Antenna module

Abstract

To provide an antenna module which has a good appearance.SOLUTION: In an antenna module 1, a dielectric layer 3 (or a dielectric layer 4) with a high fracture toughness value can be disposed on an outer layer side of a dielectric layer 2 having feeding electrodes 13H, 13V. A material with the high fracture toughness value is a material which is likely to prevent the progression of cracking. Thus, it is possible to dispose, on an outer layer side of the antenna module 1, a dielectric layer in which chipping or the like is less likely to occur. Consequently, a good appearance can be imparted to the antenna module by suppressing the chipping or the like.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to an antenna module.

Background Art

[0002] Conventionally, as an antenna module, the one described in Patent Document 1 is known. This antenna module includes a dielectric layer provided with a power supply electrode and a dielectric layer provided with another circuit (a high-pass filter circuit).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, in the antenna module as described above, there is a problem that the appearance is impaired due to chipping or the like occurring in the dielectric layer.

[0005] Therefore, an object of the present disclosure is to provide an antenna module having a good appearance.

Means for Solving the Problems

[0006] An antenna module according to one aspect of the present disclosure is an antenna module including at least a first radiation electrode and a first power supply electrode coupled to the first radiation electrode, including a first dielectric layer provided with the first power supply electrode and a second dielectric layer disposed on one side of the first dielectric layer in the thickness direction of the first power supply electrode, and the fracture toughness value of the second dielectric layer is larger than the fracture toughness value of the first dielectric layer.

Effects of the Invention

[0007] According to one aspect of this disclosure, it is possible to provide an antenna module having a good appearance. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic perspective view showing the appearance of an antenna module according to one embodiment of the present disclosure. [Figure 2] This is a schematic perspective view showing the appearance of an antenna module according to one embodiment of the present disclosure. [Figure 3] This is a schematic diagram illustrating the internal structure of the antenna module according to this embodiment. [Figure 4] This is a schematic perspective view showing the antenna module with the dielectric layer removed. [Figure 5] This is a cross-sectional view showing the area around the discharge electrode and the power supply electrode. [Figure 6] This is a schematic cross-sectional view showing the layer structure of the dielectric layer. [Figure 7] This is a schematic cross-sectional view showing the layer structure of the dielectric layer. [Figure 8] This table shows the properties of the dielectric material used in each dielectric layer. [Figure 9] This figure shows the chipping of the dielectric material used in each dielectric layer. [Modes for carrying out the invention]

[0009] Several embodiments of this disclosure are described in detail below. However, this disclosure is not limited to the embodiments described below.

[0010] Figure 1 is a schematic perspective view showing the external appearance of an antenna module 1 according to one embodiment of the present disclosure, and is shown as viewed from the radiating surface. Figure 2 is a schematic perspective view showing the external appearance of an antenna module 1 according to one embodiment of the present disclosure, and is shown as viewed from the mounting surface. Figure 3 is a schematic diagram for explaining the internal structure of the antenna module 1, and schematically shows it mounted on a motherboard 5. Figure 4 is a schematic perspective view showing the antenna module 1 with dielectric layers 2-4 removed.

[0011] The embodiments of this disclosure will be described in detail below with reference to the attached drawings.

[0012] Figures 1 and 2 are schematic perspective views showing the external appearance of an antenna module 1 according to one embodiment of the present disclosure, with Figure 1 showing the view from the radiating surface side and Figure 2 showing the view from the mounting surface side.

[0013] As shown in Figures 1 and 2, the antenna module 1 according to this embodiment has an antenna layer ANT, a filter layer FIL, and a distribution layer DIV stacked between the filter layer FIL and the antenna layer ANT.

