Wire connection structure, wire connection method, medical device, and method for manufacturing a medical device.

Abstract

To provide a wire connection structure capable of easily connecting multiple wires and a substrate, a wire connection method, a piece of medical equipment, and a manufacturing method of medical equipment.SOLUTION: In a wire connection structure, each core wire 21 of multiple insulated wires 2, in which a plurality of core wires 21 is coated with insulation coating 22, is connected to a pad 61 formed on a substrate 6. The multiple insulated wires 2 are arranged parallel to each other on the substrate 6 aligned along a predetermined alignment direction D1, and in a longitudinal direction D2, a part of the insulation coating 22 is removed with the core wire 21 exposed. The exposed portions of the core wires 21 are connected to the pads 61, respectively, and the exposed portions of the core wires 21 are aligned along a slant direction D3 with respect to the longitudinal direction D2 and the alignment direction D1 of the multiple insulated wires 2.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a wire connection structure, a wire connection method, a medical device, and a method for manufacturing a medical device. [Background technology]

[0002] Conventionally, medical catheter cables inserted into the human body for examination or treatment have a design in which multiple wires are housed together in a tubular jacket. These multiple wires are led out of the jacket at the end of the catheter cable and connected, for example, to a circuit board. Patent documents 1 and 2 describe the proposed connection structure between these multiple wires and the circuit board.

[0003] The device described in Patent Document 1 is divided into multiple groups of coaxial wires stacked in the thickness direction of the substrate, and the central conductor of the coaxial wires in each group is connected to multiple contact conductors provided on the surface of the substrate. The length of the coaxial wires differs for each group, and the central conductor of each coaxial wire is connected to the contact conductor of the substrate at its respective end.

[0004] The invention described in Patent Document 2 involves, in order to improve workability when connecting stranded core wires to connection pads on a substrate, inserting the portion of the core wire from which the insulating sheath has been removed into a metal tube, and joining the connection pads on the substrate, the metal tube, and the core wire by diffusion bonding or ultrasonic bonding while pressing from above the metal tube. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2011-82042 [Patent Document 2] International Publication Number WO2018 / 105391 A1 [Overview of the project] [Problems that the invention aims to solve]

[0006] Medical catheter cables are designed to be thinner to reduce the burden on the human body, and for example, as described in Patent Document 1, extremely thin wires equivalent to AWG46 are used. However, as the wires become thinner, the difficulty of connecting them to the circuit board increases.

[0007] Therefore, the present invention aims to provide a wire connection structure, a wire connection method, a medical device, and a method for manufacturing a medical device that can easily connect multiple wires to a circuit board. [Means for solving the problem]

[0008] The present invention aims to solve the above problems and provides a wire connection structure in which each of the core wires of a plurality of insulated wires, each of which is covered with an insulating coating, is connected to a pad provided on a substrate, wherein the plurality of insulated wires are arranged parallel to each other on the substrate in a predetermined alignment direction, and the insulating coating is removed in a portion of the longitudinal direction of each wire to expose the core wire, and the exposed portion of the core wire is connected to the pad, and the exposed portion of the core wire is arranged in an inclined direction that is inclined with respect to the longitudinal direction and the alignment direction of the plurality of insulated wires Ori , The insulating coating is removed from a portion of the outer circumference of the core wire, including the space between the core wire and the pad, and the surface of the core wire opposite to the pad side is covered by the insulating coating, a recess is formed in the outer surface of the insulating coating toward the core wire, and the core wire is soldered to the pad by solder contained in the recess, and the core wire consists of a single wire with a circular cross-section and a diameter of 0.1 mm or less. To provide a wire connection structure.

[0009] Furthermore, the present invention aims to solve the above problems, It consists of a single wire with a circular cross-section and a diameter of 0.1 mm or less. A wire connection method comprising: an alignment step of arranging the plurality of insulated wires parallel to each other along a predetermined alignment direction; an insulation coating removal step of removing the insulation coating from a portion of the longitudinal direction of each of the plurality of insulated wires to expose the core wire; and a connection step of arranging the plurality of insulated wires on the substrate and connecting the core wire to the pad, In the insulation coating removal step, a portion of the insulation coating is removed by irradiating the plurality of insulated wires perpendicular to the longitudinal direction and the alignment direction, exposing the core wires and forming a recess that opens toward the substrate; in the connection step, solder is supplied to the recess, the solder is melted, and the core wires and the pads are soldered together; The aforementioned insulation coating removal step So The present invention provides a wire connection method that involves removing the insulating coating from the plurality of insulated wires at positions along an inclined direction that is inclined with respect to the longitudinal direction and the direction in which they are aligned, thereby exposing the core wires.

