Substrate transfer device and substrate transfer method

Abstract

To suppress the emission of particles to the outside regarding a substrate conveying device.SOLUTION: A device is constituted comprising: a first housing in which a first through-hole is formed and which includes a first drive mechanism in the inside; a substrate holding unit for holding a substrate, which is connected to the first drive mechanism via the first through-hole and moves in the lateral direction toward the first housing; a second housing in which a second through-hole is formed and which includes a second drive mechanism in the inside for lifting and lowering the first housing that is connected via the second through-hole; an exhaust path which is formed from the inside of the first housing through to the inside of second housing; a first exhaust mechanism which is provided to the first housing in order for a gas suctioned from the first through-hole to be discharged at a first exhaust flow rate to the downstream side of the exhaust path and is located in the exhaust path; and a second exhaust mechanism which is provided to the second housing on the downstream side of the first exhaust mechanism in the exhaust path, and which discharges a gas suctioned from the second through-hole and a gas supplied from the upstream side of the exhaust path to the downstream side of the exhaust path at a second exhaust flow rate which is larger than the first exhaust flow rate.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a substrate transfer device and a substrate transfer method.

Background Art

[0002] A substrate processing apparatus used in the manufacture of semiconductor devices includes a processing module that processes a semiconductor wafer (hereinafter referred to as a wafer) as a substrate, and a substrate transfer device (substrate transfer mechanism) that transfers the substrate to the processing module. Patent Document 1 describes a substrate transfer mechanism configured to exhaust the atmosphere of the substrate transfer path.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of suppressing the release of particles to the outside in a substrate transfer device.

Means for Solving the Problems

[0005] The substrate transfer device of the present disclosure includes a first housing in which a first through-hole for communicating the inside and the outside is formed and a first drive mechanism is provided inside, a substrate holding portion that holds a substrate and is connected to the first drive mechanism through the first through-hole and moves in a lateral direction with respect to the first housing, a second housing in which a second through-hole for communicating the inside and the outside is formed and a second drive mechanism for raising and lowering the first housing connected through the second through-hole is provided inside, an exhaust passage formed from inside the first housing to inside the second housing, with the second housing side of the first housing and the second housing being the downstream side, A first exhaust mechanism provided in the first housing and located in the exhaust passage, for exhausting the gas sucked from the first through-hole to the downstream side of the exhaust passage at a first exhaust flow rate; A second exhaust mechanism provided in the second housing downstream of the first exhaust mechanism in the exhaust passage, for exhausting the gas sucked from the second through-hole and the gas supplied from the upstream side of the exhaust passage to the downstream side of the exhaust passage at a second exhaust flow rate greater than the first exhaust flow rate; Comprising.

Advantages of the Invention

[0006] The present disclosure can suppress the release of particles to the outside in a substrate transfer device.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Mode for Carrying Out the Invention

[0008] Regarding the coating and developing apparatus 1 including the transfer mechanisms F1 to F6 according to an embodiment of the substrate transfer apparatus of the present disclosure, it will be described with reference to the plan view of FIG. 1 and the longitudinal front view of FIG. 2. The coating and developing apparatus 1 is an apparatus that transfers and processes the wafer W in an air atmosphere, and is configured by connecting a carrier block D1, a processing block D2, and an interface block D3 in a row in the horizontal direction. In the following description, the direction along this row of blocks is defined as the left-right direction. An exposure machine D4 is connected to the interface block D3 on the side opposite to the side to which the processing block D2 is connected. The wafer W is placed on a stage 11 provided on the carrier block D1 in a state of being housed in a carrier C which is a carrier container. The carrier block D1 includes a transfer mechanism 12 for loading and unloading the wafer W with respect to the carrier C on the stage 11.

[0009] Next, the configuration of processing block D2 will be described. Processing block D2 is configured by stacking six unit blocks H1 to H6, which are partitioned from each other, in order from the bottom. In each unit block H (H1 to H6), the wafer W is conveyed and processed in parallel. Unit blocks H1 to H3 have the same configuration as each other, and unit blocks H4 to H6 have the same configuration as each other. Among unit blocks H1 to H6, the unit block H6 shown in FIG. 1 will be described as a representative. Conveyance paths 13 for the wafer W extending linearly left and right are formed at the centers in front of and behind the unit block H6. On the front side with respect to the conveyance path 13, two developing modules 14 are provided side by side on the left and right. On the rear side with respect to the conveyance path 13, a large number of heating modules 15 for performing PEB (Post Exposure Bake), which is a heat treatment after exposure and before development, are provided side by side on the left and right. Further, these heating modules 15 are stacked vertically. A conveyance mechanism F6 for conveying the wafer W in the unit block H6 is provided on the above-described conveyance path 13.

[0010] Regarding unit blocks H1 to H3, centering on the differences from the unit block H6, unit blocks H1 to H3 are provided with a resist film forming module instead of the developing module 14. The resist film forming module supplies (coats) resist to the wafer W to form a resist film. Also, in unit blocks H1 to H3, instead of the heating module 15 for PEB, a heating module for heating the wafer W after the resist film is formed is provided. In FIG. 2, the conveyance mechanisms of each unit block H1 to H5 corresponding to the conveyance mechanism F6 are shown as F1 to F5.

[0011] And at the left end of the conveyance path 13 of each unit block H1 to H6, a tower T1 extending vertically so as to straddle the unit blocks H1 to H6 is provided. In the tower T1, a transfer module TRS and a temperature adjustment module SCPL corresponding to the heights of the unit blocks H1 to H6 are provided, and the wafer W can be transferred between the modules of the tower T1 by a liftable conveyance mechanism 16 provided in the vicinity of the tower T1.

[0012] Regarding the TRS and SCPL of tower T1, the same numbers as the corresponding unit blocks H1 to H6 are assigned, and they are shown as TRS1 to TRS6 and SCPL1 to SCPL6. These TRS1 to TRS6 and the TRS at various locations described later are modules for temporarily placing the wafer W for the transfer of the wafer W between the transfer mechanisms, and are accessed by the transfer mechanisms F1 to F6. Also, tower T1 is provided with TRS7 and TRS8 for transferring the wafer W between the transfer mechanism 16 and the transfer mechanism 12 of the carrier block D1. The above SCPL1 to SCPL6 are modules capable of adjusting the temperature of the wafer W.

[0013] Next, the interface block D3 will be described. The interface block D3 includes towers T2 to T4 that extend vertically so as to straddle the unit blocks H1 to H6. Also, the interface block D3 is provided with transfer mechanisms 17 to 19, and the wafer W is transferred between various modules provided in the towers T2 to T4 by these transfer mechanisms 17 to 19. However, to avoid complication of the explanation, the display of modules other than the modules provided in tower T2 is omitted.

[0014] Tower T2 is provided with TRS at each height of the unit blocks H1 to H6. For the TRS located at the same height as the unit block, the same number and the letter A as the unit block are assigned, and they are shown as TRS1A to TRS6A. Further, tower T2 is provided with ICPL and TRS7A, which are modules for transferring the wafer W to and from the exposure machine D4. Similar to SCPL, ICPL adjusts the temperature of the wafer W.

