Gaming Machines

JP7625223B2Active Publication Date: 2025-02-03DAIICHI SHOKAI KK
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Patent Information

Application Number
JP2022177719
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-11-04
Publication Date
2025-02-03
Estimated Expiration
2042-11-04

AI Technical Summary

Benefits of technology

【0009】 本発明の遊技機においては、表面実装電子部品が実装される電子基板を備える遊技機において、信頼性の低下を抑制することができる。

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a game machine equipped with an electronic board mounted with a surface mounting electronic component, capable of suppressing deterioration in reliability.SOLUTION: A game machine is equipped with a game board having a plurality of boards mounted with a plurality of electronic components. A front board surface of a specific board of a plurality of boards is mounted with a surface mounting type IC and an insertion mounting type capacitor arranged adjacent to the surface mounting type IC. A land on a front board surface side of a specific through-hole of through-holes into which a lead terminal of the insertion mounting type capacitor is inserted is connected to a solid ground by a thermal pattern formed around the land on the front board surface side.SELECTED DRAWING: Figure 129
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Claims

[Claim 1] A gaming machine having a plurality of substrates on which a plurality of electronic components are mounted, The front substrate surface of a specific substrate among the plurality of substrates is a surface mount type IC having two sets of opposing sides; an insertion-mount type capacitor disposed adjacent to the surface-mount type IC on a specific side of the IC; the surface mount type IC has a plurality of connection terminals formed along at least one of the pair of opposing sides not including the specific side, Among the multiple pads to which the multiple connection terminals of the surface mount type IC are soldered, a special pad to which a special connection terminal arranged on a special side opposite to the specific side is soldered is connected to a solid ground by a thermal pattern formed so as to be positioned around the special pad; a land on a front substrate surface side of a specific through hole among the through holes into which a lead terminal of the insertion mounting type capacitor is inserted is connected to a solid ground by a thermal pattern formed so as to be positioned around the land on the front substrate surface side; A gaming machine characterized by:

Citation Information

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