating shaft, and a clamping assembly, wherein the clamping assembly is mounted on the rotating shaft, the rotating shaft is drive-connected to the drive assembly, the clamping assembly is provided with an insertion groove for inserting a circuit board, and the drive assembly is used to rotate the rotating shaft so that the clamping assembly reverses the circuit board.

[0010] In one embodiment, the feeding mechanism includes a first transport line, a second transport line, a third transport line, and a fourth transport line, wherein the first and second transport lines transport circuit boards along a first direction, the reversing mechanism is provided between the first and second transport lines to reverse the circuit boards in the first transport line to the second transport line, the fourth transport line extends along the transport direction of the first transport line, and the third transport line is provided along a second direction to transport the circuit boards in the second transport line to the fourth transport line, with the first and second directions being at an angle.

[0011] In one embodiment, the reversing device further includes a second push mechanism and a second positioning mechanism, the second positioning mechanism being provided on the fourth transport line for positioning a circuit board to a preset position, the second push mechanism being used to sequentially push the circuit board along the first transport line, the second transport line, the third transport line and the fourth transport line, and to push the circuit board positioned by the second positioning mechanism to the horizontal plating device, and to adjust the pitch of two adjacent circuit boards positioned by the second positioning mechanism and arranged along the first direction.

[0012] In one embodiment, the horizontal plating transport device further includes a clamping mechanism and a plating transport mechanism, the first machine frame is provided with guide rails along the horizontal direction, the clamping mechanism includes mutually connected sliding members and clamping members, the clamping members are provided in the plating transport mechanism for clamping a circuit board, the sliding members are slidably connected to the guide rails, and the plating transport mechanism is used to move the clamping mechanism along the guide rails for transporting a circuit board.

[0013] In one embodiment, the clamping member is Fixing clip and A movable clip is movably attached to the fixing clip via a connecting assembly and cooperates with the fixing clip to clamp the circuit board, The system includes a lifting support wheel provided on the side of the movable clip away from the fixed clip, which moves up and down as the clamping mechanism moves via the plating conveying mechanism, thereby opening and closing the movable clip and the fixed clip.

[0014] In one embodiment, the horizontal plating conveying device is provided on the first machine frame and further includes a guide assembly comprising a first guide member and a second guide member, wherein the first guide member is located on the supply path of the clamping mechanism and the second guide member is located on the discharge path of the clamping mechanism, and both the first guide member and the second guide member have guide slopes. In the supply path of the clamping mechanism, in order to clamp the circuit board, the guide slope contacts the lifting support wheel when guiding the clamping mechanism to move, thereby increasing the distance between the fixed clip and the movable clip. In the discharge path of the clamping mechanism, the guide slope contacts the lifting support wheel when guiding the clamping mechanism to move in order to drop the circuit board, thereby increasing the distance between the fixed clip and the movable clip.

[0015] In one embodiment, the plating transport mechanism is: A conveying steel belt is provided, which is slidably mounted on the first machine frame and is equipped with the clamping mechanism. A drive mechanism including a transport drive wheel and a transport driven wheel, wherein the transport drive wheel and the transport driven wheel are each provided at both ends of the first machine frame and connected via the transport steel belt to form a closed-loop transmission, thereby realizing continuous transport. The present invention further includes the conveying steel belt and a tensioning mechanism elastically connected to the first machine frame, which undergoes elastic deformation to change the horizontal pitch between the first machine frame and the conveying steel belt as the conveying steel belt slides along the first machine frame, thereby tensioning the conveying steel belt.

[0016] In one embodiment, the horizontal plating apparatus further includes a cathode conductive clip reverse stripping device, the cathode conductive clip reverse stripping device including a plating removal cylinder provided on the first machine frame and a stripping assembly, the conveying steel belt is used to convey the clamping mechanism into the plating removal cylinder so that the clamping mechanism and the stripping assembly form a conductive circuit and strip the plating material from the clamping mechanism.

[0017] In one embodiment, the horizontal plating apparatus further includes a conductive device, and the conductive device is A conductive oil tank assembly in which conductive oil is provided, A cathode assembly connected to the anode component of the power supply to generate current, A conductive slider assembly is arranged in the clamping mechanism, provided within the conductive oil tank assembly and immersed in the conductive oil, electrically connected to the cathode assembly, and transmits current to the horizontal plating jig to charge the circuit board in the horizontal plating jig. A recirculation mechanism comprising an oil storage tank and a recirculation assembly, wherein the oil storage tank is used for storing conductive oil, and the conductive oil tank assembly is connected to the oil storage tank via the recirculation assembly to form a circulation passage for circulating the conductive oil in the oil storage tank and the conductive oil in the conductive oil tank assembly to each other.

[0018] In one embodiment, the conductive device further includes an oil supply mechanism, the recirculation mechanism further includes an overflow assembly, the oil supply mechanism is in communication with the conductive oil tank assembly to supply conductive oil to the conductive oil tank assembly, the overflow assembly has an overflow port, the overflow assembly is in communication with the oil supply tank assembly via the overflow port, the conductive oil tank assembly is in communication with the oil storage tank via the overflow assembly and has a preset volume, and when the liquid volume in the conductive oil tank assembly exceeds the preset volume, the conductive oil in the conductive oil tank assembly can flow into the oil storage tank via the overflow assembly.

[0019] In one embodiment, the horizontal plating apparatus further includes an anode spraying apparatus provided in the plating cylinder, and the anode spraying apparatus is Anode mesh perforated plate, An anode mesh that is detachably attached to the anode mesh perforated plate, A spray assembly attached to the side of the anode mesh away from the anode mesh hole plate, A conductive assembly comprising a conductive assembly wherein the anode mesh is connected to a rectifier via the conductive assembly.

[0020] In one embodiment, at least two sets of the anode spraying devices are mounted in the plating cylinder at intervals, the spraying sides of the two sets of the anode spraying devices are provided opposite to each other, and a plating chamber for accommodating a circuit board and performing plating is formed between any two sets of the anode spraying devices provided opposite to each other.

[0021] In one embodiment, the anode mesh hole plate is a hole plate body in which a plurality of mesh holes and a plurality of first spraying holes are formed. Each of the mesh holes is provided in a hexagonal shape, the plurality of mesh holes are arranged in the body in a honeycomb-like array, the plurality of first spraying holes are provided in the hole plate body at intervals, and the hole plate body has a spraying side facing the circuit board and spraying the circuit board, and the hole plate body includes a guide wheel attached to the spraying side of the hole plate body for abutting against the circuit board.

[0022] In one embodiment, the horizontal plating production line further includes a copper dissolving device, and the copper dissolving device is a copper dissolving cylinder in which a partition plate is provided inside. The partition plate partitions the copper dissolving cylinder into a first cylinder block and a second cylinder block. The first cylinder block has a liquid supply port for containing a reaction stock solution and a copper grain basket for placing pure copper. There is an overflow part at the upper part of the partition plate for communicating the first cylinder block and the second cylinder block. An overflow port for flowing out the plating solution is opened in the second cylinder block. The copper dissolving cylinder includes a conveying pipeline for forming an internal circulation circuit by communicating the first cylinder block, the overflow part, the second cylinder block and the conveying pipeline, and an overflow mechanism attached to the overflow port for sending out the liquid in the second cylinder block to the plating cylinder.

[0023] <- In one embodiment, the horizontal plating production line includes a cleaning device provided at the inlet of the plating cylinder and located between the circuit board supply device and the plating cylinder, and / or provided at the outlet of the plating cylinder. The system further includes a drying device provided at the outlet of the plating cylinder and located away from the plating cylinder of the cleaning device, for removing water from the circuit board that has been plated and cleaned by the cleaning device. [Effects of the Invention]

[0024] The technical solution of the present invention employs a circuit board supply device in a horizontal plating production line and reduces the manufacturing cost of the device by performing plating in cooperation with the horizontal plating device. Specifically, the horizontal plating production line includes a horizontal plating device and a circuit board supply device. The horizontal plating device includes a first machine frame, a plating cylinder provided on the first machine frame, and a horizontal plating transport device. The plating cylinder extends along a first direction, and the horizontal plating transport device is used to plate the circuit board by moving it within the plating cylinder with the circuit board in between. The circuit board supply device includes a second machine frame and a supply transport mechanism provided on the second machine frame. The supply transport mechanism is a transport line of a certain length and forms a first horizontal transport surface for horizontally placing the circuit board, transporting the circuit board horizontally to the horizontal plating transport device of the plating device. As can be understood, since robotic operation is not required to maintain the circuit board in a horizontal position throughout the entire transport process, the device occupies less space than conventional plating devices, manufacturing costs are lower, and the horizontal movement of the board can meet the demand for high-precision plating, resulting in higher product quality. [Brief explanation of the drawing]

