Antenna module

Abstract

The antenna module includes a first printed circuit board including a circuit pattern; an IC chip disposed on the first printed circuit board; a solder portion disposed on the first printed circuit board; a dielectric layer disposed on the first printed circuit board and enveloping the IC chip and the solder portion; and an antenna patterned on an upper surface of the dielectric layer and coupled to the solder portion, wherein at least a portion of the solder portion protrudes above the upper surface of the dielectric layer.

Description

Technical Field

[0001] This embodiment relates to an antenna module.

Background Art

[0002] With the development of mobile communication technology, electronic devices equipped with antennas, such as smartphones and wearable devices, have become widely popular. These electronic devices can wirelessly transmit / receive data (e.g., messages, photos, videos, music files, or games, etc.) via the antenna.

[0003] Generally, Bluetooth (registered trademark) technology is a communication means that can replace the mechanically vulnerable and inconvenient wired cables between communication devices through a single wireless connection within a short distance. This enables voice communication including instant networking and data communication between small mobile devices such as mobile phones and PDAs and notebook computers, while its application scope extends to not only mobile phones, wireless headsets, and LAN access points, but also practically all digital equipment such as printers, desktops, FAX machines, keyboards, digital cameras, digital camcorders, joysticks, and PDAs.

[0004] Such a Bluetooth (registered trademark) module is configured in the form of a small printed circuit board (PCB) equipped with an RF processing module, a baseband processor, a flash memory, and its peripheral circuits and an antenna so that it can be easily mounted on the main board.

[0005] The Bluetooth (registered trademark) module has forms such as including an antenna in the Bluetooth (registered trademark) module, a PIFA (Print Inver-F Antenna) form with the antenna provided in the PCB, or applying a chip antenna on the PCB to transmit the signal processed by the RF processing module in the module.

Summary of the Invention

[0006] The objective of this embodiment is to provide an antenna module that can be miniaturized and has improved radiation efficiency. [Means for solving the problem]

[0007] The antenna module according to this embodiment includes a first printed circuit board including a circuit pattern; an IC chip disposed on the first printed circuit board; a solder portion disposed on the first printed circuit board; a dielectric layer disposed on the first printed circuit board and enclosing the IC chip and the solder portion; and an antenna patterned on the upper surface of the dielectric layer and connected to the solder portion, wherein at least a portion of the solder portion protrudes above the upper surface of the dielectric layer.

[0008] The vertical height of the solder portion may be greater than the thickness of the dielectric layer.

[0009] The material of the dielectric layer may include a resin. The dielectric layer may include an RF element that is disposed within the dielectric layer and soldered onto the first printed circuit board to generate a frequency.

[0010] At least one or more electronic components may be arranged on the first printed circuit board, and the antenna may be arranged so as not to overlap the electronic components in the vertical direction.

[0011] The antenna may have a region that has been bent at least once.

[0012] The antenna may have regions that are arranged perpendicular to each other between adjacent regions.

[0013] The first printed circuit board includes a second printed circuit board located below it, and a sub-antenna is located on the second printed circuit board adjacent to the first printed circuit board, and the sub-antenna may be electrically connected to the solder joint.

[0014] The sub-antenna may be electrically connected to the soldered portion.

[0015] The thickness of the sub-antenna can correspond to the sum of the thickness of the dielectric layer and the first printed circuit board. [Effects of the Invention]

[0016] This embodiment has the advantage of increasing radiation efficiency by placing the antenna outside the dielectric layer, and also allows for a larger space to place components on the printed circuit board. [Brief explanation of the drawing]

[0017] [Figure 1] A cross-sectional view of an antenna module according to an embodiment of the present invention. [Figure 2] A cross-sectional view illustrating the manufacturing process of an antenna module according to an embodiment of the present invention. [Figure 3] A cross-sectional view illustrating the manufacturing process of an antenna module according to an embodiment of the present invention. [Figure 4] A plan view illustrating the arrangement structure of an antenna on a printed circuit board according to an embodiment of the present invention. [Figure 5] A cross-sectional view showing an antenna module according to an embodiment of the present invention from a different angle. [Figure 6] A drawing illustrating a modified example of an antenna module according to an embodiment of the present invention. [Figure 7] A drawing illustrating a modified example of an antenna module according to an embodiment of the present invention. [Modes for carrying out the invention]

[0018] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0019] However, the technical idea of the present invention is not limited to some of the described embodiments, but can be implemented in various different forms, and within the scope of the technical idea of the present invention, one or more of the constituent elements among the embodiments can be selectively combined or replaced and used.

[0020] Also, the terms (including technical and scientific terms) used in the embodiments of the present invention should be construed to have a meaning generally understood by those of ordinary skill in the technical field to which the present invention pertains, unless specifically defined and described otherwise, and terms commonly used like pre-defined terms can be interpreted considering their meaning in the context of the related art.

[0021] Also, the terms used in the embodiments of the present invention are for the purpose of explaining the embodiments and are not intended to limit the present invention.

