Improvement of optical phase interference in digital micromirror devices by mechanical stress on device package

Abstract

[0001] Embodiments of the present disclosure relate to a mounting apparatus for a digital micromirror device in a digital lithography system and a method for mounting the digital micromirror device. The mounting apparatus described herein holds a spatial light modulator, such as a DMD. The mounting apparatus enables planarization of the DMD by applying a force so that a pair of contact pads contact the DMD. The DMD is positioned in a mounting frame of the mounting apparatus. The contact pads of the mounting frame are operable to apply pressure to the DMD.

Description

[Technical field]

[0001] TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate generally to methods and apparatus for processing one or more substrates, and more particularly to a mounting apparatus for a digital micromirror device in a digital lithography system and a method for mounting a digital micromirror device. [Background technology]

[0002]

[0002] Spatial light modulators are often used to impose spatially varying modulation on a light beam. In various applications, including digital lithography, one example of a spatial light modulator, the digital micromirror device (DMD), is used as a reflective digital light switch. In digital lithography, the DMD is typically combined with other image processing components, such as memory, light sources, and optics, and is used to project an image onto a photoresist, thereby exposing and printing the photoresist.

[0003]

[0003] A DMD typically contains hundreds of thousands to millions of tiny mirrors ("micromirrors") arranged in a rectangular array. Each micromirror corresponds to a single pixel of the image to be printed and can be tilted at various angles about a hinge. Depending on the tilt angle of the micromirror, it can be in an "on" or "off" state. In the on state, light is reflected off the DMD into a lens that ultimately projects the pixel onto the photoresist. In the off state, the light is directed elsewhere, such as to a light dump, and the projected pixel appears dark.

[0004]

[0004] A DMD generally has a convex cylindrical shape. Curvature of the DMD changes the phase interference angle across the DMD, resulting in phase angle error. Non-uniformity in the phase interference as a result of the DMD curvature can cause scan irregularities on the substrate, adversely affecting printing performance.

[0005]

[0005] Therefore, there is a need in the art for an improved mounting apparatus for digital micromirror devices in digital lithography systems and methods for mounting digital micromirror devices. Summary of the Invention

[0006] In one embodiment, a mounting apparatus is provided. The mounting apparatus includes a mounting frame including a pair of contact pads. The mounting apparatus further includes an interposer operable to contact a top surface of the mounting frame and a top surface of the DMD. The mounting apparatus further includes a printed circuit board (PCB) operable to contact the top surface of the interposer. The mounting apparatus further includes a force distribution plate operable to contact the top surface of the PCB. The mounting apparatus further includes a heat sink operable to contact the force distribution plate. The mounting apparatus further includes fasteners disposed through a plurality of through holes. The fasteners are operable to couple the mounting frame, interposer, PCB, force distribution plate, and heat sink together. The plurality of through holes are operable to be disposed through the mounting frame, interposer, PCB, force distribution plate, and heat sink.

[0007] In another embodiment, an image projection system is provided. The image projection system includes a light source operable to generate a beam and a digital micromirror device (DMD). The light source is operable to direct the beam to the DMD. The image projection system further includes a mounting apparatus operable to hold the DMD. The mounting apparatus includes a mounting frame operable to hold the digital micromirror device (DMD). The mounting frame includes a pair of contact pads in contact with an outer DMD surface of the DMD. The mounting apparatus further includes an interposer in contact with the mounting frame top surface and the DMD top surface, and a printed circuit board (PCB) in contact with the interposer top surface. The mounting apparatus further includes a force distribution plate in contact with the PCB top surface, and a heat sink in contact with the force distribution plate. The mounting apparatus further includes fasteners disposed through a plurality of through holes. The fasteners are operable to couple the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink together. A plurality of through holes are disposed through the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink. The image projection system further includes a projection lens disposed below the DMD. The projection lens is operable to project the plurality of writing beams reflected from the DMD.

