Antenna board and front-end module including the same

Abstract

The antenna substrate of the embodiment includes a transmission line that includes a plurality of antenna layers stacked vertically apart from each other, an antenna insulating layer disposed between the plurality of antenna layers, and an electrostatic feeding unit that electrostatically feeds the plurality of antenna layers with the antenna insulating layer in between. The plurality of antenna layers include a plurality of high-frequency antenna layers that radiate high-frequency signals in a first radio frequency band and are stacked vertically above the electrostatic feeding unit, and a low-frequency antenna layer that radiates low-frequency signals in a second radio frequency band lower than the first radio frequency band and is disposed below the electrostatic feeding unit.

Description

Technical Field

[0001] The embodiments relate to an antenna substrate and a front-end module including the same.

Background Art

[0002] In recent years, efforts have been made to develop an improved 5G (5th generation) communication system or a pre-5G communication system to meet the demand for wireless data traffic.

[0003] To achieve a high data transmission rate, the 5G communication system uses frequencies in the millimeter wave (mmWave) band.

[0004] To mitigate the path loss of radio waves in the ultra-high frequency band and increase the transmission distance of radio waves, integrated technologies such as beamforming, massive multiple-input / multiple-output (massive MIMO), and array antennas have been developed in the 5G communication system. Although the size of an antenna substrate that radiates a signal having such a frequency band may increase, miniaturization of the antenna substrate is required for mounting on a smartphone or the like, and various studies have been conducted to increase the bandwidth of the antenna substrate without increasing its size.

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of the embodiments is to provide an antenna substrate that is small but has a wide bandwidth at a wide high frequency, and a front-end module including the same.

Means for Solving the Problems

[0006] An antenna substrate according to one embodiment includes a plurality of antenna layers stacked vertically apart from each other, an antenna insulating layer disposed between the plurality of antenna layers, and a transmission line including an electrostatic power supply unit that electrostatically supplies power to the plurality of antenna layers with the antenna insulating layer in between. The plurality of antenna layers may include a plurality of high-frequency antenna layers that radiate high-frequency signals in a first radio frequency band and are stacked vertically on the electrostatic power supply unit, and a low-frequency antenna layer that radiates low-frequency signals in a second radio frequency band lower than the first radio frequency band and is disposed below the electrostatic power supply unit.

[0007] For example, the plurality of high-frequency antenna layers may include an upper high-frequency antenna layer and a lower high-frequency antenna layer positioned vertically between the upper high-frequency antenna layer and the electrostatic feeding unit.

[0008] For example, the transmission line may further include an upper via connecting the electrostatic power supply unit and the lower high-frequency antenna layer.

[0009] For example, the transmission line may further include a main via having one end that penetrates the low-frequency antenna layer, a lower via having one end connected to the electrostatic feeding section, and a via connection section that connects the other end of the lower via to the one end of the main via.

[0010] For example, the lower high-frequency antenna layer may have a larger surface area than the upper high-frequency antenna layer.

[0011] For example, the upper high-frequency antenna layer may include a first central portion and a plurality of peripheral portions that are horizontally separated from the first central portion by a gap and arranged around the first central portion.

[0012] For example, the lower high-frequency antenna layer may include a second central portion.

[0013] For example, the edge of the second central portion may overlap with the gap in the vertical direction.

[0014] For example, the entire first central portion may overlap with the second central portion in the vertical direction.

[0015] A front-end module according to another embodiment includes a plurality of horizontally spaced antenna regions, each of which includes an antenna section, the antenna section including a transmission line including a plurality of antenna layers stacked vertically spaced apart from each other, an antenna insulating layer disposed between the plurality of antenna layers, and an electrostatic feeding section that electrostatically feeds the plurality of antenna layers with the antenna insulating layer in between, the plurality of antenna layers may include a plurality of high-frequency antenna layers that radiate high-frequency signals in a first radio frequency band and are stacked vertically above the electrostatic feeding section, and a low-frequency antenna layer that radiates low-frequency signals in a second radio frequency band lower than the first radio frequency band and is disposed below the electrostatic feeding section. [Effects of the Invention]

[0016] The antenna substrate and front-end module including it according to the embodiment have a wide bandwidth in the high-frequency range despite their small volume, and can cover a wide frequency range of 37 GHz to 43.5 GHz. [Brief explanation of the drawing]

[0017] [Figure 1] A plan view of the antenna substrate according to the embodiment is shown. [Figure 2] Figure 1 shows a perspective view of the antenna substrate. [Figure 3] Figure 1 shows a cross-sectional view obtained by cutting along the line I-I' shown in Figure 1. [Figure 4] A schematic perspective view of the antenna substrate according to the embodiment is shown. [Figure 5] A perspective view of the antenna substrate according to the embodiment is shown. [Figure 6a] Figure 5 shows a cross-sectional view of the antenna substrate. [Figure 6b] Figure 6a shows a plan view of the antenna substrate. [Figure 7a] Figure 5 shows a plan view according to an embodiment of the first power supply board and the second power supply board. [Figure 7b] Figure 5 shows a plan view according to an embodiment of the first power supply board and the second power supply board. [Figure 8] Figure 6 shows a cross-sectional view of an antenna substrate according to a comparative example. [Figure 9] Figure 7 is a graph showing the reflection loss for the antenna substrate according to the comparative example. [Figure 10] Figure 8 is a graph showing the reflection loss for the antenna substrate according to the embodiment. [Figure 11] Figure 9 shows a block diagram of a front-end module according to the embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

[0018] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0019] However, the technical idea of the present invention is not limited to some of the described embodiments, and can be embodied in various different forms. Within the scope of the technical idea of the present invention, one or more of the components can be selectively combined and replaced among the embodiments for use.

