Antenna module

Abstract

According to the present invention, a sub-module includes a plurality of electronic components and a first support member. The plurality of electronic components include a plurality of respective internal terminals. The first support member covers and supports the plurality of electronic components such that the plurality of internal terminals are exposed. A first conductive film is provided to at least a portion of the first support member. A second support member supports the sub-module as well as an antenna. A plurality of external terminals that are exposed from the second support member are respectively connected to the plurality of internal terminals.

Description

Background Art

[0001] A technique of mounting a plurality of integrated circuit devices on an interposer and encapsulating them with resin is known (Patent Document 1). Along with the need for miniaturization and low profile of portable mobile communication terminals, miniaturization and low profile of components incorporated in the communication terminals, particularly components including an antenna, are desired.

Prior Art Documents

Patent Documents

[0002]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0003] In a module obtained by mounting a plurality of devices on an interposer and encapsulating them with resin, the thickness of the interposer becomes a bottleneck, and it is difficult to further reduce the profile. Further, when a high - frequency circuit and an antenna are mounted on a common interposer, electromagnetic interference is likely to occur between the high - frequency circuit and the antenna. An object of the present invention is to provide an antenna module capable of achieving low profile and ensuring isolation between a high - frequency circuit and an antenna.

Means for Solving the Problems

[0004] According to one aspect of the present invention, a plurality of electronic components each including a plurality of internal terminals, a first support member that covers and supports the plurality of electronic components so as to expose the plurality of internal terminals, and a first conductive film disposed on at least a part of the first support member comprising a sub - module, at least one antenna, a second support member that supports the sub - module and supports the antenna, A plurality of external terminals that are respectively connected to the plurality of internal terminals and exposed from the second support member An antenna module including the same is provided.

Advantages of the Invention

[0005] Electronic components are connected to the external terminals via the internal terminals, and the external terminals are used as terminals for mounting on a module substrate or the like. Since no substrate is disposed between the electronic components and the external terminals, the antenna module can be made thinner. By functioning as an electromagnetic shielding film, the first conductive film can enhance the isolation between the circuit and the antenna in the sub-module.

Brief Description of the Drawings

[0006]

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Best Mode for Carrying Out the Invention

[0007] [First Embodiment] With reference to the drawings from FIG. 1 to FIG. 3C, the antenna module according to the first embodiment will be described.

[0008] FIG. 1 is a cross-sectional view of the antenna module according to the first embodiment. Note that FIG. 1 does not represent a specific cross-section obtained by cutting the antenna module in a plane, but represents the cross-sectional structures obtained by cutting the antenna module at various locations as one cross-section. Also, elements shown separated into two parts in FIG. 1 may be connected to each other at locations other than the cross-section shown in FIG. 1.

[0009] The antenna module according to the first embodiment includes a sub-module 20 and a plurality of antennas 50. Hereinafter, the configuration of the sub-module 20 will be described. The sub-module 20 includes a plurality of electronic components 30 and a first support member 22 made of resin that covers and supports the plurality of electronic components 30.

[0010] Each of the electronic components 30 has a plurality of internal terminals 31, and the plurality of internal terminals 31 are exposed on one surface of the sub-module 20. The surface on which the plurality of internal terminals 31 are exposed is referred to as the first surface 21A. A substantially flat first surface 21A is formed by one surface of the first support member 22 and the exposed surfaces of the plurality of internal terminals 31. The first support member 22 includes a top surface 21T facing the direction opposite to the first surface 21A, and a side surface 21S connecting the first surface 21A and the top surface 21T.

[0011] The electronic components 30 are, for example, individual components such as semiconductor integrated circuits, surface-mounted inductors, and capacitors. The sub-module 20 has, for example, the function of an RF front end. The RF front end performs, for example, up-conversion from an intermediate frequency signal to a high frequency signal, down-conversion from a high frequency signal to an intermediate frequency signal, amplification of a high frequency signal, and the like.

[0012] The internal terminal 31 includes, for example, two layers of a first electrode 31A made of Cu and a solder 31B. The first electrode 31A is exposed on the first surface 21A of the sub-module 20. The top surface 21T and the side surface 21S of the first support member 22 are covered with a first conductive film 23. The first conductive film 23 functions as an electromagnetic shielding film. The first conductive film 23 may be a full-surface film (solid film) provided over the entire area of a specific range, or a patterned film having an electromagnetic shielding function, for example, a mesh-like film or a stripe-like film. At least one of the plurality of first electrodes 31A exposed on the first surface 21A is exposed on the side surface 21S of the first support member 22 and is electrically connected to the first conductive film 23. The first conductive film 23 is connected to the ground potential via the first electrode 31A exposed on the side surface 21S of the first support member 22.

[0013] Each of the plurality of antennas 50 is composed of an antenna component including a radiating element 51 and an antenna terminal 52. In FIG. 1, the radiating element 51 is represented by a circuit symbol. As the radiating element 51, for example, a radiating element such as a patch antenna or a dipole antenna is used.

[0014] The sub-module 20 and the plurality of antennas 50 are covered and supported by a second support member 40 made of resin. The second support member 40 is in contact with the first surface 21A of the sub-module 20 and has a second surface 41A facing the same direction as the first surface 21A. Each of the plurality of external terminals 42 is exposed on the second surface 41A and is connected to the internal terminal 31 of the electronic component 30 within the second support member 40. The mutually connected internal terminal 31 and external terminal 42 are arranged at the same position in a plan view. The external terminal 42 includes a second electrode 42A exposed on the second surface 41A and a solder 42B connected to the internal terminal 31.

[0015] Each of the plurality of antenna terminals 52 includes a third electrode 52A exposed on the second surface 41A and a solder 52B. The third electrode 52A is connected to the radiating element 51 via the solder 52B. One of the plurality of antenna terminals 52 of the antenna 50 is connected to one of the plurality of external terminals 42 of the sub-module 20 via a first power supply line 46 disposed on the second surface 41A.

[0016] Next, a method for manufacturing the sub-module 20 will be described with reference to the drawings from FIGS. 2A to 2E. The drawings from FIGS. 2A to 2D are cross-sectional views of the sub-module 20 in an intermediate manufacturing stage, and FIG. 2E is a cross-sectional view of the sub-module 20.

