Wafer inspection system and method

Abstract

To provide a wafer inspection system capable of inspecting the position, moving speed and transport process of a wafer box in real time. [Solution] The wafer inspection system of the present invention combines optical and waveband spectral waves to construct omnidirectional optical and millimeter-wave noise scan images. The wafer inspection system includes an optical inspection unit located at a first position relative to the wafer movement path and performing optical imaging of the wafer, a waveband inspection unit located at a second position relative to the wafer movement path and performing spectral imaging of the wafer, and an inspection and analysis unit signal-connected to the optical inspection unit and the waveband inspection unit and performing inspection and arithmetic analysis based on the optical imaging information and the spectral imaging information.

Description

Technical Field

[0001] The present invention relates to the field of wafer inspection, and more particularly to a wafer inspection system and method.

Background Art

[0002] In a wet slot cleaning apparatus, it is particularly important to achieve highly efficient wafer transfer per unit time. Taking a slot-type cleaning apparatus as an example, the mechanical moving device for the wafer is a wafer transfer system device, and the device composed of the wafer transfer and guide plate module needs to reliably achieve highly efficient wafer transfer during actual wafer transfer. During the transfer process of the wafer or the wafer box, usually, the transfer is performed through the connection operation of a specific transfer process. In that transfer process, the following two actual situations are faced.

[0003] (1) The supply wafer box is replaced with a cleaning wafer box, and cleaning is performed. (2) The wafers in the supply wafer box are taken out in batches, and cleaning is performed.

[0004] In either of the above two situations, it is necessary to maintain the state of the wafers in the wafer box and make the operations of the transfer process controllable in cooperation. In order to avoid the wafer box being subjected to various external forces due to shaking and causing damage, measurement of the quantity of the wafer box and wafers during the transfer process and detection of the position of the wafer box are required.

[0005] In a conventional general design, a plurality of sensors were attached on the transfer platform. However, it was difficult to inspect the specific position of the wafer box during transfer, the moving speed, the displacement of the wafers, breakage or missing of the wafers, etc.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention aims to solve the above problems by providing a wafer inspection system and method that can detect the specific movement position and speed of a wafer box during transport, as well as whether or not wafers are misaligned or missing. [Means for solving the problem]

[0007] The wafer inspection system provided in the first aspect of the present invention employs the following technical configuration.

[0008] This wafer inspection system combines optical technology and spectral band waves (particularly millimeter waves) to construct omnidirectional optical and millimeter-wave noise scan images, and includes the following components:

[0009] Optical inspection unit: Installed at a first position relative to the wafer's movement path, it performs optical imaging of the wafer.

[0010] Waveband inspection unit: Located at a second position relative to the wafer's movement path, it performs spectral imaging of the wafer.

[0011] Inspection and Analysis Unit: This unit is signal-connected to the Optical Inspection Unit and Waveband Inspection Unit described above. It performs inspection and computational analysis using optical image information and spectral image information to inspect the wafer condition and obtain real-time wafer status.

[0012] Preferably, the wafer inspection system may further include the following: Motion control unit: Controls the movement of the wafer according to a predetermined program.

[0013] The inspection and analysis unit is electrically connected to the motion control unit and monitors for wafer abnormalities by acquiring a setting program related to wafer operation and comparing it with the inspected real-time wafer state.

[0014] Preferably, the scope of wafer inspection includes inspection of the real-time operation of the wafer, wafer transport device, and wafer gripping device. Here, real-time operation includes the following: Wafer handling systems include single-operation planar transport, multi-operation planar transport, vertical movement transport, transport with wafer guide plate operation, and transport with wafer gripping operation.

[0015] Preferably, the wafer inspection range may include a first inspection range, a second inspection range, and a third inspection range.

[0016] First inspection scope: Includes identifying the real-time operating position of the wafer, as well as wafer displacement, shift, and missing parts.

[0017] Second inspection scope: Includes real-time identification of the wafer handling device's operating position, displacement, deviation and loss of the device, height and relative movement speed.

[0018] Third inspection scope: Including the identification of the real-time operating position of the wafer gripping device, gripping device displacement, deviation and detachment, height and relative movement speed.