[0015] The wafer W delivered from the carrier C by the transfer mechanism 12 is transported to the transfer module TRS7 of the tower T1 and sorted by the transfer mechanism 16 to the transfer modules TRS1 - TRS3 of the tower T1. Then, the wafer W is received by the transfer mechanisms F1 - F3 and transported in the order of the temperature adjustment modules SCPL1 - SCPL3 → the resist film forming module → the heating module. The wafer W transported in such a manner with a resist film formed thereon is transported to the transfer modules TRS1A - TRS3A and transported in the order of the transfer mechanism 17 → ICPL → the transfer mechanism 19 → the exposure machine D4, and the resist film is exposed.

[0016] After exposure, the wafer W is transported in the order of the transfer mechanism 19 → TRS7A and then sorted by the transfer mechanism 18 to the transfer modules TRS4A - TRS6A. The wafer W transported to TRS4A - TRS6A in such a manner is transported in the order of the heating module 15 → the temperature adjustment modules SCPL4 - SCPL6 → the development module 14 by the transfer mechanisms F4 - F6. Thereby, the resist film is developed and a resist pattern is formed on the wafer W. The developed wafer W is transported to the transfer modules TRS4 - TRS6, transported in the order of the transfer mechanism 16 → the transfer module TRS8, and carried into the carrier C by the transfer mechanism 12.

[0017] Also, the coating and developing apparatus 1 includes a control unit 10. The control unit 10 is constituted by a computer and includes a program, a memory, and a CPU. The program incorporates a group of steps so as to be able to perform a series of operations in the coating and developing apparatus 1 described later. Then, by the program, the control unit 10 outputs control signals to each part of the coating and developing apparatus 1, and the operations of each transfer mechanism and each module are controlled, whereby the transportation of the wafer W in the aforementioned transportation path and the processing of the wafer W are performed. The control of the operation of the transfer mechanism also includes the control of the operations of each of the fans B1 - B3 described later. The above program is stored in a storage medium such as a compact disk, a hard disk, a DVD, etc. and installed in the control unit 10.

[0018] The transfer mechanisms F1 to F6 of the processing block D2 are configured in the same manner as each other. Hereinafter, taking the transfer mechanism F6 as a representative, first, its schematic configuration will be described with reference to the perspective view of FIG. 3 and the schematic side view of FIG. 4. The transfer mechanism F6 includes, as constituent members, two holding parts 2, a base 3, a lifting table 4, a frame 5, and left and right drive blocks 6. The left and right drive blocks 6 are provided below the heating module 15 described above, and are long rectangular members extending left and right along the transfer path 13 in a plan view. The frame 5 is formed as an upright angle frame, and its lower end is located on the front side with respect to the left and right drive blocks 6. The frame 5 is connected to the drive mechanism of the left and right drive blocks 6 and linearly moves left and right (i.e., in the lateral direction).

[0019] Regarding the lifting table 4, the rear end side is surrounded by the frame 5 and is connected to the drive mechanism of the frame 5, and moves up and down in the vertical direction. A base 3 formed in a rectangular shape in a plan view is provided on the lifting table 4, and the base 3 is rotatable around the vertical axis by the lifting table 4. Two holding parts 2 are connected to the base 3. Each holding part 2 can move forward and backward independently of each other by being connected to the drive mechanism of the base 3, and linearly moves horizontally (i.e., in the lateral direction) along the length direction of the base 3. Each holding part 2 constitutes a substrate holding part that holds the back surface of the wafer W, and forms a horizontal plate-like body that is generally C-shaped in a plan view with the traveling direction being open. The two holding parts 2 are provided on the base 3 so as to overlap each other during the movement of the base 3, and hereinafter, the upper holding part 2 may be described as 2A and the lower holding part 2 as 2B. By the above-described operability of each constituent member of the transfer mechanism F6, in a state where the base 3 is positioned in front of each module, the holding parts 2A and 2B can enter the module respectively and transfer the wafer W to the module.

[0020] The linear movement distances of the holding unit 2, the lifting table 4, and the frame 5 are respectively shown as U1, U2, and U3 in Fig. 3. This linear movement distance refers to the distance between the state where a component moving linearly is located at the most one end side and the state where it is located at the most other end side on the straight line, that is, the movement stroke during conveyance, regarding the component that moves linearly when the wafer W is conveyed by the conveyance mechanism F6 in the unit block H6 along the path described above. When comparing the magnitudes of the linear movement distances U1 to U3, the linear movement distance U3 of the frame 5 > the linear movement distance U2 of the lifting table 4 > the linear movement distance U1 of the holding unit 2.

[0021] The drive mechanisms (drive mechanisms 33A, 33B, 54, 63 described later) for linearly moving the respective parts of the above-described conveyance mechanism F6 are provided inside the conveyance mechanism F6. In order to connect these drive mechanisms to the component to be driven, the conveyance mechanism F6 is configured to have an opening that communicates its inside and outside. The inside of the conveyance mechanism F6 is exhausted so that foreign matter inside the conveyance mechanism F6 is suppressed from being discharged as particles into the conveyance path 13 through the opening. Therefore, the atmosphere outside the conveyance mechanism F6 is taken into each part of the conveyance mechanism F6. Regarding the atmosphere taken into the base 3 from outside the base 3, an exhaust path 60 that straddles between the respective components is formed in the conveyance mechanism F6 so that it flows through the lifting table 4, the frame 5, and the left and right drive blocks 6 in order and is discharged to the outside of the conveyance mechanism F6. And a fan is provided at each stage of the exhaust path 60. In Fig. 4, the atmosphere taken into and flowing through the conveyance mechanism F6 in this way is indicated by arrows. The types of the above-described particles are various, and the main ones are, for example, grease (grease particles) used in the drive mechanism. In the conveyance mechanism F6, the exhaust flow rate of each fan and the size of each opening of the conveyance mechanism F6 are set so that the discharge of the particles is more surely suppressed.

[0022] To further explain the above-mentioned opening and exhaust passage 60, the base 3, lift table 4, frame 5, and left and right drive blocks 6 that make up the conveying mechanism F6 described above are provided with housings (31, 41, 51, 61 to be described later), and the exhaust passage 60 is formed by connecting these housings to each other. Slits (32A, 32B, 55, 64 to be described later) are formed in the housings 31, 51, 61 of the base 3, frame 5, and left and right drive blocks 6 as through-holes that penetrate the wall of the housing to communicate the inside and outside of the housing. To suppress the discharge of particles from this slit, a seal belt that overlaps the slit is provided from the inside of the housing. The linearly moving component (holding part 2, lift table 4 or frame 5) penetrates a part of this seal belt and is connected to the drive mechanism. Along with the linear movement of the component, the seal belt is movable and always overlaps the slit. And this seal belt is slightly separated from the housing so that particles are not generated when it rubs against the housing when it is deflected by the influence of wind pressure or the like. Therefore, the opening that communicates the inside and outside of the above-described conveying mechanism F6 is an annular gap formed by the outer peripheral edge (opening edge) of the slit and the seal belt, and the gaps R1 to R3 described later correspond to it.

[0023] Subsequently, the configuration of each part of the conveying mechanism F6 will be described in detail. In the description, there are cases where the drive mechanism, the component (holding part 2, lift table 4 or frame 5) that linearly moves by the drive mechanism, the slit that is opened to move the component, the seal belt that overlaps the slit, and the pulley on which the seal belt is hung are denoted as members in a "corresponding" relationship with each other.

