Mask device manufacturing apparatus, mask, and mask device manufacturing method

Abstract

To provide an apparatus and method for manufacturing a mask device, capable of accurately vapor-depositing a vapor deposition material on a substrate.SOLUTION: An apparatus 40 for manufacturing a mask device includes: a mask 20 having a longitudinal direction and a transverse direction; and a clamping device 50 for holding the mask. The mask includes a pair of mask end parts 30 positioned on both sides in the longitudinal direction D2 and a mask intermediate part positioned between the pair of mask end parts and including a plurality of open holes; the mask end part includes a notch 32 having the notched mask end part and a plurality of grip parts 35 projected in the transverse direction and the longitudinal direction through the notch; the clamping device includes a plurality of clamps 51 holding the corresponding grip part; the size of the grip part in the transverse direction is 10 mm or more; and the ratio of the size of the grip part in the transverse direction to that of the clamp in the transverse direction is 1 or less.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] An embodiment of the present disclosure relates to a mask device manufacturing apparatus, a mask, and a method for manufacturing a mask device. [Background technology]

[0002] There is a market demand for high-definition display devices in electronic devices such as smartphones and tablet PCs, which have pixel densities of, for example, 400 ppi or more or 800 ppi or more.

[0003] As such a display device, organic EL display devices with good responsiveness and / or high contrast have attracted attention. A known method for forming pixels of an organic EL display device is to form pixels in a desired pattern on a substrate using a mask with through-holes arranged in a desired pattern. More specifically, a vapor deposition device is first prepared. Next, the substrate is held in the vapor deposition device, and the mask is brought into close contact with the substrate. Then, a vapor deposition process is performed in which a vapor deposition material, such as an organic material and / or an inorganic material, is deposited on the substrate.

[0004] The deposition apparatus for performing the deposition process includes a mask device including a mask and a frame that supports the mask. In the mask device, the mask is fixed to the frame by welding. The frame supports the mask in a tensioned state so as to prevent the mask from bending. In the manufacturing process of the mask device, first, a clamping device clamps the edge of the mask placed on a mounting table and pulls the mask in the surface direction to apply tension. Next, with the mask still tensioned by the clamping device, a conveying device conveys the mask onto the frame. Then, a welding device welds and fixes the mask to the frame. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2020-84306 Summary of the Invention [Problem to be solved by the invention]

[0006] In order to precisely fabricate organic EL display devices with high pixel density, it is necessary to deposit the deposition material onto the substrate with high precision. However, during the manufacturing process of the mask device, sufficient tension may not be applied to the mask when it is pulled, resulting in wrinkles on the mask. In this case, the positions of the through-holes in the mask may deviate from the designed positions during the deposition process, potentially reducing the positional accuracy of the deposition. Furthermore, during the manufacturing process of the mask device, the edges of the mask may be deformed, causing them to bend. In this case, the clamping device may not be able to clamp the edges of the mask, potentially resulting in a manufacturing defect of the mask device. [Means for solving the problem]

[0007] One embodiment of the present disclosure is a mask device manufacturing apparatus, a mask having a longitudinal direction and a lateral direction; a clamping device that clamps the mask, the mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes, The mask end includes a notch portion formed by cutting out the mask end, and a plurality of grip portions arranged in the short-side direction via the notch portion and protruding in the long-side direction, the clamping device includes a plurality of clamps that clamp the corresponding grip portions, The dimension of the grip portion in the short direction is 10 mm or more, In the mask device manufacturing apparatus, a ratio of a dimension of the grip portion in the short side direction to a dimension of the clamp in the short side direction is 1 or less. [Effects of the Invention]

[0008] According to an embodiment of the present disclosure, the reliability of the mask device can be improved. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view showing an example of a vapor deposition apparatus. [Figure 2] FIG. 2 is a plan view showing an example of a mask device. [Figure 3] FIG. 3 is an enlarged plan view of the mask of the mask device of FIG. [Figure 4] FIG. 4 is a cross-sectional view showing a through-hole in the mask of FIG. [Figure 5] FIG. 5 is an enlarged plan view of the mask edge of the mask of FIG. [Figure 6] FIG. 6 is a plan view showing an example of a manufacturing apparatus for a mask device. [Figure 7] FIG. 7 is a plan view showing a mask placed on a mounting table of the mask device manufacturing apparatus of FIG. [Figure 8] FIG. 8 is a cross-sectional view taken along line AA in FIG. [Figure 9] FIG. 9 is an enlarged plan view of the mask edge of the mask of FIG. [Figure 10] FIG. 10 is a cross-sectional view illustrating a process for forming a resist pattern on a metal plate, for explaining the method for manufacturing a mask device. [Figure 11] FIG. 11 is a cross-sectional view illustrating a process for etching the metal plate from the first metal surface, for explaining the method for manufacturing the mask device. [Figure 12] FIG. 12 is a cross-sectional view illustrating a process for etching the metal plate from the second metal surface, for explaining the method for manufacturing the mask device. [Figure 13] FIG. 13 is a cross-sectional view for explaining the method for manufacturing the mask device, showing the step of removing the resin and the resist pattern from the metal plate. [Figure 14]FIG. 14 is a diagram for explaining the method of manufacturing the mask device, and is a plan view showing a step of forming the mask end portion of the mask. [Figure 15] FIG. 15 is a cross-sectional view illustrating a mask transport step for explaining the method for manufacturing the mask device. [Figure 16] FIG. 16 is a cross-sectional view illustrating a process for fixing the mask to the frame, illustrating the method for manufacturing the mask device. [Figure 17] FIG. 17 is a cross-sectional view illustrating a process for preparing a vapor deposition apparatus, illustrating the method for manufacturing an organic device. [Figure 18] FIG. 18 is a cross-sectional view illustrating a step of holding a substrate, illustrating the method for manufacturing an organic device. [Figure 19] FIG. 19 is a cross-sectional view illustrating the process for manufacturing an organic device, showing the step of bringing the mask into close contact with the substrate. [Figure 20] FIG. 20 is a cross-sectional view showing an example of an organic device manufactured using the vapor deposition apparatus. [Figure 21] FIG. 21 is an enlarged plan view showing a mask edge portion of a mask in a mask device manufacturing apparatus according to a comparative example. [Figure 22] FIG. 22 is an enlarged plan view showing a mask end portion of a mask in a mask device manufacturing apparatus according to another comparative example. [Figure 23] FIG. 23 is an enlarged plan view showing a mask end portion of a mask in a mask device manufacturing apparatus according to yet another comparative example. [Figure 24] FIG. 24 is an enlarged plan view showing a mask end portion of a mask in a mask device manufacturing apparatus according to yet another comparative example. [Figure 25] FIG. 25 is an enlarged plan view showing a mask end portion of a mask in a mask device manufacturing apparatus according to a modified example. [Figure 26] FIG. 26 is a diagram showing the evaluation results of the mask device manufacturing apparatus according to one embodiment. [Figure 27]FIG. 27 is a diagram showing the evaluation results of the mask device manufacturing apparatus according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] In this specification and drawings, unless otherwise specified, terms that refer to a material that forms the basis of a certain configuration, such as "substrate," "base material," "plate," "sheet," and "film," are not to be distinguished from one another solely on the basis of differences in name.

[0011] In this specification and drawings, "plan view" refers to the state of the target plate-like member as viewed from a normal direction perpendicular to the planar direction of the plate-like member when viewed overall and globally. For example, when a certain plate-like member "has a rectangular shape in a plan view," this means that the member has a rectangular shape when viewed from the normal direction.

[0012] In this specification and drawings, unless otherwise specified, terms that specify shapes, geometric conditions, and their degrees, such as "parallel" and "orthogonal," and values ​​of lengths and angles, are not bound by strict meanings, but are interpreted to include a range within which similar functions can be expected.

[0013] In this specification and drawings, unless otherwise specified, when a certain component, such as a certain region, is referred to as "above" or "below," "upper" or "lower," or "upward" or "below" another component, such as another region, this includes cases where the component is in direct contact with the other component. It also includes cases where another component is contained between the component and the other component, i.e., cases where the components are in indirect contact. Furthermore, unless otherwise specified, the terms "above," "upper side," or "upper," or "under," "lower side," or "lower" may be used in the up-down direction.

[0014] In this specification and drawings, unless otherwise specified, the same or similar symbols are used to designate the same parts or parts having similar functions, and repeated explanations may be omitted. Furthermore, for the sake of convenience, the dimensional ratios of the drawings may differ from the actual ratios, and some components may be omitted from the drawings.

[0015] Unless otherwise specified in this specification and drawings, the present invention may be combined with other embodiments and modified examples to the extent that no contradictions arise. Furthermore, other embodiments may be combined with each other, or other embodiments may be combined with modified examples to the extent that no contradictions arise. Furthermore, modified examples may be combined with each other to the extent that no contradictions arise.

[0016] Unless otherwise specified in this specification and drawings, when a plurality of steps are disclosed in a manufacturing method or other method, other steps that are not disclosed may be performed between the disclosed steps. In addition, the order of the disclosed steps is arbitrary as long as no contradiction occurs.

[0017] In this specification and drawings, unless otherwise specified, a numerical range expressed by the symbol "to" includes the numerical values ​​before and after the symbol "to." For example, the numerical range defined by the expression "34 to 38 mass%" is the same as the numerical range defined by the expression "34 mass% or more and 38 mass% or less."

[0018] In one embodiment of this specification, an example will be described in which the mask is a deposition mask used to pattern an organic material into a desired pattern on a substrate when manufacturing an organic EL display device. However, the use of the mask is not particularly limited, and the present embodiment can be applied to masks used for various purposes. For example, the mask of the present embodiment may be used to manufacture a device for displaying or projecting images or videos to express virtual reality (VR) or augmented reality (AR).

[0019] A first aspect of the present disclosure is a manufacturing apparatus for a mask device, comprising: a mask having a longitudinal direction and a lateral direction; a clamping device that clamps the mask, the mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes, The mask end includes a notch portion formed by cutting out the mask end, and a plurality of grip portions arranged in the short-side direction via the notch portion and protruding in the long-side direction, the clamping device includes a plurality of clamps that clamp the corresponding grip portions, The dimension of the grip portion in the short direction is 10 mm or more, In the mask device manufacturing apparatus, a ratio of a dimension of the grip portion in the short side direction to a dimension of the clamp in the short side direction is 1 or less.

[0020] A second aspect of the present disclosure is a mask device manufacturing apparatus according to the first aspect, The clamp may hold at least an edge of the mask in the short side direction.

