Electrical connector for a board support assembly

Abstract

Disclosed herein is an electrical connector for a substrate support assembly. The electrical connector includes a first interface body, a second interface body coupled to the first interface body, and a recess within the second interface body. Each of the first and second interface bodies includes a plurality of electrical terminals disposed in sockets formed in the first and second interface bodies, respectively. Some of the electrical terminals disposed in the sockets of the first interface body are coupled to respective electrical terminals disposed in the sockets of the second interface body to form a plurality of insulated electrical paths. The second interface body includes a bus bar disposed in the recess and connecting at least two of the plurality of first electrical terminals to at least one of the plurality of second electrical terminals.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 437,844, filed January 9, 2023, which is incorporated herein by reference in its entirety.

[0002] FIELD OF THE DISCLOSURE

[0002] Embodiments of the present disclosure relate generally to semiconductor chamber components, and more particularly to electrical connectors for substrate support assemblies for use in high frequency electric fields. [Background technology]

[0003] 2. Description of Related Art

[0003] Reliable fabrication of sub-nanometer features is one of the key challenges in the next generation of very large scale integration (VLSI) and ultra-large scale integration (ULSI) semiconductor devices. However, as circuit technology limits are pushed, ever-shrinking dimensions place increasing demands on VLSI and ULSI interconnect technology for processing power. Reliable formation of gate structures on substrates is critical to the success of VLSI and ULSI, as well as to the continuing effort to increase circuit density and quality on individual substrates and dies.

[0004] To reduce manufacturing costs, integrated chip (IC) manufacturers demand higher throughput and better device yield and performance from every silicon substrate processed. Several manufacturing techniques being explored for next-generation devices currently under development require processing over a wide temperature range. For example, dry reactive ion etching of a substrate maintained uniformly at cryogenic temperatures allows ions to bombard the upward-facing surface of a material deposited on the substrate with minimal spontaneous etching, resulting in trenches with smooth, vertical sidewalls. Furthermore, the selectivity of etching one material over another can be improved at cryogenic temperatures; for example, silicon-to-silicon selectivity.

[0005]

[0005] Operating a substrate support assembly at cryogenic temperatures presents challenges. For example, expansion and contraction between layers of the substrate support assembly can cause fluid and / or vacuum leaks. These challenges extend to providing electrical connections to heaters and / or voltages for chucking within or onto the substrate support assembly. Additionally, arcing within the substrate support assembly can present numerous problems.

[0006]

[0006] Therefore, there is a need for improved substrate support assemblies. Summary of the Invention

[0007]

[0007] Embodiments of the present disclosure generally relate to an electrical connector suitable for maintaining a vacuum within a process chamber while passing electricity through connections within the connector. In one embodiment, an electrical connector for a substrate support assembly is disclosed herein. The electrical connector includes a first interface body, a second interface body coupled to the first interface body, and a recess disposed within the second interface body. Each of the first and second interface bodies includes a plurality of electrical terminals disposed in sockets formed in the first and second interface bodies, respectively, and some of the electrical terminals disposed in the sockets of the first interface body are coupled to respective ones of the electrical terminals disposed in the sockets of the second interface body to form a plurality of insulated electrical paths. The second interface body includes a bus bar disposed in the recess and connecting at least two of the plurality of first electrical terminals to at least one of the plurality of second electrical terminals.

[0008] In another embodiment, an electrostatic chuck for semiconductor manufacturing is provided. The electrostatic chuck includes a first plate, a second plate, and an electrical connector disposed between the first plate and the second plate. The electrical connector includes a first interface body, a second interface body coupled to the first interface body, an adhesive, and a bus bar. The first interface body includes a connector cover, an outer surface, and a plurality of first electrical terminals. The second interface body includes a plurality of electrical paths, a plurality of second electrical terminals disposed in a plurality of sockets, and a recess disposed within the second interface body. The recess includes a first vertical surface disposed adjacent to the outer surface of the first interface body. An adhesive is disposed between the first vertical surface and the outer surface such that a space between the first vertical surface and the outer surface is void-free. A bus bar is disposed within the recess and connects at least two of the plurality of first electrical terminals to at least one of the plurality of second electrical terminals.

[0009] In another embodiment, a substrate support assembly for semiconductor manufacturing is provided. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly disposed between the ESC and an equipment plate, and an electrical connector disposed between and partially within the ESC base assembly and the equipment plate. The electrical connector includes a first interface body, a second interface body coupled to the first interface body, an adhesive, and a bus bar. The first interface body includes a connector cover, an outer surface, and a plurality of first electrical terminals. The second interface body includes a plurality of electrical pathways, a plurality of second electrical terminals disposed in a plurality of sockets, and a recess disposed within the second interface body. The recess includes a first vertical surface disposed adjacent to the outer surface of the first interface body. An adhesive is disposed between the first vertical surface and the outer surface such that a space between the first vertical surface and the outer surface is void-free. A bus bar is disposed within the recess and connects at least two of the plurality of first electrical terminals to at least one of the plurality of second electrical terminals.

