Tube Joining Device

Abstract

To provide a tube joint device capable of preventing a decrease in joint strength and generation of pin holes even when foreign matters remain in a lumen of a tube.SOLUTION: A control part 40 provided in a tube joint device 1, performs position changing operation which changes one or more positions of at least one of a first tube 210 and a second tube 220, a wafer 100, and a holder part 30 after cutting the first tube and the second tube so that a first route p1 where the wafer relatively approaches the first tube and the second tube when performing cutting operation, differs from a second route p2 where the wafer relatively separates away from the first tube and the second tube when performing retraction operation.SELECTED DRAWING: Figure 17

Description

[Technical Field]

[0001] The present invention relates to a tube connecting device. [Background technology]

[0002] A conventionally known technique for joining tubes having internal lumens involves cutting the ends of each tube and then pressing the cut ends together under pressure to join them. This technique is widely used in various industrial fields, and one example is its application to medical techniques such as peritoneal dialysis.

[0003] Peritoneal dialysis is a method in which a predetermined dialysis solution is introduced into the patient's body using a tube (catheter) implanted in the peritoneal cavity, and then water and waste products that have migrated into the dialysis solution are removed from the body via the peritoneum. For example, Patent Document 1 describes a tube joining device that uses a heated cutting member to cut two tubes to be joined, and then swaps the ends of the tubes to join them. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-146354 Summary of the Invention [Problem to be solved by the invention]

[0005] For example, in the lumen of a tube used to discharge the above-mentioned dialysis fluid outside the body, substances containing lipids, proteins, and the like that adhere to the inner surface of the tube may remain as foreign matter. If the tube is cut with a cutting member while foreign matter remains in the lumen, the foreign matter leaks out of the tube and adheres to the surface of the cutting member. Furthermore, if the foreign matter that has adhered to the cutting member adheres near the end of the tube during the process of cutting and joining the tubes, it may cause a decrease in the joining strength of the tube or the occurrence of pinholes.

[0006] The present invention aims to solve the above-mentioned problems and to provide a tube joining device that can prevent a decrease in joining strength and the occurrence of pinholes even when foreign matter remains in the inner cavity of the tube. [Means for solving the problem]

[0007] The tube joining device is a tube joining device that cuts a first tube and a second tube, and then swaps and joins a first cut end of the first tube and a second cut end of the second tube, and includes a tube holding unit that holds the first tube and the second tube, a holder unit that holds a cutting member that cuts the first tube and the second tube held in the tube holding unit, and a control unit that controls the operation of each unit of the device, and the control unit controls a cutting operation of bringing the cutting member relatively close to the first tube and the second tube when cutting the first tube and the second tube, and a cutting operation of bringing the cutting member relatively close to the first tube and the second tube when cutting the first tube and the second tube. a retracting operation is performed to move the cutting member relatively away from the first tube and the second tube after cutting the first tube and the second tube, and the control unit performs a position changing operation to change a position of at least one of the first tube and the second tube, the cutting member, and the holder unit after cutting the first tube and the second tube so that a first path along which the cutting member relatively approaches the first tube and the second tube during the cutting operation and a second path along which the cutting member relatively moves away from the first tube and the second tube during the retracting operation are different paths. The control unit moves the cutting member toward the first tube and the second tube along the first path during the cutting operation, and moves the cutting member away from the first tube and the second tube along the second path during the retracting operation, and after cutting the first tube and the second tube, the control unit changes the position of the cutting member and / or the holder unit so that the first path and the second path are different paths. [Effects of the Invention]

