Liquid jet head and liquid jet apparatus

Abstract

To provide a liquid jet head which can be produced at low costs and having a closed dummy flow passage.SOLUTION: A liquid jet head is provided. The liquid jet head includes: a liquid passage including nozzles forming nozzle arrays which jet a liquid; a dummy flow passage including dummy nozzles forming dummy nozzle arrays which do not jet the liquid; and a closing part which is formed by an adhesive and closes the dummy flow passage.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. [Background technology]

[0002] Regarding a liquid jet head provided in a liquid jet device such as a printer, Patent Document 1 discloses a liquid jet head having flow paths used for jetting liquid and dummy flow paths not used for jetting liquid. The liquid jet head has a nozzle plate in which nozzles communicating with the flow paths are formed. This nozzle plate does not have dummy nozzles formed therein that correspond to the dummy flow paths, and the dummy flow paths are blocked by the nozzle plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-82412 Summary of the Invention [Problem to be solved by the invention]

[0004] There is a demand for low-cost manufacturing of liquid jet heads that use a reduced number of nozzles according to the specifications of the liquid jet device. In this case, it is conceivable to convert some of the flow paths of an existing liquid jet head that does not have dummy flow paths into dummy flow paths and then block the dummy flow paths. However, in Patent Document 1, in order to block the dummy flow paths, a new nozzle plate having a portion where no nozzle holes are formed must be manufactured, which could increase costs accordingly. [Means for solving the problem]

[0005] According to a first aspect of the present disclosure, there is provided a liquid jet head comprising: a liquid flow path including a plurality of nozzles constituting a nozzle row that ejects liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; and a blocking portion formed of an adhesive that blocks the dummy flow path.

[0006] According to a second aspect of the present disclosure, there is provided a liquid ejecting apparatus, comprising: the liquid ejecting head of the above aspect; and a liquid storage unit that stores liquid to be supplied to the liquid ejecting head. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram illustrating a general configuration of a liquid ejecting apparatus. [Figure 2] FIG. 1 is an exploded perspective view illustrating a schematic configuration of a liquid jet head. [Figure 3] FIG. 1 is a cross-sectional view schematically illustrating a general configuration of a liquid jet head according to a first embodiment. [Figure 4] FIG. 2 is an exploded perspective view showing the configuration of a head chip. [Figure 5] 5 is a VV cross-sectional view of the head chip in FIG. 4. [Figure 6] 3A and 3B are schematic diagrams illustrating scanning of a liquid jet head. [Figure 7] FIG. 10 is a cross-sectional view schematically illustrating a schematic configuration of a liquid jet head according to a second embodiment. [Figure 8] FIG. 10 is a cross-sectional view schematically illustrating a general configuration of a liquid jet head according to a third embodiment. [Figure 9] FIG. 10 is a cross-sectional view schematically illustrating a schematic configuration of a liquid jet head according to a fourth embodiment. [Figure 10] FIG. 10 is a cross-sectional view schematically illustrating a schematic configuration of a liquid jet head according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] A. First embodiment: FIG. 1 is a schematic diagram illustrating a schematic configuration of a liquid ejection device 300 including a liquid ejection head 100 according to a first embodiment of the present disclosure. FIG. 1 depicts arrows along mutually orthogonal X, Y, and Z directions. The X, Y, and Z directions are directions along the X, Y, and Z axes, which are three mutually orthogonal spatial axes, and each direction includes both a direction on one side of the X, Y, and Z axes and a direction opposite thereto. Specifically, the positive directions along the X, Y, and Z axes are the +X, +Y, and +Z directions, respectively, and the negative directions along the X, Y, and Z axes are the -X, -Y, and -Z directions, respectively. In FIG. 1, the directions from the base end to the tip end of each arrow indicating the X, Y, and Z directions are the positive directions along the X, Y, and Z axes, respectively. Note that in FIG. 1, the X and Y axes are axes along a horizontal plane, and the Z axis is an axis along a vertical line. Therefore, in this embodiment, the -Z direction is the direction of gravity. Arrows along the X, Y, and Z directions are also shown in other figures as appropriate. The X, Y, and Z directions in FIG. 1 and the X, Y, and Z directions in other figures represent the same directions. Hereinafter, the +Z direction will also be referred to as "up" and the -Z direction will also be referred to as "down." Furthermore, in this specification, "orthogonal" includes a range of 90°±10°.

[0009] The liquid ejection device 300 is an inkjet printer that prints an image on a medium P by ejecting ink as a liquid. The liquid ejection device 300 prints an image on the medium P by ejecting ink onto the medium P, such as paper, based on print data that indicates the on / off status of dots on the medium P, and forming dots at various positions on the medium P. In addition to paper, the medium P can be any material that can hold liquid, such as plastic, film, fiber, fabric, leather, metal, glass, wood, or ceramics. In addition to ink, the liquid ejection device 300 can use any liquid, such as various coloring materials, electrode materials, biological organic or inorganic samples, lubricating oils, resin liquids, or etching solutions.

[0010] The liquid ejection device 300 includes a liquid ejection head 100 having a plurality of nozzle holes 21 formed therein, a cap 110, a suction pump 130, a liquid storage section 310, a head moving mechanism 320, a conveying mechanism 330 for feeding out the medium P, and a control section 500.

[0011] The liquid storage unit 310 stores the ink to be ejected from the liquid jet head 100. The type of ink stored in the liquid storage unit 310 may be one type or multiple types. The liquid storage unit 310 may be, for example, a bag-shaped liquid pack made of a flexible film, a cartridge that is detachable from the liquid jet device 300, an ink tank, or the like. In this embodiment, the liquid storage unit 310 is mounted on a carriage 323 together with the liquid jet head 100.

[0012] The control unit 500 is configured by a computer having one or more processors, a main memory device, and an input / output interface for inputting and outputting signals from and to the outside. The control unit 500 controls each mechanism provided in the liquid ejection device 300 in accordance with the print data, thereby ejecting ink from the liquid ejection head 100 onto the medium P and printing an image on the medium P. In other words, the control unit 500 controls the ejection operation of the liquid ejection head 100 to eject liquid.

[0013] The head moving mechanism 320 includes a drive motor 321, a drive belt 322, and a carriage 323 that houses the liquid jet head 100. The head moving mechanism 320 transmits the driving force of the drive motor 321 to the carriage 323 via the drive belt 322, and moves the carriage 323 back and forth along the main scanning direction together with the liquid jet head 100. In this embodiment, the main scanning direction is the direction along the Y direction.

[0014] The liquid jet head 100 has a nozzle row 25 that ejects liquid and a dummy nozzle row 26 that does not eject liquid. The nozzle row 25 is made up of a plurality of nozzles 22. The nozzles 22 refer to the nozzle holes 21 that eject liquid. As shown in FIG. 1 , in this embodiment, one nozzle row 25 is made up of a plurality of nozzles 22 lined up along the X direction. The dummy nozzle row 26 is made up of a plurality of dummy nozzles 23. The dummy nozzles 23 refer to the nozzle holes 21 that do not eject liquid. One dummy nozzle row 26 is made up of a plurality of dummy nozzles 23 lined up along the X direction. Hereinafter, when there is no need to distinguish between the nozzle row 25 and the dummy nozzle row 26, both may be referred to as the nozzle hole row 24.

[0015] The openings of the nozzles 22 and the openings of the dummy nozzles 23 are formed on the ejection surface 19 of the liquid ejection head 100. The ejection surface 19 in this embodiment is formed by the lower surface of a nozzle plate 160 and the lower surface of a fixing plate 250, which are shown in FIG. 2 and other drawings, which will be described later.

[0016] The liquid jet head 100, while being reciprocated in the main scanning direction by the head moving mechanism 320, jets liquid supplied from the liquid storage unit 310 in the form of droplets through the nozzles 22 onto the medium P, which is being transported by the transport mechanism 330 along a sub-scanning direction that intersects the main scanning direction. In this embodiment, the sub-scanning direction is a direction along the X direction, which is perpendicular to the main scanning direction. In other embodiments, the main scanning direction and the sub-scanning direction do not have to be perpendicular to each other. Furthermore, the liquid jet device 300 of this embodiment is a serial printer in which the liquid jet head 100 is transported in the Y direction. However, in other embodiments, the liquid jet device 300 may be a line printer in which the liquid jet head 100 is fixed and the nozzles 22 are arranged across the entire width of the medium P. The number of liquid jet heads 100 provided in the liquid jet device 300 may be one or more than two.

[0017] The cap 110 and suction pump 130 are disposed at a home position H in a non-printing region of the liquid ejection device 300, which is a region where the medium P is not disposed. In this embodiment, the cap 110 has a concave shape that opens toward the +Z direction. The cap 110 is configured to be movable up and down by a cap movement mechanism (not shown). The cap 110 has a liquid absorbent material 116 disposed at the bottom of the opening. The liquid absorbent material 116 is made of, for example, a hydrophilic foam resin, and absorbs the liquid discharged from the nozzle 22 to the outside.

[0018] The cap 110 is configured to be able to cap the openings of the nozzles 22 and the dummy nozzles 23. Capping refers to forming a closed space between the ejection surface 19 and the cap 110, in which the openings of the nozzles 22 and the dummy nozzles 23 are open, by covering at least a portion of the ejection surface 19. More specifically, the cap 110 is moved in the +Z direction by the cap moving mechanism toward the ejection surface 19 of the liquid ejection head 100 positioned at the home position H, and the upper end of the edge of the cap 110 comes into close contact with the ejection surface 19, thereby forming a closed space between the cap 110 and the ejection surface 19. This caps the openings of the nozzles 22 and the dummy nozzles 23. Hereinafter, a state in which the openings of the nozzles 22 and the dummy nozzles 23 are capped may also be referred to as a capped state.

[0019] The suction pump 130 sucks the liquid in the closed space formed by capping through a suction tube (not shown). The liquid sucked by the suction pump 130 is discharged into a waste liquid tank (not shown). The control unit 500 drives the suction pump 130 to perform suction cleaning as appropriate when printing an image on the medium P, or in response to a predetermined operation by the user. Suction cleaning refers to an operation in which, in the capping state, negative pressure is generated in the closed space formed, and air bubbles and foreign matter contained in the liquid are sucked from the liquid ejection head 100 through the nozzles 22.

[0020] Fig. 2 is an exploded perspective view showing a schematic configuration of the liquid jet head 100. Fig. 3 is a cross-sectional view showing a schematic configuration of the liquid jet head 100. In addition to the liquid jet head 100, Fig. 3 also shows a schematic view of the cap 110 described above and a closed space CL formed between the cap 110 and the ejection surface 19. The liquid jet head 100 in this embodiment includes a plurality of head chips 150, a holder 200 that holds the plurality of head chips 150, and a fixing plate 250.

[0021] As shown in FIG. 3, the liquid jet head 100 includes a liquid flow path 50, a dummy flow path 56, and a blocking section 101. The liquid flow path 50 refers to a flow path including a plurality of nozzles 22 that constitute the nozzle row 25. Liquid supplied from a liquid storage section 310 flows in the liquid flow path 50. The dummy flow path 56 refers to a flow path including a plurality of dummy nozzles 23 that constitute the dummy nozzle row 26. The dummy flow path 56 in this embodiment is not supplied with liquid from the liquid storage section 310. Therefore, in this embodiment, no liquid flows in the dummy flow path 56. The liquid jet head 100 in this embodiment includes six liquid flow paths 50 and two dummy flow paths 56 that are arranged side by side along the Y direction. The two dummy flow paths 56 are arranged in the +Y direction with respect to the six liquid flow paths 50 that are arranged adjacent to each other, and are also arranged adjacent to each other.

