Semiconductor manufacturing equipment and processing execution method for semiconductor manufacturing equipment

Abstract

To provide a semiconductor manufacturing apparatus and a processing execution method for the semiconductor manufacturing apparatus, for preventing a semiconductor manufacturing apparatus to be operated from being mixed up.SOLUTION: A semiconductor manufacturing apparatus includes: an execution instruction receiving unit that receives an execution instruction for prescribed processing relating to operation control of the semiconductor manufacturing apparatus; an identification information receiving unit that receives an input of identification information of the semiconductor manufacturing apparatus; and an execution unit that executes the prescribed processing according to the execution instruction of the prescribed processing when identification information of the semiconductor manufacturing apparatus preset in the semiconductor manufacturing apparatus is the same as the identification information of the semiconductor manufacturing apparatus that is received by the identification information receiving unit.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and a method for performing processing in the semiconductor manufacturing apparatus. [Background technology]

[0002] Patent Document 1 discloses a technology that, when a shutdown operation is performed on a medical diagnostic device, displays a message asking whether or not to continue the shutdown operation to attract the operator's attention and prevent erroneous operation of the device. Many semiconductor manufacturing devices are in operation in a semiconductor manufacturing factory, and many of the same models are lined up. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-212539 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for preventing the misidentification of semiconductor manufacturing equipment that should be operated. [Means for solving the problem]

[0005] In view of the above-described problems, the present disclosure provides a semiconductor manufacturing apparatus including an execution instruction receiving unit that receives an instruction to execute a predetermined process related to operation control of the semiconductor manufacturing apparatus from the semiconductor manufacturing apparatus; an identification information receiving unit that receives an input of a unique device name as identification information of the semiconductor manufacturing apparatus; and, when the unique device name of the semiconductor manufacturing apparatus that is preset in the semiconductor manufacturing apparatus is the same as the unique device name of the semiconductor manufacturing apparatus received by the identification information receiving unit, and the heater temperature, pressure, gas injection state, and substrate transport state are in a state where shutdown is possible, and an execution unit that executes the predetermined process in response to an instruction to execute the predetermined process. [Effects of the Invention]

[0008] This can prevent the semiconductor manufacturing device that should be operated from being mistaken for another. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic configuration diagram of an example of a processing system having semiconductor manufacturing equipment and an equipment group management system. [Figure 2] FIG. 1 is a hardware configuration diagram of an example of a semiconductor manufacturing apparatus. [Figure 3] 1 is a functional configuration diagram of an example of a semiconductor manufacturing apparatus (first embodiment); [Figure 4] 1A to 1C are diagrams illustrating an example of transition of an example of a screen displayed on a touch panel display (Example 1). [Figure 5] FIG. 1 is a flowchart illustrating an example of a process for shutting down a semiconductor manufacturing device (first embodiment). [Figure 6] FIG. 10 is a diagram illustrating an example of the arrangement of a hardware switch (Example 2). [Figure 7] FIG. 10 is a functional configuration diagram of an example showing functions of a semiconductor manufacturing apparatus (Example 2). [Figure 8] 10A to 10C are diagrams illustrating an example of transition of an example of a screen displayed on a touch panel display (Example 2). [Figure 9] FIG. 10 is a flowchart illustrating an example of a process for shutting down a semiconductor manufacturing device (Example 2). [Figure 10] FIG. 10 is a diagram showing an example of transition of an example of a screen displayed on a touch panel display (a modified example of the second embodiment). [Figure 11] FIG. 10 is a flowchart illustrating an example of a process for shutting down the semiconductor manufacturing equipment (a modified example of the second embodiment). [Figure 12] FIG. 10 is a functional configuration diagram of an example showing functions of a semiconductor manufacturing apparatus (third embodiment); [Figure 13] FIG. 10 is a diagram showing an example of reservation information (Example 3). [Figure 14]10A to 10C are diagrams illustrating an example of transition of an example of a screen displayed on a touch panel display (Example 3). [Figure 15] FIG. 10 is a flowchart illustrating an example of a process for shutting down a semiconductor manufacturing device (third embodiment). [Figure 16] FIG. 10 is a diagram showing an example of reservation information (a modified example of the third embodiment). [Figure 17] FIG. 10 is a flowchart illustrating an example of a process for shutting down the semiconductor manufacturing equipment (a modified example of the third embodiment). DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. As an example of an embodiment for carrying out the present disclosure, a method for executing a process in a semiconductor manufacturing apparatus will be described with reference to the drawings.