[0010] Furthermore, the present invention aims to solve the above problems and provides a medical device comprising a catheter cable having a plurality of insulated wires whose core wires are covered with an insulating coating, and a substrate having a plurality of pads to which the core wires of the plurality of insulated wires are connected, wherein one end of the longitudinal ends of the catheter cable is inserted into the human body, and the core wires of each of the plurality of insulated wires and the plurality of pads of the substrate are connected by the above-described wire connection structure.

[0011] Furthermore, the present invention aims to solve the above problems and provides a method for manufacturing a medical device comprising a catheter cable having a plurality of insulated wires whose core wires are covered with an insulating coating, and a substrate having a plurality of pads to which the core wires of the plurality of insulated wires are connected, wherein one end of the longitudinal ends of the catheter cable is inserted into the human body, and the method for manufacturing a medical device is provided, wherein each core wire of the plurality of insulated wires and the plurality of pads are connected by the wire connection method described above. [Effects of the Invention]

[0012] According to the wire connection structure, wire connection method, medical device, and method for manufacturing a medical device of the present invention, it becomes possible to easily connect multiple wires to a circuit board. [Brief explanation of the drawing]

[0013] [Figure 1] (a) is an explanatory diagram showing the usage state of a multi-electrode catheter as an example of a medical device according to an embodiment of the present invention. (b) is a cross-sectional view of the catheter cable. [Figure 2] (a) to (c) are diagrams showing a multi-core wire array in which multiple insulated wires are arranged in a line along a predetermined direction and integrated into one unit. [Figure 3] (a) and (b) are plan views showing a substrate on which multiple pads are provided to which the core wires of multiple insulated wires constituting a multi-core wire array are connected. (c) is a configuration diagram showing the longitudinal end face of the substrate. [Figure 4] (a) is a side view showing an electric wire connector in which a plurality of insulated electric wires and a substrate are combined, and (b) is a cross-sectional view taken along line A-A of (a). [Figure 5] It is a perspective view showing a plurality of insulated electric wires in the insulated coating removal process. [Figure 6] It is an explanatory diagram showing the connection process. [Figure 7] It is an explanatory diagram showing a modified example of the connection process. [Figure 8] (a) and (b) are explanatory diagrams showing a modified example in which a plurality of insulated electric wires are integrated using a strip member. [Figure 9] (a) is an explanatory diagram showing a modified example of the position of the exposed portion in the longitudinal direction of a plurality of insulated electric wires. (b) is a plan view showing one surface of the substrate combined with the plurality of insulated electric wires shown in (a). [Figure 10] (a) is an explanatory diagram showing another modified example of the position of the exposed portion in the longitudinal direction of a plurality of insulated electric wires. (b) is a plan view showing one surface of the substrate combined with the plurality of insulated electric wires shown in (a).

MODE FOR CARRYING OUT THE INVENTION

[0014] [Embodiment] FIG. 1(a) is an explanatory diagram showing the usage state of a multi-electrode catheter as an example of a medical instrument according to an embodiment of the present invention. FIG. 1(b) is a cross-sectional view of the catheter cable.

[0015] The multi-electrode catheter 1 has a catheter cable 10 and a handle 11 operated by an operator such as a doctor. One end of the catheter cable 10 in the longitudinal direction is accommodated in the handle 11, and the other end in the longitudinal direction is inserted into the human body of the subject P for inspection or treatment. In FIG. 1(a), the catheter cable 10 of the portion inserted into the human body of the subject P is shown by a broken line.

[0016] As shown in Figure 1(b), the catheter cable 10 comprises a wire bundle 20 consisting of multiple insulated wires 2, a binding tape 3 wrapped around the outer circumference of the wire bundle 20, a shield conductor 4 arranged on the outer circumference of the binding tape 3, and a tubular jacket 5 arranged on the outer circumference of the shield conductor 4. The jacket 5 is made of, for example, fluororesin and houses the wire bundle 20, the binding tape 3, and the shield conductor 4. In this embodiment, eight insulated wires 2 are bundled together to form the wire bundle 20. A fibrous or string-like interposition may be placed between the multiple insulated wires 2 inside the binding tape 3.

