Electronic components and equipment
By strategically arranging conductive wires with specific angles and bends on the photoelectric conversion substrate, the ghosting issue is mitigated, enhancing image quality and component compactness.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- CANON KK
- Filing Date
- 2024-04-30
- Publication Date
- 2026-06-17
Smart Images
Figure 0007875232000001 
Figure 0007875232000002 
Figure 0007875232000003
Abstract
Description
Technical Field
[0001] The present invention relates to electronic components and devices.
Background Art
[0002] Patent Document 1 discloses a solid-state imaging device including a solid-state imaging element, a transparent plate disposed opposite to the solid-state imaging element, and bonding wires connected to electrodes disposed around the optical imaging surface of the solid-state imaging element. Patent Document 1 shows design guidelines for suppressing ghosts generated when incident light is reflected by the bonding wires and the reflected light is further reflected by the transparent plate and incident on the optical imaging surface.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] An object of the present invention is to provide a technique advantageous for further suppressing the generation of ghosts caused by conductive wires.
Means for Solving the Problems
[0005] In view of the above problems, an electronic component according to an embodiment of the present invention is an electronic component including a support substrate, a photoelectric conversion substrate fixed to the support substrate, and an optical member disposed to face the photoelectric conversion substrate, wherein the photoelectric conversion substrate includes a main surface including a photoelectric conversion region in which a plurality of photoelectric conversion elements are disposed and a peripheral region in which a first electrode is disposed, and the first electrode is connected to a second electrode disposed on the support substrate via a conductive wire. multiple The first electrode is connected to a second electrode disposed on the support substrate via a conductive wire. multiple The first electrode is connected to a second electrode disposed on the support substrate via a conductive wire. multiple The second electrode Of these, the corresponding second electrode to multiple the conductive wire Among the corresponding conductive wires is connected via, eachThe first portion of the conductive wire arranged on the photoelectric conversion substrate includes one or more bent portions, each The conductive wire is the aforementioned multiple 1st electrode Among them, the first electrode that was connected Distributed in the direction normal to the surface within a range of 200 μm or less from the surface, of the first portion connected The portion from the first electrode to the first height has a maximum angle of 30° or less with respect to the normal direction, where the first height is half the maximum height of the conductive wire from the surface in the normal direction. The plurality of second electrodes include a third electrode and a fourth electrode arranged adjacent to each other, and in a plan view, the third electrode is positioned at a position of a first length from the edge of the photoelectric conversion substrate, and the fourth electrode is positioned at a position of a second length longer than the first length from the edge of the photoelectric conversion substrate, and one of the plurality of conductive wires, one of the conductive wires connected to the third electrode and one of the plurality of conductive wires, one of the conductive wires connected to the fourth electrode, is in the photoelectric conversion region in the portion of the plurality of first electrodes from the connected first electrode to the bend closest to the connected first electrode. The conductive wires are arranged to tilt toward the region, and the conductive wire connected to the third electrode and the other conductive wire connected to the fourth electrode are arranged to tilt toward the opposite side of the photoelectric conversion region in the portion of the plurality of first electrodes from the connected first electrode to the bent portion of the bent portion closest to the connected first electrode, and the conductive wire connected to the third electrode and the conductive wire connected to the fourth electrode are connected to different first electrodes among the plurality of first electrodes. It is characterized by the following. [Effects of the Invention]
[0006] According to the present invention, it is possible to provide a technique that is advantageous in further suppressing the generation of ghosting caused by conductive wires. [Brief explanation of the drawing]
[0007] [Figure 1] A cross-sectional view showing an example of the configuration of the electronic components of this embodiment. [Figure 2] Figure 1 is a top view showing an example of the configuration of electronic components. [Figure 3] A diagram illustrating the generation of ghosting caused by conductive wires. [Figure 4] A diagram illustrating the generation of ghosting caused by conductive wires. [Figure 5] A cross-sectional view showing an example of the configuration of an electronic component in Figure 1. [Figure 6] A cross-sectional view showing an example of the configuration of an electronic component in Figure 1. [Figure 7] A cross-sectional view showing an example of the configuration of an electronic component in Figure 1. [Figure 8] A cross-sectional view showing an example of the configuration of an electronic component in Figure 1. [Figure 9] A cross-sectional view showing an example of the configuration of an electronic component in Figure 1. [Figure 10] A cross-sectional view showing a modified example of the electronic component in Figure 1. [Figure 11] Figure 10 is a top view showing an example of the configuration of electronic components. [Figure 12] Figure 1 shows an example of the configuration of a device incorporating the electronic components shown in Figure 1.
Best Mode for Carrying Out the Invention
[0008] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same reference numerals are assigned to the same or similar configurations, and duplicate descriptions are omitted.
[0009] In the following description, terms indicating specific directions and positions (for example, "upper", "lower", "right", "left", and other terms including those terms) are used as necessary. The use of those terms is for facilitating the understanding of the embodiments with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of those terms.
[0010] In this specification, a plan view means viewing from a direction perpendicular to the light incident surface of the semiconductor layer included in the photoelectric conversion substrate. Further, a cross-sectional view means viewing a cross-section perpendicular to the light incident surface of the semiconductor layer. When the light incident surface of the semiconductor layer is rough when viewed microscopically, the plan view is defined based on the light incident surface of the semiconductor layer when viewed macroscopically.
[0011] In this specification, expressions such as "A or B", "at least one of A and B", "at least one of A or / and B", "one or more of A or / and B", etc. can include all possible combinations of the listed items unless otherwise explicitly defined. That is, the above expressions are understood to disclose all cases where at least one A is included, where at least one B is included, and where both at least one A and at least one B are included. This is similarly applicable to combinations of three or more elements.
[0012] In addition, the disclosure of this specification includes the complement of the concepts described in this specification. That is, for example, if this specification describes that "A is larger than B", even if the description that "A is not larger than B" is omitted, it can be said that this specification discloses that "A is not larger than B". This is because when the description that "A is larger than B" is given, it is premised that the case where "A is not larger than B" is considered.
[0013] Referring to FIGS. 1 to 11, an electronic component according to an embodiment of the present disclosure will be described. FIG. 1 is a cross-sectional view showing a configuration example of an electronic component 100 of this embodiment. The electronic component 100 includes a support substrate 101, a photoelectric conversion substrate 104 fixed to the support substrate 101, and an optical member 103 arranged to face the photoelectric conversion substrate 104. The support substrate 101 and the optical member 103 are joined via a frame body 102.
[0014] For the support substrate 101, for example, ceramics such as alumina or aluminum nitride can be used as the main material. Also, a material containing a resin such as glass epoxy may be used as the main material for the support substrate 101. When the support substrate 101 is made of ceramics, it is advantageous in terms of heat dissipation because of its high thermal conductivity. Also, when the support substrate 101 is made of a material containing a resin such as glass epoxy, it is advantageous in terms of weight reduction.
