Indication device

Abstract

To improve the detection sensitivity of the touch panel, or to improve the visibility of the touch panel. To provide a touch panel that can be bent or a thin touch panel. Provide a panel. Or, provide a lightweight touch panel. [Solution] A tap having a first substrate, a first conductive layer, a second conductive layer, and an insulating layer The sensor is configured as follows: The first conductive layer is located in the region between the first substrate and the second conductive layer. The insulating layer has a region located between the first conductive layer and the second conductive layer. The conductive layer, the second conductive layer, and the insulating layer form a capacitance. The second conductive layer has an opening. The openings of the second conductive layer and the first conductive layer have overlapping regions.

Description

[Technical Field]

[0001] One aspect of the present invention relates to a touch sensor, or to a flexible touch sensor. To do. Or, one aspect of the present invention relates to a touch panel. Or, a flexible touch Regarding the panel.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. One aspect of the present invention relates to a product, method, or method of manufacture. Another aspect of the present invention relates to a process, machine , relating to manufacture or composition of matter. More specifically, one aspect of the technical field of the present invention disclosed herein is semiconductor devices, Display devices, light-emitting devices, energy storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices Examples include their driving methods or their manufacturing methods.

[0003] In this specification, a semiconductor device is defined as a device that can function by utilizing semiconductor properties. This refers to all types of devices, including semiconductor elements such as transistors, semiconductor circuits, computing devices, and memory devices. The device is a form of semiconductor device. Examples include imaging devices, display devices, liquid crystal display devices, light-emitting devices, and electric devices. Optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic equipment are subject to the following regulations: It may have a semiconductor device. [Background technology]

[0004] In recent years, display devices have been expected to have applications in a variety of fields, and diversification is required. For example, the development of smartphones and tablet devices equipped with touch panels as personal information terminals. This is being implemented.

[0005] In addition, Patent Document 1 discloses a flexible active matrix light-emitting device provided with a transistor, which is a switching element, and an organic EL element on a film substrate.

Prior Art Document

Patent Document

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] There is a demand for a touch panel in which a function of inputting by touching a screen with a finger, a stylus, etc. as a user interface is added to a display panel.

[0008] For example, the touch panel can be configured to provide a touch sensor on the viewing side of the display panel. It is desirable that the touch sensor provided on the touch panel has high detection sensitivity. Also, since the touch sensor is provided overlapping the display panel, the visibility may be reduced as compared with the case where the touch sensor is not provided.

[0009] One aspect of the present invention is to improve the detection sensitivity of the touch panel as one of the problems. Also, it is to improve the visibility of the touch panel as one of the problems. Or, it is to provide a thin touch panel as one of the problems. Or, it is to provide a touch panel that can be bent as one of the problems. Or, it is to provide a lightweight touch panel as one of the problems. Or, it is to provide a highly reliable touch panel as one of the problems.

[0010] Alternatively, one of the objectives is to provide a novel input device. One of the objectives is to provide [this].

[0011] Furthermore, the description of these problems does not preclude the existence of other problems. One approach does not require that all of these issues be resolved. The title will become clear from the description in the specification, drawings, claims, etc. It is possible to extract other issues from the descriptions in the drawings, claims, etc. [Means for solving the problem]

[0012] One aspect of the present invention comprises a first substrate, a first conductive layer, a second conductive layer, and an insulating layer. This is a touch sensor. The first conductive layer is located between the first substrate and the second conductive layer. The insulating layer has a region located between the first conductive layer and the second conductive layer. The conductive layer, the second conductive layer, and the insulating layer form a capacitance. The second conductive layer has an opening. The openings of the second conductive layer and the first conductive layer have overlapping regions.

[0013] Furthermore, the above includes a first transistor electrically connected to the first conductive layer. This is preferable.

[0014] Another aspect of the present invention includes the touch sensor, a second substrate, a display element, and a first It is a touch panel having a first layer and a second layer. The second substrate is relative to the first substrate. It has overlapping regions. Also, between the first substrate and the second substrate, there is a display element, a first layer, and It has two layers. The first layer has the function of transmitting light in a specific wavelength band, and also displays The elements have overlapping regions. The second layer has the function of blocking visible light. The conductive layer has a region that overlaps with the first layer and a region that overlaps with the second layer. The second conductive layer has a region that overlaps with the second layer. The opening of the second conductive layer and the indicator element The children have overlapping regions. Also, the openings of the second conductive layer and the first layer overlap each other. It has a domain.

[0015] Furthermore, in the above, it is preferable that the display element is a light-emitting element.

[0016] Furthermore, it is preferable that the first substrate and the second substrate each have flexibility. It seems so.

[0017] Another aspect of the present invention is the touch sensor and a first FPC (Flexible Printed Circuit). The first FPC has a first conductive layer or A touch sensor module having the function of supplying a signal to at least one of the second conductive layers. That is the case.

[0018] Another aspect of the present invention is a touch panel, a second FPC, and a third FPC. The second FPC has a signal to at least one of the first conductive layer or the second conductive layer. The third FPC has the function of supplying a signal to the display element, touch It is a panel module.

[0019] Another aspect of the present invention relates to the above-mentioned touch sensor module or the above-mentioned touch panel A module is an electronic device that is built into a casing. [Effects of the Invention]

[0020] According to one aspect of the present invention, the detection sensitivity of the touch panel can be improved. This can improve the visibility of the touch panel. Alternatively, a thinner touch panel can be used. We can provide it. Or we can provide a lightweight touch panel. Or we can provide a highly reliable We can provide a touch panel.

[0021] Alternatively, a novel input device can be provided. Alternatively, a novel input / output device can be provided. The description of these effects does not preclude the existence of other effects. Furthermore, one embodiment of the present invention It is not necessary for it to have all of these effects. Furthermore, any effects other than these are clearly stated. This will become clear from the description in the detailed specifications, drawings, and claims, and the specifications, drawings, and claims will become clear from the description, drawings, and claims. It is possible to extract other effects from the descriptions of the requested terms, etc. [Brief explanation of the drawing]

[0022] [Figure 1] An example of the configuration of a touch panel module according to an embodiment. [Figure 2] An example of the configuration of a stacked structure of a touch panel module according to an embodiment. [Figure 3] An example of the configuration of a stacked structure of a touch panel module according to an embodiment. [Figure 4] An example of the configuration of a stacked structure of a touch panel module according to an embodiment. [Figure 5] An example of the configuration of a touch panel module according to an embodiment. [Figure 6] An example of the configuration of a touch panel module according to an embodiment. [Figure 7] An example of the configuration of a touch panel module according to an embodiment. [Figure 8] An example of the configuration of a touch panel module according to an embodiment. [Figure 9]A block diagram, circuit diagram, and timing chart of a touch panel according to an embodiment. [Figure 10] A circuit diagram and schematic diagram of the configuration of a touch panel according to an embodiment. [Figure 11] A block diagram and a circuit diagram of the configuration of a touch panel according to an embodiment. [Figure 12] A circuit diagram of the configuration of a touch panel according to an embodiment. [Figure 13] An example of a touch panel configuration according to an embodiment. [Figure 14] A diagram illustrating a method for driving a touch panel according to an embodiment. [Figure 15] An electronic device according to an embodiment. [Figure 16] An electronic device according to an embodiment. [Modes for carrying out the invention]

[0023] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. Those skilled in the art will readily understand what is possible. Therefore, the present invention is as shown in the following embodiments. It should not be interpreted as being limited to the contents described herein.

[0024] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0025] In each figure described herein, the size, layer thickness, or area of ​​each component is as follows: It may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. stomach.

[0026] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0027] A transistor is a type of semiconductor device that amplifies current and voltage, and controls conduction or non-conductivity. It is possible to realize controlled switching operations, etc. Transistors in this specification are , IGFET(Insulated Gate Field Effect Trans istors and thin-film transistors (TFTs) ) includes.

[0028] Furthermore, the words "membrane" and "layer" can be used interchangeably depending on the context or situation. Accordingly, they can be interchanged. For example, the term "conductive layer" can be replaced with "conductive layer". In some cases, the term can be changed to "film." Or, for example, "insulating film." In some cases, it may be possible to change the term to "insulating layer."

[0029] (Embodiment 1) In this embodiment, a touch sensor according to one aspect of the present invention, and a touch sensor equipped with a touch sensor This section describes examples of configurations for submodules, touch panels, and touch panel modules. The following section will explain the case where a capacitive touch sensor is applied as the touch sensor. I will reveal it.

[0030] In this specification, etc., a substrate equipped with a touch sensor may be provided with, for example, an FPC or TCP ( Items with connectors attached, such as Tape Carrier Packages. Alternatively, an IC (integrated circuit) is directly attached to the substrate using the COG (Chip On Glass) method. The implemented unit is sometimes called a touch sensor module. A device that has both the function of inputting text and the function of displaying images, etc., is called a touch panel (input / output device). It may be called. Note that the above connector is attached to the touch panel, or I A device that implements C is sometimes called a touch panel module, or simply a touch panel. ru.

[0031] A capacitive touch sensor applicable to one aspect of the present invention comprises a capacitive element A capacitive element is, for example, a first conductive layer, a second conductive layer, and an insulating layer sandwiched between them. A configuration having a laminated structure is possible. In this case, the first conductive layer and the second conductive layer Each layer functions as an electrode for a capacitive element. The insulating layer, on the other hand, functions as a dielectric.

[0032] Of the first and second conductive layers, the first conductive layer is provided on the touch surface (detection surface) side. The present invention provides a touch sensor that, according to one aspect of the present invention, detects an object such as a finger or a stylus and a first guide By detecting the capacitance formed between the electrode and the electrode, touch operation can be detected. Specifically, when a predetermined potential difference is applied between the first conductive layer and the second conductive layer, To detect the change in potential of the first conductive layer caused by the capacitance formed by the switch operation. This allows for the detection of touch movements.

[0033] Here, within the region that performs the touch detection function of the touch sensor, the surface of the second conductive layer Rather than increasing the product, it is preferable to increase the area of ​​the first conductive layer. The capacitance between the first conductive layer and the second conductive layer can be reduced. Furthermore, the electrode area of ​​the first conductive layer By increasing the size of the capacitance formed between the object to be detected and the first conductive layer, the size of the capacitance formed between the object to be detected and the first conductive layer can be increased. This is possible. As a result, the change in potential of the first conductive layer during touch operation is large. Therefore, it becomes possible to increase the detection sensitivity.

[0034] For example, the second conductive layer has a structure with an opening, and the opening and the first conductive layer overlap each other. It is preferable to arrange the first conductive layer and the second conductive layer in such a manner. The capacitance value formed between the second conductive layer and the first conductive layer is determined by changing the number and area of ​​the openings provided in the second conductive layer. By doing so, it becomes possible to easily change the insulation layer thickness or material without altering it. ru.

