Image sensor substrate

Abstract

To provide a substrate for an image sensor.SOLUTION: A substrate comprises an insulating layer and a conductive pattern portion arranged on the insulating layer. The insulating layer includes a first insulating portion, and a second insulating portion that is arranged by surrounding the periphery of the first insulating portion and spaced from the first insulating portion by sandwiching a first open region. The conductive pattern portion includes a first conductive pattern portion arranged on the first insulating portion, a second conductive pattern portion arranged on the second insulating portion, and an extension pattern portion which is arranged on the first open region and allows the first and second conductive pattern portions to connect to each other. The extension pattern portion includes a bent portion arranged on a corner region of the first open region.SELECTED DRAWING: Figure 13

Description

[Technical field]

[0001] The embodiment relates to a substrate, and in particular to a substrate for an image sensor that is capable of relative movement around a lens barrel. [Background technology]

[0002] In general, camera devices are installed in electronic devices such as mobile communication terminals, MP3 players, and other portable devices, as well as automobiles, endoscopes, CCTVs, etc. Such camera devices are gradually being developed with a focus on high pixel counts, and are becoming smaller and thinner. In addition, current camera devices are changing to be able to realize various additional functions at low manufacturing costs.

[0003] The camera device includes a lens barrel that houses a lens, a lens holder that is coupled to the lens barrel, an image sensor that is disposed within the lens holder, and a driving board on which the image sensor is mounted. In this case, the lens transmits an image signal of a subject to the image sensor, and the image sensor converts the image signal into an electrical signal.

[0004] Here, the accuracy of the image signal in the camera device is determined according to the focal length, which is defined as the distance between the lens and the image sensor.

[0005] As a result, the camera device provides focus compensation and shake correction by moving the lens barrel relative to the image sensor. That is, the camera device moves the lens barrel housing the lens relative to the image sensor in the X-axis, Y-axis, and Z-axis. In this case, the camera device requires at least six elastic members such as springs to move the lens barrel relatively. And, each of the elastic members is connected to the lens barrel by a method such as bonding.

[0006] However, the camera device according to the above-mentioned conventional technology is composed of an upper spring plate arranged on the upper part of the lens barrel, a lower spring plate arranged on the lower part of the lens barrel, and a structure such as an elastic wire for fixing the Z axis as the lens barrel moves relatively, which results in a problem that the modular structure of the camera device is complicated.

[0007] Furthermore, the camera device according to the conventional technology requires a plurality of elastic members for moving the lens barrel, which increases the number of steps required for assembling the plurality of elastic members. Summary of the Invention [Problem to be solved by the invention]

[0008] In the embodiment, it is possible to provide a substrate having a new structure, a sensor driving device, and a camera module including the same.

[0009] In addition, in the embodiment, it is possible to provide a substrate in which an image sensor is movable relative to a lens barrel, a sensor driving device, and a camera module including the same.

[0010] In addition, in the embodiment, it is possible to provide a substrate capable of tilt correction as well as movement in the X-axis, Y-axis, and Z-axis, a sensor driving device, and a camera module including the same.

[0011] In addition, in the embodiment, it is possible to provide a substrate, a sensor driving device, and a camera module including the same, which can simplify the spring structure for providing an autofocus function and an image stabilization function.

[0012] In addition, in the embodiment, a wire spring is added to a leaf spring structure that serves to electrically connect to the image sensor, thereby making it possible to provide a substrate, a sensor driving device, and a camera module including the same that can suppress tilt that occurs when the image sensor moves.

[0013] In the proposed embodiments, the technical problems to be solved are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the art to which the proposed embodiments pertain from the following description. [Means for solving the problem]

[0014] A substrate in accordance with an embodiment includes an insulating layer, a first pattern portion disposed on the insulating layer, and a second pattern portion disposed on the insulating layer and separated from the first pattern portion, the insulating layer including a first insulating portion including a first open area, and a second insulating portion disposed surrounding the outside of the first insulating portion and separated from the first insulating portion across a second open area, the first pattern portion including a first lead pattern portion disposed on the first insulating portion, a second lead pattern portion disposed on the second insulating portion, and a connecting pattern portion having one end connected to the first lead pattern portion and the other end connected to the second lead pattern portion and disposed on the second open area, the connecting pattern portion including a bent portion located at a corner of the second open area.

[0015] Moreover, the first pattern portion is a signal transmission pattern, and the second pattern portion is a reinforcing pattern physically separated from the first pattern portion.

[0016] The first lead pattern portion is disposed in a first direction on the first insulating portion, and the second lead pattern portion is disposed in a second direction on the second insulating portion that is perpendicular to the first direction.

[0017] Moreover, the length of the connecting pattern portion is greater than the linear distance between the first lead pattern portion and the second lead pattern portion.

[0018] Additionally, the length of the connecting pattern portion is greater than the width of the second open area.

[0019] The length of the connecting pattern portion is in the range of 1.5 to 20 times the linear distance between the outside of the first insulating portion and the inside of the second insulating portion.

[0020] The connecting pattern portion is disposed above the second open area.

[0021] The first lead pattern portion includes a 1-1 lead pattern portion disposed on the first insulating portion, and a 1-2 lead pattern portion extending inward from the first portion and disposed on the first open area.

[0022] The second lead pattern portion also includes a 2-1 lead pattern portion disposed on the second insulating portion, and a 2-2 lead pattern portion extending outward from the 2-1 lead pattern portion and not in contact with the second insulating portion.

[0023] Moreover, the line width of the connection pattern portion is smaller than the line width of the first lead pattern portion or the second lead pattern portion.

[0024] The connection pattern portion includes one end portion connected to the first lead pattern portion and the other end portion connected to the second lead pattern portion, and each of the one end portion and the other end portion has a curved side surface.

[0025] The curvature R of each of the side surfaces of the one end and the other end is in the range of 30-100.

[0026] The second pattern portion includes a first reinforcement pattern arranged on the first insulating portion and separated from the first lead pattern portion, a second reinforcement pattern arranged on the second insulating portion and separated from the second lead pattern portion, and a third reinforcement pattern arranged on the second open area, connecting between the first reinforcement pattern and the second reinforcement pattern, and separated from the connecting pattern portion.

[0027] The second reinforcement pattern also includes a 2-1 reinforcement pattern portion arranged on the second insulating portion, and a 2-2 reinforcement pattern portion extending from the first portion, arranged outside the second insulating portion, and not in contact with the second insulating portion.

[0028] Moreover, the 2-2 reinforcement pattern portion includes at least one coupling hole.

[0029] The insulating layer further includes a third insulating portion disposed on the second open area and in contact with the connecting pattern portion.

[0030] The third insulating portion is disposed at the corner of the second open region and contacts the bent portion of the connection pattern portion.

[0031] Additionally, the third insulating portion is physically separated from the first insulating portion and the second insulating portion.

[0032] In addition, the sensor driving device of the embodiment includes a holder portion including a holder, a magnet portion connected to the holder, and a damping plate arranged on the holder, a fixed portion including a first substrate including a first terminal portion, and a coil portion spaced apart from the fixed portion and facing the magnet, a coil moving substrate including a sensor, a moving portion connected to the coil moving substrate and a fixed portion connected to the first substrate, and a fourth substrate that moves the sensor by an electromagnetic force generated by the magnet and the coil portion, and a wire having one end connected to the damping plate of the fixed portion and the other end connected to the coil moving substrate, elastically supporting the coil moving substrate.

[0033] The fourth substrate further includes an insulating layer and a first pattern portion disposed on the insulating layer, the insulating layer including a first insulating portion including a first open area, and a second insulating portion disposed surrounding the outside of the first insulating portion and separated from the first insulating portion by a second open area, the first pattern portion including a first lead pattern portion disposed on the first insulating portion, a second lead pattern portion disposed on the second insulating portion, and a connecting pattern portion having one end connected to the first lead pattern portion and the other end connected to the second lead pattern portion and disposed on the second open area, the connecting pattern portion including a bent portion located at a corner of the second open area.

[0034] In addition, the first lead pattern portion includes a 1-1 lead pattern portion arranged on the first insulating portion and a 1-2 lead pattern portion extending inward from the first portion, arranged in the first open area, and connected to a second terminal portion of the coil movement substrate, and the second lead pattern portion includes a 2-1 lead pattern portion arranged on the second insulating portion and a 2-2 lead pattern portion extending outward from the 2-1 lead pattern portion, not in contact with the second insulating portion, and connected to the first terminal portion of the first substrate.

[0035] The coil moving substrate also includes a sensor substrate on which the sensor is disposed, the sensor substrate having an opening in which the sensor substrate is disposed.

[0036] Additionally, each of the holder and the coil moving substrate includes a through hole aligned in the optical axis direction and through which the wire passes. Effect of the Invention

[0037] According to the embodiment, a connection pattern part of a fourth substrate electrically connecting an image sensor part and a first substrate is arranged floating on an insulating layer while having a spring structure. At this time, the connection pattern part serves as a circuit for transmitting signals between the image sensor part and the first substrate and as a spring for moving an image sensor included in the image sensor part in X-axis, Y-axis, and Z-axis. As a result, the camera module according to the embodiment can eliminate a structure such as a spring plate required for moving the image sensor, and can simplify the manufacturing process by eliminating the process related to the spring plate.

[0038] In addition, according to the embodiment, a connection pattern portion having a spring function is arranged to connect a first lead pattern portion and a second lead pattern portion arranged in a region intersecting the region where the first lead pattern portion is arranged, not between the first lead pattern portion and the second lead pattern portion arranged in a region opposite to the region where the first lead pattern portion is arranged. As a result, the connection pattern portion in the embodiment has a shape rotated and arranged in the tilting direction of the image sensor. As a result, in the embodiment, the tilt operation of the image sensor can be stably performed using the connection pattern portion.

[0039] In addition, the fourth substrate in the embodiment includes an insulating layer and a connecting pattern portion disposed on the insulating layer, and the insulating layer includes a third insulating portion disposed in at least a portion of a region vertically overlapping with the connecting pattern portion, thereby enabling the camera module to move the image sensor relative to the lens barrel while more stably and elastically supporting the image sensor.

[0040] In the embodiment, the length of the connecting pattern portion is at least 1.5 to 20 times the linear distance between the opposing first and second lead pattern portions, thereby improving the mobility of the image sensor substrate and minimizing the generation of noise.

