An 8U air-cooled machine case based on F-type partition air duct and a design method thereof

Abstract

This invention discloses an 8U air-cooled chassis based on an F-shaped partitioned airflow system and its design method, belonging to the field of industrial chassis heat dissipation technology. Addressing the problems of uneven heat dissipation and difficulty in balancing mixed load demands in existing 8U high-density integrated chassis, this invention proposes an F-shaped three-dimensional partitioned airflow architecture. The chassis interior is divided into a circuit board functional area and a power supply area by partitions. A main air intake is located at the bottom of the front panel, an intake fan is located at the bottom of the circuit board functional area, a first exhaust fan is located at the top, and a second exhaust fan is located at the top of the power supply area. Crucially, a first and a second air distribution plate are respectively installed on both sides of the intake fan, with different numbers of air distribution holes on the two plates to precisely control the airflow ratio entering the circuit board functional area and the power supply area. This invention, through the synergistic effect of the air distribution plate structure and the F-shaped airflow system, achieves on-demand airflow distribution, effectively avoids thermal mixing interference, significantly improves heat dissipation efficiency, and reduces energy consumption.

Description

Technical Field

[0001] This invention relates to the field of industrial chassis heat dissipation technology, and in particular to an 8U air-cooled chassis based on an F-type partitioned airflow and its design method. Background Technology

[0002] As electronic devices become increasingly integrated, 8U standard chassis are widely used to integrate multiple functional boards, high-performance computing modules, and redundant power supplies. However, when multiple high-power CPU boards, multiple functional daughter cards, and high-power power supply modules are integrated inside the chassis, heat dissipation becomes a key bottleneck restricting system stability and lifespan.

[0003] Most existing 8U chassis use straight or U-shaped airflow channels. For example, patent CN219068777U discloses a military portable 6U sealed heat dissipation chassis structure, which forms a straight airflow channel from one side panel to the other by setting a hollow heat dissipation and ventilation device with fins. However, traditional airflow design has the following problems in 8U high-density mixed load scenarios: First, the airflow path is long, resulting in a large temperature difference between the front and back of the chassis (often exceeding 15°C), poor heat dissipation conditions for far-end components, and a surge in fan power consumption; Second, it is difficult to balance the differentiated heat dissipation needs of mixed loads. High-heat components (such as CPUs) and power modules have different airflow requirements, and traditional single airflow channels cannot allocate airflow as needed, resulting in local overheating or energy waste; Third, heat generated by different heat sources is prone to thermal mixing, producing a thermal cascading effect and deteriorating the heat dissipation environment of core components.

[0004] Therefore, designing a new type of high-efficiency heat dissipation airflow that can effectively shorten the heat dissipation path, allocate airflow on demand, and avoid thermal mixing interference for 8U high-density integrated chassis is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0005] This invention aims to overcome the shortcomings of the prior art and provide an 8U air-cooled chassis based on an F-shaped partitioned airflow system and its design method. By constructing an F-shaped three-dimensional partitioned airflow architecture, this invention divides the chassis interior into independent airflow zones, enabling on-demand distribution and independent management of cooling airflow. This solves problems such as uneven heat dissipation, high energy consumption, and severe thermal interference in high-density mixed load scenarios.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solution: In a first aspect, the present invention proposes an 8U air-cooled chassis based on an F-type partitioned airflow duct, comprising: The chassis has a vertically arranged partition inside, which divides the inner cavity of the chassis into a board function area for accommodating functional boards and a power supply area for accommodating power modules. The lower part of the front panel of the chassis is provided with a main air inlet; The top plate of the chassis is provided with a first air outlet corresponding to the board functional area and a second air outlet corresponding to the power supply area; An intake fan is provided at the bottom of the functional area of ​​the board, and a first exhaust fan is provided at the top; a second exhaust fan is provided at the top of the power supply area. A second diversion plate is provided at the bottom of the partition; a first diversion plate is provided at the bottom of the card function area near the front panel of the chassis; and the first diversion plate and the second diversion plate are located on both sides of the intake fan; Different numbers of diversion holes are provided on the second diversion plate and the first diversion plate, respectively.

[0007] Furthermore, the main air inlet is a honeycomb air inlet located in the lower part of the front panel of the chassis housing within a height range of ≤2U.

[0008] Furthermore, the board functional area is configured to accommodate no fewer than 15 standard 6U height functional boards, which are arranged in an array.

