Imaging device

Abstract

To provide an imaging device with which it is possible to efficiently cool an imaging element without obstructing the movement of the imaging element by a vibration-proof mechanism, and without increasing the size of the imaging device.SOLUTION: An imaging device 1, provided with an imaging element substrate 102 on which an imaging element 101 is mounted, a control circuit board 16 that controls the entire device, and a vibration-proof mechanism that moves the imaging element substrate 102 in an XY plane that is perpendicular to the optical axis, further includes a cooling fan 17 and a first duct 13 that are arranged behind the control circuit board 16 in the optical axis direction, and a second duct 14 that is branched from the first duct 13. The spaces in the first and second ducts 13, 14 are spatially separated from the imaging element substrate 102 and the control circuit board 16, and part of the second duct 14 is located at a position where it overlaps the imaging element substrate 102 when seen from the top face of the imaging device 1 and located at a position where it does not come into contact with the imaging element substrate 102 moved closest by the vibration-proof mechanism.SELECTED DRAWING: Figure 2A

Description

Technical Field

[0001] The present invention relates to an imaging device, and more particularly to an imaging device having a cooling structure inside.

Background Art

[0002] The imaging quality of imaging devices is improving, such as higher resolution and higher frame rate of recorded images. Such imaging devices have a large signal processing load and power consumption, and signal processing parts such as imaging elements and data recording parts generate significant heat. Since the performance of electronic components inside the imaging device deteriorates at high temperatures, it is necessary to provide a cooling structure inside the device to maintain the performance of the signal processing part even during such heat generation. For example, Patent Document 1 and Patent Document 2 disclose heat dissipation means for forced air cooling of an imaging element.

[0003] In recent years, an imaging device has been proposed that includes an anti-vibration mechanism in which an imaging element moves within a predetermined range to absorb vibrations applied to the imaging device from the outside and prevent image blurring. Conventionally, cooling for such an anti-vibration mechanism has been performed by transferring the heat of the heat generating part to a high thermal conductivity member and dissipating the heat.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the heat dissipation means of Patent Document 1 is a heat dissipation duct arranged behind the optical axis of the imaging element, and since the heat of the imaging element is transferred to this heat dissipation duct and the imaging element is cooled by forced air cooling, there is a problem that the imaging device becomes larger in the optical axis direction.

[0006] Furthermore, the heat dissipation means described in Patent Document 2 is a heat dissipation duct connected to a cooling device mounted on the outside of the main unit, and the image sensor is cooled by forced air cooling with this cooling device. As a result, there is a problem that the overall size of the imaging device becomes larger due to the cooling device mounted on the outside of the main unit. In addition, since Patent Document 2 is configured so that air blows directly on the image sensor, no consideration has been given to dustproof and waterproof protection.

[0007] On the other hand, if the heat dissipation duct is positioned in a way that avoids increasing the size of the imaging device, the movement of the image sensor by the vibration isolation mechanism may be hindered.

[0008] Therefore, the object of the present invention is to provide an imaging device that can efficiently cool an image sensor without hindering the movement of the image sensor by the vibration isolation mechanism and without increasing the size of the imaging device. [Means for solving the problem]

[0009] To solve the above problems, the imaging apparatus according to the present invention comprises: an image sensor substrate on which an image sensor that converts light from a lens into photoelectric light is mounted; an image sensor holding member that holds the image sensor substrate; an image sensor unit including the image sensor substrate and the image sensor holding member; a vibration isolation mechanism that moves the image sensor unit in a plane perpendicular to the optical axis of the lens; a cooling fan and a duct provided for heat dissipation of the image sensor substrate; and a heat transfer member that thermally connects the upper surface of the image sensor holding member and the lower surface of the duct. An imaging device The internal space of the duct is spatially separated from the space in which the image sensor unit is installed, and at least a portion of the duct is positioned above the image sensor unit, so as to overlap with the image sensor unit when the imaging device is viewed from above. [Effects of the Invention]

[0010] According to the present invention, the image sensor can be efficiently cooled without hindering the movement of the image sensor by the vibration isolation mechanism and without increasing the size of the imaging device.