[0017] As shown in FIG. 2A, a plurality of electronic components 30 and a temporary substrate 100 are prepared. A printed circuit board can be used as the temporary substrate 100. A plurality of first electrodes 31A are disposed on the surface of the temporary substrate 100, and solder S is placed thereon. At the stage shown in FIG. 2A, the sub-module 20 is not divided into individual pieces, but FIG. 2A shows only the region corresponding to one sub-module 20. The electronic component 30 such as a semiconductor integrated circuit has a plurality of solder balls 31BA for mounting. The electronic component 30 such as a surface-mounted individual component has an electrode 31C for mounting.

[0018] As shown in FIG. 2B, the solder ball 31BA or the electrode 31C of the electronic component 30 is placed on the solder S of the temporary substrate 100 and a reflow process is performed. Thereby, the electronic component 30 is fixed to the temporary substrate 100. By the reflow process, an internal terminal 31 composed of a solder 31B and a first electrode 31A in which the solder ball 31BA (FIG. 2A) and the solder S (FIG. 2A) are integrated is formed. In the electronic component 30 provided with the electrode 31C, the internal terminal 31 is formed by the solder 31B and the first electrode 31A formed by melting and solidifying the solder S.

[0019] As shown in FIG. 2C, a first support member 22 made of a sealing resin is formed by covering a plurality of electronic components 30 with the sealing resin. For forming the first support member 22, for example, a transfer molding method, a compression molding method, or the like can be used. As the first support member 22, for example, an epoxy resin is used.

[0020] As shown in FIG. 2D, a temporary substrate 100 (FIG. 2C) is ground to expose a plurality of first electrodes 31A. The first support member 22 is exposed in a region where the first electrodes 31A are not arranged. Thereby, a flat first surface 21A including the surface of the first support member 22 and the surfaces of the plurality of first electrodes 31A is exposed. After grinding, it is divided into individual sub-modules 20.

[0021] As shown in FIG. 2E, a first conductive film 23 is formed on the top surface 21T and the side surface 21S of the first support member 22. For the first conductive film 23, for example, metals such as Cu, Ag, and Ni are used. The first conductive film 23 may have a laminated structure of a plurality of metals. For forming the first conductive film 23, for example, sputtering can be used. The first conductive film 23 is connected to the first electrodes 31A exposed on the side surface 21S.

[0022] Next, with reference to the drawings from FIG. 3A to FIG. 3C, a method for manufacturing an antenna module according to the first embodiment will be described. FIGS. 3A, 3B, and 3C are cross-sectional views in an intermediate stage of manufacturing the antenna module.

[0023] As shown in FIG. 3A, a temporary substrate 101, a sub-module 20, and a plurality of antennas 50 are prepared. On the surface of the temporary substrate 101, a plurality of second electrodes 42A, third electrodes 52A, and a first feeding line 46 are arranged. The first feeding line 46 is continuous with the second electrodes 42A and the third electrodes 52A. Solder S is placed on the second electrodes 42A and the third electrodes 52A. As the temporary substrate 101, a printed circuit board can be used. A solder ball 42BA is placed on the exposed surface of the internal terminal 31 of the sub-module 20. A solder ball 52BA is placed on the terminal of the antenna 50.

[0024] As shown in FIG. 3B, the sub-module 20 and the antenna 50 are placed on the temporary substrate 101 and reflow processing is performed to fix the sub-module 20 and the antenna 50 to the temporary substrate 101. The external terminal 42 is formed by the solder 42B in which the solder ball 42BA and the solder S are integrated, and the second electrode 42A. The antenna terminal 52 is formed by the solder 52B in which the solder ball 52BA and the solder S are integrated, and the third electrode 52A. The antenna 50 and the sub-module 20 are connected by the first power supply line 46.

[0025] As shown in FIG. 3C, the second support member 40 is formed by encapsulating the sub-module 20 and the antenna 50 with a sealing resin. For the formation of the second support member 40, for example, a transfer molding method, a compression molding method, or the like can be used. As the second support member 40, for example, an epoxy resin is used.

[0026] After forming the second support member 40, the temporary substrate 101 is ground to expose the external terminal 42, the antenna terminal 52, the first power supply line 46, and the second support member 40. A substantially flat second surface 41A is formed by the surfaces of the external terminal 42, the antenna terminal 52, the first power supply line 46, and the second support member 40. Finally, by dividing each antenna module, the antenna module shown in FIG. 1 is completed.

[0027] Next, the excellent effects of the first embodiment will be described. In the first embodiment, a substrate such as an interposer is not disposed in the space between the electronic component 30 (FIG. 1) and the second surface 41A. That is, the electronic component 30 according to the first embodiment can be mounted on a module substrate or the like without passing through an interposer. Therefore, it is possible to reduce the height of the antenna module as compared with a configuration in which a substrate such as an interposer is disposed. In the first embodiment, the second support member 40 is disposed on the top surface 21T of the first support member 22. However, when the sub-module 20 can be supported only by the first surface 21A and the side surface 21S, the second support member 40 may not be disposed on the top surface 21T of the sub-module 20. When this configuration is adopted, it is possible to further reduce the height.

[0028] Since the top surface 21T and the side surface 21S of the first support member 22 of the sub-module 20 are covered with the first conductive film 23 (FIG. 1) that functions as an electromagnetic shielding film, isolation between the high-frequency circuit in the sub-module 20 and the antenna 50 can be ensured. Further, when other high-frequency circuit components are supported by the second support member 40, isolation between the high-frequency circuit in the sub-module 20 and the other high-frequency circuit components can be ensured.

[0029] Also, as an example, when the sub-module 20 is disposed between the two antennas 50 in a plan view, the isolation between the two antennas 50 can be enhanced.

[0030] In the first embodiment, the entire side surface 21S and the entire top surface 21T of the first support member 22 are covered with the first conductive film 23, but only a part of the region may be covered. For example, the first conductive film 23 may be disposed between components to be electromagnetically shielded, in a region where leakage of high-frequency noise is to be suppressed, and the like.

