electronic machinery

Abstract

To provide an electronic device that saves space while preventing cables from becoming disconnected. [Solution] The electronic device comprises a heating element, a connector, a circuit board on which stud components are mounted, a thermal module for cooling the heating element, a flat cable having a connection portion connected to the connector, and a bracket provided so as to straddle the cable in the width direction and holding the cable from above the connector and the connection portion, wherein the bracket has a first end on one side and a second end on the other side in the direction that straddles the cable, the first end is screwed to the stud component and the second end is pressed by a part of the thermal module.

Description

Technical Field

[0001] The present invention relates to an electronic device including a substrate.

Background Art

[0002] In an electronic device such as a notebook PC, various connectors are mounted on a substrate housed in a casing. For example, Patent Document 1 discloses a configuration in which a flexible substrate connected to a display is connected to a connector mounted on a substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The connection between the connector and the cable as described above needs to be difficult to disconnect easily. Therefore, for example, it is conceivable to mount stud components on both sides of the connector and screw both ends of the bracket to press the cable from above the connector. However, in this configuration, it is necessary to mount two stud components on the substrate for one bracket. Therefore, in this configuration, it may be difficult to secure the space for the stud components on the substrate, and there is a concern that it may affect the electrical / electronic (E / E) design of the electronic device.

[0005] The present invention has been made in consideration of the above problems of the prior art, and an object thereof is to provide an electronic device that can prevent the cable connection from being disconnected while achieving space saving.

Means for Solving the Problems

[0006] An electronic device according to one aspect of the present invention comprises a heating element, a connector, a substrate on which a stud component is mounted, a thermal module for cooling the heating element, a flat cable having a connecting portion connected to the connector, and a bracket provided so as to straddle the cable in the width direction and holding the cable from above the connector and the connecting portion, wherein the bracket has a first end on one side and a second end on the other side in the direction that straddles the cable, the first end is screwed to the stud component and the second end is pressed by a part of the thermal module. [Effects of the Invention]

[0007] According to the above-described aspect of the present invention, it is possible to save space while preventing the cable from becoming disconnected. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment, viewed from above. [Figure 2] Figure 2 is a schematic plan view showing the internal structure of the enclosure. [Figure 3A] Figure 3A is a schematic perspective view showing an enlarged view of the bracket and its surrounding area as shown in Figure 2. [Figure 3B] Figure 3B is an exploded perspective view showing the process of attaching the bracket shown in Figure 3A to the motherboard. [Figure 4] Figure 4 is a schematic side cross-sectional view of the electronic equipment in the bracket and its surrounding area. [Figure 5] Figure 5 is a schematic front cross-sectional view of the electronic equipment in the bracket and its surrounding area. [Modes for carrying out the invention]

[0009] Hereinafter, preferred embodiments of the electronic device according to the present invention will be described in detail with reference to the attached drawings.

[0010] Figure 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in Figure 1, the electronic device 10 in this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, a notebook PC electronic device 10 is used as an example, but the electronic device may be something other than a notebook PC, such as a tablet PC, smartphone, or portable game console.

[0011] The lid 11 is a thin, flat, box-shaped enclosure. The lid 11 houses a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The enclosure 12 is a thin, flat box. The keyboard device 18 and touchpad 19 face the top surface (surface 12a) of the enclosure 12. Hereinafter, the enclosure 12 and each component mounted thereon will be described using the operator's posture when operating the keyboard device 18 as the reference point, with the width direction (left and right) of the enclosure 12 being referred to as the X1 and X2 directions, the depth direction (front and back) of the enclosure 12 being referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the enclosure 12 being referred to as the Z1 and Z2 directions. The X1 and X2 directions may also be collectively referred to as the X direction, and similarly, the Y1 and Y2 directions and the Z1 and Z2 directions may be referred to as the Y direction and Z direction. For the sake of explanation, the Z1 direction may also be referred to as down and the opposite direction (Z2 direction) as up in the thickness direction of the enclosure 12 (see Figures 3A to 5). These directions are defined for the sake of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0013] The housing 12 is composed of a housing member 20 that forms the top surface and the four sides, and a cover material 21 that forms the bottom surface. The housing member 20 can be made of a plate-shaped member that forms the surface 12a of the housing 12. The cover material 21 can be made of a plate portion 21A that forms the bottom surface 12b of the housing 12 and a vertical wall 21B that forms the side surface of the housing 12 (see Figure 4). The vertical wall 21B rises in the Z1 direction from the edge of the plate portion 21A. The housing member 20 and the cover material 21 are overlapped in the thickness direction and detachably connected to each other. The vertical wall 21B may be formed on the housing member 20. In this case, the cover material 21 may be made of only the plate portion 21A.

