Patterned chuck for double-sided processing
The substrate chucking device with cavities and vacuum/electrostatic mechanisms addresses the issue of microstructure damage by securely holding substrates with both sides, allowing safe double-sided processing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2024-07-08
- Publication Date
- 2026-05-21
AI Technical Summary
Conventional chucking devices damage microstructures formed on the back side of substrates during processing, especially when both sides of the substrate have microstructures.
A substrate chucking device with cavities and support elements that accommodate microstructures, combined with vacuum and electrostatic chucking mechanisms to securely hold substrates without direct contact, ensuring both sides can be processed without damage.
Enables secure handling and processing of substrates with microstructures on both sides by preventing direct contact and minimizing warping, ensuring flatness and protection during double-sided processing.
Smart Images
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Abstract
Description
Technical Field
[0001]
[0001] Embodiments of the present disclosure generally relate to substrate chucks. More specifically, the embodiments described herein relate to patterned substrate chucks.
Background Art
[0002]
[0002] Substrate chucking devices are commonly used to support substrates during transfer or processing in the semiconductor and display industries. New technologies have led to the development of various advanced processing techniques for the manufacture of devices and structures on substrates. For example, the manufacture of waveguide devices for virtual reality and augmented reality applications has pushed the limits of conventional substrate processing techniques.
[0003]
[0003] Waveguide devices incorporate microstructures formed on glass or glass-like substrates. In many cases, the microstructures are formed on both the front and back sides of the substrate. However, it is difficult to handle and support substrates having microstructures formed on both the front and back sides during processing. For example, conventional chucking devices may damage the microstructures formed on the back side of the substrate while the front side is being processed.
[0004]
[0004] Therefore, what is needed in the art is an improved chucking device.
Summary of the Invention
[0005]
[0005] In one embodiment, a substrate chucking device is provided. The device includes a body having an upper surface and a bottom surface opposite the upper surface, a plurality of cavities formed within the body and recessed from the upper surface, and a plurality of support elements separating the plurality of cavities and extending from the body to the upper surface. A plurality of ports are formed within the body and extend from the upper surface to the bottom surface through one or more of the plurality of support elements, and conduits are in fluid communication with each of the plurality of ports.
[0006]
[0006] In another embodiment, a substrate chucking device is provided. This device includes a body having a top surface and a bottom surface opposite the top surface, a plurality of cavities formed within the body and recessed from the top surface, and a plurality of support elements extending from the body to the top surface, separating the plurality of cavities. A first plurality of ports are formed within the body and extend from the top surface to the bottom surface through one or more of the plurality of support elements, and a first conduit is in fluid communication with each of the first plurality of ports. A second plurality of ports are formed within the body and extend from the bottom surface of each of the plurality of cavities to the bottom surface of the body. A second conduit is in fluid communication with each of the second plurality of ports.
[0007]
[0007] In another embodiment, a substrate chucking device is provided. This device includes a body having a top surface and a bottom surface opposite the top surface, a plurality of cavities formed within the body and recessed from the top surface, and a plurality of support elements extending from the body to the top surface, separating the plurality of cavities. A polymer coating is disposed on the top surface of the body, the plurality of support elements, and the plurality of cavities. A first electrode assembly is disposed adjacent to the top surface of the body and inside each of the plurality of support elements, and a second electrode assembly is disposed adjacent to each of the plurality of cavities.
