A resistance structure

Abstract

This utility model discloses a resistor structure, including a resistor body, an insulating plate, and two leads. The resistor body has two opposing working ends. The insulating plate is stacked on one side of the resistor body along its thickness direction and includes a first region and a second region located at both ends and extending beyond the working ends. The leads are connected to the working ends, with their bent portions bent towards the insulating plate and covering at least part of the second region. Leads extend from the second region towards the first region, and the pins extend along the width direction away from the resistor body. This structure, through the bending and lead-out design of the leads, ensures that the insertion direction of the pins is perpendicular to the thickness direction of the resistor body. The shape and size of the resistor body are no longer limited by the leads, improving the versatility of the circuit board. Simultaneously, since neither side of the resistor body faces the circuit board, heat dissipation is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip resistor technology, and specifically to a resistor structure. Background Technology

[0002] In existing technologies, surface-mount resistors are typically fixed to the circuit board via plug-in connections using leads positioned on the working surface of the resistor body. This means the position of the resistor leads is limited by the plug-in locations on the circuit board, restricting the area of ​​the resistor's working surface and hindering flexible adjustments to its shape and size. Furthermore, the working surface facing the circuit board is obstructed, resulting in poor heat dissipation. While adding a heatsink or fan can improve cooling, the limited heat dissipation area prevents a satisfactory improvement. Extending the leads directly outwards along the thickness of the resistor body can mitigate these shortcomings, but it introduces insufficient rigidity after installation, compromising the stability of the resistor structure. Utility Model Content

[0003] The present invention aims to provide a resistor structure that can be designed with greater flexibility in shape and size, better heat dissipation, and guaranteed structural strength.

[0004] To solve the above technical problems, this utility model provides a resistor structure, comprising:

[0005] A resistor having two working ends that are arranged opposite each other in the length direction;

[0006] An insulating plate, stacked on one side of the resistor in the thickness direction, the insulating plate includes a first region and two second regions disposed at both ends of the first region in the length direction. The projection of the first region in the thickness direction coincides with the resistor, and each of the second regions extends beyond its corresponding working end in the length direction.

[0007] Two pins are provided, each pin being connected to the corresponding working end on the side away from the resistor. Each pin includes a bent portion, a lead-out portion, and a plug-in portion arranged sequentially adjacent to each other. The bent portion is connected to the corresponding working end and bends from the working end toward the side where the insulating plate is located to cover at least a portion of the second area. The lead-out portion extends from the second area toward the direction closer to the first area. The plug-in portion extends from one side of the corresponding lead-out portion in the width direction toward the direction away from the resistor.

[0008] Optionally, the insulating plate is a ceramic plate; and / or,

[0009] The second zone has a rounded chamfer at its edge along the length direction.

[0010] Optionally, the resistor structure further includes a heat dissipation device, which is attached to the side of the resistor facing away from the insulating plate.

[0011] Optionally, the resistor structure further includes an encapsulation portion disposed on the side of the heat dissipation device that is in contact with the insulating plate, and encapsulating the resistor and the insulating plate therein, with the plug prongs extending outward from the encapsulation portion.

[0012] Optionally, the encapsulation part is made of epoxy resin with added alumina filler.

[0013] Optionally, each of the bent portions covers the entire second region, and the projection of the lead-out portion in the thickness direction falls within the projection range of the first region.

[0014] Optionally, each of the connector pins includes a first segment adjacent to the lead-out portion and a second segment relatively far from the lead-out portion, wherein the cross-section of the first segment in the width direction is larger than that of the second segment.

[0015] Optionally, each of the bent portions has a groove on the side facing the working end, the groove extending in the width direction and being distributed at least on the outer periphery near the working end.

[0016] Optionally, multiple grooves are provided, and the multiple grooves are distributed at intervals along the length direction.

[0017] Optionally, two grooves are provided, which are respectively located on both sides of the working end in the thickness direction, and in the projection view along the width direction, each groove extends obliquely from the corner of the working end towards the outer periphery.