[0014] The hinge 14 is installed in a concave hinge mounting groove 12c formed on the rear edge of the housing 12, connecting the housing 12 and the lid 11. The hinge 14 has a structure in which, for example, a hinge shaft 14a, which serves as the axis of rotation, is supported at both ends in the longitudinal direction of the hinge housing. One end of the hinge shaft 14a is pivotally supported by a bracket fixed to the housing member 20. The other end of the hinge shaft 14a is supported within the hinge housing 14b, which is inserted into the hinge mounting groove 12c. The lid 11 has a jaw-shaped edge 11a that protrudes toward the display surface 16a side of the display 16. The hinge housing 14b is fixed to the edge 11a and supports the other end of the hinge shaft 14a (see Figures 1 and 4). Reference numeral 22 in Figure 4 is a bezel member that surrounds the peripheral edge of the display surface 16a of the display 16.

[0015] Figure 2 is a schematic plan view showing the internal structure of the housing 12. Figure 2 is a view of the inside of the housing member 20 from the bottom side after removing the cover material 21.

[0016] As shown in Figure 2, the housing 12 contains a thermal module 24, a motherboard 25, and a battery device 26. Various other electronic and mechanical components are also installed inside the housing 12.

[0017] The motherboard (substrate) 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is disposed closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source of the electronic device 10. The battery device 26 is disposed closer to the Y1 side of the motherboard 25 and extends in the X direction.

[0018] The motherboard 25 of the present embodiment mounts a CPU (Central Processing Unit) 25a. In addition to the CPU 25a, the motherboard 25 can also mount various electronic components, such as a GPU (Graphics Processing Unit), a memory, a communication module, etc. For example, the first surface 25A on the Z1 side of the motherboard 25 serves as the mounting surface for the housing member 20, and the second surface 25B on the Z2 side serves as the mounting surface for the CPU 25a, etc.

[0019] Next, the configuration of the thermal module 24 will be described.

[0020] The CPU 25a is a heat-generating component with the largest heat generation amount among the electronic components mounted in the housing 12. The thermal module 24 can absorb and diffuse the heat generated by the CPU 25a and discharge it outside the housing 12. The thermal module 24 may be configured to cool heat-generating components other than the CPU 25a, such as a GPU.

[0021] As shown in FIG. 2, the thermal module 24 can include a heat diffusion member 32 including a metal plate 30, a pressing component 34, and a pair of left and right fans 36, 36. In the thermal module 24 of the present embodiment, the heat diffusion member 32 and the pressing component 34 are integrally assembled, and the fan 36 is separate from them. The thermal module 24 may have a configuration in which the heat diffusion member 32, the pressing component 34, and the fan 36 are integrally assembled.

[0022] The heat diffusion member 32 can absorb and dissipate heat from the CPU 25a. The heat diffusion member 32 is provided to cover a portion of the second surface 25B of the motherboard 25 together with the CPU 25a. The heat diffusion member 32 has a rectangular shape, for example, that is long in the X direction and narrow in the Y direction. Fans 36 are positioned on both the left and right sides of the heat diffusion member 32.

[0023] The metal plate 30 is a thin, plate-shaped metal member made of a material with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 30 is a copper plate. The metal plate 30 is arranged to extend in the X direction between the left and right fans 36, 36. The heat diffusion member 32 can have a heat transport device such as a heat pipe or vapor chamber laminated on the Z1 side surface of the metal plate 30. A heat pipe is made by flattening a metal pipe into a thin, elliptical cross-section and sealing a working fluid in the sealed space inside. A vapor chamber is made by sealing a working fluid in a sealed space formed between two metal plates.

