Gaming machine

Abstract

To provide a game machine that can suppress a decrease in security against fraudulent access to an electronic circuit board.SOLUTION: On the front surface of a specific circuit board, multiple test points used for inspecting electronic components to be mounted and a signal wiring pattern on the front surface of a circuit board, are formed. A specific test point connected to a solid ground among multiple test points includes an insulating portion where a surrounding copper foil is removed and solder is not welded, and a conductive portion where the surrounding copper foil portion remains and solder can be welded. A special test point connected to the signal wiring pattern on the front surface of the circuit board among the multiple test points includes a land portion on the front surface of the circuit board that is connected to the signal wiring pattern on the front surface of the circuit board and a land portion on the back surface of the circuit board that is connected to a signal wiring pattern on the back surface of the circuit board that is formed on the back surface of the specific circuit board. The land portion on the front surface of the circuit board has an unweldable portion at least partially covered with an insulating film to make it impossible to weld solder.SELECTED DRAWING: Figure 129

Claims

【Claim 1】 A gaming machine having a plurality of substrates on which a plurality of electronic components are mounted, comprising a specific substrate having a solid ground and substantially the entire surface of the substrate on which the plurality of electronic components are mounted being covered with a resist film, wherein on the specific substrate, a plurality of test points used for inspecting the mounted electronic components, a signal wiring pattern, a wiring connection through-hole for electrically connecting the signal wiring pattern formed on the front substrate surface of the specific substrate and the signal wiring pattern formed on the back substrate surface of the specific substrate, and a wiring connection land portion formed so as to be positioned around the wiring connection through-hole and connected to the signal wiring pattern are formed, wherein a specific test point among the plurality of test points includes a specific land portion for testing and a thermal pattern formed so as to be positioned around the specific land portion for testing and connecting the specific land portion for testing and the solid ground of the specific substrate, wherein a special test point among the plurality of test points includes a special land portion for testing connected to the signal wiring pattern, wherein at least a part of the wiring connection land portion and the special land portion for testing has a soldering-impossible portion covered with the resist film and made impossible to be soldered, and characterized by the above.

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