Brief Description of the Drawings

[0011] [Figure 1A] It is a front perspective view of the imaging device according to an embodiment of the present invention. [Figure 1B] It is a rear perspective view of the imaging device. [Figure 2A] It is a front perspective view showing the internal components of the imaging device. [Figure 2B] It is a rear perspective view showing the internal components of the imaging device. [Figure 3] It is an exploded perspective view showing the internal components of the imaging device 1. [Figure 4] It is an exploded perspective view showing the structure of the imaging unit in FIG. 3. [Figure 5A] It is a bottom view of the imaging device. [Figure 5B] It is a sectional view taken along the line A-A of FIG. 5A. [Figure 6A] It is a rear view of the imaging device. [Figure 6B] It is a sectional view taken along the line B-B of FIG. 6A. [Figure 6C] It is a sectional view taken along the line C-C of FIG. 6A. [Figure 7A] It is an example of a front view of the internal components of the imaging device. [Figure 7B] It is an example of a top view of the internal components of the imaging device. [Figure 8A] It is another example of a front view of the internal components of the imaging device. [[ID=4८]] [Figure 8B] It is another example of a perspective view of the internal components related to the modification of the imaging device.

Modes for Carrying Out the Invention

[0012] Hereinafter, the imaging device 1 of the present invention will be described based on the accompanying drawings.

[0013] <Description of the Components of the Imaging Device 1> First, the schematic configuration of the imaging device 1 will be described using FIGS. 1A and 1B.

[0014] For the sake of simplicity in the following explanation, the XYZ coordinate system is defined as follows: The Z axis is the optical axis direction of the imaging device 1, and the direction of the subject being photographed is considered positive. On a plane perpendicular to the Z axis, the width direction of the imaging device 1 is defined as the X axis, and the right side from the subject towards the imaging device 1 is considered positive. The vertical direction of the imaging device 1 is defined as the Y axis, and the direction toward the sky is considered positive.

[0015] Figure 1A is a front perspective view of the imaging device 1, and Figure 1B is a rear perspective view of the imaging device 1.

[0016] As shown in Figures 1A and 1B, the imaging device 1 consists of an imaging device body 2 and a lens 3.

[0017] The imaging device body 2 contains the main functions of an imaging device, including a control circuit board 16 that controls the entire imaging device 1 (described later in Figures 3 and 4), an image sensor 101 that converts light from lens 3 into photoelectric light, a power supply unit, a recording unit for recording images, and various operation units. As shown in Figure 1A, lens 3 is attached to the subject side (+Z direction) of imaging device 1 and can be replaced according to the shooting conditions.

[0018] As shown in Figure 1A, the imaging device body 2 has an exhaust port 4 on its right side (+X direction) when viewed from the subject side, which is used for forced air cooling using a cooling fan 17 (described later) to expel the hot air from inside the imaging device body 2 to the outside. In addition, an accessory shoe 5 (external device mounting section) is located on the top surface (+Y direction) of the imaging device body 2, to which external accessories (external devices) can be attached.

[0019] As shown in Figure 1B, the imaging device body 2 is equipped with an air intake 6 on its left side (-X direction) when viewed from the subject side, for drawing in cool outside air into the body using a forced air cooling mechanism with a cooling fan, which will be described later. The air intake 6 is located on the side of the imaging device body 2, with a step above the grip portion 7 for gripping the imaging device body 2, and is positioned in a location that is not easily covered when the user grips the imaging device 1. The panel 8 is located on the back (-Z direction) of the imaging device body 2 and is rotatable relative to the imaging device body 2 by a rotary hinge 9.

[0020] <Outline of internal components of imaging device 1> Next, we will explain the general layout of the internal components of the imaging device 1 using Figures 2A, 2B, and 3.

