Electronic components

Abstract

To provide an electronic component that can be soldered without using a supporting component.SOLUTION: An electronic component according to an aspect of the present disclosure includes a first part having a placement surface placed on a substrate, and a second part provided spaced apart from the substrate, and the center of gravity is located at the second part when installed on the substrate, and the electronic component includes a terminal that is provided so as to protrude from the placement surface to the outside of the first part, is rotatable in a first direction and a second direction opposite to the first direction about a rotation axis of the first part, and engages with the substrate while being rotated in the first direction, and a spring portion that biases the terminal in the second direction when the terminal is engaged with the substrate.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to an electronic component mounted on a substrate.

Background Art

[0002] Conventionally, there is known an electronic component in which a part is soldered to a substrate and most of the other part is provided spaced apart from the substrate, such as a variable resistor (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Since the center of gravity of such an electronic component is located outside the soldered portion, it will tilt when placed on the substrate. For example, in a variable resistor, a rotating body (shaft) provided spaced apart from the substrate will tilt toward the substrate.

[0005] Therefore, conventionally, when performing soldering, in order to prevent the above-described tilt, it is known to use a support component that supports the portion provided spaced apart from the substrate.

[0006] However, when using a support component, there are various problems in terms of cost and the like.

[0007] An object of one aspect of the present disclosure is to provide an electronic component that can be soldered without using a support component.

Means for Solving the Problems

[0008] An electronic component according to one aspect of the present disclosure has a first portion having a placement surface on which it is placed on a substrate, and a second portion provided spaced apart from the substrate, wherein the center of gravity is located at the second portion when it is placed on the substrate, and the electronic component has a terminal provided protruding from the placement surface outward from the first portion, which is rotatable about an axis of rotation inside the first portion in a first direction and in a second direction opposite to the first direction, which engages with the substrate when rotated in the first direction, and a spring portion which biases the terminal engaged with the substrate in the second direction.

[0009] An electronic component according to one aspect of the present disclosure has a first portion having a placement surface on which it is placed on a substrate, and a second portion provided spaced apart from the substrate, wherein the center of gravity is located at the second portion when it is placed on the substrate, and has a terminal that protrudes from the placement surface outward from the first portion and engages with the substrate, the terminal is It has a first extended portion that protrudes and extends from the aforementioned arrangement surface, and a second extended portion that extends from the tip of the first extended portion at a predetermined angle with respect to the extending direction of the first extended portion, It possesses elasticity such that when displaced in a first direction by an external force, it is biased in a second direction opposite to the first direction by a restoring force. After the terminal is displaced in the first direction and passes through the hole in the substrate, it moves in the second direction due to the restoring force, and the second extension engages with the back surface of the substrate. . [Effects of the Invention]

[0010] According to this disclosure, soldering can be performed without using support components. [Brief explanation of the drawing]

[0011] [Figure 1] Side view showing the first state of a variable resistor according to Embodiment 1 of this disclosure. [Figure 2] Side view showing the second state of the variable resistor according to Embodiment 1 of this disclosure [Figure 3] A side view showing the variable resistor according to Embodiment 1 of this disclosure mounted on a substrate. [Figure 4] Side view showing the first state of the variable resistor according to Embodiment 2 of this disclosure [Figure 5] Side view showing the second state of the variable resistor according to Embodiment 2 of this disclosure [Figure 6]Side view and bottom view showing a first example of a variable resistor according to Embodiment 2 of the present disclosure attached to a substrate [Figure 7] Side view and bottom view showing a second example of a variable resistor according to Embodiment 2 of the present disclosure attached to a substrate

Embodiments for Carrying Out the Invention

[0012] Hereinafter, Embodiments 1 and 2 of the present disclosure will be described with reference to the drawings. Note that the same reference numerals are assigned to common components in each figure, and their descriptions will be omitted as appropriate.

[0013] <Embodiment 1> The configuration of the variable resistor 100 according to Embodiment 1 of the present disclosure will be described using FIGS. 1 and 2. FIGS. 1 and 2 are side views showing the first state and the second state of the variable resistor 100, respectively. The variable resistor 100 described below corresponds to an example of the "electronic component" of the present disclosure.

[0014] As shown in FIGS. 1 and 2, the variable resistor 100 has a fixed portion 1, a shaft portion 2, a protrusion portion 10, terminals 20, terminals 30, a spring portion 40, and a rotation shaft 50.