[0025] To more clearly illustrate embodiments of the present invention or technical solutions in the prior art, the drawings that may be used in the description of embodiments or the prior art are briefly described below. Clearly, the drawings described below represent only a few embodiments of the present invention, and those skilled in the art can obtain other drawings based on the structures shown in these drawings without expending any creative effort. [Figure 1] This is a schematic diagram of the structure of one embodiment of a horizontal plating production line provided by the present invention. [Figure 2] This is a top view of one embodiment of a horizontal plating production line provided by the present invention. [Figure 3] This is a schematic diagram of the connection structure between a circuit board supply device and a horizontal plating device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 4] This is a schematic diagram of the structure of a circuit board supply device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 5] This is a schematic diagram of a partial structure of a circuit board supply device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 6] This is a schematic diagram of the connection structure between a reversing device and two horizontal plating devices in one embodiment of a horizontal plating production line provided by the present invention. [Figure 7] This is a schematic diagram of the structure of a reversing device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 8] This is a schematic diagram of a partial structure of a reversing device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 9] This is a schematic diagram of a circuit board transport line using a reversing device in one embodiment of the horizontal plating production line provided by the present invention. [Figure 10] This is a schematic diagram of the structure of the reversing mechanism of a reversing device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 11] This is a schematic diagram of the internal structure of a horizontal plating apparatus in one embodiment of a horizontal plating production line provided by the present invention. [Figure 12] This is a schematic diagram of the structure of a horizontal plating conveying device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 13] This is a schematic diagram of the clamping mechanism and the structure of the conveyed steel plate in a horizontal plating conveying device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 14] This is a schematic diagram of the clamping mechanism and conveying steel plate structure in one embodiment of the horizontal plating production line provided by the present invention. [Figure 15] This is a schematic diagram of the assembly structure of a clamping mechanism and guide rail in one embodiment of a horizontal plating production line provided by the present invention. [Figure 16] This is a schematic diagram of the collaborative structure of a clamping member and a guide assembly in one embodiment of a horizontal plating production line provided by the present invention. [Figure 17] This is a schematic diagram of the structure of a plating transport mechanism in one embodiment of a horizontal plating production line provided by the present invention. [Figure 18] This is a schematic diagram of the structure of a conveying steel belt, a conveying drive wheel, and a conveying driven wheel in one embodiment of a horizontal plating production line provided by the present invention. [Figure 19] This is a schematic diagram of the structure of a clamping member, a plating removal cylinder, and a cathode conductive clip reverse stripping device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 20] This is a schematic diagram of the structure of a conductive device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 21] This is a magnified view of area A in Figure 20. [Figure 22] This is a schematic diagram of the structure of a clamping mechanism, a circuit board, and an anode spraying device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 23] This is a schematic diagram of the structure of an anode spray apparatus in one embodiment of a horizontal plating production line provided by the present invention. [Figure 24]This is a schematic diagram of the bottom structure of an anode spray device in one embodiment of a horizontal plating production line provided by the present invention. [Figure 25] This is a schematic diagram of the structure of an anodic mesh perforated plate in one embodiment of a horizontal plating production line provided by the present invention. [Figure 26] This is a schematic diagram of the structure of a copper melting apparatus in one embodiment of a horizontal plating production line provided by the present invention. [Figure 27] This is a side cross-sectional view of a copper melting apparatus in one embodiment of a horizontal plating production line provided by the present invention. The realization of the objectives, functional features, and advantages of the present invention will be further described with reference to the drawings, along with the embodiments. [Modes for carrying out the invention]

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below, in conjunction with the drawings of the embodiments. Clearly, the embodiments described are only some, and not all, embodiments of the present invention. All other embodiments that can be obtained by those skilled in the art without creative work based on the embodiments of the present invention are within the scope of the protection of the present invention.

[0027] In the embodiments of the present invention, if there are directional indicators such as (up, down, left, right, front, back, etc.), these directional indicators are used solely to describe the relative positional relationships and motion conditions between each component in a specific posture, and when that specific posture changes, the directional indicators also change accordingly.

[0028] Furthermore, in the embodiments of the present invention, if there are descriptions relating to "first," "second," etc., these descriptions are used solely for descriptive purposes and should not be understood as indicating or implying their relative importance or implicitly indicating the number of technical features described. Therefore, features limited as "first" or "second" may explicitly or implicitly include at least one other feature. Also, in the case of "and / or" or "and / or" appearing throughout the text, their meaning includes three parallel solutions, and, taking "A and / or B" as an example, includes solution A, or solution B, or a solution that satisfies both A and B simultaneously. Furthermore, while technical solutions between embodiments may be combined, this must be based on what a person skilled in the art can achieve, and if a combination of technical solutions results in a contradiction or is not achievable, such a combination of technical solutions should be considered nonexistent and outside the scope of protection required by the present invention.

[0029] Conventional plating of printed circuit boards, whether automated or VCP, employs a vertical plating method. In this method, the printed circuit board is clamped vertically in a jig during the plating process, immersed in a chemical solution, and oscillated using a mechanism with an oscillating function. The chemical solution is then flowed into the interconnection holes of the printed circuit board, forming the plating under the conductive action of the solution. Horizontal plating equipment with this structure occupies a large space, requires robotic operation for material supply and discharge, has high manufacturing costs, and results in low substrate precision, making it unable to meet the demand for high-precision plating.

[0030] This invention proposes a horizontal plating production line.

[0031] Referring to Figures 1 to 5, in one embodiment of the present invention, the horizontal plating production line 10 includes a horizontal plating apparatus 100 and a circuit board supply device 200. The horizontal plating apparatus 100 includes a first machine frame 110, a plating cylinder 120 and a horizontal plating transport device 130 provided on the first machine frame 110, the plating cylinder 120 extending along a first direction and filled with a plating solution inside, the horizontal plating transport device 130 is used to plate the circuit board 20 by moving it within the plating cylinder 120 with the circuit board 20 in between, and the circuit board supply device 200 includes a second machine frame 210 and a supply transport mechanism 220 provided on the second machine frame 210, the supply transport mechanism 220 is a transport line having a certain length and forms a first horizontal transport surface for horizontally placing the circuit board 20, and transports the circuit board 20 along the horizontal direction to the horizontal plating transport device 130 of the plating apparatus. To make it clear, since robotic operation is not required to maintain the circuit board 20 in a horizontal position throughout the entire transport process, the equipment in this production line occupies less space, has lower manufacturing costs compared to conventional plating equipment, and the horizontal movement of the board can meet the demand for high-precision plating, resulting in higher product quality.

[0032] The supply and transport mechanism 220 includes a plurality of rotating rollers 221. Specifically, the plurality of rotating rollers 221 are arranged in parallel along a first direction on the second machine frame 210 to form a transport line. Each rotating roller 221 is provided with a plurality of friction wheels 222 to form a first horizontal transport surface. A drive motor is further provided on the machine frame. Gears that mesh with each other are provided at the ends of any two adjacent rotating rollers 221. The drive motor rotates the plurality of rotating rollers 221 at the same speed via the gears. The friction wheels 222 contact the bottom of the board surface to move the circuit board 20. At the position where the friction wheels 222 contact the circuit board 20, a structure such as soft rubber can be used to prevent scratching.

[0033] Furthermore, as shown in Figures 4 and 5, the circuit board supply device 200 further includes a first positioning mechanism 230 and a first push mechanism 240 provided on the second machine frame 210. The first positioning mechanism 230 is used to position the circuit board 20 in the supply and transport mechanism 220 to a predetermined position so that the edge of the circuit board 20 is aligned with the horizontal plating transport device 130, and the positioned circuit board 20 moves into the plating cylinder 120 along the first direction. The first push mechanism 240 includes a pair of first linear motors 241 and first push members 242 provided along the first direction. The first push member 242 is driven by the first linear motor 241, and the first linear motor 241 is used to drive the first push member 242 so that it reciprocates along the first direction and moves the circuit board 20. The first positioning mechanism 230 includes a second linear motor 232 and a second push member 233 provided along a second direction, and the supply and transport mechanism 220 is further provided with a first positioning baffle 231, and the second linear motor 232 drives the second push member 233 to push and position the circuit board 20 to the first positioning baffle 231. During production supply, the operator typically sequentially loads multiple circuit boards 20 into the supply and transport mechanism 220, and the first push mechanism 240 is used to adjust the pitch between two adjacent circuit boards 20 that are positioned by the first positioning mechanism 230 and arranged along a first direction.

[0034] When positioning, if the first positioning mechanism 230 pushes the circuit board 20 laterally, the friction wheels 222 may scratch the surface of the circuit board 20. Therefore, a transport rail 250 can be provided below the supply transport mechanism 220 along a second direction. Multiple driven wheels are provided at intervals along the second direction at the upper end of the transport rail 250, and a first lifting mechanism 251 that moves up and down is provided at the lower end. When the circuit board 20 enters the positioning position, the first lifting mechanism 251 raises the transport rail 250 to push the circuit board 20 up, and the first positioning mechanism 230 pushes the circuit board 20 to move along the second direction, so that the surface of the circuit board 20 slides against the driven wheels and avoids scratching. After positioning, the first lifting mechanism 251 lowers the transport rail 250, returning the circuit board 20 to the first transport horizontal plane and proceeding to the subsequent transport step.

