Interface assembly and method for manufacturing an interface assembly

Abstract

This invention provides an interface assembly and a method for manufacturing an interface assembly that facilitates the creation of interface assemblies that can be adapted to different use cases. [Solution] An interface assembly (100) is disclosed comprising a functional multilayer structure (20) comprising a first substrate (22, 28), a molded material layer (26) on a first side surface of the first substrate, and a sensor configuration (30) comprising at least one sensor (32), wherein the sensor configuration is partially embedded in the molded material layer. The assembly further comprises a movable member (40) movable relative to the functional multilayer structure, the movable member comprising at least one detection portion (42), and the sensor configuration and the detection portion are arranged relative to each other such that the position or change in position of the movable member is detectable by the sensor configuration based on the position or change in position of the detection portion relative to the sensor configuration.

Description

Technical Field

[0001] The present invention generally relates to functional integrated structures such as electronic (multilayer) assemblies and methods for manufacturing the same. In particular, but not limited thereto, the present invention relates to an interface assembly comprising, for example, electronics and a shaped, optionally injection molded, material layer such as a plastic material, and a method for manufacturing the interface assembly.

Background Art

[0002] In connection with electronics and electronic products, there are various stacked assemblies and structures. The motivations behind the integration of electronics and related products can be as diverse as the associated usage contexts. When the resulting solutions ultimately exhibit multi-layeredness, size reduction, weight reduction, cost reduction, or simply efficient integration of components is relatively often required. The associated usage scenarios can then relate to product packages or casings, the visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, labels, and vehicle electronics, among others.

[0003] Electronics such as electronic components (passive or active components), integrated circuits (ICs), and conductors can generally be provided on substrate elements by multiple different technologies. For example, off-the-shelf electronics such as various surface-mount devices (SMDs) can be mounted on substrate surfaces that ultimately form the inner or outer interface layers of a multilayer structure. Furthermore, electronics can be actually fabricated directly and additionally on the relevant substrate by applying technologies that fall under the term "printed electronics." In this context, the term "printed" refers to a variety of printing methods that can fabricate electronic / electrical elements from printed materials through substantially additional printing processes, including but not limited to screen printing, flexographic printing, and inkjet printing. The substrates used are flexible, and the materials printed on may, but not necessarily, be organic.

[0004] Furthermore, the concept of injection-molded structural electronics (IMSE) involves constructing functional devices and their components in the form of multilayer structures, which encloses electronic functions as seamlessly as possible. Another characteristic of IMSE is that electronics are generally manufactured in a true three-dimensional (non-planar) form according to a 3D model of the product, component, or generally the entire design. To achieve the desired 3D layout of electronics on a 3D substrate and in the associated final product, the electronics may still be initially mounted on a planar substrate (e.g., a film) using a two-dimensional (2D) method of electronics assembly, and then the substrate already housing the electronics may be formed into the desired three-dimensional (i.e., 3D) shape and subjected to overmolding. This may be done, for example, with a suitable plastic material that covers and embeds the underlying elements (e.g., electronics), and thus protects and potentially conceals the elements from the environment.

[0005] In a typical solution, electrical circuits are fabricated on a printed circuit board (PCB) or substrate film, and then they are overmolded with plastic material. However, known structures and methods still have several drawbacks depending on the associated use scenario. To fabricate an electronic assembly having one or more functions, typically, fairly complex electrical circuits to achieve these functions must be fabricated on a substrate by printing and / or utilizing SMDs, and then overmolded with plastic material. Thus, both the direct provision of functional or specifically electrical elements such as related components on a larger host substrate, and the preparation of a collective subassembly for subsequent mounting, have their own drawbacks, for example, in terms of electronics fragility, structural and installation complexity, and thermal management, and consequently, there remains room for improvement in terms of associated improved or alternative manufacturing techniques and the resulting final structures.

[0006] Particularly problematic are structures with moving elements, such as interface devices. For example, overmolding a knob, button, or other (user) interface element renders it unusable because the molding material eventually solidifies and fixes the interface element in place. On the other hand, it is desirable to use IMSE structures to provide an interface for the user to control the entire structure and / or host device. These are often implemented by passive sensing elements, such as those based on capacitive sensing, in which case the sensing element does not need to move during use. However, it is often advantageous to provide feedback to the user in the form of feeling the movement when touching and operating interface elements such as buttons. Therefore, the development of structures and methods related to both IMSE technology and integrated electronics in general, as well as the interface assemblies used therein, remains necessary. [Overview of the project] [Problems that the invention aims to solve]

[0007] An object of the present invention is to mitigate at least one of the aforementioned drawbacks associated with known solutions in the context of integrated structures that include functional elements such as electronics and utilize molded or cast material layers or structures. Another object is to provide an interface durable assembly having a high level of integration and adaptable to different use cases, and a method for facilitating its efficient manufacture. [Means for solving the problem]

[0008] The object of the present invention is achieved by an interface assembly and a method for manufacturing the interface assembly, as defined by each independent claim.

[0009] According to a first embodiment, an interface assembly is provided. The interface assembly comprises a functional multilayer structure and a movable member that is movable relative to the functional multilayer structure.

[0010] The functional multilayer structure comprises a first substrate, a molded material layer on a first side surface of the first substrate, and a sensor configuration comprising at least one sensor, the sensor configuration being arranged at least partially embedded in the molded material layer.

[0011] The movable member has at least one detection part, but in many cases there are multiple such parts.

[0012] Furthermore, the sensor configuration and at least one detection portion (or more portions) are arranged relative to each other such that the position or change in position of the movable member (e.g., optionally, velocity, acceleration, jerk, and the direction of velocity, acceleration, and jerk) can be detected by the sensor configuration based on the position or change in position of at least one detection portion relative to the sensor configuration.

[0013] In some embodiments, the movable member and the functional multilayer structure may be movably mounted to each other. Therefore, the movable member and the functional multilayer structure may preferably not be completely separate and freely movable relative to each other, but there may be at least some mounting mechanism, such as a force, element, and / or structure, that prevents them from completely detaching from each other, or at least resists them from detaching, when they are mounted to each other by the mounting mechanism. Often, the mounting mechanism may restrict, but not necessarily completely, the movement of the movable member relative to the functional multilayer structure in one, more, or all directions, or the rotation of the member about an axis of rotation, but it may not necessarily be required to completely prevent this, and may at least resist movement in the aforementioned directions. The mounting mechanism may be arranged so that the movable member can move without resistance or restriction by the mounting mechanism within some limitations in one or more directions, but beyond these limitations, the mounting mechanism may resist or even prevent movement by mechanically blocking it.

[0014] In some embodiments, the movable mounting includes a magnetic mounting configuration comprising a first mounting portion on a functional multilayer structure and a second mounting portion on a movable member, wherein the magnetic mounting configuration is arranged to exert an attractive magnetic force between the first and second mounting portions. This can be considered a mounting mechanism that resists detachment.

[0015] Alternatively or additionally, the movable mounting may include a mechanical mounting configuration configured to prevent, or at least prevent, or resist, the detachment of the movable member from the functional multilayer structure. For example, the mechanical mounting configuration may include a frame adapted to at least partially confine the movable member between the frame and the functional multilayer structure so that the movable member is movable within the space between the frame and the functional multilayer structure.

[0016] In various embodiments, the functional multilayer structure may include grooves, holes, or through-holes, and a portion of a movable member having at least one sensing portion may be adapted to extend into a groove, hole, or through-hole and configured to be movable within the groove, hole, or through-hole. Furthermore, optionally, the interface assembly may include a shape interlock configuration between the portion of the groove, hole, or through-hole and the movable member to prevent, or at least prevent or resist, the detachment of the movable member from the functional multilayer structure. The grooves or holes may, for example, define a concave shape in the multilayer structure.

[0017] In some embodiments, the movable member may be able to move within grooves, holes, or through-holes in any way within a functional multilayer structure, in a translational manner such as linear or nonlinear.

[0018] Alternatively or additionally, the movable member may optionally be rotatably movable within grooves, holes, or through-holes in a functional multilayer structure.

[0019] In some embodiments, the functional multilayer structure may have projections, pins, or other shapes extending outward from the surface of the multilayer structure, and the movable member may be movable relative to the projections, pins, or other shapes, such as being rotatable around them. The projections, pins, or other shapes may define, for example, a convex shape or a dome shape within the multilayer structure.

[0020] Furthermore, at least one sensor may be at least one optical sensor configured to transmit an optical detection signal for detecting the position or change in position of at least one detection portion.

[0021] In some embodiments, at least one detection unit may include one or more magnets and / or ferromagnetic elements, and the sensor configuration includes a magnetometer or Hall effect sensor, which includes coils, etc., for detecting the position or change in position of one or more magnets.

[0022] Alternatively or additionally, the sensor configuration may include a capacitive sensing element for detecting the position or change in position of at least one detection portion.

[0023] In some embodiments, the rotational movement of the movable member may be detected by a magnetometer or a Hall effect sensor, and its linear movement may be detected by a capacitive sensing element, or vice versa.

[0024] Furthermore, the movable member may be mechanically coupled to the functional multilayer structure via a spring. In some embodiments, the central portion of the spring may include a through hole through which the movable member extends toward the functional multilayer structure. Instead of or in addition to the through hole, the spring may have the shape of a segmented dome, and when the spring is not fully compressed, the edge portion or edge portions of the segmented dome contact one of the functional multilayer structure and the movable member, and the central portion of the segmented dome is spaced apart from the other of the functional multilayer structure and the movable member.

[0025] In some embodiments, the spring may be a planar spring such as an orthogonal planar spring. Optionally, the spring may be a plastic material such as a thermoformable plastic film.

[0026] In various embodiments, the movable member may be attached and configured to move in a hinged manner with respect to the functional multilayer structure. For example, the movable member may be attached to the functional multilayer structure by a hinge mechanism from one of its ends.

[0027] The sensor configuration may include a plurality of sensors including at least two different types of sensors for detecting the position or change in position of at least one detection portion, and the types of sensors are selected from the group consisting of optical, capacitive, inductive, resistive, magnetic, galvanic, acoustic, or combinations thereof.

[0028] In various embodiments, the interface assembly may include a second substrate on the opposite side of the molding material layer with respect to the first substrate.

[0029] The sensor configuration may be provided on the surface of the first substrate and / or the second substrate.