[0031] Since the sub-module 20 and the antenna 50 are connected by the first power supply line 46 disposed on the second surface 41A, the wiring can be completed within the antenna module. When mounting the antenna module on another substrate, for example, a module substrate or the like, the number of wirings to be formed on the other substrate can be reduced. Thereby, the thinning of the module substrate or the like becomes possible.

[0032] Since the plurality of antennas 50 are covered with the second support member 40 made of resin, the broadband of the antenna 50 can be achieved.

[0033] [Second Embodiment] Next, the antenna module according to the second embodiment will be described with reference to FIG. 4. Hereinafter, the description of the configuration common to the antenna module according to the first embodiment described with reference to FIGS. 1 to 3C will be omitted.

[0034] FIG. 4 is a cross-sectional view of the antenna module according to the second embodiment. The second support member 40 has a top surface 41T facing the direction opposite to the second surface 41A and a side surface 41S connecting the second surface 41A and the top surface 41T. In the first embodiment (FIG. 1), no conductive film (particularly, a conductive film having a shielding function) is disposed on the second support member 40. In contrast, in the second embodiment, a second conductive film 43 is disposed on the top surface 41T of the second support member 40. Note that no conductive film is disposed on the side surface 41S. The second conductive film 43 can be formed by sputtering on the top surface of the second support member 40, for example, in a state before the antenna module is divided into individual pieces. For the second conductive film 43, a metal such as Cu, Ag, Ni, or the like is used. When the top surface 41T is viewed in plan, the plurality of antennas 50 are included in the second conductive film 43.

[0035] Next, the excellent effects of the second embodiment will be described. Also in the second embodiment, similar to the first embodiment, it is possible to reduce the height and widen the bandwidth, and to ensure isolation between the high-frequency circuit and the antenna 50 in the sub-module 20. Further, in the second embodiment, since the second conductive film 43 functions as an electromagnetic shielding film, the isolation between the antennas 50 can be further enhanced. Furthermore, the directivity of the antenna 50 can be controlled by the second conductive film 43. For example, the main beam can be directed in the direction facing the side surface 41S where the conductive film is not disposed.

[0036] [Third Embodiment] Next, the antenna module according to the third embodiment will be described with reference to FIG. 5. Hereinafter, the description of the configuration common to the antenna module according to the second embodiment shown in FIG. 4 will be omitted.

[0037] FIG. 5 is a schematic diagram showing the positional relationship in a plan view of a conductor pattern, a sub-module 20, and a plurality of antennas 50 disposed on the second surface 41A of the second support member 40 (FIG. 4) of the antenna module according to the third embodiment. A plurality of antennas 50 are arranged so as to surround the sub-module 20. A plurality of internal terminals 31 of the sub-module 20 are each connected to the antenna 50 via a first feeding line 46. A ground plane 47 is disposed on the second surface 41A so as not to overlap the first feeding line 46. In FIG. 5, the ground plane 47 is hatched. The ground plane 47 is connected to the ground terminal 31G among the plurality of internal terminals 31 of the sub-module 20.

[0038] Next, the excellent effects of the third embodiment will be described. Also in the third embodiment, similar to the first embodiment, it is possible to reduce the height and widen the bandwidth, and to ensure isolation between the high-frequency circuit and the antenna 50 in the sub-module 20. Further, in the third embodiment, in addition to the second conductive film 43 (FIG. 4) disposed on the top surface 41T of the second support member 40, the ground plane 47 disposed on the second surface 41A also functions as an electromagnetic shielding film. Therefore, it becomes possible to control the directivity of the antenna 50 within a narrower range.

[0039] [Fourth Embodiment] Next, the antenna module according to the fourth embodiment will be described with reference to FIG. 6. Hereinafter, the description of the configuration common to the antenna module according to the second embodiment shown in FIG. 4 will be omitted.

[0040] FIG. 6 is a cross-sectional view of the antenna module according to the fourth embodiment. In the second embodiment (FIG. 4), the second conductive film 43 is disposed over the entire top surface 41T of the second support member 40. In contrast, in the fourth embodiment, the second conductive film 43 is disposed in a partial region of the top surface 41T. A region of the top surface 41T where the second conductive film 43 is not disposed (hereinafter referred to as an opening 44) and at least one antenna 50 among the plurality of antennas 50 overlap in plan view. That is, the opening 44 is provided in the second conductive film 43, and a partial region of the top surface 41T of the second support member 40 is exposed. The third conductive film 45 is disposed in a region near the antenna 50 that overlaps the opening 44 in plan view on the side surface 41S. For example, the antenna 50 that overlaps the opening 44 in plan view is in a positional relationship sandwiched between the third conductive film 45 and the sub-module 20. Note that the third conductive film 45 may be continuous with the second conductive film 43 in a region other than the cross section shown in FIG. 6.

[0041] Next, the excellent effects of the fourth embodiment will be described. In the fourth embodiment as well as in the first embodiment, it is possible to achieve low-profile and wide-band characteristics and to ensure isolation between the high-frequency circuit in the sub-module 20 and the antenna 50. Further, in the fourth embodiment, since the second conductive film 43 and the third conductive film 45 function as electromagnetic shielding films, the directivity of the antenna 50 that overlaps the opening 44 in plan view can be controlled. For example, radio waves radiated from the antenna 50 that overlaps the opening 44 in plan view are radiated to the outside through the opening 44. Therefore, the main beam can be directed upward (the direction in which the top surface 41T faces).

[0042] Regarding the antenna 50 that overlaps with the second conductive film 43 in a plan view, similar to the second embodiment, the main beam can be directed in the direction that the side surface 41S faces.

[0043] [Fifth Embodiment] Next, the antenna module according to the fifth embodiment will be described with reference to FIG. 7. Hereinafter, the description of the configuration common to the antenna module according to the fourth embodiment shown in FIG. 6 will be omitted.

[0044] FIG. 7 is a cross-sectional view of the antenna module according to the fifth embodiment. The antenna module according to the fifth embodiment includes an antenna-integrated RF front-end unit 55 and a module substrate 80 on which the antenna-integrated RF front-end unit 55 is mounted. As the antenna-integrated RF front-end unit 55, the antenna module according to the fourth embodiment (FIG. 6) is used. A plurality of lands 87 are provided on one surface of the module substrate 80. The external terminal 42 and the antenna terminal 52 of the antenna-integrated RF front-end unit 55 are fixed to the lands 87 by solders 88, respectively, whereby the antenna-integrated RF front-end unit 55 is mounted on the module substrate 80.

