resin composition

Abstract

To provide a resin composition that yields a cured product with a low dielectric loss tangent, suppresses an increase in minimum melt viscosity and a decrease in residual solvent content, and exhibits excellent temporary bonding properties. [Solution] A resin composition comprising (A) epoxy resin, (B) active ester curing agent, (C) inorganic filler, and (D-1) ketone organic solvent having a boiling point of 150°C or higher, A resin composition in which the ratio of component (A) to component (B) ([total number of active groups in component (B)] / [total number of epoxy groups in component (A)]) is 0.7 or more and 1.6 or less, the content of component (C) is 65% by mass or more when the nonvolatile components in the resin composition are taken as 100% by mass, the content of component (D-1) is 10% by mass or more and 50% by mass or less when the total organic solvents contained in the resin composition are taken as 100% by mass, and the content of component (D-1) is 1.5% by mass or more and 10% by mass or less when the total components in the resin composition are taken as 100% by mass.

Claims

1. A resin composition comprising (A) epoxy resin, (B) active ester curing agent, (C) inorganic filler, and (D-1) ketone organic solvent having a boiling point of 150°C or higher, The ratio of component (A) to component (B) ([total number of active groups in component (B)] / [total number of epoxy groups in component (A)]) is between 0.7 and 1.

6. (C) The content of component is 65% by mass or more, when the nonvolatile components in the resin composition are taken as 100% by mass. The content of component (D-1) is 10% by mass or more and 50% by mass or less, when the total amount of organic solvent contained in the resin composition is taken as 100% by mass. A resin composition in which the content of component (D-1) is 1.5% by mass or more and 10% by mass or less, when the total content of all components in the resin composition is taken as 100% by mass.

2. Furthermore, the resin composition according to claim 1, further comprising (E) a curing agent other than an active ester-based curing agent.

3. Furthermore, the resin composition according to claim 1, further comprising (I) a radical polymerizable resin.

4. The resin composition according to claim 3, wherein component (I) comprises a maleimide resin.

5. The resin composition according to claim 1, excluding those containing a compound having liquid crystalline properties.

6. The resin composition according to claim 1, excluding those containing a hydrocarbon polymer containing a terpene skeleton.

7. The resin composition according to claim 1, excluding those containing polyimide resin.

8. The resin composition according to claim 1, excluding those containing triphenylimidazole which may have substituents.

9. The resin composition according to claim 2, wherein component (E) contains a carbodiimide-based curing agent.

10. The resin composition according to claim 9, wherein the content of the carbodiimide-based curing agent is 0.1% by mass or more and 5% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass.

11. (D-2-1) Further containing a ketone-based organic solvent with a boiling point of less than 150°C, The resin composition according to claim 1, wherein the mass ratio of component (D-1) to component (D-2-1) (component (D-1) / component (D-2-1)) is 2 or more.

12. (D-2-3) Further comprising an aromatic hydrocarbon organic solvent, The resin composition according to claim 1, wherein the mass ratio of component (D-1) to component (D-2-3) ((D-1) component / (D-2-3) component) is 0.15 or more and 1.5 or less.

13. The resin composition according to claim 1, wherein the total content of organic solvents is 5% by mass or more and 50% by mass or less, when the total content of all components in the resin composition is taken as 100% by mass.

14. The resin composition according to claim 1, wherein the resin composition is applied to a support and dried at 90°C for 2 minutes and 30 seconds, and the resin composition layer, which is 40 μm thick, is left to stand for 3 days in an environment of 25°C and 60% RH, and the minimum melt viscosity of the resin composition layer measured after this is 5000 poise or less.

15. Let X1 (poise) be the melt viscosity of the resin composition layer, which has a thickness of 40 μm, obtained by coating the resin composition onto a support and drying it at 90°C for 2 minutes and 30 seconds. The resin composition according to claim 1, wherein when the resin composition layer is left standing for 3 days in an environment of 25°C and 60% relative humidity, the minimum melt viscosity of the resin composition layer measured after this is X2 (poise), the increase in minimum melt viscosity (X2 - X1) is 2000 poise or less.

16. A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition layer comprising the resin composition according to any one of claims 1 to 15, wherein the residual solvent content of the total organic solvent in the resin composition layer is 5% by mass or less when the total components in the resin composition are considered to be 100% by mass.

17. The resin sheet according to claim 16, wherein the dielectric loss tangent of the cured product obtained by heat-curing the resin composition layer at 190°C for 90 minutes is 0.004 or less.

18. The resin sheet according to claim 16, wherein the minimum melt viscosity of the resin composition layer after being left to stand for 3 days in an environment of 25°C and 60% relative humidity is 5000 poise or less.

19. The resin sheet according to claim 16, wherein, when the amount of residual solvent of the total organic solvent contained in the resin composition layer is taken as 100% by mass, the amount of component (D-1) is 50% by mass or more.

20. A resin sheet comprising a support and a resin composition layer provided on the support, The resin composition layer comprises (A) epoxy resin, (B) active ester-based curing agent, (C) inorganic filler, and (D-1) ketone-based organic solvent with a boiling point of 150°C or higher. The ratio of component (A) to component (B) ([total number of active groups in component (B)] / [total number of epoxy groups in component (A)]) is between 0.7 and 1.

6. (C) The content of component is 65% by mass or more, when the nonvolatile components in the resin composition layer are taken as 100% by mass. The residual solvent content of the total organic solvent in the resin composition layer is 5% by mass or less, when the resin composition layer is considered to be 100% by mass. A resin sheet in which the content of component (D-1) is 50% by mass or more, when the residual amount of the total organic solvent contained in the resin composition layer is taken as 100% by mass.

21. The resin sheet according to claim 20, wherein the minimum melt viscosity of the resin composition layer after being left to stand for 3 days in an environment of 25°C and 60% relative humidity is 5000 poise or less.

22. The resin sheet according to claim 20, wherein the increase in the minimum melt viscosity of the resin composition layer before and after standing for three days in an environment of 25°C and 60% relative humidity is 2000 poise or less.

23. A circuit board comprising an insulating layer formed from a cured product of the resin composition according to any one of claims 1 to 15.

24. A semiconductor device comprising the circuit board described in claim 23.

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