[0008] According to the tube connecting device of the present invention, even if a foreign object remains in the lumen of the tube, it is possible to prevent a decrease in the connecting strength and the occurrence of pinholes. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic perspective view of a tube connecting device according to an embodiment. [Figure 2] FIG. [Figure 3] FIG. 2 is a functional block diagram of the tube connecting device. [Figure 4] FIG. 4 is a view showing a holder part of the tube connecting device. [Figure 5] FIG. 2 is a diagram showing a rotation mechanism of the tube connecting device. [Figure 6] FIG. 2 is a diagram illustrating a first tube and a second tube. [Figure 7] FIG. 10 is a diagram for explaining the cutting and joining operation of the tube joining device. [Figure 8] FIG. 10 is a diagram for explaining the cutting and joining operation of the tube joining device. [Figure 9] FIG. 10 is a diagram for explaining the cutting and joining operation of the tube joining device. [Figure 10] FIG. 10 is a diagram for explaining the cutting and joining operation of the tube joining device. [Figure 11] FIG. 10 is a diagram for explaining the cutting and joining operation of the tube joining device. [Figure 12] FIG. 10 is a diagram for explaining the cutting and joining operation of the tube joining device. [Figure 13] 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. [Figure 14] 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. [Figure 15] 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. [Figure 16] 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. [Figure 17] 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. [Figure 18] 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. [Figure 19] FIG. 10 is a diagram for explaining a tube connecting device according to a comparative example. [Figure 20]FIG. 10 is a diagram for explaining a tube connecting device according to a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0011] 1 to 5 are diagrams illustrating the overall configuration and configuration of each part of a tube connecting device 1 according to an embodiment of the present invention. FIG. 6 is a diagram illustrating a first tube 210 and a second tube 220 that are connected by the tube connecting device 1. FIGS. 7 to 12 are diagrams illustrating, in a simplified manner, the cutting and connecting operations of the tube connecting device 1. FIGS. 13 to 20 are diagrams illustrating the effects of the tube connecting device 1 according to this embodiment and a comparative tube connecting device.

[0012] In each drawing, the front-rear direction of the tube connecting device 1 is indicated by arrow X, the left-right direction is indicated by arrow Y, and the height direction is indicated by arrow Z. The "left-right direction" is approximately the same as the direction in which the tubes 210, 220 are arranged when they are set in the tube connecting device 1 (the extension direction of the tubes 210, 220).

[0013] The drawings labeled "rotating side" in Figures 13 to 20 are schematic drawings of the wafer 100 and each tube 210, 220 as viewed from the "rotating side" indicated with an arrow in Figure 9. The drawings labeled "fixed side" in Figures 13 to 20 are schematic drawings of the wafer 100 and each tube 210, 220 as viewed from the "fixed side" indicated with an arrow in Figure 9.

[0014] <Tube joining device> The tube connecting device 1 in this embodiment is configured as a medical device that cuts and connects a first tube 210 on the peritoneal dialysis fluid bag T11 side and a second tube 220 on the peritoneal catheter T26 side of a patient (user H) undergoing peritoneal dialysis, as shown in Figure 6.

[0015] As shown in FIG. 1, the tube joining device 1 can be used in combination with a wafer cassette WC that includes a plurality of wafers 100 (corresponding to a "cutting member") to be used for cutting.

[0016] In the cutting operation of the tubes 210, 220, the tube joining device 1 presses and crushes the first tube 210 and second tube 220 set in the tube joining device 1 against each other, and then cuts (melts) them with a heated wafer 100, as shown in Fig. 9. After cutting the tubes 210, 220, the tube joining device 1 swaps the cut first end 210a of the first tube 210 with the cut second end 220a of the second tube 220, and joins (welds) the tubes 210, 220 while they are pressed against each other, as shown in Figs.

[0017] As shown in FIG. 1, the tube joining device 1 generally comprises a housing 10, a tube holding section 20 that holds the first tube 210 and the second tube 220, a holder section 30 (see FIG. 4) that holds a wafer 100 that cuts the first tube 210 and the second tube 220 held by the tube holding section 20, a control section 40 (see FIG. 3) that controls the operation of each section of the device, a lid section 50 attached to the housing 10, and a rotation mechanism 80 (see FIG. 5) that rotates the first tube 210 and the second tube 220 relative to each other after cutting.

[0018] The housing 10 is configured as a case having an approximately hexahedral upper portion and a lower portion that forms the side surfaces. Each component of the tube connecting device 1 is assembled in the housing 10.

[0019] In addition to the components described in this specification, the housing 10 can be optionally equipped with, for example, a panel with operation buttons for receiving operation instructions from the user, electrical connectors and batteries that enable the supply of power to the tube connecting device 1, and other components necessary for the operation of the tube connecting device 1.

[0020] Housing 10 is provided with a storage section 11a capable of storing wafer cassette WC, and an ejection button 11b that is operated when removing wafer cassette WC from storage section 11a. User H can set wafer cassette WC in housing 10 by inserting wafer cassette WC into storage section 11a.