[0009] Furthermore, a power supply housing is provided within the power supply area, and the bottom plate of the power supply housing has a honeycomb perforated plate structure, forming a power supply honeycomb air inlet.

[0010] Furthermore, the first air outlet is a honeycomb air outlet, and the second air outlet is a honeycomb air outlet.

[0011] Furthermore, the diversion holes on the first and second diversion plates are multiple rectangular holes evenly distributed in a straight line along the left and right direction.

[0012] Furthermore, the number of diversion holes on the first diversion plate is M, and the number of diversion holes on the second diversion plate is N; satisfying: M≥2N.

[0013] Furthermore, the first flow divider plate has 6 flow divider holes; the second flow divider plate has 2 flow divider holes.

[0014] Secondly, the present invention also proposes an F-type airflow design method for the above-mentioned 8U air-cooled chassis, comprising the following steps: S1. A partition is installed inside the chassis to divide the internal space of the chassis into a board function area and a power supply area; the lower part of the board function area forms a horizontal air duct, the board function area forms a first vertical air duct, and the power supply area forms a second vertical air duct, so that the inside of the chassis is constructed into an F-shaped three-dimensional air duct. S2. A main air inlet is provided at the lower part of the front panel of the chassis, and independent first and second air outlets are provided on the top panel of the chassis for the board function area and the power supply area, respectively. S3. An intake fan and a first exhaust fan are respectively installed at the bottom and top of the functional area of ​​the board, and a second exhaust fan is installed at the top of the power supply area. S4. A first diverter plate and a second diverter plate are respectively installed on both sides of the intake fan; the second diverter plate is installed at the bottom of the partition, and the first diverter plate is installed near the front panel of the chassis; different numbers of diverter holes are designed on the first diverter plate and the second diverter plate.

[0015] Furthermore, in step S4, the airflow ratio between the bottom transverse duct of the board functional area and the power supply area is controlled by designing the number of diversion holes on the first and second diversion plates, so as to meet the design target of wind speed ≥5m / s in the bottom transverse duct of the board functional area and wind speed ≥2.5m / s in the power supply area; it also includes steps S5 and S6: Step S5: Collect the temperature of the functional area of ​​the board, and dynamically adjust the speed of the intake fan and / or the first exhaust fan according to the temperature; Step S6: Collect the temperature of the power supply area and dynamically adjust the speed of the second exhaust fan according to the temperature.

[0016] Due to the adoption of the above technical solution, the beneficial effects of the present invention are as follows: This invention constructs an F-shaped three-dimensional partitioned airflow system to achieve on-demand airflow distribution. Specifically, a partition is installed inside the chassis housing to divide the internal space into a circuit board functional area and a power supply area. The lower area of ​​the circuit board functional area forms a horizontal airflow channel, the circuit board functional area forms a first vertical airflow channel, and the power supply area forms a second vertical airflow channel, thus constructing an F-shaped three-dimensional airflow system inside the chassis housing. Simultaneously, by designing different numbers of diversion holes on the first and second diversion plates, two independent cooling airflows are formed, fundamentally avoiding the problem of different heat loads "competing for airflow" in the same airflow channel. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the 8U air-cooled chassis provided by the present invention after removing the left panel and the left panel of the power supply housing.

[0019] Figure 2 This is a schematic diagram of the 8U air-cooled chassis provided by the present invention after removing the left panel and the front panel.

[0020] Figure 3 This is a schematic diagram illustrating the airflow principle of the 8U air-cooled chassis provided by the present invention.

[0021] The following are the reference numerals: 1. Chassis housing; 2. First air outlet; 3. First exhaust fan; 4. Second air outlet; 5. Second exhaust fan; 6. Power supply housing; 7. Power supply honeycomb air inlet; 8. Partition; 9. Intake fan; 10. Functional board; 11. Main air inlet; 12. First air distribution plate; 13. Second air distribution plate. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0023] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0024] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0025] Combination Figures 1 to 3 As shown, this embodiment provides an 8U air-cooled chassis based on an F-type partitioned air duct. This 8U air-cooled chassis is particularly suitable for high-density systems that require the integration of a large number of computing boards, high-speed signal processing daughter cards, and redundant power supply modules, such as high-performance test and measurement instruments, communication base station equipment, or military ruggedized servers.