[0030] One or both of the first substrate or the second substrate may be a thermoformable substrate film, and optionally, at least locally, has a non-planar three-dimensional shape.

[0031] According to a second aspect, a method for manufacturing an interface assembly is provided. The method includes obtaining or fabricating a first substrate such as a thermoformable substrate film, and obtaining at least one sensor configured to detect the position or change in position of at least one detection portion. The method further includes molding a molding material on one side of the first substrate to at least partially embed a sensor configuration including the at least one sensor in the molding material layer, thereby obtaining a functional multi-layer structure. The method also includes obtaining or fabricating a movable member including at least one detection portion, and arranging the sensor configuration and the at least one detection portion relative to each other such that the position or change in position of the movable member can be detected by the sensor configuration based on the position or change in position of the at least one detection portion with respect to the sensor configuration.

[0032] In various embodiments, the method includes thermoforming the first substrate to have at least a portion having a non-planar three-dimensional shape prior to molding. In some embodiments, thermoforming may include stretching the first substrate at least locally under high pressure to create a non-planar three-dimensional shape.

[0033] Furthermore, the method may include providing grooves, holes, through-holes extending outward from the surface of the functional multi-layer structure; or protrusions, pins or other shapes during thermoforming.

[0034] Furthermore, the method may additionally or alternatively include mounting the movable member and the functional multilayer structure so that they are movable relative to each other.

[0035] This invention provides an interface assembly and a method for manufacturing an interface assembly. The invention offers advantages over known solutions in that it allows for the creation of a robust interface assembly that provides tactile feedback to the user when a movable member, such as a button or switch, moves. Furthermore, by embedding the sensor configuration in a material layer provided by molding, such as injection molding, the interface assembly can be made durable not only for the movable member but also for the functional multilayer structure. As a result, the structure becomes structurally durable, simple, material-efficient, and functionally robust and stable. In various embodiments, the movable member can be made substantially passive, resulting in a highly robust and durable device.

[0036] Based on the following detailed explanation, various other advantages will become apparent to those skilled in the art.

[0037] In this specification, the expression "several" may mean any positive integer starting from 1, i.e., one, at least one, or more.

[0038] The expression "multiple" can refer to any positive integers starting from 2, that is, two, at least two, or more than two integers.

[0039] Terms such as "first," "second," etc., are used in this specification to distinguish one element from another, and do not imply any special priority or ordering of them unless otherwise expressly stated.

[0040] The typical embodiments of the invention presented herein should not be construed as limiting the applicability of the appended claims. The verbs “equipment / include” are used herein as open limitations that do not exclude the existence of unenumerated features. Features enumerated in dependent claims may be freely combined with each other unless otherwise explicitly stated.

[0041] Novel features that are considered to be characteristics of the present invention are described in particular in the appended claims. However, the present invention itself, with respect to both its structure and how it operates, as well as its further objectives and advantages, is best understood when the following description of specific embodiments is read in conjunction with the accompanying drawings.

[0042] Next, the present invention will be described in more detail with reference to exemplary embodiments shown in the accompanying drawings. [Brief explanation of the drawing]

[0043] [Figure 1] The interface assembly is shown. [Figure 2] The interface assembly is shown. [Figure 3] The interface assembly is shown. [Figure 4] This shows an interface assembly with a mounting mechanism. [Figure 5] This shows an interface assembly with a mounting mechanism. [Figure 6] This shows an interface assembly with a mounting mechanism. [Figure 7] The interface assembly is shown. [Figure 8A] The interface assembly is shown. [Figure 8B] The interface assembly is shown. [Figure 8C] The interface assembly is shown. [Figure 9] The interface assembly is shown. [Figure 10]The interface assembly is shown. [Figure 11A] The interface assembly is shown. [Figure 11B] The interface assembly is shown. [Figure 11C] The interface assembly is shown. [Figure 12A] The interface assembly is shown. [Figure 12B] The interface assembly is shown. [Figure 13] This shows a spring with a segmented dome shape. [Figure 14A] The interface assembly is shown. [Figure 14B] The interface assembly is shown. [Figure 14C] The interface assembly is shown. [Figure 15A] The interface assembly is shown. [Figure 15B] The interface assembly is shown. [Figure 16A] The interface assembly is shown. [Figure 16B] The interface assembly is shown. [Figure 17A] This shows the interface assembly for the host structure. [Figure 17B] This shows the interface assembly for the host structure. [Figure 17C] The interface assembly and steering wheel of the host structure are shown. [Figure 18A] The interface assembly is shown. [Figure 18B] The interface assembly is shown. [Figure 19A] This document outlines several method steps for manufacturing an interface assembly. [Figure 19B] This document outlines several method steps for manufacturing an interface assembly. [Figure 19C]This document outlines several method steps for manufacturing an interface assembly. [Figure 19D] This document outlines several method steps for manufacturing an interface assembly. [Figure 20] This shows a flowchart of the manufacturing method for the interface assembly. [Modes for carrying out the invention]

[0044] In each drawing, the same or corresponding parts are represented by the same reference number, and in most cases, the accompanying textual description is also omitted.

[0045] Interface assemblies are provided according to numerous embodiments described herein. The interface assembly comprises a functional multilayer structure. The functional multilayer structure comprises a first substrate, such as a substrate film (e.g., of plastic), a molded material layer on a first side surface of the first substrate, and a sensor configuration comprising at least one sensor, the sensor configuration being at least partially embedded in the molded material layer. Furthermore, preferably, the interface assembly comprises a movable member that is movable relative to the functional multilayer structure, the movable member comprising at least one sensing portion. The sensor configuration and the at least one sensing portion are at least configurable such that the position or change in position of the movable member is detectable by the sensor configuration based on the position or change in position of the at least one sensing portion relative to the sensor configuration.

[0046] The substrate, such as a base film, may preferably be a thermoformable material, but it is not necessarily required. If the substrate is a thermoformable material, it can be thermoformed into a shape different from its original shape. For example, a planar substrate or base film (even if it is flexible and on a roll, but is unwound from the roll to define a film piece having a planar or "two-dimensional" shape, it is still considered planar). Thus, the substrate can be thermoformed into a shape other than a planar shape, for example, by forming at least one locally defined shape having all three dimensions.

[0047] Thermoforming can be carried out at least under elevator pressure, and optionally at elevator temperature, and can be performed on the substrate before or after the application of conductive traces to the substrate. The temperature should be such that the substrate (film) is heated to a temperature at which it can be molded without melting, softening, or breaking the substrate. For example, in the case of plastic materials, this may be called the glass transition temperature.

[0048] Alternatively or additionally, thermoforming may be performed before, or preferably after, providing any part of the sensor configuration and / or electronic components onto the substrate. Thus, the substrate may be thermoformed, for example, after the conductive traces are provided but before the sensor components and / or electronic components are provided on the substrate. In other examples, the substrate may be thermoformed before providing the traces, sensors, and electronic components. Alternatively, the substrate may be thermoformed after providing the traces, sensors, and electronic components.

[0049] As used herein, thermoforming of a substrate typically refers to a technique for shaping an existing substrate, which has significantly larger dimensions in at least two transverse directions perpendicular to the thickness direction of the substrate, from one shape to another, at least locally. Therefore, thermoforming of a substrate as used herein does not mean producing a substrate (planar or non-planar) from a liquid or liquid material and feeding it into a mold and waiting for it to solidify, as is done in casting or molding.

[0050] In various embodiments, the molded material layer may be formed by injection molding or other means on the first side surface of the substrate after providing (if any) conductive traces and sensor configurations (at least one sensor) on the substrate, thereby embedding or covering them at least partially in the molded material layer. Thermoforming is preferably performed before or simultaneously with the provisioning of the molded material layer. Naturally, after the sensors are attached, the substrate may be post-treated, if any, by cutting, drilling, polishing, varnishing, etc.

[0051] In various embodiments, the substrate(s) may be a substrate film of a flexible, 3D-molded (3D-formable) material, such as a thermoformable (plastic) material. As will be readily apparent to those skilled in the art, instead of a single, optionally monolithic film, the substrate film may be a multilayer and / or multi-sectioned configuration having, for example, different layers at least in some places. The structure may further have substrate(s) (films).

[0052] The base film and / or further base film(s) or generally material layer(s) included in the multilayer structure may contain at least one material selected from the group consisting of polymers, thermoplastics, electrical insulating materials, polymethyl methacrylate (PMMA), polycarbonate (PC), flame retardant (FR) PC film, FR700 type PC, copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural fiber or fabric materials, naturally grown materials, cotton, wool, linen, silk, and any combination thereof.

[0053] The thickness of the base film and optionally any further films or layers may vary depending on the embodiment. It may be, for example, only tens or hundreds of millimeters, or it may be considerably thicker, one or several millimeters in size.

[0054] The thickness of the molded material layer can also be selected as needed, but thicknesses of several millimeters (e.g., about 3-5 millimeters) can be applied. In some embodiments, a thickness of only about 2 millimeters may be sufficient, if not optimal, while in some other embodiments, the thickness may be considerably greater, for example, at least about 1 cm in some places. The thickness can actually vary locally. In addition to accommodating various elements (e.g., electronic or optical elements), the molded material layer may optionally include recesses or internal cavities for purposes such as optical guidance, processing, and / or thermal management.

[0055] Figure 1 schematically shows an interface assembly 100 according to several embodiments. As can be seen, the assembly 100 comprises a functional multilayer structure 20. The functional multilayer structure 20 comprises at least one substrate 22, 28, such as a base film, and is optionally flexible and / or thermoformable. Furthermore, the assembly 100 comprises a sensor configuration 30 comprising at least one sensor 32, the sensor configuration 30 being at least partially embedded in a molded material layer 26, such as an injection-molded plastic material layer. Furthermore, the interface assembly 100 may also comprise a movable member 40 that is movable relative to the functional multilayer structure 20, the movable member 40 comprising at least one detection portion 42. The movable member 40 may preferably comprise a body 41 or a frame portion 41.

[0056] As shown by the solid arrows in Figure 1, the movable member 40 may be movable relative to the functional multilayer structure 20 in a translational manner, such as linearly or nonlinearly. The multilayer structure 20 may optionally be configured to include grooves, holes, or through-holes, etc., which are adapted to allow the movable member 40 or at least its sensing portion 42 to move. Alternatively, the multilayer structure 20 may optionally include projections, pins, or other shapes extending outward from the surface of the multilayer structure 20. The movable member 40 may then include grooves, holes, or through-holes, etc., into which the projections, pins, or other shapes can extend.