[0024] Multiple fins 37 and a flow straightening member 38 can be provided on the Z2-side surface 30a of the metal plate 30. The fins 37 can, for example, have a rod shape extending in the X direction. The fins 37 increase the surface area of ​​the metal plate 30 and improve heat dissipation efficiency. The flow straightening member 38 is provided in the center of the longitudinal direction of the metal plate 30. The flow straightening member 38 is a member that directs the air discharged from the outlets 36b of the left and right fans 36, respectively, and flowing along the surface 30a, smoothly toward the exhaust port 48a of the housing 12. The flow straightening member 38 can, for example, be made of a triangular copper block with a vertex facing the Y2 side.

[0025] The pressing component 34 is a component for pressing the heat diffusion member 32 against the CPU 25a. The pressing component 34 constantly biases the heat diffusion member 32 toward the second surface 25B of the motherboard 25. The pressing component 34 has a pair of leaf spring members 34a, 34a in the Y direction. The leaf spring members 34a are connected, for example, to a thin metal frame whose central part is fixed to the Z1 side of the heat diffusion member 32, and press the heat diffusion member 32 against the CPU 25a via this metal frame. This metal frame is provided so as to surround the CPU 25a inside the frame and is fixed to the surface 32b by soldering or the like. Both ends of each leaf spring member 34a are fastened and fixed to stud components 42 mounted on the second surface 25B of the motherboard 25 using screws 44 (see Figure 5). The stud components 42 are substantially cylindrical components mounted on the ground pattern 25b provided on the second surface 25B (see Figure 5). The stud component 42 has a female threaded hole into which a screw 44 can be fastened.

[0026] As shown in Figure 2, the left and right fans 36 are arranged side by side in the X direction, straddling the heat diffusion member 32 between them, and facing each other. Each fan 36 has an outlet 36b on a side 36a facing each other. The outlets 36b of the left and right fans 36 face each other with the heat diffusion member 32 in between. This allows each fan 36 to discharge air toward the thermal module 24. Each fan 36 has an intake port 36c on at least the Z2 side end face of the upper and lower end faces facing the Z direction. An intake port 36c can also be provided on the Z1 side end face. The intake port 36c can draw in outside air (cold air) from, for example, a vent formed on the bottom surface of the housing 12. The fan 36 can be a centrifugal fan in which an impeller housed inside the housing is rotated by a motor. The fan 36 can discharge air drawn in from the intake port 36c through the outlet port 36b.

[0027] The fan 36 is attached to the housing member 20 using, for example, two mounting parts 36d and 36e. The mounting parts 36d and 36e can be made up of plate pieces protruding from the sides of the housing of the fan 36. One mounting part 36d is provided on the side opposite to the heat diffusion member 32. The mounting part 36d is fixed to the Z2 side (inner surface 20a) of the housing member 20 with a screw 46. The other mounting part 36e is provided on the side facing the heat diffusion member 32. The mounting part 36e is fixed to the second surface 25B of the motherboard 25 with a screw 47 (see Figure 3A). The screw 47 is fastened, for example, to a female screw hole of a predetermined stud component mounted on the second surface 25B.

[0028] As shown in Figure 2, the enclosure 12 may be provided with an exhaust port 48a formed in the vertical wall 21B (outer wall 48) of its rear edge (Y2 side edge). The exhaust port 48a is a vent that can discharge the air (warm air) discharged from the discharge port 36b of each fan 36 and flowing around the motherboard 25 and thermal module 24 to the outside of the enclosure 12.

[0029] In this embodiment, the vertical wall 21B on the Y2 side extends along its longitudinal direction and has a hinge arrangement groove 12c recessed towards the Y1 side. The outer wall 48 is the bottom wall (front wall) of the hinge arrangement groove 12c. The exhaust port 48a is provided near the center of the outer wall 48 in the longitudinal direction. The exhaust port 48a is composed of a plurality of small windows arranged in close proximity in the X direction, for example. The exhaust port 48a is located between the left and right fans 36, 36 when the direction of alignment of the left and right fans 36, 36 (X direction) is taken as a reference. The exhaust port 48a is on the Y2 side of the rectifier member 38. The vertical wall 21B can also be configured without the hinge arrangement groove 12c. In this case, the exhaust port 48a can be formed in the vertical wall 21B itself, which is the outer wall.