[0024] First, the base 3 will be described with reference to the cross-sectional plan view of FIG. 5 and the longitudinal side view of FIG. 6. Note that FIG. 6 is a cross-sectional view taken in the advancing and retreating direction of the holding portion 2. The base 3 includes a rectangular housing 31 in plan view, and slits 32A and 32B, which are first through-holes, are provided one above the other on the side wall forming the long side of the rectangle. The slits 32A and 32B extend in the length direction of the housing 31. Inside the housing 31, drive mechanisms 33A and 33B are provided at different heights, respectively. The drive mechanism 33A, the slit 32A, and the holding portion 2A are in a corresponding relationship with each other, and the drive mechanism 33B, the slit 32B, and the holding portion 2B are in a corresponding relationship with each other.

[0025] The drive mechanism 33A, which is the first drive mechanism, is composed of a guide rail 34, pulleys 35 and 36 that are each rotatable around a horizontal axis, a motor 37 connected to the pulley 35 to rotate the pulley 35, and an endless (i.e., annular) drive belt 38 spanned over the pulleys 35 and 36. The extension direction of the guide rail 34 and the arrangement direction of the pulleys 35 and 36 are the same as the moving direction of the holding portion 2A described above, and the rotation axes of the pulleys 35 and 36 extend horizontally perpendicular to this arrangement direction. A connecting member 21 is provided on the side of the holding portion 2A described above. Each connecting member 21 extends downward from the holding portion 2A, then bends toward the base 3, enters the housing 31 through the slit 32A, and is connected to the guide rail 34 and the drive belt 38 described above.

[0026] In the housing 31, a plurality of pulleys 22 that are paired with each other and rotatable about a vertical axis are provided. When viewed in the opening direction of the slit 32A, the paired pulleys 22 are separated in the longitudinal direction of the slit 32A and are arranged so as to sandwich the slit 32A. An endless seal belt 23 is wound around the plurality of paired pulleys 22 in this way. The width of the seal belt 23, which is the first seal portion, is larger than the width of the slit 32A. A part of the circumference of the seal belt 23 overlaps the slit 32A, and is close to and faces the side wall of the housing 31 in which the slit 32A is formed. As a result, a gap R1 having a width L1 is formed over the entire circumference of the outer peripheral edge of the slit 32A. Regarding this width L1, to describe it in more detail, it is the width of the gap R1 in the opening direction of the slit 32A, that is, the distance between the outer peripheral edge of the slit 32A and the seal belt 23. Note that this width L1 is the distance between the seal belt 23 and the outer peripheral edge of the slit 32A when the seal belt 23 is wound around the pulley 22 without being bent, and the widths L2 and L3 described later are also the distances between the seal belt and the outer peripheral edge of the slit when the seal belt is not bent.

[0027] The connecting member 21 of the holding portion 2A described above is connected to the drive mechanism 33A as described above by passing through a part of the portion of the seal belt 23 that overlaps the slit 32A. Therefore, when the drive belt 38 rotates due to the rotation of the motor 37, the holding portion 2A moves along the longitudinal direction of the guide rail 34. The seal belt 23 is rotatable in response to the movement of the holding portion 2A, and the width L1 of the gap R1, which is the first gap, is maintained at a constant size.

[0028] In the housing 31, a seal belt 23 corresponding to the holding portion 2B and pulleys 22 for the seal belt are also provided. The drive mechanism 33B, the seal belt 23, and the pulley 22 corresponding to the holding portion 2B have the same configuration as these members corresponding to the holding portion 2A. Further, the holding portion 2B is connected to the seal belt 23 and the drive mechanism 33 via the connecting member 21 in the same manner as the holding portion 2A.

[0029] Incidentally, with regard to the plurality of pulleys 22 that are paired with each other and over which the seat belt 23 is stretched, although only two are shown in FIG. 5 for simplicity of illustration, the number and arrangement may be such that each seat belt 23 can overlap with the slits 32A and 32B as described above, and actually three or more may be provided. Regarding the pulleys for the seat belt corresponding to the lift table 4 and the frame 5 to be described later, although two are shown as being paired in the same manner as the pulley 22, a configuration in which three or more are paired and the seat belt is stretched over these pulleys may also be possible. Further, regarding the configuration of each member corresponding to the lift table 4 and each member corresponding to the frame 5, since they are substantially the same as the configuration of each member corresponding to the holding portion 2 described above, in the following description, regarding each member corresponding to the lift table 4 and the frame 5, the description will focus on the differences from the members corresponding to the holding portion 2.

[0030] Supplemental description of the housing 31 that forms the base 3: A cylindrical portion 24 that protrudes vertically downward and enters the housing 41 that forms the lift table 4 is formed on the lower surface of the housing 31 (see FIG. 4), and the space 25 within the cylindrical portion 24 allows communication between the inside of the housing 31 and the inside of the housing 41 that forms the lift table 4. A rotation mechanism for rotating the base 3 is provided within the housing 41 by rotating the cylindrical portion 24 around its cylinder axis, but the illustration thereof is omitted. Note that the housings 31 and 41 correspond to the first housing.

[0031] Lift sliders 42 that protrude and enter toward the frame 5 are provided on the left and right side walls of the housing 41 that forms the lift table 4, respectively. A flow path 43 is formed within this lift slider 42, and through this flow path, the inside of the housing 41 communicates with the inside of the housing 51 that forms the frame 5. Further, a fan B1, which is a first exhaust mechanism, is provided within the housing 41. The atmosphere in the conveyance path 13 is taken in from the slits 32A and 32B of the base 3 described above by this fan B1. Then, this atmosphere flows through the inside of the housing 31 and the housing 41, is sucked in by the fan B1, and is discharged into the housing 51 that forms the frame 5 through the flow path 43.

[0032] Next, the frame 5 will be described with reference to the longitudinal front view of FIG. 7. As described above, the frame 5 includes a housing 51. When the vertically extending portions on the left and right of the frame 5 are defined as column portions 52, the two column portions 52 are configured to be mirror-symmetrical with respect to each other when viewed in the front-rear direction of the conveyance path 13. Vertical slits 53 are formed in the right side wall of the left column portion 52 and the left side wall of the right column portion 52, respectively. The elevating slider 42 of the elevating platform 4 enters the housing 51 through the slit 53 which is a second through-hole, and the flow path 43 of the elevating slider 42 opens into the housing 51.

[0033] In the portions forming the respective column portions 52 in the housing 51 which is the second housing, a drive mechanism 54 corresponding to the elevating platform 4, a set of pulleys 55 for a seal belt, and a seal belt 56 are provided. The differences between the drive mechanism 54 which is the second drive mechanism and the above-described drive mechanism 33 are that, corresponding to the moving direction of the elevating platform 4, the extending direction of the guide rail 34 and the arrangement direction of the pulleys 35 and 36 are in the vertical direction, and the pulleys 35 and 36 are rotatable about a horizontal axis extending in the front-rear direction. For each of the pulleys 55 for the seal belt, similar to the pulleys 35 and 36, they are provided apart in the vertical direction and are rotatable about the front-rear horizontal axis. When viewed in the opening direction of the slit 53, the pulleys 55 are positioned so as to sandwich the slit 53, and the seal belt 56 forming a second seal portion is wound around these pulleys 55.