[0011] [About turning off the power to semiconductor manufacturing equipment] Semiconductor manufacturing equipment continuously produces wafers and other substrates 24 hours a day. For this reason, even when work such as hardware or software updates or regular maintenance is required, the equipment is shut down according to a schedule. Shutting down refers to putting the equipment into a power state (for example, powered off) that allows the above work to be performed. Workers shut down the equipment by directly operating it. However, because there are many pieces of semiconductor manufacturing equipment in operation within a semiconductor manufacturing factory, and many of the same models are lined up, this can sometimes lead to mistakes being made about the semiconductor manufacturing equipment being operated, i.e., the equipment that needs to be shut down. If an operator shuts down semiconductor manufacturing equipment that should not be shut down, it may result in a significant loss, such as the need to revise the manufacturing schedule or the inability to ship some substrates.

[0012] Therefore, in this embodiment, the following three methods are used to prevent workers from shutting down semiconductor manufacturing equipment that should not be shut down. In other words, only semiconductor manufacturing equipment that should be shut down is shut down. Hereinafter, these methods will be simply referred to as "preventing the misidentification of semiconductor manufacturing equipment."

[0013] (i) The semiconductor manufacturing equipment requests the input of a pre-registered equipment name, and when the pre-registered equipment name is input, the equipment is shut down.

[0014] If an operator believes that the semiconductor manufacturing equipment is the equipment to be shut down (when in fact it is not), simply displaying a confirmation message when shutting down would not have allowed the operator to realize that it was the wrong semiconductor manufacturing equipment. In this way, by requiring the input of a pre-registered equipment name, the operator can shut down the semiconductor manufacturing equipment to be shut down without making a mistake.

[0015] (ii) An operation acceptance means such as a hardware switch is provided on the front and rear of the semiconductor manufacturing equipment, and when both the front and rear operation acceptance means are pressed, the shutdown operation is accepted. The front and rear are examples of locations where hardware switches, etc., are located at a certain distance apart and must be operated by two or more people.

[0016] Even if an operational rule requiring two people to confirm shutdown is established, it is not possible to enforce the operational rule because only one person operates the semiconductor manufacturing equipment. In this way, the present disclosure provides a mechanism for two people to perform shutdown operations, making it possible to enforce the operational rule requiring two people to confirm shutdown operations.

[0017] (iii) The semiconductor manufacturing equipment to be shut down is reserved using the equipment group management system described below, and the semiconductor manufacturing equipment for which shutdown has been reserved is shut down.

[0018] When an administrator instructs an operator to shut down, there is a possibility that the administrator may mistakenly communicate the target semiconductor manufacturing equipment. In this way, by having the semiconductor manufacturing equipment confirm that a shutdown has been reserved, it is possible to prevent mistakes due to communication errors.

[0019] [Terminology] The predetermined process related to the operation control of semiconductor manufacturing equipment is a process of changing the operating state of the semiconductor manufacturing equipment from one in which the equipment can perform its intended operation, such as process control, to another in which it cannot. For example, turning off the power puts the semiconductor manufacturing equipment in a state in which it cannot perform its intended operation, such as process control. Turning off the power also puts the equipment in an operating state in which it can perform hardware and software updates, periodic maintenance work, and the like. Turning off the power is, for example, a state in which no power is supplied from a power strip. In this embodiment, turning off the power is sometimes referred to as shutting down.

[0020] In this embodiment, a method for preventing the misidentification of semiconductor manufacturing equipment 2 to be shut down is described, but it can also be used to prevent the misidentification of semiconductor manufacturing equipment 2 to be restarted, for example. Restarting refers to terminating the software running on the equipment and then restarting it. Restarting can be performed up to powering off, or it can be performed by terminating and restarting only the software while leaving the power on. In addition, the purpose of preventing the misidentification of semiconductor manufacturing equipment 2 can include not only part replacement, maintenance, or movement that requires powering off, but also startup, any button operation, etc.

[0021] [System configuration example] Fig. 1 is a schematic configuration diagram of a processing system 1 having semiconductor manufacturing equipment 2 and an equipment group management system 6. As shown in Fig. 1, the processing system 1 of the present disclosure has a plurality of semiconductor manufacturing equipment 2 (21 to 2n in Fig. 1), an equipment group management system 6, and a network 5 that interconnects these.

[0022] The semiconductor manufacturing equipment 2 is placed in, for example, a clean room, and an administrator controls the semiconductor manufacturing equipment 2 by operating an equipment group management system 6 located in a separate room. For example, the equipment group management system 6 accepts input of a recipe (a command specifying process conditions and procedures) and transmits the recipe to the semiconductor manufacturing equipment 2. An operator enters the clean room and performs "machine operations" such as operating various buttons to transport substrates to be processed and execute recipes for the semiconductor manufacturing equipment 2.

[0023] The semiconductor manufacturing equipment 2 may include various types of equipment depending on the process. For example, there are film formation equipment that forms a thin film on a semiconductor wafer, oxidation equipment that performs oxidation processing to oxidize the surface region of a semiconductor wafer, diffusion equipment that performs processing to diffuse (dope) impurities into the surface region of a semiconductor wafer, annealing equipment, etching equipment, etc. The semiconductor manufacturing equipment 2 may also be equipment that processes a substrate using plasma. Such equipment includes atomic layer deposition (ALD) equipment, capacitively coupled plasma (CCP), inductively coupled plasma (ICP), radial line slot antenna (RLSA), electron cyclotron resonance plasma (ECR), helicon wave plasma (HWP), etc., and any type of equipment is applicable.

