Sensor module and vehicle
By isolating and compensating for the temperature dependencies of sensors and processing units within a sensor module, the module achieves effective temperature correction, enhancing its operational accuracy and ease of use.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- ROHM CO LTD
- Filing Date
- 2026-02-19
- Publication Date
- 2026-06-09
AI Technical Summary
The challenge of performing temperature correction for sensor modules is complicated due to the different temperature dependencies of sensors and processing units, which are typically manufactured separately and sealed in a single package.
The sensor module includes a switching unit to isolate the output signal of the sensor from the processing unit, allowing for separate temperature compensation of each component, with a control unit and storage unit to non-volatilely store and apply temperature correction data.
This configuration enables easy and accurate temperature compensation of the sensor, processing unit, and drive unit, improving the overall performance and accuracy of the sensor module.
Smart Images
Figure 2026094213000001_ABST
Abstract
Description
Technical Field
[0001] The invention disclosed in this specification relates to a sensor module and a vehicle.
Background Art
[0002] Conventionally, various sensor modules including sensors and semiconductor devices have been developed (see, for example, Patent Document 1). The semiconductor device includes a drive unit that drives the sensor and a processing unit that processes the output of the sensor.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] The sensor and the processing unit are often manufactured in separate processes and sealed in one package. Since the sensor and the processing unit manufactured in separate processes have different temperature dependencies from each other, it has been difficult to perform temperature correction for the entire sensor module.
Means for Solving the Problems
[0005] The sensor module disclosed in this specification includes a sensor, a semiconductor device including a drive unit configured to drive the sensor and a processing unit configured to process an output signal of the sensor, a switching unit configured to switch whether to block or invalidate supply of the output signal of the sensor to the processing unit, a storage unit configured to non-volatiley store the content of temperature correction, and a control unit configured to perform temperature correction on the drive unit and the processing unit based on the content of the temperature correction.
[0006] The vehicles disclosed herein include the above-mentioned sensor module. [Effects of the Invention]
[0007] According to the sensor modules and vehicles disclosed herein, temperature compensation can be easily performed. [Brief explanation of the drawing]
[0008] [Figure 1] Figure 1 is a diagram showing a schematic configuration of a sensor module according to one embodiment. [Figure 2] Figure 2 shows a first configuration example of a sensor module according to one embodiment. [Figure 3] Figure 3 is a graph showing examples of temperature compensation details for the output offset of the processing unit, the drive unit, and the sensor. [Figure 4] Figure 4 is a graph showing other examples of temperature compensation for the output offset of the processing unit alone, the output offset of the drive unit, and the output offset of the sensor. [Figure 5] Figure 5 shows a second configuration example of a sensor module according to one embodiment. [Figure 6] Figure 6 shows a third configuration example of a sensor module according to one embodiment. [Figure 7] Figure 7 shows a fourth configuration example of a sensor module according to one embodiment. [Figure 8] Figure 8 is an external view of a vehicle according to one embodiment. [Modes for carrying out the invention]
[0009] Figure 1 is a diagram showing the schematic configuration of a sensor module according to one embodiment. The sensor module 100 shown in Figure 1 comprises a semiconductor device 1, a sensor 2, and terminals T101 to T103.
[0010] The semiconductor device 1 is, for example, an LSI (Large Scale Integration). The semiconductor device 1 comprises a digital circuit 11, a drive unit 12, a resistor 13, a processing unit 14, and terminals T11 to T17. In other words, the sensor module 100 comprises a drive unit 12 and a processing unit 14.
[0011] Sensor 2 collects information on the object to be detected and converts the collected information into an electrical signal for output. Sensor 2 is equipped with terminals T21 to T24. The object to be detected by Sensor 2 is not particularly limited as long as it is not temperature. The format of the output signal of Sensor 2 is not particularly limited, but in this embodiment, Sensor 2 outputs a differential voltage signal. Semiconductor device 1 and Sensor 2 are manufactured using separate processes. For example, semiconductor device 1 is manufactured using a silicon semiconductor process, and Sensor 2 is manufactured using a compound semiconductor process.
[0012] Terminal T101 is configured to receive the power supply voltage VDD and is physically and electrically connected to terminal T11 inside the sensor module 100.