[0008] In yet another embodiment, a method is provided. The method includes positioning a digital micromirror device (DMD) on a mounting frame. The mounting frame includes a pair of contact pads for contacting the DMD. The method further includes stacking and positioning an interposer, a printed circuit board (PCB), a force distribution plate, and a heat sink on top of the DMD. The method further includes installing fasteners through the plurality of through holes to couple the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink together to form a mounting arrangement. The fasteners include a plurality of screws that screw through the plurality of through holes and threads disposed in the mounting frame. The method further includes adjusting a flatness of the DMD. Adjusting the flatness of the DMD includes torquing or loosening the plurality of screws to increase or decrease the force of the pair of contact pads on the DMD. The method further includes annealing the mounting arrangement and the DMD.

[0009]

[0009] In order that the above-mentioned features of the present disclosure may be understood in detail, the present disclosure summarized above will now be more particularly described with reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings merely depict exemplary embodiments, and therefore should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view of a digital lithography system according to an embodiment disclosed herein. [Diagram 2] 2 is a schematic perspective view of one of the image projection systems of FIG. 1 according to embodiments described herein. [Figure 3A] 1 is a schematic cross-sectional view of a mounting apparatus for a digital micromirror device (DMD) according to an embodiment described herein. [Figure 3B]1 is a schematic exploded view of a mounting apparatus for a digital micromirror device (DMD) according to embodiments described herein. [Figure 4] FIG. 2 is a flow diagram of a method for mounting a digital micromirror device (DMD) to a mounting apparatus according to embodiments described herein. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011]

[0015] To facilitate understanding, wherever possible, the same reference numerals have been used to designate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0012]

[0016] The disclosed embodiments generally relate to methods and apparatus for processing one or more substrates, and more particularly, to a mounting apparatus for a digital micromirror device in a digital lithography system and a method of mounting the digital micromirror device. The mounting apparatus includes a mounting frame having a pair of contact pads. The mounting apparatus further includes an interposer operable to contact a top surface of the mounting frame and a top surface of the DMD. The mounting apparatus further includes a printed circuit board (PCB) operable to contact the top surface of the interposer. The mounting apparatus further includes a force distribution plate operable to contact the top surface of the PCB. The mounting apparatus further includes a heat sink operable to contact the force distribution plate. The mounting apparatus further includes a fastener disposed through a plurality of through holes. The fastener is operable to couple the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink together. The plurality of through holes is operable to be disposed through the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink.

[0013]

[0017] FIG. 1 is a perspective view of a digital lithography system 100 that may benefit from embodiments described herein. The digital lithography system 100 includes a stage 114 and a processing device 104. The stage 114 is supported by a pair of tracks 116 disposed on a slab 102. A substrate 120 is supported by the stage 114. The stage 114 moves in an X direction along the pair of tracks 116 as shown in the coordinate system illustrated in FIG. 1. The stage 114 also moves in a Y direction to process and / or index the substrate 120. The stage 114 may operate independently, scanning the substrate 120 in one direction and stepping in the other direction. An encoder 118 is coupled to the stage 114 to provide information of the position of the stage 114 to a controller 122.

[0014]

[0018] The controller 122 is generally designed to facilitate control and automation of the processing techniques described herein. The controller 122 may be coupled to or in communication with the processing device 104, the stage 114, and the encoder 118. The processing device 104 and the encoder 118 may provide information to the controller 122 regarding substrate processing and substrate alignment. For example, the processing device 104 may provide information to the controller 122 to inform the controller 122 that substrate processing is complete. A program (or computer instructions), which may be referred to as an imaging program, readable by the controller 122 determines which tasks can be performed on the substrate. The program includes mask pattern data and code for monitoring and controlling processing time and substrate position. The mask pattern data corresponds to a pattern to be written into the photoresist using electromagnetic waves.