[0017] Each insulated wire 2 has a core wire 21 made of a highly conductive metal such as copper, and an insulating coating 22 covering the core wire 21. In this embodiment, the insulated wire 2 is an enameled wire, and the core wire 21, which is a single wire with a circular cross-section, is covered with an insulating coating 22 made of a resin composition such as polyurethane. The diameter of the core wire 21 is, for example, 0.02 mm or more and 0.10 mm or less. In this embodiment, the core wire 21 corresponds to AWG48 according to the AWG (American Wire Gauge) standard, and the conductor diameter is 0.032 mm (32 μm). The thickness of the insulating coating 22 is, for example, 0.008 mm (8 μm).

[0018] Multiple insulated wires 2 are led out from the jacket 5 within the handle 11. A console cable 12 is led out from the handle 11, and this console cable 12 connects the handle 11 to a console (not shown). The console is an information processing device equipped with a microprocessor, memory, etc., and for example, amplifies the signals sent from the subject P's body via the multiple insulated wires 2, and outputs an image signal to display the internal state of the subject P obtained from the amplified signals on a display.

[0019] The handle 11 houses a circuit board having multiple pads to which the core wires 21 of multiple insulated wires 2 are connected. Signals sent from the subject P's body are relayed by this circuit board and sent to the console via the console cable 12. Next, the wire connection structure in which the core wires 21 of multiple insulated wires 2 are connected to the multiple pads on the circuit board will be described.

[0020] Figures 2(a) to 2(c) are configuration diagrams showing a multi-core wire array 200 in which multiple insulated wires 2 are arranged in a line along a predetermined direction and integrated. Figures 3(a) and 3(b) are plan views showing a substrate 6 on which multiple pads 61 are provided, to which each core wire 21 of the multiple insulated wires 2 constituting the multi-core wire array 200 is connected. Figure 3(c) is a configuration diagram showing the longitudinal end face of the substrate 6. Figure 4(a) is a side view showing a wire connector 100 in which multiple insulated wires 2 and the substrate 6 are combined, and Figure 4(b) is a cross-sectional view taken along line AA of Figure 4(a).

[0021] Multiple insulated wires 2 are integrated at least on the substrate 6 to form a multi-core wire array 200. Here, "on the substrate 6" refers to the position adjacent to and facing the substrate 6. Figure 2(a) shows the substrate 6 side of the multi-core wire array 200, and Figure 2(b) shows the opposite side. Figure 2(c) shows the end faces of the multiple insulated wires 2 viewed along the longitudinal direction. In this embodiment, the multiple insulated wires 2 are integrated by bonding the insulating coatings 22 of the multiple insulated wires 2 together with adhesive 7. As shown in Figure 4(b), the adhesive 7 is applied to the side of each core wire 21 of the multiple insulated wires 2 that is further from the substrate 6 than the center line C1, and there is no adhesive 7 between the multiple insulated wires 2 and the substrate 6.

[0022] Multiple insulated wires 2 are arranged parallel to each other on the substrate 6 along a predetermined alignment direction, and the insulating coating 22 is removed in a portion of the longitudinal direction of each wire to expose the core wire 21, which is connected to the pad 61. The alignment direction of the multiple insulated wires 2 is parallel to the substrate 6 and perpendicular to the longitudinal direction of each insulated wire 2. In Figure 2(a), the alignment direction D1 and the longitudinal direction D2 of the multiple insulated wires 2 are indicated by arrows, respectively.

[0023] The insulating coating 22 of each of the multiple insulated wires 2 is removed in a portion of the outer circumference of the core wire 21, including the area between the core wire 21 and the pad 61, and the side of the core wire 21 opposite to the pad 61 side is covered with the insulating coating 22. More specifically, as shown in Figure 4(b), a portion of the insulating coating 22 is removed so that the insulating coating 22 has a C-shaped cross-section, and a recess 220 is formed that is recessed from the outer surface 22a of the insulating coating 22 toward the core wire 21. The core wire 21 and the pad 61 are electrically connected by solder 8 contained in this recess 220.

[0024] In each of the multiple insulated wires 2, the exposed portions of the core wire 21 are aligned along a direction inclined with respect to the alignment direction D1 and the longitudinal direction D2 of the multiple insulated wires 2. Hereinafter, the portions where the core wire 21 is exposed will be referred to as exposed portions 2a. In Figure 2(a), a dashed line L is shown connecting the center points C2 of the exposed portions 2a, and the inclination direction D3 indicating the direction of this line L is shown by an arrow.