[0014] The antenna layer ANT comprises dielectric layers 2 and 3, and radiating electrodes 10A (first radiating electrode) and 10B (second radiating electrode) embedded in the dielectric layer 3. In this embodiment, the radiating electrodes 10A and 10B are arranged in the dielectric layer 3. Furthermore, in a plan view from the stacking direction (z direction), the antenna layer ANT has a plurality of ground conductors 11A surrounding the radiating electrode 10A and a plurality of ground conductors 11B surrounding the radiating electrode 10B. The ground conductors 11A and 11B are columnar conductors that extend in the z direction so as to penetrate the dielectric layer 2. The plurality of ground conductors 11A are connected to a ring-shaped ground ring 12A in a predetermined xy plane, and the plurality of ground conductors 11B are connected to a ring-shaped ground ring 12B in a predetermined xy plane. A feed electrode, which will be described later, is provided in the space surrounded by the plurality of ground conductors 11A and 11B. In this way, the ground conductors 11A are arranged around the radiating electrode 10A and the feed electrodes 13V and 13H. The ground conductor 11B is positioned around the radiating electrode 10B and the power supply electrodes 14V and 14H. The positive ends of the multiple ground conductors 11A and 11B in the z direction are covered by the dielectric layer 3.

[0015] The distribution layer DIV is composed of a dielectric layer 2 and a conductor pattern embedded in the dielectric layer 2. The filter layer FIL is composed of a dielectric layer 4 and a conductor pattern embedded in the dielectric layer 4. Details of the filter layer FIL and the distribution layer DIV will be described later. The filter layer FIL constitutes a mounting surface for the motherboard. On the mounting surface, signal terminals 40V, 40H, and a plurality of ground terminals 40G are provided. The signal terminal 40V is a terminal for inputting and outputting an antenna signal of vertical polarization, and the signal terminal 40H is a terminal for inputting and outputting an antenna signal of horizontal polarization. A ground potential is applied to the ground terminal 40G.

[0016] FIG. 3 is a schematic diagram for explaining the internal structure of the antenna module 1 according to the present embodiment, and schematically shows a state of being mounted on the motherboard 5.

[0017] As shown in FIG. 3, a ground electrode G1 is provided between the filter layer FIL and the distribution layer DIV, and a ground electrode G2 is provided between the distribution layer DIV and the antenna layer ANT. The ground electrode G1 is embedded in the dielectric layer 4. The ground electrode G2 is provided at the interface between the dielectric layer 4 and the dielectric layer 2.

[0018] A filter circuit pattern 30V is provided in the filter layer FIL. The filter circuit pattern 30V is a band-pass filter and is connected to the signal terminal 40V. The filter circuit pattern 30V is surrounded by a plurality of ground conductors 31 in a plan view as viewed from the stacking direction. The ground conductor 31 is a columnar conductor extending in the z direction so as to penetrate the dielectric layer 4. Although not shown in FIG. 3, the filter layer FIL also includes another filter circuit pattern connected to the signal terminal 40H.

[0019] The distribution layer DIV is provided with a distribution circuit pattern 20V. The distribution circuit pattern 20V is a circuit that distributes the antenna signal supplied from the filter circuit pattern 30V to the radiating electrodes 10A and 10B. The distribution circuit pattern 20V is surrounded by a plurality of ground conductors 21 in a plan view as viewed from the stacking direction. The ground conductor 21 is a columnar conductor extending in the z direction so as to penetrate the dielectric layer 2. Although not shown in FIG. 3, the distribution layer DIV also includes another distribution circuit pattern connected to another filter circuit pattern. The dielectric layer 2 has the distribution circuit pattern 20V between the power supply electrodes 13V, 13H and the power supply electrodes 14V, 14H (to be described later) and the dielectric layer 4.

[0020] FIG. 4 is a schematic perspective view showing a state in which the dielectric layers 2 to 4 are removed from the antenna module 1.

[0021] As shown in FIG. 4, power supply electrodes 13V, 13H (first power supply electrodes) that overlap the radiating electrode 10A when viewed from the z direction are provided in the space surrounded by the plurality of ground conductors 11A. The power supply electrodes 13V, 13H are coupled to the radiating electrode 10A. The dielectric layer 2 has the power supply electrodes 13V, 13H. Among these, the power supply electrode 13V is a conductor pattern having the y direction as the longitudinal direction, and supplies an antenna signal SV of vertical polarization to the radiating electrode 10A. On the other hand, the power supply electrode 13H is a conductor pattern having the x direction as the longitudinal direction, and supplies an antenna signal SH of horizontal polarization to the radiating electrode 10A. The power supply electrodes 13V, 13H are supplied with an antenna signal via the filter circuit pattern 30V and the distribution circuit pattern 20V (see FIG. 3) at positions near one end of the conductor pattern, respectively. Therefore, the power supply position of the power supply electrode 13V with respect to the radiating electrode 10A is different by 90° from the power supply position of the power supply electrode 13H with respect to the radiating electrode 10A.