[0022] In this specification, the singular form can also include the plural form unless otherwise specifically stated in the text, and when described as "at least one (or one or more) of A, B, and C", it can include one or more of all combinations formed by A, B, and C.

[0023] Also, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. can be used. These terms are only for distinguishing the components from other components and are not limited to the essence, order, or sequence of the corresponding components by such terms.

[0024] Furthermore, when it is stated that one component is “linked,” “joined,” or “connected” to another component, this includes not only cases where the component is directly “linked,” “joined,” or “connected” to that other component, but also cases where it is “linked,” “joined,” or “connected” by yet another component between that component and the other component.

[0025] Furthermore, when a component is described as being formed or positioned "above" or "below" another component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more additional components are formed or positioned between the two components. Also, when expressed as "above" or "below," it can include not only an upward direction but also a downward direction relative to one component.

[0026] Figure 1 is a cross-sectional view of an antenna module according to an embodiment of the present invention, and Figures 2 and 3 are cross-sectional views illustrating the manufacturing process of an antenna module according to an embodiment of the present invention.

[0027] Referring to Figures 1-3, the antenna module 100 according to an embodiment of the present invention may include a printed circuit board 110, an IC chip 120, an RF element 130, a solder part 140, a dielectric layer 150, and an antenna 160.

[0028] The printed circuit board 110 may be formed in a plate shape, with the IC chip 120, RF element 130, solder portion 140, and dielectric layer 150 arranged on its upper surface. Circuit-patterned wiring 112 and ground (not shown) are arranged on the printed circuit board 110, and the IC chip 120, RF element 130, and antenna 160 are electrically connected via the wiring 112 and ground to process communication signals.

[0029] The IC chip 120 and the RF element 130 are mounted on the printed circuit board 110 and can process communication signals. For example, the antenna module 100 can communicate via Bluetooth® through the IC chip 120. The RF element 130 includes a crystal and can generate a frequency for communication.

[0030] The IC chip 120 can be soldered onto the printed circuit board 110. The IC chip 120 may include at least one or more legs 122. The legs 122 protrude downward from other areas and can be soldered onto the printed circuit board 110.

[0031] The RF element 130 may be placed on the printed circuit board 110, which is spaced apart from the IC chip 120. Similarly, the RF element 130 may be soldered to the upper surface of the printed circuit board 110 via legs 132 and electrically connected to the printed circuit board 110.

[0032] The solder portion 140 has its lower end positioned on the upper surface of the printed circuit board 110, and its upper end can be connected to the antenna 160. The solder portion 140 can electrically connect the antenna 160 to the printed circuit board 110. The solder portion 140 may also be a soldered area on the printed circuit board 110.

[0033] The dielectric layer 150 may be placed on the printed circuit board 110. The dielectric layer 150 may have a predetermined thickness and be placed so as to enclose the IC chip 120, the RF element 130, and the solder portion 140. The IC chip 120, the RF element 130, and the solder portion 140 can be firmly fixed to the printed circuit board 110 via the dielectric layer 150. The dielectric layer 150 can be called a molded portion in that it is molded onto the printed circuit board 110. The material of the dielectric layer 150 may include resin.

[0034] The antenna 160 may be placed on the upper surface of the dielectric layer 150. The antenna 160 may have a plate shape made of a metallic material. The antenna 160 may be patterned with a conductive material on the upper surface of the dielectric layer 150. The antenna 160 may be designed to have a resonant length corresponding to each frequency band, depending on the frequency band signal processed by the printed circuit board 110.

[0035] The antenna 160 can be electrically connected to the printed circuit board 110 via the solder portion 140. For this purpose, the vertical height of the solder portion 140, defined from its upper end to its lower end, can be formed to be longer than the thickness of the dielectric layer 150. At least a portion of the solder portion 140 can be positioned to protrude upward from the upper surface of the dielectric layer 150. A portion of the upper end of the solder portion 140 can protrude above the dielectric layer 150. This allows the solder portion 140 to be electrically connected to the antenna 160, and the antenna 160 and the printed circuit board 110 to be electrically connected via the solder portion 140.

[0036] According to the above-described structure, the antenna 160 can be placed outside the dielectric layer 150 to increase radiation efficiency, and by not placing the antenna 160 directly on the printed circuit board 110, a larger space for placing components can be secured on the printed circuit board 110.

[0037] The manufacturing process of the antenna module 100 is as follows: As shown in Figure 2, the IC chip 120, the RF element 130, and the solder portion 140 are mounted on the printed circuit board 110, and then the dielectric layer 150 is formed as shown in Figure 3. As mentioned above, the dielectric layer 150 can be formed on the printed circuit board 110 through molding. Alternatively, the antenna 160 may be electrically connected to the area of ​​the solder portion 140 that protrudes above the dielectric layer 150, and the antenna 160 may be placed on the upper surface of the dielectric layer 150.