[0057] Alternatively or additionally, the movable member 40 may be rotatably movable relative to the functional multilayer structure 20. One option is shown in Figure 1, namely, the axis of rotation is substantially perpendicular to the lateral direction of the functional multilayer structure 20. The movement may also occur around grooves, holes, through-holes, or projections, pins, or other shapes extending outward from the surface of the multilayer structure of the functional multilayer structure 20.

[0058] With respect to the sensor configuration 30, the sensor(s) 32 may be placed on the (surface) of at least one substrate 22, 28, but is not necessarily required. The sensor(s) 32 may also be placed within the molding material layer 26, or at least at least one substrate 22, 28, at a distance from it. In some embodiments, in addition to at least one (or more) sensor(s) 32, the configuration 30 may include a body or frame, for example not shown in Figures 1-3, in which the sensor(s) 32 are located internally.

[0059] Furthermore, in some embodiments in which the configuration 30 includes multiple sensors 32, some of the sensors 32 may be located on the (surface) of at least one substrate 22, 28, while some of the sensors 32 may be located at a distance from at least one substrate 22, 28. In some cases, some of the sensors 32 may even be located completely outside the molding material layer 26. In one embodiment, one sensor 32 may be on one substrate 22, while another sensor may be on another substrate 28, preferably located on both sides of the molding material layer 26.

[0060] Furthermore, in various embodiments, the movable member 40 and the functional multilayer structure 20 may be movably attached to each other. This is schematically represented in Figure 1 by long double-headed vertical arrows extending through the substrates 22 and 28 above the molded material layer 26, which are depicted as dashed lines.

[0061] Therefore, the movable member 40 and the functional multilayer structure 20 are preferably not completely separate and able to move freely relative to each other without restriction, and there may be at least some mounting mechanism, such as a force, element, and / or structure, that prevents or at least resists the two from completely detaching from each other when they are attached to each other by the mounting mechanism. Often the mounting mechanism may restrict or at least resist movement of the movable member 40 in one direction, several directions, or all directions relative to the functional multilayer structure 20. The movement between the two entities may be relatively free, for example, within a range of 0 to 10 centimeters, but this varies depending on the embodiment. The mounting mechanism may be arranged so that the movable member 40 can move without resistance or restriction by the mounting mechanism within some limitations in one or more directions, but beyond these limitations, the mounting mechanism will also prevent movement by resisting or mechanically blocking it.

[0062] Figure 1 also shows any other electronic components 102, such as surface mount devices (SMDs), and printed conductive traces 101, which may be included in one or more electrical circuits of the assembly 100 or one or more electrical circuits of the host structure of the assembly 100.

[0063] Figure 2 shows interface assemblies 100 according to several embodiments. In Figure 2, the movable member 40, such as a slider or sliding member, is arranged to translate horizontally or parallel to the lateral direction of the functional multilayer structure 20, or perpendicular to the thickness direction of the functional multilayer structure 20. As can be seen further, the sensor configuration 30 may have multiple sensors 32A, 32B. The movable member 40 may preferably include a body 41 or a frame portion 41.

[0064] Furthermore, as shown in Figure 2, but also as this applies to Figures 1 and 3, for example, the sensor configuration 100 may include sensors of the same type or at least two different types of sensors 32, 32A, 32B, 33 for detecting the position or change in position of at least one sensing part 42, 44. In Figure 2, sensors 32A, 32B are preferably optical sensors, but may also be sensors that measure a magnetic field or a change thereof, for example. Furthermore, there may be a second sensor 33, in this case a capacitive sensor. The types of sensors 32, 32A, 32B, 33 may be selected from the group consisting of optical, capacitive, inductive, resistive, magnetic, galvanic, acoustic, or combinations thereof. Furthermore, as recognized, the movable member 40, and in particular at least one or two sensing parts 42, 44, include parts corresponding to the types of sensors 32, 32A, 32B, 33.

[0065] For example, an optical sensor comprising a transmitting and receiving portion may operate such that the optical signal is interrupted or passes through the movable member 40 when the movable member 40 is moved. The assembly 100 may also have additional magnetic or capacitive sensors, corresponding sensing portions 42, 44. Thus, the detection of the position or change of the movable member 40 can be performed more reliably by using different techniques, such as those based on optical and capacitive sensing.

[0066] In preferred embodiments, the detection portions 42 and 44 within the movable member 40 correspond to sensors 32, 32A, 32B, and 33 (as described above) by their operating characteristics and are passive in the sense that they do not require additional power or control signals. Furthermore, in these embodiments, the sensors 32, 32A, 32B, and 33 are provided with the necessary power, control circuits, and connections, such as being mounted on substrates 22 and 28.

[0067] Figure 3 shows interface assemblies 100 according to several embodiments. In Figure 3, the movable member 40 is positioned to move rotatably within a groove, hole, or through-hole, at least relative to the functional multilayer structure. Alternatively, there may be projections, pins, or other shapes extending outward from the surface of the multilayer structure 20, around which the movable member 40 rotates.

[0068] Alternatively or additionally, the movable member 40 may move translationally, in this case perpendicular or parallel to the thickness direction of the functional multilayer structure 20. As can be seen further here, the sensor configuration 30 may have multiple sensors 32A, 32B. The movable member 40 may preferably include a body 41 or a frame portion 41.

[0069] Furthermore, the movable member 40 can be positioned to move in the thickness direction of the functional multilayer structure 20, that is, to act substantially as a push button. In these cases, the movable member 40 does not have to rotate at all, nor does it have to translate.

[0070] Figure 3 shows that at least a portion of the movable member 40 may be positioned to extend into, penetrate through, or protrude into the base materials 22, 28, such as in grooves, holes, or through-holes in the base materials 22, 28.

[0071] Figure 3 also shows that the detection portion 42 may preferably be located on a portion of the movable member 40 that extends into, penetrates, or protrudes from the base materials 22, 28. However, as shown in Figure 2, the detection portion 42 may preferably be positioned to function with the sensor configuration 30 such that the movable member 40 is detectable by the sensor configuration 30 based on the position or change in position of at least one detection portion 42 relative to the sensor configuration 30.

[0072] Alternatively, the detection portion 42 may be positioned in a portion of the movable member 40 that does not extend into, penetrate, or protrude into the base materials 22, 28. This option is also shown in Figure 3.

[0073] As intended above, Figures 1-3 also illustrate the detection portion 42 of the movable member 40. The detection portion 42 may simply be a part of the movable member 40, for example, a part of its body. For example, if the movable member 40 is made of a plastic material, the detection portion 42 may be a part of the movable member 40 adapted to be present and / or move so that the sensor configuration 100 can detect its position or change. In some embodiments, the detection portion 42 may be made of a material that reflects or absorbs light, and / or a transparent, translucent, or opaque material. In some other embodiments, the detection portion 42 may be made of a conductive material and / or a ferromagnetic material. The detection portion 42 may comprise, for example, a permanent magnet or a plurality of permanent magnets. Alternatively, in some embodiments, the detection portion 42 may be an electromagnet or light-emitting and / or detection device, and / or a sensing coil or electrode connected to a processing unit and / or power supply unit, etc. Therefore, the detection portion 42 may include at least an active component, in which case the movable member 40 also preferably includes means for operating and / or controlling the active component.

[0074] With respect to the sensor configuration 30, at least one sensor 42 may be at least one optical sensor 32A arranged to transmit an optical detection signal for detecting the position or change in position of at least one detection portion 42.

[0075] Alternatively, at least one sensor 32 may be one or more magnets and / or ferromagnetic elements, and the sensor configuration 30 may include a magnetometer or Hall effect sensor, such as one with a coil, for detecting the position or change in position of one or more magnets.

[0076] Alternatively or additionally, the sensor configuration 30 may include a capacitive sensing element as a sensor 32 for detecting the position or change in position of at least one sensing portion 42. In such an embodiment, the sensing portion 42 may or may not include another capacitive element. Alternatively, the movable member 40 may be such that it affects the field being measured or monitored by the sensor configuration 30.

[0077] Figure 4 shows an interface assembly 100 with a mounting mechanism 60. In Figure 4, the movable member 40 and the functional multilayer structure 20 may be the same as or identical to those shown in and described in connection with Figure 2, for example, but the following also applies to various other embodiments, such as those in Figure 3 or similar. Figure 4 shows an example of the mounting mechanism 60. As previously mentioned, the mounting mechanism 60 is preferably arranged to provide a movable attachment of the movable member 40 to the functional multilayer structure 20.

[0078] Figure 4 shows that the mounting mechanism 60 is a mechanical mounting configuration comprising a frame 61 adapted to at least partially confine the movable member 40 between the frame 61 and the functional multilayer structure 20 so that the movable member 40 is movable within the space between the frame 61 and the functional multilayer structure 20. As can be seen, the frame 61 may be placed on the substrates 22, 28 or directly on the molded material layer 26. The frame 61 is preferably at least detachably attached to the multilayer structure 20. Alternatively or additionally, the mounting mechanism 60 may include grooves, holes or through-holes in the functional multilayer structure 20 into which the movable member 40 extends at least partially, or even completely fits. As can be understood, the shape, size, material(s) used, etc. of the frame 61 may vary between embodiments. The most important aspect of the mechanical mounting configuration is to prevent, or at least hinder, or resist, detachment of the movable member 40 from the functional multilayer structure 20.

[0079] Figure 5 shows an interface assembly 100 with another mounting mechanism 60. In this case as well, the movable member 40 and the functional multilayer structure 20 may be the same as, or identical to, those illustrated and described in relation to, Figure 2, for example, but the following also applies to various other embodiments, such as those in Figure 3 or similar. In Figure 5, the movable mounting includes a magnetic mounting configuration comprising a first mounting portion 62 on the functional multilayer structure 20 and a second mounting portion 63 on the movable member 40, the magnetic mounting configuration being arranged to exert an attractive magnetic force between the first mounting portion 62 and the second mounting portion 63.

[0080] In some embodiments, the interface assembly 100 may include one or more mechanical mounting configurations and one or more magnetic mounting configurations.

[0081] Figure 6 shows an interface assembly 100 with yet another mounting mechanism 60. The assembly 100 may include a shape interlock configuration between a part of the functional multilayer structure 20 and the movable member 40, such as a groove, hole, or through-hole, to prevent or at least prevent the movable member 40 from detaching from the functional multilayer structure 20.