[0035] Since multiple circuit boards 20 need to be sequentially entered into the plating cylinder 120, if the pitch between the circuit boards 20 is not aligned, the flow of the plating solution will become uneven, potentially affecting the overall performance by causing the plating layer to be too thick or too thin in some areas. However, conventional devices have a roller transport structure that does not provide high precision in controlling the pitch. As shown in Figure 5, in one embodiment of the present invention, the first linear motor 241 of the first push mechanism 240 is provided with a first push member 242, and the first push member 242 pushes the circuit board 20 positioned by the first positioning mechanism 230 to the plating cylinder 120 so as to catch up with the preceding circuit board 20. The controller calculates the operating gap and transport distance and controls the first positioning mechanism 230 and the first push mechanism 240 to cooperate, controlling the pitch value between two adjacent circuit boards 20 to be between 1 mm and 3 mm, that is, controlling the pitch value between two adjacent circuit boards 20 to a preset value L. For example, the preset value L for the pitch between substrates may be set to 5 mm, 10 mm, or 15 mm, but due to the influence of the control accuracy of the mechanical device, there is a difference between the actual pitch value D and the preset value L. By controlling with a linear motor, the error between the pitch value D and the preset value L can be further reduced compared to conventional roller transport. Specifically, L and D satisfy L-1.5 mm ≤ D ≤ L+1.5 mm, meaning the error can be controlled within a range of 1.5 mm. For example, if the preset value L for the pitch between substrates is set to 10 mm, the minimum actual pitch value D may be 8.5 mm, the maximum may be 11.5 mm, the pitch value D may be 9.5 mm, or any value within the aforementioned range. Compared to conventional roller transport structures, the control is more accurate, and the plating effect is also better.

[0036] The primary plating effect of conventional PCB substrates is not ideal, and secondary and tertiary plating are usually required. Primary and secondary plating are applied in thin layers, but uniform plating of the substrate surface is required, so a horizontal plating method is used for primary and secondary plating. To maximize the plating effect, the substrate is turned over and the clamping points or edges are swapped. Therefore, in order to improve plating efficiency, the horizontal plating production line 10 is equipped with at least two horizontal plating devices 100 connected one after the other, and a reversing device 300 is provided between them to turn over and transport the circuit board 20. This reversing device 300 receives the circuit board 20 plated by the previous horizontal plating device 100, turns the circuit board 20 over, swaps the clamping points or edges, and then transports it to the next horizontal plating device 100, thereby improving the uniformity of the plating layer on the circuit board 20.

[0037] As shown in Figures 6 to 10, the inversion device 300 includes a third machine frame 310 and a feed mechanism 320 and an inversion mechanism 330 provided on the third machine frame 310. The feed mechanism 320 has a transport rail with a second horizontal transport surface for horizontally placing the circuit board 20, and this second horizontal transport surface may be provided flush with the first horizontal transport surface. The circuit board 20 plated by one horizontal plating device 100 enters the horizontal transport surface, and the feed mechanism 320 transports it horizontally to the other horizontal plating device 100. During transport, the inversion mechanism 330 flips the circuit board 20 over on the horizontal transport surface and swaps the positions of the two opposing sides of the circuit board 20, so that the horizontal plating transport devices 130 of the two horizontal plating devices 100 each sandwich the opposing sides of the circuit board 20.

[0038] Generally, the horizontal plating apparatus 100 energizes the jig of the horizontal plating conveying apparatus 130 to plate the circuit board 20. However, the current is high at the clamping point or edge of the circuit board 20 that is close to the horizontal plating conveying apparatus 130, resulting in a thicker plating layer. The current decreases as the position on the circuit board 20 moves away from the horizontal plating conveying apparatus 130, resulting in a thinner plating layer. It is clear that a uniform plating layer cannot be obtained with single-pass plating. The chemical solution environment differs between the upper and lower surfaces of the circuit board 20 inside the plating cylinder 120, resulting in different plating effects on both sides. This solution involves providing an inversion device 300 to invert the upper and lower surfaces of the circuit board 20 and switch the clamping point or edge to the opposite side, thereby making the plating layer of the circuit board 20 plated twice by two horizontal plating apparatuses 100 more uniform and effectively improving the production quality of the circuit board 20.

[0039] The second horizontal transport surface of the feed mechanism 320 may be formed by a structure such as a belt transport line, a roller transport line, or a transport line combining a rotating roller and a friction wheel. The circuit board 20 moves horizontally along the second horizontal transport surface from the previous horizontal plating apparatus 100 to the plating cylinder 120 of the next horizontal plating apparatus 100, thereby enabling the horizontal plating transport apparatus 130 to accurately grip the circuit board 20 and ensuring the continuous stability of the transport process.

[0040] Referring to Figures 9 and 10, in one embodiment of the present invention, the reversing mechanism 330 includes a drive assembly 331, a rotating shaft 332, and a clamping assembly 333, the feeding mechanism 320 transports the circuit board 20 along a first direction, the rotating shaft 332 similarly extends along the first direction, the clamping assembly 333 is mounted on the rotating shaft 332, the drive assembly 331 is used to rotate the rotating shaft 332 and the clamping assembly 333, the clamping assembly 333 is provided with an insertion groove 333a, the insertion groove 333a extends along the axial direction of the rotating shaft 332 and can be aligned with the horizontal transport surface of the feeding mechanism 320. When the feed mechanism 320 transports the circuit board 20 to the inversion mechanism 330, the sides of the circuit board 20 are inserted into the insertion grooves 333a, the drive assembly 331 rotates the rotation shaft 332, and the clamping assembly 333 inverts the circuit board 20 by 180° and returns it to the second horizontal transport surface of the feed mechanism 320. At this time, the inversion of the circuit board 20 is completed, and the positions of the two sides of the circuit board 20 along the first direction are swapped, so that the sides of the circuit board 20 that are clamped by the plating transport mechanism 132 within the two horizontal plating apparatuses 100 are positioned on opposing sides, ensuring uniformity of the plating layer.

[0041] Furthermore, the drive assembly 331 includes a drive motor 3311, a transmission belt 3312, and a transmission wheel 3313, specifically, one end of a rotating shaft 332 connected to the transmission wheel 3313, and the drive motor 3311 mounted on a bracket and connected to the transmission wheel 3313 via the transmission belt 3312. The drive motor 3311 rotates the transmission wheel 3313 via the transmission belt 3312, thereby driving the clamp assembly 333 to rotate the rotating shaft 332 around a first direction and to invert the circuit board 20. The cost of the drive motor 3311 and the transmission belt 3312 is lower than that of gears, and the structure of the transmission belt 3312 can absorb vibrations, resulting in less noise and quieter operation than gears, and easier maintenance. Of course, in some other embodiments of the present invention, the drive assembly 331 may employ a structure such as a worm gear set, and is not specifically limited.

[0042] Furthermore, the feeding mechanism 320 includes a first conveyor line 321, a second conveyor line 322, a third conveyor line 323, and a fourth conveyor line 324. The first conveyor line 321, the second conveyor line 322, and the fourth conveyor line 324 are all equipped with rotating rollers and friction wheels to form a horizontal conveying surface. The rotating rollers rotate, causing the friction wheels to move the circuit board 20 along a first direction. The first conveyor line 321, the second conveyor line 322, and the fourth conveyor line 324 are spaced apart and all extend along the first direction. The reversing mechanism 330 is provided between the first conveyor line 321 and the second conveyor line 322. The third conveyor line 323 is provided along a second direction, and both ends are connected to the second conveyor line 322 and the fourth conveyor line 324, respectively. The third conveyor line 323 is raised and lowered via an air cylinder mechanism to push up the circuit board 20 located on the second conveyor line 322. Specifically, when the circuit board 20 moves from the first transport line 321 to the insertion groove 333a of the clamping assembly 333, the inversion device 300 inverts the circuit board 200 by 180° to the second transport line 322, and the circuit board 20 continues to move along the first direction on the second transport line 322 to above the third transport line 323, the second lifting mechanism 3231 pushes the third transport line 323 up to the circuit board 20, the circuit board 20 moves along the second direction on the third transport line 323 to above the fourth transport line 324, the air cylinder lowers the third transport line 323, and then the circuit board 20 falls onto the fourth transport line 324 and moves along the first direction to the plating cylinder 120.

[0043] The reversing device 300 further includes a second push mechanism 340 and a second positioning mechanism 350, the second push mechanism 340 including four third linear motors 341, each linear motor provided with a third push member 342, the four third linear motors 341 and four third push members 342 are provided on four respective transport lines to push the circuit boards 20 on the corresponding transport lines and move them along the transport direction of the transport lines. Furthermore, the fourth transport line 324 is further provided with a second positioning mechanism 350 including a second positioning baffle 351, the third push member 342 located on the third transport line 323 pushes the circuit board 20 along the second direction to the fourth transport line 324, causing the circuit board 20 to come into contact with the second positioning baffle 351 of the second positioning mechanism 350, aligning the side of the circuit board 20 with the horizontal plating transport device 130 of the next horizontal plating device 100, and ensuring that the positions of the clamping points coincide. In this embodiment, a fourth linear motor 352 is further connected to the second positioning baffle 351 to adjust its position on the fourth transport line 324 and to accommodate circuit boards 20 of different specifications.

