Ultrasound probe and ultrasound diagnostic device

Abstract

To suppress the temperature rise of a subject contact part.SOLUTION: An ultrasonic probe according to an embodiment comprises: a subject contact part comprising an ultrasonic vibrator which via a subject contact face in contact with a subject on an ultrasonic transmission and reception side, transmits and receives the ultrasonic waves to and from the subject; a first latent heat storage agent having a phase transition temperature higher than a temperature to be reached by the subject contact part; and a heat-transfer element which is capable of heat transfer between the subject contact part and the first latent heat storage agent by thermally interconnecting the subject contact part and the first latent heat storage agent.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The embodiments disclosed in the present specification and drawings relate to an ultrasound probe and an ultrasound diagnostic device. [Background technology]

[0002] In the medical field, ultrasonic diagnostic devices have been widely used to examine the inside of a subject using ultrasonic waves generated by an ultrasonic probe. To perform the examination of the inside of the subject, the ultrasonic diagnostic device must bring the subject-contact part of the ultrasonic probe, which has an ultrasonic transducer for transmitting and receiving ultrasonic waves, into contact with the subject. For this reason, the ultrasonic diagnostic device is configured to limit its operation when the temperature of the subject-contact part approaches a limit temperature so that the temperature of the subject-contact part does not exceed a predetermined temperature.

[0003] In recent years, ultrasonic probes have come to incorporate electronic components, such as semiconductor switches for switching between ultrasonic transducers that transmit and receive ultrasonic waves, and electronic components for processing received signals, which are reflected waves from the subject received by the ultrasonic probe. However, when electronic components are incorporated into an ultrasonic probe, the electronic components generate heat during use, accelerating the temperature rise of the subject contact part. Therefore, ultrasonic probes incorporating electronic components may find it difficult to maintain the temperature of the subject contact part below a regulated temperature. Furthermore, the use of the ultrasonic probe may also cause the ultrasonic transducers to generate heat, accelerating the temperature rise of the subject contact part. Therefore, it becomes even more difficult for ultrasonic probes to maintain the temperature of the subject contact part below a regulated temperature.

[0004] In order to keep the temperature of this specimen contact portion below a limiting temperature, a heat-storing latent heat agent having a phase transition temperature below the limiting temperature may be placed in the ultrasound probe, and the heat of the specimen contact portion may be absorbed by the heat-storing latent heat agent. However, since the limiting temperature of the specimen contact portion is small compared to the temperature generated when the electronic components built into the ultrasound probe generate heat, it is difficult to keep the temperature of the specimen contact portion below the limiting temperature using a heat-storing latent heat agent having a phase transition temperature below the limiting temperature, even when the temperature of the specimen contact portion rises when the electronic components built into the ultrasound probe generate heat. Therefore, it is desirable to suppress the temperature rise of the specimen contact portion in an ultrasound probe. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-228425 Summary of the Invention [Problem to be solved by the invention]

[0006] One of the problems to be solved by the embodiments disclosed in this specification and the drawings is to suppress a temperature rise in the specimen contact portion. However, the problems to be solved by the embodiments disclosed in this specification and the drawings are not limited to the above problem. Problems corresponding to the effects of each configuration shown in the embodiments described below can also be positioned as other problems. [Means for solving the problem]

[0007] The ultrasonic probe according to the embodiment includes a subject contact portion having an ultrasonic vibrator that transmits and receives ultrasonic waves to and from a subject via a subject contact surface that contacts the subject on the ultrasonic transmission / reception side; a first heat-storage latent heat agent having a phase transition temperature higher than the temperature reached by the subject contact portion; and a heat exchange element that thermally connects the subject contact portion and the first heat-storage latent heat agent and is capable of exchanging heat between the subject contact portion and the first heat-storage latent heat agent. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram showing the appearance of an ultrasonic diagnostic apparatus according to a first embodiment. [Figure 2] FIG. 1 is a block diagram showing an example of the electrical configuration of an ultrasonic diagnostic apparatus according to a first embodiment. [Figure 3] FIG. 1 is an explanatory diagram illustrating the internal configuration of an ultrasound diagnostic apparatus according to a first embodiment. [Figure 4] FIG. 2 is an explanatory diagram illustrating the flow of heat in the ultrasonic probe 10 when the ultrasonic probe according to the first embodiment is cooled. [Figure 5] FIG. 3 is a flowchart illustrating the contents of a temperature control process executed by the ultrasound probe according to the first embodiment. [Figure 6] FIG. 10 is a block diagram showing an example of the electrical configuration of an ultrasonic diagnostic apparatus according to a second embodiment. [Figure 7] FIG. 10 is an explanatory diagram illustrating the flow of heat in the ultrasonic probe when heating the subject contact part according to the second embodiment. [Figure 8] FIG. 10 is a flowchart illustrating the contents of a temperature control process executed by an ultrasonic probe according to the second embodiment. [Figure 9] FIG. 10 is a block diagram showing an example of the electrical configuration of an ultrasonic diagnostic apparatus according to a third embodiment. [Figure 10] FIG. 10 is an explanatory diagram illustrating the internal configuration of an ultrasonic probe according to a third embodiment. [Figure 11] FIG. 10 is an explanatory diagram illustrating the internal configuration of a first housing of an ultrasonic probe according to a third embodiment. [Figure 12] FIG. 11 is an explanatory diagram illustrating the internal configuration of a second housing of an ultrasonic probe according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of an ultrasound probe and an ultrasound diagnostic device will be described with reference to the drawings. In the following description, components having substantially the same functions and configurations are designated by the same reference numerals, and redundant explanations will be given only when necessary.

[0010] [First embodiment] FIG. 1 is a schematic diagram showing the appearance of an ultrasonic diagnostic apparatus according to the first embodiment. As shown in FIG. 1, the ultrasonic diagnostic apparatus 1 according to this embodiment is configured to include an ultrasonic probe 10, an apparatus main body 30, a display 50, and an input interface 70. In the example shown in FIG. 1, the display 50 and the input interface 70 are configured as separate entities from the apparatus main body 30, but the apparatus main body 30, the display 50, and the input interface 70 may be configured as an integrated entity. An example of an information processing apparatus in which the apparatus main body 30, the display 50, and the input interface 70 are configured as an integrated entity is, for example, an information processing apparatus such as a tablet terminal or a workstation.

[0011] The ultrasonic probe 10 is a device connected to the apparatus main body 30, which transmits ultrasonic waves to a subject and receives reflected wave signals reflected within the subject based on the transmitted ultrasonic waves. The ultrasonic probe 10 is, for example, a 1D array probe that scans a two-dimensional area within the subject, or a mechanical 4D probe or 2D array probe that scans a three-dimensional area within the subject. While FIG. 1 illustrates an example in which the ultrasonic probe 10 is connected to the apparatus main body 30 via wireless communication, the ultrasonic probe 10 may also be connected to the apparatus main body 30 via wired communication via a cable or the like. In the following description, the details of this embodiment will be described assuming that the ultrasonic probe 10 is connected to the apparatus main body 30 via wireless communication.

[0012] The device main body 30 is a device that generates an ultrasound image based on a reception signal received from the ultrasound probe 10. In the example shown in Fig. 1, the ultrasound probe 10, a display 50, and an input interface 70 are connected to the device main body 30 according to this embodiment.

[0013] The display 50 is a display device that displays various ultrasound images, various settings, etc. For example, the display 50 displays ultrasound images generated by the device main body 30, a GUI (Graphical User Interface) for receiving various operations from the operator, etc. In this embodiment, the display 50 is configured by, for example, a liquid crystal display, a CRT (Cathode Ray Tube) display, etc.