[0020] In addition, the terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted in a meaning generally understood by those having ordinary knowledge in the technical field to which the present invention pertains, unless otherwise specifically defined and described. Terms generally used as defined in a dictionary should be interpreted in consideration of the meaning in the context of the related art.

[0021] In addition, the terms used in the embodiments of the present invention are for explaining the embodiments and do not limit the present invention. In this specification, the singular form may include the plural form unless otherwise specifically mentioned in the text, and when described as "at least one (or one or more) of A and (and) B, C", it may include one or more of all combinations that can be combined with A, B, and C.

[0022] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are used to distinguish a component from other components, and the terms do not limit the essence, order, or sequence of the component.

[0023] Furthermore, when it is stated that one component is “linked,” “joined,” or “connected” to another component, this may include not only cases where the component is directly linked, joined, or connected to the other component, but also cases where it is “linked,” “joined,” or “connected” to the other component or through other components.

[0024] Furthermore, when it is stated that a component is formed or positioned "above (upper surface) or below (lower surface)" of a component, "above (upper surface)" or "lower (lower surface)" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Also, when expressed as "above (upper surface) or below (lower surface)," it can include not only the upward direction but also the downward direction, with respect to one component.

[0025] The antenna substrate according to the embodiment will be described below with reference to the attached drawings. Here, the term "antenna substrate" may refer to a hybrid antenna substrate, an antenna-in-package (AIP), an antenna array substrate, an antenna array, etc.

[0026] For convenience, the antenna substrate 100 will be described using the Cartesian coordinate system (x-axis, y-axis, z-axis), but it is naturally possible to describe it using other coordinate systems as well. Furthermore, in the Cartesian coordinate system, the x-axis, y-axis, and z-axis are orthogonal to each other, but the embodiments are not limited to this. That is, the x-axis, y-axis, and z-axis may intersect each other. Hereinafter, for the sake of explanation, the x-axis direction will be referred to as the "first direction," the y-axis direction as the "second direction," the z-axis direction as the "third direction" or "vertical direction," and at least one of the x-axis or y-axis directions will be referred to as the "horizontal direction."

[0027] Figure 1 shows a plan view of the antenna substrate 100 according to an embodiment, and Figure 2 shows a perspective view of the antenna substrate 100 shown in Figure 1.

[0028] The antenna substrate 100 according to the embodiment may include a plurality of antenna regions arranged at horizontal spacing. For example, as shown in Figures 1 and 2, the antenna substrate 100 may include a first antenna region A1, a second antenna region A2, a third antenna region A3, and a fourth antenna region A4 arranged in the y-axis direction, which is the horizontal direction, but the embodiment is not limited thereto. That is, according to other embodiments, the antenna substrate 100 may include more or fewer than four antenna regions.

[0029] Figure 3 shows a cross-sectional view obtained by cutting along the line I-I' shown in Figure 1.

[0030] The configuration of the third antenna region A3 (hereinafter referred to as the "antenna region") will be described below with reference to Figure 3. However, since the other antenna regions A1, A2, and A4 have the same configuration as the third antenna region A3, redundant explanations will be omitted.

[0031] In one embodiment, the antenna region 200 may include an antenna section ANT and a routing section ROT. In another embodiment, the antenna region 200 may further include a core section CO. That is, the core section CO may be omitted in the antenna region 200.

[0032] In one embodiment, as shown in Figure 3, the antenna unit ANT is positioned above the core unit CO, the routing unit ROT is positioned below the core unit CO, and the core unit CO may be positioned between the antenna unit ANT and the routing unit ROT.

[0033] In other embodiments, the antenna section (ANT) and the routing section (ROT) may be arranged on the same horizontal plane.

[0034] In another embodiment, the antenna section ANT may be stacked and arranged on top of the routing section ROT.

[0035] In another embodiment, the routing section ROT and the antenna section ANT may be arranged at a distance from each other, and the routing section ROT and the antenna section ANT may be electrically connected to each other by a connecting member, such as a flexible printed circuit board (FPCB).

[0036] In another embodiment, the routing section ROT and the antenna section ANT may be arranged at a distance from each other, and the routing section ROT and the antenna section ANT may be electrically connected to each other by a connecting member, such as a solder ball or a metal bump.

[0037] The following description will be based on an example in which the antenna section ANT and routing section ROT of the antenna region 200 are arranged as shown in Figure 3, but the example is not limited to a specific arrangement between the antenna section ANT and the routing section ROT.

[0038] The antenna section (ANT) may include multiple wiring layers (hereinafter referred to as "antenna layers") and insulating layers (hereinafter also referred to as "antenna insulating layers") stacked vertically spaced apart from each other. Here, the wiring layers may mean patches, antenna patches, patch antennas, or patch layers.

[0039] Multiple antenna layers may be sequentially stacked on top of the core CO, and antenna insulating layers may be placed between the multiple antenna layers.