[0025] As shown in Figure 2(a), the exposed portions 2a of adjacent pairs of insulated wires 2 are not aligned in the alignment direction D1. Therefore, the exposed portions 2a of six of the eight insulated wires 2, excluding the two insulated wires 2 at both ends in the alignment direction D1, are sandwiched between the insulating coatings 22 of adjacent insulated wires 2. This configuration prevents the core wires 21 of multiple insulated wires 2 from being bridged together by solder 8. The width W of the exposed portion 2a in the alignment direction D1 is equal to the diameter of the core wire 21.

[0026] When L1 is the length of the exposed portion 2a in the longitudinal direction D2, and L2 is the distance between the exposed portions 2a of multiple insulated wires 2 in the longitudinal direction D2, L2 is shorter than L1 and longer than the outer diameter of the insulated wires 2. This suppresses the occurrence of solder bridges while preventing the length of the substrate 6 in the longitudinal direction D2 from becoming unnecessarily long. Note that L2 does not necessarily have to be the same in all parts and may be non-uniform.

[0027] In this embodiment, as an example, a case is described in which eight insulated wires 2 are arranged parallel to each other to form a multi-core wire array 200. However, the number of insulated wires 2 is not limited to this; any three or more will suffice. In other words, the exposed portions of the core wires 21 of at least three insulated wires 2 should be aligned along an inclined direction that is inclined with respect to the longitudinal direction and alignment direction of these insulated wires 2.

[0028] The substrate 6 is an FPC (flexible printed circuit board), and a plurality of pads 61 are provided on one side 6a of a flat base material 60. The base material 60 is made of an insulator such as polyimide and is flexible. Figure 3(a) shows the side 6a of the base material 60, and Figure 3(b) shows the other side 6b, which is the back side of the side 6a. Figure 3(c) shows the longitudinal end face of the substrate 6.

[0029] The substrate 6 is provided with through-holes 62 that penetrate the base material 60 in the thickness direction, and linear wiring patterns 63. In the examples shown in Figures 3(a) and (b), through-holes 62 are provided in a portion of each of the multiple pads 61, and wiring patterns 63 extending from the through-holes 62 are provided on the other side 6b, so that the insulated wires 2 and one side 6a of the base material 60 are in contact over a wide area. Alternatively, through-holes 62 may be provided near the multiple pads 61 via lead wires. By mainly forming the wiring patterns 63 on the other side 6b, the insulated wires 2 can be aligned with one side 6a of the flat base material 60 over a wide area, making it possible to easily and accurately align the multi-core wire array 200 and the substrate 6.

[0030] The pads 61 and wiring patterns 63 are metal foils formed by etching, with a thickness of, for example, 1 μm to 16 μm. The core wire 21 of the insulated wire 2 is electrically connected to the terminals of an electronic component (not shown) mounted on, for example, a substrate 6, via the pads 61, through-holes 62, and wiring patterns 63.

[0031] Next, a wire connection method for connecting the core wires 21 of each of the multiple insulated wires 2 to pads 61 provided on the substrate 6 will be described. This wire connection method includes an alignment step of arranging the multiple insulated wires 2 parallel to each other along the alignment direction D1, an integration step of integrating the multiple insulated wires 2 arranged in the alignment step, an insulation coating removal step of removing the insulation coating 22 of each of the multiple insulated wires 2 in a part of the longitudinal direction D2 to expose the core wires 21 while the multiple insulated wires 2 are integrated, and a connection step of placing the multiple insulated wires 2 from which the insulation coating 22 has been partially removed on the substrate 6 and connecting the core wires 21 of each insulated wire 2 to pads 61. The multi-electrode catheter 1 is manufactured by a manufacturing method using this wire connection method.

[0032] In the alignment process, longitudinal tension is applied to multiple insulated wires 2, and the multiple insulated wires 2 are aligned parallel to each other in a straight line. In the integration process, adhesive 7 is applied to the surface of the multiple insulated wires 2 opposite to the surface facing the substrate 6 to integrate the multiple insulated wires 2 and form a multi-core wire array 200. In the insulation coating removal process, the insulation coating 22 of each of the multiple insulated wires 2 is removed at a position along the inclined direction D3 to expose the core wires 21.

[0033] Figure 5 is a perspective view showing multiple insulated wires 2 in the insulation coating removal process. In the insulation coating removal process, a portion of the insulation coating 22 is removed by irradiating a laser beam LB perpendicular to the alignment direction D1 and the longitudinal direction D2, thereby exposing the core wire 21. The beam diameter of the laser beam LB in the portion corresponding to the insulation coating 22 is, for example, equivalent to the diameter of the core wire 21. By performing the insulation coating removal process using the laser beam LB, the insulation coating 22 on a portion of the outer circumference of the core wire 21, including the area between the core wire 21 and the pad 61, can be removed without excess or deficiency. The portion from which the insulation coating 22 has been removed becomes a recess 220 that opens toward the substrate 6.

