Electrical circuit device
By employing a housing with conductor pieces having varying cross-sectional areas, the device mitigates thermal stress, preventing peeling and wire breakage, thus improving the reliability and durability of the electrical circuit device in high-temperature environments.
JP7868172B2Active Publication Date: 2026-06-01ASTEMO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- ASTEMO LTD
- Filing Date
- 2022-11-16
- Publication Date
- 2026-06-01
Smart Images
Figure 0007868172000001 
Figure 0007868172000002 
Figure 0007868172000003
Abstract
The present invention addresses the problem of providing an electrical circuit device enabling a reduction in thermal stress acting on an interface between a conductor piece and a sealing material, and suppression of peeling of the sealing material from a housing. This invention is characterized in that a physical quantity measurement device 20 constituting an electrical circuit device is provided with a housing 201 having a circuit chamber 235 that opens on a front surface 221, three or more conductor pieces 301 that are insert-molded in the housing 201 and have distal end parts 312a lined up and exposed in the circuit chamber, a circuit board 207 accommodated in the circuit chamber, wires 303 connecting between the three or more conductor pieces and the circuit board, and a sealing material 211 that fills the circuit chamber, the three or more conductor pieces being configured such that distal end parts 312a, 313a, which are located in the middle, have a smaller cross-sectional area than that of distal end parts 311a, 314a that are located at the two ends of the alignment direction.
Need to check novelty before this filing date? Find Prior Art