[0021] The tube joining apparatus 1 has a feeder 91 (see FIG. 3) that transports the wafers 100 set in the wafer cassette WC to the cutting position Y0 of each tube 210, 220, and a heating unit 92 (see FIG. 3) that heats the wafers 100 transported to the feeder 91. After completing the cutting and joining operations, the feeder 91 moves the wafers 100 to a position where they can be removed from the housing 10 (for example, the gap 13 of the housing 10 shown in FIG. 1).

[0022] The feed unit 91 can be configured, for example, by a known transport member equipped with a feed screw mechanism or the like that pushes the rear end 106 (see FIG. 13) of the wafer 100 toward the holder unit 30 (see FIG. 4). The heating unit 92 can be configured, for example, by a known heater that supplies an electric current to the wafer to heat it.

[0023] 13, the wafer 100 may be made of a metal plate-like member having a first side surface 101, a second side surface 102, an upper end portion 103, a lower end portion 104, a leading end portion 105, and a trailing end portion 106. The wafer 100 may be made of, for example, a copper plate. However, there are no particular limitations on the specific material or shape of the wafer 100, as long as the tubes 210 and 220 can be cut from it.

[0024] As shown in Fig. 4, during the cutting and joining operation, the wafer 100 is transferred to the holder unit 30 assembled to the housing 10. The lower end 104 of the wafer 100 is supported by the main body 31 of the holder unit 30. The upper end 103 of the wafer 100 is positioned so as to be exposed from the holder unit 30. The upper end 103 of the wafer 100 functions as a cutting unit for cutting the tubes 210, 220, as shown in Fig. 13.

[0025] As shown in FIGS. 1 and 2, the tube holding portion 20 has a first holding portion 21 and a second holding portion 22 arranged at a predetermined distance in the left-right direction Y from the first holding portion 21.

[0026] As shown in FIG. 1, the first holding portion 21 is provided with a first recess 21a into which the first tube 210 can be fitted, and a second recess 21b into which the second tube 220 can be fitted.

[0027] As shown in FIG. 1, the second holding portion 22 is provided with a first recess 22a into which the first tube 210 can be fitted, and a second recess 22b into which the second tube 220 can be fitted.

[0028] When using the tube connecting device 1, the user H fits the first tube 210 into the first recess 21a of the first holding part 21 and the first recess 22a of the second holding part 22, and fits the second tube 220 into the second recess 21b of the first holding part 21 and the second recess 22b of the second holding part 22. By performing these operations, the user H can easily set the tubes 210, 220 in the housing 10.

[0029] Each of the holders 21, 22 may be provided with a sensor that detects whether or not each of the tubes 210, 220 is properly set.

[0030] The position where the wafer 100 cuts each of the tubes 210, 220 is a predetermined position between the first holding part 21 and the second holding part 22 (for example, the position Y0 shown in FIG. 2).

[0031] When the lid part 50 is closed on the housing 10, it shields the vicinity of the tube holding part 20 from the outside. When the lid part 50 is closed, the tube connecting device 1 prevents the positions where the tubes 210, 220 are cut and joined from being exposed to the outside. This allows the tube connecting device 1 to perform the cutting and joining operations in a sterile condition.

[0032] The housing 10 and the cover 50 may be provided with, for example, a locking mechanism to prevent the cover 50 from being accidentally released from the closed state.

[0033] As shown in FIG. 4, the holder part 30 includes a main body part 31 capable of holding the wafer 100, and a bearing part 33 that holds the main body part 31 of the wafer 100 so that the main body part 31 can rotate around a predetermined rotation axis A.

[0034] The holder part 30 is configured to perform ascending and descending movements in conjunction with the movement of the cam C1. In each drawing, the ascending movement of the holder part 30 and the ascending movement of the wafer 100 accompanying the ascending movement of the holder part 30 are indicated by arrow u, and the descending movement of the holder part 30 and the descending movement of the wafer 100 accompanying the descending movement of the holder part 30 are indicated by arrow d.

[0035] The holder part 30 is rotatably held via a predetermined rotation axis disposed in the bearing part 33. The cam C1 rotates when a rotational driving force is supplied from the cam motor M1. The outer peripheral surface of the cam C1 is formed in a non-circular shape. As the rotation position of the cam C1 changes, the contact position between the outer peripheral surface of the cam C1 and the holder part 30 changes. The holder part 30 moves up and down in accordance with the change in the contact position with the cam C1.