[0015] The frame 102 can be made of materials such as ceramics like alumina or aluminum nitride, glass epoxy, resin, or metal, similar to the support substrate 101. When the same material is used for both the support substrate 101 and the frame 102, such as when both are ceramic, the support substrate 101 and the frame 102 may be formed as a single component with a recessed shape. In other words, although the configuration shown in Figure 1 shows the support substrate 101 and the frame 102 as separate components, the support substrate 101 and the frame 102 may be an integrated unit. Furthermore, when different materials are used for the support substrate 101 and the frame, from the viewpoint of bonding reliability between the support substrate 101 and the frame 102, materials with similar coefficients of thermal expansion may be selected as the materials for the support substrate 101 and the frame 102, respectively.
[0016] The optical component 103 may be made of, for example, glass, quartz, or sapphire. When quartz or sapphire is used for the optical component 103, it can also function as a low-pass filter (LPF) that transmits light below a predetermined wavelength. Sapphire has higher strength than quartz, making it possible to make the optical component 103 thinner than when quartz is used. Therefore, using sapphire for the optical component 103 is advantageous for miniaturizing the entire electronic component 100. Also, since the coefficient of thermal expansion of sapphire is about the same as that of alumina, if the frame 102 is made of alumina, the adhesive reliability may be higher if the optical component 103 is made of sapphire. The optical component 103 may be coated with an anti-reflective coating or an infrared cut coating. From the viewpoint of suppressing light reflection, an anti-reflective coating may be applied to both the surface of the optical component 103 facing the photoelectric conversion substrate 104 and the opposite side surface.
[0017] The photoelectric conversion substrate 104 comprises a main surface 120 including a photoelectric conversion region 105 on which a plurality of photoelectric conversion elements are arranged, and a peripheral region 106 on which electrodes 107 are arranged. Electrodes 107 are connected to electrodes 108 arranged on a support substrate 101 via conductive wires 109. In this embodiment, the photoelectric conversion substrate 104 is fixed to the main surface of the support substrate 101 on which electrodes 108 are arranged. Therefore, electrodes 107 are positioned closer to the optical member 103 than electrodes 108. For example, a semiconductor substrate such as silicon may be used for the photoelectric conversion substrate 104. In a plan view, the photoelectric conversion region 105 is located in the center of the photoelectric conversion substrate 104, and a plurality of photoelectric conversion elements are arranged in an array therein. The photoelectric conversion elements may be, for example, ordinary photodiodes, or they may be, for example, avalanche photodiodes. If the photoelectric conversion element is an avalanche photodiode, the avalanche photodiode may function as a Single Photon Avalanche Diode (SPAD) for high-speed detection of weak signals at the single-photon level.
[0018] Figure 2 is a plan view of the electronic component 100 of this embodiment from the optical member 103 side. A photoelectric conversion region 105 of the photoelectric conversion substrate 104 is located in the center of the electronic component 100. The photoelectric conversion substrate 104 may be rectangular, as shown in Figure 2. The photoelectric conversion region 105 may also be rectangular. A peripheral region 106, on which a plurality of electrodes 107 are arranged, is located around the photoelectric conversion region 105. A plurality of conductive wires 109 are provided to electrically connect the plurality of electrodes 107 and a plurality of electrodes 108 arranged on the support substrate 101. Here, we assume that the electronic component 100 has a longitudinal length of x and a transverse length of y, where both x and y are approximately 10 mm to 60 mm. However, the size of the electronic component 100 is not limited to this.
[0019] In an electronic component 100 equipped with a photoelectric conversion substrate 104 containing a photoelectric conversion element, a phenomenon called wire ghosting may occur where light incident from an external source is reflected by a conductive wire 109, enters the photoelectric conversion element, and appears in the image. Generally, the conductive wire 109 is made of a metal composed of gold, silver, aluminum, copper, or an alloy thereof, and therefore easily reflects light.
[0020] Figures 3 and 4(a) to 4(f) are schematic cross-sectional diagrams illustrating the wire ghosting phenomenon. Figure 3 shows how incident light 110, entering from above the optical element 103, strikes the conductive wire 109 and is reflected. Strictly speaking, the path of the incident light 110 passing through the optical element 103 changes depending on the refractive index of the optical element 103, but for the sake of simplicity, it is shown as incident light in a straight line. Figures 4(a) to 4(f) are enlarged views of the vicinity of the conductive wire 109 shown in Figure 3.
[0021] Figure 4(a) shows a state in which the conductive wire 109 rises from the electrode 107 at an angle of θ = 15° to the outside of the photoelectric conversion substrate 104, where θ is the angle between the normal direction of the surface of the electrode 107 and the conductive wire 109. Here, the surface of the electrode 107 may be the main surface 120 of the photoelectric conversion substrate 104, or a surface parallel to the semiconductor layer constituting the photoelectric conversion substrate 104. In addition, although the surface of the electrode 107 and the main surface 120 of the photoelectric conversion substrate 104 are depicted as being at the same height in each figure of this specification, the electrode 107 may protrude by a few μm or may be recessed from the main surface 120 of the photoelectric conversion substrate 104.
[0022] When incident light 110 strikes the conductive wire 109 at a θ=15° angle, it is reflected and incident on the photoelectric conversion substrate 104, but the reflected light is incident at a position closer to the electrode 107. Figure 4(b) shows the conductive wire 109 rising from the electrode 107 at an angle of θ=30° outside the photoelectric conversion substrate 104. When incident light 110 strikes the conductive wire 109 at a θ=30° angle, it is reflected and incident on the photoelectric conversion substrate 104, but the reflected light is incident at a position further from the electrode 107 than in the case of θ=15° shown in Figure 4(a). Figure 4(c) shows the conductive wire 109 rising from the electrode 107 at an angle of θ=45° outside the photoelectric conversion substrate 104. The incident light 110 that strikes the conductive wire 109 at θ=45° is reflected and travels towards the optical member 103, where it is reflected again by the surface of the optical member 103 facing the photoelectric conversion substrate 104, and then incident on the photoelectric conversion substrate 104. In this case, the reflected light is incident at a position even further away from the electrode 107 than in the case of θ=30° shown in Figure 4(b). Strictly speaking, the reflected light also travels to the surface of the optical member 103 opposite to the surface facing the photoelectric conversion substrate 104, and there is a component that is reflected at that surface, but it is weaker than the light reflected from the surface facing the photoelectric conversion substrate 104, and is therefore not shown in Figure 4(c).