[0035] Furthermore, a touch sensor according to one aspect of the present invention is provided with a display panel having pixels equipped with display elements. By stacking these, a touch panel can be constructed. In this case, the opening of the second conductive layer is By positioning it so as to overlap with the display element, light from the display element passes through the second conductive layer. Because it becomes unnecessary, the brightness and visibility of the images displayed on the touch panel can be improved. It can. Also, the touch panel has a color filter (also called a coloring layer) that overlaps with the display element, and adjacent to it. In a configuration comprising a light-shielding layer provided between the contacting color filters, the second conductive layer is shielded It is preferable to provide the optical layer in superimposed on the second conductive layer, and further to provide the aperture of the second conductive layer in superimposed on the color filter. It seems so.

[0036] At this time, two circuit boards are placed opposite each other: one supporting the touch sensor and the other supporting the display element. It is preferable to have a configuration in which the touch panel is arranged in such a way. Because the area of ​​the second conductive layer located on the display element side of the sensor is small, the display element is driven It is less susceptible to noise generated when the sensor is placed on it. Even when the indicator elements are sandwiched and arranged in close proximity, the decrease in detection sensitivity can be suppressed. This makes it possible. As a result, the thickness of the touch panel can be reduced. In particular, a pair of substrates By using a flexible material, a thin, lightweight, and flexible touch panel can be created. It can be achieved.

[0037] In the following section, a more specific example of one aspect of the present invention will be described with reference to the drawings.

[0038] [Example Configuration] Figure 1(A) is a schematic perspective view of a touch panel module 10 according to one embodiment of the present invention. Figure 1(B) is a schematic perspective view of the touch panel module 10 when it is unfolded. The touch panel module 10 is constructed by stacking the touch sensor module 20 and the display panel 30. It has a configured arrangement.

[0039] The touch sensor module 20 has a sensor element (also called a detection element) on the first substrate 21. The touch sensor has a configuration in which an FPC 41 is provided with 22. Furthermore, multiple of them are arranged in a matrix on the first substrate 21. It is preferable to include circuits 23 and 24 that are electrically connected to the sensor element 22. At least one of circuits 23 and 24 has the function of selecting a plurality of sensor elements 22. A circuit can be applied. Also, at least one of circuits 23 and 24 is a A circuit that has the function of outputting a signal from sensor element 22 can be applied. FPC4 1 supplies an external signal to at least one of the sensor element 22, circuit 23, and circuit 24. It has the function of doing so. Alternatively, FPC41 has a small number of sensor elements 22, circuits 23 and 24. It has the ability to output a signal to the outside, even if it doesn't have a built-in function.

[0040] The display panel 30 has a display unit 32 on the second substrate 31. The display unit 32 is a matrix. It has multiple pixels 33 arranged in a grid pattern. Also, on the second substrate 31, the image within the display unit 32 It is preferable to include a circuit 34 that is electrically connected to element 33. The circuit 34 is, for example, a gate A circuit that functions as a drive circuit can be applied. The FPC42 is the display unit 32 or At least one component of circuit 34 has the function of supplying an external signal. Also, Figure 1(A) (B) shows a configuration in which the second substrate 31 is provided with terminals 43. Terminals 43 include, for example If an FPC is installed, the IC that functions as the source drive circuit is installed using the COG method or CO Direct implementation using the F method, or using FPC, TAB, TCP, etc. on which ICs are implemented. It is possible to attach them, etc. Furthermore, connectors such as ICs and FPCs are actually located on the display panel 30. The assembled form can also be called a display panel module.

[0041] A touch panel module 10 according to one aspect of the present invention is touched by a plurality of sensor elements 22. It can output position information based on the change in capacity when the operation is performed. Also, display unit 3 The image can be displayed using method 2.

[0042] [Regarding the layered structure of touch panels] Figure 2(A) shows a schematic diagram of the area indicated by the dashed line in Figure 1(A) in enlargement.

[0043] Figure 2(A) shows the capacitive element 110, pixel 33, and distribution of the sensor element 22 in Figure 1(A). This shows an example where wire 25 and wiring 26 are provided.

[0044] Multiple capacitive elements 110 are arranged in a matrix. Two adjacent wires 25 The capacitive elements 110 are arranged in a manner that intersects with the wiring 25, and multiple wirings 26 are arranged in that manner. Yes, they are.

[0045] Multiple pixels 33 are arranged in a matrix. Of the multiple pixels 33, some It is provided in overlap with the capacitive element 110, and the other part is between two adjacent capacitive elements 110. It is located overlapping with the area.

[0046] Each pixel 33 includes at least a display element. The display element could be, for example, an organic EL (Earth-emitting diode). It is preferable to apply a light-emitting element such as an ectroluminescence element. Other display elements include electrophoresis, electronic powder fluid (registered trademark) and electro Display elements (also called electronic ink) that display information using methods such as wetting, shutters Various display elements such as MEMS display elements using the optical interference method, MEMS display elements using the optical interference method, and liquid crystal elements. The term "child" can be used.

[0047] Also, transmissive liquid crystal displays, semi-transmissive liquid crystal displays, reflective liquid crystal displays It can also be applied to direct-view liquid crystal displays, etc. Furthermore, it can be applied to semi-transmissive liquid crystal displays and reflective displays. When realizing a liquid crystal display, some or all of the pixel electrodes are used as reflective electrodes. The function should be such that it has the following properties. For example, some or all of the pixel electrodes are made of aluminum. It would be good to have silver or similar material. Furthermore, in that case, markings such as SRAM should be placed below the reflective electrode. It is also possible to implement a multi-circuit. This can further reduce power consumption. Furthermore, a suitable configuration for the display element to be applied can be selected from a variety of pixel circuits. ru.

[0048] Figure 2(B) shows a schematic diagram of the stacked structure in the region overlapping with the capacitive element 110. As shown in Figure 2(B), a first conductive layer is placed between the first substrate 21 and the second substrate 31. 111, insulating layer 112, second conductive layer 113, light-shielding layer 115, colored layer 114r, 114g , 114b, and pixel 33 are arranged.

[0049] In the following, the colored layers 114r, 114g, and 114b will not be distinguished. When explaining matters common to these, it is sometimes simply referred to as the colored layer 114. be.

[0050] An insulating layer 112 is sandwiched between the first conductive layer 111 and the second conductive layer 113, and these It constitutes a capacitive element 110.

[0051] Each colored layer 114 has the function of transmitting light in a specific wavelength band. Here, colored layer 114 r transmits red light, colored layer 114g transmits green light, and colored layer 114b transmits blue light. It allows light to pass through. By arranging pixel 33 and one of the colored layers 114 to overlap each other, the image It is possible to transmit only the light in a specific wavelength band from element 33 to the first substrate 21. Cut.

[0052] The light-shielding layer 115 has the function of blocking visible light. The light-shielding layer 115 is made of two adjacent layers It is positioned so as to overlap with the region between the color layers 114. In Figure 2(B), the light-shielding layer 115 is The shape has an opening, and the opening is arranged to overlap with the pixel 33 and the colored layer 114. This shows an example.

[0053] In Figure 2(B), the light-shielding layer 115 is positioned on the first substrate 21 side of the colored layer 114. Although the configuration is shown, even if the colored layer 114 is placed on the first substrate 21 side of the light-shielding layer 115 good.

[0054] The first conductive layer 111 and the insulating layer 112 overlap with the pixel 33 and the coloring layer 114, respectively. It has a region. Therefore, the first conductive layer 111 and the insulating layer 112 are, It is preferable to use a material that transmits visible light.

[0055] The second conductive layer 113 has a plurality of openings 118. This allows the first conductive layer 111 and The area in which the second conductive layer 113 and the other layer overlap can be reduced. Also shown in Figure 2(B) To that end, the aperture 118 of the second conductive layer 113 is positioned to overlap with the pixel 33. Preferably, the second conductive layer 113 is arranged to overlap with the light-shielding layer 115. It is preferable to do so. This allows light from the pixel 33 to pass through the second conductive layer 113. Because it is ejected towards the first substrate 21, the decrease in brightness is suppressed, resulting in a more visible touch This enables the creation of touch panels. Furthermore, the improved light extraction efficiency allows for low-power touch panels. It can be achieved.

[0056] Figures 3(A) to (C) show the second conductive layer 113 and shielding in the region overlapping with the display unit 32. Examples of the shapes of the light layer 115 are shown.

[0057] As shown in Figure 3(A), the upper surface shape of the opening 118 of the second conductive layer 113 and the light-shielding layer 115 They may be positioned so as to roughly coincide with the upper surface shape of the opening. Also, as shown in Figure 3(B) To that end, the second conductive layer 113 is positioned inside the light-shielding layer 115. Even if the size of the opening 118 of layer 113 is larger than the size of the opening of the light-shielding layer 115 Good. This way, the effect of relative positional misalignment of the second conductive layer 113 and the light-shielding layer 115 can be reduced. This can be reduced. Also, as shown in Figure 3(C), a light-shielding layer 1 is added to the second conductive layer 113. The size of the opening 118 is adjusted so that a portion does not overlap with 15, and the opening of the light-shielding layer 115 is adjusted accordingly. The shape may be smaller than the size. With this configuration, the second conductive layer 113 The width can be increased, improving conductivity. Also, the thickness of the second conductive layer 113 can be reduced. This is possible. If the second conductive layer 113 is thin, when viewed from the first substrate 21 side, the second The conductive layer 113 can be made less visible.

[0058] Furthermore, if the second conductive layer 113 is made of a material that transmits visible light, then the first substrate 21 side... This is preferable because it makes the display less visible, thus suppressing a decline in the quality of the display.

[0059] Furthermore, as shown in Figures 3(A) and (B), the second conductive layer 113 is hidden by the light-shielding layer 115. When arranged in this manner, the second conductive layer 113 does not block light from the pixel 33, In addition to conductive materials that are translucent, conductive materials that are light-shielding, such as metals and alloys, are used. It is acceptable. In particular, the wiring resistance can be reduced by using low-resistance conductive materials. Therefore, it is suitable for large touch panels.

[0060] Figure 4 shows a case where an optical adjustment layer 119 is placed between two adjacent first conductive layers 111. It indicates a match.

[0061] By providing the optical adjustment layer 119, the first conductive layer is formed when viewed from the first substrate 21 side. The 111 pattern becomes less visible, improving the display quality.

[0062] The optical adjustment layer 119 has optical properties (transmittance, refractive index, reflectivity) similar to those of the first conductive layer 111. Materials with transmittance (such as emissivity) can be used. For example, the transmittance of the first conductive layer 111 Materials with a ratio within plus or minus 5% can be used. In particular, the optical adjustment layer 119 It is preferable to use the same material as the first conductive layer 111. In this case, the same conductive film By processing the material, the first conductive layer 111 and the optical adjustment layer 119 are formed simultaneously. This is preferable because it allows these thicknesses to be made equal and simplifies the process.

[0063] When a conductive material is used as the optical adjustment layer 119, a predetermined electrical charge is applied to the optical adjustment layer 119. It is preferable to have a configuration that can supply potentials. For example, a common potential, ground potential, etc. The configuration should be such that a constant potential is supplied to the optical adjustment layer 119. Alternatively, the first conductive layer 111 The configuration may also involve electrically connecting to either the first or second conductive layer 113.