[0013] Terminal T102 is configured to be connected to ground potential and is physically and electrically connected to terminal T12 inside the sensor module 100.
[0014] Terminal T103 is configured to output the output signal of the processing unit 14 (described later) to the outside of the sensor module 100, and is physically and electrically connected to terminal T17 inside the sensor module 100.
[0015] Terminals T13 to T16 are physically and electrically connected to terminals T21 to T24 inside the sensor module 100.
[0016] Next, we will describe the details of each part of the semiconductor device 1.
[0017] The digital circuit 11 is a circuit that processes digital signals and controls the operation of the entire sensor module 100. The digital circuit 11 includes a storage unit 11A and a control unit 11B. That is, the sensor module 100 includes the storage unit 11A and the control unit 11B.
[0018] The storage unit 11A is configured to non-volatilely store the content of temperature correction. The control unit 11B is configured to perform temperature correction on the drive unit 12 and the processing unit 14 based on the content of temperature correction stored by the storage unit 11A.
[0019] The drive unit 12 is configured to drive the sensor 2. The drive current output from the drive unit 12 is supplied to the terminal T21 of the sensor 2 via the terminal T13.
[0020] The first end of the resistor 13 is physically and electrically connected to the terminal T14 inside the semiconductor device 1, and the second end of the resistor 13 is physically and electrically connected to the terminal T12 inside the semiconductor device 1. The resistor 13 converts the drive current of the sensor 2 into a voltage, and the voltage corresponding to the drive current of the sensor 2 is fed back to the drive unit 12. The drive unit 12 performs feedback control on the drive current of the sensor 2.
[0021] The processing unit 14 is configured to process the output signal of the sensor 2. The processing unit 14 includes a first processing unit 14A and a second processing unit 14B.
[0022] The first processing unit 14A is configured to receive and process the output signal of the sensor 2. Specifically, the output signal of the sensor 2 output from the terminals T23 and T24 of the sensor 2 is supplied to the first processing unit 14A via the terminals T15 and T16. The first processing unit 14A is a single amplifier, but the first processing unit 14A is not limited to a single amplifier, and for example, a configuration in which a plurality of amplifiers are connected in series may be used.
[0023] The second processing unit 14B is configured to receive and process the output signal from the first processing unit 14A. The output signal from the second processing unit 14B is supplied to terminal T103 via terminal T17. In Figure 1, the second processing unit 14B is a single amplifier, but the second processing unit 14B is not limited to a single amplifier; for example, it may be configured with multiple amplifiers connected in series.
[0024] Furthermore, a switching unit SW1 is provided inside the first processing unit 14A. In other words, the sensor module 100 is equipped with a switching unit SW1. The switching unit SW1 is configured to switch whether or not to disable the supply of the output signal of the sensor 2 to the processing unit 14. Specifically, the switching unit SW1 is configured to switch whether or not to short-circuit terminals T23 and T24. Alternatively, the switching unit SW1 may be configured to switch whether or not to cut off the supply of the output signal of the sensor 2 to the processing unit 14. For example, the switching unit SW1 may be provided between terminals T15 and T16 and the processing unit 14 instead of inside the first processing unit 14A, and the switching unit SW1 may switch the electrical connection between terminals T15 and T16 and the processing unit 14 on / off.
[0025] Next, we will explain the temperature compensation of the sensor module 100.
[0026] First, the switching unit SW1 disables the supply of the output signal of sensor 2 to the processing unit 14. This makes it possible to separate the temperature characteristics of semiconductor device 1 from those of sensor 2. With the supply of the output signal of sensor 2 to the processing unit 14 disabled, the output signal of terminal T103 is input to the evaluation device, which is an external device of sensor module 100, while the ambient temperature of sensor module 100 is changed. When inputting the output signal of terminal T103 to the evaluation device, which is an external device of sensor module 100, terminal T103 of sensor module 100 and the input terminal of the evaluation device are connected by a cable or the like. Based on the output signal of terminal T103, the evaluation device creates the temperature correction content related to the output offset of the processing unit 14 alone.