[0040] Although not shown in Figure 3, the routing section (ROT) and the antenna section (ANT) may each include transmission lines. Current supplied via the ports can be fed to the corresponding antenna layer among multiple antenna layers via transmission lines arranged in the routing section (ROT) and the antenna section (ANT).

[0041] For example, multiple antenna layers may include the first antenna layer AL1 to the Mth antenna layer ALM, which are stacked sequentially from top to bottom vertically from the core CO, where M is a positive integer greater than or equal to 2.

[0042] The first antenna layer AL1 can correspond to the top layers 120-1, 120-2, 120-3, and 120-4 of the first antenna region A1, second antenna region A2, third antenna region A3, and fourth antenna region A4, respectively, as shown in Figures 1 and 2.

[0043] Between the first antenna layer AL1 and the M-th antenna layer ALM, the first antenna insulating layer DL11 to the M-1 antenna insulating layer DL1(M-1) may be arranged.

[0044] For example, if M is 7, the antenna section ANT may include first antenna layers AL1 to seventh antenna layers AL7 and first antenna insulating layers DL11 to sixth antenna insulating layers DL16, which are sequentially stacked vertically from its top to its core section CO. That is, the first antenna insulating layer DL11 is located between the first antenna layer AL1 and the second antenna layer AL2, the second antenna insulating layer DL12 is located between the second antenna layer AL2 and the third antenna layer AL3, the third antenna insulating layer DL13 is located between the third antenna layer AL3 and the fourth antenna layer AL4, the fourth antenna insulating layer DL14 is located between the fourth antenna layer AL4 and the fifth antenna layer AL5, the fifth antenna insulating layer DL15 is located between the fifth antenna layer AL5 and the sixth antenna layer AL6, and the sixth antenna insulating layer DL16 is located between the sixth antenna layer AL6 and the seventh antenna layer AL7.

[0045] On the other hand, the routing section (ROT) may have the aforementioned transmission lines, and the multiple wiring layers arranged in the routing section (ROT) may include signal patterns, power supply patterns, or resistance patterns. Furthermore, the routing section (ROT) may have a combination of various routing characteristics, such as power / data, input / output, and RF (radio frequency) routing.

[0046] Similar to the antenna section (ANT), the routing section (ROT) may also include multiple wiring layers (hereinafter also referred to as "routing layers") and insulating layers (hereinafter also referred to as "routing insulating layers").

[0047] A routing isolation layer can be placed between multiple routing layers.

[0048] The first routing layer RL1 to the Nth routing layer RLN may be arranged sequentially downward in a vertical direction from the core CO. Here, N is a positive integer of 2 or more, and may be the same as M. In this case, the first routing isolation layer DL21 to the N-1th routing isolation layer DL2(N-1) may be arranged between the first routing layer RL1 to the Nth routing layer RLN.

[0049] The first routing layer RL1 may be the main ground (or grounding layer) GND formed by a ground GND pattern.

[0050] Alternatively, the antenna section ANT may be formed on the routing section ROT without providing a core section CO. In this case, the antenna section ANT may be formed on the first routing layer RL1, which is the main ground.

[0051] For example, if N is 7, the same as M, the routing section ROT may include first routing layers RL1 to 7th routing layers RL7 and first routing insulation layers DL21 to 6th routing insulation layers DL26 that are sequentially stacked vertically from the core section CO. That is, the first routing insulation layer DL21 may be placed between the first routing layer RL1 and the second routing layer RL2, the second routing insulation layer DL22 may be placed between the second routing layer RL2 and the third routing layer RL3, the third routing insulation layer DL23 may be placed between the third routing layer RL3 and the fourth routing layer RL4, the fourth routing insulation layer DL24 may be placed between the fourth routing layer RL4 and the fifth routing layer RL5, the fifth routing insulation layer DL25 may be placed between the fifth routing layer RL5 and the sixth routing layer RL6, and the sixth routing insulation layer DL26 may be placed between the sixth routing layer RL6 and the seventh routing layer RL7.

[0052] The materials of the first antenna layer AL1 to the Mth antenna layer ALM, the core layer CO, and the first routing layer RL1 to the Nth routing layer RLN, as described above, may include metallic substances such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof.

[0053] Furthermore, each of the aforementioned first antenna insulating layer DL11 to the M-1 antenna insulating layer DL1 (M-1) and the first routing insulating layer DL21 to the N-1 routing insulating layer DL2 (N-1) can be embodied in an insulating material (hereinafter referred to as "insulating material"). For example, these insulating materials may be thermosetting resins such as epoxy resin, thermoplastic resins such as polyimide, or materials that include reinforcing materials such as glass fibers and / or inorganic fillers together, such as ABF, PID, BCC, or prepreg (PPG). However, the insulating material is not limited to resin materials; for example, a glass plate or a ceramic plate may be used. However, the examples are not limited to the specific materials of each of the first antenna insulating layer DL11 to the M-1 antenna insulating layer DL1 (M-1) and the first routing insulating layer DL21 to the N-1 routing insulating layer DL2 (N-1).

[0054] Hereinafter, an embodiment of the antenna section ANT on the antenna substrate according to the example will be described as follows with reference to the attached Figure 4.

[0055] Figure 4 shows a schematic perspective view of the antenna substrate according to an embodiment.