[0041] Also, the second actuator in the embodiment includes a connecting wire to solve the tilt problem. The connecting wire serves as a support rather than an electrical connection within the second actuator, and suppresses a tilt phenomenon of the image sensor unit in the Z-axis direction that may occur when the second actuator is driven. Accordingly, by additionally disposing the connecting wire in addition to the connecting pattern portion of the fourth substrate, the tilt phenomenon that occurs when the image sensor unit moves can be suppressed, and operational reliability can be improved. [Brief description of the drawings]

[0042] [Figure 1] FIG. 1 is a diagram showing a camera module according to a comparative example. [Diagram 2] FIG. 1 is a perspective view of a camera device according to an embodiment of the present invention. [Diagram 3] 3 is a cross-sectional view taken along line AA' in FIG. 2. [Figure 4] FIG. 2 is an exploded perspective view of the camera device according to the embodiment. [Diagram 5] FIG. 4 is an exploded perspective view of a second actuator in accordance with the embodiment. [Figure 6] 6 is an exploded perspective view of the holder portion shown in FIG. 5. [Figure 7] FIG. 7 is a diagram showing the damping plate shown in FIG. 6. [Figure 8] FIG. 6 is a perspective view of a first substrate shown in FIG. [Figure 9] 6 is an exploded perspective view of the coil movement substrate part shown in FIG. 5. [Figure 10] 10 is a bottom view of the second substrate of the coil movement substrate portion shown in FIG. [Figure 11] 10(a) is a plan view of the third substrate of the coil moving substrate portion shown in FIG. 9, and (b) is a bottom view of the third substrate of the coil moving substrate portion shown in FIG. [Figure 12] FIG. 4 is a diagram showing a bonding between a second substrate and a third substrate according to an embodiment. [Figure 13] FIG. 6 is an exploded perspective view of the fourth substrate shown in FIG. [Figure 14a]FIG. 6 is a plan view of a fourth substrate shown in FIG. [Figure 14b] FIG. 6 is a bottom view of the fourth substrate shown in FIG. 5. [Figure 14c] FIG. 13 is an enlarged view of a partial region of a fourth substrate. [Figure 15] FIG. 2 is an exploded perspective view of an image sensor module 400 according to an embodiment. [Figure 16a] 1A to 1C are diagrams illustrating shift driving in the x-axis direction through a partial configuration of the camera device according to the present embodiment. [Figure 16b] 1A to 1C are diagrams illustrating shift driving in the y-axis direction through a partial configuration of the camera device according to the present embodiment. [Figure 16c] 1A to 1C are diagrams illustrating the rotational drive around the z-axis through a partial configuration of the camera device according to the present embodiment. [Figure 17] 4A to 4C are diagrams illustrating the magnetic flow and the Lorentz force between the magnet and coil of the camera device according to the present embodiment. [Figure 18] FIG. 1A is a diagram showing the reliability evaluation results of a camera module according to a comparative example, and FIG. 1B is a diagram showing the reliability evaluation results of a camera module according to an example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0044] However, the technical concept of the present invention is not limited to the embodiments described, but may be realized in various different forms, and one or more of the components may be selectively combined or substituted between the embodiments within the scope of the technical concept of the present invention.

[0045] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention are interpreted as meanings that can be commonly understood by those having ordinary knowledge in the technical field to which the present invention belongs, unless otherwise clearly defined and described, and commonly used terms such as predefined terms may be interpreted in consideration of the contextual meaning of the related art. In addition, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not intended to limit the present invention.

[0046] In this specification, unless otherwise specified, the singular form can include the plural form, and when it is described as "A and (and) at least one (or more) of B and C," it can include one or more of all combinations of A, B, and C. In addition, in describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. can be used.

[0047] Such terms are used only to distinguish a component from other components, and do not limit the essence, order, or procedure of the components. Furthermore, when a component is described as being "coupled," "connected," or "connected" to another component, it includes not only the case where the component is directly connected or connected to the other component, but also the case where the component is "coupled," "connected," or "connected" between the other component and the other component or by another component.

[0048] In addition, when it is described as being formed or disposed "above (upper) or below (lower)" each component, the above (upper) or below (lower) includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. In addition, when it is expressed as "above (upper) or below (lower)", it can include not only the upper direction based on one component, but also the lower direction.

[0049] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0050] FIG. 1 is a diagram showing a camera module according to a comparative example.

[0051] A camera module equipped with an OIS (Optical Image Stabilizer) function and an AF (Auto Focusing) function requires at least two spring plates.

[0052] The camera module according to the comparative example may have two spring plates, whereas the camera module according to the comparative example requires at least six elastic members such as springs in the spring plate.

[0053] 1, the camera module according to the comparative example includes an optical system including a lens assembly, an infrared blocking filter unit, and a sensor unit. That is, the camera module according to the comparative example includes a lens barrel 10, a lens assembly 20, a first elastic member 31, a second elastic member 32, a first housing 41, a second housing 42, an infrared blocking filter unit 50, a sensor unit 60, a circuit board 80, and driving units 71, 72, and 74.

[0054] At this time, the lens barrel 10 is connected to the first housing 41. That is, the lens barrel 10 is connected to the first housing 41 via the first elastic member 31. That is, the lens barrel 10 is connected to the first housing 41 so as to be movable by the first elastic member 31. At this time, the first elastic member 31 includes a plurality of springs (not shown). For example, the first elastic member 31 connects the lens barrel 10 and the first housing 41 at a plurality of points of the lens barrel 10.

[0055] The second elastic member 32 is connected to the first housing 41 and the second housing 42 that accommodates the first housing 41. The second elastic member 32 fixes the first housing 41 to the second housing 42 so that the first housing 41 can move. The second elastic member 32 includes a plurality of springs. More specifically, the second elastic member 32 includes a plate spring.

[0056] At this time, the first elastic member 31 supports the lens barrel 10 and moves the lens barrel 10 in the vertical direction (Z-axis direction) relative to the sensor unit 60. For this reason, the first elastic member 31 includes at least four springs.

[0057] In addition, the second elastic member 32 supports the lens barrel 10 and moves the lens barrel 10 in the horizontal direction (X-axis direction and Y-axis direction) relative to the sensor unit 60. For this purpose, the second elastic member 32 includes at least two springs.

[0058] As described above, in the camera module according to the comparative example, the lens barrel 10 moves in the X-axis, Y-axis, and Z-axis directions to perform OIS and AF. For this purpose, the camera module according to the comparative example requires at least six elastic members such as springs. In addition, the camera module according to the comparative example requires two spring plates to support the elastic members. In addition, the camera module according to the comparative example requires an additional member such as an elastic wire to fix the Z-axis of the lens barrel 10. Therefore, the camera module according to the comparative example has a complex spring structure for moving the lens barrel in the X-axis, Y-axis, and Z-axis directions.

[0059] Furthermore, in the camera module according to the comparative example, each elastic member must be manually bonded to connect the elastic members to the lens barrel 10. As a result, the manufacturing process of the camera module according to the comparative example is complicated and takes a long time to manufacture.

[0060] Also, the camera module according to the comparative example provides a tilt function for lens barrel 10, but has a structure that makes it difficult to actually perform tilt correction on an image. That is, even if lens barrel 10 rotates with respect to sensor unit 60, the image incident on sensor unit 60 does not change, making it difficult to perform tilt correction on an image, and furthermore, the tilt function itself is unnecessary.

[0061] An image sensor substrate, a camera module, and a camera device including these according to the embodiments will be described below.

[0062] The term "optical axis direction" used hereinafter is defined as the optical axis direction of a lens and / or an image sensor coupled to the lens driving device.

[0063] The "vertical direction" used below may be a direction parallel to the optical axis direction. The vertical direction may correspond to the "z-axis direction". The "horizontal direction" used below may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the "x-axis direction" and the "y-axis direction".

[0064] The "autofocus function" used below is defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor by moving the lens along the optical axis according to the distance of the subject so that a clear image of the subject can be obtained on the image sensor. On the other hand, "autofocus" can be used in conjunction with "AF (Auto Focus)".

[0065] The "image stabilization function" used below is defined as a function that moves the lens and / or image sensor to offset vibrations (movements) that occur in the image sensor due to external forces. On the other hand, "image stabilization" can correspond to "OIS (Optical Image Stabilization)."

[0066] FIG. 2 is a perspective view of the camera device according to this embodiment, FIG. 3 is a cross-sectional view taken along line AA' in FIG. 2, and FIG. 4 is an exploded perspective view of the camera device according to this embodiment.

[0067] The camera device in the embodiment may include a camera module. The camera device may include a lens driving device. Here, the lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens driving motor. The lens driving device may be a lens driving actuator. The lens driving device may be a first actuator. The camera device may include a sensor driving device. Here, the sensor driving device may be a voice coil motor. The sensor driving device may be a sensor driving motor. The sensor driving device may be a sensor driving actuator. The sensor driving device may be a second actuator.

[0068] Here, the lens driving device may include an AF module.

[0069] And the sensor driver may include an OIS module.

[0070] <Camera equipment> The camera device may include a lens module 100 .

[0071] The lens module 100 may include a lens and a lens barrel. The lens module 100 may include one or more lenses and a lens barrel that can accommodate one or more lenses. However, a configuration of the lens module 100 is not limited to the lens barrel, and any holder structure that can support one or more lenses is possible. The lens module 100 may be coupled to a first actuator 200 and moved. The lens module 100 may be coupled to the inside of the first actuator 200, for example. Thus, the lens module 100 may move inside the first actuator 200 in response to the movement of the first actuator 200. The lens module 100 may be coupled to the first actuator 200 by a screw. The lens module 100 may be coupled to the first actuator 200 by an adhesive (not shown), for example. Meanwhile, light passing through the lens module 100 may be irradiated to an image sensor. Meanwhile, the lens module 100 may include five lenses, for example. The lens module 100 may include a liquid lens and a solid lens. The liquid lens may include a conductive liquid and a non-conductive liquid, and the interface formed between the conductive liquid and the non-conductive liquid may be controlled by an electric force. The liquid lens may be a lens whose focal length is adjusted by adjusting the interface.

[0072] The camera device may include an actuator.

[0073] Specifically, the camera apparatus may include a first actuator 200 for shifting the lens module 100. The first actuator 200 may be an AF module. The first actuator 200 may move the lens module 100 in an up-down direction (specifically, in the optical axis direction). That is, the first actuator 200 may move the lens module 100 in the optical axis direction to perform an autofocus function.

[0074] The second actuator 600 may drive the image sensor 430. The second actuator 600 may tilt or rotate the image sensor 430. The second actuator 600 may move the image sensor 430. The second actuator 600 may move the image sensor 430 in a first direction perpendicular to an optical axis, in a second direction perpendicular to the optical axis and the first direction, and rotate the image sensor 430 based on the optical axis. In this case, the first direction may be an x-axis direction, the second direction may be a y-axis direction, and the optical axis may be a z-axis direction.

[0075] Meanwhile, the first actuator 200 and the second actuator 600 may include a driving unit to move the lens module 100 and the image sensor 430, respectively. That is, the first actuator 200 may include a first driving unit (described later). Also, the second actuator 600 may include a second driving unit (described later). Each of the first and second driving units may include a coil and a magnet. The coil and the magnet may generate electromagnetic force between each other to drive the lens module 100 and the image sensor 430, respectively.

[0076] The camera device may include a case. The case may include a first case 300 and a second case 500. The first case 300 may be an upper case that covers an upper area of ​​the camera device. In this case, the first case 300 may be a shielding can.

[0077] The first case 300 may include a first opening 310 and a second opening 320 .

[0078] The second opening 320 may be an exposure hole that exposes a portion of the first actuator 200 housed in the first case 300 to the outside.

[0079] Meanwhile, as camera technology has recently developed, image resolution has increased, and the size of the image sensor 430 has also increased. At this time, as the size of the image sensor 430 increases, the size of the lens module 100 and the actuator components for shifting the lens module 100 have also increased. As a result, not only the weight of the lens module 100 itself but also the weight of other actuator components for shifting the lens module 100 increases, making it difficult to stably shift the lens module 100 using the conventional VCM technology, and many problems have arisen in terms of reliability.

[0080] As a result, in this embodiment, AF is performed using the first actuator 200 that realizes the lens shift method, and OIS is performed using the second actuator 600 that realizes the image sensor shift method, thereby improving the reliability of the camera device.