[0034] The positional relationship between the slit 53 and the seal belt 56 as viewed in the opening direction of the slit 53 is the same as the positional relationship between the slit 32A and the seal belt 23 in the base 3 described above. Therefore, the seal belt 56 is close to and faces the entire circumference of the outer peripheral edge of the slit 53. The gap between the outer peripheral edge of the slit 53 and the seal belt 56 is designated as R2, and the width of the gap R2 (i.e., the width of the slit 53 in the opening direction of the slit 53 with respect to the gap R2) is designated as L2 and is shown in FIG. 7. Note that the lifting slider 42 of the lifting table 4 described above is connected to the guide rail 34 and the drive belt 38 that constitute the drive mechanism 54 by passing through a part of the portion of the seal belt 56 that overlaps the slit 53. Therefore, the lifting table 4 can be lifted and lowered by the rotation of the motor 37 of the drive mechanism 54, and when the lifting table 4 is lifted and lowered, the seal belt 23 rotates so that the width L2 of the gap R2, which is the second gap, is maintained at a constant size.

[0035] Referring also to FIG. 8, which is a cross-sectional plan view of the column portion 52 and the left and right drive blocks 6, a fan B2 is provided on the rear side of the bottom of each column portion 52. And a block-shaped horizontal slider 58 is provided sandwiched between these fans B2. The rear end side of this horizontal slider 58 enters the left and right drive blocks 6. The air in the conveyance path 13 is taken in from the slit 53 by each fan B2. Then, the air that has flowed in from the slit 53 and the air that has flowed into the housing 51 by the fan B1 as described above are sucked by the fan B2 and discharged into the housing 61 that constitutes the left and right drive blocks 6 through the flow path 59 formed in the horizontal slider 58.

[0036] Subsequently, the left and right drive blocks 6 will be described with reference to FIG. 8 above. In this FIG. 8, the flow of air in each part is indicated by dotted arrows. As described above, the left and right drive blocks 6 include a housing 61 that is a third housing, and a slit 62 extending left and right is formed on the front surface of the housing 61. The horizontal slider 58 of the frame 5 described above enters the housing 61 through the slit 62 that is a third through-hole, and the flow path 59 of the horizontal slider 58 opens into the housing 61.

[0037] Inside the housing 61, a drive mechanism 63 corresponding to each of the frames 5, a set of pulleys 64 for the seal belt, and a seal belt 65 are provided. The differences between the drive mechanism 63, which is the third drive mechanism, and the drive mechanism 33 of the base 3 include that, corresponding to the moving direction of the frame 5, the extending direction of the guide rail 34 and the arrangement direction of the pulleys 35 and 36 are the left and right horizontal directions, and the pulleys 35 and 36 are rotatable around the front and rear horizontal axes. The pulleys 64 for the seal belt are provided apart in the left and right horizontal directions and are rotatable around the vertical axis. When viewed in the opening direction of the slit 62, the paired pulleys 64 are positioned so as to sandwich the slit 62, and the seal belt 65 forming the third seal portion is wound around these pulleys 64.

[0038] The positional relationship between the slit 62 and the seal belt 65 when viewed in the opening direction of the slit 62 is the same as the positional relationship between the slit 32A and the seal belt 23 described above. Therefore, the seal belt 65 is close to and faces the entire circumference of the outer peripheral edge of the slit 62. The gap between the outer peripheral edge of the slit 62 and the seal belt 65 is designated as R3, and the width of the gap R3, which is the distance between the outer peripheral edge and the seal belt 65 (that is, the width of the slit 62 in the opening direction of the gap R3), is designated as L3. Incidentally, the above-described horizontal slider 58 is connected to the guide rail 34 and the drive belt 38 constituting the drive mechanism 63 by passing through a part of the portion of the seal belt 65 that overlaps the slit 62. Therefore, due to the rotation of the motor 37 of the drive mechanism 63, the frame 5 can move left and right, and when the frame 5 moves, the seal belt 65 rotates so that the width L3 of the gap R3, which is the third gap, is maintained at a constant size.

[0039] Inside the housing 61, the fan B3 is provided at each of the left end and the right end of the rear wall portion of the housing 61. The atmosphere in the conveyance path 13 is taken in from the slit 62 by each fan B3. Then, the atmosphere flowing in from the slit 62 and the atmosphere flowing into the housing 51 from the horizontal slider 58 via the fans B1 and B2 as described above are sucked by the fan B3. The atmosphere sucked in this way is discharged from the housing 61 through an exhaust passage (not shown) connected to the fan B3.

[0040] As described above, the exhaust passage 60 in the conveyance mechanism F6 described with reference to FIG. 4 is formed so as to extend from inside the housing 31 through the inside of the housings 41 and 51 to inside the housing 61, and faces downstream in the order of the housings 31, 41, 51, and 61. For the two fans B2 provided on the frame 5, when viewed downstream from inside the housing 31 of the base 3 forming the upstream end of the exhaust passage 60, they are provided at positions having the same length from each other. Also, for the two fans B3 provided on the left and right drive blocks 6, when viewed downstream from inside the housing 31 of the exhaust passage 60, they are provided at positions having the same length from each other.

[0041] Incidentally, let the exhaust flow rate (the amount of exhaust per unit time) by the fan 43 of the base 3 be Ex, the exhaust flow rate by the two fans B2 of the frame 5 be Ez, and the exhaust flow rate by the two fans B3 of the left and right drive blocks 6 be Ey. That is, regarding the fans at the same position in the flow path direction when viewed toward the downstream side of the exhaust passage 60, they are regarded as one fan, and the exhaust flow rates of the fans at different positions in the flow path direction are represented by different signs. More specifically, Ez is the sum of the exhaust flow rates of the two fans B2 provided at the same position in the flow path direction of the exhaust passage 60, and Ey is the sum of the exhaust flow rates of the two fans B3 at the same position in the flow path direction of the exhaust passage 60. Ex is the first exhaust flow rate, Ez is the second exhaust flow rate, and Ey is the third exhaust flow rate.

[0042] Assuming the total exhaust flow rate ΣE of the entire transfer mechanism F6, it can be expressed as ΣE = Ex + Ez + Ey - Eloss (Equation 1). Eloss represents the loss component with respect to the exhaust flow rate, which varies depending on factors such as the assembly accuracy and design accuracy of the transfer mechanism F6 and is an inevitable factor. To suppress the scattering of particles such as grease from the transfer mechanism F6 to the outside, it is conceivable to configure the transfer mechanism F6 to reduce Eloss, or to increase ΣE by increasing the exhaust flow rates of each of the fans B1 to B3. However, through experiments and verification, in addition to such measures, it has been confirmed that appropriately setting the balance between Ex, Ey, and Ez and the balance of the widths L1 to L3 of the gaps R1 to R3 described above is effective in suppressing the scattering of the above-mentioned particles. The experiments and verification will be described as appropriate hereinafter.