[0056] The antenna substrate shown in Figure 4 may include multiple high-frequency band (HB) antenna layers (hereinafter referred to as "high-frequency antenna layers") 210, low-frequency band (LB) antenna layers (hereinafter referred to as "low-frequency antenna layers") 212, a transmission line, and an antenna insulation layer.

[0057] In Figure 4, the white areas, excluding the multiple high-frequency antenna layers 210 and low-frequency antenna layers 212, and the transmission lines, can correspond to antenna insulation layers.

[0058] Multiple high-frequency antenna layers 210 may be arranged in a vertical stack, radiating high-frequency signals (or HB signals) in the first radio frequency band.

[0059] For example, multiple high-frequency antenna layers 210 may include an upper high-frequency antenna layer 210H and a lower high-frequency antenna layer 210L. The upper high-frequency antenna layer 210H is located at the top of the antenna section, and the lower high-frequency antenna layer 210L may be positioned vertically between the upper high-frequency antenna layer 210H and the low-frequency antenna layer 212.

[0060] Multiple high-frequency antenna layers 210 can radiate signals having frequencies belonging to the millimeter-wave (mmWave) frequency band.

[0061] The low-frequency antenna layer 212 plays the role of radiating low-frequency signals (or LB signals) in a second radio frequency band that is lower than the first radio frequency band.

[0062] The transmission line arranged in the antenna section ANT may include the electrostatic feed section 310 and the upper via VAU.

[0063] The electrostatic power supply unit 310 is arranged perpendicularly opposite to each of the multiple high-frequency antenna layers 210 and low-frequency antenna layers 212, with an antenna insulating layer in between.

[0064] In one embodiment, a plurality of high-frequency antenna layers 210, namely an upper high-frequency antenna layer 210H and a lower high-frequency antenna layer 210L, are arranged on the electrostatic feeding unit 310, and a low-frequency antenna layer 212 may be arranged below the electrostatic feeding unit 310. The lower high-frequency antenna layer 210L may be arranged vertically between the upper high-frequency antenna layer 210H and the electrostatic feeding unit 310.

[0065] In this case, the upper via VAU plays the role of connecting the electrostatic feed unit 310 and the lower high-frequency antenna layer 210L. Therefore, according to this embodiment, the electrostatic feed unit 310 can directly supply power to the lower high-frequency antenna layer 210L via the upper via VAU.

[0066] Generally, the movement of carriers between two opposing metal plates separated by a dielectric material is called a capacitor. Using this principle, the electrostatic feeding unit 310 can electrostatically feed power to the low-frequency antenna layer 212 across the dielectric material. Similarly, the lower high-frequency antenna layer 210L can electrostatically feed power to the upper high-frequency antenna layer 210H.

[0067] The electrostatic feed unit 310 is electrically connected to the lower high-frequency antenna layer 210L via the upper via VAU, but does not physically contact the low-frequency antenna layer 212, and is separated by a dielectric material as described above. Similarly, the upper high-frequency antenna layer 210H does not physically contact the lower high-frequency antenna layer 210L, and is separated by a dielectric material as described above.

[0068] The transmission line may also include other vias 220.

[0069] Other vias 220 may be directly connected to the electrostatic feed unit 310 and connected to the port via a transmission line located in the routing unit ROT through the core unit CO. In this case, the other vias 220 connected to the port may be connected to the electrostatic feed unit 310 by passing through the low-frequency antenna layer 212. The low-frequency antenna layer 212 may include through-holes TH through which the other vias 220 pass.

[0070] The material of the upper via VAU and other vias 220 may be the same as the material of the first antenna layer AL1 to the Mth antenna layer ALM, and the first routing layer RL1 to the Nth routing layer RLN. For example, the material of the upper via VAU and other vias 220 may include, but is not limited to, metallic materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof.

[0071] According to the embodiment, the diameter of the through-hole TH may be larger than the diameter of the other vias 220. This is to prevent the other vias 220 passing through the through-hole TH from coming into contact with the low-frequency antenna layer 212.

[0072] In some cases, a ring RI (or via connector) can be placed on the outer surface of the other vias 220 located within the through-hole TH to efficiently connect the other vias 220 located in each insulating layer. Furthermore, because the ring RI has a larger surface area than the other vias 220, it can also perform a similar role to the electrostatic feeding section 310 of the high-frequency antenna layer 210 and the low-frequency antenna layer 212.

[0073] The upper high-frequency antenna layer 210H and the lower high-frequency antenna layer 210L mentioned above correspond to the first antenna layer AL1 and the second antenna layer AL2 shown in Figure 3, respectively, and the low-frequency antenna layer 212 may correspond to the third antenna layer AL3 shown in Figure 3. Therefore, the electrostatic feeding unit 310 may be placed between the second antenna layer AL2 and the third antenna layer AL3 shown in Figure 3.

[0074] The antenna section in an embodiment connected to two ports, Port1 and Port2, will be described below with reference to the attached Figure 5.

[0075] Figure 5 shows a perspective view of the antenna substrate according to an embodiment, Figure 6a shows a cross-sectional view of the antenna substrate shown in Figure 5, and Figure 6b shows a plan view of the antenna substrate shown in Figure 6a. For the sake of explanation, only the first antenna layer 410 and the second antenna layer 420 shown in Figure 6a are shown in Figure 6b.