[0023] Figure 4(d) shows the conductive wire 109 rising from the electrode 107 at θ=0° (normal to the surface of the electrode 107), and then bending at θ=60° so as to tilt outward from the photoelectric conversion substrate 104. The incident light 110 that strikes the θ=60° portion of the conductive wire 109 is reflected and travels towards the optical member 103, is reflected again by the surface of the optical member 103 facing the photoelectric conversion substrate 104, and then incident on the photoelectric conversion substrate 104. In this case, the reflected light is incident at a position closer to the electrode 107 than in the case of θ=45° shown in Figure 4(c). Figure 4(e) shows the conductive wire 109 rising from the electrode 107 at θ=0°, and then bending at θ=75° so as to tilt outward from the photoelectric conversion substrate 104. The incident light 110 that strikes the θ=75° portion of the conductive wire 109 is reflected and travels towards the optical member 103, where it is reflected again by the surface of the optical member 103 facing the photoelectric conversion substrate 104, and then incident on the photoelectric conversion substrate 104. In this case, the reflected light is incident at a position closer to the electrode 107 than in the case shown in Figure 4(d), where the wire rises at θ=0° and bends at θ=60°. Figure 4(f) shows the conductive wire 109 rising from the electrode 107 at θ=0°, then drawing an arc with a radius of curvature R=0.1 mm and heading outwards from the photoelectric conversion substrate 104. The incident light 110 that strikes the R-shaped bend of the conductive wire 109 is scattered at various angles depending on its position on the bend. Therefore, the reflected light is divided into a component that directly incidents on the photoelectric conversion substrate 104 and a component that is reflected by the optical member 103 at various angles and then incident at various positions on the photoelectric conversion substrate 104.
[0024] The results shown in Figures 4(a) to 4(f) indicate that if the conductive wire 109 is located at approximately θ=45° with respect to the normal direction of the surface of the electrode 107, the amount of light incident on the photoelectric conversion substrate 104 at a distance from the conductive wire 109 increases. As a result, the amount of light incident on the photoelectric conversion region 105 where multiple photoelectric conversion elements are arranged increases. Therefore, the likelihood of wire ghosting increases. Furthermore, the greater the height of the conductive wire 109 rising from the surface of the electrode 107, the greater the amount of light incident on a position farther from the conductive wire 109. In addition, the greater the distance between the photoelectric conversion substrate 104 and the optical member 103, the greater the amount of light incident on a position farther from the conductive wire 109. Whether or not wire ghosting occurs due to light reflected by the conductive wire 109 being incident on a position close to the conductive wire 109 depends on the distance from the electrode 107 to the photoelectric conversion region 105. Furthermore, whether or not the wire ghosting phenomenon occurs due to the light reflected by the conductive wire 109 entering a position far from the conductive wire 109 is also related to the size of the photoelectric conversion region 105.
[0025] The following describes a configuration that suppresses the occurrence of wire ghosting by directing light reflected by the conductive wire 109 to a position close to the conductive wire 109. Figures 5(a) to 5(d) are schematic diagrams focusing on the conductive wire 109 among the electronic components 100. Here, as shown in Figures 5(a) to 5(d), height h is defined as the maximum height of the conductive wire 109 from the electrode 107 in the direction normal to the surface of the electrode 107. Height H is defined as the height from the surface of the electrode 107 (or the main surface 120 of the photoelectric conversion substrate 104) to the optical member 103 in the direction normal. The portion 130 of the conductive wire 109 that is placed on the photoelectric conversion substrate 104 has one or more bent portions 131. In this case, the portion of the conductive wire 109 130 from the electrode 107 to at least height h / 2 may have a maximum angle θ1 with respect to the direction normal to the surface of the electrode 107 that is 30° or less. Height h / 2 refers to half the maximum height h of the conductive wire 109 from electrode 107 in the direction normal to the surface of electrode 107. Because the angle θ1 is 30° or less, the light that strikes and reflects off the inclined portion 130 of the conductive wire 109 at θ=30° is incident on the photoelectric conversion substrate 104 without being reflected back towards the optical member 103.
[0026] Depending on the placement of the conductive wire 109 and the design of the optical system that incidents light onto the electronic component 100, as shown in Figures 3 and 4(a) to 4(f), the light incident on the conductive wire 109 at an angle of approximately 10° to 20° with respect to the normal direction of the surface of the electrode 107. In this case, the light that strikes and reflects off the portion of the conductive wire 109 130 that rises from the electrode 107 at an angle of θ=30° will be incident at a position of approximately 100 μm to 400 μm from the electrode 107, depending on the height (length) of that portion. On the other hand, the length between the electrode 107 and the photoelectric conversion region 105 can be, for example, approximately 500 μm to 1500 μm. Therefore, the light that strikes and reflects off the portion of the conductive wire 109 130 at an angle of θ=30° will be incident on the peripheral region 106 of the photoelectric conversion substrate 104 without being reflected back towards the optical member 103. As a result, the occurrence of wire ghosting can be suppressed.
[0027] Furthermore, the portion of the conductive wire 109 from electrode 107 to the bent portion 131 closest to electrode 107 may be arranged along the direction normal to the surface of electrode 107 (θ1=0°), or it may be arranged so as to be tilted toward the photoelectric conversion region 105. This allows the light that strikes and reflects off the conductive wire 109 to enter the photoelectric conversion substrate 104 at a position closer to the conductive wire 109, thereby suppressing the wire ghosting phenomenon. In addition, since the distance from electrode 107 to the photoelectric conversion region 105 can be shortened, the electronic component 100 (photoelectric conversion substrate 104) can be miniaturized.
[0028] The higher the height h of the conductive wire 109, the larger the portion that reflects incident light. Therefore, a lower height h is preferable. For example, the conductive wire 109 may be positioned in a range of 200 μm or less from the surface of the electrode 107 in the direction normal to the surface of the electrode 107 (h ≤ 200 μm). Also, when the height h of the conductive wire 109 is the same, the higher the height H, the more likely the light reflected by the conductive wire 109 and the optical member 103 is to incident at a position farther from the electrode 107. Therefore, if the height H is large, reflected light may incident in the photoelectric conversion region 105, potentially causing a wire ghosting phenomenon. For this reason, the height h may be 3 / 4 or more of the height H (h ≥ 0.75 H).
[0029] In the configuration shown in Figure 5(a), the conductive wire 109 rises from the electrode 107 at an angle of θ1 ≤ 30°, tilting toward the photoelectric conversion region 105 up to a height h / 2, with a bent portion 131 at height h / 2, and extends toward the end of the photoelectric conversion substrate 104. In the configuration shown in Figure 5(b), the conductive wire 109 rises from the electrode 107 at an angle of θ1 ≤ 30°, tilting toward the end of the photoelectric conversion substrate 104 up to a height h / 2, with a bent portion 131 at height h / 2, and extends toward the end of the photoelectric conversion substrate 104. The portion of the conductive wire 109 that is positioned on the photoelectric conversion substrate 104, further away from the electrode 107 than the bent portion 131, may be positioned so that it moves away from the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent portion 131, as shown in Figures 5(a) and 5(b). In that case, as described above, if the portion of the conductive wire 109 130 that is further from the electrode 107 than the bent portion 131 has an angle of about 45° with respect to the normal direction of the surface of the electrode 107, the light reflected from that portion will be re-reflected by the optical member 103. Furthermore, the light reflected from the optical member 103 can be incident on the photoelectric conversion substrate 104 located at a distance from the conductive wire 109. Therefore, the portion of the conductive wire 109 130 that is further from the electrode 107 than the bent portion 131 does not need to have an angle of 40° or more and 50° or less with respect to the normal direction of the surface of the electrode 107. In other words, the portion of the conductive wire 109 130 that is further from the electrode 107 than the bent portion 131 may have an angle of greater than 50° and 90° or less with respect to the normal direction of the surface of the electrode 107. Furthermore, for example, the portion of the conductive wire 109 130 that is further from the electrode 107 than the bent portion 131 may have an angle greater than 0° and less than 40° with respect to the normal direction of the surface of the electrode 107. The explanation of the angle of the portion of the conductive wire 109 130 that is further from the electrode 107 than the bent portion 131 can also be applied to the portion of the conductive wire 109 from the bent portion 131 to a height h.