[0015]

[0019] The substrate 120 comprises any suitable material, such as glass, used as part of a flat panel display. The substrate 120 has a film layer formed thereon to be patterned, such as by etching a pattern into the substrate, and a photoresist layer formed on the film layer to be patterned and sensitive to electromagnetic radiation, such as ultraviolet or deep ultraviolet "light". A positive photoresist comprises portions of the photoresist that are soluble in a photoresist developer applied to the photoresist when exposed to radiation after a pattern has been written into the photoresist using electromagnetic radiation. A negative photoresist comprises portions of the photoresist that are insoluble in a photoresist developer applied to the photoresist when exposed to radiation after a pattern has been written into the photoresist using electromagnetic radiation. The chemical composition of the photoresist determines whether the photoresist is a positive photoresist or a negative photoresist. After exposing the photoresist to electromagnetic radiation, the resist is developed to leave the patterned photoresist on the underlying film layer. The patterned photoresist is then used to pattern-etch the underlying thin film through the openings in the photoresist to form part of the electronic circuitry of the display panel.

[0016]

[0020] The processing device 104 includes a support 108 and a processing unit 106. The support 108 is disposed on the slab 102 and includes a pair of risers 128 supporting two or more bridges 124. The pair of risers 128 and the bridges 124 form an opening 112 for the pair of tracks 116 and one or more stages 114 to pass under the processing unit 106. The processing unit 106 is supported by the support 108. The processing unit 106 includes a plurality of image projection systems (IPS) 110. The plurality of IPS 110 is disposed in a case 111. The plurality of IPS 110 is supported by one or more bridges 124. The plurality of image projection systems 110 each include a mounting device 220 (shown and described in FIGS. 3A and 3B) operable to hold a DMD 210 (shown in FIG. 2).

[0017]

[0021] In one embodiment, which can be combined with other embodiments described herein, the processing unit 106 includes as many as 84 IPSs 110. Each IPS 110 includes a spatial light modulator. Spatial light modulators include, but are not limited to, micro LEDs, OLEDs, digital micromirror devices (DMDs), liquid crystal displays (LCDs), and vertical cavity surface emitting lasers (VCSELs). The components of each IPS 110 vary depending on the spatial light modulator used.

[0018]

[0022] 2 is a schematic perspective view of one of the image projection systems 110 of FIG. 1. The image projection system 110 may include a light source 202, an aperture 204, a lens 206, a mirror 208, a digital micromirror device (DMD) 210, a light dump 212, a camera 214, and a projection lens 216. The light source 202 may be a light emitting diode (LED) or a laser, and the light source 202 may be capable of generating light having a predetermined wavelength. In one embodiment, the predetermined wavelength is in the blue or near ultraviolet (UV) range, for example, less than about 450 nm. The mirror 208 may be a spherical mirror. The projection lens 216 may be an image magnification or reduction objective lens of any desired magnification. The DMD 210 may include multiple mirrors, and the number of mirrors may correspond to the resolution of the projected image. In one embodiment, DMD 210 includes a 1920 x 1080 mirror that represents the number of pixels in a high definition television or other flat panel display. Image projection system 110 includes a mounting apparatus 220 (shown and described in Figures 3A and 3B) operable to hold DMD 210.

[0019]

[0023] In operation, light source 202 generates beam 203 having a predetermined wavelength, for example, a wavelength in the blue to ultraviolet range. Beam 203 is reflected by mirror 208 to DMD 210. DMD 210 includes multiple mirrors that can be individually controlled, and each mirror of the multiple mirrors of DMD 210 can be in an "on" position or an "off" position based on mask data provided to DMD 210 by a controller (not shown). When beam 203 reaches the mirrors of DMD 210, mirrors in the "on" position reflect beam 203 to projection lens 216, i.e., forming multiple writing beams 215. Projection lens 216 then projects writing beam 215 onto the surface of substrate 120 (shown in FIG. 1). Mirrors in the "off" position reflect beam 203 to light dump 212 rather than to the surface of substrate 120.