[0021] Figure 2A is a front perspective view showing the internal components of the imaging device 1, and Figure 2B is a rear perspective view showing the internal components of the imaging device 1. Figure 3 is an exploded perspective view showing the internal components of the imaging device 1.

[0022] As shown in Figures 2A, 2B, and 3, the imaging device 1 includes an image sensor unit 10, a vibration-damping fixing unit 11, a front side plate 12, a first duct 13, a second duct 14, a third duct 15, a control circuit board 16, and a cooling fan 17 inside. Furthermore, the imaging device 1 includes a heat transfer member 18, an accessory shoe 5, and an electrical connection member 20 (Figure 3) inside. Note that in this embodiment, only the components related to the present invention are described, and descriptions of other components are omitted.

[0023] As shown in Figure 3, the image sensor unit 10, vibration isolation and fixing unit 11, front side sheet metal 12, and electrical connection member 20 constitute the imaging unit 100. The image sensor unit 10 is movably held by the vibration isolation and fixing unit 11 and the front side sheet metal 12, and has a vibration isolation mechanism for the image sensor unit 10.

[0024] As shown in Figure 3, the control circuit board 16, the first duct 13, the second duct 14, the third duct 15, the cooling fan 17, the heat transfer member 18, and the accessory shoe 5 constitute the main unit 150. The imaging unit 100 and the main unit 150 are electrically connected by the electrical connection member 20. The control circuit board 16, which controls the functions of the imaging device 1, is thermally connected to the first duct 13. The cooling fan 17 is a so-called centrifugal fan, configured to draw in air from the surface and expel it in the centrifugal (side) direction. Here, although the detailed airflow will be described later, the imaging device 1 is configured to draw in air from the aforementioned intake port 6 using the cooling fan 17, pass it through the inside of the imaging device body 2, and exhaust it from the exhaust port 4 to dissipate heat.

[0025] <Explanation of the vibration isolation function of the imaging unit 100> The structure of the imaging unit 100 with vibration isolation function will be explained using Figure 4.

[0026] Figure 4 is an exploded perspective view showing the structure of the imaging unit 100.

[0027] As shown in Figure 4, in the imaging unit 100, the image sensor unit 10 consists of an image sensor 101, an image sensor substrate 102, an imaging movement flex 103, a first coil 104X, a second coil 104Y, and an image sensor holding member 105.

[0028] Furthermore, in the imaging unit 100, the vibration isolation and fixing unit 11 consists of a rear fixing plate 120, a first permanent magnet 121X, a second permanent magnet 121Y, a first rear sheet metal 122X, and a second rear sheet metal 122Y.

[0029] The image sensor 101 is mounted on the image sensor substrate 102, and the image sensor substrate 102 is fixed to the image sensor holding member 105 by adhesive or other means, thereby holding the image sensor in the image sensor holding member 105. The imaging movement flex 103 is fixed to the image sensor holding member 105 with double-sided tape or screws. The first coil 104X and the second coil 104Y are positioned to fit into the opening of the image sensor holding member 105 and are covered by the imaging movement flex 103.

[0030] The first permanent magnet 121X and the second permanent magnet 121Y are positioned to fit into the openings of the rear fixing plate 120 and are engaged and held in place by their external shape. The first rear sheet metal 122X and the second rear sheet metal 122Y are fixed to the rear fixing plate 120 with screws so as to cover the first permanent magnet 121X and the second permanent magnet 121Y, respectively. The first duct 13 (Figure 3) is fixed to the rear fixing plate 120 with screws.

[0031] The image sensor unit 10 is held between the vibration-damping fixing unit 11 and the front side sheet metal 12 shown in Figure 3. Multiple ball members (not shown) are interposed between the rear side fixing plate 120 of the vibration-damping fixing unit 11 and the image sensor unit 10.