[0030] Consider the configurations shown in Figure 5(a) and Figure 5(b), where the absolute value of angle θ1, height h, and the length from electrode 107 to height h of conductive wire 109 in a plan view are the same. In this case, the shape shown in Figure 5(a) results in a larger angle between the portion of conductive wire 109 from height h / 2 (bent portion 131) to height h and the normal direction of the surface of electrode 107. In other words, the portion of conductive wire 109 from height h / 2 (bent portion 131) to height h approaches horizontal with respect to the surface of electrode 107 (main surface 120 of photoelectric conversion substrate 104). Therefore, incident light hitting the portion of conductive wire 109 from bent portion 131 to height h is reflected by conductive wire 109, then re-reflected by optical member 103, and then incident at a position close to the portion reflected by conductive wire 109. In other words, the configuration shown in Figure 5(a) is more effective at suppressing the occurrence of wire ghosting than the configuration shown in Figure 5(b).
[0031] In the configurations shown in Figures 5(c) and 5(d), the bent portion 131 closest to the electrode 107 is positioned at a height greater than h / 2 from the surface of the electrode 107. It can also be said that the bent portion 131 is positioned between height h / 2 and height h. In the configuration shown in Figure 5(c), the conductive wire 109 rises from the electrode 107 to the bent portion 131 at a θ1 ≤ 30° angle, tilting toward the side of the photoelectric conversion region 105, and extends from the bent portion 131 toward the side of the end of the photoelectric conversion substrate 104. In the configuration shown in Figure 5(d), the conductive wire 109 rises from the electrode 107 to the bent portion 131 at a θ1 ≤ 30° angle, tilting toward the side of the end of the photoelectric conversion region 105, and extends from the bent portion 131 toward the side of the end of the photoelectric conversion substrate 104. In the configurations shown in Figures 5(c) and 5(d), the portion of the conductive wire 109 that is further from the electrode 107 than the bent portion 131 does not need to have an angle of 40° or more and 50° or less with respect to the normal direction of the surface of the electrode 107. In other words, the portion of the conductive wire 109 that is further from the electrode 107 than the bent portion 131 may have an angle of greater than 50° and 90° or less with respect to the normal direction of the surface of the electrode 107. Also, for example, the portion of the conductive wire 109 that is further from the electrode 107 than the bent portion 131 may have an angle of 0° or more and less than 40° with respect to the normal direction of the surface of the electrode 107.
[0032] Consider the configurations shown in Figure 5(c) and Figure 5(d), where the absolute value of angle θ1, the height at which the bent portion 131 is located, height h, and the length from the electrode 107 to the portion of the conductive wire 109 at height h in a plan view are all the same. In this case, the shape shown in Figure 5(c) results in a larger angle between the portion of the conductive wire 109 from the bent portion 131 to height h and the normal direction of the surface of the electrode 107. In other words, the portion of the conductive wire 109 from the bent portion 131 to height h approaches the horizontal with respect to the surface of the electrode 107 (the main surface 120 of the photoelectric conversion substrate 104). Therefore, incident light hitting the portion of the conductive wire 109 from the bent portion 131 to height h is reflected by the conductive wire 109, then re-reflected by the optical member 103, and then incident at a position close to the portion that was reflected by the conductive wire 109. In other words, the configuration shown in Figure 5(c) is more effective at suppressing the occurrence of wire ghosting than the configuration shown in Figure 5(d).
[0033] Furthermore, from a similar perspective, the configuration shown in Figure 5(c) can suppress the occurrence of wire ghosting more effectively than the configuration shown in Figure 5(a). Also, the configuration shown in Figure 5(d) can suppress the occurrence of wire ghosting more effectively than the configuration shown in Figure 5(b). Since light hitting the part of the conductive wire 109 that is further from the electrode 107 than the bent portion 131 will be incident at a position closer to the portion reflected by the conductive wire 109, it can be said that the bent portion 131 closest to the electrode 107 is suitable to be positioned at a height close to h.
[0034] Figures 6(a) to 6(d) show modified shapes of the conductive wire 109. Figures 6(a) to 6(d) show an example in which two bent portions, bent portion 131 and bent portion 132, are arranged on portion 130 of the conductive wire 109 that is placed on the photoelectric conversion substrate 104.
[0035] In the configuration shown in Figure 6(a), the conductive wire 109 rises from the electrode 107 to the bent portion 131 located at a height h / 2 with an angle of θ1 ≤ 30°, tilting toward the photoelectric conversion region 105. Next, the conductive wire 109 bends toward the end of the photoelectric conversion substrate 104 at the bent portion 131, and extends from the bent portion 131 to the bent portion 132 at an angle θ2 with respect to the normal direction of the surface of the electrode 107. Furthermore, it bends at the bent portion 132 and extends toward the end of the photoelectric conversion substrate 104. As described above, if the portion of the conductive wire 109 from the bent portion 131 to the bent portion 132 has an angle θ2 of about 45° with respect to the normal direction of the surface of the electrode 107, the light reflected at that portion is re-reflected by the optical member 103. Furthermore, the light reflected by the optical member 103 can be incident on the photoelectric conversion substrate 104 at a position away from the conductive wire 109. The portion of the conductive wire 109 from the bent portion 131 to the bent portion 132 is arranged so that it moves away from the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent portion 131. In this case, the portion of the conductive wire 109 from the bent portion 131 to the bent portion 132 does not have to be in the range of 40° or more and 50° or less with respect to the direction normal to the surface of the electrode 107. In other words, the portion of the conductive wire 109 from the bent portion 131 to the bent portion 132 may have an angle θ2 of 0° or more and less than 40° with respect to the direction normal to the surface of the electrode 107, or it may be greater than 50° and 90° or less. An angle θ2 closer to 0° or closer to 90° can better suppress the occurrence of wire ghosting. The same applies to the portion of the conductive wire 109 from the bent portion 132 up to the height h. In other words, the portion of the conductive wire 109 from the bent portion 132 up to the height h may have an angle similar to that of the portion of the conductive wire 109 130 that is further from the electrode 107 than the bent portion 131, as explained using Figures 5(a) to 5(d).