[0015] The fixed portion 1 rotatably supports the shaft portion 2. The shaft portion 2 extends along the longitudinal direction (left - right direction in the figure) of the variable resistor 100.

[0016] Note that, since known techniques can be applied to the internal configuration of the fixed portion 1 and the shaft portion 2, their descriptions are omitted. The fixed portion 1 corresponds to an example of the "first part", and the shaft portion 2 corresponds to an example of the "second part".

[0017] The fixed portion 1 has an arrangement surface A that is arranged on the substrate via solder. In the present embodiment, when the arrangement surface A is arranged on the substrate, the shaft portion 2 is provided spaced apart from the substrate (see FIG. 3 described later), and it is assumed that the center of gravity of the variable resistor 100 is located at the shaft portion 2.

[0018] As shown in FIGS. 1 and 2, a protrusion 10, a terminal 20, and a terminal 30 are provided on the placement surface A.

[0019] The terminal 30 is a characteristic component of the present embodiment. The terminal 30 has a first extension part 31 protruding from the placement surface A, and a second extension part 32 extending perpendicularly (in other words, having a 90-degree angle) from the tip of the first extension part 31 in the extension direction of the first extension part 31 (the vertical direction in the figure), and the second extension part 32 is shorter than the first extension part 31. That is, the terminal 30 is L-shaped. Note that the angle formed by the first extension part 31 and the second extension part 32 is not limited to 90 degrees, and may be a predetermined angle greater than zero degrees (that is, not limited to an L-shape).

[0020] Inside the fixing part 1, a spring part 40 and a rotating shaft 50 are provided.

[0021] The spring part 40 is an elastic member that can expand and contract. One end of it is fixed to the rotating shaft 50, and the other end is fixed to the inner wall of the fixing part 1 or the like. As the spring part 40, a tension coil spring can be used, but it is not limited to this.

[0022] The rotating shaft 50 is a member that is rotatably supported, and one end of the spring part 40 and one end of the terminal 30 (the first extension part 31) are fixed thereto. The rotating shaft 50 can rotate in the direction of arrow a shown in FIG. 1 (counterclockwise direction) and the direction of arrow b shown in FIG. 2 (clockwise direction). Along with this rotating shaft 50, the terminal 30 also rotates. Note that the direction of arrow a corresponds to an example of the "first direction", and the direction of arrow b corresponds to an example of the "second direction".

[0023] For example, when the user presses the terminal 30 in the state shown in FIG. 1 with a finger or the like and applies a force in the direction of arrow a, the rotating shaft 50 rotates in the direction of arrow a, and the spring part 40 extends. As a result, the terminal 30 rotates in the direction of arrow a and reaches the state shown in FIG. 2 (the state where the first extension part 31 is parallel to the placement surface A). The state of the variable resistor 100 when the terminal 30 is in the state shown in FIG. 2 is referred to as the "second state".

[0024] On the other hand, when the user releases their finger or the like from the terminal 30 in the state shown in Figure 2, the spring portion 40 contracts due to its restoring force, and the rotation shaft 50 rotates in the direction of arrow b. As a result, the terminal 30 rotates in the direction of arrow b and returns to the state shown in Figure 1 (the state in which the second extension portion 32 is parallel to the arrangement surface A). The state of the variable resistor 100 in which the terminal 30 is in the state shown in Figure 1 is called the "first state".

[0025] The configuration of the variable resistor 100 has been explained above.

[0026] Next, we will explain how to mount the variable resistor 100 described above onto the circuit board using Figure 3. Figure 3 is a side view showing the variable resistor 100 mounted on the circuit board 60. Here, we will use the case where reflow soldering is performed as an example.

[0027] First, solder 70 (for example, solder paste) is applied to the mounting position of the variable resistor 100 on side B of the circuit board 60.

[0028] Next, the variable resistor 100 in the first state (see Figure 1) is rotated in the direction of arrow a to the second state (see Figure 2). Then, the variable resistor 100 is placed on the solder 70. Specifically, the placement surface A of the fixing part 1 and the first extension 31 of the terminal 30 are placed on the solder 70. At this time, the projection 10, the terminal 20, and the second extension 32 of the terminal 30 are inserted into holes H1, H2, and H3 provided in the substrate 60, respectively. Holes H1 to H3 are holes that penetrate through the substrate 60 in the thickness direction. Note that solder 70 may be present in holes H1 to H3.

