Metal film deposition equipment

Abstract

To provide a film-forming apparatus for a metal coating that can suppress the infiltration of exudate between a screen mask and a substrate during film formation.SOLUTION: A mask structure 60 includes a screen mask 62 with through-holes 68 in a specified pattern P. The screen mask 62 has a mesh part 64 with grid-like openings 64c, and a mask part 65 secured to the mesh part 64 on the substrate B side, featuring through-holes 68. The mask part 65 comprises a core section 65a that maintains the shape of the mask part 65, and a sealing section 65b made of a softer elastic material than the core section 65a that is in contact with the substrate B.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a film forming apparatus for forming a metal film in a predetermined pattern on the surface of a substrate. [Background technology]

[0002] Conventionally, there have been proposed film formation devices that deposit a metal on the surface of a substrate to form a metal coating (for example, Patent Document 1). In Patent Document 1, the film formation device includes a container that contains a plating solution. An opening is formed in the container, and the opening is sealed with an electrolyte membrane. The film formation device further includes a pressing mechanism that presses the electrolyte membrane against the substrate by the hydraulic pressure of the plating solution.

[0003] Here, when a metallic underlayer of a predetermined pattern is formed on the surface of the substrate, a voltage is applied between the anode and the substrate while pressing the substrate with the liquid pressure of the electrolyte membrane. This allows a metal coating of a predetermined pattern to be formed on the underlayer. However, when a underlayer of a predetermined pattern is not formed on the substrate, it is also possible to use a masking material such as that shown in Patent Document 2. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-125087 A [Patent Document 2] JP 2016-108586 A Summary of the Invention [Problem to be solved by the invention]

[0005] When a film is formed using a mask structure having a screen mask as a masking material, the mask structure is sandwiched between a substrate and an electrolyte membrane. In this state, the mask structure is pressed by the electrolyte membrane acting on with the hydraulic pressure of the plating solution to ensure adhesion between the substrate and the screen mask. However, if the screen mask is not sufficiently in contact with the substrate, it may not be possible to form a metal film having a desired pattern.

[0006] Specifically, the screen mask has through-holes formed according to a predetermined pattern. During film formation, the through-holes are filled with liquid plating solution (exudation solution) that has seeped out from the electrolyte membrane, and the exudation solution is pressurized by the pressure of the electrolyte membrane. This can cause the exudation solution to get between the screen mask and the substrate, making it difficult to form a metal film in the desired pattern.

[0007] The present invention has been made in consideration of these points, and aims to provide a metal coating deposition apparatus that can prevent seepage liquid from entering between the screen mask and the substrate during deposition. [Means for solving the problem]

[0008] In view of the above problems, the present invention provides a metal coating deposition apparatus that deposits a metal coating of a predetermined pattern on a substrate by electrolytic plating with a mask structure sandwiched between an electrolyte membrane and the substrate. The deposition apparatus includes a pressing mechanism that presses the mask structure with the electrolyte membrane by hydraulic pressure of a plating solution. The mask structure includes a screen mask in which through-portions of the predetermined pattern are formed. The screen mask includes a mesh portion in which openings are formed in a lattice pattern, and a mask portion that is fixed to the mesh portion on the substrate side and in which the through-portions are formed. The mask portion includes a core portion that maintains the shape of the mask portion, and a seal portion that is made of an elastic material softer than the core portion and that comes into contact with the substrate.

[0009] According to the present invention, first, the mask structure is sandwiched between the electrolyte membrane and the substrate, and the electrolyte membrane to which the liquid pressure of the plating solution is applied is pressed against the mask structure by the pressing mechanism. This pressing brings the seal portion of the mask into contact with the surface of the substrate in an elastically deformed state. As a result, the screen mask can be tightly attached to the substrate.

[0010] Meanwhile, the pressure of the electrolyte membrane causes the seepage liquid (plating liquid) that seeps out from the electrolyte membrane swollen with the plating liquid to fill the penetration portion of the screen mask. The pressure of the electrolyte membrane presses the filled seepage liquid. As described above, the seal portion of the mask portion is in an elastically deformed state and contacts the surface of the substrate. Furthermore, the core portion is fixed to the mesh portion and has a higher rigidity than the mask portion. Therefore, even if the electrolyte membrane is pressed, the shape of the penetration portion can be maintained. Since the penetration portion has a shape according to a predetermined pattern, a metal coating of a predetermined pattern can be formed on the surface of the substrate by electrolytic plating.

[0011] For example, the sealing portion may extend along a side wall surface that defines the penetrating portion.

