Indication device

The display device addresses power consumption issues by incorporating a sensing switch to control power supply to the sensing unit, thereby reducing power usage during non-touch sensing periods.

JP2026084666APending Publication Date: 2026-05-21LG DISPLAY CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
LG DISPLAY CO LTD
Filing Date
2025-09-24
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Existing display devices face challenges in reducing power consumption during touch sensing periods by maintaining power supply to sensing units that output touch drive signals when they are not in use.

Method used

A display device with a substrate including a display area and a non-display area, featuring a pixel driving circuit, a first electrode, a light-emitting element, and a second electrode, equipped with a sensing unit and a sensing switch that controls power supply to the sensing unit based on a touch enable signal.

Benefits of technology

This design allows power to be cut off to the sensing unit during non-touch drive signal periods, reducing power consumption and enabling a display device with low power characteristics.

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Abstract

During the touch sensing period, if no touch drive signal is output to the touch electrode, the power supply to the sensing unit that performs the function of outputting the touch drive signal is cut off. [Solution] A display device according to an embodiment of the present disclosure includes a substrate including a display area and a non-display area, a pixel driving circuit provided in the display area, a first electrode connected to the pixel driving circuit, a light-emitting element provided on the first electrode and a second electrode provided on the light-emitting element, wherein the pixel driving circuit includes a sensing unit that supplies a cathode voltage or a touch driving signal to the second electrode and a sensing switch that transmits power transmitted from a power supply unit to the sensing unit or cuts off power transmitted from the power supply unit in response to a touch enable signal.
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Description

Technical Field

[0007]

[0001] The present disclosure relates to a display device.

Background Art

[0002] Display devices are applied to various electronic devices such as televisions, mobile phones, notebook computers, and tablets.

[0003] Display devices may include an organic light emitting display (OLED) that outputs light by itself and a liquid crystal display (LCD) that requires a separate light source.

[0004] In recent years, display devices including light emitting diodes (LEDs) have been attracting attention as next-generation display devices. Since light emitting diodes are made of inorganic materials instead of organic materials, they have a faster lighting speed, better luminous efficiency, and can display high-brightness images compared to liquid crystal display devices and organic light emitting display devices.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem to be solved by the present disclosure is to provide a display device that cuts off the power supply to a sensing unit that performs a function of outputting a touch drive signal during a period when the touch drive signal is not output to a touch electrode during a touch sensing period.

[0006] The problem to be solved by the present disclosure is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0007] A display device according to an embodiment of the present disclosure includes a substrate including a display area and a non-display area, a pixel driving circuit provided in the display area, a first electrode connected to the pixel driving circuit, a light-emitting element provided on the first electrode, and a second electrode provided on the light-emitting element, wherein the pixel driving circuit includes a sensing unit that supplies a cathode voltage or touch driving signal to the second electrode, and a sensing switch that transmits power transmitted from a power supply unit to the sensing unit or cuts off power transmitted from a power supply unit according to a touch enable signal.

[0008] Specific details of various examples in this disclosure other than the solutions to the problems mentioned above are included in the following text and figures. [Effects of the Invention]

[0009] According to this disclosure, during the touch sensing period when no touch drive signal is output to the touch electrode, the power supplied to the sensing unit that performs the function of outputting the touch drive signal can be cut off. This makes it possible to reduce the power consumption of the display device.

[0010] Therefore, according to this disclosure, it is possible to provide a display device having low power characteristics, thereby providing a display device that can embody ESG (Environment / Social / Governance).

[0011] The effects of this disclosure are not limited to those mentioned above, and any other effects not mentioned above will be clearly understood by those skilled in the art from the description of the claims. [Brief explanation of the drawing]

[0012] [Figure 1] This is a perspective view showing a display device according to one embodiment of the present disclosure. [Figure 2] This is a plan view of a display device according to one embodiment of the present disclosure. [Figure 3] This is an illustrated diagram showing an enlarged portion of a display device according to one embodiment of the present disclosure. [Figure 4]This figure shows the structure of a pixel driving circuit applied to a display device according to one embodiment of the present disclosure. [Figure 5] This is a plan view of a display panel applied to a display device according to one embodiment of the present disclosure. [Figure 6] This is a plan view of a display panel applied to a display device according to one embodiment of the present disclosure. [Figure 7A] This is a plan view of a display panel applied to a display device according to one embodiment of the present disclosure. [Figure 7B] This is a plan view of a display panel applied to a display device according to one embodiment of the present disclosure. [Figure 8] This is a cross-sectional view of a display panel applied to a display device according to one embodiment of the present disclosure. [Figure 9] This is a cross-sectional view of a light-emitting element applied to a display device according to one embodiment of the present disclosure. [Figure 10] This is an illustrative diagram showing the structure of a touch electrode portion and a display driver applied to a display device according to one embodiment of the present disclosure. [Figure 11A] This is an illustrative diagram showing the structure of a subtouch electrode and a pixel driving circuit applied to a display device according to one embodiment of the present disclosure. [Figure 11B] This is an illustrative diagram showing the connection structure of a subtouch electrode and a pixel driving circuit applied to a display device according to one embodiment of the present disclosure. [Figure 11C] This is an illustrative diagram showing the relationship between a pixel driving circuit and a light-emitting element applied to a display device according to one embodiment of the present disclosure. [Figure 11D] This is an illustrative diagram showing an example of an emission signal applied to a display device according to one embodiment of the present disclosure. [Figure 11E] This is an illustrative diagram showing a pixel circuit applied to a display device according to one embodiment of the present disclosure. [Figure 11F] This is an illustrative diagram showing a touch sensing method in a display device according to one embodiment of the present disclosure. [Figure 11G] This is an illustrative diagram showing the display period and touch sensing period applied to a display device according to one embodiment of the present disclosure. [Figure 12A]It is an exemplary diagram showing various driving methods of a display device according to an embodiment of the present disclosure. [Figure 12B] It is an exemplary diagram showing various driving methods of a display device according to an embodiment of the present disclosure. [Figure 12C] It is an exemplary diagram showing various driving methods of a display device according to an embodiment of the present disclosure. [Figure 12D] It is an exemplary diagram showing various driving methods of a display device according to an embodiment of the present disclosure. [Figure 12E] It is an exemplary diagram showing various driving methods of a display device according to an embodiment of the present disclosure. [Figure 13] It is a diagram showing an electronic device to which a display device according to an embodiment of the present disclosure is applied. [Figure 14] It is a diagram showing an electronic device to which a display device according to an embodiment of the present disclosure is applied. [Figure 15] It is a diagram showing an electronic device to which a display device according to an embodiment of the present disclosure is applied. [Figure 16] It is a diagram showing an electronic device to which a display device according to an embodiment of the present disclosure is applied.

Mode for Carrying Out the Invention

[0013] Advantages, features, and methods for achieving them of the present disclosure will become clear by referring to the embodiments described in detail below together with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below, but is embodied in various different forms, and the present embodiments are merely provided to make the disclosure of this specification complete and to fully inform those with ordinary knowledge in the technical field to which this specification belongs of the scope of the invention.

[0014] The shapes, sizes, proportions, angles, numbers, etc., disclosed in the figures illustrating the embodiments herein are illustrative, and this specification is not limited to those shown in the figures. Throughout the specification, the same reference numeral refers to the same component. Where a specific description of the relevant prior art would be deemed to unnecessarily obscure the gist of this specification, such detailed description is omitted. Where "includes," "has," or "consists of" is used herein, other parts may be added unless "only" is used. When a component is expressed singularly, it includes multiple components unless otherwise explicitly stated.

[0015] In interpreting the constituent elements, even if there is no separate explicit mention of the error range, it shall be interpreted as including the error range.

[0016] When describing a spatial relationship, for example, if the relationship between two parts is described by "above," "at the top," "below," "to the side," or "adjacent," then one or more other parts may be located between the two parts unless, for example, "right next to," "directly," or "nearby" is used.

[0017] When describing temporal relationships, if the temporal sequence is described using phrases such as "after," "following," "next," or "before," it can include cases that are not continuous unless "immediately" or "directly" is used.

[0018] The terms "first," "second," etc., are used to describe various components, but these components are not limited by these terms. These terms are simply used to distinguish one component from others. Therefore, the first component referred to below may also be the second component within the technical concept of this specification.

[0019] Terms such as 1st, 2nd, A, B, (a), or (b) may be used to describe the components of this specification. Such terms are used solely to distinguish a component from other components, and do not limit the nature, order, sequence, or number of the components.

[0020] When a component is described as “connecting,” “joining,” “attaching,” or “adhering” to another component, it should be understood that the component may directly connect, join, attach, or adhere to the other component, but that other components may also be interposed between each component that may indirectly connect, join, attach, or adhere to the other component unless otherwise explicitly stated.

[0021] Where it is stated that a component or layer "contacts" or "overlaps" with another component or layer, it should be understood that while the component or layer may directly contact or overlap with another component or layer, other components may also be interposed between each component that may indirectly contact or overlap, unless otherwise explicitly stated.

[0022] "At least one" must be understood to include all combinations of one or more of the relevant components. For example, "at least one of the first, second, and third components" can be interpreted to include not only the first, second, or third component, but also combinations of two or more of the first, second, and third components.

[0023] The terms "first direction," "second direction," "third direction," "X-axis direction," "Y-axis direction," and "Z-axis direction" should not be interpreted as referring only to geometric relationships where the relationship between them is perpendicular, but may mean that there are broader directions within the range in which the configuration specified herein can function.

[0024] Each feature of the various embodiments described herein can be combined or combined with one another, either partially or as a whole, and various technical interdependencies and drives are possible. Each embodiment can be implemented independently of one another or in conjunction with one another.

[0025] Various embodiments of this specification will be described in detail below with reference to the attached figures.

[0026] Figure 1 is a perspective view showing a display device according to one embodiment of this specification.

[0027] Referring to Figure 1, the display device 1000 according to the embodiment of this specification includes a display panel 100, a polarizing layer 280, an adhesive layer 290, a cover member 120, a support substrate 190, a flexible circuit board 170, and a printed circuit board 160.

[0028] The display panel 100 can display information and images provided to the user.

[0029] The polarizing layer 280 can be placed on the display panel 100. The polarizing layer 280 can prevent or reduce light generated from an external light source from entering the inside of the display panel 100 and affecting the light-emitting elements, etc.

[0030] The adhesive layer 290 can adhere the cover member 120 to the display panel 100. The adhesive layer 290 is positioned between the polarizing layer 280 and the cover member 120, and can adhere the cover member 120 to the polarizing layer 280. The adhesive layer 290 may include an optically clear adhesive (OCA), an optically clear resin (OCR), or a pressure-sensitive adhesive (PSA).

[0031] The cover member 120 may be placed on the polarizing layer 280. The cover member 120 may be placed on the adhesive layer 290. The cover member 120 may be a member for protecting the display panel 100. The cover member 120 may be made of a transparent material.

[0032] The support substrate 190 may be placed between the display panel 100 and the printed circuit board 160. The support substrate 190 may reinforce the rigidity of the display panel 100. The support substrate 190 may be a backplate.

[0033] The flexible circuit board 170 and the printed circuit board 160 may be positioned at the bottom of the display panel 100. The flexible circuit board 170 and the printed circuit board 160 may be positioned at one side edge of the display panel 100. One side of the flexible circuit board 170 may be attached to the display panel 100, and the other side may be attached to the printed circuit board 160. The flexible circuit board 170 may be a flexible film, but the embodiments herein are not limited thereto.

[0034] The printed circuit board 160 may include at least one hole 180. An internal component that senses ambient light or temperature may be placed in the area corresponding to at least one hole 180. For example, the internal component may include at least one of an ambient light sensor (ALS) and a temperature sensor.

[0035] Figure 2 is a plan view of a display device according to one embodiment of this specification, and Figure 3 is an enlarged example view of a part of the display device according to one embodiment of this specification.

[0036] Referring to Figures 2 and 3, the display device 1000 may include a display panel 100, a flexible circuit board 170, and a printed circuit board 160.

[0037] The display panel 100 may include a substrate 110. The substrate 110 may be a member that supports other components of the display panel 100. The substrate 110 may be made of an insulating material. For example, the substrate 110 may be made of glass or resin. The substrate 110 may also be made of a flexible material. For example, the substrate 110 may be made of a flexible plastic material such as polyimide (PI).

[0038] For example, the display panel 100 may include a display area (AA) and a non-display area (NA). Therefore, the substrate 110 may include a display area (AA) and a non-display area (NA). The display area (AA) and non-display area (NA) are not only applicable to the description of the substrate 110, but may also be applicable to the description of the display device 1000.

[0039] The display area (AA) may be the area on which an image is displayed. The display area (AA) may include multiple pixels (PX). Each of the multiple pixels may include multiple subpixels. Each of the multiple subpixels may have at least one light-emitting element.

[0040] The type of light-emitting element can be varied depending on the type of display device 1000. For example, if the display device 1000 is an inorganic light-emitting display device, the light-emitting element may be an LED (Light-emitting Diode), a Micro LED (Micro Light-emitting Diode), or a Mini LED (Mini Light-emitting Diode).

[0041] The display area (AA) can be configured in various shapes depending on the design of the display device 1000. For example, the display area (AA) can be configured as a rectangle with rounded corners. As another example, the display area (AA) can be configured as a rectangle with right-angled corners, or as a circular shape.

[0042] Referring to Figure 3, multiple pixel driving circuits (PDs) can be arranged in the display area (AA). The multiple pixel driving circuits (PDs) may be circuits for driving multiple light-emitting elements provided in multiple subpixels.

[0043] Each of the multiple pixel driver circuits (PDs) may include multiple transistors, including a drive transistor, and storage capacitors, and can supply control signals, power, and drive current to multiple light-emitting elements provided in multiple subpixels to control the light-emitting operation of the multiple light-emitting elements. For example, a pixel driver circuit (PD) may include a power line and a signal line for controlling the on / off state and / or the light-emitting time of the light-emitting elements. For example, multiple pixel driver circuits (PDs) may be manufactured on a semiconductor substrate using a MOSFET (Metal-oxide-silicon field effect transistor) manufacturing process.

[0044] The non-display area (NA) may be an area where no image is displayed. Various lines and circuits for driving multiple pixels (PX) of the display area (AA) may be arranged in the non-display area (NA). For example, various lines and drive circuits can be implemented in the non-display area (NA), and pads (PADs) to which integrated circuits and printed circuits are connected may be arranged.

[0045] For example, the drive circuit may be a data drive circuit and / or a gate drive circuit. A line supplying a control signal for controlling the drive circuit may be located in the non-display area (NA). For example, the control signal may include a clock signal, an input data enable signal, and a synchronization signal. The control signal may be received via a pad section (PAD). For example, a link line (LL) for transmitting signals may be located in the non-display area (NA). For example, drive components such as a flexible circuit board 170 and a printed circuit board 160 may be connected to the pad section (PAD).

[0046] According to this specification, the non-display area (NA) may include a first non-display area (NA1), a bendable area (BA), and a second non-display area (NA2). For example, the first non-display area (NA1) may be an area surrounding at least a portion of the display area (AA). The bendable area (BA) is an area extending from at least one of the multiple sides of the first non-display area (NA1) and may be a bendable area. The second non-display area (NA2) is an area extending from the bendable area (BA) and may have a pad portion (PAD) placed thereon. For example, the bendable area (BA) may be in a bent state, and the remaining area of ​​the substrate 110 excluding the bendable area (BA) may be in a flat state. In this case, the bending of the bendable area (BA) may cause the second non-display area (NA2) to be located on the back side of the display area (AA).

[0047] Multiple link lines (LL) may be arranged in the non-display area (NA). The multiple link lines (LL) may be lines that transmit various signals transmitted from one or more flexible circuit boards (or flexible films) 170 and printed circuit boards 160 to the display area (AA). The multiple link lines (LL) may extend from multiple pad electrodes (PE) in the second non-display area (NA2) toward the bending area (BA) and the first non-display area (NA1), and may be electrically connected to multiple drive lines (VL) in the display area (AA).

[0048] Multiple pixel driver circuits (PDs) can be driven by signals transmitted from one or more flexible circuit boards (or flexible films) 170 and printed circuit boards 160 via link lines (LL) for non-display areas (NA) and drive lines (VL) for display areas (AA).

[0049] For example, the drive line (VL) and link line (LL) may each be lines for transmitting signals output from the flexible circuit board (or flexible film) 170 and the printed circuit board 160 to the pixel drive circuit (PD). The drive line (VL) may be located in the display area (AA) and electrically connected to the pixel drive circuit (PD). The drive line (VL) may extend from the display area (AA) toward the non-display area (NA) and electrically connected to the link line (LL). Thus, signals output from the flexible circuit board (or flexible film) 170 and the printed circuit board 160 can be transmitted to the pixel drive circuit (PD) via the link line (LL) and the drive line (VL).

[0050] When the bending region (BA) bends, a portion of the link line (LL) may also bend along with the bending region (BA). Stress can concentrate on a portion of the bent link line (LL), potentially causing cracks to form. To reduce cracking during bending of the bending region (BA), the link line (LL) may be made of a highly flexible conductive material. For example, the link line (LL) may be made of a highly flexible conductive material such as gold (Au), silver (Ag), or aluminum (Al). Alternatively, the link line (LL) may be made of one of the various conductive materials used in the marking region (AA). For example, the link line (LL) may be made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) and magnesium (Mg), or an alloy thereof. The link line (LL) may be made of a multilayer structure containing various conductive materials. For example, the link line (LL) may be composed of a triple-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti).

[0051] The link line (LL) can be configured in various shapes to reduce stress. At least a portion of the link line (LL) positioned on the bending region (BA) can extend in the same direction as the bending region (BA), or it can extend in a direction different from the bending region (BA) to reduce stress. For example, if the bending region (BA) extends in one direction from the first non-visible region (NA1) to the second non-visible region (NA2), at least a portion of the link line (LL) positioned on the bending region (BA) can extend in a direction inclined from that direction.

[0052] In other examples, at least a portion of the link line (LL) may consist of patterns of various shapes. For example, at least a portion of the link line (LL) located on a bending region (BA) may have a shape in which conductive patterns having at least one of the following shapes are repeatedly arranged: diamond, rhombus, trapezoidal, triangular, sawtooth, sinusoidal, circular, and omega (Ω) shapes.

[0053] Therefore, in order to minimize the stress concentrated in the link line (LL) and the resulting cracks, the shape of the link line (LL) can consist of various shapes, including the shapes described above.

[0054] According to this specification, the width of a second non-display area (NA2) where multiple pad electrodes (PE) are located may be wider than the width of a bent area (BA) where only multiple link lines (LL) are located. Similarly, the width of a display area (AA) where multiple subpixels are located may be wider than the width of a bent area (BA) where only multiple link lines (LL) are located. Figures 2 and 3 show a substrate 110 in which the width of the bent area (BA) is narrower than the width of other areas of the substrate 110. However, the shape of the substrate 110 including the bent area (BA) is illustrative, and therefore the embodiments described herein are not limited thereto.

[0055] A pad section (PAD) including multiple pad electrodes (PE) may be arranged in the second non-display area (NA2). One or more drive components including a flexible circuit board (or flexible film) 170 and a printed circuit board 160 may be attached to or bonded to the pad section (PAD). The multiple pad electrodes (PE) of the pad section (PAD) are electrically connected to one or more flexible circuit boards (or flexible films) 170 and can transmit various signals (or power) received from the printed circuit board 160 and the flexible circuit boards (or flexible films) 170 to multiple pixel drive circuits (PD) of the display area (AA).