[0008]
[0008] To enable a detailed understanding of the above-mentioned features of the present disclosure, a more specific description of the present disclosure, which has been briefly summarized above, can be obtained by reference to embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings show only exemplary embodiments and should not be considered to limit the scope, as other equally valid embodiments may be recognized. [Brief explanation of the drawing]
[0009] [Figure 1A] A plan view of a substrate having a die on which a microstructure is formed, according to an embodiment described herein, is shown. [Figure 1B] A cross-sectional view of the substrate of Figure 1A along line 1B-1B is shown, according to the embodiment described herein. [Figure 2]A cross-sectional view of a vacuum chucking apparatus according to an embodiment described herein is shown. [Figure 3A] Figure 2 shows a plan view of the vacuum chucking apparatus according to an embodiment described herein. [Figure 3B] Figure 2 shows a plan view of the vacuum chucking apparatus according to an embodiment described herein. [Figure 4] A cross-sectional view of a vacuum chucking apparatus according to an embodiment described herein is shown. [Figure 5] Figure 4 shows a plan view of the vacuum chucking apparatus according to an embodiment described herein. [Figure 6] A cross-sectional view of an electrostatic chucking device according to an embodiment described herein is shown. [Modes for carrying out the invention]
[0010]
[0017] For ease of understanding, identical elements common to the drawings are indicated with the same reference numeral where possible. It is intended that elements and features of one embodiment may be usefully incorporated into other embodiments without further enumeration.
[0011]
[0018] Embodiments described herein relate to a substrate chucking device having a plurality of cavities formed therein. The cavities are formed in the body of the chucking device, and a plurality of support elements extend from the body, separating each of the plurality of cavities. In one embodiment, a first plurality of ports are formed on the upper surface of the body and extend through one or more of the plurality of support elements to the bottom surface of the body. In another embodiment, a second plurality of ports are formed on the bottom surfaces of the plurality of cavities and extend through the body to the bottom surface of the body. In yet another embodiment, a first electrode assembly is located adjacent to the upper surface of the body and inside each of the plurality of support elements, and a second electrode assembly is located inside the body adjacent to each of the plurality of cavities.
[0012]
[0019] Figure 1A shows a plan view of a substrate 100 having a die on which a microstructure 106 is formed, according to an embodiment described herein. In one embodiment, the substrate 100 is formed from glass or a glass-like material such as quartz or sapphire. In another embodiment, the substrate is formed from a semiconductor material such as silicon. Although the substrate 100 is shown as having a substantially circular shape, it is intended that the substrate 100 may have a polygonal shape, such as a quadrilateral shape, for example, a rectangular or square shape.
[0013]
[0020] The substrate 100 is shown having a plurality of dies 104 formed thereon. The dies 104 correspond to areas of the substrate 100 that are patterned with a structure desirable for subsequent use in various devices such as computing devices and optical devices. The dies 104 include microstructures 106 formed thereon. The microstructures 106 are feature areas formed on the dies 104 by various manufacturing processes such as lithography processes, for example, nanoimprint lithography (NIL) processes. Alternatively, the microstructures 106 are feature areas etched or deposited on the substrate 100. In one embodiment, the microstructures 106 are intended to be a lattice structure, and the dies 104 are intended to be part of a waveguide or waveguide device.
[0014]
[0021] The dies 104 are arranged on the substrate 100 such that kerf regions 108 are formed between adjacent dies 104. The kerf regions 108 are areas of the substrate surface not occupied by the dies 104. The kerf regions 108 substantially surround each individual die 104 and separate the individual dies 104 from one another. The kerf regions 108 may also extend between the individual dies 104 and the periphery of the substrate 100. In one embodiment, the kerf regions 108 substantially have no microstructures or features formed thereon. In various embodiments, the kerf regions 108 are areas that are later removed during the dicing process to separate the individual dies 104 during piece formation.
[0015]
[0022] Figure 1B shows a cross-sectional view of the substrate 100 of Figure 1A, cut along line 1B-1B, according to an embodiment described herein. As described above, the kerf region 108 is the region located between adjacent dies 104. Note that the substrate 100 is shown having a microstructure 106 formed on a first surface 102 of the substrate 100. In one embodiment, the microstructure 106 extends from the first surface 102 of the substrate 100 for a distance of about 100 μm to about 500 μm. In one embodiment, the first surface 102 is the front side of the substrate 100. The second surface 110 of the substrate 100 is located on the opposite side of the first surface 102 and parallel to the first surface 102. In the illustrated embodiment, the second surface 110 is untreated, and no features or microstructures are formed on the second surface 110.