[0010]

[0010] In order that the above-mentioned features of the present disclosure may be understood in detail, a more detailed description of the present disclosure, briefly summarized above, will be had by reference to embodiments. Some embodiments are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary embodiments and therefore should not be considered to limit the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic cross-sectional view of an exemplary plasma processing chamber according to one embodiment. [Figure 2]

[0012] 1 is a schematic cross-sectional view of a portion of an exemplary substrate support assembly according to an embodiment. [Figure 3]

[0013] 6 is a cross-sectional view of an electrical connector according to one embodiment taken along line 3-3 of FIG. 5. [Figure 4]

[0014] 1 is an isometric view of an electrical connector disclosed herein; [Figure 5]

[0015] FIG. 2 is a top plan view of the electrical connector. [Figure 6]

[0016] FIG. 2 is a bottom plan view of the electrical connector. [Figure 7A]

[0017] 2 is an isometric top view of another embodiment of an electrical connector suitable for use in the plasma processing chamber of FIG. 1, among other processing chambers. [Figure 7B]

[0018] FIG. 10 is an isometric bottom view of an electrical connector according to another embodiment. [Figure 8]

[0019] 8 is a cross-sectional view of an electrical connector, according to one embodiment, taken along line 8-8 of FIG. 7A. [Figure 9]

[0020] 9 is a cross-sectional view of an electrical connector according to one embodiment taken along line 9-9 of FIG. 8. [Figure 10]

[0021] FIG. 7B is a top view of a portion of the electrical connector shown in FIG. 7A. DETAILED DESCRIPTION OF THE INVENTION

[0012]

[0022] For ease of understanding, where possible, the same reference numerals have been used to designate identical elements that are common to multiple figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0013]

[0023] The embodiments described herein provide a substrate support assembly that enables a large operating temperature range of an electrostatic chuck (ESC) whereby a substrate disposed thereon can be maintained at a cryogenic processing temperature suitable for processing, while other surfaces of the processing chamber are maintained at a different temperature. The operating temperature range processing temperature (i.e., the temperature of the substrate) is intended to refer to temperatures at the substrate support from below −200° C. to about 350° C.

[0014]

[0024] Although the substrate support assembly is shown below in an etch processing chamber, the substrate support assembly may be utilized in other types of plasma processing chambers, such as physical vapor deposition chambers, chemical vapor deposition chambers, ion implantation chambers, among others, and in other systems in which it is desirable to process substrates maintained at a processing temperature. It should be noted, however, that the substrate support assembly and chamber components described herein may be advantageously utilized at other processing temperatures.

[0015]

[0025] FIG. 1 is a schematic cross-sectional view of an exemplary plasma processing chamber 100 configured as an etch chamber with a substrate support assembly 101. As discussed above, the substrate support assembly 101 can be utilized in other types of plasma processing chambers, such as plasma processing chambers, annealing chambers, physical vapor deposition chambers, chemical vapor deposition chambers, and ion implantation chambers, among others, as well as in other systems where the ability to uniformly maintain the surface of a workpiece, such as a substrate 124, at a cryogenic processing temperature is desirable. Dry reactive ion etching of a substrate 124 maintained within an operating temperature range allows ions to bombard the upward-facing surface of a material disposed on the substrate 124 with less spontaneous etching, so as to form trenches with smooth, vertical sidewalls. For example, while ion diffusion within the pores of a low-k dielectric material disposed on a substrate 124 maintained uniformly within an operating temperature range is reduced, ions continue to bombard the upward-facing surface of the low-k dielectric material, forming trenches with smooth, vertical sidewalls. Furthermore, etch selectivity of one material over another can be improved within the operating temperature range. For example, the selectivity between silicon (Si) and silicon dioxide (SiO2) increases exponentially with decreasing temperature.

[0016]

[0026] The plasma processing chamber 100 includes a chamber body 102 having sidewalls 104, a bottom 106, and a lid 108 that surround a processing region 110. An injector 112 is coupled to the sidewalls 104 and / or the lid 108 of the chamber body 102. A gas panel 114 is coupled to the injector 112 to enable delivery of process gases to the processing region 110. The injector 112 may be one or more nozzles or inlet ports, or alternatively, a showerhead. The process gases, along with any process by-products, are removed from the processing region 110 through exhaust ports 116 formed in the sidewalls 104 or bottom 106 of the chamber body 102. The exhaust ports 116 are coupled to a pumping system 140, which includes a throttle valve and a pump that are utilized to control the vacuum level within the processing region 110. Process by-products are also removed through the exhaust ports 116 using the pumping system 140.

[0017]

[0027] The process gas may be excited to form a plasma in the processing region 110. The process gas may be excited by capacitively or inductively coupling RF power to the process gas. In one embodiment shown in FIG. 1 and which can be combined with other embodiments described herein, multiple coils 118 are positioned above the lid 108 of the plasma processing chamber 100 and coupled to an RF power source 122 via a matching network 120.

[0018]

[0028] The substrate support assembly 101 is positioned in a processing region 110 below an implanter 112. The substrate support assembly 101 includes an electrostatic chuck (ESC) 103 and an ESC base assembly 105. The ESC base assembly 105 is coupled to the ESC 103 and an equipment plate 107. The equipment plate 107 is supported by a ground plate 111 and is configured to facilitate electrical, cooling, heating, and gas connections to the substrate support assembly 101. The ground plate 111 is supported by the bottom 106 of the processing chamber. A dielectric plate 109 electrically insulates the equipment plate 107 from the ground plate 111.

[0019]

[0029] The ESC base assembly 105 includes a base channel 115 fluidly coupled to a cryocooler 117. The cryocooler 117 supplies a base fluid, such as a refrigerant, to the base channel 115, thereby maintaining the ESC base assembly 105, and consequently the substrate 124, at a predetermined cryogenic temperature. Similarly, the facilities plate 107 includes facilities channels 113 (shown in more detail in FIG. 2 ) fluidly coupled to a heating fluid source 119. The heating fluid source 119 supplies facilities fluid to the facilities channels 113 such that the facilities plate 107 is maintained at a predetermined temperature. The heating fluid source 119 includes a heat exchange fluid that maintains the facilities plate 107 at or near ambient temperature. In one embodiment, the base fluid from the cryocooler 117 maintains the ESC base assembly 105 at a temperature lower than the temperature of the facilities plate 107.