[0043] Specifically, regarding the exhaust flow rates Ex, Ey, and Ez, the rotational speeds of each of the fans B1 to B3 are set so that Ex < Ez < Ey. This is to prevent the air flow from stagnating or remaining in the middle of the exhaust passage 60 by increasing the exhaust flow rate by the exhaust mechanism provided at a position closer to the downstream side of the exhaust passage 60. By preventing such stagnation and remaining, it is possible to prevent particles from leaking out from the gaps R1 to R3 configured to be connected to the exhaust passage 60.

[0044] An evaluation test 1 for verifying the magnitude relationship of the exhaust flow rate will be described. As evaluation test 1-1, it was set as Ex < Ez < Ey as described above. Then, the wafer W was repeatedly transferred in a predetermined circuit by the transfer mechanism F6. This transfer was performed for 10 wafers W. Thereafter, among the particles adhering to each wafer W, the number of grease particles was detected. Then, it was calculated for 10, which is the total number of grease particles adhering to 10 wafers W divided by the number of times the above-mentioned circuit was traversed divided by the number of wafers W transferred. The calculated value is defined as the number of grease particles / number of loops. As comparative test 1-2, a test similar to evaluation test 1-1 was performed except that Ez < Ex < Ey was set, and the number of grease particles / number of loops was calculated.

[0045] The results of this Evaluation Test 1 are shown as a box chart in Fig. 9. In the box chart of Fig. 9 and the box charts of each of the figures described later, points are placed on the horizontal bars of the box representing the median (second quartile), the first quartile, and the third quartile, so that each quartile can be identified even when the horizontal bars representing these quartiles are close to each other. As shown in the box chart of Fig. 9, in Evaluation Test 1-1, the number of grit particles / number of loops was smaller than in Evaluation Test 1-2. In Evaluation Test 1-2, since Ex>Ez, it is considered that stagnation and retention of the flow of grit particles occurred between fans B1 and B2 in the exhaust passage 60. As a result, it is presumed that the grit particles generated by the drive mechanisms 33A and 33B of the base 3 were discharged from the gap R2 of the frame 5 to the conveyance path 13, resulting in a larger number of grit particles / number of loops than in Evaluation Test 1-1. Thus, it was shown that the discharge of grit particles from the gaps R1 to R3 was suppressed in Evaluation Test 1-1. In each of the evaluation tests described later, the setting is the same as in this Evaluation Test 1-1, with Ex<Ez<Ey.

[0046] Incidentally, in Fig. 10, a part of the transport mechanism F6 is shown very schematically as a model G1. The model G1 includes a housing 71, a fan 72, and an opening 73. The air is sucked by the fan 72 provided inside the housing 71, and the air flows from the outside to the inside of the housing 71 through the opening 73 provided in the wall of the housing 71. The fan 72 corresponds to any one of the above-described fans B1 to B3, and the opening 73 is the gap corresponding to the fan 72 among the gaps R1 to R3. Therefore, when the fan 72 is B1, B2, or B3, the opening 73 is the gap R1, R2, or R3, respectively. And the housing 71 corresponds to the part that forms the flow path from the fan 72 to the opening 73 in each of the housings 31 to 61 that form the exhaust passage 60 described above. Let the flow rate of the air flowing toward the fan 72 inside the housing 71 without passing through the opening 73 be E1, the cross-sectional area of the opening 73 be A1, the velocity of the air flowing into the housing 71 at the opening 73 be V1, and the pressure at the opening 73 be P1. Then, the total exhaust flow rate ΣE of the fan 72 can be expressed as ΣE = E1 + P1 × V1 × A1 (Equation 2).

[0047] In Fig. 11, a part of the transport mechanism F6 is also shown schematically as a model G2 similar to the model G1. However, in this model G2, the cross-sectional area of the opening 73 is A2, which is smaller than the cross-sectional area A1 of the opening 73 of the model G1. Assuming that there is no change in this model G2 other than this cross-sectional area, the total exhaust flow rate ΣE of the transport mechanism F6 of the model G2 can be expressed as ΣE = E2 + P2 × V2 × A2 (Equation 3), which is the same equation as Equation 2 of the model G1. E2 in Equation 3 is the flow rate of the air flowing toward the fan 72 inside the housing 71 without passing through the opening 73, the same as E1 above. Also, P2 and V2 are the pressure at the opening 73 and the velocity of the air flowing into the housing 71 at the opening 73 in the model G2, respectively.

[0048] Assume that models G1 and G2 represent the same part in the transport mechanism F6. That is, models G1 and G2 represent a state where only the gap R (any one of R1 to R3) is changed at the same part. In that case, the flow rates E1 and E2 are the same as each other. And since the environments in which models G1 and G2 are placed are the same, the energies received by models G1 and G2 from the outside are also the same. Regarding P1×V1×A1 in Equation 2 and P2×V2×A2 in Equation 3, they are elements affected by the external energy, but because the energy is the same, it can be considered that P1×V1×A1 = P2×V2×A2. That is, it can be considered that the total exhaust flow rate ΣE of the fan 72 is the same between models G1 and G2. And due to the influence of the difference in the cross-sectional areas A1 and A2, the relationship is P1 > P2 and V1 < V2.

[0049] As V1 < V2 as described above, air flows into the housing 71 from the opening 73 at a higher flow velocity in model G2 than in model G1. This means that due to the high flow velocity of the air, particles can be pushed into the housing 71 and the discharge of the housing 71 to the outside through the opening 73 can be prevented. Therefore, it is considered effective to configure the gaps R1 to R3 corresponding to the opening 73 to be smaller.

[0050] Regarding the widths L1 to L3 of the gaps R1 to R3, in Evaluation Test 1, they were set to 1.0 mm. For convenience of explanation, this 1.0 mm is used as the reference value. In the experiments described hereinafter, there are cases where the widths L1 to L3 are set to reduced values smaller than the reference value. Therefore, regarding one of the fans B1 to B3, the gap corresponding to the fan, and the housing forming the exhaust passage between the fan and the gap, when the gap is set to the reference value, it can be considered to be represented by Model G1, and when the gap is set to the reduced value, it can be considered to be represented by Model G2. Regarding the exhaust flow rates of the fans B1 to B3, they are represented as Ex, Ey, and Ez. Hereinafter, for convenience, when the width of the corresponding gap is a reduced value, in some cases, an apostrophe is attached to E to represent them as E'x, E'y, and E'z, respectively. That is, the exhaust flow rate of the fan represented by Model G2 for the corresponding gap is represented as E'.

[0051] Based on the consideration that it is preferable to reduce each of the above-mentioned gaps R1 to R3, Evaluation Test 2 was conducted. Focusing on the differences from Evaluation Test 1, in this Evaluation Test 2, the width L1 of the gap R1 in the base 3 was set to a reduced value, and the widths L2 and L3 in the gaps R2 and R3 were set to the reference value. Then, similar to Evaluation Test 1, 10 wafers W were transported so as to circulate the peripheral circuit, and the number of grease particles / number of loops was calculated. The reduced value was set to any one of 0.5 mm, 0.7 mm, and 0.85 mm. Regarding the width L1, the same setting was made, and the transportation of the wafer W in the peripheral circuit and the calculation of the number of grease particles / number of loops were performed three times, and the average value of these three times was calculated.