[0024] FIG. 2 shows a hardware configuration diagram of semiconductor manufacturing equipment 2. Note that functions related to the semiconductor manufacturing process are omitted in FIG. 2. Semiconductor manufacturing equipment 2 has a network interface 11, a system controller 12, a data storage unit 13, a touch panel interface 14, a touch panel display 15, an input / output interface 16, and at least two hardware switches 17a and 17b. When referring to any of hardware switches 17a and 17b, it will be referred to as "hardware switch 17."

[0025] The network interface 11 is a network interface card (NIC) such as an Ethernet card (registered trademark). The network interface 11 connects to the network 5 and enables communication with the device group management system 6.

[0026] The system controller 12 is a microcontroller having a CPU, RAM, ROM, etc., a SoC (System on a Chip), a SiP (System in a Package), etc. The system controller 12 performs all of the control required for film formation, such as temperature, pressure, exhaust, injection of process gas, and substrate replacement, according to a recipe. In this embodiment, the system controller 12 also performs control related to shutdown.

[0027] The touch panel interface 14 converts signals from the touch panel display 15 into information such as the pressed coordinates and which button on the screen was pressed, and notifies the system controller 12. A touch panel is an electronic component that combines a display device such as a liquid crystal panel with a position input device such as a touchpad, and is an input device that allows you to operate equipment by pressing the display on the screen.

[0028] The input / output interface 16 converts the state (on / off) of the hardware switch 17 into a signal and notifies the system controller 12. The hardware switch 17 is, for example, a momentary switch that turns on when pressed by an operator and turns off by a biasing force when released.

[0029] The data storage unit 13 is a storage device such as an SSD (Solid State Drive), an HDD (Hard Disk Drive), or a ROM, and holds various types of data. The data storage unit 13 is preferably a non-volatile memory, but may be a volatile memory. [Example]

[0030] In this embodiment, a power-off method will be described in which "(i) the semiconductor manufacturing equipment requests input of a pre-registered equipment name, and when the pre-registered equipment name is input, a shutdown is performed."

[0031] [About the function] 3 is an example of a functional configuration diagram showing the functions of the semiconductor manufacturing apparatus 2 of this embodiment. The semiconductor manufacturing apparatus 2 has an execution instruction receiving unit 21, an identification information receiving unit 22, an identification information determining unit 23, an execution unit 24, and an apparatus name storage unit 25. Each of these functional units of the semiconductor manufacturing apparatus 2 is a function or means realized by the system controller 12 shown in FIG. 2 executing instructions contained in one or more programs installed in the semiconductor manufacturing apparatus 2.

[0032] The execution instruction receiving unit 21 displays a shutdown execution screen (described later) on the touch panel display 15, and receives a shutdown execution instruction from an operator. The shutdown execution screen may be displayed on a display other than a touch panel.

[0033] The identification information accepting unit 22 accepts the input of a device name by the worker by displaying a device name input screen, which will be described later, on the touch panel display 15. The device name input screen may be displayed on a display other than a touch panel.

[0034] The identification information determination unit 23 determines whether the equipment name stored in the equipment name storage unit 25 matches the equipment name received by the identification information reception unit 22. For this reason, the equipment name storage unit 25 stores individual equipment names for the semiconductor manufacturing equipment 2 in advance. The equipment name is a combination of letters and numbers that is easy for an operator to enter, but the equipment name also serves as identification information. Therefore, the equipment name may be any identification information that can identify or specify the semiconductor manufacturing equipment 2. However, the equipment name does not necessarily have to be unique, and the same identification information may be assigned to several semiconductor manufacturing equipment 2 belonging to a group.

[0035] A method for saving equipment names will now be described. For example, an operator may directly operate the semiconductor manufacturing equipment 2 and input the equipment name. Alternatively, since the equipment group management system 6 communicates with the semiconductor manufacturing equipment 2, the system may display the model number, serial number, etc. transmitted from the semiconductor manufacturing equipment 2, and the administrator may input the equipment name. Alternatively, the equipment group management system 6 may assign a unique equipment name (e.g., a combination of numbers and letters) to each piece of semiconductor manufacturing equipment 2 in response to an administrator's operation. The semiconductor manufacturing equipment 2 can display its own equipment name on the touch panel display 15. Furthermore, the equipment group management system 6 can display the equipment name transmitted from the semiconductor manufacturing equipment 2 along with information that can identify the semiconductor manufacturing equipment 2, such as the model number and serial number. This allows the administrator and operators to know the equipment name of the semiconductor manufacturing equipment 2 that needs to be shut down.