[0081] Furthermore, there is a 5-axis type of camera shake in a camera device. For example, there are two types of 5-axis camera shake caused by angles, two types of camera shake caused by shifts, and one type of camera shake caused by rotation. In this case, the lens shift method can only perform 4-axis camera shake correction, and cannot correct the camera shake caused by rotation. This is because the camera shake caused by rotation must be corrected by rotating the optical module, but even if the lens module 100 is rotated, the incident optical path remains the same, and therefore the lens shift method cannot perform 5-axis camera shake correction. Therefore, in this embodiment, the sensor shift method is applied to enable 5-axis camera shake correction, while resolving the reliability problem with the lens shift method that comes with the development of camera technology as described above.

[0082] In the following, each component of the camera device according to the embodiment will be described in more detail. The camera device according to the embodiment is characterized by the second actuator, and therefore, in the following, the second actuator will be described in detail.

[0083] <Second actuator> The second actuator 600 will be described below.

[0084] The second actuator 600 is located below the first actuator 200 and can operate separately from the first actuator 200 to shift the image sensor module 400 .

[0085] For this, the second actuator 600 may include a fixed part whose position is fixed, and a moving part whose position is moved by the electromagnetic force of the second actuator while being coupled to the fixed part. The fixed part refers to a component that is fixed in position and does not change when the second actuator 600 is driven, among the components constituting the second actuator 600, and the moving part refers to a component that changes position when the second actuator 600 is driven.

[0086] 5 is an exploded oblique view of a second actuator according to an embodiment, FIG. 6 is an exploded oblique view of the holder portion shown in FIG. 5, FIG. 7 is a diagram showing the damping plate shown in FIG. 6, FIG. 8 is an oblique view of the first substrate shown in FIG. 5, FIG. 9 is an exploded oblique view of the coil moving substrate portion shown in FIG. 5, FIG. 10 is a bottom view of the second substrate of the coil moving substrate portion shown in FIG. 9, FIG. 11(a) is a plan view of the third substrate of the coil moving substrate portion shown in FIG. 9, FIG. 11(b) is a bottom view of the third substrate of the coil moving substrate portion shown in FIG. 9, FIG. 12 is a diagram of the combination of the second substrate and the third substrate according to an embodiment, FIG. 13 is an exploded oblique view of the fourth substrate shown in FIG. 5, FIG. 14a is a plan view of the fourth substrate shown in FIG. 5, FIG. 14b is a bottom view of the fourth substrate shown in FIG. 5, and FIG. 14c is an enlarged view of a partial area of ​​the fourth substrate.

[0087] 5 to 14c, the second actuator 600 includes a fixed part and a moving part. In this case, the fixed part of the second actuator 600 may include a housing 610, a holder part 620, and a part of the substrate parts 630, 640, and 650. In addition, the moving part of the second actuator 600 may include the remaining part of the substrate parts 630, 640, and 650. The substrate parts 630, 640, and 650 may include a coil moving substrate part 640 including a first substrate 630, a second substrate 641, and a third substrate 642, and a fourth substrate 650.

[0088] The first substrate 630 of the substrate units 630, 640, and 650 may be a fixed portion of the second actuator 600. The coil moving substrate unit 640 including the second substrate 641 and the third substrate 642 of the substrate units 630, 640, and 650 may be a moving portion of the second actuator 600. The fourth substrate 650 may be a fixed portion, and may be a moving portion different from the fixed portion. That is, a part of the fourth substrate 650 may be a fixed portion, and the remaining part of the fourth substrate 650 may be a moving portion. Preferably, an outer frame (described below) of the fourth substrate 650 may be connected to the first substrate 630 and function as a fixed portion, and an inner frame of the fourth substrate 650 may be connected to the coil moving substrate unit 640 including the second substrate 641 and the third substrate 642 and function as a moving portion. This will be described in more detail below.

[0089] In addition, the second actuator 600 may include a housing 610. The housing 610 may have an accommodation space therein for accommodating components constituting the second actuator 600. Preferably, the housing 610 may accommodate a part of the first substrate 630, the second substrate 641, the holder part 620, the third substrate 642, and the fourth substrate 650.

[0090] The second actuator 600 will be described in detail below.

[0091] -housing- The housing 610 may include a bottom 611 having a first opening 612 formed at the center, and a sidewall 613 protruding upward from an end region of the bottom 611. At least a portion of the sidewall 613 of the housing 610 may include an exposed portion 616. The exposed portion 616 allows a portion of the first substrate 630 accommodated in the housing 610 to be exposed to the outside of the housing 610. The housing 610 may include a plurality of first guide protrusions 614 formed in an area adjacent to the inner side of the bottom 611. The housing 610 may include a coupling groove 615 recessed downward on an upper surface of the sidewall 613.

[0092] -Holder part- A holder portion 620 is disposed on the housing 610 .

[0093] The holder part 620 may include a holder 621 , a damping plate 622 , and a magnet part 623 .

[0094] The holder 621 may be a magnet holder in which a magnet portion 623 is disposed.

[0095] The holder 621 may also be a damping plate holder in which the damping plate 622 is disposed.

[0096] The holder 621 may include a first frame 621a having a second opening 621-1 formed in the center and disposed on the housing 610, and a second frame 621b extending downward from a lower end of the first frame 621a.

[0097] A first frame 621a of the holder 621 may be disposed to cover a portion of the open upper region of the housing 610. The first frame 621a may have a plate-like shape with a second opening 621-1 formed in the center. The second opening 621-1 may be aligned with the first opening 612 on the optical axis.

[0098] The second frame 621b may be disposed in a region of the lower surface of the first frame 621a corresponding to the exposed portion 616 of the housing 610. The second frame 621b may extend downward from the first frame 621a and be disposed within the exposed portion 616 of the housing 610. Preferably, the second frame 621b may cover a portion of the opened exposed portion 616 of the housing 610. That is, the second frame 621b may be opened in a region 621-5 corresponding to a second portion of the exposed portion 616.

[0099] That is, the area of ​​the second frame 621b may be smaller than the area of ​​the exposed portion 616. Thus, the second frame 621b may be disposed to cover only the first portion of the exposed portion 616. The second portion of the exposed portion 616 excluding the first portion may remain open even when the holder 621 is disposed on the housing 610. The region 621-5 of the second frame 621b and the second portion of the exposed portion 616 may be aligned in a direction perpendicular to the second open area 320 of the first case 300 and the optical axis. Thus, the second portion of the exposed portion 616 may expose the terminal 262 of the flexible circuit board 260 of the first actuator 200 together with the second open area 320 of the first case 300.

[0100] A first mounting part 621-2 may be provided on a first frame 621a of the holder 621. The first mounting part 621-2 may be a step disposed on an inner upper surface of the first frame 621a.

[0101] A first recess 621-3 in which elastic portions 622-2 and 622-3 of a damping plate 622 are disposed is formed in the first mounting portion 621-2 of the holder 621. The first recesses 621-3 may be disposed in a plurality of positions spaced apart from each other at regular intervals on the first mounting portion 621-2.

[0102] In addition, a first through hole 621-4 into which a connecting wire 624 is inserted may be formed in the first recess 621-3.

[0103] A damping plate 622 may be disposed on the first mounting part 621-2 of the holder 621. The damping plate 622 may include a plate part 622-1 disposed on the first mounting part 621-2, and elastic parts 622-2 and 622-3 extending from the plate part 622-1 and disposed in the first recess 621-3.

[0104] The elastic portions 622-2 and 622-3 may be integrally formed with the plate portion 622-1. However, the elastic portions 622-2 and 622-3 may extend from the plate portion 622-1 and include a bending region that can be bent at least once.

[0105] Preferably, the elastic portions 622-2 and 622-3 may include a first elastic portion 622-2 including a bending region that can be bent at least once, and a second elastic portion 622-3 extending from the first elastic portion 622-2 and having a hole formed in a region corresponding to the first through-hole 621-4. That is, the hole formed in the second elastic portion 622-3 and the first through-hole 621-4 of the holder 621 may be holes through which the connecting wire 624 passes.

[0106] One end of the connecting wire 624 may be connected to the second elastic portion 622-3 of the damping plate 622 by soldering.

[0107] As described above, the elastic portions 622-2 and 622-3 of the damping plate 622 may include curved portions, and may preferably be formed by being bent in multiple parts, so that the elastic portions 622-2 and 622-3 of the damping plate 622 may have elasticity.

[0108] At this time, if the elastic parts 622-2 and 622-3 of the damping plate 622 do not include a bent portion, the connecting wire 624 may move together with the image sensor module 400 when the image sensor module 400 moves, causing warping, and may break depending on the degree of warping. In contrast, in the embodiment, the elastic parts 622-2 and 622-3 of the damping plate 622 include a bent portion, so that the connecting wire 624 can function as a suspense when the image sensor module 400 moves, thereby imparting elasticity to the connecting wire 624 and increasing the rigidity of the connecting wire 624.

[0109] One end of the connecting wire 624 is connected to the elastic portions 622-2 and 622-3 of the damping plate 622. The connecting wire 624 passes through a first through-hole 621-4 of the holder 621 and extends downwardly of the holder 621, preferably toward a position where the bottom 611 of the housing 610 is located.

[0110] One end of the connecting wire 624 may be connected to the damping plate 622 and the other end may be connected to the coil moving substrate part 640. In this case, the damping plate 622 is a fixed part of the second actuator 600, and the coil moving substrate part 640 is a moving part of the second actuator 600. In this case, when the image sensor module 400 shifts due to the shift of the coil moving substrate part 640 in a situation where the connecting wire 624 does not exist, the image sensor module 400 may tilt due to the elasticity of the coil moving substrate part 640 or the fourth substrate 650, regardless of the direction in which the shift occurs.

[0111] Thus, the connecting wire 624 is connected to the damping plate 622 and the coil moving substrate part 640 is connected to the other end thereof to support the coil moving substrate part 640. Preferably, the connecting wire 624 can suppress a tilt phenomenon that occurs when the coil moving substrate part 640, the fourth substrate 650, and the image sensor module 400 are shifted. Here, the tilt phenomenon may include a phenomenon in which the image sensor module 400 hangs down due to the elasticity of the fourth substrate 650. The connecting wire 624 can prevent the coil moving substrate part 640 from hanging down in the downward direction. That is, the coil moving substrate part 640 may be shifted while being suspended from the holder part 620 via the connecting wire 624, and the tilt phenomenon caused thereby can be minimized.

[0112] The connecting wire 624 may have elasticity. The connecting wire 624 may be an elastic member. The connecting wire 624 may be a wire spring. As described above, the connecting wire 624 may connect the damping plate 622 and the third substrate 642 of the coil moving substrate part 640 in a state in which the holder part 620 and the coil moving substrate part 640 are spaced apart from each other at a predetermined interval. The connecting wire 624 may be made of metal. The connecting wire 624 may elastically support the movement of the coil moving substrate part 640.

[0113] The connecting wires 624 may include a plurality of wires. The connecting wires 624 may be uniformly distributed and disposed on the four sides. That is, the connecting wires 624 may have a mutually symmetrical structure with the four sides facing each other. In this case, the connecting wires 624 must elastically support the coil moving substrate unit 640. If the connecting wires 624 are disposed with an asymmetrical structure, a difference in the amount of movement or tilt occurs between a portion where many connecting wires are disposed and the other portion during the shifting operation of the coil moving substrate unit 640, and thus a problem may occur in the reliability of the operation. Therefore, in the embodiment, the connecting wires 624 are uniformly disposed in each region to improve the reliability of the image sensor shifting operation. Meanwhile, although the number of connecting wires 624 is shown as four in the drawings, this is merely an embodiment, and the number of connecting wires may be increased to eight or twelve, etc., while having the above-mentioned symmetrical structure.