[0064] Figure 5(A) shows wiring 25, wiring 26, the first conductive layer 111, and the optical adjustment layer 119. Examples of each top surface shape are shown as viewed from the first substrate 21 side.

[0065] As shown in Figure 5(A), the same conductive film is applied to each of the wiring 25 and the multiple wirings 26. It is preferable to have a configuration that includes a conductive layer obtained by processing. In this case, the first substrate 21 It is preferable to use a conductive layer provided on the side. This way, wiring 25 or wiring 2 The distance in the thickness direction between 6 and the first conductive layer 111 can be increased. As a result, each wiring and the first This reduces the parasitic capacitance that occurs between the conductive layer 111 and the other components, thereby increasing the detection sensitivity. can.

[0066] Furthermore, at the intersection of wiring 25 and wiring 26, wiring 26 is opposite to the first substrate 21 of wiring 25. A conductive layer 117 is provided on the opposite side via an insulating layer, and through an opening provided in the insulating layer It intersects with the wiring 25. Also, at this time, the optical adjustment layer 119 and the region overlapping with the conductive layer 117 If the configuration does not include the first conductive layer 111, etc., the parasitic capacitance of the wiring 26 is reduced, and detection This is preferable because it can increase sensitivity.

[0067] Furthermore, Figure 5(B) shows a transistor 120 equipped with a semiconductor layer 121. An example configuration is shown. As shown in Figure 5(B), the first substrate 21 side is further from the semiconductor layer 121. It is preferable to place a light-shielding layer, such as a conductive layer that constitutes the wiring 26, etc. Furthermore, a portion of the wiring 26 can function as the gate electrode of the transistor. As a result, ambient light that has passed through the first substrate 21 does not irradiate the semiconductor layer 121, This suppresses fluctuations in the electrical characteristics of the zista, especially in the area that overlaps with the display unit 32. Therefore, because it is susceptible to the effects of ambient light, the transistor installed here has the following configuration. It is preferable to apply this.

[0068] [Example of cross-sectional configuration] The following describes an example of the cross-sectional configuration of the touch panel module 10.

[0069] [Cross-sectional configuration example 1] Figure 6(A) shows a schematic cross-sectional view of a touch panel module according to one embodiment of the present invention. The touch panel module shown in A) uses an active matrix touch panel between a pair of substrates. Because it has a sensor and a display element, it can be made thinner. In a touch sensor where each of the multiple sensor elements has an active element, an active matrix is ​​used. This is called a touch sensor using the S-type method.

[0070] The touch panel module is formed by bonding the first substrate 21 and the second substrate 31 with an adhesive layer 220. It has a structure in which the two substrates are bonded together. On the second substrate 31 side of the first substrate 21, there is a capacitive element 110 , transistor 251, transistor 252, contact part 253, colored layer 114, light shielding Layer 115 and the like are provided. Also, on the second substrate 31, transistor 201, A zista 202, a transistor 203, a light-emitting element 204, a contact section 205, etc. are provided. It is.

[0071] On the second substrate 31, there are insulating layers 212, 213, and 212 via an adhesive layer 211. 4. Insulating layer 215, insulating layer 216, insulating layer 217, insulating layer 218, spacer 219, conductive It has layers 225, etc.

[0072] A light-emitting element 204 is provided on the insulating layer 217. The light-emitting element 204 has a first electrode 2 21 has an EL layer 222 and a second electrode 223 (see Figure 6(B)). Also, the first electrode 2 An optical adjustment layer 224 is provided between 21 and the EL layer 222. The insulating layer 218 is It is provided covering the ends of the first electrode 221 and the optical adjustment layer 224.

[0073] In Figure 6(A), pixel 33 has a transistor 201 for current control and a switching control The diagram shows a configuration having transistor 202 for use. Transistor 201 is source or One end of the drain is electrically connected to the first electrode 221 via the conductive layer 225.

[0074] Figure 6(A) shows a configuration in which the transistor 203 is provided in circuit 34.

[0075] In Figure 6(A), the channel is shaped as transistors 201 and 203. This shows an example of applying a configuration in which the semiconductor layer to be formed is sandwiched between two gate electrodes. Such transistors can increase field-effect mobility compared to other transistors. This allows for an increase in on-current. As a result, it becomes possible to create circuits capable of high-speed operation. This is possible. Furthermore, it becomes possible to reduce the area occupied by the circuit section. By applying transistors, it is possible to enlarge or increase the resolution of display panels or touch panels. Even if the number of wires increases when the system is modified, it is possible to reduce the signal delay in each wire. Therefore, it is possible to suppress display inconsistencies.

[0076] Furthermore, the transistors in circuit 34 and the transistors in pixel 33 have the same structure. It may be present. Also, all transistors in circuit 34 may have the same structure. A combination of transistors with different structures may be used. Also, the transistors that pixel 33 has A transistor may have the same structure, or it may use a combination of transistors with different structures. This is also acceptable. In addition, a transistor (transistor 251, transistor) provided on the first substrate 21 side is also acceptable. In the case of the transistor 252, etc., the same structure may be used, or a different structure may be used. You may also use it in combination with other characters.

[0077] Figure 6(A) shows a case where a top-emission structure light-emitting element 204 is applied. An example is shown. The light-emitting element 204 emits light towards the second electrode 223. The light-emitting region of 04 is superimposed on the second substrate 31 side of it, and the transistor 201 is... In addition to the st202, the aperture ratio of the pixel 33 can be increased by arranging capacitive elements and wiring. It is possible.

[0078] On the side of the first substrate 21 facing the second substrate 31, there is an insulating layer 262 via an adhesive layer 261, and an insulating layer 263, insulating layer 264, insulating layer 265, first conductive layer 111, insulating layer 112, second conductive layer It has a layer 113, an insulating layer 266, a colored layer 114, a light-shielding layer 115, etc. Also, the colored layer 114 An overcoat 267 covering the light-shielding layer 115 may also be provided.

[0079] The first conductive layer 111 is electrically connected to either the source or the drain of the transistor 251. do.

[0080] The second conductive layer 113 is provided on the second substrate 31 side of the insulating layer 112. The conductive layer 113 has an opening 118. The second conductive layer 113 is provided in superimposed on the light-shielding layer 115. Furthermore, the opening 118 of the second conductive layer 113 is provided in overlap with the colored layer 114. ru.

[0081] The light-emitting region of the light-emitting element 204 and the colored layer 114 are arranged on top of each other, and the light-emitting element 204 The light emitted from the first substrate 21 passes through the colored layer 114 and is emitted towards the first substrate 21. The opening 118 of the conductive layer 113 is provided overlapping with the colored layer 114, and the emitted light is directed to the second conductive layer Since it is not necessary to transmit through 113, the decrease in brightness of the light emitted from the first substrate 21 side is suppressed. It can be controlled.

[0082] By using flexible materials for the first substrate 21 and the second substrate 31, It enables the creation of a simple touch panel.

[0083] Furthermore, one embodiment of the present invention uses a color filter method for the touch panel. For example, color Layer 114 is a three-color pixel to which one of R (red), G (green), or B (blue) is applied. It would also be good to use a composition that expresses a single color. In addition to this, the images of W (white) and Y (yellow) A configuration that applies basic elements is also acceptable.

[0084] The combination of the colored layer 114 and the microcavity structure formed by the optical adjustment layer 224 One aspect of the present invention allows for the extraction of light with high color purity from a touch panel. The thickness of the adjustment layer 224 can be different depending on the color of each pixel. The configuration may also be one that does not have an optical adjustment layer 224.

[0085] Furthermore, the EL layer 222 of the light-emitting element 204 is made of an EL layer that emits white light. This is preferable. By applying such a light-emitting element 204, an EL layer 222 is coated on each pixel. Since there is no need to separate them, costs can be reduced, and high resolution can be easily achieved. Also, each pixel By changing the thickness of the optical adjustment layer 224, the emission of light at a wavelength suitable for each pixel is achieved. It can be extracted, and the color purity can be improved. Furthermore, for each pixel, EL layer 222 It is also possible to use a configuration where the layers are painted separately, in which case the optical adjustment layer 224 and the colored layer 114 are not used. It can also be configured in a different way.

[0086] Each insulating layer etc. located in the region overlapping with the contact portion 205 provided on the second substrate 31 An opening is provided, and a connecting layer 260 is placed in the opening, connecting the contact portion 205 and F It is electrically connected to PC41. Also, each insulating material located in the area overlapping with the first board 21 An opening is provided in the edge layer, etc., and a contact portion 2 is connected via a connecting layer 210 placed in the opening. 53 and FPC42 are electrically connected.

[0087] In Figure 6(A), the contact portion 205 is connected to the source electrode and drain electrode of the transistor. This shows a configuration having a conductive layer formed by processing the same conductive film. Also, the contact part 253 is a conductive layer formed by processing the same conductive film as the gate electrode of a transistor. A conductive layer formed by processing the same conductive film as the source electrode and drain electrode of the inverter, and The structure has a laminated structure of conductive layers formed by processing the same conductive film as the second conductive layer 113. This demonstrates the ability to achieve this by constructing the contact portion with multiple conductive layers stacked together. This is preferable because it not only reduces electrical resistance but also increases mechanical strength.

[0088] The connecting layer 210 and the connecting layer 260 are made of anisotropic conductive film (ACF: Anisotr opic conductive film) and anisotropic conductive paste (ACP: Ani Sotropic Conductive Paste, etc., can be used.

[0089] The insulating layers 212 and 262 are made of materials that do not easily allow impurities such as water and hydrogen to diffuse. It is preferable that the insulating layer 212 and insulating layer 262 function as a barrier film. This configuration allows for the first substrate 21 and the second substrate 31 to be used as follows. Even if a moisture-permeable material is used, externally, the light-emitting element 204 and each transistor may be affected. It is possible to effectively suppress the diffusion of impurities, resulting in a highly reliable touch panel. This can be achieved.

[0090] [Regarding each component] The following sections will explain each of the components listed above.

[0091] A transistor consists of a conductive layer that functions as the gate electrode, a semiconductor layer, and a source electrode. A functional conductive layer, a conductive layer that functions as a drain electrode, and a gate insulating layer that functions as a gate insulating layer. It has an insulating layer. Figure 6(A) shows the case when a bottom gate structure transistor is applied. This indicates that.

[0092] The structure of the transistors in the touch panel according to one aspect of the present invention is not particularly limited. For example, it can be a staggered transistor or an inverse staggered transistor. Good. Furthermore, it can be either a top-gate or bottom-gate transistor structure. The semiconductor material used in transistors is not particularly limited; for example, oxide semiconductors, silicon Examples include cellulose and germanium.

[0093] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor (having a region) may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0094] Furthermore, semiconductor materials used in transistors include, for example, elements from Group 4 and compound semiconductors. Alternatively, an oxide semiconductor can be used as the semiconductor layer. Typically, a silicon-containing semiconductor is used. Semiconductors containing gallium arsenide or oxide semiconductors containing indium can be applied.