[0022] The dummy flow paths 56 are blocked by blocking portions 101. The blocking portions 101 refer to portions formed with an adhesive that block the dummy flow paths 56. In this embodiment, the blocking portions 101 are formed with first adhesive portions 102. The first adhesive portions 102 refer to portions formed with an adhesive that join the first flow path member and the second flow path member together. The first flow path member refers to a member on which a first dummy portion 53, which is a part of the dummy flow path 56, is formed. The second flow path member refers to a member on which a second dummy portion 54, which is a part of the dummy flow path 56, is formed and is stacked on the first flow path member. The second dummy portion 54 is a portion of the dummy flow path 56 upstream of the first dummy portion 53. The upstream of the dummy flow path 56 refers to the side of the dummy flow path 56 opposite the downstream dummy nozzle row 26, and in this embodiment, refers to the side of a connection portion 241 of a holder 200, which will be described later. In other words, the second dummy portion 54 can also be said to be a portion of the dummy flow path 56 that is farther from the dummy nozzle row 26 than the first dummy portion 53.

[0023] In this embodiment, a first case portion 194 of a first head chip 151 (described later) corresponds to the first flow path member, and a flow path forming portion 245 of a holder 200 (described later) corresponds to the second flow path member. Two first dummy portions 53, which are parts of the two dummy flow paths 56 described above, are formed in the first case portion 194. Two second dummy portions 54, which are parts of the two dummy flow paths 56, are formed in the flow path forming portion 245 stacked on the first case portion 194. In this embodiment, two first adhesive portions 102 are provided between the first case portion 194 and the flow path forming portion 245. Each first adhesive portion 102 forms a blocking portion 101 that blocks each dummy flow path 56 between the corresponding first dummy portion 53 formed in the first case portion 194 and the corresponding second dummy portion 54 formed in the flow path forming portion 245. In this embodiment, the first adhesive portion 102 and the blocking portion 101 are made of a silicone adhesive. In other embodiments, the first adhesive portion 102 and the blocking portion 101 may be made of another adhesive, such as an epoxy adhesive.

[0024] Hereinafter, the direction in which the second flow path member is stacked on the first flow path member may be referred to as the stacking direction. In this embodiment, the direction in which the flow path forming portion 245 is stacked on the first case portion 194 corresponds to the stacking direction. The stacking direction includes both a direction on one side along the same axis and a direction opposite to the direction, and in this embodiment, it is a direction along the Z direction.

[0025] In this embodiment, the second flow path member is laminated not only on the first flow path member described above but also on the third flow path member. The third flow path member refers to a member in which the first portion 51, which is a part of the liquid flow path 50, is formed. In addition to the second dummy portion 54 described above, the second flow path member in this embodiment also has the second portion 52, which is a part of the liquid flow path 50, formed therein. The second portion 52 is a part of the liquid flow path 50 and refers to a portion of the liquid flow path 50 that is farther from the nozzle row 25 than the first portion 51. A third adhesive portion 104 is provided between the second flow path member and the third flow path member. The third adhesive portion 104 is made of an adhesive and refers to a portion between the second flow path member and the third flow path member that joins the second flow path member and the third flow path member. The third adhesive portion 104 forms a second connection flow path 62 that connects the first portion 51 and the second portion 52. In this embodiment, the third adhesive portion 104 is made of a silicone adhesive, just like the first adhesive portion 102. In other embodiments, the third adhesive portion 104 may be made of, for example, an epoxy adhesive.

[0026] In this embodiment, the second case portion 195 of the second head chip 152 and the third case portions 196 of the two third head chips 153, which will be described later, each correspond to a third flow path member. Two first portions 51 of the liquid flow path 50 described above are formed in each of the second case portion 195 and the two third case portions 196. A total of six second portions 52 are formed in the flow path forming portion 245. In this embodiment, two third adhesive portions 104 are provided between the second case portion 195 and the flow path forming portion 245, and two third adhesive portions 104 are provided between each of the third case portions 196 and the flow path forming portion 245, for a total of six. Each third adhesive portion 104 forms a second connection flow path 62 that connects the first portions 51 formed in the second case portion 195 and the two third case portions 196 to the second portions 52 formed in the flow path forming portion 245.

[0027] As shown in FIGS. 2 and 3 , the liquid jet head 100 in this embodiment includes four head chips 150 arranged along the Y direction. The first head chip 151 described above refers to the head chip 150 of the four head chips 150 that is located furthest in the +Y direction. The second head chip 152 refers to the head chip 150 that is located furthest in the -Y direction. The third head chip 153 refers to each of the two head chips 150 arranged between the first head chip 151 and the second head chip 152. In this embodiment, the configuration of the third head chip 153 is similar to that of the second head chip 152. Hereinafter, when there is no need to distinguish between the first head chip 151, the second head chip 152, and the third head chip 153, they may each be simply referred to as head chips 150.

[0028] Each head chip 150 has a common structure and includes a wiring substrate 121, a nozzle plate 160, and a chip main body 170. Chip main body 170 has a case 193. Note that wiring substrate 121 is omitted from FIG. 3. Also, FIGS. 2 and 3 show a simplified configuration of chip main body 170. The above-mentioned first case 194 refers to case 193 of first head chip 151. Similarly, second case 195 and third case 196 refer to case 193 of second head chip 152 and case 193 of third head chip 153, respectively.

[0029] In this embodiment, nozzle plate 160 is made of a silicon single crystal substrate and has a flat plate shape that is long in the X direction. In other embodiments, nozzle plate 160 may be formed of, for example, a metal material such as stainless steel, or a resin material such as polyimide resin. Nozzle plate 160 is fixed to the lower surface of chip main body 170 via an adhesive. Hereinafter, nozzle plate 160 provided on first head chip 151 may also be referred to as first nozzle plate 161. Nozzle plate 160 provided on second head chip 152 may also be referred to as second nozzle plate 162.

[0030] As shown in FIG. 3 , each nozzle plate 160 has at least one of a nozzle row 25 and a dummy nozzle row 26 formed therein. In this embodiment, one nozzle hole row 24 is provided for one liquid flow path 50 or one dummy flow path 56. More specifically, the first nozzle plate 161 has only two adjacent dummy nozzle rows 26 formed therein, corresponding to the two first dummy portions 53 formed in the first case portion 194. The second nozzle plate 162 has only two adjacent nozzle rows 25 formed therein, corresponding to the two first portions 51 formed in the second case portion 195. Furthermore, as described above, the configuration of the third head chip 153 in this embodiment is similar to that of the second head chip 152, and therefore the nozzle plate 160 provided on each third head chip 153 also has only two adjacent nozzle rows 25 formed therein, similar to the second nozzle plate 162. Therefore, in this embodiment, the total number of nozzle rows 25 and dummy nozzle rows 26 formed in each nozzle plate 160 is the same number of rows, which is two rows for each.

[0031] Two first flow paths 31 are formed in each case portion 193. The first flow paths 31 formed in the first case portion 194 correspond to the first dummy portion 53 described above. The first flow paths 31 formed in the second case portion 195 and the third case portion 196 correspond to the first portion 51 described above. In this embodiment, the structure of the first dummy portion 53 is the same as the structure of the first portion 51. Hereinafter, the first dummy portion 53 and the first portion 51 may not be distinguished from each other, and both may be simply referred to as the first flow paths 31. The configurations of the chip main body portion 170 and the first flow paths 31 will be described in detail below.

[0032] The holder 200 in this embodiment holds the four head chips 150 described above. The holder 200 has a first layer 210 and a flow path forming section 245. In this embodiment, the flow path forming section 245 has a second layer 220, a third layer 230, and a fourth layer 240. In other embodiments, the holder 200 may be formed of a single member, or may be formed by stacking two, three, or five or more members. For example, the first layer 210 and the second layer 220 may be formed integrally.

[0033] The first layer 210, the second layer 220, the third layer 230, and the fourth layer 240 are stacked in this order from the bottom up. The first layer 210 and the layers constituting the flow path forming portion 245 are formed of a resin material such as Zylon (registered trademark) or a liquid crystal polymer. The first layer 210 and the layers constituting the flow path forming portion 245 may be formed of a metal or a ceramic such as stainless steel, titanium, or aluminum. In this embodiment, the first layer 210 and the flow path forming portion 245, and the layers constituting the flow path forming portion 245, are bonded together with a silicone adhesive. In other embodiments, these members may be bonded together with, for example, an epoxy adhesive, or may be fixed to each other with screws or clamps.

[0034] Four storage spaces 211 are formed in first layer 210. Storage spaces 211 are spaces formed to penetrate first layer 210 in the Z direction, and store the four head chips 150 described above therein. Hereinafter, storage space 211 that stores first head chip 151 may be particularly referred to as first storage space 212. In this embodiment, first storage space 212 is located furthest in the +Y direction among the four storage spaces 211.

[0035] In the flow path forming portion 245 of the present embodiment, eight second flow paths 32 are formed aligned along the Y direction corresponding to the total of eight first flow paths 31 described above. In the present embodiment, of the eight second flow paths 32, the two second flow paths 32 located furthest in the +Y direction each correspond to the second dummy portion 54 described above. In addition, the second flow paths 32 other than the second flow path 32 corresponding to the second dummy portion 54 each correspond to the second portion 52 described above. Hereinafter, the second dummy portion 54 and the second portion 52 will not be distinguished from each other, and both may be simply referred to as the second flow path 32. The flow path length and flow path cross-sectional area of ​​each second flow path 32 may be the same or different from each other.

[0036] The second layer 220 is laminated on the upper surface of the first layer 210 and on the upper surface of the case portion 193 of each head chip 150 accommodated in the accommodation space 211. The second layer 220 is formed with a first holder flow path 33, which is part of the second flow path 32 and communicates with the first flow path 31. In this embodiment, the second layer 220 is formed with eight first holder flow paths 33, which communicate with the eight first flow paths 31, respectively. The first holder flow paths 33 are formed to extend along the Z direction, which is the stacking direction. A first space 41 is formed at the end of each first holder flow path 33 farther from the first flow path 31, i.e., at the upper end. The first space 41 has a flow path cross-sectional area larger than the portion of the first holder flow path 33 excluding the first space 41, and opens toward each second space 42 formed in the third layer 230, which will be described later.

[0037] The first adhesive portions 102 described above bond the first case portion 194 to the second layer 220. The third adhesive portions 104 bond the second case portion 195 to the second layer 220. The third adhesive portions 104 bond the second case portion 195 to the second layer 220. The third adhesive portions 104 bond the second case portion 195 to the second layer 220. The first head chip 151 and the second layer 220 may be fixed to each other by, for example, another adhesive portion formed by an adhesive, a screw, or a clamp in addition to the first adhesive portion 102. Similarly, the second head chip 152 and the third head chip 153 may be fixed to each other by, for example, another adhesive portion, a screw, or a clamp in addition to the third adhesive portion 104. The first adhesive portion 102, the third adhesive portion 104, and other adhesive portions may be integrally formed.

[0038] The third layer 230 is laminated on the upper surface of the second layer 220. The third layer 230 has a second holder flow path 34 formed therein, which is part of the second flow path 32 and communicates with the first holder flow path 33. In this embodiment, the third layer 230 has eight second holder flow paths 34 formed therein, which communicate with the eight first holder flow paths 33, respectively. The second holder flow paths 34 are formed to extend along the Z direction, which is the stacking direction. A second space 42 is formed at the end of each second holder flow path 34 closer to the first holder flow path 33, i.e., at the lower end. The second space 42 has a flow path cross-sectional area larger than the rest of the second holder flow path 34 excluding the second space 42, and is open toward each first space 41.