[0114] Meanwhile, a magnet seat (not shown) on which a magnet part 623 is disposed may be formed on a lower surface of the first frame 621a of the holder 621. The magnet seat of the holder 621 may have the magnet part 623 disposed thereon.

[0115] The magnet unit 623 may be disposed facing a coil unit (described below) disposed on the coil movement substrate unit 640. In this case, when a current is applied to the coil unit, an electric field may be formed around the coil unit. When a current is applied to the coil unit, the coil unit may move relative to the magnet unit 623 through electromagnetic interaction between the coil unit and the magnet unit 623.

[0116] The magnet unit 623 may be disposed at the corners of the lower surface of the holder 621. That is, the magnet unit 623 may be disposed at four corners of the lower surface of the holder 621. The magnet unit 623 may face the coil unit of the coil moving substrate unit 640. The magnet unit 623 may be a flat plate magnet.

[0117] The magnet unit 623 may include a plurality of magnets. The magnet unit 623 may include four magnets. The magnet unit 623 may include first to fourth magnets 623-1, 623-2, 623-3, and 623-4.

[0118] The first magnet 623-1 may face the first coil 641-2a arranged on the second substrate 641 of the coil movement substrate unit 640. The first magnet 623-1 may be arranged at a first corner formed on the upper left side of the holder 621. The second magnet 623-2 may face the second coil 641-2b arranged on the second substrate 641 of the coil movement substrate unit 640. The second magnet 623-2 may be arranged at a second corner formed on the upper right side of the holder 621. The third magnet 623-3 may face the third coil 641-2c arranged on the second substrate 641 of the coil movement substrate unit 640. The third magnet 623-3 may be arranged at a third corner formed on the lower right side of the holder 621. The fourth magnet 623-4 may face the fourth coil 641-2d arranged on the second substrate 641 of the coil movement substrate unit 640. The fourth magnet 623-4 may be disposed at a fourth corner formed on the lower left side of the holder 621. The magnets constituting the magnet unit 623 may be disposed perpendicular to adjacent magnets and parallel to diagonally disposed magnets.

[0119] -First board- The first substrate 630 may include a first region 631 having a third opening 631a formed in the center, and a second region 632 extending from the first region 631 and in which a connector to be connected to an external device is disposed.

[0120] The first substrate 630 may include a first terminal portion 635 disposed in the first region 631. The first terminal portion 635 may be connected to a second lead pattern portion 652-2 of a fourth substrate 650, which will be described later. For example, a second lead pattern portion 652-2 of the fourth substrate 650 may be disposed on the first terminal portion 635 of the first substrate 630, and thus the second lead pattern portion 652-2 and the first terminal portion 635 may be electrically connected to each other through a soldering process.

[0121] Preferably, the first terminal portion 635 may be disposed around the third opening 631a on the upper surface of the first region 631. The first terminal portion 635 may also be referred to as a pad electrically connected to the second lead pattern portion 652-2 of the fourth substrate 650.

[0122] The first terminal unit 635 may be composed of a plurality of terminals. The first terminal unit 635 may include a plurality of first terminals. For example, the first terminal unit 635 may include a plurality of 1-1 terminals 635-1 disposed on one side of the third opening 631a of the first region 631 and a plurality of 1-2 terminals 635-2 disposed on the other side of the first region 631 opposite to the one side of the third opening 631a.

[0123] The number of terminals of the first terminal unit 635 may be equal to or greater than the number of patterns of the second lead pattern unit 652-2. When the number of first terminals constituting the first terminal unit 635 is equal to the number of second lead patterns constituting the second lead pattern unit 652-2, all of the first terminals may be connected to the second lead patterns. When the number of first terminals constituting the first terminal unit 635 is greater than the number of second lead patterns constituting the second lead pattern unit 652-2, some of the first terminals may be connected to the second lead patterns. The remaining part of the first terminals may function as test terminals for testing the connection state, etc.

[0124] A connector may be disposed in the second region 632 connected to the first region 631. The connector may be a port for electrically connecting to an external device.

[0125] The first region 631 may be disposed inside a camera device, and the second region 632 may extend from the first region 631 and be exposed to the outside of the camera device.

[0126] For example, the first region 631 may be disposed inside the housing 610, and the second region 632 may be disposed outside the housing 610 via the exposed portion 616 of the housing 610, and the region disposed outside may include a connector for connecting to an external device.

[0127] The first substrate 630 may transmit a signal to the fourth substrate 650 or receive a signal transmitted from the fourth substrate 650. The first substrate 630 is electrically connected to a first pattern unit 652a of the fourth substrate 650, and may thereby transmit a power signal or a communication signal to the fourth substrate 650 and receive information including an image signal acquired via the image sensor module 400.

[0128] For example, the image sensor module 400 is coupled to the third substrate 642 of the coil moving substrate part 640. The third substrate 642 is coupled to the second substrate 641 of the coil moving substrate part 640. The first pattern portion 652a of the fourth substrate 650 is coupled to the third substrate 642. That is, a first lead pattern portion 652-1 of the first pattern portion 652a of the fourth substrate 650 is coupled to the third substrate 642. The first pattern portion 652a of the fourth substrate 650 is coupled to the first substrate 630. That is, a second lead pattern portion 652-2 of the first pattern portion 652a of the fourth substrate 650 is coupled to the first substrate 630.

[0129] Meanwhile, an image signal acquired through the image sensor module 400 is transmitted to the second substrate 641. At this time, the image signal is transmitted to a third substrate 642 connected to the second substrate 641, and the image signal is transmitted from the third substrate 642 to the fourth substrate 650, which may be transmitted to the first substrate 630 again.

[0130] In addition, a power signal or a communication signal transmitted from the first board 630 to the second board 641 may be transmitted to the second board 641 via the fourth board 650 and the third board 642 .

[0131] The first substrate 630 may include a second terminal portion 636 disposed in an end region of the first region 631. The second terminal portion 636 may be electrically connected to a flexible circuit board 260 included in the first actuator 200.

[0132] The first substrate 630 may be seated on the housing 610 by a first guide protrusion 614 of the housing 610. The first substrate 630 may be positioned in a fixed state within the housing 610. That is, the first substrate 630 may maintain a fixed position without moving when the second actuator 600 is driven.

[0133] Meanwhile, in the above description, the first region 631 of the first substrate 630 is disposed within the housing 610. However, a portion of the first region 631 may be disposed within the housing 610, and the remaining portion may be exposed to the outside of the housing 610 together with the second region 632. A gyro sensor 633 may be disposed in the exposed portion of the first region 631.

[0134] Additionally, a passive element 634 may be disposed on the exposed portion of the first region 631 .

[0135] That is, in this embodiment, a gyro sensor 633 for implementing a hand shake function is disposed on the first substrate 630. The first substrate 630 can feed back angular velocity / linear velocity sensing information caused by hand shake to the coil moving substrate unit 640 using information acquired through the gyro sensor 633.

[0136] - Coil movement board part - The coil moving substrate part 640 may be disposed under the holder part 620 within the housing 610. The coil moving substrate part 640 may be supported by the holder part 620 via the connecting wire 624 at a position spaced apart from the holder part 620 by a predetermined distance.

[0137] That is, one end of the connection wire 624 is connected to the damping plate 622 constituting the holder unit 620, and the other end is connected to the coil moving substrate unit 640 disposed under the holder unit 620. The connection wire 624 can prevent the coil moving substrate unit 640 from being tilted in a direction other than the moving direction when the second actuator 600 is driven. That is, the connection wire 624 can prevent the coil moving substrate unit 640 from being tilted in the optical axis direction that is unrelated to the shift direction. That is, the coil moving substrate unit 640 can move relatively to the holder unit 620 or the lens unit 100 due to the mutual action between the magnet unit 623 and the coil unit 641-2 while being supported by the holder unit 620 via the connection wire 624.

[0138] To this end, the coil moving substrate unit 640 may include a second substrate 641, a third substrate 642, and a substrate holder 643. Here, the second substrate 641 and the third substrate 642 may be substrate units constituting the coil moving substrate unit 640, and may further be moving units that move when the second actuator 600 is driven.

[0139] The second substrate 641 may be a main substrate. The second substrate 641 may be a drive substrate for driving the second actuator 600.

[0140] The second substrate 641 may include a fourth opening 641a. The fourth opening 641a may overlap with a third opening 631a formed in the first substrate 630 in the optical axis direction.

[0141] The second substrate 641 may include coil parts 641-2 disposed at each corner thereof.

[0142] The coil unit 641-2 may be electrically connected to a circuit pattern (not shown) included in the second substrate 641. The coil unit 641-2 may be disposed to face the magnet unit 623 disposed in the holder unit 620. When a current is applied to the coil unit 641-2, an electric field may be formed around the coil unit 641-2.

[0143] The coil unit 641-2 may include four coils. At this time, current may be applied independently to at least three of the four coils. In the first embodiment, the coil unit 641-2 may be controlled by three channels. Or, in the second embodiment, the coil unit 641-2 may be controlled by four individual channels. The four coils constituting the coil unit 641-2 may be electrically separated from each other. Either a forward current or a reverse current may be selectively applied to each of the four coils of the coil unit 641-2. In this embodiment, only three of the four coils may be electrically separated, and one coil may be electrically connected to the other coil. Or, all four coils constituting the coil unit 641-2 may be electrically separated from each other. Here, if only three of the four coils are electrically separated, three pairs of lead wires, a total of six, will come out from coil section 641-2, and if all four coils are electrically separated, four pairs of lead wires, a total of eight, will come out from coil section 641-2.

[0144] When controlling four coils with three channels as in the first embodiment of this embodiment, the rotational drive about the z-axis must be driven by one pair of coil section 641-2 and magnet section 623. However, when controlling four coils with four channels as in the second embodiment, the rotational drive about the z-axis can be driven by two pairs of coil section 641-2 and magnet section 623.

[0145] The coil unit 641-2 may include first to fourth coils 641-2a, 641-2b, 641-2c, and 641-2d. The first to fourth coils 641-2a, 641-2b, 641-2c, and 641-2d may be disposed to face the respective magnets of the magnet unit 623 disposed in the holder unit 620.

[0146] The first coil 641-2a may be disposed at a first corner of the second substrate 641. The second coil 641-2b may be disposed at a second corner of the second substrate 641. The third coil 641-2c may be disposed at a third corner of the second substrate 641. The fourth coil 641-2d may be disposed at a fourth corner of the second substrate 641. The first coil 641-2a and the third coil 641-2c may be disposed in a first diagonal direction of the second substrate 641, and the second coil 641-2b and the fourth coil 641-2d may be disposed in a second diagonal direction of the second substrate 641.

