Immersion cooling platform

Abstract

A two-phase liquid immersion cooling system is described in which a heat-generating computer component vaporizes a dielectric fluid in its liquid phase. The dielectric vapor is then condensed back to the liquid phase and used to cool the computer component. The disclosed system can operate below atmospheric pressure using a pressure-controlled vessel and pressure controller. By controlling the pressure at which the system operates, users can affect the temperature at which the dielectric fluid vaporizes, thereby achieving increased performance from a given computer component. Using a robotic arm and slot-in computing components, a self-healing computing system can be formed.

Description

Technical Field

[0001] The present invention relates to a computing system cooled by immersion, i.e., a computing system cooled by immersion that utilizes pressure and / or vapor management.

Summary of the Invention

[0002] Conventional computing and / or server systems utilize air to cool various components. Conventional liquid or water-cooled computers utilize a flowing liquid to remove heat from the computer components but avoid direct contact between the computer components and the liquid itself. The development of non-conductive and / or dielectric fluids enables the use of immersion cooling, in which computer components and other electronic components can be immersed in a dielectric or non-conductive liquid to directly transfer heat from the components to the liquid. Immersion cooling can be used to reduce the total energy required to cool computer components and can also reduce the amount of space and equipment required for adequate cooling.

[0003] In the embodiments of the disclosure of the present invention described below, the use of a vapor and pressure management system and a power management system can be utilized individually or in combination to form a significantly improved computer system that utilizes immersion cooling.

[0004] Embodiments of the invention of the present disclosure relate to a pressure-controlled vessel that can be used to house a computing system that is immersion-cooled. In one embodiment, the pressure-controlled vessel contains a sufficient amount of liquid dielectric fluid to substantially immerse heat-generating computer components, and also includes an atmosphere-containing gaseous dielectric fluid. The embodiment further comprises a condensation system for cooling the gaseous dielectric fluid to convert it into a liquid dielectric fluid. The pressure control system of the disclosure enables the embodiment of the disclosure to operate under vacuum, thereby causing the dielectric fluid to vaporize and lowering the temperature at which the computing system operates. The embodiment of the disclosure enables higher density of computer components and / or higher performance of the computer by improving the temperature control system described. [Brief explanation of the drawing]

[0005] [Figure 1] Figure 1 shows a schematic diagram of a pressure control vessel according to an exemplary embodiment. [Figure 2] Figure 2 shows a schematic diagram of a pressure control vessel according to an exemplary embodiment. [Figure 3] Figure 3 shows an external view of an exemplary embodiment of the pressure control vessel 110. [Figure 4] Figure 4 illustrates an exemplary embodiment of a superstructure that includes multiple pressure control vessels. [Figure 5] Figure 5 illustrates an exemplary data center embodiment showing multiple pressure control vessels connected to a central power supply. [Figure 6] Figure 6 illustrates an exemplary data center embodiment showing multiple pressure control vessels connected in series with each other. [Figure 7-1] Figure 7A illustrates an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. Figure 7B illustrates an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. [Figure 7-2]Figure 7C illustrates an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. Figure 7D illustrates an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. [Figure 8A] Figure 8A shows an example embodiment of a rack system. [Figure 8B] Figure 8B shows an example embodiment of a rack system. [Figure 8C] Figure 8C shows an exemplary embodiment of the rack system. [Figure 9A] Figure 9A shows an exemplary embodiment of a chassis for mounting various components. [Figure 9B] Figure 9B shows an example embodiment of a chassis for mounting various components. [Figure 9C] Figure 9C shows an exemplary embodiment of a chassis for mounting various components. [Figure 9D] Figure 9D shows an example embodiment of a chassis for mounting various components. [Figure 9E] Figure 9E shows an exemplary embodiment of a chassis for mounting various components. [Figure 9F] Figure 9F shows an exemplary embodiment of a chassis for mounting various components. [Figure 9G] Figure 9G shows an example embodiment of a chassis for mounting various components. [Figure 10A] Figure 10A shows an exemplary embodiment of a pressure control vessel. [Figure 10B] Figure 10B shows an exemplary embodiment of a pressure control vessel. [Figure 10C] Figure 10C shows an exemplary embodiment of a pressure control vessel. [Figure 10D] Figure 10D shows an exemplary embodiment of a pressure control vessel. [Figure 10E] Figure 10E shows an exemplary embodiment of a pressure control vessel. [Figure 10F]Figure 10F shows an exemplary embodiment of a pressure control vessel. [Figure 11] Figure 11 shows an exemplary cooling and vapor management system for a pressure control vessel. [Figure 12A] Figure 12A shows another embodiment of the vessel. [Figure 12B] Figure 12B shows another embodiment of the vessel. [Figure 12C] Figure 12C shows another embodiment of the vessel. [Figure 12D] Figure 12D shows another embodiment of the vessel. [Figure 12E] Figure 12E shows another embodiment of the vessel. [Figure 13] Figure 13 shows an example of a self - contained vessel. [Figure 14] Figure 14 shows an example of an external housing for a self - contained vessel. [Figure 15A] Figure 15A shows an exemplary magazine located on a platform that can protrude from the vessel. [Figure 15B] Figure 15B shows an exemplary magazine located on a platform that can protrude from the vessel. [Figure 15C] Figure 15C shows an exemplary magazine located on a platform that can protrude from the vessel. [Figure 15D] Figure 15D shows an exemplary magazine located on a platform that can protrude from the vessel. [Figure 16] Figure 16 shows a vapor recovery system according to an exemplary embodiment. [Figure 17] Figure 17 shows an exemplary embodiment of a rack power distribution system. [Figure 18] Figure 18 shows an example of a heating element for an immersion cooling system according to an exemplary embodiment. [Figure 19A] Figure 19A shows a filter including three cores according to an exemplary embodiment. [Figure 19B] Figure 19B shows a filter including three cores according to an exemplary embodiment. [Figure 20A]Figure 20A shows an example robot system. [Figure 20B] Figure 20B shows an example robot system. [Figure 21A] Figure 21A shows an example guide pin mechanism between the chassis and the rack. [Figure 21B] Figure 21B shows an example guide pin mechanism between the chassis and the rack. [Figure 22] Figure 22 shows an example connector with a self-aligning function. [Modes for carrying out the invention]

[0006] The following description will elaborate on specific details, such as specific quantities, sizes, arrangements, configurations, and components, to provide a complete understanding of the embodiments disclosed herein. However, it will be apparent to those skilled in the art that the disclosure can be implemented without such specific details. In many cases, details concerning such considerations are omitted because they are not necessary for a complete understanding of the disclosure and fall within the scope of the art of those skilled in the art.

[0007] The devices, components, systems, and subsystems of some of the embodiments of the disclosure described below are described by trade names. It will be apparent to those skilled in the art that the disclosure can be carried out with a number of similar components, regardless of whether such components are developed and / or sold under specific trade names, and that features and / or inventive features associated with components under specific trade names are not necessary to carry out the invention of the disclosure.

[0008] Dielectric fluid One aspect of immersion cooling is the use of a fluid that is thermally conductive but electrically substantially inconductive or substantially dielectric. Examples of such fluids include some of the Novec® series fluids designed by 3M®, including Novec 7100, but the invention described is not limited to specific dielectric fluids. Depending on the immersion fluid, it typically has a boiling point that is desirable for operating the computer components being cooled. All computer components and other aspects of the system of disclosure are preferably made of materials that are not soluble and, if not, do not undergo dielectric breakdown in a pressure control vessel upon contact with the dielectric fluid. In some embodiments, the boiling point of the dielectric fluid at standard atmospheric pressure may be less than about 100°C, less than about 80°C, less than about 60°C, less than about 50°C or even lower. In some embodiments, the boiling point of the dielectric fluid at standard atmospheric pressure may be greater than about 60°C, greater than about 40°C, greater than about 30°C or greater than about 20°C. Certain embodiments of the immersion cooling fluid have a generally low vapor pressure. Some embodiments of the immersion cooling fluid are fluorocarbons and / or fluorinated ketones. Certain embodiments of the dielectric fluid may have the chemical formula (CF3)2CFCF2OCH3, C4F9OCH3, or CF3CF2CF2CF2OCH3, or similar formulas. Certain dielectric fluids include hydrofluoroethers and methoxy-nonafluorobutane.

[0009] Other desirable properties of the immersion cooling fluid include low toxicity, non-flammability, and / or low surface tension. In some embodiments, the immersion cooling fluid does not substantially harm the computer components and / or the connections, wiring, cables, seals, and / or adhesives associated with the computer components at the pressures and temperatures used for immersion cooling. Some dielectric fluids have a dielectric constant in the range of about 1.8 to about 8 and a dielectric strength of about 15 megavolts per meter (MV / m). In some embodiments, the dielectric strength is at least about 5 MV / m, at least about 8 MV / m, at least about 10 MV / m, or at least about 12 MV / m. In some embodiments, the dielectric fluid has a dielectric strength of up to about 3 MV / m, up to about 5 MV / m, or up to about 8 MV / m. In embodiments of the disclosure, any liquid in contact with the computer components 170 has a dielectric strength that is sufficiently high so as not to damage the computer components at the intervals and conditions of a particular application.

[0010] A certain dielectric fluid has a dielectric strength of at least about 10 W / cm². 2 at least approximately 15 W / cm² 2 at least approximately 18 W / cm² 2 Or at least about 20 W / cm² 2 It has a critical heat flux of approximately 15 W / cm². Some dielectric fluids have a maximum critical heat flux of approximately 15 W / cm². 2 Up to approximately 10W / cm² 2 Up to approximately 8W / cm² 2 Or a maximum of approximately 5W / cm² 2 It has a critical heat flux.

[0011] Figure 1 shows a schematic diagram of a cooled computing system 110 according to an exemplary embodiment. Embodiments of the cooled computing system 110 (or computing system, system, vessel or pressure control vessel, all of which are interchangeable) of the disclosure may utilize a liquid dielectric fluid 140 to cool the computer components 170 by immersing the components in a tank of fluid. As electricity passes through the components 170, the components 170 generate heat. As the temperature of the components 170 rises, the performance of the components degrades, or the components are damaged to a failure point. It is advantageous to maintain various computing components at stable, relatively low temperatures. In some embodiments, the computer components 170 may be maintained at less than about 80°C, less than about 70°C, less than about 65°C, less than about 60°C, or less than about 55°C. In some embodiments, the computer components 170 may be maintained at more than about 60°C, more than about 50°C, more than about 40°C, more than about 35°C, or more than about 30°C. As the computer component 170 heats up, the heat is transferred to the liquid dielectric fluid 140 surrounding the component 170. When the liquid dielectric fluid reaches its boiling point, it transitions from the liquid phase to the gas phase and rises out of the liquid tank 142. The component 170 in the dielectric fluid tank 142 can be maintained approximately near the boiling point of the specific dielectric fluid 140 being used.

[0012] When the liquid dielectric fluid is heated to its vaporization point at the pressure used for a given application and turns into a gas, bubbles of dielectric vapor rise from the liquid tank 142 to the top of the system 110. The vapor is then cooled to its condensation point using the condenser 130. Depending on the configuration of the system 110, the heating and cooling of the dielectric fluid from the liquid phase to the vapor phase and back to the liquid phase can generate convection as shown in Figure 2.

[0013] In one embodiment, the computer component 170 will be completely immersed in the liquid dielectric fluid 140 during system operation. In other words, the upper portion of the computer component 170 will be below the water level of the dielectric fluid 140. It should be seen that heat from the computer component will cause the dielectric fluid to change from the liquid phase to the gas phase, and small bubbles of the dielectric fluid will come into contact with the computer component. Such a component is still considered to be completely immersed in the liquid phase dielectric fluid. In one embodiment, the computer component 170 may be immersed in the liquid phase dielectric fluid 140. In one exemplary embodiment, but not limited to this, if any part of the computer component, including any part of the motherboard, chip, server, card, blade, GPU, or CPU and / or any peripheral component, is in direct contact with the liquid phase dielectric fluid 140, the computer component is considered immersed. In a particular embodiment, the computer component 170 may be at least partially immersed in the liquid phase dielectric fluid 140. If the computer component 170 is not immersed but is sufficiently cooled by dielectric vapor, the computer component is considered to be at least partially immersed.

[0014] In some existing immersion cooling systems, the dielectric fluid must be constantly added to the dielectric fluid tank because the fluid is always boiling. Failure to add the dielectric fluid to tank 142 will cause the level of dielectric fluid in tank 142 to drop to the point where the components are exposed to a gaseous atmosphere and are no longer adequately cooled. This can result in reduced performance or damage to the components 170.

[0015] In one embodiment, there may be multiple operating modes that can be considered in relation to the dielectric fluid in its liquid state. These modes may include (1) initial filling, which is the process of transferring the dielectric fluid from the storage system to the container; (2) continuous leveling, which is the process of adding additional fluid to the container or removing excess fluid from the container; (3) withdrawal, which is the process of withdrawing the fluid from the container and placing it in the storage system; and (4) operational filtering, which is the process of continuously circulating the fluid through a filter system to ensure the removal of any particulate matter.

[0016] In one embodiment, the first three liquid management tasks, namely initial filling, continuous leveling, and withdrawal, can be accomplished by the same set of piping, pumps, and valves as a whole. A dedicated tank for storing liquid refrigerant may be used for storing new fluid and excess fluid that is removed and then recondensed during vapor management treatment. A set of pipes and pumps may be used to transport the refrigerant (or dielectric fluid) from the storage system to the container during filling and leveling, and from the container back to the storage system during the withdrawal operation.

[0017] In some embodiments, a fourth of the liquid management challenges, namely operational filtering, can be achieved by a series of skimmers and / or filters. The first stage may be a large-particle filter located at the bottom of the container. The purpose of this filter is to prevent particles that are too large to be handled later from entering the rest of the system. The second stage may be a medium-particle filter located inline in the piping system between the first and third stages. This second-stage medium-particle filter can be a small barrel-type filter that removes particles that are too small to be removed by the first-stage filter but are still too large to be handled by the third-stage filter. The third-stage filter may consist of one or more parallel filters with supports for various filter configurations. In some embodiments, a particular type of filter will be specialized by performing fluid analysis after it is exposed and operating together with a set of hardware components located within the container environment. Varying the hardware and / or components makes it easier to generate different types of particulate matter and chemicals that may need to be filtered to ensure the long life and efficiency of the dielectric fluid.

[0018] Pressure management In general, the immersion cooling fluid must be kept free of dust, water, and / or other contaminants. Since the computer components 170 are in direct contact with the immersion cooling fluid 140, even a small amount of contaminant could cause a short circuit or damage to the computer components. Furthermore, water or water vapor that can contaminate the dielectric fluid can degrade the dielectric properties of the fluid, including, but not limited to, dielectric strength, as it becomes contaminated. If the dielectric strength of the dielectric fluid decreases, the computer components may short circuit or, at the very least, be damaged during operation. One way to reduce contamination is to operate the immersion cooling system in an enclosure that is kept slightly above or above atmospheric pressure.

[0019] As the computer components 170 operate, some of the dielectric fluid 140 vaporizes into a gas due to the heat generated from the initial use of the computer components. If the immersion cooling system is confined within a substantially sealed housing, this vaporization typically increases the atmospheric pressure within the housing. Pressure relief valves, expansion enclosures, and / or other techniques may be used to limit the increasing pressure and / or maintain the pressure within the housing at or slightly above atmospheric pressure. Maintaining a slight positive pressure within the enclosure may help reduce the ingress of dust, water vapor, or other contaminants into the immersion cooling computing system.

[0020] The current embodiment utilizes a sealed pressure control vessel 110 (or a cooled computing system 110), which encloses the computing components 170 and immersion cooling equipment, as well as associated power supplies, networking connections, wiring connections, etc., within the pressure control vessel. In contrast to existing models, the pressure control vessel 110 is maintained at least a slight vacuum, thereby lowering the boiling point of the dielectric fluid 140 to a temperature below its boiling point at standard atmospheric pressure.

[0021] By operating the computing and immersion cooling systems under vacuum, the components 170 can be maintained at the lowered low-pressure boiling point of the dielectric fluid 140. This has advantages such as enhanced cooling, which allows more electricity to flow through the various components 170, resulting in greater component performance. By controlling the pressure in the pressure control vessel 110, the boiling point of the dielectric fluid 140 can also be controlled, allowing the same fluid 140 to be used under a wider range of conditions. While many embodiments benefit from lower temperatures, certain computer components 170 have an ideal range, below which temperatures degrade. By controlling the pressure in the pressure control vessel 110, the boiling point of the immersion cooling fluid 140 can also be controlled. In certain embodiments, the pressure control system of the disclosure may be used to dynamically control the pressure of the dielectric fluid 140 and, thereby, its boiling point, when the computing system is started up, shut down, or in response to other changing conditions.

[0022] In addition to lowering the boiling point of the dielectric fluid 140 by operating in a pressure-controlled vessel 110 below atmospheric pressure, the computer components 170 themselves may be modified to more efficiently transfer heat from themselves and to the dielectric fluid 140. Heat transfer between the component 170 and the tank 142 of the dielectric fluid 140 can be increased by increasing the surface area of ​​the component 170 exposed to the liquid dielectric fluid 140, for example, a chip. Exemplary devices for increasing the surface area may be a copper boiler or a copper disk, which can be bonded to the chip of other computer components 170. In certain embodiments, the adhesive used will be selected based on its heat transfer capability and solubility in the dielectric cooling fluid. A suitable adhesive exhibits high thermal conductivity and low solubility in the selected dielectric fluid.

[0023] Figure 1 shows a schematic diagram of an exemplary embodiment of the computing system of the disclosure. Embodiments of the system of the disclosure include a pressure control vessel 110 (or cooled computing system 110), a pressure controller 150, an immersion cooling system including at least a certain volume of dielectric fluid 140 and a condensing structure 130, and desired computer components 170. The pressure system may be configured to maintain a desired degree of pressure reduction. The pressure control vessel 110 may be configured to maintain negative pressure while allowing multiple penetrations into the pressure control vessel 110 for various connections, including power, data, networking, cooling water and / or communication systems. Some embodiments utilize airtight and / or marine-grade connections. Operating the computing system within the pressure control vessel 110 at sub-atmospheric pressure requires a series of modifications to the system as a whole. These modifications are described below, some of which will be immediately apparent to those skilled in the art.

[0024] Figure 3 shows the appearance of an exemplary embodiment of the pressure control vessel 110. In one embodiment, the disclosed pressure control vessel 110 is at least 2 feet high, at least 3 feet high, at least 4 feet high, or at least 5 feet high. In another embodiment, the pressure control vessel is at most about 3 feet high, at most about 4 feet high, or at most about 5 feet high.

[0025] In certain embodiments, the pressure control vessel has an internal volume of at least about 100 cubic feet, at least about 150 cubic feet, at least about 200 cubic feet, at least about 250 cubic feet, at least about 300 cubic feet, at least about 350 cubic feet, or at least about 400 cubic feet.

[0026] In one embodiment, the pressure control vessel is configured to contain approximately 12 inches vertically of the fluid dielectric fluid and approximately 36 inches vertically of the dielectric fluid vapor during operation. In certain embodiments, the ratio of gas volume to liquid volume helps to direct the gaseous dielectric vapor to a condensation structure that generates convection and returns the vapor to liquid. In one embodiment, the pressure control vessel is configured to contain, during operation, a volume of liquid dielectric fluid in a ratio of approximately 1:6 to the volume of gaseous dielectric fluid. In other embodiments, the pressure control vessel is configured to contain, during operation, a volume of liquid dielectric fluid in a ratio of approximately 1:3, approximately 1:5, approximately 1:8, approximately 1:10, or approximately 1:15 to the volume of gaseous dielectric fluid.

[0027] In one exemplary embodiment, the pressure management system may include a pressure controller 150. The pressure controller 150 may be a vacuum source, for example, a vacuum pump that can be connected to a pressure control vessel 110. In one embodiment, the vacuum pump 150 may be remote, and vacuum can be delivered to the pressure control vessel 110 via piping. In a preferred embodiment, a pressure sensor 180 is contained within the pressure control vessel 110 and used to adjust and / or maintain a desired negative pressure within the pressure control vessel 110. In one embodiment, the pressure sensor 180 and / or a pressure regulator 190 may be connected to a processor that monitors the pressure in the pressure control vessel 110 using the pressure sensor 180 and adjusts the pressure using the pressure regulator 190.

[0028] In some embodiments, an operator protection mechanism is provided. In one exemplary embodiment, the operator protection mechanism may be a locking mechanism that prevents the system from operating if either the lid or service panel of the pressure control vessel is not in place. In one exemplary embodiment, the operator protection mechanism may include a controller that immediately shuts off the system's power if one of the doors or panels of the pressure control vessel is breached. In addition to providing a life safety configuration, the operator protection mechanism may provide an enhanced operational security configuration for deployments where sensitive data is contained within the vessel. A high level of assurance can be achieved in the efficiency of the disk protection mechanism by ensuring that the equipment is inaccessible during normal operation without interrupting power to the system. Furthermore, in some embodiments, the disk protection mechanism may use a runtime-retained encryption key to protect the data stored on the pressure control vessel.

[0029] In certain embodiments, sensors may be placed to verify that the system is operating as designed, in addition to preventing unsafe access to the pressure control vessel. The main sensor package may include a temperature sensor in the steam space, a temperature sensor in the liquid space, a humidity sensor in the steam space, and / or a pressure sensor in the steam space. These sensor readings may be monitored by software and / or a human operator to verify that the system is operating in a safe and normal manner. In some embodiments, the sensor data is recorded or analyzed later.