[0045] A high-frequency connector 85 is mounted on the module substrate 80. The connector 85 is connected to the baseband integrated circuit component 60 via, for example, a coaxial cable 61. Further, the connector 85 is connected to the sub-module 20 of the antenna-integrated RF front-end unit 55 via a wiring (not shown) in the module substrate 80. Intermediate frequency signals and control signals are transmitted between the sub-module 20 and the baseband integrated circuit component 60 through the coaxial cable. A third conductive film 45 is disposed in a region of the side surface 41S of the second support member 40 that faces the connector 85 side. The third conductive film 45 functions as an electromagnetic shielding film.

[0046] Next, the excellent effects of the fifth embodiment will be described. Also in the fifth embodiment, similar to the first embodiment, the height can be reduced, the bandwidth can be broadened, and the isolation between the high-frequency circuit in the sub-module 20 and the antenna 50 can be ensured. Further, in the fifth embodiment, a third conductive film 45 that functions as an electromagnetic shielding film is disposed between the antenna-integrated RF front-end unit 55 supported by the second support member 40 and the connector 85. Therefore, the isolation between the antenna-integrated RF front-end unit 55 including the sub-module 20 and the antenna 50 and the connector 85 can be ensured.

[0047] [Sixth Embodiment] Next, the antenna module according to the sixth embodiment will be described with reference to FIG. 8. Hereinafter, the description of the configuration common to the antenna module according to the fifth embodiment shown in FIG. 7 will be omitted.

[0048] FIG. 8 is a cross-sectional view of the antenna module according to the sixth embodiment. In the fifth embodiment (FIG. 7), the antenna-integrated RF front-end unit 55 and the connector 85 are mounted on the module substrate 80. In the sixth embodiment, an external antenna component 81 is further mounted on the module substrate 80. The connector 85 (FIG. 7) does not appear in the cross-section shown in FIG. 8.

[0049] The third conductive film 45 is disposed in a region near the antenna 50 that overlaps the opening 44 of the second conductive film 43 in a plan view on the side surface 41S of the second support member 40. The antenna-integrated RF front-end unit 55 and the external antenna component 81 are arranged such that the side surface 41S on which the third conductive film 45 is disposed faces the external antenna component 81. In a plan view, the third conductive film 45 is disposed in a positional relationship between the antenna 50 and the external antenna component 81 that overlap the opening 44 of the second conductive film 43.

[0050] Next, the excellent effects of the sixth embodiment will be described. Also in the sixth embodiment, similar to the first embodiment, it is possible to reduce the height and broaden the bandwidth, and to ensure isolation between the high-frequency circuit and the antenna 50 in the sub-module 20. Further, in the sixth embodiment, a third conductive film 45 that functions as an electromagnetic shielding film is disposed between the antenna-integrated RF front-end unit 55 and the external antenna component 81. Therefore, isolation between the antenna-integrated RF front-end unit 55 and the external antenna component 81 can be ensured.

[0051] The third conductive film 45 functions as a reflector, and the main beam of the external antenna component 81 is directed in the normal direction of the side surface 41S where the third conductive film 45 is disposed. In this way, the directivity of the external antenna component 81 can be controlled.

[0052] [Seventh Embodiment] Next, the antenna module according to the seventh embodiment will be described with reference to FIGS. 9A and 9B. Hereinafter, description of the configuration common to the antenna module according to the first embodiment described with reference to the drawings from FIG. 1 to FIG. 3C will be omitted.

[0053] FIG. 9A is a cross-sectional view of the antenna module according to the seventh embodiment, and FIG. 9B is a schematic diagram showing the planar positional relationship of a plurality of components of the antenna module according to the seventh embodiment. In the first embodiment (FIG. 1), an antenna component including a radiating element 51 and an antenna terminal 52 is used as the antenna 50, and this antenna component is embedded and supported in the second support member 40. On the other hand, in the seventh embodiment, the radiating element 51 of the antenna 50 is constituted by a metal pattern disposed on the second surface 41A of the second support member 40. The radiating element 51 is connected to the internal terminal 31 of the sub-module 20 via a first feeding line 46 and an external terminal 42 disposed on the second surface 41A.

[0054] The second conductive film 43 is disposed over the entire top surface 41T of the second support member 40. In plan view, the second conductive film 43 includes a plurality of radiating elements 51. The second conductive film 43 is connected to the ground potential. The respective plurality of radiating elements 51 and the second conductive film 43 constitute an antenna 50 that operates as a patch antenna. Radio waves are radiated from each of the radiating elements 51 in the direction toward the second surface 41A of the second support member 40.

[0055] Next, the excellent effects of the seventh embodiment will be described. Also in the seventh embodiment, similar to the first embodiment, the profile can be made low. Furthermore, isolation between the high-frequency circuit in the sub-module 20 and the radiating element 51 can be ensured. Also, in the seventh embodiment, since the radiating element 51 is constituted by a metal pattern disposed on the second surface 41A of the second support member 40, the number of components can be reduced as compared with a configuration in which antenna components are embedded in and supported by the second support member 40.

[0056] Next, an antenna module according to a modification of the seventh embodiment will be described with reference to FIG. 10. FIG. 10 is a cross-sectional view of the antenna module according to the modification of the seventh embodiment. The antenna module according to this modification includes an antenna-integrated RF front-end unit 55 and a module substrate 80 on which the antenna-integrated RF front-end unit 55 is mounted. The antenna-integrated RF front-end unit 55 has the same configuration as that obtained by removing the second conductive film 43 from the antenna module according to the seventh embodiment (FIG. 9A).

[0057] A ground plane 97 is disposed in the module substrate 80. The ground plane 97 is connected to a terminal to which the ground potential is applied among the external terminals 42 of the antenna-integrated RF front-end unit 55 via lands 87 and solder 88. In plan view, the plurality of radiating elements 51 are included in the ground plane 97. The radiating elements 51 and the ground plane 97 constitute an antenna 50 that operates as a patch antenna.