[0027] Next, the contents of the temperature correction related to the output offset of the processing unit 14 alone are stored in the storage unit 11A. Based on the contents of the temperature correction related to the output offset of the processing unit 14 alone, the control unit 11B corrects the temperature of the second processing unit 14B, and while the supply of the output signal of the sensor 2 to the processing unit 14 is not disabled, the output signal of terminal T103 is taken into the evaluation device while changing the ambient temperature of the sensor module 100. At this time, the sensor 2 does not have to sense the sensing target (including cases where it is performing a weak sensing that can be considered as not sensing), and it may sense a sensing target such that the output signal of the sensor 2 becomes large enough that the output offset of the sensor 2 can be ignored. Based on the output signal of terminal T103, the evaluation device creates the contents of the temperature correction related to the output offset of the drive unit 12.
[0028] Then, the contents of the temperature correction for the output offset of the processing unit 14 alone and the contents of the temperature correction for the output offset of the drive unit 12 are stored in the storage unit 11A. Based on the contents of the temperature correction for the output offset of the processing unit 14 alone and the contents of the temperature correction for the output offset of the drive unit 12, the control unit 11B corrects the temperature of the drive unit 12 and the second processing unit 14B, and while the sensor 2 is not sensing the sensing target (including cases where it is performing a weak sensing that can be considered as not sensing), and the supply of the output signal of the sensor 2 to the processing unit 14 is not disabled, the output signal of terminal T103 is taken into the evaluation device while changing the ambient temperature of the sensor module 100. Based on the output signal of terminal T103, the evaluation device creates the contents of the temperature correction for the output offset of the sensor 2.
[0029] The temperature correction details for the output offset of sensor 2 are stored in the storage unit 11A. This allows the control unit 11B to perform temperature correction on the drive unit 12, the second processing unit 14B, and the first processing unit 14A based on the temperature correction details for the output offset of processing unit 14 alone, the temperature correction details for the output offset of drive unit 12, and the temperature correction details for the output offset of sensor 2.
[0030] Since the sensor module 100 is equipped with a switching unit SW1, it is possible to separate the temperature characteristics of the semiconductor device 1 from those of the sensor 2. Therefore, it becomes easy for an evaluation device, which is an external device of the sensor module 100, to acquire the contents of the temperature correction of the sensor module 100. As a result, the sensor module 100 can easily perform temperature correction. Note that the sensor module 100 may also be configured to include the functions of the evaluation device described above.
[0031] Furthermore, the temperature correction contents stored in the memory unit 11A include the temperature correction contents related to the output offset of the processing unit 14 alone, the temperature correction contents related to the output offset of the drive unit 12, and the temperature correction contents related to the output offset of the sensor 2. Therefore, the temperature correction of the processing unit 14 alone, the drive unit 12, and the sensor 2 can be performed appropriately.
[0032] Furthermore, since there is a one-to-one correspondence between the temperature correction content related to the output offset of the processing unit 14 alone, the temperature correction content related to the output offset of the drive unit 12, and the temperature correction content related to the output offset of the sensor 2, and the drive unit 12, the second processing unit 14B, and the first processing unit 14A, which are the targets of temperature correction control, temperature correction control is easy.
[0033] Figure 2 shows a first configuration example of the sensor module 100. The sensor module 100A shown in Figure 2 is equipped with terminal T104. The semiconductor device 1 of the sensor module 100A is equipped with DACs (Digital to Analog Converters) 15A to 15C, an ADC (Analog to Digital Converter) 16, a temperature sensor 17, and terminal T18. In other words, the sensor module 100A is equipped with DACs 15A to 15C. In addition, the digital circuit 11 of the sensor module 100A is equipped with a communication unit 11C.
[0034] The control unit 11B controls the second processing unit 14B via the DAC 15C to perform temperature correction related to the output offset of the processing unit 14 alone. The control unit 11B controls the drive unit 12 via the DAC 15A to perform temperature correction related to the output offset of the drive unit 12. The control unit 11B controls the first processing unit 14A via the DAC 15B to perform temperature correction related to the output offset of the sensor 2. Since the sensor module 100A is equipped with DACs 15A to 15C, the control unit 11B can control the second processing unit 14B, the drive unit 12, and the first processing unit 14A with a simple configuration.