[0038] Figure 4 is a plan view illustrating the arrangement structure of an antenna on a dielectric layer according to an embodiment of the present invention, and Figure 5 is a cross-sectional view showing an antenna module according to an embodiment of the present invention from a different angle. Referring to Figures 4 and 5, at least one or more electronic components 113 for driving the antenna module 100 may be arranged on the printed circuit board 110. The antenna 160 can be arranged so as not to overlap vertically in order to ensure the maximum distance between it and the electronic components 113. For this purpose, the antenna 160 may have a region that is bent at least once. The antenna 160 may have regions that are arranged perpendicular to each other between adjacent regions. This has the advantage that the distance between the antenna 160 and the electronic components 113 can be increased to the maximum extent, thereby preventing a decrease or change in the electrical characteristics of the electronic components 113.

[0039] Figures 6 and 7 are diagrams illustrating modified examples of the antenna module according to an embodiment of the present invention.

[0040] Referring to Figures 6 and 7, the antenna module 100 may further include other printed circuit boards 200. In this case, the printed circuit board 110 may be named the first printed circuit board, and the other printed circuit boards 200 may be named the second printed circuit board.

[0041] The second printed circuit board 200 is positioned below the first printed circuit board 110, and the lower surface of the first printed circuit board 110 can be soldered to the upper surface of the second printed circuit board 200. The second printed circuit board 200 has a larger cross-sectional area than the first printed circuit board 110, and a number of electronic components are arranged on its upper surface.

[0042] On the other hand, a sub-antenna 210 may be placed on the upper surface of the second printed circuit board 200, outside the first printed circuit board 110. The sub-antenna 210 is electrically connected to the wiring 112 in the first printed circuit board 110 and can have a predetermined thickness. The sub-antenna 210 can be electrically connected to the solder portion 140. This allows the current path of the antenna module 100 to be extended via the sub-antenna 210. For example, the antenna module 100 can be designed to transmit and receive signals in the 2.4GHz band via the sub-antenna 210 after being tuned to a frequency in the 2.7GHz to 3GHz band via the antenna 160.

[0043] The sub-antenna 210 may have a region that has been bent one or more times. The thickness of the sub-antenna 210 may correspond to the thickness of the dielectric layer 150, or to the sum of the thicknesses of the dielectric layer 150 and the first printed circuit board 110.

[0044] According to the structure described above, the antenna module 100 has the advantage that it can radiate upward via the antenna 160, as well as radiate downward via the sub-antenna 210.

[0045] Although all components constituting the embodiments of the present invention have been described above as being combined as one or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the object of the present invention, all components can also be selectively combined as one or more components and operate. Furthermore, unless otherwise stated, terms such as "includes," "constitutes," or "has" described above should be interpreted as meaning that the component in question may be inherent, and that other components may be included rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted as corresponding to their meaning in the context of the relevant art, and should not be interpreted as ideal or overly formal unless explicitly defined in the present invention.

[0046] The above description is merely illustrative of the technical concept of the present invention, and any person with ordinary skill in the art to which the present invention pertains can make various modifications and alterations without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention should be interpreted in accordance with the following claims, and all technical concepts within an equivalent scope should be interpreted as being included within the scope of the rights of the present invention.

Claims

1. First printed circuit board including circuit patterns; A second printed circuit board positioned below the first printed circuit board; IC chip disposed on the first printed circuit board; A solder portion disposed on the first printed circuit board, comprising at least solder and a conductor; A dielectric layer disposed on the first printed circuit board and enclosing the IC chip and the solder portion; An antenna patterned on the upper surface of the dielectric layer and connected to the solder portion; and On the second printed circuit board adjacent to the first printed circuit board, a sub-antenna is included; At least a portion of the solder portion protrudes above the upper surface of the dielectric layer, The vertical height of the solder portion is greater than the thickness of the dielectric layer. The antenna module is characterized in that the sub-antenna is electrically connected to the soldered portion.

2. The antenna module according to claim 1, characterized in that the IC chip is a Bluetooth® communication chip.

3. The antenna module according to claim 1 or 2, characterized in that the material of the dielectric layer includes a resin.

4. The antenna module according to any one of claims 1 to 3, characterized in that it includes an RF element disposed in the dielectric layer and soldered onto the first printed circuit board to generate a frequency.

5. The antenna module according to any one of claims 1 to 4, characterized in that at least one or more electronic components are arranged on the first printed circuit board, and the antenna is arranged so as not to overlap with the electronic components in the vertical direction.

6. The antenna module according to claim 5, characterized in that the antenna has a region that has been bent at least once.

7. The antenna module according to claim 5, characterized in that the antenna has regions arranged perpendicular to each other between adjacent regions.

8. The antenna module according to claim 1, characterized in that the sub-antenna is electrically connected to the solder portion.

9. The antenna module according to claim 1, characterized in that the thickness of the sub-antenna corresponds to the sum of the thickness of the dielectric layer and the first printed circuit board.

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