[0052] The graph in Fig. 12 shows the results of Evaluation Test 2, with the width L1 on the horizontal axis and the number of gripper particles / number of loops on the vertical axis. The average value of the above-mentioned number of gripper particles / number of loops is represented by dots, and the approximate straight line based on each dot is shown by a dotted line. As shown in this graph, the smaller the width L1, the smaller the value of the number of gripper particles / number of loops. Thus, the results of Evaluation Test 2 are consistent with the inference that by reducing each of the above-mentioned gaps, the speed of the air passing through the gap can be increased to suppress the emission of particles. Also, from this Evaluation Test 2, it was shown that for the width L1, it is preferably in the range of, for example, 0.5 mm to 0.85 mm, and a smaller value within this range is more preferable.

[0053] Each housing 31 provided with the seal belt 23 is made of, for example, metal to ensure sufficient strength. If the width L1 of the gap R1 is set to a reduced value, it is conceivable that when these seal belts 23 are bent, they will contact the housing 31 and the amount of metal particles generated from the housing 31 will increase. To prevent this, for the outer peripheral edges of the slits 32A and 32B on the inner wall of these housings 31, they may be configured with a member having higher elasticity than the metal forming the housing 31, such as resin, so as to suppress the generation of the particles. The outer peripheral edges of the slits of the housings 51 and 61 provided with the seal belts 56 and 65 may also be configured with resin in this way.

[0054] Next, Evaluation Test 3 will be described. In this Evaluation Test 3, for the widths L1 to L3 of the gaps R1 to R3, by changing the combination of the reference value and the reduced value, 10 wafers W were conveyed around the peripheral circuit in the same manner as in Evaluation Tests 1 and 2, and the number of grease particles / number of loops was calculated. In this Evaluation Test 3, the reduced value was set to 0.5 mm. In Evaluation Test 3-1, the widths L1 to L3 were all set to the reference value. In Evaluation Test 3-2, only the width L1 was set to the reduced value, and the widths L2 and L3 were set to the reference value. In Evaluation Test 3-3, the widths L1 and L2 were set to the reduced value, and the width L3 was set to the reference value. In Evaluation Test 3-4, the widths L1 to L3 were all set to the reduced value. Therefore, in Evaluation Test 3-2, it is E′x, in Evaluation Test 3-3, it is E′x and E′z, and in Evaluation Test 3-4, it is E′x, E′z, and E′y. Note that in Evaluation Test 3-4 where the widths L1 to L3 are set to the reduced value, the total exhaust gas flow rate ΣE′ of the entire transfer mechanism F6 can be expressed by the same formula 4 as formula 1: ΣE′ = E′x + E′z + E′y - E′loss. E′loss is the loss of the exhaust gas flow rate, similar to the above Eloss.

[0055] The box chart in Fig. 13 shows the results of Evaluation Test 3. As shown in this chart, regarding the number of grease particles / number of loops, it is smaller in Evaluation Test 3-2 compared to Evaluation Test 3-1. And in Evaluation Test 3-3, it is even lower than Evaluation Test 3-2 and is approximately 0, which is the most favorable result among Evaluation Tests 3-1 to 3-4. However, in Evaluation Test 3-4, although it is smaller than Evaluation Test 3-1, it is larger than Evaluation Tests 3-2 and 3-3. According to the above inference, in Evaluation Test 3-4 where all of the gaps R1 to R3 are set to the reduced value, it was expected that grease particles would be released at the same level or more than in Evaluation Test 3-3, but the result was different from that expectation.

[0056] Regarding the results of the above evaluation test 3-4, it is considered that the compression of the air inside the housing 61 of the left and right drive blocks 6 has an impact. As described with reference to FIG. 3, the linear movement distance U3 of the frame 5 is larger than the linear movement distance U1 of the holding portion 2 and the linear movement distance U2 of the lifting table 4. Therefore, when the horizontal slider 58 moving inside the housing 61 moves toward the left end or the right end inside the housing 61, it may move a relatively long distance. In that case, the air is compressed with a high compression ratio at the left end or the right end inside the housing 61.

[0057] When the width L3 of the gap R3 is a reference value and is relatively large (when the gap R3 and the fan B3 corresponding to the gap R3 can be represented in model G1), the flow velocity of the air flowing into the housing 61 through the gap R3 is relatively small. Therefore, the effect of this air blocking the gap R3 is relatively low, and the airtightness of the housing 61 is suppressed. Accordingly, the air compressed inside the housing 61 can diffuse inside the gap R3 or diffuse outside the gap R3. The influence on the upstream side of the exhaust passage 60 due to this diffusion is relatively small.

[0058] However, when the width L3 of the gap R3 is a reduced value and is relatively small (when the gap R3 and the fan B3 corresponding to the gap R3 can be represented in model G2), the flow velocity of the air flowing into the housing 61 through the gap R3 is relatively large. Therefore, the effect of this air blocking the gap R3 is relatively high, and the airtightness of the housing 61 is increased. Accordingly, it is difficult for the air compressed inside the housing 61 to be released inside the gap R3 and to the outside through the gap R3. Therefore, it is considered that the above results are caused by the fact that air stays and flows backward in the exhaust passage 60, and the grease particles that were in the middle of flowing through the exhaust passage 60 or adhered to each drive mechanism are released to the conveyance path 13 through the gaps R1 and R2 connected to the upstream side of the exhaust passage 60.

[0059] Supplementary to the experimental conditions of Evaluation Test 3, after setting the exhaust flow rates of fans B1 to B3 such that Ex + Ez < Ey, Evaluation Tests 3-1 to 3-4 were conducted by changing the widths L1 to L3 of the gaps R1 to R3 described above. Therefore, Evaluation Test 3-4 was conducted in a state where the relationship E'x + E'z < E'y was satisfied. In order to suppress the release of grease particles, it is considered effective to make the relationship E'x + E'z < E'y not hold in this Evaluation Test 3-4. Specifically, for example, E'x + E'z > E'y. That is, after setting the fans B1 to B3 such that the relationship Ex + Ez > Ey is obtained, it is considered effective to make the widths L1 to L3 of the gaps R1 to R3 each a reduced value, that is, a value smaller than 1.0 mm. Note that setting E'x + E'z > E'y in this way means that E'y becomes a relatively small value compared to setting E'x + E'z < E'y, which means that the increase in the speed of the atmosphere in the gap R3 described above is prevented. Therefore, it is possible to prevent the sealing performance of the housing 61 from increasing, and since the diffusion of the atmosphere to the outside of the gap R3 and the housing 61 is possible, it is considered possible to suppress the release of particles from the gaps R1 and R2 described above.

[0060] Also, in eliminating the relationship E'x + E'z < E'y, which is the condition of Evaluation Test 3-4 described above, E'x + E'z > Ey may be set. This means that, as in the setting in Evaluation Test 3-2, the width L3 of the gap R3 is not made a reduced value only. That is, the width L3 of the gap R3 is set to be larger than the widths L1 and L2 of the gaps R1 and R2. Thereby, the speed of the atmosphere in the gap R3 can be reduced, and the release of particles from the gaps R1 and R2 described above can be suppressed.

[0061] Next, Evaluation Test 4 will be described. This Evaluation Test 4 is conducted as Evaluation Tests 4-1 to 4-4, performing the same tests as the above-described Evaluation Tests 3-1 to 3-4, but the detection target is not only the grit particles but all types of particles. The number of particles / loop was calculated by the same calculation method as the method for calculating the number of grit particles / loop, except that the number of all types of particles was used instead of the number of grit particles.