[0032] The first coil 104X and the first permanent magnet 121X described above are arranged to face each other in the optical axis direction, and their outsides are covered by the front side sheet metal 12 and the first back side sheet metal 122X, respectively. Hereinafter, the voice coil motor (VCM) type movement force generating unit of the first coil 104X and the first permanent magnet 121X will be referred to as the first movement mechanism 130X (vibration isolation mechanism). When current flows through the first coil 104X via the imaging movement flex 103, a force is generated in the first movement mechanism 130X that moves the image sensor unit 10 in the X direction (Yaw direction), allowing the position of the image sensor unit 10 to be controlled. Similarly, the second coil 104Y and the second permanent magnet 121Y are arranged to face each other in the optical axis direction, and their outsides are covered by the front side sheet metal 12 and the second back side sheet metal 122Y, respectively. Hereinafter, the VCM-type movement force generation unit of the second coil 104Y and the second permanent magnet 121Y will be referred to as the second movement mechanism 130Y (vibration isolation mechanism). When current flows through the second coil 104Y via the imaging movement flex 103, the second movement mechanism 130Y generates a force that moves the image sensor unit 10 in the Y direction (Pitch) or the rotational direction (ROLL direction) depending on the direction of the flowing current. This allows the position of the image sensor unit 10 to be controlled. Specifically, first, when an external force is applied to the imaging device 1, the control circuit board 16 detects the amount of blur in the plane perpendicular to the optical axis (X direction, Y direction, ROLL direction) caused by that external force using a sensor (not shown). Next, the control circuit board 16 moves the image sensor unit 10 using the first movement mechanism 130X and the second movement mechanism 130Y to cancel out that amount of blur. This allows the camera shake occurring in the imaging device 1 to be corrected.

[0033] <Explanation of the heat dissipation structure of imaging device 1> The heat dissipation structure of the imaging device 1 will be explained using Figures 5A, 5B, 6A, 6B, and 6C.

[0034] Figure 5A is a bottom view of the imaging device 1, and Figure 5B is a cross-sectional view AA of Figure 5A.

[0035] Figure 6A is a rear view of the imaging device 1, Figure 6B is a cross-sectional view of BB in Figure 6A, and Figure 6C is a cross-sectional view of CC in Figure 6A.

[0036] As shown in Figure 6B, the heat generated by the control circuit board 16 is transferred to the first duct 13, which is made of a highly thermally conductive metal such as aluminum, via a thermally conductive material (not shown). Cooled outside air taken in by the cooling fan 17 enters the imaging device 1 through the intake port 6 and flows into the first duct 13, where it exchanges heat with the first duct 13, which has become hot due to the heat generated by the control circuit board 16. The hot air is then taken in by the cooling fan 17 and discharged to the outside through the exhaust port 4 via the third duct 15.

[0037] As shown in Figure 6C, the heat generated by the image sensor substrate 102 of the image sensor unit 10 inside the imaging unit 100 is transferred to a second duct 14 made of a metal such as aluminum with high thermal conductivity. The method of electrically heating from the image sensor substrate 102 to the second duct 14 will be described in detail later. As shown in Figures 5B and 6C, the cooled outside air taken in by the cooling fan 17 enters the inside of the imaging device 1 through the intake port 6 and passes through the first duct 13. After that, it branches off to the second duct 14, where it exchanges heat with the second duct 14, which has become hot due to the heat generated by the image sensor substrate 102. The hot air then passes through the first duct 13 again and is taken in by the cooling fan 17, and is discharged to the outside through the exhaust port 4 via the third duct 15.

[0038] With the configuration described above, the forced air cooling mechanism using the cooling fan 17 can dissipate the heat generated by the image sensor substrate 102 and the control circuit board 16, which are the main heat sources of the imaging device body 2, to the outside of the imaging device 1.