[0056] The flexible circuit board (or flexible film) 170 may be a flexible base film, and various components can be placed on the flexible circuit board. For example, drive ICs such as gate driver ICs and data driver ICs can be placed on the flexible circuit board (or flexible film) 170. The drive ICs may be referred to as drive drivers below.

[0057] The driver IC may be a component that processes data and drive signals for displaying the image. The driver IC may be disposed in a chip-on-glass (COG), chip-on-film (COF), or tape carrier package (TCP), but the embodiments herein are not limited to these. The flexible circuit board (or flexible film) 170 may be attached to or bonded to a plurality of pad electrodes (PEs) via a conductive adhesive layer.

[0058] The printed circuit board 160 may be a component that is electrically connected to one or more flexible circuit boards (or flexible films) 170 and supplies signals to a drive IC. The printed circuit board 160 may be located on one side of the flexible circuit board (or flexible film) 170 and be electrically connected to the flexible circuit board (or flexible film) 170. Various components for supplying various signals to the drive IC may be arranged on the printed circuit board 160. For example, various components such as a timing controller, power supply unit, memory, or processor may be arranged on the printed circuit board 160. For example, the printed circuit board 160 may include a power management integrated circuit (PMIC).

[0059] Figure 4 shows the structure of a pixel driving circuit applied to a display device according to one embodiment of this specification.

[0060] In the above, the pixel driver (PD) described with reference to Figure 3 may be a microdriver (μDriver) as shown in Figure 4. In Figure 4, one light-emitting element (ED) is connected to the microdriver (μDriver), but the embodiments described herein are not limited to this.

[0061] For example, eight light-emitting elements (EDs) may be connected to one microdriver (μDriver). As another example, sixteen light-emitting elements (EDs) may be connected to one microdriver, or 32 or 64 light-emitting elements (EDs) may be connected to one microdriver. The light-emitting elements (EDs) may be micro-light-emitting elements (μLEDs). To elaborate further, one pixel driver circuit (PD) (e.g., a microdriver (μDriver)) may be connected to at least two light-emitting elements (EDs). In this case, one pixel driver circuit (PD) (e.g., a microdriver (μDriver)) may comprise one or more pixel circuits (PCs) as shown in Figure 4. A pixel circuit (PC) may be connected to at least one light-emitting element (ED). The pixel driver circuit (PD) included in the microdriver (μDriver) may include a driver transistor (TDR) and a light-emitting transistor (TEM).

[0062] For example, a high-potential power supply voltage (VDD) may be applied to the first electrode of a drive transistor (TDR), the first electrode of a light-emitting transistor (TEM) may be connected to the second electrode of the drive transistor (TDR), and a scan signal (SC) may be applied to the gate electrode of the drive transistor (TDR). The scan signal (SC) applied to the gate electrode of the drive transistor (TDR) may be a DC power supply, and a fixed reference voltage may be applied for each frame.

[0063] The first electrode of a light-emitting transistor (TEM) can be connected to the second electrode of a drive transistor (TDR), a light-emitting element (ED) can be connected to the second electrode of the light-emitting transistor (TEM), and a light-emitting signal (EM) can be applied to the gate electrode of the light-emitting transistor (TEM). The light-emitting signal (EM) applied to the gate electrode of the light-emitting transistor (TEM) may be a pulse-width modulation (PWM) signal that varies from frame to frame.

[0064] The first electrode of the light-emitting element (ED) may be connected to the second electrode of the light-emitting transistor (TEM), and the second electrode of the light-emitting element (ED) may be connected to ground. For example, the first electrode of the light-emitting element (ED) may be the anode electrode, and the second electrode of the light-emitting element (ED) may be the cathode electrode.

[0065] The driver transistor (TDR) and the light-emitting transistor (TEM) can each be either an n-type transistor or a p-type transistor.

[0066] A scan signal (SC) applied from a timing controller (T-CON) can turn on the drive transistor (TDR), and a light-emitting transistor (TEM) can be turned on by a light-emitting signal (EM). In this case, a high-potential power supply voltage (VDD) applied to the first electrode of the drive transistor (TDR) can apply a drive current to the light-emitting element (ED) via the drive transistor (TDR) and the light-emitting transistor (TEM), thereby causing the light-emitting element (ED) to emit light.

[0067] Figures 5 to 7B are plan views of a display panel applied to a display device according to one embodiment of this specification. For example, Figure 5 is a magnified plan view of a portion of a display area (AA) containing multiple pixels, Figure 6 is a magnified plan view of a portion of a display area (AA) containing one pixel, Figure 7A is another plan view showing the area shown in Figure 5, and Figure 7B is a plan view showing the two second electrodes (CE2) shown in Figure 7A. Figures 5 and 6 show multiple signal lines (TL), multiple communication lines (NL), multiple first electrodes (CE1), multiple banks (BNK), and multiple light-emitting elements (ED). Figure 7A shows two additional second electrodes (CE2) to the plan view shown in Figure 5, and Figure 7B shows the two second electrodes (CE2) shown in Figure 7A.

[0068] Referring to Figures 5 to 7B, a display area (AA) can contain multiple pixels (PX) each consisting of multiple subpixels. Each of the multiple subpixels includes a light-emitting element (ED) and can independently emit light. The multiple subpixels can be arranged in a matrix configuration, consisting of multiple rows and multiple columns.

[0069] The subpixels may include a first subpixel (SP1), a second subpixel (SP2), and a third subpixel (SP3). For example, one of the first subpixel (SP1), second subpixel (SP2), and third subpixel (SP3) may be a red subpixel, another a green subpixel, and the remaining one a blue subpixel. The types of subpixels are illustrative, and the examples herein are not limited thereto.

[0070] Each of multiple pixels (PX) may contain one or more first subpixels (SP1), one or more second subpixels (SP2), and one or more third subpixels (SP3). For example, a single pixel (PX) may contain a pair of first subpixels (SP1), a pair of second subpixels (SP2), and a pair of third subpixels (SP3).

[0071] A pair of first subpixels (SP1) may include a first a subpixel (SP1a) and a first b subpixel (SP1b). A pair of second subpixels (SP2) may include a second a subpixel (SP2a) and a second b subpixel (SP2b). A pair of third subpixels (SP3) may include a third a subpixel (SP3a) and a third b subpixel (SP3b). For example, a single pixel (PX) may include a first a subpixel (SP1a) and a first b subpixel (SP1b), a second a subpixel (SP2a) and a second b subpixel (SP2b), and a third a subpixel (SP3a) and a third b subpixel (SP3b).

[0072] Multiple subpixels constituting a single pixel (PX) can be arranged in various ways. For example, a pair of first subpixels (SP1), a pair of second subpixels (SP2), and a pair of third subpixels (SP3) may be arranged in the same column within a single pixel (PX). The first subpixels (SP1), second subpixels (SP2), and third subpixels (SP3) may be arranged in the same row. The number and arrangement of multiple subpixels constituting a single pixel (PX) are illustrative examples, and the embodiments herein are not limited thereto.

[0073] Multiple signal lines (TLs) may be arranged in the region between multiple subpixels. Multiple signal lines (TLs) may extend in the column direction between multiple subpixels. Multiple signal lines (TLs) may be lines that transmit the anode voltage transmitted from the pixel driver circuit (PD in Figure 3) to the multiple subpixels. For example, the signal lines (TLs) may be electrically connected to the pixel driver circuit (PD) and the first electrode (CE1) of the subpixel. The anode voltage output from the pixel driver circuit (PD) (e.g., a microdriver (μDriver)) may be transmitted to the first electrode (CE1) of the subpixel via the signal lines (TLs).

[0074] For example, the first electrode (CE1) may be an electrode electrically connected to the anode electrode of the light-emitting element (ED). The anode voltage transmitted via the signal line (TL) may be transmitted to the anode electrode of the light-emitting element (ED) via the first electrode (CE1). That is, the first electrode (CE1) is connected to the anode electrode. Therefore, in the following description, the first electrode (CE1) may mean the anode electrode, or it may mean another electrode connected to the anode electrode.

[0075] In one embodiment of the display device described herein, instead of forming multiple transistors and storage capacitors in each of the multiple subpixels, the structure of the display device 1000 can be simplified by using a pixel driver circuit (PD) that integrates multiple pixel circuits (PCs). Furthermore, since the circuits that are arranged in each of the multiple subpixels are integrated into a single pixel driver circuit (PD), highly efficient, low-power driving may be possible.

[0076] Multiple signal lines (TLs) may include a first signal line (TL1), a second signal line (TL2), a third signal line (TL3), a fourth signal line (TL4), a fifth signal line (TL5), and a sixth signal line (TL6). Each of the first signal line (TL1) and the second signal line (TL2) may be electrically connected to a pair of first subpixels (SP1). Each of the third signal line (TL3) and the fourth signal line (TL4) may be electrically connected to a pair of second subpixels (SP2). Each of the fifth signal line (TL5) and the sixth signal line (TL6) may be electrically connected to a pair of third subpixels (SP3).

[0077] A first signal line (TL1) may be placed on one side of a pair of first subpixels (SP1), and a second signal line (TL2) may be placed on the other side of the pair of first subpixels (SP1). The first signal line (TL1) may be electrically connected to the first electrode (CE1) of one of the first subpixels (SP1) of the pair, for example, the first a subpixel (SP1a). The second signal line (TL2) may be electrically connected to the first electrode (CE1) of the remaining first subpixel (SP1) of the pair, for example, the first b subpixel (SP1b).

[0078] A third signal line (TL3) may be placed on one side of a pair of second subpixels (SP2), and a fourth signal line (TL4) may be placed on the other side of the pair of second subpixels (SP2). For example, the third signal line (TL3) may be placed adjacent to the second signal line (TL2). The third signal line (TL3) may be electrically connected to the first electrode (CE1) of one of the second subpixels (SP2) of the pair, for example, the seconda subpixel (SP2a). The fourth signal line (TL4) may be electrically connected to the first electrode (CE1) of the remaining second subpixel (SP2) of the pair, for example, the secondb subpixel (SP2b).

[0079] A fifth signal line (TL5) may be placed on one side of a pair of third subpixels (SP3), and a sixth signal line (TL6) may be placed on the other side of the pair of third subpixels (SP3). For example, the fifth signal line (TL5) may be placed adjacent to the fourth signal line (TL4). The sixth signal line (TL6) may be placed adjacent to the first signal line (TL1) connected to an adjacent pixel (PX). The fifth signal line (TL5) may be electrically connected to the first electrode (CE1) of one of the third subpixels (SP3) of the pair, for example, the thirda subpixel (SP3a). The sixth signal line (TL6) may be electrically connected to the first electrode (CE1) of the remaining third subpixel (SP3) of the pair, for example, the thirdb subpixel (SP3b).

[0080] Signal lines (TLs) can consist of conductive materials. For example, signal lines (TLs) can be composed of conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), and indium gallium zinc oxide (IGZO). As another example, multiple signal lines (TLs) can consist of a multilayer structure containing conductive materials. For example, multiple signal lines (TLs) can consist of a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO).

[0081] Multiple communication lines (NL) may be arranged in the region between adjacent pixels (PX). Communication lines (NL) may extend in the row direction within the region between adjacent pixels (PX). Communication lines (NL) may be arranged in the region between adjacent second electrodes (CE2) and may not overlap adjacent second electrodes (CE2). For example, communication lines (NL) may be lines used for short-range communication such as NFC (Near Field Communication). Communication lines (NL) can also function as antennas.

[0082] According to this specification, a bank (BNK) may be placed in each of a plurality of subpixels. A bank (BNK) may be a structure on which light-emitting elements (EDs) are attached. Multiple banks (BNKs) may guide the positions of multiple light-emitting elements (EDs) in a transfer process for transferring multiple light-emitting elements (EDs). In the transfer process for multiple light-emitting elements (EDs), multiple light-emitting elements (EDs) may be transferred onto multiple banks (BNKs). The entire area of ​​a light-emitting element (ED) may overlap with a bank (BNK). Multiple banks (BNKs) may be a bank pattern or a structure, but the embodiments herein are not limited thereto.

[0083] The banks (BNK) of the first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3) can be arranged spaced apart from each other. The banks (BNK) of the first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3) can be separated. This makes it easy to distinguish between the banks (BNK) of the first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3) onto which different types of light-emitting elements (EDs) are transferred.

[0084] The banks (BNK) of the first subpixel (SP1a) and the banks (BNK) of the first subpixel (SP1b) can be linked together, separated from each other, or formed separately. For example, the banks (BNK) of the first subpixel (SP1a) and the banks (BNK) of the first subpixel (SP1b) where the same type of light-emitting element (ED) is arranged, taking into consideration the design of the transfer process requirements, can be linked together, separated from each other, or formed separately. Similarly, the banks (BNK) of the second subpixel (SP2a) and the banks (BNK) of the second subpixel (SP2b) can be linked together, separated from each other, or formed separately. The banks (BNK) of the third subpixel (SP3a) and the banks (BNK) of the third subpixel (SP3b) can be linked together, separated from each other, or formed separately. Therefore, a bank of a pair of first subpixels (SP1), a bank of a pair of second subpixels (SP2), and a bank of a pair of third subpixels (SP3) can be formed in various forms.

[0085] For example, each of the multiple banks (BNKs) may consist of an organic insulating material. Each of the multiple banks (BNKs) may consist of a single or multiple layer of the organic insulating material. For example, each of the multiple banks (BNKs) may consist of a photoresist, polyimide (PI), or acrylic material.

[0086] A first electrode (CE1) may be placed on each of the multiple subpixels. The first electrode (CE1) may be placed on the bank (BNK) while superimposing it with the bank (BNK). The first electrode (CE1) may be electrically connected to one of the multiple signal lines (TL) (TL).

[0087] At least a portion of the first electrode (CE1) may extend outside the bank (BNK) and be electrically connected to the signal line (TL) closest to the first electrode (CE1). A portion of the first electrode (CE1) may overlap with the bank (BNK), while the remainder of the first electrode (CE1) may not overlap with the bank (BNK).

[0088] For example, a portion of the first electrode (CE1) of the first subpixel (SP1a) may extend to one side of the first subpixel (SP1a) and be electrically connected to the first signal line (TL1), and a portion of the first electrode (CE1) of the first subpixel (SP1b) may extend to the other side of the first subpixel (SP1b) and be electrically connected to the second signal line (TL2). A portion of the first electrode (CE1) of the second subpixel (SP2a) may extend to one side of the second subpixel (SP2a) and be electrically connected to the third signal line (TL3), and a portion of the first electrode (CE1) of the second subpixel (SP2b) may extend to the other side of the second subpixel (SP2b) and be electrically connected to the fourth signal line (TL4). A portion of the first electrode (CE1) of the third subpixel (SP3a) may extend to one side of the third subpixel (SP3a) and be electrically connected to the fifth signal line (TL5), and a portion of the first electrode (CE1) of the third subpixel (SP3b) may extend to the other side of the third subpixel (SP3b) and be electrically connected to the sixth signal line (TL6).

[0089] The first electrode (CE1) is electrically connected to the anode electrode of the light-emitting element (ED). The anode voltage transmitted from the pixel driver circuit (PD) can be transmitted to the light-emitting element (ED) via the signal line (TL) and then the first electrode (CE1). Different voltages may be applied to the first electrode (CE1) of each of the multiple subpixels depending on the displayed image. For example, different voltages may be applied to the first electrodes (CE1) of multiple subpixels. Therefore, the first electrode (CE1) can be named a pixel electrode.

[0090] The first electrode (CE1) may be made of a conductive material. For example, the first electrode (CE1) may be integrated with the signal line (TL). For example, the first electrode (CE1) may be made of the same conductive material as the signal line (TL). For example, the first electrode (CE1) may be made of one of the following conductive materials: titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO). As another example, the first electrode (CE1) may be made of a multilayer structure of conductive material. For example, multiple first electrodes (CE1) may consist of a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO).

[0091] A light-emitting element (ED) may be placed in each of the multiple subpixels. The light-emitting element (ED) may be either an LED (Light-emitting Diode) or a Micro LED (Micro Light-emitting Diode). The light-emitting element (ED) may be placed on the bank (BNK) and the first electrode (CE1) while superimposing them on the bank (BNK) and the first electrode (CE1). The entire area of ​​the light-emitting element (ED) may superimpose on the bank (BNK) and the first electrode (CE1).

[0092] The light-emitting element (ED) is positioned on the first electrode (CE1) and can be electrically connected to the first electrode (CE1). Thus, the light-emitting element (ED) can output light using the anode voltage (or anode current) transmitted from the pixel driver circuit (PD) via the signal line (TL) and the first electrode (CE1).

[0093] The multiple light-emitting elements (EDs) may include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150. The first light-emitting element 130 may be located in a first subpixel (SP1). The second light-emitting element 140 may be located in a second subpixel (SP2). The third light-emitting element 150 may be located in a third subpixel (SP3). For example, one of the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150 may be a red light-emitting element, another may be a green light-emitting element, and the rest may be blue light-emitting elements, but the embodiments herein are not limited thereto. By combining the red, green, and blue light emitted by the multiple light-emitting elements (EDs), various colors of light, including white, can be realized. The types of multiple light-emitting elements (EDs) are illustrative, and the embodiments herein are not limited thereto.

[0094] The first light-emitting element 130 may include a first a-light-emitting element 130a located in the first a subpixel (SP1a), and a first b-light-emitting element 130b located in the first b subpixel (SP1b). The second light-emitting element 140 may include a second a-light-emitting element 140a located in the second a subpixel (SP2a) and a second b-light-emitting element 140b located in the second b subpixel (SP2b). The third light-emitting element 150 may include a third a-light-emitting element 150a located in the third a subpixel (SP3a) and a third b-light-emitting element 150b located in the third b subpixel (SP3b).

[0095] The second electrode (CE2) can be placed in each of the multiple subpixels.

[0096] The second electrode (CE2) may be placed on the light-emitting element (ED). The second electrode (CE2) may be electrically connected to the pixel driver circuit (PD) via a plurality of contact electrodes (CCE).

[0097] For example, the second electrode (CE2) is electrically connected to the cathode electrode of the light-emitting element (ED) and can transmit the cathode voltage transmitted from the pixel driver circuit (PD) to the light-emitting element (ED). In other words, the second electrode (CE2) is connected to the cathode electrode. Therefore, in the following description, the second electrode (CE2) can mean the cathode electrode, or it can mean a separate electrode connected to the cathode electrode.

[0098] Multiple subpixels can have the same cathode voltage applied to their second electrodes (CE2). For example, the same voltage can be applied to the second electrodes (CE2) provided on multiple subpixels. Therefore, the second electrode (CE2) can be called a common electrode.

[0099] At least some of the multiple subpixels may share a second electrode (CE2). For example, the second electrode (CE2) may be present in at least two subpixels. More specifically, the second electrode (CE2) may be present in at least one pixel (PX) of multiple pixels (PX) arranged in the same row in the lateral direction (X-axis direction). For example, one second electrode (CE2) may be placed on multiple pixels (PX). That is, one second electrode (CE2) may be placed on n subpixels (where n is a natural number). Figures 7A and 7B show a display device in which one second electrode (CE2) is provided on two pixels (PX) arranged along the lateral direction (X-axis direction).

[0100] In this case, the second electrodes (CE2) provided on multiple subpixels can be arranged separately from each other. For example, the second electrode (CE2) connected to the pixel (PX) in the nth row and the second electrode (CE2) connected to the pixel (PX) in the (n+1)th row can be arranged separately from each other. For example, as shown in Figures 7A and 7B, multiple second electrodes (CE2) can be arranged separately from each other with multiple communication lines (NL) extending in the row direction in between. Therefore, the number of multiple subpixels may be greater than the number of multiple second electrodes (CE2).