[0020]

[0030] The heating fluid source 119 is in fluid communication with the facility channels 113 via a facility inlet conduit 127 connected to an inlet (not shown) of the facility channel 113 and a facility outlet conduit 129 connected to an outlet (not shown) of the facility channel 113 so that the facility plate 107 is maintained at a predetermined ambient temperature. The heat exchange fluid may include a material capable of maintaining an ambient temperature of about -10°C to about 60°C. The heating fluid source 119 supplies the heat exchange fluid, which circulates through the facility channels 113 of the facility plate 107. The heat exchange fluid is typically dielectric or electrically insulating so that no electrical path is formed through the heat exchange fluid as it circulates through the substrate support assembly 101. Non-limiting examples of suitable facility fluids include fluorinated heat transfer fluids such as perfluoropolyether (PFPE) fluids. The heat exchange fluid flowing through the facility channels 113 allows the facility plate 107 to be maintained at a predetermined ambient temperature, which in turn helps maintain the dielectric plate 109 at a predetermined ambient temperature.

[0021]

[0031] The ESC 103 has a support surface 130 and a bottom surface 132 opposite the support surface 130. In one embodiment, which can be combined with other embodiments described herein, the ESC 103 is fabricated from a ceramic material such as alumina (Al2O3), aluminum nitride (AlN), or other suitable material. Alternatively, the ESC 103 can be fabricated from a polymer such as polyimide, polyetheretherketone, or polyaryletherketone.

[0022]

[0032] A bonding layer 133 is provided at the interface between a bottom surface 132 of the ESC 103 and a top surface 134 of the ESC base assembly 105. The ESC 103 may be made from alumina (Al2O3) or aluminum nitride (AlN). The ESC base assembly 105 may be made from aluminum (Al), molybdenum (Mo), ceramic, or a combination thereof. The bonding layer 133 allows strain to be absorbed due to slight differences in the coefficients of thermal expansion (CTE) of the ESC 103 and the ESC base assembly 105 at temperatures between about 90°C and about -200°C during operation.

[0023]

[0033] A chuck electrode 126 is disposed within the ESC 103. The chuck electrode 126 may be configured as a unipolar or bipolar electrode, or in any other suitable arrangement. The chuck electrode 126 is coupled to a chuck power supply 135 via an RF filter and fixture plate 107, which provides direct current (DC) power for electrostatically clamping the substrate 124 to the support surface 130 of the ESC 103. The RF filter prevents the RF power utilized to form a plasma (not shown) within the plasma processing chamber 100 from damaging or causing electrical interference to electrical equipment outside the chamber.

[0024]

[0034] The ESC 103 includes one or more resistive heaters 128 embedded therein. The resistive heaters 128 are used to control the temperature of the ESC 103, which is cooled by the ESC base assembly 105, thereby maintaining a processing temperature suitable for processing a substrate 124 disposed on the support surface 130 of the substrate support assembly 101. The resistive heaters 128 are coupled to a heater power supply 136 via a fixture plate 107 and an RF filter. The RF filter prevents RF power used to form a plasma (not shown) in the plasma processing chamber 100 from damaging or causing electrical interference to electrical equipment outside the chamber. The heater power supply 136 is capable of supplying 500 watts or more of power to the resistive heater 128. The heater power supply 136 includes a controller (not shown) used to control the operation of the heater power supply 136, which is generally configured to heat the substrate 124 to a predetermined operating temperature range. In one embodiment, which can be combined with other embodiments described herein, the resistive heater 128 includes multiple laterally separated heating zones, and the controller enables preferential heating of at least one zone of the resistive heater 128 relative to resistive heaters 128 located in one or more of the other zones. For example, the resistive heaters 128 may be concentrically arranged within the multiple separated heating zones. The resistive heater 128 maintains the substrate 124 at a temperature suitable for processing. In one embodiment, which can be combined with other embodiments described herein, the operating temperature includes the processing temperature. The operating temperature range is from about −250° C. to about 400° C. For example, the operating temperature range is from about −200° C. to about 350° C.

[0025]

[0035] Power to the resistive heater 128 and the ESC 103 from the heater power supply 136 and the chuck power supply 135, respectively, is provided by an electrical feedthrough or electrical connector 138. The electrical connector 138 is described in more detail below.

[0026]

[0036] The cryocooler 117 is in fluid communication with the base channel 115 via a base inlet conduit 123 connected to the inlet of the base channel 115 and via a base outlet conduit 125 connected to the outlet of the base channel 115 so that the ESC base assembly 105 is maintained at a predetermined cryogenic temperature. In one embodiment, which can be combined with other embodiments described herein, the cryocooler 117 includes a base fluid. The base fluid includes a composition that remains liquid at cryogenic temperatures below −50° C. at operating pressure. The base fluid is typically dielectric or electrically insulating, so that no electrical path is formed through the base fluid as it circulates through the substrate support assembly 101. Non-limiting examples of suitable base fluids include fluorinated heat transfer fluids. The cryocooler 117 provides the base fluid, which circulates through the base channel 115 of the ESC base assembly 105. The base fluid flowing through the base channel 115 allows the ESC base assembly 105 to be maintained at a cryogenic temperature, which helps control the lateral temperature profile of the ESC 103 so that the substrates 124 disposed on the ESC 103 are maintained uniformly within an operating temperature range. In one embodiment that can be combined with other embodiments described herein, the cryogenic refrigerator 117 is a single-stage refrigerator operable to maintain a cryogenic temperature below about −50° C. In another embodiment that can be combined with other embodiments described herein, the cryogenic refrigerator 117 is a two-stage refrigerator that utilizes a refrigerant within the two-stage refrigerator so that the base fluid is maintained at a cryogenic temperature below −50° C.