[0026] I. Overall Structure The entire 8U air-cooled chassis conforms to the standard 8U height (1U=44.45mm, 8U≈355.6mm) industrial chassis mechanical size requirements. The 8U air-cooled chassis comprises a hexagonal chassis shell 1. The front panel of the chassis shell 1 serves as the user interface and air intake, the rear panel is typically used for signal connections, and the left and right side panels are used for support and fixation. The core innovation of this invention lies in the internal layout of the chassis, the airflow design, and the unique structure of the first and second airflow dividers 12 and 13.

[0027] II. Internal Partitions and Core Components Inside the chassis housing 1, a vertically mounted partition 8 is constructed from sheet metal (such as galvanized steel or stainless steel) providing good strength and thermal conductivity. The partition 8 divides the interior of the chassis housing 1 into two chambers: a front chamber for circuit board functions and a rear chamber for power supplies. This partitioning physically isolates the two main heat source areas.

[0028] 1. Board Function Area This area houses the core computing and signal processing units of the chassis. It contains multiple board guide slots for mounting functional boards 10. These board guide slots are standard existing technology and will not be described in detail here.

[0029] The primary function of the board functional area is to accommodate functional boards 10. Specifically, to meet high-density requirements, this board functional area is configured to accommodate no fewer than 15 standard 6U height functional boards 10. These functional boards 10 may include CPU motherboards, FPGA accelerator cards, data acquisition cards, storage control cards, etc., which are arranged in an array side by side, forming vertical inter-board channels.

[0030] 2. Power Supply Area This area provides a stable and reliable power supply for the entire system. The power supply housing 6 is installed within this area, and can accommodate one or more redundant power modules and related cables. The power supply housing 6 itself also functions as an air duct; its bottom (the side closest to the bottom of the chassis) is not a closed solid plate, but rather designed with a honeycomb perforated plate structure, forming the power supply honeycomb air inlet 7. This allows cooling airflow to enter evenly from the bottom of the power supply housing 6, passing over the power devices and heat sinks of the internal power modules.

[0031] III. F-type air duct structure and double diverter plate design The core of this invention is the construction of an F-shaped three-dimensional air duct inside the chassis housing 1, which is specifically achieved through the following air vent settings and fan layout: S1. A partition 8 is installed inside the chassis housing 1 to divide the internal space of the chassis housing 1 into a board function area and a power supply area; the lower part of the board function area forms a horizontal air duct, the board function area forms a first vertical air duct, and the power supply area forms a second vertical air duct, so that the interior of the chassis housing 1 is constructed into an F-shaped three-dimensional air duct. S2. A main air inlet 11 is provided at the lower part of the front panel of the chassis housing 1, and a first air outlet 2 and a second air outlet 4 are provided on the top plate of the chassis housing 1 for the board function area and the power supply area, respectively. S3. An intake fan 9 and a first exhaust fan 3 are respectively provided at the bottom and top of the functional area of ​​the board, and a second exhaust fan 5 is provided at the top of the power supply area. S4. A first diverter plate 12 and a second diverter plate 13 are respectively set on both sides of the intake fan 9; the second diverter plate 13 is set at the bottom of the partition plate 8, and the first diverter plate 12 is set near the front panel of the chassis housing 1; different numbers of diverter holes are designed on the first diverter plate 12 and the second diverter plate 13.

[0032] (a) Layout of air inlets and outlets and fans 1. Main air intake A large main air intake 11 is provided in the lower part of the front panel of the chassis housing 1 (specifically, in the height range of ≤2U). In order to ensure a high open area ratio while taking into account structural strength and electromagnetic compatibility, the main air intake 11 is a honeycomb air intake. Relatively cool outside air enters the chassis through this intake.

[0033] 2. Air intake and exhaust system of the board's functional area At the bottom of the board functional area, there is a set of intake fans 9. This set of fans is a high static pressure, high flow axial fan. The function of the intake fans 9 is to force a portion of the cold air entering from the main air inlet 11 to be drawn upwards and into the board-to-board passage of the board functional area.

[0034] On the top plate of the chassis 1, directly above the functional area of ​​the circuit board, there is a first air outlet 2, which is a honeycomb air outlet. Inside the first air outlet 2 (i.e., inside the chassis), a first exhaust fan 3 is installed in close contact. The function of the first exhaust fan 3 is to forcefully exhaust the heated air that has flowed through the functional circuit board 10 out of the chassis.