[0022] Similarly, in the space surrounded by multiple ground conductors 11B, feed electrodes 14V and 14H (second feed electrodes) are provided, which overlap with the radiating electrode 10B when viewed from the z direction. The feed electrodes 14V and 14H are coupled to the radiating electrode 10B. The dielectric layer 2 has the feed electrodes 14V and 14H. Of these, the feed electrode 14V is a conductor pattern with its longitudinal direction in the y direction and supplies a vertically polarized antenna signal SV to the radiating electrode 10B. On the other hand, the feed electrode 14H is a conductor pattern with its longitudinal direction in the x direction and supplies a horizontally polarized antenna signal SH to the radiating electrode 10B. The feed electrodes 14V and 14H are each supplied with antenna signals via a filter circuit pattern 30 and a distribution circuit pattern 20V (see Figure 3) at positions near one end of the conductor pattern. Therefore, the power supply position of the power supply electrode 14V relative to the radiating electrode 10B is 90° different from the power supply position of the power supply electrode 14H relative to the radiating electrode 10B.

[0023] Large-area ground electrodes G1 to G3 are provided below the antenna layer ANT. Ground electrodes G1 to G3 are positioned on the negative side in the z-axis direction compared to the feed electrodes 13V, 13H and 14V, 14H. The region between ground electrode G1 and ground electrode G2 is the distribution layer DIV. Ground electrode G1 and ground electrode G2 are connected by multiple ground conductors 21. Here, both ground electrodes G1 and G2 have, in a plan view from the z direction, a region S1 that overlaps with the space surrounded by multiple ground conductors 11A, a region S2 that overlaps with the space surrounded by multiple ground conductors 11B, and a region S3 that connects regions S1 and S2. The width of region S3 in the y direction is narrower than the width of regions S1 and S2 in the y direction. As a result, mutual interference between radiating electrodes 10A and 10B via ground electrodes G1 and G2 is reduced, thereby increasing the independence of radiating electrode 10A and 10B.

[0024] The region between ground electrode G1 and ground electrode G3 is the filter layer FIL. Ground electrode G1 and ground electrode G3 are connected by multiple ground conductors 31. The width of ground electrode G3 in the y-direction may be constant.

[0025] Referring to Figure 5, the position of the radiating electrode 10A in the dielectric layer 3 will be explained. As shown in Figure 5(a), the radiating electrode 10A is placed in the dielectric layer 3. In this case, the dielectric layer 3 is composed of two or more layers. Alternatively, as shown in Figure 5(b), the radiating electrode 10A may be placed on the positive main surface 2a in the z direction of the dielectric layer 2.

[0026] Next, the dielectric layers 2, 3, and 4 will be described with reference to Figure 6(a). Dielectric layer 3 is located on the positive side in the z direction of dielectric layer 2. Dielectric layer 4 is located on the negative side in the z direction of dielectric layer 4. An antenna layer ANT is formed by a portion of dielectric layer 2 and dielectric layer 3. A distribution layer DIV is formed by another portion of dielectric layer 2. A filter layer FIL is formed by dielectric layer 4. In this embodiment, dielectric layer 2 is an example of the "first dielectric layer" in the claim, dielectric layer 3 is an example of the "second dielectric layer" in the claim, and dielectric layer 4 is an example of the "third dielectric layer" in the claim. Furthermore, the positive side in the z direction is an example of "one side in the thickness direction of the feed electrode" in the claim, and the negative side in the z direction is an example of "the other side in the thickness direction of the feed electrode" in the claim.

[0027] The dielectric material constituting dielectric layer 4 may have a higher dielectric constant than the dielectric material constituting dielectric layer 2. The dielectric material constituting dielectric layer 3 may be the same as the dielectric material constituting dielectric layer 4.