[0027]

[0037] Figure 2 is a schematic cross-sectional view of a portion of an exemplary substrate support assembly 101, according to one embodiment. The substrate support assembly 101 is configured to enable cryogenic operation of the ESC 103, such that a substrate 124 (shown in Figure 1) disposed thereon is maintained within an operating temperature range. The ESC base assembly 105, the facilities plate 107, and the dielectric plate 109 are shown in Figure 2. The ESC 103 is also shown coupled to a top surface 134 of the ESC base assembly 105. Also shown is an electrical connector 138 positioned at the geometric center of the substrate support assembly 101. It is contemplated that the electrical connector 138 may be positioned elsewhere.

[0028]

[0038] During use, as described above, the ESC 103 and ESC base assembly 105 are cooled by the cryocooler 117, and the equipment plate 107 is warmed by the heated fluid source 119. The substrate support assembly 101 is generally divided into two zones, such as a first zone 200A and a second zone 200B. The first zone 200A and the second zone 200B are characterized as different pressure regions. For example, during substrate processing, the first zone 200A is maintained at a negative or vacuum pressure, while the second zone 200B is maintained at or near atmospheric or ambient pressure. The seal 205 prevents leakage between the first zone 200A and the second zone 200B. In another embodiment, the first zone 200A and the second zone 200B are characterized as different temperature regions, but may or may not also be characterized as different pressure regions. For example, during substrate processing, first zone 200A is maintained at a first temperature, while second zone 200B is maintained at a second temperature. The first temperature is lower than the second temperature. In one embodiment, first zone 200A is maintained at a cryogenic temperature, while second zone 200B is maintained at or near ambient temperature, or at a temperature significantly higher than cryogenic temperature. Examples of first temperatures include temperatures from about −10° C. to about −150° C., including up to about −200° C. Examples of second temperatures include temperatures from about 0° C. to about 350° C., including up to about 400° C.

[0029]

[0039] The electrical connector 138, in one aspect, functions to maintain pressure within the first zone 200A and the second zone 200B. A seal 210 is coupled between the equipment plate 107 and the electrical connector 138 to maintain separation of the pressure within the first zone 200A and the second zone 200B. The seal 210 may be any suitable seal or gasket, such as an O-ring type, cup seal, lip seal, or gasket, among others. The seal 210 is fabricated from a polymer, an elastomeric material, or other suitable material.

[0030]

[0040] The electrical connector 138 is coupled to the ESC base assembly 105 by a plurality of fasteners 215 (only one shown in this view), such as screws or bolts. Each fastener 215 is received in a threaded hole 220 formed in the body 225. The dielectric plate 109 is coupled to the facilities plate 107 by one or more fasteners 230 (only one shown in this view), such as screws or bolts.

[0031]

[0041] The electrical connector 138 may include an upper piece 300A and a lower piece 300B. The upper piece 300A includes a plurality of upper or first sockets 235. The lower piece 300B includes a plurality of lower or second sockets 240. Each of the first sockets 235 and the second sockets 240 is configured as a female electrical connector interface. Each of the first sockets 235 is configured to receive a pin 245 of an electrical line coupled to either the resistive heater 128 (shown in FIG. 1) or the chuck electrode 126 (shown in FIG. 1) of the ESC 103. Each of the second sockets 240 is configured to receive a pogo-pin connector (not shown) or other suitable electrical connector coupled to either the heater power supply 136 or the chuck power supply 135 (both shown in FIG. 1).

[0032]

[0042] 3 is a cross-sectional view of an electrical connector 138 disclosed herein. The electrical connector 138 includes an upper or first piece 300A and a lower or second piece 300B opposite the first piece 300A. The first piece 300A and the second piece 300B are coupled to one another. The second piece 300B is coupled to a middle or third interface body 305.

[0033]

[0043] A portion of the electrical connector 138 is disposed within the first zone 200A (shown in FIG. 2 ), and another portion of the electrical connector 138 is disposed within the second zone 200B (shown in FIG. 2 ). For example, the first piece 300A and the third interface body 305 are positioned in the first zone 200A, and the second piece 300B is positioned in the second zone 200B (in terms of pressure). In one embodiment, the first piece 300A and the third interface body 305 are vacuum portions of the electrical connector 138, while the second piece 300B is an atmospheric or peripheral portion of the electrical connector 138.

[0034]

[0044] In FIG. 3 , at least two second sockets 240 and three first sockets 235 are shown in cross section, while two first sockets 235 are at least partially visible behind the cross section of the three first sockets 235. Each of the first sockets 235 is formed in the first piece 300A, and each of the second sockets 240 is formed in the second piece 300B. Each of the first piece 300A and the second piece 300B is fabricated from a dielectric material to electrically insulate the multiple conductive unions 310 disposed between the first piece 300A and the second piece 300B. In one embodiment, the first piece 300A is fabricated from a polymeric material such as a thermoplastic material, e.g., a polyetheretherketone (PEEK) material. In another embodiment, the second piece 300B is fabricated from a ceramic material, e.g., a high-dielectric-constant material such as aluminum oxide. The third interface body 305 may be fabricated from a metallic material, e.g., titanium. A seal groove 312 for receiving seal 210 (shown in FIG. 2) is formed in a lower surface 314 of third interface body 305. Each of first piece 300A and second piece 300B can be brazed, potted, or otherwise coupled to third interface body 305. The ceramic material of second piece 300B promotes thermal insulation and also facilitates brazing to couple electrical connector 138 together.

[0035]

[0045] The connection between the third interface body 305 and the second piece 300B is a relatively small surface-to-surface contact, which can provide a thermal choke that helps isolate the seal 210 from the cooler ESC 103. The connection between the first piece 300A and the second piece 300B, and the third interface body 305 coupled to the back surface of the second piece 300B, can also help to thermally insulate the seal 210.