[0036] In the configuration shown in Figure 6(b), the conductive wire 109 rises at an angle of θ1 ≤ 30°, tilting toward the end of the photoelectric conversion substrate 104, up to the bent portion 131 located at a height h / 2 from the electrode 107. The portion of the conductive wire 109 from the bent portion 131 to height h may be the same as the configuration shown in Figure 6(a). In the configurations shown in Figures 6(c) and 6(d), the bent portion 131 closest to the electrode 107 is positioned at a distance greater than h / 2 from the surface of the electrode 107. In other words, the bent portion 131 is positioned between height h / 2 and height h. The configurations shown in Figures 6(c) and 6(d) may be the same as the configurations shown in Figures 6(a) and 6(b), except for the position of the bent portion 131.
[0037] In the configurations shown in Figures 6(a) to 6(d), it is suitable that the bent portion 131 closest to the electrode 107 be positioned close to height h. Also, in the configurations shown in Figures 6(a) to 6(d), the bent portion 132 is positioned below height h. Therefore, the portion 130 of the conductive wire 109 that is positioned on the photoelectric conversion substrate 104, which is further from the electrode 107 than the bent portion 132, is positioned so that it moves away from the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent portion 132, but it is not limited to this. The bent portion 132 may be positioned at height h. In that case, the portion 130 of the conductive wire 109 that is further from the electrode 107 than the bent portion 132 may extend at a 90° angle with respect to the normal direction of the surface of the electrode 107, or it may be positioned so that it moves closer to the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent portion 132.
[0038] Furthermore, the portion 130 of the conductive wire 109 that is placed on the photoelectric conversion substrate 104 may have three or more bent sections. In this case, the conductive wire 109 rises from the electrode 107 to the bent section 131 closest to the electrode 107 at an angle of θ1 ≤ 30°. Subsequently, until it reaches a height h, the conductive wire 109 is positioned so that it moves away from the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent section 131, so that the angle with respect to the normal direction of the surface of the electrode 107 is not in the range of 40° or more and 50° or less. This can suppress the occurrence of wire ghosting.
[0039] Figure 7 shows an example in which a portion 130 of the conductive wire 109, placed on the photoelectric conversion substrate 104, includes an R-shaped bend 131. In the configuration shown in Figure 7, the bend 131 closest to the electrode 107 has an R shape, but it is not limited to this. For example, the bend 132 shown in Figures 6(a) to 6(d) may also have an R shape. Also, as shown in Figure 7, the R shape of the bend 131 may include a portion located at a height h in the normal direction from the surface of the electrode 107. As shown in Figure 4(f), light striking the R-shaped bend is scattered at various angles depending on the point of impact. Therefore, the reflected light is divided into a component that is directly incident on the photoelectric conversion substrate 104 and a component that is reflected by the optical member 103 at various angles and further incident on various positions on the photoelectric conversion substrate 104. As a result, the occurrence of wire ghosting can be suppressed.
[0040] Furthermore, when a bent portion such as the bent portion 131 has an R shape, the radius of curvature of the R shape may be made as small as possible so that less light hits the R-shaped bent portion. For example, it has been experimentally found that the occurrence of wire ghosting is greatly suppressed by setting the radius of curvature R to 0.16 mm or less. The radius of curvature R of the R shape may be 0.15 mm or less, 0.13 mm or less, or even 0.12 mm or less.
[0041] Figures 8, 9(a), and 9(b) show modified examples of the arrangement positions of the electrodes 108 on the support substrate 101. In each of the embodiments described above, each electrode 108, which is arranged corresponding to each side of the photoelectric conversion substrate 104, is positioned at the same length from the edge of the photoelectric conversion substrate 104. For example, as shown in Figure 2, electrodes 108 corresponding to each of the four sides of the photoelectric conversion substrate 104 may all be positioned at the same length from the edge of the photoelectric conversion substrate 104. On the other hand, in the configurations shown in Figures 8, 9(a), and 9(b), electrode 108a is positioned at a length L1 from the edge of the photoelectric conversion substrate 104, and electrode 108b is positioned at a length L2, which is longer than length L1, from the edge of the photoelectric conversion substrate 104. Electrodes 108a and 108b may be electrodes that are adjacent to each other among a plurality of electrodes 108. For example, electrodes 108a and 108b may be arranged alternately in a staggered pattern along one side of the photoelectric conversion substrate 104.
[0042] The conductive wire 109 shown in Figure 8 may have any of the shapes described above, such as those shown in Figures 5(a) to 5(d), Figures 6(a) to 6(d), and Figure 7. As shown in Figure 8, the conductive wire 109a connecting electrode 107a and electrode 108a, and the conductive wire 109b connecting electrode 107b and electrode 108b may have equivalent shapes in the portion 130 arranged on the photoelectric conversion substrate 104.
[0043] Furthermore, Figures 9(a) and 9(b) show examples in which conductive wires 109a and 109b have different shapes. As shown in Figures 9(a) and 9(b), one of the conductive wires 109a and 109b may be arranged to tilt toward the photoelectric conversion region 105 in the portion from electrodes 107a and 107b to the bent portion 131 closest to electrodes 107a and 107b. In the configuration shown in Figures 9(a) and 9(b), the conductive wire 109b connected to electrode 108b, which is located further from the edge of the photoelectric conversion substrate 104 than electrode 108a, is tilted toward the photoelectric conversion region 105 between electrode 107 and the bent portion 131. However, it is not limited to this, and the conductive wire 109a connected to electrode 108a, which is positioned closer to the edge of the photoelectric conversion substrate 104 than electrode 108b, may be tilted towards the photoelectric conversion region 105 between electrode 107 and the bent portion 131.
[0044] The shapes of adjacent conductive wires 109a and 109b from the rise of the electrode 107 up to height h are different from each other. As a result, light incident on conductive wire 109a and light incident on conductive wire 109b are reflected in different directions. Consequently, the occurrence of wire ghosting can be suppressed.
[0045] In the configuration shown in Figures 9(a) and 9(b), electrodes 108a and 108b, which are at different distances from the ends of the photoelectric conversion substrate 104, are arranged in a staggered pattern, and the conductive wire 109a connected to electrode 108a and the conductive wire 109b connected to electrode 108b have different shapes. However, this is not the only configuration; even if the distance between electrodes 107 and 108 is the same, the shapes of adjacent conductive wires 109 may be different. For example, in the wire bonding process, by adjusting the length and tension of the conductive wires 109, it is possible to arrange conductive wires 109 with different shapes even if the distance between electrodes 107 and 108 is the same. Furthermore, it is not limited to arranging conductive wires 109 with different shapes alternately; conductive wires 109 with different shapes may be arranged, such as one in several or several in several. Furthermore, although the configurations shown in Figures 9(a) and 9(b) include conductive wires 109a and 109b of two different shapes, three or more conductive wires 109 of different shapes may also be included.