[0147] In this embodiment, the first coil 641-2a and the third coil 641-2c may be arranged to be long in the first direction, and the second coil 641-2b and the fourth coil 641-2d may be arranged to be long in the second direction. In this case, the first direction and the second direction may be perpendicular. The long side of the first coil 641-2a and the long side of the third coil 641-2c may be arranged parallel to each other. The long side of the second coil 641-2b and the long side of the fourth coil 641-2d may be arranged parallel to each other. The long side of the first coil 641-2a and the long side of the second coil 641-2b may be arranged not to be parallel to each other. In this case, the long side of the first coil 641-2a and the long side of the second coil 641-2b may be arranged so that their virtual extension lines are perpendicular to each other. The arrangement direction of the first coil 641-2a and the arrangement direction of the second coil 641-2b may be perpendicular to each other.

[0148] In this embodiment, currents may be applied independently to at least three of the first to fourth coils 641-2a, 641-2b, 641-2c, and 641-2d, and the first to fourth coils 641-2a, 641-2b, 641-2c, and 641-2d may be electrically isolated from each other.

[0149] Meanwhile, a hall sensor 641-3 may be disposed inside the first to fourth coils 641-2a, 641-2b, 641-2c, and 641-2d. In this embodiment, the hall sensor 641-3 may be disposed inside only three of the first to fourth coils 641-2a, 641-2b, 641-2c, and 641-2d. In the first embodiment, the first to fourth coils 641-2a, 641-2b, 641-2c, and 641-2d are controlled by three channels, so that a hall sensor does not need to be provided for one coil. The hall sensor 641-3 may sense the magnetic force of the magnet unit 623. The movement of the image sensor module may be grasped in real time by the magnetic force of the magnet unit 623 sensed by the hall sensor 641-3. This allows OIS feedback control.

[0150] The Hall sensor 641-3 may be configured in plurality. That is, as described above, the Hall sensor 641-3 may include three sensors. Through the three sensors, the movement in the x-axis direction, the movement in the y-axis direction, and the rotation about the z-axis of the image sensor 430 may all be detected. The Hall sensor 641-3 may include first to third sensors. The first sensor may face the first magnet, the second sensor may face the second magnet, and the third sensor may face the third magnet.

[0151] The Hall sensor 641-3 may include a first Hall sensor that senses the amount of movement and / or displacement of the magnet unit 623 in the x-axis direction. The Hall sensor 641-3 may include a second Hall sensor that senses the amount of movement and / or displacement of the magnet unit 623 in the y-axis direction. The Hall sensor 641-3 may include a third Hall sensor that senses the amount of movement and / or displacement of the magnet unit 623 in the x-axis direction or the amount of movement and / or displacement of the magnet unit 623 in the y-axis direction. The rotational movement of the magnet unit 623 about the z-axis may be sensed via any two or more of the first Hall sensor, the second Hall sensor, and the third Hall sensor.

[0152] A driver IC 641-4 for controlling the operation of the second actuator may be disposed on the second substrate 641. Also, various passive elements 641-5 for operating the second actuator may be disposed on the second substrate 641.

[0153] In this case, the second substrate 641 must electrically connect the coil unit 641-2, the driver IC 641-4, and the passive element 641-5 to each other, and then connect the second substrate 641 to the first substrate 630. Here, the number of terminals required for the electrical connection of the second substrate 641 to the first substrate 630 may be 12. The 12 terminals may be terminals connected to the driver IC 641-4. Here, four of the 12 terminals may be connected to each other. Thus, the four terminals may be configured as one terminal. Thus, in the connection between the first substrate 630 and the second substrate 641, the number of terminals required for the connection to the driver IC 641-4 may be eight.

[0154] Also, the second substrate 641 may have 28 terminals required for electrical connection with the image sensor module 400. The second substrate 641 must transmit image signals acquired through the image sensor module 400 to the first substrate 630. Therefore, in the connection between the first substrate 630 and the second substrate 641, the number of terminals required for transmitting the image signals may be 28.

[0155] Accordingly, a third terminal unit 641-8 may be disposed on the lower surface of the second substrate 641, which is connected to the driver IC 641-4 or for transmitting an image signal acquired through the image sensor module 400 to the first substrate 630. The third terminal unit 641-8 may be a pad for electrically connecting to the first substrate 630. Preferably, the first substrate 630 and the second substrate 641 do not directly transmit and receive signals to each other, but transmit and receive signals through the third substrate 642 disposed therebetween. Therefore, the third terminal unit 641-8 may be a pad for electrically connecting to the third substrate 642. Preferably, the third terminal unit 641-8 is connected to the second substrate 641, thereby transmitting a signal (e.g., a control signal) generated in the first substrate 630 to the second substrate 641, or transmitting a signal (e.g., an image signal) generated in the second substrate 641 to the first substrate 630.

[0156] Meanwhile, the third terminal portion 641-8 may be divided into a plurality of regions and disposed on the lower surface of the second substrate 641. For example, the third terminal portion 641-8 may include a 3-1 terminal portion 641-8a disposed on a first side of the fourth opening 641a on the lower surface of the second substrate 641 and a 3-2 terminal portion 641-8b disposed on a second side opposite to the first side.

[0157] In addition, a fourth terminal unit 641-7 to which the image sensor module 400 is coupled may be formed on a lower surface of the second substrate 641. The fourth terminal unit 641-7 may be arranged on the lower surface of the second substrate 641 in a plurality of divided regions.

[0158] That is, the fourth terminal unit 641-7 may include a 4-1 terminal unit 641-7a and a 4-2 terminal unit 641-7b disposed in regions facing each other on a lower surface of the fourth opening 641a with the fourth opening 641a interposed therebetween. At this time, the fourth terminal unit 641-7 is connected to the image sensor module 400 and may receive an image signal transmitted through the image sensor module 400 or may receive a signal other than the image signal.

[0159] At this time, a noise signal may be included in the image signal if a terminal for receiving the image signal and a terminal for receiving other signals are arranged in the same region on the bottom surface of the second substrate 641. Therefore, in the embodiment, a 4-1 terminal 641-7a for transmitting the image signal and a 4-2 terminal 641-7b for transmitting other signals among the fourth terminal 641-7 connected to the image sensor module 400 are arranged in different regions, thereby improving the quality of the image signal.

[0160] Meanwhile, a second through hole 641-6 may be formed in the second substrate 641. At this time, the second through hole 641-6 may be aligned in the optical axis direction with the first through hole 621-4 disposed in the holder 621. The second through hole 641-6 may be a wire through hole through which a connecting wire 624 coupled to the damping plate 622 passes.

[0161] A third substrate 642 may be disposed under the second substrate 641. The third substrate 642 may relay electrical connections between the first substrate 630, the second substrate 641, and the fourth opening 641a.

[0162] In this case, a substrate holder 643 may be disposed between the second substrate 641 and the third substrate 642 .

[0163] A substrate holder 643 may be disposed between the second substrate 641 and the third substrate 642 to increase a bonding strength between the second substrate 641 and the third substrate 642 .

[0164] A fifth opening 643-1 may be formed at the center of the substrate holder 643. The fifth opening 643-1 may be aligned with a fourth opening 641a formed in the second substrate 641 in the optical axis direction.

[0165] In addition, the substrate holder 643 may include a protrusion 643-2 extending outward from an end region. The protrusion 643-2 may be formed to protrude outward from a side surface of the substrate holder 643. The protrusion 643-2 may be seated on an upper surface of the second substrate 641, and a lower surface of the protrusion 643-2 may contact the upper surface of the second substrate 641. At this time, the protrusion 643-2 may be configured in multiple numbers, thereby allowing the substrate holder 643 to be stably seated on the second substrate 641.

[0166] Meanwhile, the protrusion 643-2 formed on the substrate holder 643 may be disposed in a region overlapping in the optical axis direction with the second through-hole 641-6 formed on the second substrate 641. Therefore, the protrusion 643-2 may include a recess 643-3 recessed inward to expose the second through-hole 641-6.

[0167] And, the third substrate 642 may be coupled to the substrate holder 643 below the second substrate 641. The third substrate 642 may also have an opening formed in its center, and the opening may be aligned in the optical axis direction with openings disposed in the second substrate 641, the third substrate 642, the first actuator, etc.

[0168] As shown in FIG. 11(a), the third substrate 642 may include a fifth terminal portion 642-2 formed on an upper surface thereof.

[0169] The fifth terminal unit 642-2 may face the third terminal unit 641-8 formed on the lower surface of the second substrate 641. That is, the fifth terminal unit 642-2 may be aligned with the third terminal unit 641-8 formed on the second substrate 641 in the optical axis direction. The fifth terminal unit 642-2 may include terminals corresponding to the number of terminals of the third terminal unit 641-8. The fifth terminal unit 642-2 and the third terminal unit 641-8 may be electrically connected to each other through soldering.

[0170] In this case, the fifth terminal unit 642-2 may include a fifth terminal unit 642-2a connected to the third terminal unit 641-8a of the third terminal unit 641-8, and a fifth terminal unit 642-2b connected to the second terminal unit 641-8b.

[0171] 11(b), the third substrate 642 may include a sixth terminal portion 642-3 formed on a lower surface thereof. The sixth terminal portion 642-3 may be electrically connected to a first pattern portion 652a of a fourth substrate 650, which will be described later. More preferably, the sixth terminal portion 642-3 may be coupled to a first lead pattern portion 652-1 of the first pattern portion 652a of the fourth substrate 650. That is, the fourth substrate 650 may be disposed below the sixth terminal portion 642-3, and the first lead pattern portion 652-1 of the first pattern portion 652a of the fourth substrate 650 may be located therebelow. The sixth terminal portion 642-3 may be coupled and electrically connected to the first lead pattern portion 652-1 through soldering.

[0172] At this time, the fifth terminal unit 642-2 and the sixth terminal unit 642-3 may be arranged to be aligned with each other in the optical axis direction. That is, a part of the fifth terminal unit 642-2 and the sixth terminal unit 642-3 receives an image signal transmitted from the second board 641 and transmits the image signal again to the first board 630 via the fourth board 650. At this time, the longer the length of the signal wiring for transmitting the image signal, the more likely it is to affect the quality of the image signal. Therefore, in order to minimize the length of the signal wiring, the fifth terminal unit 642-2 and the sixth terminal unit 642-3 may be arranged to be aligned with each other in the optical axis direction. Also, one of the fifth terminal unit 642-2 and the sixth terminal unit 642-3 is a terminal for transmitting the image signal, and the other is a terminal for transmitting signals other than the image signal. Thus, in the embodiment, the fifth terminal unit 642-2 and the sixth terminal unit 642-3 are separated from each other by an opening, thereby minimizing the influence of noise generated during the transmission of the image signal.

[0173] Meanwhile, the third substrate 642 may include a plurality of coupling protrusions 642-1 protruding outward from an outer surface thereof, and a third through hole 642-4 may be formed in the coupling protrusions 642-1 and extending in the optical axis direction.

[0174] The third through hole 642-4 may be aligned in the optical axis direction with a first through hole 621-4 formed in the holder 621 and a second through hole 641-6 formed in the second substrate 641. A portion of the connecting wire 624 passing through the first through hole 621-4 and the second through hole 641-6 may be disposed in the third through hole 642-4.

[0175] In this case, a bonding pad (not shown) may be disposed around the third through hole 642-4 on the lower surface of the bonding protrusion 642-1. The bonding pad (not shown) may be disposed around the third through hole 642-4 to solder the connecting wire 624. The other end of the connecting wire 624 may be soldered to the bonding pad after passing through the third through hole 642-4.

