jig

Abstract

To provide a jig which can suppress abrasion of a carrier bar and can reduce the exchange frequency of components.SOLUTION: A jig holding a printed wiring board includes: a carrier bar; a first leg member extending substantially vertical to the carrier bar; and a second leg member extending substantially vertical to the carrier bar. The printed wiring board is held by the first leg member and the second leg member, and at least a part of a lower surface of the carrier bar where the first leg member and the second leg member are provided is covered with a protective member.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The technology disclosed by this specification relates to a jig for holding a printed wiring board.

Background Art

[0002] Patent Document 1 discloses a workpiece holder having a header member, a first flexible leg member extending from a first end of the header member, and a second flexible leg member extending from a second end of the header member. The workpiece holder holds the workpiece by a seal strip provided on the first flexible leg member and a seal strip provided on the second flexible leg member.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] [Problems of Patent Document 1]<了 The technology of Patent Document 1 forms an electroplating film on a workpiece using a workpiece holder. It is conceivable that the header member interferes with a part of the plating bath during the electroplating process. It is conceivable that the header member wears out.

Means for Solving the Problems

[0005] The jig of the present invention is a jig for holding a printed wiring board, and includes a carrier bar having an upper surface and a lower surface opposite to the upper surface, a first leg member extending downward from the lower surface of the carrier bar, a second leg member extending downward from the lower surface of the carrier bar, and a protective member formed on at least a part of the lower surface of the carrier bar. The printed wiring board is held by the first leg member and the second leg member, and when the jig is immersed in a plating bath, the protective member contacts the plating bath.

[0006] The jig of the embodiment of the present invention has a protective member on the underside of the carrier bar. The jig is placed in the plating bath via the protective member. As a result, wear on the underside of the carrier bar is suppressed. Deformation of the jig is suppressed. The frequency of replacement of jig parts is reduced. [Brief explanation of the drawing]

[0007] [Figure 1] A schematic perspective view showing the jig of the embodiment and the printed circuit board held by the jig. [Figure 2] A schematic front view showing the jig of the embodiment and the printed circuit board held by the jig. [Figure 3] A schematic top view showing the jig of the embodiment. [Figure 4] A schematic right side view showing the jig of the embodiment. [Figure 5] A schematic diagram illustrating the second retaining mechanism of the second leg member and the printed circuit board sandwiched between the second retaining mechanisms. [Figure 6] A schematic perspective view showing a plating tank having a jig and guide member according to an embodiment. [Modes for carrying out the invention]

[0008] [Embodiment] Figures 1 to 4 schematically show the jig 2 of the embodiment. Figure 1 is a perspective view, Figure 2 is a front view, Figure 3 is a top view, and Figure 4 is a right side view. The jig 2 of the embodiment holds both ends of the printed circuit board 4 from both sides. By placing the jig 2, which holds the printed circuit board 4, in the plating bath, electroplating is performed on the printed circuit board 4.

[0009] As shown in Figure 1, the jig 2 has a carrier bar 10, a first leg member 21, and a second leg member 22. The carrier bar 10 has an upper surface 10A and a lower surface 10B opposite to the upper surface 10A. The first leg member 21 extends downward from the lower surface 10B. The first leg member 21 extends approximately perpendicular to the carrier bar 10. The second leg member 22 extends downward from the lower surface 10B. The second leg member 22 extends approximately perpendicular to the carrier bar 10. The printed circuit board 4 is held by the first leg member 21 and the second leg member 22.

[0010] The carrier bar 10 is formed in an elongated shape. The surface of the carrier bar 10 is covered with a resin coating. As shown in Figures 1 and 3, two transport sections 14 are formed on the upper surface 10A of the carrier bar 10. The jig 2 is transported via the transport sections 14 by a transport device (not shown).

[0011] Protective members 61 and 62 are formed on the lower surface 10B of the carrier bar 10. The protective members (protective plates) 61 and 62 are formed on at least a portion of the lower surface 10B. Protective member 61 is the first protective member (first protective plate) 61, and protective member 62 is the second protective member (second protective plate) 62. The first protective plate 61 covers a portion of the lower surface 10B. The second protective plate 62 covers a portion of the lower surface 10B. The protective plates 61 and 62 do not cover the entire lower surface 10B. The surface between the first protective plate 61 and the second protective plate 62 is the lower surface 10B. In this embodiment, the protective members 61 and 62 have openings. The first leg member 21 extends from the lower surface 10B exposed by the opening (first opening) of the first protective member 61. The second leg member 22 extends from the lower surface 10B exposed by the opening (second opening) of the second protective member 62. The first protective plate 61 and the second protective plate 62 are plate-shaped members. The first protective plate 61 and the second protective plate 62 are made of resin. An example of resin is polyetheretherketone (PEEK).