[0014] The input interface 70 is an input device for performing various settings, and may be realized by, for example, a trackball, switch buttons, a mouse, a keyboard, a touchpad for performing input operations by touching the operation surface, a touch monitor in which a display screen and a touchpad are integrated, a non-contact input circuit using an optical sensor, and a voice input circuit. The input interface 70 is connected to a processing circuit in the device main body 30 (described later) and converts input operations received from an operator into electrical signals and outputs them to the processing circuit in the device main body 30. Note that, in this specification, the input interface 70 is not limited to those having physical operation components such as a mouse and a keyboard. For example, an electrical signal processing circuit that receives electrical signals corresponding to input operations from an external input device provided separately from the device and outputs these electrical signals to the processing circuit in the device main body 30 is also included as an example of the input interface 70.

[0015] Next, an example of the configuration of an ultrasonic diagnostic apparatus 1 according to this embodiment will be described with reference to FIGS. 2 and 3. FIG. 2 is a block diagram showing an example of the electrical configuration of the ultrasonic diagnostic apparatus 1 according to the first embodiment. FIG. 3 is an explanatory diagram showing the internal configuration of the ultrasonic diagnostic apparatus 1 according to the first embodiment. As shown in FIGS. 2 and 3, the ultrasonic diagnostic apparatus 1 according to this embodiment is configured to include an ultrasonic probe 10, an apparatus main body 30, a display 50, and an input interface 70. The ultrasonic probe 10 according to this embodiment also includes a subject contact unit 101, a transmitting / receiving circuit 103, a processing circuit 105, a heat exchange element 107, a battery 109, a selector switch 111, a communication circuit 113, a temperature sensor 115, a first heat storage latent heat agent 117, an electronic component 119, a first thermal conductor 121, and a second thermal conductor 123. In the ultrasonic probe 10 according to this embodiment, the subject contact portion 101, the transmitting / receiving circuit 103, the processing circuit 105, the heat exchange element 107, the battery 109, the changeover switch 111, the communication circuit 113, the temperature sensor 115, the first heat storage latent heat agent 117, the electronic component 119, the first thermal conductor 121, and the second thermal conductor 123 are all contained in a single housing. Furthermore, the device main body 30 according to this embodiment includes a processing circuit 301, a memory circuit 303, and a communication circuit 305.

[0016] In the following, first, the subject contact portion 101, the transmitting / receiving circuit 103, the processing circuit 105, the heat exchange element 107, the battery 109, the changeover switch 111, the communication circuit 113, the temperature sensor 115, the first heat storage latent heat agent 117, the electronic component 119, the first thermal conductor 121, and the second thermal conductor 123 in the ultrasonic probe 10 will be described.

[0017] The subject contact portion 101 has, for example, an ultrasonic transducer that transmits and receives ultrasonic waves to and from the subject P via a subject contact surface S that contacts the subject P on the ultrasonic transmission / reception side, a matching layer, and a backing material. The subject contact portion 101 is also thermally connected to the first heat storage latent heat agent 117 via the heat exchange element 107 by the first thermal conductor 121.

[0018] The ultrasonic transducer is, for example, a piezoelectric transducer made of piezoelectric ceramic. A plurality of ultrasonic transducers are arranged at the tip of the subject contact portion 101, and transmit ultrasonic waves based on a drive signal supplied from the transmission / reception circuit 103, receive reflected waves from within the subject P, and convert them into electrical signals. The matching layer is an intermediate layer provided on the ultrasonic transmission / reception side of the ultrasonic transducer, and is used to efficiently propagate ultrasonic waves to the subject P. The backing material prevents ultrasonic waves from propagating backward from the ultrasonic transducer.

[0019] The transmission / reception circuit 103 is a processor that controls the transmission directivity and reception directivity in transmitting and receiving ultrasound, and includes a transmission circuit and a reception circuit. Note that, although an example in which the transmission / reception circuit 103 is provided in the ultrasound probe 10 is shown in Fig. 2, the transmission / reception circuit 103 may be provided in the device main body 30, or may be provided in both the ultrasound probe 10 and the device main body 30.

[0020] The transmission circuit includes a pulse generator, a transmission delay circuit, a pulser circuit, and the like, and supplies a drive signal to the ultrasonic transducer. The pulse generator repeatedly generates rate pulses at a predetermined rate frequency to form transmitted ultrasonic waves. The transmission delay circuit provides each rate pulse generated by the pulse generator with a delay time for each ultrasonic transducer required to focus the ultrasonic waves generated from the ultrasonic transducer into a beam and determine the transmission directivity. The pulser circuit also applies drive pulses to the ultrasonic transducer at a timing based on the rate pulse. The transmission delay circuit changes the delay time provided for each rate pulse to arbitrarily adjust the transmission direction of the ultrasonic waves transmitted from the ultrasonic transducer surface.

[0021] The receiving circuit, which includes an amplifier circuit, A / D converter, adder, etc., receives the reflected wave signal received by the ultrasonic transducer and performs various processing on this reflected wave signal to generate a received signal (echo signal). The amplifier circuit amplifies the reflected wave signal for each channel and performs gain correction processing. The A / D converter A / D converts the gain-corrected reflected wave signal and gives the digital data the delay time required to determine the receiving directivity. The adder adds the reflected wave signals processed by the A / D converter to generate a received signal. The adder's addition processing emphasizes the reflected component from the direction corresponding to the receiving directivity of the reflected wave signal.

[0022] The processing circuitry 105 is, for example, a control circuit that performs overall control of the ultrasound probe 10. The processing circuitry 105 according to this embodiment controls the transmitting and receiving circuitry 103 and the temperature of the subject contact unit 101.

[0023] For this reason, the processing circuit 105 according to this embodiment has a probe control function 1051 and a temperature control function 1052. The probe control function 1051 corresponds to the probe control unit in this embodiment, and the temperature control function 1052 corresponds to the temperature control unit in this embodiment.

[0024] In the embodiment shown in FIG. 2 , the processing functions performed by the probe control function 1051 and the temperature control function 1052 are stored in the storage circuitry 303 of the device main body 30 in the form of computer-executable programs. The processing circuitry 105 is a processor that reads and executes the programs from the storage circuitry 303 of the device main body 30 to realize the functions corresponding to the programs. In other words, the processing circuitry 105 in a state in which the programs have been read has the functions shown in the processing circuitry 105 of FIG. 2 . Note that, in FIG. 2 , the probe control function 1051 and the temperature control function 1052 are described as being realized by a single processing circuit 105. However, the processing circuitry 105 may be configured by combining multiple independent processors, and these functions may be realized by each processor executing a program. Alternatively, the ultrasonic probe 10 may be provided with a storage circuit, and the processing functions may be stored in the storage circuitry of the ultrasonic probe 10.

[0025] The probe control function 1051 is a function for controlling basic operations such as transmission and reception of ultrasonic waves by the ultrasonic probe 10. For example, the processing circuit 105 controls each part and each circuit of the ultrasonic probe 10 using the probe control function 1051 based on instructions from the device main body 30.

[0026] The temperature control function 1052 is a function that controls the heat exchange element 107 based on the temperature of the specimen contact portion 101 detected by the temperature sensor 115, thereby controlling the temperature of the specimen contact portion 101. Specifically, the temperature control function 1052 according to this embodiment controls the temperature of the specimen contact portion 101 by switching on / off the current flowing through the heat exchange element 107 based on the temperature of the specimen contact portion 101 detected by the temperature sensor 115. Note that the temperature control function 1052 may also be configured to control the changeover switch 111 to switch on / off the current flowing through the heat exchange element 107, thereby controlling the heat exchange element 107 and controlling the temperature of the specimen contact portion 101.

[0027] The heat exchange element 107 is an element capable of exchanging heat between the specimen contact portion 101 and the first heat storage latent heat agent 117. One surface of the heat exchange element 107 is connected to the specimen contact portion 101 via a first thermal conductor 121, and the other surface of the heat exchange element 107 is connected to the first heat storage latent heat agent 117 via the first thermal conductor 121. In other words, the heat exchange element 107 thermally connects the specimen contact portion 101 and the first heat storage latent heat agent 117.