[0176] In conclusion, one end of the connecting wire 624 is connected to the damping plate 622. The other end of the connecting wire 624 is connected to the third substrate 642. The portion between the one end and the other end of the connecting wire 624 may be located within the first through hole 621-4, the second through hole 641-6, and the third through hole 642-4. At this time, the length of the connecting wire 624 may be greater than the total thickness of the damping plate 622, the holder 621, the second substrate 641, and the third substrate 642. Therefore, the coil moving substrate 640 may be disposed in a suspended state from the holder 620 at a position spaced apart from the holder 620 via the connecting wire 624.

[0177] -Fourth board- The fourth substrate 650 may be disposed between the first substrate 630 and the third substrate 642. At least a portion of the fourth substrate 650 may have elasticity. The coil moving substrate unit 640 disposed on the fourth substrate 650 may move relative to the lens unit due to the elastic force of the fourth substrate 650 and the interaction between the magnet unit 623 and the coil unit 641-2. The fourth substrate 650 may also be expressed as an image sensor substrate on which an image sensor is disposed.

[0178] The fourth substrate 650 allows the image sensor module 400 to be shifted while also allowing signal transmission.

[0179] The fourth substrate 650 includes an insulating layer 651 and a pattern unit 652 disposed on one surface of the insulating layer 651. In this case, the pattern unit 652 is illustrated as being disposed on the lower surface of the insulating layer 651 in the drawings, but is not limited thereto, and the pattern unit 652 may be disposed on the upper surface of the insulating layer 651.

[0180] The insulating layer 651 can be divided into a number of regions that are isolated from one another.

[0181] For example, the insulating layer 651 may include a first insulating portion 651-1 having a first open region OR1 formed at the center thereof, and a second insulating portion 651-2 disposed outside the first insulating portion 651-1 and spaced apart from the first insulating portion 651-1. In this case, the first insulating portion 651-1 and the second insulating portion 651-2 are shown as being separated from each other in the drawings, but are not limited thereto. For example, a connecting insulating portion (not shown) connecting the first insulating portion 651-1 and the second insulating portion 651-2 may be further disposed between the outside of the first insulating portion 651-1 and the inside of the second insulating portion 651-2. In other words, the insulating layer 651 may have a structure in which the first insulating portion 651-1 and the second insulating portion 651-2 are completely physically separated with the open region therebetween, or may be connected to each other in some regions through a connecting insulating portion additionally disposed in the open region. In this case, the insulating portion of the entire region between the first insulating portion 651-1 and the second insulating portion 651-2 is not entirely removed, but is partially left, and the remaining portion may function as a connecting insulating portion connecting the first insulating portion 651-1 and the second insulating portion 651-2. The connecting insulating portion may provide elasticity during a shift operation of the image sensor module 400, and may prevent the first insulating portion 651-1 and the second insulating portion 651-2 from being detached during the shift process. The insulating layer 651 may be formed by removing a region corresponding to the open region on one insulating member through etching or physical punching, etc.

[0182] However, what is important here is that in the embodiment, the insulating layer 651 has a second open area OR2 formed between the first insulating portion 651-1 and the second insulating portion 651-2, and the first insulating portion 651-1 and the second insulating portion 651-2 in the second open area OR2 may be separated from each other without being connected to each other.

[0183] That is, the second insulating portion 651-2 may be disposed to surround the first insulating portion 651-1 at a position spaced apart from the first insulating portion 651-1 via the second open region OR2. In this case, the first insulating portion 651-1 and the second insulating portion 651-2 may form a single layer structure disposed on the same plane.

[0184] The insulating layer 651 may have a thickness of 20 μm to 100 μm. For example, the insulating layer 651 may have a thickness of 25 μm to 50 μm. For example, the insulating layer 651 may have a thickness of 30 μm to 40 μm. If the insulating layer 651 has a thickness of more than 100 μm, the overall thickness of the fourth substrate 650 may increase. If the insulating layer 651 has a thickness of less than 20 μm, the pattern unit 652 may not be stably supported. For example, if the insulating layer 651 has a thickness of less than 20 μm, the insulating layer 651 may be weak to heat / pressure during a soldering process for bonding with the first substrate 630 and the third substrate 642, and thus the bonding strength with the first substrate 630 and the third substrate 642 may be reduced.

[0185] Meanwhile, although not shown in the drawings, at least one slit (not shown) may be formed on the first insulating portion 651-1. The slit may be formed to maintain the flatness of the first insulating portion 651-1. The slit maintains the flatness while reducing the weight of the insulating layer 651 and further the fourth substrate 650, thereby improving the overall reliability of the camera module.

[0186] A pattern unit 652 is disposed on one surface of the insulating layer 651 .

[0187] The pattern unit 652 includes a first pattern unit 652a performing a signal transmission function, and a second pattern unit 652b separated from the first pattern unit 652a for ensuring rigidity. The second pattern unit 652b can also be said to be a reinforcing pattern for ensuring rigidity of the fourth substrate 650. Meanwhile, although not shown in the drawing, an adhesive sheet (not shown) may be disposed between the insulating layer 651 and the pattern unit 652, thereby improving the adhesive strength between the insulating layer 651 and the pattern unit 652.

[0188] The first pattern unit 652a may include a first lead pattern unit 652-1 disposed on a first insulating portion 651-1 of the insulating layer 651, a second lead pattern unit 652-2 disposed on a second insulating portion 651-2 of the insulating layer 651, and a connection pattern unit 652-3 disposed on a second open area OR2 between the first insulating portion 651-1 and the second insulating portion 651-2 and electrically connecting the first lead pattern unit 652-1 and the second lead pattern unit 652-2. In this case, the connection pattern unit 652-3 is disposed on the second open area OR2 between the first insulating portion 651-1 and the second insulating portion 651-2.

[0189] The first lead pattern portion 652-1 may be disposed in two opposing side regions among the four side regions of the first insulating portion 651-1. That is, the first insulating portion 651-1 may include a left side region, a right side region, an upper side region, and a lower side region. The first lead pattern portion 652-1 may be disposed in the upper side region and the lower side region among the four side regions of the first insulating portion 651-1, which are opposing each other. The first lead pattern portion 652-1 may not be disposed in the left side region and the right side region among the side regions of the first insulating portion 651-1.

[0190] The second lead pattern portion 652-2 may be arranged in one of four side regions of the second insulating portion 651-2, which is different from the side region in which the first lead pattern portion 652-1 is arranged.

[0191] That is, the second insulating portion 651-2 may include a left side region, a right side region, an upper side region, and a lower side region. The second lead pattern portion 652-2 may be disposed in the left side region and the right side region that face each other among the four side regions of the second insulating portion 651-2. The second lead pattern portion 652-2 may not be disposed in the upper side region and the lower side region among the side regions of the second insulating portion 651-2.

[0192] As described above, the first lead pattern part 652-1 and the second lead pattern part 652-2 may be disposed in different side regions of the first insulating part 651-1 and the second insulating part 651-2. That is, the first lead pattern part 652-1 is disposed in the upper side region and the lower side region of the first insulating part 651-1. Differently, the second lead pattern part 652-2 is disposed in the left side region and the right side region of the second insulating part 651-2. As a result, the first lead pattern part 652-1 and the second lead pattern part 652-2 may be disposed without facing each other in the second open region OR2 between the first insulating part 651-1 and the second insulating part 651-2. This may improve the reliability of the roll operation of the image sensor module 400 in the Z-axis direction.

[0193] Here, the first lead pattern portion 652-1 may be an inner lead pattern portion connected to a sixth terminal portion 642-3 of the third substrate 642. And, the second lead pattern portion 652-2 may be an outer lead pattern portion connected to a first terminal portion 635 of the first substrate 630.

[0194] The first lead pattern portion 652-1 and the second lead pattern portion 652-2 may be connected to each other via a connection pattern portion 652-3. One end of the connection pattern portion 652-3 may be connected to the first lead pattern portion 652-1 and the other end of the connection pattern portion 652-3 may be connected to the second lead pattern portion 652-2, and a region excluding the one and other ends may be located on the second open region OR2 between the first insulating portion 651-1 and the second insulating portion 651-2. That is, the connection pattern portion 652-3 may be disposed in a flying manner on the second open region OR2 between the first insulating portion 651-1 and the second insulating portion 651-2. Here, the flying may mean that the insulating layer 651 does not exist on at least a portion of the connection pattern portion 652-3, and thus at least a portion of the connection pattern portion 652-3 is floating in the air.

[0195] In this case, the first lead pattern portion 652-1 is formed in a plurality of portions. Also, the second lead pattern portion 652-2 is also formed in a plurality of portions. And, the connection pattern portion 652-3 can connect the plurality of first lead pattern portions 652-1 and the plurality of second lead pattern portions 652-2 in a 1:1 ratio.

[0196] In this case, the first lead pattern unit 652-1 may include 36 first lead patterns. And the second lead pattern unit 652-2 may also include 36 second lead patterns. Thus, the connection pattern unit 652-3 may include 36 connection patterns, thereby connecting the first lead patterns and the second lead patterns.

[0197] The connection pattern unit 652-3 may be disposed on the second open area OR2 by being folded at least once. That is, the connection pattern unit 652-3 may include at least one bent portion. The connection pattern unit 652-3 may be disposed on the second open area OR2 by having a structure having a rotated shape.

[0198] For example, when the first lead pattern portion 652-1 and the second lead pattern portion 652-2 are arranged facing each other on the insulating layer 651, the connecting pattern portion 652-3 may connect the first lead pattern portion 652-1 and the second lead pattern portion 652-2 in a straight line without a bent portion.

[0199] In contrast, in the embodiment, since the first lead pattern portion 652-1 and the second lead pattern portion 652-2 are not disposed opposite to each other, the connection pattern portion 652-3 includes a bent portion that is bent at least once. The bent portion of the connection pattern portion 652-3 can improve not only the elasticity of the connection pattern portion 652-3 but also the rigidity of the connection pattern portion 652-3.

[0200] In this case, the length of the connecting pattern portion 652-3 is greater than the width of a second open area OR2 between the first insulating portion 651-1 and the second insulating portion 651-2.

[0201] The connection pattern unit 652-3 may be formed by etching to have the above-mentioned shape through an additive process, a subtractive process, a modified semi-additive process (MSAP), a semi-additive process (SAP), etc. Preferably, the first lead pattern unit 652-1, the second lead pattern unit 652-2, and the connection pattern unit 652-3 are integrally formed with each other, and thus may be simultaneously formed by etching one metal layer.

[0202] Meanwhile, the first pattern unit 652 including the first lead pattern unit 652-1, the second lead pattern unit 652-2, and the connecting pattern unit 652-3 may have a thickness of 10 μm to 50 μm. For example, the first pattern unit 652 may have a thickness of 30 μm to 40 μm. If the thickness of the first pattern unit 652 is less than 10 μm, the first pattern unit 652 may be cut during the shifting of the image sensor module 400. If the thickness of the first pattern unit 652 is more than 50 μm, the elasticity of the connecting pattern unit 652-3 may be reduced, which may hinder the mobility of the image sensor module 400. Therefore, in the embodiment, the thickness of the first pattern unit 652 is set to be 35 μm±5 μm so that the shifting operation of the image sensor module 400 can be stably performed.

[0203] The length of the connection pattern unit 652-3 is greater than the width of a second open area OR2 between the first insulating portion 651-1 and the second insulating portion 651-2. Here, the width of the second open area OR2 may be a straight line distance connecting the first insulating portion 651-1 and the second insulating portion 651-2.