[0076] The antenna substrate shown in Figure 5 may correspond to the embodiment of the antenna substrate shown in Figure 4.

[0077] The antenna substrate may include a first antenna layer 410, a second antenna layer 420, a third antenna layer 430, a fourth antenna layer 440, and a fifth antenna layer 450 stacked with vertical spacing, as well as a ground layer 460, an upper via 320, a lower via 330, a via connection section VC, a main via MVA, and an electrostatic feed section 310A. Here, the ground layer 460 may correspond to the first routing layer RL1 shown in Figure 3.

[0078] Furthermore, the first antenna layer 410 corresponds to the upper high-frequency antenna layer 210H shown in Figure 4, and the second antenna layer 420 corresponds to the lower high-frequency antenna layer 210L shown in Figure 4.

[0079] The first antenna layer 410 may include a first central portion 412 and a plurality of peripheral portions 414, where the peripheral portions may represent parasitic patches or stacked patches.

[0080] Multiple peripheral sections 414 can be arranged around the first central section 412, separated from it horizontally by a gap. For example, the multiple peripheral sections 414 may include a first peripheral section 414A, a second peripheral section 414B, a third peripheral section 414C, and a fourth peripheral section 414D, as illustrated in Figure 6b. The first peripheral section 414A can be arranged around the first central section 412, separated from it in a second direction, horizontally, by a first gap Y1. The third peripheral section 414C can be arranged around the first central section 412, separated from it in a second direction, horizontally, by a second gap Y2. Similarly, the second peripheral section 414B and the fourth peripheral section 414D can each be arranged around the first central section 412. The peripheral sections play a role in impedance matching and further extending the bandwidth.

[0081] The second antenna layer 420 does not include the peripheral portion, but includes only the second central portion.

[0082] According to the embodiment, the lower high-frequency antenna layer 210L may have a larger planar area than the upper high-frequency antenna layer 210H. For example, assuming that the first antenna layer 410 and the second antenna layer 420 each have a square planar shape, if the length of one side of the first antenna layer 410 is 0.5λ1 and the length of one side of the second antenna layer 420 is 0.5λ2, then λ2 may be greater than λ1.

[0083] Furthermore, according to the embodiment, as shown in Figure 6a, the first edge 420E1 of the second antenna layer (i.e., the second central portion) 420 may overlap the first gap Y1 perpendicularly, and the second edge 420E2 of the second antenna layer 420 may overlap the second gap Y2 perpendicularly.

[0084] Furthermore, according to the embodiment, as shown in Figure 6b, since the second central portion 420 is larger than the first central portion 412, the first central portion 412 as a whole can overlap the second central portion 420 in the vertical direction.

[0085] On the other hand, the third antenna layer 430 shown in Figures 5 and 6a may correspond to the low-frequency antenna layer 212 shown in Figure 4.

[0086] Furthermore, at least one additional antenna layer may be placed between the third antenna layer 430 and the ground layer 460. For example, as shown in Figure 5, multiple fourth antenna layers 440, fifth antenna layers 450, and so on may be placed between the third antenna layer 430 and the ground layer 460.

[0087] Each of the multiple fourth antenna layers 440 and fifth antenna layers 450 may be added or omitted to serve various purposes, such as impedance matching, adjusting bandwidth, or tuning S-parameters, and the embodiment may be applicable with or without the additional antenna layers 440, 450.

[0088] On the other hand, the upper via 320 corresponds to an embodiment of the upper via VAU shown in Figure 4, the lower via 330, via connection VC, and main via MVA correspond to embodiments of other vias 220 shown in Figure 4, and the electrostatic power supply unit 310A may correspond to an embodiment of the electrostatic power supply unit 310 shown in Figure 4.

[0089] In other words, the transmission line according to the embodiment may include various vias 320, 330, MVA, via connection section VC, and electrostatic power supply section 310A.

[0090] The following description of the transmission line will be based on the attached drawings, but the following description of the transmission line may be applied regardless of the presence or number of additional antenna layers 440, 450.

[0091] The electrostatic power supply unit 310A may include a first power supply plate 312 and a second power supply plate 314.

[0092] Hereinafter, various embodiments of the first power supply board 312 and the second power supply board 314 shown in Figure 5 will be described with reference to the attached Figures 7a and 7b.

[0093] Figures 7a and 7b show plan views of embodiments of the first power supply plate 312 and the second power supply plate 314 shown in Figure 5. In Figures 7a and 7b, the lower vias 332 and 334 are not visible, but are shown with dotted lines to aid understanding.

[0094] Here, CP is defined as the point where the vertical axis passing through the center of the second antenna layer 420 intersects with the virtual horizontal plane on which the first feed plate 312 and the second feed plate 314 are located, and is referred to as the center.

[0095] In one embodiment, as shown in Figures 7a and 7b, the first power supply plates 312A and 312B may be located on a virtual first horizontal line HL1 passing through the center CP, and the second power supply plates 314A and 314B may be located on a virtual second horizontal line HL2 passing through the center CP and perpendicular to the first horizontal line HL1. In this way, the first power supply plates 312A and 312B and the second power supply plates 314A and 314B may be arranged orthogonally to each other with respect to the center CP.

[0096] Furthermore, with respect to the central CP, the first power supply plates 312A and 312B and the second power supply plates 314A and 314B can be arranged asymmetrically.