[0030] The dashed arrows in Figure 2 schematically represent the airflow. As shown in Figure 2, in the electronic device 10, the air discharged from the outlets 36b of the left and right fans 36 cools the thermal module 24 and motherboard 25, which absorb and dissipate heat from the CPU 25a and other components. The cooled air is then discharged outside the enclosure 12 through the exhaust port 48a. At this time, on the second surface 25B side of the motherboard 25, an exhaust path 50 is formed between the left and right stud components 42 (screws 44) that fix the leaf spring member 34a on the Y2 side.

[0031] Figure 3A is a schematic, enlarged perspective view of the bracket 56 and its surrounding area shown in Figure 2. Figure 3B is an exploded perspective view showing the operation of attaching the bracket 56 shown in Figure 3A to the motherboard 25. Figure 4 is a schematic side cross-sectional view of the electronic device 10 with respect to the bracket 56 and its surrounding area. Figure 4 is a view of the electronic device 10 cut along the YZ plane passing through the second end 56b of the bracket 56, which will be described later. Figure 5 is a schematic front cross-sectional view of the electronic device 10 with respect to the bracket 56 and its surrounding area.

[0032] As shown in Figures 2 to 5, the electronic device 10 includes a cable 52, a connector 54, and a bracket 56. The cable 52, connector 54, and bracket 56 are located near the edge 12d on the Y2 side of the housing 12. The edge 12d is the edge that is connected to the edge 11a of the lid 11 by a hinge 14.

[0033] Cable 52 is provided in pairs, for example, one on the left and one on the right. One cable 52 is a flat wire for connecting, for example, a display 16 mounted on the lid 11 to the motherboard 25. The other cable 52 is a flat wire for connecting, for example, a camera 17 (see Figure 1) mounted on the lid 11 to the motherboard 25. Each cable 52 can be made of, for example, a flexible printed circuit board (FPC). Each cable 52 is routed from the edge 11a of the lid 11 through the edge 12d of the housing 12 into the housing 12.

[0034] The cable 52 has a connection portion 52a on one side of its end facing the housing 12. The connection portion 52a is a terminal that connects to the connector 54. As shown in Figures 3B to 5, the cable 52 may have a plate 52b on the back surface of the connection portion 52a that forms the back surface of the connection portion 52a. The plate 52b is a metal plate, such as stainless steel (SUS).

[0035] As shown in Figure 4, the cable 52 loops in a roughly S-shape within the housing 12 from the connection part 52a toward the display 16 (or camera 17), and then passes through the edge 12d into the edge 11a of the cover 11. The housing 12 may have a cable insertion hole 48b in the outer wall 48 (vertical wall 21B) of the edge 12d.

[0036] Reference numeral 53 in Figures 3A to 4 indicates a support member for fixing the cable 52 and holding the S-shaped loop. The support member 53 is a strip plate provided so that the cable 52 passes through in the width direction, and both ends are screwed to the inner surface 20a of the housing member 20. The S-shaped loop of the cable 52 is the part that absorbs the excess length of the cable 52 when the lid 11 rotates relative to the housing 12.

[0037] As described above, this embodiment includes a pair of left and right cables 52. Therefore, in this embodiment, there is also a pair of left and right connectors 54 and brackets 56. There may be only one cable 52, or there may be three or more. In this case, it is preferable to provide a number of connectors 54 and brackets 56 corresponding to the number of cables 52.

[0038] The connector 54 is connected to the connection portion 52a of the cable 52. Each connector 54 is mounted on the second side 25B of the motherboard 25. The connector 54 in this embodiment connects the cable 52, which is an FPC, to the motherboard 25, and is a so-called BtoB connector (board-to-board connector).

[0039] The bracket 56 can be made of a metal plate, such as stainless steel (SUS). As shown in Figure 2, the left and right brackets 56 can be used by arranging identical parts symmetrically. The left and right brackets 56 may have different shapes. The bracket 56 is positioned to straddle the cable 52 in the width direction and holds the cable 52 by pressing it down from above the connection part 52a and the connector 54. In this way, the bracket 56 prevents the connection part 52a from coming off the connector 54.