[0095] In particular, applying oxide semiconductors to the semiconductors in which transistor channels are formed is It is preferable. In particular, it is preferable to use oxide semiconductors with a larger band gap than silicon. It seems so. A semiconductor material with a wider band gap and lower carrier density than silicon. Using this method is preferable because it reduces the current when the transistor is off.

[0096] For example, the above oxide semiconductor may contain at least indium (In) or zinc (Zn). Preferably contains ). More preferably In-M-Zn oxide (where M is Al, Ti, Contains oxides represented by metals such as Ga, Ge, Y, Zr, Sn, La, Ce, or Hf. nothing.

[0097] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. Alternatively, grains are observed that are oriented approximately perpendicular to the upper surface of the semiconductor layer, and grain boundaries are observed between adjacent crystalline regions. It is preferable to use an oxide semiconductor film that is not treated.

[0098] Such oxide semiconductors do not have grain boundaries, so when the display panel is curved... This suppresses the formation of cracks in the oxide semiconductor film due to stress. Therefore, Such oxide semiconductors are suitable for applications that are flexible and can be bent, such as touch panels. It can be used.

[0099] Furthermore, by using such an oxide semiconductor as the semiconductor layer, fluctuations in electrical properties are suppressed. This makes it possible to create highly reliable transistors.

[0100] Furthermore, its low off-current allows the charge stored in the capacitor via the transistor to be released over a long period of time. It is possible to hold it over time. By applying such transistors to pixels, each It also becomes possible to stop the drive circuit while maintaining the gradation of the image displayed in the display area. As a result, a display device with extremely reduced power consumption can be realized.

[0101] Alternatively, silicon is preferred as the semiconductor in which the transistor channel is formed. It is fine. Amorphous silicon may be used as silicon, but crystalline silicon is particularly desirable. It is preferable to use silicon. For example, microcrystalline silicon, polycrystalline silicon, single-crystal silicon It is preferable to use materials such as n. In particular, polycrystalline silicon is suitable for lower temperatures compared to single-crystal silicon. It can be formed using [a specific method] and possesses higher field-effect mobility and higher reliability compared to amorphous silicon. By applying such polycrystalline semiconductors to pixels, the aperture ratio of the pixels can be improved. It is possible. Furthermore, even when the pixels have extremely high resolution, the gate drive circuit and source drive circuit This makes it possible to form the paths on the same substrate as the pixels, reducing the number of components that make up electronic devices. It is possible.

[0102] In addition to the gate, source, and drain of transistors, various components that make up a touch panel are also included. Materials that can be used for conductive layers such as wires and electrodes include aluminum, titanium, Chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and This involves using metals such as tungsten, or alloys with tungsten as the main component, in a single-layer or layered structure. It is used as follows: For example, a single-layer structure of an aluminum film containing silicon, or an aluminum film on a titanium film. A two-layer structure with stacked aluminum films, a two-layer structure with stacked aluminum films on a tungsten film, copper - A two-layer structure in which a copper film is laminated on a magnesium-aluminum alloy film, and a copper film on a titanium film. Laminated two-layer structure, two-layer structure with copper film laminated on tungsten film, titanium film or nitride A tan film is layered with an aluminum film or copper film on top of the titanium film or titanium nitride film. Furthermore, a three-layer structure is formed by forming a titanium film or titanium nitride film on top of that, or a molybdenum film or This consists of a molybdenum nitride film and aluminum layered on top of the molybdenum film or molybdenum nitride film. A molybdenum film or copper film is laminated, and then a molybdenum film or molybdenum nitride film is formed on top of it. There are three-layer structures, etc. Furthermore, transparent conductive materials containing indium oxide, tin oxide, or zinc oxide. You may also use [this]. Furthermore, if you use copper containing manganese, the controllability of the shape by etching is [improved]. This is desirable because it increases.

[0103] Furthermore, examples of conductive materials that are translucent include indium oxide, indium tin oxide, and Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium or Graphene can be used. Alternatively, gold, silver, platinum, magnesium, nickel, and Examples include sten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium. Metal materials or alloy materials containing such metal materials can be used. Alternatively, the nitrogen of the metal material can be used. Metallic compounds (e.g., titanium nitride) may also be used. When using these nitrides, they should be thinned to a degree that allows light to pass through. A laminated film of materials can be used as a conductive layer. For example, an alloy of silver and magnesium and an ink Using a multilayer film of tungsten oxide is preferable because it can improve conductivity.

[0104] Insulating materials that can be used for each insulating layer, overcoat 267, spacer 219, etc. For example, resins such as acrylic and epoxy, resins having siloxane bonds, and acids Silicon oxide, silicon nitride, silicon nitride, silicon nitride, aluminum oxide Any inorganic insulating material can be used.

[0105] Furthermore, as mentioned above, the light-emitting element is provided between a pair of insulating films with low water permeability. This is preferable. This prevents impurities such as water from entering the light-emitting device, and the light-emitting device This can suppress the decline in reliability.

[0106] Examples of insulating films with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Silicon oxide films, silicon oxide nitride films, aluminum oxide films, etc., may also be used.

[0107] For example, the amount of water vapor transmitted through a low-permeability insulating film is 1 × 10⁻⁶ -5 [g / (m 2 ·day) ] Preferably 1 × 10 -6 [g / (m 2 ·day)] Below, more preferably 1×1 0 -7 [g / (m 2 (day) More preferably 1 x 10 -8 [g / (m 2 ·d (ay) and below.

[0108] Each adhesive layer can be made of a curable resin such as a thermosetting resin, a photocuring resin, or a two-component curable resin. Fats can be used. For example, acrylic, urethane, epoxy, or siloxane bonds. Resins such as resins having a specific property can be used.

[0109] The EL layer 222 has at least an emissive layer. The EL layer 222 has layers other than the emissive layer, Materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential Substances with high electron injection properties, or bipolar substances (substances with high electron transport and hole transport properties) It may further have a layer containing substances such as [material name].

[0110] The EL layer 222 can use either low-molecular-weight compounds or high-molecular-weight compounds. It may contain chemical compounds. The layers constituting the EL layer 222 are each deposited by a vapor deposition method (vacuum vapor deposition). It can be formed by methods such as (including adhesive application), transfer, printing, inkjet, and coating. Cut.

[0111] Materials that can be used for the light-shielding layer 115 include carbon black, metal oxides, and composite materials. Examples include composite oxides containing solid solutions of several metal oxides.

[0112] Materials that can be used for the colored layer 114 include metal materials, resin materials, pigments, or dyes. Examples include resin materials containing [the specified substance].

[0113] [Example of manufacturing method] Here, we will explain a method for manufacturing a flexible touch panel.

[0114] For convenience, here we will refer to configurations including pixels and circuits, configurations including optical components such as color filters, and The configuration including the touch sensor will be referred to as the element layer. The element layer includes, for example, a display element. In addition to the display elements, there are also the wiring that electrically connects to the display elements, and transistors used in pixels and circuits. It may also be equipped with such elements.

[0115] Furthermore, here, a support having an insulating surface on which the element layer is formed (for example, the first substrate 21) Alternatively, the second substrate 31) will be referred to as the base material.

[0116] A method for forming an element layer on a substrate having a flexible insulating surface is to directly place the element layer on the substrate. Methods for forming a contact element layer, and after forming an element layer on a rigid support substrate, the element layer and support There are two methods: one involves peeling the element layer off the substrate and transferring it to the substrate.

[0117] If the material constituting the base material has heat resistance to the heat generated during the device layer formation process, Forming the element layer directly on the substrate is preferable because it simplifies the process. When the element layer is formed with the element fixed to the support substrate, transport within and between devices becomes easier. It is preferable because it makes things easier.

[0118] Furthermore, when using a method in which the element layer is formed on a support substrate and then transferred to the substrate, first the support A release layer and an insulating layer are laminated onto a support base, and an element layer is formed on the insulating layer. Subsequently, a support base The material and element layer are separated and transferred to the substrate. At this time, the interface between the support substrate and the peeled layer, and the peeled layer and the insulating layer You should select a material that will cause delamination at the interface of the marginal layer or within the delamination layer.

[0119] For example, a layer containing a high-melting-point metal material such as tungsten as a release layer, and oxidation of the said metal material Layers containing materials are stacked, and multiple layers of silicon nitride or silicon oxynitride are stacked on top of the release layer. It is preferable to use a high melting point metal material. Using a high melting point metal material increases the degree of freedom in the device layer formation process. Therefore, it is preferable.

[0120] The peeling may be performed by applying mechanical force, etching the peeling layer, or dropping a liquid onto a part of the peeling interface to penetrate the entire peeling interface. Or, the peeling may be performed by applying heat to the peeling interface using the difference in thermal expansion. Alternatively, when peeling is possible at the interface between the support substrate and the insulating layer, the peeling layer may not be provided. For example, when using glass as the support substrate and an organic resin such as polyimide as the insulating layer, a starting point for peeling may be formed by locally heating a part of the organic resin using a laser beam or the like, and peeling may be performed at the interface between the glass and the insulating layer. Or, a metal layer may be provided between the support substrate and the insulating layer made of an organic resin, and the metal layer may be heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the insulating layer. At this time, the insulating layer made of an organic resin can be used as a substrate.

[0121] When peeling is possible at the interface between the support substrate and the insulating layer, the peeling layer may not be provided. For example, when using glass as the support substrate and an organic resin such as polyimide as the insulating layer, a starting point for peeling may be formed by locally heating a part of the organic resin using a laser beam or the like, and peeling may be performed at the interface between the glass and the insulating layer. Or, a metal layer may be provided between the support substrate and the insulating layer made of an organic resin, and the metal layer may be heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the insulating layer. At this time, the insulating layer made of an organic resin can be used as a substrate. When peeling is possible at the interface between the support substrate and the insulating layer, the peeling layer may not be provided. For example, when using glass as the support substrate and an organic resin such as polyimide as the insulating layer,

[0122] Examples of the flexible substrate include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, etc. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 30×10 / K or less can be preferably used. Also, a substrate impregnated with a resin in a fibrous body (also referred to as a prepreg), or an inorganic filler mixed in an organic resin Examples of the flexible substrate include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, etc. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 30×10 / K or less can be preferably used. Also, a substrate impregnated with a resin in a fibrous body (also referred to as a prepreg), or an inorganic filler mixed in an organic resin Examples of the flexible substrate include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, etc. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 30×10 / K or less can be preferably used. Also, a substrate impregnated with a resin in a fibrous body (also referred to as a prepreg), or an inorganic filler mixed in an organic resin -6 / K or less can be preferably used. Also, a substrate impregnated with a resin in a fibrous body (also referred to as a prepreg), or an inorganic filler mixed in an organic resin Examples of the flexible substrate include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, etc. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 30×10 Examples of the flexible substrate include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, etc. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 30×10 It is also possible to use a substrate with a reduced coefficient of thermal expansion.