[0101] Multiple second electrodes (CE2) can be made of a transparent conductive material. When multiple second electrodes (CE2) are made of a transparent conductive material, the light emitted from the light-emitting element (ED) can be directed towards the top of the second electrodes (CE2). For example, the second electrodes (CE2) can be made of transparent conductive materials such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO).

[0102] Multiple contact electrodes (CCEs) can be arranged on the substrate 110. For example, the multiple contact electrodes (CCEs) can be arranged at a distance from multiple banks (BNKs) and multiple signal lines (TLs). Each of the multiple second electrodes (CE2) can be superimposed on at least one contact electrode (CCE). For example, one second electrode (CE2) can be superimposed on multiple contact electrodes (CCEs).

[0103] For example, multiple contact electrodes (CCEs) may be electrically connected to a second electrode (CE2). The contact electrodes (CCEs) are positioned between the substrate 110 and the second electrode (CE2) and can transmit the cathode voltage transmitted from the pixel drive circuit (PD) to the second electrode (CE2).

[0104] When using micro-LEDs as light-emitting elements (EDs), multiple micro-LEDs can be formed on a wafer, and the display panel 100 can be manufactured by transferring the micro-LEDs to a substrate 110. Various defects can occur during the process of transferring multiple fine-sized light-emitting elements (EDs) from the wafer to the substrate 110. For example, some subpixels may not be transferred, resulting in a non-transfer defect, while other subpixels may be transferred with the light-emitting elements (EDs) shifted from their designated positions due to alignment errors. Furthermore, even if the transfer process proceeds normally, the transferred light-emitting elements (EDs) themselves may be defective. Therefore, considering defects during the transfer process for multiple light-emitting elements (EDs), multiple identical light-emitting elements (EDs) can be transferred to a single subpixel. After lighting tests are performed on the multiple light-emitting elements (EDs), only the single light-emitting element (ED) that is ultimately judged to be normal can be used.

[0105] For example, a first a-element light-emitting element 130a and a first b-element light-emitting element 130b can be transferred together to a single pixel (PX), and their defects can be checked. If both the first a-element light-emitting element 130a and the first b-element light-emitting element 130b are determined to be normal, only the first a-element light-emitting element 130a may be used, and the first b-element light-emitting element 130b may remain unused. As another example, if only the first b-element light-emitting element 130b is determined to be normal, the first a-element light-emitting element 130a will remain unused, and only the first b-element light-emitting element 130b can be used. Therefore, even if multiple identical light-emitting elements (EDs) are transferred to a single pixel (PX), ultimately only one light-emitting element (ED) can be used.

[0106] In this case, one of a pair of light-emitting elements (EDs) can be called the main (or primary) ED, and the other ED can be called the redundant ED. The redundant ED may be an extra ED that is transferred in case the main ED fails. If the main ED fails, the redundant ED can be used in its place. By transferring both the main ED and the redundant ED together to a single pixel (PX), the degradation of display quality due to failures of the main ED and the redundant ED can be minimized.

[0107] For example, the first a-element light-emitting element 130a, the second a-element light-emitting element 140a, and the third a-element light-emitting element 150a transferred to a single pixel (PX) can be used as the main element-emitting element (ED), while the first b-element light-emitting element 130b, the second b-element light-emitting element 140b, and the third b-element light-emitting element 140b can be used as redundant element-emitting elements (ED).

[0108] Figure 8 is a cross-sectional view of a display panel applied to a display device according to one embodiment of this specification, and Figure 9 is a cross-sectional view of a light-emitting element applied to a display device according to one embodiment of this specification. For example, Figure 8 is a cross-sectional view of a display area (AA), a first non-display area (NA), a bending area (BA), and a second non-display area (NA2), and Figure 9 is a cross-sectional view of a light-emitting element (ED) provided in the display area (AA).

[0109] Referring to Figure 8, the first buffer layer 111a and the second buffer layer 111b can be placed in the remaining area of ​​the substrate 110, excluding the bending region (BA).

[0110] The first buffer layer 111a and the second buffer layer 111b may be placed in the display area (AA), the first non-display area (NA1), and the second non-display area (NA2). The first buffer layer 111a and the second buffer layer 111b can reduce the penetration of moisture or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b may be made of an inorganic insulating material. For example, each of the first buffer layer 111a and the second buffer layer 111b may consist of a single layer of silicon oxide (SiOx) or silicon nitride (SiNx), or may consist of a multilayer containing at least one of silicon oxide (SiOx) and silicon nitride (SiNx), but the embodiments herein are not limited thereto.

[0111] For example, portions of the first buffer layer 111a and the second buffer layer 111b located in the bending region (BA) can be removed. The upper surface of the substrate 110 located in the bending region (BA) can be exposed without being covered by the first buffer layer 111a and the second buffer layer 111b. Removing the first buffer layer 111a and the second buffer layer 111b, which are made of inorganic insulating material, from the bending region (BA) can minimize cracks in the first buffer layer 111a and the second buffer layer 111b that may occur during bending.

[0112] Multiple alignment keys (MKs) may be placed between the first buffer layer 111a and the second buffer layer 111b. These alignment keys (MKs) may be configured to identify the position of the pixel drive circuit (PD) during the manufacturing process of the display panel 100. For example, they may be configured to align the position of the pixel drive circuit (PD) transferred onto the adhesive layer 112. However, the alignment keys (MKs) may be omitted.

[0113] An adhesive layer 112 may be placed on the second buffer layer 111b. The adhesive layer 112 may be placed in the display area (AA), the first non-display area (NA1), the bending area (BA), and the second non-display area (NA2). At least a portion of the adhesive layer 112 may be removed in the non-display areas (NA1, NA2) including the bending area (BA). For example, the adhesive layer 112 may consist of one of the following: an adhesive polymer, an epoxy resin, a UV-curable resin, a polyimide-based resin, an acrylate-based resin, a urethane-based resin, and polydimethylsiloxane (PDMS).

[0114] In the display area (AA), a pixel drive circuit (PD) may be placed on the adhesive layer 112. The pixel drive circuit (PD) may be mounted on the adhesive layer 112 by a transfer process, but the embodiments described herein are not limited to this.

[0115] A first protective layer 113a and a second protective layer 113b may be placed on the adhesive layer 112 and the pixel drive circuit (PD). The first protective layer 113a and the second protective layer 113b may be placed so as to surround the sides of the pixel drive circuit (PD). For example, the second protective layer 113b may be placed so as to cover at least a portion of the upper surface of the pixel drive circuit (PD). At least one of the first protective layer 113a and the second protective layer 113b placed on the bending region (BA) may be omitted. For example, the first protective layer 113a may be placed entirely on the display region (AA) and the non-display region (NA), the second protective layer 113b may be placed partially on the display region (AA), the first non-display region (NA1), and the second non-display region (NA2), and the second protective layer 113b may not be placed on the bending region (BA).

[0116] The first protective layer 113a and the second protective layer 113b may be composed of an organic insulating material. For example, the first protective layer 113a and the second protective layer 113b may be composed of a photoresist, polyimide (PI), or photoacrylic material. The first protective layer 113a and the second protective layer 113b may be an overcoat layer or an insulating layer.

[0117] According to this specification, a plurality of first connecting lines 121 may be arranged on the second protective layer 113b in the display area (AA). The first connecting lines 121 may be lines for electrically connecting a pixel driving circuit (PD) to other components. The pixel driving circuit (PD) may be electrically connected to signal lines (TL) and contact electrodes (CCE) etc. via the first connecting lines 121.

[0118] The first connecting line 121 may include the first a connecting line 121a, the first b connecting line 121b, the first c connecting line 121c, and the first d connecting line 121d.

[0119] Multiple first a-connection lines 121a may be arranged on the second protective layer 113b. Multiple first a-connection lines 121a may be electrically connected to a pixel drive circuit (PD). The first a-connection lines 121a may transmit the voltage output from the pixel drive circuit (PD) to the first electrode (CE1) or the second electrode (CE2).

[0120] A third protective layer 114 may be placed on the second protective layer 113b. The third protective layer 114 may be placed entirely in the display area (AA) and the non-display area (NA). In the bending area (BA), the third protective layer 114 may cover or overlap the sides of the second protective layer 113b and the top surface of the first protective layer 113a. The third protective layer 114 may be made of an organic insulating material. For example, the third protective layer 114 may be made of a photoresist, polyimide (PI), or photoacrylic material. The first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may be made of the same material, but the examples herein are not limited thereto.

[0121] Multiple firstb connection lines 121b may be arranged on the third protective layer 114. The firstb connection lines 121b may be connected to the pixel driver circuit (PD) via the firsta connection lines 121a or directly to the pixel driver circuit (PD). For example, a portion of the firstb connection lines 121b may be directly connected to the pixel driver circuit (PD) via contact holes in the third protective layer 114. Another portion of the firstb connection lines 121b may be electrically connected to the firsta connection lines 121a via contact holes in the third protective layer 114. However, the embodiments herein are not limited thereto. For example, a voltage output from the pixel driver circuit (PD) may be transmitted to a first electrode (CE1) or a second electrode (CE2) via connection lines different from the firstb connection lines 121b.

[0122] Multiple first b connecting lines 121b may be arranged on the first insulating layer 115a. The first insulating layer 115a may be arranged entirely over the display area (AA) and the non-display area (NA), but the embodiments herein are not limited thereto. The first insulating layer 115a may be composed of an organic insulating material. For example, the first insulating layer 115a may be composed of a photoresist, polyimide (PI), or photoacrylic material.

[0123] Multiple first c-connection lines 121c can be arranged on the first insulating layer 115a. The first c-connection lines 121c can be electrically connected to the first b-connection lines 121b. For example, the first c-connection lines 121c can be electrically connected to the first b-connection lines 121b via contact holes in the first insulating layer 115a.

[0124] A second insulating layer 115b may be placed on a plurality of first c connecting lines 121c. The second insulating layer 115b may be placed in the remaining areas excluding the bending region (BA), but the embodiments herein are not limited thereto. The second insulating layer 115b may be placed in the display region (AA), the first non-display region (NA1), and the second non-display region (NA2). For example, at least a portion of the second insulating layer 115b placed in the bending region (BA) may be removed. The second insulating layer 115b may be composed of an organic insulating material. For example, the second insulating layer 115b may be composed of a photoresist, polyimide (PI), or photoacrylic material.

[0125] Multiple first d connection lines 121d can be arranged on the second insulating layer 115b. The first d connection lines 121d can be electrically connected to the first c connection lines 121c. For example, the first d connection lines 121d can be electrically connected to the first c connection lines 121c via contact holes in the second insulating layer 115b.

[0126] The first connecting line 121d can be connected to the contact electrode (CCE) via the contact hole in the third insulating layer 115c, thereby electrically connecting the contact electrode (CCE) and the pixel driving circuit (PD) via the first connecting line 121.

[0127] In other words, the contact electrode (CCE) connected to the second electrode (CE2) can be electrically connected to the pixel drive circuit (PD) via the firstd connection line 121d, the firstc connection line 121c, the firstb connection line 121b, and the firsta connection line 121a.

[0128] However, the first connecting line 121d can also be directly connected to the signal line (TL) via a contact hole provided in the third insulating layer 115c, or it can be electrically connected to the signal line (TL) via other additional lines or electrodes, and accordingly the signal line (TL) and the pixel driving circuit (PD) can be electrically connected by the first connecting line 121.

[0129] The signal line (TL) can be formed from at least one of the firsta connection lines 121a to the firstd connection line 121d, or it can be connected to the first connection line 121.

[0130] In the non-display area (NA), a plurality of second connecting lines 122 may be arranged on the second protective layer 113b. The second connecting lines 122 may be lines for transmitting signals transmitted from the flexible circuit board (or flexible film) 170 and the printed circuit board 160 to the pad area (PAD) to the pixel driving circuit (PD) of the display area (AA).

[0131] For example, multiple second connecting lines 122 can be electrically connected to multiple pad electrodes (PE) and receive signals transmitted from a flexible circuit board (or flexible film) 170 and a printed circuit board 160.

[0132] For example, multiple second link lines 122 can extend from the pad section (PAD) toward the display area (AA) and transmit signals to the lines of the display area (AA). In this case, each of the multiple second link lines 122 can function as a link line (LL in Figure 3). The second link lines 122 may include a seconda link line 122a, a secondb link line 122b, a secondc link line 122c, and a secondd link line 122d.

[0133] Multiple seconda connecting lines 122a can be arranged on the second protective layer 113b. These multiple seconda connecting lines 122a can extend from the second non-display area (NA2) to the bending area (BA) and the first non-display area (NA1). The multiple seconda connecting lines 122a can transmit signals transmitted from the flexible circuit board (or flexible film) 170 and the printed circuit board 160 to the pad area (PAD) to the pixel driving circuit (PD) in the display area (AA). Thus, the seconda connecting lines 122a can be electrically connected to the pad electrodes (PE) and the pixel driving circuit (PD), respectively. For example, the seconda connecting lines 122a can extend into the display area (AA) and be directly connected to the pixel driving circuit (PD) within the display area (AA), or they can be electrically connected to the pixel driving circuit (PD) via other additional lines or electrodes. Furthermore, the seconda connection line 122a can be electrically connected to the pad electrodes (PE) in the second non-display area (NA2) via the secondb connection line 122b, the secondc connection line 122c, and the secondd connection line 122d. Therefore, the pixel drive circuit (PD) and the pad electrodes (PE) can be electrically connected by the second connection line 122.

[0134] Multiple secondb connection lines 122b can be arranged on the third protective layer 114. The secondb connection lines 122b can be arranged in the second non-display area (NA2). The secondb connection lines 122b can be electrically connected to the seconda connection lines 122a via contact holes in the third protective layer 114. Thus, signals transmitted from the flexible circuit board (or flexible film) 170 and the printed circuit board 160 can be transmitted to the seconda connection lines 122a via the secondb connection lines 122b.

[0135] A second c-connection line 122c may be placed on the first insulating layer 115a. The second c-connection line 122c may be placed in a second non-display area (NA2). The second c-connection line 122c may be electrically connected to the second b-connection line 122b via a contact hole in the first insulating layer 115a. Thus, signals transmitted from the flexible circuit board (or flexible film) 170 and the printed circuit board 160 can be transmitted to the second a-connection line 122a via the second c-connection line 122c and the second b-connection line 122b.

[0136] A second d connection line 122d may be placed on the second insulating layer 115b. The second d connection line 122d may be placed in the second non-display area (NA2). The second d connection line 122d may be electrically connected to the second c connection line 122c via a contact hole in the second organic insulating layer 115b.

[0137] Therefore, signals transmitted from the flexible circuit board (or flexible film) 170 and the printed circuit board 160 can be transmitted to the seconda connection line 122a via the secondd connection line 122d, the secondc connection line 122c, and the secondb connection line 122b.

[0138] Furthermore, the seconda connecting line 122a can be extended to the display area (AA) via the bending area (BA), and can be electrically connected to the pixel driving circuit (PD) in the display area (AA).

[0139] Therefore, the pad electrodes (PE) provided in the second non-display area (NA2) can be electrically connected to the pixel driving circuit (PD) provided in the display area (AA) via the secondd connecting line 122d, the secondc connecting line 122c, the secondb connecting line 122b, and the seconda connecting line 122a provided in the bending area (BA).

[0140] Each of the first connecting line 121 and the second connecting line 122 may be formed from any one of several conductive materials with good flexibility or various conductive materials used in the display area (AA). For example, the second connecting line 122, which is partially located in the bending area (BA), may be made of a conductive material with good flexibility such as gold (Au), silver (Ag), or aluminum (Al). Other examples include, but the embodiments herein are not limited to, each of the first connecting line 121 and the second connecting line 122, being made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys of silver (Ag) and magnesium (Mg).

[0141] A third insulating layer 115c may be placed on a plurality of first connecting lines 121 and a plurality of second connecting lines 122. The third insulating layer 115c may be placed in the remaining area excluding the bending region (BA). The third insulating layer 115c may be placed in the display region (AA), the first non-display region (NA1), and the second non-display region (NA2). At least a portion of the third insulating layer 115c in the bending region (BA) may be removed. The third insulating layer 115c may be composed of an organic insulating material, but the embodiments herein are not limited thereto. For example, the third insulating layer 115c may be composed of a photoresist, polyimide (PI), or photoacrylic material.

[0142] A bank (BNK) may be placed on the third insulating layer 115c in the display area (AA). The bank (BNK) may be placed so as to overlap each of the subpixels. The bank (BNK) may not be placed in the first non-display area (NA1), the second non-display area (NA2), and the bending area (BA). One or more light-emitting elements (ED) of the same type may be placed on top of the bank (BNK).

[0143] Multiple signal lines (TL) may be arranged on the third insulating layer 115c in the display area (AA). The signal lines (TL) may be arranged in the area between multiple banks (BNK). For example, the signal lines (TL) may be arranged adjacent to any one of the multiple banks (BNK). The signal lines (TL) may be electrically connected to the first connection line 121, for example, the first d connection line 121d.

[0144] Multiple contact electrodes (CCE) may be arranged on the third insulating layer 115c in the display area (AA). The contact electrodes (CCE) can supply the cathode voltage transmitted from the pixel driving circuit (PD) to the second electrode (CE2). The contact electrodes (CCE) may be electrically connected to the first connecting line 121, for example, the first d connecting line 121d.

[0145] A first electrode (CE1) may be positioned on the bank (BNK). For example, the first electrode (CE1) may be positioned extending from an adjacent signal line (TL) toward the top of the bank (BNK). The first electrode (CE1) may be positioned on the top surface and the side surface of the bank (BNK). For example, the first electrode (CE1) may be positioned extending from a signal line (TL) provided on the top surface of the third insulating layer 115c toward the side surface and the top surface of the bank (BNK). The first electrode (CE1) may be formed integrally with the signal line (TL).

[0146] Referring to Figure 9, the first electrode (CE1) may be composed of multiple conductive layers. For example, the first electrode (CE1) may include a first conductive layer (CE1a), a second conductive layer (CE1b), a third conductive layer (CE1c), and a fourth conductive layer (CE1d).

[0147] The first conductive layer (CE1a) may be placed on a bank (BNK). The second conductive layer (CE1b) may be placed on the first conductive layer (CE1a). The third conductive layer (CE1c) may be placed on the second conductive layer (CE1b). The fourth conductive layer (CE1d) may be placed on the third conductive layer (CE1c). For example, each of the first conductive layer (CE1a), the second conductive layer (CE1b), the third conductive layer (CE1c), and the fourth conductive layer (CE1d) may consist of titanium (Ti), molybdenum (Mo), aluminum (Al), or titanium (Ti) and indium tin oxide (ITO), but the examples herein are not limited thereto.

[0148] Among the multiple conductive layers constituting the first electrode (CE1), some conductive layers with good reflectivity can be used as alignment keys and / or reflectors for aligning the light-emitting element (ED). For example, among the multiple conductive layers of the first electrode (CE1), the second conductive layer (CE1b) may contain a reflective material. For example, the second conductive layer (CE1b) may contain aluminum (Al). In this case, the second conductive layer (CE1b) can be used as a reflector. Furthermore, the high reflectivity of the second conductive layer (CE1b) makes it easy to identify in the manufacturing process, thereby allowing the position or transfer position of the light-emitting element (ED) to be aligned with respect to the second conductive layer (CE1b).

