Copper alloy additive manufacturing structure, and method for manufacturing a copper alloy additive manufacturing structure.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- MITSUBISHI MATERIALS CORP
- Filing Date
- 2026-03-18
- Publication Date
- 2026-06-09
AI Technical Summary
【0021】 本発明によれば、Cu-Cr-Zr系合金からなり、ボイド等の構造欠陥が少なく、かつ、結晶方位の高い配向性を有する銅合金積層造形体を提供することができる。
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Abstract
Claims
1. A copper alloy additively fabricated body made of a Cu-Cr-Zr alloy, The Cu-Cr-Zr alloy has a Cr content in the range of 0.5% by mass or more and 1.5% by mass or less, and a Zr content in the range of 0.02% by mass or more and 0.2% by mass or less. The nitrogen concentration is set to 1 mass ppm or less. The Cu-Cr-Zr alloy contains additive elements other than alloying elements and impurity elements in total amount to 0.04% by mass or less. The density of the molded object is said to be 99.1% or higher. A copper alloy additively manufactured body characterized in that, as a result of measuring the crystal orientation by electron backscatter diffraction in the sample cross-section of the copper alloy additively manufactured body, the area ratio of crystals having a plane orientation of {10¹} ± 15° in the powder stacking direction in the sample cross-section is 50% or more.
2. A copper alloy additively fabricated body made of a Cu-Cr-Zr alloy, The Cu-Cr-Zr alloy has a Cr content in the range of 0.5% by mass or more and 1.5% by mass or less, and a Zr content in the range of 0.02% by mass or more and 0.2% by mass or less. The hydrogen concentration is said to be 3 mass ppm or less. The Cu-Cr-Zr alloy contains additive elements other than alloying elements and impurity elements in total amount to 0.04% by mass or less. The density of the molded object is said to be 99.1% or higher. A copper alloy additively manufactured body characterized in that, as a result of measuring the crystal orientation by electron backscatter diffraction in the sample cross-section of the copper alloy additively manufactured body, the area ratio of crystals having a plane orientation of {10¹} ± 15° in the powder stacking direction in the sample cross-section is 50% or more.
3. The copper alloy additive body according to claim 1 or 2, characterized in that the oxygen concentration is 300 mass ppm or less.
4. The copper alloy additive body according to claim 1 or 2, characterized in that, as a result of measuring the crystal orientation by electron backscatter diffraction in the sample cross-section of the copper alloy additive body, the area ratio of crystals having a plane orientation of {001} ± 15° in a direction parallel to the sample cross-section and perpendicular to the powder layering direction is 66.4% or more in the sample cross-section.
5. The copper alloy additive body according to claim 1 or 2, characterized in that its conductivity is 50% IACS or higher.
6. A powder bed forming step in which a powder bed containing copper alloy powder for metal AM is formed, A process of forming a molding bed by solidifying the copper alloy powder for metal AM at a predetermined position in the powder bed, A method for manufacturing a copper alloy additive body according to claim 1 or 2, comprising having the following characteristics.
7. The method for manufacturing a copper alloy additive body according to claim 6, characterized by having an aging heat treatment step of maintaining the copper alloy additive body in a range of 400°C to 800°C.
8. The method for manufacturing a copper alloy additive body according to claim 6, characterized by having a solution heat treatment step of maintaining the copper alloy additive body in a range of 900°C to 980°C.