[0036]

[0046] Each conductive union 310 includes an upper or first electrical terminal 315, a lower or second electrical terminal 320, and a connection tab 325. Each first electrical terminal 315 extends from the conductive union 310 to a first socket 235, and each second electrical terminal 320 extends from the conductive union 310 to a second socket 240. The conductive union 310 also includes a plurality of connection tabs 325. One of the connection tabs 325 is disposed between each pair of first and second electrical terminals 315 and 320. The connection tabs 325 are conductive metals coupled to and / or at least partially surrounding each of the first and second electrical terminals 315 and 320. The separate connection tabs 325 provide electrical connections within the electrical connector 138 between the pair of first and second electrical terminals 315 and 320. Some of the connection tabs 325 extend laterally such that the centerlines of the mating electrical terminals 315, 320 do not have to be aligned, which allows the pitch of the first electrical terminals 315 to be different from the pitch of the electrical terminals 320. In the embodiments described herein, the pitch of the first electrical terminals 315 is greater than the pitch of the electrical terminals 320, thereby allowing the second sockets 240 to be more closely spaced and occupy less space than the first sockets 235.

[0037]

[0047] The first electrical terminal 315, the second electrical terminal 320, and the connection tab 325 are made from a conductive material suitable for efficient electrical transmission. Examples of conductive materials include molybdenum (Mo), copper (Cu), or other conductive metals. The conductive metal may be coated with another conductive metal, such as silver (Ag) or gold (Au). In a specific example, the first electrical terminal 315 is Cu coated with Ag, the second electrical terminal 320 is Mo, and the connection tab 325 is Cu.

[0038]

[0048] One or both of the first electrical terminal 315 and the second electrical terminal 320 can be coupled to the connection tabs 325 by brazing or by a threaded connection 330. The second piece 300B includes protruding sidewalls 335 that separate the connection tabs 325 into the first piece 300A. The protruding sidewalls 335 provide electrical insulation between the different connection tabs 325 coupling each pair of the first electrical terminal 315 and the second electrical terminal 320 such that electrical breakdown and short circuits are substantially prevented. The protruding sidewalls 335 also electrically isolate adjacent electrical paths (e.g., first electrical terminals 315 electrically connected to respective second electrical terminals 320 by connection tabs 325).

[0039]

[0049] Figure 4 is an isometric view of an electrical connector 138 disclosed herein, Figure 5 is a top plan view of the electrical connector 138, and Figure 6 is a bottom plan view of the electrical connector 138.

[0040]

[0050] 4, 5, and 6 show a central terminal set 400 surrounded by a plurality of peripheral terminal sets 405. Each of the central terminal set 400 and peripheral terminal sets 405 includes a separate electrical pathway through a pair of first and second electrical terminals 315, 320. The central terminal set 400 includes one of the first electrical terminals 315 electrically connected to one of the second electrical terminals 320 by one of the connection tabs 325. Similarly, each of the plurality of peripheral terminal sets 405 includes one of the first electrical terminals 315 electrically connected to one of the second electrical terminals 320 by one of the connection tabs 325. Thus, nine separate electrical pathways (one central terminal set 400 and eight peripheral terminal sets 405) are shown in FIGS. 5 and 6.

[0041]

[0051] The central terminal set 400 is coupled to the chuck electrode 126 (shown in FIG. 1 ) of the ESC 103. At least a portion of the peripheral terminal set 405 is dedicated to the heater element of the resistive heater 128 (shown in FIG. 1 ). One of the peripheral terminal set 405 may be coupled to ground.

[0042]

[0052] In one embodiment, the electrical connector 138 is operable to conduct up to approximately 25 amps of current during operation at a temperature range of approximately 25°C to at least approximately -90°C. For example, the electrical connector 138 can operate at a temperature range of at least 15°C to at least -90°C. The electrical connector 138 provides a voltage standoff (breakdown voltage) of at least approximately 7 kilovolts (kV) between the various electrical paths and between the electrical paths and the interface bodies (e.g., first piece 300A, second piece 300B, and third interface body 305). This reduces the possibility of arcing within the substrate support assembly 101. The electrical connector 138 can operate at temperatures ranging from approximately 10°C to at least approximately -90°C during operation, including low operating temperatures. -3 The electrical connector 138 provides a suitable vacuum seal, including pressures of Torr (e.g., approximately 0.0001934 pounds per square inch (psi)) or less. Additionally, the electrical connector 138 provides an operational electrical and sealing interface, including those using a polymer or elastomer seal 210.

[0043]

[0053] Figure 7A is an isometric top view of another embodiment of an electrical connector 700 that may be used in place of electrical connector 138 of Figure 1. Figure 7B is an isometric bottom view of electrical connector 700. Figure 8 is a cross-sectional view of electrical connector 700 taken along section line 8-8 of Figure 7A. Figure 9 is a cross-sectional view of electrical connector 700 taken along section line 9-9 of Figure 8. Figure 10 is a top view of second interface body 711B.

[0044]

[0054] The electrical connector 700 includes a first interface body 711A and a second interface body 711B. The first interface body 711A includes a connector cover 717, which includes a central terminal set 400 surrounded by a plurality of peripheral terminal sets 405, and an external flange area 725. The external flange area 725 includes a shoulder and a ledge extending radially outward relative to the outer diameter of the connector cover 717. The second interface body 711B includes a top surface 721, a recess 715 concentric with the outer diameter 719 of the second interface body 711B, a potting material 901 disposed between the first interface body 711A and the second interface body 711B, and an index hole 713. The index hole 713 passes through the second interface body 711B from the top surface 721 to the bottom surface 731 and is radially offset from the center of the electrical connector 700. The connector cover 717 is disposed over the recess 715 and a portion of the potting material 901 (shown in more detail in FIG. 9 ). According to some embodiments, the outer diameter of the connector cover 717 is smaller than the outer diameter 723 of the recess 715 so that a portion of the potting material 901 is exposed between the connector cover 717 and the body 711B. Alternatively, the outer diameter of the connector cover 717 may be the same size as or larger than the outer diameter of the recess 715 so that the potting material 901 is not exposed between the connector cover 717 and the body 711B. The potting material 901 is configured to maintain a vacuum within the processing region 110. The potting material 901 sealingly couples the first interface body 711A and the second interface body 711B. When the processing region is operating, the connector 700 allows electrical current to pass through the connector 700 without leaking fluid into or out of the processing region 110. The connector 700 provides a means for maintaining a pressure differential between the first interface body 711A and the second interface body 711B.