[0062] The box chart in Fig. 14 shows the results of Evaluation Test 4. As shown in this chart, it was confirmed that the number of particles / loop tended to be suppressed in Evaluation Tests 4-2 to 4-4 compared to Evaluation Test 4-1. Therefore, even when the widths L1 to L3 of the gaps R1 to R3 were set to 0.5 mm, which is a reduced value, it was confirmed that the increase in the risk of contamination by particles other than grit particles was suppressed. And from the results of this Evaluation Test 4, it was shown that by setting the widths L1 to L3 of the gaps R1 to R3 to values smaller than 1.0 mm, the release of various particles to the transport path 13 can be suppressed.

[0063] As described above, for the exhaust flow rates of the fans B1 to B3 of the transport mechanism F6, Ex < Ez < Ey. Thereby, the release of grit particles from each of the gaps R1 to R3 to the transport path 13 can be suppressed, and thus the adhesion of the particles to the wafer W transported on the transport path 13 can be prevented. As a result, a decrease in the yield of semiconductor products manufactured from the wafer W can be prevented.

[0064] Then, as described in Evaluation Test 3, in order to suppress the release of grease particles from the gaps R1 and R2 due to the compression of the atmosphere by the left and right drive blocks 6, Ex + Ez > Ey (that is, the sum of the first exhaust gas flow rate and the second exhaust gas flow rate is greater than the third exhaust gas flow rate). And it is also effective in suppressing the release of grease particles to make the gaps R1 to R3 smaller than 1.0 mm, which is the reduced value. Considering the results of Evaluation Test 2, these gaps R1 to R3 are preferably, for example, 0.85 mm or less, and more preferably 0.5 mm or less. Also, as described in Evaluation Test 3, regarding the widths L1 and L2 of the gaps R1 and R2, the release of the above-mentioned grease particles may be suppressed by making them smaller than the width L3 of the gap R3. Considering the results of the evaluation test for the widths L1 and L2 of the gaps R1 and R2 in this case, it is preferably, for example, 0.85 mm or less, and more preferably 0.5 mm or less.

[0065] As described above, since the other transport mechanisms F1 to F5 provided in the processing block D2 also have the same configuration as the transport mechanism F6, it is preferable to perform the same settings as those of the transport mechanism F6 for the fans B1 to B3 and the gaps R1 to R3. Also, since the transport mechanism 19 in the interface block D3 and the transport mechanism 12 in the carrier block D1 also have the same configuration as the transport mechanisms F1 to F6, it is preferable to perform the same settings as those of the transport mechanisms F1 to F6.

[0066] For the transport mechanisms 17 and 18 provided in the interface block D3, the left and right drive blocks 6 are not provided, and thus they have the same configuration as the transport mechanism F6 except that the air exhausted by the fan B2 is discharged to the outside of the apparatus. Also, for the transport mechanism 16 in the processing block D2, it has the same configuration as the transport mechanisms 17 and 18 except that the base 3 does not rotate. For these transport mechanisms 16 - 18 without the left and right drive blocks 6, the exhaust flow rate may be set to be larger for the downstream fan. Therefore, the exhaust flow rates of the fans B1 and B2 may be set such that Ex < Ez. Also, for the widths of the gaps R1 - R2 formed by each slit, for example, values smaller than 1.0 mm, which is the value shown for the transport mechanism F6, may be used.

[0067] Next, the evaluation test 5 will be described. In this evaluation test 5, as shown in FIG. 15, one end of a pipe 74 was provided on the base 3 and was made to open at one end of the slit 32A. The other end of the pipe 74 is connected to a pressure gauge 75. That is, the pressure of the slit 32A can be measured by the pressure gauge 75. Then, similar to the evaluation test 2, the width L1 of the gap R1 was set to any one of 0.5 mm, 0.7 mm, and 0.85 mm, the transport mechanism F6 was operated, and the pressure was detected.

[0068] FIG. 16 shows the results of this evaluation test 5. It can be seen that the smaller the width L1 of the gap R1, the smaller the pressure of the slit 32A, and there is a positive correlation between the width L1 and the pressure of the slit 32A. Considering the results of this evaluation test 5 and the results of the evaluation test 2 showing that the release amount of grease particles changes depending on the width L1, by detecting the pressure of the slit 32A during the operation of the transport mechanism F6, it is possible to determine whether the width L1 is appropriate (whether the positional relationship between the seal belt 23 and the housing 31 is appropriate). And the determination regarding the width L1 will be to determine whether the release amount of grease particles is abnormal.

[0069] Therefore, one end of each pipe 74 is provided so as to open at each of the slits 32A, 32B, 53, and 62 of the transfer mechanism F6. That is, in FIG. 15, an example in which one end of the pipe 74 is provided only at the slit 32A is shown, but one end of the pipe 74 is similarly provided at the other slits. Then, by means of the pressure gauges 75 connected to the other ends of the respective pipes 74, for example, the pressures at the slits 32A, 32B, 53, and 62 during the transfer of the wafer W by the transfer mechanism F6 are detected. Note that these pipes 74 and the pressure gauges 75 form a pressure detection unit, and the pressure gauges 75 transmit a signal corresponding to the detected pressure value to the control unit 10 corresponding to the determination mechanism. Then, the control unit 10 determines whether the detected values from the respective pressure gauges 75 fall within a preset allowable range, and if there is a slit outside the allowable range, notifies the user to that effect by a predetermined screen display or voice output. By adopting such a configuration, the atmosphere in the transfer path 13 is kept cleaner, and a decrease in the yield of the wafer W is more reliably prevented.

[0070] Note that it is not limited to monitoring the pressures of all the slits of the transfer mechanism F6, and the presence or absence of an abnormality may be detected by monitoring the pressures of only some of the slits. Also, the pressure detected by the pressure gauge 75 may be displayed on the monitor constituting the control unit 10, and the user of the apparatus may determine the presence or absence of an abnormality.

[0071] Incidentally, regarding the transfer mechanism F6, depending on the arrangement of the modules provided in the unit block H6, it is conceivable that the linear movement distance U2 of the lift table 4 becomes larger than the linear movement distance U3 of the frame 5. In that case, since the air compression rate becomes higher inside the housing 51 of the frame 5 than inside the housing 61 of the left and right drive blocks 6, the gap R2 is made relatively large in order to suppress the retention and backflow of air on the upstream side of the housing 51 in the exhaust passage 60, and the airtightness inside the housing 51 is relaxed. On the other hand, it is effective to increase the airtightness of the housings 31 and 51 and increase the air flow velocity in the gaps R1 and R3 to suppress the release of particles. Therefore, it is preferable to make the width L2 of the gap R2 larger than the widths L1 and L3 of the gaps R1 and R3.

[0072] Assuming that the width L2 of the gap R2 corresponds to the lifting platform 4 and the width L3 of the gap R3 corresponds to the frame 5, as for the relationship between the widths L2 and L3, it is effective to make the width corresponding to the component (lifting platform 4 or frame 5) having the larger linear movement distance among the linear movement distances U2 and U3 larger. Also, as for the relationship among the widths L1 to L3 including the width L1, it is preferable to make the width corresponding to the component having the larger linear movement distance among the linear movement distances U2 and U3 the largest.