[0149] For example, in order to use the second conductive layer (CE1b) as a reflector, the third conductive layer (CE1c) and the fourth conductive layer (CE1d) covering the second conductive layer (CE1b) may be partially removed or etched. The upper surface of the second conductive layer (CE1b) may be exposed by removing or etching a portion of the third conductive layer (CE1c) and the fourth conductive layer (CE1d) placed on the bank (BNK). Of the third conductive layer (CE1c) and the fourth conductive layer (CE1d), the central portion and the edge (or end portion) where the solder pattern (SDP) is placed may be left intact, and the remaining portions may be removed. The edge (or end portion) and central portion of the third conductive layer (CE1c), which is made of titanium (Ti), and the fourth conductive layer (CE1d), which is made of indium tin oxide (ITO), may not be etched. Therefore, the phenomenon of corrosion of other conductive layers of the first electrode (CE1) by the TMAH (Tetra Methyl Ammonium Hydroxide) solution used in the masking process of the first electrode (CE1) can be prevented or reduced.

[0150] The first conductive layer (CE1a) and the third conductive layer (CE1c) may contain titanium (Ti) or molybdenum (Mo). The second conductive layer (CE1b) may contain aluminum (Al). The fourth conductive layer (CE1d) may contain a transparent conductive oxide layer such as indium tin oxide (ITO) or indium zinc oxide (IZO) which has good adhesion to the solder pattern (SDP) and is corrosion-resistant and acid-resistant.

[0151] The first conductive layer (CE1a), the second conductive layer (CE1b), the third conductive layer (CE1c), and the fourth conductive layer (CE1d) can be patterned by photolithography and etching processes after being deposited in sequence.

[0152] Each of the signal line (TL), contact electrode (CCE), and pad electrode (PE), which are arranged on the same layer as the first electrode (CE1), may consist of a multilayer of conductive material, but the embodiments herein are not limited thereto. For example, each of the signal line (TL), contact electrode (CCE), and pad electrode (PE) may consist of a multilayer of indium tin oxide (ITO) / titanium (Ti) / aluminum (Al) / titanium (Ti).

[0153] In each of the multiple subpixels, a solder pattern (SDP) may be placed on the first electrode (CE1). The solder pattern (SDP) can be used to bond an luminescent element (ED) to the first electrode (CE1). The first electrode (CE1) and the luminescent element (ED) may be electrically connected via entrctic bonding using the solder pattern (SDP), but the embodiments herein are not limited to this. For example, if the solder pattern (SDP) is made of indium (In) and the anode electrode 134 of the luminescent element (ED) is made of gold (Au), the solder pattern (SDP) and the anode electrode 134 can be bonded by applying heat and pressure during the transfer process of the luminescent element (ED). The luminescent element (ED) can be bonded to the solder pattern (SDP) and the first electrode (CE1) via entrctic bonding without the need for a separate adhesive. The solder pattern (SDP) may be made of indium (In), tin (Sn), or alloys thereof. For example, a solder pattern (SDP) could be a bonding pad or joint pad.

[0154] The passivation layer 116 may be placed on multiple signal lines (TL), multiple first electrodes (CE1), multiple contact electrodes (CCE), and the third insulating layer 115c. For example, the passivation layer 116 may be placed in the display area (AA), the first non-display area (NA1), and the second non-display area (NA2). At least a portion of the passivation layer 116 placed in the bending area (BA) may be removed. A portion of the passivation layer 116 covering multiple pad electrodes (PE) in the second non-display area (NA2) may be removed. A portion of the passivation layer 116 covering multiple contact electrodes (CCE) in the display area (AA) may be removed. A passivation layer 116 covering the solder pattern (SDP) in the display area (AA) may be removed. The passivation layer 116 may cover the first electrodes (CE1). The passivation layer 116 may cover a portion of the upper surface of the exposed second conductive layer (CE1b).

[0155] The passivation layer 116 is positioned to expose portions of multiple pad electrodes (PEs), multiple contact electrodes (CCEs), and solder patterns (SDPs), while covering the remaining areas, thereby reducing the penetration of moisture or impurities into the light-emitting element (ED). The passivation layer 116 may consist of a single or multiple layer of silicon oxide (SiOx) or silicon nitride (SiNx). For example, the passivation layer 116 may be a protective layer or an insulating layer. The passivation layer 116 may include holes for exposing solder patterns (SDPs) and holes for exposing contact electrodes (CCEs).

[0156] In each of the multiple subpixels, an emissive element (ED) can be placed on the solder pattern (SDP). A first emissive element 130 can be placed in the first subpixel (SP1). A second emissive element 140 can be placed in the second subpixel (SP2). A third emissive element 150 can be placed in the third subpixel (SP3).

[0157] Light-emitting elements (EDs) can be formed on a silicon wafer by methods such as metal-organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), or sputtering, but the examples herein are not limited to these methods.

[0158] The first light-emitting element 130 may include an anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, a cathode electrode 135, and a sealing film 136. For example, the first light-emitting element 130 may not include the sealing film 136.

[0159] A first semiconductor layer 131 can be placed on a solder pattern (SDP). A second semiconductor layer 133 can be placed on the first semiconductor layer 131.

[0160] For example, each of the first semiconductor layer 131 and the second semiconductor layer 133 can be made up of compound semiconductors such as those of the III-V or II-VIII groups, and each of the first semiconductor layer 131 and the second semiconductor layer 133 can be doped with impurities (or dopants). For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be a semiconductor layer doped with an n-type impurity, and the other may be a semiconductor layer doped with a p-type impurity. For example, the first semiconductor layer 131 and the second semiconductor layer 133 may each be a layer doped with n-type or p-type impurities in a material such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide (GaAsP), aluminum gallium indium phosphide (AlGaInP), indium aluminum phosphide (InAlP), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), aluminum indium gallium nitride (AlInGaN), aluminum gallium arsenide (AlGaAs), or gallium arsenide (GaAs). n-type impurities may include silicon (Si), germanium (Ge), selenium (Se), carbon (C), tellurium (Te), or tin (Sn). p-type impurities may include magnesium (Mg), zinc (Zn), calcium (Ca), strontium (Sr), barium (Ba), or beryllium (Be).

[0161] The first semiconductor layer 131 and the second semiconductor layer 133 can each be a nitride semiconductor containing n-type impurities or a nitride semiconductor containing p-type impurities. For example, the first semiconductor layer 131 may be a nitride semiconductor containing p-type impurities, and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities.

[0162] The active layer 132 may be positioned between the first semiconductor layer 131 and the second semiconductor layer 133. The active layer 132 can emit light by receiving holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133. For example, the active layer 132 may consist of one of the following: a single-well structure, a multi-well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, and a quantum beam structure. The active layer 132 may be made of indium gallium nitride (InGaN) or gallium nitride (GaN), etc.

[0163] As another example, the active layer 132 may include a multi-quantum well (MQW) structure having a well layer and a barrier layer with a higher band gap than the well layer. For example, the active layer 132 may include InGaN as the well layer and an AlGaN layer as the barrier layer.

[0164] The anode electrode 134 may be placed between the first semiconductor layer 131 and the solder pattern (SDP). The anode electrode 134 can electrically connect the first semiconductor layer 131 and the first electrode (CE1). The anode voltage output from the pixel drive circuit (PD) can be applied to the first semiconductor layer 131 via the signal line (TL), the first electrode (CE1), and the anode electrode 134. The anode electrode 134 may be made of a conductive material that can be eutectic bonded to the solder pattern (SDP). The anode electrode 134 may be made of gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), and copper (Cu), or alloys thereof.

[0165] The cathode electrode 135 may be placed on the second semiconductor layer 133. For example, the cathode electrode 135 may electrically connect the second semiconductor layer 133 and the second electrode (CE2). The cathode voltage output from the pixel driving circuit (PD) may be applied to the second semiconductor layer 133 via the contact electrode (CCE), the second electrode (CE2), and the cathode electrode 135. The cathode electrode 135 may be made of a transparent conductive material so that the light emitted from the light-emitting element (ED) is directed towards the top of the light-emitting element (ED). For example, the cathode electrode 135 may be made of a material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO).

[0166] The encapsulation film 136 may be placed on at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the encapsulation film 136 may surround at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135.

[0167] The encapsulation film 136 can protect the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133. The encapsulation film 136 can be placed on the side surfaces of the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133.

[0168] The sealing film 136 may be present on at least a portion of the anode electrode 134 and the cathode electrode 135. For example, the sealing film 136 may be placed on the edge (or end portion or one side) of the anode electrode 134 and the edge (or end portion or one side) of the cathode electrode 135. At least a portion of the anode electrode 134 may be exposed without being covered by the sealing film 136, allowing the anode electrode 134 to be connected to a solder pattern (SDP). For example, at least a portion of the cathode electrode 135 may be exposed without being covered by the sealing film 136, allowing the cathode electrode 135 to be connected to a second electrode (CE2). The sealing film 136 may consist of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx).

[0169] As another example, the encapsulation film 136 may be a film in which a reflective material is dispersed in a resin layer. The encapsulation film 136 can be fabricated with reflectors of various structures. Light emitted from the active layer 132 is reflected upward by the encapsulation film 136, improving the light extraction efficiency. In this case, the encapsulation film 136 may be a reflective layer.

[0170] Although the light-emitting element (ED) has been described in terms of a vertical structure, the embodiments herein are not limited thereto. For example, the light-emitting element (ED) may have a lateral structure or a flip-chip structure.

[0171] In the above description, the first light-emitting element 130 was explained with reference to Figure 9, but the second light-emitting element 140 and the third light-emitting element 150 may have substantially the same structure as the first light-emitting element 130. For example, each of the second light-emitting element 140 and the third light-emitting element 150 may include substantially the same structure as the first semiconductor layer 131, active layer 132, second semiconductor layer 133, anode electrode 134, cathode electrode 135, and sealing film 136 of the first light-emitting element 130.

[0172] According to this specification, as shown in Figures 8 and 9, a first optical layer 117a surrounding a plurality of light-emitting elements (EDs) can be arranged in the display area (AA). For example, the first optical layer 117a can be arranged to cover the sides of the plurality of light-emitting elements (EDs) and the sides of the plurality of banks (BNKs). The first optical layer 117a can cover a portion of the passivation layer 116. The first optical layer 117a can be provided between the second electrode (CE2), the passivation layer 116, and the plurality of light-emitting elements (EDs).

[0173] The first optical layer 117a can be positioned between multiple light-emitting elements (EDs) contained in a single pixel (PX), or it can cover multiple light-emitting elements (EDs), and it can be positioned between multiple banks (BNKs), or it can cover multiple banks (BNKs). For example, the first optical layer 117a extends in a first direction, and multiple first optical layers 117a can be positioned on a plan view, spaced apart from a second direction. For example, the first optical layer 117a can be positioned between the passivation layer 116 and the second electrode (CE2) so as to surround the sides of the light-emitting elements (EDs) and banks (BNKs). The first optical layer 117a can be called a diffusion layer or a sidewall diffusion layer, etc. In the following description, the first direction may be the X-axis direction as shown in Figure 5, and the second direction may be the Y-axis direction as shown in Figure 5. That is, the first direction and the second direction are different directions from each other. Therefore, in the following description, the first direction may be assigned the drawing reference numeral X, and the second direction may be assigned the drawing reference numeral Y.

[0174] The first optical layer 117a may contain an organic insulating material in which fine particles are dispersed. For example, the first optical layer 117a may consist of a siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed. Light emitted from multiple light-emitting elements (EDs) can be scattered by the fine particles dispersed in the first optical layer 117a and emitted to the outside of the display panel 100. Therefore, the first optical layer 117a can improve the extraction efficiency of light emitted from multiple light-emitting elements (EDs).

[0175] The first optical layer 117a can be placed on each of multiple pixels (PX), or on some of the pixels (PX) arranged in the same row. For example, the first optical layer 117a can be placed on each of multiple pixels (PX). Alternatively, multiple pixels (PX) can share a single first optical layer 117a. As another example, each of multiple subpixels can also contain the first optical layer 117a.

[0176] In the display area (AA), a second optical layer 117b may be placed on the passivation layer 116. For example, the second optical layer 117b may be placed so as to surround the first optical layer 117a. For example, the second optical layer 117b may be in contact with the side surface of the first optical layer 117a. For example, the second optical layer 117b may be placed in the region between multiple pixels (PX). However, the embodiments of this specification are not limited thereto. The second optical layer 117b may be called a diffusion layer, a diffusion layer window, or a window diffusion layer, etc.

[0177] The second optical layer 117b may be composed of an organic insulating material, but the examples herein are not limited thereto. The second optical layer 117b may be composed of the same material as the first optical layer 117a, but the examples herein are not limited thereto. For example, the first optical layer 117a may contain fine particles, while the second optical layer 117b may not contain fine particles. For example, the second optical layer 117b may be composed of a siloxane.

[0178] The thickness of the first optical layer 117a may be thinner than the thickness of the second optical layer 117b. Therefore, when viewed in a planar view, the region where the first optical layer 117a is located may include a recess that is inward from the upper surface of the second optical layer 117b.

[0179] A second electrode (CE2) may be placed on the first optical layer 117a and the second optical layer 117b. The second electrode (CE2) may be electrically connected to a plurality of contact electrodes (CCE) via contact holes in the second optical layer 117b. The second electrode (CE2) may be placed on a plurality of light-emitting elements (EDs). The second electrode (CE2) may include a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO). The second electrode (CE2) may be positioned in contact with the cathode electrode 135. The second electrode (CE2) may be superimposed on the entire first optical layer 117a or on a portion of the second optical layer 117b.

[0180] The second electrode (CE2) can extend continuously in the first direction (X) of the substrate 110. Therefore, the second electrode (CE2) can be commonly connected to at least two pixels (PX) arranged in the first direction (X) of the substrate 110. For example, the second electrode (CE2) can be commonly connected to at least two pixels (PX).

[0181] The second electrode (CE2) may be provided on the upper end of the first optical layer 117a, the second optical layer 117b, and the light-emitting element (ED). The region on which the first optical layer 117a is located may include a recess that is recessed inward from the upper surface of the second optical layer 117b. As a result, the first portion of the second electrode (CE2) located on the first optical layer 117a is positioned along the recess, so the first portion of the second electrode (CE2) located on the first optical layer 117a may be positioned lower than the second portion of the second electrode (CE2) located on the second optical layer 117b.

[0182] A third optical layer 117c may be placed on the second electrode (CE2). The third optical layer 117c may be placed so as to overlap the plurality of light-emitting elements (EDs) and the first optical layer 117a. In this case, the third optical layer 117c may be placed so as not to overlap the second optical layer 117b. Since the third optical layer 117c is placed on top of the second electrode (CE2) and the plurality of light-emitting elements (EDs), the third optical layer 117c can improve unevenness (Mura) that may occur in some of the plurality of light-emitting elements (EDs). For example, when a plurality of light-emitting elements (EDs) are transferred onto the substrate 110 of the display panel 100, areas where the spacing between the plurality of light-emitting elements (EDs) is not uniform may occur due to process deviations, etc. If the spacing between the plurality of light-emitting elements (EDs) is uneven, the light-emitting areas of each of the plurality of light-emitting elements (EDs) may be unevenly arranged, thereby allowing the user to visually perceive the unevenness. Since a third optical layer 117c is provided above the multiple light-emitting elements (EDs) to uniformly diffuse the light, the phenomenon in which light emitted from some of the light-emitting elements (EDs) appears uneven can be reduced. Therefore, the light emitted from the multiple light-emitting elements (EDs) is uniformly diffused by the third optical layer 117c and extracted to the outside of the display panel 100, thereby improving the brightness uniformity of the display device.

[0183] The third optical layer 117c may consist of an organic insulating material in which fine particles are dispersed, but the examples herein are not limited thereto. For example, the third optical layer 117c may consist of a siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed. However, the third optical layer 117c may consist of the same material as the first optical layer 117a. The third optical layer 117c may be called a diffusion layer or an upper diffusion layer, etc.

[0184] Light transmitted from multiple light-emitting elements (EDs) can be scattered by fine particles dispersed in the third optical layer 117c and emitted outside the display panel 100. The third optical layer 117c can uniformly mix the light emitted from the multiple light-emitting elements (EDs) to further improve the brightness uniformity of the display device. Furthermore, the light extraction efficiency of the display device can be improved by the light scattered by the multiple fine particles, thereby enabling the display device to be driven with low power.

[0185] In the display area (AA), a black matrix (BM) may be placed at the upper end of the second electrode (CE2), the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c. For example, the black matrix (BM) may fill the contact holes provided in the second optical layer 117b. Since the black matrix (BM) is configured to cover the display area (AA), it can reduce the mixing of light and external light reflection of multiple subpixels. For example, since the black matrix (BM) is also placed in the contact holes connecting the second electrode (CE2) and the contact electrode (CCE), it can prevent light leakage between multiple adjacent subpixels.

[0186] The black matrix (BM) is not provided at the upper end of the light-emitting element (ED). This allows the light generated by the light-emitting element (ED) to be output externally.

[0187] The black matrix (BM) may consist of an opaque material, but the examples herein are not limited to this. For example, the black matrix (BM) may be an organic insulating material to which a black pigment or black dye has been added.

[0188] In the display area (AA), a cover layer 118 may be placed on the black matrix (BM) as shown in Figure 8. The cover layer 118 can protect the structure beneath it. For example, the cover layer 118 may be made of an organic insulating material, but the examples herein are not limited to this. For example, the cover layer 118 may be made of a photoresist, polyimide (PI), or photoacrylic material. The cover layer 118 may be called an overcoat layer or insulating layer.

[0189] A polarizing layer 280 can be placed on the cover layer 118 via a first adhesive layer 291. A cover member 120 can be placed on the polarizing layer 280 via a second adhesive layer 295. For example, the first adhesive layer 291 and the second adhesive layer 295 may include optically clear adhesive (OCA), optically clear resin (OCR), or pressure-sensitive adhesive (PSA).

[0190] According to this specification, a plurality of pad electrodes (PEs) may be arranged on the third insulating layer 115c in the second non-display area (NA2). For example, at least a portion of the plurality of pad electrodes (PEs) may be exposed without being covered by the passivation layer 116. For example, the pad electrodes (PEs) may be electrically connected to the second to fourth connecting lines 122d via contact holes in the third insulating layer 115c.

[0191] An adhesive film (ACF) may be placed on multiple pad electrodes (PE). The adhesive film (ACF) may be an adhesive layer in which conductive balls are dispersed in an insulating material. When heat or pressure is applied to the adhesive film (ACF), the conductive balls may electrically connect at the heated or pressured portion and acquire conductive properties. The adhesive film (ACF) may be placed between the multiple pad electrodes (PE) and a flexible circuit board (or flexible film) 170, and the flexible circuit board (or flexible film) 170 may be attached to or bonded to the multiple pad electrodes (PE). For example, the adhesive film (ACF) may be an anisotropic conductive film.

[0192] A flexible circuit board (or flexible film) 170 can be placed on an adhesive film (ACF). The flexible circuit board (or flexible film) 170 can be electrically connected to a plurality of pad electrodes (PE) via the adhesive film (ACF). Therefore, signals output from the flexible circuit board (or flexible film) 170 and the printed circuit board can be transmitted to the pixel driving circuit of the display area (AA) via the pad electrodes (PE), the secondd connection line 122d, the secondc connection line 122c, the secondb connection line 122b, and the seconda connection line 122a.