[0045]

[0055] The electrical connector 700 facilitates reducing thermal energy transferred between the first interface body 711A and the second interface body 711B, allowing vacuum within the processing region and atmospheric conditions outside the processing chamber 100 to be maintained, thereby enhancing the operability of the substrate support 101. For example, the electrical connector 700 is configured to maintain a pressure differential within the substrate support 101.

[0046]

[0056] As shown in FIG. 7B , the second interface body 711B also includes a bottom surface 731, a connection port 733, and a connection boss 735. The connection port 733 is an aperture formed through the bottom surface 731 and configured to allow the common bus bar connection 701 and the return power connection 703 to connect to the power source 135. Multiple connection ports 733 are also contemplated. According to some embodiments, the bottom surface 731 may also include a plurality of blind holes 729 located on the bottom surface 731 radially arranged about the center of the electrical connector 700. The blind holes 729 may be threaded or have threaded inserts to allow the electrical connector 700 to couple to the equipment plate 107. The connection boss 735 is concentric with the outer diameter 719 of the second interface body 711B.

[0047]

[0057] The central terminal set 400 includes one of the first electrical terminals 315 electrically connected to one of the second electrical terminals 320 by one of the connection tabs 325. The second electrical terminal 320 is disposed within a connection boss 735. Similarly, several of the peripheral terminal sets 405 include one of the first electrical terminals 315 electrically connected to one of the second electrical terminals 320 by one of the connection tabs 325. The second electrical terminal 320 in the connection boss 735 is better shown in FIG.

[0048]

[0058] FIG. 9 is a cross-sectional view of the electrical connector 700 disclosed herein, illustrating the recess 715 and the interaction between the first interface body 711A and the second interface body 711B. Additionally, FIG. 9 illustrates an example of where potting material 901 may be present. The potting material 901 can maintain a seal throughout the operating temperatures described above. The potting material 901 is an electrical insulator and may be an adhesive, epoxy, or other suitable material. The potting material 901 can fill any gaps that may exist between the first interface body 711A and the second interface body 711B. The potting material 901 is disposed in the space defined between the first vertical surface and the outer surface and is void-free filled with adhesive. The potting material 901 fills the gaps, creating void-free separation and thereby reducing creepage paths between the electrical components. For example, if the bus bar 801 is not as tall as the connection tab 325, more potting material is placed in the bus bar recess 1005.

[0049]

[0059] 8 , the second electrical terminal 320 includes a bus electrical terminal 830 and a power return electrical terminal 840. In some embodiments, the bus electrical terminal 830 and the power return electrical terminal 840 are disposed radially opposite one another. The first electrical terminal 315 includes a first common electrical terminal 832 and a second common electrical terminal 834. In some embodiments, the first common electrical terminal 832 and the second common electrical terminal 834 are disposed radially opposite one another. In some embodiments, the bus electrical terminal 830 is disposed adjacent to the second common electrical terminal 834, and the power return electrical terminal 840 is disposed adjacent to but separated from the first common electrical terminal 832 by the second interface body 711B.

[0050]

[0060] The bus bar 801, the power return bar 803, and the plurality of tabs 325 are disposed within a recess 715 in the second interface body 711B. The recess 715 formed in the second interface body 711B is better shown in FIG. 10 . Some of the peripheral terminal sets 405 include separate electrical paths through pairs of first and second electrical terminals 315 and 320. In some embodiments, the first common electrical terminal 832 and the second common electrical terminal 834 are connected by the bus bar 801. The bus bar 801 is connected to the bus electrical terminal 830 and the common bus bar connection 701, creating a bus bar electrical path. The first common electrical terminal 832, the second common electrical terminal 834, and the bus bar 801 are connected to the bus electrical terminal 830 by the connection portion 805 of the bus bar 801. The power return bar 803 resides within the recess 715 of the second interface body 711B and is connected to the return power connection 703 and the power return electrical terminal 840, creating a power return bar electrical path. The power return electrical terminal 840 is one of the plurality of second electrical terminals 320. The connections 701, 703 may be soldered wires, although other electrical connection methods are contemplated. The connections 701, 703 may also include cables and other electrical transmission devices. Thus, nine separate electrical paths are shown in FIG. 8: one central terminal set 400, six peripheral terminal sets 405, one bus bar electrical path, and one power return bar electrical path.

[0051]

[0061] The connection shown in FIG. 8 is insulated, with the bodies 711A and 711B held together by a potting material 901. The potting material 901 completely seals the electrical connector 700, keeping the pressures experienced by the first and second zones 200A and 200B separate, i.e., preventing vacuum leakage through the connector. As with other embodiments, the first zone 200A is maintained at a negative or vacuum pressure, while the second zone 200B is maintained at or near atmospheric or ambient pressure. The potting material 901 substantially prevents leakage between the first and second zones 200A and 200B. In another embodiment, the first and second zones 200A and 200B are characterized as distinct temperature zones, but may or may not also be characterized as distinct pressure zones.