[0097] Furthermore, with respect to the center CP, the first power supply plates 312A, 312B and the second power supply plates 314A, 314B can be arranged to form various angles, such as 60°, 45°, or 30°. That is, the angle θ formed by the first horizontal line HL1 and the second horizontal line HL2 may be 90°, 60°, 45°, or 30°, etc.

[0098] Furthermore, the first power supply plate 312 and the second power supply plate 314 can each have a variety of planar shapes.

[0099] According to one embodiment, the first power supply board and the second power supply board may have a circular or polygonal planar shape.

[0100] In other embodiments, the first and second power supply plates may each have a tapered planar shape in which the width increases as it moves away from the center CP. That is, the width may decrease as it approaches the center CP. Furthermore, the first and second power supply plates may each have a region in which the width increases as it moves away from the center CP, and then decreases again. In this case, the region in which the width decreases may have curvature.

[0101] For example, as shown in Figure 7a, the first power supply plate 312A and the second power supply plate 314A may each have a teardrop-shaped planar shape, and as shown in Figure 7b, the first power supply plate 312B and the second power supply plate 314B may each have a planar shape in which the teardrop shape shown in Figure 7a is cut off at the part furthest from the center CP, or a trapezoidal cross-sectional shape.

[0102] In Figures 7a and 7b, it can be seen that the planar area of ​​the first power supply plates 312A and 312B and the second power supply plates 314A and 314B is larger than the planar area of ​​the upper via 320 or the lower via 330.

[0103] The upper via 320 electrically connects the electrostatic feed unit 310A and the second antenna layer 420. For example, the upper via 320 may have one end connected to the electrostatic feed unit 310A and the other end connected to the second antenna layer 420.

[0104] The upper via 320 may include a first upper via 322 and a second upper via 324. The first upper via 322 may have one end connected to one side of the upper surface of the first feed plate 312 and the other end connected to the second antenna layer 420. The second upper via 324 may have one end connected to one side of the upper surface of the second feed plate 314 and the other end connected to the second antenna layer 420.

[0105] The lower via 330 may have one end connected to the electrostatic power supply unit 310A and the other end connected to the via connection unit VC.

[0106] The lower via 330 may include a first lower via 332 and a second lower via 334. The first lower via 332 may have one end connected to the other side of the lower surface of the first power supply plate 312 and the other end connected to the via connection portion VC. The second lower via 334 may have one end connected to the other side of the lower surface of the second power supply plate 314 and the other end connected to the via connection portion VC.

[0107] The first feed plate 312 extends horizontally from one end of the first lower via 332, facing the second antenna layer 420 above and the third antenna layer 430 below. The second feed plate 314 extends horizontally from one end of the second lower via 334, facing the second antenna layer 420 above and the third antenna layer 430 below, and may be positioned at a distance from the first feed plate 312.

[0108] Referring to Figures 7a and 7b, one side of the upper surface of the first power supply plates 312A and 312B, where one end of the first upper via 322 is located, and the other side of the lower surface of the first power supply plates 312A and 312B, where one end of the first lower via 332 is located, do not need to overlap each other in the vertical direction.

[0109] Furthermore, one side of the upper surface of the second power supply boards 314A and 314B, on which one end of the second upper via 324 is located, and the other side of the lower surface of the second power supply boards 314A and 314B, on which one end of the second lower via 334 is located, do not need to overlap each other in the vertical direction.

[0110] According to the embodiment, the distance d1 between the first lower via 332 and the center CP shown in Figure 7a may be the same as the distance d2 between the second lower via 334 and the center CP, and the distance d3 between the first lower via 332 and the center CP shown in Figure 7b may be the same as the distance d4 between the second lower via 334 and the center CP.

[0111] The main via MVA may penetrate the third antenna layer 430 corresponding to the low-frequency antenna layer and have one end connected to a via connection VC. The main via MVA may include a first main via VA1 and a second main via VA2 that penetrate from the ground layer 460 through the third antenna layer 430, the fourth antenna layer 440, and the fifth antenna layer 450. The first main via VA1 and the second main via VA2 may penetrate multiple antenna layers 440, 450, etc., and be connected to the ground layer 460. For this purpose, the third antenna layer 430, the fourth antenna layer 440, and the fifth antenna layer 450 each have a configuration similar to the through-hole TH formed in the low-frequency antenna layer 212 shown in Figure 4, and may include through-holes through which the first main via VA1 and the second main via VA2 penetrate.

[0112] One end of the first main via VA1 may be connected to the first via connection VC1, and the other end may be connected to the first port Port1 via the ground layer 460. One end of the second main via VA2 may be connected to the second via connection VA2, and the other end may be connected to the second port Port2 via the ground layer 460.

[0113] The via connection section VC serves to connect the lower via 330 and the main via MVA. That is, one end of the via connection section VC can be connected to the other end of the lower via 330, and the other end of the via connection section VC can be connected to one end of the main via MVA.

[0114] The via connection section VC may include a first via connection section VC1 and a second via connection section VC2. The first via connection section VC1 may connect the other end of the first lower via 332 to one end of the first main via VA1, and the second via connection section VA2 may connect the other end of the second lower via 334 to one end of the second main via VA2.