[0058] In the modification shown in FIG. 10, radio waves are radiated from each of the radiating elements 51 in the direction in which the top surface 41T of the second support member 40 faces.

[0059] Next, an antenna module according to another modification of the seventh embodiment will be described with reference to FIG. 11. FIG. 11 is a schematic diagram showing the planar positional relationship of a plurality of components of the antenna module according to another modification of the seventh embodiment.

[0060] In the seventh embodiment (FIG. 9A), the antenna 50 provided on the second support member 40 is a patch antenna. In contrast, in this modification, the antenna 50 is a dipole antenna. The radiating elements 51 (two elements) and the balun 53 of the dipole antenna are constituted by metal patterns arranged on the second surface 41A of the second support member 40. The radiating element 51 is connected to the sub-module 20 via the balun 53 and the first feeding line 46. Note that the first feeding line 46 may be a differential line, and the differential line may be connected to the radiating elements 51 (two elements) of the dipole antenna without passing through the balun 53.

[0061] As in the modification shown in FIG. 11, a dipole antenna may be used as the antenna 50. In this case, radio waves can be radiated in the direction in which the side surface 41S of the second support member 40 faces.

[0062] [Eighth Embodiment] Next, an antenna module according to the eighth embodiment will be described with reference to FIGS. 12A, 12B, and 12C. Hereinafter, descriptions of configurations common to the antenna module according to the first embodiment described with reference to FIGS. 1 to 3C will be omitted.

[0063] FIGS. 12A, 12B, and 12C are a cross-sectional view, a side view, and a bottom view of the antenna module according to the eighth embodiment, respectively. In the first embodiment (FIG. 1), a plurality of antennas 50 are embedded and supported in the second support member 40. In the eighth embodiment, in addition to the antenna 50 embedded in the second support member 40, it has a radiating element 51 formed of a metal pattern disposed on the side surface 41S of the second support member 40.

[0064] The radiation element 51 is composed of a linear metal pattern extending in the height direction from the second surface 41A toward the top surface 41T and operates as a monopole antenna. The radiation element 51 can be formed by, for example, partial sputtering or the like. An end portion of the radiation element 51 on the second surface 41A side is connected to the external terminal 42 of the sub-module 20 via the first feeding line 46. Note that an L-shaped monopole antenna may be configured by the first feeding line 46 and the radiation element 51.

[0065] Next, the excellent effects of the eighth embodiment will be described. Also in the eighth embodiment, similar to the first embodiment, it is possible to reduce the height and widen the bandwidth, and to ensure isolation between the high-frequency circuit and the antenna 50 in the sub-module 20. By configuring a part of the plurality of antennas 50 with a metal pattern provided on the side surface 41S of the second support member 40, the number of components can be reduced. Further, the radiation element 51 provided on the side surface 41S of the second support member 40 can radiate radio waves in the direction in which the side surface 41S faces.

[0066] Next, with reference to FIG. 13, an antenna module according to a modification of the eighth embodiment will be described. FIG. 13 is a side view of the antenna module according to the modification of the eighth embodiment. In the eighth embodiment (FIG. 12B), the radiation element 51 disposed on the side surface 41S of the second support member 40 constitutes a monopole antenna. In contrast, in this modification, the radiation element 51 constitutes a dipole antenna. The radiation element 51 constituting the dipole antenna is connected to the first feeding line 46 via a balun 53. The first feeding line 46 may be a differential line, and the differential line may be connected to the radiation elements 51 (two elements) of the dipole antenna without passing through the balun 53. As in this modification, it is also possible to dispose a dipole antenna on the side surface 41S of the second support member 40.

[0067] [Ninth Embodiment] Next, the antenna module according to the ninth embodiment will be described with reference to FIG. 14. Hereinafter, the description of the configuration common to the antenna module (FIG. 8) according to the sixth embodiment will be omitted.

[0068] FIG. 14 is a cross-sectional view of the antenna module according to the ninth embodiment. In the sixth embodiment (FIG. 8), the antenna-integrated RF front-end unit 55 includes the sub-module 20 and a plurality of antennas 50. The antenna module according to the ninth embodiment is such that the antenna-integrated RF front-end unit 55 further includes a surface-mounted chip component 70. In the sixth embodiment (FIG. 8), the external antenna component 81 is mounted on the module substrate 80, but in the ninth embodiment, instead of or in addition to the external antenna component 81, a connector 85 for high-frequency signals is mounted.

[0069] The chip component 70 included in the antenna-integrated RF front-end unit 55 is, for example, a chip inductor. FIG. 14 shows an example in which the chip component 70 is a chip inductor, but the chip component 70 is not limited to a chip inductor. For example, examples of the chip component 70 include surface-mounted ferrite beads, surface-mounted bypass capacitors, etc. in addition to the chip inductor. The chip component 70 has a plurality of electrode terminals 71. The plurality of electrode terminals 71 are exposed on the second surface 41A of the second support member 40.

[0070] One external terminal 42 of the sub-module 20 is connected to one electrode terminal 71 of the chip component 70 via a wiring 48 provided on the second surface 41A. In a plan view, the sub-module 20 is disposed between the antenna 50 and the chip component 70. The second conductive film 43 is disposed on a partial region of the top surface 41T and substantially the entire side surface 41S of the second support member 40 that embed and support the sub-module 20, the antenna 50, and the chip component 70.

[0071] Next, the excellent effects of the ninth embodiment will be described. In the ninth embodiment, the first conductive film 23 provided on the sub-module 20 and the second conductive film 43 provided on the second support member 40 function as electromagnetic shielding films. Therefore, isolation can be ensured between the sub-module 20, the antenna 50, and the chip component 70 in the antenna-integrated RF front-end unit 55. Furthermore, isolation can be ensured between the high-frequency circuit in the antenna-integrated RF front-end unit 55 and the connector 85.

[0072] [Tenth Embodiment] Next, the antenna module according to the tenth embodiment will be described with reference to FIG. 15. Hereinafter, the description of the configuration common to the antenna module (FIG. 8) according to the sixth embodiment will be omitted.