[0012] According to this example, since the seal portion extends along the side wall surface forming the through-hole portion, the core portion is covered with the seal portion. Therefore, it is possible to prevent the core portion from coming into contact with the seepage liquid filled in the through-hole portion during film formation. As a result, it is possible to prevent deterioration and damage of the core portion and maintain the rigidity of the mask portion.

[0013] For example, it is preferable that the core portion has an opposing surface facing the base material and a side wall surface forming the penetrating portion, and the sealing portion is formed along a ridge formed by the opposing surface and the side wall surface.

[0014] According to this example, since the seal portion is formed along the ridge line of the core portion, the compressive deformation of the seal portion can be improved by the pressure of the electrolyte membrane, and as a result, a metal coating having a more accurate pattern can be formed.

[0015] For example, it is preferable that the hardness of the mask portion gradually increases from the seal portion to the core portion.

[0016] When the mask structure is used repeatedly, the seal portion is repeatedly elastically deformed. This makes it easy for the seal portion and the core portion to separate at their interface. However, according to this example, the hardness difference between the seal portion and the core portion is prevented from becoming locally large. As a result, separation between the core portion and the seal portion can be prevented. Effect of the Invention

[0017] According to the present invention, it is possible to prevent seepage liquid from entering between the screen mask and the substrate during film formation. [Brief description of the drawings]

[0018] [Figure 1] 1 is a schematic cross-sectional view showing an example of a metal film forming apparatus according to an embodiment of the present invention. [Diagram 2] 2 is a schematic perspective view of a mask structure of the film forming apparatus shown in FIG. 1 and a schematic perspective view of a substrate on which a metal film has been formed. FIG. [Figure 3A] 3 is a partially enlarged cross-sectional view taken along line AA shown in FIG. 2. [Figure 3B] FIG. 3B is an enlarged cross-sectional view of part C in FIG. 3A. [Figure 4] 2 is a schematic cross-sectional view for explaining film formation by the film formation apparatus shown in FIG. 1. [Diagram 5] FIG. 5 is a cross-sectional view of a main part of FIG. [Figure 6] 4 is a flowchart illustrating an example of a method for forming a metal film using the film forming apparatus according to an embodiment of the present invention. [Figure 7A] 10 is a partial cross-sectional view of a mask structure of a film forming apparatus according to a first modified example. [Figure 7B] 11 is a partial cross-sectional view of a mask structure of a film forming apparatus according to a second modified example. FIG. [Figure 7C] 11 is a partial cross-sectional view of a mask structure of a film forming apparatus according to a third modified example. FIG. [Figure 7D] 13 is a partial cross-sectional view of a mask structure of a film forming apparatus according to a fourth modified example. FIG. [Figure 8A] 7C is a schematic diagram for explaining a method of manufacturing a mask portion of the mask structure of FIG. 7B. [Figure 8B] 7D is a schematic diagram for explaining a method of manufacturing a mask portion of the mask structure of FIG. 7C. [Figure 8C] 7D is a schematic diagram for explaining a method of manufacturing a mask portion of the mask structure of FIG. 7D. [Figure 9A] 13 is a partial cross-sectional view of a mask structure of a film forming apparatus according to a fifth modified example. FIG. [Figure 9B] 13 is a partial cross-sectional view of a mask structure of a film forming apparatus according to a sixth modified example. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] First, a description will be given of a metal coating deposition apparatus 1 according to an embodiment of the present invention. Fig. 1 is a schematic cross-sectional view showing an example of a metal coating deposition apparatus according to an embodiment of the present invention.

[0020] 1, the film formation apparatus 1 is a film formation apparatus that forms a metal coating F of a predetermined pattern P on a substrate B by electrolytic plating in a state in which a mask structure 60 is sandwiched between an electrolyte membrane 13 and the substrate B. Specifically, the film formation apparatus 1 includes an anode 11, an electrolyte membrane 13, and a power source 14 that applies a voltage between the anode 11 and the substrate B.

[0021] The film formation apparatus 1 includes a container 15 that contains an anode 11 and a plating solution L, a mounting table 40 for mounting a substrate B, and a mask structure 60. During film formation, the mask structure 60 is mounted on the mounting table 40 together with the substrate B. The electrolyte membrane 13 is disposed between the mask structure 60 and the anode 11.

[0022] The film forming apparatus 1 includes a linear actuator 70 that raises and lowers the container 15. In this embodiment, for convenience of explanation, it is assumed that the electrolyte membrane 13 is disposed below the anode 11, and the mask structure 60 and the substrate B are disposed further below that. However, as long as a metal film can be formed on the surface of the substrate B, the positional relationship is not limited to this.