[0044] Furthermore, the third linear motor 341 and the third push member 342 located on the fourth transport line 324 push the positioned circuit board 20 onto the plating cylinder 120. During the pushing process, the control mechanism calculates the distance traveled by the previous positioned circuit board 20 and pushes the circuit board 20 in the second positioning mechanism 350 to catch up with the previous circuit board 20, controlling the pitch between them. Furthermore, in order to unify the plating quality, the second push mechanism 340 of the reversing device 300 also uses a linear motor, and the pitch error of the two adjacently positioned circuit boards 20 can be controlled to within 1.5 mm. That is, the actual pitch value D between the circuit boards and the preset value L satisfy L-1.5 mm ≤ D ≤ L+1.5 mm. For example, the preset value L for the pitch between boards is set to 10 mm, the minimum value of the actual pitch value D may be 8.5 mm, the maximum value may be 11.5 mm, the pitch value D may be 9.5 mm, or any one of the values ​​within the aforementioned range. This ensures that the pitch between the circuit boards 20 that enter the two horizontal plating devices 100 is maintained within the same range, thereby reducing the influence of pitch on secondary plating.

[0045] As shown in Figures 11 to 15, in one embodiment of the present invention, the horizontal plating conveying apparatus 130 further includes a clamping mechanism 131 and a plating conveying mechanism 132, the first machine frame 110 provides support for the overall structure of the horizontal plating apparatus 100, and the first machine frame 110 is provided with guide rails 111 for guiding the linear motion of the sliding member 1311. The main purpose of providing guide rails 111 on the first machine frame 110 is to ensure that the clamping mechanism 131 can move stably and accurately along a predetermined path, which is very important to ensure that the circuit board 20 is not damaged or misaligned during the plating process. Guide rails 111 can help keep the clamping mechanism 131 on the correct rail to prevent processing errors due to misalignment. They reduce vibration and shaking during the movement of the sliding member 1311, ensuring that the circuit board 20 remains stable during transport. Guide rails 111 can reduce friction between the clamping mechanism 131 and other parts, extending the life of the apparatus.

[0046] The clamping mechanism 131 includes a plurality of sliding members 1311 and clamping members 1312. The sliding members 1311 slide and connect to the guide rails 111 on the first machine frame 110, and the clamping members 1312 serve to fix the circuit board 20. The plating transport mechanism 132 is used to drive the clamping mechanism 131 so that the sliding members 1311 move along the guide rails 111, thereby enabling the transport of the circuit board 20 in the production line. Specifically, the clamping mechanism 131 first clamps the circuit board 20 to be processed with the clamping members 1312. When the plating transport mechanism 132 is activated, it moves the sliding members 1311 along the direction of the guide rails 111. As the sliding members 1311 move, the clamping members 1312 and the circuit board 20 on them move, completing the transport process of the circuit board 20 between the plating grooves. The main objective of this design is to achieve automated transportation of circuit boards 20 in the plating production line, reducing manual operation and improving production efficiency and safety. Furthermore, this design allows the device to adapt to different sizes and shapes of circuit boards 20, offering excellent versatility and flexibility.

[0047] To understand, the guide rail 111 is typically a long strip structure made of metal, and may be an open T-groove or a closed V-groove, and the sliding member 1311 is matched with a corresponding slider. Alternatively, rollers or balls may be used to reduce friction, making it suitable for application scenes requiring frequent reciprocating motion. Alternatively, it may consist of the guide rail 111 and a slider, with balls or needles inside the slider to allow smooth movement along the guide rail 111. To understand, the structural design of the sliding member 1311 generally needs to consider the method of cooperation with the guide rail 111, and the slider may be a metal or plastic slider used in combination with the guide rail 111 or guide groove, and may contain balls or needles inside the slider to reduce friction. Alternatively, it may be a roller, and the wheeled sliding member 1311 can roll on the surface of the guide rail 111, reducing friction and allowing for smooth movement. Alternatively, it may be a suspended type, in which the sliding member 1311 is connected to the upper guide rail 111 in a suspended manner to suit vertical or inclined movement. This solution can better realize the accurate and stable transport of the circuit board 20 during plating, and the sliding member 1311 functions as part of the guide system, and by fitting with the guide rail 111, ensures that the circuit board 20 does not slip or vibrate during movement, thereby ensuring plating quality and production efficiency. Stable mechanical transmission reduces product damage and plating unevenness caused by improper manual operation. Automated transport reduces the time spent on manual handling, improves production speed, enhances production efficiency and product quality, and also reduces production costs and safety risks.

[0048] Referring further to Figures 14 to 16, the clamping member 1312 includes a fixed clip 13121, a movable clip 13122, and a lifting support wheel 13123. The movable clip 13122 is movablely attached to the fixed clip 13121 via a connecting assembly and is used in cooperation with the fixed clip 13121 to clamp the circuit board 20. The lifting support wheel 13123 is provided on the side of the movable clip 13122 away from the fixed clip 13121 to raise and lower the movable clip 13122. The first machine frame 110 is provided with a guide assembly including a first guide member 112 and a second guide member 113 along the first direction, and slopes are formed on the upper surfaces of the first guide member 112 and the second guide member 113, respectively, extending diagonally upward along the transport direction. When the lifting support wheel 13123 reaches a slope, it moves upward along the slope. The fixed clip 13121 is fixedly attached to the plating transport mechanism 132, thereby allowing the plating transport mechanism 132 to move horizontally along the entire apparatus through the fixed clip 13121. The lifting support wheel 13123 moves to the lowest point of the slope and then begins to rise along the slope. Because the fixed connection between the fixed clip 13121 and the plating transport mechanism 132 is always maintained at the same horizontal height, the movable clip 13122 is moved upward by the lifting support wheel 13123, thereby causing the movable clip 13122 and the fixed clip 13121 to slide relative to each other, opening the movable clip 13122 and the fixed clip 13121.

[0049] As shown in Figure 16, when the clamping mechanism 131 moves in the supply direction along the guide slope of the first guide member 112, the lifting support wheel 13123 rises, increasing the distance between the fixed clip 13121 and the movable clip 13122, thereby allowing the circuit board 20 to be smoothly clamped. When the clamping mechanism 131 moves in the opposite direction (i.e., the discharge direction) along the guide slope of the second guide member 113, the distance between the fixed clip 13121 and the movable clip 13122 increases similarly, this time to release the circuit board 20 from the clamped state. Specifically, the clamping mechanism 131 is in its initial position, and at this time, the distance between the fixed clip 13121 and the movable clip 13122 is suitable for clamping the circuit board 20. During the supply phase, the circuit board 20 is placed in the position of the clamping mechanism 131. The clamping mechanism 131 begins to move and slides along the guide rail 111 to the first guide member 112. Under the action of the guide slope of the first guide member 112, the distance between the fixed clip 13121 and the movable clip 13122 gradually increases. As the distance increases, the circuit board 20 can smoothly enter between the two clamping assemblies 333. After the clamping mechanism 131 has completely passed the first guide member 112, the distance between the fixed clip 13121 and the movable clip 13122 is restored, and the circuit board 20 is firmly clamped. The clamping mechanism 131 continues to move along the guide rail 111 and enters the plating groove or other processing area. At this stage, the circuit board 20 undergoes plating or other surface treatment. In the discharge stage, once the processing is complete, the clamping mechanism 131 begins to return and slides along the guide rail 111 to the second guide member 113. Under the action of the guide slope of the second guide member 113, the distance between the fixed clip 13121 and the movable clip 13122 gradually increases again. As the distance increases, the circuit board 20 can be released from the clamped state. Once the clamping mechanism 131 has completely passed the second guide member 113, the circuit board 20 is lowered or moved to the next process. The clamping mechanism 131 returns to its initial position in preparation for the next cycle. This flow allows the circuit board 20 to be safely clamped and released during the plating process, while ensuring continuity and automation of the entire process flow.