[0036] The tube joining device 1 can be configured so that the position of the holder part 30 and / or the wafer 100 can be changed after the cutting operation. The direction in which the position of the holder part 30 and / or the wafer 100 can be changed is, for example, the front-to-rear direction of the tube joining device 1 (the direction intersecting the extension direction of each tube 210, 220 set in the tube holding part 20, which is the direction of arrows X1-X2 shown in FIG. 4).

[0037] As shown in FIG. 5, the rotation mechanism 80 has a base portion 25 installed in the housing 10 and a tube housing portion 60.

[0038] 1, the base portion 25 is disposed between the first holding portion 21 and the second holding portion 22. The tube accommodating portion 60 is disposed in the lid portion 50, as shown in FIG.

[0039] When the lid portion 50 is closed on the housing 10, the tubes 210, 220 are arranged in a state where they are pressed against each other between the base portion 25 and the tube accommodating portion 60, as shown in Fig. 5. Furthermore, when the lid portion 50 is closed on the housing 10, the second holding portion 22 releases the hold of the tubes 210, 220. Therefore, after the cutting operation, the tubes 210, 220 can be rotated on the side of the second holding portion 22 (see Fig. 10).

[0040] 5, a first driven gear 25a is formed on the outer peripheral surface of the base portion 25. A second gear driven 60a is formed on the outer peripheral surface of the tube accommodating portion 60. Each of the driven gears 25a, 60a is configured to mesh with a drive gear G1 that rotates the rotation mechanism 80.

[0041] In the tube connecting device 1, a rotational driving force is applied from the gear motor M2 to the drive gear G1 when the base part 25 and the tube accommodating part 60 are combined together. When the drive gear G1 rotates, the base part 25 and the tube accommodating part 60 rotate in conjunction with the rotation of the drive gear G1, and accordingly, the tubes 210, 220 arranged in the base part 25 and the tube accommodating part 60 rotate. In each drawing, the rotational movement of each tube 210, 220 is indicated by an arrow r.

[0042] 2 and 9, the portion of each tube 210, 220 that is rotated is one side (the side indicated by the arrow Y1 in FIG. 2) that is located on the second holding unit 22 side. In the tube joining device 1 according to this embodiment, the other side of each tube 210, 220, indicated by the arrow Y2 in FIG. 2, is a portion that is not rotated before or after the cutting and joining operation.

[0043] As shown in FIGS. 1 and 8, the tube connecting device 1 has a fixed tube pressing section 70 that maintains the tubes 210, 220 held by the first holding section 21 in a pressed state against each other.

[0044] The fixed-side tube pressing portion 70 can be configured to maintain the tubes 210, 220 pressed against each other when the lid portion 50 is closed. The fixed-side tube pressing portion 70 can be disposed near the first holding portion 21 of the housing 10, for example.

[0045] The control unit 40 can be configured with a microcomputer or the like. The control unit 40 has a CPU and a storage unit that stores the control program for the entire device executed by the CPU and various data. The storage unit can be configured with a ROM, RAM, etc.

[0046] In the tube connecting device 1 according to this embodiment, the control unit 40 controls operations such as a "cutting operation," a "retracting operation," and a "position changing operation," which will be described later.

[0047] The first tube 210 and the second tube 220 can be made of, for example, a resin tube having lumens 211, 221 (see FIG. 13) through which a fluid containing a biological component can flow. Each of the tubes 210, 220 can be made of, for example, a polyvinyl chloride tube. However, the material of each of the tubes 210, 220 is not limited as long as it can be joined to each other by cutting and applying pressure. For example, each of the tubes 210, 220 may be made of a different material. Furthermore, there are no particular limitations on the outer diameter, cross-sectional shape, etc. of each of the tubes 210, 220.

[0048] As shown in Fig. 6, the first tube 210 is formed by a tube on the dialysate bag T11 side of the peritoneum. A predetermined connector T12 is attached to the tip of the first tube 210. The dialysate tube T14 of the dialysate bag T11 is connected to the other side of the tip of the first tube 210 via a branch pipe T13. The first tube 210 is also connected to a drainage tube T16 of a drainage bag T15 via the branch pipe T13.