[0193] Figure 10 is an illustrative diagram showing the structure of a touch electrode and a display driver applied to a display device according to one embodiment of this specification. Content in the following description that is the same as or similar to that described with reference to Figures 1 to 9 will be omitted or briefly explained.

[0194] A display device according to one embodiment of this specification, as shown in Figure 10, may include a display panel 100 on which an image is displayed, and a display driver 200 that supplies an image signal and a control signal to a pixel drive circuit (PD) provided in the display panel 100 during the display period, and detects a touch on the display panel 100 using a touch sensing signal transmitted from the pixel drive circuit (PD) provided in the display panel 100 during the touch sensing period.

[0195] Furthermore, the display device according to one embodiment of this specification may further include, in addition to the display panel 100 and the display driver 200, a timing controller 300, a power supply unit 500, and memory, as described with reference to Figures 1 and 2. In this case, the display driver 200 may be included in the timing controller 300.

[0196] The display driver 200 and the timing controller 300 may be provided on the printed circuit board 160.

[0197] The power supply unit 500 can supply various levels of power to the display panel 100, the pixel driving circuit (PD), the display driver 200, and the timing controller 300. In particular, the power supply unit 500 can perform the function of supplying cathode voltage to the second electrode (CE2). For this purpose, the power supply unit 500 may include a cathode voltage supply unit 510. However, the cathode voltage supply unit 510 may be provided separately and independently from the power supply unit 500.

[0198] The power supply unit 500 can generate the power necessary to drive the pixel drive circuit (PD) and transmit it to the pixel drive circuit (PD). For this purpose, the power supply unit 500 may include a power supply unit 520.

[0199] As described above, the display panel 100 may include a substrate 110 including a display area (AA) and a non-display area (NA), a pixel driving circuit (PD) provided in the display area (AA) on the substrate 110, an insulating layer provided on the pixel driving circuit (PD), a bank (BNK) provided on the insulating layer, a first electrode (CE1) connected to the pixel driving circuit (PD), a light-emitting element (ED) provided on the first electrode (CE1), and a second electrode (CE2) provided on the light-emitting element (ED).

[0200] Here, the insulating layer may be formed by a single layer, but may also include multiple layers. For example, the insulating layer may include a first insulating layer 115a, a second insulating layer 115b, and a third insulating layer 115c.

[0201] Each bank (BNK) may be equipped with a first electrode (CE1).

[0202] The first electrode (CE1) may be equipped with a light-emitting element (ED).

[0203] The upper end of the light-emitting element (ED) may be provided with a second electrode (CE2).

[0204] Each light-emitting element (ED) can be driven by any one of the pixel driver circuits (PDs).

[0205] Each pixel driver (PD) is connected to at least two light-emitting elements (EDs) and is capable of driving at least two light-emitting elements (EDs).

[0206] Each of the second electrodes (CE2) can be connected to at least two light-emitting elements (EDs).

[0207] Some of the subpixels may be covered by a second electrode (CE2). For example, the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150, which are provided in the first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3), may be covered by a single second electrode (CE2).

[0208] However, as shown in Figures 7A and 7B, subpixels (SP) contained within two or more pixels (PX) can be covered by a single second electrode (CE2).

[0209] Each pixel driver circuit (PD) may be connected to at least two second electrodes (CE2). For example, the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150 provided on one pixel (PX) may be connected to one second electrode (CE2). Also, if the pixel driver circuit (PD) drives at least two pixels (PX), the pixel driver circuit (PD) may be connected to at least two second electrodes (CE2). For example, if pixels (PX) arranged in a 16x16 configuration are connected to the pixel driver circuit (PD), the pixel driver circuit (PD) may be connected to 16 second electrodes (CE2).

[0210] In this case, the display panel 100 may include a light-emitting element section (EDU) which includes a pixel driving circuit (PD) and light-emitting elements (ED), and a touch electrode section (TEU) which includes at least two second electrodes (CE2).

[0211] For example, in the display panel 100 shown in Figure 8, the substrate 110, buffer layers 111a, 111b, adhesive layer 112, pixel driving circuit (PD), protective layers 113a, 113b, 114, insulating layers 115a, 115b, 115c, first connecting line 121, bank (BNK), first electrode (CE1), light-emitting elements 130, 140, 150, and optical layers 117a, 117b may be included in the light-emitting element unit (EDU).

[0212] Furthermore, in the display panel 100 shown in Figure 8, the second electrode (CE2) may be included in the touch electrode section (TEU).

[0213] Furthermore, in the display panel 100 shown in Figure 8, the black matrix (BM), the third optical layer 117c, and the cover layer 118 may be other components included in the display panel 100. However, for the sake of explanation below, the black matrix (BM), the third optical layer 117c, and the cover layer 118 can be included in the light-emitting unit (EDU).

[0214] To further explain, as described with reference to Figure 1, the display device 1000 according to one embodiment of this specification may include a display panel 100, a polarizing layer 280, an adhesive layer 290, a cover member 120, a support substrate 190, and a flexible circuit board 170 and a printed circuit board 160, and the display panel 100 may include various layers as shown in Figure 8.

[0215] In this case, the various layers included in the display panel 100 can be divided into light-emitting units (EDUs) and touch electrode units (TEUs).

[0216] The light-emitting element (EDU) can include various layers as described above, and in particular, it can include a light-emitting element (ED).

[0217] The touch electrode section (TEU) may include at least two second electrodes (CE2).

[0218] In this case, the pixel driver circuit (PD) can be substantially included in the light-emitting unit (EDU) and can drive the first electrode (CE1) and the second electrode (CE2). However, for the sake of explanation, in Figure 10, the pixel driver circuit (PD) is included in the touch electrode unit (TEU).

[0219] In the following description, the second electrode (CE2) controlled by a single pixel driver (PD) will be referred to as the subtouch electrode (STE).

[0220] Furthermore, in the following description, a configuration that includes at least one sub-touch electrode (STE) and corresponds to one touch coordinate will be referred to as a touch electrode (TE).

[0221] For example, a subtouch electrode (STE) can be connected to a pixel driver (PD), and the subtouch electrode (STE) may include at least two second electrodes (CE2). As described above, when pixels (PX) arranged in a 16x16 configuration are connected to a pixel driver (PD), the subtouch electrode (STE) may include 16 second electrodes (CE2).

[0222] A single pixel driver (PD) controlling a single subtouch electrode (STE) can be connected to the display driver 200, as shown in Figure 10.

[0223] For example, a pixel driver (PD) may be connected to a display driver 200 via an image signal line. An image signal corresponding to the light emission signal (EM) supplied to the gate of a light-emitting transistor (TEM) in the pixel driver (PD) may be supplied from the display driver 200 to the pixel driver (PD) via the image signal line. Furthermore, a touch sensing signal line may be provided between the pixel driver (PD) and the display driver 200, through which a touch sensing signal is transmitted.

[0224] For the sake of clarity, the display device according to this specification will be described below using as an example a touch electrode (TE) that includes four sub-touch electrodes (STEs) along a first direction (X) and four sub-touch electrodes (STEs) along a second direction (Y), as shown in Figure 10. However, depending on the structure or resolution of the display panel 100, the touch electrode (TE) located on the left side of the display panel 100 or the touch electrode (TE) located on the right side of the display panel 100 may include three sub-touch electrodes (STEs) along a first direction (X) and four sub-touch electrodes (STEs) along a second direction (Y). For example, in the display panel 100, each of the touch electrodes (TE) located on the right or left side of the display panel 100 may include three sub-touch electrodes (STEs) along a first direction (X) and four sub-touch electrodes (STEs) along a second direction (Y).

[0225] To further explain, in the following description, a touch electrode (TE) may include 16 sub-touch electrodes (STEs), as shown in Figure 10. However, the number of sub-touch electrodes (STEs) included in a touch electrode (TE) can vary considerably.

[0226] In this case, the display driver 200 may include a data driver that generates an image signal supplied to the pixel driver circuit (PD), and a touch driver for sensing touch.

[0227] For example, the display driver 200 can generate and supply an image signal to the pixel driver circuit (PD).

[0228] For this purpose, each of the pixel driver circuits (PDs) corresponding to all sub-touch electrodes (STEs) included in the touch electrode unit (TEU) can be connected to the display driver 200 via an image signal line.

[0229] In this case, the power required by the pixel driver (PD) can be transmitted from the power supply unit 500 to the pixel driver (PD) via the display driver 200, or it can be transmitted directly from the power supply unit 500 to the pixel driver (PD). In the following, a display device according to this specification will be described using as an example a display device in which the power supply unit 500 supplies power to the pixel driver (PD), as shown in Figure 10.

[0230] Furthermore, the cathode voltage required to drive the light-emitting element (ED) can be transmitted from the cathode voltage supply unit 510 to the pixel driving circuit (PD) via the display driver 200, or it can be transmitted directly from the cathode voltage supply unit 510 to the pixel driving circuit (PD). For the sake of explanation, below, a display device in which the cathode voltage is directly transmitted from the cathode voltage supply unit 510 included in the power supply unit 500 to the pixel driving circuit (PD), and power is directly transmitted from the power supply unit 520 included in the power supply unit 500 to the sensing unit 420 of the pixel driving circuit (PD) will be described as an example of a display device according to this specification.

[0231] Furthermore, the display driver 200 can detect touches on the display panel 100 using touch sensing signals received from the pixel driver circuit (PD).

[0232] In this case, the touch coordinates can be determined by the display driver 200, or by the timing controller 300 or an external system 900.

[0233] First, the structure and function of the display panel 100 are as follows. In the following, the same or similar content as described with reference to Figures 1 to 9 will be omitted or explained briefly.

[0234] The display panel 100 may include a light-emitting element section (EDU) which includes a pixel driving circuit (PD) and light-emitting elements (ED), and a touch electrode section (TEU) which includes at least two second electrodes (CE2).

[0235] The light-emitting unit (EDU) can output light, and in response, can display an image.

[0236] The touch electrode section (TEU) includes at least two touch electrodes (TE). Each touch electrode (TE) includes at least one sub-touch electrode (STE) and may correspond to one touch coordinate.

[0237] A touch electrode (TE) may include at least two second electrodes (CE2) connected to a pixel driver circuit (PD). A second electrode (CE2) controlled by one pixel driver circuit (PD) is designated as a subtouch electrode (STE).

[0238] Each of at least two second electrodes (CE2) can extend along a first direction (X) of the substrate 110, and at least two second electrodes (CE2) can be provided along a second direction (Y) different from the first direction (X).

[0239] When a cathode voltage is supplied to at least one of the two second electrodes (CE2), light can be output from the light-emitting element (ED) connected to the second electrode (CE2) to which the cathode voltage is supplied.

[0240] For example, the period during which an image is displayed on the display panel 100 is defined as the display period, and during the display period, a cathode voltage may be supplied to the cathode electrode 135 via the second electrode (CE2). The light-emitting element (ED) can output light using the cathode voltage supplied via the cathode electrode 135 and the anode voltage supplied to the anode electrode 134.

[0241] When at least two second electrodes (CE2) are used as a single touch electrode (TE), a touch drive signal can be supplied to at least two second electrodes (CE2) simultaneously.

[0242] For example, the period during which a touch is detected on the display panel 100 is defined as the touch sensing period, and during the touch sensing period, each of the pixel drive circuits (PDs) may simultaneously supply a touch drive signal to the second electrode (CE2). In this case, the display driver 200 may detect a touch on the display panel 100 using the touch sensing signal received from the second electrode (CE2) via the pixel drive circuit (PD).

[0243] Secondly, the structure and function of the pixel driver (PD) are as follows. The following explanation will omit or briefly describe content that is the same or similar to that described with reference to Figures 1 to 9.

[0244] During the display period when an image is displayed, an image signal corresponding to the light emission signal (EM) supplied to the gate of the light-emitting transistor (TEM) in the pixel drive circuit (PD) can be supplied to the pixel drive circuit (PD) via an image signal line.

[0245] The image signal generated by the display driver 200 is transmitted to the pixel driver circuit (PD) via the image signal line, and the pixel driver circuit (PD) can use the image signal to generate an emission signal (EM). This allows the light-emitting element (ED) to output light.

[0246] To further explain, the display driver 200 can transmit an image signal to each of the image signal lines during the display period. During the touch sensing period when a touch is sensed, the touch sensing signal transmitted from the second electrode (CE2) can be transmitted to the display driver 200 via the touch sensing signal line.

[0247] For example, during the touch sensing period, the pixel driver circuit (PD) can supply a touch drive signal to the second electrode (CE2), and the touch sensing signal received from the second electrode (CE2) can be transmitted to the display driver 200 via the touch sensing signal line. Such a touch sensing method is called a self-capping method.

[0248] The above functions can be performed simultaneously in each of the pixel driver circuits (PDs).

[0249] In this case, the touch drive signal can be generated by the pixel driver (PD), or it can be generated by the display driver 200 and transmitted to the pixel driver (PD). However, for the sake of explanation, below, a display device in which the touch drive signal is generated by the pixel driver (PD) will be described as an example of the display device of this specification.

[0250] Thirdly, as explained above, in a display device using a self-capping method, each of the touch electrodes (TEs) shown in Figure 10 can be driven independently, and one touch coordinate can be associated with each touch electrode (TE).

[0251] For example, in a display device using a self-capping method, the pixel driving circuit (PD) can transmit a touch driving signal to the second electrode (CE2) and receive a touch sensing signal from the second electrode (CE2). The touch sensing signal can be converted into a digital signal and transmitted to the display driver 200.

[0252] In this case, if there is no touch on the touch electrode (TE), the value of the touch sensing signal received from the pixel driver circuit (PD) corresponding to the touch electrode (TE) may be within a preset range. However, if there is a touch on the touch electrode (TE), the value of the touch sensing signal received from the pixel driver circuit (PD) corresponding to the touch electrode (TE) may be outside the preset range. By utilizing this difference, the display driver 200 can detect a touch on the touch electrode (TE).

[0253] However, in one embodiment of this specification, a touch can be detected using a mutual cap method.

[0254] For example, in a display panel 100 to which a mutual cap method is applied, as shown in Figure 10, the first upper end of the display panel 100 may alternately be provided with first sub-drive electrodes (TX1a, TX1b, TX1c) that form a first drive electrode (TX1) and sub-receiving electrodes (RX1a, RX3a, RX5a) that form a receiving electrode (RX).

[0255] Below the first drive electrode (TX1), second sub-drive electrodes (TX2a, TX2b, TX2c) that form the second drive electrode (TX2) and sub-receiving electrodes (RX2a, RX4a, RX6a) that form the receiving electrode (RX) may be alternately provided.

[0256] In this case, the second sub-driving electrodes (TX1a, TX1b, TX1c) and the second sub-driving electrodes (TX2a, TX2b, TX2c) are not arranged in a straight line along the second direction (Y), but are arranged alternately. Therefore, the sub-driving electrodes and sub-receiving electrodes are arranged alternately along the second direction (Y).

[0257] With the arrangement structure described above, the first lower end of the display panel 100 may alternately be provided with seventh sub-drive electrodes (TX7a, TX7b, TX7c) that form the seventh drive electrode (TX7) and sub-receiving electrodes (RX1a, RX3a, RX5a) that form the receiving electrode (RX).

[0258] In this case, each of the sub-drive electrode and sub-receive electrode can correspond to a touch electrode (TE) in a self-capping system and can correspond to a single touch coordinate.

[0259] For example, during the touch sensing period, each sensing unit 420 included in the pixel driving circuit (PD) corresponding to the sub-driving electrode can supply a touch driving signal to the second electrode (CE2).

[0260] In this case, each sensing unit 420 included in the pixel driving circuit (PD) corresponding to the sub-receiving electrode can convert the analog touch sensing signal received from the second electrode (CE2) into a digital touch sensing signal and transmit the touch sensing signal to the display driver 200.

[0261] The display driver 200 can detect touch on the display panel 100 using a touch sensing signal received from a pixel driver (PD) corresponding to one sub-receiving electrode.

[0262] For example, if a touch occurs at the second sub-drive electrode (TX2b) among the second sub-drive electrodes (TX2a, TX2b, TX2c) that form the second drive electrode (TX2), the value of the touch sensing signal corresponding to the second sub-receiving electrode (RX2a) among the second sub-receiving electrodes (RX2a, RX2b, RX2c) that form the second receiver electrode (RX2) may fall outside the range of the touch sensing signal when there is no touch. Similarly, the value of the touch sensing signal corresponding to the fourth sub-receiving electrode (RX4a) among the fourth sub-receiving electrodes (RX4a, RX4b, RX4c) that form the fourth receiver electrode (RX4) may fall outside the range of the touch sensing signal when there is no touch.

[0263] Therefore, the display driver 200 can determine that a touch has occurred at the second b sub-drive electrode (TX2b) located between the second a sub-receiving electrode (RX2a) and the fourth b sub-receiving electrode (RX4a).

[0264] In other words, when a touch drive signal is transmitted to a sub-drive electrode where a touch has occurred, the value of the touch sensing signal received from a sub-receiving electrode adjacent to the sub-drive electrode where the touch occurred may fall outside the reference range for when there is no touch. Therefore, the display driver 200 can use this difference to determine the position of the sub-drive electrode where the touch occurred.

[0265] As another example, when a touch occurs at a sub-receiving electrode, the value of the touch sensing signal received from the pixel driving circuit corresponding to the sub-receiving electrode where the touch occurred may be different from the value of the touch sensing signal received from the pixel driving circuit corresponding to a sub-receiving electrode where no touch occurred. Therefore, the display driver 200 can use this difference to determine the position of the sub-receiving electrode where the touch occurred.

[0266] To further explain, even if the sub-drive electrode and sub-receive electrode are not superimposed in the thickness direction of the display panel 100, but are arranged adjacent to each other on the plane of the display panel 100 as shown in Figure 10, the touch drive signal transmitted to the sub-drive electrode can still affect the adjacent sub-receive electrode. In this case, the sub-receive electrode can generate a touch sensing signal corresponding to the touch drive signal. Therefore, the display driver 200 can analyze the value of the touch sensing signal to detect a touch on the display panel 100.

[0267] Fourth, as described above, the display panel 100 according to one embodiment of this specification can detect touch using a self-capping method, and can also detect touch using a mutual capping method.

[0268] Furthermore, touch detection can be performed using both self-capping and mutual-capping methods.

[0269] For example, during the first touch sensing period, the pixel driving circuit (PD) provided on each touch electrode (TE) can supply a touch driving signal to the second electrode (CE2), and can transmit the touch sensing signal received from the second electrode (CE2) to the display driver 200. In this case, the display driver 200 can use the received touch sensing signal to detect a touch on each of the touch electrodes (TE).

[0270] In this case, during the second touch sensing period, the pixel driving circuit (PD) included in the touch electrode (TE) corresponding to the sub-driving electrode among the touch electrodes (TE) can supply a touch driving signal to the second electrode (CE2). The pixel driving circuit (PD) included in the touch electrode (TE) corresponding to the sub-receiving electrode among the touch electrodes (TE) can receive an analog touch sensing signal from the second electrode (CE2), convert the received analog touch sensing signal into a digital touch sensing signal, and then transmit the converted touch sensing signal to the display driver 200. In this case, the display driver 200 can detect touches on each of the touch electrodes (TE) using the method described above.

[0271] Figure 11A is an illustrative diagram showing the structure of a subtouch electrode and a pixel driving circuit applied to a display device according to one embodiment of this specification, Figure 11B is an illustrative diagram showing the connection structure of the subtouch electrode and the pixel driving circuit applied to a display device according to one embodiment of this specification, and Figure 11C is an illustrative diagram showing the connection relationship between the pixel driving circuit and the light-emitting element applied to a display device according to one embodiment of this specification.