[0052]

[0062] FIG. 9 shows the first terminal 315 conductively connected to the second terminal 320 via the connection tab 325, thus forming an electrical path through the electrical connector 700. Another electrical path is formed through the bus bar 801. The bus bar path includes and connects at least the first common electrical terminal 832 (shown in FIG. 8), the second common electrical terminal 834, the bus bar 801, the common bus bar connection 701, and the bus electrical terminal 830. The central electrical path includes at least the first terminal 315 and the second terminal 320, connecting them via the connection 330. In this embodiment, the first common electrical terminal 832, the second common electrical terminal 834, and the bus electrical terminal 830 are connected through blind holes in the bus bar 801. The first terminal 315 and the second terminal 320 are connected through blind holes in the connection tab 325 for a path through the peripheral terminal set 405. First terminal 315 and second terminal 320 are connected through blind holes in connection portion 330. The use of blind holes for connections to bus bar 801, connection portion 330, and connection tab 325 helps prevent leakage into the vacuum through electrical connector 138.

[0053]

[0063] As shown schematically in the cross-sectional view of FIG. 9 , the potting material 901 is between the connector cover 717, the sidewall 335, the first vertical surface 921, and overlies at least the various components 801, 805, 330, and 325 within the electrical connector 700. The second interface body 711B includes a plurality of interior recess walls 925 and the recess 715. FIG. 9 is intended to illustrate examples of where the potting material 901 may be located. For example, the potting material 901 covers the exterior flange area 725 of the cover 717, filling voids, gaps, and / or spaces in the connector 700 and creating a seal between the cover 717 and the first vertical surface 921. The potting material 901 may be disposed on the exterior surface 923 of the exterior flange area 725. For example, the potting material 901 is disposed between and in contact with the exterior surface 923 of the first interface body 711A and the first vertical surface 921 of the recess 715. The potting material 901 seals and secures the first vertical surface 921 and the outer surface 923. The space defined between the first vertical surface 921 and the outer surface 923 is filled with the potting material 901 without any voids. The potting material 901 may be disposed on and in spaces between the cover 717, the interior recess walls 925, and adjacent surfaces of the bus bar 801, the power return bar 803, the connection tabs 325, and the connections 330. Additionally, the potting material 901 may be present in lateral gaps and / or spaces between the second interface body 711B, the side walls 335, the bus bar 801, the power return bar 803, the connection tabs 325, and the connections 330. For example, the recess 715 of the second interface body 711B includes a lower surface 927. The lower surface 927 is parallel to the upper surface 721. The lower surface 929 of the bus bar 801 is substantially parallel to the lower surface 927 of the second interface body 711B. The lower surface 929 of the bus bar 801 is laterally separated from the lower surface 927 of the second interface body 711B by the potting material 901. Similarly, the cover 717 of the first interface body 711A is separated from the upper surface 933 of the connection tab 325 by the potting material 901. In another embodiment, the lower surface 927 of the second interface body 711B is laterally separated from the lower surface 931 of the connection tab 325 by the potting material 901. The separation ensures both vertical and horizontal isolation.

[0054]

[0064] The potting material 901 electrically insulates the electrical paths of the electrical connector 700 and can seal the connector when used in a vacuum environment. The potting material 901 creates a void-free seal within the electrical connector 700. Furthermore, the potting material 901 can hold the components of the electrical connector 700 together to form a unitary body, which may also be referred to as a solid composite. The potting material 901 creates a seal such that the electrical connector 700 seals off at least the pressure experienced by the top surface 721 from the pressure experienced by the bottom surface 731. In other words, the potting material 901 maintains a pressure differential across the top surface 721 and the bottom surface 731. By having a void-free seal, gases do not leak to atmospheric conditions outside the processing chamber 100 when a vacuum is induced within the processing chamber 100.

[0055]

[0065] As shown in FIG. 10 , recess 715 is provided to indicate the recess within second interface body 711B and recess 715. According to some embodiments, recess 715 includes at least first recess 1013 and interior recesses 1003, 1005, 1009, 1021. Recess 715 has an annular shape centered about the center of electrical connector 700. Recess 715 begins at recess outer diameter 723, extends downward from upper surface 721, and has first surface 1011 of first recess 1013. The interior recess begins at first surface 1011 and extends to lower surface 927, as shown in FIG. 9 , and has recess depth 911. The interior recess is defined by interior recess walls 925 ( FIG. 9 ).

[0056]

[0066] The interior recesses 1003, 1005, 1009, 1021 include at least a power return recess 1003, a busbar recess 1005, one or more tab recesses 1009, and a connection recess 1021. The tab recess 1009 includes a terminal aperture 1017. The tab recess 1009 is configured to attach the connection tab 325 below the first surface 1011. The power return recess 1003 includes the terminal aperture 1007 and a connection port 733 formed in the bottom surface 731. The power return recess 1003 is configured to attach the power return bar 803 below the first surface 1011. The busbar recess 1005 includes the terminal aperture 1015 and the connection port 733 extending through the bottom surface 731, and is configured to attach the busbar 801 below the first surface 1011. The connection recess 1021 is aligned with the central axis of the electrical connector 700, includes a terminal aperture 1023, and is configured to retain the connection portion 330 below the first surface 1011. The lower surface 927 is the same depth as the interior recess, although various depths are contemplated.

[0057]

[0067] Terminal apertures 1007, 1015, 1017, 1023 form ports that extend through the second interface body 711B and exit into the second socket 240 of the connection boss 735. The internal recess is configured to be deep enough to allow the potting material 901 to form an insulating seal over at least the internal components 801, 803, 325.

[0058]

[0068] Internal recesses 1003, 1005, 1009, 1021 are defined by internal recess walls 925. Internal recess walls 925 are approximately perpendicular to top surface 721 (FIG. 9).

[0059]

[0069] Advantages of the present disclosure include improved sealing of connection points within the substrate support assembly, a wider operating temperature range, enhanced arcing resistance, and improved production life.