[0204] The length of the connecting pattern portion 652-3 is at least 1.5 times the linear distance, and is 20 times or less the linear distance.

[0205] At this time, if the length of the connecting pattern part 652-3 is less than 1.5 times the linear distance, the elasticity of the connecting pattern part 652-3 may be reduced, which may affect the shifting operation of the image sensor module 400. Also, if the length of the connecting pattern part 652-3 is more than 20 times the linear distance, the resistance increases as the signal transmission distance through the connecting pattern part 652-3 increases, and thus noise may be included in the signal transmitted through the connecting pattern part 652-3. Therefore, in order to minimize the generation of noise, the length of the connecting pattern part 652-3 is set to be 10 times or less the linear distance between the first lead pattern part 652-1 and the second lead pattern part 652-2.

[0206] Meanwhile, the first pattern unit 652 is a wiring for transmitting an electrical signal and may be formed of a metal material having high electrical conductivity. To this end, the first pattern unit 652 may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Also, the first pattern unit 652 may be formed of a paste or solder paste including at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) having excellent bonding strength.

[0207] Preferably, the first pattern unit 652 may be formed of a metal material having elasticity that allows the image sensor module 400 disposed on the coil moving substrate 640 on the fourth substrate 650 to shift in the X-axis, Y-axis, and Z-axis directions while serving as a wiring for transmitting an electrical signal. For this purpose, the first pattern unit 652 may be formed of a metal material having a tensile strength of 1000 MPa or more. For example, the first pattern unit 652 may be a binary alloy or a ternary alloy including copper. For example, the first pattern unit 652 may be a binary alloy or a ternary alloy including at least one selected from nickel (Ni), tin (Sn), beryllium (Be), and cobalt (Co) and copper (Cu). The first pattern unit 652 may be formed of an alloy of iron (Fe), nickel (Ni), zinc, etc., having elasticity capable of acting as a spring and good electrical properties. In addition, the first pattern unit 652 may be surface-treated as a plating layer containing a metal material such as gold (Au), silver (Ag), palladium (Pd), etc., thereby improving electrical conductivity.

[0208] The second pattern portion 652b may be selectively disposed in an area of ​​one surface of the insulating layer 651 where the first pattern portion 652 is not disposed.

[0209] The second pattern portion 652b may include a first reinforcement pattern 652-4 arranged on the first insulating portion 651-1, a second reinforcement pattern 652-5 arranged on the second insulating portion 651-2, and a third reinforcement pattern 652-6 arranged on the second open area OR2 and connecting the first reinforcement pattern 652-4 and the second reinforcement pattern 652-5.

[0210] The first reinforcement pattern 652-4 may be disposed in a left side region and a right side region of the first insulating portion 651-1.

[0211] The second reinforcement pattern 652-5 may be disposed in a region of one surface of the second insulating portion 651-2 where the second lead pattern portion 652-2 is not disposed.

[0212] Also, the second reinforcement pattern 652-5 may include a first portion disposed on the upper surface of the second insulating portion 651-2, and a second portion extending from the first portion and disposed outside the second insulating portion 651-2. The second portion of the second reinforcement pattern portion 652b may be disposed extending outside the second insulating portion 651-2 to maintain the flatness of the second substrate 641 while ensuring the rigidity of the second substrate 641. Also, at least one coupling hole 652-7 may be formed in the second portion of the second reinforcement pattern 652-5. Thus, although not shown in the drawing, a coupling protrusion (not shown) corresponding to the coupling hole 652-7 may be disposed on the first substrate 630, thereby improving the coupling force between the fourth substrate 650 and the first substrate 630.

[0213] Meanwhile, the second pattern portion 652b may be formed of the same metal material as the first pattern portion 652. Preferably, the second pattern portion 652b may be formed together with the first pattern portion 652 in the same process.

[0214] Meanwhile, the first insulating portion 651-1, the first lead pattern portion 652-1, and the first reinforcement pattern 652-4 of the fourth substrate 650 may be a moving portion that moves together with the coil moving substrate 640.

[0215] The second insulating portion 651 - 2 , the second lead pattern portion 652 - 2 , and the second reinforcement pattern portion 652 - 5 of the fourth substrate 650 may be a fixing portion fixed onto the first substrate 630 .

[0216] In addition, the connection pattern unit 652-3 of the fourth substrate 650 may be a metal pattern having elasticity that allows the image sensor module 400 to shift while transmitting signals.

[0217] In addition, the third reinforcement pattern 652-6 of the fourth substrate 650 may have an elastic force that allows the image sensor module 400 to shift together with the connecting pattern portion 652-3.

[0218] Meanwhile, the line width of the first lead pattern portion 652-1 may be the same as the line width of the second lead pattern portion 652-2.

[0219] In addition, the line width of the connecting pattern portion 652-3 may be smaller than the line widths of the first lead pattern portion 652-1 and the second lead pattern portion 652-2.

[0220] In this case, between the first lead pattern portion 652-1 and the connecting pattern portion 652-3 and between the second lead pattern portion 652-2 and the connecting pattern portion 652-3, there may be a buffer portion whose width gradually decreases and whose sides are rounded rather than straight.

[0221] That is, the side surfaces of both ends of the connection pattern part 652-3 may have a curvature. In this case, if the side surfaces of both ends of the connection pattern part 652-3 have a linear shape, stress may be concentrated in this portion, which may cause a breakage phenomenon in which the connection pattern part 652-3 is separated from the first lead pattern part 652-1 or the second lead pattern part 652-2.

[0222] As a result, the end of the connection pattern portion 652-3 has a rounded side, which makes it possible to prevent stress from concentrating on the end.

[0223] At this time, the curvature R value of the side of the end of the connection pattern part 652-3 is set to be between 30 and 100. If the curvature R value of the side is less than 30, the effect of preventing the stress concentration may be insufficient, and if it is more than 100, the elasticity of the connection pattern part 652-3 may decrease.

[0224] Here, the line width of the connecting pattern unit 652-3 may be 20 to 1000 μm. If the line width of the connecting pattern unit 652-3 is less than 20 μm, the overall rigidity of the connecting pattern unit 652-3 may be reduced, resulting in reduced reliability. If the line width of the connecting pattern unit 652-3 is more than 1000 μm, the elasticity of the connecting pattern unit 652-3 may be reduced, resulting in a problem in shifting the image sensor module 400.

[0225] Meanwhile, the first lead pattern portion 652-1 may include a 1-1 lead pattern portion 652-1a disposed on the first insulating portion 651-1 of the insulating layer 651, and a 1-2 lead pattern portion 652-1b extending from the 1-1 lead pattern portion 652-1a and protruding inwardly of the first insulating portion 651-1. The 1-2 lead pattern portion 652-1b is disposed protruding from the first insulating portion 651-1, thereby facilitating a soldering process performed for coupling to the sixth terminal portion 642-3 of the third board 642.

[0226] The second lead pattern portion 652-2 may include a 2-1 lead pattern portion 652-2a disposed on the second insulating portion 651-2 of the insulating layer 651, and a 2-2 lead pattern portion 652-2b extending from the 2-1 lead pattern portion 652-2a and protruding outward from the first insulating portion 651-2. The 2-2 lead pattern portion 652-2b is disposed protruding outward from the second insulating portion 651-2, thereby facilitating a soldering process performed for coupling to the first terminal portion 635 of the first substrate 630.

[0227] Meanwhile, the insulating layer 651 may include a third insulating portion 651-3 disposed on a second open region OR2 between the first insulating portion 651-1 and the second insulating portion 651-2.

[0228] The third insulating portion 651-3 may be disposed on the connection pattern portion 652-3 and may function to increase the rigidity of the connection pattern portion 652-3.

[0229] In addition, the shape of the connection pattern unit 652-3 may change during a shift process of the image sensor module 400, and different connection pattern units may come into contact with each other during this process. Thus, the third insulating portion 651-3 may be disposed on the connection pattern unit 652-3 and maintain a distance from the connection pattern unit 652-3. That is, the third insulating portion 651-3 may be formed to solve a short problem that may occur when a plurality of connection pattern units 652-3 come into contact with each other during a shift process of the image sensor module 400.

[0230] For this, the third insulating portion 651-3 may be commonly disposed on a plurality of different connection pattern units 652-3. Preferably, the third insulating portion 651-3 may be disposed on a bent portion of a plurality of different connection pattern units 652-3. That is, the bent portion of the connection pattern unit 652-3 may have low rigidity, and thus the third insulating portion 651-3 may improve the rigidity of the bent portion and solve the short problem.

[0231] <Image sensor module> FIG. 15 is an exploded perspective view of an image sensor module 400 according to an embodiment.

[0232] Referring to FIG. 15, the image sensor module 400 may include a filter 440, a sensor base 410, an image sensor 430, and an image sensor substrate 420.

[0233] The image sensor module 400 includes a sensor base 410 .

[0234] The sensor base 410 includes an opening 411, and may be provided with a step adjacent to the opening 411 on which the filter 440 can be seated. An adhesive member (not shown) may be disposed on the step, and the filter 440 may be fixedly disposed on the adhesive member. The filter 440 may serve to block light of a specific frequency band from passing through the lens module 100 from entering the image sensor 430. The filter 440 may be disposed parallel to the xy plane. The filter 440 may be disposed between the lens module 100 and the image sensor 430. The filter 440 may include an infrared filter. The infrared filter may absorb or reflect infrared light entering the infrared filter.

[0235] The image sensor substrate 420 may be a package substrate. That is, the image sensor 430 may be mounted in a package form on the image sensor substrate 420. The image sensor substrate 420 may include a printed circuit board (PCB). The image sensor substrate 420 may include a circuit board. The image sensor 430 may be disposed on the image sensor substrate 420. The image sensor substrate 420 may be coupled to the second substrate 641. To this end, the seventh terminal portion 421 electrically connected to the fourth terminal portion 641-7 of the second substrate 641 may be provided on the lower surface of the image sensor substrate 420. In this case, the seventh terminal portion 421 may also be disposed in the opposite end regions on the lower surface of the image sensor substrate 420 as described above, thereby separating the pads to which the image signal is transmitted from the other pads. Meanwhile, the image sensor substrate 420 may be positioned within the opening of the second substrate 641, and the seventh terminal portion 421 may be horizontally aligned with the fourth terminal portion 641-7 of the second substrate 641 within the opening of the second substrate 641. The fourth terminal portion 641-7 and the seventh terminal portion 421 may be coupled to each other through soldering, etc. In this case, an adhesive member for soldering is omitted in the drawing, and the seventh terminal portion 421 and the fourth terminal portion 641-7 may be spaced apart from each other before the soldering process, and the seventh terminal portion 421 and the fourth terminal portion 641-7 may be electrically coupled to each other through the soldering process.

[0236] The image sensor 430 may be configured to form an image by receiving light passing through the lens module 100 and the filter 440. The image sensor 430 may be mounted on the image sensor substrate 420. The image sensor 430 may be electrically connected to the image sensor substrate 420. For example, the image sensor 430 may be coupled to the image sensor substrate 420 by a surface mounting technology (SMT). For another example, the image sensor 430 may be coupled to the image sensor substrate 420 by a flip chip technology. The image sensor 430 may be disposed such that its optical axis coincides with that of the lens module 100. That is, the optical axis of the image sensor 430 may be aligned with the optical axis of the lens module 100. The image sensor 430 may convert light irradiated to an effective image area of ​​the image sensor 430 into an electrical signal. The converted electrical signal may be an image signal. The image sensor 430 may be any one of a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, and a CID.

