Multi-wafer brushing device

Abstract

The present invention discloses a multi-wafer brushing device, which includes a housing with multiple compartment chambers inside, the bottoms of the multiple compartment chambers are connected to each other, and each compartment chamber is provided with a support wheel system and a brushing system, and the brushing system includes a set of roll brushing units that can approach each other to brush the wafer or move away from each other to remove the wafer, and the multiple brushing systems are connected to each other by an opening and closing drive mechanism, and the opening and closing drive mechanism is used to simultaneously drive the multiple sets of roll brushing units to approach or move away from each other. The present invention can integrate multiple sets of roll brushing units in the same housing, greatly shorten the distance between stations, effectively improve the production efficiency per volume, and the housing can be two, three or four compartments, etc., and the number of compartment chambers has a high level of customization and a wide range of applications, and one opening and closing drive mechanism can be shared to realize the synchronous opening and closing of different roll brushing units, saving equipment space and reducing procurement costs.

Description

[Technical field]

[0001] The present invention relates to the field of semiconductor integrated circuit chip manufacturing, and more particularly to a multi-wafer brushing apparatus. [Background technology]

[0002] Chemical mechanical planarization (CMP) is one of the processes in integrated circuit processing. With the development of technology, the requirements for processing are increasing. Chemical mechanical planarization is a wet process in wafer processing, and a large amount of polishing liquid and different chemical reagents are used throughout the whole process, so at the end of the process, the wafer needs to be cleaned and dried to remove the particles attached to the surface of the wafer, so that it can proceed to the next process.

[0003] In conventional integrated circuit devices, the wafer is inserted into a brushing housing to ensure that the wafer surface is free of particle residue, and the brushing process of the wafer surface is achieved by the cooperation of a support wheel system and a roll brushing system. The wafer is placed on a number of support wheels in the brushing housing, which are all in contact with the circumference of the wafer, and the support wheel drive system rotates the wafer. The roll brushing system consists of two roller brushes that contact both sides of the wafer and pinch it toward the center.

[0004] Although the cooperation between the support wheel system and the roll brushing system can ensure that the entire wafer surface is brushed cleanly, the entire brushing housing has a complex structure and occupies a large amount of equipment space. Currently, all brushing devices used can only brush one wafer in the housing, which requires a long process time and has a significant impact on production efficiency. Using multiple sets of brushing housings for simultaneous cleaning requires a very large space, which is disadvantageous to compacting the equipment. In order to improve the wafer brushing efficiency and reduce the spatial size of the equipment, it is possible to improve the configuration of the brushing device. Summary of the Invention

[0005] SUMMARY OF THE DISCLOSURE In order to overcome the shortcomings of the prior art, the present invention provides a multi-wafer brushing apparatus capable of simultaneously brushing multiple wafers in the same housing, with high cleaning efficiency and small equipment space.

[0006] The technical solution adopted by the present invention to solve the technical problem is as follows: A multi-wafer brushing device, comprising a housing with multiple compartment chambers therein, the bottoms of the multiple compartment chambers are connected to each other, a support wheel system and a brushing system are provided in each compartment chamber, the brushing system comprises a set of roll brushing units that can approach each other to brush the wafers or move away from each other to remove the wafers, the multiple brushing systems are connected to each other by an opening and closing drive mechanism, and the opening and closing drive mechanism is used to simultaneously drive the multiple sets of roll brushing units to approach or move away from each other.

[0007] Furthermore, the roll brushing unit includes two horizontal bars installed in parallel, a first connecting plate connected to both ends of one horizontal bar, and a second connecting plate connected to both ends of the other horizontal bar, the first connecting plate and the second connecting plate are used to attach roller brushes, and by driving the opening / closing drive mechanism, the two first connecting plates and two second connecting plates of different sets of roll brushing units are opened and closed synchronously in a V shape.

[0008] Furthermore, the opening / closing drive mechanism includes a power source, a first drive unit connected to the power source, a second drive unit, and a third drive unit, wherein the first drive unit connects the second connecting plates and the first connecting plates of adjacent roll brushing units, respectively, and the second drive unit is used to drive the first connecting plates and the second connecting plates of the same set of roll brushing units to open and close, and the third drive unit is provided between adjacent roll brushing units to which the power source is not connected, and is used to drive the second connecting plates and the first connecting plates of the adjacent roll brushing units to open and close.