[0035] The communication unit 11C can acquire signals and information supplied to terminal T104 via terminal T18. For example, by connecting the output terminal of the evaluation device and terminal T104 with a cable or the like, the communication unit 11C can acquire from the evaluation device the contents of the temperature correction related to the output offset of the processing unit 14 alone, the contents of the temperature correction related to the output offset of the drive unit 12, and the contents of the temperature correction related to the output offset of the sensor 2.
[0036] Figure 3 is a graph showing an example of the temperature correction details for the output offset of the processing unit 14 alone, the temperature correction details for the output offset of the drive unit 12, and the temperature correction details for the output offset of the sensor 2. In each graph shown in Figure 3, the horizontal axis represents temperature, the vertical axis of the upper graph in Figure 3 represents the digital value supplied by the control unit 11B to the DAC 15C, the vertical axis of the middle graph in Figure 3 represents the digital value supplied by the control unit 11B to the DAC 15A, and the vertical axis of the lower graph in Figure 3 represents the digital value supplied by the control unit 11B to the DAC 15B.
[0037] The data table corresponding to the nine black circles in the upper graph shown in Figure 3 is stored in the storage unit 11A as the content of the temperature correction related to the output offset of the processing unit 14 alone. The digital value between two black circles is linearly interpolated, for example.
[0038] The data table corresponding to the nine black circles in the central graph shown in Figure 3 is stored in the storage unit 11A as the content of the temperature correction related to the output offset of the drive unit 12. The digital value between two black circles is linearly interpolated, for example.
[0039] The data table corresponding to the nine black circles in the lower graph shown in Figure 3 is stored in the storage unit 11A as the content of the temperature correction related to the output offset of sensor 2. The digital value between two black circles is, for example, linearly interpolated.
[0040] In Figure 3, each graph had nine black dots, but there could be any number other than nine. Furthermore, each graph could have a different number of black dots.
[0041] In each graph shown in Figure 3, the value of the first temperature data t1 is the same, and the values of the second temperature data t2 to the ninth temperature data t9 are also the same.
[0042] Here, it is preferable that the temperature data can be set to different values for each of the temperature correction settings related to the output offset of the processing unit 14, the output offset of the drive unit 12, and the output offset of the sensor 2. This makes it possible, for example, to concentrate the temperature data near the inflection point of the graph and improve the accuracy of temperature correction near the inflection point of the graph.
[0043] In Figure 4, the horizontal axis of each graph represents temperature. The vertical axis of the upper graph in Figure 4 represents the digital value supplied by the control unit 11B to the DAC 15C. The vertical axis of the middle graph in Figure 4 represents the digital value supplied by the control unit 11B to the DAC 15A. The vertical axis of the lower graph in Figure 4 represents the digital value supplied by the control unit 11B to the DAC 15B. In each graph in Figure 4, for example, the value of the 8th temperature data t8 is set to a different value.
[0044] Alternatively, the storage unit 11A may store a function that shows the relationship between temperature and digital values instead of a data table.
[0045] Furthermore, as described above, the semiconductor device 1 of the sensor module 100A is equipped with a temperature sensor 17. In other words, the sensor module 100A is equipped with a temperature sensor 17. The output signal (temperature information) of the temperature sensor 17 is converted into a digital signal by the ADC 16 and supplied to the digital circuit 11. The digital circuit 11 corrects the temperature of the drive unit 12 and the processing unit 14 based on the above temperature information and the contents of the temperature correction stored in the storage unit 11A.
[0046] Since the sensor module 100A is equipped with a temperature sensor 17, there is no need to provide an input terminal for inputting temperature information to the sensor module 100A. This makes it possible to miniaturize and reduce the cost of the sensor module 100A.
[0047] Figure 5 shows a second configuration example of the sensor module 100. The sensor module 100B shown in Figure 5 differs from the sensor module 100A in that the temperature sensor is not located inside the semiconductor device 1, but is otherwise basically the same as the sensor module 100A.
[0048] The sensor module 100B includes a sensor 3. The semiconductor device 1 of the sensor module 100B includes a terminal T19. The output signal (temperature information) of the sensor 3 is supplied to the ADC 16 via terminal T19.