[0272] In the following explanations, content that is the same as or similar to what is explained with reference to Figures 1 to 10 will be omitted or briefly explained.

[0273] As shown in Figure 11A, the pixel drive circuit (PD) may include a sub-pixel drive unit 450 for supplying an anode voltage to an anode electrode 134 provided on a sub-pixel (SP) and a cathode electrode drive unit 420 for supplying a cathode voltage or touch drive signal to a second electrode (CE2) shared by at least two sub-pixels (SP).

[0274] As explained above, the second electrode (CE2), controlled by a single pixel driver (PD), is designated as the subtouch electrode (STE).

[0275] The subtouch electrode (STE) may include at least two second electrodes (CE2).

[0276] As described above, at least two light-emitting elements (ED) can be connected to one pixel driving circuit (PD). Also, one second electrode (CE2) can be connected to at least two light-emitting elements (ED).

[0277] Hereinafter, for convenience of explanation, as shown in FIG. 11A, a display device including a pixel driving circuit (PD) to which 16 pixels (PX) having a 4×4 form are connected will be described as an example of a display device according to an embodiment of the present specification. Further, in the display device shown in FIG. 11A, pixels (PX) arranged in a 4×4 form are connected to the pixel driving circuit (PD), but in the display device according to an embodiment of the present specification, pixels (PX) arranged in a (4N)×(4M) (N and M are natural numbers) form can be connected to the pixel driving circuit (PD). For example, in FIG. 11B, pixels (PX) arranged in a 16×16 form are connected to the pixel driving circuit (PD).

[0278] The pixel driving circuit (PD) can be connected to, for example, four pixels (PX) provided along the first direction (X) and four pixels (PX) provided along the second direction (Y) as shown in FIG. 11A.

[0279] In this case, one second electrode (CE2) controlled by the pixel driving circuit (PD) can be connected to light-emitting elements (ED) provided in at least two sub-pixels (SP).

[0280] In particular, the second electrode (CE2) can be connected to at least two light-emitting elements (ED) provided along the first direction (X) of the display panel 100, and at least two second electrodes (CE2) provided along the second direction (Y) can be separated.

[0281] When four pixels (PX) are provided along the first direction (X) and one pixel (PX) includes three sub-pixels (SP), twelve sub-pixels (PX) can be provided along the first direction (X).

[0282] In this case, if the second electrode (CE2) provided along the first direction (X) is shared by two subpixels (SP), then there may be six second electrodes (CE2) along the first direction (X).

[0283] Therefore, one pixel driver (PD) can be connected to 24 (=6 × 4) second electrodes (CE2).

[0284] However, for the sake of convenience, in the following description, we will explain one embodiment of the display device according to this specification, using as an example a display device in which four pixels (PX) arranged along a first direction (X) are connected to a single second electrode (CE2), as shown in Figure 11A.

[0285] In this case, the pixel driver circuit (PD) can be connected to four second electrodes (CE2).

[0286] In other words, for the sake of explanation, the following description will use a pixel drive circuit (PD) in which 16 pixels (PX) having a 4x4 configuration are connected, and a second electrode (CE2) connected to 4 pixels (PX) provided along a first direction (X), as shown in Figure 11A, to explain a display device according to one embodiment of this specification.

[0287] Firstly, the sub-pixel driving unit 450 is described as follows.

[0288] In the following, as shown in Figures 4 and 11A, a circuit provided inside the sub-pixel drive unit 450 to drive at least one light-emitting element (ED) will be referred to as a pixel circuit (PC). For example, the pixel circuit (PC) may include a drive transistor (TDR) and a light-emitting transistor (TEM), as shown in Figure 4. In this case, the gate of the drive transistor (TDR) may be supplied with a scan signal (SC) that can turn on the drive transistor (TDR). The scan signal (SC) may be a DC power supply that can continuously turn on the drive transistor (TDR). For example, a fixed reference voltage (Vref) for each frame may be supplied to the gate of the drive transistor (TDR).

[0289] A light-emitting signal (EM) can be supplied to the gate of the light-emitting transistor (TEM). The light-emitting signal (EM) may be a pulse-width modulated (PWM) signal. The amount of current supplied to the light-emitting element (ED) can be controlled by the light-emitting signal (EM), thereby allowing the light-emitting element (ED) to output light of varying brightness. The sub-pixel drive unit 450 may include at least one pixel circuit (PC).

[0290] In this case, a high-potential power supply voltage (VDD) can be supplied to the first electrode of the drive transistor (TDR) provided in the pixel circuit (PC). The high-potential power supply voltage (VDD) can be supplied from a power supply unit 500 provided outside the pixel drive circuit (PD).

[0291] The scan signal (SC) and the light emission signal (EM) can be transmitted from a control signal generation unit located outside the pixel drive circuit (PD). For example, the scan signal (SC) and the light emission signal (EM) can be transmitted from a control signal generation unit included in the timing controller 300. In this case, the light emission signal (EM) can also be generated in the sub-pixel drive unit 450 using the image signal transmitted from the timing controller 300.

[0292] For example, as shown in Figure 11A, when four pixels (PX) connected to a pixel drive circuit (PD) are provided in one row extending along a first direction (X), 16 pixels (PX) may be provided in four rows (1H, 2H, 3H, 4H).

[0293] To elaborate further, each of the four rows may be present along the first direction (X), and the four rows may be separated along the second direction (Y).

[0294] In this case, in order to output light from the light-emitting element (ED) provided in the first row (1H), a light emission signal (EM) and a scan signal can be supplied to a pixel circuit (PC) connected to the light-emitting element (ED) provided in the first row (1H).

[0295] As described above, the scan signal (SC) can be a DC power source that can continuously turn on the drive transistor (TDR), and the emission signal (EM) can be a pulse width modulation (PWM) signal.

[0296] The scan signal (SC) can turn on the light-emitting transistor (TEM), whereby the high-potential power supply voltage (VDD) can be supplied to the anode electrode 134 of the light-emitting element (ED) via the drive transistor (TDR), the light-emitting transistor (TEM), and the first electrode (CE1).

[0297] In this case, as described above, the emission signal (EM) applied to the gate electrode of the light-emitting transistor (TEM) can be a pulse width modulation (PWM) signal, and the pulse width of the emission signal (EM) supplied to the pixel circuit (PC) connected to the anode electrode 134 of the light-emitting element (ED) provided in the first row (1H) can be variously set according to the brightness of the light output by the light-emitting element (ED).

[0298] For example, the pulse width of the emission signal (EM) supplied to the pixel circuit (PC) connected to the light-emitting element that outputs high-brightness light may be larger than the pulse width of the emission signal (EM) supplied to the pixel circuit (PC) connected to the light-emitting element that outputs low-brightness light.

[0299] In this case, when a high-level pulse is supplied to the gate of the light-emitting transistor (TEM), the light-emitting transistor (TEM) can turn on.

[0300] When the period during which the light-emitting transistor (TEM) is turned on increases, the amount of current supplied to the light-emitting element (ED) via the light-emitting transistor (TEM) can increase. The brightness of the light-emitting element (ED) can be changed according to the magnitude of the current flowing through the light-emitting element (ED).

[0301] Therefore, the greater the pulse width of the emission signal (EM), the greater the brightness of the light output from the light-emitting element (ED) can be.

[0302] Furthermore, when the pulse width of the light emission signal (EM) supplied to a pixel circuit (PC) connected to a light-emitting element that emits high-brightness light is equal to the pulse width of the light emission signal (EM) supplied to a pixel circuit (PC) connected to a light-emitting element that emits low-brightness light, the number of pulses in the light emission signal (EM) supplied to the pixel circuit (PC) connected to the light-emitting element that emits high-brightness light may be greater than the number of pulses in the light emission signal (EM) supplied to the pixel circuit (PC) connected to the light-emitting element that emits low-brightness light. For example, the frequency of the light emission signal (EM) supplied to a pixel circuit (PC) connected to a light-emitting element that emits high-brightness light may be greater than the frequency of the light emission signal (EM) supplied to a pixel circuit (PC) connected to a light-emitting element that emits low-brightness light.

[0303] As the frequency increases, the number of pulses increases. An increase in the number of pulses supplied to the light-emitting transistor (TEM) increases the number of times the TEM turns on. An increase in the number of times the TEM turns on can increase the amount of current flowing through the TEM to the light-emitting element (ED).

[0304] As explained above, the brightness of an ED (light-emitting element) can change depending on the magnitude of the current flowing through it. Therefore, the brightness of the light emitted from the ED can increase as the frequency of the light-emitting signal (EM) increases or as the number of pulses in the light-emitting signal (EM) increases.

[0305] For example, the timing controller 300 or the sub-pixel drive unit 450 may supply light-emitting signals (EM) having different frequencies or different pulse widths to light-emitting transistors (TEM) provided in the pixel circuit (PC).

[0306] As a result, the light-emitting elements (EDs) connected to the pixel driver circuit (PD) can output light with different luminances.

[0307] Secondly, the cathode electrode drive unit 420 is described as follows.

[0308] When a scan signal (SC) is supplied to the drive transistor (TDR), the cathode electrode drive unit 420 can supply a cathode voltage to the second electrode (CE2).

[0309] For example, as shown in Figure 11A, when 16 pixels (PX) in a 4x4 configuration are connected to a pixel drive circuit (PD), and one second electrode (CE2) is connected to 4 pixels (PX) arranged along a first direction (X), the 16 pixels (PX) can be arranged in 4 rows (1H, 2H, 3H, 4H), and the 4 rows (1H, 2H, 3H, 4H) can be separated along a second direction (Y).

[0310] In this case, the four pixels (PX) in each of the four rows (1H, 2H, 3H, 4H) are connected to one second electrode (CE2). Therefore, the display panel 100 is equipped with four second electrodes (CE2) to drive the 16 pixels (PX).

[0311] The four second electrodes (CE2) are connected to one pixel driver circuit (PD). The four second electrodes (CE2) connected to one pixel driver circuit (PD) are designated as subtouch electrodes (STE). That is, the subtouch electrodes (STE) include the four second electrodes (CE2).

[0312] To further explain, at least one second electrode (CE2) connected to the pixel driving circuit (PD) is provided along a first direction (X) or row of the display panel 100, and at least two light-emitting elements (ED) connected to the second electrode (CE2) may be provided in a row along the first direction (X) or row.

[0313] In the example above, each of the four pixels (PX) in the first row (1H) has three subpixels (SP).

[0314] Therefore, when an anode voltage is supplied from the 12 pixel circuits (PC) connected to the 12 subpixels (SP) in the first row (1H) to the 12 anode electrodes 134 provided on the 12 subpixels (SP), the cathode electrode drive unit 420 can supply a cathode voltage to the second electrode (CE2) provided on the first row (1H). This allows light to be output from the subpixels (SP) in the first row (1H).

[0315] This operation is provided for the first row (1H) and can also be performed simultaneously for sub-pixels (SP) connected to other pixel drive circuits (PDs). Therefore, light can be output simultaneously from all sub-pixels (SP) provided for the first row (1H) of the display panel 100.

[0316] Furthermore, when an anode voltage is supplied from the 12 pixel circuits (PC) connected to the 12 subpixels (SP) in the second row (2H) to the 12 anode electrodes 134 provided on the 12 subpixels (SP), the cathode electrode drive unit 420 can supply a cathode voltage to the second electrode (CE2) provided on the second row (2H). This allows light to be output from the subpixels (SP) in the second row (2H).

[0317] This operation is provided for the second row (2H) and can also be performed simultaneously for sub-pixels (SP) connected to other pixel drive circuits (PDs). Therefore, light can be output simultaneously from all sub-pixels (SP) provided for the second row (2H) of the display panel 100.

[0318] Through the operation described above, light can be output sequentially from the subpixels (SP) provided in all rows of the display panel 100, thereby enabling the display of a single image through the display panel 100.

[0319] The structure and driving method described above allow for the individual driving of subpixels (SPs).

[0320] To perform the operations described above, the cathode electrode drive unit 420 may include, as shown in Figure 11A, a sensing unit 420 that supplies cathode voltage or a touch drive signal to the second electrode (CE2), a sensing switch 430 that transmits power transmitted from the power supply unit 500 to the sensing unit 420 or cuts off power transmitted from the power supply unit 500 in response to a touch enable signal, and a control switch unit 410 that supplies cathode voltage to the second electrode (CE2) during the display period and connects the sensing unit to the second electrode (CE2) during the touch sensing period.

[0321] The control switching unit 410 includes control switches 411. Each of the control switches 411 can have its second electrode (CE2) connected to the sensing unit 420 or the cathode voltage supply unit 510.

[0322] The cathode voltage supply unit 510 can generate a cathode voltage. The cathode voltage supply unit 510 may be provided independently of the power supply unit 500, but may be included in the power supply unit 500 as shown in Figure 11A.

[0323] Each of the control switches 411 can connect its second electrode (CE2) to the cathode voltage supply unit 510 or to the sensing unit 420, depending on the control signal transmitted from the display driver 200 or the timing controller 300.

[0324] For example, the control switch 411 can connect the second electrode (CE2) to the cathode voltage supply unit 510 during the display period, and can also connect the second electrode (CE2) to the cathode voltage supply unit 510 during the touch sensing period.

[0325] In particular, the control switching unit 410 can sequentially supply cathode voltage to the second electrode (CE2) during the display period and simultaneously supply touch drive signals to the second electrode (CE2) during the touch sensing period. For this reason, the control switching unit 410 can be formed in various structures.

[0326] Each of the control switches 411 can be turned on or off by a control signal received from the timing controller 300 or the display driver 200. The control signal may include the touch synchronization signal described below.

[0327] In the example above, one subtouch electrode (STE) includes four secondary electrodes (CE2), and the four secondary electrodes (CE2) are connected to one pixel driver (PD).

[0328] In this case, the control switching unit 410 may include four control switches 411. Each of the four control switches 411 is connected to the second electrode (CE2), the cathode voltage supply unit 510, and the sensing unit 420.

[0329] During the display period when an image is displayed on the display panel 100, the control switch 411 can connect the second electrode (CE2) to the cathode voltage supply unit 510.

[0330] For example, each of the pixel driver circuits (PDs) may, during the display period, supply a cathode voltage to at least one second electrode (CE2) provided along a first direction (X) or row of the display panel 100.

[0331] In the example above, one second electrode (CE2) is provided in each row. Therefore, the control switch 411 can connect one second electrode (CE2) provided in one row to the cathode voltage supply unit 510 during the display period. In this case, the control switch 411 can be turned on to connect the second electrode (CE2) to the cathode voltage supply unit 510. Therefore, the second electrode (CE2) can be connected to the cathode voltage supply unit 510 via the control switch 411.

[0332] However, if a row is provided with two or more second electrodes (CE2), the control switch 411 may connect the two or more second electrodes (CE2) provided in a row to the cathode voltage supply unit 510.

[0333] As described above, when an anode voltage is supplied from the subpixel driving unit 450 to the anode electrode 134 of the light-emitting element (ED) via the first electrode (CE1), and a cathode voltage is supplied from the cathode electrode driving unit 420 to the cathode electrode 135 of the light-emitting element (ED) via the second electrode (CE2), the light-emitting element (ED) can output light.

[0334] When cathode voltages are supplied sequentially to the four second electrodes (CE2) provided in the four rows (1H, 2H, 3H, 4H), light can be output sequentially from the four rows (1H, 2H, 3H, 4H).

[0335] This type of operation can also be performed on sub-pixels (SPs) connected to other pixel driver circuits (PDs).

[0336] This allows light to be output sequentially from the row of the display panel 100, and therefore, a single image can be displayed across the entire display panel 100.

[0337] Furthermore, during the touch sensing period when a touch is sensed on the display panel 100, all of the control switches 411 can connect all of their second electrodes (CE2) to the sensing unit 420. In this case, all of the control switches 411 can be turned on.

[0338] In other words, the display period for displaying the image and the touch sensing period for sensing touches can be implemented using a time-division multiplexing method.

[0339] For example, each pixel driver circuit (PD) can supply a touch drive signal to all second electrodes (CE2) connected to the pixel driver circuit (PD) during the touch sensing period.

[0340] In the example above, one second electrode (CE2) is provided for each row, and four second electrodes (CE2) are provided for each of the four rows. Therefore, the control switching unit 410 can connect all four second electrodes (CE2) to the sensing unit 420 during the touch sensing period. In this case, the touch drive signal output from the display driver 200 or the sensing unit can be transmitted to the second electrodes (CE2) via the control switch 411. Also, the touch sensing signal generated from the second electrodes (CE2) can be transmitted to the display driver 200 via the control switch 411.

[0341] If a row is provided with two or more second electrodes (CE2), the control switch 411 can connect the two or more second electrodes (CE2) provided in a row to the sensing unit 420.

[0342] When touch drive signals are simultaneously supplied to the four second electrodes (CE2) provided in the four rows (1H, 2H, 3H, 4H), touch sensing signals can be generated in the four rows.

[0343] The touch sensing signals generated by the four rows can be transmitted to the display driver 200 via the switching unit 410 and the sensing unit 420. In this case, the sensing unit 420 can convert the analog touch sensing signals transmitted via the switching unit 410 into digital touch sensing signals and transmit the digital touch sensing signals to the display driver 200. Hereinafter, the analog touch sensing signals and the digital touch sensing signals will be collectively referred to as touch sensing signals. Such operation can also be performed similarly in other pixel driver (PD) circuits.

[0344] To elaborate further, the sensing unit 420 provided in each pixel driving circuit (PD) can supply a touch driving signal to at least one second electrode (CE2) during the touch sensing period, and can transmit the touch sensing signal received from at least one second electrode to the display driver 200.

[0345] The display driver 200 can determine whether or not a touch is present at the touch electrode (TE) using a touch sensing signal transmitted from at least one pixel driver circuit (PD).

[0346] The above describes a driving method for a display device using a self-capping method, but the driving method described above can also be applied to display devices using a mutual capping method and to display devices using both a self-capping method and a mutual capping method.

[0347] For example, the method of driving a pixel driver (PD) during the display period in a display device using a self-capping method can be similarly applied to the method of driving a pixel driver (PD) during the display period in a display device using a mutual capping method.

[0348] The method of driving the pixel driver circuit (PD) in a display device using a mutual cap method during the touch sensing period may vary depending on whether the pixel driver circuit (PD) is included in the sub-drive electrode or the sub-receive electrode, as described above.

[0349] The sensing switch 430 is connected between the power supply unit 500 and the sensing unit 420, and can either supply power to the sensing unit 420 or cut off the power supplied to the sensing unit 420.

[0350] The power supply unit 500 may include a cathode voltage supply unit 510 that generates a cathode voltage, and a power supply unit 520 that generates the power necessary to drive the sensing unit 420. The power supply unit 520 can generate power for various other power sources necessary to drive the display device, not just the sensing unit 420.

[0351] The display driver 200 can transmit a touch enable signal (Touck_EN) to the sensing switch 430, as shown in Figure 11G. Depending on the structure of the touch electrodes (TEs), the method of sensing the touch, and the number of touch electrodes (TEs), the display driver 200 can generate various forms of the touch enable signal (Touck_EN).

[0352] The sensing switch 430 turns on or off according to the touch enable signal (Touck_EN).

[0353] For example, during the display period when cathode voltage is supplied from the cathode voltage supply unit 510 to the second electrode (CE2) via the switching unit 410, the sensing switch 430 may be turned off by a touch enable signal (Touck_EN). As a result, the sensing unit 420 may not be driven during the display period.

