resin foam aggregate

Abstract

To provide a technology that enables the effective utilization of scraps of irregularly shaped resin foam insulation and powder generated during the processing of phenolic foam, thereby taking advantage of the inherent low thermal conductivity of phenolic resin foam. [Solution] A resin foam assembly comprising a resealable container and a plurality of resin foams and powders inside the container, wherein the density of the resin foam is 20-70 kg / m³ 3 A resin foam assembly in which the closed-cell ratio of the resin foam is 85% or more, the total mass of the resin foam in the container is M1, and the mass of one resin foam having the same volume as the internal volume of the closed container is M2, the mass ratio (M1 / M2) is 0.30 to 0.90, and when the internal volume of the closed container is V0, the total volume of the resin foam is V1, and the total volume of the powder is V2, (V1+V2) / V0 is 0.9 to 2.0.

Claims

[Claim 1] A resin foam aggregate, The resin foam assembly comprises a container that can be closed, a plurality of resin foams within the container, and a plurality of powders within the container. The density of the aforementioned resin foam is 20 kg / m³ ３ More than 70kg / m ３ The following: The closed-cell ratio of the aforementioned resin foam is 85% or more. When the total mass of the resin foam in the container is M1, and the mass of one piece of resin foam having the same volume as the internal volume of the closed container is M2, the mass ratio (M1 / M2) is 0.30 or more and 0.90 or less. A resin foam assembly in which, when the internal volume of the closed container is V0, the total volume of the resin foam is V1, and the total volume of the powder is V2, (V1 + V2) / V0 is 0.9 or more and 2.0 or less. [Claim 2] 80% by mass or more of the aforementioned resin foam is phenolic resin foam. The density of the phenolic resin foam is 20 kg / m³. ３ More than 70kg / m ３ The following: The closed-cell ratio of the phenolic resin foam is 85% or more. The above M1 is the total mass of the phenolic resin foam in the container, The resin foam assembly according to claim 1, wherein M2 is the mass of one phenolic resin foam having the same volume as the internal volume of the closed container. [Claim 3] The resin foam assembly according to claim 1 or 2, wherein the thermal conductivity of the resin foam assembly at a 23°C environment is 0.030 W / (m·K) or less. [Claim 4] The resin foam assembly according to claim 1 or 2, wherein the powder is a phenolic resin foam powder.

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