[0049] Figure 6 shows a third configuration example of the sensor module 100. The sensor module 100C shown in Figure 6 differs from the sensor module 100A in that the semiconductor device 1 is equipped with a constant voltage source 18 and a selector 19, but is otherwise basically the same as the sensor module 100A.
[0050] The constant voltage source 18 is configured to output a constant voltage. Here, constant voltage refers to a voltage that is constant under ideal conditions, and in reality, it is a voltage that may fluctuate slightly due to temperature changes, etc. The specific circuit configuration of the constant voltage source 18 is not particularly limited, but in this configuration example, the constant voltage source 18 is a bandgap type constant voltage circuit.
[0051] The output signal (temperature information) from sensor 17 is supplied to the first input terminal of selector 19. The constant voltage output from constant voltage source 18 is supplied to the second input terminal of selector 19.
[0052] The selector 19 is configured to select either the output signal of the sensor 17 or a constant voltage. The ADC 16 converts the output of the selector 19 into a digital signal and supplies it to the digital circuit 11. The control unit 11B is configured to correct the output signal (temperature information) of the sensor 17 based on the output of the ADC 16 when the selector 19 has selected a constant voltage. The selector 19 periodically selects a constant voltage for a very short period of time, and at other times selects the output signal of the sensor 3.
[0053] The sensor module 100C improves the accuracy of temperature information through temperature information correction, which in turn improves the accuracy of temperature correction in the drive unit and processing unit.
[0054] Figure 7 shows a fourth configuration example of the sensor module 100. The sensor module 100D shown in Figure 7 differs from the sensor module 100C in that the temperature sensor is not located inside the semiconductor device 1, but is otherwise basically the same as the sensor module 100C.
[0055] The sensor module 100D includes a sensor 3. The semiconductor device 1 of the sensor module 100D includes a terminal T19. The output signal (temperature information) of the sensor 3 is supplied to the first input terminal of the selector 19 via terminal T19.
[0056] The devices or equipment on which the aforementioned sensor module 100 is installed are not limited, but it is particularly useful to install the sensor module 100 in devices or equipment where the temperature in the operating environment changes significantly.
[0057] The sensor module 100 is mounted on, for example, the vehicle X shown in Figure 8. In other words, the vehicle X is equipped with the sensor module 100. When the vehicle X is equipped with the sensor module 100, for example, the sensor 2 provided on the sensor module 100 may be a magnetic sensor, and the rotor rotation position of a predetermined motor provided on the vehicle X may be detected based on the detection signal of the magnetic sensor.
[0058] Furthermore, the configuration of the present invention can be modified in various ways without departing from the spirit of the invention, in addition to the embodiments described above. The embodiments described above should be considered to be illustrative and not restrictive in all respects, and the technical scope of the present invention is indicated by the claims, not by the description of the embodiments described above, and should be understood to include all modifications that fall within the meaning and scope equivalent to the claims.
[0059] For example, although the sensor modules 100A to 100D described above have a built-in temperature sensor, the temperature information detected by a temperature sensor located outside the sensor module may be acquired by a control unit located inside the sensor module.
[0060] The sensor modules (100A to 100D) described above have the following configuration (first configuration): a sensor (2), a semiconductor device (1) including a drive unit (12) configured to drive the sensor and a processing unit (14) configured to process the output signal of the sensor, a switching unit (SW1) configured to switch whether or not to cut off or disable the supply of the output signal of the sensor to the processing unit, a storage unit (11A) configured to non-volatilely store the contents of the temperature correction, and a control unit (11B) configured to temperature correct the drive unit and the processing unit based on the contents of the temperature correction.
[0061] The sensor module, as described in the first configuration above, is configured to allow for the separation of the temperature characteristics of the semiconductor device from those of the sensor. Therefore, the sensor module can easily perform temperature compensation.
[0062] In the sensor module having the first configuration described above, the temperature compensation may also have a configuration (second configuration) that includes a first content relating to the output offset of the processing unit alone, a second content relating to the output offset of the drive unit, and a third content relating to the output offset of the sensor.
[0063] The sensor module, which is the second configuration described above, can appropriately perform temperature compensation for the processing unit, the drive unit, and the sensor itself.