[0034] Figure 6 is an explanatory diagram showing the connection process. In the connection process, as shown in Figure 6, paste-like solder paste 80 is applied to the recess 220, and then one side 6a of the substrate 6 is brought close to the multi-core wire array 200 to adhere the solder paste 80 to the pad 61. After that, the solder paste 80 is melted by heating, and the core wires 21 are connected to the pad 61 by soldering, as shown in Figure 4(b). Note that the heat resistance temperature of the insulating coating 22 is higher than the melting point of the solder paste 80, so even if the molten solder 8 comes into contact with the insulating coating 22 of another insulated wire 2 adjacent to the core wire 21 of the insulated wire 2, the insulating coating 22 will not melt.

[0035] (Effects of the embodiment) According to the embodiments of the present invention described above, since the exposed portions 2a on which the core wire 21 is exposed are arranged along an inclined direction D3 that is inclined with respect to the alignment direction D1 and the longitudinal direction D2 of the multiple insulated wires 2, for example, the spacing between the exposed portions 2a can be increased compared to the case where the exposed portions 2a are arranged along the alignment direction D1, making it possible to easily connect the multiple insulated wires 2 and the substrate 6 while suppressing the occurrence of solder bridges.

[0036] Furthermore, since the insulating coating 22 is removed from a portion of the outer circumference of the core wire 21, including the space between the core wire 21 and the pad 61, the work is easier compared to removing the insulating coating 22 from the entire outer circumference of the core wire 21. In addition, the solder paste 80 can be held in the recess 220 formed by removing the insulating coating 22, making the connection process easy and reliable.

[0037] Furthermore, since multiple insulated wires 2 are integrated, misalignment between the insulated wires 2 can be prevented, and the spacing between the exposed portions 2a of the multiple insulated wires 2 can be appropriately maintained, thereby suppressing the occurrence of solder bridges. In addition, by performing the insulation coating removal process and the connection process with the multiple insulated wires 2 integrated, these processes can be carried out easily and reliably. Moreover, by integrating the multiple insulated wires 2 with adhesive 7 applied to the side of each core wire 21 that is further from the substrate 6 than the center line C1, it is possible to prevent the adhesive 7 from interfering with the insulation coating removal process and the connection process.

[0038] (modified version) Next, modified examples of the embodiments will be described with reference to Figures 7 to 10. In Figures 7 to 10, components corresponding to those described in the above embodiments are given the same reference numerals as those used in Figures 2 to 6, and redundant descriptions are omitted.

[0039] Figure 7 is an explanatory diagram showing a modified version of the connection process. In the above embodiment, the case in which soldering is performed by applying solder paste 80 to the recess 220 formed by removing the insulating coating 22 was described. However, in the modified version shown in Figure 7, spherical solder balls 81 are placed in each recess 220 of the multiple insulated wires 2, and these solder balls 81 are melted by heating to solder the core wire 21 to the pad 61. Although Figure 7 shows the case in which two solder balls 81 are placed in each recess 220, the number of solder balls 81 placed in the recess 220 is not limited to this; it may be one or three or more.

[0040] Figures 8(a) and 8(b) are explanatory diagrams showing modified examples in which multiple insulated wires 2 are integrated using a strip-shaped member 91 positioned on the opposite side from the substrate 6. Figure 8(a) shows a modified example in which multiple insulated wires 2 are integrated by being bonded to the strip-shaped member 91 with adhesive 90. The adhesive 90 is applied to the side of each core wire 21 that is further from the substrate 6 than the center line C1. Figure 8(b) shows a modified example in which multiple insulated wires 2 are integrated by using an adhesive tape 9 having an adhesive layer 92 formed on one side of the strip-shaped member 91, and the multiple insulated wires 2 are bonded to the strip-shaped member 91 by the adhesive layer 92. The strip-shaped member 91 is made of a flexible strip-shaped resin and is attached vertically so that its longitudinal direction is parallel to the longitudinal direction of the multiple insulated wires 2.