[0046] Next, modified examples of the electronic component 100 will be described using Figures 10 and 11. Figure 10 is a cross-sectional view showing an example of the configuration of the electronic component 100 of this embodiment, and Figure 11 is a plan view of the electronic component 100 from the optical member 103 side. In the configurations shown in Figures 10 and 11, the frame 102 has protrusions 111 and 112 that protrude from the sides of the frame 102 in a plan view. The frame 102 also covers the outer peripheral end of the support substrate 101 and further covers at least a part of the side of the support substrate 101 opposite to the side on which the photoelectric conversion substrate 104 is fixed. Other configurations may be the same as those of the embodiments described above, so here we will focus on describing the different configurations, and descriptions of configurations that may be the same will be omitted as appropriate.
[0047] As shown in Figure 11, in plan view, the frame 102 is provided with protrusions 111 and 112 that protrude from at least two opposing sides of the four rectangular sides of the frame 102. In plan view, the edges of the frame 102 may be rounded, chamfered, or the edges may intersect at right angles, as shown in Figure 11. In the configuration shown in Figure 11, the protrusions 111 and 112 are arranged to protrude from two sides of the frame 102 that are arranged in the longitudinal direction, but are not limited to this. The protrusions 111 and 112 may be arranged on two opposing sides in the short direction, or on three or more sides.
[0048] The protrusions 111 and 112 can be used, for example, to fix the electronic component 100 to an external unit. The protrusion 111 has one or more through holes 113 that penetrate through it. The protrusion 112 has through holes 114 and 115 that penetrate through it. For example, the through holes 113 and 114 can be holes used to pass screws or bolts when fixing the electronic component 100 to an external unit using screws or bolts. Also, for example, the through hole 115 can be a hole used for positioning when fixing the electronic component 100 to an external unit. Therefore, the shapes of the through holes 113 and 114 and the through hole 115 may differ from each other. For example, the through holes 113 and 114 may be provided with steps to receive screw heads or nuts. Therefore, in a plan view, the structure including the steps can be larger than the through hole 115.
[0049] As shown in Figure 11, the center of the through-hole 114 in the projection 112 is located at a distance L11 from the imaginary line extending the side on which the projection 112 is located. The center of the through-hole 114 in the projection 112 is located at a distance L12 from the imaginary line extending the side on which the projection 112 is located. The center of the through-hole 113 in the projection 111 is located at a distance L13 from the imaginary line extending the side on which the projection 111 is located. In this case, lengths L11 and L12 may be different from each other. If lengths L11 and L12 are the same, the projection 112 may become larger in the direction in which the through-holes 114 and 115 are aligned. For example, as described above, the through-holes 113 and 114 may be formed to be structurally larger than the through-hole 115. Therefore, through holes 113 and 114 are formed such that length L11 is longer than length L12. This makes it possible to reduce the outer shape of the protruding portion 112 and miniaturize the electronic component 100. Also, because length L11 is longer than length L12, the electronic component 100 can be made smaller than when length L11 is shorter than length L12. Lengths L11 and L13 may be the same length, as shown in Figure 11. This is because through holes 113 and 114 can be formed to the same size (shape).
[0050] As described above, the protrusions 111 and 112 arranged on the frame 102 can be used to fix the electronic component 100 to an external unit. On the other hand, the arrangement of the protrusions 111 and 112 on the frame 102 may cause partial warping or partial shape changes in the support substrate 101 joined to the frame 102. For this reason, the shape of the conductive wire 109 may be adjusted as appropriate depending on the position where the conductive wire 109 is arranged. By appropriately adjusting the shape of the conductive wire 109, it is possible to suppress problems such as the conductive wire 109 being subjected to tensile stress due to partial warping of the support substrate 101, which may cause the conductive wire 109 to break. In the configurations shown in Figures 10 and 11, the multiple electrodes 108 arranged on the support substrate 101 are arranged in a staggered pattern, similar to the configuration shown in Figure 8 described above. However, it is not limited to this, and the shape of the conductive wire 109 and the arrangement of the electrodes 108 can be adjusted to match the shapes and arrangements of each embodiment described above. Even when protrusions 111 and 112 are arranged on the frame 102, the wire ghosting phenomenon can be suppressed by shaping the conductive wire 109 as described above.
[0051] Furthermore, as shown in Figure 11, projections 112a and 112b may be arranged on two opposing sides. The projections 112a and 112b may have the same shape. In this case, as shown in Figure 11, the projection 112b, which is arranged only once on one side of the frame 102, may be located in the center of the side. Here, the center of the side may be, for example, the two parts that are in contact with the center of the side when the side is divided into four equal parts. Alternatively, for example, the center of the side may be the part that includes the center of the side when the side is divided into three equal parts. When only one projection 111 or projection 112 is arranged on one side, the projections 111 and 112 are located in the center of the side. This suppresses deformation and warping, such as twisting, of the frame 102 and the support substrate 101 that is joined to the frame 102. Furthermore, as shown in Figure 11, when projections 111 and 112a are arranged on one side, each projection 111 and 112a may be positioned at a distance of equal length from the center of the side on which they are arranged. For example, the difference between the distance from the center of the side on which projections 111 and 112a are arranged to the center of the through hole 113 of projection 111 and the distance from the center of the side on which projections 111 and 112a are arranged to the center of the through hole 113 of projection 112a may be 20% or less of the side length. Also, for example, the difference between the distance from the center of the side on which projections 111 and 112a are arranged to the center of the through hole 113 of projection 111 and the distance from the center of the side on which projections 111 and 112a are arranged to the center of the through hole 113 of projection 112a may be 10% or less of the side length. Furthermore, for example, the length from the center of the side on which the protrusions 111 and 112a are located to the center of the through hole 113 of the protrusion 111 may be the same as the length from the center of the side on which the protrusions 111 and 112a are located to the center of the through hole 114 of the protrusion 112a. This suppresses deformation and warping, such as twisting, of the frame 102 and the support substrate 101 joined to the frame 102. When three or more protrusions 111 and 112 are located on one side, each protrusion 111 and 112 may be located at equal intervals, for example. The interval between the protrusions 111 and 112 may be defined, for example, by the length of the portion of the side on which no protrusions are provided, or by the length between the centers of through holes of the same shape.