[0040] The bracket 56 may have a roughly bottle shape, being longer in the X direction and narrower in the Y direction when viewed from above. The bracket 56 has a first end 56a on one side and a second end 56b on the other side in the direction that straddles the cable 52 (X direction).

[0041] The first end portion 56a is the part that is fastened to the second surface 25B of the motherboard 25 with a screw 58. A fastening hole 56a1 is formed through the first end portion 56a through which the screw 58 is inserted.

[0042] A stud component 60 for fastening a screw 58 is mounted on the second surface 25B. The stud component 60 is a cylindrical component mounted, for example, by soldering to the ground pattern 25b of the second surface 25B (see Figure 5). The stud component 60 rises from the second surface 25B in the Z2 direction. The stud component 60 has an upward-facing female screw hole 60a that opens at its top surface, and a screw 58 can be fastened to it.

[0043] As shown in Figures 2 to 3B and Figure 5, the stud component 60 is positioned so as to be aligned in the X direction with respect to the stud component 42 that screws the leaf spring member 34a. The stud component 60 is positioned so as to sandwich the connector 54 (cable 52) between it and the stud component 42. The stud component 60 is located on the opposite side of the exhaust path 50 in the X direction when viewed from the stud component 42. As a result, the stud component 60 does not block the exhaust path 50 formed between the left and right stud components 42, 42.

[0044] The second end 56b is the portion that is held down by a part of the thermal module 24 of the motherboard 25 (in this embodiment, the leaf spring member 34a). In other words, the bracket 56 has its first end 56a screwed to the stud component 60, and its second end 56b is supported by the thermal module 24. This allows the bracket 56 to be attached to the motherboard 25 and to hold down the cable 52 against the connector 54 from above (Z2 side).

[0045] The second end 56b may be formed to be narrower in the Y direction than the first end 56a. The bracket 56 may have the first end 56a on the side further from the exhaust path 50 than the second end 56b. In other words, the second end 56b is positioned on the opposite side of the exhaust path 50 in the X direction when viewed from the stud part 42 for the leaf spring member 34a, and does not block the exhaust path 50.

[0046] As shown in Figures 2 to 3B and Figure 5, screw fastening portions 62, protruding pieces 64, and stepped portions 66 can be provided at both ends of the leaf spring member 34a on the Y2 side.

[0047] The screw fastening portion 62 is for fixing the leaf spring member 34a to the motherboard 25. The screw fastening portion 62 has a through hole through which a screw 44 can be inserted and can be fastened to the stud component 42.

[0048] The protruding piece 64 is a plate piece provided to protrude from the screw-fastening portion 62 toward the bracket 56. The protruding piece 64 protrudes from the screw-fastening portion 62 toward the opposite side of the exhaust passage 50 in the X direction. The protruding piece 64 can press against the second end portion 56b of the bracket 56 from above (Z2 side). Specifically, the second end portion 56b is inserted between the protruding piece 64 and the second surface 25B and is supported by the protruding piece 64.

[0049] The stepped portion 66 is a crank-shaped portion in the Z direction provided between the screw-fastening portion 62 and the protruding piece 64. The stepped portion 66 positions the height of the protruding piece 64 from the second surface 25B of the motherboard 25 higher than the screw-fastening portion 62. This allows the stepped portion 66 to eliminate the height difference between the second end portion 56b of the bracket 56 and the leaf spring member 34a (see Figure 5).

[0050] As shown in Figure 5, for example, the top surfaces of the stud parts 42 and 60 are at approximately the same height as the second surface 25B. The protruding piece 64 is at the same height as the top surface of the stud part 42 if there is no stepped portion 66. The first end 56a of the bracket 56 is also at the same height as the top surface of the stud part 60. Therefore, if the heights of the stud parts 42 and 60 are approximately the same, the second end 56b will be flush with the protruding piece 64 and abut against it if there is no stepped portion 66. In particular, the bracket 56 sandwiches the connector 54, the connecting portion 52a, the cable 52, the plate 52b, and the cushioning material 68, which will be described later, between itself and the second surface 25B. For this reason, it is conceivable that the second end 56b side may tilt upward (towards Z2) compared to the first end 56a side (see Figure 5). Therefore, the leaf spring member 34a is provided with a stepped portion 66 in front of the protruding piece 64 so that it can reliably press down on the second end 56b from above. The stepped portion 66 may be omitted depending on the height relationship of the stud parts 42 and 60.