[0023] The substrate B functions as a cathode. The material of the substrate B is not particularly limited as long as it functions as a cathode (i.e., a surface having electrical conductivity). The substrate B may be made of a metal material such as aluminum or copper. When forming a wiring pattern from the metal coating F, the substrate B is a substrate in which a base layer such as copper is formed on the surface of an insulating substrate such as a resin. In this case, after the metal coating F is formed, the base layer other than the portion on which the metal coating F is formed is removed by etching or the like. This allows a wiring pattern made of the metal coating F to be formed on the surface of the insulating substrate.

[0024] The anode 11 is, for example, a non-porous (e.g., non-porous) anode made of the same metal as the metal of the metal coating. The anode 11 has a block or plate shape. Examples of the material of the anode 11 include copper. The anode 11 dissolves when a voltage is applied from the power source 14. However, when forming a film using only metal ions of the plating solution L, the anode 11 is an anode that is insoluble in the plating solution L. The anode 11 is electrically connected to the positive electrode of the power source 14. The negative electrode of the power source 14 is electrically connected to the substrate B via the mounting table 40.

[0025] The plating solution L is a solution containing the metal of the metal film to be formed in an ion state. Examples of the metal include copper, nickel, gold, silver, and iron. The plating solution L is a solution in which these metals are dissolved (ionized) with an acid such as nitric acid, phosphoric acid, succinic acid, sulfuric acid, or pyrophosphoric acid. Examples of the solvent of the solution include water and alcohol. For example, when the metal is copper, the plating solution L can be an aqueous solution containing copper sulfate, copper pyrophosphate, or the like.

[0026] The electrolyte membrane 13 is a membrane that can be impregnated (contained) with metal ions together with the plating solution L by contacting the electrolyte membrane 13 with the plating solution L. The electrolyte membrane 13 is a flexible membrane. The material of the electrolyte membrane 13 is not particularly limited as long as the metal ions of the plating solution L can migrate to the substrate B side when a voltage is applied from the power source 14. Examples of the material of the electrolyte membrane 13 include resins having an ion exchange function, such as fluororesins such as Nafion (registered trademark) manufactured by DuPont. The thickness of the electrolyte membrane is preferably in the range of 20 μm to 200 μm. More preferably, the thickness is in the range of 20 μm to 60 μm.

[0027] The container 15 is made of a material insoluble in the plating solution L. The container 15 has a container space 15a for accommodating the plating solution. The anode 11 is disposed in the container space 15a of the container 15. An opening 15d is formed on the substrate B side of the container space 15a. The opening 15d of the container 15 is covered with the electrolyte membrane 13. Specifically, the periphery of the electrolyte membrane 13 is sandwiched between the container 15 and the frame 17. This allows the plating solution L in the container space 15a to be sealed by the electrolyte membrane 13.

[0028] 1 and 4, the linear actuator 70 raises and lowers the container 15 so that the electrolyte membrane 13 and the mask structure 60 can be brought into contact with and separated from each other. In this embodiment, the mounting table 40 is fixed, and the container 15 is raised and lowered by the linear actuator 70. The linear actuator 70 is an electric actuator, and converts the rotational motion of a motor into linear motion by a ball screw or the like (not shown). However, instead of the electric actuator, a hydraulic or pneumatic actuator may be used.

[0029] The container 15 is formed with a supply flow path 15b for supplying the plating solution L to the container space 15a. Furthermore, the container 15 is formed with a discharge flow path 15c for discharging the plating solution L from the container space 15a. The supply flow path 15b and the discharge flow path 15c are holes communicating with the container space 15a. The supply flow path 15b and the discharge flow path 15c are formed on either side of the container space 15a. The supply flow path 15b is connected to a liquid supply pipe 50. The discharge flow path 15c is fluidly connected to a liquid discharge pipe 52.

[0030] The film forming apparatus 1 further includes a liquid tank 90, a liquid supply pipe 50, a liquid discharge pipe 52, and a pump 80. As shown in FIG. 1, the liquid tank 90 contains a plating liquid L. The liquid supply pipe 50 connects the liquid tank 90 and the accommodation body 15. The liquid supply pipe 50 is provided with a pump 80. The pump 80 supplies the plating liquid L from the liquid tank 90 to the accommodation body 15. The liquid discharge pipe 52 connects the liquid tank 90 and the accommodation body 15. The liquid discharge pipe 52 is provided with a pressure adjustment valve 54. The pressure adjustment valve 54 adjusts the pressure (liquid pressure) of the plating liquid L in the accommodation space 15a to a predetermined pressure.