[0123] If the above material contains fibrous material, the fibrous material is a high strength organic or inorganic compound. High-strength fibers are used. Specifically, high-strength fibers are fibers with a high tensile modulus or Young's modulus. This refers to polyvinyl alcohol-based fibers, polyester fibers, and poly- Aramid fibers, polyethylene fibers, aramid fibers, poly(p-phenylenebenzobisoxide) Examples include sazole fibers, glass fibers, or carbon fibers. Examples of glass fibers include E-glass. Examples include glass fibers using S glass, D glass, Q glass, etc. These are woven fabrics. Alternatively, it can be used in the form of a nonwoven fabric, and a structure made by impregnating this fiber with resin and hardening the resin is made flexible. It may also be used as a substrate having flexibility. As a substrate having flexibility, it may be made of fibers and resin. Using structures improves reliability against damage caused by bending and localized compression, therefore it is preferable. stomach.

[0124] Alternatively, a thin glass, metal, or other material that is flexible can be used as the base material. Alternatively, a composite material in which glass and resin materials are bonded together may be used.

[0125] For example, in the configuration shown in Figure 6(A), a first release layer and an insulating layer 26 are placed on the first support substrate. After forming 2 in order, a structure above it is formed. Separately from this, the second After forming the second release layer and the insulating layer 212 in order on the support substrate, the structure above that This is formed. Next, the first support substrate and the second support substrate are bonded together with the adhesive layer 220. Subsequently, the second support substrate and the second release layer are separated at the interface between the second release layer and the insulating layer 212. Remove the release layer of 2, and bond the insulating layer 212 and the second substrate 31 with the adhesive layer 211. . Also, by peeling at the interface between the first release layer and the insulating layer 262, the first support substrate and the first release layer are removed, and the insulating layer 262 and the first substrate 21 are bonded with the adhesive layer 261. Note that either side can be peeled and bonded first.

[0126] The above is an explanation of a method for manufacturing a flexible touch panel.

[0127] 〔Cross-sectional configuration example 2〕 Fig. 7 shows a cross-sectional configuration example in which a part of the configuration is different from that in Fig. 6. The configuration shown in Fig. 7 is mainly different in that the configuration of the first conductive layer 111 is different compared to the configuration shown in Fig. 6.

[0128] In Fig. 7, instead of the first conductive layer 111 in Fig. 6, a case where a first conductive layer 111a having a semiconductor layer formed by processing a film the same as the semiconductor layers of the transistor 251 and the transistor 252 is applied is shown. Also, the first conductive layer 111a is provided in contact with the insulating layer 265.

[0129] Here, the first conductive layer 111a preferably contains an oxide semiconductor. The oxide semiconductor is a semiconductor material that can control the resistance depending on the oxygen deficiency or / and the concentration of impurities such as hydrogen and water in the film. Therefore, even when the semiconductor layer applied to the first conductive layer 111a and the semiconductor layer applied to the transistor are formed by processing the same semiconductor film, by selecting and performing a process of increasing the oxygen deficiency or / and the impurity concentration, or a process of reducing the oxygen deficiency or / and the impurity concentration for each of these semiconductor layers, the resistivity of these semiconductor layers can be controlled. ​​​​​​​​​​

[0130] Specifically, the acid contained in the first conductive layer 111a that functions as an electrode for the capacitive element 110 Plasma treatment is performed on the oxide semiconductor layer to increase oxygen vacancies in the oxide semiconductor layer. / and by increasing impurities such as hydrogen and water in the oxide semiconductor layer, the carrier density A first conductive layer 111a containing an oxide semiconductor with high resistance and low resistance can be formed. A hydrogen-containing insulating film (insulating layer 265) is formed in contact with a hydrogen-containing semiconductor layer, and the hydrogen-containing insulating film is formed in contact with the semiconductor layer. By diffusing hydrogen from the oxide semiconductor layer, a high carrier density and low resistance acid can be produced. An oxide semiconductor layer can be formed. It can be applied.

[0131] On the other hand, an oxide semiconductor layer is provided on transistors 251 and 252. An insulating layer 264 is provided to prevent exposure to the treatment. Therefore, the oxide semiconductor layer can be configured not to come into contact with the hydrogen-containing insulating layer 265. By using an insulating film that can release oxygen as the insulating layer 264, the transistor Oxygen can be supplied to the oxide semiconductor layer. The oxide semiconductor layer to which oxygen has been supplied is Oxygen vacancies in the film or at the film interface are reduced, resulting in a high-resistance oxide semiconductor layer. Examples of insulating films capable of releasing oxygen include silicon oxide films and silicon oxide-nitride films. These can be used.

[0132] Furthermore, typical plasma treatments performed on oxide semiconductor layers include those using noble gases (He, Ne). A gas containing one selected from Ar, Kr, Xe, phosphorus, boron, hydrogen, and nitrogen. Plasma processing using [a specific method] is one example. More specifically, plasma processing in an Ar atmosphere, Plasma treatment under a mixed gas atmosphere of Ar and hydrogen, plasma treatment under an ammonia atmosphere Plasma treatment under a mixed gas atmosphere of Ar and ammonia, or plasma treatment under a nitrogen atmosphere Examples include processing and other treatments.

[0133] As a result of the plasma treatment described above, the oxide semiconductor layer has a lattice from which oxygen has been removed (or oxygen has been removed An oxygen deficiency is formed in the separated portion. This oxygen deficiency becomes a factor in the generation of carriers. In some cases, this can occur. Also, in the vicinity of the oxide semiconductor layer, more specifically, on the underside of the oxide semiconductor layer. Alternatively, hydrogen is supplied from the insulating layer film in contact with the upper side, and when hydrogen enters the oxygen vacancy, carrier In some cases, electrons are generated. Therefore, plasma treatment increases oxygen deficiency. The oxide semiconductor layer applied to the first conductive layer 111a is an oxide semiconductor layer applied to the transistor. It has a higher carrier density than a physical semiconductor layer.

[0134] On the other hand, oxide semiconductors applied to transistors with reduced oxygen deficiency and reduced hydrogen concentration The body layer can be described as a highly purified or substantially highly purified oxide semiconductor layer. In essence, trueness means that the carrier density of the oxide semiconductor is 1 × 10⁻⁶ 17 / cm 3 Less than Preferably 1 × 10 15 / cm 3 It is less than 1 × 10⁻¹⁰. 1 3 / cm 3 This refers to being less than a certain value. Alternatively, it refers to having a low impurity concentration and a low defect level density (acid High-purity genuine or substantially high-purity genuine refers to a product with few elemental defects. An oxide semiconductor that is highly pure and intrinsic has few carrier generation sources, so the carrier density can be lowered. Therefore, a transistor in which a channel region is formed in the oxide semiconductor film is likely to have electrical characteristics in which the threshold voltage is positive (also referred to as normally-off characteristics). Also, an oxide semiconductor layer that is highly pure and intrinsic or substantially highly pure and intrinsic has a low density of defect levels, so the trap level density can be reduced.

[0135] Also, an oxide semiconductor layer that is highly pure and intrinsic or substantially highly pure and intrinsic has an extremely small off-current, and even in an element with a channel width of 1×10 μm and a channel length L of 10 μm, the off-current is below the measurement limit of a semiconductor parameter analyzer, that is, 1×10 6 A or less when the voltage between the source electrode and the drain electrode (drain voltage) is in the range of 1 V to 10 V. -13 That is, such characteristics can be obtained. Therefore, transistors 251, 252, etc. in which a channel region is formed in the oxide semiconductor layer have small fluctuations in electrical characteristics and are highly reliable transistors. Note that it is preferable to apply a similar oxide semiconductor layer to transistors 201, 202, 203, etc. provided on the second substrate 31 side.

[0136] Also, in FIG. 7, the insulating layer 264 is provided such that a region overlapping with the first conductive layer 111a that functions as an electrode of the capacitive element 110 is selectively removed. Also, the insulating layer 2 65 may be removed from above the first conductive layer 111a after being formed in contact with the first conductive layer 111a. As the insulating layer 265, for example, an insulating film containing hydrogen, that is, a film that releases hydrogen An insulating film that can perform this function, typically a silicon nitride film, is used to create the first conductive layer 11 Hydrogen can be supplied to 1a. An insulating film capable of releasing hydrogen contains Hydrogen concentration is 1 × 10 22 atoms / cm 3 It is preferable that such an insulating film is By forming it in contact with the first conductive layer 111a, hydrogen can be effectively supplied to the first conductive layer 111a. It can be included. In this way, in combination with the plasma treatment described above, oxide semiconductor The resistance of the oxide semiconductor layer can be arbitrarily adjusted by changing the configuration of the insulating film in contact with the layer. This is possible. Furthermore, a layer containing an oxide semiconductor with sufficiently low resistance is called an oxide conductive layer. It can also be changed.

[0137] The hydrogen contained in the first conductive layer 111a reacts with oxygen bonded to metal atoms to form water. At the same time, oxygen vacancies are formed in the lattice (or the parts where oxygen has been removed) from which oxygen has been removed. When hydrogen enters an oxygen vacancy, it can generate electrons, which act as carriers. When a portion of it combines with oxygen that bonds with metal atoms, it generates electrons, which are carriers. Therefore, the oxide semiconductor contained in the first conductive layer 111a which contains hydrogen. It has a higher carrier density than oxide semiconductors used in transistors.

[0138] The oxide semiconductor layer in which the transistor channel region is formed has hydrogen reduced as much as possible. It is preferable that the oxide semiconductor layer is subjected to secondary ion mass spectrometry. SIMS (Secondary Ion Mass Spectrometry) The hydrogen concentration obtained is 2 × 10 20 atoms / cm 3 The following is preferably 5 × 1019 a toms / cm 3 More preferably 1 × 10 19 atoms / cm 3 Below, 5 x 10 18 atoms / cm 3 Less than 1 × 10 18 atoms / cm 3 The following are better Mashikuha 5 x 10 17 atoms / cm 3 More preferably 1 × 10 16 Atom s / cm 3 The following applies:

[0139] On the other hand, the oxide semiconductor contained in the first conductive layer 111a that functions as an electrode for the capacitive element 110 The conductor has a higher hydrogen concentration and / or oxygen concentration than the oxide semiconductor used in the transistor described above. It has many defects and low resistance.

[0140] The first conductive layer 111a and the oxide semiconductor layer applied to the transistor are typically, n-Ga oxide, In-Zn oxide, In-M-Zn oxide (where M is Mg, Al, Ti) It is formed from metal oxides such as Ga, Y, Zr, La, Ce, Nd, or Hf. The conductive layer 111a and the oxide semiconductor layer applied to the transistor are translucent.

[0141] Furthermore, the first conductive layer 111a and the oxide semiconductor layer applied to the transistor are In-M- In the case of Zn oxide, when the sum of In and M is taken as 100 atomic%, In is 25 at 0mic% or more, M is less than 75 atomic%, or In is 34 atomic% or more, M This is defined as less than 66 atomic%.

[0142] The first conductive layer 111a and the oxide semiconductor layer applied to the transistor are energy gas It is preferable that the peak voltage is 2 eV or higher, or 2.5 eV or higher, or 3 eV or higher.