[0082] In Figure 6, the functional multilayer structure 20, i.e., the wall surface of the through-hole, has projecting elements 65, and recesses 64 corresponding to the portion of the movable member 40 that extends into the through-hole. Naturally, the reverse is also possible, such as the movable member 40 having projecting elements 65 within itself. Therefore, the movable member 40 can be placed inside the through-hole, and for example, by pushing hard enough, the projections 65 slide into the recesses 64, thereby locking the movable member 40 movably relative to the multilayer structure 20. As can be understood, the interlock shape / joint must be such that it allows the movement of the movable member 40. In Figure 6, rotational movement of the movable member 40 is clearly possible, but movement away from or toward the structure 20 is limited unless a considerable force is applied.

[0083] Furthermore, in various embodiments, any of the mounting configurations shown in and described in relation to Figures 4 to 6 may be used, or any combination thereof. Mechanical, magnetic, and interlocking shapes / joints may differ in shape, size, and associated materials. In addition, the multilayer structure 100 may have grooves, recesses, protrusions, holes, and through-holes, or the mounting configurations may be completely separate, such as a frame positioned on at least a portion of the movable member 40 after the movable member 40 is positioned to be movably operated in connection with the structure 20.

[0084] Figure 7 shows another interface assembly 100. In Figure 7, the movable member 40 may be arranged to move in a rotational and / or vertical direction. In this case, as already described herein, the sensor configuration 100 comprising at least one sensor 32, for example, a rotary switch or microswitch, further comprises a body 34 or frame 34 that defines a cavity containing a space or volume in which the sensor 32 is located. The body 34 may be, for example, a substrate (material) such as a piece of printed circuit board (PCB).

[0085] As shown by the horizontal dashed line in Figure 7, the body 34 may be a single piece body 34, such as a U-shaped PCB piece in which the cavity is formed by carving, drilling, or milling the PCB piece. Alternatively, the body 34 may be made up of multiple pieces having a horizontal or laterally extending portion to receive the sensor 32, as shown in Figure 7, and then a vertically extending portion extending from the first substrate 22 or the laterally extending portion to the second substrate 28, thereby having side walls (such as PCB or plastic material) that surround the sensor 32 so as not to be overmolded into the molding material layer 26. In some embodiments, the side walls may be circular or ring-shaped to surround the sensor 32. Thus, the sensor configuration 100 will be at least partially embedded in the molding material layer 26 when the molding material surrounds and contacts the body 34 opposite to the cavity, provided that the molding material layer 26 is provided on the first side surface of the first substrates 22, 28.

[0086] In embodiments where the body 34, for example, at least its horizontally or laterally extending portion is a PCB or similar substrate, the body 34 may be used to provide an electrical connection to the sensor 32. The body 34 may also include connection portions 39 for providing an electrical connection to the sensor configuration 100 from outside the sensor configuration 100, such as the first substrate 22. The connection portions 39 may be on the opposite side of the horizontally or laterally extending portion from the sensor 32 and / or the molding material layer 26, or on the side or sidewall(s) of the horizontally or laterally extending portion. Figure 7 shows an example where the connection portions 39 are located on the side of the horizontally or laterally extending portion. The connection portions 39 may be, for example, half-cut castrated holes or plated semi-holes. Thus, the electrical connection may be provided from the conductive trace 24 to the connection portions 39 by, for example, using solder material. Figure 7 further shows an adhesive 29, such as an electrically insulating structural adhesive, provided for attaching the body 34 to the first substrate 22.

[0087] Figures 8A–8C show an interface assembly 100 that includes mechanical buttons, etc., which are movable toward and away from the functional multilayer structure 20. Figure 8C is a perspective view of the interface assembly 100 from the side, showing at least a portion of the movable member 40. Figure 8C also shows cross-sections of AA and BB. Figure 8A shows the cross-section of AA, and Figure 5B shows the cross-section of BB. These are shown as perpendicular to each other, but are not necessarily so.

[0088] Figure 8A shows that at least one sensor 32 is embedded and positioned in the molded material layer 26. The sensor 32 may be, for example, a Hall sensor, a reed switch, or a sensing coil for sensing changes in the magnetic field. Thus, when the movable member 40 is pushed toward the multilayer structure 20, the sensor 32 detects a change in the magnetic field. The same applies when the movable member 40 is moved away from the structure 20. Therefore, the sensing portion 42 is preferably a permanent magnet or a plurality of permanent magnets.

[0089] Figure 8B, showing cross-section BB at a different location from cross-section AA, also shows a first permanent magnet 51 provided on the movable member 40. The first permanent magnet 51 is positioned to interact with a second permanent magnet 52 within the functional multilayer structure 20. The first permanent magnet 51 and the second permanent magnet 52 are positioned so that a repulsive force is generated between them. That is, when the movable member 40 is pushed down and released, the repulsive force between the first permanent magnet 51 and the second permanent magnet 52 causes the movable member 40 to move away from the structure 20. In a preferred embodiment, the magnets of the detection portion 42 and the magnets of the first permanent magnet 51 may be the same, or they may be arranged alternately or in other patterns around the vertical central axis of the movable member 40, for example. On the other hand, while the first permanent magnet 51 is in the state shown in Figure 8B, the detection portion 42 may be in a portion that extends into a hole in the structure 20, if any.

[0090] Figure 9 shows the interface assembly 100. The movable member 40, or “slider,” in Figure 9 is equipped with a permanent magnet as the sensing portion 42. Furthermore, the functional multilayer structure 20 includes a coil assembly, and the sensor 32 is a coil, which is included in the coil assembly. Furthermore, the coil assembly may be equipped with a magnetic core 35 around the coil around which it is wound, for example, around its teeth. The coil can further be connected to a sensing unit (not shown), for example, which includes a sensing circuit and a processing unit.

[0091] In addition to measuring the position or changes in the position of the movable member 40, a coil may also be used to vibrate the movable member 40. This may be done by injecting an appropriate current pattern into the coil to generate a preferably changing magnetic field, which vibrates the movable member 40 when this magnetic field interacts with the magnet of the movable member 40. In this way, tactile feedback such as vibrational tactile feedback may be generated by the interface assembly 100.

[0092] Figure 10 shows the interface assembly 100. The operating principle is generally the same as in the embodiment shown in Figure 9, but the coil is provided on a substrate such as a multilayer PCB. Therefore, the coil may be provided using etching. In some other embodiments, the conductive traces forming the coil on the substrate such as a multilayer substrate may be printed by printed electronics technology. Examples of such technology include screen printing, flexographic printing, inkjet printing, or 3D printing, which are substantially additional printing processes (compared to etching, for example).

[0093] In various embodiments, electrically and / or thermally conductive elements (such as traces, pads, connectors, electrodes, etc.) may include at least one material selected from the group consisting of conductive inks, conductive nanoparticle inks, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesives, carbon fiber, graphene, alloys, silver alloys, zinc, brass, titanium, solder, and any of these components. The conductive material used may be optically opaque, translucent, and / or transparent at a desired wavelength (e.g., at least a portion of the visible light) to, for example, mask, reflect, absorb, or pass through radiation (e.g., visible light). As a practical example of a feasible conductive material, for example, Dupont® ME602 or ME603 conductive inks may be used.

[0094] Figures 11A to 11C show the interface assembly 100. Figure 11A is a cross-sectional view of the interface assembly 100 from the side, Figure 11B is a perspective view, and Figure 11C is a view from above, that is, from the side of the assembly 100 where the movable member 40 is located.

[0095] The movable member 40 in Figures 11A to 11C is a rotatable movable member 40. In this case, it is movably mounted to the functional multilayer structure 20 by a mounting mechanism 60, i.e., by a mechanical mounting configuration comprising a rotating shaft or shaft. Figure 11A shows that in this case, the mounting mechanism 60 restricts lateral and upward movement by a flange at the upper end of the rotating shaft or shaft.

[0096] The mounting mechanism 60 may be a separate shaft attached to the surface of the structure 20. Alternatively, the mounting mechanism may be at least partially an integrated part of the structure 20, such as the base material 22, 28 or its molded material layer 26. Thus, the mounting mechanism 60 may be a projection, a pin, or other shape extending outward from the structure 20. The movable member 40 may be arranged to move, for example, by rotating around the projection, pin, or the other shape.

[0097] Alternatively or additionally, as shown in Figure 11A, the movable member 40 may be movable in the vertical direction of the figure (in the thickness direction of the structure 20 or in the direction of the surface normal of the structure 20) and / or horizontal direction (in the transverse direction of the structure 20), as described above in relation to other figures.

[0098] Figure 11B shows that the main body 41 of the movable member 40 is U-shaped in this case, but other shapes are also possible. There are multiple detection parts 42, which are magnetic pieces such as permanent magnets or ferromagnetic materials, arranged around the axis of rotation or shaft. In this case, the magnets are located on the outer circumference of the main body 41, but they can also be located closer to the axis of rotation or shaft. The detection parts 42 may be made of magnetic materials such as ferromagnetic materials, either as an alternative or additional method. For example, the detection parts 42 may be made of a material such as iron or an iron alloy that has magnetic properties detectable by a magnetometer or the like.

[0099] Furthermore, as can be seen, the permanent magnets may be arranged so that the magnetic poles of every other magnet point in a different direction from the adjacent magnet, that is, their polarities alternate. Therefore, when you move from one magnet to another, the direction of the magnetic field alternates.

[0100] The operating principle of the interface assembly 100 according to Figures 11A-11C is best understood by looking at Figure 11C. Figure 11C shows that the interface assembly 100 comprises at least two sensors 32 in the sensor configuration 30. The sensors 32 are positioned within the functional multilayer structure 20 in a manner corresponding to the circular rotation path of the permanent magnets. In this particular embodiment, the sensors 32 are positioned such that when one sensor 32 is aligned with one of the magnets, the other sensor 32 is positioned between two adjacent magnets. The arrangement of the sensors 32 and / or sensing parts 42, which are permanent magnets, may also differ from those described herein.

[0101] Therefore, the sensor 32, which is adapted to measure the magnetic field or its change due to the rotation of the movable member 40, alternately measures the changing magnetic field. Thus, the sensor configuration 30 can be arranged to determine the speed and direction related to the rotation of the movable member 40.