[0039] As mentioned above, the airflow path for the forced air cooling structure passes through the first duct 13, the second duct 14, the third duct 15, and the cooling fan 17. Therefore, within the imaging device body 2, the space that serves as the airflow path for the forced air cooling structure is spatially separated from the space containing other components such as the imaging unit 100 and the control circuit board 16. In other words, the outside air taken into the imaging device body 2 by the forced air cooling structure does not directly come into contact with electrical components involved in imaging, such as the imaging unit 100 and the control circuit board 16. Therefore, even if water droplets or dust enter the imaging device body 2 through the exhaust port 4 or intake port 6, dust and water-resistant protection is possible for these electrical components.

[0040] <Explanation of the heat transfer structure to the second duct 14> The heat transfer structure to the second duct 14 will be explained using Figures 7A and 7B.

[0041] Figure 7A is an example of a front view of the internal components of the imaging device 1.

[0042] Figure 7B is an example of a top view of the internal components of the imaging device 1.

[0043] As shown in Figure 7B, the second duct 14, which branches off from the first duct 13, passes over the control circuit board 16 (+Y side) and around the accessory shoe 5, passing in front of the accessory shoe 5 (+Z side) perpendicular to the optical axis (X direction). At this time, the second duct 14 is positioned so as to overlap with the imaging unit 100 when the imaging device 1 is viewed from above (+Y side). After that, it passes over the control circuit board 16 (+Y side) again and connects to the first duct 13. In this configuration, since the second duct 14 is positioned above the imaging unit 100, it is possible to prevent the imaging device body 2 from becoming larger in the optical axis direction due to the addition of a structure for heat dissipation of the image sensor unit 10.

[0044] Furthermore, the second duct 14 is positioned so as not to come into contact with the imaging unit 100, even when it is at its closest point due to the vibration isolation mechanism. In other words, the second duct 14 is positioned so as not to hinder the movement of the imaging unit 100 by the vibration isolation mechanism.

[0045] The heat generated by the image sensor substrate 102 of the image sensor unit 10 is transferred to the image sensor holding member 105 to which the image sensor substrate 102 is fixed. It is desirable that the image sensor holding member 105 be made of a metal with high thermal conductivity, such as aluminum. The upper surface (+Y side) of the image sensor holding member 105 and the lower surface (-Y side) of the second duct 14 are thermally connected by a heat transfer member 18, as shown in Figure 7A. Here, the heat transfer member 18 is a thin, flexible sheet-like material with high thermal conductivity, such as a graphite sheet.

[0046] The heat transfer member 18 has a curved shape (a shape with at least two or more normal vectors) in a plane perpendicular to the optical axis (XY plane). For example, it has a roughly C-shape as shown in Figure 7A. Furthermore, the length of the heat transfer member 18 in a plane perpendicular to the optical axis (XY plane) is longer than the maximum amount of movement in the vibration isolation mechanism of the image sensor unit 10. Therefore, the heat transfer member 18 does not obstruct the movement of the vibration isolation mechanism of the image sensor unit 10 and can transfer heat to the second duct 14.

[0047] To minimize the impact on image quality, it is desirable for the temperature distribution of the image sensor 101 to be as uniform as possible. Therefore, as shown in Figure 7A, multiple heat transfer members 18 are arranged and connected at equal intervals between the second duct 14 and the image sensor holding member 105. This ensures multiple heat transfer paths from the image sensor substrate 102 to the second duct 14, thereby achieving a more uniform temperature distribution on the image sensor 101.

[0048] Next, we will explain the case where the heat transfer member of the imaging device 1 is not the heat transfer member 18, but a different form of heat transfer member 200, using Figures 8A and 8B.

[0049] Figure 8A is another example of a front view of the internal components of the imaging device 1, and Figure 8B is another example of a perspective view of the internal components of the imaging device 1.

[0050] In the example shown in Figures 8A and 8B, the image sensor holder 105 and the second duct 14 are thermally connected by a heat transfer member 200. Here, the heat transfer member 200 is a thin, flexible sheet-like material with high thermal conductivity, such as a graphite sheet. One end of the heat transfer member 200 is attached to the second duct 14, and the other end is attached to the image sensor holder 105. The heat transfer member 200 is connected in the shape of a helical spiral around a single axis, with an axis 201 parallel to the direction perpendicular to the optical axis and the Y direction (X direction: second direction). The spiral is created by rotating 360 degrees from the starting point 203 to the ending point 204 while moving in the positive X direction around the axis 201.