[0020]

[0024] FIG. 3A is a schematic cross-sectional view of a mounting apparatus 220 for a digital micromirror device (DMD) 210. FIG. 3B is a schematic exploded view of a mounting apparatus 220 for a digital micromirror device (DMD) 210. As described above, the mounting apparatus 220 is operable to hold the DMD 210 in the image projection system 110 shown in FIG. 2. The mounting apparatus 220 can be used to transition the DMD 210 from a convex state to a flattened state, as shown in FIGS. 3A and 3B. The convex cylindrical shape can cause scan unevenness on the substrate 120 during the printing process. The mounting apparatus 220 can be used to apply mechanical stress to the DMD 210 to improve the uniformity of the phase interference and reduce the scan unevenness. Applying mechanical stress to the DMD 210 improves the flatness of the DMD 210. Applying mechanical stress to the DMD 210 calculates the difference in the average slope of two opposing edges of the DMD 210. The minimum difference in average slope between two opposing edges of the DMD 210 is monitored to ensure flatness of the DMD 210. The mechanical stress is achieved by holding the DMD 210 in a mounting apparatus 220. The mounting apparatus 220 includes a mounting frame 302, an interposer 304, a printed circuit board (PCB) 306, a force distribution plate 308, a heat sink 310, fasteners 312, and a pair of mating mounts 314.

[0021]

[0025] The DMD 210 includes a DMD outer surface 324, a DMD top surface 316, and a DMD bottom surface 318. The DMD 210 is positioned on and supported by a mounting frame 302. The mounting frame 302 includes a frame top surface 303 and a frame bottom surface 305. The mounting frame 302 has a frame opening 320 disposed therethrough. The DMD bottom surface 318 of the DMD 210 is positioned in the frame opening 320. The mounting frame 302 further includes a pair of contact pads 322. The pair of contact pads 322 are disposed adjacent to and on opposite sides of the frame opening 320. The pair of contact pads 322 contact the DMD outer surface 324 of the DMD 210. The pair of contact pads 322 are operable to apply pressure to the DMD 210. The mounting frame 302 includes a plurality of through holes 326. In one embodiment, which can be combined with other embodiments described herein, the mounting frame 302 is a stainless steel, titanium, steel, or plated steel material. For example, the mounting frame 302 is a 303 stainless steel material.

[0022]

[0026] The DMD 210 further includes a plurality of first contacts 328 on the DMD top surface 316. In one embodiment that can be combined with other embodiments described herein, the first contacts 328 are gold contacts. The interposer 304 includes an interposer top surface 330 and an interposer bottom surface 332. The interposer 304 includes a plurality of second contacts 334. In one embodiment that can be combined with other embodiments described herein, the second contacts 334 are gold contacts. The interposer bottom surface 332 is positioned to contact the DMD top surface 316 and the frame top surface 303. The plurality of first contacts 328 contact the plurality of second contacts 334. The plurality of first contacts 328 in contact with the plurality of second contacts 334 are conductively connected. An electrical signal is operable to pass through the plurality of first contacts 328 in contact with the plurality of second contacts 334 onto the interposer 304 and the PCB 306. The interposer 304 has an interposer opening 336 disposed therethrough. The interposer 304 includes a plurality of through holes 326. In one embodiment, which may be combined with other embodiments described herein, the interposer 304 is a polymer material. For example, the interposer 304 is a liquid crystal polymer material.

[0023]

[0027] The PCB 306 includes a PCB top surface 338 and a PCB bottom surface 340. The PCB 306 has a PCB opening 342 disposed therethrough. The PCB bottom surface 340 contacts the interposer top surface 330. The PCB 306 may receive electrical signals from or provide electrical signals to the DMD 210 via a plurality of first contacts 328 in contact with a plurality of second contacts 334. The PCB 306 includes a plurality of through holes 326.

[0024]

[0028] The force distribution plate 308 includes a force distribution plate top surface 344 and a force distribution plate bottom surface 346. The force distribution plate 308 has a force distribution plate opening 348 disposed therethrough. The force distribution plate bottom surface 346 contacts the PCB top surface 338. The force distribution plate 308 distributes forces to protect the PCB 306. The force distribution plate 308 is operable to reinforce the mounting arrangement 220. The force distribution plate 308 includes a plurality of through holes 326. In one embodiment, which can be combined with other embodiments described herein, the force distribution plate 308 is a stainless steel, titanium, steel, or plated steel material. For example, the force distribution plate 308 is a 303 stainless steel material.