[0028] The fracture toughness value of dielectric layer 3 is greater than that of dielectric layer 2. Similarly, the fracture toughness value of dielectric layer 4 is greater than that of dielectric layer 2. Fracture toughness is a characteristic that indicates how well a material can resist crack propagation. It is generally understood as ductility. The method for measuring the fracture toughness value of fine ceramics is specified in "JIS R 1607". The fracture toughness value of dielectric layer 2 may be in the range of 0.5 to 2.5. The fracture toughness values ​​of dielectric layers 3 and 4 may be 1.5 to 2.5 times greater than that of dielectric layer 2. While the fracture toughness value of antenna module 1 may be determined by directly measuring the product, depending on the product size, instead of direct measurement, a dielectric layer for measurement may be fabricated based on the composition obtained by analyzing the components of the dielectric layer, and the fracture toughness value may be determined by measuring the fabricated dielectric layer.

[0029] The Young's modulus of dielectric layer 3 is greater than that of dielectric layer 2. Also, the Young's modulus of dielectric layer 4 is greater than that of dielectric layer 2. According to Hooke's Law in mechanics of materials, there is a proportional relationship between stress and strain, and when Young's modulus is E, normal stress is σ, and longitudinal strain is ε, the relationship "σ = Eε" holds true. A larger Young's modulus indicates higher rigidity (less prone to deformation) and better processing accuracy. The Young's modulus of dielectric layer 2 may be in the range of 30 to 80. The Young's moduli of dielectric layers 3 and 4 may be 1.5 to 4 times larger than that of dielectric layer 2.

[0030] Ceramic materials are used as the materials for dielectric layers 2, 3, and 4. Dielectric layers 2, 3, and 4 may be composed of low-temperature fired ceramics (LTCC). Methods for increasing the fracture toughness of the dielectric layers include reducing the pores in the ceramic material used in the dielectric layers to increase density, using ceramic materials with plate-like or columnar particle shapes in the dielectric layers, and increasing the Young's modulus of the ceramic material used in the dielectric layers. As an example, the pores in the ceramic materials used in dielectric layers 3 and 4 can be reduced to be less than those in the ceramic material used in dielectric layer 2 to increase density. This makes it possible to increase the fracture toughness of dielectric layers 3 and 4 compared to dielectric layer 2. In addition, methods of reducing the pores in the ceramic material used in the dielectric layers to increase density, and methods of using ceramic materials with plate-like or columnar particle shapes in the dielectric layers, can increase the Young's modulus of the dielectric layers.

[0031] The layer configuration in antenna module 1 is not particularly limited, and the configuration shown in Figure 6(b) may be adopted. In antenna module 1 shown in Figure 6(b), the dielectric layer 3 constitutes the antenna layer ANT. The dielectric layer 2 constitutes the distribution layer DIV. The dielectric layer 4 constitutes the filter layer FIL.

[0032] The dielectric layer of antenna module 1 may consist of two types of layers. For example, the configuration shown in Figure 6(c) may be adopted. In antenna module 1 shown in Figure 6(c), the dielectric layer 2 constitutes the antenna layer ANT. The dielectric layer 2 constitutes the distribution layer DIV. The dielectric layer 4 constitutes the filter layer FIL. In this case, dielectric layer 2 is an example of the "first dielectric layer" in the claim, and dielectric layer 4 is an example of the "second dielectric layer" in the claim. Furthermore, the negative side in the z direction is an example of the "one side in the thickness direction of the feed electrode" in the claim, and the positive side in the z direction is an example of the "other side in the thickness direction of the feed electrode" in the claim. This relationship also holds true for antenna module 1 shown in Figure 7(b), which will be described later.

[0033] In antenna module 1, the distribution layer DIV may be omitted. For example, the configurations shown in Figures 7(a) and 7(b) may be adopted. In antenna module 1 shown in Figure 7(a), the antenna layer ANT is formed by dielectric layer 3 and dielectric layer 2. The filter layer FIL is formed by dielectric layer 4. In antenna module 1 shown in Figure 7(b), the antenna layer ANT is formed by dielectric layer 2. The filter layer FIL is formed by dielectric layer 4.

[0034] In antenna module 1, the distribution layer DIV and the filter layer FIL may be omitted. For example, the configuration shown in Figure 7(c) may be adopted. In antenna module 1 shown in Figure 7(c), the antenna layer ANT is formed by the dielectric layer 3 and the dielectric layer 2. Thus, the term "antenna module" in this specification also includes products that consist only of the antenna layer ANT.