[0021] A third aspect of the present disclosure is a mask device manufacturing apparatus according to each of the first aspect and the second aspect, The cutout portion may include a linear portion extending linearly in the longitudinal direction from an edge of the mask end in the longitudinal direction, and a semicircular portion adjacent to the linear portion on the opposite side of the edge in the longitudinal direction, The clamp may clamp the grip portion at a position closer to the edge than the semicircular portion.

[0022] A fourth aspect of the present disclosure is a mask device manufacturing apparatus according to the third aspect, The clamp may clamp the grip portion at a position closer to the end edge than a center position of the linear portion in the longitudinal direction.

[0023] A fifth aspect of the present disclosure is a mask device manufacturing apparatus according to each of the first to fourth aspects described above, The grip portion may include a clamping region that is clamped by the clamp, The dimension of the clamping region in the short-side direction may be greater than the dimension of the clamping region in the long-side direction.

[0024] A sixth aspect of the present disclosure is a mask device manufacturing apparatus, comprising: a mask having a longitudinal direction and a lateral direction; a clamping device that clamps the mask, the mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes, The mask end includes a notch portion formed by cutting out the mask end, and a plurality of grip portions arranged in the short-side direction via the notch portion and protruding in the long-side direction, the clamping device includes a plurality of clamps that clamp the corresponding grip portions, the grip portion includes a clamping region that is clamped by the clamp, The device for manufacturing a mask device is such that the dimension of the clamping region in the short direction is larger than the dimension of the clamping region in the long direction.

[0025] A seventh aspect of the present disclosure is a mask having a longitudinal direction and a lateral direction and being clamped by a clamping device, A pair of mask end portions located on both sides in the longitudinal direction; a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes; The mask end includes a notch portion formed by cutting out the mask end, and a plurality of grip portions arranged in the short-side direction via the notch portion and protruding in the long-side direction, the grip portions being clamped by corresponding clamps of the clamping device, The dimension of the grip portion in the short direction is 10 mm or more, The mask has a ratio of the dimension of the grip portion in the short side direction to the dimension of the clamp in the short side direction of 1 or less.

[0026] An eighth aspect of the present disclosure is a mask according to the seventh aspect, The cutout portion may include a linear portion extending linearly in the longitudinal direction from the edge of the mask end in the longitudinal direction, and a semicircular portion adjacent to the linear portion on the opposite side of the edge in the longitudinal direction.

[0027] A ninth aspect of the present disclosure is a method for manufacturing a mask device, comprising: providing a mask having a longitudinal direction and a transverse direction; and clamping the mask with a clamping device, the mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes, The mask end includes a notch portion formed by cutting out the mask end, and a plurality of grip portions arranged in the short-side direction via the notch portion and protruding in the long-side direction, the clamping device includes a plurality of clamps that clamp the corresponding grip portions, The dimension of the grip portion in the short direction is 10 mm or more, In the method for manufacturing a mask device, a ratio of a dimension of the grip portion in the short side direction to a dimension of the clamp in the short side direction is 1 or less.

[0028] A tenth aspect of the present disclosure provides a method for manufacturing a mask device according to the ninth aspect, comprising: In the step of clamping the mask, the clamp may clamp an edge of the mask in at least the short side direction.

[0029] An eleventh aspect of the present disclosure is a method for manufacturing a mask device according to each of the ninth aspect and the tenth aspect, comprising: The cutout portion may include a linear portion extending linearly in the longitudinal direction from an edge of the mask end in the longitudinal direction, and a semicircular portion adjacent to the linear portion on the opposite side of the edge in the longitudinal direction, In the step of clamping the mask, the clamp may clamp the grip portion at a position closer to the edge than the semicircular portion.

[0030] A twelfth aspect of the present disclosure is a method for manufacturing a mask device according to the eleventh aspect, comprising: In the step of clamping the mask, the clamp may clamp the grip portion at a position closer to the edge of the linear portion in the longitudinal direction than a center position of the linear portion.

[0031] A thirteenth aspect of the present disclosure is a method for manufacturing a mask device according to each of the ninth to twelfth aspects described above, In the step of clamping the mask, a clamping region of the grip portion may be clamped by the clamp, The dimension of the clamping region in the short-side direction may be greater than the dimension of the clamping region in the long-side direction.

[0032] A fourteenth aspect of the present disclosure is a method for manufacturing a mask device, comprising: providing a mask having a longitudinal direction and a transverse direction; and clamping the mask with a clamping device, the mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes, The mask end includes a notch portion formed by cutting out the mask end, and a plurality of grip portions arranged in the short-side direction via the notch portion and protruding in the long-side direction, the clamping device includes a plurality of clamps that clamp the corresponding grip portions, In the step of clamping the mask, the clamping region of the grip portion is clamped by the clamp, A method for manufacturing a mask device, wherein the dimension of the clamping region in the short direction is larger than the dimension of the clamping region in the long direction.

[0033] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the embodiment described below is an example of an embodiment of the present disclosure, and the present disclosure should not be interpreted as being limited to only these embodiments.

[0034] First, a vapor deposition apparatus 1 will be described with reference to Fig. 1. The vapor deposition apparatus 1 is an apparatus for performing a vapor deposition process in which a vapor deposition material 7 is vapor-deposited on a target object.

[0035] As shown in FIG. 1 , the vapor deposition apparatus 1 may include a vapor deposition source 6, a heater 8, and a mask device 10. The vapor deposition source 6, the heater 8, and the mask device 10 are disposed inside the vapor deposition apparatus 1. Although not shown, the vapor deposition apparatus 1 may also include an exhaust means for creating a vacuum atmosphere inside the vapor deposition apparatus 1. The vapor deposition source 6 is, for example, a crucible, and contains a vapor deposition material 7 such as an organic light-emitting material. The heater 8 heats the vapor deposition source 6 to evaporate the vapor deposition material 7 under a vacuum atmosphere. The mask device 10 is disposed opposite the vapor deposition source 6.

[0036] As shown in FIG. 1, the mask device 10 may include a frame 15 and a mask 20. The frame 15 supports the mask 20 in a state where it is pulled in the direction of its surface so as to prevent the mask 20 from bending. The mask 20 may be fixed to the frame 15. The mask 20 may include a first mask surface 20a and a second mask surface 20b. The first mask surface 20a is located on the substrate 110 side. The second mask surface 20b is located on the opposite side to the first mask surface 20a. The frame 15 may also include a first frame surface 15a and a second frame surface 15b. The first frame surface 15a faces and is in contact with the second mask surface 20b. The second frame surface 15b is located on the opposite side to the first frame surface 15a.

[0037] 1, the mask device 10 may be disposed in a vapor deposition apparatus 1 so that the mask 20 faces and contacts a substrate 110, which is an object to which the vapor deposition material 7 is to be attached. The mask 20 includes a plurality of through-holes 25 that allow the vapor deposition material 7 coming from the vapor deposition source 6 to pass through.

[0038] As shown in FIG. 1, the deposition apparatus 1 may include a substrate holder 2 that holds a substrate 110. The substrate holder 2 may be movable in the thickness direction of the substrate 110, i.e., the up-down direction (vertical direction). The substrate holder 2 may also be movable in a first direction D1 (see FIG. 2) that is the widthwise direction of the mask 20 and a second direction D2 (see FIG. 2) that is the lengthwise direction of the mask 20. Here, the thickness direction of the substrate 110 is also referred to as a third direction D3. The first direction D1, the second direction D2, and the third direction D3 may be perpendicular to one another.

[0039] 1, the deposition apparatus 1 may include a mask holder 3 that holds a mask device 10. The mask holder 3 may be movable in a third direction D3. The mask holder 3 may also be movable in a first direction D1 and a second direction D2.

[0040] By moving at least one of the substrate holder 2 and the mask holder 3, the position of the mask 20 of the mask device 10 relative to the substrate 110 can be adjusted.

[0041] As shown in FIG. 1, the deposition apparatus 1 may include a magnet 5. The magnet 5 may be disposed above the substrate holder 2. As shown in FIG. 1, the magnet 5 may be located on the surface of the substrate holder 2 opposite the mask device 10. The magnet 5 can attract the mask 20 of the mask device 10 toward the substrate 110 by magnetic force. This allows the mask 20 to be closely attached to the substrate 110, preventing a gap from being formed between the mask 20 and the substrate 110. This prevents a shadow from being generated during the deposition process, improving the dimensional accuracy and positional accuracy of the deposition material 7 attached to the substrate 110. Here, the shadow refers to a phenomenon in which the deposition material 7 enters the gap between the mask 20 and the substrate 110, causing the thickness of the deposition material 7 attached to the substrate 110 to become non-uniform.

[0042] Next, the mask device 10 will be described in detail with reference to FIGS.

[0043] As described above, the mask device 10 includes a frame 15. As shown in FIG. 2, the frame 15 is formed in a rectangular frame shape in a plan view. An opening 15d is formed inside the frame 15. The opening 15d penetrates from the first frame surface 15a to the second frame surface 15b. In the vapor deposition process, the vapor deposition material 7 evaporated from the vapor deposition source 6 passes through the opening 15d of the frame 15 and adheres to the substrate 110. Here, a plan view means viewing the mask device 10 along the normal direction of the first frame surface 15a of the frame 15 or the normal direction of the first mask surface 20a of the mask 20.

[0044] As shown in Fig. 2, the frame 15 may include alignment marks 15e for aligning the mask 20 with respect to the frame 15. The alignment marks 15e are provided at positions on the frame 15 that do not overlap the mask 20 in a plan view. As shown in Fig. 2, the alignment marks 15e may be provided at each of the four corners of the frame 15. This prevents the alignment marks 15e from being hidden by the mask 20 when positioning the mask 20. This makes it easier to align the mask 20.

[0045] As described above, the mask device 10 includes a mask 20. As shown in FIG. 2, the mask device 10 may include a plurality of masks 20. The mask 20 may have a short side direction in a first direction D1 and a long side direction in a second direction D2 perpendicular to the first direction D1. In other words, the mask 20 has an elongated shape, and the first direction D1 is identified as the short side direction of the mask 20, and the second direction D2 is identified as the long side direction of the mask 20. As shown in FIG. 2, the plurality of masks 20 may be arranged in the first direction D1. In the illustrated example, ten masks 20 are arranged in the first direction D1.