[0064] In the sensor module having the second configuration described above, the processing unit may be configured to include a first processing unit (14A) configured to receive and process the output signal of the sensor, and a second processing unit (14B) configured to receive and process the output signal of the first processing unit, and the control unit may be configured to correct the temperature of the second processing unit based on the first content, correct the temperature of the drive unit based on the second content, and correct the temperature of the first processing unit based on the third content (third configuration).
[0065] In the third configuration described above, the sensor module has a one-to-one correspondence between each of the first to third components and each of the temperature compensation control targets, making temperature compensation control easy.
[0066] In the sensor module having the third configuration described above, there may be a fourth configuration in which the control unit is configured to correct the temperature of the second processing unit via the first DAC, correct the temperature of the drive unit via the second DAC, and correct the temperature of the first processing unit via the third DAC.
[0067] The sensor module, which is the fourth configuration described above, includes first to third DACs, so the control unit can control the second processing unit, the drive unit, and the first processing unit with a simple configuration.
[0068] In a sensor module having any of the second to fourth configurations described above, the first content, the second content, and the third content are each data tables, and the temperature data in the data tables can be set to different values for each of the first content, the second content, and the third content (fifth configuration).
[0069] The sensor module, which is the fifth configuration described above, can concentrate temperature data near the inflection point of a graph obtained by interpolating a data table, for example, and improve the accuracy of temperature correction near the inflection point of the graph.
[0070] In a sensor module having any of the above configurations 1 to 5, there may be a configuration (the sixth configuration) in which a temperature sensor (3, 17) is provided, and the control unit acquires temperature information detected by the temperature sensor and corrects the temperature of the drive unit and the processing unit based on the temperature information and the content of the temperature correction.
[0071] The sensor module, which is the sixth configuration described above, has a built-in temperature sensor and therefore does not require an input terminal for inputting temperature information. This makes it possible to miniaturize and reduce the cost of the sensor module.
[0072] In the sensor module of the sixth configuration described above, the sensor module may also include a constant voltage source (18) configured to output a constant voltage, a selector (19) configured to select either the output of the temperature sensor or the constant voltage, and an ADC (16) configured to convert the output of the selector from analog to digital, wherein the control unit is configured to correct the temperature information based on the output of the ADC when the selector has selected the constant voltage (seventh configuration).
[0073] The sensor module, which is the seventh configuration described above, improves the accuracy of temperature information through temperature information correction, and therefore the accuracy of temperature correction in the drive unit and processing unit also improves.
[0074] The vehicle (X) described above has a configuration (8th configuration) that includes a sensor module having one of the configurations described in the 1st to 7th above.
[0075] In a vehicle with the eighth configuration described above, the installed sensor module can easily perform temperature compensation. [Explanation of Symbols]
[0076] 1 Semiconductor device 11 Digital Circuits 11A Storage section 11B Control Unit 11C Communication Department 12 Drive unit 13 Resistors 14 Processing Unit 14A First Processing Unit 14B Second Processing Unit 15A~15C DAC 16 ADC 17 Temperature sensor 18 Constant voltage source 19 Selector 2 sensors 3. Temperature sensor 100, 100A~100D Sensor Modules SW1 Switching section Terminals T11-T19, T21-T24, T101-T104 X Vehicle
Claims
1. Sensors and, A semiconductor device including a drive unit configured to drive the sensor and a processing unit configured to process the output signal of the sensor, A storage unit configured to store the temperature correction settings in a non-volatile manner, A control unit configured to perform temperature correction on the drive unit and the processing unit based on the content of the temperature correction, Equipped with, The control unit is configured to acquire temperature information detected by an internal or external temperature sensor, and to perform temperature correction on the drive unit and the processing unit based on the temperature information and the content of the temperature correction, as a sensor module.
2. The sensor module according to claim 1, further comprising a supply unit configured to supply the output signal of the sensor to the processing unit.
3. The sensor module according to claim 2, further comprising a switching unit configured to switch whether or not to cut off or disable the supply of the output signal of the sensor to the processing unit.
4. The sensor module according to claim 3, wherein the switching unit includes the supply unit.