[0073] In the above example, in the exhaust passage 60, the fans B1, B2, and B3 are respectively provided at three different positions in the flow path direction. However, it is not limited to providing them at three different positions like this. For example, a fan may also be provided in the housing 31 of the base 3 so that a total of four different positions have fans. Even in that case, for the fans at the same position in the flow path direction of the exhaust passage 60, each fan may be operated so that the exhaust flow rate of the exhaust mechanism provided on the downstream side of the exhaust passage is as large as that of the exhaust mechanism formed by grouping them together as one exhaust mechanism. Also, the exhaust mechanism is not limited to using a fan and may be constituted by a blower or the like.

[0074] Also, the frame 5 moves linearly because the guide rail 34 of the corresponding drive mechanism 63 is formed linearly. However, for example, it may be configured to move in an arc because this guide rail 34 is formed in a curved shape. Similarly, other component members other than the frame 5 are not necessarily configured to move linearly. Also, each of the above-described conveying mechanisms is not limited to being used in an air atmosphere and can be used in an atmosphere in which other types of gases such as nitrogen gas are present.

[0075] Note that the configuration of the module to be transported on the substrate is arbitrary. In addition to the resist coating and development described above, for example, modules that form a film other than the resist, modules that image the surface of the wafer W for inspection, modules that clean the front or back surface of the wafer W, etc., the wafer W can be transported. Furthermore, the transport of the wafer W, which is a circular substrate, is not limited, and this technology may be applied to a transport mechanism that transports a rectangular substrate such as a substrate for manufacturing a flat panel display.

[0076] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. Without departing from the scope and spirit of the appended claims, the above embodiments may be omitted, substituted, changed, and combined in various forms.

Explanation of Reference Numerals

[0077] B1, B2 Fans Ex, Ez Exhaust Flow Rate F6 Transport Mechanism R1, R2 Gap W Wafer 2 Holding Part 31, 41, 51 Housing 32A, 55 Slit 33A, 54 Driving Mechanism 60 Exhaust Duct

Claims

1. A first housing in which a first through-hole for communicating the inside and outside is formed and which houses a first drive mechanism therein; A substrate holding unit that holds a substrate and is connected to the first drive mechanism through the first through-hole, and that moves in a lateral direction with respect to the first housing; A second housing in which a second through-hole for communicating the inside and outside is formed and which houses a second drive mechanism for raising and lowering the first housing connected through the second through-hole therein; An exhaust passage that is formed from inside the first housing to inside the second housing, with the second housing side of the first housing and the second housing being the downstream side; A first exhaust mechanism that is provided in the first housing so as to exhaust the gas sucked from the first through-hole to the downstream side of the exhaust passage at a first exhaust flow rate and that is located in the exhaust passage; A second exhaust mechanism that is provided in the second housing on the downstream side of the first exhaust mechanism in the exhaust passage, and that exhausts the gas sucked from the second through-hole and the gas supplied from the upstream side of the exhaust passage to the downstream side of the exhaust passage at a second exhaust flow rate that is larger than the first exhaust flow rate; A substrate transfer device comprising the above.

2. A third housing that has a third through-hole formed therein for communicating the inside and outside and that houses a third drive mechanism for moving the second housing connected through the third through-hole in a lateral direction therein; The exhaust passage is formed from inside the first housing to inside the third housing, with the third housing side of the second housing and the third housing being the downstream side; The substrate transfer device according to Claim 1, further comprising a third exhaust mechanism that is provided in the third housing on the downstream side of the second exhaust mechanism in the exhaust passage, and that exhausts the gas sucked from the third through-hole and the gas supplied from the upstream side of the exhaust passage to the downstream side of the exhaust passage at a third exhaust flow rate that is larger than the second exhaust flow rate.

3. A first seal portion that overlaps the first through-hole such that a first gap is formed between the first seal portion and the outer peripheral edge of the first through-hole; A second seal portion that overlaps the second through-hole such that a second gap is formed between the second seal portion and the outer peripheral edge of the second through-hole; A third seal portion that overlaps the third through-hole such that a third gap is formed between the third seal portion and the outer peripheral edge of the third through-hole, the substrate transfer device according to Claim 2 being provided with the above.

4. The substrate transfer device according to Claim 3, wherein the sum of the first exhaust flow rate and the second exhaust flow rate is larger than the third exhaust flow rate.

5. The substrate transfer device according to claim 4, wherein the width of the first gap in the opening direction of the first through hole, the width of the second gap in the opening direction of the second through hole, and the width of the second gap in the opening direction of the second through hole are each smaller than 1.0 mm.

6. The substrate transfer device according to any one of claims 3 to 5, wherein the width of the third gap in the opening direction of the third through hole is larger than the width of the first gap in the opening direction of the first through hole and the width of the second gap in the opening direction of the second through hole.

7. The substrate transfer device according to claim 6, wherein the width of the first gap in the opening direction of the first through hole and the width of the second gap in the opening direction of the second through hole are smaller than 1.0 mm.

8. The substrate transfer device according to any one of claims 4 to 7, wherein the moving distance of the third housing by the third driving mechanism is larger than the moving distance of the first housing by the first driving mechanism and the moving distance of the second housing by the second driving mechanism.

9. If the width of the second gap in the opening direction of the second through hole corresponds to the second housing, and the width of the third gap in the opening direction of the third through hole corresponds to the third housing, For the width of the second gap and the width of the third gap, the width corresponding to the housing having the larger moving distance among the moving distance of the second housing by the second driving mechanism and the moving distance of the third housing by the third driving mechanism is larger. The substrate transfer device according to claim 3.

10. The substrate transfer device according to any one of claims 1 to 9, wherein a pressure detection unit for detecting the pressure of the first through hole or the second through hole is provided.

11. The substrate transfer device according to claim 10, further comprising a determination mechanism for determining the presence or absence of an abnormality based on the pressure detected by the pressure detection unit.

12. A first housing having a first through hole formed therein for communicating the inside and outside and having a first driving mechanism therein, A substrate holding unit that holds a substrate and is connected to the first driving mechanism through the first through hole and moves laterally with respect to the first housing, A second housing having a second through hole formed therein for communicating the inside and outside and having a second driving mechanism therein for raising and lowering the first housing connected through the second through hole, In a substrate transfer method using a substrate transfer device comprising: A step of exhausting the gas sucked from the first through-hole to the downstream side of an exhaust passage that is formed from the inside of the first housing to the inside of the second housing and has the inside of the second housing as the downstream side, by a first exhaust mechanism provided in the first housing and positioned in the exhaust passage, at a first exhaust flow rate; A step of exhausting, by a second exhaust mechanism provided in the second housing on the downstream side of the first exhaust mechanism in the exhaust passage, the gas sucked from the second through-hole and the gas supplied from the upstream side of the exhaust passage to the downstream side of the exhaust passage, at a second exhaust flow rate greater than the first exhaust flow rate; A step of detecting the pressure of the first through-hole or the second through-hole by a pressure detection unit; A step of determining the presence or absence of an abnormality based on the pressure; A substrate transfer method comprising the above steps.

Images