[0046] In FIG. 2, the symbol W1 represents the dimension (width dimension) of the mask 20 in the first direction D1. The dimension W1 may be, for example, 30 mm or more, 50 mm or more, or 80 mm or more. The dimension W1 may be, for example, 100 mm or less, 150 mm or less, or 180 mm or less. The range of the dimension W1 may be defined by a first group consisting of 30 mm, 50 mm, and 80 mm and / or a second group consisting of 100 mm, 150 mm, and 180 mm. The range of the dimension W1 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the dimension W1 may be defined by a combination of any two of the values ​​included in the first group. The range of the dimension W1 may be defined by a combination of any two of the values ​​included in the second group. For example, it may be 30 mm or more and 180 mm or less, 30 mm or more and 150 mm or less, 30 mm or more and 100 mm or less, 30 mm or more and 80 mm or less, 30 mm or more and 50 mm or less, 50 mm or more and 180 mm or less, 50 mm or more and 150 mm or less, 50 mm or more and 100 mm or less, 50 mm or more and 80 mm or less, 80 mm or more and 180 mm or less, 80 mm or more and 150 mm or less, 80 mm or more and 100 mm or less, 100 mm or more and 180 mm or less, 100 mm or more and 150 mm or less, or 150 mm or more and 180 mm or less.

[0047] In FIG. 2, the symbol L1 denotes the dimension (length dimension) of the mask 20 in the second direction D2. The dimension L1 may be, for example, 1000 mm or more, 1200 mm or more, or 1400 mm or more. The dimension L1 may be, for example, 1600 mm or less, 2200 mm or less, or 2800 mm or less. The range of the dimension L1 may be defined by a first group consisting of 1000 mm, 1200 mm, and 1400 mm, and / or a second group consisting of 1600 mm, 2200 mm, and 2800 mm. The range of the dimension L1 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the dimension L1 may be defined by a combination of any two of the values ​​included in the first group. The range of the dimension L1 may be defined by a combination of any two of the values ​​included in the second group. For example, it may be 1000 mm or more and 2800 mm or less, 1000 mm or more and 2200 mm or less, 1000 mm or more and 1600 mm or less, 1000 mm or more and 1400 mm or less, 1000 mm or more and 1200 mm or less, 1200 mm or more and 2800 mm or less, 1200 mm or more and 2200 mm or less, 1200 mm or more and 1600 mm or less, 1200 mm or more and 1400 mm or less, 1400 mm or more and 2800 mm or less, 1400 mm or more and 2200 mm or less, 1400 mm or more and 1600 mm or less, 1600 mm or more and 2800 mm or less, 1600 mm or more and 2200 mm or less, 2200 mm or more and 2800 mm or less.

[0048] As shown in FIG. 2, the mask 20 includes a pair of mask end portions 30 and a mask intermediate portion 21 located between the pair of mask end portions 30 .

[0049] First, the mask intermediate portion 21 will be described. The mask intermediate portion 21 is a portion of the mask 20 located between a pair of mask end portions 30. The mask intermediate portion 21 includes an effective region 22 and a peripheral region 23. The peripheral region 23 is a region located around the effective region 22. As shown in FIG. 2, the mask intermediate portion 21 may include multiple effective regions 22. The multiple effective regions 22 may be aligned in the second direction D2. In the illustrated example, five effective regions 22 are aligned in the second direction D2. Also, as shown in FIG. 2, the peripheral region 23 may surround the multiple effective regions 22. The peripheral region 23 may be a region for supporting the effective regions 22 and may not be a region through which the deposition material 7 intended to be deposited on the substrate 110 passes. On the other hand, the effective region 22 may be a region of the mask 20 facing the display region of the substrate 110.

[0050] 2, the effective area 22 may have a rectangular outline in a plan view. Although not shown, the effective area 22 may have an outline of various shapes depending on the shape of the display area of ​​the organic EL display device. For example, the effective area 22 may have an outline of a circle, an ellipse, or a polygon, such as a hexagon or an octagon. Furthermore, the multiple effective areas 22 may have outlines of different shapes, such as a circle, an ellipse, or a polygon.

[0051] 3, the effective area 22 of the mask intermediate portion 21 includes a plurality of through holes 25. The plurality of through holes 25 may be regularly arranged at a predetermined pitch along the first direction D1 and the second direction D2 in the effective area 22. The deposition material 7 that passes through each through hole 25 of the mask intermediate portion 21 is attached to the substrate 110.

[0052] When an organic device such as an organic EL display device is fabricated using the mask 20, one effective area 22 may correspond to the display area of ​​one organic EL display device. Therefore, the mask device 10 shown in FIG. 2 allows for multi-surface deposition of an organic EL display device. Note that one effective area 22 may correspond to multiple display areas. Furthermore, although not shown, multiple effective areas 22 may be aligned in the first direction D1 in one mask 20.

[0053] As shown in FIG. 4, the plurality of through holes 25 penetrate from the first mask surface 20a to the second mask surface 20b. The through holes 25 may include a first recess 202 and a second recess 203. The first recess 202 is located on the first mask surface 20a. The second recess 203 is located on the second mask surface 20b. The first recess 202 and the second recess 203 are connected to each other. The first recess 202 may be formed by etching the metal plate 200, which is the base material of the mask 20, from the first metal surface 200a. The second recess 203 may be formed by etching the metal plate 200 from the second metal surface 200b.

[0054] 4, wall surface 202a of first recess 202 and wall surface 203a of second recess 203 may be connected via a circumferential connecting portion 205. Connecting portion 205 may define through portion 206 in which the opening area of ​​through hole 25 is minimized in plan view.

[0055] As shown in FIG. 4 , two adjacent first recesses 202 may be spaced apart from each other. Similarly, two adjacent second recesses 203 may also be spaced apart from each other. That is, the second metal surface 200b of the metal plate 200 may remain between two adjacent second recesses 203. In the following description, the portion of the second metal surface 200b of the metal plate 200 that remains unetched between two adjacent second recesses 203 is also referred to as a top portion 207. Fabricating the mask 20 so that the top portion 207 remains can enhance the strength of the mask 20. This can prevent deformation or damage of the mask 20, for example, during transportation. In FIG. 4 , the width of the top portion 207 is indicated by the symbol β. If the width β of the top portion 207 is too large, a shadow may occur during the deposition process, which may reduce the utilization efficiency of the deposition material 7. Therefore, the width β of the top portion 207 is determined so as not to be excessively large.

[0056] Although not shown, etching may be performed so that two adjacent second recesses 203 are connected. In other words, the second metal surface 200b of the metal plate 200 does not have to remain between two adjacent second recesses 203. Furthermore, although not shown, etching may be performed so that two adjacent second recesses 203 are connected over the entire area of ​​the second metal surface 200b of the metal plate 200.

[0057] The symbol α is shown in FIG. 4. The symbol α represents the width of the portion of the first metal surface 200a of the metal plate 200 that remains unetched between two adjacent first recesses 202. Such a portion is also referred to as a rib portion. The symbol r is also shown in FIG. 4. The symbol r represents the dimension (inner diameter dimension) of the through portion 206. The width α of the rib portion and the dimension r of the through portion 206 are determined appropriately depending on the dimensions of the organic device to be manufactured, the number of display pixels, etc.

[0058] During the deposition process, the first mask surface 20a faces and contacts the substrate 110. The second mask surface 20b faces the deposition source 6 holding the deposition material 7. The deposition material 7 passes through the second recesses 203 and the first recesses 202 and adheres to the substrate 110.

[0059] As shown by the arrows pointing from the second mask surface 20b to the first mask surface 20a in FIG. 4 , the deposition material 7 moves from the deposition source 6 toward the substrate 110 not only along the normal to the first mask surface 20a of the mask 20 but also in a direction inclined relative to the normal. If the thickness T of the mask 20 is large, the deposition material 7 moving in the inclined direction is more likely to get caught on the top portion 207, the wall surface 203a of the second recess 203, and / or the wall surface 202a of the first recess 202. As a result, the proportion of the deposition material 7 that cannot pass through the through holes 25 increases. Therefore, the thickness T of the mask 20 may be reduced to improve the utilization efficiency of the deposition material 7. In this case, the height of the wall surface 203a of the second recess 203 may be reduced, or the height of the wall surface 202a of the first recess 202 may be reduced. The thickness T of the mask 20 may be reduced as much as possible within a range that ensures the strength of the mask 20.

[0060] The thickness T of the mask 20 may be 5 μm or more and 50 μm or less. When the thickness T of the mask 20 is 5 μm or more, the strength of the mask 20 is ensured, and damage or deformation of the mask 20 can be suppressed. When the thickness T of the mask 20 is 50 μm or less, the proportion of the vapor deposition material 7 that gets caught on the wall surfaces 203 a of the through holes 25 before passing through the through holes 25 can be reduced. This improves the utilization efficiency of the vapor deposition material 7. Here, the thickness T is the thickness of the portions of the mask 20 where the first recesses 202 and the second recesses 203 are not formed. Therefore, the thickness T can also be said to be the thickness of the metal plate 200.

[0061] The thickness T of the mask 20 may be, for example, 5 μm or more, 10 μm or more, or 15 μm or more. The thickness T of the mask 20 may be, for example, 20 μm or less, 35 μm or less, or 50 μm or less. The range of the thickness T of the mask 20 may be defined by a first group consisting of 5 μm, 10 μm, and 15 μm and / or a second group consisting of 20 μm, 35 μm, and 50 μm. The range of the thickness T of the mask 20 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the thickness T of the mask 20 may be defined by a combination of any two of the values ​​included in the first group. The range of the thickness T of the mask 20 may be defined by a combination of any two of the values ​​included in the second group. For example, it may be 5 μm or more and 50 μm or less, 5 μm or more and 35 μm or less, 5 μm or more and 20 μm or less, 5 μm or more and 15 μm or less, 5 μm or more and 10 μm or less, 10 μm or more and 50 μm or less, 10 μm or more and 35 μm or less, 10 μm or more and 20 μm or less, 10 μm or more and 15 μm or less, 15 μm or more and 50 μm or less, 15 μm or more and 35 μm or more and 15 μm or more and 20 μm or less, 20 μm or more and 50 μm or less, 20 μm or more and 35 μm or more and 35 μm or more and 50 μm or less.

[0062] A contact-type measurement method may be adopted as a method for measuring the thickness T of the mask 20. For the contact-type measurement method, a length gauge "MT1271" by HEIDENHAIN-METRO, manufactured by HEIDENHAIN, having a ball bush guide type plunger, may be used.

[0063] Next, the pair of mask ends 30 will be described. The mask ends 30 are portions of the mask 20 located on both sides in the second direction D2. The mask ends 30 do not have to overlap the opening 15d of the frame 15 in a plan view. In this case, the mask ends 30 can be defined as portions of the mask 20 that are outer than the opening 15d of the frame 15. Here, the "outside" refers to the side away from the center line CL of the mask 20 in the second direction D2, as indicated by arrow A in FIG. 2. The center line CL of the mask 20 is a straight line extending in the first direction D1 and passing through a center point C (see FIG. 2) of the mask 20 in the second direction D2.