[0039] The first space 41 and the second space 42 form a filter chamber 40. The filter chamber 40 is provided with a filter 43 for removing air bubbles and foreign matter contained in the liquid. The filter 43 is disposed between the first space 41 and the second space 42 so as to cover the opening of the first space 41 and the opening of the second space 42. The liquid flowing through the liquid flow path 50 passes through the filter 43 within the filter chamber 40, thereby removing air bubbles and foreign matter. In this embodiment, no liquid flows through the filter chamber 40 formed in the dummy flow path 56. Hereinafter, the filter chamber 40 formed in the dummy flow path 56 may also be referred to as a dummy filter chamber 44. In this embodiment, the dummy filter chamber 44 is disposed upstream of the blocking portion 101 in the dummy flow path 56.

[0040] The fourth layer 240 is stacked on the upper surface of the third layer 230. The fourth layer 240 has a connecting portion 241. In this embodiment, the connecting portion 241 is formed in a needle shape protruding in the +Z direction. The fourth layer 240 also has formed therein a third holder flow path 35 that is part of the second flow path 32 and communicates with the second holder flow path 34, and a fourth holder flow path 36 that communicates with the third holder flow path 35. In this embodiment, the fourth layer 240 also has formed therein eight third holder flow paths 35 that communicate with the eight second holder flow paths 34, respectively, and eight fourth holder flow paths 36 that communicate with the eight third holder flow paths 35, respectively. The fourth holder flow paths 36 are formed to extend from the tip of the connecting portion 241 toward the lower surface of the third layer 230 along the Z direction, which is the stacking direction. The third holder flow path 35 is formed to extend in a direction perpendicular to the Z direction, which is the stacking direction, and connects the fourth holder flow path 36 and the second holder flow path 34. In this embodiment, the third holder flow path 35 is formed to extend in the Y direction. Note that in other embodiments, the second flow path 32 does not have to be formed, for example, by the first holder flow path 33 to the fourth holder flow path 36, and may be formed as a flow path of another type.

[0041] The connection portion 241 is configured to be connectable to the above-described liquid storage portion 310. The liquid storage portion 310 may be directly connected to the connection portion 241, or, for example, in a case where the liquid storage portion 310 is not mounted on the carriage 323, the liquid storage portion 310 may be indirectly connected to the connection portion 241 via a tube or the like. For example, an upper surface of the connection portion 241 may be formed with irregularities or the like for positioning the liquid storage portion 310 or the tube. The liquid in the liquid storage portion 310 connected to the connection portion 241 flows into the liquid jet head 100 via the fourth holder flow path 36 and is supplied to the liquid flow path 50 in the liquid jet head 100. Note that in this embodiment, the liquid storage portion 310 is not connected to two of the connection portions 241 that correspond to the dummy flow paths 56.

[0042] In this embodiment, the fixing plate 250 is made of stainless steel. Four openings 255 are formed in the fixing plate 250 and aligned along the Y direction to correspond to the head chips 150. The fixing plate 250 is fixed to the lower surface of the holder 200 and the lower surfaces of the head chips 150 via an adhesive so that each nozzle plate 160 is positioned within each opening 255 when viewed along the Z direction. As a result, the lower surface of the nozzle plate 160 and each nozzle hole row 24 are exposed downward through the openings 255. As described above, in this embodiment, the lower surface of the nozzle plate 160 and the lower surface of the fixing plate 250 form the ejection surface 19.

[0043] FIG. 4 is an exploded perspective view showing the configuration of head chip 150. FIG. 5 is a VV cross-sectional view of head chip 150 in FIG. 4. As shown in FIGS. 4 and 5, nozzle plate 160 and chip main body 170 of head chip 150 are layered in this order from bottom to top along the Z direction. Chip main body 170 is configured by layering compliance substrate 175, communication plate 180, flow path forming substrate 185, protective substrate 190, and the above-mentioned case portion 193 in this order from bottom to top along the Z direction. As shown in FIG. 5, nozzle plate 160 and chip main body 170 in this embodiment are configured to be plane-symmetrical with respect to center plane O in the Y direction.

[0044] 5, two chip flow paths 30 are formed in the head chip 150 of this embodiment. The chip flow path 30 of this embodiment is composed of a nozzle hole array 24, a nozzle communication path 181, a pressure generating chamber 187, a supply communication path 184, a second manifold portion 183, a first manifold portion 182, a liquid chamber portion 197, and a connection port 199, which are formed so as to be connected in this order. In this embodiment, the liquid chamber portion 197 and the connection port 199 are formed in the case portion 193 and constitute the first flow path 31. In other words, the liquid chamber portion 197 and the connection port 199 of the first head chip 151 correspond to the first dummy portion 53 described above, and the nozzle hole array 24, the nozzle communication path 181, the pressure generating chamber 187, the supply communication path 184, the second manifold portion 183, and the first manifold portion 182 correspond to the portion of the dummy flow path 56 downstream of the first dummy portion 53. Furthermore, the liquid chamber portion 197 and the connection port 199 in the second head chip 152 and the third head chip 153 correspond to the first portion 51 described above, and the nozzle hole row 24, the nozzle communication passage 181, the pressure generating chamber 187, the supply communication passage 184, the second manifold portion 183, and the first manifold portion 182 correspond to the portion of the liquid flow path 50 that is closer to the nozzle row 25 than the first portion 51.

[0045] The flow path forming substrate 185 in this embodiment is a flat member made of a silicon single crystal substrate. The flow path forming substrate 185 is anisotropically etched from one side thereof to form pressure generating chambers 187 partitioned by a plurality of partition walls, which are aligned along the X direction. In this embodiment, the flow path forming substrate 185 is provided with two rows of the pressure generating chambers 187 aligned along the X direction, sandwiching a central plane O in the Y direction. In other embodiments, the flow path forming substrate 185 may be formed of, for example, a metal such as stainless steel (SUS) or nickel (Ni), a ceramic material typified by zirconia (ZrO2) or alumina (Al2O3), a glass ceramic material, or an oxide such as magnesium oxide (MgO) or lanthanum aluminate (LaAlO3).

[0046] In this embodiment, the communication plate 180 is a flat member made of a silicon single crystal substrate. In other embodiments, the communication plate 180 may be formed of, for example, a metal such as stainless steel or nickel, or a ceramic such as zirconia. As shown in FIG. 5 , the communication plate 180 is provided with pairs of the above-mentioned nozzle communication passages 181, first manifold portions 182, second manifold portions 183, and supply communication passages 184, arranged on either side of the center plane O. Hereinafter, the dummy nozzles 23 constituting the dummy nozzle row 26, and the sets of the nozzle communication passages 181, pressure generating chambers 187, and supply communication passages 184 that communicate with the dummy nozzles 23, may be referred to as dummy individual flow passages.

[0047] The first manifold portion 182 and the second manifold portion 183 are provided in common to a plurality of pressure generating chambers 187 that form one row, and together with the liquid chamber portion 197 of the case portion 193, form a common liquid chamber portion 60 that is part of the chip flow path 30. A plurality of nozzle communicating paths 181 and a plurality of supply communicating paths 184 are provided corresponding to the respective pressure generating chambers 187, and are lined up along the X direction.

[0048] Each nozzle communication passage 181 connects each pressure generating chamber 187 to each nozzle hole 21 in the Z direction. Each supply communication passage 184 connects each common liquid chamber 60 to each pressure generating chamber 187 in the Z direction. That is, the common liquid chamber 60 of the second head chip 152 connects to the plurality of nozzles 22 constituting the nozzle row 25 via the supply communication passage 184, the pressure generating chamber 187, and the nozzle communication passage 181. Similarly, the common liquid chamber 60 of the first head chip 151 connects to the plurality of dummy nozzles 23 constituting the dummy nozzle row 26. Hereinafter, a common liquid chamber 60 connected to the plurality of dummy nozzles 23 constituting the dummy nozzle row 26, such as the common liquid chamber 60 of the first head chip 151, may also be referred to as a dummy common liquid chamber 63. As shown in FIG. 3 , in this embodiment, the blocking portion 101 described above is disposed upstream of the dummy common liquid chamber 63. In this embodiment, a portion of the dummy common liquid chamber 63 is defined by a first case portion 194 that corresponds to the first flow path member.

[0049] The compliance substrate 175 is bonded to the surface of the communication plate 180 on the -Z direction side via an adhesive. In this embodiment, the compliance substrate 175 includes a sealing film 176 made of a flexible thin film and a flat frame member 177 made of a hard material such as metal. As shown in FIGS. 4 and 5 , openings penetrating the sealing film 176 and the frame member 177 in the Z direction are provided in the central portions of the sealing film 176 and the frame member 177, at portions that overlap with the nozzle plate 160 when viewed along the Z direction. Furthermore, the frame member 177 also has openings penetrating the frame member 177 in the Z direction at positions that overlap with each of the first manifold sections 182 when viewed along the Z direction. Therefore, the lower surfaces of the first manifold sections 182 are sealed only by the sealing film 176.

[0050] A diaphragm 188 is disposed on the surface of the flow path forming substrate 185 on the +Z direction side. In this embodiment, the diaphragm 188 includes an elastic film made of silica (SiO2) and an insulating film made of zirconia provided on the elastic film. The surface of the elastic film of the diaphragm 188 on the -Z direction side forms the wall surface of the pressure generating chamber 187 on the +Z direction side.

[0051] A piezoelectric actuator 280 is disposed on the surface of the vibration plate 188 facing the +Z direction. The piezoelectric actuator 280 is formed by laminating a first electrode, a piezoelectric layer, and a second electrode. In this embodiment, the first and second electrodes are formed of platinum. In this embodiment, the piezoelectric layer is formed of lead zirconate titanate (PZT). The piezoelectric actuator 280 vibrates the vibration plate 188 by piezoelectric strain of the piezoelectric layer caused by voltage application to both electrodes from the drive circuit 120 disposed on the wiring substrate 121. The vibration of the vibration plate 188 provided corresponding to the pressure generating chamber 187 included in the liquid flow path 50—that is, the vibration of the vibration plate 188 of the second head chip 152 and the third head chip 153 in this embodiment—generates a pressure change in the liquid inside the pressure generating chamber 187. This pressure change reaches the nozzle 22 via the nozzle communication passage 181 and causes the liquid to be ejected from the nozzle 22.

[0052] In other embodiments, the first electrode and the second electrode of the piezoelectric actuator 280 may be formed of, for example, various metals such as platinum, iridium, titanium, tungsten, and tantalum, or conductive metal oxides such as lanthanum nickel oxide (LaNiO). Instead of PZT, the piezoelectric layer may be formed of other ceramic materials having a so-called perovskite structure represented by the ABO3 type, such as barium titanate, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, barium strontium titanate (BST), strontium bismuth tantalate (SBT), lead metaniobate, lead zinc niobate, and lead scandium niobate. Furthermore, the piezoelectric layer is not limited to ceramic materials, and may be formed of any material having a piezoelectric effect, such as polyvinylidene fluoride or quartz crystal.

[0053] A protective substrate 190 is bonded to the surface of the flow path forming substrate 185 on the piezoelectric actuator 280 side. When viewed along the Z direction, the protective substrate 190 has approximately the same area as the flow path forming substrate 185. The protective substrate 190 has a through hole 192 and a pair of holding portions 191 provided on either side of a central plane O. The through hole 192 is a hole that penetrates the protective substrate 190 in the Z direction. The wiring substrate 121 is inserted into the through hole 192. The holding portion 191 is a recess that is provided on the -Z direction side of the protective substrate 190 and opens toward the -Z direction. The piezoelectric actuator 280 is disposed within the opening of the holding portion 191.