[0025]

[0029] The heat sink 310 includes a heat sink top surface 350 and a heat sink bottom surface 352. The heat sink bottom surface 352 contacts the force distribution plate top surface 344. The heat sink 310 includes a cooling tube 354. The cooling tube 354 is coupled to the heat sink top surface 350 through a cooling interface 356. The cooling tube 354 is operable to channel a cooling fluid through the cooling interface 356. For example, the cooling tube 354 can channel water through the cooling interface 356. The cooling tube 354 is operable to remove excess heat from the DMD 210. The interposer opening 336, the PCB opening 342, and the force distribution plate opening 348 allow the heat sink 310 to contact the DMD 210 such that the DMD 210 is cooled. The heat sink 310 includes a plurality of through holes 326. In one embodiment, which can be combined with other embodiments described herein, the heat sink 310 is a conductive material. For example, the heat sink 310 may be a copper, plated copper, aluminum, or plated aluminum material.

[0026]

[0030] The fastener 312 includes a plurality of washers 358, a plurality of deformed bushings 360, a plurality of springs 362, and a plurality of screws 364. Each of the plurality of deformed bushings 360 is positioned in each of the plurality of through holes 326. The plurality of deformed bushings 360 are disposed in the plurality of through holes 326 such that they contact the force distribution plate 308. Each of the plurality of springs 362 is disposed between the plurality of deformed bushings 360 and a lip 366 formed in the heat sink 310. The plurality of washers 358 are disposed in a cavity 368 of each of the plurality of deformed bushings 360. A plurality of screws 364 are positioned through each cavity 368 and through the plurality of through holes 326. The plurality of screws 364 are operable to thread through threads 370. The threads 370 are disposed along the plurality of through holes 326 of the mounting frame 302. The plurality of screws 364 are operable to be torqued to apply the necessary pressure to flatten the DMD 210 .

[0027]

[0031] A pair of coupling mounts 314 are coupled to the frame bottom surface 305. In one embodiment, which may be combined with other embodiments described herein, the pair of coupling mounts 314 are coupled to the frame bottom surface 305 using a number of screws 364. The pair of coupling mounts 314 are operable to couple the mounting apparatus 220 to a number of components of the image projection system (IPS) 110 (shown in FIG. 2 ).

[0028]

[0032] 4 is a flow diagram of a method 400 for mounting a digital micromirror device (DMD) 210 to a mounting apparatus 220. The mounting apparatus 220 and DMD 210 are disposed in each of a number of image projection systems (IPS) 110. The peak-to-valley curvature of the DMD 210 changes the phase interference angle across the DMD 210. The change in phase interference angle leads to scan irregularities on the substrate 120 during the printing process. The method 400 described herein improves the uniformity of the phase interference angle across the DMD 210 by increasing the flatness of the DMD 210.

[0029]

[0033] At step 401, the DMD 210 is positioned on a mounting frame 302. The mounting frame includes a pair of contact pads 322 positioned in contact with the DMD 210. At step 402, an interposer 304, a printed circuit board (PCB) 306, a force distribution plate 308, and a heat sink 310 are stacked on top of the DMD surface 316 of the DMD 210.

[0030]

[0034] At step 403, the fasteners 312 are installed. The fasteners 312 couple the mounting frame 302, the interposer 304, the printed circuit board (PCB) 306, the force distribution plate 308, and the heat sink 310 together. The fasteners 312 provide a force such that the pair of contact pads 322 are pressed against the DMD 210. The fasteners 312 have a number of screws 364 disposed through a number of through holes 326. The number of through holes 326 are disposed through the mounting frame 302, the interposer 304, the printed circuit board (PCB) 306, the force distribution plate 308, and the heat sink 310. The force is applied by threading the number of screws 364 through threads 370 of the mounting frame 302. The force flattens the DMD 210 and improves the uniformity of the phase interference angle. For example, the uniformity of the phase interference angle is improved by about 75% to about 85%. For example, the phase interference uniformity may be improved from between about 5° and about 6° to about 1°.