[0115] Generally, the third antenna layer 430, which is a low-frequency antenna layer, has a smaller area than the second antenna layer 420, which is a high-frequency antenna layer. Therefore, if the electrostatic feed section 310A is located below the second antenna layer 420, it may be difficult to connect the main via MVA to the electrostatic feed section 310A. For this reason, the main via MVA can be connected to the electrostatic feed section 310A via the via connection section VC.

[0116] The antenna substrates according to comparative examples and embodiments will be described below with reference to the attached drawings.

[0117] Figure 8 shows a cross-sectional view of an antenna substrate according to a comparative example.

[0118] The antenna substrate shown in Figure 8 includes the first antenna layer 10 to the seventh antenna layer 22, the first via 42 to the fourth via 48, and the ground layer 24.

[0119] The second antenna layer 12 and the sixth antenna layer 20 perform the same roles as the first antenna layer 420 and the third antenna layer 430 shown in Figure 5, respectively, and the ground layer 24 corresponds to the ground layer 460 shown in Figure 5, so redundant explanations are omitted.

[0120] The first antenna layer 10 corresponds to a high-frequency stack patch, the third antenna layer 14 corresponds to a high-frequency feed patch, the fourth antenna layer 16 corresponds to a high-frequency impedance matching patch, the fifth antenna layer 18 corresponds to a low-frequency stack patch, and the seventh antenna layer 22 corresponds to a low-frequency impedance matching patch.

[0121] The ends of the first via 42 and the second via 44 are directly coupled to the sixth antenna layer 20, supplying power to the sixth antenna layer 20. In addition to the first via 42 and the second via 44, the ends of the third via 46 and the fourth via 48 are directly coupled to the second antenna layer 12, supplying power to the second antenna layer 12.

[0122] As mentioned above, the comparative example shows that a total of four vias 42-48 are required to feed power to the second antenna layer 12 and the sixth antenna layer 20, and that each of the four vias 42-48 is directly connected to the corresponding antenna layer.

[0123] On the other hand, in the embodiment, as shown in Figure 5, the second antenna layer 420 is fed from a total of two first main vias VA1 and second main vias VA2 via via connection section VC and lower via 330, feed section 310A and upper via 320, the first antenna layer 410 is not directly coupled to the second antenna layer 420 or feed section 310A, but is fed electrostatically from the second antenna layer 420 or feed section 310A, and the third antenna layer 430 can be fed electrostatically from the second antenna layer 420 or feed section 310A.

[0124] Therefore, according to the embodiment, the high-frequency antenna layers 410, 420 and the low-frequency antenna layer 430 can be fully supplied with fewer vias than in the comparative example. As a result, the antenna substrate according to the embodiment has a simple structure, reduced manufacturing costs, a simple manufacturing process, and shorter lengths in the first, second, and third directions, resulting in a smaller volume than the comparative example.

[0125] Furthermore, the area of ​​the region supplied with power to each antenna layer is referred to as the "feeding area." In this comparative example, since the high-frequency antenna layer 12 and the low-frequency antenna layer 20 are each supplied with power from vias 42 to 48, the region in contact with vias 42 to 48 in each of the high-frequency antenna layer 12 and the low-frequency antenna layer 20, i.e., the flat area of ​​vias 42 to 48, corresponds to the feeding area.

[0126] In this embodiment, the first antenna layer 410 is fed electrostatically from the second antenna layer 420, so the entire surface area of ​​the second antenna layer 420 corresponds to the feeding area. The low-frequency antenna layer 430 is fed electrostatically from the electrostatic feeding section 310A, so the entire surface area of ​​the electrostatic feeding section 310A corresponds to the feeding area. In this case, the surface area of ​​the second antenna layer 420 is larger than the surface area of ​​the vias 42 to 48, and the surface area of ​​the electrostatic feeding section 310A is larger than the surface area of ​​the vias 42 to 48.

[0127] Thus, because the power supply area of ​​the embodiment is larger than that of the comparative example, the paths through which the power supply current flows can be diversified, thereby increasing the bandwidth and enabling support for global networks.

[0128] Figure 9 is a graph showing the return loss (or reflection coefficient) for the antenna substrate in a comparative example, and Figure 10 is a graph showing the return loss for the antenna substrate in an example. In both Figures 9 and 10, the horizontal axis represents frequency, and the vertical axis represents return loss. Return loss is the ratio of the reflected voltage to the input voltage.

[0129] When the antenna substrate according to the comparative example is realized as shown in Figure 8, and the first vertical height H1 from the ground layer 24 to the fifth antenna layer 18 is 0.36 mm, the reflection loss characteristics for the first port Port1, second port Port2, third port Port3, and fourth port (Port4), to which the first vias 42 to the fourth via 48 are connected, are obtained as shown in Figure 9.

[0130] Furthermore, in the embodiment, as shown in Figure 5, two high-frequency antenna layers 410 and 420 are arranged on the electrostatic power supply unit 310A. That is, the first antenna layer 410 corresponding to the upper high-frequency antenna layer is further arranged on the second antenna layer 420 corresponding to the lower high-frequency antenna layer. Therefore, in the high-frequency band, a second bandwidth BW2 can be obtained that is wider than the first bandwidth BW1. Thus, in the embodiment, it can be seen that a wide bandwidth of 37 GHz to 43.5 GHz is obtained at -10 dB, and an even wider operating frequency band is covered at -6 dB.