[0054] The case portion 193 is formed of a material such as resin or metal. As shown in FIGS. 4 and 5 , the case portion 193 constitutes the upper surface of the chip main body portion 170 and is bonded to the second layer 220 of the flow path forming portion 245 via the first adhesive portion 102, the third adhesive portion 104, and the like. The case portion 193 is layered on the communication plate 180 and the protective substrate 190 and bonded to both via an adhesive. More specifically, the case portion 193 has a recess Dp on its lower surface that can accommodate the flow path forming substrate 185 and the protective substrate 190. The case portion 193 is layered on the communication plate 180 and the protective substrate 190 while accommodating the flow path forming substrate 185 and the protective substrate 190 in the recess Dp.

[0055] The case 193 is provided with a liquid chamber 197, an insertion port 198, and a connection port 199. A pair of the liquid chambers 197 and the connection ports 199 are provided on either side of the central plane O. The connection port 199 is a portion of the chip flow path 30 that constitutes the end farther from the nozzle hole array 24. In this embodiment, the connection port 199 opens in the +Z direction. The liquid chamber 197 communicates with the second flow path 32 formed in the holder 200 in the Z direction, which is the stacking direction, via the connection port 199. As described above, the liquid chamber 197, together with the first manifold 182 and the second manifold 183, constitutes the common liquid chamber 60. The insertion port 198 is a hole that penetrates the case 193 in the Z direction and communicates with the through-hole 192 of the protection substrate 190. The above-described wiring board 121 is inserted into the through-hole 192 via the insertion opening 198 and connected to the piezoelectric actuator 280 .

[0056] In this embodiment, the above-mentioned first adhesive portion 102 is formed by an adhesive applied between the openings of each connection port 199 of the first case portion 194 and the openings on the head chip 150 side of each first holder flow path 33 formed in the holder 200 and corresponding to each connection port 199. The first adhesive portion 102 forms a blocking portion 101 that blocks the openings of the connection ports 199 of the first case portion 194 and the openings of the first holder flow paths 33. Therefore, in this embodiment, the blocking portion 101 is provided in a portion of the dummy flow path 56 that is formed by the connection ports 199 and the first holder flow paths 33 and extends along the Z direction, which is the stacking direction. In this embodiment, the blocking portion 101 and the first adhesive portion 102 are formed, for example, when the second layer 220 is stacked on the first case portion 194 and the two are joined together, by applying adhesive between the second layer 220 and the first case portion 194 so that the opening of the connection port 199 and the opening of the first holder flow path 33 overlap when viewed along the Z direction, which is the stacking direction.

[0057] Furthermore, the above-mentioned third adhesive portion 104 is formed by an adhesive applied between the edge of the opening of each connection port 199 of second case portion 195 and third case portion 196 and the edge of the opening on the head chip 150 side of each first holder flow path 33 formed in holder 200 and corresponding to that connection port 199. The third adhesive portion 104 forms second connection flow path 62 that liquid-tightly connects the opening of connection port 199 formed in second case portion 195 or third case portion 196 to the opening of first holder flow path 33. In this embodiment, the third adhesive portion 104 and the second connection flow path 62 are formed, for example, when the second layer 220 is stacked on the second case portion 195 or the third case portion 196 and the two are joined together, by applying adhesive between the second layer 220 and the second case portion 195 or the third case portion 196 so as to surround the opening of the connection port 199 and the opening of the first holder flow path 33 when viewed along the Z direction, which is the stacking direction.

[0058] In this embodiment, the connection port 199 of the second case portion 195, which corresponds to the third flow path member, functions as an inlet for introducing the liquid supplied from the liquid storage portion 310 to the liquid jet head 100 into the chip main body portion 170 via the second portion 52 and the second connection flow path 62 described above. Furthermore, the liquid is supplied to the common liquid chamber portion 60 of the second head chip 152 via the connection port 199. On the other hand, as described above, in this embodiment, the liquid is not supplied to the dummy flow paths 56. Therefore, the liquid does not flow into the connection port 199 and the common liquid chamber portion 60 of the first head chip 151.

[0059] Another method for manufacturing a liquid jet head that uses a reduced number of nozzle rows 25 is to reduce the number of head chips 150 themselves. As described above, in this embodiment, the number of dummy nozzle rows 26 in the entire liquid jet head 100 is two, which is greater than the common number of rows described above. Therefore, it is possible to configure a head chip 150 in which no nozzle rows 25 are formed and only dummy nozzle rows 26 are formed, like the first head chip 151. However, it is also possible to reduce the number of head chips 150 by not providing such a head chip 150. However, for example, when the first head chip 151 is removed, the fixing plate 250 is not fixed to the head chip 150 in the vicinity of the first accommodation space 212. Therefore, compared to portions located in the vicinity of the other accommodation spaces 211, there is a risk that deformation such as a dent may be more likely to occur in the portion of the fixing plate 250 located in the vicinity of the first accommodation space 212 due to, for example, an external force caused by a collision of the medium P in a transport jam or negative pressure due to suction cleaning. Furthermore, when the first head chip 151 is removed, a space having a volume equivalent to the volume of the first head chip 151 is formed in the first housing space 212. Therefore, during suction cleaning performed in a capping state using the cap 110, the negative pressure generated in the closed space CL acts on the first housing space 212 so as to draw in air outside the liquid ejection head via the connection portion 241 that is open to the atmosphere. This may prevent liquid from being properly sucked from the second head chip 152 or the third head chip 153, reducing the effectiveness of suction cleaning. Therefore, when the first head chip 151 is removed, it may be necessary to newly manufacture, for example, a fixing plate that does not have an opening 255 corresponding to the first housing space 212, or a cap that covers only the second head chip 152 and each third head chip 153 but does not cover the first housing space 212 so that the negative pressure caused by suction cleaning does not act on the first housing space 212, which increases manufacturing costs. In this embodiment, a first head chip 151 is provided, and a blocking portion 101 that blocks the dummy flow path 56 is also provided, so even when a fixed plate 250 or a cap 110 is used, deformation of the fixed plate 250 and a decrease in the effectiveness of suction cleaning can be suppressed.

[0060] FIG. 6 is a schematic diagram illustrating scanning of the liquid jet head 100 in this embodiment. As shown in FIG. 6, when the liquid jet head 100 performs printing in the print region R, in order for all of the nozzle rows 25 to scan from the −Y-direction end to the +Y-direction end of the print region R, the liquid jet head 100 needs to move in the Y direction by at least a distance A. The distance A is the sum of the width W of the print region R in the Y direction and the distance D1 between the nozzle row 25 located furthest in the −Y direction and the nozzle row 25 located furthest in the +Y direction. The width W is, for example, the same as the width of the medium P in the Y direction. When two dummy nozzle rows 26 are arranged adjacent to each other on the first nozzle plate 161 as in this embodiment, the distance D1 is smaller than when, for example, the two dummy nozzle rows 26 are not adjacent to each other but are arranged to sandwich a total of six nozzle rows 25 in the Y direction. The reason for this is that the distance between adjacent nozzle hole rows 24 in one nozzle plate 160 is usually smaller than the distance between adjacent nozzle hole rows 24 formed in adjacent nozzle plates 160. This makes it possible to reduce the movement distance in the Y direction of the liquid ejection head 100 when printing in the printing region R, increasing the possibility of more efficiently printing an image. Furthermore, in this embodiment, the first nozzle plate 161 does not have a nozzle row 25 formed therein, thereby increasing the possibility of more efficiently printing an image.

[0061] The liquid jet head 100 according to the present embodiment described above includes the liquid flow path 50 including the plurality of nozzles 22 that constitute the nozzle row 25, the dummy flow path 56 including the plurality of dummy nozzles 23 that constitute the dummy nozzle row 26, and the blocking portion 101 that is formed of an adhesive and blocks the dummy flow path 56. As a result, the blocking portion 101 can be formed of an adhesive, and therefore the liquid jet head 100 having the blocked dummy flow path 56 can be manufactured at low cost.

[0062] In this embodiment, the blocking portion 101 is disposed upstream of the dummy common liquid chamber 63. This allows the dummy flow paths 56 to be blocked without providing blocking portions 101 individually corresponding to the plurality of dummy individual flow paths disposed downstream of the dummy common liquid chamber 63.

[0063] Furthermore, in this embodiment, a first adhesive portion 102 that bonds the first flow path member and the second flow path member, on which the first dummy portion 53 is formed, is provided between the first flow path member and the second flow path member, on which the second dummy portion 54 is formed, and the first adhesive portion 102 forms the blocking portion 101. Therefore, when manufacturing the liquid jet head 100, the first flow path member and the second flow path member can be bonded together with an adhesive, and the blocking portion 101 can be easily formed between the first flow path member and the second flow path member.

[0064] Furthermore, in this embodiment, a portion of the dummy common liquid chamber 63 is defined by the first flow path member. According to this configuration, the volume of the dummy flow path 56 between the dummy nozzle 23 and the blocked portion 101 can be reduced compared to, for example, a case where the dummy common liquid chamber 63 is not defined by the first flow path member but is defined only by a member separate from the first flow path member. This reduces the likelihood of negative pressure being generated in the dummy flow path 56 during suction cleaning, allowing liquid to be efficiently sucked from the liquid flow path 50, thereby improving the effectiveness of suction cleaning. Note that, even if the entire dummy common liquid chamber 63 is defined by the first flow path member, the volume of the dummy flow path 56 between the dummy nozzle 23 and the blocked portion 101 can be reduced in the same way. In other words, if at least a portion of the dummy common liquid chamber 63 is defined by the first flow path member, the volume of the dummy flow path 56 between the dummy nozzle 23 and the blocked portion 101 can be reduced, improving the effectiveness of suction cleaning.

[0065] Furthermore, in this embodiment, the blocking portions 101 are provided in portions of the dummy flow paths 56 that extend along the Z direction, which is the stacking direction. This reduces the amount of adhesive required to block the dummy flow paths 56, compared to when the blocking portions 101 are provided in portions of the dummy flow paths 56 that extend along a direction intersecting the stacking direction. This reduces the time and cost required to block the dummy flow paths 56 when manufacturing the liquid jet head 100.

[0066] Furthermore, in this embodiment, a third adhesive portion 104 is provided that is made of an adhesive and bonds the third flow path member, on which the first portion 51 is formed, to the second flow path member, on which the second portion 52 is formed, between the third flow path member and the third flow path member, and the third adhesive portion 104 forms a second connection flow path 62 that connects the first portion 51 and the second portion 52. As a result, when manufacturing the liquid jet head 100, the third adhesive portion 104 and the second connection flow path 62, as well as the first adhesive portion 102 and the blocking portion 101, can all be formed with an adhesive. Therefore, the third adhesive portion 104 and the second connection flow path 62, as well as the first adhesive portion 102 and the blocking portion 101 can be formed in substantially the same process using an adhesive, and the process for forming the blocking portion 101 can be simplified. For example, if the first step is the step of forming the first adhesive portion 102 and the blocking portion 101 by applying an adhesive between the first flow path member and the second flow path member, and the second step is the step of forming the third adhesive portion 104 and the second connecting flow path 62 by applying an adhesive between the second flow path member and the third flow path member, the first step can be a step in which the amount of adhesive applied is increased compared to the second step in order to form the blocking portion 101 by applying the adhesive between the flow path corresponding to the first dummy portion 53 and the flow path corresponding to the second dummy portion 54. In this way, the first step and the second step can be made substantially the same step, and the step of forming the blocking portion 101 can be simplified.

