A thick film resistor with reduced cost

Abstract

This utility model discloses a cost-reducing thick-film resistor, relating to the field of thick-film resistor technology. It includes an outer electrode and an inner electrode. The outer electrode has a nickel-chromium alloy layer, a nickel layer, and a tin layer. An inner electrode is mounted inside the outer electrode, and the inner electrode has a trapezoidal structure design. A resistive layer is mounted inside the inner electrode. This cost-reducing thick-film resistor uses a vacuum-sputtered nickel-chromium alloy layer instead of traditional screen-printed silver as the side conductor material, significantly reducing material costs. Simultaneously, the high conductivity and corrosion resistance of the nickel-chromium alloy layer ensure a stable current path. The granular structure design reduces the lateral size of the outer electrode, ensuring welding area and circuit connection while reducing material usage and preventing resistive particles from sticking together during barrel plating, thus improving the electroplating pass rate. The positive conductor uses a silver-palladium layer, utilizing the anti-oxidation and anti-sulfurization properties of palladium to protect the silver and prevent electrode failure.

Description

Technical Field

[0001] This utility model relates to the field of thick film resistor technology, specifically a cost-reducing thick film resistor. Background Technology

[0002] Thick-film resistors, as key passive components in electronic circuits, are widely used in consumer electronics, automotive electronics, and industrial control, performing important functions such as voltage regulation and current distribution. As core passive components in electronic products, cost control of thick-film resistors is crucial to a company's competitiveness.

[0003] The existing technology has the following drawbacks;

[0004] Thick-film resistors typically employ a silver screen printing process for their side conductors, resulting in higher material costs. Furthermore, the internal electrodes and resistive layers often utilize rectangular structures, leading to low material utilization and uneven current distribution. Additionally, in traditional barrel plating processes, sheet resistors tend to adhere to each other, resulting in low plating pass rates and further increasing production costs.

[0005] Therefore, we propose a cost-reducing thick-film resistor to address the problems mentioned above. Utility Model Content

[0006] The purpose of this invention is to provide a cost-effective thick-film resistor to address the issues raised in the background section. Currently, thick-film resistors on the market typically use screen-printed silver for their side leads, resulting in high material costs. Furthermore, the internal electrodes and resistive layers often employ rectangular structures, leading to low material utilization and uneven current distribution. Additionally, in traditional barrel plating processes, sheet resistors tend to adhere to each other, resulting in low plating pass rates and further increasing production costs.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a cost-reducing thick film resistor, comprising an outer electrode and an inner electrode, wherein a nickel-chromium alloy layer, a nickel layer and a tin layer are disposed on the outer electrode, and an inner electrode is installed on the inner side of the outer electrode, wherein the inner electrode is designed with a trapezoidal structure, and a resistive layer is installed on the inner side of the inner electrode.

[0008] Preferably, the nickel-chromium alloy layer, nickel layer, and tin layer are disposed on the outer electrode from the inside to the outside, and the outer electrode adopts a granular structure design.

[0009] With the above structural design, the outer electrode is provided with a nickel-chromium alloy layer, a nickel layer, and a tin layer from the inside out. The granular structure reduces the lateral size, which reduces the amount of material used while ensuring the welding area. Moreover, the particles do not stick together, which improves the barrel plating pass rate and significantly reduces process loss costs.

[0010] Preferably, the internal electrode includes a positive conductor and a back conductor, both of which are designed in a trapezoidal structure.

[0011] With the above structural design, the internal electrodes are divided into a positive conductor and a back conductor, both of which are trapezoidal. The positive conductor uses a silver-palladium layer, which utilizes the antioxidant properties of palladium to protect the silver. Only a small amount of palladium is needed to reduce material costs. The back conductor eliminates palladium to reduce the consumption of precious metals and improve the overall cost-effectiveness.

[0012] Preferably, one end of the trapezoid on the inner electrode is connected to the outer electrode, and the other end is connected to the resistive layer, and the lateral dimension of the trapezoid decreases along the direction away from the outer electrode.

[0013] With the above structural design, the trapezoidal structure of the inner electrode connects the outer electrode at one end and the resistive layer at the other end. The design of decreasing lateral size further reduces the amount of silver used. The back conductor is coated with nano-silver on the surface of copper powder. Combined with the trapezoidal shape, the back conductor material is reduced, the cost is lowered, and the electric field distribution is optimized, making the current conduction more uniform and efficient.

[0014] Preferably, a silver-palladium layer is disposed on the positive conductor.