[0031] In this embodiment, the plating solution L is sucked from the liquid tank 90 into the liquid supply pipe 50 by driving the pump 80. The sucked plating solution L is pressure-fed from the supply flow path 15b to the accommodation space 15a. The plating solution L in the accommodation space 15a is returned to the liquid tank 90 via the discharge flow path 15c. In this manner, the plating solution L circulates within the film forming apparatus 1.

[0032] Furthermore, by continuing to drive the pump 80, the liquid pressure of the plating solution L in the accommodation space 15a can be maintained at a predetermined pressure by the pressure regulating valve 54. The pump 80 presses the mask structure 60 with the electrolyte membrane 13 acting on the liquid pressure of the plating solution L. Therefore, the pump 80 corresponds to the "pressing mechanism" of the present invention. However, the pressing mechanism is not particularly limited as long as it is capable of pressing the mask structure 60 with the electrolyte membrane 13. Instead of the pump 80, an injection mechanism composed of a piston and a cylinder that injects the plating solution may be used.

[0033] The mounting table 40 is formed of a conductive material (e.g., metal), for example. A first recess 41 and a second recess 42 are formed in the mounting table 40. The first recess 41 is a recess that accommodates the substrate B. The second recess is a recess that accommodates the mask structure 60 in a state in which the substrate B is accommodated in the first recess 41.

[0034] Fig. 2 is a schematic perspective view of the mask structure 60 of the film forming apparatus 1 shown in Fig. 1, and a schematic perspective view of the substrate B on which a metal film F is formed. Fig. 3A is a partially enlarged cross-sectional view taken along the line AA shown in Fig. 2, and Fig. 3B is an enlarged cross-sectional view of a portion C in Fig. 3A.

[0035] The mask structure 60 includes a frame body 61 and a screen mask 62. The screen mask 62 has through-holes 68 formed therein according to a predetermined pattern P of the metal coating F. The screen mask 62 includes a mesh portion 64 and a mask portion 65.

[0036] The frame body 61 supports the periphery 62a of the screen mask 62 on the substrate B side (the mounting table 40 side) relative to the frame body 61. Specifically, the periphery 62a of the screen mask 62 is fixed to the frame body 61. In this embodiment, the screen mask 62 has a rectangular outer shape. Therefore, the frame body 61 has a rectangular frame-like shape. The material of the frame body 61 is not particularly limited as long as it can maintain the shape of the mask structure 60. For example, the material of the frame body 61 can be a metal material such as stainless steel, or a resin material such as thermoplastic resin. The frame body 61 is formed, for example, by punching a metal plate, and has a thickness of about 1 mm to 3 mm. Note that in FIG. 3A and the like, the thickness of the frame body 61 is drawn thicker than the actual thickness for convenience of explanation.

[0037] The mesh portion 64 has a plurality of openings 64c, 64c, ... formed in a lattice pattern. Specifically, as shown in FIG. 3B, the mesh portion 64 is a mesh-like portion in which a plurality of oriented wires 64a, 64b are woven to intersect. The plurality of wires 64a, 64a are arranged at intervals, and the plurality of wires 64b, 64b intersecting the plurality of wires 64a, 64a are arranged at intervals. As a result, a plurality of openings 64c, 64c, ... are formed in a lattice pattern in the mesh portion 64. The material of the wires 64a, 64b is not particularly limited as long as it has corrosion resistance to the plating solution L. Examples of the material of the wires 64a, 64b include metal materials such as stainless steel and resin materials such as polyester.

[0038] The mask portion 65 is fixed to the mesh portion 64 on the substrate B side of the mesh portion 64. The mask portion 65 has through portions 68 formed according to a predetermined pattern P. The mask portion 65 is a portion that comes into close contact with the substrate B during membrane formation due to pressure from the electrolyte membrane 13. The mask portion 65 has a core portion 65a that maintains the shape of the mask portion 65, and a seal portion 65b that is made of an elastic material softer than that of the core portion and comes into contact with the substrate B.

[0039] As shown in Fig. 3B, the core portion 65a is fixed to the mesh portion 64. A seal portion 65b is formed on the surface of the core portion 65a that faces the base material B (opposing surface 65c). The seal portion 65b is formed on the entire opposing surface 65c of the core portion 65a. The thickness of the seal portion 65b is thinner than the thickness of the core portion 65a. The thickness of the seal portion 65b is preferably in the range of about 1 / 5 to 1 / 10 of the thickness of the core portion 65a.