[0051] The second end 56b may have a pair of upright pieces 56b1 that stand up from both sides in the width direction (Y direction). The upright pieces 56b1 stand up on the upper side (Z2 side) which is supported by the projection piece 64. As a result, the second end 56b has a groove shape with a substantially U-shaped cross-section. The pair of upright pieces 56b1, 56b1 are arranged so as to sandwich the projection piece 64 between them and are locked into the end faces of the projection piece 64 on both sides in the width direction (Y direction). As a result, the upright pieces 56b1 act as anti-rotation devices that prevent the bracket 56 from rotating around the first end 56a as a pivot point when the screw 58 is fastened. The upright pieces 56b1 can also simply prevent the second end 56b, which is held down from above by the projection piece 64, from shifting position in the Y direction and coming off the projection piece 64.

[0052] As shown in Figures 3B and 5, the bracket 56 may have a conductive cushioning material 68 on the surface that holds the cable 52. The cushioning material 68 can be made of a conductive sponge or the like. In this embodiment, the cushioning material 68 is a conductive gasket. The cushioning material 68 is fixed to the surface of the bracket 56 with double-sided adhesive tape or the like. The cushioning material 68 is pressed against the cable 52 (plate 52b), electrically connecting the bracket 56 and the cable 52. This allows the bracket 56 to ground the cable 52 to the ground pattern 25b via the screw 57 and stud component 60.

[0053] As shown in Figure 4, a conductive cushioning material 70 can also be fixed to the inner surface of the cover material 21. The cushioning material 70 can be made of a conductive sponge or the like, similar to the cushioning material 68, for example, a conductive gasket. The cushioning material 70 is pressed against the Z2 side surface of the bracket 56. This allows the bracket 56 to ground the cable 52 to the housing member 20 (frame ground) via the cushioning materials 68 and 70.

[0054] As described above, the electronic device 10 of this embodiment comprises a heating element (e.g., CPU 25a), a circuit board (motherboard 25) on which a connector 54 and a stud component 60 are mounted, a thermal module 24 for cooling the heating element, and a flat cable 52 having a connection portion 52a connected to the connector 54. Furthermore, the electronic device 10 includes a bracket 56 provided so as to straddle the cable 52 in the width direction and holding the cable 52 from above the connector 54 and the connection portion 52a. The bracket 56 has a first end portion 56a on one side and a second end portion 56b on the other side in the direction that straddles the cable 52. The first end portion 56a is screwed to the stud component 60. The second end portion 56b is pressed by a part of the thermal module 24.

[0055] Therefore, the electronic device 10 can prevent the cable 52 from becoming disconnected from the connector 54 by supporting the cable 52 with the bracket 56. Moreover, the bracket 56 has its first end 56a screwed to the stud component 60 and its second end 56b held down by the thermal module 24. As a result, the electronic device 10 only needs to mount one stud component 60 on the motherboard 25 for each bracket 56 to be installed. In other words, the electronic device 10 does not need to use two stud components 60 to install one bracket 56. As a result, the electronic device 10 can reduce the number of stud components 60 and reduce component costs. In addition, since the number of stud components 60 to be installed on the motherboard 25 is halved, the electronic device 10 can save space on the motherboard 25. This allows the electronic device 10 to miniaturize the chassis 12 by saving space on the motherboard 25, and also reduces the impact on E / E design.

[0056] In this way, the second end 56b of the bracket 56 is supported from above by a part of the thermal module 24. Therefore, when the electronic device 10 removes the thermal module 24, for example when replacing the CPU 25a or memory mounted on the motherboard 25, the thermal module 24 can be easily removed without removing the bracket 56.