[0016]
[0023] Figure 2 shows a cross-sectional view of a vacuum chucking apparatus 200 according to an embodiment described herein. The substrate 100 is shown with a first surface 202 in contact with the apparatus 200 and a second surface 110 facing away from the apparatus 200 in a position suitable for processing the second surface 110.
[0017]
[0024] The chucking device 200 includes a body 201 having a top surface 202 and a bottom surface 204 facing the opposite side of the top surface 202. In one embodiment, the body 201 is formed from a metallic material such as aluminum, stainless steel, or alloys, combinations, and mixtures thereof. In another embodiment, the body 201 is formed from a ceramic material such as silicon nitride, aluminum nitride, alumina, or combinations and mixtures thereof. In certain embodiments, a coating is placed on the top surface 202 of the body 201. Depending on the desired embodiment, the coating is a polymer material such as one or more of polyimide, polyamide, or polytetrafluoroethylene (PTFE) materials.
[0018]
[0025] A plurality of cavities 206 are formed in the main body 201. The cavities 206 are disposed within the main body 201 and extend into the main body 201 from the upper surface 202. The cavities 206 are defined by a bottom surface 203 and side walls 205. The depth of the cavities 206 is from about 100 um to about 1000 um, for example from about 300 um to about 700 um. The depth of the cavities 206 is contemplated to be sufficient to accommodate the microstructures 106 formed on the substrate 100 such that the microstructures 106 do not come into contact with the main body 201 when the substrate 100 is positioned on the chucking device 200. In one embodiment, the plurality of cavities 206 are formed in a material layer disposed on the main body 201.
[0019]
[0026] In one embodiment, the shape of the cavity 206 corresponds to the shape of the die 104. For example, if the die 104 has a square or rectangular shape, the shape of the cavity 206 is likewise square or rectangular. However, it is contemplated that the size of the cavity 206 may be larger or smaller than the area corresponding to the die 104.
[0020]
[0027] The cavities 206 are part of the main body 201 and are separated by a plurality of support elements 208 that extend from the main body 201 to the upper surface 202 of the main body 201. In addition to separating adjacent cavities 206, the support elements 208 extend around each of the cavities 206 and enclose each of the cavities 206. The support elements 208 further define the side walls 205 of the cavities 206. During operation, the substrate 100 is positioned on the device 200 such that the kerf region 108 is aligned with and contacts the support elements 208. In this way, the die 104 is aligned with the cavities 206 such that the microstructures 106 do not come into contact with the main body 201 of the device 200.
[0021]
[0028] The first plurality of ports 210 are formed on the upper surface 202 of the main body 201. In one embodiment, the first plurality of ports 210 are disposed on the upper surface 202 of the support element 208. The first plurality of ports 210 are aligned with the support element 208 between the cavities 206. The first plurality of ports 210 are also formed on the upper surface 202 of the main body radially outside the plurality of cavities 206. The first plurality of conduits 212 extend from the first plurality of ports 210 on the upper surface 202 through the main body 201 to the bottom surface 204. The first plurality of conduits 212 are coupled to a first vacuum source 214. Thus, the first vacuum source 214 is in fluid communication with the upper surface 202 of the main body 201 via the first plurality of conduits 212 and the first plurality of ports 210.
[0022]
[0029] During operation, a vacuum pressure is generated to chuck the substrate 100 to the main body 201 in a region away from the cavities 206. It is contemplated that chucking the substrate 100 to the main body 201 by vacuum is sufficient to achieve the desired substrate flatness for subsequent processing of the untreated second surface 110 of the substrate.