[0102] Figures 11A-11C further show an optional first permanent magnet 51. A second permanent magnet 52 can also be provided in the multilayer structure 20, as shown in Figure 8B, even though it is not shown. Alternatively, a coil (see Figures 9 and 10) can be provided below the first permanent magnet 51 to provide tactile feedback to the movable member 40.

[0103] Regarding the operation of the interface assembly 100 in Figures 11A to 11C, when the movable member 20 is rotating, the sensor 32(or more) detects a change in the magnetic field as the magnet 42 passes over the sensor 32. If there are magnets 42 whose polarity changes alternately as shown in the figure, the sensor 32 can detect changes including polarity (or direction of the magnetic field) because every other magnet 42 causes a change in polarity opposite to the previous one. Therefore, the sensor(or more) 32 generates a sensing signal that represents or indicates the movement of the movable member 40.

[0104] In various embodiments, the interface assembly 100 may include a spring positioned to interact with the movable member 40. For example, the movable member 40 may be mechanically coupled to the functional multilayer structure 20 via the spring. Alternatively, the movable member 40 may not be in contact with the spring at one position but may come into contact with the spring as it moves. The spring may be, for example, a coil spring or a leaf spring, and is positioned to compress or extend from its stationary position as the movable member 40 is moved translationally, vertically, or horizontally / laterally. In some embodiments, the central portion of the spring may include a through-hole through which the movable member 40 passes and extends toward the functional multilayer structure 20.

[0105] Figures 12A and 12B show the interface assembly 100. In this case, the movable member 40 may be moved by rotation and / or downward pushing. However, the interface assembly 100 further includes a spring 70. In Figure 12A, the spring 70 is in a stationary position or at most partially compressed. In Figure 12B, the spring 70 is essentially fully compressed. The spring 70 in Figures 12A and 12B is a dome-shaped spring. When the spring 70 is not fully compressed, the edge portion or multiple portions of the dome are in contact with either the functional multilayer structure 20 (such as the first base material 22 or the second base material 28, or the molding material layer 26) or the movable member 40, while the central portion of the dome is separated from the other of the functional multilayer structure 20 or the movable member 40. Figures 12A and 12B show the edge portion in contact with the functional multilayer structure 20. The dome-shaped spring 70 in Figures 12A and 12B may be made of plastic, such as a thermoformable plastic film, or of metal. The central portion of the spring 70 may have a through-hole through which the movable member 40 can pass and extend toward the functional multilayer structure 20. In some embodiments, the movement of the movable member 40 may cause the spring 70 to bend.

[0106] The interface assembly 100 in Figures 12A and 12B operates such that, in the case of Figure 12A, there is a clear path between sensors 32A and 32B. For example, sensor 32A may emit light waves, such as light or infrared light, toward sensor 32B, which can be used, for example, to record or detect the emitted light waves. In Figure 12B, the movable member 40 is pushed down, and a portion of it, i.e., the sensing portion 42, is obstructing the path. This can be detected by sensor 32B, which is no longer receiving the emitted light waves. Of course, alternatively, the movable member 40 may obstruct the path in a first position corresponding to Figure 12A and allow the emitted light waves to reach sensor 32B in a second position corresponding to Figure 12B. The sensing portion 42 of the movable member 40 may, for example, have a through hole or a portion containing a material transparent to the emitted light waves. Sensor 32B may, for example, be a reflective surface positioned to reflect the emitted light waves back to sensor 32A and to detect the reflected signal.

[0107] Figure 13 shows a spring 70 having a particularly advantageous segmented dome shape. Small arrows in the figure indicate that the central portion is spaced apart from the level of the edge portion or multiple edge portions. The spring 70 is operated in essentially the same way as described above for dome-shaped springs. When the segmented dome-shaped spring is not fully compressed, the edge portion or multiple portions of the segmented dome are in contact with either the functional multilayer structure 20 (such as the first base material 22 or the second base material 28, or the molded material layer 26) or the movable member 40, while the central portion of the dome is spaced apart from the functional multilayer structure 20 and the other of the movable member 40. Figure 13 shows the edge portion in contact with the functional multilayer structure 20. The dome-shaped spring 70 in Figure 13 may preferably be made of a plastic material such as a thermoformable plastic film. The central portion of the segmented dome-shaped spring may have a through-hole through which the movable member 40 can pass and extend toward the functional multilayer structure 20.

[0108] Alternatively, the spring 70 may be a planar spring, such as a orthogonal planar spring. It may also be a plastic material, such as a thermoformable plastic film. In the case of a planar spring, the functional multilayer structure 20 may have holes, recesses, or cavities into which the planar spring can extend as the movable member 40 moves toward the structure 20. Alternatively, the planar spring may extend into such holes, recesses, or cavities in the movable member 40, or both the structure 20 and the movable member 40 may have such holes, recesses, or cavities. Further alternatively, a support frame, such as a support ring, may be utilized to provide space for the planar spring to move.

[0109] When the spring 70 is compressed, it may slide against the surface of the structure 20 and the movable member 40. Meanwhile, Figure 13 also illustrates a spring support member 80 or projection shape, such as a pin, for supporting the spring 70 laterally in the figure. Depending on the embodiment, the spring support member 80 or a plurality of members 80 may be positioned on the structure 20 or the movable member 40 so as to align with a groove or hole or other counter element of the spring 70. Preferably, the support member 80 may support the spring 70 such that when the spring 70 is compressed, it contacts the support member 80 perpendicular to the direction of movement of the movable member 40.

[0110] Alternatively, the spring element 70 may be placed in a hole or cavity defining the outer wall, or in another structure such as a ring, which can be contacted when the spring element 70 is compressed or at virtually all positions.

[0111] Figures 14A to 14C show the interface assembly 100. For readability, Figure 14A shows only the movable member 40 and sensors 32A and 32B. The movable member 40 may have a through-hole 49 or channel 49 extending laterally through the movable member 40, either within or as part of its sensing portion 42. The purpose of the through-hole 49 or channel 49 is to allow light waves, such as light, to pass through when the movable member 40 is in a first position relative to the functional multilayer structure 20. The operation of the assembly 100 will be described in more detail with reference to Figures 14B and 14C.

[0112] Figure 14B shows the movable member 40 in the first position. As can be seen, the signal emitted by sensor 32A passes through channel 49 and is received by sensor 32B. On the other hand, Figure 14C shows the movable member 40 in the second position. The movable member 40 is pushed down, and channel 49 is no longer aligned with sensors 32A and 32B. Thus, the position of the movable member 40 and / or changes thereof can be detected. As can be seen in Figures 14B and 14C, the assembly 100 may optionally include a spring 70. In various embodiments, the movable member 40 may be rotatable.

[0113] Figures 14B and 14C also show an alternative embodiment in which the channel 49 is located on the surface where the movable member 40 is operated, i.e., on the portion of the movable member 40 that is close to the outer surface, as shown. In such an embodiment, the sensors 32, 32A, and 32B may be provided on the substrates 22, 28 that are close to the outer surface, as shown. In such a case, there may or may not be another substrate 22 on the opposite side of the molding material layer 26 that at least partially embeds the sensor configuration 30.

[0114] Figures 15A and 15B show the interface assembly 100. The movable member 40 comprises a sensing portion 42 which is a permanent magnet or a pair of permanent magnets or another material that influences the surrounding magnetic field. The functional multilayer structure 20, on the other hand, comprises at least one sensor 32 which is a coil. The coil may be similar to a voice coil of a speaker, i.e., comprises a support ring around which the coil is wound. Thus, as the movable member 40, in particular the magnet or magnetic material, moves toward the coil, a current is induced in the coil, which can be used to detect the movement of the movable member 40. As seen in Figures 15A and 15B, a spring 70 may be positioned between the movable member 40, which is translatably (vertically) movable and arbitrarily rotatable, and the multilayer structure 20. In various embodiments, the movable member 40 may also be rotatable as indicated by the double-headed arrow with a dashed line.

[0115] In Figures 15A and 15B, a coil may be used to give movement to the movable member 40. By injecting current into the coil, the magnetic field generated by the injected current interacts with the sensing portion 42 of the movable member 40, thereby enabling the movement of the movable member 40. This may be used, for example, to generate vibration, but it may even be used to produce sound.

[0116] In some embodiments, the movable member 40 may be essentially like the spring 70 shown in Figure 13, but the central portion is made of a solid material and does not have a through hole. Optionally, the central portion may comprise a ferromagnetic material that can be moved by changing the magnetic field around it. Furthermore, such a movable member 40 comprises a support member 80 that secures the edge portion of the movable member 40 to the functional multilayer structure 20. Moreover, the material of such a movable member 40 is flexible with respect to at least its edge portion or multiple edge portions, thus allowing the movement of the movable member 40 relative to the structure 20.

[0117] Figures 16A and 16B show the interface assembly 100. In Figure 16A, the interface assembly 100 includes a movable member 40 that is arranged to move hingely relative to the functional multilayer structure 20. Thus, if the movable member 40 has a longitudinal shape as shown in Figure 16A, it may, preferably but not necessarily, rotate about a pivot point located at one end of the movable member 40. The movable member 40 may be, for example, a switch.

[0118] The mounting mechanism 60 in Figures 16A and 16B may include a hinge 66 or a plurality of hinges 66. Optionally, the movable member 40 may be positioned away from the functional multilayer structure 20 when in a standby position where it is not being operated or touched. For example, there may be a spring to hold the movable member 40 in the standby position. In some embodiments, the hinges 66 may be at least partially integrated parts of the functional multilayer structure 20, such as protrusions of the base materials 22, 28 and / or the molded material layer 26. Alternatively, the hinges 66 may be separate structures attached to the functional multilayer structure 20. Alternatively, the standby position may be when the movable member 40 is closer to the structure 20.

[0119] Figure 16B shows another interface assembly 100 in which the movable member 40 is hinged. In these embodiments, the movable member 40 is not attached to the functional multilayer structure 20, but rather to the host structure 90. Preferably, the host structure 90, such as a substrate or other support structure, may be fixed to the multilayer structure 20 by a fixing mechanism 92 when installed for use. The fixing mechanism 92 may be, for example, another substrate or support member on which both the host structure 90 and the functional multilayer structure 20 are mounted. Of course, the functional multilayer structure 20 may also be directly attached to the host structure 90.