[0040] The core portion 65a may be made of a resin material such as acrylic resin, vinyl acetate resin, polyvinyl resin, polyimide resin, or polyester resin. The core portion 65a having the predetermined pattern P can be manufactured by a general silk screen manufacturing technique using an emulsion. Therefore, a detailed description of the manufacturing method of the screen mask 62 will be omitted.

[0041] Alternatively, the material of the core portion 65a may be a metal material such as stainless steel. In this case, the core portion 65a can be formed by attaching a metal sheet in which the through portions 68 are formed to the mesh portion 64. Furthermore, the core portion 65a may have a laminated structure in which a resin layer and a metal layer are laminated.

[0042] The material of the seal portion 65b is an elastic material that is softer than the material of the core portion 65a. Specifically, the material of the seal portion 65b may be a rubber material such as silicone rubber (PMDS) or ethylene propylene diene rubber (EPDM). However, the material of the seal portion 65b is not particularly limited as long as it is elastically deformed when the electrolyte membrane 13 is pressed.

[0043] Therefore, for example, the core portion 65a and the seal portion 65b may be made of a thermosetting resin or a rubber material. For example, the hardness of the seal portion 65b and the core portion 65a may be adjusted by changing the type or the ratio of the hardener of these materials. In addition, the hardness may be adjusted by setting the temperature conditions, etc., for the crosslinking reaction or polymerization reaction during the manufacturing of the screen mask.

[0044] The hardness of the core portion 65a is preferably HS150 or more, more preferably HS200 or more, in Shore A hardness. On the other hand, the hardness of the seal portion 65b is preferably HS90 or less, more preferably HS50 or less, in Shore A hardness. When the core portion 65a and the seal portion 65b are made of a rubber material, the relationship between their hardness can be determined using a commercially available standard rubber hardness tester.

[0045] A film forming method using the film forming apparatus 1 will be described with reference to Fig. 4 to Fig. 6. First, a placement step S1 is performed as shown in Fig. 6. In this step, the substrate B and the mask structure 60 are placed on the mounting table 40. Specifically, the substrate B is accommodated in the first recess 41 of the mounting table 40, and then the mask structure 60 is accommodated in the second recess 42. At this time, the alignment of the substrate B with respect to the anode 11 attached to the housing 15 is adjusted, and the temperature of the substrate B may be adjusted.

[0046] Next, a pressing step S2 is performed. In this step, first, the linear actuator 70 is driven to lower the housing body 15 toward the mask structure 60 from the state shown in FIG. 1 to the state shown in FIG. 4. Next, the pump 80 is driven. As a result, the plating solution L is supplied to the housing space 15a of the housing body 15. Since the pressure control valve 54 is provided in the liquid discharge pipe 52, the liquid pressure of the plating solution L in the housing space 15a is maintained at a predetermined pressure. As a result, as shown in FIG. 4, the electrolyte membrane 13 is deformed toward the internal space 69 of the frame body 61 by the liquid pressure, and the mask structure 60 can be sandwiched between the electrolyte membrane 13 and the substrate B. Furthermore, the electrolyte membrane 13 acting on the liquid pressure of the plating solution L can press the mask structure 60. This pressing causes the seal portion 65b of the mask portion 65 to contact the surface of the substrate B in an elastically deformed state. As a result, the screen mask 62 can be closely attached to the substrate B.

[0047] Meanwhile, the electrolyte membrane 13 is pressed, and the seepage liquid (plating liquid) La seeping out from the electrolyte membrane 13 swollen with the plating liquid L fills the through-holes 68 of the screen mask 62. The electrolyte membrane 13 is pressed, and the filled seepage liquid La is pressurized. As described above, the seal portion 65b of the mask portion 65 is in contact with the surface of the base material B in an elastically deformed state. Furthermore, the core portion 65a is fixed to the mesh portion 64 and has a higher rigidity than the mask portion 65. Therefore, the shape of the through-holes 68 can be maintained regardless of the pressure of the electrolyte membrane 13. Since the through-holes 68 have a shape according to the predetermined pattern P, a metal film F of the predetermined pattern can be formed on the surface of the base material B by electrolytic plating.