[0237] <Image sensor module shift drive operation> The shift operation of the image sensor module 400 will be described below.

[0238] FIG. 16a is a diagram explaining the shift drive in the x-axis direction through a partial configuration of the camera device of this embodiment, FIG. 16b is a diagram explaining the shift drive in the y-axis direction through a partial configuration of the camera device of this embodiment, FIG. 16c is a diagram explaining the rotation drive around the z-axis through a partial configuration of the camera device of this embodiment, and FIG. 17 is a diagram showing the magnetic flow and Lorentz force between the magnet and coil of the camera device of this embodiment.

[0239] 16a, in this embodiment, when currents in the same direction are applied to the second coil 641-2b and the fourth coil 623-2d, the image sensor 430 coupled to the image sensor module 400 may be moved (shifted) in the x-axis direction through electromagnetic interaction between the second magnet 623-2 and the fourth magnet 623-4, respectively. That is, the second coil 641-2b and the second magnet 623-2 and the fourth coil 623-2d and the fourth magnet 623-4 may be used to shift the image sensor 430 in the x-axis direction. In this case, the second coil 641-2b and the second magnet 623-2 may be a first x-axis shift driver X1, and the fourth coil 623-2d and the fourth magnet 623-4 may be a second x-axis shift driver X2.

[0240] 16b, in this embodiment, when currents in the same direction are applied to the first coil 641-2a and the third coil 641-2c, the image sensor 430 coupled to the image sensor module 400 may be moved (shifted) in the y-axis direction through electromagnetic interaction with the first magnet 623-1 and the third magnet 623-3, respectively. That is, the first coil 641-2a and the first magnet 623-1 and the third coil 641-2c and the third magnet 623-3 may be used to shift the image sensor 430 in the y-axis direction. In this case, the first coil 641-2a and the first magnet 623-1 may be a first y-axis shift driver Y1, and the third coil 641-2c and the third magnet 623-3 may be a second y-axis shift driver Y2.

[0241] As shown in Fig. 16c, in this embodiment, when currents in opposite directions are applied to the first coil 641-2a and the third coil 641-2c, and currents in opposite directions are applied to the second coil 641-2b and the fourth coil 641-2d, and when the currents applied to the first coil 641-2a and the second coil 641-2b rotate in the same direction, the image sensor 430 coupled to the image sensor module 400 may rotate (roll) around the z-axis. The embodiment shown in Fig. 16c illustrates a case where the coil unit 641-2 is controlled to four channels, and when the coil unit 641-2 is controlled to three channels, the image sensor 430 may be rolled via the first coil 641-2a and the third coil 641-2c or the second coil 641-2b and the fourth coil 641-2d. This is because if any of the first coil 641-2a and the third coil 641-2c, and the second coil 641-2b and the fourth coil 641-2d are bundled together in one channel, a current cannot be applied in the opposite direction.

[0242] In this embodiment, the magnetic flow of the magnet section 623 is as shown in Fig. 17. Referring to Fig. 17, it can be seen that there are magnetic lines of force passing perpendicularly to the coil section 641-2, and when a current is applied to the coil section 641-2 in this state, the coil section 641-2 can move relative to the magnet section 623 due to the Lorentz force.

[0243] <Shift reliability evaluation> FIG. 18(a) is a diagram showing the reliability evaluation results of the camera module according to the comparative example, and FIG. 18(b) is a diagram showing the reliability evaluation results of the camera module according to the example.

[0244] In the embodiment, the coil moving substrate 640 connected to the first lead pattern portion 652-1 arranged on the first insulating portion 651-1 of the fourth substrate 650 and the image sensor module 400 coupled to the coil moving substrate 640 are shifted by an elastic force provided through the connecting pattern portion 652-3 of the fourth substrate 650.

[0245] At this time, the connection pattern unit 652-3 is disposed in a direction parallel to the optical axis direction to allow the image sensor module 400 to be shifted.

[0246] Here, when the image sensor module 400 is shifted only by the connection pattern unit 652-3, the connection pattern unit 652-3 may be tilted in the optical axis direction during the shifting of the image sensor module 400.

[0247] That is, it was confirmed that the image sensor module 400 tilts in the optical axis direction during the process of shifting the image sensor module 400 in the x-axis direction as shown in (a) of Fig. 18. That is, it was confirmed that one side of the coil moving substrate 640 on which the image sensor module 400 is disposed moves in an upward direction with a first tilt (tilt1), and the other side of the coil moving substrate 640 moves in a downward direction with a second tilt (tilt2). The first and second tilts (tilt1 and 2) may affect the reliability of the shift operation of the image sensor module 400.

[0248] Meanwhile, as shown in Fig. 18(b), in this embodiment, a connecting wire is included, one end of which is connected to a damping plate included in a holder part, and the other end of which is connected to the coil moving substrate 640. The connecting wire is arranged in the optical axis direction within the camera device. Thus, the connecting wire prevents the coil moving substrate 640 from tilting upward or downward during a shift operation of the coil moving substrate 640. That is, the connecting wire supports the coil moving substrate 640 and prevents the coil moving substrate 640 from sagging during a shift operation.

[0249] Meanwhile, the camera device according to the above embodiment may be installed in an optical device. Here, the optical device may be any one of a cell phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a notebook computer, a digital broadcasting terminal, a PDA (Personal Digital Assistant), a PMP (Portable Multimedia Player), and a navigation system. However, the type of the optical device is not limited thereto, and any device for taking an image or a photograph may be included in the optical device.

Claims

1. an image sensor substrate including a fixed portion, a movable portion movable relative to the fixed portion, and a connecting portion connecting the fixed portion and the movable portion; a coil moving substrate disposed on the image sensor substrate so as to be movable together with the moving portion of the image sensor substrate; A coil portion disposed on the coil movement substrate; Including, the coil unit includes a plurality of coils disposed at a plurality of first corner portions of the coil movement substrate, the connecting portion includes a plurality of bent portions that overlap with each of the plurality of coils in the optical axis direction and are bent in a first horizontal direction perpendicular to the optical axis direction and in a second horizontal direction perpendicular to the optical axis direction and the first horizontal direction, The image sensor substrate includes: an insulating layer including a first insulating portion corresponding to the moving portion and a second insulating portion disposed to surround the outside of the first insulating portion; a metal pattern portion disposed on the insulating layer; the second insulating portion includes a first side region and a second side region opposed to each other in the first horizontal direction, and a third side region and a fourth side region opposed to each other in the second horizontal direction, The first side region is provided with a first protrusion protruding in a direction away from the second side region, The second side region is provided with a second protruding portion protruding in a direction away from the first side region, The metal pattern portion is disposed on at least one of the first protrusion portion and the second protrusion portion.

2. The sensor driving device according to claim 1 , further comprising an image sensor disposed on the moving part of the image sensor substrate, the image sensor moving together with the moving part and the coil moving substrate.

3. The first insulating portion includes a first open area overlapping the image sensor in an optical axis direction, a second open area is provided between the first insulating portion and the second insulating portion, The sensor driving device according to claim 2 , wherein the coil moving substrate includes a third open area overlapping the first open area and the image sensor in an optical axis direction.

4. The coil movement substrate includes: a first substrate portion on which the coil portion is disposed; The sensor driving device according to claim 1 , further comprising: a second substrate portion disposed between the first substrate portion and the image sensor substrate, the second substrate portion separating the first substrate portion from the image sensor substrate in an optical axis direction.

5. The coil moving substrate further includes a driving element disposed on the coil moving substrate and spaced apart from the coil unit in a horizontal direction, The sensor driving device according to claim 2 , wherein the driving element tilts, rotates or moves the image sensor.

6. The sensor driving device according to claim 5 , wherein the driving element does not overlap with the plurality of bent portions of the connecting portion in the optical axis direction.

7. The coil movement substrate includes four corner portions, The coil portion includes four coils arranged at the four corner portions, 2. The sensor driving device according to claim 1, wherein the connecting portion includes first to fourth groups of a plurality of bent portions that overlap the four coils in the optical axis direction.

8. The four coils include a first coil and a third coil arranged opposite each other in a first diagonal direction; second and fourth coils arranged opposite to each other in a second diagonal direction different from the first diagonal direction, The sensor driving device of claim 7 , wherein a direction in which each of the first and third coils extends is different from a direction in which each of the second and fourth coils extends.

9. The first and third coils extend in parallel to each other. The sensor driving device according to claim 8 , wherein the second and fourth coils extend in parallel to each other.

10. The sensor driving device according to claim 1 , wherein the connecting portion electrically connects the fixed portion and the moving portion while elastically supporting the moving portion with respect to the fixed portion.

11. The metal pattern portion includes a circuit pattern portion including a first lead pattern portion corresponding to the moving portion and disposed on the first insulating portion, a second lead pattern portion corresponding to the fixed portion and disposed on the second insulating portion, and a connecting pattern portion corresponding to the connecting portion and connecting between the first lead pattern portion and the second lead pattern portion; The sensor driving device according to claim 10 .

12. The metal pattern portion includes a circuit pattern portion including a first lead pattern portion corresponding to the moving portion and arranged on the first insulating portion, a second lead pattern portion corresponding to the fixed portion and arranged on the second insulating portion, and a connecting pattern portion corresponding to the connecting portion and connecting between the first lead pattern portion and the second lead pattern portion; the second open area includes a plurality of second corner portions overlapping the plurality of first corner portions in an optical axis direction, The sensor driving device according to claim 3 , wherein the connecting pattern portion of the circuit pattern portion includes the plurality of bent portions that are respectively disposed at the plurality of second corner portions and overlap the plurality of coils in the optical axis direction.

13. The metal pattern portion is The sensor driving device of claim 11, further comprising a reinforcement pattern portion including a first reinforcement pattern corresponding to the moving portion and arranged on the first insulating portion, a second reinforcement pattern corresponding to the fixed portion and arranged on the second insulating portion, and a third reinforcement pattern connecting between the first reinforcement pattern and the second reinforcement pattern and corresponding to the connecting portion.

14. The sensor driving device of claim 13 , wherein the reinforcement pattern portion and the circuit pattern portion each include the same metal material.

15. The sensor driving device of claim 13 , wherein the first reinforcement pattern and the connection pattern portion move together with the moving portion of the image sensor substrate and the coil moving substrate.

16. A sensor driving device as described in Claim 13, wherein the reinforcement pattern portion and the circuit pattern portion are electrically isolated from each other.

17. the insulating layer further includes a third insulating portion disposed in the second open region, The sensor driving device according to claim 12 , wherein the third insulating portion includes an overlapping region that overlaps with the connecting pattern portion in the optical axis direction, and a non-overlapping region that does not overlap with the connecting pattern portion in the optical axis direction.

18. The sensor driving device of claim 17 , wherein the third insulating portion connects the plurality of bent portions of the connection pattern portion to each other.

19. A sensor driving device according to any one of claims 1 to 18, a holder portion disposed on the sensor driving device and having a magnet portion disposed at a position facing the coil portion; Including, A camera module, wherein a current is applied to the coils to enable the coil portion to move relative to the magnet portion.

20. The camera module according to claim 19 , wherein the magnet portion includes a plurality of magnets overlapping with the plurality of coils and the plurality of bent portions of the connecting portion in the optical axis direction.

Images