[0019] Preferably, the optical inspection unit may include the following components: Light-receiving integrated module: This module is designed to receive light, change its direction, and guide it. Light source integration module: This configuration integrates guided light to perform optical scanning of the wafer. Optical detection integration module: Inspects the optical signal after performing an optical scan on the wafer and feeds it back to the inspection and analysis unit.

[0020] Preferably, the waveband inspection unit may include the following: Waveband emission end: Transmits millimeter waves in the X, Y, and Z axis directions to construct an omnidirectional spatial spectral scan. Band Detection Integration Module: After the millimeter wave reflected and transmitted after the band scan on the wafer is inspected, feedback is provided to the inspection and analysis unit.

[0021] Preferably, the wafer inspection system may further include a wafer transfer platform. A hollow support part is provided in the center of the platform to support the wafer transfer device. The light receiving integration module and the light source integration module are provided at the bottom of the wafer transfer platform and symmetrically arranged on both sides of the hollow part.

[0022] Preferably, the light receiving integration module and the light source integration module receive and conduct light by lifting and lowering movement and rotational swaying respectively.

[0023] Preferably, a positioning block is provided on the wafer transfer platform corresponding to the support part, and the block positions the wafer transfer device.

[0024] Preferably, an inspection sensor is provided on the positioning block to inspect whether the wafer transfer device is accurately placed on the positioning legs.

[0025] Preferably, both the first position and the second position are arranged on the same side of the wafer transfer path.

[0026] Preferably, the second position is arranged along at least one of the X-axis, Y-axis and Z-axis to transmit millimeter waves to the wafer and perform a spectral scan.

[0027] As a second aspect of the present invention, a wafer inspection method including the following steps is provided.

[0028] Step S1 The optical inspection unit performs optical imaging of the wafer at the first position with respect to the wafer, and the band inspection unit performs spectral imaging of the wafer at the second position with respect to the wafer.

[0029] Step S2 The inspection and analysis unit performs inspection and computational analysis on the optical imaging and spectral imaging to inspect the wafer and obtain the real-time status of the wafer.

[0030] Preferably, step S1 may be configured as follows: The optical emission end emits light in the X, Y, and Z axis directions. The light-receiving integrated module receives light, changes its direction, and guides it. The light source integration module concentrates the guided light rays. The optical exploration integration module inspects the optical signal after the wafer has been optically scanned.

[0031] Preferably, step S1 may be configured as follows: The waveband emission end emits millimeter waves in the X, Y, and Z axis directions. The light-receiving integrated module receives millimeter waves, changes their direction, and guides them. The light source integration module aggregates the guided millimeter waves. The waveband exploration integrated module inspects millimeter waves after the wafer's spectral scan.

[0032] Preferably, the wafer inspection method may further include the following steps. The inspection and analysis unit monitors wafer anomalies by acquiring the setting program related to wafer operation and comparing it with the inspected real-time wafer status. [Effects of the Invention]

[0033] According to the present invention, wafer boxes and wafers can be inspected by using optical and spectral techniques in coordination. This allows for accurate real-time inspection of the position, movement speed, and movement process of the wafer box, as well as real-time inspection of the three-dimensional position or movement deviation of the wafer box and wafers, and whether or not there is any damage to the wafers. [Brief explanation of the drawing]

[0034] [Figure 1] This is a schematic diagram showing the positional relationship between the light receiving integrated module and the light source integrated module in a wafer inspection system according to one embodiment of the present invention. [Figure 2] This is a schematic diagram showing the vertical movement of the light receiving integrated module and the light source integrated module in a wafer inspection system according to one embodiment of the present invention. [Figure 3] This is a schematic diagram showing the rotational operation of the light receiving integrated module and the light source integrated module in a wafer inspection system according to one embodiment of the present invention. [Figure 4] This is a schematic diagram showing the structure of a light-receiving integrated module in a wafer inspection system according to one embodiment of the present invention. [Figure 5] This is a schematic diagram showing the structure of a light source integration module in a wafer inspection system according to one embodiment of the present invention. [Figure 6] This is a schematic diagram of the optical inspection in a wafer inspection system according to one embodiment of the present invention. [Figure 7] This is a schematic diagram of waveband inspection in a wafer inspection system according to one embodiment of the present invention. [Figure 8] This is a schematic diagram illustrating the integration of optical inspection and waveband inspection in a wafer inspection system according to one embodiment of the present invention. [Figure 9] This is a schematic diagram of the inspection path in a wafer inspection system according to one embodiment of the present invention. [Figure 10]This is a schematic diagram of waveband inspection in a wafer transport scene in a wafer inspection system according to one embodiment of the present invention. [Figure 11] This is a schematic diagram of waveband inspection in another wafer transport scene in a wafer inspection system according to one embodiment of the present invention. [Figure 12] This is a schematic diagram of waveband inspection in another wafer transport scene in a wafer inspection system according to one embodiment of the present invention. [Figure 13] This is a diagram illustrating the principle of waveband inspection in a wafer inspection system according to one embodiment of the present invention. [Modes for carrying out the invention]