[0035] Next, the operation and effects of the antenna module 1 according to this embodiment will be described.

[0036] The antenna module 1 comprises at least a radiating electrode 10A and feeding electrodes 13H and 13V coupled to the radiating electrode 10A, and further comprises a dielectric layer 2 having the feeding electrodes 13H and 13V, and a dielectric layer 3 (or dielectric layer 4) disposed on one side of the dielectric layer 2 in the thickness direction of the feeding electrodes 13H and 13V, wherein the fracture toughness value of the dielectric layer 3 (or dielectric layer 4) is greater than the fracture toughness value of the dielectric layer 2.

[0037] This antenna module 1 allows for the placement of a dielectric layer 3 (or dielectric layer 4) with high fracture toughness on the outer side of the dielectric layer 2, which is equipped with feed electrodes 13H and 13V. Materials with high fracture toughness are materials that are resistant to crack propagation. Therefore, a dielectric layer that is less prone to chipping can be placed on the outer side of the antenna module 1. Consequently, chipping can be suppressed, and the appearance of the antenna module can be improved.

[0038] The Young's modulus of dielectric layer 3 (or dielectric layer 4) may be greater than that of dielectric layer 2. Materials with a high Young's modulus have high rigidity and are resistant to deformation, resulting in good processing accuracy. Therefore, a dielectric layer with good processing accuracy and low risk of chipping can be placed on the outer layer side of antenna module 1. Consequently, chipping can be suppressed, and the appearance of the antenna module can be improved.

[0039] The antenna module 1 may further include ground electrodes G1, G2, and G3, which are located on the opposite side in the thickness direction from the feed electrodes 13H and 13V. In this case, a dielectric layer 3 with a high fracture toughness value can be placed on the opposite side of the dielectric layer 2 from the ground electrodes G1, G2, and G3, thereby suppressing chipping on the surface side of the antenna module 1 and improving the appearance of the antenna module 1.

[0040] The radiating electrode 10A may be placed in the dielectric layer 3. In this case, the radiating electrode 10A is placed inside the dielectric layer 3, which has a high fracture toughness value. Therefore, by placing the radiating electrode 10A close to the surface, high radiation efficiency can be achieved.

[0041] The radiating electrode 10A is placed on one main surface 2a of the dielectric layer 2 and may be covered by the dielectric layer 3. In this case, the radiating electrode 10A on the main surface 2a of the dielectric layer 2 can be covered with the dielectric layer 3 which has a high fracture toughness value. Therefore, the radiating electrode 10A can be sufficiently protected from external impacts.

[0042] The antenna module 1 may further include a dielectric layer 4 located on the other side of the dielectric layer 2 in the thickness direction. In this case, the antenna module 1 can be configured to include other circuits, etc., on the opposite side of the dielectric layer 3.

[0043] The dielectric layer 4 may have a filter circuit pattern 30V. In this case, the transmission loss of the antenna module 1 can be reduced because the extra transmission path can be reduced.

[0044] The fracture toughness value of dielectric layer 4 may be greater than that of dielectric layer 2. In this case, dielectric layer 2 is sandwiched on both sides by dielectric layers 3 and 4, which have high fracture toughness values. Therefore, the appearance of both sides of the antenna module 1 can be improved.

[0045] The Young's modulus of dielectric layer 4 may be greater than that of dielectric layer 2. In this case, a dielectric layer with good processing accuracy and less susceptibility to chipping can be placed on the other outer layer side of the antenna module 1.

[0046] The antenna module 1 may include a plurality of columnar ground conductors 11A arranged around the radiating electrode 10A and the feed electrodes 13H and 13V. In this case, when the antenna elements including the radiating electrode 10A and the feed electrodes 13H and 13V are arranged in an array, isolation from other surrounding antenna elements can be improved.

[0047] One end of each of the multiple ground conductors 11A in the thickness direction may be covered by the dielectric layer 3. In this case, the dielectric layer 3, which has a high fracture toughness value, can cover the end of the ground conductor 11A.