[0030] In some embodiments, additional sensors may be included within the container or the superstructure (as defined below). Such sensors may include, for example, a FLIR thermal imaging camera, a VESDA or other form of suction smoke detector, and / or a refrigerant leak detector, designed to detect leakage of dielectric fluid into the surrounding environment.

[0031] In one embodiment, the container and / or the superstructure may be equipped with indicator lights indicating the operating status of the system.

[0032] The cooled computing system 110 is sometimes also called a pressure-controlled system 110, but those skilled in the art will recognize that many, if not all, of the advantages of the cooled computing system 110 can be realized without using a "pressure-controlled system".

[0033] Steam management system Immersion cooling systems can be operated in different ways. Some operate by continuously cooling the immersed fluid directly. Others operate by bringing the liquid to its maximum liquidus temperature and then boiling it to create a vapor phase. Immersion cooling systems that operate by vaporizing the liquid are called two-phase immersion cooling systems. Two-phase immersion cooling systems often boil and / or vaporize the dielectric fluid, and regularly add additional fluid to replace the fluid lost to the atmosphere.

[0034] Embodiments of the disclosure utilize an immersion cooling system contained within a pressure control vessel 110. This has the effect of not losing the dielectric fluid 140 even after it has been converted to a gaseous form. In a sealed or substantially sealed pressure control vessel 110, the gaseous dielectric fluid is condensed and returned to a tank 142 of liquid dielectric fluid 140, which is actively used to cool the computing components 170. The condensation step can be performed in any appropriate manner, for example, by circulating the treated water through heat conduction tubes. The condensing structure 130 may include heat dissipation fins and / or similar devices that increase the surface area of ​​the condenser, thereby allowing for greater and / or faster condensation of the gaseous dielectric fluid, which is returned to a liquid form. In some embodiments, the treated water is at ambient temperature and is not actively cooled. In other embodiments, the treated water can be cooled using vaporization cooling, dry cooling towers and / or other known methods in the art for cooling treated water.

[0035] In one embodiment, there may be two interfaces between the pressure control vessel and the external system. The first interface may be a treated water supply interface. This may be a pipe that delivers treated water from a cooling treated water supply facility to a distribution manifold on the pressure control vessel. The second interface may be a treated water return interface. This may be a pipe that returns treated water to a cooling water supply facility. The treated water may be returned to the facility after it has flowed through the pressure control vessel and associated cooling components. Cooling components may include, for example, a condenser, condensing coil and / or radiator in the vessel, and coils that block heat from the exhaust of any powered components, including, for example, a motor, pump and / or utility cabinet. In one embodiment, there may be two interfaces between the superstructure and the external system. These interfaces may be similar to or substantially similar to the two interfaces between the pressure control vessel and the external system.

[0036] In one embodiment, the position of the condensation structure 130 within the pressure control vessel 110 may be configured to optimize the flow of the vapor phase dielectric fluid and increase the rate and / or efficiency of condensation. In another embodiment, the geometry of the pressure control vessel 110 itself may be controlled to increase the rate and / or efficiency of condensation.

[0037] In one exemplary embodiment, the position of the condensation structure 130 may facilitate and optimize the placement (or removal of) the computer components 170 from the container (e.g., by a robot) within the container. For example, the condensation structure 130 may be positioned on the side (or side wall) of the container such that it is not located between the container lid and the computer components 170. In this way, when the lid is opened, the robot can directly remove the computer 170 without interfering with the condensation structure 130. This placement of the condensation structure simplifies the placement and removal of the computer components 170, thereby greatly benefiting the autonomous operation of the container. In one exemplary embodiment, the condensation structure 130 may be located on a shelf within the container.

[0038] As shown in Figures 1-3, in one exemplary embodiment, the pressure control vessel is approximately 10 feet long, 4 feet wide, and 4 feet high. Tank 142 may be formed within the pressure control vessel 110 using approximately 130 gallons of Novec® dielectric fluid 140. This leaves a layer of liquid dielectric fluid to a depth of approximately 12 inches in the immersion cooling tank at the bottom of the pressure control vessel, while the majority of the volume of the pressure control vessel is gas. The ceiling of the pressure control vessel is lower than the central part of the elongated structure. The ceiling and / or lid 120 are angled upward and become higher as they approach the side walls of the pressure control vessel 110. The condensation structure 130 is elongated on two sides of the pressure control vessel 110. In this exemplary embodiment, the condensation structure 130 is approximately 12 inches wide and 24 inches high and extends substantially the entire length of the pressure control vessel 110. The condensing structure 130 includes a heat sink, such as one made of a material with large surface area fins that is cooled using flow-treated water. Some embodiments may include additional or alternative heat exchangers.

[0039] As shown in Figure 2, the structural arrangement within the pressure control vessel 110 directs the convection of the dielectric fluid vapor as it rises from the liquid tank 142 after boiling. The structural arrangement directs the convection toward the ceiling of the pressure control vessel, where the flow is directed toward a large surface area condensation structure 130, where it is recondensed into a liquid form. The dielectric fluid 140 then re-flows into the liquid tank 142. In this embodiment, the total amount of dielectric fluid 140 can be held within this sealed housing. By using convection to circulate the dielectric fluid vapor, the embodiment of the disclosure can operate without a mechanical pump for circulating the dielectric liquid, thereby reducing the total energy consumption of the system of the disclosure.

[0040] In certain embodiments, additional tanks and / or storage containers for dielectric fluid may be used during system startup and / or shutdown to allow redundant and robust control of the height of the liquid dielectric fluid, in cases where the pressure control vessel must be opened and / or to enable such control.

[0041] Figure 11 shows an exemplary cooling and steam management system 600 for a pressure control vessel 110. In this exemplary embodiment, the cooling and steam management system 600 may include a storage unit 611 for cooled treated water, which passes through a cooling coil 132 to bring about condensation of a dielectric fluid 140. After passing through the cooling coil 132, the treated water may proceed to a treated water return storage unit 612. The cooling and steam management system 600 may also include a steam storage tank 614 and a dielectric fluid storage tank 615. Tanks 614 and 615 can supply dielectric fluid or steam as needed, for example, during system startup and / or shutdown. In one exemplary embodiment, tanks 614 and 615 may be connected via a condensing structure 616. If there is an excess supply of steam to tank 614, the condensing structure 616 may remove the steam and add it as dielectric fluid to the fluid storage tank 615.

[0042] In one embodiment, during operation, the pressure control vessel is maintained at approximately 3 psi below atmospheric pressure, which lowers the boiling point of the dielectric fluid and thereby lowers the operating temperature of the computer chip and other components. In another embodiment, the pressure control vessel 110 is maintained at at least approximately 2 psi below atmospheric pressure, at least approximately 4 psi below, at least approximately 6 psi below, at least approximately 8 psi below, or at least approximately 10 psi below atmospheric pressure.

[0043] In some embodiments, it is necessary to select components that have a certain degree of tolerance to pressure fluctuations. By adjusting the operating pressure of the system, it is preferable to use components that can withstand a wide range of pressures so that the boiling point of the refrigerant and thus the approximate operating temperature of the entire system can be controlled. Considering the nature of operation of a two-phase system, the standard operating conditions for some embodiments are a variation of ±4 PSIg. Under certain conditions, such as during rapid system startup or shutdown, a difference of three additional PSIg may be introduced. In some embodiments, system level adjustments may be made to better control these variables and keep them within a more controlled and defined range.

[0044] In a particular embodiment, the computer component 170 operates at a pressure at least about 3% lower than atmospheric pressure, at least about 5% lower than atmospheric pressure, at least about 10% lower, at least about 15% lower, at least about 20% lower, at least about 25% lower, or at least about 30% lower.

[0045] In one embodiment, the pressure control vessel is maintained during operation at a pressure of less than approximately 750 torr, less than approximately 710 torr, less than approximately 650 torr, less than approximately 600 torr, less than approximately 550 torr, less than approximately 500 torr, less than approximately 450 torr, less than approximately 400 torr, or less than that. In another embodiment, the pressure control vessel is maintained during operation at a pressure of more than approximately 650 torr, more than approximately 600 torr, more than approximately 550 torr, more than approximately 500 torr, more than approximately 450 torr, more than approximately 400 torr, or more than approximately 300 torr.

[0046] In one embodiment, a vapor scrubbing process and / or initial purging process is utilized to control the gaseous atmosphere within a pressure control vessel. This process removes a portion of the gaseous atmosphere from the pressure control vessel, removing undesirable parts of the atmosphere such as air and water vapor. These and other undesirable parts of the atmosphere can be separated based on the temperature at which vapor condenses into liquid. Due to the specialized properties and boiling points of dielectric fluids, numerous naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable acts to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20°C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10°C at standard atmospheric pressure.

[0047] To reduce the amount of dielectric fluid lost when the pressure control vessel is opened and / or exposed to atmospheric conditions during maintenance, startup, and / or shutdown operations, a layer of inert gas, such as nitrogen gas, may be introduced into the pressure control vessel. As shown in Figure 11, the cooling and steam management system 600 may also include an inert gas tank 613, which can supply inert gas to reduce the loss of dielectric fluid.

[0048] Embodiments of the disclosure may include substantially self-contained server and / or computing systems. In some embodiments, specialized sealing and / or connections may be used to reduce the total number of penetrations into the pressure control vessel 110. In some embodiments, power, water, vacuum, and networking connections are bundled into a series of lines to minimize penetrations into the pressure control vessel in order to reduce the possibility of leakage while the system is under vacuum.

[0049] Figure 4 illustrates an exemplary embodiment of a superstructure including multiple pressure control vessels. In this exemplary embodiment, two pressure control vessels 110 are pre-piped, pre-wired, and housed within a modular superstructure 210. This allows the embodiment to be prefabricated and delivered as a substantially complete, self-contained system. The modular system may be configured to connect to other modular embodiments of the computing system disclosed. In one embodiment, the modular superstructure 210 requires only a single power connection and is pre-wired to appropriate electronics that supply the necessary voltage to computer components and / or other electronic components.

[0050] Figure 5 illustrates an exemplary data center embodiment showing multiple pressure control vessels connected to a central power supply. Figure 6 illustrates an exemplary data center embodiment showing multiple pressure control vessels connected in series with each other. In these exemplary embodiments, the pressure control vessels 110 may or may not be located within a superstructure.

[0051] Figures 7A-D illustrate an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. In this exemplary embodiment, an internal robotic arm 230 contained within a pressure control vessel 110 may be used to remove component 170 and transport the removed component to an airlock 220. Component 170 can be removed using the airlock 220 without substantially disrupting or disturbing the pressure, atmosphere, dielectric fluid, and / or other conditions within the pressure control vessel 110. Once component 170 is removed from the pressure control vessel 110, a replacement component can be introduced into the pressure control vessel 110 using the airlock 220. The replacement component can then be installed by the internal robotic arm 230. This process can be greatly facilitated by using components that can be installed in a “slot-in” manner, such as blade servers and chassis.

[0052] Disturbances to the conditions within the pressure control vessel can be detected by sensors placed within the pressure control vessel, such as pressure sensors. Such disturbances may be indicated by a deviation of at least 10% outside the standard range of operating conditions under those conditions. Large disturbances to the conditions within the pressure control vessel may be indicated by a deviation of at least 30% outside the standard range of operating conditions under those conditions.

[0053] In certain embodiments, a self-contained diagnostic program may be executed to analyze the performance of components within the pressure control vessel 110. If a component 170 is not functioning as desired, a robotic arm 230 will be used to automatically remove and / or replace that component. In this embodiment, a self-healing, self-contained server and / or computing system can be formed. In certain embodiments, such a self-healing system is prefabricated and pre-wired to form a modular unit that can be shipped or delivered to a remote location using conventional methods, providing significantly more efficient computing power, and requiring only limited setup and / or maintenance.

[0054] In one embodiment, the first steam management task of cooling steam and condensing it back from a gaseous state to a liquid state is fully achieved within a closed system of a vessel through the use of a condensing coil. The treated water is piped through the condensing coil within the vessel. The shape and geometry of the vessel itself facilitate the flow of steam from the tank area to the coil area, and gravity acts to draw the recondensed liquid back into the tank area.

[0055] In one embodiment, a second steam management challenge, which is to monitor and maintain the internal pressure of the vessel, is achieved through the use of an integrated pressure sensor within the vessel and a purge system. In one embodiment, the purge system is used to remove excess steam from the vessel and condense it back into a liquid for storage in a liquid storage tank.

[0056] In one embodiment, a third steam management task, which is to control and remove non-condensable components of the steam present during system startup, is achieved through the same mechanism as the second task. A purge system may be used to pressurize the system and remove any non-condensable gases from the system during its initial startup.

[0057] In one embodiment, a fourth vapor management challenge, controlling the overlay of an inert gas, can be achieved using a dedicated nitrogen overlay supply system. This overlay keeps the refrigerant below the top of the vessel, minimizing refrigerant loss during periods when the vessel is opened and its components are being repaired. Dedicated piping from a set of nitrogen storage tanks through a dedicated set of overlay pipes within the vessel allows the operator to add an inert overlay when they wish to open the system. This gas, along with any other non-condensable substances, may be removed during the removal of non-condensable substances that may occur during system startup. The overall vapor management process can be managed and monitored through control system software based on user commands and system status monitoring.

[0058] Ballast block In some embodiments of the disclosed system, such as that shown in Figure 1, the pressure control vessel 110 may include a deep tank 142 for containing the majority of the dielectric fluid 140 and a wide shelf area 112 adjacent to the tank. Substrates, cards, chips, blades, and / or any other computer components 170 are substantially contained within the deep tank 142 of the pressure control vessel 110. The wide shelf area 112 may also contain the liquid dielectric fluid 140 and / or collect the dielectric fluid 140 that is recondensed from the vapor phase to the liquid phase. In certain embodiments, the depth of the dielectric fluid in the pressure control vessel 110 may be increased using a ballast block 160. The ballast block 160 is used to occupy unnecessary volume on the shelf, thereby removing the dielectric fluid 140 that would otherwise be present on the shelf 112, and allowing the liquid level to be raised without requiring the addition of additional dielectric fluid 140. In one embodiment, the ballast block 160 includes riser legs 161 that allow fluid to flow beneath the ballast block 160 so that the condensed liquid can continue to flow into the deep chamber of the pressure control vessel without the flow being obstructed by the ballast block 160.

[0059] The ballast block 160 may consist of any material that does not interfere with the operation of the immersion cooling system disclosed. The ballast block may consist of materials including, but not limited to, metals, rubber, silicone, and / or polymers. Preferred materials are substantially insoluble in the dielectric fluid. The block must be denser than the dielectric fluid, but does not need to be solid. In preferred embodiments, the block has a handle or notch that allows for easier handling and manipulation of the block. One embodiment of the ballast block 160 utilizes interlocking tops and bottoms so that the blocks can be stacked on top of each other in a fixed manner. The interlocking tops and bottoms reduce the risk of the block damaging nearby components if the block slides or shifts from its desired position. In one embodiment, the bottom block is fixedly stacked on top of the bottom block so as not to obstruct the fluid flow and to occupy a large volume, thereby allowing the dielectric liquid level to rise without requiring the addition of a large amount of additional dielectric liquid, the interlocking top includes recesses on the bottom that align with legs and / or risers.

[0060] In one embodiment, the ballast block 160 is configured to extend across the entire length of the pressure control vessel 110 and / or the rack 112. In another embodiment, the ballast block 160 can be substantially any size that makes the block handleable. In such embodiments, multiple modular ballast blocks can be configured to eliminate as much or as little volume as desired. In one embodiment, a single ballast block has external dimensions of approximately 2 feet, 3 feet, 4 feet or more in length, approximately 6 inches, 8 inches, 12 inches or more in width, and approximately 1 inch, 3 inches, 6 inches, 8 inches or more in height.

[0061] superstructure The disclosed computing system consists of various components, all of which can be directly or indirectly mounted to a physical superstructure 210, as shown in Figure 4. The superstructure 210 allows for the pre-wiring and pre-piping of any required electrical sensors, controls, power, fluid control, pressure control, and / or communication systems. This enables faster and simpler field deployment and factory testing before delivery to the customer.

[0062] The superstructure 210 is typically constructed from metal components and may be skid-mounted or configured to be handled by a forklift, hoist, or crane. In some embodiments, the superstructure 210 is configured to fit into a standard container to facilitate shipping. The superstructure 210 and its associated components are configured to weigh less than approximately 58,000 lbs in total and may be divided into smaller components to facilitate shipping without requiring special equipment. In some embodiments, the superstructure 210 and its associated components weigh less than approximately 50,000 lbs, less than approximately 40,000 lbs, less than approximately 30,000 lbs, or less than approximately 20,000 lbs. In some embodiments, the superstructure 210 and its associated components weigh more than approximately 5,000 lbs, more than approximately 10,000 lbs, more than approximately 20,000 lbs, or more than approximately 30,000 lbs. Embodiments of the superstructure 210 can be of any size and / or shape. Many embodiments are large enough to include multiple pressure control vessels 110, server racks 310 and associated immersion cooling equipment, as well as equipment necessary for managing power transmission and distribution and network connectivity.

[0063] The overall design of the superstructure 210 can be adapted to the specific characteristics of each deployment, including customization to the type and the number of interconnections for power and treated water, to meet the needs of existing facilities.

[0064] Control and management systems for all components within the disclosed pressure control vessel may be included as part of the disclosed computing system. A preferred embodiment of the disclosed system includes all the mechanical systems necessary to maintain and operate a two-phase immersion cooling environment, including necessary pumps, valves, regulators, steam management systems, pressure management systems, and other related components.

[0065] The superstructure 210 may have an open frame design or may include side panels and access doors. This allows for deployment inside existing structures or outside of site conditions. The superstructure 210 may be modified to include a weather-resistant configuration, enabling deployment in harsh environments. In some embodiments, the superstructure may be a skid / modular framework.

[0066] Various systems, configurations, and / or capabilities may be included in the superstructure 210 to support, monitor, and manage any environment contained within or related to the pressure control vessel and other components of the pressure control vessel. In some embodiments, such systems may include, among many others, fire detection and / or suppression capabilities, dedicated air conditioning and / or environmental control capabilities, security configurations such as access control, and / or monitoring configurations.

[0067] Power system One embodiment of a superstructure 210 is designed to receive various means of electrical input and connect them to an existing power distribution system built within the superstructure. One of many exemplary embodiments includes a 415V input to a main breaker, which is then distributed to a series of power racks that convert the AC 415V input to a DC 12V output. In a preferred embodiment, this conversion is performed in substantially one conversion step, thereby reducing the efficiency loss that is usually associated with such conversions. A conventional computer server location typically converts incoming industrial power from a high AC voltage, such as 415V, to a reduced AC voltage, such as 120V. This conversion results in an energy-to-heat loss. Under typical conditions, this can be about 6% energy loss. The 120V voltage must then be further converted to DC current for use by various computer components. This second conversion results in a second energy-to-heat loss of about 6%. By directly converting the industrial voltage of about 415V to about DC 12V, the total energy-to-heat loss can be reduced.

[0068] Another exemplary embodiment includes connecting the AC480V input to a power rack that converts the AC480V input to a DC48V output, which is then distributed to a series of intermediate power supplies that convert the DC48V input to various DC outputs, including, for example, 12V, 5V, 3.5V, 3.3V, and others.

[0069] In one embodiment, there may be a single set of power supplies, or there may be multiple power supplies operating with different input and output voltages. The exact configuration is tailored to suit the needs of the specific equipment being installed and according to the application requirements. The specific design of the power system may be tailored to suit the needs of the specific environment in which the disclosed computing system is deployed. Customization may include the type, capacity, and interface of both the power inputs and outputs to the system.

[0070] In some embodiments, a rack power distribution system may comprise a modular power supply system and / or a set of modular power supply systems. The specific configuration of one or more modular power systems is not particularly important, as long as they can transmit the desired amount and type of power to the rack. Thus, the modular power systems may be configured in parallel, series, or a combination thereof to provide one, two, or even many distribution paths. The specific paths to the rack may be direct or indirect, often depending on the components involved, the amount and type of energy, and / or the desired configuration. If desired, the paths to the rack may involve power distribution to chassis located within the rack. The distributed power may be transmitted at one or more desired voltages, which may vary depending on the configuration and components. In some cases, the desired voltages may include, for example, 12V, 5V, and / or 3.5V. In some embodiments, if a chassis is employed, it may employ one or more subsystems. Such subsystems may include any desired subsystems that do not interfere with the desired amount and type of power transmitted to the rack. For example, power-on-package subsystems may be employed. Such packages can, depending on the requirements, receive AC current and convert it to DC current and / or vice versa. For example, a particularly useful power-on-package subsystem may be designed to receive input power at AC 208, 240, 380, 400, 415, 480 and / or 600 volts and convert that power directly to DC power, for example, DC 48V.

[0071] One or more modular power systems can be powered directly or indirectly in any appropriate manner. For example, a modular power system can be powered directly through a main power distribution system within a chassis. Depending on the type and amount of power and other components, the chassis may establish electrical continuity between the power distribution path and the chassis itself using an interface such as a set of spring-loaded pins or other suitable connector interface. The continuity can then be established between the interface connector and any desired power input interface on any desired server or other computing component located on the chassis. In some embodiments, power-on-package modules may be used within each chassis to directly convert the voltage to an appropriate level within the chassis itself. This can be used for various types of power distribution, but can be particularly useful, for example, for 48V power distribution. Figure 17 shows an exemplary embodiment of a rack power distribution system 950. In this exemplary embodiment, rack 310 can receive an AC input 960 at its AC interface 311. The power distribution system 950 can generate a DC output 320 and distribute the DC output 320 to one or more chassis 400.