[0012] The first protective plate 61 covers the lower surface 10B around the first leg member 21. The second protective plate 62 covers the lower surface 10B around the second leg member 22. When the jig 2 is immersed in the plating bath 70, the protective members 61 and 62 come into contact with the plating bath 70 (see Figure 6). The carrier bar 10 does not come into direct contact with the plating bath 70. The jig 2 is placed on the plating bath 70 via the first protective plate 61 and the second protective plate 62.

[0013] As shown in Figures 1 and 2, the first leg member 21 extends from the first end 11 of the carrier bar 10. The first leg member 21 extends substantially perpendicular to the lower surface 10B of the carrier bar 10. The first leg member 21 is formed in an elongated shape. The first leg member 21 has a first holding mechanism 31 for holding one end of the printed circuit board 4. The first holding mechanism 31 is provided along the length of the first leg member 21. The end (lower end) of the first leg member 21 is covered by a first cover member 41.

[0014] As shown in Figures 1, 2, and 4, the second leg member 22 extends from the second end 12 of the carrier bar 10 opposite to the first end 11. The second leg member 22 extends substantially perpendicular to the lower surface 10B of the carrier bar 10. The second leg member 22 is elongated. The second leg member 22 has a second retaining mechanism 32 for holding the other end of the printed circuit board 4. The second retaining mechanism 32 is provided along the length of the second leg member 22. The end (lower end) of the second leg member 22 is covered by a second cover member 42.

[0015] Figure 5 schematically shows the second holding mechanism 32 and the printed circuit board 4 sandwiched between the second holding mechanism 32. The second holding mechanism 32 holds the end of the printed circuit board 4. As shown in Figure 5, the second holding mechanism 32 has a pair of flexible members 52A and 52B. The flexible members 52A and 52B are made of a flexible insulating material. The flexible members 52A and 52B have a conductive material built inside. The end of the printed circuit board 4 is held by sandwiching both sides of the end of the printed circuit board 4 with the flexible members 52A and 52B. Conductive contacts 54A and 54B are exposed from the inside of the tips of the flexible members 52A and 52B. The contacts 54A and 54B are connected to the conductive material built inside the flexible members 52A and 52B. When the end of the printed circuit board 4 is held, the contacts 54A and 54B come into contact with the conductive layer (seed layer) on the surface of the printed circuit board 4. Therefore, current can be passed through the second leg member 22 to the conductive layer (seed layer) of the printed circuit board 4.

[0016] The configuration of the first holding mechanism 31 and the configuration of the second holding mechanism 32 in Figure 5 are the same. The first holding mechanism 31 and the second holding mechanism 32 clamp the printed circuit board 4 in the same way.

[0017] Figure 6 shows the jig 2 and plating tank 70 of the embodiment. Figure 6 shows only the upper part of the plating tank 70. The inner wall of the plating tank 70 is provided with a first guide member 71 that guides the first leg member 21 of the jig 2 and a second guide member 72 that guides the second leg member 22. The first guide member 71 and the second guide member 72 are facing each other.

[0018] The first guide member 71 comprises a first guide block 71A and a first guide rail 71B. The first guide block 71A is provided on the upper side of the plating tank 70. The first guide block 71A is a block member having a groove for guiding the first leg member 21 into the plating tank 70. The first guide rail 71B is provided below the first guide block 71A. The first guide rail 71B guides the first leg member 21 into the plating tank 70.

[0019] The second guide member 72 includes a second guide block 72A and a second guide rail 72B. The second guide block 72A is provided above the plating tank 70. The second guide block 72A has a groove for guiding the second leg member 22 into the plating tank 70. The second guide rail 72B is provided below the second guide block 72A. The second guide rail 72B guides the second leg member 22 into the plating tank 70.

[0020] When electrolytic plating is formed on the printed wiring board 4 using the jig 2 of the embodiment, the following steps are performed. Both ends of the printed wiring board 4 are sandwiched by the first leg member 21 and the second leg member 22 of the jig 2. Thereby, the printed wiring board 4 is held by the jig 2. The transfer device holds the jig 2. The transfer device is not shown. The transfer device transports the jig 2 above the plating tank 70. The transfer device immerses the printed wiring board 4 held by the jig 2 into the plating solution in the plating tank 70. At this time, the first leg member 21 is guided in order from the first cover member 41 at the lower end through the groove of the first guide block 71A and the groove of the first guide rail 71B. The second leg member 22 is guided in order from the second cover member 42 at the lower end through the groove of the second guide block 72A and the groove of the second guide rail 72B. Thereby, the jig 2 is installed in the plating tank 70. The first leg member 21 is held in the plating tank 70 by the first guide member 71. The second leg member 22 is held in the plating tank 70 by the second guide member 72.