[0035] 3. Air intake and exhaust system for the power supply area The power supply area does not have a separate bottom intake fan. Its cooling air comes from another portion of the airflow entering through the main air intake 11. This airflow is guided into the power supply area by the combined suction of the intake fan 9 and the second exhaust fan 5. A second exhaust vent 4 is located on the top plate of the chassis 1, directly above the power supply area. The second exhaust vent 4 is also a honeycomb vent. A second exhaust fan 5 is installed inside the second exhaust vent 4 to expel the heated air from the chassis.

[0036] (ii) Dual-split plate structure Combination Figure 1 and Figure 2 As shown, in order to achieve precise on-demand airflow distribution, the present invention provides two key airflow control components on both sides of the intake fan 9: The first air diversion plate 12 is located at the bottom of the board's functional area, near the front panel of the chassis 1. Specifically, it is located behind the main air inlet 11 and in front of the intake fan 9 (i.e., upstream of the airflow direction). The first air diversion plate 12 has multiple air diversion holes.

[0037] The second air diverter plate 13 is located at the bottom of the partition 8. Specifically, it is located behind the intake fan 9 (i.e., downstream of the airflow direction) and at the transition position between the partition 8 and the chassis bottom plate. The second air diverter plate 13 also has multiple air diversion holes.

[0038] The first air divider plate 12 and the second air divider plate 13 are located on both sides (front and rear) of the intake fan 9, and the number of air divider holes on the two air divider plates is different. The physical significance of this layout is: The first diverter plate 12 mainly controls how much of the cold air entering from the main air inlet 11 can smoothly enter the bottom horizontal air duct of the board's functional area (i.e., the area where the air intake fan 9 is located).

[0039] The second shunt board 13 mainly controls how much of the airflow that has entered the horizontal air duct at the bottom of the board's functional area will be "leaked" to the power supply area on the right.

[0040] In this embodiment, the diversion holes on the first diversion plate 12 and the second diversion plate 13 are designed as multiple rectangular holes evenly distributed in a straight line along the left and right direction. Compared with circular holes, rectangular holes have a larger range of opening area adjustment and better processing economy.

[0041] (III) Design of the number and proportion of diversion holes In order to achieve differentiated air supply to the high-heat-generating functional area of ​​the circuit board and the relatively low-heat-generating power supply area, the present invention has specially designed the number and ratio of diversion holes.

[0042] Let M be the number of diversion holes on the first diversion plate 12 and N be the number of diversion holes on the second diversion plate 13. Through extensive CFD simulations and experimental verification, this invention found that the optimal airflow distribution effect can be obtained when M ≥ 2N.

[0043] As a specific and verified preferred embodiment, in this embodiment, the number of diversion holes on the first diversion plate 12 is 6, and the number of diversion holes on the second diversion plate 13 is 2. That is, M=6, N=2, satisfying M=3N≥2N.

[0044] This 6:2 pore number ratio can produce the following synergistic effect: The six rectangular holes on the first air distribution plate 12 provide a sufficiently large total opening area to ensure that the intake fan 9 can draw a sufficient amount of cold air from the main air intake 11 to form a high-speed airflow (target ≥5m / s) to cool the functional areas of the board.

[0045] The second air distribution plate 13 has only two small rectangular holes, which limit the airflow leakage from the bottom of the board's functional area to the power supply area. This forces most of the cold air to flow upwards across the board, with a portion entering the power supply area.

[0046] At the same time, the small amount of airflow provided by these two holes is just enough to meet the heat dissipation requirements of the power supply area (target ≥2.5m / s), avoiding the need to set up a separate intake fan for the power supply area, simplifying the structure and reducing costs.

[0047] IV. Working Process and Airflow Path Combination Figure 3 As shown, when the system is started, the intake fan 9, the first exhaust fan 3, and the second exhaust fan 5 start operating simultaneously.

[0048] 1. Cold air entry and initial distribution: Under the negative pressure of the fan, external cold air is drawn into the chassis through the honeycomb main air inlet 11 at the bottom of the front panel, forming a horizontal main airflow. This airflow first encounters the first splitter plate 12.

[0049] 2. First airflow diversion (intake of the transverse air duct in the board functional area): The six rectangular holes on the first diversion plate 12 create the first throttling and distribution of the airflow. Most of the cold air passes smoothly through these six holes and enters the bottom transverse air duct of the board functional area (i.e., the area where the intake fan 9 is located). The rotation of the intake fan 9 further accelerates the upward movement of this airflow.