[0120] Furthermore, the movable member 40 may include, for example, a magnet, a metallic material such as a magnetic metal material, or an optically reflective material, or a capacitive sensing element. The functional multilayer structure 20, and in particular its sensor configuration 30, may include a magnetic sensor for measuring a magnetic field or its changes, an inductive sensor including a coil or multiple coils, a capacitive sensor, or an optical sensor including a transmitter and receiver. Thus, the position and / or changes of the movable member 40 may be determined or detected based on the sensor configuration 30.

[0121] Figures 17A–17C show the interface assembly 100 and the steering wheel 200 within the host structure 90. Figure 17A shows the interface assembly 100 having a movable member 40 that is positioned to move hingely relative to the functional multilayer structure 20. The movable member 40 is attached to the functional multilayer structure 20 by a hinge 66 or hinge configuration 66.

[0122] Figure 17B shows an interface assembly 100 having a movable member 40 positioned to move hingely relative to a functional multilayer structure 20. The movable member 40 is attached to a host structure 90 by a hinge 66 or hinge configuration 66. The host structure 90 is preferably fixed relative to the functional multilayer structure 20.

[0123] Figure 17C shows a perspective view of the interface assembly 100 shown in Figure 17B. As can be seen, the interface assembly 100 is positioned on the host structure 90, which in this case is the steering wheel 200. The steering wheel 200 comprises a steering wheel body that defines a handle portion(s) and a central portion. The axis of rotation of the steering wheel 200 is shown by a dashed line. The interface assembly 100 is positioned in the middle portion of the steering wheel, which lies between the central portion and the handle portion(s). As can be seen, the movable member 40 is hinged and attached to the rear of the central portion of the steering wheel 200. Alternatively, the movable member 40 can also be hinged and attached to the rear of the middle portion of the steering wheel 200. Therefore, the user can easily operate the movable member 40 by hand while holding the handle portion of the steering wheel 200.

[0124] Figures 18A and 18B show the interface assembly 100. Figures 18A and 18B show the interface assembly 100 as a cross-sectional side view. The interface assembly 100 comprises a movable member 40 defined by a base film, which is part of the base materials 22, 28, preferably flexible and / or moldable, for example, thermoformable, and a detection portion 42, which is preferably a planar element on the surface of the base materials 22, 28.

[0125] Therefore, the movable member 40 may be an integrated part of the functional multilayer structure 20, and the movable member 40 is still movable relative to the structure 20. In one embodiment, the movable member 40 may advantageously comprise a portion of the base materials 22, 28.

[0126] In a preferred embodiment, the detection portion 42 is a first contact pad, strip, or region of a conductive material such as metal (copper, aluminum, silver, etc., or an alloy thereof) provided on the surface of substrates 22, 28, preferably a formable substrate film. The first contact pad, first strip, or first region may be used as a capacitive sensing element region.

[0127] The detection portion 42 may also be connected to an electrical circuit such as the same substrates 22, 28, another substrate, or another host device. The interface assembly 100 also includes a gap or empty space 82 between the substrates 22, 28 and the functional multilayer structure 20, preferably at a position corresponding to the detection portion 42. Thus, when force is applied, such as by pressing the movable member 40 against its outer surface, i.e., the “dome”, the detection portion 42 can move toward the functional multilayer structure 20.

[0128] Accordingly, the functional multilayer structure 20 may also include a sensor 32, such as a second contact pad, a second strip, or a second region of a conductive material (copper, aluminum, silver, etc., or an alloy thereof), on the surface of a substrate 22, 28, which is preferably a moldable substrate film, on the opposite side of the moldable material layer 26, the sensor 32 being at least partially embedded in the moldable material layer 26 or at least one side being covered by the moldable material layer 26. The second contact pad, second strip, or second region interacts with the first contact pad, first strip, or first region and may be used as a capacitive sensing element providing a capacitive sensing device including TX (transmitter) and RX (receiver) electrodes in the form of first and second contact pads, etc.

[0129] In a preferred embodiment, the first and / or second contact pads, etc., may be manufactured by printing on the corresponding substrates 22, 28. Substantially additional printing techniques such as screen printing, flexographic printing, and inkjet printing may be used.

[0130] In various embodiments, the functional multilayer structure 20 may include ventilation channels 89 that connect the empty space 82 to the surrounding environment of the interface assembly 100, preferably via channel portions extending through the functional multilayer structure 20. Thus, when the movable member 40 is moved toward the structure 20, it may be controlled so that the pressure in the empty space does not increase too much and / or the resistance to the movement does not become too great.

[0131] In some embodiments, the functional multilayer structure 20 may include a support material layer 80. The surface of the support material layer 80 facing the substrates 22, 28 is preferably not too strongly adhered to the substrate, or at least not more strongly adhered than the molding material layer 26.

[0132] In a further embodiment as shown in Figure 18B, an adhesive 29, such as an electrically insulating structural adhesive, may be used between the support material layer 80 and the substrates 22 and 28 on which the detection portion 42 is located. Preferably, the adhesive 29 is positioned to bond one portion(s) of the substrates 22 and 28 to the support material layer 80 surrounding the portion defining the movable member 40.

[0133] Figures 19A to 19D illustrate several method steps for manufacturing the interface assembly 100. Figure 19A shows a multilayer structure comprising at least one base material 22, 28, the surface of which is provided with a first contact pad, etc. (indicated by reference numeral 42). Furthermore, a molding material layer 26 may be molded on the sides of the base materials 22, 28, or the molding material layer 26 may be provided after the base materials 22, 28 have been molded to include a shape that functions as a movable member 40.

[0134] In Figure 19A, the contact pads are located on the same side as the molding material layer 26 of the substrates 22 and 28, but the contact pads could alternatively be located on the opposite side, i.e., the outer surface of the manufactured interface assembly 100.

[0135] Furthermore, the multilayer structure includes a second contact pad (denoted by reference numeral 32) which is at least partially embedded in or covered by the molding material layer 26. Figure 19A shows an optional mold 84 positioned on the structure at the location corresponding to the first contact pad. As can be seen, the mold 84 may be used to apply forces such as suction 86, negative pressure 86, or optionally high pressure 86 (through ventilation channels 89, if any) to the surface of the substrates 22, 28 at the location corresponding to the first contact pad. The mold 84 has a recess, in this case dome-shaped, but the shape can easily be other. For example, the shape may be longitudinal, such as providing a slider interface.

[0136] During a molding process such as a thermoforming process utilizing high temperature and high pressure (relative to room temperature and ambient temperature), the substrates 22 and 28 detach from the underlying structure, such as the molding material layer 26 or the support material layer 80, if there is a structure underneath, creating a gap or empty space 82 between the first contact pad, which is the detection portion 42, and the multilayer structure, which is the functional multilayer structure 20.

[0137] Figures 19C and 19D show substantially the same steps as in Figures 19A and 19B, but are shown in perspective. In Figure 19C, the substrates 22 and 28 are in contact with the underlying structure and are basically planar in shape, at least locally at the first contact pad. Next, in Figure 19D, when the substrates 22 and 28 are formed, at least locally at the first contact pad, by thermoforming or the like, a dome-shaped movable member 40 is formed, and a gap or empty space 82 is created beneath the movable member 40 so that the movable member 40 can move. While the sensing portion 42 moves within the empty space 82 which is optionally ventilated (ventilation channel 89) to ambient pressure, a sensor 32 such as a capacitive sensing element or electrode can be embedded in the molded material layer 26 or between the molded material layer 26 and another substrate 28, thus having the advantage of essentially sealing the sensor 32 from ambient conditions (humidity, temperature, pressure, etc.).

[0138] The first substrate 22 and / or second substrate 28 or generally material layer(s) included in the multilayer structure 20, such as a base film(s), may contain at least one material selected from the group consisting of polymers, thermoplastics, electrical insulating materials, polymethyl methacrylate (PMMA), polycarbonate (PC), flame-retardant (FR) PC film, FR700 type PC, copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural fiber or fabric materials, naturally grown materials, cotton, wool, linen, silk, and any combination thereof.

[0139] The molding material layer 26 may generally contain at least one material selected from the group consisting of polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermosetting materials, elastomer resins, PC, PMMA, ABS, PET, copolyester, copolyester resin, nylon or polyamide (PA), polypropylene (PP), thermoplastic polyurethane (TPU), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanized material), and MS resin. The molding material layer may be transparent, translucent, or opaque.

[0140] In various embodiments, the substrates 22, 28 (one or both) may be printed circuit boards (PCBs), ceramic substrates, flexible printed circuits, FR-4 substrates, and the like. Even metal substrates can be used in various embodiments. The metal substrate may or may not have an insulating coating on one or both of its large surfaces.

[0141] Depending on the applicable embodiment, the additional films(s) or layers(s) potentially included in the substrates 22, 28 and / or structure 20 may include, or be, optically substantially transparent or at least translucent materials, taking into account the wavelength of interest (e.g., visible light), having, for example, about 80%, 90%, 95%, or higher relevant light transmittance. This may be particularly true when the substrate is configured within the structure 20 to effectively transmit or pass through light emitted by a light source. However, in some embodiments, the substrates 22, 28 used may exhibit a substantially opaque, black, and / or other dark color so as to block incident light from passing through it (masking function).

[0142] If the substrates 22 and 28 are substrate films, the thickness of the films and optionally the thickness of any further films or layers included in the structure 20 may vary depending on the embodiment, and may be, for example, only tens or hundreds of millimeters, or may be considerably thicker, one or several millimeters in size.

[0143] The thickness may actually vary locally and / or, in addition to accommodating various elements (e.g., electronic or optical elements), may optionally include recesses or internal cavities for purposes such as optical guiding, processing, and / or thermal management.

[0144] The base film, as well as further layers of the structure (e.g., films, coatings), can be essentially planar (width and length are greater than thickness, e.g., orders of magnitude different). The same applies to the entire structure as illustrated in the figure, although other non-planar shapes are also entirely achievable.