[0035] The technical configuration of embodiments of the present invention will be clearly and completely described below with reference to Figures 1 to 13. However, the embodiments described below are merely examples of the present invention and do not limit all embodiments of the present invention. In one embodiment of the wafer inspection system according to the present invention, optical and frequency band (particularly millimeter wave) are combined to construct an optical and millimeter wave noise scan image in all directions. The system includes the following configuration.

[0036] Optical inspection unit: Installed at a first position relative to the movement path of wafer 5, it performs optical imaging of wafer 5.

[0037] Waveband inspection unit: Installed at a second position relative to the movement path of wafer 5, it performs spectral imaging of wafer 5.

[0038] Inspection and Analysis Unit: This unit is signal-connected to the Optical Inspection Unit and the Waveband Inspection Unit, acquires optical and waveband imaging information, performs inspection and calculation processing, and inspects wafer 5 and acquires its real-time status.

[0039] Motion control unit: Controls the movement of wafer 5 based on a set program.

[0040] Furthermore, the inspection and analysis unit is electrically connected to the motion control unit and monitors for abnormalities in wafer 5 by acquiring the program related to the operation of wafer 5 and comparing it with the state of wafer 5 inspected in real time.

[0041] The optical inspection unit performs optical inspection and imaging on wafer 5, while the waveband inspection unit performs spectral inspection and imaging on wafer 5. The inspection and analysis unit inspects the state of wafer 5 based on the optical imaging information and spectral imaging information, and obtains the real-time state of wafer 5 by performing computational analysis.

[0042] Furthermore, the inspection and analysis unit acquires the setting program related to the movement of wafer 5 and performs anomaly monitoring of wafer 5 by comparing it with the state of wafer 5 inspected in real time.

[0043] The wafer inspection scope in this wafer inspection system includes real-time inspection of the wafer 5, the wafer transport device, and the wafer gripping device. Here, real-time operation includes planar transport by single operation of the wafer transport device, planar transport by multiple operations, vertical transport, transport with guide plate operation of wafer 5, and transport with gripping operation of wafer 5.

[0044] Furthermore, the scope of testing is classified into the following three categories. The first inspection scope includes real-time operational positioning of wafer 5, displacement, shift, and missing parts of wafer 5 (see Figure 5).

[0045] Second inspection scope: Includes real-time operational positioning, misalignment, displacement, and loss of the wafer transport device, as well as the height and relative travel speed of the transport device (see Figures 7, 9, and 10).

[0046] Third inspection scope: Includes real-time operational positioning of the wafer gripping device, gripping position deviation, displacement and detachment, gripping device height and relative movement speed (see Figures 11 and 12).

[0047] Referring to Figures 1 to 6, the optical inspection unit according to the present invention includes the following: Optical emission end: Emits light sources in the X, Y, and Z axis directions to form an omnidirectional spatial optical scan. Light-receiving integrated module 1: It can be raised and lowered and rotated, and it receives light, changes its direction, and guides the light. Light source integration module 2: It can be raised, lowered, and rotated, and focuses the guided light rays to perform an optical scan of the wafer 5.

[0048] The light-receiving integration module 1 comprises a first negative meniscus lens 11, a biconvex positive lens 12, and a second negative meniscus lens 13, arranged sequentially along the direction of light incidence. The light-receiving integration module 1 receives light from the light source integration module 2, and these three lens groups receive and focus the light, emitting it back to the light source integration module 2, thereby improving the scanning and imaging effect of the wafer 5.