[0009] Furthermore, the first drive unit includes at least a rotating disk that is driven by a power source and can rotate in a circumferential direction, and two links whose one ends are directly or indirectly connected to the rotating disk, and the other ends of the two links are directly or indirectly connected to a first connecting plate and a second connecting plate of adjacent roll brushing units, respectively.

[0010] Furthermore, the link and the turntable are both connected via a third relay column, the first connecting plate and the link are connected via a first relay column, and the second connecting plate and the link are connected via a second relay column.

[0011] Furthermore, the two third relay columns are arranged along the radial direction of the rotating disk and are positioned vertically between the two connection plates in the initial state, and the link is connected to the third relay columns at an angle.

[0012] Furthermore, the second drive unit includes a first gear provided at the bottom of the first connecting plate and a second gear provided at the bottom of the second connecting plate, and the first gear and the second gear mesh with each other to transmit power.

[0013] Furthermore, said third drive units, when at least two in number, are arranged alternately one above the other.

[0014] Furthermore, the second connecting plate and the first connecting plate of the adjacent roll brushing units each have a notch formed therein so as to form an escape space.

[0015] Furthermore, the tops of the compartments are in communication with each other and share a set of exhaust system and a set of drainage system, and each compartment is provided with a spray system.

[0016] The present invention provides a brushing device capable of simultaneously brushing multiple wafers in one housing, enabling multi-wafer cleaning. The brushing housing is extended and divided into multiple independent compartment chambers, each of which has an independent support wheel system, roll brushing system, and spray system. The present invention can effectively utilize the equipment space and improve cleaning efficiency while maintaining the cleaning level of the wafer brushing.

[0017] The beneficial effects of the present invention are as follows: 1) Multiple sets of roll brushing units can be integrated into the same housing, and the distance between stations can be greatly shortened to effectively improve the production efficiency per volume. 2) The independent support wheel system, brushing system, and spraying system can improve efficiency while ensuring flexibility, and enable independent or simultaneous brushing of different wafers. 3) The housing can be two-compartment, three-compartment, four-compartment, etc., and the number of compartment chambers has a high level of customization and a wide range of application. 4) In the same housing, the bottoms of different compartment chambers can be communicated to allow multiple stations to share one set of drainage pipes, simplifying the drainage system and further simplifying the internal space of the equipment. 5) The integrated brushing housing shares multiple sets of parts, such as partitions, floors, etc., greatly reducing the number of parts, saving material costs, and reducing assembly work. 6) One opening and closing drive mechanism can be shared to realize synchronous opening and closing of different roll brushing units, saving equipment space and reducing procurement costs. 7) The multi-wafer brushing device can be of symmetrical structure, so as to facilitate the arrangement of the equipment and facilitate the connection of the electric circuit and the gas or liquid circuit. [Brief description of the drawings]

[0018] [Figure 1] FIG. 2 is a perspective view of a portion of the present invention excluding a housing. [Diagram 2] FIG. 2 is a perspective view of a portion of the structure of the present invention. [Diagram 3] FIG. 2 is a first schematic diagram of a partial engagement structure between the opening / closing drive mechanism and the roll brushing unit of the present invention. [Figure 4] FIG. 2 is a second schematic diagram of the partial engagement structure of the opening / closing drive mechanism and the roll brushing unit of the present invention. [Diagram 5] FIG. 2 is a schematic diagram of the partial engagement structure of the opening / closing drive mechanism and the roll brushing unit of the present invention (in this case, the first connecting plate and the second connecting plate are open). [Figure 6] FIG. 2 is a first perspective view of a first drive unit according to the present invention. [Figure 7] FIG. 2 is a second perspective view of the first drive unit according to the present invention. [Figure 8] FIG. 11 is a third perspective view of the first drive unit according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] In order to allow those skilled in the art to better understand the method of the present invention, the technical solutions in the embodiments of the invention are described below clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts should belong to the scope of the present invention.