[0028] The heat exchange element 107 is, for example, a Peltier element. A Peltier element utilizes the Peltier effect, in which heat is transferred from one surface to the other surface by electrically connecting two metals or semiconductors in series and passing a direct current through them. That is, one surface from which heat is transferred serves as a heat absorption surface, and the other surface to which heat is transferred serves as a heat release surface. The Peltier element can adjust the amount of heat absorbed from one surface according to the value of the current supplied. Furthermore, the Peltier element can reverse the heat absorption surface and the heat release surface by reversing the polarity of the current supplied to the Peltier element. The heat exchange element 107 may also be another element capable of exchanging heat between the specimen contact portion 101 and the first heat storage latent heat agent 117.

[0029] The battery 109 is a rechargeable battery such as a lithium ion battery or a nickel-metal hydride battery that supplies power to each component of the ultrasonic probe 10. The battery 109 supplies power to, for example, the electronic components 119 and the heat exchange element 107. The battery 109 may be charged by power obtained by the ultrasonic probe 10 via an AC adapter, or may be charged after being detached from the ultrasonic probe 10. Note that instead of a rechargeable battery, a non-rechargeable battery may be used as the battery 109.

[0030] The changeover switch 111 is a switch for switching ON / OFF of the current flowing through the heat exchange element 107. Specifically, the changeover switch 111 is an electrical switch such as a semiconductor switch for switching ON / OFF of the current flowing from the battery 109 to the heat exchange element 107 under the control of the temperature control function 1052. Note that the changeover switch 111 is not limited to an electrical switch, and may be a mechanical switch. Furthermore, although the changeover switch 111 is controlled by the temperature control function 1052, the changeover switch 111 may be configured to switch ON / OFF of the current flowing through the heat exchange element 107 by operation by an operator. This changeover switch 111 corresponds to the switching unit in this embodiment.

[0031] The communication circuit 113 implements various protocols for wireless communication and realizes communication with the device main body 30 via wireless communication. The communication circuit 113 according to this embodiment transmits, for example, a reception signal generated by the reception circuit of the transmission / reception circuit 103 to the device main body 30 via wireless communication. Note that in the example of FIG. 1 according to this embodiment, the ultrasonic probe 10 and the device main body 30 communicate via wireless communication, but communication between the ultrasonic probe 10 and the device main body 30 is not limited to wireless communication. For example, when communication between the ultrasonic probe 10 and the device main body 30 is performed via wired communication, the communication circuit 113 may implement various protocols for wired communication and realize communication between the ultrasonic probe 10 and the device main body 30 via wired communication via a cable or the like.

[0032] The temperature sensor 115 is a sensor, such as a thermocouple, a resistance temperature detector, a thermistor, or an IC temperature sensor, that detects the temperature of the subject contact portion 101. The temperature sensor 115 detects the temperature of the subject contact portion 101 and outputs the detected temperature of the subject contact portion 101 to the processing circuit 105.

[0033] The first heat-storing latent heat agent 117 is a material that undergoes a phase transition from solid to liquid and absorbs (stores) latent heat when the temperature exceeds a predetermined phase transition temperature, and undergoes a phase transition from liquid to solid and releases (radiates) latent heat when the temperature drops below the predetermined phase transition temperature. This first heat-storing latent heat agent 117 is made of, for example, an organic material such as wax or paraffin, an inorganic hydrated salt material such as sodium sulfate decahydrate or sodium acetate trihydrate, or a low-melting-point metal material such as wood metal or gallium.

[0034] 3, the first heat storage latent heat agent 117 is thermally connected to the specimen contact portion 101 via the heat exchange element 107. The first heat storage latent heat agent 117 absorbs heat from the specimen contact portion 101 by controlling the heat exchange element 107, for example, by the processing circuit 105 or the changeover switch 111. The first heat storage latent heat agent 117 is also thermally connected to an electronic component 119 and absorbs heat from the electronic component 119. Furthermore, the first heat storage latent heat agent 117 is housed in, for example, a housing with high thermal conductivity.

[0035] For example, in the case where the battery 109 is a rechargeable battery, the first heat storage latent heat agent 117 is cooled when the battery 109 is charged. Furthermore, when the first heat storage latent heat agent 117 is cooled when the battery 109 is charged, the ultrasonic probe 10 may control the heat exchange element 107 to absorb the heat of the first heat storage latent heat agent 117 by the heat exchange element 107 and discharge the absorbed heat of the first heat storage latent heat agent 117 to the outside, thereby rapidly cooling the first heat storage latent heat agent 117.

[0036] Furthermore, the phase transition temperature of the first heat storage latent heat agent 117 is a temperature higher than the temperature reached by the specimen contact portion 101, for example, the limit temperature of the specimen contact portion 101. The limit temperature of the specimen contact portion 101 is, for example, 40°C or 43°C. Therefore, the phase transition temperature of the first heat storage latent heat agent 117 is, for example, a temperature between 43°C and 70°C, and more preferably, a temperature between 50°C and 65°C. If the phase transition temperature of the first heat storage latent heat agent 117 is less than 50°C, the operating temperature due to heat generation by the electronic component 119 is 60°C. Therefore, the first heat storage latent heat agent 117 may quickly undergo a phase transition by absorbing the heat of the electronic component 119, and it may be difficult to maintain the temperature of the specimen contact portion 101 at or below the limit temperature. Furthermore, if the first heat storage latent heat agent 117 has a phase transition temperature higher than 65°C, the operating temperature due to heat generation by the electronic component 119 is 60°C, and therefore, even if the electronic component 119 generates heat, the first heat storage latent heat agent 117 may not undergo phase transition, and as a result, the temperature inside the ultrasonic probe 10 rises, making it difficult to maintain the temperature of the subject contact portion 101 at or below the restricted temperature even if the subject contact portion 101 absorbs heat by the heat exchange element 107. For this reason, the first heat storage latent heat agent 117 of the ultrasonic diagnostic device 1 according to this embodiment preferably has a phase transition temperature of 50°C or higher and 65°C or lower. Depending on the ambient environment when the ultrasonic probe 10 is used and the characteristics of the material of the first heat-storage latent heat agent 117, the first heat-storage latent heat agent 117 may not immediately undergo a phase transition even if its phase transition temperature is less than 50°C, and the first heat-storage latent heat agent 117 may undergo a phase transition even if its phase transition temperature is higher than 65°C. For this reason, the first heat-storage latent heat agent 117 of the ultrasonic diagnostic device 1 according to this embodiment may have a phase transition temperature of 43°C or higher and 70°C or lower.

[0037] The electronic components 119 are electrical components that constitute circuits and the like built into the ultrasonic probe 10. The electronic components 119 constitute, for example, the transmitting / receiving circuit 103, the processing circuit 105, the communication circuit 113, and the like, and are electrically connected to the ultrasonic transducer. The electronic components 119 are thermally connected to the first heat-storage latent heat agent 117 via the second thermal conductor 123. Note that the electronic components 119 do not necessarily need to include all of the components that constitute the transmitting / receiving circuit 103, the processing circuit 105, the communication circuit 113, and the like. In other words, the electronic components 119 may be constituted by some of the components that constitute the transmitting / receiving circuit 103, the processing circuit 105, the communication circuit 113, and the like, or may include components other than the transmitting / receiving circuit 103, the processing circuit 105, and the communication circuit 113.

[0038] The first thermal conductor 121 is a heat transfer member made of a metal with high thermal conductivity, such as aluminum or copper, or graphite, etc. The first thermal conductor 121 thermally connects the specimen contact portion 101 and the first heat storage latent heat agent 117 via the heat exchange element 107.