[0048] Next, the film forming step S3 is performed. In this step, the pressing state by the electrolyte membrane 13 in the pressing step S2 is maintained, and a metal film F is formed. Specifically, a voltage is applied between the anode 11 and the substrate B. As a result, the metal ions contained inside the electrolyte membrane 13 move to the surface of the substrate B via the oozing liquid La, and the metal ions are reduced on the surface of the substrate B. Since the oozing liquid La filled in the through portion 68 is sealed inside the through portion 68 by the electrolyte membrane 13, a metal film F of a predetermined pattern can be formed on the surface of the substrate B (see FIG. 2). Furthermore, since the oozing liquid La is uniformly pressurized by the pressing of the electrolyte membrane 13, a homogeneous metal film F can be formed. When manufacturing wiring using the metal film F, it is only necessary to etch the conductive underlayer formed on the surface of the insulating substrate B.

[0049] <Modification> 7A to 7D are partial cross-sectional views of mask structures of film forming apparatuses according to Modifications 1 to 4. These modifications differ from the embodiment shown in Fig. 3A in the form of the mask portion. Therefore, only the differences from the above-described embodiment will be described, and detailed descriptions of similar configurations will be omitted.

[0050] For example, as shown in FIG. 7A, in the first modification, the seal portion 65b may extend along a side wall surface 65e of the core portion 65a forming the through portion 68. This allows the core portion 65a to be covered with the seal portion 65b. Therefore, it is possible to prevent the core portion 65a from contacting the exudation liquid La filled in the through portion 68 during film formation. As a result, it is possible to prevent deterioration and damage of the core portion 65a, and to maintain the rigidity of the mask portion 65. Furthermore, the seal portion 65b can protect the corners including the ridge line 65f of the core portion 65a. For example, the seal portion 65b is formed by immersing the core portion 65a in a material having fluidity to become the seal portion 65b (for example, material 6B in FIG. 8B) and solidifying the material.

[0051] Furthermore, as shown in Fig. 7B to Fig. 7D, in Modifications 2 to 4, the core portion 65a has an opposing surface 65c that faces the base material B and a side wall surface 65e that forms the through portion 68. The seal portion 65b is formed along a ridge line 65f that is formed by the opposing surface 65c and the side wall surface 65e. In these figures, the ridge line 65f extends in a direction perpendicular to the paper surface. Here, the ridge line 65f is an opening edge that forms the through portion 68 by the core portion 65a. This opening edge is the opening edge on the opposite side to the base material B side (mesh portion 64).

[0052] According to these modified examples, the seal portion 65b is partially formed along the ridge line 65f of the core portion 65a. That is, the opposing surface 65c of the core portion 65a is exposed from the seal portion 65b. By pressing the electrolyte membrane 13, the compressive deformability of the seal portion 65b can be improved. As a result, the metal film F can be formed in a more accurate pattern.

[0053] 7B, the seal portion 65b is formed in an edge region along the ridge line 65f of the facing surface 65c of the core portion 65a. The other central region of the facing surface 65c is exposed from the seal portion 65b. By partially providing the seal portion 65b on the facing surface 65c, the compressive deformation property of the seal portion 65b can be improved.

[0054] The sealed portion 65b shown in Fig. 7B can be manufactured as shown in Fig. 8A. A sheet material 6A corresponding to the sealed portion 65b is brought into contact with the opposing surface 65c of the core portion 65a (see the upper diagram of Fig. 8A). In this state, a laser beam G1 is irradiated onto the sheet material 6A toward the edge region along the ridge line 65f of the core portion 65a, and the sheet material 6A is partially fused to the core portion 65a (see the center diagram of Fig. 8B). Thereafter, the sheet material 6A is removed to obtain the sealed portion 65b shown in Fig. 7B (see the lower diagram of Fig. 8C).

[0055] In the third modification shown in FIG. 7C, a recess 65g is formed in an edge region along the ridge 65f of the opposing surface 65c of the core portion 65a. The seal portion 65b enters the recess 65g and protrudes toward the base material B side from the exposed opposing surface 65c. Compared to FIG. 7B, in the third modification, the thickness of the seal portion 65b is increased, so that the compressive deformability of the seal portion 65b can be further improved. In addition, the seal portion 65b enters the recess 65g, so that the seal portion 65b fits into the core portion 65a. This allows the seal portion 65b to be mechanically restrained by the core portion 65a.

[0056] The seal portion 65b shown in FIG. 7C can be manufactured as shown in FIG. 8B. The facing surface 65c of the core portion 65a is brought into contact with the molten rubber or resin material 6B corresponding to the seal portion 65b (see the upper diagram of FIG. 8B). Specifically, the core portion 65a is brought into contact with the material 6B until it enters the recess 65g. Thereafter, the core portion 65a is pulled up from the material 6B, and the material 6B is solidified to form a portion 6C including the seal portion 65b (see the center diagram of FIG. 8B). The resin is removed by irradiating the area of ​​the core portion 65a except for the edge area along the ridge line 65f with the laser light G2. This allows the seal portion 65b shown in FIG. 7C to be obtained (see the lower diagram of FIG. 8C).