[0041] Figures 9(a) and 10(a) are explanatory diagrams showing modified configurations of the exposed portions 2a in the longitudinal direction of multiple insulated wires 2. Figure 9(b) is a plan view showing one side 6a of a substrate 6 combined with the multiple insulated wires 2 shown in Figure 9(a). Figure 10(b) is a plan view showing one side 6a of a substrate 6 combined with the multiple insulated wires 2 shown in Figure 10(a). In the above embodiment, the case in which all exposed portions 2a of the eight insulated wires 2 constituting the multi-core wire array 200 are aligned along a single straight line L was described, but in the modified configurations shown in Figures 9(a) and 10(a), the arrangement of the exposed portions 2a is different from that of the above embodiment.

[0042] In the modified example shown in Figure 9(a), the exposed portions 2a of four of the eight insulated wires 2 constituting the multi-core wire array 200 are aligned along a first straight line La, and the exposed portions 2a of the other four insulated wires 2 are aligned along a second straight line Lb. Both the first straight line La and the second straight line Lb extend along an inclined direction D3 that is inclined with respect to the alignment direction D1 and the longitudinal direction D2, and are parallel to each other. The exposed portions 2a of the four insulated wires 2 aligned along the first straight line La and the exposed portions 2a of the four insulated wires 2 aligned along the second straight line Lb are each aligned in the alignment direction D1 via three insulated wires 2.

[0043] In the modified example shown in Figure 10(a), the exposed portions 2a of five of the eight insulated wires 2 constituting the multi-core wire array 200 are aligned along a third straight line Lc, and the exposed portions 2a of the other three insulated wires 2 are aligned along a fourth straight line Ld. Both the third straight line Lc and the fourth straight line Ld are inclined with respect to the alignment direction D1 and the longitudinal direction D2, but the directions of inclination with respect to the longitudinal direction D2 are opposite to each other. The extension direction of the third straight line Lc is inclined in the inclination direction D, which is inclined to one side with respect to the longitudinal direction D2. 31 Therefore, the extension direction of the fourth straight line Ld is the inclined direction D, which is inclined to the other side with respect to the longitudinal direction D2. 32 The exposed portions 2a of the three insulated wires 2 aligned along the fourth straight line Ld, and the exposed portions 2a of the three insulated wires 2 among the five insulated wires 2 aligned along the third straight line Lc, are each aligned in the direction D1 via multiple insulated wires 2.

[0044] Each of these modifications can achieve the same functions and effects as the above embodiment. In the above embodiment and each of the modifications, the wire connection structure at one end of the multiple insulated wires 2 is shown, but the core wires 21 may also be connected to the multiple pads on the substrate by the same wire connection structure at the other end in the longitudinal direction of the multiple insulated wires 2. In this case, by making the arrangement of the exposed portion 2a of the multi-core wire array 200 at one end of the multiple insulated wires 2 the same as the arrangement of the exposed portion 2a of the multi-core wire array 200 at the other end, the distance between the connection portion between the core wires 21 and the pads on the substrate at one end of each insulated wire 2 and the connection portion between the core wires 21 and the pads on the substrate at the other end can be made the same.

[0045] (Summary of embodiments and modified examples) Next, the technical concept understood from the embodiments and modified examples described above will be described using the reference numerals and other symbols from the embodiments and modified examples. However, the reference numerals in the following description are not limited to the components in the claims that are specifically shown in the embodiments.

[0046] [1] A wire connection structure in which each of a plurality of insulated wires (2), each having a core wire (21) covered with an insulating coating (22), is connected to a pad (61) provided on a substrate (6), wherein the plurality of insulated wires (2) are arranged parallel to each other on the substrate (6) along a predetermined alignment direction (D1), and the insulating coating (22) is removed in a portion of the longitudinal direction of each to expose the core wire (21), and the exposed portion of the core wire (21) is connected to the pad (61), wherein the exposed portion of the core wire (21) is in an inclined direction (D3, D) with respect to the longitudinal direction (D2) and the alignment direction (D1) of the plurality of insulated wires (2) 31 ,D 32 A wire connection structure arranged along the line.

[0047] [2] The wire connection structure according to [1], wherein the insulating coating (22) is removed from a portion of the outer circumference of the core wire (21), including the space between the core wire (21) and the pad (61), and the side of the core wire (21) opposite to the pad (61) side is covered by the insulating coating (22).

[0048] [3] At least three of the insulated wires (2) have exposed core wires (21) in the inclined direction (D3, D 31 ,D 32 The wire connection structure described above [1], arranged along the lines of [1].

[0049] [4] The wire connection structure according to [1] above, wherein the plurality of insulated wires (2) are integrated at least on the substrate (6).