[0039] The second thermal conductor 123 is a heat transfer member made of a metal such as aluminum or copper, or graphite, which has high thermal conductivity, similar to the first thermal conductor 121. The second thermal conductor 123 thermally connects the electronic component 119 and the first heat storage latent heat agent 117.

[0040] Next, the processing circuit 301, the memory circuit 303, and the communication circuit 305 in the device main body 30 will be described.

[0041] The processing circuitry 301 is a control circuit that performs overall control of the ultrasound diagnostic apparatus 1. The processing circuitry 301 is also an arithmetic circuit that performs various calculations, and is configured with a processor such as a CPU or a GPU. The processing circuitry 301 according to this embodiment generates ultrasound image data based on a reception signal received via the communication circuitry 305, and displays the generated ultrasound image data on the display 50, for example.

[0042] For this reason, the processing circuitry 301 according to this embodiment has a B-mode processing function 3011, a Doppler processing function 3012, an image generation function 3013, and a display control function 3014. The B-mode processing function 3011 corresponds to the B-mode control unit in this embodiment, the Doppler processing function 3012 corresponds to the Doppler processing unit in this embodiment, the image generation function 3013 corresponds to the image generation unit in this embodiment, and the display control function 3014 corresponds to the display control unit in this embodiment.

[0043] In the embodiment shown in FIG. 2 , the processing functions performed by the B-mode processing function 3011, Doppler processing function 3012, image generation function 3013, and display control function 3014 are stored in the storage circuitry 303 in the form of computer-executable programs. The processing circuitry 301 is a processor that reads and executes the programs from the storage circuitry 303 to realize the functions corresponding to the programs. In other words, the processing circuitry 301 in a state in which the programs have been read out has the functions shown in the processing circuitry 301 of FIG. 2 . Note that, although FIG. 2 illustrates an example in which the B-mode processing function 3011, Doppler processing function 3012, image generation function 3013, and display control function 3014 are realized by a single processing circuitry 301, the processing circuitry 301 may be configured by combining multiple independent processors, and each processor may execute a program to realize these functions.

[0044] The B-mode processing function 3011 is a function that generates B-mode data based on the reception signal received from the ultrasound probe 10. The processing circuit 301 uses the B-mode processing function 3011 to perform, for example, envelope detection processing, logarithmic compression processing, etc. on the reception signal received from the ultrasound probe 10, and generates B-mode data in which the signal strength is expressed as brightness.

[0045] The Doppler processing function 3012 is a function that generates Doppler data such as blood flow velocity, blood flow dispersion, and blood flow power based on the received signal received from the ultrasound probe 10. The Doppler processing function 3012 performs frequency analysis on the received signal received from the ultrasound probe 10 to generate Doppler data that extracts blood flow information based on the Doppler effect of a moving object within a ROI (Region Of Interest) set in the scan region.

[0046] The image generation function 3013 is a function that generates ultrasound image data based on the reception signal received from the ultrasound probe 10. Specifically, the image generation function 3013 is a function that generates various types of ultrasound image data based on the B-mode data generated by the B-mode processing function 3011 and / or the Doppler data generated by the Doppler processing function 3012. For example, the image generation function 3013 generates B-mode image data that represents the intensity of the reflected wave as brightness from the B-mode data generated by the B-mode processing function 3011. Furthermore, for example, the image generation function 3013 generates Doppler image data as an average velocity image, variance image, power image, or a combination of these images of a moving object from the Doppler data generated by the Doppler processing function 3012.

[0047] The display control function 3014 is a function that causes various types of ultrasound image data generated by the image generation function 3013 to be displayed on the display 50. Specifically, for example, the display control function 3014 controls the display on the display 50 of ultrasound image data including B-mode image data, Doppler image data, or both generated by the image generation function 3013.

[0048] The storage circuitry 303 is realized by, for example, a semiconductor memory element such as a RAM (Random Access Memory), a flash memory, a hard disk, an optical disk, etc. In this embodiment, for example, the storage circuitry 303 stores programs executed by circuits included in the ultrasound probe 10 and the device main body 30.

[0049] The communication circuit 305 implements various information communication protocols according to the type of network. The communication circuit 305 realizes communication with other devices via the network in accordance with these various protocols. For example, the communication circuit 305 according to this embodiment receives a reception signal generated by the reception circuit of the transmission / reception circuit 103 of the ultrasonic probe 10, transmits a control program for the ultrasonic probe 10 to the ultrasonic probe 10, and transmits ultrasonic images generated by the device main body 30 to other devices.

[0050] Next, the flow of heat in the ultrasonic probe 10 when the subject contact portion 101 according to the first embodiment is cooled will be described with reference to Figures 3 and 4. Figure 4 is an explanatory diagram illustrating the flow of heat in the ultrasonic probe 10 when the ultrasonic probe 10 according to the first embodiment is cooled. In the example shown in Figure 4, dotted lines indicate the direction of power supply and current flow. Furthermore, solid lines indicate the direction of heat flow, and the thickness of the solid lines indicates the amount of heat flow.

[0051] 4, when the ultrasonic probe 10 starts to be used, the battery 109 supplies power Pbe to the electronic component 119, as indicated by the dotted line a. Furthermore, the ultrasonic probe 10 causes the processing circuit 105 and / or the selector switch 111 to pass a current Pbp through the heat exchange element 107, as indicated by the dotted line b, so that the subject contact portion 101 is cooled. The power Pbe supplied from the battery 109 to the electronic component 119 is converted into heat by the electronic component 119. Much of the heat Pet converted by the electronic component 119 is then thermally conducted to the first heat storage latent heat agent 117 via the second thermal conductor 123, as indicated by the solid line c, and the first heat storage latent heat agent 117 stores much of the heat Pet converted by the electronic component 119.

[0052] 4, a portion of the heat Pek converted by the electronic component 119 is transferred to the subject contact portion 101, as indicated by the solid line d. At this time, a current Pbp flows through the heat exchange element 107 so as to cool the subject contact portion 101. Therefore, the heat Pkp of the subject contact portion 101 is absorbed by the heat exchange element 107 via the first thermal conductor 121, as indicated by the solid line e. Since the amount of heat Pek converted by the electronic component 119 and transferred to the subject contact portion 101 is the same as the amount of heat Pkp of the subject contact portion 101 absorbed by the heat exchange element 107, the temperature Tk of the subject contact portion 101 does not change. That is, the subject contact portion 101 is cooled by the heat exchange element 107. Then, as shown by the solid line f, heat Ppt, which is the sum of heat Pkp absorbed from the subject contact portion 101 and heat generated by the heat exchange element 107, is released to the first heat storage latent heat agent 117, and the first heat storage latent heat agent 117 stores the heat Ppt, which is the sum of heat Pkp absorbed from the subject contact portion 101 and heat generated by the heat exchange element 107. In this way, even if the phase transition temperature of the first heat storage latent heat agent 117 contained in the ultrasonic probe 10 is set higher than the limit temperature of the subject contact portion 101, the ultrasonic probe 10 can cool the subject contact portion 101 by the heat exchange element 107.

[0053] 5 is a flowchart illustrating the temperature control process executed by the ultrasonic probe 10 according to this embodiment. In this temperature control process, the ultrasonic probe 10 controls the heat exchange element 107 to control the temperature of the subject contact part 101 based on the temperature of the subject contact part 101 detected by the temperature sensor 115. For example, this temperature control process is executed when the use of the ultrasonic probe 100 is started.

[0054] 5, first, the ultrasonic probe 10 detects the temperature of the subject contact part 101 (step S11). The process of detecting the temperature of the subject contact part 101 is realized by the temperature control function 1052 in the processing circuit 105. Specifically, the ultrasonic probe 10 detects the temperature of the subject contact part 101 by the temperature sensor 115.