[0064] As shown in FIG. 2 , the mask end 30 includes a joint 31 that is joined to the first frame surface 15a of the frame 15. The second mask surface 20b of the mask 20 may be welded to the first frame surface 15a of the frame 15 at the joint 31, thereby fixing the mask 20 to the frame 15. For example, the mask 20 may be spot-welded to the frame 15 at the joint 31. In this case, weld marks may be formed at the joint 31. The joint 31 may include multiple dot-shaped weld marks aligned in the first direction D1. However, this is not limited thereto, and the arrangement and shape of the weld marks are arbitrary. For example, multiple weld marks may also be aligned in the second direction D2, or the weld marks may extend linearly in the first direction D1 and / or the second direction D2. For example, the weld marks may include both dot-shaped weld marks and linear weld marks.

[0065] 5, the mask end 30 includes a notch 32. The notch 32 is formed by cutting out the mask end 30. The notch 32 may be formed in the center of the mask 20 in the first direction D1. The notch 32 is located outside the frame 15. Therefore, the notch 32 does not overlap with the frame 15 in a plan view.

[0066] As shown in FIG. 5, the edge 32e of the cutout 32 may have a substantially U-shape in plan view. In this case, the cutout 32 may include a linear portion 32a and a semicircular portion 32b. The linear portion 32a extends linearly in the second direction D2 from the edge 30e of the mask end 30. The semicircular portion 32b is a semicircular portion adjacent to the linear portion 32a on the opposite side of the edge 30e of the mask end 30 in the second direction D2. The semicircular portion 32b is located inside the linear portion 32a and is continuous with the linear portion 32a. Here, "inside" refers to the side closer to the center line CL of the mask 20 shown in FIG. 2. The position of the center O of the circle forming the semicircular portion 32b in the first direction D1 may coincide with the center position of the linear portion 32a in the first direction D1.

[0067] In FIG. 5, the symbol W2 represents the dimension (width) of the linear portion 32a in the first direction D1. The dimension W2 may be equal to the diameter of the circle forming the semicircular portion 32b. The dimension W2 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension W2 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of the dimension W2 may be defined by a first group consisting of 10 mm, 20 mm, and 40 mm and / or a second group consisting of 30 mm, 50 mm, and 60 mm. The range of the dimension W2 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the dimension W2 may be defined by a combination of any two of the values ​​included in the first group. The range of the dimension W2 may be defined by a combination of any two of the values ​​included in the second group. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, 20 mm or more and 50 mm or less, 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, or 50 mm or more and 60 mm or less.

[0068] In FIG. 5, the symbol L2 denotes the dimension (length dimension) of the linear portion 32a in the second direction D2. The dimension L2 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension L2 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of the dimension L2 may be defined by a first group consisting of 10 mm, 20 mm, and 40 mm and / or a second group consisting of 30 mm, 50 mm, and 60 mm. The range of the dimension L2 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the dimension L2 may be defined by a combination of any two of the values ​​included in the first group. The range of the dimension L2 may be defined by a combination of any two of the values ​​included in the second group. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, 20 mm or more and 50 mm or less, 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, or 50 mm or more and 60 mm or less.

[0069] In FIG. 5, the symbol L3 represents the dimension (length dimension) of the semicircular portion 32b in the second direction D2. That is, the dimension L3 represents the radius of the circle forming the semicircular portion 32b. The dimension L3 may be half the dimension W2. The dimension L3 may be, for example, 5 mm or more, 10 mm or more, or 20 mm or more. The dimension L3 may be, for example, 15 mm or less, 25 mm or less, or 30 mm or less. The range of the dimension L3 may be defined by a first group consisting of 5 mm, 10 mm, and 20 mm and / or a second group consisting of 15 mm, 25 mm, and 30 mm. The range of the dimension L3 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the dimension L3 may be defined by a combination of any two of the values ​​included in the first group. The range of the dimension L3 may be defined by a combination of any two of the values ​​included in the second group. For example, it may be 5 mm or more and 30 mm or less, 5 mm or more and 25 mm or less, 5 mm or more and 15 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 25 mm or less, 10 mm or more and 15 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 25 mm or less, 20 mm or more and 15 mm or less, 15 mm or more and 30 mm or less, 15 mm or more and 25 mm or less, or 25 mm or more and 30 mm or less.

[0070] The edge 32e of the cutout 32 may have other shapes besides the approximate U-shape, such as an approximate V-shape, an approximate semicircular shape, or an approximate U-shape.

[0071] By forming the cutout portion 32 in the mask end portion 30 in this manner, as shown in FIG. 5, grip portions 35 are formed on both sides of the cutout portion 32 of the mask end portion 30. That is, the mask end portion 30 includes a plurality of grip portions 35 arranged in the first direction D1 via the cutout portion 32. In this embodiment, the plurality of grip portions 35 include a first grip portion 35a and a second grip portion 35b. The first grip portion 35a is located on one side in the first direction D1 (the left side in FIG. 5), and the second grip portion 35b is located on the other side in the first direction D1 (the right side in FIG. 5). In the following description, when describing the configuration of the grip portion that is common to the first grip portion 35a and the second grip portion 35b, the term and symbol "grip portion 35" are used.

[0072] As shown in FIG. 5, the grip portion 35 protrudes in the second direction D2. That is, the grip portion 35 is formed so as to protrude outward from the base portion 33 in the second direction D2. The grip portion 35 is defined by the edge portion 20s of the mask 20 in the first direction D1, the edge 30e of the mask end portion 30 in the second direction D2, and a portion (half) of the edge portion 32e of the notch portion 32. The grip portion 35 is a portion that is clamped by a corresponding clamp 51 of a clamping device 50, which will be described later. The grip portion 35 may include a clamping region 36 that is clamped by the clamp 51. More specifically, the first grip portion 35a may include a first clamping region 36a that is clamped by a first clamp 51a, which will be described later, and the second grip portion 35b may include a second clamping region 36b that is clamped by a second clamp 51b, which will be described later (see FIG. 9).

[0073] In FIG. 5, the symbol W3 represents the dimension (width) of the first grip portion 35a in the first direction D1. The dimension W3 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension W3 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of the dimension W3 may be defined by a first group consisting of 10 mm, 20 mm, and 40 mm and / or a second group consisting of 30 mm, 50 mm, and 60 mm. The range of the dimension W3 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the dimension W3 may be defined by a combination of any two of the values ​​included in the first group. The range of the dimension W3 may be defined by a combination of any two of the values ​​included in the second group. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, 20 mm or more and 50 mm or less, 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, or 50 mm or more and 60 mm or less.

[0074] In Figure 5, the symbol W4 represents the dimension (width) of the second grip portion 35b in the first direction D1. The dimension W4 may be equal to the dimension W3 of the first grip portion 35a in the first direction D1. However, this is not limited thereto, and the dimension W4 may be smaller or larger than the dimension W3. The range of the dimension W4 may be the same as the range of the dimension W3.

[0075] Next, the materials of the mask 20 and the frame 15 will be described. An iron alloy containing nickel may be used as the main material of the mask 20 and the frame 15. The iron alloy may further contain cobalt in addition to nickel. For example, an iron alloy containing nickel and cobalt in total at 28% by mass or more and 54% by mass or less and a cobalt content at 0% by mass or more and 6% by mass or less may be used as the material of the metal plate 200 of the mask 20. This reduces the difference between the thermal expansion coefficients of the mask 20 and the frame 15 and the substrate 110 containing glass. This prevents the dimensional accuracy and positional accuracy of the deposition material 7 attached to the substrate 110 from decreasing due to thermal expansion of the mask 20, the frame 15, the substrate 110, etc.

[0076] The total content of nickel and cobalt in the metal plate 200 may be 28% by mass or more and 38% by mass or less. In this case, specific examples of iron alloys containing nickel or nickel and cobalt include Invar, Super Invar, and Ultra Invar. Invar is an iron alloy containing 34% by mass or more and 38% by mass or less of nickel, with the balance being iron and unavoidable impurities. Super Invar is an iron alloy containing 30% by mass or more and 34% by mass or less of nickel, cobalt, and the balance being iron and unavoidable impurities. Ultra Invar is an iron alloy containing 28% by mass or more and 34% by mass or less of nickel, 2% by mass or more and 7% by mass or less of cobalt, 0.1% by mass or more and 1.0% by mass or less of manganese, 0.10% by mass or less of silicon, 0.01% by mass or less of carbon, and the balance being iron and unavoidable impurities.

[0077] The total content of nickel and cobalt in the metal plate 200 may be 38% by mass or more and 54% by mass or less. In this case, a specific example of the iron alloy containing nickel or nickel and cobalt is a low-thermal expansion Fe-Ni-based plating alloy. The low-thermal expansion Fe-Ni-based plating alloy is an iron alloy containing 38% by mass or more and 54% by mass or less of nickel, with the remainder being iron and unavoidable impurities.

[0078] If the temperatures of the mask 20, frame 15, and substrate 110 do not reach high temperatures during the vapor deposition process, the thermal expansion coefficients of the mask 20 and frame 15 do not need to be set to values ​​equivalent to the thermal expansion coefficient of the substrate 110. In this case, materials other than the above-mentioned iron alloys may be used as the material for the mask 20. For example, iron alloys other than the above-mentioned iron alloys containing nickel, such as iron alloys containing chromium, may be used. As the iron alloy containing chromium, for example, iron alloys known as stainless steel may be used. Furthermore, alloys other than iron alloys, such as nickel or nickel-cobalt alloys, may also be used.

[0079] Next, a manufacturing apparatus 40 for the mask device 10 (hereinafter referred to as the manufacturing apparatus 40) will be described with reference to FIGS.

[0080] As shown in FIG. 6, the manufacturing apparatus 40 may include a mask 20, a mounting table 45, a clamping device 50, a conveying device 60, and a welding device 70 (see FIG. 16).

[0081] The mounting table 45 is a table on which the mask 20 is placed. As shown in Fig. 6, the mounting table 45 is disposed at a position separated from the frame 15. The mask 20 placed on the mounting table 45 is sequentially transported by the clamping device 50 and the transporting device 60, and fixed to the frame 15.

[0082] As shown in FIGS. 6 to 8 , the mounting table 45 may include a flat tray 46, an adhesive member 47, and guide pins 48. The tray 46 may have a substantially rectangular shape in a plan view. An upper surface 46a of the tray 46 contacts the second mask surface 20b of the mask 20. The adhesive member 47 is located on the upper surface 46a of the tray 46. The adhesive member 47 may extend in the first direction D1 and be located near both ends of the mask 20 in the second direction D2. The arrangement and number of the adhesive members 47 are arbitrary. The adhesive member 47 adheres to the second mask surface 20b of the mask 20, thereby temporarily fixing the mask 20 on the tray 46. The guide pins 48 protrude from the upper surface 46a of the tray 46. The guide pins 48 may be located near the adhesive members 47. The arrangement and number of the guide pins 48 are arbitrary. The guide pin 48 abuts against the edge 20s of the mask 20, thereby guiding the mask 20 to a predetermined position on the tray 46 so that the position of the mask 20 does not shift.