[0050] As shown in Figures 17 and 18, the plating conveying mechanism 132 further includes a conveying steel belt 1321, a drive mechanism, and a tension mechanism 1324. The conveying steel belt 1321 is attached to the first machine frame 110 and is slidable on the first machine frame 110. The drive mechanism consists of a conveying drive wheel 1322 and a conveying driven wheel 1323, each located at both ends of the first machine frame 110, forming a closed-loop transmission via the conveying steel belt 1321. A clamping mechanism 131 is provided on the outer surface of the conveying steel belt 1321 to achieve continuous conveyance. The tension mechanism 1324 is elastically connected to the conveying steel belt 1321 and the first machine frame 110, and ensures the tension of the steel belt by adjusting the horizontal pitch between the first machine frame 110 and the conveying steel belt 1321 through elastic deformation. Specifically, before the device is started, the conveyor steel belt 1321 is in its initial position, and the tension mechanism 1324 maintains a constant pre-tension, ensuring that the conveyor steel belt 1321 is in the appropriate tension state on the first machine frame 110. When the system is started, the conveyor drive wheel 1322 in the drive mechanism begins to rotate. Since the conveyor drive wheel 1322 and the conveyor driven wheel 1323 form a closed-loop transmission via the conveyor steel belt 1321, the conveyor driven wheel 1323 also rotates in conjunction with it. The conveyor steel belt 1321 slides along the first machine frame 110 under the drive of the drive mechanism, gripping the circuit board 20 to be plated by the gripping mechanism 131 and pulling it to the next process. The circuit board 20 moves forward as the conveyor steel belt 1321 moves.

[0051] Furthermore, the tension mechanism 1324 includes a tension base 13241 and a compression spring 13242. The compression spring 13242 is fitted into the tension base 13241, which is slidably mounted to the first machine frame 110 via a slide rail assembly 1325. One end of the compression spring 13242 abuts against the tension base 13241, and the other end abuts against the first machine frame 110, thus providing tension. In this design, the elasticity of the compression spring 13242 allows the position of the transport driven wheel 1323 relative to the first machine frame 110 to be automatically adjusted, thereby maintaining tension on the transport steel belt 1321, ensuring stable transport of the multiple clamping members 1312 on the outside of the steel belt, and preventing them from falling or shifting.

[0052] Conventional copper stripping processes using jigs typically involve using nitric acid or sulfuric acid in combination with chemical agents such as hydrogen peroxide to strip the copper layer. The jigs perform copper stripping by closing the clamping parts, resulting in a small contact area with the clamping points of the chemical solution, insufficient copper stripping effect, and easy copper residue.

[0053] As shown in Figure 19, this solution proposes a cathode conductive clip reverse stripping device 140, which includes a plating removal cylinder 141 and a stripping assembly 142 provided on a first machine frame 110. The first machine frame 110 includes a plating removal station, a transport station, and a transport rail connecting the plating removal station and the transport station. The plating removal cylinder 141 and the plating cylinder 120 are provided on opposing sides along a first direction of the transport steel belt 1321. The plating removal station is provided inside the plating removal cylinder 141, the transport station is provided inside the plating cylinder 120, the transport steel belt 1321 forms the transport rail, and a clamping member 1312 is movably provided on the transport rail. When the clamping member 1312 moves from the transport station to the plating removal station, the lifting support wheel 13123 of the clamping member 1312 is raised by the second guide member 113, and then the locking block on the fixed clip 13121 locks the movable clip 13122, maintaining the fixed clip 13121 and the movable clip 13122 in an open state. The stripping assembly 142 is inserted into the plating removal cylinder 141, into which stripping solution is added, and the clamping member 1312 and the stripping assembly 142 are electrically connected to the power supply system 143, so that the stripping assembly 142 forms the negative electrode and the clamping member 1312 forms the positive electrode, and both form a conductive circuit with the stripping solution to strip the plating material from the clamping member 1312. The stripping solution may be an iron-based copper plating solution, and therefore can be used for stripping instead of conventional solutions made by adding hydrogen peroxide to nitric acid or sulfuric acid.

[0054] When the clamping member 1312 and the stripping assembly 142 are energized simultaneously, the iron-based copper plating solution and the charged clamping member 1312 and stripping assembly 142 form a conductive circuit. This causes an electrolytic reaction of copper in the clamping member 1312, and the copper ions stripped from the clamping member 1312 enter the solution. Some of the copper ions deposit on the surface of the stripping assembly 142, forming a copper layer, while some copper ions remain in the solution. The stripping process removes copper from the clamping member 1312 and transfers it to the stripping assembly 142. Furthermore, it balances the ionic components in the stripping solution, so that even if the clamping member 1312 unexpectedly carries the stripping solution to the next plating process, the stripping solution does not erode the plating cylinder 120, or the stripping solution carried by the clamping member 1312 contaminates the plating solution inside the plating cylinder 120.

[0055] As shown in Figures 20 and 21, in one embodiment of the present invention, the horizontal plating apparatus 100 further includes a cathode conductive device 150 whose main components include a conductive oil tank assembly 151, a cathode assembly 152, a conductive slider assembly 1313, and a recirculation mechanism 153. Conductive oil is filled inside the conductive oil tank assembly 151 to form a conductive medium environment. The cathode assembly 152 is connected to the anode member of the power supply and forms part of the current circuit. The conductive slider assembly 1313 is attached to the clamping mechanism 131 and is immersed in the conductive oil in the conductive oil tank assembly 151. The conductive slider assembly 1313 is electrically connected to the cathode assembly 152 and is used to transmit current from the cathode assembly 152 to the clamping mechanism 131, thereby charging the circuit board 20. The recirculation mechanism 153 includes an oil storage tank 1531 for storing conductive oil and a recirculation assembly 1532. The conductive oil tank assembly 151 is connected to the oil storage tank 1531 via the recirculation assembly 1532, forming a circulation passage for the conductive oil. Specifically, the anode member of the power supply and the cathode assembly 152 form an electric current circuit. The conductive slider assembly 1313 is immersed in the conductive oil in the conductive oil tank assembly 151 and is electrically connected to the cathode assembly 152. The current is transmitted to the clamping mechanism 131 via the conductive slider assembly 1313, charging the circuit board 20.

[0056] During operation, the conductive oil in the conductive oil tank assembly 151 may need to be replaced or replenished due to temperature changes or other factors. The recirculation assembly 1532 forms a circulation passage between the conductive oil tank assembly 151 and the oil storage tank 1531. When the conductive oil needs to be replaced or replenished, the conductive oil in the oil storage tank 1531 flows into the conductive oil tank assembly 151 via the recirculation assembly 1532, and vice versa, thereby realizing the circulating use of the conductive oil. In this solution, current is transmitted using conductive oil as a medium, and the circulating use of conductive oil is realized using the recirculation mechanism 153, ensuring stable current transport and effective management of conductive oil in the horizontal plating process. This method can improve plating efficiency, reduce resource waste, and improve the reliability and maintenance efficiency of the equipment. The core of the entire solution is to use conductive oil as a medium in the plating process and to realize the circulating use of conductive oil through the recirculation mechanism 153. This maintains current stability and conductivity in the plating process, while reducing resource consumption and costs by circulating the conductive oil. Furthermore, this design can reduce mechanical wear and improve the reliability and service life of the system.

[0057] The conductive device 150 includes a conductive oil tank assembly 151, a cathode assembly 152, a conductive slider assembly 1313, and a recirculation mechanism 153, with the addition of an oil supply mechanism 154. The main function of the oil supply mechanism 154 is to supply new conductive oil from an external source to the conductive oil tank assembly 151 to ensure a continuous supply of conductive oil and the normal operation of the system. When it is necessary to replenish or replace the conductive oil in the conductive oil tank assembly 151, the oil supply mechanism 154 supplies new conductive oil to the conductive oil tank assembly 151. The presence of the oil supply mechanism 154 ensures that the conductive oil tank assembly 151 is always supplied with sufficient conductive oil, allowing the system to maintain normal operation even during long periods of operation or high consumption. Replenishing the conductive oil helps maintain the cleanliness of the conductive oil, thereby improving the quality and efficiency of plating. By automatically replenishing the conductive oil with the oil supply mechanism 154, the frequency of manual addition of conductive oil is reduced, simplifying maintenance work and improving the reliability and ease of operation of the device.

[0058] The recirculation mechanism 153 includes an oil storage tank 1531, a recirculation assembly 1532, and an overflow assembly 155 having an overflow port and communicating with the conductive oil tank assembly via the overflow port. The conductive oil tank assembly 151 is communicated with the oil storage tank 1531 via the overflow assembly 155 and has a preset volume. When the liquid volume in the conductive oil tank assembly 151 exceeds the preset volume, the conductive oil in the conductive oil tank assembly 151 can flow into the oil storage tank 1531 via the overflow assembly 155. The overflow assembly 155 enables automatic overflow and circulation of the conductive oil, ensuring that the liquid volume in the conductive oil tank assembly 151 does not exceed a preset volume limit. As can be understood, the overflow assembly 155 can be connected to the conductive oil tank assembly 151 and the oil storage tank 1531 via pipes. The pipe between the overflow port and the conductive oil tank assembly 151 ensures that the conductive oil flows smoothly into the overflow assembly 155. The pipe between the overflow assembly 155 and the oil storage tank 1531 ensures that conductive oil can flow into the oil storage tank 1531.