[0049] The second tube 220 is configured by a tube that is placed on the side of the peritoneal catheter T26 of the user H that is used during peritoneal dialysis. Specifically, the second tube 220 includes an extension tube T21 and a protective tube T22. The extension tube T21 is connected to the peritoneal catheter T26 via a connecting tube T23, a silicone tube T24, and a catheter joint T25. One end of the peritoneal catheter T26 can be inserted into the abdominal cavity of the user H.

[0050] The flow of cutting and joining operations performed by the tube joining device 1 will be outlined with reference to FIGS.

[0051] When starting to join tubes using the tube joining device 1, the user H sets the tubes 210, 220 in the first holding part 21 and the second holding part 22, respectively, as shown in FIG.

[0052] After setting the tubes 210, 220, the user H closes the lid part 50. When the lid part 50 is closed, the tubes 210, 220 are pressed against each other by the fixed side tube pressing part 70 and the rotation mechanism 80, as shown in FIG.

[0053] The user H operates various buttons on the operation panel arranged on the housing 10 to instruct the control unit 40 to execute the cutting and joining work.

[0054] When the control unit 40 receives an instruction from the user H, as shown in FIG. 9, the control unit 40 moves the wafer 100 closer to each of the tubes 210, 220, and cuts each of the tubes 210, 220.

[0055] As shown in FIG. 10, after cutting each tube 210, 220, the control unit 40 drives the rotation mechanism 80 to rotate each tube 210, 220 so that the positions of the cut first end 210a of the first tube 210 and the cut second end 220a of the second tube 220 are swapped.

[0056] 11, after cutting each of the tubes 210, 220, the control unit 40 moves the wafer 100 away from the cutting position Y0. The control unit 40 presses and joins each end 210a, 220a of each of the tubes 210, 220 that has been released from the second holding unit 22 against each of the tubes 210, 220 that has not been rotated.

[0057] After the ends 210a, 210b of the tubes 210, 220 have been swapped and joined, user H can pull the joint located on the outer surface of each tube 210, 220 with his / her fingers or the like to separate the tubes 210, 220, as shown in Figure 12.

[0058] When the joining operation is completed, the side of the first tube 210 connected to the connector T12 remains joined to the second tube 220 via the second end 220a of the second tube 220. In addition, the second tube 220 connected to the peritoneal catheter T26 remains joined to the side of the first tube 210 connected to the branch pipe T13 via the first end 210a of the first tube 210.

[0059] Next, the control contents by the control unit 40 and the effects of the present embodiment will be described with reference to FIGS.

[0060] Figures 13 to 20 illustrate a state in which, before the cutting-connecting operation is performed by the tube connecting device 1, peritoneal fluid has already been discharged through the first tube 210, and as a result, foreign matter S derived from the living body (for example, a solidified liquid substance containing lipids, proteins, etc.) remains near the cutting position Y0 in the inner cavity 211 of the first tube 210.

[0061] As shown in FIG. 13, when cutting the first tube 210 and the second tube 220, the control unit 40 performs a cutting operation of bringing the wafer 100 relatively close to the first tube 210 and the second tube 220.

[0062] Specifically, during the cutting operation, the control unit 40 moves the wafer 100 toward the first tube 210 and the second tube 220 along a predetermined first path p1. At this time, the control unit 40 performs a lifting operation to lift the holder unit 30 along the first path p1 (see FIG. 4).

[0063] 14, when the first tube 210 and the second tube 220 are cut by the wafer 100, foreign matter S may leak from the inner cavity 211 of the first tube 210. Furthermore, the leaked foreign matter S may adhere to each side surface 101, 102 of the wafer 100 that comes into contact with the cut surface of the first tube 210 during the cutting operation.

[0064] 15 , after cutting the first tube 210 and the second tube 220, the control unit 40 rotates each tube 210, 220 to swap the positions of the first end 210a and the second end 220a (the rotation of each tube 210, 220 is indicated by arrow r). When the control unit 40 rotates the first tube 210 and the second tube 220, a portion of the foreign matter S attached to the second side surface 102 located on the side in contact with the cut first end 210a of the first tube 210 and the cut second end 220a of the second tube 220 is dispersed onto the wafer 100 as each tube 210, 220 rotates, thereby being removed or thinned. However, a portion of the foreign matter S located outside the range of rotation of each tube 210, 220 (the portion attached to the rear side of the tube joining device 1, the side indicated by arrow X1 in FIG. 4 ) remains on the second side surface 102 of the wafer 100. Furthermore, more foreign matter S remains on the other side of the first tube 210 and the second tube 220, that is, on the first side surface 101 located on the side on which no rotation operation is performed after cutting, than on the second side surface 102.