[0055] 5, the ultrasonic probe 10 determines whether the temperature of the subject contact part 101 is equal to or higher than a predetermined temperature (step S13). The process of determining whether the temperature is equal to or higher than the predetermined temperature is realized by the temperature control function 1052 in the processing circuit 105. Specifically, in step S11, the ultrasonic probe 10 determines whether the temperature of the subject contact part 101 detected by the temperature sensor 115 is equal to or higher than a predetermined temperature.

[0056] Then, in step S13, if it is determined that the temperature of the subject contact portion 101 is equal to or higher than the predetermined temperature (step S13: Yes), the ultrasonic probe 10 cools the subject contact portion 101 (step S15). This process of cooling the subject contact portion 101 is realized by the temperature control function 1052 in the processing circuit 105. Specifically, the ultrasonic probe 10 controls the heat exchange element 107 to absorb heat from the subject contact portion 101 through the first thermal conductor 121. Then, the ultrasonic probe 10 releases the heat of the subject contact portion 101 absorbed by the heat exchange element 107 to the first heat storage latent heat agent 117 through the first thermal conductor 121. In this way, the ultrasonic probe 10 cools the subject contact portion 101.

[0057] More specifically, for example, when the heat exchange element 107 is a Peltier element, the ultrasonic probe 10 passes a current through the Peltier element, and the surface of the Peltier element connected to the subject contact portion 101 serves as a heat absorption surface, and the surface of the Peltier element connected to the first heat storage latent heat agent 117 serves as a heat release surface. Then, the ultrasonic probe 10 absorbs heat from the subject contact portion 101 by the Peltier element via the first thermal conductor 121, and releases the heat from the subject contact portion 101 absorbed by the Peltier element to the first heat storage latent heat agent 117. In this way, the ultrasonic probe 10 cools the subject contact portion 101.

[0058] On the other hand, if the temperature of the subject contact portion 101 is lower than the predetermined temperature in step S13 (step S13: No), the ultrasonic probe 10 does not cool the subject contact portion 101 (step S17). This process of not cooling the subject contact portion 101 is realized by the temperature control function 1052 in the processing circuitry 105. Specifically, if the subject contact portion 101 is being cooled in step S15, the ultrasonic probe 10 controls the heat exchange element 107 to stop cooling the subject contact portion 101. On the other hand, if the subject contact portion 101 is not being cooled in step S15, the ultrasonic probe 10 maintains the non-cooled state.

[0059] The temperature control process according to this embodiment shown in FIG. 5 is repeatedly executed while the operator is using the ultrasonic probe 10, and ends when the operator has finished using the ultrasonic probe 10.

[0060] As described above, the ultrasound probe 10 of the ultrasound diagnostic device 1 according to this embodiment includes the heat exchange element 107 that thermally connects the subject contact portion 101 and the first heat storage latent heat agent 117 and enables heat exchange between the subject contact portion 101 and the first heat storage latent heat agent 117. This makes it possible to cool the subject contact portion 101 even when the first heat storage latent heat agent 117 has a phase transition temperature higher than the temperature reached by the subject contact portion 101. That is, in this embodiment, even if the electronic component 119 generates heat and the heat of the electronic component 119 is transferred to the subject contact portion 101, the heat exchange element 107 can absorb the heat of the subject contact portion 101 to cool the subject contact portion 101 while dissipating the absorbed heat of the subject contact portion 101 to the first heat storage latent heat agent 117. This makes it possible to maintain the temperature of the portion in contact with the subject P at or below the limit temperature. That is, it is possible to suppress a temperature rise in the subject contact portion 101.

[0061] Second Embodiment The ultrasound probe 10 of the ultrasound diagnostic apparatus 1 according to the first embodiment described above includes a heat exchange element 107 capable of exchanging heat between the subject contact portion 101 and the first heat storage latent heat agent 117. When the temperature of the subject contact portion 101 is equal to or higher than a predetermined temperature, the subject contact portion 101 is cooled by the heat exchange element 107. However, the subject contact portion 101 is not limited to being cooled only. Therefore, in the second embodiment, an ultrasound probe 10 of the ultrasound diagnostic apparatus 1 is described that is capable of not only cooling the subject contact portion 101 but also heating the subject contact portion 101 when the temperature of the subject contact portion 101 is equal to or lower than a predetermined temperature. Differences from the first embodiment described above will be described below. The configuration of the ultrasound diagnostic apparatus 1 according to this embodiment is the same as that shown in FIG. 1, and therefore a description thereof will be omitted.

[0062] Next, an example of the configuration of an ultrasound diagnostic apparatus 1 according to the second embodiment will be described with reference to FIGS. 3 and 6. The internal configuration of the ultrasound probe 10 of the ultrasound diagnostic apparatus 1 according to this embodiment is the same as that of the first embodiment shown in FIG. 3, and therefore a description thereof will be omitted. FIG. 6 is a block diagram showing an example of the electrical configuration of the ultrasound diagnostic apparatus according to the second embodiment, and corresponds to FIG. 2 of the first embodiment. As shown in FIGS. 3 and 6, the ultrasound diagnostic apparatus 1 according to this embodiment is configured to include an ultrasound probe 10, a device main body 30, a display 50, and an input interface 70. The configurations of the device main body 30, the display 50, and the input interface 70 are the same as those of the first embodiment, and therefore a description thereof will be omitted.

[0063] 3 and 6, the ultrasonic probe 10 according to this embodiment includes a subject contact portion 101, a transmitting / receiving circuit 103, a processing circuit 105a, a heat exchange element 107, a battery 109, a changeover switch 111a, a communication circuit 113, a temperature sensor 115, a first heat storage latent heat agent 117, an electronic component 119, a first thermal conductor 121, and a second thermal conductor 123. In the ultrasonic probe 10 according to this embodiment, the subject contact portion 101, the transmitting / receiving circuit 103, the processing circuit 105a, the heat exchange element 107, the battery 109, the changeover switch 111a, the communication circuit 113, the temperature sensor 115, the first heat storage latent heat agent 117, the electronic component 119, the first thermal conductor 121, and the second thermal conductor 123 are housed in a single housing. The configuration of the ultrasonic probe 10 according to the second embodiment, other than the processing circuitry 105a and the changeover switch 111a, is the same as that of the first embodiment described above, and therefore a description thereof will be omitted.

[0064] The processing circuitry 105a is, for example, a control circuit that performs overall control of the ultrasonic probe 10. The processing circuitry 105a according to this embodiment controls the transmitting and receiving circuitry 103 and the temperature of the subject contact unit 101.

[0065] For this reason, the processing circuit 105a according to this embodiment has a probe control function 1051 and a temperature control function 1052a. The probe control function 1051 corresponds to the probe control unit in this embodiment, and the temperature control function 1052a corresponds to the temperature control unit in this embodiment.

[0066] In the embodiment shown in FIG. 6 , the processing functions performed by the probe control function 1051 and the temperature control function 1052a are stored in the storage circuitry 303 of the device main body 30 as computer-executable programs. The processing circuitry 105a is a processor that reads and executes the programs from the storage circuitry 303 of the device main body 30 to realize the functions corresponding to the programs. In other words, the processing circuitry 105a, after reading the programs, has the functions shown in the processing circuitry 105a of FIG. 2 . Note that while FIG. 6 illustrates the probe control function 1051 and the temperature control function 1052a being realized by a single processing circuit 105a, the processing circuitry 105 may be configured by combining multiple independent processors, and each processor may execute a program to realize these functions. Note that the probe control function 1051 according to the second embodiment is the same as that of the first embodiment, and therefore a description thereof will be omitted.

[0067] The temperature control function 1052a is a function that controls the heat exchange element 107 based on the temperature of the specimen contact portion 101 detected by the temperature sensor 115. Specifically, the temperature control function 1052a according to this embodiment switches ON / OFF of the current flowing through the heat exchange element 107 and switches the polarity of the current flowing through the heat exchange element 107 based on the temperature of the specimen contact portion 101 detected by the temperature sensor 115.