[0015] The above structural design forms a composite protective structure of silver-palladium alloy. The amount of palladium used is small, but it can effectively inhibit the oxidation and sulfidation of silver, extend the electrode life, reduce the scrap cost caused by failure, and reduce the amount of precious metals used.

[0016] Preferably, the resistive layer has an elliptical structure design, with the major axis of the resistive layer aligned with the current flow direction.

[0017] With the above structural design, the resistor layer adopts an elliptical structure, with its major axis aligned with the current flow direction. This optimizes the current path, reducing resistance error and material usage. The elliptical design promotes uniform current distribution, improving resistance accuracy and consistency, meeting the requirements of high-precision electronic equipment, while also reducing material costs.

[0018] Preferably, the resistive layer comprises a resistive paste layer and a glass layer, and the resistive layer is seamlessly connected to the inner electrode.

[0019] With the above structural design, the resistive layer is composed of a resistive paste layer and a glass layer. The glass layer enhances structural stability and reduces the amount of precious metal resistive material used. The seamless connection with the internal electrode ensures conductivity reliability, and the overall manufacturing process cost is lower than that of traditional pure resistive materials.

[0020] Compared with the prior art, the beneficial effects of this utility model are: the cost-reducing thick film resistor

[0021] 1. Cost reduction through optimization of external electrode materials and structure: Vacuum sputtered nickel-chromium alloy layer is used to replace traditional screen-printed silver as the side guide material, which significantly reduces material costs. At the same time, the high conductivity and corrosion resistance of the nickel-chromium alloy layer ensure a stable current path. The granular structure design reduces the lateral size of the external electrode, which reduces material usage while ensuring welding area and circuit connection. It also prevents resistive particles from sticking together during barrel plating, thereby improving the electroplating pass rate.

[0022] 2. Cost reduction through optimization of internal electrode materials and structure: The positive conductor uses a silver-palladium layer, utilizing the anti-oxidation and anti-sulfurization properties of palladium to protect the silver and prevent electrode failure; the trapezoidal structure of the internal electrode connects the external electrode at one end and the resistor layer at the other end, and the design of decreasing lateral dimensions further reduces the amount of silver used; the back conductor has nano-silver coated on the surface of copper powder, and the trapezoidal shape reduces the cost of the back conductor material, while optimizing the electric field distribution to make the current conduction more uniform and efficient.

[0023] 3. Cost reduction through optimization of resistor layer structure and materials: Elliptical resistor layers replace rectangular structures, optimizing the current path, reducing resistance value errors, reducing material usage, and promoting uniform current distribution, thus improving accuracy and consistency; the composite structure of resistor paste layer and glass layer enhances stability, reduces the amount of precious metal resistor materials used, and lowers costs. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the cross-sectional structure of the external electrode of this utility model;

[0026] Figure 3 This is a schematic diagram of the cross-sectional structure of the inner electrode of this utility model;

[0027] Figure 4 This is a schematic diagram of the cross-sectional structure of the resistive layer of this utility model.

[0028] In the diagram: 1. External electrode; 2. Nickel-chromium alloy layer; 3. Nickel layer; 4. Tin layer; 5. Internal electrode; 6. Forward conductor; 7. Back conductor; 8. Silver-palladium layer; 9. Resistive layer; 10. Resistive paste layer; 11. Glass layer. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-4This utility model provides a technical solution: a cost-reducing thick-film resistor, comprising an external electrode 1, a nickel-chromium alloy layer 2, a nickel layer 3, a tin layer 4, an internal electrode 5, a forward conductor 6, a back conductor 7, a silver-palladium layer 8, a resistive layer 9, a resistive paste layer 10, and a glass layer 11. The external electrode 1 is provided with the nickel-chromium alloy layer 2, the nickel layer 3, and the tin layer 4, arranged from the inside to the outside. The external electrode 1 adopts a granular structure design, with the granular structure and reduced lateral dimensions. To ensure effective welding area, the layout space is compressed, reducing the amount of nickel-chromium alloy layer 2, nickel layer 3, and tin layer 4 materials used. Simultaneously, the granular structure prevents resistors from sticking together during barrel plating, improving the plating pass rate. An inner electrode 5 is installed inside the outer electrode 1. The inner electrode 5 has a trapezoidal structure design and includes a positive conductor 6 and a back conductor 7, both of which are trapezoidal in design. The positive conductor 6 on the inner electrode 5 uses a silver-palladium layer 8, utilizing the anti-oxidation and anti-sulfurization properties of palladium to protect the silver and prevent product defects caused by electrode failure. The product is scrapped. One end of the trapezoid on the inner electrode 5 is connected to the outer electrode 1, and the other end is connected to the resistor layer 9. The lateral dimension of the trapezoid decreases in the direction away from the outer electrode 1. The palladium on the back conductor 7 of the inner electrode 5 is removed, and only silver is retained. The material configuration is optimized to meet the functional requirements of the welding area, reducing the material cost of the back conductor 7. The trapezoidal structure design further reduces the amount of silver used, reducing the overall cost. A silver-palladium layer 8 is set on the positive conductor 6. A resistor layer 9 is installed on the inner side of the inner electrode 5. The resistor layer 9 has an elliptical structure design. The long axis of the resistor layer 9 is consistent with the current flow direction. The elliptical structure of the resistor layer 9 replaces the rectangle. By optimizing the current path, the resistance value error is reduced and the amount of material used is reduced. At the same time, the elliptical design promotes uniform current distribution and improves resistance accuracy and consistency. The resistor layer 9 includes a resistor paste layer 10 and a glass layer 11. The resistor layer 9 is seamlessly connected to the inner electrode 5. The resistor layer 9 is composed of a resistor paste layer 10 and a glass layer 11. The glass layer 11 enhances the structural stability while reducing the amount of precious metal resistor material used, which can greatly reduce the manufacturing cost.