[0060]

[0070] Advantages also include reduced creepage paths within the connectors of the substrate support assembly. It is contemplated that one or more aspects disclosed herein may be combined. By way of example, one or more aspects, features, components, operations, and / or properties of the processing chamber 100, the substrate support assembly 101, the electrical connector 138, the electrical connector 700, the bus bar 801, and / or the potting material 901 may be combined.

[0061]

[0071] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, which scope is determined by the following claims.

Claims

1. 1. An electrical connector, comprising: a first interface body, Connector cover, and a plurality of first electrical terminals a first interface body comprising: a second interface body sealingly coupled to the first interface body, Multiple electrical pathways, a plurality of second electrical terminals disposed in the plurality of sockets; and a recess disposed within the second interface body, the recess connecting the plurality of first electrical terminals and the plurality of second electrical terminals by the plurality of electrical paths; a second interface body comprising: an adhesive sealingly coupling the first interface body and the second interface body; a bus bar disposed in the recess and connecting at least two of the plurality of first electrical terminals to at least one of the plurality of second electrical terminals; An electrical connector comprising:

2. 10. The electrical connector of claim 1, further comprising a power return bar coupled to at least one of the second electrical terminals disposed in the socket of the second interface body.

3. 3. The electrical connector of claim 2, wherein a bus bar is connected to a bus bar connection and the power return bar is coupled to a power return electrical terminal.

4. The electrical connector of claim 1 , further comprising an index hole disposed through the second interface body.

5. The electrical connector of claim 1 , wherein the adhesive insulates the plurality of electrical paths from the first interface body and the second interface body.

6. 6. The electrical connector of claim 5, wherein the adhesive is electrically insulating at temperatures from about -200°C to about 350°C.

7. 6. The electrical connector of claim 5, wherein said adhesive fills said recess so that said electrical connector becomes a solid composite.

8. 6. The electrical connector of claim 5, wherein the recess includes a first recess partially defined by a first vertical surface, and the adhesive is in contact with an outer surface of the first interface body and all of the first vertical surface of the recess.

9. 6. The electrical connector of claim 5, wherein the recess includes a first recess partially defined by a recess outer diameter, and the adhesive contacts all of the surfaces defined by the recess outer diameter.

10. 1. An electrostatic chuck for semiconductor manufacturing, comprising: a first plate; a second plate; and an electrical connector disposed between the first plate and the second plate; wherein the electrical connector comprises: a first interface body, Connector cover, outer surface, and a plurality of first electrical terminals a first interface body comprising: a second interface body coupled to the first interface body, the second interface body comprising: Multiple electrical pathways, a plurality of second electrical terminals disposed in the plurality of sockets; and a recess disposed within the second interface body, the recess having a first vertical surface, the first vertical surface disposed adjacent the outer surface of the first interface body; a second interface body comprising: an adhesive sealingly securing the first vertical surface and the outer surface, the adhesive filling a space defined between the first vertical surface and the outer surface without voids; and a bus bar disposed in the recess and connecting at least two of the plurality of first electrical terminals to at least one of the plurality of second electrical terminals; Equipped with Electrostatic chuck.

11. 11. The electrostatic chuck of claim 10, wherein the adhesive is configured to be electrically insulating at temperatures from about -200°C to about 350°C.

12. The electrostatic chuck of claim 10 , further comprising a connection tab disposed between the pair of first and second electrical terminals.

13. The electrostatic chuck of claim 12 , wherein the adhesive is disposed on an upper surface and a lower surface of the connection tab.

14. 11. The electrostatic chuck of claim 10, further comprising a power return bar coupled to at least one of the second electrical terminals disposed in a socket of the second interface body.

15. The plurality of first electrical terminals a first common electrical terminal; a second common electrical terminal disposed radially opposite to the first common electrical terminal; 11. The electrostatic chuck of claim 10, wherein the first common electrical terminal and the second common electrical terminal are electrically coupled to the bus bar.

16. 1. A substrate support assembly for semiconductor manufacturing, comprising: an electrostatic chuck (ESC); an ESC base assembly disposed between the ESC and an equipment plate; an electrical connector disposed between and partially within the ESC base assembly and the equipment plate; wherein the electrical connector comprises: a first interface body, Connector cover, outer surface, and a plurality of first electrical terminals a first interface body comprising: a second interface body coupled to the first interface body, the second interface body comprising: Multiple electrical pathways, a plurality of second electrical terminals disposed in the plurality of sockets; and a recess disposed within the second interface body, the recess having a first vertical surface, the first vertical surface disposed adjacent the outer surface of the first interface body; a second interface body comprising: an adhesive that seals and secures the first vertical surface and the outer surface, the adhesive filling a space defined between the first vertical surface and the outer surface without voids; and a bus bar disposed in the recess and connecting at least two of the plurality of first electrical terminals to at least one of the plurality of second electrical terminals; Equipped with Substrate support assembly.

17. 17. The electrostatic chuck of claim 16, wherein the adhesive is disposed between the bus bar, the first interface body, and the second interface body.

18. 17. The electrostatic chuck of claim 16, wherein the adhesive is configured to be electrically insulating at temperatures from about -200°C to about 350°C.

19. The plurality of first electrical terminals a first common electrical terminal; a second common electrical terminal disposed radially opposite to the first common electrical terminal; 17. The electrostatic chuck of claim 16, wherein the first common electrical terminal and the second common electrical terminal are electrically coupled to the bus bar.

20. the plurality of second electrical terminals a bus electrical terminal; a power return electrical terminal disposed radially opposite said bus electrical terminal; 17. The electrostatic chuck of claim 16, wherein the bus electrical terminal is coupled to the bus bar, the power return electrical terminal is coupled to a power return bar, and the power return bar is electrically insulated from the bus bar.

Images