[0018] The technical solution provided by this utility model has the following advantages:

[0019] This invention provides a resistor structure including a resistor body, an insulating plate, and two leads. The resistor body has two opposing working ends. The insulating plate is stacked on one side of the resistor body along its thickness direction and includes a first region and a second region located at both ends and extending beyond the working ends. The leads are connected to the working ends, with their bent portions bent towards the insulating plate and covering at least part of the second region. Leads extend from the second region towards the first region, and the pins extend in the width direction away from the resistor body. In the embodiments provided by this invention, the bending and lead-out design of the leads makes the insertion direction of the pins perpendicular to the thickness direction of the resistor body. The shape and size of the resistor body are no longer limited by the leads, improving the versatility of the circuit board. Simultaneously, since neither side of the resistor body faces the circuit board, heat dissipation is improved. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 A projection view in the thickness direction of an embodiment of the resistor structure provided by this utility model;

[0022] Figure 2 for Figure 1 A bottom view of the medium-resistance structure;

[0023] Figure 3 for Figure 1 Assembly diagram of the medium resistance element, lead components, and insulating plate;

[0024] Figure 4 for Figure 3 Top view of the medium resistance element, lead components, and insulating plate;

[0025] Figure 5 for Figure 3 Front view of the intermediate resistance element and lead components before assembly;

[0026] Figure 6 for Figure 5 Top view of the medium resistance element and lead components before assembly.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1-Resistor structure; 10-Resistor body; 11-Working terminal; 20-Insulating plate; 21-First zone; 22-Second zone; 30-Pin; 31-Bending part; 311-Groove; 32-Lead-out part; 33-Plug-in pin; 331-First segment; 332-Second segment; 40-Heat dissipation device; 50-Package part. Detailed Implementation

[0029] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The present utility model will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0031] Please see Figures 1 to 6 This utility model provides a resistor structure 1. Please refer to [link / reference]. Figures 1 to 3 The resistor structure 1 includes a resistor body 10, an insulating plate 20, and two leads 30. The resistor body 10 has two working ends 11 arranged opposite each other along its length, used for electrical connection. The resistor body 10 is preferably an alloy resistor. The insulating plate 20 is stacked on one side of the resistor body 10 along its thickness direction. It includes a first region 21 located in the middle and two second regions 22 located at opposite ends of the first region 21 along its length. The projection of the first region 21 along its thickness direction completely coincides with the resistor body 10, while each of the second regions 22 extends beyond its corresponding working end 11 along its length. The two leads 30 are respectively connected to the side of the corresponding working end 11 away from the resistor body 10, thereby conducting current to the resistor body 10. The leads 30 can be made of copper. Each pin 30 includes a bent portion 31, a lead-out portion 32, and a plug-in pin 33 arranged sequentially adjacent to each other. The bent portion 31 is fixed to the working end 11 by welding, crimping, or other suitable connection methods, and bends from the working end 11 toward the side where the insulating plate 20 is located to cover at least part of the second region 22. The lead-out portion 32 extends from the second region 22 toward the first region 21, and its extension length can be adjusted according to the required insertion width. The plug-in pin 33 extends from one side of the corresponding lead-out portion 32 in the width direction away from the resistor 10, and its shape and size can be adaptively designed according to the insertion requirements so that it can be inserted into the corresponding circuit.

[0032] Preferably, the connector pin 33 includes a first segment 331 adjacent to the lead-out portion 32 and a second segment 332 relatively far from the lead-out portion 32. The cross-section of the first segment 331 in the width direction can be larger than that of the second segment 332 to enhance contact stability and mechanical strength when plugged into the circuit board. Thus, the first segment 331 and the second segment 332 form a stepped structure. The connection between the first segment 331 and the lead-out portion 32 can be achieved using an integral molding process, such as stamping or die casting, to ensure conductive continuity. The second segment 332 can be finely machined according to the size of the circuit board's plug-in hole. In this embodiment, the larger cross-section of the first segment 331 provides lower contact resistance, reduces heat generation during current flow, and enhances the connection rigidity with the lead-out portion 32. The smaller cross-section of the second segment 332 can precisely match the size of the circuit board's plug-in hole, avoiding installation difficulties caused by hole diameter limitations. When resistor structure 1 is inserted into the circuit board, the wide structure of the first segment 331 forms a surface contact with the surface of the circuit board. After being soldered through the pads, it can withstand greater shear and tensile forces, while the slender structure of the second segment 332 extends deep into the hole, forming a dual function of mechanical locking and electrical connection.

[0033] In practical applications, the insulating plate 20 can be made of materials such as ceramic plate, fiberglass plate, or epoxy resin plate. Among them, ceramic plate is particularly suitable for high-temperature working environments due to its excellent high-temperature resistance and thermal conductivity. The shape and size of the resistor 10 can also be flexibly designed according to the resistance value and power requirements. The thickness of the ceramic plate can be adjusted according to the size of the resistor 10 and the mechanical strength requirements. For example, when the thickness of the resistor 10 is 2mm, the thickness of the ceramic plate can be set to 0.5-1.5mm. The ceramic plate and the resistor 10 can be fixed by high-temperature sintering process to form a tightly integrated structure, avoiding the influence of relative displacement on the resistance performance. Optionally, the edge of the second region 22 in the length direction can be designed as an arc chamfer or rounded arc to reduce stress concentration and improve the safety during assembly.