[0143] The thickness of the first conductive layer 111a and the oxide semiconductor layer applied to the transistor is 3 nm or less. The wavelength must be 200 nm or less, or 3 nm to 100 nm, or 3 nm to 60 nm. It is possible.

[0144] The first conductive layer 111a and the oxide semiconductor layer applied to the transistor are made of In-M-Zn acid In the case of oxides, the sputtering target used to deposit In-M-Zn oxide is The atomic ratio of the metal elements preferably satisfies In≧M and Zn≧M. As for the atomic ratio of metal elements in the taring target, In:M:Zn = 1:1:1, In: M:Zn=1:1:1.2, In:M:Zn=2:1:1.5, In:M:Zn=2:1 :2.3, In:M:Zn=2:1:3, In:M:Zn=3:1:2, etc. are preferred. Oh, the atoms of the first conductive layer 111a that is formed and the oxide semiconductor layer applied to the transistor. Each numerical ratio represents the error of the atoms of the metal elements contained in the sputtering target mentioned above. This includes a variation of plus or minus 40% in numerical ratios.

[0145] Furthermore, when hydrogen is added to an oxide semiconductor in which oxygen vacancies have formed, hydrogen is added to the oxygen vacancy sites. As a result, donor levels are formed near the conduction band. It becomes conductive. An oxide semiconductor that has been made conductive can be called an oxide conductor. Generally, oxide semiconductors have a large energy gap and therefore are transparent to visible light. On the other hand, oxide conductors are oxide semiconductors that have donor levels near the conduction band. Therefore, the effect of absorption by the donor level is small, and is similar to that of oxide semiconductors for visible light. It has a degree of light transmittance. Oxide conductors are degenerate semiconductors, and the conduction band edge and the Fermi level are It can also be said that they are identical or nearly identical. For this reason, oxide conductive films are used as capacitive elements. It can be used as an electrode, etc.

[0146] By using the configuration shown in Figure 7, the first conductive layer 111a can be fabricated simultaneously during the transistor manufacturing process. Because it can be formed in this way, the process can be simplified. Also, in Figure 6, Since a photomask is not required when forming the conductive layer 111, manufacturing costs are reduced. It is also possible to do so.

[0147] [Cross-sectional configuration example 3] Figure 8 shows an example of a cross-sectional configuration that differs in some aspects from those in Figures 6 and 7. The configuration shown in Figure 8 is: Compared to the configuration shown in Figure 6, this configuration does not have a transistor provided on the first substrate 21 side. The main difference lies in the following points. That is, the cross-sectional configuration shown in Figure 8 is a passive matrix type. It can be applied to the panel.

[0148] In this case, the first conductive layer 111 can have a strip-like shape extending in one direction. Furthermore, the second conductive layer 113 has a strip-like shape that extends in a direction intersecting with the first conductive layer 111. This can be done by having multiple such first conductive layers 111 and second conductive layers 113. By arranging them side by side, a passive matrix type touch panel can be realized.

[0149] Figure 8 shows the contact portion 271 between the first conductive layer 111 and the wiring 273, and the second conductive layer The first conductive layer 111 and the wiring 274 are shown. The wire 273 is electrically connected through an opening provided in the insulating layer 264. The electrical layer 113 and the wiring 274 are separated by openings provided in the insulating layer 264 and the insulating layer 112. Connect electrically.

[0150] The above is an explanation of the cross-sectional configuration examples.

[0151] In this embodiment, the first substrate supports the touch sensor and the display element supports The second circuit board has been shown as having two circuit boards, but it is not limited to this. For example, the display element It is sandwiched between two substrates, and a first substrate supporting the touch sensor is attached to it, making a total of three substrates. Alternatively, the display element and the touch sensor may be sandwiched between two substrates. The resulting components can be bonded together to form a configuration with four substrates.

[0152] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0153] (Embodiment 2) This embodiment provides an example of the configuration of a touch sensor according to one aspect of the present invention, and an example of its driving method. Then, I will explain by referring to the drawings.

[0154] [Example Configuration] Figure 9(A) shows the configuration of a touch panel (also called an input / output device) according to one aspect of the present invention. This is an explanatory block diagram. Figure 9(B) is a circuit diagram illustrating the configuration of the converter CONV. Figure 9(C) is a circuit diagram illustrating the configuration of the sensor element 22. Also see Figure 9(D-1) and Figure 9(D-2) is a timing chart illustrating the driving method of the sensor element 22.

[0155] The touch sensor illustrated in this embodiment consists of multiple sensor elements arranged in a matrix. 22 and a signal line DL to which multiple sensor elements 22 arranged in the row direction are electrically connected, A flexible first substrate 21 on which the sensor element 22, scan line G1, and signal line DL are arranged. It has (see Figure 9(A)).

[0156] For example, multiple sensor elements 22 are arranged in an n-row, m-column (where n and m are natural numbers greater than or equal to 1) They can be arranged in a trix pattern.

[0157] Furthermore, the sensor element 22 includes a capacitive element C that functions as a detection element. This corresponds to the capacitive element 110 in the first embodiment of the implementation. For example, the first electrode of the capacitive element C is implemented In form 1, the first conductive layer 111 corresponds to the first conductive layer 113, and the second electrode corresponds to the second conductive layer 113. do.

[0158] The second electrode of the capacitive element C is electrically connected to the wiring CS. The potential of the second electrode of C can be controlled using the control signal supplied by the wiring CS.

[0159] A sensor element 22 according to one aspect of the present invention has at least a transistor M1. The configuration may also include transistor M2 and / or transistor M3 (see Figure 9(C)). ).

[0160] Transistor M1 has its gate electrically connected to the first electrode of a capacitive element C, and the first electrode The pole is electrically connected to the wiring VPI. The wiring VPI, for example, supplies the ground potential. It has a function.

[0161] Transistor M2 has its gate electrically connected to the scan line G1, and the first electrode is transistor The second electrode of sta M1 is electrically connected, and the second electrode is electrically connected to the signal line DL. The scan line G1 has the function of supplying, for example, a selection signal. The signal line DL is, for example, For example, it has the function of supplying detection signal data.

[0162] Transistor M3 has its gate electrically connected to wiring RES, and the first electrode is a capacitive element. The first electrode of C is electrically connected, and the second electrode is electrically connected to the wiring VRES. Wiring RES has the function of supplying, for example, a reset signal. Wiring VRES has the function of supplying, for example It has the function of supplying a potential that can make transistor M1 conduct.

[0163] The capacitance value of the capacitive element C is determined, for example, when an object is in close proximity to the first electrode or the second electrode. Alternatively, it changes due to a change in the distance between the first electrode and the second electrode. The sensor element 22 can supply a detection signal DATA based on the change in capacitance of the capacitive element C. can.

[0164] Furthermore, the wiring CS electrically connected to the second electrode of the capacitive element C is the second electrode of the capacitive element C It has the function of supplying a control signal to control the potential of the electrodes.

[0165] Furthermore, the first electrode of the capacitive element C, the gate of transistor M1, and the third electrode of transistor M3 A node formed by the electrical connection of electrodes 1 is called node A.

[0166] Figure 10(A) shows two sensor elements 22 arranged in the row direction and two in the column direction. An example of a circuit diagram for this case is shown.

[0167] Furthermore, Figure 10(B) shows the first conductive layer 111 (on the first electrode) of the sensor element 22. This shows an example of the positional relationship between the equivalent and each wiring. The first conductive layer 111 is a transistor The gate of M1 and the second electrode of transistor M3 are electrically connected. The first conductive layer 111 is arranged so as to overlap with the plurality of pixels 33 shown in Figure 10(C). Furthermore, as shown in Figure 10(B), transistors M1 to M3 are connected to the first conductive layer 11. It is preferable to place it in an area that does not overlap with 1.

[0168] Furthermore, as shown in Figures 11(A) to (C), the sensor element 22 has a transistor M2. A configuration that does not include this is also acceptable. In this case, among the sensor elements 22 arranged in multiple rows, The second electrode of each capacitive element C is electrically connected to the scan line G1 instead of the wiring CS. That's all you need to do.

[0169] The wiring VPO and wiring BR shown in Figure 9(B) are, for example, used to make the transistor conductive. It has the function of supplying a high power potential sufficient to enable this. Furthermore, the signal line DL is for the detection signal DAT. It has the function of supplying A. Terminal OUT is a signal converted based on the detection signal DATA. It has the function of supplying.

[0170] The converter CONV is equipped with a conversion circuit. It converts the detection signal DATA and supplies it to terminal OUT. Various circuits that can perform this function can be used in the converter CONV. For example, converter C By electrically connecting ONV to sensor element 22, a source follower circuit or karry A circuit that functions as a mirror circuit may also be applied.

[0171] Specifically, a converter CONV using transistor M4 is used in a source follower circuit. This can be constructed (see Figure 9(B)). Note that it is manufactured using the same process as transistors M1 to M3. A transistor capable of performing this operation may be used for transistor M4.

[0172] For example, the configuration of transistor 251 or transistor 252 as illustrated in Embodiment 1 This can be applied to each of transistors M1 through M4.

[0173] Note that the configuration of the converter CONV is not limited to the configuration shown in Figure 9(B). Figure 12 shows the converter. This shows different configuration examples for CONV.

[0174] The converter CONV shown in Figure 12(A) has transistor M5 in addition to transistor M4. It has. Specifically, transistor M5 has a gate that is electrically connected to the signal line DL, and the first The first electrode is electrically connected to terminal OUT, and the second electrode is electrically connected to wiring GND. GND has the function of supplying, for example, the ground potential. Also, as shown in Figure 12(B), Even if transistors M4 and M5 each have a second gate, Good. In this case, it is preferable that the second gate be configured to be electrically connected to the gate. .

[0175] Furthermore, the converter CONV shown in Figure 12(C) consists of transistors M4, M5 and It has a resistor R. Specifically, the gate of transistor M4 is electrically connected to the wiring BR1. Transistor M5 has its gate electrically connected to wiring BR2, and the first electrode is connected to terminal OU. T is electrically connected to the second electrode of resistor R, and the second electrode is electrically connected to the wiring GND. The resistor R has its first electrode electrically connected to the wiring VDD. Wiring BR1 and wiring BR2 is a high power supply potential, for example, high enough to make each transistor conduct. It has the function of supplying a high power potential. Wiring VDD has the function of supplying a high power potential, for example.

[0176] Figures 13(A) and (B) show the first electrode, the signal line DL, and the converter CONV, respectively. This is a schematic diagram showing an example of the positional relationship of 1 on substrate 21.

[0177] As shown in Figure 13(A), the converter CONV is arranged in the direction of extension of each signal line DL. When placed in this configuration, the lengths of the signal lines DL electrically connected to each converter CONV become approximately equal. This is possible. For example, if the electrical resistance of the signal line DL significantly affects the detection sensitivity, It is preferable to arrange them in the manner shown above.

