Thermal management system

The thermal management system addresses cooling efficiency issues by dynamically adjusting flow paths and temperatures to maintain efficient cooling and prevent output loss when a switching device is stuck.

JP2026099076APending Publication Date: 2026-06-18TOYOTA JIDOSHA KK

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
TOYOTA JIDOSHA KK
Filing Date
2024-12-06
Publication Date
2026-06-18

AI Technical Summary

Technical Problem

In thermal management systems with fixed five-way valves, cooling efficiency decreases, and reducing heat generation risks a decrease in device output.

Method used

A thermal management system with a control device that switches the flow path state to increase the flow rate of the heat transfer medium when a switching device becomes stuck, forming a connection circuit with a cooling member to enhance cooling efficiency.

Benefits of technology

Efficient cooling of heat-generating components is maintained even when a switching device is stuck, preventing output reduction by optimizing flow rates and temperatures.

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Abstract

The present invention provides a thermal management system that can efficiently cool the heat-generating component using a heat transfer medium when the second switching device becomes stuck. [Solution] The thermal management system 1 comprises a thermal management circuit 100, a PCU 133 that exchanges heat with the heat transfer medium in the unit flow path 130, an LT radiator 122 located in the radiator flow path 122a, a chiller 160 located in the chiller flow path 161a, six-way valves 180 and 190 that can switch the flow path of the heat transfer medium in the thermal management circuit 100, and an ECU 500 that controls each of the six-way valves 180 and 190. If one of the six-way valves 180 and 190 becomes stuck, the ECU 500 controls the other six-way valve 180 and 190 to maximize the flow rate of the heat transfer medium flowing through the unit flow path 130.
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