[0354] However, during the touch sensing period, the sensing switch 430 can be turned on by a touch enable signal (Touck_EN), thereby allowing power to be supplied from the power supply unit 520 to the sensing unit 420.

[0355] Therefore, the sensing unit 420 can be driven, thereby supplying a touch drive signal to the second electrode (CE2) and transmitting the touch sensing signal to the display driver 200.

[0356] In particular, in the display device according to one embodiment of this specification, the sensing switch 430 can be turned on only during the period when a touch drive signal is supplied to the second electrode (CE2) during the touch sensing period. For example, even during the touch sensing period, the sensing switch 430 can be turned off during the period when a touch drive signal is not supplied to the second electrode (CE2).

[0357] In other words, power can be supplied to the sensing unit 420 only for the minimum period required for touch sensing. This minimizes the power consumption of the sensing unit 420, minimizes the power consumption of the pixel driving circuit (PD), and ultimately minimizes the power consumption of the display device.

[0358] Thirdly, as described above, in the display device according to one embodiment of this specification, pixels (PX) arranged in a 4x4 configuration can be connected to a pixel drive circuit (PD), as shown in Figure 11A, and pixels (PX) arranged in a 16x16 configuration can also be connected to a pixel drive circuit (PD), as shown in Figure 11B. In addition, pixels (PX) arranged in various configurations can be connected to a pixel drive circuit (PD). Below, the structure of the display panel 100 applied to the display device according to one embodiment of this specification will be described with reference to Figures 11B and 11C. In the following description, the same or similar content as described with reference to Figures 1 to 11A will be omitted or simplified. The display device according to one embodiment of this specification may include a pixel drive circuit (PD) and pixels (PX1 to PX16) including light-emitting elements (ED) electrically connected to the pixel drive circuit (PD).

[0359] For example, as shown in Figure 11B, the first pixels (PX1) to the sixteenth pixels (PX16) may be arranged along the first direction (X). A single pixel (PX) may contain red subpixels, green subpixels, and blue subpixels (SP).

[0360] A subpixel (SP) may contain an emitting element (ED). At least one emitting element (ED) may be present in a single subpixel (SP). For example, a single subpixel may contain two emitting elements. One of the two emitting elements may be the main element, and the other the redundant element. The emitting element (ED) may be a micro-LED.

[0361] Along the first direction (X), red subpixels, green subpixels, and blue subpixels may be repeatedly arranged.

[0362] Subpixels (SPs) that emit light of the same color may be arranged along the second direction (Y). For example, subpixels (SPs) that emit light of one of the following colors, red, green, or blue, may be arranged along the second direction (Y). Subpixels (SPs) that emit the same hue may be electrically connected via a first electrode line (AND), as shown in Figure 11C. The first electrode line (AND) may be connected to the first electrode (CE1).

[0363] The first electrode line (AND) may include a first line (AND_P) and a second line (AND_R). The first line (AND_P) and the second line (AND_R) may be spaced apart along a first direction (X). The first line (AND_P) may be connected to the main light-emitting element, and the second line (AND_P) may be connected to a redundant light-emitting element.

[0364] Each of the second electrodes (CE2) may extend in the first direction (X), as shown in Figure 11B. Furthermore, each of the second electrodes (CE2) may be spaced apart from one another along the second direction (Y). Therefore, each of the second electrodes (CE2) may be connected to the first pixels (PX1) to the sixteenth pixels (PX16) located in each row (1H to 16H).

[0365] The pixel driver circuit (PD) can be connected to pixels (PX1 to PX16) via a first electrode (CE1) and a second electrode (CE2). This allows the pixel driver circuit (PD) to drive the light-emitting elements (EDs) arranged in rows 1H to 16H.

[0366] To explain further, the pixel driver circuit (PD) is electrically connected to the light-emitting elements arranged in rows 1H to 16H via the first electrode (CE1) and the second electrode (CE2), and can control the light-emitting operation of the light-emitting elements (ED) by supplying control signals and power to the light-emitting elements (ED) via the first electrode (CE1) and the second electrode (CE2).

[0367] In this case, the second electrode (CE2) can be connected to the pixel (PX) and the pixel driving circuit (PD) in the configuration shown in Figure 11B, the first electrode (CE1) provided on the pixel (PX) can be connected to the first electrode line (AND) in the configuration shown in Figure 11C, and the first electrode (CE1) can be connected to the pixel driving circuit (PD) via the first electrode line (AND).

[0368] For example, as shown in Figure 11C, the light-emitting unit (EDU) may have first electrode lines (AND) arranged on both the upper and lower sides of the pixel driving circuit (PD).

[0369] One of the first electrode lines (AND) can connect the first electrodes (CE1) of light-emitting elements (EDs) that are adjacent to each other in the vertical direction, as shown in Figure 11C.

[0370] In this case, a pixel circuit (PC) may be connected to each of the first electrode lines (AND). However, it is also possible to connect pixel circuits (PC) to at least two first electrode lines (AND). In this case, an anode voltage may be supplied sequentially to at least two first electrode lines (AND).

[0371] The following briefly describes the basic driving method of the display device according to this specification during the display period in which an image is displayed.

[0372] Figure 11D is an illustrative diagram showing a light-emitting signal applied to a display device according to one embodiment of this specification, and Figure 11E is an illustrative diagram showing a pixel circuit applied to a display device according to one embodiment of this specification.

[0373] As explained above, the pixel driver (PD) can control the light emission operation of the light-emitting element (ED) using the pulse width of the light emission signal (EM).

[0374] The pixel driver circuit (PD) can adjust the pulse width of the light emission signal (EM), for example, as shown in Figure 11D, thereby enabling the output of light corresponding to 1 gray to 32 grays via the light-emitting element (ED).

[0375] The pixel driver (PD) can supply a light-emitting signal (EM), whose pulse width is adjusted according to the gray level, to the gate electrode of the light-emitting transistor (TEM).

[0376] In this case, a fixed light-emitting current can be applied to the light-emitting element (ED) via a light-emitting transistor (TEM), thereby allowing the light-emitting element (ED) to emit light.

[0377] For example, if eight light-emitting elements (EDs) are connected to a single first electrode line (AND), the eight EDs can output light using a constant current with the same current value.

[0378] In this case, in a typical organic light-emitting device, the voltage applied to the gate electrode of the driving transistor differs for each light-emitting element, resulting in different amounts of current flowing through the light-emitting elements, while the duration for which current flows through the light-emitting elements is the same.

[0379] However, in the display device according to one embodiment of this specification, the amount of current flowing through the light-emitting elements (EDs) is the same, and the time for which current flows through each light-emitting element is different. That is, the time for which current flows through the light-emitting elements can be adjusted by the pulse width of the light-emitting signal (PWM signal) (EM).

[0380] For example, the pixel circuit (PC), as shown in Figures 4 and 11E, includes a drive transistor (TDR) and a light-emitting transistor (TEM), and is connected to a light-emitting element. The reference numerals 1H, 2H, and 8H in Figure 11E refer to the light-emitting elements (ED) provided in the first column (1H), second column (2H), and eighth column (8H) shown in Figure 11B.

[0381] A high potential voltage (AVDD) is applied to the first electrode of the drive transistor (TDR), a light-emitting transistor (TEM) is connected to the second electrode of the drive transistor (TDR), and a reference voltage (VREF) or initialization voltage (VINT) may be applied to the gate electrode of the drive transistor (TDR). The reference voltage (VREF) or initialization voltage (VINT) may be a scan signal (SC).

[0382] For example, a reference voltage (VREF) may be applied to the gate electrode of a drive transistor (TDR) via a switching means, or an initialization voltage (VINT) may be applied via a voltage buffer (VB) and a switching means.

[0383] A drive transistor (TDR) is connected to the first electrode of the light-emitting transistor (TEM), a light-emitting element is connected to the second electrode of the light-emitting transistor (TEM), and a light-emitting signal (EM) (PWM) can be applied to the gate electrode of the light-emitting transistor (TEM).

[0384] Below, with reference to Figures 11F and 11G, we will briefly explain the display period during which the image is displayed and the touch sensing period during which a touch is detected.

[0385] Figure 11F is an illustrative diagram showing a touch sensing method in a display device according to one embodiment of this specification, and Figure 11G is an illustrative diagram showing the display period and touch sensing period applied to the display device according to one embodiment of this specification.

[0386] In one embodiment of this specification, the second electrode (CE2) can be used as a touch electrode (TE), and such a structure is called an in-cell touch structure. Since the display device according to one embodiment of this specification does not have a separate touch electrode, the thickness of the display panel can be reduced.

[0387] For example, when the cover member 120 is touched by a user, the first capacitance (C1) between the second electrode (CE2) on the display panel 100 and the cover member 120, and the second capacitance (C2) between the second electrode (CE2) and the signal wiring may change, as shown in Figure 11F.

[0388] The touch sensing signals generated by changes in the first capacitance (C1) and the second capacitance (C2) can be transmitted to the pixel driver circuit (PD) via the second electrode (CE2). In this case, the pixel driver circuit (PD) can be connected to the ground (GND).

[0389] The touch sensing signal transmitted to the pixel driver circuit (PD) can be transmitted to the display driver 200, which can use the touch sensing signal transmitted from at least one pixel driver circuit (PD) to determine whether or not there is a touch on the touch electrode (TE).

[0390] A 1-frame period may refer to the period during which one image is displayed through the display panel 100. A 1-frame period may include a display period (DP) and a touch sensing period (TP), as shown in Figure 11G. Within a 1-frame period, the touch sensing period (TP) and the display period (DP) may differ. For example, the touch sensing period (TP) may be shorter than the display period (DP).

[0391] The touch sensing period (TP) and the display period (DP) can be repeated at least once within one frame period. For example, as shown in Figure 11G, the touch sensing period (TP) and the display period (DP) can be repeated four times within one frame period. However, the display device according to one embodiment of this specification is not limited thereto. Therefore, the number of times the touch sensing period (TP) and the display period (DP) are repeated within one frame period can be varied in various ways, and the touch sensing period (TP) and the display period (DP) can also be repeated periodically in cycles of at least two frame periods.

[0392] The timing controller 300 can generate a touch synchronization signal (Tsync) and transmit it to the display driver 300.

[0393] The display driver 300 can perform actions to display an image according to a touch synchronization signal (Tsync), and it can also perform actions to sense touches.

[0394] When the display driver 300 receives a touch signal (S1) indicating the touch sensing period (TP) among the touch synchronization signals (Tsync) that distinguish between the touch sensing period (TP) and the display period (DP), it may transmit a touch enable pulse (E1) that constitutes the touch enable signal (Toutch_EN) to the sensing switch 430.

[0395] In the following description, the touch synchronization signal (Tsync) may include a touch signal (S1) indicating a touch sensing period (TP) and a display signal (S2) indicating a display period (DP). When the display driver 200 receives the touch signal (S1), it can perform operations for touch sensing, and when it receives the display signal (S2), it can perform operations for displaying an image.

[0396] In the following description, the touch enable signal (Touck_EN) may include a touch enable pulse (E1) that turns on the sensing switch 430, and a touch enable off signal (E2) that turns off the sensing switch 430.

[0397] Upon receiving a touch enable pulse (E1), the sensing switch 430 can connect the power supply unit 520 to the sensing unit 420.

[0398] In this case, the sensing unit 420 is driven by power supplied from the power supply unit 520 and can supply a touch drive signal to the second electrode (CE2). This allows the touch sensing signal received from the second electrode (CE2) to be transmitted to the display driver 300, which can then determine whether or not a touch has occurred.

[0399] If the touch enable pulse (E1) is not received, the sensing switch 430 may disconnect the power supply unit 520 from the sensing unit 420. The absence of the touch enable pulse (E1) means that the touch enable off signal (E2) is received.

[0400] For example, when a touch enable-off signal (E2) is received, the sensing switch 430 can be turned off, which prevents power from being supplied to the sensing unit 420.

[0401] Therefore, the sensing unit 420 cannot supply a touch drive signal to the second electrode (CE2), and the touch sensing signal cannot be transmitted to the display driver 300. In other words, when the touch enable-off signal (E2) is received, the touch sensing operation is not performed. This can reduce the power consumption of the sensing unit 420.

[0402] The width of the touch enable pulse (E1) may be the same as the width of the touch signal (S1), or it may be smaller than the width of the touch signal (S1), as shown in Figure 11G.

[0403] For example, during the normal touch sensing period, the width of the touch enable pulse (E1) may be the same as the width of the touch signal (S1), while during the wake-up touch sensing period, the width of the touch enable pulse (E1) may be smaller than the width of the touch signal (S1).

[0404] In the following description, the touch sensing period may include the normal touch sensing period and the wake-up touch sensing period.

[0405] The normal touch sensing period refers to the touch sensing period that continues after a touch is detected, and the wake-up touch sensing period refers to the wake-up touch sensing period that continues after no touch is detected. The wake-up touch sensing period may continue until a touch is detected.

[0406] For example, the touch sensing period can be either a normal touch sensing period or a wake-up touch sensing period. In other words, the normal touch sensing period and the wake-up touch sensing period do not occur simultaneously.

[0407] During the wake-up touch sensing period, as described above, the width of the touch enable pulse (E1) may be smaller than the width of the touch signal (S1), which reduces the operating time of the sensing unit 420 and, therefore, reduces the power consumption of the sensing unit 420.

[0408] During the normal touch sensing period, as explained above, the width of the touch enable pulse (E1) may be the same as the width of the touch signal (S1). However, even during the normal touch sensing period, there is no need to drive the sensing unit 420 during the period when the touch drive signal is not supplied to the second electrode (CE2). Therefore, even during the normal touch sensing period, the width of the touch enable pulse (E1) may be smaller than the width of the touch signal (S1).

[0409] The following describes various driving methods for a display device according to one embodiment of this specification.

[0410] Figures 12A to 12E are illustrative diagrams showing various driving methods for a display device according to one embodiment of this specification. Content identical or similar to that described with reference to Figures 1 to 11G will be omitted or briefly explained. Furthermore, the driving method for the touch sensing period will be described below.

[0411] First, Figure 12A shows the driving method for a display device using a self-capping method, and in particular, the driving method during the normal touch sensing period.

[0412] As described above, the touch synchronization signal (Tsync) may include a touch signal (S1) indicating the touch sensing period (TP) and a display signal (S2) indicating the display period (DP).

[0413] When a touch signal (S1) is received during the normal touch sensing period, the display driver may transmit a touch enable pulse (E1) to the sensing switch 430. This allows the sensing switch 430 to be turned on, power to be supplied to the sensing unit 420, and the sensing unit 420 to be driven.

[0414] The normal touch sensing period refers to the touch sensing period that persists after a touch is detected, and therefore, the likelihood of a touch being detected is high.

[0415] Therefore, it is necessary to rapidly supply a touch drive signal (TDS) to the touch electrode (TE). The touch drive signal (TDS) can be a pulse-width modulated (PWM) signal.

[0416] For example, if the display panel 100 shown in Figure 10 uses only a self-capping method, it may have seven touch electrodes (TEs) along the second direction (Y). In the following description, a horizontal line having seven touch electrodes (TEs) will be referred to as a touch electrode row. In this case, each of the seven touch electrode rows formed on the display panel 100 shown in Figure 10 may have six touch electrodes (TEs).

[0417] If one frame period includes four touch sensing periods (TP), the sensing unit 420 can supply touch drive signals (TDS) with touch electrodes (TE) provided in seven rows of touch electrodes for each touch sensing period (TP).

[0418] However, the sensing unit 420 may, for example, as shown in Figure 12A, supply a touch drive signal (TDS) to the touch electrodes (TE) provided in four of the seven touch electrode rows during the first touch sensing period (TP1) of the four touch sensing periods (TP), and supply a touch drive signal (TDS) to the touch electrodes (TE) provided in the remaining three of the seven touch electrode rows during the second touch sensing period (TP2) of the four touch sensing periods (TP).

[0419] During the first touch sensing period (TP1), the sensing unit 420 can simultaneously supply touch drive signals (TDS) to the touch electrodes (TE) in the four touch electrode rows, or it can sequentially supply touch drive signals (TDS) to the four touch electrode rows.

[0420] The period during which touch drive signals (TDS) are supplied sequentially to three touch electrode rows in the second touch sensing period (TP2) may be shorter than the period during which touch drive signals (TDS) are supplied sequentially to four touch electrode rows in the first touch sensing period (TP1).

[0421] Furthermore, in both the first touch sensing period (TP1) and the second touch sensing period (TP2), if touch drive signals (TDS) are simultaneously supplied to touch electrodes (TEs) located in different rows of touch electrodes, the period during which touch drive signals (TDS) are simultaneously supplied to four rows of touch electrodes in the first touch sensing period (TP1) may be longer than the period during which touch drive signals (TDS) are simultaneously supplied to three rows of touch electrodes in the second touch sensing period (TP2) in order to increase touch sensitivity.

[0422] In this case, the width of the touch enable pulse (E1) supplied to the sensing switch 430 during the first touch sensing period (TP1) may be the same as or smaller than the width of the touch signal (S1).

[0423] Furthermore, the width of the touch enable pulse (E1) supplied to the sensing switch 430 during the second touch sensing period (TP2) may be smaller than the width of the touch enable pulse (E1) supplied to the sensing switch 430 during the first touch sensing period (TP1).

[0424] Therefore, during the second touch sensing period (TP2), when the touch drive signal (TDS) is not supplied to the touch electrode, power may not be supplied to the sensing unit 420, thereby reducing the power consumption of the sensing unit 420.

[0425] To further explain, if it is not necessary to drive the sensing unit 420 during the normal touch sensing period, the power supplied to the sensing unit 420 can be cut off, thereby reducing the power consumption of the display device including the sensing unit 420.

[0426] Next, Figure 12B shows a driving method for a display device using a mutual cap system, and in particular, a driving method during the normal touch sensing period.

[0427] In a display device using a mutual cap method, touch drive signals (TDS) can be supplied sequentially to the first drive electrode (TX1) to the seventh drive electrode (TX7) as shown in Figure 10. For example, during the first touch sensing period (TP1), touch drive signals (TDS) can be supplied sequentially to the first drive electrode (TX1) to the fourth drive electrode (TX4), and during the second touch sensing period (TP2), touch drive signals (TDS) can be supplied sequentially to the fifth drive electrode (TX5) to the seventh drive electrode (TX7).

[0428] The period during which touch drive signals (TDS) are supplied sequentially to the first drive electrode (TX1) through the fourth drive electrode (TX4) may be longer than the period during which touch drive signals (TDS) are supplied sequentially to the fifth drive electrode (TX5) through the seventh drive electrode (TX7).

[0429] Therefore, the width of the touch enable pulse (E1) supplied to the sensing switch 430 during the first touch sensing period (TP1) may be the same as or smaller than the width of the touch signal (S1), and the width of the touch enable pulse (E1) supplied to the sensing switch 430 during the second touch sensing period (TP2) may be smaller than the width of the touch enable pulse (E1) supplied to the sensing switch 430 during the first touch sensing period (TP1).

[0430] Therefore, during the second touch sensing period (TP2), when the touch drive signal (TDS) is not supplied to the drive electrode, power may not be supplied to the sensing unit 420, thereby reducing the power consumption of the sensing unit 420.

[0431] In this case, a sub-receiving electrode located in the same touch electrode row as the drive electrode (TX) to which the touch drive signal (TDS) is supplied may be supplied with the same touch enable pulse (E1) as the touch enable pulse (E1) applied to the drive electrode (TX) to which the touch drive signal (TDS) is supplied.