[0068] The changeover switch 111a is a switch for switching ON / OFF of a current flowing through the heat exchange element 107 and for switching the polarity of the current flowing through the heat exchange element 107. Specifically, the changeover switch 111a is an electrical switch such as a semiconductor switch for switching ON / OFF of a current flowing through the heat exchange element 107 and for switching the polarity of the current flowing through the heat exchange element 107 under the control of the temperature control function 1052a. Note that the changeover switch 111a is not limited to an electrical switch and may be a mechanical switch. Furthermore, although the changeover switch 111 is controlled by the temperature control function 1052a, the changeover switch 111a may be operated by an operator to switch ON / OFF of a current flowing through the heat exchange element 107 and to switch the polarity of the current flowing through the heat exchange element 107. This changeover switch 111a corresponds to the switching unit in this embodiment.

[0069] Next, the heat flow in the ultrasonic probe 10 when cooling the subject contact portion 101 and the heat flow in the ultrasonic probe 10 when heating the subject contact portion 101 will be described with reference to Figures 3, 4, and 7. Figure 7 is an explanatory diagram for explaining the heat flow in the ultrasonic probe 10 when heating the subject contact portion 101 according to the second embodiment. In the example shown in Figure 7, dotted lines indicate the direction of power supply and current flow. Solid lines indicate the direction of heat flow, and the thickness of the solid lines indicates the amount of heat flow. Note that the heat flow in the ultrasonic probe 10 when cooling the subject contact portion 101 is the same as in the first embodiment described above, so a description thereof will be omitted.

[0070] 7, when the ultrasonic probe 10 starts to be used, the battery 109 supplies power Pbe to the electronic component 119, as indicated by the dotted line a. Furthermore, the ultrasonic probe 10, based on the processing circuit 105a and / or the selector switch 111a, supplies current Pbp to the heat exchange element 107 so that the subject contact portion 101 is heated, as indicated by the dotted line b. The power Pbe supplied from the battery 109 to the electronic component 119 is converted into heat by the electronic component 119. Much of the heat Pet converted by the electronic component 119 is thermally conducted to the first heat storage latent heat agent 117 via the second thermal conductor 123, as indicated by the solid line c, and the first heat storage latent heat agent 117 stores much of the heat Pet converted by the electronic component 119.

[0071] 7, a portion of the heat Pek converted by the electronic component 119 is transferred to the subject contact portion 101, as indicated by the solid line d. At this time, a current Pbp flows through the heat exchange element 107 so as to heat the subject contact portion 101. Therefore, the heat Pkp of the first heat storage latent heat agent 117 is absorbed by the heat exchange element 107 via the first thermal conductor 121, as indicated by the solid line g. Then, as indicated by the solid line h, the heat Pkp obtained by adding the heat Ppt absorbed from the first heat storage latent heat agent 117 and the heat generated by the heat exchange element 107 is released to the subject contact portion 101. Therefore, the portion of the heat Pek converted by the electronic component 119 transferred to the subject contact portion 101 and the heat Ppt of the first heat storage latent heat agent 117 absorbed by the heat exchange element 107 are transferred to the subject contact portion 101, and the temperature Tk of the subject contact portion 101 rises. The subject P is given heat Pkd transferred from the subject contact portion 101 at the point of contact with the subject contact portion 101. Therefore, the ultrasonic probe 10 can heat the subject contact portion 101.

[0072] 8 is a flowchart illustrating the temperature control process executed by the ultrasonic probe 10 according to this embodiment, and corresponds to FIG. 5 in the first embodiment. In this temperature control process, the ultrasonic probe 10 controls the heat exchange element 107 to control the temperature of the subject contact portion 101 based on the temperature of the subject contact portion 101 detected by the temperature sensor 115. For example, this temperature control process is executed when the use of the ultrasonic probe 10 is started. Note that the process of step S11 shown in FIG. 8 is the same as that in FIG. 5 in the first embodiment, and therefore a description thereof will be omitted.

[0073] 8, the ultrasonic probe 10 determines whether the temperature of the subject contact portion 101 is equal to or higher than a first temperature (step S21). The process of determining whether the temperature of the subject contact portion 101 is equal to or higher than the first temperature is implemented by the temperature control function 1052a in the processing circuit 105a. Specifically, in step S11, the ultrasonic probe 10 determines whether the temperature of the subject contact portion 101 detected by the temperature sensor 115 is equal to or higher than the first temperature. If it is determined in step S21 that the temperature of the subject contact portion 101 is equal to or higher than the first temperature (step S21: Yes), the ultrasonic probe 10 cools the subject contact portion 101 (step S15). The process of step S15 is equivalent to step S15 in the temperature control process of FIG. 5 in the first embodiment, and therefore a description thereof will be omitted.

[0074] On the other hand, if it is determined in step S21 that the temperature of the subject contact portion 101 is not equal to or higher than the first temperature (step S21: No), the ultrasonic probe 10 determines whether or not the temperature of the subject contact portion 101 is equal to or lower than a second temperature (step S23). The process of determining whether or not the temperature of the subject contact portion 101 is equal to or lower than the second temperature is realized by the temperature control function 1052a in the processing circuit 105a. Specifically, in step S11, it is determined whether or not the temperature of the subject contact portion 101 detected by the temperature sensor 115 is equal to or lower than the second temperature. The second temperature corresponds to a predetermined temperature in this embodiment.

[0075] Then, in step S23, if it is determined that the temperature of the subject contact portion 101 is equal to or lower than the second temperature (step S23: Yes), the ultrasonic probe 10 heats the subject contact portion 101 (step S25). This process of heating the subject contact portion 101 is realized by the temperature control function 1052a in the processing circuit 105a. Specifically, the ultrasonic probe 10 controls the heat exchange element 107 to absorb heat from the first heat storage latent heat agent 117 through the first thermal conductor 121. Then, the ultrasonic probe 10 releases the heat of the first heat storage latent heat agent 117 absorbed by the heat exchange element 107 to the subject contact portion 101 through the first thermal conductor 121. In this way, the ultrasonic probe 10 heats the subject contact portion 101.

[0076] More specifically, for example, when the heat exchange element 107 is a Peltier element, the ultrasonic probe 10 passes a current through the Peltier element so that the surface of the Peltier element connected to the subject contact portion 101 serves as a heat release surface and the surface of the Peltier element connected to the first heat storage latent heat agent 117 serves as a heat absorption surface. Then, the ultrasonic probe 10 absorbs heat from the first heat storage latent heat agent 117 by the Peltier element via the first thermal conductor 121, and releases the heat of the first heat storage latent heat agent 117 absorbed by the Peltier element to the subject contact portion 101. In this way, the ultrasonic probe 10 heats the subject contact portion 101.

[0077] On the other hand, if it is determined in step S23 that the temperature of the subject contact portion 101 is not equal to or lower than the second temperature (step S23: No), the ultrasonic probe 10 does not heat or cool the subject contact portion 101 (step S27). This process of not heating or cooling the subject contact portion 101 is realized by the temperature control function 1052a in the processing circuit 105a. Specifically, if the subject contact portion 101 is cooled in step S15 or heated in step S25, the ultrasonic probe 10 stops cooling or heating the subject contact portion 101 by the temperature control function 1052 or the changeover switch 111. On the other hand, if the subject contact portion 101 is not cooled in step S15 or heated in step S25, the ultrasonic probe 10 maintains a state in which the subject contact portion 101 is not cooled or heated.

[0078] The temperature control process according to this embodiment shown in FIG. 8 is repeatedly executed while the operator is using the ultrasonic probe 10, and ends when the operator has finished using the ultrasonic probe 10.