[0034] In this embodiment, the bent portion 31 of the pin 30, through its connection with the working end 11 of the resistor 10 and its covering of the second region 22 of the insulating plate 20, forms an integral mechanical structure of the pin 30, the resistor 10, and the insulating plate 20. The insulating plate 20 provides insulation and isolation for the resistor 10, preventing short circuits from occurring when it comes into contact with the pin 30. The design of the second region 22 extending beyond the working end 11 provides a supporting foundation for the bent portion 31. The rigid support of the insulating plate 20 effectively enhances the structural rigidity of the pin 30, avoiding the problem of insufficient rigidity caused by the traditional pin extending directly from the thickness direction of the resistor 10.

[0035] In this embodiment, the lead-out portion 32 moves the insertion pin 33 of the lead member 30 from near the working end 11 of the resistor 10 to the central region of the insulating plate 20, and the insertion direction extends along the thickness direction. Unlike the conventional resistor 10 structure, where the thickness direction of the resistor 10 is perpendicular to the circuit board and the insertion direction is perpendicular to the resistor 10, this not only limits the size of the resistor 10 to the pin position, but also results in poor heat dissipation performance due to the shielding of the circuit board.

[0036] In this embodiment, the position and insertion direction of the pins are changed, making the shape and size design of the resistor 10 more flexible. The volume of the resistor 10 can be increased according to actual needs to meet the design requirements of high power and high resistance. The design of the insertion pin 33 extending along the width direction makes the thickness direction of the resistor 10 parallel to the circuit board. The two large side areas of the resistor 10 in the thickness direction are no longer blocked by the circuit board, resulting in better heat dissipation performance.

[0037] In particular, since the side of the resistor 10 facing away from the insulating plate 20 is not blocked by the circuit board, it can be directly exposed to the air to provide good heat dissipation conditions.

[0038] Optionally, the resistor structure 1 further includes a heat dissipation device 40. The heat dissipation device 40 is attached to the side of the resistor 10 facing away from the insulating plate 20. The heat dissipation device 40 can be a heat sink, a finned heat sink, or an active cooling fan. By directly contacting the back of the resistor 10, the heat dissipation device 40 absorbs the heat generated by the resistor 10 during operation and conducts or radiates it outward through its own structure. This significantly improves heat dissipation efficiency and is particularly suitable for scenarios requiring long-term high-power operation.

[0039] In summary, the resistor structure 1, through the ingenious arrangement of the pins 30 and the insulating plate 20, significantly improves the design flexibility and heat dissipation effect of the resistor 10 shape and size while ensuring structural strength and insulation performance.

[0040] Optionally, the resistor structure 1 further includes an encapsulation portion 50, which is disposed on the side of the heat dissipation device 40 that is in contact with the insulating plate 20, and encapsulates the resistor 10 and the insulating plate 20 therein. The pin 33 extends outward from the encapsulation portion 50. Specifically, the encapsulation portion 50 can be made of insulating materials such as epoxy resin and silicone, and formed by processes such as potting and molding. Preferably, the encapsulation portion 50 is filled with alumina filler to enhance its heat dissipation performance. In addition, the encapsulation portion 50 can be integrated with the heat dissipation device 40, for example, by forming a chemical bond between the encapsulation material and the surface of the heat dissipation device 40 during the molding process, thereby enhancing the bonding force and reducing thermal resistance. In this embodiment, the encapsulation portion 50 forms a physical protective layer by wrapping the resistor 10 and the insulating plate 20, preventing damage to the internal structure from external mechanical impacts, dust, or liquids. At the same time, the encapsulation material, as an insulating medium, further isolates the pin 30 from other components, improving electrical safety. The addition of thermally conductive filler can make the encapsulation part 50 an auxiliary heat dissipation path, transferring the heat of the resistor 10 to the heat dissipation device 40 through the encapsulation part 50.

[0041] Preferably, please refer to the following: Figures 1 to 3 In this embodiment, each bend 31 covers the entire second region 22, and the projection of the lead-out portion 32 in the thickness direction is located within the projection range of the first region 21. This ensures that the mechanical load of the pin 30 is uniformly transferred to the insulating plate 20 through the entire area of ​​the second region 22, avoiding the risk of breakage due to excessive local stress. Since the second region 22 extends beyond the working end 11, it provides greater torque resistance as a support surface, allowing the stress on the pin 30 to be dispersed throughout the entire insulating plate 20 structure through the path of bend 31-second region 22-first region 21 when subjected to insertion / extraction forces or vibrations, rather than being concentrated at the connection point between the resistor 10 and the pin.