[0073] FIG. 15 is a cross-sectional view of the antenna module according to the tenth embodiment. The antenna module according to the tenth embodiment has an antenna-integrated RF front-end unit 55 and a module substrate 80, similar to the antenna module according to the sixth embodiment. In the tenth embodiment, an external radiation element 82 made of a metal pattern is disposed on the surface of the module substrate 80 opposite to the surface on which the antenna-integrated RF front-end unit 55 is mounted.

[0074] The external radiation element 82 is connected to the external terminal 42 of the antenna-integrated RF front-end unit 55 via a second feeding line 83, a land 87, and a solder 88 disposed in the module substrate 80. A ground plane 97 is disposed in the module substrate 80. The external radiation element 82 and the ground plane 97 constitute a patch antenna.

[0075] Next, the excellent effects of the tenth embodiment will be described. Also in the tenth embodiment, similar to the sixth embodiment, it is possible to reduce the height and increase the bandwidth, and to ensure isolation between the high-frequency circuit and the antenna 50 in the sub-module 20. Further, in the tenth embodiment, the external radiation element 82 provided on the module substrate 80 can radiate radio waves in a direction opposite to the direction in which the surface of the module substrate 80 on which the antenna-integrated RF front-end unit 55 is mounted faces.

[0076] [Eleventh Embodiment] Next, the antenna module according to the eleventh embodiment will be described with reference to FIGS. 16 and 17. Hereinafter, description of the configurations common to the antenna module according to the first embodiment described with reference to FIGS. 1 to 3C will be omitted.

[0077] FIG. 16 is a schematic diagram showing a planar positional relationship of a plurality of components of the antenna module according to the eleventh embodiment, and FIG. 17 is a cross-sectional view of the antenna module according to the eleventh embodiment. In the first embodiment (FIG. 1), the sub-module 20 is embedded and supported in the second support member 40 (FIG. 1). In contrast, in the eleventh embodiment, the sub-module 20 is directly mounted on the module substrate 80 in a posture in which the first surface 21A faces the module substrate 80 without being supported by the second support member 40. Specifically, the internal terminal 31 of the sub-module 20 is fixed to the land 87 of the module substrate 80 by solder 88.

[0078] A connector 85 and a plurality of external antennas 90 are mounted on the module substrate 80. The plurality of external antennas 90 are arranged so as to surround the sub-module 20 in a plan view. Each of the external antennas 90 has an external radiation element 91 and a plurality of antenna terminals 92. The plurality of antenna terminals 92 are each fixed to the land 87 of the module substrate 80 by solder 88. One antenna terminal 92 of each of the external antennas 90 is connected to the internal terminal 31 of the sub-module 20 via a power supply line 93 arranged on the module substrate 80.

[0079] Next, the excellent effects of the 11th embodiment will be described. In the 11th embodiment, since the sub-module 20 is mounted on the module substrate without passing through an interposer, the height can be reduced. Since the first conductive film 23 functions as an electromagnetic shielding film, isolation between the high-frequency circuit in the sub-module 20 and the external antenna 90 can be ensured. Further, since the first conductive film 23 disposed on the side surface 21S of the sub-module 20 functions as a reflector, the directivity of the external antenna 90 can be controlled.

[0080] [12th Embodiment] Next, the antenna module according to the 12th embodiment will be described with reference to FIG. 18. Hereinafter, descriptions of configurations common to the antenna module (FIGS. 16 and 17) according to the 11th embodiment will be omitted.

[0081] FIG. 18 is a cross-sectional view of the antenna module according to the 12th embodiment. In the 11th embodiment (FIG. 17), the external antenna 90 is surface-mounted on the module substrate 80. In contrast, in the 12th embodiment, the external antenna 90 is constituted by a metal pattern disposed on the module substrate 80.

[0082] The external antenna 90 includes an external radiation element 91 disposed on the surface of the module substrate 80 where the sub-module 20 is mounted, and a part of the ground plane 97 disposed in the inner layer of the module substrate 80. The external radiation element 91 and the ground plane 97 constitute a patch antenna. The external radiation element 91 is connected to the internal terminal 31 of the sub-module 20 via a feeding line 93 disposed on the module substrate 80. The external antenna 90 radiates radio waves in the direction in which the surface of the module substrate 80 where the sub-module 20 is mounted faces.

[0083] Next, the excellent effects of the 12th embodiment will be described. Also in the 12th embodiment, similar to the 11th embodiment, the height can be reduced, and isolation between the high-frequency circuit in the sub-module 20 and the external antenna 90 can be ensured. Further, in the 12th embodiment, since the external antenna 90 is composed of a metal pattern disposed on the module substrate 80, the number of components can be reduced as compared with a configuration in which a surface-mounted external antenna is mounted.

[0084] Next, an antenna module according to a modification of the 12th embodiment will be described with reference to FIG. 19. FIG. 19 is a schematic diagram showing a planar arrangement of a plurality of components of an antenna module according to a modification of the 12th embodiment. In the 12th embodiment (FIG. 18), a patch antenna is used as the external antenna 90. In contrast, in this modification, a dipole antenna is used as the external antenna 90. The external radiation element 91 of the external antenna 90 includes two radiation elements constituting the dipole antenna. The external radiation element 91 is connected to the feeding line 93 via a balun 98. Further, the feeding line 93 is connected to the internal terminal 31 of the sub-module 20. Note that the feeding line 93 may be a differential line and the differential line may be connected to the two radiation elements constituting the dipole antenna without passing through the balun 98. As in this modification, a dipole antenna may be used as the external antenna 90.

[0085] [13th Embodiment] Next, an antenna module according to the 13th embodiment will be described with reference to FIG. 20. Hereinafter, descriptions of configurations common to the antenna module according to the 11th embodiment (FIGS. 16 and 17) will be omitted.

[0086] FIG. 20 is a cross-sectional view of the antenna module according to the 13th embodiment. In the 13th embodiment, in addition to the configuration of the antenna module (FIG. 17) according to the 11th embodiment, an external radiation element 95 made of a metal pattern disposed on a surface of the module substrate 80 opposite to the surface on which the sub-module 20 is mounted is provided. The external radiation element 95 is connected to the internal terminal 31 of the sub-module 20 via a power supply line 96, a land 87, and a solder 88 disposed in the module substrate 80. A ground plane 97 is disposed in the module substrate 80, and a patch antenna is configured by the external radiation element 95 and the ground plane 97.