[0079] As described above, the ultrasound probe 10 of the ultrasound diagnostic device 1 according to this embodiment includes the heat exchange element 107 that thermally connects the subject contact portion 101 and the first heat-storing latent heat agent 117 and allows heat exchange between the subject contact portion 101 and the first heat-storing latent heat agent 117, and controls the heat exchange element 107 to cool and heat the subject contact portion 101, thereby maintaining a constant temperature of the subject contact portion 101. That is, in this embodiment, when the temperature of the subject contact portion 101 is equal to or higher than a first temperature, the temperature of the subject contact portion 101 can be cooled, and when the temperature of the subject contact portion 101 is equal to or lower than a second temperature, the temperature of the subject contact portion 101 can be heated. This makes it possible to maintain a temperature of the subject contact portion 101 that is comfortable for the subject P while suppressing a temperature rise at the portion in contact with the subject P.

[0080] Third Embodiment In the first and second embodiments described above, the first heat storage latent heat agent 117 and the battery 109 are accommodated in the same housing as the components other than the first heat storage latent heat agent 117 and the battery 109. However, the first heat storage latent heat agent 117 and the battery 109 do not necessarily have to be accommodated in the same housing as the components other than the first heat storage latent heat agent 117 and the battery 109. Therefore, in the third embodiment, the first heat storage latent heat agent 117 and the battery 109 are accommodated in a housing different from the components other than the first heat storage latent heat agent 117 and the battery 109. Below, differences from the first embodiment will be described based on the first embodiment described above. Note that the configuration of the ultrasound diagnostic device 1 according to this embodiment is the same as that shown in FIG. 1, and therefore description thereof will be omitted.

[0081] Next, an example of the configuration of the ultrasonic diagnostic apparatus 1 according to this embodiment will be described with reference to FIGS. 9 to 12. FIG. 9 is a block diagram showing an example of the electrical configuration of the ultrasonic diagnostic apparatus 1 according to the third embodiment, and corresponds to FIG. 2 in the first embodiment described above. FIG. 10 is an explanatory diagram illustrating the internal configuration of an ultrasonic probe 10 according to the third embodiment, and corresponds to FIG. 3 in the first embodiment described above. FIG. 11 is an explanatory diagram illustrating the internal configuration of a first housing of the ultrasonic probe 10 according to the third embodiment. FIG. 11(a) is an explanatory diagram illustrating the internal configuration of the first housing 11 of the ultrasonic probe 10 as seen from the front, and FIG. 11(b) is a diagram illustrating the first housing of the ultrasonic probe 10 as seen from the side. FIG. 12 is an explanatory diagram illustrating the internal configuration of a second housing of the ultrasonic probe 10 according to the third embodiment. FIG. 12(a) is an explanatory diagram illustrating the internal configuration of the second housing of the ultrasonic probe 10 as seen from the front, and FIG. 12(b) is a diagram illustrating the second housing of the ultrasonic probe 10 as seen from the side.

[0082] 9 to 12, the ultrasound diagnostic device 1 according to this embodiment is configured to include an ultrasound probe 10, a device main body 30, a display 50, and an input interface 70. Note that the configurations of the device main body 30, the display 50, and the input interface 70 are the same as those in the first embodiment, and therefore description thereof will be omitted. The ultrasound probe 10 according to this embodiment is configured to include a first housing 11 and a second housing 13.

[0083] The first housing 11 is a housing that houses at least the subject contact portion 101 and the electronic components 119. The second housing 13 is a housing that houses at least the heat exchange element 107, the battery 109, and the first heat storage latent heat agent 117. The second housing 13 can be detachably attached to the first housing 11. When the second housing 13 is detachably attached to the first housing 11, the second housing 13 is thermally and electrically connected to the first housing 11.

[0084] The first housing 11 according to this embodiment accommodates, for example, the subject contact section 101, the transmitting / receiving circuit 103, the processing circuit 105, the changeover switch 111, the communication circuit 113, the temperature sensor 115, the electronic components 119, the first housing-side first thermal conductor 121a, the first housing-side second thermal conductor 123a, the second heat storage latent heat agent 125, and the first housing-side electrode 127. The second housing 13 according to this embodiment accommodates, for example, the heat exchange element 107, the battery 109, the first heat storage latent heat agent 117, the second housing-side first thermal conductor 121b, the second housing-side second thermal conductor 123b, and the second housing-side electrode 129. The configuration of the ultrasonic probe 10 other than the first housing side first thermal conductor 121a, the first housing side second thermal conductor 123a, the second heat storage latent heat agent 125, the first housing side electrode 127, the second housing side first thermal conductor 121b, the second housing side second thermal conductor 123b, and the second housing side electrode 129 is the same as in the first embodiment described above, and therefore description thereof will be omitted.

[0085] The first housing-side first thermal conductor 121a is a heat transfer member contained in the first housing 11 and constitutes the first thermal conductor 121. The first housing-side first thermal conductor 121a is connected to the subject contact portion 101. When the second housing 13 is detachably attached to the first housing 11, the first housing-side first thermal conductor 121a is thermally connected to the second housing-side first thermal conductor 121b, and is thereby thermally connected to the first heat storage latent heat agent 117 via the second housing-side first thermal conductor 121b and the heat exchange element 107.

[0086] The first housing side second thermal conductor 123a is a heat transfer member contained in the first housing 11 and constitutes the second thermal conductor 123. The first housing side second thermal conductor 123a is connected to the electronic component 119. Furthermore, when the second housing 13 is detachably attached to the first housing 11, the first housing side second thermal conductor 123a is thermally connected to the second housing side second thermal conductor 123b, and is thereby thermally connected to the first heat storage latent heat agent 117 via the second housing side second thermal conductor 123b.

[0087] Like the first heat-storage latent heat agent 117, the second heat-storage latent heat agent 125 is a material that undergoes a phase transition from solid to liquid and absorbs (stores) latent heat when the temperature exceeds a predetermined phase transition temperature, and undergoes a phase transition from liquid to solid and releases (radiates) latent heat when the temperature drops below the predetermined phase transition temperature. The second heat-storage latent heat agent 125 may be made of, for example, an organic material such as wax or paraffin, an inorganic hydrated salt material such as sodium sulfate decahydrate or sodium acetate trihydrate, or a low-melting-point metal material such as wood metal or gallium. As shown in FIG. 9 , the second heat-storage latent heat agent 125 is thermally connected to the subject contact portion 101 via the first housing-side first thermal conductor 121a and absorbs heat from the subject contact portion 101. The second heat-storage latent heat agent 125 may also be thermally connected to the subject contact portion 101 without the first housing-side first thermal conductor 121a.

[0088] The phase transition temperature of the second heat storage latent heat agent 125 is lower than that of the first heat storage latent heat agent 117, for example, a temperature of 43°C or lower, preferably a temperature between 38°C and 43°C. If the second heat storage latent heat agent 125 is lower than 38°C, the heat storage latent heat agent may quickly undergo a phase transition due to the body temperature of the subject P, making it difficult to maintain the temperature of the subject contact portion 101 at or below the restricted temperature. If the second heat storage latent heat agent 125 is higher than 43°C, the subject contact portion 101 may reach a temperature higher than 43°C, making it difficult to maintain the temperature of the subject contact portion 101 at or below the restricted temperature.

[0089] The first housing-side electrode 127 is an electrode housed in the first housing 11 and is electrically connected to the electronic component 119. When the second housing 13 is detachably attached to the first housing 11, the first housing-side electrode 127 is electrically connected to the second housing-side electrode 129, and is thereby electrically connected to the battery 109 via the second housing-side electrode 129. Note that, as shown in FIG. 11(b), the first housing-side electrode 127 is composed of three electrodes, but the number of electrodes of the first housing-side electrode 127 is not limited to this. In other words, the number of electrodes of the first housing-side electrode 127 is arbitrary, and may be two or less electrodes, or may be four or more electrodes.