[0049] The light source integration module 2 includes a light guide plate 21 that can be rotated at small angles, an optical lattice and filter 22, and a shutter and aperture structure 23. The light guide plate 21 is positioned in a straight line with the incident light, and is movable and rotatable, guiding the light into the optical lattice and filter 22 for light reception. The optical lattice and filter 22 are positioned perpendicular to the light guide plate 21, and by filtering and modulating the light, they improve imaging performance and also guide the light.

[0050] The optical lattice and filter 22 can be rotated and translated, thereby adjusting the angle and position of the incident light and enabling arc-shaped scanning of the wafer 5. This allows scanning and inspection of different locations on the wafer 5.

[0051] The shutter and aperture structure 23 is positioned above the optical grating and filter 22 and corresponds to the hollow position. The arc-shaped scanning area of ​​light is parallel to the wafer 5, and the light ultimately passes through the shutter and aperture structure 23 to scan and inspect the wafer 5.

[0052] Light is guided by the light guide plate 21, then filtered and conducted by the optical lattice and filter 22, and finally performs an arc-shaped scan of the wafer 5 via the shutter and aperture structure 23, scanning the image formation information of the wafer 5 in the wafer box 6 from all directions.

[0053] Furthermore, the wafer inspection system may include a wafer transport platform 3. The wafer transport platform 3 has a hollow support position in the center, which is used to support the wafer transport device.

[0054] Positioning blocks 4 are provided corresponding to the support positions of the wafer transfer platform 3, and the positioning blocks 4 are used to position the wafer transfer device (e.g., wafer box 6).

[0055] The positioning block 4 is equipped with inspection sensors to check whether the wafer transport device is correctly positioned on the positioning legs of the positioning block 4.

[0056] The light receiving integration module 1 and the light source integration module 2 are located at the bottom of the wafer transport platform 3, symmetrically positioned across a hollow space. The optical fiber from the light source integration module 2 passes through the hollow section of the wafer transport platform 3 and enters the wafer transport device to perform inspection of the wafer 5.

[0057] Furthermore, the optical inspection unit may include an integrated optical detection module, which inspects the optical signal after the optical scan of wafer 5 and feeds it back to the inspection and analysis unit.

[0058] The light receiving integration module 1 receives light and guides it to the light source integration module 2, which then focuses the guided light rays to perform an optical scan of the wafer 5. The optical detection integration module inspects the optical signal after the optical scan of the wafer 5 and feeds it back to the inspection and analysis unit, which then analyzes the optical image information.

[0059] Referring to Figures 7 to 13, the waveband inspection unit has the following configuration. Waveband emission ends: Positioned in at least one direction along the X, Y, and Z axes, they emit millimeter waves in each direction to form a waveband scan of omnidirectional space.

[0060] Waveband Exploration Integrated Module (Receiving End): Inspects millimeter waves after waveband scanning of wafer 5 and provides feedback to the inspection and analysis unit.

[0061] The waveband inspection unit can be installed at any position along the wafer 5 transport path as needed. For example, as shown in Figure 7, the waveband inspection unit is installed on the side of a wafer transport platform having multiple wafer support positions, and inspects the dynamic state of the wafer box 6 and wafer 5 from the side as the wafer 5 is transported between the multiple support positions.

[0062] As shown in Figures 11 and 12, the waveband inspection unit is positioned above the transfer position of the wafer 5 and uses its spatial positional relationship to inspect the movement of the wafer 5, such as guiding and gripping.

[0063] Preferably, the optical inspection unit is positioned at a first position relative to the wafer 5's movement path, and the waveband inspection unit is positioned at a second position relative to the wafer 5's movement path. The first and second positions may both be on the same side of the wafer 5's transport path, or they may be located on different sides of the transport path.

[0064] In response to this, the present invention also provides a wafer inspection method comprising the following steps.

[0065] Step S1: The optical inspection unit performs optical imaging on the wafer 5 at a first position. The optical emission end emits light in the X, Y, and Z axis directions. The light receiving integration module 1 receives light, changes its direction, and guides it. • The light source integration module 2 concentrates the guided light rays. The optical detection integration module inspects the optical signal after optical scanning of wafer 5.