[0048] The antenna module 1 further comprises a radiating electrode 10B and feeding electrodes 14H and 14V coupled to the radiating electrode 10B, and the dielectric layer 2 may have feeding electrodes 14H and 14V. In this case, the antenna module 1 may have two sets of radiating electrodes and feeding electrodes.

[0049] The antenna module 1 further comprises a dielectric layer 4 located on the other side of the dielectric layer 2 in the thickness direction, and the dielectric layer 2 may have a distribution circuit pattern 20V between the feed electrodes 13H, 13V and 14H, 14V and the dielectric layer 4. In this case, since multiple antenna elements can be integrated into the antenna module 1, the connection structure between the antenna module 1 and the IC that supplies the antenna signal can be simplified.

[0050] Dielectric layer 3 and dielectric layer 4 may be composed of the same dielectric material. In this case, the number of dielectric materials required to form multiple dielectric layers can be reduced.

[0051] The dielectric layers 2, 3, and 4 may be made of low-temperature fired ceramics. In this case, low loss can be achieved when the antenna module 1 is used in the millimeter-wave band.

[0052] Referring to Figure 8, the resistance to chipping in dielectric layers 3, 4 and dielectric layer 2 will be explained. In Figure 8, "Dielectric Constant" lists the relative permittivity of the dielectrics used in dielectric layers 3, 4 and dielectric layer 2. "Stiffness (Young's Modulus)" lists the Young's modulus of the dielectrics used in dielectric layers 3, 4 and dielectric layer 2. Young's modulus is measured according to JIS R 1602. Specifically, Young's modulus was measured using the static elastic modulus test method. "Fracture Toughness Value" lists the fracture toughness value of the dielectrics used in dielectric layers 3, 4 and dielectric layer 2. Fracture toughness value is measured according to JIS R 1607. Specifically, fracture toughness value was measured using the fracture toughness test method. Figure 9(a) shows the chipping that occurred at the four edges when the dielectrics used in dielectric layers 3, 4 were cut into rectangles. Figure 9(b) shows the chipping that occurred at the four edges when the dielectrics used in dielectric layers 3, 4 were cut into rectangles. As shown in the circled area in Figure 9(b), significant chipping was observed in the dielectric material used for dielectric layer 2. In contrast, as shown in Figure 9(a), it was confirmed that chipping could be suppressed in the dielectric materials shown in dielectric layers 3 and 4.

[0053] This disclosure is not limited to the embodiments described above.

[0054] For example, the shapes and arrangements of the conductors in antenna module 1 shown in Figures 1-3 are merely examples and may be modified as appropriate.

[0055] The technology relating to this disclosure includes, but is not limited to, the following configuration examples.

[0056] [Form 1] An antenna module comprising at least a first radiating electrode and a first feeding electrode coupled to the first radiating electrode, A first dielectric layer comprising the first power supply electrode, The first power supply electrode comprises a second dielectric layer disposed on one side of the first dielectric layer in the thickness direction of the first dielectric layer, An antenna module in which the fracture toughness value of the second dielectric layer is greater than the fracture toughness value of the first dielectric layer. [Form 2] The antenna module according to Embodiment 1, wherein the Young's modulus of the second dielectric layer is greater than the Young's modulus of the first dielectric layer. [Form 3] The antenna module according to embodiment 1 or 2, further comprising a ground electrode positioned on the other side in the thickness direction from the first power supply electrode. [Form 4] The antenna module according to any one of embodiments 1 to 3, wherein the first radiating electrode is disposed in the second dielectric layer. [Form 5] The antenna module according to any one of embodiments 1 to 4, wherein the first radiating electrode is disposed on the main surface of one side of the first dielectric layer and covered by the second dielectric layer. [Form 6] The antenna module according to any one of embodiments 1 to 5, further comprising a third dielectric layer disposed on the other side of the first dielectric layer in the thickness direction. [Form 7] The antenna module according to embodiment 6, wherein the third dielectric layer has a filter circuit pattern. [Form 8] The antenna module according to embodiment 6 or 7, wherein the fracture toughness value of the third dielectric layer is greater than the fracture toughness value of the first dielectric layer. [Form 9] The antenna module according to any one of embodiments 6 to 8, wherein the Young's modulus of the third dielectric layer is greater than the Young's modulus of the first dielectric layer. [Form 10] An antenna module according to any one of embodiments 1 to 9, comprising a plurality of columnar ground conductors arranged around the first radiating electrode and the first feeding electrode. [Form 11] The antenna module according to any one of Embodiment 10, wherein one end of each of the plurality of ground conductors in the thickness direction is covered with the second dielectric layer. [Form 12] The device further comprises a second radiating electrode and a second power supply electrode coupled to the second radiating electrode. The antenna module according to any one of embodiments 1 to 11, wherein the first dielectric layer has the second power supply electrode. [Form 13] The system further comprises a third dielectric layer disposed on the other side of the first dielectric layer in the thickness direction, The antenna module according to embodiment 12, wherein the first dielectric layer has a distribution circuit pattern between the first and second power supply electrodes and the third dielectric layer. [Form 14] The antenna module according to any one of embodiments 6 to 8, wherein the second dielectric layer and the third dielectric layer are made of the same dielectric material. [Form 15] The antenna module according to any one of embodiments 6 to 8, wherein the first dielectric layer, the second dielectric layer, and the third dielectric layer are made of low-temperature fired ceramic. [Explanation of Symbols]