[0178] Furthermore, in Figure 13(B), by varying the length and shape of each signal line DL, multiple The converter CONV is placed in close proximity. By using this arrangement, converter C If the position dependence of the transistor's electrical characteristics is large, the ONV should be placed close together. By arranging them in this way, variations in the electrical characteristics of the converter CONV are reduced, improving detection sensitivity. It is possible.

[0179] [Example of driving method] Next, the method for driving the sensor element 22 will be explained with reference to Figure 9.

[0180] [Step 1] In the first step, transistor M3 is made conductive and then deconducted. The set signal is supplied to the gate of transistor M3, and the potential of the first electrode of capacitive element C is The potential of node A is set to the predetermined potential (see Figure 9(D-1), period T1).

[0181] Specifically, the reset signal is supplied to the RES wiring. The transistor M3 can change the potential of node A to, for example, make transistor M1 conduct. Let's convert it to an electric potential.

[0182] [Step 2] In the second step, a selection signal is sent to the transistor to make transistor M2 conduct. This supplies power to the gate of M2, electrically connecting the second electrode of transistor M1 to the signal line DL. (See Figure 9(D-1), period T2).

[0183] Specifically, a selection signal is supplied to scan line G1. Transistor M to which the selection signal is supplied. 2 electrically connects the second electrode of transistor M1 to the signal line DL.

[0184] [Step 3] In the third step, the control signal is supplied to the second electrode of the capacitive element C, and the control signal and A potential that changes based on the capacitance of the capacitive element C is supplied to the gate of transistor M1.

[0185] Specifically, a rectangular control signal is supplied to the wiring CS. The rectangular control signal is then applied to the first part of the capacitive element C. When supplied to electrode 2, the potential of node A changes based on the capacitance of capacitive element C (Figure 9). See D-1) and the latter half of period T2).

[0186] For example, if a capacitive element C is placed in the atmosphere, then a material with a higher dielectric constant than the atmosphere will have a capacitance. When placed in close proximity to the second electrode of element C, the capacitance of capacitive element C appears to increase. .

[0187] As a result, the change in potential at node A caused by the rectangular control signal is greater than that of air due to its higher dielectric constant. The size becomes smaller compared to when objects are not placed in close proximity (see Figure 9(D-2), solid line). ).

[0188] Alternatively, the distance between the first and second electrodes of the capacitive element C changes as the touch panel deforms. When this occurs, the capacitance of the capacitive element C changes. This causes a change in the potential of node A. .

[0189] [Step 4] In the fourth step, the signal resulting from the change in the gate potential of transistor M1 is transmitted. It supplies power to the DL on line number 1.

[0190] For example, the change in current caused by a change in the gate potential of transistor M1 can be transmitted to the signal line DL. To supply.

[0191] The converter CONV converts, for example, a change in current flowing through a signal line DL into a change in voltage and supplies it. do.

[0192] [Step 5] In the fifth step, a selection signal is sent to de-conduct transistor M2. It supplies power to the gate of the M2.

[0193] This completes the operation of the multiple sensor elements 22 electrically connected to a single scan line G1. ru.

[0194] If there are n scan lines G1, then for scan lines G1(1) to G1(n) Each of these steps should be repeated from the first to the fifth step.

[0195] Alternatively, if wiring RES and wiring CS are common to each sensor element 22, see Figure 14. The driving method shown in (A) may also be used. That is, first a reset signal is sent to the wiring RES. Next, with the control signal supplied to the wiring CS, scan line G1(1) to scan By sequentially supplying selection signals to line G1(n), the change in potential at node A is brought about by The signal is supplied to signal line DL(1) through signal line DL(m).

[0196] This method reduces the frequency of supplying reset signals and control signals. It is possible.

[0197] Here, the potential of node A may change over time due to various factors. Example For example, changes in environmental factors such as temperature and humidity can cause the potential of node A to change.

[0198] Therefore, two types of potentials are used as the rectangular control signal supplied to the second electrode of the capacitive element C. By operating in this manner and taking the difference between the two detection signals DATA, the timestamp of the potential at node A is obtained. This allows for the cancellation of the effects of changes. By performing this operation, detection sensitivity can be increased. This becomes possible.

[0199] Figure 14(B) shows an example of a driving method that alternately repeats periods R1 and R2. .

[0200] In Figure 14(B), during period R1, transistor M3 is in a conductive state on the signal line RES. During the period when a certain potential is supplied, a low-level potential is supplied to the wiring CS. Next This supplies a high-level potential to the wiring CS. That is, during period R1, the second electric current of the capacitive element C When the potential of the pole transitions from a low-level potential to a high-level potential, the potential of node A changes. A detection signal DATA based on the data is supplied to the signal line DL. The signal converted by the converter CONV is then supplied to terminal OUT.

[0201] On the other hand, during period R2, a potential is supplied to the signal line RES that causes transistor M3 to conduct. During the period in which this is happening, a high-level potential is supplied to the wiring CS. Then, the wiring CS A low-level potential is supplied. That is, during period R2, the potential of the second electrode of the capacitive element C is Based on the transition from high-level potential to low-level potential, the change in the potential of node A is observed. The detection signal DATA is supplied to the signal line DL. Then, a converter is used based on the detection signal DATA. The signal converted by CONV is supplied to terminal OUT.

[0202] Subsequently, the signal supplied to terminal OUT during period R1 and the signal supplied to terminal OUT during period R2 By taking the difference between the signals, the signal obtained is one in which the effects of the temporal change in the potential of node A are canceled out. It can be obtained.

[0203] Figure 14(C) shows an example where the signal supplied to the wiring CS is different from that in Figure 14(B). Yes, they are.

[0204] In Figure 14(C), the control signal supplied to the wiring CS is at a high level potential and a middle level potential. It has three types of potentials: low potential and low-level potential. Specifically, during period R1, the signal line During the period when a potential that causes transistor M3 to conduct is supplied to RES, the wiring CS A low-level potential is supplied. Then, scanning is performed while a middle-level potential is supplied to the wiring CS. A selection signal is sequentially supplied to line G1(1) through scan line G1(n). Meanwhile, during period R2... And, during the period when the potential that causes transistor M3 to conduct is supplied to the signal line RES, A high-level potential was supplied to wiring CS. Subsequently, a medium-level potential was supplied to wiring CS. In this state, selection signals are sequentially supplied to scan lines G1(1) through G1(n).

[0205] Subsequently, as described above, the signal supplied to terminal OUT during period R1 and the signal supplied to terminal O during period R2 are used. By taking the difference of the signals supplied to UT, the effect of the temporal change in the potential of node A can be determined. You can obtain a signal that has been canceled out.

[0206] The above is an explanation of the drive method.

[0207] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0208] (Embodiment 3) In this embodiment, an electronic device and a lighting device that can be manufactured by applying one aspect of the present invention are described below. This will be explained using Figures 15 and 16.

[0209] A touch panel according to one aspect of the present invention is flexible. Therefore, a flexible electronic device It can be suitably used in devices and lighting equipment. Furthermore, by applying one aspect of the present invention, It is possible to manufacture highly reliable electronic and lighting devices that are resistant to repeated bending.

[0210] Examples of electronic devices include television equipment (also known as televisions or television receivers). (e.g., computer monitors, digital cameras, digital video cameras, digital) Photo frames, mobile phones (also called mobile phones or mobile phone devices), portable game consoles, Examples include personal digital assistants, audio playback devices, and large-scale game machines such as pachinko machines.

[0211] Furthermore, since the touch panel according to one aspect of the present invention is flexible, it can be attached to the interior walls of houses and buildings or It can also be incorporated into exterior walls, or along curved surfaces of the interior or exterior of automobiles.

[0212] Furthermore, an electronic device according to one embodiment of the present invention may include a touch panel and a secondary battery. In this case, it is preferable that the secondary battery can be charged using contactless power transmission.

[0213] Examples of secondary batteries include lithium polymer batteries (lithium-ion batteries) that use a gel-like electrolyte. Lithium-ion secondary batteries such as polymer batteries, lithium-ion batteries, nickel-metal hydride batteries Pond, nickel-cadmium battery, organic radical battery, lead-acid battery, air rechargeable battery, nickel-zinc battery, silver-sulfide battery Lead-acid batteries are one example.

[0214] An electronic device according to one aspect of the present invention may have a touch panel and an antenna. By receiving signals via the na, the display unit can display images, information, etc. If the sub-device has a secondary battery, the antenna may be used for contactless power transmission.

[0215] Figure 15(A) shows an example of a mobile phone. The mobile phone 7400 has a housing 740 In addition to the display unit 7402 incorporated into 1, there are also operation buttons 7403 and an external connection port 7404. It is equipped with speaker 7405, microphone 7406, etc. Note that the mobile phone 7400 is This invention is manufactured by using a touch panel according to one embodiment of the present invention as the display unit 7402. In one embodiment, a highly reliable mobile phone equipped with a curved display unit is produced with a high yield. It can be used.

[0216] The mobile phone 7400 shown in Figure 15(A) can be accessed by touching the display unit 7402 with a finger, etc. Information can be entered. Also, all kinds of actions such as making phone calls or typing text can be performed. This operation can be performed by touching the display unit 7402 with a finger or the like.

[0217] Furthermore, the power can be turned ON or OFF by operating the operation button 7403, and the display unit 7402 You can switch the type of image displayed. For example, from the email composition screen, You can switch to the menu screen.

[0218] Figure 15(B) shows an example of a wristwatch-type personal information terminal. Personal information terminal 7100 The components are: housing 7101, display unit 7102, band 7103, buckle 7104, and operation button 7 It is equipped with terminals 105 and input / output terminals 7106, etc.

[0219] The 7100 mobile information terminal offers mobile phone calls, email, document viewing and creation, music playback, and more. It can run various applications such as internet communication and computer games. Cut.

[0220] The display unit 7102 has a curved display surface, and displays information along the curved surface. It is possible to do so. In addition, the display unit 7102 is equipped with a touch sensor, and the screen can be touched with a finger or stylus. It can be operated by touching it. For example, icon 7 displayed on the display unit 7102 Touching 107 will launch the application.

[0221] The 7105 control button is used for time setting, as well as power on / off, wireless communication on, and more. Various functions such as operation, activation and deactivation of silent mode, and activation and deactivation of power saving mode. It can be made to hold. For example, the operating system built into the personal digital assistant 7100 The system also allows you to freely configure the function of the control button 7105.

[0222] Furthermore, the 7100 portable information terminal is capable of performing standardized short-range wireless communication. For example, by communicating with a wireless headset, hands-free operation is possible. You can also make calls.

[0223] Furthermore, the portable information terminal 7100 is equipped with an input / output terminal 7106, and can connect to other information terminals. Data can be exchanged directly via this. Also, charging is possible via input / output terminal 7106. It can also perform electrical operations. Note that charging is done wirelessly without using the input / output terminal 7106. You may go.

[0224] The display unit 7102 of the portable information terminal 7100 incorporates a touch panel according to one aspect of the present invention. It is being developed. According to one aspect of the present invention, a mobile information display unit with a curved display section and reliable information We can provide devices with a high yield rate.