[0036] The execution unit 24 shuts down the semiconductor manufacturing equipment 2. For example, the execution unit 24 checks whether the heater temperature, pressure, gas injection state, substrate transport state, etc. are in a state where shutdown is possible. If these are in a state where shutdown is possible, the execution unit 24 saves data from RAM to SSD, closes files, etc., ends OS processing, and finally shuts down the power to the semiconductor manufacturing equipment 2.

[0037] [Screen transition example] Next, an example of transition of screens displayed on touch panel display 15 will be described with reference to Fig. 4. Fig. 4 is a diagram showing an example of transition of screens displayed on touch panel display 15 during shutdown.

[0038] FIG. 4(a) is an example of a shutdown execution screen 100. The shutdown execution screen 100 is a screen for accepting an instruction to execute a shutdown. The shutdown execution screen 100 has a message 101 saying "If you want to shut down, press the Yes button," a Yes button 102, and a No button 103. When the user presses the Yes button 102, the semiconductor manufacturing equipment 2 accepts the instruction to execute a shutdown, and the shutdown execution screen 100 transitions to an equipment name input screen 110 shown in FIG. 4(b).

[0039] 4(b) is an example of the device name input screen 110. The device name input screen 110 has a message 111 saying "Please enter the device name and press the verify button," a device name input field 112, a verify button 113, and a cancel button 114. The equipment name input field 112 is a field where the operator inputs the name of the semiconductor manufacturing equipment 2 to be shut down. The verification button 113 is a button that the operator presses to request the semiconductor manufacturing equipment 2 to verify whether the equipment name stored in the equipment name storage unit 25 matches the equipment name entered in the equipment name input field 112. If they match, shutdown is executed. The cancel button 114 is a button for returning to the shutdown execution screen 100.

[0040] 4(c) is an example of the equipment name input screen 110 displaying the software keyboard 115. The software keyboard 115 is displayed when the worker touches the equipment name input field 112. The worker can operate the software keyboard 115 to input the equipment name of the semiconductor manufacturing equipment 2 that has been specified.

[0041] [Shutdown procedure] 5 is a flowchart illustrating the process of shutting down the semiconductor manufacturing equipment 2. The explanation will be given assuming that the operator has displayed the shutdown execution screen 100.

[0042] First, the execution instruction receiving unit 21 determines whether or not a shutdown execution instruction has been received (S11). That is, it determines whether or not the Yes button 102 has been pressed on the shutdown execution screen 100 of FIG. 4(a).

[0043] If the determination in step S11 is Yes, the identification information accepting unit 22 displays an equipment name input screen 110 on the touch panel display 15. The worker touches an equipment name input field 112 to display a software keyboard 115 (S12). The worker operates the software keyboard 115 to input the equipment name of the semiconductor manufacturing equipment 2 that has been instructed by the manager verbally, by email, on paper, or the like. When input is complete, the worker closes the software keyboard 115 with the close button 116 and presses the verify button 113.

[0044] When the comparison button 113 is pressed, the identification information judgment unit 23 acquires the device name stored in the device name storage unit 25 and judges whether it matches the device name entered in the device name input field 112 (S13).

[0045] If the determination in step S13 is Yes, the execution unit 24 starts the execution of shutting down the semiconductor manufacturing equipment 2 in response to the execution instruction (S14).

[0046] If the determination in step S13 is No, the identification information accepting unit 22 displays an error message on the touch panel display 15 (S15). The error message may be, for example, "Device names do not match."

[0047] In this case, the operator can clear the error message (it may be cleared automatically) and again operate the software keyboard 115 to input the equipment name of the instructed semiconductor manufacturing equipment 2. If the equipment names do not match even after pressing the verification button 113 N times, the identification information receiving unit 22 may prohibit the display of the equipment name input screen 110 for a certain period of time. In this way, the power-off method of the present disclosure makes it easier to prevent mistakes in identifying the semiconductor manufacturing equipment 2.

[0048] [Major effects] If an operator believes that the semiconductor manufacturing equipment 2 is the equipment to be shut down (when it is not actually the equipment to be shut down), simply displaying a confirmation message when shutting down the equipment would not have made the operator realize that the equipment was mistaken. According to this embodiment, the semiconductor manufacturing equipment 2 requests the input of a pre-registered equipment name before shutting down, and the present disclosure can therefore prevent the operator from mistaking the semiconductor manufacturing equipment 2 to be shut down. [Example]

[0049] In this embodiment, the power-off method will be described as follows: "(ii) An operation acceptance means such as a hardware switch is provided on the front and rear surfaces of the semiconductor manufacturing equipment, and when both the front and rear operation acceptance means are pressed, the shutdown operation is accepted."