[0050] 3. Secondary airflow diversion (power supply area intake): A small portion of the airflow entering the horizontal air duct at the bottom of the board's functional area will enter the bottom of the power supply area through the only two rectangular holes on the second diversion plate 13. This portion of the airflow becomes the cooling air for the power supply area. Due to the small number of openings and the small total area of ​​the second diversion plate 13, most of the airflow cannot pass through and is thus forcibly retained within the board's functional area.

[0051] 4. Airflow Conversion and Vertical Ascent (Board Functional Area): Most of the airflow retained at the bottom of the board functional area is immediately redirected vertically upward by the powerful upward suction of the intake fan 9, entering the gaps between the boards in the functional area. This cool air flows over the surface of each functional board 10 at a high velocity (design target ≥5m / s), carrying away the heat generated by high heat flux density devices such as the CPU and FPGA. The heated air continues to rise and, under the suction of the first exhaust fan 3 at the top of the board functional area, is efficiently exhausted outside the chassis through the first honeycomb exhaust port 2.

[0052] 5. Horizontal Airflow Intake and Vertical Ascent (Power Supply Area): A small amount of cool air leaks into the bottom of the power supply area through the two holes of the second diverter plate 13. Under the suction of the second exhaust fan 5, it passes through the power supply honeycomb air inlet 7 at the bottom of the power supply housing 6 and enters the interior of the power supply housing 6 evenly. The airflow exchanges heat with the power devices of the power module, carrying away heat and achieving cooling (design target airflow speed ≥ 2.5m / s). Finally, the hot air is exhausted from the chassis through the second honeycomb air outlet 4 under the suction of the second exhaust fan 5 at the top of the power supply area.

[0053] V. Intelligent Control Logic (A Preferred Implementation) To further leverage the advantages of this invention and achieve energy saving and noise reduction, this embodiment also includes an intelligent control unit (e.g., an embedded microcontroller or BMC management chip). This control unit is electrically connected to the intake fan 9, the first exhaust fan 3, and the second exhaust fan 5.

[0054] Independent control of board functional areas: Temperature sensors are installed at key locations within the board functional areas (such as near the CPU and the board's air intake area). The control unit reads the temperature feedback of the board functional areas in real time. When the board functional area has a light computational load and the temperature is low, the control unit reduces the PWM duty cycle of the intake fan 9 and / or the first exhaust fan 3, causing their speed to decrease, thus reducing noise and power consumption while ensuring heat dissipation. When the board functional area is under high load and the temperature rises and exceeds a preset threshold, the control unit increases the speed of these two fans, prioritizing the design target of ≥5m / s airflow velocity in the bottom horizontal air duct of the board functional area.

[0055] Independent power supply zone control: A temperature sensor is installed inside the power supply zone. The control unit independently adjusts the speed of the second exhaust fan 5 based on the temperature feedback from the power supply zone. Even if the board's functional area is under low load, as long as the power module load is high and the temperature is high, the power supply zone fan can run at full speed independently, and vice versa.

[0056] This partitioned and decoupled control strategy ensures that the distribution of airflow and fan power consumption is perfectly matched with the actual heat demand, achieving true "on-demand cooling".

[0057] VI. Expansion and Optimization of Dual Splitter Design Although this embodiment provides a specific ratio of M=6 and N=2, those skilled in the art should understand that the specific values ​​of M and N can be adjusted according to different system power consumption configurations (e.g., the power consumption of the board's functional area is extremely high while the power consumption of the power supply area is very low, or the power consumption of both is equivalent). As long as the ratio M≥2N is satisfied, the core inventive concept of this invention can be achieved. For example, in one alternative embodiment, the number of shunt holes on the first shunt plate 12 is 8, and the number of shunt holes on the second shunt plate 13 is 3 (M≈2.67N). In another alternative embodiment, the number of shunt holes on the first shunt plate 12 is 4, and the number of shunt holes on the second shunt plate 13 is 2 (M=2N). These variations all fall within the protection scope of this invention.

[0058] Furthermore, the shape of the diversion orifice is not limited to a rectangular orifice; it can be circular, oval, or other regular shapes, as long as a controllable throttling effect can be achieved.

[0059] In summary, this invention provides an efficient, reliable, and energy-saving heat dissipation solution for 8U high-density mixed-load chassis through its innovative F-shaped three-dimensional partitioned airflow design, unique dual-split plate precise airflow control structure, independent fan layout, and intelligent control logic. It has extremely high industrial application value and market prospects.