[0087] Next, the excellent effects of the 13th embodiment will be described. Similar to the 11th embodiment, in the 13th embodiment, the height can be reduced. Further, by disposing the external radiation element 95, radio waves can be radiated in a direction opposite to the direction in which the surface of the module substrate 80 on which the sub-module 20 is mounted faces.

[0088] [14th Embodiment] Next, the antenna module according to the 14th embodiment will be described with reference to FIG. 21A. Hereinafter, description of the configuration common to the antenna module according to the 1st embodiment described with reference to the drawings from FIG. 1 to FIG. 3C will be omitted.

[0089] FIG. 21A is a cross-sectional view of the antenna module according to the 14th embodiment. The second support member 40 is divided into a first portion 40A and a second portion 40B. The sub-module 20 and the antenna 50 are supported by the first portion 40A. A plurality of external terminals 42 are exposed on one surface of the first portion 40A. The configurations of the sub-module 20, the antenna 50, the plurality of external terminals 42, and the first portion 40A of the second support member 40 are the same as those of the 1st embodiment (FIG. 1).

[0090] The second sub-module 120 is covered and supported by the second portion 40B of the second support member 40. For the purpose of distinguishing from the second sub-module 120, the sub-module 20 supported by the first portion 40A may be referred to as the first sub-module 20. The second sub-module 120 includes a plurality of second electronic components 130, a plurality of second internal terminals 131, and a third support member 122. These configurations are the same as those of the plurality of electronic components 30, the plurality of internal terminals 31, and the first support member 22 of the first sub-module 20.

[0091] The second sub-module 120 is covered and supported by the second portion 40B of the second support member 40. A plurality of second external terminals 142 are exposed on a surface of the second support member 40 opposite to the surface on which the plurality of external terminals 42 are exposed. The plurality of second external terminals 142 are respectively connected to the plurality of second internal terminals 131. A surface of the first portion 40A opposite to the surface on which the plurality of external terminals 42 are exposed and a surface of the second portion 40B opposite to the surface on which the plurality of second external terminals 142 are exposed are adhesively bonded to each other.

[0092] A surface of the first sub-module 20 (hereinafter referred to as the top surface) facing in a direction opposite to the surface of the second support member 40 on which the plurality of external terminals 42 are exposed faces, via the second support member 40, a surface of the second sub-module 120 (hereinafter referred to as the top surface) facing in the same direction as the surface of the second support member 40 on which the plurality of external terminals 42 are exposed.

[0093] Next, a method for manufacturing the antenna module according to the 14th embodiment will be described. A structure at an intermediate manufacturing stage shown in FIG. 3C of the antenna module according to the 1st embodiment is produced. In the steps up to this point, the first portion 40A of the second support member 40 and the plurality of first sub-modules 20 supported by the first portion 40A are produced. Similarly, the second portion 40B of the second support member 40 and the plurality of second sub-modules 120 supported by the second portion 40B are produced.

[0094] By bonding the first portion 40A and the second portion 40B together and removing the temporary substrate 101, the antenna module according to the 14th embodiment can be produced.

[0095] Next, with reference to FIG. 21B, an antenna module according to a modification of the 14th embodiment will be described. FIG. 21B is a cross-sectional view of the antenna module according to the modification of the 14th embodiment. In the 14th embodiment (FIG. 21A), the top surface of the first sub-module 20 and the top surface of the second sub-module 120 face each other via the second support member 40. On the other hand, in the modification shown in FIG. 21B, the top surface of the first sub-module 20 and the top surface of the second sub-module 120 face each other without the second support member 40 intervening therebetween. For example, an adhesive layer (not shown) for bonding the two is disposed between the top surface of the first sub-module 20 and the top surface of the second sub-module 120.

[0096] Next, with reference to FIGS. 22A and 22B, an antenna module according to another modification of the 14th embodiment will be described. FIGS. 22A and 22B are cross-sectional views of the antenna module according to another modification of the 14th embodiment. In the antenna modules according to the 14th embodiment (FIG. 21A) and the modification of the 14th embodiment (FIG. 21B), the second support member 40 includes a first portion 40A and a second portion 40B, and the two are bonded to each other. On the other hand, in the modification shown in FIGS. 22A and 22B, the first sub-module 20, the antenna 50, and the second sub-module 120 are supported by an integrated single second support member 40.

[0097] In the modification shown in FIG. 22A, the top surface of the first sub-module 20 faces the top surface of the second sub-module 120 via the second support member 40. In the modification shown in FIG. 22B, the top surface of the first sub-module 20 faces the top surface of the second sub-module 120 without the second support member 40 intervening therebetween. For example, the top surface of the first sub-module 20 is in contact with the top surface of the second sub-module 120.

[0098] Next, a method for manufacturing the antenna module shown in FIG. 22A will be described. First, a structure at an intermediate manufacturing stage of the antenna module according to the first embodiment, as shown in FIG. 3B, is fabricated. A structure including the second sub-module 120 is also fabricated in the same manner. Two temporary substrates 101 are arranged such that the surface on which the first sub-module 20 is mounted faces the surface on which the second sub-module 120 is mounted, and a liquid resin is filled between the two temporary substrates 101 using a transfer molding method. By curing the liquid resin, the antenna module shown in FIG. 22A is completed.

[0099] For the antenna module according to the modified example shown in FIG. 22B, the top surface of the first sub-module 20 and the top surface of the second sub-module 120 may be brought into contact with each other while the two temporary substrates 101 are facing each other.

[0100] Next, the excellent effects of the fourteenth embodiment and its modified examples will be described. Similar to the first embodiment, in the fourteenth embodiment and its modified examples, it is possible to reduce the height of the antenna module, improve the isolation between the first sub-module 20 and the antenna 50, and achieve broadband characteristics for the antenna 50. Furthermore, in the fourteenth embodiment and its modified examples, since the first sub-module 20 and the second sub-module 120 are stacked and arranged, high-density mounting becomes possible.