[0083] The clamping device 50 is a device that clamps the mask 20. As shown in FIGS. 6 to 8, the clamping device 50 includes a first clamping device 50A and a second clamping device 50B that is located on the opposite side of the first clamping device 50A with the mask 20 in between. In other words, the clamping device 50 includes the first clamping device 50A that clamps the grip portion 35 of one of the pair of mask ends 30 of the mask 20, and the second clamping device 50B that clamps the grip portion 35 of the other mask end 30. In the following description, when describing the configuration of the clamping device that is common to the first clamping device 50A and the second clamping device 50B, the term and reference numeral "clamping device 50" will be used.

[0084] As shown in FIGS. 6 to 9, the clamping device 50 includes a plurality of clamps 51 that clamp the corresponding grip portions 35 of the mask 20. In this embodiment, the plurality of clamps 51 include a first clamp 51a and a second clamp 51b. The first clamp 51a clamps the first grip portion 35a of the mask 20, and the second clamp 51b clamps the second grip portion 35b of the mask 20. In the following description, when describing the clamp configuration that is common to the first clamp 51a and the second clamp 51b, the term and symbol "clamp 51" will be used.

[0085] As shown in Fig. 8, the clamp device 50 includes a pair of clamps 51. One clamp 51 of the pair of clamps 51 is positioned above the mask 20, and the other clamp 51 is positioned below. The clamp device 50 clamps the mask 20 by clamping the grip portions 35 with a predetermined pressing force using the pair of clamps 51. The clamp device 50 supports the mask 20 by clamping the corresponding grip portions 35 of the mask 20 with each clamp 51. The clamp device 50 can apply tension to the mask 20 by pulling the mask 20 in opposite directions in the second direction D2 using each clamp 51.

[0086] The clamp device 50 may be driven by a drive device 53. The drive device 53 may be, for example, an air cylinder, a hydraulic cylinder, or a servo motor. The clamp 51 may be controlled by the drive device 53 and be movable in a first direction D1, a second direction D2, and a third direction D3. Furthermore, the multiple clamps 51 may be controlled by corresponding drive devices 53 and be movable independently of one another. The multiple clamps 51 may be controlled in conjunction with one another by a single drive device 53.

[0087] The clamp 51 may have a rectangular shape in a plan view. The clamp 51 may also be made of a flat plate-like member. The clamp 51 may be made of, for example, a flat metal plate. An anti-slip member such as silicone rubber may be arranged on the surface of the metal plate facing the mask 20.

[0088] In FIG. 9, the symbol W5 represents the dimension (width) of the first clamp 51a in the first direction D1. The dimension W5 may be greater than or equal to the dimension W3 (see FIG. 5) of the first grip portion 35a in the first direction D1. The dimension W5 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension W5 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of the dimension W5 may be defined by a first group consisting of 10 mm, 20 mm, and 40 mm and / or a second group consisting of 30 mm, 50 mm, and 60 mm. The range of the dimension W5 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the dimension W5 may be defined by a combination of any two of the values ​​included in the first group. The range of dimension W5 may be determined by a combination of any two of the values ​​included in the second group described above. For example, it may be 10 mm to 60 mm, 10 mm to 50 mm, 10 mm to 30 mm, 10 mm to 40 mm, 10 mm to 20 mm, 20 mm to 60 mm, 20 mm to 50 mm, 20 mm to 30 mm, 20 mm to 40 mm, 40 mm to 60 mm, 40 mm to 50 mm, 40 mm to 30 mm, 30 mm to 60 mm, 30 mm to 50 mm, or 50 mm to 60 mm.

[0089] If the ratio of the dimension W3 of the first grip portion 35a in the first direction D1 to the dimension W5 of the first clamp 51a in the first direction D1 is defined as W3 / W5, W3 / W5 may be, for example, 0.3 or greater, 0.4 or greater, or 0.5 or greater. W3 / W5 may be, for example, 0.6 or less, 0.8 or less, or 1 or less. The range of W3 / W5 may be defined by a first group consisting of 0.3, 0.4, and 0.5 and / or a second group consisting of 0.6, 0.8, and 1. The range of W3 / W5 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of W3 / W5 may be defined by a combination of any two of the values ​​included in the first group. The range of W3 / W5 may be defined by a combination of any two of the values ​​included in the second group. For example, it may be 0.3 or more and 1 or less, 0.3 or more and 0.8 or less, 0.3 or more and 0.6 or less, 0.3 or more and 0.5 or less, 0.3 or more and 0.4 or less, 0.4 or more and 1 or less, 0.4 or more and 0.8 or less, 0.4 or more and 0.6 or less, 0.4 or more and 0.5 or less, 0.5 or more and 1 or less, 0.5 or more and 0.8 or less, 0.5 or more and 0.6 or less, 0.6 or more and 1 or less, 0.6 or more and 0.8 or less, or 0.8 or more and 1 or less.

[0090] In FIG. 9, the symbol W6 represents the dimension (width dimension) of the second clamp 51b in the first direction D1. The dimension W6 may be greater than or equal to the dimension W4 (see FIG. 5) of the second grip portion 35b in the first direction D1. The dimension W6 may be equal to the dimension W5 of the first clamp 51a in the first direction D1. However, this is not limited thereto, and the dimension W6 may be smaller or larger than the dimension W5. The range of the dimension W6 may be the same as the range of the dimension W5.

[0091] The ratio W4 / W6 of the dimension W4 of the second grip portion 35b in the first direction D1 to the dimension W6 of the second clamp 51b in the first direction D1 may be equal to W3 / W5 of the dimension W3 of the first grip portion 35a in the first direction D1 to the dimension W5 of the first clamp 51a in the first direction D1. However, this is not limited thereto, and W4 / W6 may be smaller or larger than W3 / W5. The range of W4 / W6 may be the same as the range of W3 / W5.

[0092] As shown in Fig. 9, the clamp 51 may clamp at least the edge 20s of the mask 20 in the first direction D1. That is, when the clamp 51 clamps the grip portion 35, the clamp 51 and the edge 20s of the mask 20 may overlap in a plan view. In the example shown in Fig. 9, the clamp 51 extends beyond the edge 20s of the mask 20, that is, to a position that protrudes beyond the grip portion 35 on the opposite side from the notch portion 32 in the first direction D1. However, this is not limited thereto, and the clamp 51 does not have to extend beyond the edge 20s of the mask 20.

[0093] 9, the clamp 51 may clamp the grip portion 35 without overlapping the cutout portion 32 in a plan view. That is, when the clamp 51 clamps the grip portion 35, the clamp 51 and the cutout portion 32 may not overlap in a plan view. Note that, as shown in FIG. 9, the clamp 51 and the edge portion 32e of the cutout portion 32 may overlap in a plan view. However, this is not limited to this, and the clamp 51 and the edge portion 32e of the cutout portion 32 may not overlap in a plan view.

[0094] 9, the clamp 51 may clamp the grip portion 35 at a position closer to the edge 30e of the mask end portion 30 in the second direction D2 than the semicircular portion 32b of the cutout portion 32. That is, the clamp 51 may clamp the grip portion 35 at a position that overlaps with the linear portion 32a of the cutout portion 32 but does not overlap with the semicircular portion 32b in the second direction D2. In other words, when the clamp 51 clamps the grip portion 35, the clamp 51 may be located outside the semicircular portion 32b in a plan view.

[0095] 9, the clamp 51 may clamp the grip portion 35 at a position closer to the edge 30e of the mask end portion 30 in the second direction D2 than the center position 32c of the straight portion 32a in the second direction D2. In other words, when the clamp 51 clamps the grip portion 35, the clamp 51 may be located outside the center position 32c of the straight portion 32a in the second direction D2 in a plan view.

[0096] In FIG. 9, the symbol W7 represents the dimension (width) of the first clamping region 36a in the first direction D1. As shown in FIG. 9, the dimension W7 may be equal to the dimension W3 (see FIG. 5) of the first grip portion 35a in the first direction D1. However, this is not limited thereto, and the dimension W7 may be smaller than the dimension W3. Furthermore, the symbol L7 represents the dimension (length) of the first clamping region 36a in the second direction D2. As shown in FIG. 9, the dimension W7 of the first clamping region 36a in the first direction D1 may be larger than the dimension L7 of the first clamping region 36a in the second direction D2. In other words, the first clamping region 36a may have a shape such that the width in the first direction D1 is larger than the length in the second direction D2.

[0097] The dimension W7 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension W7 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of the dimension W7 may be defined by a first group consisting of 10 mm, 20 mm, and 40 mm, and / or a second group consisting of 30 mm, 50 mm, and 60 mm. The range of the dimension W7 may be defined by a combination of any one of the values ​​included in the first group described above with any one of the values ​​included in the second group described above. The range of the dimension W7 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the dimension W7 may be defined by a combination of any two of the values ​​included in the second group described above. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, 20 mm or more and 50 mm or less, 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, or 50 mm or more and 60 mm or less.

[0098] The dimension L7 may be, for example, 5 mm or more, 10 mm or more, or 20 mm or more. The dimension L7 may be, for example, 15 mm or less, 25 mm or less, or 30 mm or less. The range of the dimension L7 may be defined by a first group consisting of 5 mm, 10 mm, and 20 mm, and / or a second group consisting of 15 mm, 25 mm, and 30 mm. The range of the dimension L7 may be defined by a combination of any one of the values ​​included in the first group described above with any one of the values ​​included in the second group described above. The range of the dimension L7 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the dimension L7 may be defined by a combination of any two of the values ​​included in the second group described above. For example, it may be 5 mm or more and 30 mm or less, 5 mm or more and 25 mm or less, 5 mm or more and 15 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 25 mm or less, 10 mm or more and 15 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 25 mm or less, 20 mm or more and 15 mm or less, 15 mm or more and 30 mm or less, 15 mm or more and 25 mm or less, or 25 mm or more and 30 mm or less.

[0099] In FIG. 9, the symbol W8 represents the dimension (width) of the second clamping region 36b in the first direction D1. As shown in FIG. 9, the dimension W8 may be equal to the dimension W4 (see FIG. 5) of the second grip portion 35b in the first direction D1. However, this is not limited thereto, and the dimension W8 may be smaller than the dimension W4. Furthermore, the symbol L8 represents the dimension (length) of the second clamping region 36b in the second direction D2. As shown in FIG. 9, the dimension W8 of the second clamping region 36b in the first direction D1 may be larger than the dimension L8 of the second clamping region 36b in the second direction D2. In other words, the second clamping region 36b may have a shape such that the width in the first direction D1 is larger than the length in the second direction D2.