[0031]

[0035] In step 404, the flatness of the DMD 210 is adjusted. The flatness of the DMD 210 can be adjusted by torquing or loosening the plurality of screws 364. Adjusting the torque of the plurality of screws 364 adjusts the flatness of the DMD 210 with a first force path and a second force path. The first force path and the second force path are directed to each of the pair of contact pads 322. The first force path is achieved by torquing the plurality of screws 364 such that the mounting frame 302 is pulled towards the DMD 210, the DMD 210 is pulled to the interposer 304, and the interposer 304 is pulled to the PCB 306 and the force distribution plate 308. Each of the plurality of screws 364 is disposed through a cavity 368 of the plurality of deformation bushings 360. The plurality of deformation bushings 360 are pulled by a torque force that results in a compressive force towards the pair of contact pads 322. The second force path is achieved by the plurality of deformed bushings 360 compressing a plurality of springs 362 that surround each of the plurality of deformed bushings 360. Compression of the plurality of springs 362 presses the heat sink 310 towards the pair of contact pads 322. In one embodiment, which may be combined with other embodiments described herein, the first force path and the second force path apply different amounts of force to the DMD 210. For example, the first force path may apply a force of approximately 600 N and the second force path may apply a force of approximately 55 N.

[0032]

[0036] In one embodiment, which may be combined with other embodiments described herein, an interferometer is used to determine and monitor the flatness of the DMD 210 during the method 400. The flatness of the DMD 210 may be increased by torquing the screws 364. The flatness may be decreased by loosening the screws 364. In this manner, the flatness of the DMD 210 may be adjusted by torquing or loosening the screws 364. The screws 364 may provide a torque of about 0.1 Nm to about 0.6 Nm.

[0033]

[0037] In step 405, the mounting apparatus 220 and the DMD 210 are annealed. The mounting apparatus 220 and the DMD 210 are annealed at temperatures of about 55° C. and about 65° C. The mounting apparatus 220 and the DMD 210 are annealed for at least 60 hours. The annealing process accelerates mechanical creep of the mounting apparatus 220, for example, the mechanical creep of the interposer 304. Mechanical creep that may occur at room temperature is negligible after the annealing process is performed. Thus, the mechanical stability of the mounting apparatus 220 is improved after the mounting apparatus 220 and the DMD 210 are annealed.

[0034]

[0038] In optional step 406, steps 404 and 405 may be repeated. The flatness of the DMD 210 may be measured using an interferometer to ensure that the desired flatness has been achieved. Step 405 may change the flatness of the DMD 210, which may require adjustment of the flatness using the screws 364. The mounting apparatus 220 and DMD 210 may be annealed again. Step 406 may be repeated until the desired flatness of the DMD 210 is achieved.

[0035]

[0039] In summary, a mounting apparatus for a digital micromirror device in a digital lithography system and a method for mounting the digital micromirror device are described herein. The mounting apparatus described herein holds a spatial light modulator such as a DMD. The mounting apparatus includes a mounting frame, an interposer, a printed circuit board (PCB), a force distribution plate, a heat sink, a fastener, and a pair of bonded mounts. The mounting apparatus allows for planarization of the DMD by applying a force such that a pair of contact pads contact the DMD. Advantages of the DMD being held in the mounting apparatus include improved uniformity of phase interference and therefore improved printing performance.

[0036]

[0040] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, as determined by the following claims.

Claims

1. A mounting device, a mounting frame including a pair of contact pads; an interposer operable to contact the upper surface of the mounting frame; a printed circuit board (PCB) operable to contact the top surface of the interposer; a force distribution plate operable to contact the top surface of the PCB; a heat sink operable to contact the force distribution plate; fasteners disposed through a plurality of through holes and operable to couple the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink together, the plurality of through holes being disposed through the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink; Equipped with The mounting apparatus, wherein the mounting frame is operable to hold a digital micromirror device (DMD), and the pair of contact pads is operable to contact an outer DMD surface of the DMD to apply pressure to the DMD.