[0065] 19 and 20 , if the wafer 100 is retracted from each tube 210, 220 along the second path p2, which is the same as the first path p1, after the cutting operation while foreign matter S is attached to each side surface 101, 102, the foreign matter S attached to each side surface 101, 102 will end up adhering to the outer surface of each tube 210, 220. If the tubes 210, 220 are joined together while foreign matter S is attached to the outer surface of each tube 210, 220, the foreign matter S may get into the joint located at the end face of each tube 210, 220 or may hinder the formation of the joint. This reduces the strength of the joint and increases the possibility of pinholes occurring. In particular, in the portion where the foreign matter S was not removed when the first tube 210 was rotated (the portion on the rear side of the tube connecting device 1), more foreign matter S that had migrated from the first side surface 101 to each tube 210, 220 and more foreign matter S that had migrated from the second side surface 102 to each tube 210, 220 gather, making it more likely that the above-mentioned pinholes will occur.

[0066] In the tube connecting device 1 according to this embodiment, in order to prevent a decrease in the connecting strength or the occurrence of pinholes due to the foreign matter S as described above, the control unit 40 performs a "position change operation" which will be described below.

[0067] After cutting the first tube 210 and the second tube 220, the control unit 40 performs a position change operation (operation indicated by arrow m1 in the figure) to change the position of at least one of the first tube 210 and the second tube 220, the wafer 100, and the holder unit 30, as shown in Figure 17, so that the first path p1, along which the wafer 100 moves relatively closer to the first tube 210 and the second tube 220 during the cutting operation, and the second path p2, along which the wafer 100 moves relatively away from the first tube 210 and the second tube 220 during the retraction operation, are different paths.

[0068] In this embodiment, in the position change operation, the wafer 100 is moved toward the rear side of the tube bonding apparatus 1 (the side in the direction intersecting the extending direction of the first tube 210 and the second tube 220, the side of the arrow X1 in FIG. 4).

[0069] There are no particular limitations on the members to be moved during the position change operation and the direction of movement, as long as the first path p1 and the second path p2 are different paths. Also, there are no particular limitations on the specific paths, as long as the first path p1 and the second path p2 are different paths.

[0070] As shown in FIG. 18, after performing the position change operation, the control unit 40 performs a retraction operation to relatively separate the wafer 100 from the first tube 210 and the second tube 220.

[0071] Specifically, during the retraction operation, the control unit 40 separates the wafer 100 from the first tube 210 and the second tube 220 along a predetermined second path p2 different from the first path p1. At this time, the control unit 40 performs a lowering operation to lower the holder unit 30 along the second path p2 (see FIG. 4).

[0072] 18, by making the second path p2 a different path from the first path p1, it is possible to prevent foreign matter S adhering to each side surface 101, 102 of the wafer 100 from coming into contact with each tube 210, 220 during the retraction operation. Therefore, it is possible to prevent the foreign matter S from getting into the bonded portion during the bonding operation that follows the cutting operation. This makes it possible to effectively prevent a decrease in bonding strength and the occurrence of pinholes.

[0073] As described above, when the tube joining device 1 rotates the first tube 210, it is possible to remove or thin out a part of the foreign matter S attached to the wafer 100 by diffusing it as the first tube 210 rotates (see FIG. 15). Therefore, the control unit 40 can rotate the first tube 210 multiple times within a range of rotation angles that satisfies the following formula (1), for example: Rotation angle θ [°] = 180 × 360 × n Equation (1) Here, n is an integer of 1 or more.

[0074] The control unit 40 can swap the positions of the first end 210a of the first tube 210 and the second end 220a of the second tube 220 by rotating one side of the first tube 210 and the second tube 220 by 180°. Furthermore, the control unit 40 can increase the rotation angle based on the above formula (1) so that one side of each tube 210, 220 becomes 180°, 540° (=180°+360°), 900° (=180°+360°+360°), etc., thereby removing or thinning the foreign matter S by diffusing it on the wafer 100 through multiple rotations.