[0050] [Example of hardware switch placement] First, an example of the arrangement of the hardware switch 17 will be described with reference to FIG. 6. FIG. 6 is a diagram showing an example of the arrangement of the hardware switch 17 relative to a perspective view of the exterior of the semiconductor manufacturing equipment 2. The hardware switches 17a and 17b (examples of two operation receiving means) are arranged in two locations, the front and rear of the semiconductor manufacturing equipment 2. The two hardware switches 17a and 17b are not limited to being arranged on the front and rear, but may be arranged at a distance sufficient to prevent one operator from pressing them simultaneously (hereinafter simply referred to as a certain distance or more). Therefore, the hardware switch 17a may be arranged on the front, rear, left or right side, or top surface, and the hardware switch 17b may be arranged on a surface different from the hardware switch 17a, the front, rear, left or right side, or top surface. However, the two hardware switches 17a and 17b may be arranged on the same surface as long as they are separated by a certain distance or more. Therefore, the certain distance may be approximately 2 m.

[0051] It is also preferable that one of the two hardware switches 17a, 17b is located near the touch panel display 15. One worker can press the hardware switch 17 while viewing the touch panel display 15. Furthermore, one worker can operate the touch panel display 15 and press the hardware switch 17 at the same time.

[0052] Furthermore, both of the two hardware switches 17a, 17b may be soft keys displayed on the touch panel display 15. In this case, for example, the touch panel display 15 is provided on the rear surface of the semiconductor manufacturing equipment 2. Alternatively, one of the two hardware switches 17a, 17b may be the hardware switch 17, and the other may be a soft key displayed on the touch panel display 15. In this case, for example, the hardware switch 17 is provided on the rear surface of the semiconductor manufacturing equipment 2.

[0053] At least one of the two hardware switches 17a, 17b may have a function to detect the operation or presence of a worker, and may be a simple touch sensor or ultrasonic sensor without a display. At least one of the two hardware switches 17a, 17b may be an IC card reader. In this case, the worker holds up an IC card, so a record of the worker who performed the work can be kept. The hardware switch 17, soft key, touch sensor, ultrasonic sensor, and IC card reader are examples of operation reception means.

[0054] It should be noted that there may be three or more hardware switches 17. By having three or more workers perform the shutdown work, it is possible to more reliably prevent mistakes from being made.

[0055] [About the function] 7 is an example of a functional configuration diagram showing functions possessed by the semiconductor manufacturing apparatus 2 of this embodiment. The semiconductor manufacturing apparatus 2 of FIG. 7(a) has a shutdown operation initiation unit 31, a first operation detection unit 32, a second operation detection unit 33, an operation determination unit 34, an execution instruction reception unit 35, and an execution unit 36. Each of these functional units possessed by the semiconductor manufacturing apparatus 2 is a function or means realized by the system controller 12 shown in FIG. 2 executing instructions contained in one or more programs installed in the semiconductor manufacturing apparatus 2. Note that although the hardware switches 17a and 17b are hardware configurations, they are illustrated for convenience of explanation.

[0056] The shutdown operation initiation unit 31 displays a shutdown start screen, which will be described later, on the touch panel display 15, and accepts the start of the shutdown operation in response to an operation by the operator.

[0057] The first operation detection unit 32 detects pressing of the hardware switch 17a, and the second operation detection unit 33 detects pressing of the hardware switch 17b. While the first operation detection unit 32 detects pressing of the hardware switch 17a, it continuously (or repeatedly) outputs an ON signal to the operation determination unit 34. While the second operation detection unit 33 detects pressing of the hardware switch 17b, it continuously (or repeatedly) outputs an ON signal to the operation determination unit 34.

[0058] The operation determination unit 34 determines whether the first operation detection unit 32 and the second operation detection unit 33 output ON signals at the same time in time. In other words, the operation determination unit 34 determines whether both of the two hardware switches 17 are pressed down.

[0059] The execution instruction receiving unit 35 displays a shutdown execution screen when the operation determination unit 34 determines that the first operation detection unit 32 and the second operation detection unit 33 have output ON signals at the same time. Therefore, the execution instruction receiving unit 35 of this embodiment can receive an instruction to execute shutdown when both of the two hardware switches 17 are pressed down.

[0060] The function of the execution unit 36 ​​may be the same as that in the first embodiment.

[0061] The semiconductor manufacturing apparatus 2 in Figure 7(b) is a functional configuration diagram of a modified example of Example 2. The functions of each functional unit are the same as those in Figure 7(a). In this modified example, after the execution instruction receiving unit 35 receives an instruction to execute shutdown, if the operation judging unit 34 determines that the first operation detecting unit 32 and the second operation detecting unit 33 output ON signals at the same time, the executing unit 36 ​​executes the shutdown.

[0062] [Screen transition example] Next, an example of transition of screens displayed on touch panel display 15 will be described with reference to Fig. 8. Fig. 8 is a diagram showing an example of transition of screens displayed on touch panel display 15 during shutdown.