[0100] The dimension W8 of the second clamping region 36b in the first direction D1 may be equal to the dimension W7 of the first clamping region 36a in the first direction D1. However, this is not limited thereto, and the dimension W8 may be smaller or larger than the dimension W7. The range of the dimension W8 may be the same as the range of the dimension W7. Furthermore, the dimension L8 of the second clamping region 36b in the second direction D2 may be equal to the dimension L7 of the first clamping region 36a in the second direction D2. However, this is not limited thereto, and the dimension L8 may be smaller or larger than the dimension L7. The range of the dimension L8 may be the same as the range of the dimension L7.

[0101] The transport device 60 is a device that transports the mask 20. The transport device 60 transports the mask 20 clamped by the clamp device 50. As shown in FIG. 6 , the transport device 60 may extend in a first direction D1. The transport device 60 may be configured to linearly move the clamp device 50 and the drive device 53 in the first direction D1. The transport device 60 may be configured to be able to transport the mask 20 clamped by the clamp device 50 from the mounting table 45 to a corresponding position on the frame 15 by linearly moving the clamp device 50 and the drive device 53 in the first direction D1.

[0102] The welding device 70 is a device that welds and joins the mask 20 to the frame 15. The welding device 70 welds the mask end 30 of the mask 20, which has been transported to a predetermined position on the frame 15 by the transport device 60, to the first frame surface 15a of the frame 15 at the joint 31 (see FIG. 16 ). The welding device 70 may also join the mask 20 to the frame 15 by spot welding. Alternatively, the welding device 70 may be a laser device that irradiates laser light L. In this case, the laser light L may be, for example, a YAG laser light (fundamental wavelength: 1064 nm) generated by a YAG laser device. The YAG laser device may be, for example, a device that includes a crystal of YAG (yttrium aluminum garnet) doped with Nd (neodymium) as an oscillation medium. Alternatively, the laser light L may be, for example, a fiber laser light (wavelength: 1070 nm) generated by a Yb fiber laser device.

[0103] Next, a method for manufacturing the mask device 10 will be described with reference to FIGS.

[0104] The manufacturing method of the mask device 10 may include a preparation step, a clamping step, a transporting step, and a fixing step.

[0105] First, a preparation step is carried out, which may include a frame preparation step and a mask preparation step.

[0106] In the frame preparation step, first, a metal plate (not shown) is prepared. Next, the metal plate is subjected to machining such as cutting to obtain the frame 15 including the opening 15d. The frame 15 may be produced using a mold or a 3D printer.

[0107] In the mask preparation step, the above-described mask 20 is prepared. Here, a large number of through holes 25 corresponding to the plurality of masks 20 are formed in the metal plate 200. In other words, the plurality of masks 20 are allocated to the metal plate 200. Thereafter, a portion 210 of the metal plate 200 in which a plurality of through holes 25 corresponding to one mask 20 are formed is separated from the metal plate 200. In this manner, a sheet of mask 20 can be obtained.

[0108] More specifically, first, a resist film containing a photosensitive resist material is formed on the first metal surface 200a and the second metal surface 200b of the metal plate 200. Next, the resist film is exposed to light and developed. As a result, as shown in FIG. 10, a first resist pattern 201a is formed on the first metal surface 200a of the metal plate 200, and a second resist pattern 201b is formed on the second metal surface 200b of the metal plate 200.

[0109] 11, a first etching step is performed in which regions of the first metal surface 200a of the metal plate 200 that are not covered by the first resist pattern 201a are etched using a first etching solution. As a result, a large number of first recesses 202 are formed in the first metal surface 200a of the metal plate 200. As the first etching solution, for example, a solvent containing a ferric chloride solution and hydrochloric acid may be used.

[0110] Next, as shown in FIG. 12 , a second etching step is performed in which regions of the second metal surface 200b of the metal plate 200 that are not covered by the second resist pattern 201b are etched using a second etching solution. This forms a large number of second recesses 203 on the second metal surface 200b of the metal plate 200. The second etching step is performed until the first recesses 202 and the second recesses 203 are connected to form through-holes 25. As with the first etching solution described above, the second etching solution may be, for example, a solvent containing a ferric chloride solution and hydrochloric acid. During the second etching step, the first recesses 202 may be covered with a resin 204 that is resistant to the second etching solution, as shown in FIG. 12 .

[0111] Next, as shown in Fig. 13, the resin 204 is removed from the metal plate 200. The resin 204 can be removed by using, for example, an alkaline remover. When an alkaline remover is used, the resist patterns 201a and 201b can be removed simultaneously with the resin 204, as shown in Fig. 13. After the resin 204 is removed, the resist patterns 201a and 201b may be removed separately from the resin 204 using a remover different from the remover used to remove the resin 204.

[0112] Then, a portion 210 of the metal plate 200 in which a plurality of through holes 25 corresponding to one mask 20 are formed is separated from the metal plate 200.

[0113] Thereafter, the mask end 30 of the mask 20 is formed as shown in Fig. 14. More specifically, an end 215 of a portion 210 of the metal plate 200 corresponding to one mask 20 is cut along the dashed line DL as shown in Fig. 14 using a cutting device (not shown), and the metal piece 208 is removed. This allows the mask end 30, which includes the notch portion 32 and the grip portion 35 (first grip portion 35a and second grip portion 35b), to be formed.

[0114] In this way, it is possible to obtain the mask 20. The prepared mask 20 is placed on a mounting table 45 (see FIGS. 6 to 8).

[0115] After forming the mask end portion 30, a mask inspection step may be performed to inspect the mask 20. In the mask inspection step, for example, the mask 20 is inspected for local deformation or the like on its surface.

[0116] After the preparation step, a clamping step is carried out. In the clamping step, the mask 20 is clamped by the clamp device 50. More specifically, as shown in Fig. 8, the corresponding grip portions 35 of the mask 20 placed on the mounting table 45 are clamped by the multiple clamps 51 of the clamp device 50. Then, the mask 20 is pulled in opposite directions in the second direction D2 by the clamps 51, thereby applying tension to the mask 20.

[0117] After the clamping step, a transporting step is performed. In the transporting step, the mask 20 is transported by the transport device 60. The transporting step may include a moving step, a position adjusting step, and a contacting step.

[0118] First, in the moving step, the clamp device 50 is moved. More specifically, with the mask 20 clamped by the clamp device 50, the conveying device 60 moves the clamp device 50 and the driving device 53 linearly in the first direction D1. Then, the mask 20 is conveyed from the mounting table 45 to a corresponding position on the frame 15, and the mask end 30 of the mask 20 faces the first frame surface 15a of the frame 15, as shown in FIG.

[0119] Next, in the position adjustment step, the position of the mask 20 relative to the frame 15 is adjusted. More specifically, the position of the mask 20 relative to the frame 15 is adjusted using the alignment mark 15e of the frame 15 as a reference. The position adjustment is performed by moving the clamp device 50 in parallel within a horizontal plane using the transport device 60 while the clamp device 50 applies tension to the mask 20.

[0120] Next, in the contacting step, the mask 20 is brought into contact with the frame 15. More specifically, the clamping device 50 is moved downward by the conveying device 60, and the mask end 30 of the mask 20 is brought into contact with the first frame surface 15a of the frame 15 while the clamping device 50 applies tension to the mask 20.

[0121] In this manner, the mask 20 can be transported from the mounting table 45 onto the frame 15 .

[0122] After the transporting step, a fixing step is performed. In the fixing step, the mask 20 is fixed to the frame 15. More specifically, as shown in FIG. 16 , while the clamping device 50 applies tension to the mask 20, the mask end 30 of the mask 20 is welded and fixed to the first frame surface 15a of the frame 15 at the joint 31 by the welding device 70. If the welding device 70 is a laser device, the mask 20 may be joined to the frame 15 by spot welding using laser light L.

[0123] Thereafter, each clamp 51 of the clamping device 50 releases the mask 20. After the fixing process, the portion of the mask edge 30 of the mask 20 that is outside the joint 31 may be cut and removed by a cutting device (not shown).

[0124] By sequentially performing the clamping step, the transporting step, and the fixing step on each mask 20, a mask device 10 having a plurality of masks 20 fixed to a frame 15 as shown in FIG. 2 can be obtained.

[0125] Next, a method for manufacturing an organic device will be described with reference to Figures 17 to 20. The organic device is manufactured using a vapor deposition apparatus 1 including the mask apparatus 10 described above.

[0126] The method for manufacturing an organic device may include a preparation step, a holding step, an adhesion step, and a vapor deposition step.

[0127] First, a preparation step is carried out. In the preparation step, as shown in Fig. 17, a deposition apparatus 1 including a deposition source 6 containing a deposition material 7, a heater 8, and a mask device 10 is prepared. The mask device 10 can be obtained by the above-mentioned method for manufacturing a mask device. Here, the mask device 10 is held by a mask holder 3 so as to be positioned above the deposition source 6.

[0128] After the preparation step, a holding step is performed. In the holding step, as shown in FIG. 18, the substrate 110 is held by the substrate holder 2. More specifically, the substrate 110 is held inside the deposition apparatus 1 so as to face the first mask surface 20a of the mask 20. At this time, the substrate holder 2 may be moved to adjust the position of the substrate 110 relative to the mask 20. For example, the substrate 110 may be moved to adjust the position so that an alignment mark (not shown) of the mask 20 or an alignment mark 15e of the frame 15 (see FIG. 2) overlaps with an alignment mark (not shown) of the substrate 110.

[0129] After the holding step, the adhesion step is performed. In the adhesion step, the mask 20 is brought into close contact with the substrate 110 by the magnetic force of the magnet 5. More specifically, as shown in FIG. 19 , the magnet 5 is placed on the surface of the substrate holder 2 opposite the mask device 10. As a result, the magnetic force of the magnet 5 attracts the mask 20 toward the substrate 110, and the first mask surface 20a of the mask 20 is brought into close contact with the substrate 110.

[0130] After the adhesion process, a vapor deposition process is carried out. In the vapor deposition process, a vapor deposition material 7 is vapor-deposited on the substrate 110. At this time, first, the inside of the vapor deposition device 1 is evacuated by an exhaust means (not shown) so that the inside of the vapor deposition device 1 is in a high vacuum state. Next, the vapor deposition source 6 is heated by a heater 8 to evaporate the vapor deposition material 7. Then, the vapor deposition material 7 that has evaporated from the vapor deposition source 6 and reached the mask device 10 passes through the opening 15d of the frame 15 and the through-hole 25 of the mask 20 and adheres to the substrate 110.