[0023]
[0030] FIG. 3A shows a plan view of the vacuum chucking apparatus 200 of FIG. 2 according to an embodiment described herein. The first plurality of ports 210 are disposed over a region corresponding to the support element 208. In the illustrated embodiment, the first plurality of ports 210 on the upper surface 202 are substantially circular in shape. Circular ports may improve the ease of manufacture of the apparatus 200, but it is contemplated that any port shape may be utilized, as described with respect to FIG. 3B. Although some of the ports 210 are shown distributed across the upper surface 202 of the main body 201, any number, arrangement, or distribution of ports 210 suitable to enable substantially flat chucking of the substrate 100 is contemplated to be within the scope of the present disclosure.
[0024]
[0031] Figure 3B shows a plan view of the vacuum chucking apparatus 200 of Figure 2 according to an embodiment described herein. The illustrated port 210 has an irregular shape that increases the surface area of the substrate exposed to the vacuum compared to the embodiment shown in Figure 3A. Any desirable shape can be used as long as the port 210 is aligned with the support element 208.
[0025]
[0032] Figure 4 shows a cross-sectional view of a vacuum chucking apparatus 200 according to an embodiment described herein. In the illustrated embodiment, the apparatus 200 includes a second plurality of ports 404, a second plurality of conduits 402, and a second vacuum source 406. The second plurality of ports 404 are formed in the bottom surface 203 of the cavity 206, and the second plurality of conduits 402 extend from each of the second plurality of ports 404 through the body 201 to the bottom surface 204. The second plurality of conduits 402 are coupled accordingly to the second vacuum source 406.
[0026]
[0033] During operation, the apparatus 200 in Figure 4 enables differential pressure chucking of the substrate 100. A first vacuum source 214 is in fluid communication with the substrate 100 via a first set of conduits 212 and a first set of ports 210, generating a first vacuum pressure to chucking the substrate against the upper surface 202 of the main body 201. A second vacuum source 406 is in fluid communication with the cavity 206 via a second set of conduits 402 and a second set of ports 404, generating a second vacuum pressure to further reduce the pressure within the cavity 206, thereby reducing or eliminating warping of the substrate 100 during exposure to the first vacuum pressure. The first vacuum pressure is intended to be greater than, less than, or equal to the second vacuum pressure, depending on the desired chucking characteristics.
[0027]
[0034] Figure 5 shows a plan view of the vacuum chucking apparatus 200 of Figure 4 according to an embodiment described herein. As shown, the second plurality of ports 404 are located within the cavity 206. It is intended that one or both of the first and second plurality of ports 210, 404 may be used in cooperation with each other or independently to achieve chucking of the substrate 100 into the body 201. Although the second plurality of ports 404 are shown as circular, it is intended that various polygonal shapes may be used as alternatives, similar to the shape of the first plurality of ports shown in Figure 3B. For example, the second plurality of ports 404 may be annular in shape, or a number of second ports 404 may be arranged within a single cavity 206.
[0028]
[0035] Figure 6 shows a cross-sectional view of an electrostatic chucking apparatus 600 according to an embodiment described herein. Similar to apparatus 200, apparatus 600 includes a body 601 having a top surface 603 and a bottom surface 604 facing opposite the top surface 603. In one embodiment, the body 601 is formed from a metallic material such as aluminum, stainless steel, or alloys, combinations, and mixtures thereof. In another embodiment, the body 601 is formed from a ceramic material such as silicon nitride, aluminum nitride, alumina, or combinations and mixtures thereof. In a particular embodiment, a coating 602 is placed on the top surface 603 of the body 601. Depending on the desired embodiment, the coating 602 is a polymer material such as one or more of polyimide, polyamide, or polytetrafluoroethylene (PTFE) materials.
[0029]
[0036] Multiple cavities 626 are formed in the main body 601. The cavities 626 are located within the main body 601 and extend from the top surface 603 into the main body 601. The cavities 626 are defined by a bottom surface 628 and side walls 630. The depth of the cavities 626 is approximately 0.5 μm to approximately 1000 μm, for example, approximately 300 μm to approximately 700 μm. The depth of the cavities 626 is intended to be sufficient to accommodate the microstructure 106 formed on the substrate 100 so that the microstructure 106 does not come into contact with the main body 601 when the substrate 100 is positioned on the chucking device 600.