[0052] The photoelectric conversion substrate 104 mounted on the electronic component 100 may exhibit a distribution of heat generation within its plane. For example, if electrodes 107 arranged along the longitudinal direction of the electronic component 100 function as output terminals for outputting signals from the photoelectric conversion substrate 104, the heat generation of the electrodes 107 arranged along the longitudinal direction may increase. This is because the number of signal inputs and outputs when the photoelectric conversion substrate 104 operates differs depending on the function of the electrodes 107, resulting in different heat generation. Therefore, as shown in Figure 11, the length between the frame 102 and the photoelectric conversion substrate 104 may differ between the longitudinal and short-width directions of the electronic component 100 in a plan view. In the configuration shown in Figure 11, the length L21 between the frame 102 and the photoelectric conversion substrate 104 in the longitudinal direction is shorter than the length L22 between the frame 102 and the photoelectric conversion substrate 104 in the short-width direction. In other words, the length L22 between the frame 102 and the end of the photoelectric conversion substrate 104, where electrodes 107 arranged along the longitudinal direction, which generate a large amount of heat, is longer than the length L21 between the frame 102 and the end of the photoelectric conversion substrate 104, where electrodes 107 arranged along the short direction. This makes it possible to secure a heat dissipation space. For example, a heat dissipation material such as a heat dissipation sheet may be placed in the heat dissipation space secured between the electrodes 108 and the frame 102. By suppressing heat conduction to the frame 102, it is possible to suppress deformation of the frame 102.
[0053] In the configuration shown in Figure 11, length L22 is longer than length L21. However, this is not the only option, and length L22 may be shorter than length L21 depending on the function of each of the multiple electrodes 107 and the heat distribution of the photoelectric conversion substrate 104.
[0054] In the configuration shown in Figure 10, the support substrate 101 and the frame 102 are shown as separate components. However, the configuration is not limited to this, and the support substrate 101 and the frame 102 may be integrated. Furthermore, in the configurations of the support substrate 101 and frame 102 shown in Figures 1 and 2, the frame 102 may also have protrusions 111 and 112.
[0055] Here, an example of the application of the electronic component 100 of this embodiment will be described using Figure 12. Figure 12 is a schematic diagram of a device 9191 equipped with the electronic component 100. The device 9191 may include at least one of the following: an optical device 940, a control device 950, a processing device 960, a display device 970, a storage device 980, and a mechanical device 990. The optical device 940 is, for example, a lens, shutter, or mirror. The control device 950 controls, for example, a photoelectric conversion substrate 104 arranged on the electronic component 100. The control device 950 is, for example, a semiconductor device such as an ASIC.
[0056] The processing unit 960 processes the signals output from the photoelectric conversion board 104 located on the electronic component 100. The processing unit 960 is a semiconductor device such as a CPU or ASIC that constitutes an AFE (analog front end) or DFE (digital front end). The display device 970 is an EL display device or liquid crystal display device that displays the information (image) obtained from the photoelectric conversion board 104. The storage device 980 is a magnetic device or semiconductor device that stores the information (image) obtained from the photoelectric conversion board 104. The storage device 980 is a volatile memory such as SRAM or DRAM, or a non-volatile memory such as flash memory or a hard disk drive.
[0057] The mechanical device 990 has movable parts or propulsion parts such as motors and engines. The device 9191 displays signals output from the photoelectric conversion board 104 arranged on the electronic component 100 on the display device 970, or transmits them to the outside by a communication device (not shown) provided in the device 9191. For this purpose, the device 9191 may further include a storage device 980 and a processing device 960, separate from the memory circuits and arithmetic circuits of the photoelectric conversion board 104. The mechanical device 990 may be controlled based on signals output from the photoelectric conversion board 104.
[0058] Furthermore, the device 9191 is suitable for electronic devices such as information terminals with shooting capabilities (e.g., smartphones and wearable devices) and cameras (e.g., interchangeable lens cameras, compact cameras, video cameras, and surveillance cameras). In a camera, the mechanical device 990 can drive components of the optical device 940 for zooming, focusing, and shutter operation. Alternatively, the mechanical device 990 in a camera can move an electronic component 100 on which a photoelectric conversion board 104 is located for vibration damping.
[0059] Furthermore, the device 9191 can also be applied to on-board cameras mounted on transportation equipment such as vehicles, ships, airplanes, and industrial robots. The mechanical device 990 in transportation equipment can be used as a mobile device. As transportation equipment, the device 9191 is suitable for transporting electronic components 100 on which the photoelectric conversion board 104 is located, or for assisting and / or automating driving (operation) through its imaging function. The processing device 960 for assisting and / or automating driving (operation) can perform processing to operate the mechanical device 990 as a mobile device based on information obtained from the photoelectric conversion board 104. The device 9191 incorporating the electronic components 100 on which the photoelectric conversion board 104 is located can be applied not only to transportation equipment, but also to a wide range of equipment that utilizes object recognition, such as intelligent transportation systems (ITS). Alternatively, the device 9191 may be medical equipment such as endoscopes, measuring instruments such as distance sensors, analytical instruments such as electron microscopes, or office equipment such as photocopiers.
[0060] The disclosures herein include the following electronic components and devices:
[0061] (Item 1) An electronic component comprising a support substrate, a photoelectric conversion substrate fixed to the support substrate, and an optical member arranged to face the photoelectric conversion substrate, The photoelectric conversion substrate comprises a main surface including a photoelectric conversion region on which a plurality of photoelectric conversion elements are arranged, and a peripheral region on which a first electrode is arranged. The first electrode is connected to the second electrode, which is arranged on the support substrate, via a conductive wire. The first portion of the conductive wire arranged on the photoelectric conversion substrate includes one or more bent portions, The conductive wire is arranged in a range of 200 μm or less from the surface in the direction normal to the surface of the first electrode. The electronic component is characterized in that the portion of the first part from the first electrode to the first height has a maximum angle of 30° or less with respect to the normal direction, where the first height is half the maximum height of the conductive wire from the surface in the normal direction.
[0062] (Item 2) The electronic component according to item 1, characterized in that the first bent portion, which is closest to the first electrode, is positioned at a distance greater than the first height from the surface.
[0063] (Item 3) The electronic component according to item 2, characterized in that the portion of the first part from the first electrode to the first bent portion is arranged along the normal direction or is arranged to be tilted toward the photoelectric conversion region.
[0064] (Item 4) The electronic component according to item 2 or 3, characterized in that the portion of the first part that is further from the first electrode than the first bend is arranged to move away from the main surface as it moves away from the first bend, and the angle with respect to the normal direction is not in the range of 40° or more and 50° or less.
[0065] (Item 5) The bent portion includes the first bent portion and the second bent portion, The electronic component according to any one of items 2 to 4, characterized in that the portion of the first part from the first bend to the second bend is arranged to move away from the main surface as it moves away from the first bend, and the angle with respect to the normal direction is not in the range of 40° or more and 50° or less.
[0066] (Item 6) The second bent portion is positioned in the normal direction from the surface to a position less than the maximum height, The electronic component according to item 5, characterized in that the portion of the first part that is further from the first electrode than the second bent portion is arranged so that it moves away from the main surface as it moves away from the second bent portion.
[0067] (Item 7) The electronic component according to item 5, characterized in that the second bent portion is positioned at the maximum height from the surface in the normal direction.
[0068] (Item 8) The electronic component according to any one of items 1 to 7, characterized in that the bent portion includes an R-shaped bent portion.