[0042] Based on any of the above embodiments, please refer to the following: Figures 3 to 6The bent portion 31 of the lead member 30 also has a groove 311 on the side facing the working end 11. The groove 311 extends along the width direction and is distributed at least near the outer periphery of the working end 11. Preferably, multiple grooves 311 are provided, and the multiple grooves 311 are spaced apart in the length direction. It is understood that the bent portion 31 is prone to fatigue deformation or even fracture due to bending processing. These grooves 311 can further increase the contact area between the bent portion 31 and the working end 11, improve the connection reliability, and at the same time help to disperse stress and avoid structural damage caused by local stress concentration.

[0043] Ideally, two grooves 311 are provided, located on both sides of the working end 11 in the thickness direction. In the projection view along the width direction, each groove 311 extends obliquely from the corner of the working end 11 towards the outer periphery. The oblique directions of the two grooves 311 can be designed symmetrically. For example, the left groove 311 obliques from the upper left corner of the working end 11 to the lower right, and the right groove 311 obliques from the upper right corner to the lower left, forming a figure-eight distribution. The cross-sectional shape of the grooves 311 can be V-shaped or U-shaped. The tip of the V-shaped groove 311 points outward, which can more effectively guide the stress to diffuse outward; the U-shaped groove 311 is convenient for accommodating solder and enhances the welding strength. In this embodiment, the two obliquely distributed grooves 311 form symmetrical stress diversion paths on both sides of the working end 11. When the lead 30 is subjected to lateral shear force, the left groove 311 will guide the stress to the upper left direction, and the right groove 311 will guide it to the upper right direction, so that the resultant force is decomposed into a component force perpendicular to the direction of the groove 311, and the energy is consumed through the plastic deformation of the material. This design utilizes geometric symmetry to transform concentrated stress into distributed stress, avoiding the stress concentration problem that is prone to occur in traditional right-angle connections.

[0044] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, those skilled in the art can make other variations or modifications without creative effort, and all such variations or modifications should fall within the protection scope of this utility model.

Claims

1. A resistor structure, characterized in that, include: A resistor having two working ends that are arranged opposite each other in the length direction; An insulating plate, stacked on one side of the resistor in the thickness direction, the insulating plate includes a first region and two second regions disposed at both ends of the first region in the length direction. The projection of the first region in the thickness direction coincides with the resistor, and each of the second regions extends beyond its corresponding working end in the length direction. Two pins are provided, each pin being connected to the side of the corresponding working terminal away from the resistor. Each pin includes a bent portion, a lead-out portion, and a plug-in portion arranged sequentially adjacent to each other. The bent portion is connected to the corresponding working terminal and bends from the working terminal toward the side where the insulating plate is located to cover at least a portion of the second area. The lead-out portion extends from the second area toward the direction closer to the first area. The plug-in portion extends from one side of the corresponding lead-out portion in the width direction toward the direction away from the resistor.

2. The resistor structure as described in claim 1, characterized in that, The insulating plate is a ceramic plate; and / or, The second zone has a rounded chamfer at its edge along the length direction.

3. The resistor structure as described in claim 1, characterized in that, The resistor structure also includes a heat dissipation device, which is attached to the side of the resistor facing away from the insulating plate.

4. The resistor structure as described in claim 3, characterized in that, The resistor structure also includes an encapsulation part, which is disposed on the side of the heat dissipation device that is in contact with the insulating plate, and encapsulates the resistor and the insulating plate therein, with the plug prongs extending outward from the encapsulation part.

5. The resistor structure as described in claim 4, characterized in that, The encapsulation part is made of epoxy resin with added alumina filler.

6. The resistor structure as described in claim 1, characterized in that, Each of the bent portions covers the entire second region, and the projection of the lead-out portion in the thickness direction falls within the projection range of the first region.

7. The resistor structure as described in claim 6, characterized in that, Each of the aforementioned pins includes a first segment adjacent to the lead-out portion and a second segment relatively far from the lead-out portion, wherein the cross-section of the first segment in the width direction is larger than that of the second segment.

8. The resistor structure as described in any one of claims 1 to 7, characterized in that, Each of the bent portions has a groove on the side facing the working end, the groove extending in the width direction and being distributed at least on the outer periphery near the working end.

9. The resistor structure as described in claim 8, characterized in that, The grooves are provided in multiple ways, and the multiple grooves are distributed at intervals along the length direction.

10. The resistor structure as described in claim 9, characterized in that, Two grooves are provided, which are respectively located on both sides of the working end in the thickness direction, and in the projection view along the width direction, each groove extends obliquely from the corner of the working end towards the outer periphery.

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