[0029] When terminal 30 engages with the substrate 60 in this manner, terminal 30 is biased in the direction of arrow b by the restoring force of spring portion 40. Since the direction of this restoring force is opposite to the direction in which shaft portion 2 faces surface B of substrate 60, shaft portion 2 does not tilt toward surface B of substrate 60. In other words, the variable resistor 100 placed on substrate 60 can maintain the correct posture shown in Figure 3 without using a support member.

[0030] Subsequently, the solder 70 is heated and melted using a predetermined heating device (not shown). As a result, the variable resistor 100 (specifically, the first extension portion 31 of the terminal 30, the projection portion 10, and the terminal 20) is soldered to the substrate 60 (specifically, surface B), and the variable resistor 100 is fixed to the substrate 60.

[0031] The above describes how to mount the variable resistor 100 onto the circuit board 60.

[0032] As described above, the variable resistor 100 of this embodiment has a fixed part 1 (an example of a first part) having an arrangement surface A that is placed on a substrate 60, and a shaft part 2 (an example of a second part) provided spaced apart from the substrate 60, and the center of gravity of the variable resistor 100 (an example of an electronic component) is located at the shaft part 2 when it is placed on the substrate 60, and is provided protruding from the arrangement surface A to the outside of the fixed part 1, and is rotatable about a rotation axis 50 inside the arrangement surface 1 in the direction of arrow a (an example of a first direction) and in the direction of arrow b (an example of a second direction) opposite to that direction, and is characterized by having a terminal 30 that engages with the substrate 60 when rotated in the direction of arrow a, and a spring part 40 that biases the terminal 30, which is engaged with the substrate 60, in the direction of arrow b.

[0033] This feature allows the variable resistor 100 to be positioned correctly on the circuit board 60 and soldered without the need for support members. Therefore, various problems that arise when using support members (for example, an increase in the number of components due to the use of support members, thermal expansion of the support members due to reflow soldering, generation of waste when the support members are discarded after reflow soldering, and costs associated with the manufacturing, transportation, and management of support members) can be solved.

[0034] <Embodiment 2> The configuration of the variable resistor 200 according to Embodiment 2 of this disclosure will be explained using Figures 4 and 5. Figures 4 and 5 are side views showing the first and second states of the variable resistor 200, respectively. The variable resistor 200 described below corresponds to an example of the "electronic component" of this disclosure.

[0035] As shown in Figures 4 and 5, the variable resistor 200 has a fixed portion 1, a shaft portion 2, a projection portion 10, terminals 20 and 30, similar to the variable resistor 100 described in Embodiment 1. On the other hand, the variable resistor 200 does not have the spring portion 40 and the rotating shaft 50 described in Embodiment 1.

[0036] The following describes the differences between the variable resistor 200 and the variable resistor 100 of Embodiment 1.

[0037] Terminal 30 is a characteristic component of this embodiment and, like in Embodiment 1, is an L-shaped terminal having a first extension portion 31 and a second extension portion 32. Also, as in Embodiment 1, the angle formed by the first extension portion 31 and the second extension portion 32 is not limited to 90 degrees, but can be any predetermined angle greater than zero degrees (i.e., not limited to an L-shape).

[0038] Terminal 30 is a terminal that deforms when an external force is applied and returns to its original shape by a restoring force when the external force is removed. The materials used to construct terminal 30 include, but are not limited to, elastic steel, phosphor bronze, stainless steel, and alloy materials.

[0039] Although not shown in the diagram, one end of the first extension portion 31 of the terminal 30 is fixed to a predetermined member (for example, a circuit board) within the fixing portion 1.

[0040] For example, if a user applies force in the direction of arrow a by pressing the terminal 30 in the first state shown in Figure 4 with their finger, the portion of the first extension 31 closest to one end (the part fixed to the fixing part 1) will bend in the direction of arrow a. As a result, the terminal 30 rotates in the direction of arrow a, resulting in the state shown in Figure 5 (where the first extension 31 is parallel to the arrangement surface A).

[0041] On the other hand, if the user releases their finger or other object from the terminal 30 in the state shown in Figure 5, the terminal 30 is biased in the direction of arrow b by its restoring force. As a result, the terminal 30 rotates in the direction of arrow b and returns to the state shown in Figure 4 (the state in which the second extension portion 32 is parallel to the arrangement surface A).

[0042] In other words, the terminal 30 of this embodiment is characterized by having elasticity that allows it to be bent in the direction of arrow a by an external force (see Figure 4), and then, when the external force is removed, be biased in the direction of arrow b by a restoring force to return to its original shape.