[0030]
[0037] The coating 602 extends along the top surface 603 of the body 601 and over the side walls 630 and bottom surface 628 of the cavity 626. Similarly, the coating 602 extends over the support member 608 that defines the side wall 630 of the cavity 626. The thickness of the coating 602 is intended to be sufficient to allow electrostatic chucking of the substrate 100 to the body 601. As such, the coating 602 is thought to affect the electrostatic force applied to the substrate 100 via the electrode assemblies 612, 614.
[0031]
[0038] The first electrode assembly 612 is located inside the main body 601, adjacent to the upper surface 603 of the main body 601. The first electrode assembly 612 includes one or more leads coupled to the first power supply 620. In one embodiment, the first electrode assembly 612 is a single lead. Alternatively, the first electrode assembly 612 includes multiple leads. In this embodiment, the leads of the first electrode assembly 612 may be arranged in an alternating pattern. The first power supply 620 is configured to deliver power of a desired polarity to the first electrode assembly 612. In one embodiment, the first power supply 620 delivers a current having positive polarity to the first electrode assembly 612. In another embodiment, the first power supply 620 delivers a current having negative polarity to the first electrode assembly 612.
[0032]
[0039] The second electrode assembly 614 is positioned within the body 601 adjacent to the bottom surface 628 of the cavity 626. Similar to the first electrode assembly 612, the second electrode assembly 614 includes one or more lead wires. In one embodiment, the second electrode assembly 614 has a single lead wire. In another embodiment, the second electrode assembly 614 includes multiple lead wires. In this embodiment, the lead wires of the second electrode assembly 614 may be arranged in an alternating pattern. The second electrode assembly 614 is coupled to a second power supply 622 configured to deliver power of a desired polarity to the second electrode assembly 614. In one embodiment, the second power supply 622 delivers a current having positive polarity to the second electrode assembly 614. In another embodiment, the second power supply 622 delivers a current having negative polarity to the second electrode assembly 614.
[0033]
[0040] In one embodiment, the first power supply 620 and the second power supply 622 deliver currents of the same polarity to the first and second electrode assemblies 612 and 614, respectively. Alternatively, the first power supply 620 and the second power supply 622 deliver currents of different polarities to the first and second electrode assemblies 612 and 614, respectively.
[0034]
[0041] The first electrode assembly 612 is positioned within the body 601 in the first plane 616. The second electrode assembly 614 is positioned within the body 601 in the second plane 618. In one embodiment, the first plane 616 is positioned closer to the top surface 603 than the second plane 618. In another embodiment, both the first electrode assembly 612 and the second electrode assembly 614 are positioned within the second plane 618. By positioning the electrode assemblies 612 and 614 within the body 601 according to the embodiments described above, differential electrostatic chucking of the substrate 100 can be achieved in the regions of the support element 608 and the cavity 626. Thus, the flatness of the substrate can be adjusted across the substrate 100 during electrostatic chucking.
[0035]
[0042] While the above-described devices 200 and 600 relate to vacuum and electrostatic chucking, respectively, it is intended that other substrate positioning devices such as clamp rings, edge rings, and shadow rings can also find advantageous embodiments according to the embodiments described herein. Substrate positioning devices may be used alone or in combination with the vacuum and electrostatic chucking capabilities of devices 200 and 600.
[0036]
[0043] In summary, a substrate chucking device with a cavity allows for chucking of substrates having a surface with a microstructure for double-sided substrate processing. The chucking device includes various vacuum or electrostatic chucking elements as described above, and a chucking body configuration selected to support the kerf region of the substrate during processing.