2. The fastener comprises: A plurality of washers; A plurality of deformed bushings; A plurality of springs; Multiple screws and The mounting apparatus of claim 1 , comprising:

3. The mounting apparatus of claim 2 , wherein each of the plurality of deformed bushings is operable to be positioned in one of the plurality of through holes.

4. The mounting apparatus of claim 3 , wherein the plurality of springs are operable to be positioned between the plurality of deformable bushings and a lip formed on the heat sink.

5. The mounting apparatus of claim 4 , wherein each of the plurality of screws is operable to be disposed through a cavity in each of the plurality of deformed bushings, the plurality of screws threading through threads of the mounting frame.

6. 2. The mounting apparatus of claim 1, wherein the interposer includes a plurality of second contacts, the plurality of second contacts operable to contact a plurality of first contacts of the DMD.

7. The mounting apparatus of claim 1 , further comprising a pair of coupling mounts operable to be coupled to a bottom frame surface of the mounting frame.

8. 1. An image projection system, comprising: a light source operable to generate a beam; a digital micromirror device (DMD), wherein the light source is operable to direct the beam to the DMD; a mounting apparatus operable to hold the DMD, a mounting frame operable to hold a digital micromirror device (DMD), the mounting frame including a pair of contact pads that contact an outer DMD surface of the DMD to apply pressure to the DMD; an interposer in contact with a top surface of the mounting frame and a top surface of the DMD; a printed circuit board (PCB) in contact with a top surface of the interposer; a force distribution plate in contact with the top surface of the PCB; a heat sink in contact with the force distribution plate; fasteners disposed through a plurality of through holes and operable to couple the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink together, the plurality of through holes being disposed through the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink; a mounting device including: a projection lens disposed below the DMD, the projection lens operable to project a plurality of writing beams reflected from the DMD; An image projection system comprising:

9. The fastener comprises: A plurality of washers; A plurality of deformed bushings; A plurality of springs; Multiple screws and The image projection system of claim 8 .

10. The image projection system of claim 9 , wherein each of the plurality of deformed bushings is positioned in one of the plurality of through holes.

11. The image projection system of claim 10 , wherein the springs are positioned between the deformed bushings and a lip formed on the heat sink.

12. The image projection system of claim 11 , wherein each of the plurality of screws is disposed through a cavity in each of the plurality of deformed bushings, and the plurality of screws are threaded through threads of the mounting frame.

13. The image projection system of claim 8 , further comprising a pair of coupling mounts coupled to a bottom frame surface of the mounting frame.

14. positioning a digital micromirror device (DMD) in a mounting frame, the mounting frame including a pair of contact pads for contacting an outer DMD surface of the DMD to apply pressure to the DMD; stacking and positioning an interposer, a printed circuit board (PCB), a force distribution plate, and a heat sink on a top surface of the DMD; installing fasteners through a plurality of through holes to couple the mounting frame, the interposer, the PCB, the force distribution plate, and the heat sink together to form a mount arrangement, the fasteners including threads disposed on the mounting frame and a plurality of screws threaded through the plurality of through holes; adjusting a flatness of the DMD, the adjusting comprising torquing or loosening the plurality of screws to increase or decrease a force of the pair of contact pads on the DMD; annealing the mounting apparatus and the DMD; The method includes:

15. The method of claim 14 , wherein torquing the plurality of screws in the threads of the mounting frame increases flatness of the DMD.

16. 15. The method of claim 14, wherein adjusting the flatness of the DMD includes using an interferometer to determine the flatness of the DMD, and torquing or loosening based on the flatness of the DMD determined by the interferometer.

17. The method of claim 14 , further comprising repeating adjusting the flatness of the DMD after annealing the mounting apparatus and the DMD.

18. The method of claim 14 , wherein annealing the mounting apparatus and the DMD comprises annealing for at least 60 hours.

19. The method of claim 14 , wherein annealing the mounting apparatus and the DMD includes annealing at temperatures of 55° C. and 65° C.

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