[0145] In various embodiments, possible additional layers or features may be added to the multilayer structure 20 by molding, lamination, or suitable coating (e.g., vapor deposition) procedures, without regard to other possible positioning or fixing methods. The layers may be protective, indicator, and / or aesthetically valuable (graphics, colors, shapes, text, numerical data, etc.) and may contain, for example, textiles, leather, or rubber materials instead of or in addition to further plastics. Further elements (e.g., electronics, modules, module interiors or components, and / or optical components) may be attached and fixed, for example, to the outer surface of the structure (e.g., the outer surface of the film or molded material layer included, depending on the embodiment). Molding / cutting of necessary materials may be performed. For example, a diffuser may be made from an optically conductive material that is locally irradiated with a laser. If connectors are provided, the connectors of the multilayer structure 20 may be connected to desired external connection elements (e.g., external devices, systems, or structures, e.g., external connectors of a host device). For example, these two connectors may together form a plug-and-socket type connection and interface. In this specification, the multilayer structure 20 may also be generally positioned and mounted in a larger ensemble, such as an electronic device including a personal communication device, a computer, a home appliance, or an industrial appliance, or in a vehicle in an embodiment where the multilayer structure constitutes part of the exterior or interior of a vehicle, such as a dashboard.

[0146] Furthermore, the structure 20 includes electronic components, electromechanical components, electro-optical components, radiation-emitting components, light-emitting components, LEDs (light-emitting diodes), OLEDs (organic LEDs), side-shooting LEDs or other light sources, top-shooting LEDs or other light sources, bottom-shooting LEDs or other light sources, radiation detection components, photodetection or photosensitive components, photodiodes, phototransistors, photovoltaics, sensors, micromechanical components, switches, touch switches, touch panels, proximity switches, touch sensors, air sensors, temperature sensors, pressure sensors, moisture sensors, gas sensors, proximity sensors, capacitive switches, capacitive sensors, projected capacitive sensors or switches, single-electrode capacitive switches or sensors, and capacitive sensors. An electrical circuit comprising at least one component or element selected from the group consisting of, for example, a button, a multi-electrode capacitive switch or sensor, a self-capacitive sensor, a mutual-capacitive sensor, an inductive sensor, a sensor electrode, a micromechanical component, a UI element, a user input element, a vibration element, an acoustic generation element, a communication element, a transmitter, a receiver, a transceiver, an antenna, an infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a radio tag, a tag reader, a data processing element, a microprocessor, a microcontroller, a digital signal processor, a signal processor, a programmable logic chip, an ASIC (Application-Specific Integrated Circuit), a data storage element, and an electronic subassembly may be included on, for example, the substrate films 22, 28. In various embodiments, the circuit may be at least partially embedded in the molding material layer 26.

[0147] Figure 20 shows a flowchart of the manufacturing method for the interface assembly 100.

[0148] Step or item 300 refers to the initiation stage of the method. Suitable equipment and components are obtained, the system is assembled, and configured to operate.

[0149] At the start of the method, the startup phase 300 may be performed. During startup, necessary tasks (e.g., selection, acquisition, calibration, and other configuration tasks of materials, parts, and tools) may be performed. Special care must be taken to ensure that the individual elements and material selections work together to withstand the selected manufacturing and installation processes. This is, of course, preferably by checking in advance based on the specifications of the manufacturing process and datasheets of the parts, or by examining and testing a fabricated prototype in detail. Accordingly, the equipment to be used (among other things, equipment that provides measurements such as molding, IMD (in-mold decoration), lamination, bonding, (thermo)forming, electronics assembly, cutting, drilling, printing, and / or desired optical measurements) may be brought up to operational status at this stage.

[0150] Step or item 310 refers to obtaining or manufacturing first substrates 22, 28 (such as the first substrate 22 and / or second substrate 28), such as thermoformable, preferably flexible substrate films. The substrates 22, 28 may be off-the-shelf substrates or substrate films, and preferably planar substrates (films) including substrate films on rolls. The substrates 22, 28 may be at least primarily electrically substantially insulating materials. In some embodiments, the substrates 22, 28 themselves may be manufactured in-house first by molding from selected starting materials using a mold or forming apparatus or other method. Optionally, the substrate film may be further processed at this stage. For example, holes, notches, depressions, cuts, etc., may be provided.

[0151] Step or item 320 refers to obtaining at least one sensor 32 configured to detect the position or change in position of at least one sensing portion 42.

[0152] In various embodiments, several electrically and / or thermally conductive elements, such as various conductive wires (traces), sensing elements (e.g., electrodes), and / or contact areas (e.g., pads), are provided on one or both sides of one or more substrates, or, more favorably, substrate films, preferably by one or more additional techniques, such as printed electronics technology or 3D printing. For example, screen printing, inkjet printing, flexographic printing, gravure printing, or offset lithography printing may be applied by a suitable printing apparatus or a set of apparatuses. In some cases, subtractive or semi-additive processes may also be utilized. For example, further actions to cultivate the substrate film(s), including printing or generally providing graphics, visual indicators, optical elements, etc., may be performed.

[0153] In various embodiments, electrically and / or thermally conductive elements (such as traces, pads, connectors, electrodes, etc.) may include at least one material selected from the group consisting of conductive inks, conductive nanoparticle inks, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesives, carbon fiber, graphene, alloys, silver alloys, zinc, brass, titanium, solder, and any of these components. The conductive material used may be optically opaque, translucent, and / or transparent at a desired wavelength (e.g., at least a portion of visible light) so as to mask, reflect, absorb, or pass through radiation (e.g., visible light). As a practical example of a feasible conductive material, for example, Dupont® ME602 or ME603 conductive inks may be used.

[0154] At least some of the electronics and / or other elements of the final multilayer structure may be conveniently supplied to substrates 22, 28, such as substrate films, via fully or partially pre-fabricated modules or subassemblies. Optionally, the modules or subassemblies may be at least partially overmolded with a protective plastic layer before being attached to the substrates 22, 28.

[0155] For example, adhesives, pressure, and / or heat may be used for the mechanical bonding of a module or subassembly to the primary (receiving) substrate. Solder, wiring, and conductive inks are examples of applicable options for providing electrical and / or thermal connections between elements of the module or subassembly and with the remaining electrical and / or thermal elements on the main substrate.

[0156] Step or item 330 refers to molding material onto one side of the first substrates 22, 28 in order to at least partially embed a sensor configuration 30 including at least one sensor 32 into the molded material layer 26, thereby obtaining a functional multilayer structure 20.

[0157] Step or item 340 refers to obtaining or fabricating a movable member 40 which includes at least one sensing portion 42. It should be noted that obtaining or fabricating the movable member 40 may be done at any step relative to other steps of the Method. For example, the movable member 40 may be fabricated or obtained before obtaining the substrates 22, 28. In some embodiments, as described herein in relation to Figures 18A-19D, the movable member 40 may be fabricated during any step of thermoforming the substrates 22, 28, preferably the substrate film (described later). As a further example, the movable member 40 may be fabricated or obtained after the multilayer structure 20 has been manufactured. In Figure 20, item 340 is depicted as having parallel branches in the flow chart.

[0158] Step or item 350 refers to positioning the sensor configuration 30 and the at least one detection part 42 relative to the sensor configuration 30 such that the position or change in position of the movable member 40 can be detected by the sensor configuration 30 based on the position or change in position of the at least one detection part 42 relative to the sensor configuration 30.

[0159] The execution of the method may end in step or item 399.

[0160] Furthermore, the method may include thermoforming the first substrates 22, 28 to have at least a portion having a non-planar three-dimensional shape before molding 330. Preferably, the thermoforming includes stretching the first substrates 22, 28 at least locally under high pressure to generate a non-planar three-dimensional shape. The thermoforming is preferably performed after providing conductive traces and electrical circuits, such as sensors 32, 32A, 32B and other electronic components, but before the molding 330 step.

[0161] In some embodiments, grooves, holes, or through-holes extending outward from the surface of the multilayer structure 20, or alternatively, protrusions, pins, or other shapes, may be provided by thermoforming the base material 28.

[0162] Alternatively or additionally, the method includes mounting the movable member 40 and the functional multilayer structure 20 so that they are movable relative to each other.

[0163] Furthermore, in various embodiments, the movable member 40 and the functional multilayer structure 20 are adapted to each other such as between a portion of a groove, hole, or through-hole in the structure 20 and the movable member 40, in order to prevent, or at least prevent, the movable member 40 from detaching from the functional multilayer structure 20. An example of a shape interlock structure is shown in Figure 6 and will be described in relation thereto. As will be understood by those skilled in the art, the shape interlock structure can be provided in several different ways with respect to its shape and other details.

[0164] With respect to the molding material layer 26, the light transmittance of a translucent material selected for the molding material layer 26 can be about 25% to about 90% or more at selected wavelengths (e.g., at least a portion of the visible wavelengths), considering, for example, a material sample about 2 mm or 3 mm thick. The relevant half-width angle can be about 5 to about 75 degrees (on an intensity basis), for example, about 5, 10, 20, 30, 40, 50, 60, or 70 degrees. In different usage scenarios, the desired transmittance and scattering characteristics can naturally vary further.

[0165] Therefore, the molded material layer 26 may contain a material that is at least optically translucent (optionally substantially transparent), and the light transmittance of the entire thermoplastic layer may preferably be at least 50% in some use scenarios, although the desired transmittance may actually differ fundamentally among all possible use scenarios. In some embodiments, a transmittance of at least about 80% or 90% may be preferable to maximize the light output from the structure, while in some other embodiments, for example, 10%, 20%, or 30% may be perfectly sufficient, if not advantageous, when problems related to light leakage should be minimized. The transmittance may be measured or defined in a selected direction, e.g., the main direction of light propagation, and / or perpendicular to the surface of the substrate film at the location of the illumination module on the substrate film, taking into account selected wavelengths (optionally including visible wavelengths) of light emitted by at least one light source.

[0166] For example, considering scattering / diffusion or other optical properties, the molded material layer 26 may generally contain at least one material selected from the group consisting of polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermosetting materials, elastomer resins, PC, PMMA, ABS, PET, copolyester, copolyester resin, nylon (PA, polyamide), polypropylene (PP), thermoplastic polyurethane (TPU), polystyrene (GPPS), thermoplastic silicone vulcanized products (TPSiV), and MS resins.

[0167] An example of an applicable polycarbonate-based material is Makrolon®, available in various grades, which exhibits, for example, different colors / hues (e.g., white / whitish and black / dark, or dark), transparency, and scattering properties.