[0060] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An 8U air-cooled chassis based on an F-type partitioned airflow duct, characterized in that, include: The chassis housing (1) has a vertical partition (8) inside, which divides the inner cavity of the chassis housing (1) into a board function area for accommodating the function board (10) and a power area for accommodating the power module. The lower part of the front panel of the chassis housing (1) is provided with a main air inlet (11). The top plate of the chassis housing (1) is provided with a first air outlet (2) corresponding to the board functional area and a second air outlet (4) corresponding to the power supply area. An intake fan (9) is provided at the bottom of the functional area of ​​the board, and a first exhaust fan (3) is provided at the top; a second exhaust fan (5) is provided at the top of the power supply area. A second diversion plate (13) is provided at the bottom of the partition (8); a first diversion plate (12) is provided at the bottom of the card function area near the front panel of the chassis housing (1); and the first diversion plate (12) and the second diversion plate (13) are located on both sides of the air intake fan (9); Different numbers of diversion holes are provided on the second diversion plate (13) and the first diversion plate (12).

2. The 8U air-cooled chassis based on an F-type partitioned air duct according to claim 1, characterized in that, The main air inlet (11) is a honeycomb air inlet located in the lower part of the front panel of the chassis housing (1) within a height range of ≤2U.

3. The 8U air-cooled chassis based on an F-type partitioned air duct according to claim 1, characterized in that, The board functional area is configured to accommodate no less than 15 standard 6U height functional boards (10), and each functional board (10) is arranged in an array.

4. The 8U air-cooled chassis based on an F-type partitioned air duct according to claim 1, characterized in that, The power supply area is provided with a power supply housing (6), and the bottom plate of the power supply housing (6) is a honeycomb perforated plate structure, which constitutes the power supply honeycomb air inlet (7).

5. The 8U air-cooled chassis based on an F-type partitioned air duct according to claim 1, characterized in that, The first air outlet (2) is a honeycomb air outlet, and the second air outlet (4) is a honeycomb air outlet.

6. The 8U air-cooled chassis based on an F-type partitioned air duct according to claim 1, characterized in that, The diversion holes on the first diversion plate (12) and the second diversion plate (13) are multiple rectangular holes evenly distributed in a straight line along the left and right direction.

7. The 8U air-cooled chassis based on an F-type partitioned air duct according to claim 1, characterized in that, The number of diversion holes on the first diversion plate (12) is M, and the number of diversion holes on the second diversion plate (13) is N; satisfying: M≥2N.

8. The 8U air-cooled chassis based on an F-type partitioned air duct according to claim 7, characterized in that, The first diverter plate (12) has 6 diverter holes; the second diverter plate (13) has 2 diverter holes.

9. A method for designing an F-type air duct for an 8U air-cooled chassis according to any one of claims 1 to 8, characterized in that, Includes the following steps: S1. A partition (8) is set inside the chassis housing (1) to divide the internal space of the chassis housing (1) into a board function area and a power supply area; the lower part of the board function area forms a horizontal air duct, the board function area forms a first vertical air duct, and the power supply area forms a second vertical air duct, so that the interior of the chassis housing (1) is constructed into an F-shaped three-dimensional air duct. S2. A main air inlet (11) is provided at the lower part of the front panel of the chassis housing (1), and independent first air outlet (2) and second air outlet (4) are provided on the top plate of the chassis housing (1) for the board function area and the power supply area respectively. S3. An intake fan (9) and a first exhaust fan (3) are respectively installed at the bottom and top of the board's functional area, and a second exhaust fan (5) is installed at the top of the power supply area. S4. Set a first diverter plate (12) and a second diverter plate (13) on both sides of the air intake fan (9); set the second diverter plate (13) at the bottom of the partition plate (8) and set the first diverter plate (12) near the front panel of the chassis housing (1); design different numbers of diverter holes on the first diverter plate (12) and the second diverter plate (13).

10. The F-type air duct design method according to claim 9, characterized in that, In step S4, by designing the number of diversion holes on the first diversion plate (12) and the second diversion plate (13), the airflow ratio between the bottom horizontal air duct of the board functional area and the power supply area is controlled to meet the design target of wind speed ≥5m / s in the bottom horizontal air duct of the board functional area and wind speed ≥2.5m / s in the power supply area. It also includes steps S5 and S6: Step S5: Collect the temperature of the functional area of ​​the board and dynamically adjust the speed of the intake fan (9) and / or the first exhaust fan (3) according to the temperature; Step S6: Collect the temperature of the power supply area and dynamically adjust the speed of the second exhaust fan (5) according to the temperature.

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