[0066] The waveband inspection unit performs spectral imaging at a second position relative to wafer 5. The waveband emission end emits millimeter waves in the X, Y, and Z axis directions. The light-receiving integrated module 1 receives millimeter waves, changes their direction, and guides them. • The light source integration module 2 aggregates guided millimeter waves. The waveband exploration integrated module inspects millimeter waves after waveband scanning of wafer 5.

[0067] Furthermore, the emission of light from the optical emission end and the emission of millimeter waves from the waveband emission end can be performed simultaneously, regardless of the time order, thereby enabling the formation of an image of wafer 5.

[0068] Step S2: The inspection and analysis unit performs inspection and computational analysis based on optical and spectral imaging to inspect the condition of wafer 5 and obtain real-time status.

[0069] The inspection and analysis unit monitors for abnormalities in wafer 5 by acquiring the configuration program related to the operation of wafer 5 and comparing it with its real-time status.

[0070] <Operating principle> The transport mechanism transports the wafer box 6, which is loaded with wafers 5, on the wafer transport platform 3. The wafer box 6 can be positioned at the wafer support location. The optical inspection unit's light receiving integration module 1 receives light, changes its direction, and guides it; the light source integration module 2 focuses the guided light rays; and the optical exploration integration module inspects the optical signal after the optical scan of the wafer 5.

[0071] The waveband emission end of the waveband inspection unit emits millimeter waves to the target inspection location, and the millimeter wave noise generated by reflection or scattering from the target is fed back to the waveband detection integration module (receiving end), where the target waveband inspection is performed.

[0072] The optical detection integration module inspects the optical signal after the optical scan of wafer 5, and the waveband detection integration module inspects the millimeter waves after scanning wafer 5. The inspection and analysis unit analyzes the optical and spectral images and acquires the state of wafer 5 in real time, enabling inspection of the three-dimensional position and movement deviations of wafer box 6 and wafer 5, as well as whether or not wafer 5 is damaged.

[0073] In the wafer inspection method according to the present invention, the wafer 5 can be inspected using either optical inspection or waveband inspection alone, but it is also possible to combine both to perform a multifaceted and comprehensive inspection. In this combined method, optical inspection and waveband inspection can be performed simultaneously within the same transport process, or they can be performed one after the other in terms of time. Furthermore, it is also possible to perform optical inspection in one transport process and waveband inspection in another transport process, thus allowing for a divided operation.

[0074] As will be apparent to those skilled in the art, the present invention is not limited to the details of the embodiments described above, and can be implemented in other specific forms without departing from the spirit or basic features of the invention. Accordingly, the embodiments described herein are illustrative and not limiting. The scope of the invention is defined by the appended claims, and all modifications that fall within the scope of the equivalence requirement of the claims should be understood to be included within the scope of the invention. Furthermore, the reference numerals in the figures described in the claims should not be interpreted as limiting their technical scope. [Explanation of Symbols]

[0075] 1: Light-receiving integrated module 11: First negative meniscus lens 12: Biconvex lens 13: Second negative meniscus lens 2: Light source integration module 21: Light guide plate 22: Optical lattices and filters 23: Shutter and aperture structure 3: Wafer transport platform 4: Positioning block 5: Wafer 6: Wafer Box

Claims

1. A wafer inspection system that combines optics and waveband spectral waves to construct omnidirectional optical and millimeter-wave noise scan images, It comprises an optical inspection unit, a waveband inspection unit, and an inspection and analysis unit. The optical inspection unit is provided at a first position with respect to the movement path of the wafer (5) and performs optical imaging of the wafer (5). The waveband inspection unit is provided at a second position relative to the movement path of the wafer (5) and performs spectral imaging of the wafer (5). The inspection and analysis unit is signal-connected to the optical inspection unit and the waveband inspection unit, and performs inspection and computational analysis using optical imaging information and spectral imaging information, and includes inspecting the wafer (5) and acquiring its real-time status. The inspection of the wafer (5) includes real-time operation inspection of the wafer (5), the wafer transport device, and the wafer gripping device. A wafer inspection system characterized in that the real-time operation includes single-operation planar transport by a wafer transport device, multiple-operation planar transport, vertical transport, and transport of the wafer (5) by guide plate operation and gripping operation.