[0063] FIG. 8(a) is an example of a shutdown start screen 120. The shutdown start screen 120 is a screen on which an operator accepts the start of shutdown work. Execution of shutdown is not yet accepted on this screen. The shutdown start screen 120 has a message 121 asking "Do you want to perform the shutdown operation?", a Yes button 122, and a No button 123. When the user presses the Yes button 122, the shutdown start screen 120 transitions to a hardware switch press prompt screen 130 shown in FIG. 8(b).

[0064] 8(b) is an example of the hardware switch press prompt screen 130. The hardware switch press prompt screen 130 has a message 131 that reads, "Please press the hardware switches on the front and rear of the equipment at the same time." After confirming this message 131, the two workers press the front and rear hardware switches 17a and 17b, respectively. While the hardware switch press prompt screen 130 is displayed, the semiconductor manufacturing equipment 2 may emphasize the display by, for example, flashing the hardware switches 17a and 17b.

[0065] When both of the two hardware switches 17a and 17b are pressed, the hardware switch pressing prompt screen 130 transitions to a shutdown execution screen 140.

[0066] 8(c) is an example of the shutdown execution screen 140. The shutdown execution screen 140 may be the same as that in the first embodiment. When the user presses the Yes button 142 on the shutdown execution screen 140, the semiconductor manufacturing apparatus 2 accepts an instruction to execute shutdown. When the user presses the No button 143, the shutdown execution screen 140 transitions to the shutdown start screen 120.

[0067] The shutdown execution screen 140 is not displayed unless both of the two hardware switches 17a and 17b are pressed, which prevents a single worker from mistaking one semiconductor manufacturing device for another.

[0068] The shutdown execution screen 140 may be displayed only while both of the two hardware switches 17a and 17b are pressed down. This more strictly enforces the operational rule that two people must check the shutdown process together.

[0069] [Shutdown procedure] 9 is a flowchart illustrating the process of shutting down the semiconductor manufacturing equipment 2. The description will be given assuming that the operator has displayed the shutdown start screen 120.

[0070] First, the shutdown operation initiation unit 31 determines whether or not the start of the shutdown operation has been accepted (S21), that is, whether or not the Yes button 132 has been pressed on the shutdown start screen 120 of Fig. 8(a).

[0071] If the determination in step S21 is Yes, the screen transitions to the hardware switch press prompt screen 130 shown in Fig. 8(b). Then, the operation determination unit 34 determines whether the first operation detection unit 32 and the second operation detection unit 33 output ON signals at the same time (S22). In order to prevent erroneous operations, the operation determination unit 34 may ignore the overlapping ON signals within a predetermined time period.

[0072] If the determination in step S22 is No, the hardware switch press prompt screen 130 remains displayed, but the operation determination unit 34 may display an error message after a certain period of time has elapsed (S25), and the screen may return to the main screen (not shown) or the shutdown start screen 120. The error message may be, for example, "Two hardware switches 17 were not pressed."

[0073] If the determination in step S22 is Yes, the execution instruction receiving unit 35 displays the shutdown execution screen 140 of Fig. 8(c) and determines whether the Yes button 142 has been pressed (S23). That is, when both of the two hardware switches 17 are pressed, the semiconductor manufacturing apparatus 2 becomes able to receive an instruction to execute shutdown.

[0074] If the determination in step S23 is Yes, the execution unit 36 ​​starts the execution of shutting down the semiconductor manufacturing equipment 2 in response to the execution instruction (S24).

[0075] If the determination in step S23 is No, the execution unit 36 ​​displays an error message on the touch panel display 15 (S25). First, if the No button 143 is pressed, it is preferable to return to the main screen or the shutdown start screen 120. If neither the Yes button 142 nor the No button 143 is pressed, the shutdown execution screen 140 remains displayed, but the operation determination unit 34 displays an error message after a certain period of time has elapsed, and the screen returns to the main screen or the shutdown start screen 120. The error message may be something like "Shutdown not executed."

[0076] <Modification of operation procedure> 8 and 9, the shutdown procedure does not have to be the shutdown start screen 120 → hardware switch press prompt screen 130 → shutdown execution screen 140, but may be the shutdown execution screen 140 → hardware switch press prompt screen 130. Figure 10 shows the latter screen transition. The shutdown execution screen 140 in Figure 10(a) is the same as Figure 8(c), and the hardware switch press prompt screen 130 in Figure 10(b) is the same as Figure 8(b).

[0077] In this case, when two workers simultaneously press the hardware switch 17, shutdown is executed without any further button operation.

[0078] 11 is a flowchart illustrating the process of shutting down the semiconductor manufacturing equipment 2. The description will be given assuming that the operator has displayed the shutdown execution screen 140.