[0069] (Item 9) The electronic component according to any one of items 2 to 7, characterized in that the first bent portion has an R shape.
[0070] (Item 10) The first bent portion has an R shape, The electronic component according to item 2 or 3, characterized in that the R shape includes a portion located at the maximum height from the surface in the normal direction.
[0071] (Item 11) An electronic component according to any one of items 8 to 10, characterized in that the radius of curvature of the R shape is 0.16 mm or less.
[0072] (Item 12) The electronic component according to any one of items 1 to 11, characterized in that the maximum height is 3 / 4 or more of the height from the surface to the optical member in the normal direction.
[0073] (Item 13) The electronic component according to any one of items 1 to 12, characterized in that the first electrode is positioned closer to the optical member than the second electrode.
[0074] (Item 14) A plurality of first electrodes including the first electrode, a plurality of second electrodes including the second electrode, and a plurality of conductive wires including the conductive wire are arranged, The plurality of second electrodes include third and fourth electrodes arranged adjacent to each other. An electronic component according to any one of items 1 to 13, characterized in that, in a plan view, the third electrode is positioned at a position of a first length from the edge of the photoelectric conversion substrate, and the fourth electrode is positioned at a position of a second length longer than the first length from the edge of the photoelectric conversion substrate.
[0075] (Item 15) The electronic component according to item 14, characterized in that one of the plurality of conductive wires, the conductive wire connected to the third electrode, and the conductive wire connected to the fourth electrode, is arranged to be tilted toward the photoelectric conversion region in the portion from the first electrode to the bent portion of the bent portion closest to the first electrode.
[0076] (Item 16) The electronic component according to item 15, characterized in that the conductive wire connected to the fourth electrode among the plurality of conductive wires is arranged to be tilted toward the photoelectric conversion region in the portion from the first electrode to the bent portion of the bent portion closest to the first electrode.
[0077] (Item 17) The plurality of second electrodes include a plurality of third electrodes including the third electrode, and a plurality of fourth electrodes including the fourth electrode, The electronic component according to any one of items 14 to 16, characterized in that the third electrode and the fourth electrode are arranged alternately.
[0078] (Item 18) An electronic component listed in any one of items 1 through 17, A processing device for processing the signal output from the photoelectric conversion substrate, A device characterized by being equipped with the following features.
[0079] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]
[0080] 100: Electronic component, 101: Support substrate, 103: Optical component, 104: Photoelectric conversion substrate, 105: Photoelectric conversion region, 106: Peripheral region, 107, 108: Electrode, 109: Conductive wire, 130: Part, 131: Bent portion
Claims
1. An electronic component comprising a support substrate, a photoelectric conversion substrate fixed to the support substrate, and an optical member arranged to face the photoelectric conversion substrate, The photoelectric conversion substrate comprises a main surface including a photoelectric conversion region on which a plurality of photoelectric conversion elements are arranged, and a peripheral region on which a plurality of first electrodes are arranged. The plurality of first electrodes are connected to the corresponding second electrodes among the plurality of second electrodes arranged on the support substrate via the corresponding conductive wires among the plurality of conductive wires. Each conductive wire has one or more bent portions, Each conductive wire is arranged in a range of 200 μm or less from the surface in the direction normal to the surface of the connected first electrode among the plurality of first electrodes. The portion of the first part from the connected first electrode to the first height has a maximum angle of 30° or less with respect to the normal direction, where the first height is half the maximum height of the conductive wire from the surface in the normal direction. The plurality of second electrodes include third and fourth electrodes arranged adjacent to each other. In a plan view, the third electrode is positioned at a position of a first length from the edge of the photoelectric conversion substrate, and the fourth electrode is positioned at a position of a second length longer than the first length from the edge of the photoelectric conversion substrate. One of the plurality of conductive wires, the conductive wire connected to the third electrode, and the conductive wire connected to the fourth electrode, is arranged to be tilted toward the photoelectric conversion region in the portion of the plurality of first electrodes from the connected first electrode to the bent portion of the bent portion closest to the connected first electrode. Of the plurality of conductive wires, the conductive wire connected to the third electrode, and the other conductive wire connected to the fourth electrode, are arranged to tilt to the side opposite to the photoelectric conversion region in the portion of the plurality of first electrodes from the connected first electrode to the bent portion of the bent portion closest to the connected first electrode. An electronic component characterized in that the conductive wire connected to the third electrode and the conductive wire connected to the fourth electrode are connected to different first electrodes among the plurality of first electrodes.
2. The electronic component according to claim 1, characterized in that the first bent portion, among the plurality of first electrodes, that is closest to the connected first electrode is positioned at a distance greater than the first height from the surface.
3. The electronic component according to claim 2, characterized in that the portion of the first part that is further away from the connected first electrode among the plurality of first electrodes than the first bent portion is arranged to move away from the main surface as it moves away from the first bent portion, and the angle with respect to the normal direction is not in the range of 40° or more and 50° or less.
4. The bent portion includes the first bent portion and the second bent portion, The electronic component according to claim 2, characterized in that the portion of the first part from the first bend to the second bend is arranged to move away from the main surface as it moves away from the first bend, and the angle with respect to the normal direction is not in the range of 40° or more and 50° or less.
5. The second bent portion is positioned in the normal direction from the surface at a height less than the maximum height, The electronic component according to claim 4, characterized in that the portion of the first part that is further from the first electrode than the second bent portion is arranged to move away from the main surface as it moves away from the second bent portion.
6. The electronic component according to claim 4, characterized in that the second bent portion is positioned at the maximum height from the surface in the normal direction.
7. The electronic component according to claim 1, characterized in that the bent portion includes an R-shaped bent portion.
8. The electronic component according to claim 2, characterized in that the first bent portion has an R shape.
9. The first bent portion has an R shape, The electronic component according to claim 2, characterized in that the R shape includes a portion located at the maximum height from the surface in the normal direction.
10. The electronic component according to claim 8, characterized in that the radius of curvature of the R shape is 0.16 mm or less.
11. The electronic component according to claim 1, characterized in that the maximum height is 3 / 4 or more of the height from the surface to the optical member in the normal direction.
12. The electronic component according to claim 1, characterized in that the plurality of first electrodes are arranged closer to the optical member than the plurality of second electrodes.
13. The electronic component according to claim 1, characterized in that the conductive wire connected to the fourth electrode among the plurality of conductive wires is arranged to be tilted toward the photoelectric conversion region in the portion from the connected first electrode among the plurality of first electrodes to the bent portion of the bent portion closest to the connected first electrode.
14. The plurality of second electrodes include a plurality of third electrodes including the third electrode, and a plurality of fourth electrodes including the fourth electrode, The electronic component according to claim 1, characterized in that the third electrode and the fourth electrode are arranged alternately.
15. An electronic component according to any one of claims 1 to 14, A processing device for processing the signal output from the photoelectric conversion substrate, A device characterized by being equipped with the following features.