[0037]
[0044] While the foregoing is directed toward embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the fundamental scope of the present disclosure, the scope of which is determined by the following claims.
Claims
1. A body having an upper surface and a bottom surface opposite to the upper surface, Multiple cavities formed within the main body and recessed from the upper surface, configured to accommodate multiple microstructures of multiple dies formed on the back side of the substrate while the front side of the substrate is being processed, Multiple support elements extending from the main body to the upper surface, separated by the multiple cavities, A first electrode assembly is disposed inside each of the plurality of support elements, adjacent to the upper surface of the main body, and A second electrode assembly is positioned adjacent to each of the aforementioned plurality of cavities. Main unit equipped with A substrate chucking device equipped with the following features.
2. The apparatus according to claim 1, wherein the first electrode assembly is arranged in a first plane, and the second electrode assembly is arranged in a second plane different from the first plane.
3. The apparatus according to claim 1, wherein the main body is made of a metal material.
4. The apparatus according to claim 3, wherein the metal material is an aluminum material, a stainless steel material, or an alloy, combination, or mixture thereof.
5. The apparatus according to claim 1, wherein the main body is made of ceramic material.
6. The apparatus according to claim 5, wherein the ceramic material is a silicon nitride material, an aluminum nitride material, an alumina material, or a combination or mixture thereof.
7. The apparatus according to claim 3, further comprising a polymer material disposed on the main body, wherein the polymer material is selected from the group consisting of polyimide material, polyamide material, and polytetrafluoroethylene material.
8. The apparatus according to claim 5, further comprising a polymer material disposed on the main body, wherein the polymer material is selected from the group consisting of polyimide material, polyamide material, and polytetrafluoroethylene material.
9. The apparatus according to claim 1, wherein the main body is substantially circular in shape.
10. The apparatus according to claim 1, wherein the main body is substantially rectangular in shape.
11. A body having an upper surface and a bottom surface opposite to the upper surface, Multiple cavities formed within the main body and recessed from the upper surface, Multiple support elements extending from the main body to the upper surface, separated by the multiple cavities, A first electrode assembly is disposed inside each of the plurality of support elements, adjacent to the upper surface of the main body, and A second electrode assembly is positioned adjacent to each of the aforementioned plurality of cavities. A main unit equipped with, The first power supply and The second power source, Equipped with, The first power supply is connected to the first electrode assembly, and the second power supply is connected to the second electrode assembly, and the first and second power supplies are configured to supply different currents to the first and second electrode assemblies, respectively, in order to adjust the flatness of the substrate while the substrate is electrostatically chucked. Circuit board chucking device.
12. The apparatus according to claim 11, wherein the first electrode assembly comprises one or more first lead wires coupled to the first power supply, and the second electrode assembly comprises one or more second lead wires coupled to the second power supply.
13. The apparatus of claim 11, wherein the first and second power supplies each supply currents having different polarities to the first and second electrode assemblies.
14. The apparatus according to claim 11, further comprising a polymer material disposed on the main body, wherein the polymer material is selected from the group consisting of polyimide material, polyamide material, and polytetrafluoroethylene material.
15. The apparatus of claim 11, wherein the first and second electrode assemblies are arranged along a plane parallel to the upper surface of the main body such that they are equidistant from the plane of the upper surface.
16. The apparatus according to claim 11, wherein the first electrode assembly is positioned closer to the plane of the upper surface of the main body than the second electrode assembly.
17. The apparatus according to claim 1, wherein the main body is made of a metal material.
18. The apparatus according to claim 1, wherein the main body is made of ceramic material.
19. The apparatus according to claim 17, further comprising a polymer material disposed on the main body, wherein the polymer material is selected from the group consisting of polyimide material, polyamide material, and polytetrafluoroethylene material.
20. The apparatus of claim 18, further comprising a polymer material disposed on the main body, wherein the polymer material is selected from the group consisting of polyimide material, polyamide material, and polytetrafluoroethylene material.