[0020] As shown in FIG. 1 and FIG. 2, the multi-wafer brushing apparatus includes a housing 1 in which a plurality of compartment chambers 2 are disposed. The bottoms of the plurality of compartment chambers 2 communicate with each other and share a set of drainage systems. The tops of the plurality of compartment chambers 2 communicate with each other and share a set of exhaust systems 21. A support wheel system 3 and a brushing system 4 are provided in each compartment chamber 2. The support wheel system 3 positions the wafer 6 by a support wheel, fixes the position of the wafer 6, and rotates the wafer 6 during brushing. A spray system 22 is provided in each compartment chamber 2 to continuously spray a cleaning liquid to clean the chemical reagent on the surface of the wafer 6 while the wafer 6 is inside the housing 1. That is, the processes of cleaning the wafer 6 in each compartment chamber 2 are independent of each other, and cleaning liquids of different processes can be used.

[0021] The brushing system 4 includes a set of roll brushing units 5 that can move toward each other to brush the wafers 6 or move away from each other to release the wafers 6, facilitating removal of the wafers 6. The brushing systems 4 are connected to each other by an opening / closing drive mechanism 7, which is used to simultaneously drive the sets of roll brushing units 5 in different compartment chambers 2 toward or away from each other.

[0022] The roll brushing units 5 may approach or move away from each other in a parallel manner, or may approach or move away from each other with one end open, or may approach each other with one end closed.

[0023] The roll brushing unit 5 includes two horizontal bars 53 arranged in parallel, two first connecting plates 51 connected to both ends of one horizontal bar 53, and two second connecting plates 52 connected to both ends of the other horizontal bar 53. A roller brush 54 is attached between the two first connecting plates 51 and between the two second connecting plates 52. The two first connecting plates 51 on the horizontal bar 53 are arranged symmetrically to ensure parallelism of the roller brush 54 during opening and closing operations.

[0024] In order to avoid interference, the installation positions of the two cross bars 53 are different, one cross bar 53 is installed between the bottom parts of the two first connecting plates 51, specifically, on the side away from the second connecting plate 52 of the same set of roll brushing units 5 at the bottom, and the other cross bar 53 is installed between the middle parts of the two second connecting plates 52, specifically, on the side away from the first connecting plate 51 of the same set of roll brushing units 5 at the middle.

[0025] By driving the opening / closing drive mechanism 7, the two first connecting plates 51 and the two second connecting plates 52 of different sets of roll brushing units 5, i.e., the roll brushing units 5 in different compartment chambers 2, are synchronously opened and closed in a V-shape.

[0026] As shown in Figs. 3 and 4, the opening / closing drive mechanism 7 includes a power source 74, a first drive unit 71 connected to the power source 74, a second drive unit 72, and a third drive unit 73. The first drive unit 71 connects the second connection plate 52 and the first connection plate 51 of the adjacent roll brushing units 5. The second drive unit 72 is used to drive the first connection plate 51 and the second connection plate 52 of the same pair of roll brushing units 5 to open and close. The third drive unit 73 is provided between adjacent roll brushing units 5 to which the power source is not connected, and is used to drive the second connection plate and the first connection plate of the adjacent roll brushing units 5 to open and close.

[0027] The first drive unit 71 includes at least a rotating disk 711 that is driven by a power source 74 and can rotate in a circumferential direction, and two links 712 each having one end connected directly or indirectly to the rotating disk, and the other ends of the two links 712 are connected directly or indirectly to a first connecting plate and a second connecting plate, respectively, of the adjacent roll brushing units 5.

[0028] As shown in Fig. 6 to Fig. 8, in this embodiment, the two links 712 and the rotating disk 711 are both connected by the third relay column 713, and the two third relay columns 713 are installed along the radial direction of the rotating disk 711, and in the initial state, the two third relay columns 713 are vertically located between the two connecting plates, which facilitates the subsequent transmission and makes the transmission structure more labor-saving. The links 712 and the third relay column 713 are connected at an incline, and the two links 712 are arranged in parallel. The first connecting plate and the link 712 are connected by the first relay column 714, and the second connecting plate of the other roll brushing unit 5 and the other link 712 are connected by the second relay column 715.