[0432] Therefore, the width of the touch enable pulse (E1) supplied to the sensing switch 430 of the sub-receiving electrode during the first touch sensing period (TP1) may be the same as or smaller than the width of the touch signal (S1), and the width of the touch enable pulse (E1) supplied to the sensing switch 430 of the sub-receiving electrode during the second touch sensing period (TP2) may be smaller than the width of the touch enable pulse (E1) supplied to the sensing switch 430 of the sub-receiving electrode during the first touch sensing period (TP1).

[0433] Therefore, during the second touch sensing period (TP2), when no touch sensing signal is received, power may not be supplied to the sensing unit 420, thereby reducing the power consumption of the sensing unit 420.

[0434] Next, Figure 12C shows a driving method for a display device using a self-capping method or a mutual-capping method, and in particular, a driving method during the wake-up touch sensing period.

[0435] The wake-up touch sensing period refers to the period that continues after it is determined that there is no touch, and there is a high probability that no touch occurred during the wake-up touch sensing period.

[0436] Therefore, there is no need to rapidly supply touch drive signals (TDS) to the touch electrodes (TE).

[0437] Therefore, during the wake-up touch sensing period, a touch can be detected by a touch electrode (TE) provided in at least one of the seven touch electrode rows shown in Figure 10.

[0438] For example, when a self-capping method is used, during the first touch sensing period (TP1), a touch drive signal (TDS) can be supplied to the touch electrode (TE) provided in the first touch electrode row among the seven touch electrode rows shown in Figure 10; during the second touch sensing period (TP2), a touch drive signal (TDS) can be supplied to the touch electrode (TE) provided in the second touch electrode row; during the third touch sensing period (TP3), a touch drive signal (TDS) can be supplied to the touch electrode (TE) provided in the third touch electrode row; and during the fourth touch sensing period (TP4), a touch drive signal (TDS) can be supplied to the touch electrode (TE) provided in the fourth touch electrode row.

[0439] Thereafter, during another frame period, a touch drive signal (TDS) may be supplied to the touch electrode (TE) in the fifth touch electrode row during the first touch sensing period (TP1), a touch drive signal (TDS) may be supplied to the touch electrode (TE) in the sixth touch electrode row during the second touch sensing period (TP2), and a touch drive signal (TDS) may be supplied to the touch electrode (TE) in the seventh touch electrode row during the third touch sensing period (TP3). A touch drive signal (TDS) may be supplied to the touch electrode (TE) in the first touch electrode row during the fourth touch sensing period (TP4), although it is also possible that no touch drive signal is supplied to the touch electrode during the fourth touch sensing period (TP4).

[0440] In this case, a touch can be detected across the entire display panel 100 during a 2-frame period. Here, a 2-frame period means a period in which one frame period is repeated twice.

[0441] However, as another example, during the first touch sensing period (TP1), touch drive signals (TDS) can be supplied to the touch electrodes (TE) provided in the first and second touch electrode rows; during the second touch sensing period (TP2), touch drive signals (TDS) can be supplied to the touch electrodes (TE) provided in the third and fourth touch electrode rows; during the third touch sensing period (TP3), touch drive signals (TDS) can be supplied to the touch electrodes (TE) provided in the fifth and sixth touch electrode rows; and during the fourth touch sensing period (TP4), touch drive signals (TDS) can be supplied to the touch electrodes (TE) provided in the seventh touch electrode row.

[0442] In this case, touch can be detected across the entire display panel 100 within a single frame period.

[0443] In other words, the period during which a touch is detected across the entire display panel 100 during the wake-up touch sensing period can be varied in various ways.

[0444] Furthermore, the period during which a touch drive signal is supplied to the touch electrode (TE) during the wake-up touch sensing period may be shorter than the period during which a touch drive signal is supplied to the touch electrode (TE) during the normal touch sensing period.

[0445] Therefore, the width of the touch enable pulse (E1) during the wake-up touch sensing period may be smaller than the width of the touch enable pulse (E1) during the normal touch sensing period, as shown in Figures 12A and 12B.

[0446] As a result, the power consumption of the sensing unit 420 during the wake-up touch sensing period may be less than the power consumption of the sensing unit 420 during the normal touch sensing period.

[0447] The explanation above, with reference to Figure 12C, can also be applied when a mutual cap system is used.

[0448] Therefore, in a display device using a mutual cap method, the power consumption of the sensing unit 420 during the wake-up touch sensing period may be less than the power consumption of the sensing unit 420 during the normal touch sensing period.

[0449] Next, Figure 12D shows the driving methods for display devices using the self-capping method and the mutual-capping method, and in particular, the driving method during the wake-up touch sensing period. Content in the following explanation that is the same as or similar to that explained with reference to Figures 12A to 12C will be omitted or briefly explained.

[0450] For example, in Figure 12C, if touch is detected using a self-capping method during the first touch sensing period (TP1) and the third touch sensing period (TP3), and touch is detected using a mutual-capping method during the second touch sensing period (TP2) and the fourth touch sensing period (TP4), the width of the touch enable pulse (E1) in each of the first touch sensing period (TP1) to the fourth touch sensing period (TP4) may be smaller than the width of the touch enable pulse (E1) in the normal touch sensing period shown in Figures 12A and 12B.

[0451] Therefore, in display devices using a self-capping method and a mutual-capping method, the power consumption of the sensing unit 420 during the wake-up touch sensing period may be less than the power consumption of the sensing unit 420 during the normal touch sensing period.

[0452] Furthermore, the power consumption of the sensing unit 420 during the normal touch sensing period may be less than the power consumption of the sensing unit 420 during the normal touch sensing period applied to conventional display devices.

[0453] In a display device using a self-capping method and a mutual-capping method, the touch sensing period (TP) using the self-capping method and the touch sensing period (TP) using the mutual-capping method can be consecutive as shown in Figure 12D, and the touch sensing period using the self-capping method and the touch sensing period (TP) using the mutual-capping method can occur only once in one frame period.

[0454] In this case, during the first touch sensing period (TP1), a self-capping method can be used to detect a touch, and during the second touch sensing period (TP2), a mutual capping method can be used to detect a touch.

[0455] In particular, while a touch signal (S1) is supplied, touch detection using a self-capping method and touch detection using a mutual-capping method can be performed sequentially.

[0456] In this case, the sum of the widths of the touch enable pulses (E1) supplied to the sensing switch 430 during the first touch sensing period (TP1) and the touch enable pulses (E1) supplied to the sensing switch 430 during the second touch sensing period (TP2) may be smaller than the width of the touch signal (S1). Furthermore, the width of each touch enable pulse (E1) may be set to be approximately the same as the period for which the touch drive signal (TDS) is substantially supplied to the touch electrode (TE).

[0457] This means that power is supplied to the sensing unit 420 only during the period when touch is effectively detected.

[0458] Therefore, according to the display device specified herein, the power consumption of the sensing unit 420 can be reduced, thereby reducing the power consumption of the display device.

[0459] Finally, Figure 12E shows driving methods for other display devices using self-capping and mutual-capping methods, and in particular, driving methods during the wake-up touch sensing period.

[0460] In a display device using a self-capping method and a mutual-capping method, the touch sensing period (TP) using the self-capping method and the touch sensing period (TP) using the mutual-capping method can be consecutive, as shown in Figures 12D and 12E, and the touch sensing period using the self-capping method and the touch sensing period (TP) using the mutual-capping method can occur only once within one frame period.

[0461] In this case, during the first touch sensing period (TP1) and the second touch sensing period (TP2) that are consecutive within one frame period (hereinafter simply referred to as the first frame), a self-capping method can be used to detect touches, and during any other one-frame period that occurs after the first frame (hereinafter simply referred to as the second frame), a mutual capping method can be used to detect touches.

[0462] For example, if the touch electrodes (TEs) shown in Figure 10 are divided into two groups along a first direction (X), then each of the first and second groups may include touch electrodes (TEs) arranged in a 3 × 7 (width × height) configuration.

[0463] In this case, during the first touch sensing period (TP1) and the second touch sensing period (TP2) of the first frame, a touch can be detected at the touch electrodes (TE) provided in the first group using a self-capping method, and during the first touch sensing period (TP1) and the second touch sensing period (TP2) of the second frame, a touch can be detected at the touch electrodes (TE) provided in the second group using a mutual capping method.

[0464] In this case, the sum of the width of the touch enable pulse (E1) supplied to the sensing switch 430 during the first touch sensing period (TP1) of the first frame and the width of the touch enable pulse (E1) supplied to the sensing switch 430 during the second touch sensing period (TP2) may be narrower than the width of the touch signal (S1) of the first frame. Furthermore, the width of each touch enable pulse (E1) may be set to be approximately the same as the duration for which the touch drive signal (TDS) is substantially supplied to the touch electrode (TE).

[0465] Furthermore, the sum of the widths of the touch enable pulses (E1) supplied to the sensing switch 430 during the first touch sensing period (TP1) of the second frame and the widths of the touch enable pulses (E1) supplied to the sensing switch 430 during the second touch sensing period (TP2) may be narrower than the width of the touch signal (S1) of the second frame. Also, the width of each touch enable pulse (E1) may be set to be approximately the same as the period for which the touch drive signal (TDS) is substantially supplied to the touch electrode (TE).

[0466] This means that power is supplied to the sensing unit 420 only during the period when touch is effectively detected.

[0467] Therefore, according to the display device specified herein, the power consumption of the sensing unit 420 can be reduced, thereby reducing the power consumption of the display device.

[0468] To further explain, in a display device according to one embodiment of this specification, as shown in Figures 12D and 12E, upon receiving a touch signal (S1), the display driver 200 can sequentially transmit a first enable pulse (E1) and a second enable pulse (E1) to the sensing switch 430.

[0469] In this case, upon receiving the first enable pulse (E1), the sensing unit 420 can supply a touch drive signal (TDS) to the second electrode (CE2), convert the analog touch sensing signal received from the second electrode (CE2) into a digital touch sensing signal, and transmit the touch sensing signal to the display driver 200. For example, as explained with reference to Figure 12D, a self-capping method can be used to detect a touch during the first touch sensing period (TP1).

[0470] Thereafter, upon receiving the second enable pulse (E1), the sensing unit 420 may supply a touch drive signal (TDS) to the second electrode (CE2), or convert the analog touch sensing signal received from the second electrode (CE2) into a digital touch sensing signal and transmit the touch sensing signal to the display driver 200. For example, as explained with reference to Figure 12D, a touch may be detected during the second touch sensing period (TP2) using a mutual cap method.

[0471] As described above, the display device according to one embodiment of this specification can minimize the width of the touch enable pulse (E1) during the wake-up touch sensing period, thereby minimizing the time the sensing unit 420 is driven, and thus minimizing the power consumption of the sensing unit 420. Not only during the wake-up touch sensing period, but also during the normal touch sensing period, the width of the touch enable pulse (E1) may be narrower than the width of the touch signal (S1), thereby reducing the power consumption of the sensing unit 420 even during the normal touch sensing period.

[0472] Furthermore, in a display device according to one embodiment of this specification, touch electrodes provided along a first direction (X) or a second direction (Y) of the display panel 100 can be divided into groups, and touches can be detected by sequentially driving these groups. In this case, the groups can be set to various configurations and numbers, thereby allowing for various changes in the duration or ratio of touch detection on the display panel 100.

[0473] Figures 13 to 16 show an electronic device to which a display device according to one embodiment of this specification is applied.

[0474] Referring to Figures 13 to 16, the display devices according to the embodiments of this specification may be included in a variety of electronic devices. For example, the various electronic devices may be a wearable device 1100 as shown in Figure 13, a mobile device 1200 as shown in Figure 14, a notebook 1300 as shown in Figure 15, and a monitor or television 1400 as shown in Figure 16, but the embodiments of this specification are not limited thereto.

[0475] Each of the wearable device 1100, mobile device 1200, notebook 1300, and monitor or TV 1400 may include a case 1005, 1010, 1015, 1020, and a display panel 100 and display device according to the embodiments of this specification described above.

[0476] For example, the display devices according to the embodiments of this specification can be applied to mobile devices, video phones, smartwatches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, curved devices, sliding devices, variable devices, electronic organizers, ebooks, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbook computers, workstations, navigation systems, vehicle display devices, theater display devices, televisions, wallpaper devices, signage devices, game consoles, laptops, monitors, cameras, video cameras, home appliances, and the like.

[0477] The features of the display device according to one embodiment of this specification can be briefly summarized as follows:

[0478] A display device according to one embodiment of this specification includes a substrate including a display area and a non-display area, a pixel driving circuit provided in the display area, a first electrode connected to the pixel driving circuit, a light-emitting element provided on the first electrode, and a second electrode provided on the light-emitting element, wherein the pixel driving circuit includes a sensing unit that supplies a cathode voltage or a touch driving signal to the second electrode, and a sensing switch that transmits power transmitted from a power supply unit to the sensing unit or cuts off power transmitted from the power supply unit based on a touch enable signal.

[0479] At least two second electrodes connected to the pixel driving circuit are used as a single touch electrode.

[0480] Each of at least two second electrodes extends along a first direction of the substrate, and the at least two second electrodes are provided along a second direction different from the first direction.

[0481] When a cathode voltage is supplied to any one of the at least two second electrodes, light is emitted from the light-emitting element connected to the second electrode to which the cathode voltage is supplied.

[0482] When the at least two second electrodes are used as a single touch electrode, a touch drive signal is supplied to the at least two second electrodes simultaneously.

[0483] The pixel driving circuit further includes a control switching unit that supplies a cathode voltage to the second electrode during the display period and connects the sensing unit to the second electrode during the touch sensing period.

[0484] The pixel driving circuit further includes a sub-pixel driving unit that supplies an anode voltage to the first electrode.

[0485] A display device according to one embodiment of this specification further includes a display driver that transmits the touch enable signal to the sensing switch.

[0486] When the display driver receives a touch signal indicating the touch sensing period, which is one of the touch synchronization signals that distinguishes between the touch sensing period and the display period, it transmits a touch enable pulse that constitutes the touch enable signal to the sensing switch.

[0487] Upon receiving the touch enable pulse, the sensing switch connects the power supply unit to the sensing unit.

[0488] The sensing unit is driven by power supplied from the power supply unit and supplies the touch drive signal to the second electrode.

[0489] If the touch enable pulse is not received, the sensing switch disconnects the power supply unit from the sensing unit.

[0490] The width of the touch enable pulse is narrower than or equal to the width of the touch signal.

[0491] Upon receiving the touch signal, the display driver transmits a first enable pulse and a second enable pulse to the sensing switch in sequence.

[0492] When the first enable pulse is received, the sensing unit supplies a touch drive signal to the second electrode, converts the analog touch sensing signal received from the second electrode into a digital touch sensing signal, and transmits the touch sensing signal to the display driver. When the second enable pulse is received, the sensing unit either supplies a touch drive signal to the second electrode or converts the analog touch sensing signal received from the second electrode into a digital touch sensing signal and transmits the touch sensing signal to the display driver.

[0493] The touch sensing period includes a normal touch sensing period that continues after it is determined that a touch has occurred and a wake-up touch sensing period that continues after it is determined that there is no touch, and the display driver transmits the touch enable pulse to the sensing switch during each of the normal touch sensing period and the wake-up touch sensing period.

[0494] The features, structures, effects, etc., described in the various examples of this specification described above are included in, and not necessarily limited to, at least one example of this specification. Furthermore, the features, structures, effects, etc., exemplified in at least one example of this specification can be combined or modified and implemented in other examples by a person with ordinary skill in the art to which the technical idea of ​​this specification belongs. Accordingly, the content related to such combinations and modifications should be construed as being included in the scope of the technology or rights of this specification.

[0495] This specification, as described above, is not limited by the embodiments and accompanying figures, and it will be apparent to those with ordinary skill in the art to which this specification belongs that various substitutions, modifications, and alterations are possible without departing from the technical matters of this specification. Accordingly, the scope of this specification is indicated by the claims set forth below, and all modified or altered forms derived from the meaning, scope, and equivalent concepts of the claims should be construed as being included within the scope of this specification. [Explanation of Symbols]

[0496] 100: Display Panel 110: Circuit board 200: Display driver 300: Timing Controller 900: External systems

Claims

1. A substrate including a display area and a non-display area, The display area includes a pixel driving circuit, A first electrode connected to the aforementioned pixel driving circuit, A light-emitting element provided on the first electrode, The light-emitting element includes a second electrode provided on the light-emitting element, The aforementioned pixel driving circuit A sensing unit that supplies cathode voltage or touch drive signal to the second electrode, A display device including a sensing switch that, in response to a touch enable signal, transmits power transmitted from a power supply unit to the sensing unit, or cuts off the power transmitted from the power supply unit.

2. The display device according to claim 1, wherein at least two second electrodes connected to the pixel driving circuit are used as a single touch electrode.

3. Each of the at least two second electrodes extends along the first direction of the substrate, The display device according to claim 2, wherein the at least two second electrodes are provided along a second direction different from the first direction.

4. The display device according to claim 3, wherein when a cathode voltage is supplied to any one of the at least two second electrodes, light is output from a light-emitting element connected to the second electrode to which the cathode voltage is supplied.

5. The display device according to claim 3, wherein when the at least two second electrodes are used as a single touch electrode, a touch drive signal is supplied simultaneously to the at least two second electrodes.

6. The aforementioned pixel driving circuit The display device according to claim 1, further comprising a control switch unit that supplies a cathode voltage to the second electrode during the display period and connects the sensing unit to the second electrode during the touch sensing period.

7. The aforementioned pixel driving circuit The display device according to claim 1, further comprising a sub-pixel driving unit that supplies an anode voltage to the first electrode.

8. The display device according to claim 1, further comprising a display driver for transmitting the touch enable signal to the sensing switch.

9. The aforementioned display driver The display device according to claim 8, wherein, among the touch synchronization signals that distinguish between a touch sensing period and a display period, when a touch signal indicating the touch sensing period is received, a touch enable pulse constituting the touch enable signal is transmitted to the sensing switch.

10. The display device according to claim 9, wherein when the touch enable pulse is received, the sensing switch connects the power supply unit to the sensing unit.

11. The display device according to claim 10, wherein the sensing unit is driven by a power supply provided by the power supply unit and supplies the touch drive signal to the second electrode.

12. The display device according to claim 10, wherein if the touch enable pulse is not received, the sensing switch disconnects the power supply unit from the sensing unit.

13. The display device according to claim 9, wherein the width of the touch enable pulse is narrower than or equal to the width of the touch signal.

14. The display device according to claim 9, wherein when the touch signal is received, the display driver transmits a first enable pulse and a second enable pulse to the sensing switch in sequence.

15. When the first enable pulse is received, the sensing unit supplies a touch drive signal to the second electrode, converts the analog touch sensing signal received from the second electrode into a digital touch sensing signal, and transmits the touch sensing signal to the display driver. The display device according to claim 14, wherein when the second enable pulse is received, the sensing unit supplies a touch drive signal to the second electrode, or converts the analog touch sensing signal received from the second electrode into a digital touch sensing signal, and transmits the touch sensing signal to the display driver.

16. The touch sensing period includes a normal touch sensing period that continues after it is determined that a touch has occurred, and a wake-up touch sensing period that continues after it is determined that there is no touch. The display device according to claim 9, wherein the display driver transmits the touch enable pulse to the sensing switch during the normal touch sensing period and the wake-up touch sensing period, respectively.