[0075] In the above formula (1), if the number of rotations of the first tube 210 and the second tube 220 becomes excessively large, the twisting of the first tube 210 and the second tube 220 after joining may cause crushing of the inner lumens 211 and 221 of each tube 210 and 220. Therefore, in the above formula (1), it is preferable that n≦4 (a range in which the positions of the first end 210a and the second end 220a are interchanged five times).

[0076] As described above, the tube joining apparatus 1 according to this embodiment is a tube joining apparatus that cuts the first tube 210 and the second tube 220, and then swaps and joins the cut first end 210a of the first tube 210 with the cut second end 220a of the second tube 220. The tube joining apparatus 1 includes a tube holding unit 20 that holds the first tube 210 and the second tube 220, a holder unit 30 that holds a wafer 100 that cuts the first tube 210 and the second tube 220 held by the tube holding unit 20, and a control unit 40 that controls the operation of each unit of the apparatus. The control unit 40 performs a cutting operation that brings the wafer 100 relatively close to the first tube 210 and the second tube 220 when cutting the first tube 210 and the second tube 220, and a retraction operation that moves the wafer 100 relatively away from the first tube 210 and the second tube 220 after cutting the first tube 210 and the second tube 220. Then, after cutting the first tube 210 and the second tube 220, the control unit 40 performs a position change operation to change the position of at least one of the first tube 210 and the second tube 220, the wafer 100, and the holder unit 30 so that the first path p1, along which the wafer 100 moves relatively closer to the first tube 210 and the second tube 220 during the cutting operation, and the second path p2, along which the wafer 100 moves relatively away from the first tube 210 and the second tube 220 during the retraction operation, are different paths.

[0077] According to the tube joining device 1 configured as described above, the first path p1 and the second path p2 are different paths, which prevents the foreign matter S adhering to each side surface 101, 102 of the wafer 100 from coming into contact with each tube 210, 220 during the retraction operation. Therefore, it is possible to prevent the foreign matter S from getting into the joining portion during the joining operation that follows the cutting operation. This effectively prevents a decrease in joining strength and the occurrence of pinholes.

[0078] Furthermore, the control unit 40 moves the wafer 100 toward the first tube 210 and the second tube 220 along the first path p1 during the cutting operation, and moves the wafer 100 away from the first tube 210 and the second tube 220 along the second path p2 during the retraction operation. After cutting the first tube 210 and the second tube 220, the control unit 40 changes the position of the wafer 100 and / or the holder unit 30 so that the first path p1 and the second path p2 are different paths. With the tube joining device 1 configured in this manner, changing the position of the wafer 100 and / or the holder unit 30 during the position changing operation can more reliably set the first path p1 and the second path p2 to be different paths. This more effectively prevents a decrease in joining strength and the occurrence of pinholes.

[0079] Furthermore, the control unit 40 performs an ascending operation to raise the holder unit 30 along the first path p1 during the cutting operation, and performs a descending operation to lower the holder unit 30 along the second path p2 during the retreating operation. After cutting the first tube 210 and the second tube 220, the control unit 40 moves the wafer 100 and / or the holder unit 30 in a direction intersecting the extension direction of the first tube 210 and the second tube 220 so that the first path p1 and the second path p2 are different paths. With the tube joining device 1 configured in this manner, when the wafer 100 and the holder unit 30 are moved along the second path p2, foreign matter S attached to the rear portion of the wafer 100 relative to the tube joining device 1 can be prevented from adhering to each tube 210, 220. This more effectively prevents a decrease in joining strength and the occurrence of pinholes.

[0080] The tube joining apparatus 1 also includes a rotation mechanism 80 that rotates the first tube 210 and the second tube 220 to swap the relative positions of the cut first end 210a and the cut second end 220a. After cutting the first tube 210 and the second tube 220, the control unit 40 rotates the first tube 210 and the second tube 220 and then performs a position change operation. With the tube joining apparatus 1 configured in this manner, the rotation of the first tube 210 and the second tube 220 removes or thins a portion of the foreign matter S attached to the wafer 100, and then performs the position change operation and joining operation. This makes it possible to more effectively prevent a decrease in joining strength and the occurrence of pinholes.