[0131] In this manner, the deposition material 7 is deposited on the substrate 110 in a desired pattern corresponding to the positions of the through-holes 25 of the mask 20. As a result, an organic device 100 having the deposition material 7 attached to the substrate 110 can be obtained, as shown in FIG.

[0132] When the organic device 100 is an organic EL display device, the above-described steps are repeated to deposit the deposition materials 7 corresponding to each color onto the substrate 110. In this case, a mask device 10 including a mask 20 provided with through-holes 25 corresponding to the pattern of each color is used.

[0133] 20 does not include other components, such as electrodes that apply voltage to pixels containing the deposition material 7. Therefore, the organic device 100 shown in FIG. 20 can also be called an intermediate of an organic device.

[0134] Next, the effects of this embodiment will be described.

[0135] In a typical mask device manufacturing apparatus 140, for example, as shown in FIG. 21, the grip portion 135 of the mask 120 may be formed elongated, and the dimensions W13 and W14 of the grip portion 135 (first grip portion 135a and second grip portion 135b) in the first direction D1 may be smaller than 10 mm. In this case, when forming the mask end portion 130 of the mask 120 during manufacturing of the mask device, the grip portion 135 may be subjected to a force from the cutting device and may be deformed so as to bend. As a result, it may be impossible for each clamp 151 (first clamp 151a and second clamp 151b) of the clamping device 150 to clamp the corresponding grip portion 135 of the mask 120, which may result in a manufacturing defect of the mask device.

[0136] On the other hand, in another general mask device manufacturing apparatus 240, for example, as shown in FIG. 22, the grip portions 235 of the mask 220 are formed wide, and the ratios W23 / W25 and W24 / W26 of the dimensions W23 and W24 of the grip portions 235 (first grip portions 235a and second grip portions 235b) in the first direction D1 to the dimensions W25 and W26 of the clamps 251 (first clamps 251a and second clamps 251b) in the first direction D1 may be greater than 1. In this case, during the manufacturing of the mask device, when the clamp device 250 clamps the corresponding grip portions 235 of the mask 220 with the clamps 251 and pulls the mask 220 in opposite directions in the second direction D2, it may not be possible to apply sufficient tension to the mask 220. This may cause wrinkles in the mask 220, which may cause the positions of the through holes in the mask 220 to deviate from the designed positions during the vapor deposition process, thereby reducing the positional accuracy of the vapor deposition.

[0137] In contrast, according to the present embodiment, in the manufacturing apparatus 40, the dimensions W3 and W4 of the grip portion 35 in the first direction D1 are 10 mm or more, and the ratios W3 / W5 and W4 / W6 of the dimensions W3 and W4 of the grip portion 35 in the first direction D1 to the dimensions W5 and W6 of the clamp 51 in the first direction D1 are 1 or less (see FIGS. 5 and 9). By making the dimensions W3 and W4 of the grip portion 35 in the first direction D1 10 mm or more, deformation of the grip portion 35 can be suppressed when forming the mask end portion 30 of the mask 20 during the manufacturing of the mask device 10. This can suppress the occurrence of manufacturing defects in the mask device 10. Furthermore, because the ratios W3 / W5 and W4 / W6 of the dimensions W3 and W4 of the gripping portion 35 in the first direction D1 to the dimensions W5 and W6 of the clamps 51 in the first direction D1 are 1 or less, sufficient tension can be applied to the mask 20 when the clamping device 50 pulls the mask 20 with each clamp 51 during manufacturing of the mask device 10. This can prevent wrinkles from forming in the mask 20. As a result, deviation of the positions of the through holes 25 in the mask 20 from the designed positions can be prevented, and a decrease in the positional accuracy of vapor deposition can be prevented. As such, according to this embodiment, the reliability of the mask device 10 can be improved.

[0138] Furthermore, in yet another typical mask device manufacturing apparatus 340, as shown in FIG. 23, for example, when clamping the corresponding grip portion 335 (first grip portion 335a and second grip portion 335b) between the clamps 351 (first clamp 351a and second clamp 351b) of the clamping device 350, the clamps 351 may not clamp the edge portion 320s of the mask 320 in the first direction D1. In this case, during the manufacturing of the mask device, while the clamps 351 are clamping the corresponding grip portion 335, the pressing force of the clamps 351 may cause the edge portion 320s of the mask 320 in the first direction D1 to be deformed and turned up. Therefore, when welding the mask end portion 330 of the mask 320 to the frame, the adhesion between the mask 320 and the frame may be reduced, which may result in poor welding.

[0139] In contrast, according to the present embodiment, the clamps 51 clamp at least the edge 20s of the mask 20 in the first direction D1 (see FIG. 9). As a result, during the manufacture of the mask device 10, while each clamp 51 clamps the corresponding grip portion 35, deformation of the edge 20s of the mask 20 in the first direction D1 due to the pressing force of each clamp 51 can be suppressed. This can suppress the occurrence of welding defects. As a result, the reliability of the mask device 10 can be improved.

[0140] In yet another typical mask device manufacturing apparatus 440, as shown in FIG. 24, for example, each clamp 451 (first clamp 451a and second clamp 451b) of a clamping device 450 may clamp a corresponding grip portion 435 (first grip portion 435a and second grip portion 435b) at a position overlapping with a semicircular portion 432b of a cutout portion 432 in the second direction D2 or at a position inward of the semicircular portion 432b. In this case, the pressing force of each clamp 451 may cause wrinkles to occur in a region R4 (see FIG. 24) of the mask 420 between the first clamp 451a and the second clamp 451b in the first direction D1. If these wrinkles extend into the effective region of the mask 420, the positions of the through holes in the mask 420 may deviate from the designed positions during the vapor deposition process, potentially reducing the positional accuracy of the vapor deposition.

[0141] In contrast, according to the present embodiment, the clamps 51 clamp the grip portions 35 at positions closer to the edge 30e of the mask end portion 30 in the second direction D2 than the semicircular portions 32b of the cutout portions 32 (see FIG. 9). This makes it possible to prevent wrinkles from occurring in the mask 20 due to the pressing force of each clamp 51 while each clamp 51 clamps the corresponding grip portion 35 during the manufacture of the mask device 10. This makes it possible to prevent the positions of the through holes 25 in the mask 20 from shifting from the designed positions, and to prevent a decrease in the positional accuracy of vapor deposition.

[0142] In particular, according to this embodiment, the clamp 51 clamps the grip portion 35 at a position closer to the edge 30e of the mask end 30 in the second direction D2 than the center position 32c of the linear portion 32a in the second direction D2 (see FIG. 9). This makes it possible to more effectively prevent wrinkles from occurring in the mask 20. This makes it possible to more effectively prevent the positions of the through holes 25 in the mask 20 from shifting from the designed positions, and to more effectively prevent a decrease in the positional accuracy of vapor deposition.

[0143] Furthermore, according to the present embodiment, the dimensions W7 and W8 of the clamping regions 36a and 36b in the first direction D1 are larger than the dimensions L7 and L8 of the clamping regions 36a and 36b in the second direction D2 (see FIG. 9 ). Because the clamping regions 36a and 36b are wide, sufficient tension can be applied to the mask 20 when the mask 20 is pulled by the clamps 51 of the clamping device 50 during the manufacture of the mask device 10, thereby preventing wrinkles from forming in the mask 20. Furthermore, because the clamping regions 36a and 36b are short, the mask 20 is prevented from being wrinkled by the pressing force of the clamps 51 while the clamps 51 are clamping the corresponding grip portions 35. Therefore, deviation of the positions of the through holes 25 of the mask 20 from the designed positions can be prevented, thereby preventing a decrease in the positional accuracy of vapor deposition.

[0144] In the above-described embodiment, an example has been described in which the multiple grip portions 35 include a first grip portion 35a and a second grip portion 35b. However, this is not limited to this, and any number of grip portions 35 may be used. For example, as shown in FIG. 25, the multiple grip portions 35 may include a first grip portion 35a, a second grip portion 35b, and a third grip portion 35c.

[0145] In the example shown in Figure 25, the mask end portion 30 includes multiple cutouts 32. The multiple cutouts 32 include first cutouts 32X and second cutouts 32Y. The multiple grip portions 35 are aligned in the first direction D1 via these cutouts 32. More specifically, the first grip portion 35a and the second grip portion 35b are aligned in the first direction D1 via the first cutouts 32X, and the second grip portion 35b and the third grip portion 35c are aligned in the first direction D1 via the second cutouts 32Y.

[0146] 25, the multiple clamps 51 include a first clamp 51a, a second clamp 51b, and a third clamp 51c. The multiple clamps 51 clamp the corresponding grip portions 35 of the mask 20. More specifically, the first clamp 51a clamps the first grip portion 35a of the mask 20, the second clamp 51b clamps the second grip portion 35b of the mask 20, and the third clamp 51c clamps the third grip portion 35c of the mask 20.

[0147] Even in such a case, by setting the dimension of the grip portion 35 in the first direction D1 to 10 mm or more, deformation of the grip portion 35 during manufacturing of the mask device 10 can be suppressed, thereby suppressing the occurrence of manufacturing defects in the mask device 10. Furthermore, by setting the ratio of the dimension of the grip portion 35 in the first direction D1 to the dimension of the clamp 51 in the first direction D1 to 1 or less, wrinkles can be suppressed from occurring in the mask 20 during manufacturing of the mask device 10. This prevents the positions of the through holes 25 in the mask 20 from shifting from the designed positions, thereby suppressing a decrease in the positional accuracy of vapor deposition. As a result, the reliability of the mask device 10 can be improved.

[0148] It should be noted that the present invention is not limited to the above example, and the plurality of grip portions 35 may include even more grip portions 35, such as a fourth grip portion and a fifth grip portion. In this case, the plurality of cutout portions 32 may also include even more cutout portions 32, such as a third cutout portion and a fourth cutout portion. Furthermore, the plurality of clamps 51 may also include even more clamps 51, such as a fourth clamp and a fifth clamp. [Example]

[0149] Next, the embodiment of the present disclosure will be described more specifically with reference to an example, but the embodiment of the present disclosure is not limited to the description of the following example as long as it does not depart from the gist of the disclosure.

[0150] First, as an example, the deformation of the grip portion 35 and the positional accuracy of the through-hole 25 were evaluated when the width dimensions W3 and W4 of the grip portion 35 were changed.