[0067] Moreover, in this embodiment, the liquid jet head 100 includes a plurality of head chips 150 and a holder 200 that holds the plurality of head chips 150 and has a second flow path member, and the head chips 150 include at least a head chip 150 that has a first flow path member and a nozzle plate 160 in which a dummy nozzle row 26 is formed, and a head chip 150 that has a third flow path member and a nozzle plate 160 in which a nozzle row 25 is formed. Therefore, when manufacturing the liquid jet head 100, the holder 200 and each head chip 150 can be joined with an adhesive, and the blocking portion 101 and the second connection flow path 62 can be formed.

[0068] Furthermore, in this embodiment, a plurality of dummy nozzle rows 26 adjacent to each other are formed in the nozzle plate 160 of the head chip 150 having the first flow path member. This increases the possibility that printing can be performed efficiently using the liquid jet head 100.

[0069] Furthermore, in this embodiment, the nozzle plate 160 of the head chip 150 having the first flow path member does not have the nozzle row 25. Therefore, the possibility that printing can be performed efficiently using the liquid jet head 100 is increased.

[0070] Furthermore, in this embodiment, the total number of nozzle hole rows 24 formed in the nozzle plate 160 of each head chip 150 is a common number of rows, and the liquid jet head 100 as a whole is provided with dummy nozzle rows 26 that is equal to or greater than the common number of rows. This makes it easier to share components such as the fixing plate 250 and the cap 110 with components constituting a liquid jet head that does not have dummy flow paths 56, compared to when a liquid jet head is configured in which the number of nozzle rows 25 is reduced by reducing the number of head chips 150. Therefore, the liquid jet head 100 can be manufactured at low cost.

[0071] Furthermore, in this embodiment, the plurality of head chips 150 each have a common structure, which reduces the cost required to manufacture the plurality of head chips 150.

[0072] Furthermore, in this embodiment, the dummy flow path 56 includes a dummy filter chamber 44 that is arranged upstream of the blocking portion 101. According to this configuration, the volume of the dummy flow path 56 between the dummy nozzle 23 and the blocking portion 101 can be made smaller than when the dummy filter chamber 44 is arranged downstream of the blocking portion 101 in the dummy flow path 56. This makes it difficult for negative pressure to be generated in the dummy flow path 56 during suction cleaning, allowing liquid to be efficiently sucked from the liquid flow path 50, thereby improving the effectiveness of suction cleaning.

[0073] Furthermore, the liquid ejection device 300 in this embodiment includes the cap 110 configured to cover at least a portion of the ejection surface 19, thereby forming a closed space CL between the ejection surface 19 and the cap 110, in which the openings of the nozzles 22 and the dummy nozzles 23 are open. As a result, even when a cap 110 converted from a liquid ejection head that does not have a dummy flow path 56 covers the openings of the nozzles 22 and the openings of the dummy nozzles 23 with a common closed space CL, negative pressure is less likely to be generated in the dummy flow path 56 via the closed space CL during suction cleaning because the dummy flow path 56 is closed by the closing portion 101. Therefore, suction cleaning of the liquid flow path 50 can be effectively performed without newly manufacturing a cap 110 that covers only the nozzles 22 and does not cover the dummy nozzles 23.

[0074] B. Second embodiment: 7 is a cross-sectional view schematically illustrating a general configuration of a liquid jet head 100b according to the second embodiment. In this embodiment, unlike the first embodiment, a first case portion 194b corresponding to a first flow path member is formed with a first portion 51 in addition to a first dummy portion 53. The liquid jet head 100b also includes a second adhesive portion 103, which will be described later. Portions of the configuration of a liquid jet device 300 and a liquid jet head 100b according to the second embodiment that are not particularly described are the same as those in the first embodiment.

[0075] Of the two chip flow paths 30 formed in the first head chip 151b in this embodiment, the chip flow path 30 located in the +Y direction corresponds to a part of the dummy flow path 56, and the chip flow path 30 located in the -Y direction corresponds to a part of the liquid flow path 50. Similarly, of the first flow paths 31 formed in the first case portion 194b corresponding to the first flow path member, the chip flow path 30 located in the +Y direction corresponds to the first dummy portion 53, and the chip flow path 30 located in the -Y direction corresponds to the first portion 51. Unlike the first embodiment, the first nozzle plate 161b of the first head chip 151b in this embodiment is formed with a dummy nozzle row 26 and a nozzle row 25 that communicates with the first portion 51 formed in the first case portion 194b. In this embodiment, the dummy nozzle row 26 and the nozzle row 25 are formed in one row each in the first nozzle plate 161b. In the first nozzle plate 161b, the dummy nozzle row 26 is formed in the +Y direction of the nozzle row 25.

[0076] The second head chip 152b in this embodiment has the same configuration as the first head chip 151b. More specifically, the second head chip 152b has a configuration in which the chip flow paths 30 corresponding to a portion of the dummy flow paths 56 in the first head chip 151b and the chip flow paths 30 corresponding to a portion of the liquid flow paths 50 are swapped. In other words, the second case portion 195b corresponds to the first flow path member, similar to the first case portion 194b. Furthermore, the second nozzle plate 162b is formed with a dummy nozzle row 26 and a nozzle row 25. The configuration of the third head chip 153 is the same as that of the first embodiment. Therefore, in this embodiment, one dummy nozzle row 26 is provided at the farthest end in the -Y direction and one at the farthest end in the +Y direction of each nozzle hole row 24.

[0077] The second adhesive portion 103 is made of an adhesive and is a portion between the first flow path member and the second flow path member that joins the first flow path member and the second flow path member. The second adhesive portion 103 forms a first connection flow path 61 that connects the first portion 51 and the second portion 52 formed in the first flow path member. Like the first adhesive portion 102, the second adhesive portion 103 is made of, for example, a silicone-based adhesive or an epoxy-based adhesive.

[0078] In the present embodiment, one second adhesive portion 103 is provided between first case portion 194b corresponding to the first flow path member and second case portion 195b corresponding to the first flow path member and flow path forming portion 245 corresponding to the second flow path member. Each second adhesive portion 103 forms a first connection flow path 61 that connects each first portion 51 formed in first case portion 194b and second case portion 195b to each second portion 52 formed in flow path forming portion 245. In the present embodiment, second adhesive portion 103 and first connection flow path 61 are formed by a method similar to the method of forming third adhesive portion 104 and second connection flow path 62 described in the first embodiment, for example, when second layer 220 is stacked on first case portion 194b or second case portion 195b and joined together.

[0079] The liquid jet head 100b of the second embodiment described above also allows the blocking portion 101 to be formed using an adhesive, making it possible to manufacture the liquid jet head 100 having the blocked dummy flow paths 56 at low cost. In particular, this embodiment includes a second adhesive portion 103 that is formed using an adhesive and bonds the first flow path member, on which the first portion 51 is formed, to the second flow path member, on which the second portion 52 is formed, and the second adhesive portion 103 forms a first connection flow path 61 that connects the first portion 51 formed in the first flow path member to the second portion 52 formed in the second flow path member. This allows the second adhesive portion 103 and the first connection flow path 61, as well as the first adhesive portion 102 and the blocking portion 101, to be formed using an adhesive when manufacturing the liquid jet head 100b. Therefore, even when the first dummy portion 53 and the first portion 51 are formed in the first flow path member, the second adhesive portion 103 and the first connecting flow path 61, and the first adhesive portion 102 and the blocking portion 101 can be formed in substantially the same process using an adhesive, thereby simplifying the process for forming the blocking portion 101. For example, if the process of forming the first adhesive portion 102 and the blocking portion 101 by applying adhesive between the first flow path member and the second flow path member is defined as the first process, and the process of forming the second adhesive portion 103 and the first connecting flow path 61 by similarly applying adhesive is defined as the third process, the first process can be a process in which the amount of adhesive applied is increased compared to the third process in order to form the blocking portion 101 by applying adhesive between the flow path corresponding to the first dummy portion 53 and the flow path corresponding to the second dummy portion 54. In this way, the first process and the third process can be substantially the same process, thereby simplifying the process for forming the blocking portion 101.

[0080] Moreover, in this embodiment, the liquid jet head 100 includes a plurality of head chips 150 and a holder 200 that holds the plurality of head chips 150 and has a second flow path member, and the head chips 150 include at least a head chip 150 that has a first flow path member and a nozzle plate 160 in which a nozzle row 25 and a dummy nozzle row 26 are formed. Therefore, when manufacturing the liquid jet head 100, the holder 200 and each head chip 150 can be joined with an adhesive, and the blocking portion 101 and the first connection flow path 61 can be formed.

[0081] C. Third embodiment: 8 is a cross-sectional view schematically illustrating a general configuration of a liquid jet head 100c according to a third embodiment. Unlike the first embodiment, the liquid jet head 100c according to this embodiment includes a first junction where two dummy flow paths join. In this embodiment, the dummy filter chamber 44b corresponds to the first junction. Portions of the configuration of a liquid jet device 300 and a liquid jet head 100c according to the third embodiment that are not specifically described are the same as those in the first embodiment.

[0082] The liquid jet head 100 in this embodiment includes, as dummy flow paths, a first dummy flow path 57 and a second dummy flow path 58. The first dummy flow path 57 refers to a dummy flow path that includes a plurality of dummy nozzles 23 that constitute the first dummy nozzle row 27 as a dummy nozzle row. The second dummy flow path 58 refers to a dummy flow path that includes a plurality of dummy nozzles 23 that constitute the second dummy nozzle row 28 as a dummy nozzle row.

[0083] Similarly to the first embodiment, the liquid jet head 100c in this embodiment is provided with eight first flow paths 31. On the other hand, in this embodiment, the second flow paths 32b are not provided one-to-one with the first flow paths 31, but one second flow path 32b is provided for every two first flow paths 31. More specifically, the flow path forming portion 245b of the holder 200b in this embodiment is provided with four second flow paths 32b that branch off midway, and each second flow path 32b communicates with the corresponding two first flow paths 31. In this embodiment, of the second flow paths 32b, the one second flow path 32b that is located furthest in the +Y direction corresponds to the second dummy portion 54 in the first dummy flow path 57 and the second dummy flow path 58. Furthermore, the three second flow paths 32b other than the second flow path 32b that corresponds to the second dummy portion 54 correspond to the second portion 52 in the liquid flow path 50.

[0084] In this embodiment, the fourth layer 240b of the flow path forming portion 245b is provided with one connection portion 241, one fourth holder flow path 36, and one third holder flow path 35 for each of the two first flow paths 31. The third layer 230b is provided with one second holder flow path 34 for each of the two first flow paths 31. The second layer 220b is provided with a branch flow path 37 that connects the second holder flow path 34 to the two first flow paths 31. The branch flow path 37 branches into two paths at a first space 41b formed at the upper end of the branch flow path 37, and each of the branched flow paths is connected to a first flow path 31. The first space 41b and the second space 42 of the second holder flow path 34b form a filter chamber 40b, as in the first embodiment.