[0081] Furthermore, the control unit 40 rotates the first tube 210 and the second tube 220 within a range of rotation angles that satisfies the following formula (1): Rotation angle θ [°] = 180 + 360 × n Equation (1) Here, n is an integer of 1 or more.

[0082] According to the tube bonding apparatus 1 configured as described above, by rotating the first tube 210 and the second tube 220 multiple times, the foreign matter S adhering to the wafer 100 can be effectively removed or thinned during the rotation operation. Therefore, it is possible to more effectively prevent a decrease in bonding strength and the occurrence of pinholes.

[0083] Furthermore, the wafer 100 is a plate-shaped metal wafer that is heated during cutting, and the first tube 210 and the second tube 220 are resin tubes having lumens 211, 221 through which a fluid containing biological components can flow. Therefore, the tube connecting device 1 can prevent a decrease in connecting strength and the occurrence of pinholes in tubes for medical applications such as those used for peritoneal dialysis.

[0084] Although the tube connecting device according to the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the claims.

[0085] For example, the application of the present invention is not limited to peritoneal dialysis. As an example, the present invention can be applied to a device that joins a tube connected to a container (bag) that contains blood products used for transfusions with another tube. As another example, the present invention can be applied to a device that joins a tube connected to a container (bag) that contains a cell culture solution containing various collected and cultured cells with another tube.

[0086] Furthermore, the tube joining device of the present invention is not particularly limited in terms of the specific device configuration, control content, control procedure, etc., as long as it is configured to prevent a decrease in joining strength or the occurrence of pinholes by performing a predetermined position change operation after cutting the first tube and the second tube. [Explanation of symbols]

[0087] 1 Tube joining device 10. Cabinet 20 Tube holding part 21 1st holding part 22 Second holding part 30 Holder part 40 Control Unit 50 Lid 80 Rotation mechanism 100 wafers (cutting material) 210 1st Tube 210a Cut first end 211 Lumen of first tube 220 2nd Tube 220a Cut second end 221 Lumen of second tube p1 1st pathway p2 Alternative pathway

Claims

1. A tube joining device that cuts a first tube and a second tube, and then joins the first end of the first tube and the second end of the second tube by swapping them, a tube holding portion that holds the first tube and the second tube; a holder portion for holding a cutting member for cutting the first tube and the second tube held by the tube holding portion; a control unit that controls the operation of each unit of the device, the control unit performs a cutting operation of moving the cutting member relatively close to the first tube and the second tube when cutting the first tube and the second tube, and a retraction operation of moving the cutting member relatively away from the first tube and the second tube after cutting the first tube and the second tube, the control unit performs a position change operation to change the position of at least one of the first tube and the second tube, the cutting member, and the holder unit after cutting the first tube and the second tube so that a first path along which the cutting member relatively approaches the first tube and the second tube during the cutting operation and a second path along which the cutting member relatively moves away from the first tube and the second tube during the retracting operation are different paths; The control unit During the cutting operation, the cutting member is moved toward the first tube and the second tube along the first path, and during the retracting operation, the cutting member is moved away from the first tube and the second tube along the second path, The control unit A tube joining device that changes the position of the cutting member and / or the holder portion after cutting the first tube and the second tube so that the first path and the second path are different paths.

2. The control unit an ascending operation of ascending the holder part along the first path during the cutting operation, and a descending operation of descending the holder part along the second path during the retreating operation; The control unit 2. The tube joining device of claim 1, wherein after cutting the first tube and the second tube, the position of the cutting member and / or the holder portion is moved in a direction intersecting the extension direction of the first tube and the second tube so that the first path and the second path are different paths.

3. a rotation mechanism that rotates the first tube and the second tube to interchange the relative positions of the cut first end and the cut second end; 3. The tube joining device according to claim 1, wherein the control unit rotates the first tube and the second tube after cutting the first tube and the second tube, and then performs the position change operation.

4. The tube connecting device according to claim 3 , wherein the control unit controls the rotation mechanism to rotate the first tube and the second tube within a range of rotation angles that satisfies the following formula (1): Rotation angle θ [°] = 180 + 360 × n ... Equation (1) Here, n is an integer of 1 or more.

5. the cutting member is a plate-shaped metal wafer that is heated during cutting; 5. The tube connecting device according to claim 1, wherein the first tube and the second tube are resin tubes having an inner cavity through which a fluid containing a biological component can flow.

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