[0050] [5] The wire connection structure according to [4] above, wherein the insulating coatings (22) of the plurality of insulated wires (2) are bonded together by an adhesive (7), thereby integrating the plurality of insulated wires (2).

[0051] [6] The wire connection structure according to [5], wherein the adhesive (7) is applied to the side of each of the plurality of insulated wires (2) that is further from the substrate (6) than the center wire (C1) of the core wire (21).

[0052] [7] The wire connection structure according to [4] above, wherein the plurality of insulated wires (2) are integrated by bonding or adhesive to a strip-shaped member (91) located on the opposite side from the substrate (6).

[0053] [8] The wire connection structure according to [1] above, wherein the diameter of the core wire (21) is 0.1 mm or less.

[0054] [9] A wire connection method for connecting each core wire (21) of a plurality of insulated wires (2), each having a core wire (21) covered with an insulating coating (22), to a pad (61) provided on a substrate (6), comprising: an alignment step of arranging the plurality of insulated wires (2) parallel to each other along a predetermined alignment direction; an insulating coating removal step of removing the insulating coating (22) from a part of the longitudinal direction of each of the plurality of insulated wires (2) to expose the core wire (21); and a connection step of arranging the plurality of insulated wires (2) on the substrate (6) and connecting the core wire (21) to the pad (61), wherein in the insulating coating removal step, the plurality of insulated wires (2) are in an inclined direction (D3, D) that is inclined with respect to the longitudinal direction (D2) and the alignment direction (D1). 31 ,D 32 A wire connection method comprising removing the insulating coating (22) at a position along the ) to expose the core wire (21).

[0055]

[10] The wire connection method according to [9], further comprising an integration step of integrating the plurality of insulated wires (2) arranged in the alignment step, wherein in the insulation coating removal step, the insulation coating (22) is removed while the plurality of insulated wires (2) are integrated.

[0056]

[11] The wire connection method according to [9] above, wherein the insulating coating removal step removes the insulating coating (22) from a portion of the outer circumference of the core wire (21), including the space between the core wire (21) and the pad (61).

[0057]

[12] The wire connection method according to

[11] , wherein in the connection step, the paste-like solder (80) attached to the portion from which the insulating coating (22) was removed in the insulating coating removal step is melted and the core wire (21) is soldered to the pad (61).

[0058]

[13] The wire connection method according to

[11] , wherein in the connection step, the solder ball (81) contained in the portion from which the insulating coating (22) was removed in the insulating coating removal step is melted and the core wire (21) is soldered to the pad (61).

[0059]

[14] A medical device (multi-electrode catheter 1) comprising a catheter cable (10) having a plurality of insulated wires (2) whose core wires (21) are covered with an insulating coating (22), and a substrate (6) having a plurality of pads (61) to which the core wires (21) of the plurality of insulated wires (2) are connected, wherein one end of the longitudinal ends of the catheter cable (10) is inserted into the human body, and the core wires (21) of each of the plurality of insulated wires (2) and the plurality of pads (61) of the substrate (6) are connected by the wire connection structure described in any one of [1] to [8] above.

[0060]

[15] A method for manufacturing a medical device (1), comprising a catheter cable (10) having a plurality of insulated wires (2) whose core wires (21) are covered with an insulating coating (22), and a substrate (6) having a plurality of pads (61) to which the core wires (21) of the plurality of insulated wires (2) are connected, wherein one end of the longitudinal ends of the catheter cable (10) is inserted into the human body, wherein the core wires (21) of each of the plurality of insulated wires (2) and the plurality of pads (61) are connected by the wire connection method described in any one of [9] to

[13] above.

[0061] The embodiments of the present invention and their modifications have been described above. However, the embodiments and modifications described above do not limit the invention according to the claims. Also, it should be noted that not all combinations of features described in the embodiments are essential for the means to solve the problems of the invention.

[0062] Also, in the above embodiment, the case where the present invention is applied to the multi-electrode catheter 1 which is a kind of medical instrument has been described. However, it is not limited to this. For example, the present invention may be applied to an endoscope, or the present invention may be applied to devices other than medical instruments. Also, in the above embodiment, the case where the core wire 21 is connected to the pad 61 by soldering has been described. However, it is not limited to this, and the core wire 21 may be connected to the pad 61 by a conductive adhesive.