[0085] Of the chip channels 30 provided in first head chip 151c in this embodiment, the chip channel 30 located in the +Y direction corresponds to a part of first dummy channel 57, and the chip channel 30 located in the -Y direction corresponds to a part of second dummy channel 58. In this embodiment, a first dummy nozzle row 27 and a second dummy nozzle row 28 are formed as dummy nozzle rows in first nozzle plate 161c of first head chip 151c. In addition, a first dummy portion 53A of first dummy channel 57 and a first dummy portion 53B of second dummy channel 58 are formed in first case portion 194c, which corresponds to the first channel member. In addition, the configurations of second head chip 152 and third head chip 153 in this embodiment are the same as those in the first embodiment.

[0086] The first dummy flow path 57 and the second dummy flow path 58 join together in a dummy filter chamber 44b, which corresponds to the first joining portion described above. In the present embodiment, the filter chamber 40b and the portion of the second flow path 32b that communicates with the first dummy nozzle row 27 and the second dummy nozzle row 28, which is located upstream of the filter chamber 40b, are common to the first dummy flow path 57 and the second dummy flow path 58. In other words, the portions of the first dummy flow path 57 and the second dummy flow path 58 that are located upstream of the first joining portion are both part of the first dummy flow path 57 and part of the second dummy flow path 58.

[0087] The liquid jet head 100c includes, as blocking portions, a first blocking portion 106 that blocks the first dummy flow path 57 and a second blocking portion 107 that blocks the second dummy flow path 58. The first blocking portion 106 and the second blocking portion 107 in this embodiment are formed by a first adhesive portion 102, similar to the blocking portion 101 in the first embodiment. As shown in FIG. 8 , the first blocking portion 106 and the second blocking portion 107 are disposed downstream of the dummy filter chamber 44b, which is the first junction, in the first dummy flow path 57 and the second dummy flow path 58, respectively.

[0088] According to the liquid jet head 100c of the third embodiment described above, the first blocking portion 106 that blocks the first dummy flow path 57 and the second blocking portion 107 that blocks the second dummy flow path 58 are arranged downstream of the first junction where the first dummy flow path 57 and the second dummy flow path 58 join. According to this configuration, the flow path length of the dummy flow path from each blocking portion to each dummy nozzle row can be shortened compared to when each blocking portion is arranged upstream of the first junction. This makes it difficult for negative pressure to be generated in each dummy flow path during suction cleaning, allowing liquid to be efficiently suctioned from the liquid flow path 50, thereby improving the effectiveness of suction cleaning.

[0089] D. Fourth embodiment: 9 is a cross-sectional view schematically illustrating a general configuration of a liquid jet head 100d according to the fourth embodiment. In this embodiment, unlike the third embodiment, the first dummy portions 53B of the second dummy flow paths 58 are not provided in the first case portion 194d of the first head chip 151d, and the first dummy portions 53B of the second dummy flow paths 58 are provided in the second case portion 195c of the second head chip 152c. The first case portion 194d and the second case portion 195c each correspond to a first flow path member. Furthermore, the second dummy nozzle row 28 is formed in the second nozzle plate 162c, not in the first nozzle plate 161d. Portions of the configuration of a liquid jet device 300 and a liquid jet head 100d according to the fourth embodiment that are not specifically described are similar to those of the third embodiment.

[0090] Of the chip channels 30 provided in the first head chip 151d in this embodiment, the chip channels 30 located in the +Y direction correspond to a part of the first dummy channels 57, and the chip channels 30 located in the -Y direction correspond to a part of the liquid channels 50. Furthermore, of the chip channels 30 provided in the second head chip 152c, the chip channels 30 located in the +Y direction correspond to a part of the liquid channels 50, and the chip channels 30 located in the -Y direction correspond to a part of the second dummy channels 58. In the first nozzle plate 161d and the second nozzle plate 162c, one nozzle row 25 is formed in addition to the first dummy nozzle row 27 and the second dummy nozzle row 28 described above. Furthermore, in the first case portion 194d and the second case portion 195c, the first portions 51 of the liquid channels 50 are formed in addition to the first dummy portions 53A and the first dummy portions 53B, respectively.

[0091] The holder 200c in this embodiment has a flow path forming portion 245c. Unlike the third embodiment, the branch flow path 37b formed in the second layer 220c of the flow path forming portion 245c branches into two at a branch point 38 rather than at the filter chamber 40. The branch point 38 is located in the second flow path 32c closer to the nozzle hole row 24 than the first space 41. Note that in FIG. 9, a portion of the second flow path 32c other than the second flow path 32c communicating with the first dummy nozzle row 27 and the second dummy nozzle row 28 is omitted, but each second flow path 32c is connected to an arbitrary first flow path 31. In this embodiment, the branch point 38 in the second flow path 32c communicating with the first dummy nozzle row 27 and the second dummy nozzle row 28 corresponds to the first junction. The first blocking portion 106 and the second blocking portion 107 are each located downstream of the branch point 38, which is the first junction, as in the third embodiment.

[0092] The liquid jet head 100d of the fourth embodiment described above also makes it possible to shorten the flow path length of the dummy flow paths from each blocking part to each dummy nozzle row 26, compared to when each blocking part is located upstream of the first junction. This makes it difficult for negative pressure to be generated in each dummy flow path during suction cleaning, and allows liquid to be efficiently sucked from the liquid flow path 50, thereby improving the effectiveness of suction cleaning.

[0093] E. Fifth embodiment: 10 is a cross-sectional view schematically illustrating a general configuration of a liquid jet head 100e according to a fifth embodiment. In this embodiment, the liquid jet head 100c is different from the third embodiment in that it has a second junction where the dummy flow paths 56 and the liquid flow paths 50 join together, rather than a first junction. Portions of the configuration of the liquid jet device 300 and the liquid jet head 100e according to the fifth embodiment that are not particularly described are similar to those of the third embodiment.

[0094] The configuration and arrangement of each head chip 150 in this embodiment are the same as those in the second embodiment. In this embodiment, the filter chamber 40b of the second flow path 32b, which communicates with the nozzle row 25 and the dummy nozzle row 26, corresponds to the second junction described above. The blocking section 101 is located downstream of the second junction in the dummy flow path 56. Note that in this embodiment, the liquid storage section 310 is connected to all four connection sections 241 provided in the fourth layer 240b. Therefore, liquid flows in the portion of the dummy flow path 56 upstream of the blocking section 101. Furthermore, the filter chamber 40b and the portion upstream of the filter chamber 40b in the second flow path 32b, which communicates with the nozzle row 25 and the dummy nozzle row 26, are common to the liquid flow path 50 and the dummy flow path 56, which merge at the filter chamber 40b. The filter chamber 40b, which is the second junction, functions as a dummy filter chamber in the dummy flow path 56.

[0095] According to the liquid jet head 100e of the fifth embodiment described above, the closing portion 101 is disposed downstream of the second confluence portion where the dummy flow path 56 and the liquid flow path 50 converge. Therefore, by closing some of the multiple flow paths that converge with the closing portion 101, it is possible to manufacture the liquid jet head 100e having the dummy flow path 56.

[0096] F. Other Embodiments: (F-1) In the above embodiment, first case portion 194 of first head chip 151 corresponds to the first flow path member, and flow path forming portion 245 of holder 200 corresponds to the second flow path member. However, the components corresponding to the first flow path member and the second flow path member do not have to be first case portion 194 and flow path forming portion 245, respectively. For example, first nozzle plate 161 may be a component corresponding to the first flow path member, and communication plate 180 laminated on first nozzle plate 161 may be a component corresponding to the second flow path member. In this case, dummy nozzles 23 of first nozzle plate 161 correspond to the first dummy portion, nozzle communication passages 181 of first head chip 151 correspond to the second dummy portion, nozzles 22 of second nozzle plate 162 correspond to the first portion, and nozzle communication passages 181 of second head chip 152 correspond to the second portion. The first adhesive portion 102 and the blocking portion 101 are disposed between the first nozzle plate 161 and the communication plate 180. Alternatively, for example, the second layer 220 of the flow path forming portion 245 may be a member corresponding to the first flow path member, and the third layer 230 may be a member corresponding to the second flow path member. In this case, the first holder flow path 33 communicating with the dummy nozzle 23 corresponds to the first dummy portion, and the second holder flow path 34 communicating with the first holder flow path 33 communicating with the dummy nozzle 23 corresponds to the second dummy portion. In this case, the first holder flow path 33 communicating with the nozzle 22 corresponds to the first portion 51, and the second holder flow path 34 communicating with the first holder flow path 33 communicating with the nozzle 22 corresponds to the second portion. The first adhesive portion 102 and the blocking portion 101 are disposed between the second layer 220 and the third layer 230.

[0097] (F-2) In the above embodiment, the first adhesive portion 102 forms the blocking portion 101. In contrast, the first adhesive portion 102 does not have to form the blocking portion 101. For example, the blocking portion 101 may be provided in a portion other than between the stacked members, and may be provided on the lower surface of the nozzle plate 160, inside the nozzle hole 21, inside the pressure generating chamber 187, inside the second manifold portion 183, inside the liquid chamber portion 197, inside the first holder flow path 33, etc.

[0098] (F-3) In the above embodiment, the blocking section 101 is provided in a portion of the dummy flow channel 56 that extends along the Z direction, which is the stacking direction. In contrast, the blocking section 101 does not have to be provided in a portion of the dummy flow channel 56 that extends along the stacking direction, and may be provided, for example, in a portion that extends along the X direction or Y direction, which is a direction perpendicular to the stacking direction.

[0099] (F-4) In the above embodiment, the blocking portion 101 is disposed in the dummy flow path 56 upstream of the dummy common liquid chamber 63. In contrast, the blocking portion 101 does not have to be disposed upstream of the dummy common liquid chamber 63, and may be disposed in the dummy common liquid chamber 63, or may be disposed downstream of the dummy common liquid chamber 63, for example.

[0100] (F-5) In the above embodiment, at least a portion of the dummy common liquid chamber 63 is defined by the first flow path member. However, the dummy common liquid chamber 63 does not have to be defined by the first flow path member. For example, the dummy common liquid chamber 63 may not be defined by the first case portion 194, which corresponds to the first flow path member, and the common liquid chamber portion 60 may be defined only by the communication plate 180, in which the portion of the dummy flow path 56 downstream of the first dummy portion 53 is formed.

[0101] (F-6) In the above embodiment, the liquid jet head 100 is provided with dummy nozzle rows 26 that are equal to or greater than the common number of nozzle hole rows 24 formed in each nozzle plate 160. In contrast, the number of dummy nozzle rows 26 provided in the liquid jet head 100 may be one or more and less than the common number of rows.

[0102] (F-7) In the above embodiment, each head chip 150 has a common structure. However, the head chips 150 do not necessarily have to have a common structure.

[0103] (F-8) In the above embodiment, the dummy filter chamber 44 is arranged upstream of the occluded portion 101 in the dummy flow path 56. In contrast, the dummy filter chamber 44 does not have to be arranged upstream of the occluded portion 101; for example, the dummy filter chamber 44 may be arranged downstream of the occluded portion 101, or the occluded portion 101 may be arranged in the dummy filter chamber 44. Furthermore, the dummy flow path 56 does not have to have a dummy filter chamber 44.

[0104] (F-9) In the above embodiment, two dummy flow paths 56 merge at the first junction. However, the first junction may be configured such that, for example, three or more dummy flow paths 56 merge, or two or more dummy flow paths 56 merge with one or more liquid flow paths 50. Similarly, the second junction may be configured such that, in addition to one liquid flow path 50 and one dummy flow path 56, other liquid flow paths 50 and dummy flow paths 56 also merge.

[0105] (F-10) In the above embodiment, two nozzle hole rows 24 are formed in each nozzle plate 160. However, each nozzle plate 160 may have only one nozzle hole row 24 formed therein, or three or more nozzle hole rows 24 formed therein.