[0029] The connection between the link 712 and the third relay column 713 may be a rotating connection or a fixed connection. The connection between the link 712 and the first relay column 714 may be a rotating connection or a fixed connection. The connection between the link 712 and the second relay column 715 may be a rotating connection or a fixed connection. The connection between the first relay column 714 and the first connecting plate may be a rotating connection or a fixed connection. The connection between the second relay column 715 and the second connecting plate may be a rotating connection or a fixed connection. However, the connections between the two links 712, the third relay column 713, the first relay column 714, the second relay column 715, the first connecting plate and the second connecting plate cannot all be fixed connections, and at least one side of the connecting structure needs to be a rotating connection.

[0030] The second driving unit 72 is composed of a first gear 721 provided at the bottom of the first connecting plate 51 and a second gear 722 provided at the bottom of the second connecting plate 52, and the first gear 721 and the second gear 722 mesh with each other to transmit power. The above-mentioned first connecting plate 51 and the second connecting plate 52 belong to the same set of roll brushing units 5. Of course, in other embodiments, the second driving unit 72 is not limited to gear transmission, and may be in the form of belt transmission, link transmission, etc.

[0031] The third drive unit 73 has a similar configuration to the first drive unit 71, except that the rotating disk is not connected to a power source. When the number of the third drive units 73 is at least two, they are arranged alternately above and below.

[0032] A notch 55 is formed in both the second connecting plate and the first connecting plate to form an escape space and avoid interference between adjacent roll brushing units 5. Specifically, a notch is formed in the apex of the second connecting plate on the side facing the first connecting plate of the other roll brushing unit, and a notch is also formed in the apex of the first connecting plate on the side facing the second connecting plate of the other roll brushing unit.

[0033] 3, the operation process of the present invention is explained as follows: the power source 74 rotates the rotating disk 711 of the first driving unit 71 counterclockwise, and rotates the two links 712 in an interlocking manner, so that the top end of the second connecting plate 52-1 and the top end of the first connecting plate 51-2 are open. The second connecting plate 52-1 and the first connecting plate 51-2 belong to two different roll brushing units 5.

[0034] At the same time, under the driving of the second driving unit 72 at the bottom of the first set of roll brushing units, i.e., the first gear at the bottom of the first connecting plate 51-1 and the second gear at the bottom of the second connecting plate 52-1 of the same set of roll brushing units mesh with each other and transmit power, so that the first connecting plate 51-1 and the second connecting plate 52-1 of the first set of roll brushing units open in a V shape as shown in Figure 5.

[0035] Similarly, the first connecting plate 51-2 and the second connecting plate 52-2 of the second roll brushing unit also open in a V-shape.

[0036] When the second connecting plate 52-2 is driven, the second relay pillar of the third driving unit 73 rotates, thereby rotating the first connecting plate 51-3 of the third set of roll brushing units, and when another second driving unit is driven, the first connecting plate 51-3 and the second connecting plate 52-3 of the third set of roll brushing units also open in a V shape.

[0037] Another third drive unit is connected between the third and fourth roll brushing units, and its position is lower than the middle part, which is different from the position of the third drive unit arranged between the second and third roll brushing units, which is higher than the middle part. In other words, the third drive units are arranged alternately up and down when the number of the third drive units is at least two.

[0038] The brushing system 4 controls the opening / closing and rotation of the roll brushing unit 5, and the opening / closing drive mechanism 7 controls the roll brushing unit 5 to open during the initial stage of brushing so that a sufficient gap is created to prevent interference when the robot arm enters the housing 1.

[0039] The above is the process by which the first and second connecting plates are opened, and after opening, the robot arm is used to grasp the wafer 6. When the robot arm needs to close both plates to lift the wafer 6 and move it out of the housing 1 and bring the roller brush 54 close to the wafer 6 for brushing, the rotating disk 711 of the first driving unit 71 is driven to rotate clockwise by the power source 74.