[0059] As shown in Figures 22 to 25, the horizontal plating apparatus 100 further includes an anode spray apparatus 160 located within the plating cylinder 120, which includes an anode mesh perforated plate 161, a spray assembly 162, and a conductive assembly 163. The anode mesh is used to immerse the circuit board 20 together with the anode mesh in an electrolyte containing plating metal ions. The anode mesh is connected to a power supply to form a potential difference with the circuit board 20, thereby inducing an electrolytic reaction and plating a metal plating layer onto the outer surface of the circuit board 20. The spray assembly 162 is used to spray the reaction solution onto the circuit board 20. The spray assembly 162 has multiple spray tubes, each equipped with multiple nozzles 1621, through which the reaction solution enters the spray tubes and is ejected via the nozzles 1621. One end of the conductive assembly 163 is connected to a rectifier, and the other end is connected to the anode mesh to supply power to the anode mesh, enabling plating.

[0060] In this embodiment of the present invention, at least two sets of anode spray devices 160 are provided within the plating cylinder 120 at intervals along the height direction and have spray surfaces. The spray surfaces of the two sets of anode spray devices 160 are positioned opposite each other with a gap between them to form a plating chamber for the circuit board 20 to move and be plated. The multiple anode spray devices 160 are each sequentially positioned above and below the movement path of the circuit board 20. As the circuit board 20 moves within the plating chamber, the upper and lower anode spray devices 160 spray the reaction solution, ensuring uniform plating on both the upper and lower sides of the circuit board 20. In this embodiment, multiple sets of anode spray devices 160 are provided at intervals along the horizontal direction, and each set of anode spray devices 160 is tightly arranged along the same height, reducing the gaps between the device sets and allowing continuous plating to be performed as the circuit board 20 moves until the plating is complete.

[0061] The anode spray device 160 belongs to the anode conductive part of the apparatus. After assembly is complete, it is fixed to the plating cylinder 120. A reaction solution is added to the plating cylinder 120, the anode spray device 160 is immersed in the reaction solution, and the circuit board 20 is placed between the anode spray devices 160 via a horizontal plating jig. Subsequently, electricity is applied to perform a conductive action and plate the circuit board 20. The anode mesh perforated plate 161 is an auxiliary device for assisting the plating process in the horizontal plating apparatus 100. It provides a uniform current density distribution to the workpiece during the plating process and plays a role in decomposing elemental particles in the reaction solution and adhering them to the circuit board 20.

[0062] Referring to Figure 25, in one embodiment of the present invention, the anode mesh perforated plate 161 includes a perforated plate body 1611 and a guide wheel 1614, wherein the perforated plate body 1611 has a plurality of mesh holes 1612 and a plurality of first spray holes 1613, each mesh hole 1612 is arranged in a hexagon shape, the plurality of mesh holes 1612 are arranged in a honeycomb array on the perforated plate body 1611, the plurality of first spray holes 1613 are provided at intervals on the perforated plate body 1611, the perforated plate body 1611 has a spray side that faces the circuit board 20 and sprays onto the circuit board 20, and the guide wheel 1614 is attached to the spray side of the perforated plate body 1611 in order to contact the circuit board 20.

[0063] In this embodiment, the perforated plate body 1611 of the anode mesh perforated plate 161 is provided horizontally so as to be parallel to the circuit board 20, thereby allowing the circuit board 20 to slide between multiple anode mesh perforated plates 161 in a predetermined direction. The mesh holes 1612 are used to increase light transmittance during plating of the circuit board 20, and a plating anode with good light transmittance can improve the efficiency and quality of the plating process. The plating anode acts as a catalyst in the plating process, plating a thin layer of metal or alloy onto the metal surface through electrolysis. The light transmittance provided by the mesh holes 1612 in the anode mesh perforated plate 161 can support the uniform deposition of metal during the plating process. The anode mesh perforated plate 161 is provided with regular hexagonal mesh holes 1612. By utilizing the angular characteristics of the regular hexagon, three adjacent mesh holes 1612 can be closely arranged, thereby allowing the mesh holes 1612 to be tightly arranged in a honeycomb array on the perforated plate body 1611. This reduces the shielding area between adjacent mesh holes 1612, helps to ensure that light rays are uniformly irradiated onto the plated surface, ensures uniform deposition of the plating layer, and avoids problems of localized excessive thickness or thinness.

[0064] Furthermore, the hexagonal shape has more sides and is closer to a circle than other shapes that can be arranged closely together, resulting in high light transmittance and making it easier to ensure light transmittance in each part compared to equilateral triangles or squares. The good light transmittance of the mesh holes 1612 reduces shadow areas during the plating process, avoids the occurrence of rough or uneven surfaces, and can improve plating quality. The first spray holes 1613 are used to spray the reaction solution. During plating, the drain port of the pipe through which the reaction solution flows is joined to the first spray holes 1613, and the reaction solution is sprayed onto the surface of the circuit board 20 through the first spray holes 1613. The installation of the first spray holes 1613 allows for a wider spray range of the reaction solution, thereby allowing the solution to be sprayed more uniformly onto the surface of the circuit board 20, causing metal ions to adhere more uniformly to the surface of the circuit board 20, and further reacting to produce a more uniform plating layer. Furthermore, in order to prevent scratches on the circuit board 20 caused by friction against the surface of the anode mesh perforated plate 161 when the circuit board 20 falls due to factors such as gravity, multiple guide wheels 1614 are provided on the anode mesh perforated plate 161 at further intervals.

[0065] Referring to Figures 26 and 27, in one embodiment of the present invention, the horizontal plating production line 10 further includes a copper dissolving apparatus 400 for dissolving pure copper with a reaction stock and generating a plating solution by reaction, the copper dissolving apparatus 400 includes a copper dissolving cylinder 410, a transport pipeline 413 and an overflow mechanism 414. The copper dissolving cylinder 410 is provided with a partition plate 411, which partitions the copper dissolving cylinder 410 into a first cylinder block 410a and a second cylinder block 410b. The first cylinder block 410a has a liquid supply port for introducing the reaction stock and a copper granule basket 412 for placing pure copper. The upper part of the partition plate 411 has an overflow section that connects the first cylinder block 410a and the second cylinder block 410b, and the second cylinder block 410b has an overflow port for draining the plating solution. The transport pipeline 413 connects the second cylinder block 410b and the first cylinder block 410a, thereby connecting the first cylinder block 410a, the overflow section, the second cylinder block 410b, and the transport pipeline 413 to form an internal circulation circuit. The overflow mechanism 414 is attached to the overflow port and is used to send the liquid in the second cylinder block 410b to the plating cylinder 120.

[0066] In this embodiment, the copper dissolution cylinder 410 is used to carry out a chemical reaction by filling it with the reaction solution. The reaction stock and pure copper react in the copper dissolution cylinder 410 to produce a plating solution that can be used for plating. The transport pipeline 413 is used to transport the liquid in the second cylinder block 410b to the first cylinder block 410a. The liquid in the first cylinder block 410a flows into the second cylinder block 410b via an overflow section provided at the top of the partition plate 411. The transport pipeline 413 works in cooperation with the overflow section at the top of the partition plate 411 to achieve internal circulation of the liquid in the copper dissolution cylinder 410. The reaction stock solution enters the first cylinder block 410a through the liquid inlet of the first cylinder block 410a. When the level of the solution in the first cylinder block 410a reaches the overflow section, it flows into the second cylinder block 410b via the overflow section. A transport pipe is connected to the bottom of the second cylinder block 410b, and the liquid overflowing from the first cylinder block 410a to the second cylinder block 410b flows back into the first cylinder block 410a via the transport pipe, thereby forming an internal circulation within the copper dissolution cylinder 410. The overflow mechanism 414 is used to flow the plating solution formed by the reaction through the overflow method into the plating cylinder 120.

[0067] In this embodiment, the entire plating circulation system includes a copper dissolving apparatus 400 and a plating cylinder 120. The copper dissolving apparatus 400 consumes a reaction stock solution containing Fe+ from the main groove in the first cylinder block 410a. The reaction stock solution dissolves pure copper to produce Fe+ and Cu+. The copper dissolving cylinder 410 is equipped with an internal circulation system to maintain a balance of chemical solution ion concentrations in the copper dissolving cylinder 410, thereby controlling the ion concentration in the reaction solution transported into the plating cylinder 120 to reach a predetermined standard. The copper dissolving apparatus 400 and the plating cylinder 120 repeatedly transport the chemical solution, continuously transporting a reaction solution containing a large amount of Fe+ and exchanging it with a plating solution containing a large amount of Cu+ and Fe+, thereby obtaining the copper ions necessary for plating in the plating cylinder 120.