[0072] In some embodiments, the primary concern is ensuring reliable power supply to computer components within a rack. To this end, some embodiments utilize blade-level or computer component-level power supplies that can supply specific input voltages to provide the required output voltages to the blade and / or component-level power supplies. In some embodiments, multiple power supplies are included in each blade to provide redundancy.

[0073] In some embodiments, one or more switches may require power. The exemplary switches may be standard data center-grade switches having appropriate interfaces that connect to a backplane and provide rack-level communication to each blade. In some embodiments, only one voltage is distributed, which can be achieved by a power rail and interface system having connectors that interface between the power rail and each blade, and transmitting voltage directly to the power input rail or via intermediate connectors located between the power lead and the rack-level voltage distribution system.

[0074] In one embodiment, there may be one or more power rails distributing the main voltage along the bottom of the racks. These rails are supplied from one or more main power rectifiers, often located outside the pressure control vessel, and transmitted to each rack via cables or a busbar system. Using a higher voltage at this level, for example 48 volts, reduces the current carrying capacity required by the power distribution system and allows for efficient interfacing between the distribution rails and the load interfaces.

[0075] In one embodiment, there are two main distribution systems located within the superstructure platform. The first main distribution system is a primary equipment power system (PEPS), and the second main distribution system is a secondary equipment power system (SEPS). The purpose of the PEPS is to provide electrical services to components within the container. This system may be a high-voltage, high-current distribution system that receives input via copper conductors or a busbar system and transmits it to a mains power supply, which is responsible for supplying operable current to the chassis, computer components, and / or other critical load equipment. Power enters the superstructure at a specified point and is transmitted to a master service disconnection breaker. All power redundant components used in the electrical services and system are located upstream of this point. This input is a high voltage, such as AC 415 or 480 volts. The main equipment loads are driven by a power supply or rectifier supplied from a breaker panel downstream of the master disconnection breaker.

[0076] The purpose of SEPS is to provide electrical services to all infrastructure support systems and components located within the superstructure. Since components required as part of the secondary equipment infrastructure may require lower input voltages, SEPS can be powered by a step-down converter connected upstream of the PEPS master service disconnection breaker via a secondary service disconnection.

[0077] This configuration allows the superstructure support and infrastructure system, including all components powered by the SEPS, to be turned on and operate even if the main power is not transmitted to the remaining system components. All aspects of the management and control systems and steam control systems may be able to operate independently of the operation of the PEPS.

[0078] In one embodiment, an uninterruptible power supply (UPS) is included as part of or in addition to the power distribution system. The inclusion of the UPS enables continuous operation of the disclosed computing system in the event of a temporary interruption to the external power supply.

[0079] The components of the power distribution system disclosed may include, but are not limited to, commercially available components such as uninterruptible power supplies, DC power systems, AC power systems, and / or power control and monitoring systems. Such components may include, but are not limited to, Vertiv products such as Liebert and / or Chloride UPS products, dual-conversion online UPSs, line-interactive UPSs, standby UPSs, lithium-ion battery UPSs, and combinations thereof. UPS products may be single-phase or three-phase. Other exemplary power distribution system components may include, for example, EmersonNetworkPower products, NetSureDC power systems, Vertiv, Liebert, Chloride, and / or NetSure distribution units, and related components such as inverters, rectifiers, transfer switches, and combinations thereof. Commercially available monitoring units, controller units, and / or software related to such components may also be included in certain embodiments of the disclosure.

[0080] Pressure control vessel and pressure control system Embodiments of the disclosed system include a pressure control vessel designed to house a two-phase immersion cooling system. The pressure control vessel 110 includes a tank 142 for a dielectric cooling fluid 140, a condenser 130 having a cooling coil 132 for condensing the gaseous dielectric fluid into a liquid, and physical mechanisms and / or equipment necessary for holding computer components 170 and for distributing power from the power system to the equipment and components within the pressure control vessel 110.

[0081] During operation, the pressure control vessel 110 can be maintained at a slight vacuum. It will be apparent that various specialized connections and considerations must be made to operate the computing system within the pressure control vessel 110, which is maintained at a negative pressure.

[0082] One embodiment of the system in the disclosure, in addition to distributing the fibers to the rack 310 by penetrating panels and cable trays, enables the connection of the fibers to the pressure control vessel 110 using a series of optical fiber media transfer protocol (MTP) interfaces. This arrangement reduces the total number of penetrations into the pressure control vessel 110, thereby reducing the possibility of leakage in the vessel.

[0083] One embodiment of the pressure control vessel 110 includes sensors to ensure safe operation. These sensors may include, but are not limited to, temperature sensors, fluid height sensors, pressure sensors 180, gas partial pressure sensors, position sensors, electrical sensors, microphones and / or cameras to ensure and / or automate the operation of the system.

[0084] In one exemplary embodiment, the temperature sensor may include, but is not limited to, a sensor for measuring the temperature of the gas phase in the pressure control vessel 110, a sensor for measuring the temperature of the liquid phase in the pressure control vessel, a sensor for measuring the temperature of water and / or other processing fluids, and / or a sensor for measuring the temperature of other components, including the computer component 170. In some embodiments, thermocouples, thermistors, and / or silicone sensors may be used to measure the temperature of the computer component. In some embodiments, the system may determine the instrument temperature by relying on information provided by the component itself and information obtained or monitored through the use of generally accepted communication protocols, such as an API provided by the device or an interface to other programs such as JSON via HTTPT or SNMP.

[0085] One embodiment may include various life safety configurations to ensure user safety. These configurations may include, but are not limited to, automatic electromagnetic locking mechanisms, fail-safe systems, fire and / or smoke detectors and / or suppression systems, ventilation systems, and / or backup lighting. In certain embodiments, these configurations may be included as part of an integrated platform.

[0086] Certain embodiments include an automated vapor detection leak detection system that ensures rapid detection of any fluid loss in the pressure control vessel. These systems may include a pressure sensor 180 inside the pressure control vessel 110 that monitors the pressure to confirm that there is no substantial leak, and / or a gas sensor located outside the pressure control vessel that detects the presence of any dielectric vapor that may have leaked from the pressure control vessel.

[0087] The specific design, arrangement, and / or layout of the embodiments of the disclosed system may be adjusted based on the conditions under which it is deployed. In some embodiments, the size, materials, internal systems, component implementation and configuration options, and the interfaces between the pressure control vessel 110, the computer components 170, and the power system may all be adjusted based on the conditions under which the system is used.

[0088] Rack system Figures 8A-8C show illustrative embodiments of the rack system 310 (or rack 310). The rack 310 can act as a relay between the electrical and communication systems installed in the pressure control vessel 110 and the computing equipment 170 installed in the rack 310. The computer components 170 may be mounted in the rack 310 to control the spacing, orientation, position and / or configuration of the computer components 170 in the pressure control vessel 110. In one illustrative embodiment, each computer component 170 may be installed in the chassis 400 before being installed in the pressure control vessel 110.

[0089] The rack 310 may be any physical structure that can be used to mount the computer components 170, including, but not limited to, frames, brackets, supports, or other structures. The computer components 170 are considered mounted in the rack 310 if they are directly or indirectly attached to the rack 310 and held in substantially fixed positions. One embodiment may include the use of a dedicated mechanical guide plate as a mounting mechanism, a wiring harness attached to a bulkhead fitting, and / or a relay power supply and backplane receiver 331 for distributing power and signals within the rack.

[0090] The specific design of the rack system 310 may be adjusted based on the conditions under which the system will be deployed. One embodiment of the rack 310 may include a dedicated switch. In one embodiment, the uplink interface may be connected via fiber infrastructure, and / or the downlink access interface may be connected to the computing equipment 170 in the rack via a backplane receiver 331 interface or any other suitable manner for connecting computing equipment.

[0091] In certain embodiments, the rack system 310 may include housings for one or more intermediate power supplies capable of distributing appropriate voltages from the power interface to other equipment installed within the rack 310. The interface interconnecting power from the distribution system to the intermediate power supplies may be included in the design of the rack 310 to allow it to be removed and / or replaced with an alternative rack configuration by disconnecting the interface between various rack, power, and communication systems.

[0092] Figure 8A shows a top view of rack 310. In this exemplary embodiment, rack 310 includes an AC interface 311 and a data interface 312. Rack 310 also includes a pair of power supplies, a power supply 313 and a redundant power supply 314 (or backup power supply). Rack 310 may also include a rectifier and a controller. The redundant power supply 314 (and / or rectifier and controller) allows rack 310 to be quickly repaired or to continue functioning even if the main power supply fails. Rack 310 may optionally include a converter 315. Rack 310 is configured to receive a plurality of chassis 400 and to hold the chassis 400 in substantially fixed positions.

[0093] In one embodiment, the entire rack 310 may be immersed in a dielectric fluid. This may include immersing the rectifier, power connections and / or data connections in the dielectric fluid in operation. In one embodiment, to reduce and / or eliminate plastic contamination of the dielectric fluid, plastic insulators and / or cable sheathing may be removed. In such an embodiment, the dielectric fluid may act to insulate cables and / or connections that would otherwise be exposed.

[0094] Figure 8B shows a perspective view of a rack 310 containing multiple chassis 400. The configuration of the rack disclosure facilitates the hot-swapping of the chassis 400. In this exemplary embodiment, the rack 310 may include multiple AC cables 318 connecting an AC interface 311 to a power supply 313 and / or redundant power supply 314. The power supply 313 and / or redundant power supply 314 can generate a DC output 320 that can be transmitted to a backplane receiver 331 via a DC cable 321. The rack 310 may also include multiple data cables 319 connecting a data interface 312 to a backplane receiver 331. The backplane receiver 331 may be used to supply data from a data connection on the bottom of the chassis 400 to a data connection on the top of the rack.

[0095] Figure 8C shows a side view of rack 310. In one embodiment, rack 310 provides mechanical stability and / or housing for the chassis 400 and its components. Furthermore, rack 310 facilitates the routing of power cables and data cables from the top of rack 310, where the cables are generally accessible within the enclosure, to the bottom of rack 310, where the cables connect to the chassis 400.

[0096] Chassis and interface system In one exemplary embodiment, the purpose of the disclosed chassis system 400 is to act as a standardized physical relay component between conventional and / or dedicated computing components 170 and the disclosed rack system 310. In one exemplary embodiment, the purpose of the backplane receiver 331 is to provide a slot-in interface between the chassis 400 and the rack 310 to enable the distribution of power and signals between power sources in a power system and network switches in a communications system, having various computing components 170 installed within the chassis 400.

[0097] In one embodiment, the pressure control vessel of the present disclosure may include at least one rack 310 which may contain one or more servers, for example, blade servers. Each server is mountable in a chassis 400 (also referred to as a server case or case). Figures 9A–G show exemplary embodiments of the chassis 400 for mounting various components 170. The chassis may facilitate the installation of servers onto the racks of the pressure control vessel or their removal from the system. In one embodiment, other electronic components of the pressure control vessel may be mounted in the chassis. For example, computer components or hardware such as a motherboard, chips, cards, or any part of a GPU or CPU may be mounted in the chassis. As another example, components such as a power supply, power interface or network communication interface may be mounted in the chassis.

[0098] In one exemplary embodiment, the chassis can act as a common interface between components (e.g., servers) and a pressure control vessel. The chassis can provide a variety of mount, power, and connectivity configurations that are customizable based on the nature or design of the components. In other words, various aspects of the chassis can be modified based on the design specifications of the components. Thus, the chassis can accommodate almost any model or type of hardware. For example, the chassis can facilitate the use of specifically designed or off-the-shelf hardware.

[0099] Embodiments of the chassis 400 may include components designed to allow the use of existing commercially available components, custom-designed components, and / or chassis specialized for specific applications. Embodiments may include fitting kits for standard motherboards and special components. In certain embodiments, such components include a Gigabyte motherboard with an NVidia GPU and / or an ultra-miniature motherboard with an Intel CPU.

[0100] Figure 9A shows a chassis 400 for mounting servers on a rack according to an exemplary embodiment. In this exemplary embodiment, the chassis 400 may be a rectangular box including a rear wall 410 and two side walls 420. The rear wall 410 may include a number of holes 411 to facilitate fluid circulation within the chassis 400. The chassis 400 may include guide rails 421 on each side wall 420.

[0101] Figure 9B shows several internal components of a chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the rear wall 410 is removed. Thus, Figure 9B shows a server 430 including a power supply module 431, a GPU module 432, a CPU module 433, and an interface card 434. In one exemplary embodiment, the internal components of the chassis 400 may include components used in a blade server, such as the CPU module 433 and the GPU module 432. Furthermore, the internal components of the chassis 400 may include other components not conventionally included in a server, such as the power supply module 431 or the interface card 434. Since the chassis 400 does not require conventional air cooling equipment, the chassis 400 does not include fans or heatsinks within the chassis. Thus, the chassis has a very low profile relative to the computing power of the chassis.

[0102] Figure 9C shows a schematic diagram of the components within the chassis. In this exemplary embodiment, a server motherboard 445, a number of power modules 431, and an interface card 434 are mounted in the chassis 400. Storage devices and / or other peripheral components may also be mounted in the chassis 400 together with the backplane interface 330 and / or power modules and communication system modules.

[0103] In one example, the mounting interface is attached to or detachable from the chassis so that one piece of hardware is fixed to the chassis. Measures may be made on the inner surface of the chassis 400 to allow components (e.g., motherboard, GPU, CPU, interface card, and other related components) to be mounted to the chassis. These measures are the mounting interfaces. The specific arrangement of the chassis system 400 will depend on the equipment and / or components to be mounted to the chassis 400 and / or rack. One embodiment of the chassis 400 may feature interchangeable mounting plates that can be used for mounting equipment. A set of standard mounting plates may be used for common or frequently used components.

[0104] The style and form elements of the power and network interface modules within the chassis system 400 can be adjusted based on the requirements and demands of specific components and / or user-specified equipment. In one example, the power subsystem of the chassis can be modified to accommodate the needs of a particular component. In another example, the size of the chassis can be designed to accommodate one piece of hardware of any size. In yet another example, the chassis can offer different networking options depending on the network connectivity card installed in the chassis. Due to these and other configurations of the chassis, the chassis can accommodate a variety of components. As a result, the assembly and removal of these components of the pressure control vessel can be simplified and therefore automated. For example, the chassis may include a blade server, and a robot can easily install or remove the chassis from the rack of the pressure control vessel. In this way, the robot can remove and replace the blade server without human intervention, thereby minimizing human exposure to dielectric fluids.

[0105] In one exemplary embodiment, the chassis may include a microcontroller capable of communicating with a management system for a pressure control vessel. The microcontroller can receive sensor data from various sensors located inside or outside the chassis. For example, the chassis may include a sensor for detecting whether the chassis is properly positioned in a rack. The server is appropriately positioned in the rack if it is capable of connecting to the rack. The sensor can determine whether the chassis is properly positioned in the rack. Thus, the sensor can transmit data to the microcontroller, which can then use that data to supply a signal to the management system indicating whether the chassis is properly positioned in the rack.

[0106] In one embodiment, a microcontroller may be coupled to a switch that can power on or off components mounted within the chassis. The microcontroller may receive power-on or power-off signals from a management system, and upon receiving such signals, it may transmit signals to a switch that powers on or off a component, such as a server. In one exemplary embodiment, the microcontroller may receive operable data from the server, and the microcontroller may relay this data to the management system. The operable data may be an indicator of the server's important performance and may demonstrate its capabilities. The operable data may include computation speed, computation degradation, power consumption, circuit temperature, and system bandwidth.

[0107] In one exemplary embodiment, a microcontroller can monitor, manage, and control the electrical and communication equipment of a blade server. For example, indicators such as current (i.e., amperes) and voltage are monitored to ensure that the system is self-protective, for example, that there are no measures in place for overcurrent or undercurrent.

[0108] In one exemplary embodiment, the chassis may include structures that allow a robot to grasp and remove the chassis. For example, the chassis may be in the shape of a rectangular box having a front wall, a rear wall, and side walls. The chassis may also include a top wall and a bottom wall. The top wall of the chassis may include a plate that can be coupled to a robot arm. Using this plate, the robot arm can grasp the plate for unloading and other handling operations.

[0109] In one exemplary embodiment, the chassis may include mechanical guide rails and positioning pins to ensure proper alignment and insertion of the chassis in the rack. The mechanical guide rails may be located on the side walls of the chassis.

[0110] In one exemplary embodiment, the chassis may include various configurations to facilitate fluid flow. For example, the chassis may be in the shape of a rectangular box having a front wall, a rear wall, and side walls. The chassis may also include a top wall and a bottom wall. In this example, at least one of the chassis walls may include fluid flow holes throughout the wall. For example, the rear wall may include a plurality of holes that can facilitate fluid flow into and out of the chassis when the chassis is immersed in a liquid tank.

[0111] In one exemplary embodiment, the chassis may include openings to ensure that all fluid within the chassis is drained when the chassis is removed from the fluid tank. For example, a rack may be located in a fluid tank that cools computer components held by the rack. To remove the server, a robot can grasp the chassis plates and lift the chassis from the rack (thus removing the chassis from the fluid tank). Once the chassis is removed from the fluid tank, a certain amount of fluid may remain within the chassis. The chassis may include notches or drains in the bottom wall of the chassis to ensure that fluid can be reliably evacuated even if the pressure control vessel is not perfectly horizontal. The notches or drains may be located at the corners of the bottom wall.

[0112] In one exemplary embodiment, the chassis may include a power interface and / or a communication interface. The interface can electrically couple components mounted within the chassis to the rack and / or pressure control vessel. The power interface and / or communication interface may be located on the backplane. For example, a server mounted within the chassis may be connected to the chassis interface via various wiring and cables. Once the chassis is placed in the rack, the interface becomes electrically coupleable to other interfaces connected to the rack (i.e., the backplane receiver) and / or the pressure control vessel. This electrical coupling between the two interfaces (i.e., the backplane and the backplane receiver) can supply power to the server and connect the server to a communication network inside or outside the pressure control vessel. This coupling between the two interfaces may occur automatically during the mechanical insertion of the chassis into the rack. Similarly, the rack and / or pressure control vessel can be disconnected from the server by removing the chassis from the rack.

[0113] In one embodiment, by providing standardized interoperability via the backplane interface 330 and the communication system interface, the possibility of misconnection of the data interface can be minimized, and the need for troubleshooting connections can be reduced.

[0114] In certain embodiments, the chassis 400 includes a set of standard power and network interfaces. The network interface may be in the form of a Cat6A or Cat7 compatible RJ45 interface for connection to a 1G or 10G Ethernet interface on the device's motherboard. In such embodiments, the power interface may include a set of standard Molex-style connectors for connection to a standard motherboard and / or peripheral device components.

[0115] In one exemplary embodiment, the pressure control vessel may include an internal database that stores information about the components installed in the system. The internal database can be a repository of the components installed in the pressure control vessel. For example, the internal database can store the configuration and model of each server and power supply installed in the system. Since the components of the system are replaced or substituted, for example by a robot, the management system can track changes and updates to the information stored in the internal database. The pressure control vessel may also be connected to an external database via a network.

[0116] In one exemplary embodiment, each chassis may be associated with a unique serial number, for example, displayed as a barcode on the chassis. When components are placed within the chassis, the specifications of the components (or the configuration and model of the components) can be stored in an external database in association with their unique serial numbers. Subsequently, when the chassis is installed in a pressure control vessel, the pressure control vessel can reference the components by searching for their unique serial numbers in the external database. For example, a robotic arm can scan a barcode on the chassis, and the management system can use the barcode to search the external database. The management system can update its internal database using the information obtained from the external database. Similarly, when the chassis is removed from the pressure control vessel, a robotic arm can scan a barcode associated with the chassis, and the management system can update its internal database to indicate that the components mounted on the chassis are no longer installed in the system.

[0117] In one exemplary embodiment, the chassis may include an RFID tag. The robotic arm of the pressure control vessel may include a scanner capable of detecting the RFID tag by emitting radio frequencies. While the robotic arm is handling the chassis, it can scan the RFID tag and provide a management system with a unique serial number to update an internal database.

[0118] In one exemplary embodiment, the chassis may include an identification plate which may contain a user-specific asset identification number. This asset identification number may be stored in association with components mounted within the chassis. In one embodiment, the identification plate may be a chip configured to store the asset identification number.

[0119] In one exemplary embodiment, the chassis may include a pump that enhances the flow of fluid within the chassis. To maximize heat exchange between components within the chassis and the fluid tank, the chassis may include a pump capable of circulating fluid within and around the components. The pump can draw fluid from various conduits extending around the chassis and push the fluid out of the chassis, or vice versa.

[0120] In one exemplary embodiment, the chassis may include various conduits around the chassis to dry the chassis and the components mounted thereon. When the chassis is withdrawn from the liquid tank, a predetermined amount of liquid may remain in the chassis or its components. The chassis may include various conduits that can guide a gas flow within or around the chassis to promote drying of the chassis and its components. In one exemplary embodiment, a pressure control vessel may expose the chassis to a gas flow before delivering the chassis to the user. For example, the chassis may include an input pipe for receiving the gas flow, and the pressure control vessel can supply the gas flow through the input pipe.

[0121] Figure 9D shows the bottom wall 415 of the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the bottom wall 415 may include a power interface 416 and a communication interface 417. Figure 9D also shows guide rails 421 on the side wall 420 of the chassis 400.

[0122] Figure 9E shows the upper wall 425 of the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the upper wall 425 may include a plate 426 and a pair of handles 427. A robotic arm can remove the chassis 400 using the plate 426.

[0123] Figure 9F shows a side wall 420 of the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the side wall 420 may include a guide rail 421. Figure 9F also shows a rear wall 410, a handle 427, and a power interface 416.