[0040] The roller brushes 54 rotate continuously and simultaneously close towards the center to pinch the wafer 6. The left roller brush rotates clockwise and the right roller brush rotates counterclockwise to ensure the resultant downward force the wafer receives during the brushing process and fix the wafer position together with the support wheel system 3. The support wheel system 3 rotates the wafer in a fixed direction so that each surface of the wafer can be brushed. The cleaning liquids sprayed from the different compartment chambers 2 are collected in the space at the bottom of the housing 1 and discharged to the outside of the equipment along the same set of drainage lines.

[0041] The above specific embodiments are for the purpose of explaining and interpreting the present invention, and are not intended to limit the present invention. Any modifications or changes made to the present invention within the spirit of the present invention and the scope of the claims are included in the scope of the present invention.

Claims

1. A multi-wafer brushing device comprising: The present invention comprises a housing (1) having a plurality of compartment chambers (2) therein, The bottoms of the multiple compartment chambers (2) are in communication with each other; Within each compartment chamber (2) there is provided a support wheel system (3) and a brushing system (4); The brushing system (4) comprises a set of roll brushing units (5) which are movable toward each other to brush the wafers (6) or move away from each other to remove the wafers (6); The brushing systems (4) are connected to each other by an opening / closing drive mechanism (7); The opening / closing drive mechanism (7) is used to simultaneously drive a plurality of sets of the roll brushing units (5) toward or away from each other. A multi-wafer brushing device.

2. The roll brushing unit (5) comprises two horizontal bars (53) arranged in parallel, a first connecting plate (51) connected to both ends of one horizontal bar (53), and a second connecting plate (52) connected to both ends of the other horizontal bar (53); The first connecting plate (51) and the second connecting plate (52) are used to attach a roller brush (54); By driving the opening / closing drive mechanism (7), the two first connecting plates (51) and the two second connecting plates (52) of different sets of roll brushing units (5) are synchronously opened and closed in a V-shape.

2. The multi-wafer brushing apparatus of claim 1.

3. The opening / closing drive mechanism (7) includes a power source (74), a first drive unit (71) connected to the power source (74), a second drive unit (72), and a third drive unit (73), The first driving unit (71) connects the second connecting plate and the first connecting plate of the adjacent roll brushing units (5), the second driving unit (72) is used to drive the first connecting plate and the second connecting plate of the same set of roll brushing units (5) to open and close; the third drive unit (73) is provided between adjacent roll brushing units (5) to which a power source is not connected, and is used to drive the adjacent roll brushing units (5) to open and close the gap between the second connection plate and the first connection plate; 3. The multi-wafer brushing device according to claim 2.

4. The first drive unit (71) includes at least a rotating disk (711) that is driven by a power source (74) and can rotate in a circumferential direction, and two links (712) each having one end directly or indirectly connected to the rotating disk (711); The other ends of the two links (712) are directly or indirectly connected to a first connecting plate and a second connecting plate of the adjacent roll brushing units (5), respectively.

4. The multi-wafer brushing device according to claim 3.

5. The link (712) and the rotating disk (711) are connected via a third relay post (713), The first connecting plate and the link (712) are connected via a first relay post (714), The second connecting plate and the link (712) are connected via a second relay post (715).

5. The multi-wafer brushing device according to claim 4.

6. The two third relay columns (713) are arranged along the radial direction of the rotating disk (711) and are positioned vertically between the two connecting plates in the initial state; The link (712) is connected to the third relay column (713) at an angle.

6. The multi-wafer brushing apparatus according to claim 5.

7. The second drive unit (72) comprises a first gear (721) provided at the bottom of the first connecting plate (51) and a second gear (722) provided at the bottom of the second connecting plate (52); The first gear (721) and the second gear (722) mesh with each other to transmit power.

4. The multi-wafer brushing device according to claim 3.

8. the third drive units (73), when they are at least two in number, are arranged one above the other; 4. The multi-wafer brushing device according to claim 3.

9. The second connecting plate and the first connecting plate of the adjacent roll brushing units (5) each have a notch (55) so as to form an escape space.

3. The multi-wafer brushing device according to claim 2.

10. The tops of the compartment chambers (2) are in communication with each other and share a set of exhaust system (21) and a set of drainage system; Each compartment chamber (2) is provided with a spray system (22).

2. The multi-wafer brushing apparatus of claim 1.

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