[0057] In the fourth modification shown in FIG. 7D, the seal portion 65b is formed in an edge region along the ridge line 65f of the facing surface 65c of the core portion 65a. In the other central region of the facing surface 65c, the facing surface 65c is exposed from the seal portion 65b. Furthermore, the seal portion 65b also extends to the side wall surface 65e of the core portion 65a. By partially providing the seal portion 65b on the facing surface 65c, the compressive deformability of the seal portion 65b can be improved. Furthermore, the seal portion 65b can protect the corners of the core portion 65a, including the ridge line 65f.

[0058] The seal portion 65b shown in FIG. 7D can be manufactured as shown in FIG. 8C. The facing surface 65c of the core portion 65a is brought into contact with the molten rubber or resin material 6B corresponding to the seal portion 65b (see the upper diagram of FIG. 8C). The core portion 65a is then pulled up from the material 6B, and the material 6B is solidified to form a portion 6D including the seal portion 65b (see the center diagram of FIG. 8C). The resin is removed by irradiating the area of ​​the core portion 65a except for the edge area along the ridge line 65f with laser light G2. This allows the seal portion 65b shown in FIG. 7D to be obtained (see the lower diagram of FIG. 8C).

[0059] 9A and 9B are partial cross-sectional views of mask structures of film forming apparatuses according to Modifications 5 and 6. These modifications differ from the embodiment shown in Fig. 3A in the form of the mask portion. Therefore, only the differences from the above-described embodiment will be described, and detailed descriptions of similar configurations will be omitted.

[0060] In the fifth and sixth modified examples, the hardness of the mask portion 65 is gradually increased from the seal portion 65b to the core portion 65a. When the mask structure 60 is used repeatedly, the seal portion 65b is repeatedly elastically deformed. This makes it easy for the seal portion 65b and the core portion 65a to separate at their interface. However, according to these examples, the difference in hardness between the seal portion 65b and the core portion 65a is prevented from becoming locally large. As a result, separation between the core portion 65a and the seal portion 65b can be prevented.

[0061] In the fifth modification shown in FIG. 9A, the seal portion 65b is formed only on the side in contact with the base material B, and the hardness of the mask portion 65 changes gradually along the thickness direction of the mask portion 65. Specifically, the mask portion 65 has a hardness that changes gradually from the seal portion 65b side toward the core portion 65a on the mesh portion 64 side. In the fifth modification, the portion of the mask portion 65 that is compressed and elastically deformed by the pressure of the electrolyte membrane 13 is the seal portion 65b. The other portion is the core portion 65a. The hardness of the mask portion 65 may be changed as follows. Specifically, when the mask portion 65 is produced, a heater is used to apply a temperature gradient in the thickness direction to heat the mask portion 65, thereby changing the degree of crosslinking or polymerization of the resin material or rubber material.

[0062] In the sixth modification shown in FIG. 9B, a seal portion 65b is formed so as to surround the core portion 65a. That is, in the sixth modification, unlike the fifth modification, the seal portion 65b extends to the side wall surface 65e forming the through portion 68. This makes it possible to prevent the core portion 65a from being exposed. The hardness of the mask portion 65 may be changed as follows. Specifically, when the mask portion 65 is produced, the degree of the crosslinking reaction or polymerization reaction of the resin material or rubber material is changed by heating with a temperature gradient applied from the center to the periphery using microwaves. EXAMPLES

[0063] The invention is illustrated by the following examples.

[0064] [Example] A glass epoxy substrate was prepared as a substrate for film formation, in which a glass fiber cloth was layered and impregnated with epoxy resin. Copper foil was formed on the surface of this glass epoxy substrate. Next, a copper film was formed using the film formation apparatus according to the embodiment shown in FIG. 1. The mask structure shown in FIG. 9B was prepared. Specifically, the surface of the mask portion was swelled to adjust the Shore A hardness of the seal portion to HS40. The Shore A hardness of the core portion was HS600. A copper sulfate aqueous solution (Cu-BRITE-SED) manufactured by JCU Corporation was used as the plating solution, and a Cu plate was used as the anode. Nafion (registered trademark) manufactured by DuPont was used as the electrolyte membrane. The film formation conditions were a plating solution temperature of 42°C, a solution pressure of 1 MPa, and a current density of 7 A / dm. 2 The copper film was formed for 500 seconds.