[0090] The second housing-side first thermal conductor 121b is a member constituting the first thermal conductor 121 housed in the second housing 13. The second housing-side first thermal conductor 121b is thermally connected to the first heat storage latent heat agent 117 via the heat exchange element 107. Furthermore, when the second housing 13 is detachably attached to the first housing 11, the second housing-side first thermal conductor 121b is thermally connected to the first housing-side first thermal conductor 121a, and the second housing-side first thermal conductor 121b is thermally connected to the subject contact portion 101 via the first housing-side first thermal conductor 121a.

[0091] The second housing side second thermal conductor 123b is a member provided in the second housing 13 and constitutes the second thermal conductor 123. The second housing side second thermal conductor 123b is thermally connected to the first heat storage latent heat agent 117. Furthermore, when the second housing 13 is detachably attached to the first housing 11, the second housing side second thermal conductor 123b is thermally connected to the first housing side second thermal conductor 123a, and is thereby thermally connected to the electronic component 119 via the first housing side second thermal conductor 123a.

[0092] The second housing-side electrode 129 is an electrode housed in the second housing 13 and is electrically connected to the heat exchange element 107, the battery 109, and the like. When the second housing 13 is detachably attached to the first housing 11, the second housing-side electrode 129 is electrically connected to the first housing-side electrode 127, and is thereby electrically connected to the electronic component 119 via the first housing-side electrode 127. Note that, as shown in FIG. 12(b), the second housing-side electrode 129 is composed of three electrodes, but the number of electrodes of the second housing-side electrode 129 is not limited to this. That is, the number of electrodes of the second housing-side electrode 129 is arbitrary, and may be two or less electrodes, or may be four or more electrodes.

[0093] As described above, according to the ultrasonic probe 10 of the ultrasonic diagnostic apparatus 1 of this embodiment, the subject contact portion 101 and the electronic components 119 are housed in the first housing 11, and the heat exchange element 107, the battery 109, and the first heat storage latent heat agent 117 are housed in the second housing 13, and the second housing 13 can be detachably attached to the first housing 11. Therefore, when the first heat storage latent heat agent 117 attached to the first housing is no longer able to store heat, the operator can continue to use the ultrasonic probe 10 by removing the second housing 13 from the first housing 11 and attaching the first housing 11 to another second housing 13 in which the first heat storage latent heat agent 117 has been cooled and the battery 109 has been charged.

[0094] The above description of the third embodiment is a description of the case where it is applied to the first embodiment, but it is clear that this embodiment can also be applied to the second embodiment.

[0095] [Modifications of the first to third embodiments] In the ultrasonic probe 10 of the ultrasonic diagnostic device 1 according to the first to third embodiments described above, the first heat-storage latent heat agent 117 and the second heat-storage latent heat agent 125 are not limited to organic materials, inorganic hydrated salt materials, low-melting-point metal materials, etc., and other materials may be used. That is, any material may be used for the first heat-storage latent heat agent 117 and the second heat-storage latent heat agent 125. For example, a solid phase transition material (electronic phase transition heat storage material) may be used. This solid phase transition material is a material that undergoes a phase transition from a first solid phase having a different crystalline structure to a second solid phase and absorbs latent heat when the temperature exceeds a predetermined phase transition temperature, and undergoes a phase transition from the second solid phase to the first solid phase and releases latent heat when the temperature drops below the predetermined phase transition temperature.

[0096] In the ultrasound diagnostic devices 1 according to the first to third embodiments described above, the ultrasound probe 10 and the device main body 30 are connected by wireless communication, but the ultrasound probe 10 and the device main body 30 may be connected by wired communication via a cable.

[0097] The term "processor" used in the above description refers to a circuit such as a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a programmable logic device (e.g., a simple programmable logic device (SPLD), a complex programmable logic device (CPLD), and a field programmable gate array (FPGA)). A processor realizes its functions by reading and executing a program stored in a memory circuit. Instead of storing a program in a memory circuit, the processor may be configured to directly incorporate the program into its circuit. In this case, the processor realizes its functions by reading and executing the program embedded in the circuit. A processor is not limited to being configured as a single circuit, but may also be configured as a single processor by combining multiple independent circuits to realize its functions. Furthermore, multiple components may be integrated into a single processor to realize its functions.

[0098] Although several embodiments have been described above, these embodiments are presented only as examples and are not intended to limit the scope of the invention. The novel apparatus and method described herein may be embodied in various other forms. Furthermore, various omissions, substitutions, and modifications may be made to the forms of the apparatus and method described herein without departing from the spirit of the invention. The appended claims and their equivalents are intended to cover such forms and modifications that fall within the scope and spirit of the invention. [Explanation of symbols]

[0099] 1...ultrasonic diagnostic device, 10...ultrasonic probe, 30...device main body, 50...display, 70...input interface, 101...subject contact portion, 103...transmitting / receiving circuit, 105, 301...processing circuit, 107...heat exchange element, 109...battery, 111...selector switch, 113, 305...communication circuit, 115...temperature sensor, 117...first heat storage latent heat agent, 119...electronic component, 121...first thermal conductor, 123...second thermal conductor, 303...storage circuit

Claims

1. a subject contact unit having an ultrasonic transducer that transmits and receives the ultrasonic waves to and from the subject via a subject contact surface that contacts the subject on an ultrasonic transmission / reception side; a first thermal storage latent heat agent having a phase transition temperature higher than a temperature reached by the specimen contact portion; a heat exchange element that thermally connects the specimen contact portion and the first heat-storage latent heat agent and is capable of exchanging heat between the specimen contact portion and the first heat-storage latent heat agent; an electronic component electrically connected to the ultrasonic vibrator and thermally connected to the first heat storage latent heat agent; a second heat-storage latent heat agent that is disposed on a side opposite to the first heat-storage latent heat agent via the heat exchange element, that is thermally connected to the specimen contact portion, and that has a phase transition temperature lower than that of the first heat-storage latent heat agent; An ultrasound probe comprising:

2. The ultrasound probe of claim 1 , further comprising a battery that provides power to the electronic components and / or the heat exchange element.

3. the subject contact unit and the electronic component are housed in a first housing, the first heat storage latent heat agent, the heat exchange element, and the battery are housed in a second housing; The ultrasonic probe according to claim 2 , wherein the second housing is detachably attached to the first housing.

4. The ultrasonic probe according to claim 3 , wherein the second housing is thermally and electrically connected to the first housing when the second housing is detachably attached to the first housing.

5. 5. The ultrasonic probe according to claim 2, wherein the first heat-storing latent heat agent is cooled when the battery is being charged.

6. a first thermal conductor that thermally connects the specimen contact portion and the first heat-storing latent heat agent via the heat exchange element; 6. The ultrasonic probe according to claim 1, further comprising a second thermal conductor that thermally connects the electronic component and the first heat-storage latent heat agent.

7. 7. The ultrasonic probe according to claim 1, wherein the first heat-storing latent heat agent has a phase transition temperature of 50 to 65°C.

8. The ultrasonic probe according to claim 1 , wherein the second heat-storing latent heat agent has a phase transition temperature of 43° C. or less.

9. a temperature sensor for detecting the temperature of the specimen contact portion; 9. The ultrasound probe according to claim 1, further comprising: a temperature control unit that controls the heat exchange element based on the temperature detected by the temperature sensor to control the temperature of the subject contact portion.

10. The ultrasonic probe according to claim 9 , wherein the temperature control unit heats the subject contact portion when the temperature detected by the temperature sensor is equal to or lower than a predetermined temperature.

11. 11. The ultrasonic probe according to claim 1, further comprising a switching unit that switches on / off and / or polarity of a current flowing through the heat exchange element.

12. 12. The ultrasonic probe according to claim 1, wherein the heat exchange element is a Peltier element.

13. An ultrasonic probe according to any one of claims 1 to 12; an apparatus main body including an image generating unit that generates ultrasound image data based on a reception signal received from the ultrasound probe; An ultrasound diagnostic device comprising:

Images