[0051] The spiral shape of the heat transfer member 200 is such that the spacing 205 between adjacent arcs is longer than the maximum amount of movement in the X direction of the vibration isolation mechanism of the image sensor unit 10. Therefore, even when the image sensor unit 10 moves in the X direction due to its vibration isolation mechanism, the spacing 205 between the arcs extends. As a result, the heat transfer member 200 can transfer heat without hindering the movement in the X direction of the image sensor unit 10 due to its vibration isolation mechanism.

[0052] Furthermore, when the image sensor unit 10 moves in the Y direction due to its vibration damping mechanism, for example, if it moves away from the image sensor holding member 105, the arc of the helix becomes smaller, and conversely, if it moves closer to the image sensor holding member 105, the arc of the helix becomes larger. In other words, the heat transfer member 200 disperses and absorbs the change in its length in the Y direction by changing the size of the arc of the helix. For this reason, the heat transfer member 200 can transfer heat without hindering the movement of the image sensor unit 10 in the Y direction due to its vibration damping mechanism.

[0053] If a graphite sheet is used for the heat transfer member 200, the heat conduction effect will be significantly reduced when it is bent. However, if the heat transfer member 200 has the spiral shape described above, the excess length of the heat transfer member 200 required for movement by the vibration isolation mechanism of the image sensor unit 10 can be distributed and absorbed by changing the arc diameter and the spacing between the arcs. Therefore, bending does not occur in the heat transfer member 200, and the heat conduction effect of the graphite sheet is not hindered. In addition, the heat transfer member 200 has a strip-like, roughly rectangular shape in its unassembled state (not shown). This allows for efficient material extraction from the sheet material, resulting in low-cost production.

[0054] With the configuration described above, the heat generated by the image sensor substrate 102 of the image sensor unit 10 can be efficiently transferred to the second duct 14 without increasing the size of the imaging device body 2 in the optical axis direction.

[0055] Although the present invention has been described in detail above based on its preferred embodiments, the present invention is not limited to these specific embodiments, and various forms that do not depart from the spirit of the invention are also included in the present invention. Some of the above embodiments may be combined as appropriate.

[0056] This embodiment includes the following configurations, methods, and programs. (Configuration 1) An imaging device comprising an image sensor substrate on which an image sensor that converts light from a lens into photoelectricity is mounted, a control circuit board for controlling the entire device, and a vibration isolation mechanism for moving the image sensor substrate in a plane perpendicular to the optical axis of the light from the lens, further comprising a cooling fan and a first duct arranged behind the control circuit board in the optical axis direction of the light from the lens, and a second duct for heat dissipation of the image sensor substrate branched from the first duct, wherein the space inside the first and second ducts is spatially separated from the image sensor substrate and the control circuit board, and at least a part of the second duct is positioned to overlap with the image sensor substrate when the imaging device is viewed from above, and is positioned not to touch the image sensor substrate when it is brought as close as possible by the vibration isolation mechanism. (Configuration 2) The imaging device according to Configuration 1, wherein an external device mounting section to which external devices can be attached is provided on the upper surface of the imaging device, and at least a portion of the flow path inside the second duct passes in front of the optical axis of the external device mounting section. (Configuration 3) The imaging apparatus according to Configuration 1 or 2, further comprising an image sensor holding member for holding the image sensor substrate and a heat transfer member connecting the image sensor holding member and the second duct, wherein the heat transfer member has a shape having at least two normal vectors in a plane perpendicular to the optical axis. (Configuration 4) The imaging apparatus according to Configuration 3, characterized in that a plurality of heat transfer members are arranged at equal intervals between the image sensor holding member and the second duct. (Configuration 5) The imaging apparatus according to any one of Configurations 1 to 4, further comprising an image sensor holding member for holding the image sensor substrate and a heat transfer member connecting the image sensor holding member and the second duct, wherein the heat transfer member has a helical shape around a single axis. (Configuration 6) The imaging device according to Configuration 5, characterized in that the shape of the spiral has an axis parallel to the width direction of the imaging device. (Configuration 7) The imaging apparatus according to Configuration 6, characterized in that the spacing between adjacent arcs of the spiral shape is longer than the maximum amount of movement in the width direction of the image sensor substrate due to the vibration damping mechanism. (Configuration 8) The imaging apparatus according to Configuration 6 or 7, characterized in that when the image sensor substrate moves in the vertical direction of the imaging apparatus by the vibration damping mechanism, the heat transfer member changes the size of the arc of the helix. (Configuration 9) The imaging apparatus according to any one of Configurations 6 to 8, characterized in that the heat transfer member has a strip-shaped, substantially rectangular form when unfolded in an unassembled state. (Configuration 10) The imaging apparatus according to any one of Configurations 6 to 9, characterized in that a graphite sheet is used for the heat transfer member. [Explanation of Symbols]