[0124] Figure 9G shows an exploded view of the bottom drain hole 450 of the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the bottom drain hole 450 can be located at the corners of the bottom wall 415, the side wall 420, and the rear wall 410.

[0125] Figures 10A–F illustrate exemplary embodiments of a pressure control vessel 500. In particular, Figure 10A shows an exemplary embodiment of the vessel 500, for example, a 600KW skid. The exemplary embodiment includes a modular skid. The vessel 500 may include a plurality of forklift tubes 514 to facilitate the movement and transport of the vessel 500 to a desired position. The vessel 500 can receive treated water from power and communication inputs 511 and treated water pipes 512 through minimal penetrations through the vessel itself. These connections may be located on the top of the vessel to facilitate the sealed packaging of the modular vessel in a data center. In some embodiments, the connections may be located on the front and / or sides of the vessel to accommodate vertically stacked loads of multiple modular vessels in a data center. In some embodiments, the vessel may have vertical spacers to facilitate the vertical stacking of the vessels on top of each other. The vertical space may form additional space for connections, airflow, and / or insulation between the vessels. By stacking the containers vertically, very high power densities can be achieved in square feet. In one embodiment, the container 500 may include a power and communications box configured to receive an input 511 and distribute power and network connectivity across the container 500. The container 500 may include a sealing lid 515 that can facilitate the addition of components to and / or the removal of components from the container 500.

[0126] Figure 10B shows another diagram of the container 500. In one embodiment, a stock of replacement components may be stored in the container 500 so that components can be replaced using a robotic system inside the container without opening the container. The robotic system may be operated using a gantry motor 516. In such an embodiment, if a component is damaged or requires repair, a replacement component may be installed in the system, and components that are damaged or removed even if not damaged may be stored in the cassette until the cassette is full. At that point, the cassette containing the removed components may be removed from the container, and a new cassette with new replacement components may be inserted into the container for future use. In one embodiment, the container of disclosure is about 15 feet long, about 7 feet wide, and about 10 feet high. In one embodiment, the system of disclosure provides 600 kW of computing power to be achieved in about 150 square feet.

[0127] In some embodiments, the vessel 500 may also include one or more bellows tanks 517. The bellows tanks 517 may be used to regulate the pressure within the vessel. Once the computing and / or cooling system of the disclosure is first activated, the expanded dielectric fluid may be directed to the bellows tanks so as not to escape into the environment and / or to avoid pressure buildup within the vessel. In some embodiments, the bellows tanks 517 may be large enough to hold about twice the volume of liquid dielectric fluid within the vessel.

[0128] Figure 10C shows a cross-sectional view of the vessel 500. The lower part of the vessel 500 may include racks 310 and / or chassis 400 containing computing components. A condenser coil 132 for cooling and condensing any dielectric vapor is located on the rack. Power may be distributed within the vessel using power busbars 518. This allows power to be distributed to individual computing components in a hot-swappable manner. The power busbars 518 allow the vessel to receive external power through one or a few penetrations. This design simplifies the installation and operation of the vessel system. In one embodiment, each power busbar can supply 600 amps as power to five racks. In such an embodiment, there may be two sets of busbars, one set on each side of the vessel. In one embodiment, the busbars do not contain plastic insulators. Plastic can be considered a contaminant of some dielectric fluids and will generally be avoided in one embodiment.

[0129] In one embodiment, the container 500 may contain a desiccant 519. In one embodiment, dielectric vapor may be condensed in such a manner that it is removed from the head space of the container 500, allowing any non-condensable components to be removed from the dielectric fluid. Water does not condense under the same conditions as many dielectric fluids. Thus, this system can be used to remove water contaminants from a dielectric fluid.

[0130] In one embodiment, the container 500 may include a fluid filter 520, a fluid pipe 521, and a fluid pump 522. In another embodiment, the dielectric fluid may be added to the container in such a manner that the liquid dielectric fluid overflows from the rack 310 into the reservoir area 523. The fluid can then be filtered using the fluid filter 520 and pumped distal to the container using the fluid pump 522 and the fluid pipe 521. The system circulates fresh filtered dielectric fluid through the container so that the dielectric fluid can be reused to cool the computing components.

[0131] Figure 10D shows a cross-sectional view of the container 500. In this embodiment, the water level of the liquid dielectric fluid can be maintained at a fluid height 524 that is higher than the height of the rack 310 and / or the computing components located therein. As a result, the rack 310 and / or the computing components will be immersed in the dielectric fluid. Saturated dielectric vapor may be present above the fluid height 524, for example, up to an intermediate height 525. In some embodiments, the saturated dielectric vapor is maintained up to an intermediate height 525, which may be about half the height of the condenser coil 132. In some embodiments, a head space that may contain low-density dielectric vapor exists above the saturated vapor.

[0132] In the exemplary embodiment shown in Figure 10D, the cooling coil 132 is located on the shelf area. In this way, the cooling coil 132 does not become an obstacle when the robot 526 places or removes the chassis 400. This placement of the cooling coil 132 simplifies the placement and removal of the chassis 400, thereby greatly benefiting the autonomous operation of the container.

[0133] Communication system Embodiments of the communication system of the disclosure are designed to provide standard Layer 1-3 connectivity and management interfaces for equipment located within or associated with the superstructure 210, pressure control vessel 110 and / or computing system of the disclosure.

[0134] In one embodiment, a series of MTP interfaces provides the ability to introduce multiple high-density multimode fiber connections into a pressure control vessel 110. Once incorporated into the pressure control vessel 110, the fiber connections can be divided into individual switch-level connections using a set of dedicated breakout cables, breakout interfaces, patch panels, and / or distribution patch panels to rack 310.

[0135] In one embodiment of the disclosed system, each rack 310 may include a port for a dedicated fiber patch panel interface to allow connection to a switch system installed therein via a short patch panel. In other embodiments, there may be a dedicated patch panel, or a set of patch panels extending from each switch system to an MTP distribution interface.

[0136] In one embodiment, the interface between the switch system and the chassis 400 may be via a backplane interface 330 and / or via some other mechanism which may or may not include the use of backplane connectors. In one embodiment, the intermediate rack-level switch system may be omitted. In such an embodiment, a set of centralized switches in the pressure control vessel 110 may be used to connect to various computing devices located therein.

[0137] A standard interface between the switch system and chassis 400 is provided using a patch panel mounted on rack 310, and the ports on the patch panel can be wired to the backplane system 330 with patch cables connecting to the appropriate ports on the switch system.

[0138] In one embodiment, there is a small (6U) rack rail area including a patch panel that interconnects communication system cabinets to MTP interfaces in each pressure control vessel 110, as well as a centralized communication system distribution switch that acts to interconnect switch systems to each other and / or to the outside world. In such an embodiment, the end user or customer may choose to install their own routing means within this space and provide therewith an external connection that will be a connection between the disclosed computing system and the outside world, or to make a fiber connection between the pressure control vessel 110 or higher structure 210 and an existing network environment.

[0139] The access, communication, and / or networking components used within the embodiment of the communication system environment may be standard equipment or user-specified. The rack 310 and backplane interface 330 system may include the ability to replace the switch system located within each rack 310 by removing the existing switch, replacing it with some standard switch (such as a 1U switch), and rewiring the desired interface to the backplane network interface panel.

[0140] In certain embodiments, products designed to interface directly with the backplane system 330 may be used. Such products may utilize direct electrical interfaces specifically designed to interconnect the patch panel system and / or switch ports of the chassis 400 via specialized dedicated internetworking interfaces, via commercially used protocols, or via specifications for the design of network-level interconnection interfaces.

[0141] In some embodiments, the connection between each blade or chassis and the switch may include multiple interfaces. One interface may be a standard switch port, which may be a standard port available on a commercially available switch. A common interface may be 1GBASE-T or 10GBASE-T utilizing a Cat6 or Cat7 stranded-to-copper connection between the switch and the host device. Another interface may be a switch-to-backplane relay device, which may consist of either a patch panel with standard patch cables running from the standard switch port to the front side of the patch panel and a set of hard-wiring connections from the back side of the patch panel to the signal interface of the signal backplane. Alternatively, this may consist of specialized cables and / or a standard RJ45 interface running from the switch port to the board to establish a connection between the standard switch port and the backplane. Yet another interface may be an interface system signal backplane that distributes signal paths from the standard switch port along a printed circuit board (PCB). One or more signal paths may be terminated at connectors on the PCB to which the signal backplane interface connects. Yet another interface may be a chassis signal backplane interface. This may be a connector located on the chassis itself, which mates with a connector on the interface system signal backplane. It serves as the interface between the interface system signal backplane and the chassis itself. Another interface could be a chassis network interface. This could be a standard patch interface that allows patch cables to be connected from the chassis network interface to RJ45 interfaces on servers mounted on the chassis.

[0142] robot systems One embodiment of the system in one disclosure demonstrates a promising method for addressing the need for hot-swappable components within a pressure control vessel 110. The need for the ability to remotely remove and replace a faulty component 170 can be addressed by a robot.

[0143] Certain embodiments of the disclosed system combination may include an internal robotic arm 230 and / or an external robotic arm 240. Some embodiments, such as those for cryptocurrency applications and / or certain high-performance computing environments, may require hot-swappable components. In other hyperscale GPU and CPU environments, this may be a fundamental requirement. Embodiments of the disclosed robotic system allow for the replacement of the chassis and / or other computer components without interrupting any other components. In some embodiments, a faulty card and / or component may be replaced and / or stored automatically and / or programmatically. This enables fully remote and autonomous operation of embodiments of the disclosed system for short and medium periods.

[0144] The mechanism of the internal robot arm 230 is located within the environment of the pressure control vessel 110. As shown in Figures 7A-D, in the exemplary embodiment, a removal sequence may be initiated if a card or component is not functioning properly. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. Once this sequence is complete, the internal airlock door 222 closes, the airlock pressure is equal to the ambient pressure, and the external airlock door 224 opens. Once the external door 224 is open, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot.

[0145] In some embodiments, the airlock 220 is purged with nitrogen, other inert gases, and / or non-condensable gases before being opened to the external environment. In some embodiments, this has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is coupled with a one-way valve internally, externally, or both. In embodiments where the airlock has a one-way valve both internally and externally, purging the airlock prevents cross-contamination of the internal atmosphere of the pressure control vessel 110 by the external environment and also prevents the loss of dielectric vapor.

[0146] When a card or component replacement sequence is initiated, the external robotic arm 240 removes the replacement component and / or chassis 400 from the storage slot and places the component in the airlock 220. Once completed, the outer airlock door 224 closes, the airlock pressure is equal to the internal pressure of the pressure control vessel 110, and the inner door 222 opens. Once the inner door 222 is open, the internal robotic arm 230 removes the chassis 400 from the airlock 220 and inserts it into the appropriate rack 310.

[0147] When combined with a remotely accessible management system, the internal and external robotic arms 230 and 240 enable remote operation and management of the data center environment. This reduces the need for human operators to be on standby and can reduce costs and / or downtime. In one embodiment, the external robotic arm 240 is mounted on a movable base, thereby enabling a single external robotic arm system to act as multiple embodiments of the computing system disclosed.

[0148] When integrated with custom development workflow management systems and virtualization technologies, the disclosed robotic systems enable the development of fully autonomous, self-healing data center solutions that can provide the highest level of system reliability.

[0149] In some embodiments, asset tags having a unique human- and / or machine-readable serial number and / or product batch code may be included in each computer component and / or chassis. In these embodiments, the asset tag may be a unique serial number. The tag may include a printed barcode or QR code and may enable automated part identification by embodiments of the robotic system of the disclosure. The tag code may be used in relation to a management software system that provides detailed component information with respect to inventory management and automation systems. The tag and any associated adhesive or other components are preferably made of a material compatible with dielectric fluids. The tag is preferably located on the chassis in a spot that becomes readable when the chassis is inserted into a rack. In some embodiments, secondary or additional tags may be located in other areas of the chassis to aid in the identification of components and / or inventory management.

[0150] Embodiments of the disclosed robotic system enable a process called "reinstallation," in which any individual chassis is temporarily removed and replaced. This is useful when it is determined during troubleshooting that a hard power cycle of a component is desired. Reinstallation is achieved by cutting off all power, temporarily waiting, and then reconnecting it.

[0151] In one embodiment, individual cards and / or chassis are allowed to be removed from the pressure control vessel through an airlock. In one embodiment, a robotic system removes the chassis from its slot in the rack, moves it to the airlock, and signals the completion of this task, allowing the airlock to open and the cards and / or chassis to be removed. In another embodiment, replacement components and / or chassis are allowed to be placed in a specific rack slot through the same airlock used for removal. In one embodiment, a robotic system removes the chassis from the airlock, places it in the appropriate rack slot, and signals the completion of this task.

[0152] Robots in the internal systems Embodiments of the disclosed system may include a “robot-internal” robotic system. In such embodiments, the pressure control vessel may be extended to accommodate a robotic arm operating within the vessel. The vessel may be positioned to accommodate the movement or transfer of computer components and / or chassis on a rack, including the operating computer components. It should be noted that the pressure control vessel may also be referred to as a tank, pod, and / or vacuum chamber. Alternatively, it should be noted that certain components of the pressure control vessel may be referred to as a tank or pod.

[0153] Figure 10E illustrates an embodiment of the system of the Disclosure having a gantry robot 526 configured to remove, replace and / or install computing components, for example, the chassis 400 of rack 310. In some embodiments, the gantry robot 526 may be configured to remove, replace and / or install DC rectifiers and / or other components of a power distribution system. It should be noted that some embodiments of the computer and power distribution components of the Disclosure may be designed to be hot-swappable and may include handles or other configurations to facilitate handling by the gantry robot 526. In some embodiments, the gantry robot 526 is positioned to move in both x and y directions and can descend in the z direction to remove and / or install replacement components. In some embodiments, the gantry robot 526 includes a gripping tool for gripping the chassis 400 and / or power supply, for example, the gripping tool can grip plate 426.

[0154] Figure 10E shows a top cross-sectional view of an exemplary embodiment of the tank of disclosure. In one embodiment, an array of racks 310 may be mounted on a chassis 400 and / or computing board. In one embodiment, each chassis 400 may utilize approximately 6 kW of power, and each rack 310 may contain 10 chassis. Thus, in an embodiment including 10 such racks 310, the container can utilize approximately 600 kW of power for computing. In one embodiment, additional racks 310 and / or magazines 527 and DC power rectifiers of the chassis 400 may be housed in the container 500, providing space for components used as replacement components and / or components removed from the container 500.

[0155] External system robots Figures 12A–E illustrate other embodiments of the container. In particular, Figure 12A illustrates an embodiment of the container 700 in which a gantry robot 526 is located outside the tank 710 housing the chassis 400 and / or computing components. In this embodiment, the tank 710 is smaller but needs to be opened more frequently for the external gantry robot 526 to access the chassis 400 and / or power supply inside the tank 710. Replacement equipment may also be stored and / or housed in a modular enclosure, such as a storage unit 716 located outside the tank 710. In one embodiment, the tank 710 may have multiple doors 711 so as to limit the exposure of the inside of the tank 710 when one door 711 is opened for the purpose of removing, installing and / or replacing components or the chassis 400. In such an embodiment, replacement components may be stored outside the tank 710 to avoid unnecessarily opening the tank.

[0156] Furthermore, the container 700 may include one or more transformers 712, power distribution panels 713, treated water pipes 512, and electrical chases 714. The container 700 may also include a programmable logic controller (PLC) cabinet 715 for monitoring and controlling the status of various devices within the container 700. The transformers 712, power distribution panels 713, treated water pipes 512, electrical chases 714, and PLC cabinet 715 may be located outside the tank 710.

[0157] Figure 12B shows a cross-sectional view of the vessel 700, in which the tank 710 is accessible to an external gantry robot 526. In this exemplary embodiment, the condenser coil 132, rack 310, and bellows 717 are located in the tank 710. Figure 12C shows a side view of the vessel 700, in which the external gantry robot and the tank 710 have multiple doors 711. In this exemplary embodiment, the tank 710 includes a fluid pump for removing fluid from the reservoir area and sending the fluid through a fluid pipe 521 to a fluid filter 520. The vessel 700 also includes a magazine 718 for storing replacement equipment. In this exemplary embodiment, the magazine 718 is located outside the tank 710. In some embodiments, spacers and / or ballast blocks 160 may be used to reduce the total volume of liquid dielectric fluid in the tank 710.

[0158] Figure 12D shows a rack 310 according to an exemplary embodiment. In one embodiment, the redundant power supply 314 may be located on the opposite side of the rack 310 rather than adjacent to the primary power supply 313. Furthermore, the power and / or data cables 318 and 319 may be routed to alternative configurations to adapt to the specific requirements of a particular deployment. In this exemplary embodiment, the backplane receiver 331 is located at the bottom of the rack 310.

[0159] Figure 12E shows an exemplary hinged door 711 that may be used in an alternative embodiment of the tank 710 of the disclosure. In some embodiments, a sliding door may be used instead of a hinged door to reduce or avoid induced currents in the dielectric vapor. Slowly sliding the door open results in less fluctuation of the dielectric vapor compared to swinging the hinged door open and generating mixed currents.

[0160] Management System The management system is a web interface between the users of the disclosed computing system and the computing system itself. Embodiments of the management system provide an operational display of the computing system and enable monitoring and management of various components, including the pressure control vessel 110, the robotic system, the communication system, the power system, and / or other systems and components. In one exemplary embodiment, the management system may be implemented in the PLC cabinet 715 of Figure 12A. In another exemplary embodiment, the management system may be implemented in the power and communication box 513 of Figure 10A. In each embodiment, the power management system can be implemented as a control device or other suitable device, such as a software program on a computer.

[0161] In certain embodiments, a set of data points accessible via a simple network management protocol may be made available to users of the management system to enable monitoring of key operating parameters via a third-party monitoring system. Full operation logs may be maintained, and charts may be provided for user updates of operating condition data.

[0162] Regular maintenance of system components may be scheduled and maintained through a management system. Users may be given regular reminders for this maintenance, and they may recognize it as being performed within the interface. All of this data may be retained as part of the operation log information for reviewing historical operations.

[0163] In one embodiment, the operational functions may be exposed via an API interface to enable remote programmatic monitoring and management of the computing system and associated components. A full set of operational monitoring and warning functions may be included to enable notification to the operator in the event of any problems.

[0164] A centralized server-based or hosted cloud-based management system can be provided to customers using multiple pressure control vessel computing systems. This provides operators with a single program-based, user-accessible interface for managing a group of pressure control vessel computing systems.

[0165] In one embodiment, a software-based interface module enables interoperability with computing platforms such as Microsoft System Center and VMware vCenter, as well as third-party management utilities. API interfaces provided by users and management systems enable full interoperability with the disclosed robotic system, enabling full remote and programmable autonomous operation and management of the disclosed computing platform.

[0166] In one embodiment, the control system enables the adjustment and control of operations including temperature, pressure, flow rate, and / or power management. In one embodiment, the user authentication system enables multiple unique users to be authenticated to the system. In one embodiment, the system includes a role-based and / or element-based authorization system. In such an embodiment, the administrator can configure multiple roles to which users are associated and / or apply specific authorizations to individual users outside of their role assignments.

[0167] In one embodiment, video management is included to give the user the ability to record and acquire video input from a camera that may be located inside the container and / or a superstructure. In one embodiment, the camera may acquire visible data that can be analyzed by a processor. In such an embodiment, the processor may utilize computer vision technology to control the operation of the container, robot and / or superstructure system in accordance with the acquired visible data.

[0168] In one embodiment, the control system and software may be configured to generate reports on the operation and status of the entire computing platform, individual subsystems, and / or components of the disclosed computing platform.

[0169] Example of a merger system It should be understood that the disclosed systems can be used individually or in combination. There are numerous embodiments of the merged computing system that can be adapted to various use cases.

[0170] One exemplary embodiment is the Crypto series, which is an ultra-high-density embodiment of the technology of the disclosure utilizing dedicated computing hardware, a rack 310 having guide plates and wiring harnesses designed for that hardware, a modified architecture of a communication system 360, and a 1MW pressure control vessel 110 and a power distribution system. Typical users of this embodiment are those who wish to perform cryptocurrency mining or other ultra-high power density processing using customized computing components, or manufacturers of computing components who wish to develop a full-area two-phase immersion cooling system including their own hardware.

[0171] Another exemplary embodiment is a GPU series, which is an embodiment of high-density GPU supercomputing of the technology of this disclosure. This embodiment utilizes the technology of a custom-made chassis 400, rack 310, and backplane interface 330 designed to include a Gigabyte motherboard and an NVidia GPU with NVidia NVLink technology to facilitate ultrafast GPU communication. Typical users of this technology include general-purpose parallel processing applications that can utilize GPU-based computing and memory capabilities, including graphics rendering, particle simulation, and general research activities.

[0172] Another exemplary embodiment is a CPU series, which is an embodiment of high-density CPU computing of the disclosed technology. This embodiment utilizes a high-end Supermicro-based motherboard, an Intel Xeon CPU, a high-speed network interface, high-speed memory, and semiconductor memory for local storage. Typical users of this technology include data centers, enterprises, and cloud / VPS hosting providers and service providers that utilize high-performance computing for their own internal applications or for what they provide to third-party customers and other organizations.

[0173] Further exemplary embodiments include the Edge series, which are scaled-down versions of the disclosed computing systems specifically designed for remote / on-site deployment or within or in conjunction with conventional business and data center environments. The embodiments are specialized for secure, weather-resistant environments with full remote monitoring and management capabilities. Target users of this technology include operators of on-site and distributed technologies, such as network operators and other organizations with distributed on-site infrastructure, as well as operators of existing facilities who wish to enhance their computing capabilities with minimal modifications to existing facilities or structures. The system can incorporate various extensions into external structures to simplify connectivity to systems of utility services, including electricity, water, and network connectivity.