[0151] More specifically, first, a plurality of masks 20 were prepared. For each mask 20, the length dimension L1 (see FIG. 2) of the mask 20 was 1200 mm. The width dimension W1 (see FIG. 2) of the mask 20 was varied within the range of 28 mm to 200 mm. The thickness T of each mask 20 was 30 μm.

[0152] A cutout 32 was formed in the mask edge 30 of each mask 20. As shown in FIG. 5, the edge 32e of the cutout 32 was approximately U-shaped in plan view, and the cutout 32 had a linear portion 32a and a semicircular portion 32b. In each mask 20, the width W2 of the linear portion 32a was 20 mm. The length L2 of the linear portion 32a was 10 mm. The length L3 of the semicircular portion 32b was 10 mm.

[0153] Each mask 20 had a notch 32 formed in the mask end 30, resulting in grip portions 35 (first grip portion 35a and second grip portion 35b) on either side of the notch 32 in the mask end 30, as shown in Figure 5. In each mask 20, the width W3 of the first grip portion 35a was varied within a range of 4 mm to 90 mm (see Figure 26). The width W4 of the second grip portion 35b was set to the same dimension as the width W3 of the first grip portion 35a.

[0154] 9, the corresponding grip portions 35 of each mask 20 were clamped by the clamps 51 of the clamping device 50. That is, the first grip portions 35a of each mask 20 were clamped by the first clamps 51a, and the second grip portions 35b of each mask 20 were clamped by the second clamps 51b. The width dimension W5 of the first clamps 51a was 30 mm. The width dimension W6 of the second clamps 51b was also 30 mm, the same as the width dimension W5 of the first clamps 51a.

[0155] Because the width dimension W5 of the first clamp 51a was 30 mm, when the width dimension W3 (see FIG. 5) of the first grip portion 35a was smaller than 30 mm, the width dimension W7 of the first clamping region 36a was the same as the width dimension W3 of the first grip portion 35a. Furthermore, when the width dimension W3 (see FIG. 5) of the first grip portion 35a was 30 mm or greater, the width dimension W7 of the first clamping region 36a was 30 mm. The length dimension L7 of the first clamping region 36a was 8 mm. The width dimension W8 of the second clamping region 36b was the same as the width dimension W7 of the first clamping region 36a. The length dimension L8 of the second clamping region 36b was 8 mm, the same as the length dimension L7 of the second clamping region 36b. Furthermore, when the clamp 51 clamps the grip portion 35, it clamps at least the edge portion 20s of the mask 20 in the first direction D1 (see FIG. 9).

[0156] First, each mask 20 was evaluated for deformation of the grip portion 35. Figure 26 shows the evaluation results of deformation of the grip portion 35 relative to the width dimension W3 of the grip portion 35 of each mask 20. In the column for the evaluation item "Grip portion deformation" in Figure 26, "◯" indicates that no deformation was observed, "△" indicates that deformation was observed but that clamping was possible, and "×" indicates that large deformation was observed to the extent that clamping was impossible.

[0157] 26, when the width dimension W3 of grip portion 35 was 7.5 mm or less, deformation was observed in grip portion 35, and when the width dimension W3 of grip portion 35 was 6 mm or less, large deformation was observed in grip portion 35 to the extent that it was impossible to hold with clamp 51. On the other hand, when the width dimension W5 of grip portion 35 was 10 mm or more, no deformation was observed in grip portion 35.

[0158] Next, each mask 20 that could be clamped by the clamps 51 (masks 20 whose width dimension W5 of the grip portion 35 was 7 mm or more) was fixed to the frame 15 to obtain a mask device 10 corresponding to each mask 20. More specifically, first, the masks 20 were pulled in opposite directions in the second direction D2 by each clamp 51 to apply tension to the masks 20. Then, with tension applied to the masks 20 by the clamping device 50, the masks 20 were transported onto the frame 15 by the transport device 60, and the mask end 30 of the masks 20 was welded to the frame 15 by the welding device 70.

[0159] Thereafter, the positional accuracy of the through-holes 25 of the mask 20 in each mask device 10 was evaluated. More specifically, the positions of the through-holes 25 of each mask 20 fixed to the frame 15 were measured, and the amount of misalignment was calculated from the difference between the measured positions and the design positions. Nine evaluation points were set for one effective area 22 of each mask 20, at positions of any through-holes 25 within that effective area 22. The amount of misalignment was calculated as the standard deviation of the variation in the differences between the measured positions and the design positions at all evaluation points.

[0160] Figure 26 shows the evaluation results of the positional accuracy of the through-holes 25 of each mask 20. Figure 26 shows each value of W3 / W5, which is the ratio of the width dimension W3 of the grip portion 35 to the width dimension W5 of the clamp 51, and the evaluation results of the positional accuracy of the through-holes 25 for each W3 / W5. In the column for the evaluation item "Positional accuracy of through-holes" in Figure 26, "◯" indicates that the amount of positional deviation was within ±3 μm, "△" indicates that the amount of positional deviation was greater than ±3 μm but within ±5 μm, and "×" indicates that the amount of positional deviation was greater than ±5 μm.

[0161] 26, when W3 / W5 was 1.07 or more, the misalignment amount was greater than ±3 μm, and when W3 / W5 was 1.27 or more, the misalignment amount was greater than ±5 μm. On the other hand, when W3 / W5 was 1 or less, the misalignment amount was within ±3 μm.

[0162] As another example, the deformation of the mask 20 when the clamping position of the clamp 51 was changed was evaluated.

[0163] More specifically, first, a plurality of masks 20 having the same dimensions were prepared. Next, for each mask 20, the dimension ΔW (see FIG. 23 ) between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 was changed, and the grip portion 35 was clamped by the clamp 51. Next, tension was applied to the mask 20 by the clamp 51, and the mask 20 was transported onto the frame 15 by the transport device 60. Then, an attempt was made to weld the mask edge 30 of each mask 20 to the frame 15 by the welding device 70. At this time, for each mask 20 whose clamping position was changed, an evaluation was made as to whether the edge 20s of the mask 20 was deformed so as to turn up, and whether the mask 20 was successfully welded to the frame 15.

[0164] Here, for each mask 20, the dimension ΔW between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 was changed in 1 mm increments within a range of −3 mm to 3 mm (see FIG. 27). A dimension ΔW of “− (minus)” means that the clamp 51 not only clamps the edge 20s of the mask 20 but also extends beyond the edge 20s of the mask 20. For example, a dimension ΔW of “−3 mm” means that the position of the clamp 51 exceeds the edge 20s of the mask 20 by 3 mm in the first direction D1.

[0165] For each mask 20, the length dimension L1 (see FIG. 2) of the mask 20 was 1200 mm. The width dimension W1 (see FIG. 2) of the mask 20 was 80 mm. The thickness T of each mask 20 was 30 μm. The width dimension W2 (see FIG. 5) of the linear portion 32a of the cutout portion 32 was 20 mm. The length dimension L2 (see FIG. 5) of the linear portion 32a of the cutout portion 32 was 10 mm. The length dimension L3 (see FIG. 5) of the semicircular portion 32b of the cutout portion 32 was 10 mm. The width dimensions W3 and W4 (see FIG. 5) of the grip portion were 30 mm. The width dimensions W5 and W6 (see FIG. 9) of the clamp 51 were 30 mm. The length dimensions L7 and L8 (see FIG. 9) of the clamping region 36 were 8 mm.

[0166] 27 shows the results of evaluation of the deformation of the edge 20s of the mask 20 relative to the dimension ΔW (see FIG. 23) between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 and the possibility of welding the mask 20 to the frame 15. In the column for the evaluation item "edge deformation" in FIG. 27, "absent" indicates that no deformation was observed in the edge 20s of the mask 20, and "present" indicates that deformation such as curling up was observed in the edge 20s of the mask 20. In addition, in the column for the evaluation item "welding," "◯" indicates that the mask 20 was successfully welded to the frame 15, and "×" indicates that poor welding occurred between the mask 20 and the frame 15. 27, when the dimension ΔW between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 is 1 mm or more, deformation such as curling up is observed at the edge 20s of the mask 20, resulting in poor welding between the mask 20 and the frame 15. On the other hand, when the dimension ΔW between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 is 0 mm or less, that is, when the clamp 51 holds at least the edge 20s of the mask 20, no deformation is observed at the edge 20s of the mask 20, and the mask 20 can be successfully welded to the frame 15.

Claims

1. A mask device manufacturing apparatus, a mask having a longitudinal direction and a lateral direction; a clamping device that clamps the mask, the mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes, The mask end includes a notch portion formed by cutting out the mask end, and a plurality of grip portions arranged in the short-side direction via the notch portion and protruding in the long-side direction, the clamping device includes a plurality of clamps that clamp the corresponding grip portions, The dimension of the grip portion in the short direction is 10 mm or more, a ratio of a dimension of the grip portion in the short-side direction to a dimension of the clamp in the short-side direction is 1 or less; the clamp holds an edge of the mask at least in the short-side direction; the notch portion includes a linear portion extending linearly in the longitudinal direction from an edge of the mask end in the longitudinal direction, and a semicircular portion adjacent to the linear portion on the opposite side of the edge in the longitudinal direction, the clamp clamps the grip portion at a position closer to the edge than the semicircular portion; the clamp clamps the grip portion at a position closer to the end edge than a center position of the linear portion in the longitudinal direction, the grip portion includes a clamping region that is clamped by the clamp, A mask device manufacturing apparatus, wherein the dimension of the clamping region in the short direction is larger than the dimension of the clamping region in the long direction.

2. A method for manufacturing a mask device, comprising: providing a mask having a longitudinal direction and a transverse direction; and clamping the mask with a clamping device, the mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes, The mask end includes a notch portion formed by cutting out the mask end, and a plurality of grip portions arranged in the short-side direction via the notch portion and protruding in the long-side direction, the clamping device includes a plurality of clamps that clamp the corresponding grip portions, The dimension of the grip portion in the short direction is 10 mm or more, a ratio of a dimension of the grip portion in the short-side direction to a dimension of the clamp in the short-side direction is 1 or less; In the step of clamping the mask, the clamp clamps at least an edge portion of the mask in the short side direction, the notch portion includes a linear portion extending linearly in the longitudinal direction from an edge of the mask end in the longitudinal direction, and a semicircular portion adjacent to the linear portion on the opposite side of the edge in the longitudinal direction, In the step of clamping the mask, the clamp clamps the grip portion at a position closer to the edge than the semicircular portion, In the step of clamping the mask, the clamp clamps the grip portion at a position closer to the edge than a center position of the linear portion in the longitudinal direction, In the step of clamping the mask, the clamping region of the grip portion is clamped by the clamp, A method for manufacturing a mask device, wherein the dimension of the clamping region in the short direction is larger than the dimension of the clamping region in the long direction.

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