[0101] The above-described embodiments are illustrative, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. The same operational effects due to the same configurations of multiple embodiments will not be sequentially described for each embodiment. Furthermore, the present invention is not limited to the above-described embodiments. For example, it will be obvious to those skilled in the art that various changes, improvements, combinations, etc. are possible.

Description of Reference Numerals

[0102] 20 Sub-module 21A First surface of the sub-module 21S Side surface of the sub-module 21T Top surface of the sub-module 22 First support member 23 First conductive film 30 Electronic component 31 Internal terminal 31A First electrode 31B Solder 31BA Solder ball 31C Electrode 31G Ground terminal 40 Second support member 40A First part of the second support member 40B Second part of the second support member 41A Second surface of the second support member 41S Side surface of the second support member 41T Top surface of the second support member 42 External terminal 42A Second electrode 42B Solder 42BA Solder ball 43 Second conductive film 44 Opening (area where the second conductive film is not arranged) 45 Third conductive film 46 First power supply line 47 Ground plane 48 Wiring 50 Antenna 51 Radiation element 52 Antenna terminal 52A Third electrode 52B Solder 52BA Solder ball 53 Balun 55 Antenna-integrated RF front-end unit 60 Baseband integrated circuit component 61 Coaxial cable 70 Chip component 71 Electrode terminal 80 Module substrate 81 External antenna component 82 External radiation element 83 Second power supply line 85 Connector 87 Land 88 Solder 90 External antenna 91 External radiation element 92 Antenna terminal 93 Feeder line 95 External radiation element 96 Feeder line 97 Ground plane 98 Balun 100, 101 Temporary substrate 120 Second sub-module 122 Third support member 130 Second electronic component 131 Second internal terminal 142 Second external terminal

Claims

1. A plurality of electronic components, each including a plurality of internal terminals, a first support member that covers and supports the plurality of electronic components so as to expose the plurality of internal terminals, and a first conductive film disposed on at least a part of the first support member including a sub-module; at least one antenna; a second support member that supports the sub-module and supports the antenna; a plurality of external terminals respectively connected to the plurality of internal terminals and exposed from the second support member An antenna module comprising.

2. The plurality of internal terminals are exposed on a first surface of the first support member, the plurality of external terminals are exposed on a second surface of the second support member, and the first surface and the second surface face the same direction. The antenna module according to claim 1.

3. The antenna is composed of an antenna component including a radiating element and an antenna terminal, The antenna module according to claim 2, wherein the antenna component is covered and supported by the second support member so that the antenna terminal is exposed on the second surface.

4. The second support member has a top surface facing a direction opposite to the second surface, The antenna module according to claim 3, further comprising a second conductive film disposed on the top surface.

5. The second conductive film is disposed in a partial region of the top surface, and in a plan view, a region where the second support member is exposed from the second conductive film and at least one of the antenna components overlap. The antenna module according to claim 4.

6. A first feeding line disposed on the second surface and connecting one of the plurality of external terminals and the antenna; A ground plane disposed in a region that does not overlap the first feeding line on the second surface The antenna module according to any one of claims 3 to 5, further comprising.

7. Further comprising a surface-mount chip component having an electrode terminal supported by the second support member and exposed on the second surface, The antenna module according to any one of claims 3 to 5, wherein when the second surface is viewed in a plan view, the sub-module is disposed between the antenna component and the chip component.

8. The antenna module according to claim 2, wherein the antenna includes a radiating element formed of a metal pattern disposed on the second surface.

9. The second support member has a top surface facing a direction opposite to the second surface, and a side surface connecting the top surface and the second surface. The antenna module according to claim 2 or 8, wherein the antenna includes a radiation element formed of a metal pattern disposed on the side surface.

10. Furthermore, a module substrate on which the second support member that supports the sub-module and the antenna is mounted; a connector mounted on the same surface of the module substrate as the surface on which the second support member is mounted; and a third conductive film disposed in a region facing the connector side on the surface of the second support member. The antenna module according to claim 2 or 8, comprising:

11. Furthermore, an external antenna component mounted on the same surface of the module substrate as the surface on which the second support member is mounted is provided, The antenna module according to claim 10, wherein the third conductive film is disposed in a region facing the external antenna component on the surface of the second support member.

12. Furthermore, a module substrate on which the second support member that supports the sub-module and the antenna is mounted; an external radiation element formed of a metal pattern disposed on the module substrate; and a second feeding line disposed on the module substrate and connecting one of the plurality of external terminals and the external radiation element. The antenna module according to any one of claims 2 to 5, comprising:

13. a second sub-module including a plurality of second electronic components each including a plurality of second internal terminals, and a third support member that covers and supports the plurality of second electronic components so as to expose the plurality of second internal terminals; and a plurality of second external terminals exposed on a surface of the second support member opposite to the surface on which the plurality of external terminals are exposed. The antenna module further comprises: the second sub-module is covered and supported by the second support member; The antenna module according to any one of claims 1 to 5, wherein the plurality of second internal terminals are respectively connected to the plurality of second external terminals.

14. The antenna module according to claim 13, wherein a surface of the sub-module, on which the plurality of external terminals of the second support member are exposed and face in opposite directions, faces a surface of the second sub-module, on which the plurality of external terminals of the second support member are exposed and face in the same direction, without the second support member intervening therebetween.

15. The second support member according to claim 13, comprising a first portion that supports the sub-module and the antenna, and a second portion that supports the second sub-module, wherein the first portion and the second portion are adhesively bonded to each other. The antenna module described.

16. A plurality of electronic components each including a plurality of internal terminals, A first support member that covers and supports the plurality of electronic components so as to expose the plurality of internal terminals, and A first conductive film disposed on at least a part of the first support member A sub-module including: A module substrate on which the sub-module is mounted; A first antenna having a radiation element formed of a metal pattern provided on the module substrate; A second antenna mounted on a surface of the module substrate opposite to the surface on which the first antenna is provided An antenna module comprising:

17. The antenna module according to claim 16, wherein the radiation element of the first antenna is provided on a surface of the module substrate opposite to the surface on which the sub-module is mounted.

18. Furthermore, the antenna module according to claim 16 or 17, further comprising a feeding line disposed on the module substrate and connecting one of the plurality of internal terminals of the sub-module to the first antenna.

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