[0079] First, the execution instruction receiving unit 35 determines whether or not a shutdown execution instruction has been received (S31). That is, it determines whether or not the Yes button 142 has been pressed on the shutdown execution screen 140 of FIG. 10(a).

[0080] If the determination in step S31 is Yes, the screen transitions to the hardware switch press prompt screen 130 shown in Fig. 10(b). Then, the operation determination unit 34 determines whether the first operation detection unit 32 and the second operation detection unit 33 output ON signals at the same time (S32).

[0081] If the determination in step S32 is Yes, the execution unit 36 ​​starts the execution of shutting down the semiconductor manufacturing equipment 2 in response to the execution instruction (S33).

[0082] If the determination in step S32 is No, the execution unit 36 ​​displays an error message on the touch panel display 15 (S34). If the determination in step S32 is No, the hardware switch press prompt screen 130 remains displayed, but after a certain period of time has passed, an error message may be displayed and the screen may return to the main screen or the shutdown execution screen 140. For example, the error message may be "Two hardware switches 17 were not pressed."

[0083] [Major effects] According to this embodiment, by providing a mechanism for two people to perform the shutdown operation, it is possible to enforce the operational rule that two people must work together to check the operation. [Example]

[0084] In this embodiment, a power-off method will be described in which "(iii) the semiconductor manufacturing equipment 2 to be shut down is reserved from the equipment group management system 6, and the shutdown is executed for the semiconductor manufacturing equipment 2 for which shutdown has been reserved."

[0085] [About the function] 12 is an example of a functional configuration diagram showing the functions of the semiconductor manufacturing apparatus 2 of this embodiment. The semiconductor manufacturing apparatus 2 has a reservation reception unit 41, an execution instruction reception unit 42, a reservation determination unit 43, an execution unit 44, and a reservation information storage unit 45. Each of these functional units of the semiconductor manufacturing apparatus 2 is a function or means realized by the system controller 12 shown in FIG. 2 executing instructions contained in one or more programs installed in the semiconductor manufacturing apparatus 2.

[0086] The reservation receiving unit 41 receives a reservation for shutdown from the device group management system 6 and stores the reservation information in the reservation information storage unit 45 .

[0087] FIG. 13 shows an example of reservation information. The reservation information includes reservation details for the reservation acceptance date and time. One of the reservation details is a shutdown. The reservation information may be deleted once the reservation details are executed, or the oldest reservation information may be deleted once the reservation information reaches a certain capacity.

[0088] 12, the execution instruction receiving unit 42 displays a shutdown execution screen on the touch panel display 15 and receives a shutdown instruction from the operator. The shutdown execution screen may be displayed on a display other than a touch panel.

[0089] The reservation determination unit 43 determines whether a shutdown has been reserved and whether a predetermined time has passed since the reservation acceptance date and time. If a shutdown has been reserved and the predetermined time has not passed since the reservation acceptance date and time, the reservation determination unit 43 requests a shutdown from the execution unit 44. Since it can be determined that the semiconductor manufacturing equipment 2 for which a shutdown has been reserved is not the semiconductor manufacturing equipment 2 for which the information was erroneously communicated, it is possible to prevent misidentification due to communication errors.

[0090] The function of the execution unit 44 may be the same as that in the first embodiment.

[0091] [Screen example] 14A and 14B are diagrams showing an example of the transition of screens displayed on the touch panel display 15 during shutdown. FIG. 14A shows a shutdown execution screen 150. The shutdown execution screen 150 in FIG. 14A is the same as that in FIG. 4A. In this embodiment, the shutdown execution is accepted when the worker presses the Yes button 152 on the shutdown execution screen 150. The shutdown execution screen 150 transitions to a reservation confirmation screen 160.

[0092] 14(b) is an example of the reservation confirmation screen 160. The reservation confirmation screen 160 has a message 161 that reads "Reservation confirmation in progress."

[0093] [Shutdown procedure] 15 is a flowchart illustrating the process of shutting down the semiconductor manufacturing equipment 2. The explanation will be given assuming that an operator has displayed the shutdown execution screen.

[0094] First, the execution instruction receiving unit 42 determines whether or not a shutdown execution instruction has been received (S41). That is, it determines whether or not the Yes button 152 has been pressed on the shutdown execution screen 150 of FIG. 14(a).

[0095] If the determination in step S41 is Yes, the reservation confirmation screen 160 of FIG. 14(b) is displayed, and the reservation determination unit 43 determines whether or not reservation information related to shutdown is stored in the reservation information storage unit 45 (S42).

[0096] If the determination in step S42 is No, the reservation determination unit 43 displays an error message (S43). The error message may be, for example, "Shutdown is not reserved." In this case, the screen transitions to the main screen or the shutdown execution screen 150.

[0097] If the determination in step S42 is Yes, the reservation determination unit 43 determines whether a predetermined time has elapsed from the reservation acceptance date and time of the reservation information regarding shutdown to the current time (S44).