[0057] The thermal module 24 may have a heat diffusion member 32 capable of diffusing heat from the heat-generating element, and a leaf spring member 34a for pressing the heat diffusion member 32 against the heat-generating element. In this case, it is preferable that the second end 56b of the bracket 56 is held down by the leaf spring member 34a. That is, the leaf spring member 34a needs to be fixed to the motherboard 25 in order to press the heat diffusion member 32 against the heat-generating element mounted on the motherboard 25. In other words, of the components of the thermal module 24, at least the leaf spring member 34a is fixed to the motherboard 25. Therefore, by configuring the thermal module 24 so that the second end 56b is held down by the leaf spring member 34a, the bracket 56 can be supported more stably and firmly.

[0058] When the orientation of the pair of fans 36, 36 is taken as the reference direction (X direction), the left and right stud components 60 and brackets 56 of the electronic device 10 can be arranged with a space between them that forms an exhaust path 50 from the discharge port 36b of each fan 36 to the exhaust port 48a of the housing 12. In this case, it is preferable that the first end 56a of each bracket 56 is further from the exhaust path 50 than the second end 56b. This allows the electronic device 10 to avoid the stud component 60 fastening the first end 56a of the bracket 56 interfering with the exhaust path 50. As a result, the electronic device 10 improves the airflow efficiency of the fans 36 and improves the cooling capacity of the thermal module 24. In other words, by making it possible to attach one bracket 56 with one stud component 60, the electronic device 10 can also suppress the influence of the stud component 60 on the thermal design.

[0059] It should be noted that the present invention is not limited to the embodiments described above, and can be freely modified without departing from the spirit of the invention. [Explanation of Symbols]

[0060] 10 Electronic equipment 11 Lid 12 cabinets 24 Thermal Modules 25 Motherboards 25a CPU 32 Heat Diffusion Member 34a Leaf spring member 36 Fans 42,60 Stud parts 48a Exhaust port 50 Exhaust path 52 Cables 52a Connection part 54 Connectors 56 Bracket 56a First end 56b Second end 56b1 Standing piece 62 Screw fastening part 64 Projecting piece 66 Stepped section 68,70 Cushioning material

Claims

1. It is an electronic device, A circuit board with a heating element, connector, and stud components mounted on it, A thermal module for cooling the aforementioned heat-generating element, A flat cable having a connecting portion that connects to the aforementioned connector, A bracket is provided so as to span the cable in the width direction and holds the cable from above the connector and the connection part, Equipped with, The bracket has a first end on one side and a second end on the other side in a direction that straddles the cable. The first end is screwed to the stud component, The second end is pressed by a part of the thermal module. An electronic device characterized by the following features.

2. The electronic device according to claim 1, The thermal module is A heat diffusion member capable of diffusing the heat from the aforementioned heating element, A leaf spring member for pressing the heat diffusion member against the heating element, It has, The second end of the bracket is held in place by the leaf spring member. An electronic device characterized by the following features.

3. The electronic device according to claim 2, The aforementioned leaf spring member is A screw fastening portion that is screwed to the aforementioned substrate, A protruding piece provided so as to protrude from the screw fastening portion, A stepped portion is provided between the screw fastening portion and the protruding piece, causing the height position of the protruding piece from the surface of the substrate to be higher than that of the screw fastening portion, It has, The second end of the bracket is inserted between the protruding piece and the surface of the substrate and is held in place by the protruding piece. An electronic device characterized by the following features.

4. The electronic device according to claim 3, The second end of the bracket has a pair of upright pieces that are locked to the end faces on both sides of the protruding piece. An electronic device characterized by the following features.

5. An electronic device according to any one of claims 1 to 4, A housing containing the aforementioned substrate and the aforementioned thermal module, A pair of fans are mounted within the aforementioned housing, positioned so as to straddle the thermal module between them, and each fan has an outlet on one side facing the other that is capable of discharging air toward the thermal module. Equipped with, The housing has an exhaust port located between the pair of fans when the direction in which the pair of fans are arranged is taken as a reference, The stud component and the bracket are each provided in pairs. With respect to the direction in which the pair of fans are arranged, the pair of stud components and the bracket are arranged with a space between them that forms an exhaust path from the discharge port to the exhaust port of the pair of fans. The pair of brackets are such that the first end is further from the exhaust path than the second end. An electronic device characterized by the following features.

6. An electronic device according to any one of claims 1 to 4, The aforementioned bracket is made of metal. The bracket is provided with a conductive cushioning material on the surface that holds the cable. An electronic device characterized by the following features.

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