[0174] Self-contained implementation One embodiment of the disclosure does not require an external water supply. Such an embodiment may include a closed-loop chiller for cooling water or other fluids that may be circulated through a condenser as described above. Using a closed-loop chiller instead of an external cooling water supply enables a substantially self-contained embodiment.

[0175] Figure 13 shows an exemplary self-contained vessel 750. The exemplary embodiment in Figure 13 utilizes a skid-mounted closed-loop chiller 719 for cooling water or other liquids used in a condenser within a pod or immersion tank 710. The use of a closed-loop chiller eliminates the need for an external cooling water supply, resulting in a self-contained data center solution that requires only an external power supply and network connection to be fully operational. The vessel 750 may also include bellows 717, a door 711, a gantry robot 526, a power distribution panel 713, a PLC cabinet 715, and a magazine 718.

[0176] In one embodiment, the closed-loop chiller 719 may be a skid-mounted closed-loop chiller enclosed within the outer housing of a modular pressure control vessel. In such an embodiment, heat is transferred from the computer components to the dielectric liquid in the tank 710. This process converts the dielectric liquid into dielectric vapor as described herein. The dielectric vapor rises within the tank 710 and is cooled by a condenser, which converts the dielectric vapor back into dielectric liquid. The heat transferred from the dielectric vapor to the condenser is then transferred from the condenser to the refrigerant or condensing fluid within the condenser, and then to the closed-loop chiller 719. In one embodiment, the chiller 719 removes heat from the refrigerant or condensing fluid using vapor compression, a compressor, an evaporator, a heat exchanger, or other closed-loop method for cooling the refrigerant or condensing fluid. The heat from the refrigerant or condensing fluid is ultimately dissipated via air cooling. In one embodiment, this becomes a self-contained, modular, air-cooled two-phase immersion computing system. The field of immersion cooling has generally taught the opposite of air cooling, especially air cooling of self-contained devices, so air cooling of any self-contained embodiment is surprising.

[0177] One embodiment of the disclosure may be provided in a space-saving installation-range form element. An exemplary embodiment comprises a single rack containing 10 blades or servers immersed in a dielectric liquid as described above. In one embodiment, each server can draw approximately 6 kW of power. Thus, approximately 60 kW of computer power is provided in a small installation range.

[0178] The exemplary embodiment shown in Figure 13 is contained within an installation area of ​​approximately 4 feet 2 inches deep, 8 feet 8.5 inches wide, and 8 feet 8 inches high. This exemplary embodiment includes approximately 60 kW of computer power and other operating components and systems and is contained within an area of ​​approximately 36.3 square feet. The operating components of the vessel may include, but are not limited to, tanks or pods containing dielectric fluids, condensers, power supplies, and data connections for the computer components. The vessel may also include sensors, control equipment, power cabinets, bellows 717, vacuum systems, fluid filters, purge systems, and / or other components. Some self-contained embodiments may include an outer housing. In some embodiments, the outer housing may enclose the vessel, provide structural support, be skid-mountable, ventilated, weather-resistant and / or water-resistant, and / or decorative. In some embodiments, the outer housing of a self-contained vessel may include radiator coils, fan grates, heat transfer components, and / or air-cooling components to facilitate the use of closed-loop chillers.

[0179] In one embodiment, the self-contained computing system provides computing power of at least approximately 1.5 kW, at least approximately 1.6 kW, at least approximately 1.65 kW, at least approximately 1.8 kW, at least approximately 2.0 kW, or at least approximately 3.0 kW per square foot. In another embodiment, the self-contained computing system provides computing power of up to approximately 1.5 kW, at least approximately 1.6 kW, at least approximately 1.65 kW, at least approximately 1.8 kW, at least approximately 2.0 kW, or at least approximately 3.0 kW per square foot. It should be seen that adjusting the height of the self-contained system allows for more or less computing power to be supplied within a given installation range.

[0180] It should be noted that the dimensions, components, arrangement, and configuration of the exemplary embodiments in the disclosure may be modified, added, and / or removed to generate a variety of potential embodiments in a variety of morphological elements.

[0181] In one embodiment, the self-contained computing system may include a robotic system such as a gantry robot 526 configured to remove, replace, and / or install, for example, blade servers, power supplies, or other components, such as a chassis 400. The self-contained system may include either an "internal robot" or an "external robot" of the system. In embodiments with a smaller installation range, a smaller magazine 718 of replacement components may be used. In one embodiment, the magazine 718 of replacement components may be mounted outside the tank 710 shown in Figure 13. In one embodiment, the tank 710, racks, computer components, power supplies, replacement magazine 718, and gantry robot 526 may be arranged such that the gantry robot 526 can remove, replace, and / or install components while moving substantially in only one direction. If the various components are arranged substantially linearly, the gantry robot 526 can move along a single axis to remove, replace, and / or install the desired component without moving in a second direction. It should be seen that, in addition to moving in a single linear direction, the gantry robot 526 may also be able to move components up and down.

[0182] By utilizing compact elements such as those shown in the embodiment in Figure 13, a self-contained 2PLIC system can be easily transported. The inclusion of a closed-loop chiller 719 allows the two-phase immersion cooling system to be used in remote conditions where access to a practical source of the water to be cooled is unavailable. Furthermore, the elimination of the need for external cooling water results in a self-contained computing system requiring only two external connections, one power supply, and one data connection in one embodiment.

[0183] In some embodiments, the computing system may be contained within an outer housing as shown in Figure 14. In some embodiments, components schematically identified and / or disclosed in Figure 13 may be contained within the outer housing. In some embodiments, the volume of the outer housing may be adapted based on assumed cooling requirements, closed-loop chiller configuration, and / or the environment in which the self-contained computing system is expected to be deployed.

[0184] Embodiments of the disclosed self-contained, self-healing, and miniature form elements can be used as standalone solutions that provide significant computing power in virtually any location or environment. In some applications, multiple miniature computing systems may be located near each other and / or linked together to form a cluster. In some embodiments, the outer housing is positioned to allow maintenance and / or service work to be performed with access to only one or two sides of the outer housing. This arrangement allows individual self-contained computing systems to be located at reduced or minimal distances from each other.

[0185] In one exemplary embodiment, a cluster of four exemplary self-contained computing systems may be strategically arranged to enable approximately 240 kW of self-contained computing power in an installation area of ​​approximately 140 square feet. In one embodiment, these units may be in a state of power and / or data communication with one another, thereby enabling the operation of a multi-unit cluster having only a single external power connection and a single data connection. In one embodiment, a data center may be established using multiple small computing systems or multiple clusters of such computing systems.

[0186] While some embodiments of the disclosure and / or the computing systems disclosed herein may be used in modern data centers and / or weather-controlled environments, some embodiments of the self-contained computing systems of the disclosure may be deployed in remote locations and / or harsh environmental conditions. In some embodiments, the outer housing may be weatherproof, waterproof, and / or otherwise configured to withstand prolonged exposure to harsh environments. Some embodiments of the disclosure enable the rapid deployment of large amounts of computing resources to remote or difficult-to-reach locations. Some self-contained embodiments may be configured to be operational at substantially any location with access to power and data connectivity. In some embodiments, an uninterruptible power supply and / or generator may be operably connected to the computing system to provide more reliable or always-on access to power.

[0187] A self-contained embodiment of a certain disclosure is designed to be stackable. A stackable embodiment may be low-profile. A particular embodiment may be approximately 5 feet 5 inches high, 5 feet 6 inches deep, and 9 feet wide. This would provide approximately 60 kW of computer power in a 42 square foot installation area. Such units may be stacked vertically to provide 120 kW of computer power in the same 42 square foot installation area.

[0188] Embodiments of the disclosed computing systems are stacked, and multiple stacks may be arranged adjacent to one another. This reduces the need for aisle space between individual computing systems, thereby enabling a higher overall power density within the data center.

[0189] In some embodiments, a self-contained computing system may be designed to be fully operational and maintainable with access to only one side of the system. Such embodiments may be advantageous because they facilitate the placement of self-contained systems in very close proximity to one another. Furthermore, in some self-contained embodiments, the entire immersion tank may be removed and / or replaced with access to only one side of the device. In certain embodiments, the tanks may be individually modular and / or skid-mounted.

[0190] In one embodiment, the self-contained computing system may be vertically oriented to take advantage of a smaller installation area. An embodiment of the vertically oriented design of the system in the disclosure can provide approximately 60 kW of computing power in an installation area of ​​approximately 22.9 square feet. As with other embodiments of the disclosure, several vertically oriented self-contained computing systems may be positioned in close proximity to one another. Also, as described in several other embodiments, some vertically oriented self-contained computing systems can be operated and maintained with access to only one side of the device. In one embodiment, the entire tank can be removed from the outer housing and replaced. This arrangement allows for the rapid replacement of multiple blade servers and / or other computing components.

[0191] Mobile Implementation A self-contained computing system that does not require an external cooling water source enables novel computing applications. In one embodiment, power is supplied to the system using a generator, eliminating the need to connect the system to an external and / or fixed power source. In another embodiment, the system may rely on wireless data communication.

[0192] In certain self-contained embodiments that do not rely on fixed power sources or wired data communications, fully mobile computing systems can be realized. Embodiments of the disclosure include vehicle-mounted self-contained computing systems that can be used to provide large amounts of computing power in virtually any environment. In one embodiment, a truck-mounted wireless computing system can be driven within the wireless range of an existing or temporary network and provide large amounts of computing power with virtually no setup or installation time.

[0193] Embodiment of natural water In some embodiments, the computing system may be configured for use on a boat, ship, oil drilling equipment, floating platform, or other container or structure located in close proximity to a body of water. In such embodiments, the condenser used to convert dielectric vapor back into a dielectric fluid, as described herein, may be cooled using water from the body of water. In one exemplary embodiment, the modular computing system may include an intake, an outlet, and a pump or impeller. The pump and / or impeller can carry water from the body of water through the condenser and back into the body of water. In some embodiments, the condenser, piping, and other computing system components may include filters and / or treatment components designed to protect the condenser, piping, and other computing system components from sources of contamination in the body of water. In some embodiments, the condenser and other components are configured to withstand prolonged contact with brackish or saltwater, such as seawater, for example.

[0194] Horizontal magazine swap In one embodiment, a magazine of replacement components may be housed outside the tank within the outer housing of the computing system. For example, replacement components such as chassis, servers, blades, and / or power components may be removed from the magazine and used to replace components in the tank. The magazine may be located on a platform configured to protrude from the outer housing of the computing system to allow components to be replaced from the magazine.

[0195] In a non-limiting example, if a blade server in a tank is not functioning properly, a robotic arm could be used to remove the non-functioning component from the tank and move it to a storage slot in the magazine. The robotic arm could then remove a working blade server from the magazine and install it in the location where the non-functioning server was previously located, thereby replacing the non-functioning server with a new, working one.

[0196] Over time, the magazine stores non-operational components that can be replaced with new operational components to ensure the robotic system can continue operating for extended periods. In some embodiments, the magazine may be located on a platform that can extend outside the outer housing, thereby allowing an operator to access the magazine. In some embodiments, the platform is configured to rotate the magazine from a substantially vertical to a substantially horizontal position to allow components to slide in or out of the magazine.

[0197] In one embodiment, a cart with adjustable height may be used to move, load, and / or receive components such that a human operator does not need to lift or support the weight of the components while removing or replacing them from the magazine. It should be seen that a magazine configured to rotate to a substantially horizontal position can also facilitate the loading of functional components into the magazine and the removal of non-functional components.

[0198] Figures 15A–D show an exemplary magazine 810 located on a platform 820 that can extend outward from the container. In Figure 15A, the magazine 810 may be connected to a platform including a rotating member 821, a support member 822, and a rail 823. In one embodiment, the support member 822 may be connected to a rail 823 that allows the support member 822 to move while supporting the weight of the magazine 810 and any servers or other components housed within the magazine. In the exemplary embodiment of Figure 15A, the platform 820 is in the extended position.

[0199] As shown in Figure 15B, during normal operation, the support member 822 can be retracted relative to the outer housing of the computing system. The magazine 810 can be stored on the rail 823 during normal operation. In one embodiment, the weight of the magazine 810 is supported by the support member 822 and the rail 823 regardless of the position of the support member 822 on the rail 823.

[0200] In some embodiments, computer components such as servers used in the disclosed embodiments may be denser and / or heavier than conventional computer components. In some embodiments, due to the increased cooling capacity of the disclosed embodiments, the weight of the blade server may be at least about 50 lbs, at least about 60 lbs, at least about 70 lbs, at least about 80 lbs, at least about 90 lbs, or at least about 100 lbs. In some embodiments, the weight of the blade server may be up to about 50 lbs, up to about 60 lbs, up to about 70 lbs, up to about 80 lbs, up to about 90 lbs, or up to about 100 lbs. As shown in Figure 15B, the magazine 810 can hold multiple chassis 400 or blade servers, and the weight of an individual blade server may be about 73 lbs. When three such servers are loaded into the magazine, the total weight of the magazine 810 and the servers may be about 395 lbs.

[0201] In one embodiment, the server used is a blade server mounted on a chassis. The server and / or chassis may include a backplane system that facilitates the installation and removal of the server in the computing system. In one embodiment, the server may be an immersion server that does not include fans or other air cooling devices. In one embodiment, an individual server board may have 16 GPUs and be configured to draw approximately 6 kW of power. In one embodiment, the server is a 1.5U server. In one disclosure, the server may be a 1 otto immersion unit (OIU) server. Such a server is 1.5U tall and configured for immersion cooling. In one embodiment, a single tank in the computing system may be configured to power 10 1OIU servers, resulting in approximately 60 kW of power when all 10 servers are operating at substantially full power. In one embodiment, the computing system may comprise one or two such tanks. In one embodiment, the computing system may comprise multiple tanks, such as 10 such tanks.

[0202] In one embodiment, as shown in Figure 15A, when the magazine is removed from the computing system, the support member moves along the rail from its storage position and is cantilevered outside the outer housing of the computing system.

[0203] As shown in Figures 15C-D, the magazine may be cantilevered outside the computing system, either pulled out or slid along a rail if not pulled out. In some embodiments, as shown in Figures 15C-D, a magazine removal tool may be used to remove the entire magazine and the components contained within it. In such embodiments, the magazine removal tool may be used to lift the magazine from the support member and slide it along the rail for transport.

[0204] In one embodiment, when the magazine is moved outside the computing system, the platform can rotate the magazine to a nearly horizontal position. The servers contained within the magazine can then slide out of the magazine.

[0205] Figures 15A–D illustrate an exemplary sequence of steps for removing a server from a magazine according to an exemplary embodiment. In the exemplary embodiment, the magazine may be mounted on a linear guide rail system behind an access door. As shown in Figures 15C–D, the magazine may be pulled out and cantilevered outside the computing system. The magazine may be pulled out manually or moved outside the computing system using a powered or automated system. As shown in Figure 15D, the magazine may be rotated about 90 degrees so that the server and / or other components contained in the magazine are in a substantially horizontal position. Once in a substantially horizontal position, the server and / or other components can slide out of the magazine and onto a cart or other tool configured to receive the server and / or other components. As shown in Figure 15C, a scissor lift cart may be adjusted to an appropriate height to receive the server or other components. A cart with a height adjustable by a rotating surface may be used to allow the server to be transferred from the magazine onto the cart without requiring a human operator to support the weight of the server. As shown in Figure 15D, once the server is slid onto a cart with a grinding or rotating surface, the server or other components are transported to another location for replacement or repair. It should be observed that new components can be loaded into the magazine using substantially the same steps in reverse order.

[0206] In one alternative embodiment, the magazine may be supported on a rotatable and extendable arm without rails. In such an embodiment, the magazine may be stored in a substantially vertical position within the outer housing of the computing system during normal operation. When it is determined that components within the magazine should be replaced, the magazine may be extended outside the outer housing using the extendable arm. Once the magazine is extended beyond the outer housing, it may be rotated from a substantially vertical position to a substantially horizontal position to allow the components stored within the magazine to be removed horizontally from the magazine.

[0207] Bellows In some embodiments, bellows and / or a vapor collection system may be utilized. Before an embodiment of a certain disclosure is first activated, the dielectric fluid, computer components such as servers, and other system components may be brought to thermal equilibrium. When the computing system is activated, the computer components such as servers begin to generate heat that can be dissipated into the dielectric fluid. This process causes a portion of the dielectric fluid to transition from a liquid state to a vapor state. As the temperature of the fluid rises, more of the dielectric fluid may transition to a vapor state. In a closed system, an increase in the volume of dielectric vapor results in an increase in pressure within the system. In some embodiments, a tank containing the dielectric fluid may be in a fluid and / or vapor flow state with a collection system.

[0208] Figure 16 shows a steam recovery system 900 according to an exemplary embodiment. The recovery system 900 is connected to a tank 710 containing dielectric steam. The dielectric steam flows from the tank 710 through piping to one or more bellows 905. In one embodiment, the steam recovery system 900 includes an expandable / contractable bellows 905 configured to receive the dielectric steam, thereby reducing or eliminating any increased pressure in the tank 710. Once the system has cooled or the portion of the dielectric steam has condensed into a dielectric liquid, the bellows can be folded or contracted to substantially maintain pressure equilibrium within the tank 710.

[0209] In one embodiment, the steam recovery system 900 includes a valve 912 configured to introduce air into the steam recovery system. In such an embodiment, dielectric steam can be mixed with the air. Mixing the dielectric steam with the air can lower the temperature of the dielectric steam. In one embodiment, the mixed air / steam may be directed through a carbon bed 911. The carbon medium in the carbon bed 911 may be configured to attract dielectric steam while allowing air to pass through the carbon medium and be ventilated from the system 900, for example, through an outlet valve 913. In such an embodiment, the heated dielectric steam can be cooled and captured by the carbon medium.

[0210] After operating for a sufficient period of time, the embodiment of the computing system reaches a stable thermal state based on the power capacity utilized by the computing components. If more or less computing power is utilized, more or less dielectric fluid may transition to dielectric vapor. As a result, the bellows 905 may expand and / or contract in response to the heat dissipated by the dielectric fluid.

[0211] In some embodiments, the bellows 905 may comprise one or more pouches. Each pouch may comprise a metal foil and polymer laminate structure. The bellows pouches may extend to the steam recovery system piping and be connected in series or in parallel with each other. In some embodiments, the total volume of the expanded bellows pouches may be at least about 15% of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches may be at least about 20%, at least about 23%, or at least about 25%, or more, of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches may be up to about 40%, up to about 30%, or up to about 25%, or less, of the liquid fluid volume of the tank.

[0212] In one embodiment, once the computing system has substantially reached thermal stability, the steam recovery system 900 may be closed to the cooling atmosphere, and a valve that allows air to be discharged from the system may be closed. In one embodiment, the carbon bed may be configured to be open only to the tank and bellows using a valve. In one embodiment, a desorption heater configured to circulate heat through the carbon medium may be operated to raise the temperature of the carbon medium. As the temperature of the carbon medium rises, any dielectric fluid previously captured by the carbon medium will be drawn away from the carbon and returned to the tank, where it may condense back into a dielectric fluid as described above.

[0213] In one embodiment, if the computing system is powered below its previous stable state, the portion of the dielectric fluid in vapor state may decrease, and in one embodiment, the bellows may contract to regulate the decrease in dielectric vapor. In one embodiment, a valve that allows air to be introduced into the bellows may be opened to allow air to be introduced into the bellows to further reduce the pressure difference. In one embodiment, nitrogen instead of air may be used to reduce the pressure difference and also avoid introducing potential pollution from the atmosphere.

[0214] In some embodiments, the bellows and / or steam recovery system may be entirely or substantially passive. In some embodiments, the bellows and / or steam recovery system may be powered and / or automated based on sensor data from temperature, pressure and / or power sensors positioned throughout the computing system.

[0215] In one embodiment, a computing system having a steam recovery system is emission-free even if the system is not a closed system. In one embodiment, air or nitrogen can be introduced into the system and discharged from the system with little or no release of dielectric fluid into the ambient atmosphere.

[0216] Exemplary Embodiments Embodiments of disclosure enable increased density of computer components and / or computing power. In one embodiment, comprising two-phase immersion-cooled computer components 170 within a pressure control vessel 110, the components may be spaced only about 1 inch, about 0.7 inches, or about 0.5 inches apart from each other. In another embodiment, individual components may be spaced more than about 0.3 inches, about 0.5 inches, about 0.7 inches, about 1 inch, or about 1.5 inches apart.

[0217] One embodiment of the disclosure enables improved power usage efficiency (PUE) compared to conventional data centers. By using the embodiment of the disclosure, it is possible to reduce the energy used to cool the computer components 170, thereby reducing the total energy usage of the data center and bringing the PUE closer to 1.0. One embodiment relates to a data center having two-phase immersion-cooled computer components in a pressure control vessel 110, where the data center has a PUE of less than approximately 1.15, less than approximately 1.10, less than approximately 1.08, or less than approximately 1.05. Another embodiment relates to a data center having two-phase immersion-cooled computer components in a pressure control vessel 110, where the data center has a PUE of greater than approximately 1.05, greater than approximately 1.06, greater than approximately 1.08, or greater than approximately 1.10.

[0218] In one embodiment, a heat-conductive, condensable dielectric fluid is provided for use in a two-phase immersion cooling system. The computer components operate at sub-atmospheric pressure, which lowers the vaporization temperature of the dielectric fluid, thereby maintaining a lower temperature in the liquid phase of the dielectric fluid compared to standard atmospheric pressure. The computer components generate heat as they operate. The generated heat is transferred to the dielectric liquid in contact with the computer components, causing the dielectric liquid to vaporize into a gas. The gaseous dielectric fluid can be condensed using a condenser. Ambient temperature or cooled treated water is passed through the condenser. As the gaseous dielectric fluid is cooled by the condenser, it condenses back into the liquid phase and descends back into the tank of liquid dielectric fluid.