[0225] Figures 15(C) to (E) show an example of a lighting device. Lighting device 7200, lighting device 7210 and the lighting device 7220 each have a base 72 equipped with an operating switch 7203. It has part 01 and a light-emitting part supported by the base part 7201.

[0226] The lighting device 7200 shown in Figure 15(C) includes a light-emitting section 7202 having a wave-shaped light-emitting surface. Therefore, it is a lighting fixture with a highly aesthetic design.

[0227] The light-emitting section 7212 of the lighting device 7210 shown in Figure 15(D) has two convexly curved parts The light-emitting parts are arranged symmetrically. Therefore, the lighting device 7210 is the central component. It can illuminate in all directions.

[0228] The lighting device 7220 shown in Figure 15(E) includes a concavely curved light-emitting section 7222. Therefore, in order to concentrate the light emitted from the light-emitting unit 7222 onto the front of the lighting device 7220, It is suitable for brightly illuminating a wide area.

[0229] Furthermore, the light emission provided by each of the lighting devices 7200, 7210, and 7220 Because the part is flexible, the light-emitting part can be made of plastic material or a movable frame. The light-emitting part may be fixed with a material, and the light-emitting surface may be freely bent to suit the application.

[0230] Here, we have provided an example of a lighting device in which the light-emitting part is supported by a base, but the light-emitting part The enclosure equipped with this feature can also be fixed to the ceiling or suspended from the ceiling. Because the light surface can be curved, the light-emitting surface can be curved into a concave shape to illuminate a specific area. It can illuminate a specific area, or the light-emitting surface can be curved into a convex shape to brightly illuminate the entire room.

[0231] Here, each light-emitting unit incorporates a touch panel according to one embodiment of the present invention. In one embodiment, a highly reliable lighting device equipped with a curved light-emitting section is provided with a high yield. Cut.

[0232] Figure 15(F) shows an example of a portable touch panel. Touch Panel 7300 The components are: housing 7301, display unit 7302, operation buttons 7303, pull-out member 7304, control It is equipped with part 7305.

[0233] The touch panel 7300 is a flexible unit wound in a roll inside a cylindrical housing 7301. It is equipped with a display unit 7302.

[0234] Furthermore, the touch panel 7300 can receive video signals via the control unit 7305, and receives them. The image can be displayed on the display unit 7302. The control unit 7305 also has a battery. It is equipped with terminals for connecting connectors to the control unit 7305, and for video signals and power The system may also be configured to supply power directly from an external source via a wired connection.

[0235] Additionally, the 7303 control button allows you to turn the power on and off, and switch the displayed image. It is possible to perform actions such as [this].

[0236] Figure 15(G) shows the display unit 7302 pulled out by the pull-out member 7304. The switch panel 7300 is shown. In this state, an image can be displayed on the display unit 7302. Furthermore, the operation buttons 7303 located on the surface of the housing 7301 allow for easy one-handed operation. This is possible. Also, as shown in Figure 15(F), the operation button 7303 is located inside the housing 7301. By positioning it to one side rather than in the center, it can be easily operated with one hand.

[0237] Furthermore, when the display unit 7302 is pulled out, the display surface of the display unit 7302 becomes flat. To secure it, a reinforcing frame may be provided on the side of the display unit 7302.

[0238] In addition to this configuration, a speaker is installed in the enclosure, and the audio signal received along with the video signal is used. It would also be possible to configure it to output audio.

[0239] The display unit 7302 incorporates a touch panel according to one aspect of the present invention. Depending on the configuration, lightweight and highly reliable touch panels can be provided with a high yield.

[0240] Figures 16(A) to (C) show a foldable portable information terminal 310. Figure 16(A) Figure 16(B) shows the mobile information terminal 310 in its unfolded state. Figure 16(C) shows a portable information terminal 310 in an intermediate state, transitioning from one state to the other. The image shows the portable information terminal 310 in its folded state. In its unfolded state, it offers excellent portability, and in its unfolded state, it provides a seamless, wide display area for displaying information. Excellent readability.

[0241] The display panel 316 is supported by three housings 315 connected by hinges 313. The portable information terminal 3 is formed by bending the two housings 315 via the hinge 313. The invention allows for the reversible transformation of 10 from an unfolded state to a folded state. One embodiment of a touch panel can be used as the display panel 316. For example, a radius of curvature of 1 m A touch panel that can be bent between m and 150 mm can be applied.

[0242] In one embodiment of the present invention, the touch panel is in a folded state or an unfolded state. The configuration may also include a sensor that detects the state and supplies detection information. The panel's control unit acquires information indicating that the touch panel is in a folded state. The movement of the folded part (or the part that is folded and no longer visible to the user) The operation may be stopped. Specifically, the display may be stopped. Also, detection by touch sensor You may cease to know.

[0243] Similarly, the touch panel control unit indicates that the touch panel is in the deployed state. You may retrieve the information and resume display or touch sensor detection.

[0244] Figure 16(D)(E) shows a foldable portable information terminal 320. Figure 16 shows the portable information terminal 320 in a folded state with the display unit 322 facing outwards. (E) shows the portable information terminal 320 in a folded state with the display unit 322 facing inward. When the mobile information terminal 320 is not in use, the non-display section 325 is folded outwards. This can suppress dirt and scratches on the display unit 322. A touch panel according to one embodiment of the present invention has a display unit 32 It can be used in 2.

[0245] Figure 16(F) is a perspective view illustrating the external shape of the portable information terminal 330. Figure 16(G) is This is a top view of the personal digital assistant (PAD) 330. Figure 16(H) illustrates the external shape of the PAD 340. This is a perspective.

[0246] The portable information terminals 330 and 340 are selected from, for example, telephones, notebooks, or information viewing devices. It has one or more functions. Specifically, it can be used as a smartphone. can.

[0247] The personal digital assistants 330 and 340 can display text and image information on multiple surfaces. For example, three operation buttons 339 can be displayed on one surface (Figure 16(F)( H)). In addition, the information 337 shown by the dashed rectangle can be displayed on other surfaces (Figure 16( G)(H)). An example of information 337 is SNS (Social Networking). • Notifications from services, displays indicating incoming emails and phone calls, and subject lines of emails, etc. Name, sender's name (e.g., email address), date and time, battery level, antenna signal strength, etc. There is. Alternatively, in the position where information 337 is displayed, instead of information 337, there is an operation button. You may also display icons, etc. Note that in Figure 16(F)(G), information is displayed at the top. An example in which 337 is displayed has been shown, but the present invention is not limited thereto. For example, Figure It may also be displayed on the side, as in the portable information terminal 340 shown in 16(H).

[0248] For example, a user of the personal digital assistant 330 places the personal digital assistant 330 in the breast pocket of their clothing. Once the item is delivered, you can check the display (information 337 in this case).

[0249] Specifically, the phone number or name of the caller of the incoming call is displayed on the mobile information terminal 330. It is displayed in a position where it can be observed from the side. The user takes the portable information terminal 330 out of their pocket. Without having to do anything, you can check the display and decide whether or not to answer the call.

[0250] The casing 335 of the personal digital assistant 330 and the casing 336 of the personal digital assistant 340 each have A touch panel according to one aspect of the present invention can be used for the display unit 333. Depending on the design, a curved display area can be provided, and a highly reliable touch panel can be delivered with a high yield. Cut.

[0251] Furthermore, even if information is displayed on three or more screens, as shown in Figure 16(I) of the portable information terminal 345 Good. Here, information 355, information 356, and information 357 are displayed on different sides. Here is an example.

[0252] The display unit 358 of the housing 354 of the portable information terminal 345 has a touch display according to one aspect of the present invention. A panel can be used. In one aspect of the present invention, a curved display section is provided, and reliable We can provide high-quality touch panels with a high yield. [Explanation of symbols]

[0253] 10 Touch panel modules 20 Touch Sensor Modules 21 circuit boards 22 Sensor elements 23 circuits 24 circuits 25 Wiring 26 Wiring 30 Display Panel 31 circuit boards 32 Display section 33 pixels 34 circuits 41 FPC 42 FPC 43 terminals 110 Capacitive elements 111 Conductive layer 111a Conductive layer 112 Insulating layer 113 Conductive layer 114 Colored layer 114b Colored layer 114g colored layer 114r colored layer 115 Light blocking layer 117 Conductive layer 118 Aperture 119 Optical adjustment layer 120 transistors 121 Semiconductor layer 201 Transistors 202 transistors 203 Transistors 204 Light-emitting element 205 Contact section 210 Connecting Layer 211 Adhesive layer 212 Insulating layer 213 Insulating layer 214 Insulating layer 215 Insulating layer 216 Insulating layer 217 Insulating layer 218 Insulating layer 219 Spacer 220 Adhesive layer 221 Electrode 222 EL layer 223 Electrode 224 Optical adjustment layer 225 Conductive layer 251 transistors 252 transistors 253 Contact section 260 Connecting Layers 261 Adhesive layer 262 Insulating layer 263 Insulating layer 264 Insulating layer 265 Insulating layer 266 Insulating layer 267 Overcoat 271 Contact section 272 Contact section 273 Wiring 274 Wiring 310 Mobile Information Terminal 313 Hinge 315 cabinets 316 Display Panel 320 Mobile Information Terminals 322 Display section 325 Hidden part 330 Mobile Information Terminals 333 Display section 335 cabinets 336 cabinets 337 Information 339 Operation buttons 340 Mobile Information Terminals 345 Mobile Information Terminal 354 cabinets 355 Information 356 Information 357 Information 358 Display section 7100 Mobile Information Terminal 7101 enclosure 7102 Display section 7103 Band 7104 Buckle 7105 Operation Buttons 7106 Input / output terminal 7107 Icon 7200 Lighting device 7201 Daibu 7202 Light-emitting part 7203 Operation switch 7210 Lighting device 7212 Light-emitting part 7220 Lighting device 7222 Light-emitting part 7300 Touch Panel 7301 enclosure 7302 Display section 7303 Operation Buttons 7304 component 7305 Control Unit 7400 mobile phones 7401 enclosure 7402 Display section 7403 Operation Buttons 7404 External connection port 7405 Speaker 7406 Microphone

Claims

[Claim 1] It comprises a first substrate, a second substrate supporting a display element, a first conductive layer, a second conductive layer, a first layer, a third conductive layer, an insulating layer, a transistor, and a display element. When viewed from the first substrate side, the first layer has a region located between the first conductive layer and the second conductive layer. In a cross-sectional view, the first conductive layer, the second conductive film, and the first layer have a region located between the first substrate and the third conductive layer. The insulating layer has a region located between the first conductive layer and the third conductive film, The transistor is electrically connected to the first conductive layer, The first conductive layer, the third conductive layer, and the insulating layer form a capacitance. The third conductive layer has an opening, The opening in the third conductive layer and the first conductive layer have overlapping regions. The first conductive layer, the second conductive layer, the first layer, the insulating layer, and the transistor are supported on the first substrate. Display device.

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