Piezoelectric resonant devices

Abstract

To provide a piezoelectric resonance device in which resonance frequency of a piezoelectric element can vary depending on a variety of factors.SOLUTION: A piezoelectric resonance device includes: a substrate 110 having a first surface 1110; a first connection conductor located on the first surface; a MEMS element 150 which is located on the first surface and has a second surface (a top surface 1500), a second connection conductor 151 located on the second surface and a resonance part 153 exposed on the second surface and electrically connected to the second connection conductor; and a wiring conductor (a bonding wire 181) electrically connecting the first connection conductor and the second connection conductor. The first connection conductor, the second connection conductor and the wiring conductor are located outside a range where a range of the resonance part is made to extend in a prescribed direction in a planar view looking at the first surface from above.SELECTED DRAWING: Figure 2B

Claims

1. A substrate having a first surface, A MEMS element located on the first surface, Wiring conductors and Equipped with, The substrate has a first connecting conductor located on the first surface, The MEMS element has a second surface, a second connecting conductor located on the second surface, a resonant portion exposed on the second surface and electrically connected to the second connecting conductor, and a surface finish mark obtained by grinding the surface of the resonant portion exposed on the second surface. The wiring conductor electrically connects the first connecting conductor and the second connecting conductor. The first connecting conductor, the second connecting conductor, and the wiring conductor are located outside the range of the resonance portion when viewed from above in a plan view of the first surface, in which the range of the resonance portion is extended in the scanning direction of at least one of the surface treatments. In the plan view, a resin member is positioned between the first connecting conductor and the second connecting conductor, and in at least a portion of the space between the wiring conductor and the first surface. In the resin member, at a position where it overlaps with the wiring conductor in a plan view, the maximum distance from the first surface is greater than or equal to the distance between the first surface and the surface of the second connecting conductor. Piezoelectric resonant device.

2. The second connecting conductor is located between the first connecting conductor and the resonant portion. The piezoelectric resonant device according to claim 1.

3. The second connecting conductor has the first connecting portion and the second connecting portion at different positions. The first connecting conductor has the third connecting portion and the fourth connecting portion at different positions. The wiring conductor comprises a first wiring conductor connecting the first connection part and the third connection part, and a second wiring conductor connecting the second connection part and the fourth connection part. The scanning direction is parallel to the first reference line passing through a predetermined first position of the first connection portion and a predetermined second position of the second connection portion. A piezoelectric resonant device according to claim 1 or 2.

4. The piezoelectric resonant device according to claim 3, wherein the scanning direction is parallel to the second reference line passing through a predetermined third position of the third connection portion and a predetermined fourth position of the fourth connection portion.

5. The piezoelectric resonant device according to claim 4, wherein the center of the resonant portion of the MEMS element is located on a line passing through the midpoint of the first and second positions and the midpoint of the third and fourth positions.

6. The piezoelectric resonant device according to claim 5, wherein the distance between the first reference line and the second reference line is smaller than the distance between the second reference line and the edge of the first surface in a direction perpendicular to the second reference line.

7. The piezoelectric resonant device according to any one of claims 3 to 6, wherein the distance between the connection positions of the first connection portion and the third connection portion of the first wiring conductor is equal to the distance between the connection positions of the second connection portion and the fourth connection portion of the second wiring conductor.

8. The piezoelectric resonant device according to any one of claims 3 to 7, wherein the line connecting the first position and a predetermined third position of the third connection portion, and the line connecting the second position and a predetermined fourth position of the fourth connection portion, are perpendicular to the scanning direction, respectively.

9. The piezoelectric resonant device according to any one of claims 1 to 8, wherein the scanning direction is a direction along the longitudinal direction of the resonant portion, or a direction perpendicular to the longitudinal direction.

10. The first surface has a projection, The first connecting conductor is located on the projection, The surface of the first connecting conductor and the surface of the second connecting conductor are located at the same distance from the first surface. A piezoelectric resonant device according to any one of claims 1 to 9.

11. The piezoelectric resonant device according to any one of claims 1 to 10, wherein the resin member covers the edge of the MEMS element at least between the first connecting conductor and the second connecting conductor.

12. The piezoelectric resonant device according to any one of claims 1 to 11, wherein the wiring conductor is located inside the resin member in at least a portion of the space between the first connecting conductor and the second connecting conductor.

13. The piezoelectric resonant device according to any one of claims 1 to 12, wherein the second surface of the MEMS element has a space of a predetermined area or more at a position that does not overlap with the second connecting conductor, the resonant portion, and the wiring conductor in a plan view.

14. The piezoelectric resonant device according to claim 13, wherein the space is located on the second surface on the opposite side of the second connecting conductor from the resonant portion.

15. The MEMS element is bonded to the first surface via an adhesive member. The adhesive member extends outward at least beyond the corners of the MEMS element in a plan view. A piezoelectric resonant device according to any one of claims 1 to 14.

16. The MEMS element has a semiconductor substrate, a lower electrode, a piezoelectric material, and an upper electrode stacked in order from the first surface upwards. The piezoelectric resonant device according to claim 15, wherein the upper end position of the adhesive member on the side surface of the MEMS element is lower than the upper end position of the semiconductor substrate.

17. The piezoelectric resonant device according to any one of claims 1 to 16, wherein the material of at least the surface of the first connecting conductor and the second connecting conductor is gold.

18. The surface treatment marks are located in a region including the vicinity of the center of the resonance part. The piezoelectric resonant device according to claim 1.

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