[0131] λ1 and λ2 are wavelengths between 37 GHz and 43.5 GHz band frequencies of the second bandwidth BW2, respectively, and can be adjusted for the formation of multiple resonant modes by the electrostatic feed section 310 located beneath the first antenna layer 410 and the second antenna layer 420.

[0132] Furthermore, in this embodiment, the high-frequency antenna layer is stacked vertically to achieve miniaturization while simultaneously improving performance degradation.

[0133] The front-end module according to the example will be described below with reference to the attached drawings.

[0134] Figure 11 shows a block diagram of the front-end module 500 according to an embodiment.

[0135] The front-end module 500 in the embodiment shown in Figure 11 may include an antenna 510, a first amplifier 520 and a second amplifier 540, a multilayer filter 530, and a switch 550.

[0136] The first amplifier 520 can amplify the signal received via the antenna 510 and provide the amplified result to the multilayer filter 530. For example, the first amplifier 520 may be a low-noise amplifier (LNA).

[0137] The multilayer filter 530 can filter the signal amplified by the first amplifier 520 and output it via the output terminal OUT.

[0138] The second amplifier 540 amplifies the signal input via the input terminal IN and transmits the amplified result via the antenna 510. For example, the second amplifier 540 may be a power amplifier (PA).

[0139] The switch 550 is positioned between the input terminal of the first amplifier 520 and the output terminal of the second amplifier 540, respectively, and the antenna 510, and plays the role of selecting these signal paths.

[0140] Since the antenna 510 can correspond to the antenna substrate 100 according to the above embodiment, redundant explanations will be omitted.

[0141] Figure 11 is merely one example of the configuration of the front-end module 500, and the antenna substrate 100 according to the above embodiment is not limited to Figure 11, but can be applied as a substrate for front-end modules with various configurations.

[0142] The antenna substrate and front-end module according to the above-described embodiment can be applied to modules for mobile devices, base stations, repeaters, etc., enabling short-range or medium-range ultra-high-speed broadband communication for mobile devices and mobility devices. However, the embodiment is not limited to specific applications.

[0143] The above description has focused on examples, but these are merely illustrative and do not limit the present invention. Those with ordinary skill in the art to which the present invention pertains should understand that various modifications and applications not exemplified above are possible, without departing from the essential features of these examples. For example, each component specifically shown in the examples can be modified. Furthermore, any differences arising from these modifications and applications should be interpreted as falling within the scope of the present invention as defined in the appended claims.

Claims

1. Multiple antenna layers stacked vertically, spaced apart from each other, An antenna insulating layer disposed between the plurality of antenna layers, A transmission line including an electrostatic power supply section arranged opposite to the plurality of antenna layers with the antenna insulating layer in between, Includes, The aforementioned multiple antenna layers are A plurality of high-frequency antenna layers are arranged vertically stacked on the electrostatic power supply unit, which emit a high-frequency signal in the first radio frequency band. A low-frequency antenna layer is positioned below the electrostatic power supply unit, which emits a low-frequency signal in a second radio frequency band lower than the first radio frequency band. Antenna board, including

2. The aforementioned multiple high-frequency antenna layers are The upper high-frequency antenna layer, The lower high-frequency antenna layer is positioned in the vertical direction between the upper high-frequency antenna layer and the electrostatic power supply unit, The antenna substrate according to claim 1, including the following:

3. The antenna substrate according to claim 2, wherein the transmission line further includes an upper via connecting the electrostatic power supply unit and the lower high-frequency antenna layer.

4. The aforementioned transmission line is A main via having one end that penetrates the low-frequency antenna layer, A lower via having one end connected to the electrostatic power supply unit, A via connecting portion that connects the other end of the lower via to the one end of the main via, The antenna substrate according to claim 3, further comprising:

5. The antenna substrate according to claim 2, wherein the lower high-frequency antenna layer has a larger planar area than the upper high-frequency antenna layer.

6. The upper high-frequency antenna layer is, The first central section and, A plurality of peripheral parts are separated horizontally from the first central part by a gap and are arranged around the first central part, The antenna substrate according to claim 5, including the antenna substrate according to claim 5.

7. The antenna substrate according to claim 6, wherein the lower high-frequency antenna layer includes a second central portion.

8. The antenna substrate according to claim 7, wherein the edge of the second central portion overlaps with the gap in the vertical direction.

9. The antenna substrate according to claim 7, wherein the entire first central portion overlaps the second central portion in the vertical direction.

10. It includes multiple antenna regions that are separated from each other in the horizontal direction, Each of the aforementioned plurality of antenna regions includes an antenna section. The aforementioned antenna section is Multiple antenna layers stacked vertically, spaced apart from each other, An antenna insulating layer disposed between the plurality of antenna layers, A transmission line including an electrostatic power supply unit that electrostatically supplies power to the plurality of antenna layers with the antenna insulating layer in between, Includes, The aforementioned multiple antenna layers are A plurality of high-frequency antenna layers are arranged vertically stacked on the electrostatic power supply unit, which emit a high-frequency signal in the first radio frequency band. A low-frequency antenna layer is positioned below the electrostatic power supply unit, which emits a low-frequency signal in a second radio frequency band lower than the first radio frequency band. A front-end module that includes this.

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