[0106] (F-11) In the above embodiment, the liquid jet head 100 includes four head chips 150. However, the liquid jet head 100 may include three or fewer head chips 150, or may include five or more head chips 150.

[0107] (F-12) In the above embodiment, one nozzle hole row 24 is provided for one liquid flow path 50 or one dummy flow path 56. In contrast to this, for example, one nozzle hole row 24 may be provided for a plurality of liquid flow paths 50 or a plurality of dummy flow paths 56. In this case, for example, some of the plurality of liquid flow paths 50 may function as supply flow paths for supplying liquid to the nozzle row 25, and other liquid flow paths 50 may function as recovery flow paths for recovering liquid from the nozzle row 25 toward the liquid storage section 310. In other words, a circulation flow path for circulating the liquid may be formed by the plurality of liquid flow paths 50.

[0108] G. Other forms: The present disclosure is not limited to the above-described embodiments and can be realized in various forms without departing from the spirit thereof. For example, the present disclosure can also be realized in the following forms. The technical features in the above embodiments corresponding to the technical features in each form described below can be appropriately replaced or combined to solve some or all of the problems of the present disclosure or to achieve some or all of the effects of the present disclosure. Furthermore, if a technical feature is not described as essential in this specification, it can be appropriately deleted.

[0109] (1) According to a first aspect of the present disclosure, there is provided a liquid jet head comprising: a liquid flow path including a plurality of nozzles constituting a nozzle row that ejects liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; and a blocking portion formed of an adhesive that blocks the dummy flow path. According to this aspect, since the blocking portion can be formed by adhesive, a liquid jet head having blocked dummy flow paths can be manufactured at low cost.

[0110] (2) In the liquid jet head of the above aspect, the dummy flow path may include a dummy common liquid chamber that communicates with the plurality of dummy nozzles that constitute the dummy nozzle row, and the blocking portion may be disposed upstream of the dummy common liquid chamber. According to this aspect, the dummy flow path can be blocked in a portion of the dummy flow path downstream of the dummy common liquid chamber without providing blocking portions individually corresponding to the plurality of dummy nozzle rows.

[0111] (3) The liquid jet head of the above aspect may further include: a first flow path member in which a first dummy portion that is a part of the dummy flow path is formed; a second flow path member in which a second dummy portion that is a part of the dummy flow path is formed upstream of the first dummy portion and is laminated on the first flow path member; and a first adhesive portion that is made of an adhesive and bonds the first flow path member to the second flow path member between the first flow path member and the second flow path member, wherein the first adhesive portion forms the blocking portion. According to this aspect, when manufacturing the liquid jet head, the first flow path member and the second flow path member can be bonded together with the adhesive, and the blocking portion can be easily formed between the first flow path member and the second flow path member.

[0112] (4) In the liquid jet head of the above aspect, at least a portion of the dummy common liquid chamber may be defined by the first flow path member. According to this aspect, for example, the volume of the dummy flow path between the dummy nozzle and the blocking portion can be reduced compared to when the dummy common liquid chamber is not defined by the first flow path member but is defined only by a member separate from the first flow path member. As a result, negative pressure is less likely to be generated in the dummy flow path during suction cleaning, and liquid can be efficiently sucked from the liquid flow path, thereby improving the effectiveness of suction cleaning.

[0113] (5) In the liquid jet head of the above aspect, the blocking portion may be provided in a portion of the dummy flow path that extends along the stacking direction of the first flow path member and the second flow path member. According to this aspect, the amount of adhesive required to block the dummy flow path can be reduced compared to when the blocking portion is provided in a portion of the dummy flow path that extends along a direction intersecting the stacking direction. Therefore, the time and cost required to block the dummy flow path when manufacturing the liquid jet head can be reduced.

[0114] (6) In the liquid jet head of the above aspect, the first flow path member may be formed with a first portion that is a part of the liquid flow path, and the second flow path member may be formed with a second portion that is a part of the liquid flow path and is farther from the nozzle row than the first portion of the liquid flow path. The liquid jet head may further include a second adhesive portion that is made of an adhesive and bonds the first flow path member to the second flow path member between the first flow path member and the second flow path member. The second adhesive portion may form a first connection flow path that connects the first portion to the second portion. According to this aspect, when manufacturing the liquid jet head, the second adhesive portion and the first connection flow path, as well as the first adhesive portion and the blocking portion, can all be formed with an adhesive. Therefore, even when the first dummy portion and the first portion are formed in the first flow path member, the second adhesive portion and the first connection flow path, as well as the first adhesive portion and the blocking portion, can be formed in substantially the same process using an adhesive, thereby simplifying the process for forming the blocking portion.

[0115] (7) The liquid jet head of the above aspect may further include a third flow path member having a first portion that is a part of the liquid flow path formed therein, the second flow path member being laminated on the first flow path member and the third flow path member, the second flow path member having a second portion that is a part of the liquid flow path and is farther from the nozzle row than the first portion of the liquid flow path, the third adhesive portion being formed between the second flow path member and the third flow path member, the third adhesive portion bonding the second flow path member and the third flow path member, the third adhesive portion forming a second connection flow path that connects the first portion and the second portion. According to this aspect, when manufacturing the liquid jet head, the third adhesive portion and the second connection flow path, as well as the first adhesive portion and the blocking portion, can all be formed with an adhesive. Therefore, the third adhesive portion and the second connection flow path, as well as the first adhesive portion and the blocking portion, can be formed in substantially the same process using an adhesive, simplifying the process for forming the blocking portion.

[0116] (8) The liquid jet head of the above aspect may further include a plurality of head chips, each having a nozzle plate in which at least one of the nozzle row and the dummy nozzle row is formed, and a holder that holds the plurality of head chips and has the second flow path member, wherein the head chips include at least one head chip having the first flow path member and the nozzle plate in which the nozzle row communicating with the first portion and the dummy nozzle row communicating with the first dummy portion are formed. According to this aspect, when manufacturing the liquid jet head, the holder and each head chip can be joined with an adhesive, and blocking portions and first connection flow paths can be formed.

[0117] (9) The liquid jet head of the above aspect may include a plurality of head chips, each having a nozzle plate in which at least one of the nozzle row and the dummy nozzle row is formed, and a holder that holds the plurality of head chips and has the second flow path member, wherein the head chips include at least a head chip having the first flow path member and the nozzle plate in which the dummy nozzle row that communicates with the first dummy portion is formed, and a head chip having the third flow path member and the nozzle plate in which the nozzle row that communicates with the first portion is formed. According to this aspect, when manufacturing the liquid jet head, the holder and each head chip can be joined with an adhesive, and blocking portions and second connection flow paths can be formed.

[0118] (10) In the liquid jet head of the above aspect, the head chip may include a plurality of the dummy flow paths, and the nozzle plate of the head chip having the first flow path member may be formed with a plurality of adjacent dummy nozzle rows. According to this aspect, it is possible to increase the possibility of efficiently printing an image using the liquid jet head.

[0119] (11) In the liquid jet head of the above aspect, the nozzle row may not be formed in the nozzle plate of the head chip having the first flow path member. According to this aspect, it is possible to increase the possibility of efficiently printing an image using the liquid jet head.

[0120] (12) In the liquid jet head of the above aspect, the total number of the nozzle rows and the dummy nozzle rows formed in the nozzle plate of each of the head chips may be a common number of rows, and the head chip may include a number of dummy nozzle rows equal to or greater than the common number of rows. According to this aspect, compared to a case in which a liquid jet head having a reduced number of nozzle rows is configured by reducing the number of head chips, it is easier to share components constituting a liquid jet head without a dummy flow path and components constituting a liquid jet head having a dummy flow path. Therefore, the liquid jet head can be manufactured at low cost.

[0121] (13) In the liquid jet head of the above aspect, the plurality of head chips may each have a common structure. According to this aspect, it is possible to reduce the cost required to manufacture the plurality of head chips.

[0122] (14) In the liquid jet head of the above aspect, the dummy flow path may be provided with a dummy filter chamber disposed upstream of the blocking portion and having a filter therein. According to this aspect, the liquid can be efficiently sucked from the liquid flow path during suction cleaning, thereby enhancing the effectiveness of suction cleaning.

[0123] (15) In the liquid jet head of the above aspect, the dummy flow paths may include a first dummy flow path including a plurality of dummy nozzles constituting a first dummy nozzle row as the dummy nozzle row, and a second dummy flow path including a plurality of dummy nozzles constituting a second dummy nozzle row as the dummy nozzle row. The blocking units may include a first blocking unit that blocks the first dummy flow path and a second blocking unit that blocks the second dummy flow path. The liquid jet head may further include a first junction where the first dummy flow path and the second dummy flow path merge, the first blocking unit and the second blocking unit being located downstream of the first junction. According to this aspect, the flow path length of the dummy flow path from each blocking unit to each dummy nozzle row can be shortened compared to when each blocking unit is located upstream of the first junction. This reduces the likelihood of negative pressure being generated in each dummy flow path during suction cleaning, allowing liquid to be efficiently suctioned from the liquid flow path, thereby improving the effectiveness of suction cleaning.

[0124] (16) In the liquid jet head of the above aspect, a second junction portion where the dummy flow path and the liquid flow path merge may be provided, and the blocking portion may be disposed downstream of the second junction portion. According to this aspect, a liquid jet head having a dummy flow path can be manufactured by blocking some of the multiple flow paths that merge with each other with the blocking portion.

[0125] (17) According to a second aspect of the present disclosure, there is provided a liquid ejection device including the liquid ejection head of the first aspect and a liquid storage unit that stores liquid to be supplied to the liquid ejection head.

[0126] (18) In the liquid ejection device of the above aspect, the liquid ejection head may further include a cap configured to include an ejection surface in which the openings of the nozzles constituting the nozzle row and the openings of the dummy nozzles constituting the dummy nozzle row are formed, and to cover at least a portion of the ejection surface to form a closed space between the ejection surface and the cap, in which the openings of the nozzles and the dummy nozzles are open. According to this aspect, even if a cap converted from a liquid ejection head that does not have a dummy flow path covers the openings of the nozzles and the openings of the dummy nozzles with a common closed space, the dummy flow path is blocked by a blocking portion, making it difficult for negative pressure to be generated in the dummy flow path through the closed space during suction cleaning. Therefore, suction cleaning of the liquid flow path can be effectively performed without manufacturing a new cap that covers only the nozzles and does not cover the dummy nozzles. [Explanation of symbols]