Explanation of Reference Numerals

[0063] 1... multi-electrode catheter (medical instrument) 10... catheter cable 2... insulated wire 200... multi-core wire array 21... core wire 22... insulating coating 6... substrate 61... pad 7... adhesive 80... cream solder 81... solder ball 91... strip member C1... center line D1... arrangement direction D2... longitudinal direction D3, D 31 , D 32 ... inclination direction

Claims

1. A wire connection structure in which each of the core wires of a plurality of insulated wires, each of which is covered with an insulating coating, is connected to a pad provided on a substrate, The plurality of insulated wires are arranged parallel to each other on the substrate in a predetermined direction, and the insulating coating is removed in a portion of the longitudinal direction of each wire to expose the core wire, and the exposed portion of the core wire is connected to the pad. The exposed portions of the core wires are arranged along a direction of inclination that is inclined with respect to the longitudinal direction and the direction of alignment of the plurality of insulated wires. The insulating coating is removed from a portion of the outer circumference of the core wire, including the space between the core wire and the pad, and the side of the core wire opposite to the pad side is covered by the insulating coating. A recess is formed in the outer surface of the insulating coating, extending toward the core wire, and the core wire is soldered to the pad by solder contained in the recess. The aforementioned core wire consists of a single wire with a circular cross-section and a diameter of 0.1 mm or less. Wire connection structure.

2. At least three of the insulated wires have exposed core wires that are aligned along the direction of inclination. The wire connection structure according to claim 1.

3. The plurality of insulated wires are integrated at least on the substrate. The wire connection structure according to claim 1.

4. The insulating coatings of the multiple insulated wires are bonded together with an adhesive, thereby integrating the multiple insulated wires. The wire connection structure according to claim 3.

5. The adhesive is applied to the side of each of the multiple insulated wires that is further from the substrate than the center line of the core wire. The wire connection structure according to claim 4.

6. The plurality of insulated wires are integrated by adhesion or bonding to a strip-shaped member located on the opposite side from the substrate. The wire connection structure according to claim 3.

7. A wire connection method for connecting the core wires of a plurality of insulated wires, each having a core wire with a circular cross-section and a diameter of 0.1 mm or less, to pads provided on a substrate, wherein each core wire is covered with an insulating coating. Alignment step of arranging the plurality of insulated wires parallel to each other along a predetermined alignment direction, An insulation coating removal step is performed to remove the insulation coating from a portion of the longitudinal direction of each of the plurality of insulated wires to expose the core wire, The process includes arranging the plurality of insulated wires on the substrate and connecting the core wires to the pads, In the insulating coating removal step, a portion of the insulating coating is removed by irradiating the plurality of insulated wires perpendicular to the longitudinal direction and the direction in which they are aligned, thereby exposing the core wires and forming a recess that opens toward the substrate. In the connection process described above, solder is supplied to the recess, the solder is melted, and the core wire and the pad are soldered together. In the insulation coating removal step, the insulation coating is removed at positions along the inclined direction relative to the longitudinal direction and the direction of alignment of the plurality of insulated wires to expose the core wires. Method of connecting electrical wires.

8. The process further includes an integration step in which the plurality of insulated wires arranged in the alignment step are integrated, In the insulation coating removal step, the insulation coating is removed while the plurality of insulated wires are integrated together. The wire connection method according to claim 7.

9. In the insulation coating removal step, the insulation coating is removed from a portion of the outer circumference of the core wire, including the space between the core wire and the pad. The wire connection method according to claim 7.

10. In the connection step, the solder paste that was applied to the portion from which the insulating coating was removed in the insulating coating removal step is melted and the core wire is soldered to the pad. The wire connection method according to claim 9.

11. In the connection step, the solder ball contained in the portion from which the insulating coating was removed in the insulating coating removal step is melted and the core wire is soldered to the pad. The wire connection method according to claim 9.

12. A medical device comprising a catheter cable having multiple insulated wires, the core wires of which are covered with an insulating coating, and a substrate having multiple pads to which the core wires of the multiple insulated wires are connected, wherein one end of the longitudinal ends of the catheter cable is inserted into the human body, Each of the core wires of the plurality of insulated wires and the plurality of pads of the substrate are connected by the wire connection structure described in any one of claims 1 to 6. Medical devices.

13. A method for manufacturing a medical device comprising a catheter cable having a plurality of insulated wires whose core wires are covered with an insulating coating, and a substrate having a plurality of pads to which the core wires of the plurality of insulated wires are connected, wherein one end of the longitudinal ends of the catheter cable is inserted into the human body, Each of the core wires of the plurality of insulated wires and the plurality of pads are connected by the wire connection method described in any one of claims 7 to 11. A method for manufacturing medical devices.

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