[0031] It should be noted that in the positive conductor 6, in the silver-palladium layer 8, silver accounts for 80-85%, palladium accounts for 5-10%, and the remainder is binder and organic solvent. The silver-palladium alloy in the silver-palladium layer 8 is existing technology and is only used here for application. It increases palladium, inhibits silver ion migration, and improves high-temperature stability.

[0032] In the back conductor 7, nano-silver is coated on the surface of copper powder, reducing the silver content to 40%-60%, which reduces the material cost by more than 30% compared to pure silver paste, and the increase in resistivity can be controlled within 15%.

[0033] Working Principle: When using this cost-reducing thick-film resistor, the current is first conducted through the outer electrode 1. The vacuum-sputtered nickel-chromium alloy layer 2 acts as a side conductor, providing a low-resistance path. The surface-mounted nickel layer 3 and tin layer 4 enhance corrosion resistance and solderability. The granular structure increases the surface area and reduces current concentration. The positive conductor 6 in the inner electrode 5 uses a silver-palladium alloy layer 8, and the back conductor 7 is a trapezoidal pure silver structure layer. These two form an upper and lower electrode structure that optimizes the electric field distribution. The elliptical resistor layer 9 is composed of a resistive paste layer 10 and a glass layer 11. The special shape and material ratio achieve precise resistance control. The entire structure combines vacuum sputtering, barrel plating, and high-temperature sintering processes, reducing costs while ensuring uniform current conduction and reliable performance, thus completing a series of tasks. Content not described in detail in this specification belongs to prior art known to those skilled in the art.

[0034] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cost-reduced thick film resistor comprising an outer electrode (1) and an inner electrode (5), characterized in that: The outer electrode (1) is provided with a nickel-chromium alloy layer (2), a nickel layer (3) and a tin layer (4). An inner electrode (5) is installed on the inner side of the outer electrode (1). The inner electrode (5) is designed in a trapezoidal structure. A resistive layer (9) is installed on the inner side of the inner electrode (5).

2. The cost-reduced thick-film resistor of claim 1, wherein: The nickel-chromium alloy layer (2), nickel layer (3) and tin layer (4) are arranged from the inside to the outside on the outer electrode (1), and the outer electrode (1) adopts a granular structure design.

3. The cost reduced thick film resistor of claim 1 wherein: The internal electrode (5) includes a positive conductor (6) and a back conductor (7), both of which are designed in a trapezoidal structure.

4. The reduced cost thick film resistor of claim 3 wherein: One end of the trapezoid on the inner electrode (5) is connected to the outer electrode (1), and the other end is connected to the resistive layer (9), and the lateral dimension of the trapezoid decreases in the direction away from the outer electrode (1).

5. The cost reduced thick film resistor of claim 3 wherein: A silver-palladium layer (8) is disposed on the positive conductor (6).

6. The cost reduced thick film resistor of claim 1 wherein: The resistive layer (9) has an elliptical structure, and the long axis of the resistive layer (9) is aligned with the current flow direction.

7. The cost-reducing thick-film resistor according to claim 1, characterized in that: The resistive layer (9) includes a resistive paste layer (10) and a glass layer (11), and the resistive layer (9) is seamlessly connected to the inner electrode (5).

Images