Component holding device and circuit board handling device
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- JUKI CORP
- Filing Date
- 2024-11-28
- Publication Date
- 2026-06-09
AI Technical Summary
【0007】 本明細書で開示する技術によれば、電子機器の品質の低下が抑制される。
Smart Images

Figure 2026093869000001_ABST
Abstract
Claims
1. A retaining mechanism for holding parts, A first member connected to the aforementioned holding mechanism, A second member supports the first member so that it can move relative to it in a vertical direction parallel to the vertical axis, The first member is rotated in a rotational direction about the vertical axis when the first member moves vertically relative to the second member, Parts holding device.
2. The aforementioned rotating mechanism is A guide groove is provided on one of the first member and the second member, and is inclined with respect to the vertical axis, A slide pin provided on the other of the first member and the second member and positioned in the guide groove, The component holding device according to claim 1.
3. At least a portion of the first member is rod-shaped, The second member has a sleeve portion into which at least a part of the first member is inserted. The guide groove is provided in the sleeve portion, The slide pin is provided so as to protrude from the outer surface of the first member. The component holding device according to claim 2.
4. When the surface of the component held by the holding mechanism is pressed against the substrate, the first member moves upward relative to the second member. The rotation mechanism rotates the first member by a predetermined angle in a first direction when the first member moves upward. The component holding device according to claim 1.
5. The first member is rod-shaped, The second member has a sleeve portion into which at least a part of the first member is inserted. The aforementioned rotating mechanism is The sleeve portion is provided with a guide groove that is inclined with respect to the vertical axis, The first member has a slide pin that is provided to protrude from the outer surface of the first member and is positioned in the guide groove, The component holding device according to claim 4.
6. The guide groove is inclined downward in a second direction opposite to the first direction. The component holding device according to claim 5.
7. A component holding device according to claim 5 for mounting components on the surface of a substrate, The circuit board comprises a screw tightening unit that fastens screws to the component mounted on the surface of the circuit board from the back surface of the circuit board, The aforementioned rotating mechanism is When the component held by the holding mechanism is pressed against the surface of the substrate, the first member is rotated so that the mounting angle is such that the component is rotated by a predetermined angle in the first direction with respect to the target angle. The screw tightening unit rotates the screw in a second direction opposite to the first direction while the component mounted on the surface of the substrate is held by the component holding device, thereby tightening the screw to the component from the back surface of the substrate. Circuit board handling equipment.
8. The screw tightening unit terminates tightening the screw when the tightening torque of the screw reaches a predetermined target torque. The mounting angle is set such that the component is at the target angle when the tightening of the screw is completed. The substrate processing apparatus according to claim 7.