2. It is further equipped with a motion control unit, The motion control unit controls the movement of the wafer (5) based on a predetermined program. The wafer inspection system according to claim 1, characterized in that the inspection and analysis unit is electrically connected to the motion control unit, acquires a setting program relating to the operation of the wafer (5), and monitors for abnormalities in the wafer (5) by comparing it with the real-time state.

3. The inspection range for the wafer (5) includes a first inspection range, a second inspection range, and a third inspection range. The first inspection range includes real-time operational positioning, displacement, shifting, and missing parts of the wafer (5), The second inspection range includes real-time operational positioning, displacement, deviation and missing data of the wafer transport device, height and relative travel speed, The wafer inspection system according to claim 1, characterized in that the third inspection range includes real-time operational positioning of the wafer gripping device, gripping misalignment, displacement and breakage, height and relative movement speed.

4. The aforementioned optical inspection unit is A light receiving integrated module (1) that receives light, changes its direction, and guides the light, A light source integration module (2) that focuses the guided light rays to perform an optical scan on the wafer (5), A wafer inspection system according to claim 1, further comprising: an optical detection integration module that inspects the optical signal after an optical scan of a wafer (5) and feeds it back to an inspection and analysis unit.

5. The aforementioned waveband inspection unit is A waveband emission end that emits millimeter waves in the X, Y, and Z axis directions to form an omnidirectional spatial scan, A wafer inspection system according to claim 4, further comprising: a waveband exploration integration module that inspects millimeter waves after waveband scanning of a wafer (5) and feeds them back to an inspection analysis unit.

6. A wafer transport platform (3) is further provided, with a hollow support position in the middle to support the wafer transport device. The wafer inspection system according to claim 4, characterized in that the light receiving integrated module (1) and the light source integrated module (2) are symmetrically arranged at the bottom of the wafer transport platform (3).

7. The wafer inspection system according to claim 6, characterized in that the light receiving integrated module (1) and the light source integrated module (2) receive and guide light by vertical movement and rotational oscillation.

8. The wafer inspection system according to claim 6, characterized in that a positioning block (4) is provided corresponding to the support position of the wafer transport platform (3), and is used for positioning the wafer transport device.

9. The wafer inspection system according to claim 8, characterized in that the positioning block (4) is provided with an inspection sensor for checking whether or not a wafer transport device is positioned on the positioning legs of the block.

10. The wafer inspection system according to claim 1, characterized in that the first position and the second position are located on the same side of the transport path of the wafer (5).

11. The wafer inspection system according to claim 1, characterized in that the second position is arranged along at least one of the X, Y, and Z axes, and performs a spectral scan by emitting millimeter waves to the wafer (5).

12. A method for inspecting a wafer using the wafer inspection system described in Claim 4, Step S1: The optical inspection unit performs optical imaging on the wafer (5) at a first position, and the waveband inspection unit performs spectral imaging on the wafer (5) at a second position. Step S2: The inspection and analysis unit inspects and performs computational analysis on the optical imaging information and spectral imaging information to obtain the real-time status of the wafer (5). A wafer inspection method characterized by including [a certain element].

13. In step S1, The optical emission end emits light in the X, Y, and Z axis directions. The light receiving integration module (1) receives light, changes its direction, and guides the light. The light source integration module (2) concentrates the guided light rays, The optical detection integration module inspects the optical signal after optical scanning of the wafer (5). The wafer inspection method according to claim 12, characterized by including the following.

14. In step S1, The waveband emission end emits millimeter waves in the X, Y, and Z axis directions. The light-receiving integrated module (1) receives millimeter waves, changes their direction, and guides them. The light source integration module (2) aggregates the guided millimeter waves, The waveband exploration integrated module inspects the millimeter waves after scanning the wafer (5). The wafer inspection method according to claim 12, characterized by including the following.

15. The inspection and analysis unit acquires a setting program related to the operation of the wafer (5) and monitors for abnormalities in the wafer (5) by comparing it with the real-time state, The wafer inspection method according to claim 12, further comprising the following:

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