[0098] The predetermined time may be the time required for the work, for example, from several hours to one day, etc. In other words, it is assumed that the administrator will reserve the shutdown in the equipment group management system 6 on the day, and the worker who receives the shutdown instruction from the administrator will perform the shutdown work on the same day.

[0099] There may be cases where the administrator wants to reserve a shutdown in the equipment group management system 6 in advance. For example, the administrator may set a shutdown reservation one week to one month in advance. In this case, it is preferable that the administrator can also set the specified time. For example, if the administrator sets a shutdown reservation one week in advance, the administrator sets the specified time to one week and registers this in the reservation information. Note that a shutdown reservation may also be set by an operator for the semiconductor manufacturing equipment 2.

[0100] If the determination in step S44 is No, the reservation determination unit 43 displays an error message (S46). The error message may be, for example, "A predetermined time has passed since the reservation was accepted. Please check the semiconductor manufacturing equipment 2 to be shut down." In this case, the screen transitions to the main screen or the shutdown execution screen 150.

[0101] If the determination in step S44 is Yes, the execution unit 44 starts shutting down the semiconductor manufacturing equipment 2 in response to the execution instruction (S45).

[0102] Note that if the operation is one in which the reservation information for shutdown is deleted after the shutdown is executed, the determination in step S44 is not necessary. However, by including step S44, it is possible to reliably determine whether or not a reservation has been made even if the operation is one in which the reservation information for shutdown is not deleted after the shutdown is executed, or even if the operation is one in which the reservation information for shutdown is not deleted.

[0103] <Modification> An administrator may reserve a date and time for shutdown, in which case workers can only perform the shutdown at the reserved date and time.

[0104] Fig. 16 is an example of reservation information in this modified example. A new executable date and time has been registered in the reservation information in Fig. 16. The executable date and time is the range of dates and times (start and end) when the work for the reservation can be performed. If the current time is within this range of dates and times, the semiconductor manufacturing equipment 2 will accept an instruction to perform shutdown.

[0105] 17 is a flowchart illustrating the process of shutting down the semiconductor manufacturing equipment 2 in this modification. The description will be given assuming that an operator has displayed the shutdown execution screen. The description of FIG. 17 will mainly focus on the differences from FIG. 15.

[0106] 17, the process in step S44-2 is different. That is, the reservation determination unit 43 determines whether the current time is included in the executable date and time (range of date and time) in the reservation information (S44-2). This allows the worker to perform the scheduled shutdown without considering the reservation acceptance date and time.

[0107] [Major effects] According to this embodiment, even if the administrator mistakenly communicates the target semiconductor manufacturing equipment 2 when instructing the operator to shut down, by confirming that the shutdown has been reserved, it is possible to prevent confusion due to communication errors.

[0108] 〔others〕 For example, all or any two of the first to third embodiments can be combined to implement the present disclosure, which can further reduce the possibility of mistaking the semiconductor manufacturing equipment 2.

[0109] 1 is just one example, and it goes without saying that there are various system configurations depending on the application and purpose. The classification of equipment such as the equipment group management system 6 and semiconductor manufacturing equipment 2 in FIG. 1 is just one example. [Explanation of symbols]

[0110] 1 Processing System 2. Semiconductor manufacturing equipment 6 Equipment Group Management System 21 Execution instruction reception unit 22 Identification information determination unit 23 Identification Information Judgment Unit 24 Executive Department 25 Device name storage section 45 Reservation information storage unit

Claims

1. an execution instruction receiving unit that receives an instruction to a semiconductor manufacturing device to execute a predetermined process related to operation control of the semiconductor manufacturing device; an identification information receiving unit that receives an input of a unique device name as identification information for the semiconductor manufacturing device; an execution unit that executes the predetermined process in response to an execution instruction for the predetermined process when the unique device name of the semiconductor manufacturing device that is preset in the semiconductor manufacturing device is the same as the unique device name of the semiconductor manufacturing device that is received by the identification information receiving unit, and when the heater temperature, pressure, gas injection state, and substrate transport state are in a state that allows shutdown; A semiconductor manufacturing apparatus comprising:

2. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the predetermined process is powering off, shutting down, or restarting the semiconductor manufacturing apparatus.

3. receiving an instruction to a semiconductor manufacturing device to execute a predetermined process related to operation control of the semiconductor manufacturing device; receiving an input of a unique equipment name as identification information of the semiconductor manufacturing equipment; executing the predetermined process in response to an instruction to execute the predetermined process when the unique device name of the semiconductor manufacturing device preset in the semiconductor manufacturing device is the same as the unique device name of the semiconductor manufacturing device received in the input receiving step, and when the heater temperature, pressure, gas injection state, and substrate transport state are in a state allowing shutdown; 1. A method for executing processing in a semiconductor manufacturing device, comprising:

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