[0057] 1... Antenna module, 2... Dielectric layer (first dielectric layer), 3... Dielectric layer (second dielectric layer), 4... Dielectric layer (third dielectric layer, second dielectric layer), 10A... Radiation electrode (first radiation electrode), 10B... Radiation electrode (second radiation electrode), 11A... Ground conductor, 13H, 13V... Feed electrode (first feed electrode), 14H, 14V... Feed electrode (second feed electrode), 20V... Distribution circuit pattern, 30V... Filter circuit pattern, G1, G2, G3... Ground electrode, DIV... Distribution layer, FIL... Filter layer.

Claims

1. An antenna module comprising at least a first radiating electrode and a first feeding electrode coupled to the first radiating electrode, A first dielectric layer comprising the first power supply electrode, The first power supply electrode comprises a second dielectric layer disposed on one side of the first dielectric layer in the thickness direction of the first dielectric layer, An antenna module in which the fracture toughness value of the second dielectric layer is greater than the fracture toughness value of the first dielectric layer.

2. The antenna module according to claim 1, wherein the Young's modulus of the second dielectric layer is greater than the Young's modulus of the first dielectric layer.

3. The antenna module according to claim 1, further comprising a ground electrode disposed on the other side in the thickness direction from the first power supply electrode.

4. The antenna module according to claim 1, wherein the first radiating electrode is disposed in the second dielectric layer.

5. The antenna module according to claim 1, wherein the first radiating electrode is disposed on the main surface of one side of the first dielectric layer and covered by the second dielectric layer.

6. The antenna module according to claim 1, further comprising a third dielectric layer disposed on the other side of the first dielectric layer in the thickness direction.

7. The antenna module according to claim 6, wherein the third dielectric layer has a filter circuit pattern.

8. The antenna module according to claim 6, wherein the fracture toughness value of the third dielectric layer is greater than the fracture toughness value of the first dielectric layer.

9. The antenna module according to claim 6, wherein the Young's modulus of the third dielectric layer is greater than the Young's modulus of the first dielectric layer.

10. The antenna module according to claim 1, further comprising a plurality of columnar ground conductors arranged around the first radiating electrode and the first feeding electrode.

11. The antenna module according to claim 10, wherein one end of each of the plurality of ground conductors in the thickness direction is covered with the second dielectric layer.

12. The device further comprises a second radiating electrode and a second power supply electrode coupled to the second radiating electrode. The antenna module according to claim 1, wherein the first dielectric layer has the second power supply electrode.

13. The system further comprises a third dielectric layer disposed on the other side of the first dielectric layer in the thickness direction, The antenna module according to claim 12, wherein the first dielectric layer has a distribution circuit pattern between the first and second power supply electrodes and the third dielectric layer.

14. The antenna module according to claim 6, wherein the second dielectric layer and the third dielectric layer are made of the same dielectric material.

15. The antenna module according to claim 6, wherein the first dielectric layer, the second dielectric layer, and the third dielectric layer are made of low-temperature fired ceramic.

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