Resin compositions, adhesives, coatings, cured products, adhesive sheets, resin-coated copper foil, copper-clad laminates, and printed circuit boards.

Abstract

To provide a resin composition that produces a cured product with exceptional adhesion, resistance to solder heat, resistance to moist heat, and resistance to migration, wherein the cured product, when used as a resin film, also demonstrates outstanding solder heat resistance and a high storage modulus.SOLUTION: A resin composition comprises (A) a polyimide resulting from the reaction of a monomer group including an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) including a dimeric diamine, (B) a crosslinker represented by the general formula (1), and (C) a curing agent other than the component (B).SELECTED DRAWING: None

Claims

1. A resin composition comprising a polyimide (A) which is a reaction product of a monomer group including an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer amine, a crosslinking agent (B) represented by general formula (1-3), and one or more curing agents (C) selected from the group consisting of benzoxazine, bismaleimide, cyanate ester, polyisocyanate, phosphorus compound, acid anhydride, amine, imidazole, guanidine, phenol resin, and active ester. 【Transformation 8】

2. The resin composition according to claim 1, wherein component (C) is one or more selected from the group consisting of polyamide polyamines, polyether polyamines, and trimer triamines.

3. Furthermore, the resin composition according to claim 1 or 2, further comprising an inorganic filler.

4. An adhesive comprising the resin composition described in claim 1.

5. A coating agent comprising the resin composition described in claim 1.

6. A cured product comprising one or more selected from the group consisting of the resin composition described in claim 1, the adhesive described in claim 4, and the coating agent described in claim 5.

7. An adhesive sheet having the cured product described in claim 6 on at least one side of the support film.

8. A resin-coated copper foil comprising the cured product described in claim 6 or the adhesive sheet described in claim 7, and copper foil.

9. A copper-clad laminate comprising the resin-coated copper foil described in claim 8, and copper foil or an insulating sheet.

10. A printed wiring board having a circuit pattern on the copper foil surface of a copper-clad laminate according to claim 9.

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