[0065] [Comparative Example 1] A copper film was formed in the same manner as in Example 1. The difference from Example 1 was that a 100 μm-thick polyethylene terephthalate (PET) was used for the mask portion of the mask structure.

[0066] [Comparative Example 2] A copper film was formed in the same manner as in Example 1. The difference from Example 1 was that a 100 μm-thick silicone rubber with a Shore A hardness of HS50 was used for the mask portion of the mask structure.

[0067] After deposition, the shape of the deposited metal film was confirmed in the Example and Comparative Examples 1 and 2. In Comparative Example 1, infiltration of plating solution (seepage solution) between the masked portion and the substrate was confirmed. In the Example and Comparative Example 2, such a phenomenon did not occur. This was because the material of the masked portion in Comparative Example 1 was hard, and the adhesion between the masked portion and the substrate was insufficient.

[0068] On the other hand, a structural analysis was performed by pressing the electrolyte membrane on the mask parts of the Example and Comparative Examples 1 and 2. It was found that the mask part of Comparative Example 2 was significantly deformed, and the cross-sectional area of ​​the penetration part was reduced by about 5% after pressing. Note that there was almost no change before and after pressing in the Example and Comparative Example 1.

[0069] From these results, it can be said that by providing a core portion in the mask portion and providing a sealing portion made of a softer elastic material than the core portion and in contact with the substrate, it is possible to form a metal coating having the desired pattern and cross-sectional shape.

[0070] Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the film forming apparatus according to the above embodiment, and includes all aspects included in the concept of the present invention and the scope of the claims. In addition, each configuration may be appropriately and selectively combined to achieve the above-mentioned problems and effects. For example, the shape, material, arrangement, size, etc. of each component in the above embodiment may be appropriately changed depending on the specific aspect of the present invention. [Explanation of symbols]

[0071] 1: film forming device, 13: electrolyte membrane, 40: mounting table, 41: first recess, 42: second recess, 42b: opening edge, 60: mask structure, 61: frame, 62: screen mask, 64: mesh portion, 65: mask portion, 65a: core portion, 65b: seal portion, 68: through portion, B: substrate, L: plating solution

Claims

1. A film forming apparatus for forming a metal film having a predetermined pattern on a substrate by electrolytic plating in a state in which a mask structure is sandwiched between an electrolyte membrane and a substrate, the film forming apparatus comprising: the film forming apparatus includes a pressing mechanism that presses the mask structure with the electrolyte membrane by a hydraulic pressure of a plating solution, the mask structure includes a screen mask having a through portion of the predetermined pattern formed therein; the screen mask includes a mesh portion having openings formed in a lattice pattern, and a mask portion fixed to the mesh portion on the base material side and having the through-portions formed therein; the mask portion has a core portion that maintains a shape of the mask portion, and a seal portion that is made of an elastic material that is softer than the core portion and that comes into contact with the base material; The sealing portion extends along a side wall surface that defines the through portion.

2. A film forming apparatus for forming a metal film having a predetermined pattern on a substrate by electrolytic plating in a state in which a mask structure is sandwiched between an electrolyte membrane and a substrate, the film forming apparatus comprising: the film forming apparatus includes a pressing mechanism that presses the mask structure with the electrolyte membrane by a hydraulic pressure of a plating solution, the mask structure includes a screen mask having a through portion of the predetermined pattern formed therein; the screen mask includes a mesh portion having openings formed in a lattice pattern, and a mask portion fixed to the mesh portion on the base material side and having the through-portions formed therein; the mask portion has a core portion that maintains a shape of the mask portion, and a seal portion that is made of an elastic material that is softer than the core portion and that comes into contact with the base material; the core portion has an opposing surface facing the base material and a side wall surface forming the penetrating portion, The sealing portion is formed along a ridge line formed by the opposing surface and the side wall surface.

3. A film forming apparatus for forming a metal film having a predetermined pattern on a substrate by electrolytic plating in a state in which a mask structure is sandwiched between an electrolyte membrane and a substrate, the film forming apparatus comprising: the film forming apparatus includes a pressing mechanism that presses the mask structure with the electrolyte membrane by a hydraulic pressure of a plating solution, the mask structure includes a screen mask having a through portion of the predetermined pattern formed therein; the screen mask includes a mesh portion having openings formed in a lattice pattern, and a mask portion fixed to the mesh portion on the base material side and having the through-portions formed therein; the mask portion has a core portion that maintains a shape of the mask portion, and a seal portion that is made of an elastic material that is softer than the core portion and that comes into contact with the base material; The hardness of the mask portion gradually increases from the seal portion to the core portion.

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