[0127] 19... injection surface, 21... nozzle hole, 22... nozzle, 23... dummy nozzle, 24... nozzle hole row, 25... nozzle row, 26... dummy nozzle row, 27... first dummy nozzle row, 28... second dummy nozzle row, 30... chip flow path, 31... first flow path, 32, 32b, 32c... second flow path, 33... first holder flow path, 34... second holder flow path, 35... third holder flow path, 36... fourth holder flow path, 37, 37b... branch flow path, 38... branch point, 40, 40b... filter chamber, 41, 41b... first space, 42... second space, 43... filter, 44, 44b... dummy filter chamber, 50 ...liquid flow path, 51...first portion, 52...second portion, 53, 53A, 53B...first dummy portion, 54...second dummy portion, 56...dummy flow path, 57...first dummy flow path, 58...second dummy flow path, 60...common liquid chamber portion, 61...first connecting flow path, 62...second connecting flow path, 63...dummy common liquid chamber, 100, 100b, 100c, 100d, 100e...liquid jet head, 101...closing portion, 102...first adhesive portion, 103...second adhesive portion, 104...third adhesive portion, 106...first closing portion, 107...second closing portion, 110...cap, 116...liquid absorbent material, 120...drive circuit, 121...wiring board , 130... suction pump, 150... head chip, 151, 151b, 151c, 151d... first head chip, 152, 152b, 152c... second head chip, 153... third head chip, 160... nozzle plate, 161, 161b, 161d... first nozzle plate, 162, 162b, 162c... second nozzle plate, 170... chip main body, 175... compliance substrate, 176... sealing film, 177... frame member, 180... communication plate, 181... nozzle communication passage, 182... first manifold portion, 183... second manifold portion, 184... supply communication passage, 185... Flow path forming substrate, 187... pressure generating chamber, 188... vibration plate, 190... protective substrate, 191... holding portion, 192... through hole, 193... case portion, 194, 194b, 194c, 194d... first case portion, 195, 195b, 195c... second case portion, 196... third case portion, 197... liquid chamber portion, 198... insertion port, 199... connection port, 200, 200b, 200c... holder, 210... first layer, 211... storage space, 212... first storage space, 220, 220b, 220c... second layer, 230, 230b... third layer, 240, 240b... fourth layer, 241... connection portion, 245, 245b,245c...flow path forming portion, 250...fixing plate, 255...opening portion, 280...piezoelectric actuator, 300...liquid ejection device, 310...liquid storage portion, 320...head moving mechanism, 321...driving motor, 322...driving belt, 323...carriage, 330...transport mechanism, 500...control portion,

Claims

1. a liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a first flow path member having a first dummy portion formed therein, the first dummy portion being a part of the dummy flow path; a second flow path member that is a part of the dummy flow path and has a second dummy portion formed therein that is upstream of the first dummy portion, and that is stacked on the first flow path member; a first adhesive portion formed of an adhesive between the first flow path member and the second flow path member, the first adhesive portion joining the first flow path member and the second flow path member and forming a blocking portion that blocks the dummy flow path, the blocking portion is provided in a portion of the dummy flow path that extends along a stacking direction of the first flow path member and the second flow path member, A liquid jet head, characterized in that one surface of the blocking portion in the stacking direction faces the first dummy portion, and the other surface of the blocking portion in the stacking direction faces the second dummy portion.

2. the dummy flow path includes a dummy common liquid chamber that communicates with the plurality of dummy nozzles that form the dummy nozzle row, The liquid jet head according to claim 1 , wherein the blocking portion is disposed upstream of the dummy common liquid chamber.

3. The liquid jet head according to claim 2 , wherein at least a portion of the dummy common liquid chamber is defined by the first flow path member.

4. A liquid injection head described in any one of claims 1 to 3, wherein no liquid flows through the first dummy portion and the second dummy portion.

5. a first portion that is a part of the liquid flow path is formed in the first flow path member, a second portion that is a part of the liquid flow path and is farther from the nozzle row than the first portion in the liquid flow path is formed in the second flow path member; a second adhesive portion formed of an adhesive and positioned between the first flow path member and the second flow path member to bond the first flow path member and the second flow path member; The liquid jet head according to claim 1 , wherein the second adhesive portion forms a first connection flow path that connects the first portion and the second portion.

6. A liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a first flow path member having a first dummy portion formed therein, the first dummy portion being a part of the dummy flow path; a third flow path member different from the first flow path member, the third flow path member having a first portion that is a part of the liquid flow path; a second flow path member that is formed with a second dummy portion that is a portion of the dummy flow path and is upstream of the first dummy portion, and a second portion that is a portion of the liquid flow path and is farther from the nozzle row than the first portion in the liquid flow path, and that is stacked on the first flow path member and the third flow path member; a third adhesive portion formed of an adhesive, the third adhesive portion being between the second flow path member and the third flow path member, and joining the second flow path member and the third flow path member and forming a second connection flow path connecting the first portion and the second portion; a first adhesive portion formed of an adhesive between the second flow path member and the first flow path member, the first adhesive portion joining the first flow path member and the second flow path member and forming a blocking portion that blocks the dummy flow path, A liquid jet head characterized in that the first flow path member and the third flow path member are arranged on the same side of the second flow path member in terms of a stacking direction of the first flow path member and the third flow path member and the second flow path member.

7. a plurality of head chips each having a nozzle plate in which at least one of the nozzle row and the dummy nozzle row is formed; a holder that holds the plurality of head chips and has the second flow path member, The liquid jet head according to claim 5, characterized in that the head chip comprises at least the first flow path member and the nozzle plate in which the nozzle row communicating with the first portion and the dummy nozzle row communicating with the first dummy portion are formed.

8. a plurality of head chips each having a nozzle plate in which at least one of the nozzle row and the dummy nozzle row is formed; a holder that holds the plurality of head chips and has the second flow path member, The head chip includes: a head chip including the first flow path member and the nozzle plate in which the dummy nozzle row communicating with the first dummy portion is formed; and a head chip including the third flow path member and the nozzle plate on which the nozzle row communicating with the first portion is formed, The liquid jet head according to claim 6 , further comprising:

9. A liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a first flow path member having a first dummy portion formed therein, the first dummy portion being a part of the dummy flow path; a third flow path member that is a flow path member different from the first flow path member and that has a first portion that is a part of the liquid flow path formed therein; a second flow path member that is formed with a second dummy portion that is a portion of the dummy flow path and is upstream of the first dummy portion, and a second portion that is a portion of the liquid flow path and is farther from the nozzle row than the first portion in the liquid flow path, and that is stacked on the first flow path member and the third flow path member; a third adhesive portion formed of an adhesive, the third adhesive portion being between the second flow path member and the third flow path member, and joining the second flow path member and the third flow path member and forming a second connection flow path connecting the first portion and the second portion; a first adhesive portion formed of an adhesive between the second flow path member and the first flow path member, the first adhesive portion joining the first flow path member and the second flow path member and forming a blocking portion that blocks the dummy flow path; a plurality of head chips each having a nozzle plate in which at least one of the nozzle row and the dummy nozzle row is formed; a holder that holds the plurality of head chips and has the second flow path member, The head chip includes: a head chip including the first flow path member and the nozzle plate in which the dummy nozzle row communicating with the first dummy portion is formed; and a head chip including the third flow path member and the nozzle plate on which the nozzle row communicating with the first portion is formed, a plurality of the dummy channels; The liquid jet head, wherein a plurality of adjacent dummy nozzle rows are formed in the nozzle plate of the head chip having the first flow path member.

10. A liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a first flow path member having a first dummy portion formed therein, the first dummy portion being a part of the dummy flow path; a third flow path member that is a flow path member different from the first flow path member and that has a first portion that is a part of the liquid flow path formed therein; a second flow path member that is formed with a second dummy portion that is a portion of the dummy flow path and is upstream of the first dummy portion, and a second portion that is a portion of the liquid flow path and is farther from the nozzle row than the first portion in the liquid flow path, and that is stacked on the first flow path member and the third flow path member; a third adhesive portion formed of an adhesive, the third adhesive portion being between the second flow path member and the third flow path member, and joining the second flow path member and the third flow path member and forming a second connection flow path connecting the first portion and the second portion; a first adhesive portion formed of an adhesive between the second flow path member and the first flow path member, the first adhesive portion joining the first flow path member and the second flow path member and forming a blocking portion that blocks the dummy flow path; a plurality of head chips each having a nozzle plate in which at least one of the nozzle row and the dummy nozzle row is formed; a holder that holds the plurality of head chips and has the second flow path member, The head chip includes: a head chip including the first flow path member and the nozzle plate in which the dummy nozzle row communicating with the first dummy portion is formed; and a head chip including the third flow path member and the nozzle plate on which the nozzle row communicating with the first portion is formed, The liquid jet head, wherein the nozzle row is not formed in the nozzle plate of the head chip having the first flow path member.

11. The liquid jet head according to claim 8 , wherein the nozzle row is not formed in the nozzle plate of the head chip having the first flow path member.

12. A liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a first flow path member having a first dummy portion formed therein, the first dummy portion being a part of the dummy flow path; a third flow path member that is a flow path member different from the first flow path member and that has a first portion that is a part of the liquid flow path formed therein; a second flow path member that is formed with a second dummy portion that is a portion of the dummy flow path and is upstream of the first dummy portion, and a second portion that is a portion of the liquid flow path and is farther from the nozzle row than the first portion in the liquid flow path, and that is stacked on the first flow path member and the third flow path member; a third adhesive portion formed of an adhesive, the third adhesive portion being between the second flow path member and the third flow path member, and joining the second flow path member and the third flow path member and forming a second connection flow path connecting the first portion and the second portion; a first adhesive portion formed of an adhesive between the second flow path member and the first flow path member, the first adhesive portion joining the first flow path member and the second flow path member and forming a blocking portion that blocks the dummy flow path; a plurality of head chips each having a nozzle plate in which at least one of the nozzle row and the dummy nozzle row is formed; a holder that holds the plurality of head chips and has the second flow path member, The head chip includes: a head chip including the first flow path member and the nozzle plate in which the dummy nozzle row communicating with the first dummy portion is formed; and a head chip including the third flow path member and the nozzle plate on which the nozzle row communicating with the first portion is formed, the total number of the nozzle rows and the dummy nozzle rows formed in the nozzle plate of each of the head chips is a common number of rows, a liquid jet head including the dummy nozzle rows equal to or greater than the number of the common rows;

13. The liquid jet head according to claim 8 , wherein the plurality of head chips each have a common structure.

14. A liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a blocking portion configured by an adhesive and blocking the dummy flow path, the dummy flow path is disposed upstream of the blocking portion and includes a dummy filter chamber having a filter therein; The liquid jet head is characterized in that the blocking portion is disposed between the dummy nozzle row and the dummy filter chamber.

15. A liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a blocking portion configured by an adhesive and blocking the dummy flow path, the dummy flow paths include a first dummy flow path including a plurality of dummy nozzles constituting a first dummy nozzle row as the dummy nozzle row, and a second dummy flow path including a plurality of dummy nozzles constituting a second dummy nozzle row as the dummy nozzle row, the blocking unit includes a first blocking unit that blocks the first dummy flow path and a second blocking unit that blocks the second dummy flow path, a first junction where the first dummy flow path and the second dummy flow path join together, The liquid jet head, wherein the first closing portion and the second closing portion are disposed downstream of the first junction portion.

16. A liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a blocking portion formed of an adhesive and blocking the dummy flow path; a second junction where the dummy flow path and the liquid flow path join together, the blocking portion is provided midway through the dummy flow path and is disposed downstream of the second junction portion, The liquid jet head, wherein liquid flows in the dummy flow path between the blocking portion and the second junction portion.

17. A liquid flow path including a plurality of nozzles constituting a nozzle row for ejecting liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; a blocking portion formed of an adhesive and blocking the dummy flow path; the dummy flow path includes a dummy common liquid chamber that communicates with the plurality of dummy nozzles that form the dummy nozzle row, The liquid jet head is characterized in that the blocking portion is disposed downstream of the dummy common liquid chamber.

18. The liquid jet head according to any one of claims 1 to 17, a liquid reservoir that stores the liquid to be supplied to the liquid ejection head.

19. the liquid jet head includes an ejection surface on which openings of the nozzles constituting the nozzle row and openings of the dummy nozzles constituting the dummy nozzle row are formed, 19. The liquid ejection device according to claim 18, further comprising a cap configured to cover at least a portion of the ejection surface, thereby forming a closed space between the ejection surface and the cap, in which the openings of each of the nozzles and the openings of each of the dummy nozzles are open.

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