[0043] The configuration of the variable resistor 200 has been explained above.

[0044] The method for mounting the above-mentioned variable resistor 200 to the circuit board will be explained below using Figures 6 and 7.

[0045] First, the first mounting example will be explained using Figure 6. The upper and lower figures in Figure 6 are a side view and a bottom view, respectively, showing the variable resistor 200 mounted on the circuit board 60. Note that the upper figure in Figure 6 shows the cross-section of the circuit board 60 as shown in the lower figure in Figure 6. Here, as an example, we will consider the case where reflow soldering is performed.

[0046] First, solder 70 (for example, solder paste) is applied to the mounting position of the variable resistor 200 on side B of the circuit board 60.

[0047] Next, the variable resistor 200 in the first state (see Figure 4) is bent (rotated) in the direction of arrow a to reach the second state (see Figure 5). Then, the variable resistor 200 is placed on the solder 70. Specifically, the first extension 31 of the terminal 30 is placed on the solder 70. At this time, the projection 10, the terminal 20, and the second extension 32 of the terminal 30 are inserted into holes H1, H2, and H3 provided in the substrate 60, respectively. Note that solder 70 may be present in the holes H1 to H3.

[0048] When terminal 30 engages with the substrate 60 in this way, terminal 30 is biased in the direction of arrow b by its own restoring force. Since the direction of this restoring force is opposite to the direction in which the shaft portion 2 faces surface B of the substrate 60, the shaft portion 2 does not tilt toward surface B of the substrate 60. In other words, the variable resistor 200 placed on the substrate 60 can maintain the correct posture shown in the upper part of Figure 6 without using a support member.

[0049] Subsequently, the solder 70 is heated and melted using a predetermined heating device (not shown). As a result, the variable resistor 200 (specifically, the first extension portion 31 of the terminal 30, the projection portion 10, and the terminal 20) is soldered to the substrate 60 (specifically, surface B), and the variable resistor 200 is fixed to the substrate 60.

[0050] Next, a second mounting example will be explained using Figure 7. The upper and lower figures of Figure 7 are a side view and a bottom view, respectively, showing the variable resistor 200 mounted on the circuit board 60. Note that the upper figure of Figure 7 shows the cross-section of the circuit board 60 as shown in the lower figure of Figure 7.

[0051] In this example, as shown in Figure 7, the substrate 60 differs in that it has a larger hole H4 instead of the hole H3 shown in Figure 6.

[0052] First, solder 70 (for example, solder paste) is applied to the area around the hole H4 on the back surface of side B of the substrate 60 (the area where the second extended portion 32 engages).

[0053] Next, the terminal 30 in the state shown in Figure 4 is bent slightly in the direction of arrow a (for example, to an intermediate position between the position shown in Figure 4 and the position shown in Figure 5), and the second extension portion 32 is inserted into the hole H4 in that state. At the same time, the projection portion 10 and the terminal 20 are inserted into the holes H1 and H2, respectively.

[0054] Subsequently, when the second extension portion 32 passes through the hole H4, the terminal 30 is biased in the direction of arrow b and returns to its original position (the position shown in Figure 4). As a result, the second extension portion 32 is positioned on the solder 70 attached to the back surface B of the substrate 60 (see the upper diagram in Figure 7). At this time, the tips of the projection portion 10 and the terminal 20 protrude from the holes H1 and H2, respectively (see the upper diagram in Figure 7).

[0055] Next, the solder 70 between the substrate 60 and the second extended portion 32 is heated and melted using a predetermined heating device (not shown). In addition, flow soldering is performed around the projections 10 and terminals 20 that protrude from the back surface of surface B (solder is not shown in the upper and lower diagrams of Figure 7).

[0056] As a result, the variable resistor 200 (specifically, the second extension portion 32 of terminal 30, the projection portion 10, and terminal 20) is soldered to the substrate 60 (specifically, the back surface of side B), and the variable resistor 200 is fixed to the substrate 60.

[0057] In this way, the variable resistor 200 placed on the substrate 60 can maintain the correct orientation shown in the upper diagrams of Figures 6 and 7 without using any support members.

[0058] The above describes how to mount the variable resistor 200 onto the circuit board 60.