[0057] 1. Imaging device 2. Imaging device main unit 3 lenses 4 exhaust ports 5 Accessory Shoes 6. Air intake 7. Grip section 8 panels 9-rotation hinge 10 Image sensor unit 11 Vibration Isolation Fixing Unit 12 Front side sheet metal 13. First duct 14. Second duct 15. Third duct 16 Control circuit board 17 Cooling fan 18 Heat transfer member 20 Electrical connection components 100 imaging units 101 Image sensor 102 Image sensor substrate 103 Imaging Movement Flexible Cable 104X First Coil 104Y Second coil 105 Image sensor holding member 120 Rear side fixing plate 121X First Permanent Magnet 121Y Second Permanent Magnet 122X First rear side sheet metal 122Y Second rear side sheet metal 130X First moving mechanism 130Y Second moving mechanism 150 Main Unit 200 Heat transfer member 201 axis 203 Starting point 204 Final stop 205 Arc spacing

Claims

1. An image sensor substrate on which an image sensor that converts light from a lens into photoelectric energy is mounted, An image sensor holding member that holds the image sensor substrate, An image sensor unit including the image sensor substrate and the image sensor holding member, A vibration isolation mechanism that moves the image sensor unit in a plane perpendicular to the optical axis of the lens, A cooling fan and duct are provided for heat dissipation of the image sensor substrate, A heat transfer member thermally connects the upper surface of the image sensor holding member and the lower surface of the duct, An imaging device comprising, The space inside the duct is spatially separated from the space in which the image sensor unit is installed. An imaging device characterized in that at least a portion of the duct is positioned above the image sensor unit and overlaps with the image sensor unit when the imaging device is viewed from above.

2. The imaging device according to claim 1, characterized in that an external device mounting section, to which an external device can be attached, is arranged on the upper surface of the imaging device.

3. The imaging apparatus according to claim 1, characterized in that a plurality of the heat transfer members are arranged between the image sensor unit and the duct.

4. The imaging apparatus according to claim 1, characterized in that the heat transfer member has a curved shape.

5. The imaging apparatus according to claim 1, characterized in that the heat transfer member has a helical shape.

6. The imaging apparatus according to claim 5, characterized in that when the image sensor substrate moves in the vertical direction of the imaging apparatus by the vibration damping mechanism, the heat transfer member changes the size of the arc of the helix.

7. The imaging apparatus according to claim 1, characterized in that the heat transfer member is a strip-shaped, substantially rectangular shape.

8. The imaging apparatus according to claim 1, characterized in that the heat transfer member is a sheet-like member with high thermal conductivity.

9. The imaging apparatus according to claim 8, characterized in that the sheet-like member is a graphite sheet.

Images