[0168] In various embodiments, assembly 100 may also comprise one or more electrical circuits in association with the sensing configuration 30 and / or the movable member 40. The electrical circuit(s) may comprise several light sources and, for example, associated drivers, conductive traces or contact pads, optionally printed on substrates 22, 28 and / or other material layers of assembly 100 using printed electronics techniques. Traces may be configured for the transfer of power and / or data (e.g., signaling data or other data) between elements (e.g., light sources and associated drivers, or generally controllers and / or power supplies, etc.). Furthermore, the circuit may comprise one or more electrodes, electrical connectors, electronic components, and / or integrated circuits (ICs) (e.g., control circuits or data transfer circuits). Such circuits may be fabricated directly for assembly 100 by a selected method, for example, by a selected printed electronics technique (optionally screen printing) or by a selected coating technique. Additionally or alternatively, the circuit may comprise several mounting components (e.g., surface mount devices (SMDs)). Therefore, non-conductive and / or conductive adhesives may be used to secure components to a carrier. In some embodiments, mechanical fastening is performed or at least reinforced by a non-conductive adhesive material, while solder or other electrically highly conductive (but less conductive, adhesive-type) materials are used for electrical connections.

[0169] If, optionally, further capacitive sensing of touchless gestures on assembly 100 is to be implemented, for example, the configuration (dimensions, positioning, etc.) of the sensing electrodes of the circuit may be configured such that their sensing areas or volumes, defined by the relevant electric or electromagnetic fields, are positioned as necessary, thereby covering, for example, selected side walls and / or top areas of the structure, and / or other areas, which should be highly sensitive to touch (and / or touchless gestures in some embodiments) or other sensing targets. This type of configuration may be achieved or implemented, for example, by utilizing the necessary simulations or measurements.

[0170] Furthermore, the circuit and / or the multilayer structure may include at least one component or element selected from the group consisting of: electronic components, electromechanical components, electro-optical components, radiation-emitting components, light-emitting components, LEDs (light-emitting diodes), OLEDs (organic LEDs), side-shooting LEDs or other light sources, top-shooting LEDs or other light sources, bottom-shooting LEDs or other light sources, radiation-detecting components, photodetector or photosensitive components, photodiodes, phototransistors, photovoltaics, sensors, micromechanical components, switches, touch switches, touch panels, proximity switches, touch sensors, air sensors, temperature sensors, pressure sensors, moisture sensors, gas sensors, proximity sensors, capacitive switches, capacitive sensors, projected capacitive sensors or Switches, single-electrode capacitive switches or sensors, capacitive buttons, multi-electrode capacitive switches or sensors, self-capacitive sensors, mutual-capacitive sensors, inductive sensors, sensor electrodes, micromechanical components, UI elements, user input elements, vibration elements, sound generation elements, communication elements, transmitters, receivers, transceivers, antennas, infrared (IR) receivers or transmitters, wireless communication elements, wireless tags, radio tags, tag readers, data processing elements, microprocessors, microcontrollers, digital signal processors, signal processors, programmable logic chips, ASICs (application-specific integrated circuits), data storage elements, and electronic subassemblies.

[0171] Assembly 100 may be an external system or device such as a receiving device or receiving configuration for assembly 100, and in many use scenarios may be connected to such a connection, which may be made by connectors, e.g., electrical connectors or connector cables, which may be attached to assembly 100 or the structure 20 and its elements (e.g., circuits) in a selected manner (e.g., with respect to communications and / or power). The attachment points may be on the sides or bottom of the structure, provided, for example, through through holes in the substrates 22, 28.

[0172] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will understand that the disclosed embodiments are constructed for illustrative purposes only, and that other configurations applying many of the above principles can be readily constructed to best suit each potential use scenario.

Claims

1. Interface assembly (100), A functional multilayer structure (20), The first substrate (22, 28) and The molding material layer (26) on the first side surface of the first substrate (22, 28), A sensor configuration (30) comprising at least one sensor (32, 32A, 32B), wherein the sensor configuration (30) is arranged to be at least partially embedded in the molding material layer (26), A functional multilayer structure (20) having, A movable member (40) that is movable relative to the functional multilayer structure (20), wherein the movable member (40) comprises at least one detection portion (42), Equipped with, The sensor configuration (30) and the at least one detection portion (42) are arranged such that the position or change in position of the movable member (40) can be detected by the sensor configuration (30) based on the position or change in position of the at least one detection portion (42) relative to the sensor configuration (30). Interface assembly (100).

2. The interface assembly (100) according to claim 1, wherein the movable member (40) and the functional multilayer structure (20) are movably attached to each other.

3. The interface assembly (100) according to claim 2, wherein the movable attachment includes a magnetic attachment configuration comprising a first attachment portion (62) on the functional multilayer structure (20) and a second attachment portion (63) on the movable member (40), and the magnetic attachment configuration is arranged to exert an attractive magnetic force between the first attachment portion (62) and the second attachment portion (63).

4. The interface assembly (100) according to claim 2 or 3, wherein the movable attachment includes a mechanical attachment configuration, the mechanical attachment configuration is arranged to prevent, or at least prevent, the movable member (40) from detaching from the functional multilayer structure (20).

5. The interface assembly (100) according to claim 2, wherein the mechanical mounting configuration comprises a frame (61) which is adapted to at least partially confine the movable member (40) between the frame (61) and the functional multilayer structure (20) so that the movable member (40) is movable in the space between the frame (61) and the functional multilayer structure (20).

6. The interface assembly (100) according to any one of claims 1 to 5, wherein the functional multilayer structure (20) comprises grooves, holes, or through-holes, and a portion of the movable member (40) comprising the at least one detection portion (42) is adapted to extend into the grooves, holes, or through-holes and is movably disposed within the grooves, holes, or through-holes.

7. The interface assembly (100) according to claim 6, further comprising a shape interlock configuration between a portion of the groove, hole, or through-hole and the movable member (40) to prevent or at least prevent the movable member (40) from detaching from the functional multilayer structure (20).

8. The interface assembly (100) according to any one of claims 1 to 7, wherein the movable member (40) is movable in any way within the groove, hole, or through-hole in a translational manner such as linear or nonlinear relative to the functional multilayer structure (20).

9. The interface assembly (100) according to any one of claims 1 to 8, wherein the movable member (40) is arbitrarily rotatably movable within the groove, hole, or through-hole relative to the functional multilayer structure (20).

10. The interface assembly (100) according to any one of claims 1 to 9, wherein the functional multilayer structure (20) includes projections, pins, or other shapes extending outward from the surface of the multilayer structure (20), and the movable member (40) is movable, such as being rotatable, with respect to the projections, pins, or other shapes.

11. The interface assembly (100) according to any one of claims 1 to 10, wherein the at least one sensor (32, 32A, 32B) is at least one optical sensor configured to transmit an optical detection signal for detecting the position or change in position of the at least one detection portion (42).

12. The interface assembly (100) according to any one of claims 1 to 11, wherein the at least one detection portion (42) comprises one or more magnets and / or ferromagnetic elements, and the sensor configuration (30) comprises a magnetometer, coil, or Hall effect sensor for detecting the position or change in position of the one or more magnets.

13. The interface assembly (100) according to any one of claims 1 to 12, wherein the sensor configuration (30) comprises a capacitive sensing element for detecting the position of the at least one detection portion (42) or a change in the position thereof.

14. The interface assembly (100) according to any one of claims 1 to 13, wherein the movable member (40) is mechanically coupled to the functional multilayer structure (20) via a spring (70).

15. The interface assembly (100) according to claim 14, wherein the central portion of the spring (70) has a through hole through which the movable member (40) extends toward the functional multilayer structure (20).

16. The interface assembly (100) according to claim 14 or 15, wherein the spring (70) has the shape of a segment dome, and when the spring (70) is not fully compressed, the edge portion or a plurality of edges of the segment dome are in contact with one of the functional multilayer structure (20) and the movable member (40), and the central portion of the segment dome is spaced apart from the other of the functional multilayer structure (20) and the movable member (40).

17. The interface assembly (100) according to claim 14 or 15, wherein the spring (70) is a planar spring such as an orthogonal planar spring.

18. The interface assembly (100) according to claim 17, wherein the spring (70) is made of a plastic material such as a thermoformable plastic film.

19. The interface assembly (100) according to any one of claims 1 to 18, wherein the movable member (40) is attached and positioned to the functional multilayer structure (20) in a hinged manner.

20. The interface assembly (100) according to any one of claims 1 to 19, wherein the sensor configuration (30) comprises a plurality of sensors (32, 32A, 32B) including at least two different types of sensors for detecting the position or a change in the position of the at least one detection portion, the type of sensor being selected from the group consisting of optical, capacitive, inductive, resistive, magnetic, galvanic, acoustic, or a combination thereof.

21. The interface assembly (100) according to any one of claims 1 to 20, wherein a second substrate (28) is provided on the opposite side of the molding material layer (26) from the first substrate (22).

22. The interface assembly (100) according to any one of claims 1 to 21, wherein the sensor configuration (30) is provided on the surface of the first substrate (22) and / or the second substrate (28).

23. The interface assembly (100) according to any one of claims 1 to 22, wherein one or both of the first substrate (22) or the second substrate (28) is a thermoformable substrate film and optionally has a non-planar three-dimensional shape.

24. A method for manufacturing an interface assembly (100), Obtaining or manufacturing (310) a first substrate (22, 28) such as a thermoformable substrate film, To obtain (320) at least one sensor (32, 32A, 32B) configured to detect the position or change in position of at least one detection part (42), The sensor configuration (30) including at least one sensor (32, 32A, 32B) is at least partially embedded in the molded material layer (26) by molding material (330) on one side of the first substrate (22, 28), thereby obtaining a functional multilayer structure (20). Obtaining or manufacturing (340) a movable member (40) having at least one detection portion (42), A method comprising arranging the sensor configuration (30) and the at least one detection portion (42) relative to each other (350) such that the position or change in position of the movable member (40) can be detected by the sensor configuration (30) based on the position or change in position of the at least one detection portion (42) relative to the sensor configuration (30).

25. The method according to claim 24, further comprising thermoforming the first substrate (22, 28) to have at least a portion having a non-planar three-dimensional shape prior to the molding (330).

26. The method according to claim 25, wherein the thermoforming comprises stretching the first substrate (22, 28) at least locally under high pressure so as to generate a non-planar three-dimensional shape.

27. The method according to any one of claims 24 to 26, comprising attaching the movable member (40) and the functional multilayer structure (20) so as to be movable relative to each other.

28. The method according to any one of claims 25 to 27, comprising providing grooves, holes, or through-holes, or protrusions, pins, or other shapes extending outward from the surface of the functional multilayer structure (20) during the thermoforming process.

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