[0059] As described above, the variable resistor 200 of this embodiment has a fixed part 1 (an example of a first part) having an arrangement surface A that is placed on a substrate 60, and a shaft part 2 (an example of a second part) provided spaced apart from the substrate 60, and the center of gravity of the variable resistor 200 (an example of an electronic component) when placed on the substrate 60 is located at the shaft part 2, and has a terminal 30 that protrudes from the arrangement surface A to the outside of the fixed part 1 and engages with the substrate 60, and the terminal 30 is characterized in that when bent in the direction of arrow a (an example of a first direction) by an external force, it is biased in the direction of arrow b (an example of a second direction) in the opposite direction by a restoring force.

[0060] This feature allows the variable resistor 200 to be positioned correctly on the substrate 60 and soldered without using a support member, similar to Embodiment 1. Therefore, various problems that arise when using a support member (for example, an increase in the number of components due to the use of a support member, thermal expansion of the support member due to reflow soldering, generation of waste when the support member is discarded after reflow soldering, and costs associated with the manufacturing, transportation, and management of support parts) can be solved.

[0061] <Variation> This disclosure is not limited to the descriptions of Embodiments 1 and 2 above, and various modifications are possible without departing from its spirit.

[0062] For example, the above explanation used the case where the terminal 30 is L-shaped, but it is not limited to this. In other words, the terminal 30 can have any shape other than L-shape that can engage with the substrate 60.

[0063] Furthermore, although the above explanation used reflow soldering as an example, it is not limited to this. In other words, even when performing flow soldering, the variable resistors 100 and 200 can exhibit the effects described above. [Industrial applicability]

[0064] The electronic components of this disclosure are useful for electronic components placed on a substrate. [Explanation of Symbols]

[0065] 1 Fixed part 2. Shaft section 10 Protrusion 20 terminals 30 terminals 31 1st extension section 32 2nd extension section 40 Spring section 50 Rotation axis 60 circuit boards 70 Handa 100, 200 variable resistors

Claims

1. An electronic component having a first portion with an arrangement surface for placement on a substrate, and a second portion provided spaced apart from the substrate, wherein the center of gravity is located at the second portion when the component is placed on the substrate, A terminal is provided that protrudes from the arrangement surface outward from the first portion, is rotatable about a rotation axis inside the first portion in a first direction and in a second direction opposite to the first direction, and engages with the substrate when rotated in the first direction, The device has a spring portion that biases the terminal, which is engaged with the substrate, in the second direction. Electronic components.

2. The aforementioned terminal is A first extended portion that protrudes and extends from the aforementioned arrangement surface, It comprises a second extended portion that extends from the tip of the first extended portion at a predetermined angle greater than zero degrees with respect to the extending direction of the first extended portion, When the terminal is rotated in the first direction, the second extension is inserted into the hole in the substrate, causing the terminal to engage with the substrate. The electronic component according to claim 1.

3. The aforementioned electronic component is a variable resistor, The second part is a shaft portion that extends along the longitudinal direction of the electronic component. The electronic component according to claim 1 or 2.

4. An electronic component having a first portion with an arrangement surface for placement on a substrate, and a second portion provided spaced apart from the substrate, wherein the center of gravity is located at the second portion when the component is placed on the substrate, It is provided protruding from the aforementioned arrangement surface to the outside of the first portion and has a terminal that engages with the substrate, The aforementioned terminal is It has a first extended portion that protrudes and extends from the aforementioned arrangement surface, and a second extended portion that extends from the tip of the first extended portion at a predetermined angle with respect to the extending direction of the first extended portion, It possesses elasticity such that when displaced in a first direction by an external force, it is biased in a second direction opposite to the first direction by a restoring force. After the terminal is displaced in the first direction and passes through the hole in the substrate, it moves in the second direction due to the restoring force, and the second extension engages with the back surface of the substrate. Electronic components.

5. With the terminal bent in the first direction and the second extension inserted into the hole in the substrate, the first extension is soldered to the substrate. The electronic component according to claim 4.

6. The second extension portion is inserted into the hole in the substrate with the terminal bent in the first direction. Subsequently, when the second extension passes through the hole in the substrate, the terminal is biased in the second direction and returns to its original position. With the first extended portion inserted into the hole in the substrate and the second extended portion protruding from the hole in the substrate, the second extended portion is soldered to the substrate. The electronic component according to claim 4.

7. The aforementioned electronic component is a variable resistor, The second part is a shaft portion that extends along the longitudinal direction of the electronic component. The electronic component according to claim 4.

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