[0021] At this time, the first protection plate 61 contacts the upper surface of the first guide block 71A, and the second protection plate 62 contacts the upper surface of the second guide block 72A. Therefore, the lower surface 10B of the carrier bar 10 does not directly interfere with the first guide block 71A and the second guide block 72A. The carrier bar 10 is placed on the first guide block 71A and the second guide block 72A via the protection plates 61 and 62. Thereby, the printed wiring board 4 is immersed in the plating solution. The transfer device releases the jig 2.

[0022] Current is passed through the conductive layer (seed layer) on the surface of the printed circuit board 4 via the first leg member 21, the first holding mechanism 31, the second leg member 22, and the second holding mechanism 32. Electroplating is applied to the printed circuit board 4. After the electroplating process is completed, the transport device picks up the jig 2 again. The transport device transports the jig 2 to the next work position.

[0023] In this embodiment, the first protective plate 61 and the second protective plate 62 made of PEEK partially cover the lower surface 10B of the carrier bar 10. That is, the portion covered by the first protective plate 61 and the second protective plate 62 is the portion that comes into contact with a part of the plating bath 70 (Figure 6). When electroplating is formed, the lower surface of the carrier bar 10 does not come into direct contact with the first guide block 71A and the second guide block 72A. The carrier bar 10 does not come into direct contact with the plating bath 70. Wear of the carrier bar 10 is suppressed. Deformation of the carrier bar 10 is suppressed. The frequency of replacing parts of the jig 2 is reduced. Because deformation of the carrier bar 10 is suppressed, changes in the locking height (locking position) of the jig 2 by the conveying device are also suppressed. Problems in the conveying of the jig 2 by the conveying device are suppressed.

[0024] [Another example of an embodiment 1] In another embodiment (1), the first protective plate 61 and the second protective plate 62 are made of a material other than resin. For example, the first protective plate 61 and the second protective plate 62 are made of metal, wood, bamboo, or the like.

[0025] [Another example of an embodiment 2] In another embodiment (2), a protective member of a shape other than a plate is provided on the lower surface 10B of the carrier bar 10. For example, a protective member of a polygonal prism shape, spherical shape, annular shape, etc., may be provided.

[0026] [Another example of an embodiment 3] In another embodiment 3, the first protective plate 61 is separated from the first leg member 21. The first protective plate 61 is not formed around the first leg member 21. A lower surface 10B exists between the first protective plate 61 and the first leg member 21. The second protective plate 62 is separated from the second leg member 22. The second protective plate 62 is not formed around the second leg member 22. A lower surface 10B exists between the second protective plate 62 and the second leg member 22.

[0027] [Another example of an embodiment 4] In another embodiment 4, the lower surface 10B of the carrier bar 10 exposed from the first leg member 21 and the second leg member 22 is completely covered by a protective member.

[0028] [Another example of an embodiment 5] In another embodiment 5, the first leg member 21 and the second leg member 22 extend from portions of the carrier bar 10 other than the ends. [Explanation of Symbols]

[0029] 2: Jig 4: Printed circuit board 10: Carrier bar 10B: Bottom surface 11:First end 12:Second end 21:First leg member 22:Second leg member 61: First protective plate 62: Second protective plate 70: Plating tank 71: First guide member 72: Second guide member

Claims

1. A jig for holding a printed circuit board comprises a carrier bar having an upper surface and a lower surface opposite to the upper surface, a first leg member extending downward from the lower surface of the carrier bar, a second leg member extending downward from the lower surface of the carrier bar, and a protective member formed on at least a portion of the lower surface of the carrier bar, wherein the protective member is a plate-shaped member, the printed circuit board is held by the first leg member and the second leg member, and when the jig is immersed in a plating bath, the protective member comes into contact with the plating bath.

2. The jig according to claim 1, wherein the protective member is made of resin.

3. The jig according to claim 2, wherein the protective member is made of polyetheretherketone (PEEK).

4. The jig according to claim 1, wherein the first leg member extends from the first end of the carrier bar, and the second leg member extends from the second end of the carrier bar opposite to the first end.

5. The jig according to claim 1, wherein the printed circuit board is held by sandwiching both ends of the printed circuit board between the first leg member and the second leg member.

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