[0219] One embodiment of the disclosure relates to a high-density data center. A conventional data center includes about 1 megawatt (MW) of computing power distributed over about 10,000 square feet. A high-end data center may include 1 MW of computing power distributed over about 6,000 square feet. The embodiment of the disclosure relates to a data center comprising two-phase immersion-cooled computer components 170 in a pressure control vessel 110, where the data center utilizes about 1 MW of computing power distributed over about 3,000 square feet, about 1,500 square feet, about 1,000 square feet, about 800 square feet, or about 600 square feet. In one embodiment, multiple pressure control vessels containing the computing system of the disclosure may be arranged in a row and powered by a central power supply. In one embodiment, multiple embodiments of the computing system of the disclosure may be connected in series with one another.

[0220] Embodiments of the disclosure include a computer component 170 that is immersion-cooled within a pressure control vessel 110, thereby isolating the component from air pollution by the pressure control vessel and by immersion in a dielectric liquid 140. Embodiments of the disclosure relate to a data center that operates with minimal air filtration and / or cleaning requirements. In some embodiments, the data center operates without a HEPA filter or equivalent, without a MERV11 filter or equivalent, or without a MERV8 filter or equivalent.

[0221] Embodiments of the disclosure include a computer component 170 that is immersion-cooled within a pressure control vessel 110, thereby preventing the component from being cooled by gaseous air. Embodiments of the disclosure include a data center that operates without cooling fans and / or other similar devices for circulating air.

[0222] Embodiments of the disclosure relate to environmentally friendly data centers. In one embodiment, the data center comprises computer components 170 that are immersion-cooled within a pressure control vessel 110, consuming little to no water for the cooling process. In another embodiment, a closed-circuit dry cooling tower is used to cool a condensing structure 130 to condense dielectric fluid vapor into dielectric fluid liquid, thereby lowering the temperature of water circulating through the condensing structure 130 of the disclosure. Such embodiments operate as a closed loop without large amounts of water being added or discharged, and the dry cooling tower does not rely on water flow for evaporative cooling or cooling operations. One embodiment of the data center utilizes and / or discharges less than approximately 10,000 gallons of water per day, less than approximately 1,000 gallons of water per day, less than approximately 100 gallons of water per day, less than approximately 10 gallons of water per day, and 0 gallons of water per day. One embodiment of a data center utilizes and / or discharges more than approximately 100 gallons of water per day, more than approximately 1,000 gallons of water per day, and more than approximately 10,000 gallons of water per day.

[0223] Embodiments of the disclosure relate to a computing system comprising: a pressure control vessel operably connected to a pressure controller and / or vacuum source, having an interior and an exterior, configured to contain an atmosphere inside; a predetermined volume of a thermally conductive, condensable dielectric fluid; a rack for mounting computer components, the rack being positioned such that when the computer components are mounted on the rack, they are at least partially immersed in the predetermined volume of the thermally conductive, condensable dielectric fluid; and a condensing structure, wherein the predetermined volume of the thermally conductive, condensable dielectric fluid, the rack, the computer components, and the condensing structure are contained within the pressure control vessel. One embodiment relates to a cooling system comprising: a pressure control vessel having an interior, configured to be operably connected to a pressure controller for reducing the internal pressure to below atmospheric pressure, and configured to contain a predetermined volume of a thermally conductive, condensable dielectric fluid in liquid and gas phases; one or more computer components being positioned such that one or more computer components can be at least partially immersed in the liquid phase of a predetermined volume of the thermally conductive, condensable dielectric fluid; and a condenser for condensing the gas phase dielectric fluid into a liquid phase dielectric fluid.

[0224] In one embodiment, the pressure control vessel is mounted within a superstructure, the blade servers are configured to be swappable without interrupting the computing system, the pressure control vessel is operably connected to a power source, a water source and networking connections, the pressure control vessel has a top opening and a lid configured to seal the opening, the lid is configured to direct rising steam from the middle of the pressure control vessel to the sides of the pressure control vessel, the pressure control vessel has an internal volume between approximately 100 cubic feet and approximately 300 cubic feet, and / or the pressure control vessel contains a liquid dielectric fluid in a ratio between approximately 1:3 and approximately 1:8 to a gaseous dielectric fluid. In one embodiment, the system further comprises a ballast block, blade servers and blade server chassis, a robotic arm and an airlock, the robotic arm and airlock configured to allow access to the interior of the pressure control vessel without significantly disturbing the atmosphere inside the pressure control vessel, and / or a purge system configured to remove contaminants from a predetermined volume of thermally conductive dielectric fluid. In one embodiment, the purge system is configured to remove a portion of the atmosphere from a pressure control vessel, condense any dielectric fluid from the atmosphere, and discard any remaining vapor. In another embodiment, the purge system is configured to condense at least a portion of a gaseous dielectric fluid and discard gaseous contaminants.

[0225] One embodiment relates to a method for cooling computer components, the method comprising the steps of: providing a housing which includes a thermally conductive, condensable dielectric fluid and a heat-generating computer component, and the housing is configured to withstand at least a small vacuum; operating the computer component, the operating step of which generates heat and the computer component is in contact with the dielectric fluid; and creating a vacuum within the housing such that the pressure within the housing is at least less than about 1 atmosphere. Another embodiment further comprises the steps of: maintaining a vacuum within the housing such that the pressure within the housing is less than about 1 atmosphere while the computer component is operating; vaporizing the dielectric fluid from a liquid state to a gaseous state using the heat generated by the computer component; condensing the dielectric fluid from a gaseous state to a liquid state using a condenser; and removing any fluid from the dielectric fluid that is not immediately condensable. In another embodiment, a part of the computer component is replaced during and / or operation of the system. In certain embodiments, the step of removing a non-condensable fluid comprises the steps of isolating a portion of the gaseous atmosphere from inside the housing, condensing any dielectric fluid from the gaseous atmosphere, returning the condensed dielectric fluid to the housing, and discarding any remaining portion of the gaseous atmosphere, and / or configuring the housing to generate convection.

[0226] One embodiment relates to a method for cooling computer components, comprising the step of operating the computer components in contact with a thermally conductive dielectric fluid at a pressure below atmospheric pressure. Another embodiment further comprises the steps of vaporizing the dielectric fluid and condensing the dielectric fluid at a pressure below atmospheric pressure.

[0227] One embodiment relates to a method for cooling computer components, comprising the steps of supplying a thermally conductive, condensable dielectric fluid in liquid and gas phases, and operating a computer component, at least partially in contact with the liquid phase of the thermally conductive, condensable dielectric fluid, at a pressure below atmospheric pressure in the presence of the thermally conductive, condensable dielectric fluid. Another embodiment further comprises the steps of vaporizing the dielectric fluid from the liquid phase to the gas phase using at least a portion of the heat generated by operating the computer components, condensing at least a portion of the dielectric fluid from the gas phase to the liquid phase, removing at least a portion of the fluid that is not immediately condensable from the dielectric fluid, and / or replacing at least one computer component while the computer components are operating.

[0228] One embodiment relates to a method for cooling computer components, the method comprising the step of operating the computer components at a pressure below atmospheric pressure of at least 1 psi, wherein the computer components are at least partially in contact with a thermally conductive dielectric fluid, the boiling point of which is below approximately 80°C. Another embodiment further comprises the step of condensing the dielectric fluid under conditions such that the computer components do not exceed approximately 80°C.

[0229] It should be understood that various embodiments of the disclosure may include some or all of the components not described herein. Specific components and their characteristics may be adapted based on the characteristics of each specific embodiment. Modifications may include the use of higher or lower density power, cooling and network connectivity systems, pressure management systems, steam management systems, and the selection of specialized equipment and components.

[0230] From the above description, those skilled in the art will readily be able to identify the essential features of this disclosure and make various changes and modifications to adapt it to various uses and conditions without departing from its spirit and scope. The embodiments described above are illustrative and should not be construed as limiting the scope of this disclosure.

[0231] Heating and cooling of the tank in response to impact events. In one exemplary embodiment, the immersion cooling system or container may include a tank, a computing device, a robot, an absorption unit, bellows, and a management system. The tank may be a pressure-controlled tank maintained at (or within) atmospheric pressure. The tank may include a tank area and a reservoir area, and the computing device may be immersed in a dielectric fluid within the tank area of ​​the tank. While immersed in the dielectric fluid, the computing device can be connected to a network and perform various processing tasks. The tank may include a lid that provides access to the tank area, the computing device, and the reservoir area. The tank may be fluidically coupled to bellows and an absorption unit, and a plurality of valves may selectively connect or disconnect the tank from the bellows and / or absorption unit to allow dielectric vapor to be transferred to or from the bellows and / or the absorption unit. The robot may be a gantry robot that can lift the computing device from the tank of the container when the tank lid is open. The robot may place the lifted computing device in a magazine provided for storing computing devices. The robot may also lift the computing device from the magazine and place it in place of the computing device lifted from the tank.

[0232] In one exemplary embodiment, the tank may include a heating element, for example, a plurality of heating rods, some of which are at least partially immersed in a dielectric fluid. The tank may include a plurality of sensors, for example, temperature sensors, pressure sensors, or sensors that provide operational data related to a computing device (e.g., current, voltage, workload, etc.). The temperature sensor may be located within or above the tank. The container management system can use the data received from the sensors to operate the heating element to adjust or control the temperature or temperature fluctuations of the dielectric fluid in the tank (and / or the pressure or pressure fluctuations of the dielectric vapor). Figure 18 shows an example of a heating element 1000 for an immersion cooling system according to an exemplary embodiment. The heating element 1000 may include a plurality of heating rods 1010. Each heating rod may include a plurality of wires 1011 that can be connected to the tank's power supply. The tank controller can adjust the heating element 1000 to heat a tank area of ​​the tank, for example, during various operations of the tank. In this exemplary embodiment, the heating element 1000 may be mounted within the tank and fully immersed in the dielectric fluid.

[0233] In one exemplary embodiment, the heating element is isolated from the computing device and does not process data. The heating element may be specialized solely for generating heat and not for any other function. The heating element can be easily controlled, in particular, during tank operation (e.g., startup), component changes, or other times when control is required. The heat generated by the heating element may be adjustable depending on the size of the bellows and other aspects of the system, such as evaluating data indicating pressure or temperature.

[0234] In particular, rapid changes in the power consumption or workload of computing devices (e.g., caused by end-user activity or lack thereof) can result in rapid changes in the amount of heat generated by the computing devices within the container. This, in turn, causes rapid temperature changes within the tank or vessel, which can result in sudden changes in the tank's pressure (since in a closed, insulated system, pressure and temperature are directly related, i.e., PV=nRT). These pressure fluctuations can damage the container and introduce contaminated gases (e.g., air) or particulate matter (e.g., dust) into the tank. These pressure fluctuations can also cause leakage of dielectric fluids from the tank. To address the effects of these pressure fluctuations, bellows or absorption units can be used to remove excess steam from the tank or introduce steam into the tank when the pressure drops. On the other hand, the use of heating elements can reduce the capacity of bellows and absorption units, thereby enabling the design of more space-efficient containers. If heating elements are not used, the bellows will rupture if there is an excessive increase in pressure.

[0235] A heating element allows for modulation of temperature changes within a tank or vessel, thereby facilitating control transitions between various operating load states that a computing device may experience during its operation. For example, if there is a rapid decrease in the operating workload of a computing device, the heat generated by the computing device may decrease rapidly. This can cause a sudden decrease in the internal pressure of the tank. A heating element can add heat to the tank, allowing for a controlled decrease in the temperature of the dielectric fluid, for example, during a shutdown process. In other words, a heating element can equilibrium the pressure and temperature of the tank in the event of a sudden change in the workload of the computing device, i.e., a shock event. Therefore, the container requires much smaller bellows and absorption units to maintain the atmospheric pressure of the tank.

[0236] In one exemplary embodiment, a container control system can determine how much heat to add to a tank in response to an impact event, such as an increase or decrease in the tank's internal pressure or temperature. In another exemplary embodiment, the rate of decrease (or increase) in temperature or pressure can determine how much heat to add to the tank. For example, if the dielectric fluid temperature level in the tank falls below a predetermined degree over a predetermined number of minutes, the control system can activate a heating element to add a predetermined amount of heat to the tank (e.g., to maintain the system's temperature and pressure). This added heat can stop the temperature from falling or reduce the rate at which the temperature is falling. The control system can stop the heating element from adding heat to the system when the tank is in a steady state, for example, when the rate of decrease in pressure or temperature falls below a threshold. In another exemplary embodiment, the actual temperature of the dielectric fluid in the tank when an increase or decrease in the workload of a computing device begins can determine how much heat to add to the tank.

[0237] In one exemplary embodiment, the management system may activate a heating element when an impact event is detected, for example, before, during, or after a startup, boost, slowdown, or shutdown operation. The management system may detect the operating mode of the vessel (e.g., startup or shutdown) by receiving sensor data (e.g., from temperature or pressure sensors in the tank) or data from a computing device (e.g., current, voltage, temperature, workload, data transfer, etc.). The heating element can mitigate or adjust changes in temperature or pressure in the tank to minimize pressure deviations from atmospheric pressure. Otherwise, without the operation of the heating element by the technology disclosed herein, the vessel would need to either absorb or store excess gas generated as a result of rapid heating of the computing device, or the vessel would need to release or supply gas to counteract pressure drops as a result of rapid cooling of the computing device.

[0238] During startup, the tank temperature, for example, the temperature of the dielectric fluid in the tank, falls below the threshold required for the computing device to begin operation. Startup can occur, for example, immediately after the container is switched on when the tank is cold. Since the computing device can heat up rapidly, it can generate a large amount of steam when the dielectric fluid is cold. Therefore, before, during, or after startup, the management system can activate heating elements to heat the dielectric fluid, thereby increasing its temperature in a controlled manner and minimizing steam generation by the computing device. For example, the heating elements can slowly increase the temperature of the dielectric fluid to a threshold temperature before the computing device is switched on. Otherwise, the container would need to accommodate an excess amount of steam to maintain the tank at atmospheric pressure, which could require large capacities in the bellows and absorption units.

[0239] During a boost operation, the temperature of the tank, for example, the temperature of the dielectric fluid in the tank, may increase faster than the threshold rate (for example, if the tank temperature falls below a threshold). A boost operation may occur, for example, when a computing device is in operation and the workload of the computing device increases significantly, for example, due to increased consumer demand. A sudden increase in the workload of the computing device can increase the amount of heat generated by the computing device, and thereby increase the amount of steam generated by the computing device. Therefore, before, during, or after a boost operation, the management system can activate heating elements to heat the dielectric fluid, thereby increasing the temperature of the dielectric fluid in a controlled manner and minimizing steam generation by the computing device. Otherwise, the vessel would need to accommodate an excess amount of steam to maintain the tank at atmospheric pressure, which may require a large capacity for storage or absorption in the bellows and absorption units.

[0240] During a slowdown operation, the temperature of the tank, for example, the temperature of the dielectric fluid in the tank, may decrease faster than the threshold rate (for example, if the tank temperature exceeds a threshold). A slowdown operation may occur, for example, when a computing device is in operation and its workload decreases significantly due to a decrease in consumer demand. A sudden decrease in the computing device's workload reduces the amount of heat generated by the computing device, which can cause a sudden drop in the tank pressure. Therefore, before, during, or after a slowdown operation, the management system can activate heating elements to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop in the tank. Otherwise, the vessel would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which may require a large storage or desorption capacity in the bellows and absorption units.

[0241] During a shutdown operation (or controlled shutdown process), the container is commanded to shut down while the tank temperature, for example, the temperature of the dielectric fluid in the tank, is above a threshold. Because the computing device suddenly stops generating heat, the tank pressure drops rapidly. Therefore, before, during, or after a shutdown operation, the management system can activate heating elements to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating elements can slowly heat the dielectric fluid so that its temperature drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which may require a large storage or desorption capacity in the bellows and absorption units.

[0242] In one exemplary embodiment, the control system (or other system) can maintain the tank pressure at near atmospheric pressure by adding or removing steam or fluid from the tank so that the container responds to an impact event. For example, as the tank temperature increases, steam or fluid can be removed from the tank, and as the tank temperature decreases, steam or fluid can be added to the tank.

[0243] The container can use various mechanisms for adding steam or fluid to the tank or removing steam or fluid from the tank. In one exemplary embodiment, the container can use bellows as a mechanism for adding steam to the tank or removing steam from the tank. In another exemplary embodiment, the container can use an absorption / desorption unit (hereinafter, "absorption unit") for adding steam to the tank or removing steam from the tank. In yet another exemplary embodiment, the container can use a pressurized container for adding steam to the tank or removing steam from the tank. In yet another exemplary embodiment, the container can use a combination of the mechanisms listed above for adding steam or fluid to the tank or removing steam or fluid from the tank. In yet another exemplary embodiment, the container can maintain the pressure in the tank using a combination of a heating element and one or more of the mechanisms listed above.

[0244] For example, during startup, the management system can maintain the tank pressure using a combination of heating elements and bellows. In one example, before the computing device is turned on, the management system can activate the heating elements to heat the dielectric fluid. At some point (e.g., before, after, or during heating), the management system can open a valve connecting the bellows to the tank, thereby facilitating the transfer of dielectric vapor to the bellows. This transfer of dielectric vapor to the bellows prevents an uncontrolled increase in the tank pressure, thereby allowing the temperature of the dielectric fluid to increase while the tank pressure can be maintained (e.g., within an acceptable range).

[0245] Similarly, during setup, the control system can maintain tank pressure using a combination of heating elements and absorption units. At some point (e.g., before, after, or during heating), the control system can open a valve connecting the absorption unit to the tank, thereby facilitating the transfer of dielectric vapor to the absorption unit, which can then absorb or retain the dielectric vapor in the absorption unit, e.g., a carbon bed. Similarly, during setup, the control system can maintain tank pressure using a combination of heating elements and a pressurized container. At some point (e.g., before, after, or during heating), the control system can open a valve connecting the pump and pressurized container to the tank, thereby facilitating the transfer of dielectric vapor to the pressurized container using the pump. The pressurized container can store dielectric vapor.

[0246] As another example, during a shutdown operation, the management system can maintain tank pressure using a combination of heating elements and bellows. In one example, after the computing device is turned off, the management system can activate the heating elements to heat the dielectric fluid. At some point (e.g., before, after, or during heating), the management system can open a valve connecting the bellows to the tank, thereby facilitating the transfer of dielectric vapor into the tank. This transfer of dielectric vapor into the tank prevents an uncontrolled decrease in tank pressure, thereby lowering the temperature of the dielectric fluid while the tank pressure can be maintained (e.g., within an acceptable range).

[0247] Similarly, during the shutdown operation, the management system can maintain the pressure of the tank using a combination of a heating element and an absorption unit. At some point (e.g., before heating, after heating, or during heating), the management system can open the valve connecting the absorption unit to the tank, thereby facilitating the transfer of the dielectric vapor to the tank. In the case of a carbon bed as the absorption unit, the management system can activate the carbon bed and release the captured or absorbed dielectric molecules. The management system can activate the carbon bed, for example, by sending a signal to a switch to turn on the heating element within the carbon bed. In one example, as the pressure of the tank decreases, the carbon bed is heated to release the dielectric vapor and minimize the pressure drop.

[0248] Similarly, during the shutdown operation, the management system can maintain the pressure of the tank using a combination of a heating element and a pressurized container. At some point (e.g., before heating, after heating, or during heating), the management system can open the valve connecting the pressurized container to the tank, thereby facilitating the transfer of the dielectric vapor to the tank.

[0249] In one exemplary embodiment, there may be a trade-off between the use of bellows and the use of an absorption unit. Bellows are passive elements, while absorption units are active elements. A bellows-type system can be more power-efficient than an absorption-unit-type system because the bellows do not require active heating. On the other hand, bellows take up more space than absorption units, and an absorption-unit-type system provides more advanced control and functionality. Design constraints regarding this can include efficiency, control, and space.

[0250] In one exemplary embodiment, the vessel may be subject to an uncontrolled shutdown. For example, the vessel may be subject to an uncontrolled shutdown due to a power loss. In this exemplary embodiment, emergency shutdown procedures may be implemented to accommodate potential pressure fluctuations in the tank. For example, the vessel may have a backup or uninterruptible power supply ("UPS") that can supply power to the vessel and its management system (or other systems). If the management system receives a signal from a sensor indicating that the pressure in the tank has fallen below an acceptable threshold as a result of power loss and cooling of the system, the management system may command the opening of a bypass valve. The bypass valve can connect the tank to the environment outside the tank. The bypass valve can introduce air into the tank, thereby normalizing the pressure in the tank (to prevent the tank or bellows from collapsing). Subsequently, during the startup operation, the vessel may purge the air introduced into the tank.

[0251] In one exemplary embodiment, a management system (or other system) may use a table, matrix, or map ("map") to determine how to respond to an impact event. In one exemplary embodiment, the map may display temperature changes as input and display outputs regarding how much heat to add to the tank in response to the temperature changes. In one exemplary embodiment, the map may include data as inputs regarding steam temperature, tank pressure, fluid height in the tank or reservoir area, fluid pressure in the pump or filter, differential pressure, humidity level, and alumina state. In response to these inputs, the map may provide outputs such as operating parameters for the condenser, heating element, pump, bellows valve, carbon intake valve, carbon exhaust valve, and computing device. The map can define various states about the operation of the vessel. The management system may receive various data from sensors provided throughout the vessel. The management system may use the map to translate the data into operating parameters for devices on the vessel, such as bellows, absorption units, valves, heating elements, pumps, condensers, and computing devices.