[0068] A copper granule basket 412 is located inside the copper dissolution apparatus 400. Pure copper is added to the copper granule basket 412, and the reaction solution containing Fe+ reacts with the pure copper in the first cylinder block 410a. This forms a plating solution containing Fe+ and Cu+, which flows from the first cylinder block 410a into the second cylinder 410b of the copper dissolution granule cylinder. The first cylinder block 410a and the second cylinder 410b are connected by an internal circulation mechanism to achieve internal circulation. In this embodiment, pure copper is placed in the copper granule basket 412, and then, a chemical solution containing Fe+ is drawn into the liquid inlet of the first cylinder block 410a by a power unit and poured into the first cylinder block 410a. The pure copper in the first cylinder block 410a reacts with the Fe+ in the reaction solution, and the Fe+ continuously erodes the pure copper, forming a solution that can be used for plating and contains a large amount of Fe+ and Cu+. Furthermore, the plating solution containing Fe+ and Cu+ is overflowed through the overflow mechanism 414 in the second cylinder 410b and transported to the plating cylinder 120. By using an overflow method to discharge the reaction solution, the amount of copper sludge entering the plating cylinder 120 and contaminating it can be reduced. The internal circulation system of the copper dissolution cylinder 410, realized via an internal circulation mechanism, allows for a more complete reaction, thereby saving costs and maintaining a balance of ion concentrations between the first cylinder block 410a and the second cylinder 410b. Furthermore, the overflow method transports the plating solution containing Fe+ and Cu+ from the second cylinder 410b to the plating cylinder 120. The Cu+ contained in the plating solution formed in the copper dissolution cylinder 410 is the medium necessary for plating the circuit board 20, and the above process is repeated until the copper plating of the circuit board 20 is completed.

[0069] In the technical solution of the present invention, by providing a partition plate 411 in the copper melting cylinder 410, the copper melting cylinder 410 is partitioned into a first cylinder block 410a and a second cylinder block 410b. An overflow section is provided in the partition plate 411, so that the liquid in the first cylinder block 410a can flow into the second cylinder block 410b via the overflow section. Furthermore, a transport pipeline 413 is provided connecting the first cylinder block 410a and the second cylinder block 410b, so that the liquid in the second cylinder block 410b can flow into the first cylinder block 410a via the transport pipeline 413. As a result, the liquid in the first cylinder block 410a and the second cylinder block 410b achieve internal circulation flow, the liquid in the copper melting cylinder 410 reacts more thoroughly with pure copper, and it is only necessary to provide a copper granule basket 412 in the first cylinder block 410a and place pure copper in it, eliminating the need to widely arrange many titanium baskets, thereby improving production efficiency and reducing maintenance costs.

[0070] In one embodiment, the copper melting apparatus 400 further includes a material lifting mechanism 420 mounted on the outside of the cylinder block for transporting pure copper. Due to the height of the copper melting apparatus 400, the cylinder block contains a reaction solution with a high liquid level, and to avoid leakage, several large pipe openings or openings are usually provided at the top of the apparatus, although pure copper is usually fed into the first cylinder block 410a from the top opening of the apparatus. By providing the material lifting mechanism 420, a large pure copper block or pure copper ball can be lifted into the opening by the machine. When it is necessary to replenish and feed pure copper, an operator at a height can feed the copper block directly into the opening in the lifting mechanism, making it easier to feed the copper block into the copper granule basket 412.

[0071] As shown in Figures 1 and 2, the horizontal plating production line 10 further includes a cleaning device 500 and a drying device 600. The number of cleaning devices 500 may be multiple, and they are located at the inlet of the plating cylinder 120 of the horizontal plating apparatus 100 and connected to the circuit board supply device 200 to pre-remove impurities from the circuit board 20, thereby preventing any impact on the plating quality when the circuit board 20 enters the plating cylinder 120 for plating. Alternatively, the cleaning device 500 may be located at the outlet of the plating cylinder 120. After the circuit board 20 has been plated and discharged, it is necessary to pickle the circuit board 20 to prevent oxidation, wash away any acidic solution remaining on the substrate surface, and remove any optical agents remaining on the circuit board 20. The number and location of the cleaning devices 500 are not particularly limited and can be set according to the requirements for substrate cleaning.

[0072] To dry the plated and pickled circuit board 20 and remove water from the circuit board 20, the drying device 600 is located away from the outlet of the plating cylinder 120 of the washing device 500. At this time, the circuit board 20 needs to be cooled slowly to prevent excessive temperature differences from affecting the copper surface or causing stress changes. As can be understood, the drying device 600 can be connected to the inversion device 300. If secondary plating is required, the cooled circuit board 20 can be directly transported from the drying device 600 to the inversion device 300. After the circuit board 20 is flipped over, it can be transported to the next horizontal plating device 100 for secondary plating.

[0073] Furthermore, as shown in Figure 1, the copper melting apparatus 400 is installed at a distance from the horizontal plating apparatus 100, with a channel 30 provided between them for workers to pass through, facilitating the checking and operation of the apparatus on both sides. In addition, on the side of the channel 30 away from the horizontal plating apparatus 100, there are other standard devices such as a photo-additive cylinder, a transformer, an oil tank cooling cylinder, and a pump system, but these will not be described in detail here.

[0074] The foregoing describes only exemplary embodiments of the present invention and does not limit the scope of the patent. Any equivalent structural transformations performed using the contents of the specification and drawings of the present invention, or their direct or indirect application to other related technical fields, under the technical concept of the present invention, are all included within the scope of patent protection of the present invention. [Explanation of symbols]

[0075] 10 Horizontal plating production line 20 Circuit boards 30 channels 100 Horizontal plating apparatus 110 First Unit Frame 111 Guide rail 112 First guide member 113 Second guide member 120 Plated Cylinder 130 Horizontal Plating Conveying Device 131 Clamping Mechanism 1311 Sliding member 1312 Clamping member 13121 Fixing clip 13122 Movable Clip 13123 Lifting support wheel 1313 Conductive Slider Assembly 13131 First conductive slider 13132 Second conductive slider 132 Plating transport mechanism 1321 Conveyor steel belt 1322 Transport drive wheel 1323 Transport Driven Wheel 1324 Tension Mechanism 13241 Tension Bass 13242 Compression Spring 1325 Slide Rail Assembly 140 Cathode conductive clip reverse stripping device 141 Plating removal cylinder 142 Detachment Assembly 143 Power supply system 150 Conductive devices 151 Conductive Oil Tank Assembly 1511 First conductive oil tank 1512 Second conductive oil tank 152 Cathode Assembly 1521 First cathode component 1522 Second cathode component 153 Reflux mechanism 1531 Oil storage tank 1532 Reflux Assembly 154 Oil supply mechanism 155 Overflow Assembly 160 Anode spraying equipment 161 Anode Mesh Perforated Plate 1611 Perforated plate body 1612 mesh holes 1613 First spray hole 1614 Guide Wheel 162 Spray Assembly 1621 Nozzle 163 Conductive Assembly 200 Circuit board supply equipment 210 Second Unit Frame 220 Supply and conveying mechanism 221 Rotating Roller 222 Friction Wheel 230 First positioning mechanism 231 First positioning baffle 232 Second Linear Motor 233 Second push member 240 First push mechanism 241 First Linear Motor 242 First push member 250 Transport Rails 251 First Lifting Mechanism 300 Inverting device 310 Third Unit Frame 320 Feed mechanism 321 First Conveyor Line 322 Second Conveyor Line 323 Third Conveyor Line 3231 Second Lifting Mechanism 324 Fourth Conveyor Line 330 Reversing Mechanism 331 Drive Assembly 3311 Drive motor 3312 Power transmission belt 3313 Transmission Wheel 332 Rotation axis 333 Clamp Assembly 333a Insertion groove 340 Second push mechanism 341 Third Linear Motor 342 Third push member 350 Second positioning mechanism 351 Second positioning baffle 352. Fourth Linear Motor 400 Copper melting equipment 410 Copper melting cylinder 410a First Cylinder Block 410b Second Cylinder Block 411 Partition plate 412 Copper granule basket 413 Conveyor pipeline 414 Overflow mechanism 415 Overflow holes 416 Flow guidance assembly 4161 First deflector 4162 Second deflector 420 Material Lifting Mechanism 500 Cleaning device 600 Drying equipment.

Claims

1. It is a horizontal plating production line, A horizontal plating apparatus comprising a first machine frame, a plating cylinder and a horizontal plating conveying device provided on the first machine frame, wherein the plating cylinder has an inlet and an outlet at both ends, and the horizontal plating conveying device is used to move a circuit board that has entered the plating cylinder from the inlet to the outlet, A horizontal plating production line comprising a circuit board supply device provided at the end of the plating cylinder near the inlet, and including a second machine frame and a supply and transport mechanism provided on the second machine frame, wherein the supply and transport mechanism is used to maintain the circuit board in the plating cylinder horizontally and transport the circuit board along a first direction, thereby moving the circuit board to the horizontal plating transport device.

2. The circuit board supply device is A first positioning mechanism for positioning the circuit board in the supply and transport mechanism to a predetermined position, The horizontal plating production line according to claim 1, further comprising: a first push mechanism for moving a circuit board in the supply and transport mechanism along the first direction to adjust the pitch of two adjacent circuit boards positioned by the first positioning mechanism and arranged along the first direction.

3. The horizontal plating production line according to claim 2, wherein the first push mechanism is used to push a circuit board positioned by the first positioning mechanism so as to move along the first direction, wherein the pitch between the circuit board being pushed and the previous circuit board positioned by the first positioning mechanism is a preset value L, the actual pitch value of the two circuit boards is D, and L and D satisfy L - 1.5 mm ≤ D ≤ L + 1.5 mm.