[0252] In one exemplary embodiment, the container can operate at a temperature near the boiling point of the dielectric fluid and a pressure near atmospheric pressure. However, one skilled in the art will recognize that the container can operate at other temperature and pressure ranges based on the optimal operating temperature for operating the computing device. In one exemplary embodiment, the optimal operating temperature of the system is about 137 ± 8 degrees Fahrenheit. In one exemplary embodiment, the optimal operating pressure of the system is about atmospheric pressure (e.g., 101325 Pa) ± 5000 Pa. In this exemplary embodiment, during an impact event, the management system attempts to maintain the temperature and pressure of the container within this range.

[0253] In certain exemplary embodiments of this disclosure, the management system is designated as a system programmed to perform various tasks in an impact event, but one skilled in the art will recognize that other systems disclosed in this disclosure can be programmed to perform these tasks.

[0254] In one exemplary embodiment, the container may operate under three modes of operation. In the first mode of operation, the tank may operate at atmospheric pressure. In the second mode of operation, the tank may operate in a pressure range that deviates significantly from atmospheric pressure. In the third mode of operation, the container may operate at atmospheric pressure or in a pressure range that deviates significantly from atmospheric pressure. The third mode of operation may be a hybrid of the first and second modes. In one exemplary embodiment, a management system can determine the operating mode of the container. For example, the management system may operate the container based on rules defined for the management system, for example, pressurizing the container at 5 a.m. every morning and returning it to atmospheric pressure at night, and pressurizing the container during peak workload as determined by sensor data. As another example, the management system may use a machine learning algorithm to predict the operating mode for the container. For example, the machine learning algorithm can use extrinsic data, such as weather conditions, calendar data, and usage data, as well as sensor data, to predict which operating mode is more efficient under those circumstances. System users provide labeled data to the management system, which can then extrapolate the data to create models for predicting operating modes.

[0255] In one exemplary embodiment, the control system can perform certain routines before the tank lid may be opened. For example, if the container is given a command to open the tank lid, the condensation system may cool the system for a certain period of time before the control system allows the lid to be opened. The condensation system may minimize the vapor in the tank so that, once the lid is opened, minimal dielectric vapor is lost to the environment.

[0256] In one exemplary embodiment, the immersion cooling system may be a modular system. For example, each group of system components may be mounted on individual skids, such as a condensing skid, a heating skid, a bellows skid, an absorption unit skid, etc. These skids can be made movable and deployed for various applications.

[0257] Circulation and filtration of dielectric fluids In one exemplary embodiment, the container may include a pump for circulating a dielectric fluid through a tank. For example, the tank may include a reservoir area and a tank area. The tank area can hold a computing device immersed in the dielectric fluid. The reservoir area may be in or adjacent to the tank area, or may be in fluid communication with the tank area. For example, the reservoir area may receive overflow of dielectric fluid from the tank area, and the dielectric fluid may flow over the wall of the tank area adjacent to the reservoir area. The pump can draw the dielectric fluid from the reservoir area and pass the fluid through a filter. After filtering, the dielectric fluid returns to the tank area. The container may include various pipes connecting the reservoir area, the pump, the filter, and the tank area.

[0258] In one exemplary embodiment, the container is supplied with a predetermined amount of dielectric fluid such that the tank region is filled with the dielectric fluid and the dielectric fluid overflows into the reservoir region. The filled tank region ensures that the computing device is fully immersed in the dielectric fluid. A pump can draw the dielectric fluid from the reservoir region and pass it through the tank region, for example, through a filter. Since there is more dielectric fluid in the tank than the capacity of the tank region to hold the fluid, the tank region is always filled when the pump is running (especially when the pump is operating). However, depending on the temperature of the tank, the height of the dielectric fluid in the reservoir region may change because the dielectric fluid evaporates from the tank region and the dielectric fluid from the reservoir region can replace the evaporated fluid in the tank.

[0259] In one exemplary embodiment, the tank may be rectangular in shape. Dielectric fluid may flow over the top of one of the short sides into a reservoir area adjacent to the short side. Since interruptions or turbulence can cause cavitation in the fluid, the pump can draw out the dielectric fluid and return or reintroduce it to a location in the tank where it can cause minimal interruption or turbulence in the fluid within the tank. In particular, the greater the distance between the overflow area and the reintroduction point, the less turbulence will be associated with the reintroduction of the fluid into the tank. For example, if the dielectric fluid overflows from the top of a first side of the tank, the pump can return the dielectric fluid to the bottom on the opposite side from the first side. The pump can return the dielectric fluid to the corner on the bottom side, which minimizes interruption or turbulence in the fluid within the tank.

[0260] In one exemplary embodiment, the vessel may include two pumps. Each pump can independently draw fluid from the reservoir area and deliver it to the tank area. Providing the vessel with two separate, independent pumps can increase the service life of the vessel. In addition, if one of the pumps fails for any reason, the vessel can continue to operate without interruption until the failed pump is replaced.

[0261] In one exemplary embodiment, the container may include a filter. The filter may include one or more cores. Each core can filter the dielectric fluid for different types of contaminants, particles, substances, diluents, or solutes. In one exemplary embodiment, the cores may be selected based on the properties of the dielectric fluid and the contaminants that are easily introduced into the dielectric fluid. For example, contaminants may include solder and resin used in the manufacturing process of electronic circuit boards used in computing devices. The dielectric fluid can act as a cleaning agent for resin, solder, dust, dirt, or other substances in the system. Solder and resin (or other substances) may be washed away from these electronic circuit boards after they have been immersed in the dielectric fluid. The filter can remove the solder and resin (or other substances) from the dielectric fluid. If these substances are not removed from the dielectric fluid, as the dielectric fluid vaporizes, these substances will deposit as layers on the heat-generating components of the computing device, such as a processor. As a result, the layer thermally separates or insulates the heat-generating components from the dielectric fluid, thereby reducing the efficiency of heat transfer from these components to the dielectric fluid. Consequently, the components may overheat and break more frequently.

[0262] In one exemplary embodiment, the filter may include two cores, one containing activated carbon (charcoal) and the other containing activated aluminum. For example, the ratio of activated carbon to activated aluminum may be 3:1. In another example, the filter may include four cores, three containing activated carbon and one containing activated aluminum.

[0263] In one exemplary embodiment, the filter may include a stripe for testing the acidity of a dielectric fluid. This stripe may be a pH indicator, litmus paper, or other indicator. In one example, the dielectric fluid may become acidic after interacting with a predetermined component of the tank. The stripe may come into contact with the dielectric fluid and change color if the dielectric fluid becomes acidic. The filter may also include a color detection sensor that can detect the change in color on the stripe and transmit a signal to a management system (or other system) when the change in color on the stripe is detected. In one exemplary embodiment, the stripe may be placed in a container or chamber containing a glass shield. Thus, the change in color on the stripe may be visible from outside the container. A camera may be placed in the vicinity of the container. The camera may take a photograph of the stripe (behind the glass shield) and transmit the photograph to the management system. If the management system (or a user of the system) detects the change in color on the stripe (using data provided by the camera or color sensor), the management system may trigger a remedial action, such as notifying a maintenance system or shutting down the system.

[0264] In one exemplary embodiment, the camera may be a pan-tilt-zoom camera. The filter cover may be mounted on top of the reservoir area. The filter cover may be positioned next to other covers that provide access to the tank area. The filter cover may include a filter, and the camera may be mounted on top of the filter cover. In one embodiment, the camera may be mounted directly below the filter cover. Thus, as the camera rotates, the camera can capture images of the area spanning the stripe, the reservoir area (the area below the camera), and the tank area.

[0265] Figures 19A and 19B show a filter comprising three cores according to an exemplary embodiment. As shown in Figure 19A, the filter may include a mountable lid 1050 on the tank, for example, next to other lids that provide access to computing devices installed inside the tank. Each core of the filter may be connected to the lid 1050. The lid 1050 may include three caps 1060, each cap providing access to one of the cores. Figure 19B shows a structure 1070 mounted on the lid 1050. The structure 1070 can support various filter cores and other components, for example, a filter core 1071, a camera 1072, and an electromechanical valve 1073. On the opposite side of the structure 1070, two other filter cores may be present (not shown in Figure 19B).

[0266] In this example filter, there is a camera and two color sensors mounted on the lid. The camera and color sensors can acquire data on the acidity of the dielectric fluid (based on the color of the stripes) and transmit the data to a management system.

[0267] In one exemplary embodiment, the filter may be mounted on a chassis that can be removed by a robot. The chassis may include connection interfaces that detachably connect the chassis (and the filter mounted thereon) to various pipes provided within the tank. Thus, when a management system determines that the filter needs to be replaced, the robot can lift the chassis from the tank and place the filter in a magazine.

[0268] In one exemplary embodiment, the management system can notify the user when the filter needs repair or replacement. For example, the management system may include a timer or counter that is activated when the filter is installed in a container. If the management system determines that the filter has been operating for longer than a threshold time, it can send a notification to the user (or other entity). In another example, the management system may activate the timer or counter only when the container is operating, the pump is running, or (as determined by a fluid sensor in the filter) a dielectric fluid is passing through the filter. If the management system determines that the filter has been operating for longer than a threshold time, it can send a notification to the user. In yet another example, the management system can determine the pressure difference across the filter and can notify the user to repair or replace the filter if the pressure difference exceeds a threshold pressure. In particular, the filter may include an input pipe and an output pipe, and there may be pressure sensors on the input pipe and pressure sensors on the output pipe. Each pressure sensor can transmit pressure readings to the management system. If the pressure difference between the pressure sensor readings exceeds a threshold pressure, the management sensor can determine that the filter is clogged. Therefore, the management system can notify the user to repair or replace the filter. As yet another example, the filter may include a sensor that indicates the flow velocity to the filter. The management system can use the flow velocity to determine if the filter needs repair. As yet another example, the management system can use a machine learning model to determine when to replace the filter. The model can receive training data from a central server that shows the behavioral data for filters in multiple containers connected to the server.

[0269] In one exemplary embodiment, the reservoir region and / or tank region may include one or more fluid height sensors. During startup or a rapid increase in workload, the fluid height in the reservoir region decreases as the dielectric fluid vaporizes in the tank region. Meanwhile, the fluid height in the tank region remains constant as the pump circulates the dielectric fluid, i.e., the computing device remains immersed. Conversely, during shutdown or a rapid decline in workload, the fluid height in the reservoir region decreases.

[0270] The fluid height sensor can provide the management system with data on the fluid height in the reservoir and tank areas. If the fluid height in the reservoir area decreases after the container is started (i.e., while the container is operating in a steady state), it indicates a leak in the tank. Similarly, if the fluid height in the tank area decreases at some point, it indicates a problem in the fluid circulation system, such as a pump failure. Therefore, the management system can continuously monitor the fluid height data provided by the fluid height sensor and notify the user of any unexpected drops in the fluid height in the reservoir or tank area.

[0271] In one exemplary embodiment, the pump can draw fluid from a reservoir (or tank) and supply it to a drain valve connected to the tank body. When the valve is opened, the pump can drain the reservoir (or tank) or provide a sample to the user of the container. The sample may be provided to a laboratory for testing. In one exemplary embodiment, the user can use a management system to command the container to drain the tank. Accordingly, the management system can open the drain valve, and the pump can direct fluid from the reservoir (or even the tank, if, for example, the connection is provided in the tank) to the drain valve. For example, if there is a valve connection between the tank and the reservoir, and a drain command is received, the valve connection can connect the tank to the reservoir so that the tank discharges the dielectric fluid into the reservoir and the pump drains the reservoir. In one exemplary embodiment, the pump can draw the dielectric fluid directly from the tank.

[0272] robot systems In an exemplary embodiment, the container may include a gantry robot configured to lift a computing device from a robot system, such as a tank sump area or a magazine located near the tank. The gantry robot can also place the computing device in the sump area or the magazine.

[0273] The gantry robot (or robot) may include a series of linear actuators. For example, the robot may include actuators for movement in a plurality of directions, such as each of horizontal and vertical. A management system (or other system) can control how much or how fast each of these actuators moves. In an exemplary embodiment, the actuator may be configured to move on one or more tracks. Actuator-type or track-type systems lose their accuracy over time (e.g., due to drifting or wear and tear). Therefore, in this exemplary embodiment, to detect the exact relative position of the robot, the tank (or various of its components) may include one or more calibration zones or flags. For example, one or more of the important components or positions of the container with which the robot interacts, such as a magazine, a first server rack, a second server rack, or a home position, may include a flag that can be detected by the robot when it reaches that position with respect to the important component or position. The flag can notify the robot about its exact position with respect to the important component or position.

[0274] In one exemplary embodiment, the flag may be a physical object, an RFID tag, a color, an alphanumeric code, a QR code, etc. In one exemplary embodiment, the sensor for detecting the flag may be a motion sensor, an RFID detector, a camera, etc. In one exemplary embodiment, the camera can determine the distance between the robot and various objects and provide feedback to the robot regarding the distance. In one exemplary embodiment, the camera can provide video data to a management system, which can determine the precise position of the robot in a container based on the video data. In one exemplary embodiment, the management system can determine the robot's position by, for example, scanning a QR code or counting components in a tank. In one exemplary embodiment, images from the camera may be used to determine the robot's proximity to an object or whether the robot has properly grasped or positioned the chassis. In one exemplary embodiment, the management system can determine the robot's position using object recognition technology. In one exemplary embodiment, the management system can determine the robot's position using artificial intelligence technology. The management system can calibrate the robot using object recognition technology or artificial intelligence.

[0275] In one exemplary embodiment, the container may include a home position, a magazine, and two racks. A management system (or other system) can instruct the robot to, for example, lift a computing device from the second rack. The robot can move from the home position to the magazine, and then to the first and second racks. As the robot approaches each of these positions or components, the robot's sensors can detect a flag associated with the position or component. The advantage of the flag system is that the robot can further detect its position relative to important components or positions, even if other components or positions have been removed from the container. This is because the flags are always located in the same position relative to each of the important components or positions to which the flag is associated. For example, even if the first rack has been removed from the container, the robot can find the flag for the second rack, calibrate its position relative to the second rack, and remove the computing device from the second rack. Similarly, even if the second rack has been moved slightly from its position in the container, the robot can find the flag for the second rack, calibrate its position relative to the second rack, and remove the computing device from the second rack.

[0276] In one exemplary embodiment, the gantry robot may receive commands to remove or replace various components of the container, such as computing devices, filters, etc. In one exemplary embodiment, commands may be provided by a management system (or other system). The management system may provide commands in response to a determination by the management system (or other system), the user of the container, or a system outside the container. For example, the management system may receive and monitor various data points regarding the operation of the computing device, such as voltage levels, temperature, and other operating characteristics. If the computing device exceeds a determined or predetermined threshold for the computing device, the management system is programmed to instruct the robot to replace the computing device.

[0277] As another example, the user of the container may instruct the management system to provide a command to a robot to remove the computing device. Yet another example is that the management system may include an application programming interface (API) to receive commands from systems outside the container. For example, the container could communicate with a top-level orchestration and management platform that can instruct the management system (via the API) to remove the computing device from the tank.

[0278] In one exemplary embodiment, the robot can lift a computing device from a tank or magazine. In this exemplary embodiment, the computing device may be located on a chassis including a connecting plate. The robot may include guide pins and coupling mechanisms that can interface with the connecting plate. The robot may also include one or more load cells for measuring positive or negative forces or pressures applied to the robot.

[0279] The robot can start from its home position and move toward a tank (or rack containing computing devices). At the tank, the robot can detect a flag associated with the tank, which can notify the robot of its presence in the tank. The robot can then move a predetermined distance from the flag so that it is precisely (or substantially) positioned across the computing devices. Once the robot is above the computing devices, it can rapidly descend from its top position to a position several inches away from the computing devices (or greater than the length of the guide pins, e.g., 50% longer than the guide pins). At that point (i.e., several inches away from the computing devices), the robot can slowly approach the computing devices so that the robot's guide pins make initial contact with the connecting plate. Once the robot makes initial contact, it continues to move downward at the same low speed until it presses the connecting plate (of the chassis) with a force greater than a threshold pressure. At that point, the robot's coupling mechanism can actuate the robot to interconnect with the computing devices (e.g., fingers may open). The coupling mechanism may be an armature-type coupling mechanism containing multiple fingers. When the coupling mechanism closes, the robot can provide feedback to the management system, namely, feedback that the coupling mechanism is closed. The management system can then command the robot to lift the computing device. The robot can slowly lift the chassis a few inches to ensure it has a firm grip on it. The robot can then rapidly move upward to its top position. At that point, the robot can move to any position commanded by the management system, such as a magazine or another rack.

[0280] In one exemplary embodiment, a robot can place a computing device inside a tank or magazine. For example, the robot can lower or position the chassis into the tank (or magazine) by moving over a slot (or one of its racks) in the tank while holding the chassis. Once the robot is over the tank, it begins to move rapidly downward until it is several inches above the initial alignment point (or mating point) between the chassis and the tank (or rack). The design of the chassis and tank can determine the distance from the tank at which the robot should decelerate. In particular, the robot can decelerate one or two inches above the alignment point (where the chassis's guide rails contact the grooves in the rack). The robot can move slowly towards the tank so that the grooves in the rack can move within the chassis's guide rails. A management system can receive and monitor data from load cells and other sensors to ensure that the chassis is not misaligned. For example, feedback of an excessive amount of force to a load cell may indicate a misalignment between the groove and the guide rail. If a misalignment is detected, the management system can abort the lowering operation.

[0281] In one exemplary embodiment, in addition to grooves and guide rails, the chassis and rack may include additional alignment mechanisms. For example, after the initial mating between the chassis and rack using grooves and guide rails, a guide pin mechanism may be provided on the rack and chassis to further align the rack and chassis. The guide pin mechanism may include pins on the rack and mating holes on the chassis. After the initial mating, the robot can move rapidly again downward until it reaches a second alignment mechanism (or a few inches thereafter, e.g., two inches larger than the size of the guide pins). Here, the second alignment mechanism may be a guide pin mechanism. The robot moves slowly downward so that the pins on the rack connect to the mating holes on the chassis. The robot continues to move slowly downward until the load cell provides feedback indicating that the chassis is inserted, e.g., until the load cell detects positive pressure. At this point, the coupling mechanism comes to a stop, and the robot can move upward (slowly a few inches and then rapidly to ensure proper positioning) to return to its home position.

[0282] In one exemplary embodiment, the chassis or rack may include a presence detection pin. When the presence detection pin mates with the corresponding receiver, the management system can receive a signal from the receiver. The signal may indicate that the chassis is properly positioned in its location. In this exemplary embodiment, the robot can only put the coupling mechanism into a stopped state after the receiver has provided a signal to the management system.

[0283] During lifting and lowering operations, the management system can receive and monitor data from the load cell, as well as from other sensors (e.g., motion sensors, tilt sensors, rotation sensors, accelerometers, etc.). This data can ensure that the chassis is not stacked or misaligned, or that the robot is gripping the chassis securely. If the management system determines that the chassis is protruding or misaligned for any reason (e.g., due to insufficient connection between the robot and the chassis), or that the robot is tilted or rotating, the management system can stop the lifting and lowering operation.

[0284] Figures 20A and 20B show an exemplary robotic system 1100. Figure 20A shows the robotic system 1100, which may be a gantry robot including a plate 1110. The gantry robot can move within a tank and use the plate 1110 to lift a computing device. Figure 20B shows the plate 1110, which may include a coupling mechanism 1111 and guide pins 1112. The coupling mechanism 1111 may include a plurality of fingers 1113 mechanically coupled to one or more armatures. When the coupling mechanism is positioned on the coupling plate of the chassis, the armature can actuate and move the fingers to hold the coupling plate.

[0285] Figures 21A-B show an exemplary guide pin mechanism between the chassis 1150 and the rack 1160. In this exemplary embodiment, the rack 1160 includes two guide pins 1161 (for each chassis 1150), and the chassis 1150 may include two mating holes 1151 configured to receive the guide pins 1161. When the robot lowers the chassis 1150 onto the rack 1160, the guide pin mechanism ensures proper electrical connection between the chassis 1150 and the rack 1160.

[0286] In one exemplary embodiment, the robot is a robotic arm. The robotic arm can move along rails provided on the side of the tank. In one exemplary embodiment, each chassis can be lifted using a piston and connected to a channel located above the piston. The channel can transport the chassis to a magazine, for example, using a rail system.

[0287] In one exemplary embodiment, the robot may include a calibration system, which may include several sensors. The calibration system can determine whether the robot is operating outside its normal range of motion. For example, a tilt sensor can notify the robot if it is not in balance or is tilted. In another example, a load cell can signal the robot if it is not moving freely or, for example, colliding with an object.

[0288] In one exemplary embodiment, the robot may use artificial intelligence or machine learning techniques to provide hot-swapping or as a fail-safe mechanism.

[0289] In one exemplary embodiment, the container may include multiple cameras. In this example, one camera may be mounted on the robot and another on the container wall. The cameras may be mounted so that the user always has visibility of the moving components of the container. The container may also include a display device, such as a user interface displayed on a monitor. When the robot is moving the chassis up and down, the user interface can display video feeds from the cameras. In this way, the user can take action if there is any problem with the robot's operation.

[0290] In one exemplary embodiment, the robot system may be a visual system linked to active control. Active control allows for the return of a reference point through a logic that determines proximity by proximity switching. In one exemplary embodiment, the robot system may be an AI robot system. In one exemplary embodiment, the robot system may be an automatic correction system. In one embodiment, the robot system may be a logic-controlled active-loop system that is pre-programmed and can be calibrated based on the interval between its idle state and its operational state.

[0291] Absorption / Detachment Unit In one exemplary embodiment, the absorption unit may be a carbon bed type system. The absorption unit may be a round, circular drum. Inside the absorption unit, there may be an aluminum framework that may include copper ribbon heating elements that extend throughout the framework. The height and radius of the absorption unit may be designed based on the size of the container and the volume of fluid in the tank.

[0292] The absorption unit is sealed and may contain activated carbon within its framework. The absorption unit may include an inlet and an outlet. In one embodiment, the absorption unit may include a cooling system, for example, in which cold air flows through the center of the absorption unit without contact with the carbon. This system allows the carbon to be cooled by convection.

[0293] In one exemplary embodiment, activated carbon enables the absorption or adhesion of dielectric vapor. If it is necessary to equilibrate the tank (e.g., create pressure or vacuum), the control system can connect the absorption unit to the tank by opening a valve. The control system can activate or start power to a copper heating ribbon element, which can heat the carbon. The carbon then releases dielectric fluid molecules as vapor, which returns to the tank.

[0294] In one exemplary embodiment, pressure and temperature sensors may be present in the carbon bed to prevent excessive pressure or temperature conditions.

[0295] In one exemplary embodiment, the absorption unit may include a control loop bypass for emergency pressure release (or pressurization). This is a safety configuration of the container. The absorption unit has a valve that disconnects it from the tank. If the valve fails, an overpressure condition may exist. For example, the control system may open the bypass valve if the outlet of the absorption unit is clogged. When the bypass valve is opened, dielectric vapors can move into the atmosphere, thereby preventing the absorption unit from exploding. If there is a vacuum in the tank, the valve may be opened to allow air to flow into the tank and prevent the tank from collapsing.

[0296] In one exemplary embodiment, the vessel may include a number of safety bypass valves. For example, during startup, a computing device may generate an excess amount of steam. A valve that allows the steam to exit the tank into the absorption unit may fail. Thus, an overpressure condition that the bellows cannot handle may exist in the tank. An emergency bypass valve may be opened to release some of the steam into the atmosphere.

[0297] Another example is when an excess amount of steam enters the absorption unit during startup. This creates an overpressure condition in the absorption unit. Therefore, the bypass valve in the absorption unit can be opened to release the steam into the atmosphere.

[0298] In one exemplary embodiment, in addition to pressure and temperature, the management system can receive and monitor data regarding the power of the absorption unit from the absorption unit. The management system ensures that current is flowing through the absorption unit. The management system can shut down the absorption unit if there is an overcurrent problem or an overpressure condition.

[0299] Chassis self-alignment In one exemplary embodiment, the chassis may include a self-aligning function. The self-aligning function may include a plate that may be movable (i.e., floating) relative to the chassis. One or more input or output ports (or connectors) may be present on the plate. The chassis (and plate) includes mating holes that receive guide pins and can align ports that receive ports. In one exemplary embodiment, the ports may be ExaMAX® connectors.

[0300] In one exemplary embodiment, the self-alignment function may include several alignment mechanisms. For example, as a first self-alignment mechanism, the rack and chassis may have grooves and guide rails. As a second self-alignment mechanism, the rack may include pins with tapered and rounded ends. The pins will enter into catch holes in the chassis. Once the pins are inserted into the mating holes (or catch holes), they provide the final, precise alignment between the connector on the chassis and the interface (i.e., backplane) on the rack. By the time the connector is ready to pair with its mating counterpart, the alignment pins bring the floating pair into perfect alignment with the relative orientation of the connector into which it will be inserted.

[0301] In one exemplary embodiment, the chassis and rack connectors may include their own alignment mechanisms, and for example, pins may be part of the connector.

[0302] In one exemplary embodiment, the connector may include a multi-stage mechanism for self-alignment, including an overall external alignment catch and a more detailed internal alignment catch.

[0303] In one exemplary embodiment, the plate may be located on the backplane of the rack.

[0304] Figure 22 shows an example connector with a self-aligning function. These connectors can ensure proper connection between pairs by including guide pins and other guiding configurations.

[0305] Immersion cooling treatment 1. A method, A step of immersing computer components at least partially in a thermally conductive, condensable dielectric fluid, The aforementioned computer components are mounted in a chassis that includes a backplane for receiving power from a rack. The computer component is configured to dissipate heat into the dielectric fluid when the computer component is operating. Steps and The steps include: using a condenser to condense the dielectric fluid in the gas phase into the dielectric fluid in the liquid phase; A method comprising a rack located within the tank, the rack being equipped with a pressure controller for reducing or increasing the internal pressure of the tank. 2. The method of Embodiment 1, wherein the tank has a computing power density of at least 300 W of computing power distributed across each square foot of space. 3. The method of Embodiment 1, further comprising the step of using a robot to remove the chassis from the rack, wherein the robot is located inside the tank. 4. The method of Embodiment 3, further comprising the step of transporting the chassis to an airlock using the robot, wherein the airlock is configured to allow access to the inside of the tank without significantly disturbing the pressure inside the tank. 5. The step of opening the inner door of the airlock, The steps include placing the chassis in the airlock, The steps include closing the inner door of the airlock, The steps include making the pressure of the airlock equal to atmospheric pressure, The steps include opening the outer door of the aforementioned airlock and A method according to embodiment 4, further comprising: 6. The method of Embodiment 3, further comprising the step of using the robot to store the chassis in a magazine. 7. The method of Embodiment 6, wherein the magazine is located on a platform including a support member, a rotating member, and a rail. 8. The method of Embodiment 3, wherein the robot is a gantry robot configured to remove, replace, or install the chassis. 9. The method of Embodiment 8, wherein the gantry robot is configured to move in a horizontal plane and descend vertically. 10. The method of Embodiment 9, wherein the robot is configured to remove, replace, or install components of a power distribution system. 11. The method of Embodiment 10, wherein the robot includes a gripping tool for gripping the chassis. 12. The method of Embodiment 1, wherein the tank is mounted within a superstructure that includes a plurality of tanks. 13. The method of Embodiment 1, further comprising the step of removing contaminants from the dielectric fluid. 14. The method of Embodiment 1, further comprising the step of removing gaseous contaminants. 15. The method of Embodiment 1, further comprising the steps of supplying power, network connectivity, and processing fluid to the tank. 16. The method of Embodiment 1, wherein the tank comprises an opening at the top and a removable lid. 17. The method of Embodiment 1, wherein the tank has an internal volume between approximately 100 cubic feet and approximately 300 cubic feet. 18. The method of Embodiment 1, wherein the chassis does not include a heatsink and a fan. 19. The method of Embodiment 1, wherein the chassis includes a blade server, a processor, a power supply, or an interface card. 20. The method of Embodiment 19, wherein the backplane is electrically connected to an interface card which is a Cat6A or Cat7 compatible RJ45 interface for connection to a 1G or 10G Ethernet interface.

[0306] Container design and configuration for immersion cooling 1. A device, A tank configured to hold a thermally conductive, condensable dielectric fluid, A pressure controller for lowering or raising the internal pressure of the tank, A rack at least partially immersed in the dielectric fluid, A condenser for condensing the dielectric fluid in the gas phase, A robot configured to move the chassis within the rack A device equipped with the following features. 2. The apparatus of Embodiment 1, wherein the apparatus includes a modular skid equipped with a plurality of forklift tubes. 3. The apparatus of Embodiment 1, wherein the tank has a computing power density of at least 300 W of computing power distributed across each square foot of space. 4. The apparatus of Embodiment 1, wherein the external part of the apparatus includes a power input unit and a communication input unit. 5. The power input unit and the communication input unit are electrically connected to the box. The box is the device of Embodiment 4, which distributes the power input unit and the communication input unit to the rack using multiple wires. 6. The apparatus of Embodiment 5, wherein the rack includes a backplane receiver configured to distribute power and communication signals to the chassis. 7. The chassis is, The power and communication signals are received from the backplane receiver of the rack. The power and communication signals are distributed to the computer components within the chassis. Apparatus of Embodiment 6, including a backplane configured as such. 8. The apparatus of Embodiment 5, wherein the plurality of wires do not contain plastic insulators. 9. The rack is the apparatus of Embodiment 5, including a transformer. 10. The apparatus of Embodiment 1, wherein the apparatus is loadable. 11. The apparatus of Embodiment 1, further comprising a magazine for storing replacement components. 12. The apparatus of Embodiment 11, wherein the robot is configured to remove the chassis from the rack and place the chassis in the magazine. 13. The apparatus of Embodiment 12, wherein the magazine is located on a platform including a rotating member, a support member and a rail. 14. The apparatus of Embodiment 13, wherein the platform is configured to guide the magazine to the outside of the apparatus. 15. The apparatus of Embodiment 1, wherein the apparatus includes a desiccant configured to remove water vapor contaminants from the apparatus. 16. Charge area and, Pump and Filters and The apparatus of Embodiment 1, further comprising the pump being configured to remove the dielectric fluid from the reservoir area and pass the dielectric fluid through the filter before transporting the dielectric fluid to the tank portion of the tank. 17. The apparatus of Embodiment 1, wherein the dielectric fluid has a boiling point in the range of 20°C to 100°C. 18. The apparatus of Embodiment 1, wherein the dielectric fluid comprises a chemical substance of the formula (CF3)2CFCF2OCH3, C4F9OCH3, or CF3CF2CF2CF2OCH3, a hydrofluoroether, or methoxy-nonafluorobutane. 19. The apparatus of Embodiment 1, further comprising a lock that prevents the apparatus from operating if either the lid or door of the apparatus is not secured. 20. The apparatus of Embodiment 19, further comprising a controller configured to shut off the power to the apparatus in the event of unauthorized access to the lid or the door.

[0307] Robots and automation for immersion cooling 1. A device, A tank configured to hold a thermally conductive, condensable dielectric fluid, A pressure controller for lowering or raising the internal pressure of the tank, A computer component at least partially immersed in the dielectric fluid, A condenser for condensing the dielectric fluid in the gas phase, A robot configured to retrieve the aforementioned computer components A device equipped with the following features. 2. The apparatus of Embodiment 1, further comprising an airlock. 3. The airlock is the apparatus of Embodiment 2, which includes an inner door and an outer door. 4. The apparatus of Embodiment 3, wherein the airlock is configured to receive an inert gas that purges the dielectric fluid in the gas phase before the outer door is opened. 5. The robot is the apparatus of Embodiment 3, located outside the tank. 6. The robot is the apparatus of Embodiment 3, located inside the tank. 7. The apparatus of Embodiment 6, wherein the robot is configured to remove the computer components from the rack and transport the computer components to the airlock. 8. The robot further, Open the inner door of the airlock, The aforementioned computer components are placed in the airlock, Close the inner door of the airlock, The pressure of the aforementioned airlock is made equal to atmospheric pressure. Open the outer door of the airlock. The apparatus of Embodiment 7, configured as described above. 9. The apparatus of embodiment 8, further comprising a second robot located outside the tank. 10. The apparatus of Embodiment 9, wherein the second robot is configured to remove the computer components from the airlock when the outer door is opened. 11. The apparatus of Embodiment 9, wherein the second robot is configured to place the computer components in a storage slot. 12. The apparatus of Embodiment 9, wherein the airlock is configured to equalize the pressure in the airlock after the outer door is closed. 13. The apparatus of Embodiment 1, wherein the apparatus is configured to receive commands from a server located outside the apparatus. 14. The apparatus of Embodiment 1, wherein the computer components are located within a chassis that displays asset tags. 15. The apparatus of Embodiment 14, wherein the robot is configured to scan the asset tag and relay the asset tag to a management system. 16. The apparatus of Embodiment 1, wherein the robot is a gantry robot configured to remove, replace, or install the computer components. 17. The apparatus of Embodiment 16, wherein the gantry robot is configured to move horizontally and vertically. 18. The apparatus of Embodiment 1, wherein the robot is configured to remove, replace, or install components of a power distribution system. 19. The apparatus of Embodiment 18, wherein the component of the power distribution system is a transformer or a power supply. 20. The apparatus of Embodiment 1, wherein the robot includes a gripping tool for gripping the computer components.

[0308] Ballast block for immersion cooling 1. A device, It is a tank, A tank portion for holding a thermally conductive, condensable dielectric fluid and computer components, A shelf section configured to hold at least one ballast block and A tank equipped with, A pressure controller for lowering or raising the internal pressure of the tank, A condenser for condensing the dielectric fluid in the gas phase, A robot configured to retrieve the aforementioned computer components A device equipped with the following features. 2. The apparatus of Embodiment 1, wherein the bottom point of the tank portion is lower than the height of the shelf portion. 3. The apparatus of Embodiment 1, wherein the tank portion is configured such that the computer components are at least partially immersed in the dielectric fluid. 4. The apparatus of Embodiment 3, wherein the computer components are a blade server, a processor, a power supply, or a transformer. 5. The apparatus of Embodiment 1, wherein the height of the dielectric fluid is sufficient to cover at least a portion of the shelf. 6. The apparatus of Embodiment 1, wherein the shelf portion is located next to the condenser. 7. The apparatus of Embodiment 6, wherein the shelf portion is configured to receive the condensed dielectric fluid from the condenser. 8. The apparatus of Embodiment 1, wherein the ballast block is configured to occupy the volume of the tank on the shelf so as to remove the dielectric fluid from the shelf into the area on the tank portion. 9. The apparatus of Embodiment 1, wherein the ballast block includes a plurality of riser feet to allow the dielectric fluid to flow beneath the ballast block. 10. The apparatus of Embodiment 1, wherein the ballast block is not soluble in the dielectric fluid. 11. The apparatus of Embodiment 1, wherein the ballast block is made of metal, rubber, silicone, or polymer. 12. The apparatus of Embodiment 1, wherein the ballast block is denser than the dielectric fluid. 13. The apparatus of Embodiment 1, wherein the ballast block has a handle, notch, or plate for removing or replacing the ballast block. 14. The apparatus of Embodiment 13, wherein the robot is configured to lift the ballast block using the handle, the notch, or the plate. 15. The apparatus of Embodiment 1, wherein the ballast block is configured to interlock with other ballast blocks from the upper or bottom side of the ballast block. 16. The device of Embodiment 15, wherein the interlock prevents the other ballast block from sliding. 17. The apparatus of Embodiment 15, wherein the other ballast block is configured to be located above or below the ballast block. 18. The apparatus of Embodiment 15, wherein the ballast block has a recess on its upper side, so that the riser feet of the other ballast blocks can lock into one of the recesses of the ballast block. 19. The apparatus of Embodiment 1, wherein the ballast blocks are configured to extend over at least 40% of the total length of the shelf portion. 20. The apparatus of Embodiment 1, wherein the ballast block has external dimensions of approximately 2 feet in length, 8 inches in width, and 1 inch in height.

[0309] Server cases for immersion cooling 1. A device, A tank configured to hold a thermally conductive, condensable dielectric fluid, A pressure controller for lowering or raising the internal pressure of the tank, A chassis at least partially immersed in the dielectric fluid, A condenser for condensing the dielectric fluid in the gas phase, A robot configured to remove the chassis A device equipped with the following features. 2. The apparatus of Embodiment 1, wherein the chassis does not require a heat sink and a fan. 3. The chassis is the apparatus of Embodiment 1, including a blade server. 4. The chassis is the apparatus of Embodiment 1, including a processor, power supply, or interface card. 5. The apparatus of Embodiment 4, wherein the interface card is a Cat6A or Cat7 compatible RJ45 interface for connection to a 1G or 10G Ethernet interface. 6. The apparatus of Embodiment 1, wherein the chassis is removably mounted on a rack. 7. The apparatus of Embodiment 6, wherein the chassis includes a backplane that provides a slot-in interface between the chassis and the rack. 8. The apparatus of Embodiment 7, wherein the backplane is configured to distribute power and signals received from the rack within the chassis. 9. The apparatus of Embodiment 8, wherein the backplane is configured to transmit power and data to blade servers via cables. 10. The apparatus of Embodiment 1, wherein the chassis is a substantially rectangular box having a rear wall and two side walls, and the rear wall has a plurality of holes to facilitate the circulation of the dielectric fluid within the chassis. 11. The apparatus of embodiment 10, wherein the chassis is provided with guide rails on each of the two side walls. 12. The apparatus of Embodiment 1, wherein the chassis is provided with mounting interfaces for holding computer components. 13. The apparatus of Embodiment 1, wherein the chassis is provided with a plane, and the robot is configured to lift the chassis using the plate. 14. The chassis is the apparatus of Embodiment 1, including a microcontroller. 15. The microcontroller, Sensor data indicating whether the chassis is properly positioned in the rack is received from a sensor mounted on the chassis. The aforementioned sensor data is transmitted to the management system. The apparatus of embodiment 14, configured as described above. 16. The microcontroller, Receive power signals from the management system, The power signal is transmitted to a switch configured to cut off the power within the chassis. The apparatus of embodiment 14, configured as described above. 17. The microcontroller, The system receives operational data from computer components mounted within the chassis. The aforementioned operation data is transmitted to the management system. The apparatus of embodiment 14, configured as described above. 18. The apparatus of Embodiment 14, wherein the microcontroller is configured to control the electrical and communication equipment of the blade server. 19. The chassis is the apparatus of Embodiment 1, which is equipped with an RFID tag. 20. The apparatus of Embodiment 19, wherein the robot is configured to scan the RFID tag and transmit a signal to a management system.

[0310] Steam control for immersion cooling using bellows 1. A device, A tank configured to hold a thermally conductive, condensable dielectric fluid and computer components, A pressure controller for lowering or raising the internal pressure of the tank, A vapor control system for condensing the dielectric fluid in the gas phase, A robot configured to retrieve the aforementioned computer components A device equipped with the following features. 2. The steam management system is the apparatus of Embodiment 1, which includes a condensation structure in the tank. 3. The apparatus of Embodiment 2, wherein the condensation structure includes a heat-conducting tube, a coil, and a heat dissipation fin. 4. The apparatus of Embodiment 2, wherein the condensing structure is configured to be connected to a coolant supply source such that the coolant passes through the condensing structure. 5. The apparatus of Embodiment 2, wherein the apparatus is configured to cool the coolant using evaporative cooling or a dry cooling tower. 6. The steam management system is the apparatus of Embodiment 2, including an intake pipe and a discharge pipe. 7. The apparatus of Embodiment 6, wherein the intake pipe is configured to receive coolant from a cooled coolant supply source and guide the coolant to the condensing structure. 8. The apparatus of Embodiment 6, wherein the discharge pipe is configured to receive coolant from the condensing structure and return the coolant to the cooled coolant supply source. 9. The apparatus of Embodiment 1, wherein the steam management system includes a storage unit for storing the dielectric fluid. 10. The apparatus of Embodiment 9, wherein the steam management system is configured to direct the dielectric fluid from the storage unit to the tank. 11. The apparatus of Embodiment 1, wherein the steam management system includes a steam storage unit for storing the steam of the dielectric fluid. 12. The apparatus of Embodiment 11, wherein the steam storage unit is a bellows. 13. The apparatus of Embodiment 12, wherein the bellows is configured to expand or contract to maintain the internal pressure of the tank. 14. The apparatus of Embodiment 12, wherein the bellows comprises one or more pouches. 15. The apparatus of Embodiment 11, wherein the steam storage unit is equipped with a valve for lowering the temperature of the dielectric fluid steam by allowing air to be introduced into the steam management system. 16. The apparatus of Embodiment 15, wherein the steam storage unit is operably connected to a carbon bed that separates the dielectric fluid steam from air. 17. The apparatus of embodiment 16, wherein the carbon bed is equipped with a detachable heater configured to heat the carbon bed and raise its temperature. 18. The steam management system is the apparatus of Embodiment 1, comprising a filter. 19. The apparatus of Embodiment 17, wherein the filter is configured to remove air and water vapor. 20. The steam management system is, Equipped with an inert gas storage unit, The apparatus of Embodiment 1, configured to supply inert gas from the inert gas storage unit to the tank during startup or shutdown operations.

Claims

1. It is a system, A tank configured to hold liquid and gaseous fluids, A structure within the tank, configured to hold one or more computer components that are at least partially immersed in the liquid phase of the fluid during the operation of the system, A heating element configured to heat the fluid in the liquid phase, A controller configured to adjust the heating element, A pressure control system operating under vacuum inside a pressure control vessel Equipped with, The pressure control vessel further comprises a temperature sensor and a pressure sensor operably coupled to the controller, The temperature sensor includes a sensor for measuring the gas phase temperature in the pressure control vessel, a sensor for measuring the liquid phase temperature in the pressure control vessel, and a sensor for measuring the temperature of one or more computer components. The controller is configured to adjust the heating element based on the temperature measured by the temperature sensor, and to activate the pressure management system based on the pressure measured by the pressure sensor. A system in which the controller is configured to operate the heating element to maintain the temperature of the liquid phase of the fluid within a threshold range below the boiling point of the fluid.

2. The system according to claim 1, wherein the heating element is configured to be completely immersed in the liquid phase during the operation of the system.

3. The system according to claim 1, wherein the controller is configured to adjust the heating element using a map for determining how to respond to an event.

4. The aforementioned controller The system receives data relating to the operating load, temperature, or both of the above one or more computer components. The system according to claim 1, configured to adjust the heating element based on the operating load of the one or more computer components, the temperature, or both.

5. The system according to claim 1, wherein the controller is configured to cause the heating element to heat the liquid-phase fluid during or before the startup operation of one or more computer components.

6. The system according to claim 1, wherein the controller is configured to cause the heating element to heat the fluid in the liquid phase when the temperature of the fluid in the liquid phase is below a threshold temperature.

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