4. The aforementioned horizontal plating production line includes a reversing device and two horizontal plating devices. The horizontal plating production line according to any one of claims 1 to 3, characterized in that the inversion device is provided between two horizontal plating devices and is used to invert a circuit board plated by one of the horizontal plating devices and transport it to the other horizontal plating device, such that the horizontal plating transport devices of the two horizontal plating devices each sandwich the opposing sides of the circuit board.

5. The reversing device includes a third aircraft frame and a feed mechanism and a reversing mechanism provided on the third aircraft frame. The horizontal plating production line according to claim 4, characterized in that the feeding mechanism is used to horizontally position the circuit board, and the inversion mechanism is used to flip the circuit board in the feeding mechanism.

6. The reversing mechanism includes a drive assembly, a rotating shaft, and a clamping assembly. The horizontal plating production line according to claim 5, characterized in that the clamping assembly is provided on the rotating shaft, the rotating shaft is driven and connected to the drive assembly, the clamping assembly is provided with an insertion groove for inserting a circuit board, and the drive assembly is used to rotate the rotating shaft so that the clamping assembly inverts the circuit board.

7. The feeding mechanism includes a first transport line, a second transport line, a third transport line, and a fourth transport line. The horizontal plating production line according to claim 6, characterized in that the first transport line and the second transport line transport circuit boards along a first direction, the reversing mechanism is provided between the first transport line and the second transport line to reverse the circuit boards in the first transport line to the second transport line, the fourth transport line extends along the transport direction of the first transport line, and the third transport line is provided along a second direction to transport the circuit boards in the second transport line to the fourth transport line, and the first direction and the second direction form an angle.

8. The reversing device further includes a second push mechanism and a second positioning mechanism, The second positioning mechanism is provided on the fourth transport line to position the circuit board to a predetermined position, The horizontal plating production line according to claim 7, characterized in that the second push mechanism is used to sequentially push circuit boards along the first transport line, the second transport line, the third transport line, and the fourth transport line, and to push the circuit boards positioned by the second positioning mechanism to the horizontal plating apparatus, and to adjust the pitch of two adjacent circuit boards positioned by the second positioning mechanism and arranged along the first direction.

9. The horizontal plating conveying device further includes a clamping mechanism and a plating conveying mechanism, and the first machine frame is provided with guide rails along the horizontal direction. The horizontal plating production line according to claim 1, characterized in that the clamping mechanism includes mutually connected sliding members and clamping members, the clamping members are provided in the plating transport mechanism for clamping a circuit board, the sliding members are slidably connected to the guide rail, and the plating transport mechanism is used to move the clamping mechanism along the guide rail for transporting a circuit board.

10. The aforementioned clamping member is Fixing clip and A movable clip is movably attached to the fixing clip via a connecting assembly and cooperates with the fixing clip to clamp the circuit board, The horizontal plating production line according to claim 9, further comprising a lifting support wheel provided on the side of the movable clip away from the fixed clip, which lifts up and down to open and close the movable clip and the fixed clip when the clamping mechanism moves via the plating conveying mechanism.

11. The horizontal plating conveying device further includes a guide assembly provided on the first machine frame, wherein the guide assembly includes a first guide member and a second guide member, the first guide member located on the supply path of the clamping mechanism, the second guide member located on the discharge path of the clamping mechanism, and both the first guide member and the second guide member have guide slopes. In the supply path of the clamping mechanism, in order to clamp the circuit board, the guide slope contacts the lifting support wheel when guiding the clamping mechanism to move, thereby increasing the distance between the fixed clip and the movable clip. The horizontal plating production line according to claim 10, characterized in that, in the discharge path of the clamping mechanism, the guide slope contacts the lifting support wheel when guiding the clamping mechanism to move in order to drop the circuit board, thereby increasing the distance between the fixed clip and the movable clip.

12. The aforementioned plating transport mechanism is A conveying steel belt is provided on the first machine frame, which is slidably mounted thereon and is equipped with the clamping mechanism, A drive mechanism including a transport drive wheel and a transport driven wheel, wherein the transport drive wheel and the transport driven wheel are each provided at both ends of the first machine frame and connected via the transport steel belt to form a closed-loop transmission, thereby realizing continuous transport. The horizontal plating production line according to claim 9, further comprising the conveying steel belt and a tensioning mechanism elastically connected to the first machine frame, which generates elastic deformation to change the horizontal pitch between the first machine frame and the conveying steel belt when the conveying steel belt slides along the first machine frame, thereby tensioning the conveying steel belt.

13. The horizontal plating apparatus further includes a cathode conductive clip reverse stripping apparatus, which includes a plating removal cylinder and a stripping assembly provided on the first machine frame, The horizontal plating production line according to claim 12, characterized in that the conveying steel belt is used to convey the clamping mechanism into the plating removal cylinder in order to remove the plating material from the clamping mechanism, so that the clamping mechanism and the peeling assembly form a conductive circuit.

14. The horizontal plating apparatus further includes a conductive device, and the conductive device is A conductive oil tank assembly in which conductive oil is provided, A cathode assembly connected to the anode component of the power supply to generate current, A conductive slider assembly is arranged in the clamping mechanism, provided within the conductive oil tank assembly and immersed in the conductive oil, electrically connected to the cathode assembly, and transmits current to the horizontal plating jig to charge the circuit board in the horizontal plating jig. A horizontal plating production line according to claim 9, comprising a recirculation mechanism including an oil storage tank and a recirculation assembly, wherein the oil storage tank is used for storing conductive oil, and the conductive oil tank assembly includes a recirculation mechanism that is connected to the oil storage tank via the recirculation assembly and constitutes a circulation passage for circulating the conductive oil in the oil storage tank and the conductive oil in the conductive oil tank assembly to each other.

15. The horizontal plating production line according to claim 14, wherein the conductive device further includes an oil supply mechanism, the recirculation mechanism further includes an overflow assembly, the oil supply mechanism is in communication with the conductive oil tank assembly to supply conductive oil to the oil supply tank assembly, the overflow assembly has an overflow port, the overflow assembly is in communication with the oil supply tank assembly via the overflow port, the conductive oil tank assembly is in communication with the oil storage tank via the overflow assembly and has a preset volume, and when the liquid volume in the conductive oil tank assembly exceeds the preset volume, the conductive oil in the conductive oil tank assembly can flow into the oil storage tank via the overflow assembly.

16. The horizontal plating apparatus further includes an anode spray device provided in the plating cylinder, and the anode spray device is Anode mesh perforated plate, An anode mesh that is detachably attached to the anode mesh perforated plate, A spray assembly attached to the side of the anode mesh away from the anode mesh hole plate, The horizontal plating production line according to claim 1, comprising a conductive assembly wherein the anode mesh is connected to a rectifier via the conductive assembly.

17. The horizontal plating production line according to claim 16, characterized in that at least two sets of the anode spray devices are mounted at intervals within the plating cylinder, the spray sides of the two sets of the anode spray devices are arranged facing each other, and a plating chamber for housing and plating circuit boards is formed between the two sets of the anode spray devices that are arranged facing each other.

18. The aforementioned anode mesh perforated plate is A perforated plate body having a plurality of mesh holes and a plurality of first spray holes, wherein each of the mesh holes is hexagonal, the plurality of mesh holes are arranged in a honeycomb array on the perforated plate body, the plurality of first spray holes are spaced apart on the perforated plate body, and the perforated plate body has a spray side facing the circuit board and spraying the circuit board, The horizontal plating production line according to claim 17, further comprising a guide wheel attached to the spray side of the perforated plate body for contacting the circuit board.

19. The horizontal plating production line further includes a copper dissolving apparatus, and the copper dissolving apparatus is A copper dissolution cylinder having a partition plate inside, the partition plate divides the copper dissolution cylinder into a first cylinder block and a second cylinder block, the first cylinder block having a liquid inlet for supplying the reaction stock solution and a copper granule basket for placing pure copper, the upper part of the partition plate having an overflow section that connects the first cylinder block and the second cylinder block, and the second cylinder block having an overflow port for discharging the plating solution, By connecting the second cylinder block and the first cylinder block, the conveying pipeline connects the first cylinder block, the overflow section, the second cylinder block, and the conveying pipeline to form an internal circulation circuit, The horizontal plating production line according to claim 1, further comprising an overflow mechanism attached to the overflow port for discharging the liquid in the second cylinder block to the plating cylinder.

20. The aforementioned horizontal plating production line is A cleaning device provided at the inlet of the plating cylinder and located between the circuit board supply device and the plating cylinder, and / or at the outlet of the plating cylinder, The horizontal plating production line according to claim 1, further comprising a drying device provided at the outlet of the plating cylinder and located away from the plating cylinder of the cleaning device, for removing water from the circuit board that has been plated and cleaned by the cleaning device.

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